WO2017073559A1 - ポリアミド樹脂組成物、フィルム - Google Patents
ポリアミド樹脂組成物、フィルム Download PDFInfo
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- WO2017073559A1 WO2017073559A1 PCT/JP2016/081578 JP2016081578W WO2017073559A1 WO 2017073559 A1 WO2017073559 A1 WO 2017073559A1 JP 2016081578 W JP2016081578 W JP 2016081578W WO 2017073559 A1 WO2017073559 A1 WO 2017073559A1
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- polyamide
- mass
- polyamide resin
- resin composition
- film
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
- C08L77/02—Polyamides derived from omega-amino carboxylic acids or from lactams thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C55/00—Shaping by stretching, e.g. drawing through a die; Apparatus therefor
- B29C55/02—Shaping by stretching, e.g. drawing through a die; Apparatus therefor of plates or sheets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/13—Phenols; Phenolates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/04—Homopolymers or copolymers of ethene
- C08L23/08—Copolymers of ethene
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/04—Homopolymers or copolymers of ethene
- C08L23/08—Copolymers of ethene
- C08L23/0846—Copolymers of ethene with unsaturated hydrocarbons containing atoms other than carbon or hydrogen
- C08L23/0869—Copolymers of ethene with unsaturated hydrocarbons containing atoms other than carbon or hydrogen with unsaturated acids, e.g. [meth]acrylic acid; with unsaturated esters, e.g. [meth]acrylic acid esters
- C08L23/0876—Salts thereof, i.e. ionomers
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/26—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers modified by chemical after-treatment
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
- C08L33/04—Homopolymers or copolymers of esters
- C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
Definitions
- the present invention relates to a polyamide resin composition and a film containing the same.
- a film made of a polyamide resin composition (hereinafter, a "film made of a polyamide resin composition” may be referred to as a "polyamide film” or a “resin film”) has gas barrier properties, toughness, pinhole resistance, heat resistance It is excellent in various characteristics such as elasticity and transparency. For this reason, polyamide films are widely used in various fields. Specifically, the polyamide film is also used as, for example, a food packaging member (see Patent Document 1).
- the polyamide film when a polyamide film is used as a food packaging member, the polyamide film may be heated upon heat sterilization. Therefore, in such a case, excellent thermal durability is required for the polyamide film.
- the main object of the present invention is to provide a polyamide resin composition that can provide a polyamide film having excellent thermal durability, and a film.
- the problems are solved by the following means ⁇ 1>, preferably by ⁇ 2> to ⁇ 11>.
- ⁇ 1> Polyamide resin, 0.1% by mass to 5% by mass of olefin elastomer, 0.01% by mass to 1% by mass of antioxidant, and 0.01% by mass to 3% by mass of ionomer resin
- the polyamide resin composition containing.
- ⁇ 2> The polyamide resin composition according to ⁇ 1>, wherein the polyamide resin comprises an aliphatic polyamide resin.
- ⁇ 4> The polyamide resin composition according to any one of ⁇ 1> to ⁇ 3>, wherein the olefin-based elastomer contains an ethylene-ethyl acrylate copolymer.
- ⁇ 5> The ⁇ 1> to ⁇ 3>, wherein the olefin-based elastomer contains an ethylene-ethyl acrylate copolymer, and the acrylic acid content of the ethylene-ethyl acrylate copolymer is 5% by mass to 30% by mass.
- ⁇ 6> The polyamide resin composition according to any one of ⁇ 1> to ⁇ 5>, wherein the antioxidant comprises a phenolic antioxidant.
- ⁇ 7> The polyamide resin composition according to any one of ⁇ 1> to ⁇ 6>, wherein the ionomer resin comprises at least one of an ethylene-methacrylic acid copolymer and an ethylene-acrylic acid copolymer.
- the olefin elastomer and the ionomer resin each independently contain at least one of an ethylene-methacrylic acid copolymer and an ethylene-acrylic acid copolymer The polyamide resin composition as described.
- the polyamide resin composition which can provide the polyamide film which has the outstanding thermal durability, and a film can be provided.
- the polyamide resin composition according to the present invention comprises a polyamide resin, 0.1% by mass to 5% by mass of an olefin elastomer, 0.01% by mass to 1% by mass of an antioxidant, and 0.01% by mass to And 3% by mass of ionomer resin.
- polyamide resin for example, homopolymers of aliphatic polyamides and copolymers using several kinds of raw material monomers forming these (i.e., aliphatic polyamide resins, homopolymers or copolymers Of the Specific examples of homopolymers of aliphatic polyamides and copolymers using several kinds of raw material monomers forming these include, for example, polycaproamide (polyamide 6), poêtcane amide (polyamide 11), polydodecane Amide (polyamide 12), polyethylene adipamide (polyamide 26), polytetramethylene succinamide (polyamide 44), polytetramethylene glutamide (polyamide 45), polytetramethylene adipamide (polyamide 46), polytetramethylene Suberamide (polyamide 48), polytetramethylene azelamide (polyamide 49), polytetramethylene sebacamide (polyamide 410), polytetramethylene dodecamide
- polyamide resin for example, polymethaxylylene adipamide (polyamide MXD6), polymethaxylylene beramide (polyamide MXD8), polymethaxylylene aceramide (polyamide MXD9), polymethaxylylene sebacamide (polyamide MXD10) Polymethaxylylene dodecamide (polyamide MXD12), polymethaxylylene terephthalamide (polyamide MXDT), polymethaxylylene isophtalamide (polyamide MXDI), polymethaxylylene hexahydroterephthalamide (polyamide MXDT (H)), polymers Taxylylene naphthalamide (polyamide MXDN), polyparaxylylene adipamide (polyamide PXD6), polyparaxylylenes beramide (polyamide PXD8), polyparaxylylene Ramid (polyamide PXD9), polyparaxylylene
- polycaproamide polyamide 6
- polymetaxylylene adipamide polyamide MXD 6
- polyundecane amide polyamide 11
- polydodecane amide polyamide 12
- polyhexamethylene adipate Pamide polyamide 66
- polyhexamethylene decamide polyamide 610
- polyhexamethylene dodecamide copolymer of polyamide 6 and polyamide 12
- polydecamethylene decamide polyamide 1010
- polydecamethylene dodecamide Polyamide 1012
- at least one homopolymer selected from the group consisting of polydodecamethylene dodecamide polyamide 1212
- at least one homopolymer selected from the group consisting of proamide polyamide 6
- poêtcane amide polyamide 11
- polydodecane amide polydodecane amide
- 90% by mass or more of the polyamide resin contained in the polyamide resin composition according to the present invention is preferably an aliphatic polyamide resin (for example, polyamide 6), and 95% by mass or more is an aliphatic polyamide resin (for example, polyamide) 6) is more preferably, 99% by mass or more is an aliphatic polyamide resin (for example, polyamide 6), and substantially 100% by mass is an aliphatic polyamide resin (for example, polyamide 6) Is more preferred.
- substantially 100% by mass means that all polyamide resins are aliphatic polyamide resins (e.g., polyamide 6) except for those which are unintentionally mixed with impurities and the like.
- the total amount of polyamide resin in the polyamide resin composition according to the present invention is preferably 80% by mass or more, more preferably 85% by mass or more, still more preferably 90% by mass or more, and further preferably 92% by mass or more of the composition. . 99.88 mass% or less is preferable, and the total amount of the said polyamide resin may be 99 mass% or less.
- a polyamide resin only 1 type of the said polyamide resin may be used independently, and multiple types of polyamide resin may be mixed and used. When mix
- the olefin elastomer is copolymerized with at least one selected from ethylene and propylene and at least one selected from an ⁇ , ⁇ -unsaturated carboxylic acid monomer and an ⁇ , ⁇ -unsaturated carboxylic acid ester monomer Polymer.
- Examples of the ⁇ , ⁇ -unsaturated carboxylic acid monomer include acrylic acid and methacrylic acid.
- ⁇ -unsaturated carboxylic acid ester monomers methyl ester, ethyl ester, propyl ester, butyl ester, pentyl ester, hexyl ester, heptyl ester, octyl ester, nonyl ester, decyl ester of these unsaturated carboxylic acids Or a mixture of these.
- olefin-based elastomer only one of the above-mentioned olefin-based elastomers may be used alone, or plural types of olefin-based elastomers may be mixed and used.
- ethylene- (meth) acrylic acid ester copolymer obtained by copolymerizing ethylene and (meth) acrylic acid ester monomer is preferable, and specifically, ethylene-ethyl acrylate copolymer, ethylene-methyl Acrylate copolymer, ethylene-ethyl methacrylate copolymer and the like are more preferable.
- an ethylene-ethyl acrylate copolymer is preferably used as an olefin elastomer from the viewpoint of the thermal stability at the time of molding and the effect of adding a small amount.
- the content of (meth) acrylic acid ester in the ethylene- (meth) acrylic acid ester copolymer is preferably 5 to 30% by mass.
- the content of the olefin-based elastomer is 0.1% by mass to 5% by mass of the polyamide resin composition.
- the content of the olefin elastomer is preferably 0.5% by mass or more, more preferably 0.8% by mass or more, and still more preferably 1% by mass or more.
- transparency of the resin film using a polyamide resin composition can be maintained by content of an olefin type elastomer being 5 mass% or less.
- the content of the olefin elastomer is preferably 4% by mass or less, more preferably 3.5% by mass or less, and still more preferably 3% by mass or less.
- olefin-based elastomer only one type may be used alone, or a plurality of olefin-based elastomers may be mixed and used. When using multiple types, it is preferable that a total amount becomes the said range.
- the content of the ethylene-ethyl acrylate copolymer is preferably 0.1% by mass to 5% by mass.
- the content of the ethylene-ethyl acrylate copolymer is more preferably 0.5% by mass or more, still more preferably 0.8% by mass or more, and 1% by mass or more. Is more preferred.
- the content of the ethylene-ethyl acrylate copolymer is more preferably 4% by mass or less, still more preferably 3.5% by mass or less, and still more preferably 3% by mass or less preferable.
- olefin elastomer only one of the above-mentioned ethylene-ethyl acrylate copolymers may be used alone, or a plurality of olefin elastomers may be mixed and used. When using multiple types, it is preferable that a total amount becomes the said range.
- a phenol type antioxidant represented by Irganox 1098, a hindered amine type antioxidant, a phosphorus type antioxidant represented by IRGAFOS 168 etc., a sulfur type antioxidant, a hydrazine type antioxidant, an amide
- a system antioxidant etc. are mentioned, a phenol type antioxidant is used preferably in this invention.
- N ′, N′-bis-3- examples include '-5'di-t-butyl-4'-hydroxyphenyl) propionyl hexamethylene diamine, pentaerythritol tetrakis [3- (3,5-di-tert-butyl-4-hydroxyphenyl) propionate] and the like.
- N ′, N′-bis-3- (3′-5′-di-t-butyl-4′-hydroxyphenyl) propionylhexamethylene diamine is preferably used as a phenolic antioxidant.
- the content of the antioxidant is 0.01% by mass to 1% by mass.
- the content of the antioxidant is preferably 0.05% by mass or more, more preferably 0.08% by mass or more, and still more preferably 0.1% by mass or more .
- the content of the antioxidant exceeds 1% by mass, long-term heat resistance can be expected, but from the viewpoint of practical material cost, the content of the antioxidant is 1% by mass or less, 0 .8 mass% or less is preferable, 0.5 mass% or less is more preferable, 0.3 mass% or less is more preferable.
- antioxidant only 1 type of the said antioxidant may be used independently, and multiple types of antioxidant may be mixed and used. When using multiple types, it is preferable that a total amount becomes the said range.
- the ionomer resin is an olefin / unsaturated carboxylic acid in which the side chain carboxyl group of the main chain consisting of an olefin unit and an ⁇ , ⁇ -unsaturated carboxylic acid unit is partially neutralized with metal ions (crosslinking via metal ions) It is a copolymer.
- the olefin examples include ethylene and propylene. Among them, ethylene is preferably used. As the ⁇ , ⁇ -unsaturated carboxylic acid, acrylic acid and methacrylic acid are preferably used, but other ⁇ , ⁇ -unsaturated carboxylic acid esters may be copolymerized. In the present invention, in particular, the ionomer resin preferably contains at least one of an ethylene-methacrylic acid copolymer and an ethylene-acrylic acid copolymer.
- the metal ion component of the neutralized carboxyl group includes, in addition to alkali metal ions such as lithium ion, sodium ion, potassium ion, magnesium ion, calcium ion, strontium ion and barium ion, alkaline earth metal ion, aluminum ion, tin ion, Examples thereof include titanium ions, manganese ions, iron ions, nickel ions, copper ions, zinc ions and cadmium ions. Only one of these metal ion components may be used, or two or more thereof may be used.
- the degree of neutralization of the carboxyl groups of the ionomer resin (the ratio of the number of neutralized carboxyl groups to the total number of carboxyl groups (the ratio of the number of neutralized carboxyl groups / the total number of carboxyl groups) x 100 (unit:%)) is 20% to 80% Is preferable, and 30% to 70% is more preferable.
- the degree of neutralization of the carboxyl group of the ionomer resin is 20% or more, the transparency of the obtained film becomes good, which is preferable. It is preferable for the degree of neutralization of the carboxyl group of the ionomer resin to be 80% or less, since the decrease in melt flowability of the ionomer resin is avoided and the transparency of the obtained film is improved.
- the content of the ionomer resin in the polyamide resin composition is preferably 0.01% by mass or more, and more preferably 0.05% by mass or more in the polyamide resin composition from the viewpoint of compatibility with the polyamide resin and the olefin elastomer. More preferably, it is 0.1 mass% or more. Similarly, from the viewpoint of film transparency, 3% by mass or less is preferable, more preferably 1% by mass or less, and still more preferably 0.6% by mass or less.
- the ionomer resin may be contained alone or in combination of two or more kinds in the polyamide resin composition. When 2 or more types are contained, it is preferable that a total amount becomes said range.
- the ionomer resin may react with the ionomer resin or with other components in the polyamide resin composition or film, but this case is also included in the range of the polyamide resin composition or film according to the present invention. Needless to say.
- the mass ratio (ionomer resin / olefin elastomer) of the ionomer resin to the olefin elastomer in the polyamide resin composition is preferably 0.04 to 0.4.
- the lower limit value of the mass ratio is more preferably 0.05 or more, and the upper limit value of the mass ratio is more preferably 0.3 or less.
- the olefin elastomer and the ionomer resin independently contain at least one of an ethylene-methacrylic acid copolymer and an ethylene-acrylic acid copolymer. In such a case, the compatibility between the two is improved, and the above effect is more effectively exhibited.
- the polyamide resin composition according to the present invention may contain, for example, an antiblocking agent, a lubricant, a nucleating agent, a foaming agent, a stabilizer, a coupling agent and the like in addition to the above components, but is not limited thereto.
- Each of these additives may be contained alone or in combination of two or more. However, the content of these additives is preferably 10% by mass or less, more preferably 5% by mass or less, still more preferably 3% by mass or less, based on the total mass of the polyamide resin composition. Is 1% by mass or less.
- the polyamide resin composition which concerns on this invention may contain thermoplastic resins other than a polyamide resin, it is preferable not to contain.
- the thermoplastic resin other than the polyamide resin contained in the polyamide resin composition according to the present invention is preferably 1% by mass or less of the polyamide resin.
- the method for producing the polyamide resin composition is not particularly limited, and various additives may be blended if necessary, and various methods conventionally known can be adopted.
- the polyamide resin composition is, for example, a method of dry blending uniformly to a specific ratio using a tumbler or a mixer, or a method of melt-kneading a mixture obtained by dry blending with a melt kneader, It can manufacture by the method etc. which carry out the dry blending with the remainder, after knead
- Melt-kneading can be performed using kneaders, such as a single-screw extruder, a twin-screw extruder, a kneader, and a Banbury mixer.
- the film according to the present invention comprises the polyamide resin composition according to the present invention.
- the film according to the present invention is preferably formed of a polyamide resin composition.
- the thickness of the film according to the present invention is preferably 1 to 300 ⁇ m.
- the film according to the present invention may be, for example, a stretched film.
- the polyamide resin composition is melt-kneaded using an extruder, extruded into a film form using a die such as a T-die or a coat hanger die, cast on a casting roll surface, and then cooled. Contained films can be produced.
- the produced film may be subjected to a stretching treatment to form a stretched film. In that case, the produced film may be uniaxially stretched to be a uniaxially stretched film, or may be biaxially stretched to be a biaxially stretched film.
- the film laminate according to the present invention is a laminate of a plurality of films including the film according to the present invention.
- the film laminate according to the present invention can be produced, for example, by thermocompression bonding a plurality of films including the film according to the present invention.
- the produced film laminate may be subjected to a stretching treatment to form a stretched film laminate.
- the produced film laminate may be uniaxially stretched to be a uniaxially stretched film laminate, or may be biaxially stretched to be a biaxially stretched film laminate.
- the film laminated body which concerns on this invention may be comprised, for example by the core layer and the skin layer which covers each of both surfaces of a core layer.
- the skin layer be constituted of the polyamide resin composition according to the present invention.
- the core layer is made of a barrier resin such as polymetaxylylene adipamide (polyamide MXD6) or ethylene-vinyl alcohol copolymer
- the skin layer is made of the polyamide resin composition according to the present invention.
- the film according to the present invention contains the polyamide resin 6, it is a packaging material for food, and is preferably used particularly for applications to be heat-treated.
- a preferred embodiment of the present invention is a film according to the present invention, which is a film laminate of a film containing polyamide resin 6 and a barrier layer (for example, ethylene-vinyl alcohol copolymer (EVOH)). .
- the details of the film laminate can be referred to the description of JP-A-2001-341253, the contents of which are incorporated herein.
- a laminate in which the composition constituting the layer B is replaced with the polyamide resin composition according to the present invention in JP-A-2001-341253 is preferable.
- Polyamide resin Polyamide 6 (hereinafter also referred to as "PA 6", trade name: UBE nylon 1022 B (manufactured by Ube Industries, Ltd.))
- Olefin-based elastomer ethylene-ethyl acrylate copolymer (hereinafter, also referred to as "ethylene-ethyl acrylate resin”, trade name: UBE polyethylene ZE 708 (manufactured by Ube Maruzen Polyethylene Co., Ltd.)
- Acrylic in ethylene-ethyl acrylate copolymer The content of acid ester is 16% by mass.
- Olefin-based elastomer ethylene-ethyl acrylate copolymer, trade name: UBE polyethylene ZE 742 (manufactured by Ube Maruzen Polyethylene Corporation) The content of acrylic ester in the ethylene-ethyl acrylate copolymer is 25% by mass.
- Antioxidant Phenolic antioxidant, Irganox 1098 (manufactured by BASF)
- Ionomer resin Zn 2+ ionomer of ethylene-methacrylic acid copolymer, degree of neutralization of carboxyl group of ionomer resin 60%, trade name: HIMIRAN 1706 (manufactured by Mitsui & DuPont Co., Ltd.)
- Example 1 Dry blend of 98.7% by mass of polyamide 6, 1% by mass of ethylene-ethyl acrylate copolymer (ZE 708), 0.1% by mass of antioxidant, and 0.2% by mass of ionomer resin The mixture was mixed to obtain a polyamide resin composition.
- the film which consists of a polyamide resin composition was obtained using the Pravo T-die shaping
- the set temperature of the extruder was 200 to 260 ° C.
- the temperature of the die was 260 ° C.
- the temperature of the cooling roll was 30 ° C. Films with thicknesses of 100 ⁇ m and 50 ⁇ m were produced by changing the winding speed of the roll.
- Example 2 The content of polyamide 6 in the polyamide resin composition is 96.1% by mass, the content of ethylene-ethyl acrylate copolymer (ZE 708) is 3% by mass, and the content of antioxidant is 0.3% by mass.
- a film of a polyamide resin composition was produced in the same manner as in Example 1 except that the content of the ionomer resin was 0.6% by mass.
- Example 3 The content of polyamide 6 in the polyamide resin composition is 99.3% by mass, the content of ethylene-ethyl acrylate copolymer (ZE 708) is 0.5% by mass, and the content of antioxidant is 0.1% %, And a polyamide film was produced in the same manner as in Example 1 except that the content of the ionomer resin was 0.1% by mass.
- Example 4 The content of polyamide 6 in the polyamide resin composition is 98.7% by mass, the content of ethylene-ethyl acrylate copolymer (ZE 742) is 1% by mass, and the content of antioxidant is 0.1% by mass.
- a polyamide film was produced in the same manner as in Example 1 except that the content of the ionomer resin was 0.2% by mass.
- Example 5 The content of polyamide 6 in the polyamide resin composition is 96.1% by mass, the content of ethylene-ethyl acrylate copolymer (ZE 742) is 3% by mass, and the content of antioxidant is 0.3% by mass.
- a polyamide film was produced in the same manner as in Example 1 except that the ionomer resin content was 0.6% by mass.
- Example 1 A polyamide film was produced in the same manner as in Example 1 using only polyamide 6 to prepare a polyamide film.
- Example 2 A polyamide film was produced in the same manner as in Example 1 except that the content of polyamide 6 in the polyamide resin composition was 99.9% by mass, and the ethylene-ethyl acrylate copolymer (ZE 708) and the ionomer resin were not used. .
- the content of the polyamide 6 in the polyamide resin composition is 99.0 mass%, the content of the ethylene-ethyl acrylate copolymer (ZE 708) is 1 mass%, and the antioxidant and the ionomer resin are not used.
- a polyamide film was produced in the same manner as in Example 1.
- the content of polyamide 6 in the polyamide resin composition is 97.0% by mass, the content of ethylene-ethyl acrylate copolymer (ZE 708) is 3% by mass, and no antioxidant and ionomer resin are used.
- a polyamide film was produced in the same manner as in Example 1.
- the content of polyamide 6 in the polyamide resin composition is 99.0 mass%, ethylene-ethyl acrylate copolymer and antioxidant are not used, and the content of ionomer resin is 1 mass%.
- a polyamide film was produced in the same manner as in Example 1.
- the content of polyamide 6 in the polyamide resin composition is 98.8% by mass, the content of ethylene-ethyl acrylate copolymer (ZE 708) is 1% by mass, and the content of ionomer resin is 0.2% by mass.
- a polyamide film was produced in the same manner as in Example 1 except that no inhibitor was used.
- the haze value of the biaxially stretched film was measured by Haze Meter manufactured by Nippon Denshoku Kogyo Co., Ltd. according to ASTM D-1003. Specifically, a 100 ⁇ m thick film is preheated for 60 seconds at 100 ° C. using a biaxial drawing machine BIX-703 manufactured by Iwamoto Seisakusho, and then the extrusion direction (MD direction) at T die forming and the right angle thereof After stretching in 3.0 directions at a deformation rate of 150 mm / sec in two directions (TD direction), heat treatment is performed with heated air at 200 ° C. for 30 seconds, and then cooled and taken out from the stretching tank. A biaxially stretched film of about 15 ⁇ m was obtained. The above-mentioned haze value was measured using the obtained biaxially stretched film.
- Elongation retention (%) tensile elongation at break after hot water treatment (%) / tensile elongation at break before hot water treatment (%) x 100
- the film using the polyamide resin composition according to the present invention was high in tensile elongation at break and elongation retention, and also excellent in pinhole resistance even after hot water treatment. Furthermore, as is clear from the comparison of Example 1 with Comparative Example 3 and Example 2 with Comparative Example 4, it was possible to significantly lower the haze by blending the antioxidant and the ionomer resin. In addition, when no antioxidant was contained (Comparative Examples 5 to 7), various physical properties after the hot water treatment were remarkably inferior. In particular, the performance was inferior to the case where a film consisting only of a polyamide resin was used (Comparative Example 1). When the ionomer antioxidant was not contained (comparative example 8), the haze became high.
- polyamide resin composition As a polyamide resin composition, polyamide 6 as a polyamide resin, UBE polyethylene ZE 708 as an olefin elastomer, and HIMIRAN 1706 as an ionomer resin were blended so as to have the mass ratio shown in Table 3.
- the obtained polyamide resin composition was used to form an unstretched single-layer film having a thickness of 100 ⁇ m according to Example 1. Furthermore, it carried out similarly to the method as described in the item of haze, and obtained a 15-micrometer-thick stretched single layer film. The tensile elastic modulus of the obtained stretched single-layer film is measured at 23 ° C.
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Abstract
Description
<1>ポリアミド樹脂と、0.1質量%~5質量%のオレフィン系エラストマーと、0.01質量%~1質量%の酸化防止剤と、0.01質量%~3質量%のアイオノマー樹脂と、を含む、ポリアミド樹脂組成物。
<2>前記ポリアミド樹脂が脂肪族ポリアミド樹脂を含む、<1>に記載のポリアミド樹脂組成物。
<3>前記ポリアミド樹脂がポリアミド6を含む、<1>に記載のポリアミド樹脂組成物。
<4>前記オレフィン系エラストマーが、エチレン-エチルアクリレート共重合体を含む、<1>~<3>のいずれか一つに記載のポリアミド樹脂組成物。
<5>前記オレフィン系エラストマーが、エチレン-エチルアクリレート共重合体を含み、前記エチレン-エチルアクリレート共重合体におけるアクリル酸含有量が5質量%~30質量%である、<1>~<3>のいずれか一つに記載のポリアミド樹脂組成物。
<6>前記酸化防止剤がフェノール系酸化防止剤を含む、<1>~<5>のいずれか一つに記載のポリアミド樹脂組成物。
<7>前記アイオノマー樹脂が、エチレン-メタクリル酸共重合体及びエチレン-アクリル酸共重合体の少なくとも一方を含む、<1>~<6>のいずれか一つに記載のポリアミド樹脂組成物。
<8>前記オレフィン系エラストマー及びアイオノマー樹脂が、それぞれ独立に、エチレン-メタクリル酸共重合体及びエチレン-アクリル酸共重合体の少なくとも一方を含む、<1>~<7>のいずれか一つに記載のポリアミド樹脂組成物。
<9>前記ポリアミド樹脂組成物に含まれるポリアミド樹脂の99質量%以上が脂肪族ポリアミド樹脂である、<1>~<8>のいずれか一つに記載のポリアミド樹脂組成物。
<10><1>~<9>のいずれか一つに記載のポリアミド樹脂組成物を含むフィルム。
<11>延伸フィルムである、<10>に記載のフィルム。
本明細書において、「~」を用いて表される数値範囲は、「~」の前後に記載される数値を下限値及び上限値として含む範囲を意味する。また、「(メタ)アクリル」は、「アクリル」及び「メタクリル」の双方、又は、いずれかを表す。
ポリアミド樹脂としては、例えば、脂肪族ポリアミドの単独重合体やこれらを形成する原料単量体を数種用いた共重合体等(すなわち、脂肪族ポリアミド樹脂であって、単独重合体又は共重合体のもの)が挙げられる。脂肪族ポリアミドの単独重合体やこれらを形成する原料単量体を数種用いた共重合体の具体例としては、例えば、ポリカプロアミド(ポリアミド6)、ポリウンデカンアミド(ポリアミド11)、ポリドデカンアミド(ポリアミド12)、ポリエチレンアジパミド(ポリアミド26)、ポリテトラメチレンスクシナミド(ポリアミド44)、ポリテトラメチレングルタミド(ポリアミド45)、ポリテトラメチレンアジパミド(ポリアミド46)、ポリテトラメチレンスベラミド(ポリアミド48)、ポリテトラメチレンアゼラミド(ポリアミド49)、ポリテトラメチレンセバカミド(ポリアミド410)、ポリテトラメチレンドデカミド(ポリアミド412)、ポリペンタメチレンスクシナミド(ポリアミド54)、ポリペンタメチレングルタミド(ポリアミド55)、ポリペンタメチレンアジパミド(ポリアミド56)、ポリペンタメチレンスベラミド(ポリアミド58)、ポリペンタメチレンアゼラミド(ポリアミド59)、ポリペンタメチレンセバカミド(ポリアミド510)、ポリペンタメチレンドデカミド(ポリアミド512)、ポリヘキサメチレンスクシナミド(ポリアミド64)、ポリヘキサメチレングルタミド(ポリアミド65)、ポリヘキサメチレンアジパミド(ポリアミド66)、ポリヘキサメチレンスベラミド(ポリアミド68)、ポリヘキサメチレンアゼラミド(ポリアミド69)、ポリヘキサメチレンセバカミド(ポリアミド610)、ポリヘキサメチレンドデカミド(ポリアミド6とポリアミド12との共重合体)、ポリヘキサメチレンテトラデカミド(ポリアミド614)、ポリヘキサメチレンヘキサデカミド(ポリアミド616)、ポリヘキサメチレンオクタデカミド(ポリアミド618)、ポリノナメチレンアジパミド(ポリアミド96)、ポリノナメチレンスベラミド(ポリアミド98)、ポリノナメチレンアゼラミド(ポリアミド99)、ポリノナメチレンセバカミド(ポリアミド910)、ポリノナメチレンドデカミド(ポリアミド912)、ポリデカメチレンアジパミド(ポリアミド106)、ポリデカメチレンスベラミド(ポリアミド108)、ポリデカメチレンアゼラミド(ポリアミド109)、ポリデカメチレンセバカミド(ポリアミド1010)、ポリデカメチレンドデカミド(ポリアミド1012)、ポリドデカメチレンアジパミド(ポリアミド126)、ポリドデカメチレンスベラミド(ポリアミド128)、ポリドデカメチレンアゼラミド(ポリアミド129)、ポリドデカメチレンセバカミド(ポリアミド1210)、ポリドデカメチレンドデカミド(ポリアミド1212)等が挙げられる。
本発明に係るポリアミド樹脂組成物に含まれるポリアミド樹脂は、その90質量%以上が脂肪族ポリアミド樹脂(例えば、ポリアミド6)であることが好ましく、95質量%以上が脂肪族ポリアミド樹脂(例えば、ポリアミド6)であることがより好ましく、99質量%以上が脂肪族ポリアミド樹脂(例えば、ポリアミド6)であることがさらに好ましく、実質的に100質量%が脂肪族ポリアミド樹脂(例えば、ポリアミド6)であることが一層好ましい。実質的に100質量%とは、不純物等意図せず配合するものを除き、すべてのポリアミド樹脂が脂肪族ポリアミド樹脂(例えば、ポリアミド6)であることをいう。
ポリアミド樹脂として、上記ポリアミド樹脂の1種のみを単独で用いてもよいし、複数種類のポリアミド樹脂を混合して用いてもよい。複数種類を配合する場合、合計量が上記範囲となることが好ましい。
オレフィン系エラストマーは、エチレン及びプロピレンから選ばれる少なくとも1種と、α,β-不飽和カルボン酸単量体及びα,β-不飽和カルボン酸エステル単量体から選ばれる少なくとも1種とを共重合した重合体である。
酸化防止剤としては、イルガノックス1098に代表されるフェノール系酸化防止剤、ヒンダードアミン系酸化防止剤、IRGAFOS168等に代表されるリン系酸化防止剤、イオウ系酸化防止剤、ヒドラジン系酸化防止剤、アミド系酸化防止剤等が挙げられるが、本発明においてはフェノール系酸化防止剤が好ましく用いられる。具体例として、例えば、ビス[3-(3-tert-ブチル-4-ヒドロキシ-5-メチルフェニル)プロピオン酸][エチレンビス(オキシエチレン)]、N’,N’-ビス-3-(3’-5’ジ-t-ブチル-4’-ヒドロキシフェニル)プロピオニルヘキサメチレンジアミン、ペンタエリトリトールテトラキス[3-(3,5-ジ-tert-ブチル-4-ヒドロキシフェニル)プロピオナート]等が挙げられる。なかでも、N’,N’-ビス-3-(3’-5’ジ-t-ブチル-4’-ヒドロキシフェニル)プロピオニルヘキサメチレンジアミンがフェノール系酸化防止剤として好ましく用いられる。
アイオノマー樹脂は、オレフィン単位とα,β-不飽和カルボン酸単位とからなる主鎖の側鎖カルボキシル基を金属イオンで部分的に中和(金属イオンを介して架橋)したオレフィン/不飽和カルボン酸共重合体である。
本発明では、特に、アイオノマー樹脂が、エチレン-メタクリル酸共重合体及びエチレン-アクリル酸共重合体の少なくとも一方を含むことが好ましい。
また、アイオノマー樹脂が、ポリアミド樹脂組成物又はフィルム中において、アイオノマー樹脂同士又は他の成分と反応している場合もあるが、この場合も本発明に係るポリアミド樹脂組成物又はフィルムの範囲に含まれることは言うまでもない。
特に、オレフィン系エラストマー及びアイオノマー樹脂が、それぞれ独立に、エチレン-メタクリル酸共重合体及びエチレン-アクリル酸共重合体の少なくとも一方を含むことが好ましい。このような場合、両者の相溶性が向上し、上記効果がより効果的に発揮される。
本発明に係るポリアミド樹脂組成物は、上記成分に加え、例えば、アンチブロッキング剤、滑剤、核剤、発泡剤、安定剤及びカップリング剤などを含んでいてもよいが、これらに限定されない。これらの添加剤は、それぞれ、1種のみ含まれていてもよいし、2種以上含まれていてもよい。但し、これらの添加剤の配合量は、ポリアミド樹脂組成物の合計質量に対して10質量%以下が好ましく、より好ましくは5質量%以下であり、さらに好ましくは3質量%以下であり、一層好ましくは1質量%以下である。上記添加剤を配合する場合、配合量の下限値としては、ポリアミド樹脂組成物の合計質量に対して0.01質量%以上であることが好ましい。
また、本発明に係るポリアミド樹脂組成物は、ポリアミド樹脂以外の熱可塑性樹脂を含んでいてもよいが、含んでいない方が好ましい。具体的には、本発明に係るポリアミド樹脂組成物に含まれるポリアミド樹脂以外の熱可塑性樹脂は、ポリアミド樹脂の1質量%以下であることが好ましい。
本発明に係るフィルムは、上記本発明に係るポリアミド樹脂組成物を含む。本発明に係るフィルムは、ポリアミド樹脂組成物から形成されることが好ましい。本発明に係るフィルムの厚さは、1~300μmが好ましい。本発明に係るフィルムは、例えば、延伸フィルムであってもよい。
本発明に係るフィルム積層体は、上記本発明に係るフィルムを含む複数のフィルムの積層体である。本発明に係るフィルム積層体は、例えば、本発明に係るフィルムを含む複数のフィルムを熱圧着することにより製造することができる。製造したフィルム積層体を延伸処理して、延伸フィルム積層体としてもよい。その場合、製造したフィルム積層体を一軸延伸して一軸延伸フィルム積層体としてもよいし、二軸延伸して二軸延伸フィルム積層体としてもよい。
特に、本発明に係るフィルムが、ポリアミド樹脂6を含む場合、食品用包装材料であって、特に加熱処理される用途に好ましく用いられる。
本発明の好ましい一実施形態として、本発明に係るフィルムであって、ポリアミド樹脂6を含むフィルムと、バリア層(例えば、エチレン-ビニルアルコール共重合体(EVOH))とのフィルム積層体が挙げられる。
ポリアミド樹脂:ポリアミド6(以下「PA6」とも称す、商品名:UBEナイロン1022B(宇部興産株式会社製))
オレフィン系エラストマー:エチレン-エチルアクリレート共重合体(以下、「エチレン-エチルアクリレート樹脂」、とも称す)、商品名:UBEポリエチレンZE708(宇部丸善ポリエチレン株式会社製)) エチレン-エチルアクリレート共重合体におけるアクリル酸エステルの含有量は16質量%である。
オレフィン系エラストマー:エチレン-エチルアクリレート共重合体、商品名:UBEポリエチレンZE742(宇部丸善ポリエチレン株式会社製)) エチレン-エチルアクリレート共重合体におけるアクリル酸エステルの含有量は25質量%である。
酸化防止剤:フェノール系酸化防止剤、イルガノックス(Irganox)1098(BASF社製)
アイオノマー樹脂:エチレン-メタクリル酸共重合体のZn2+アイオノマー、アイオノマー樹脂のカルボキシル基の中和度60%、商品名:ハイミラン1706(三井・デュポン株式会社製)
ポリアミド6を98.7質量%と、エチレン-エチルアクリレート共重合体(ZE708)を1質量%と、酸化防止剤を0.1質量%と、アイオノマー樹脂を0.2質量%とをドライブレンドにて混合し、ポリアミド樹脂組成物を得た。プラボー社製Tダイ成形装置(ダイ幅:300mm)を用いて、ポリアミド樹脂組成物からなるフィルムを得た。押出機の設定温度を200~260℃、ダイの温度を260℃、冷却ロールの温度を30℃で成形した。ロールの巻き取り速度を変えて、厚み100μmと50μmのフィルムを作製した。
ポリアミド樹脂組成物におけるポリアミド6の含有量を96.1質量%とし、エチレン-エチルアクリレート共重合体(ZE708)の含有量を3質量%とし、酸化防止剤の含有量を0.3質量%とし、アイオノマー樹脂の含有量を0.6質量%としたこと以外は、実施例1と同様にしてポリアミド樹脂組成物からなるフィルムを作製した。
ポリアミド樹脂組成物におけるポリアミド6の含有量を99.3質量%とし、エチレン-エチルアクリレート共重合体(ZE708)の含有量を0.5質量%とし、酸化防止剤の含有量を0.1質量%とし、アイオノマー樹脂の含有量を0.1質量%としたこと以外は、実施例1と同様にしてポリアミドフィルムを作製した。
ポリアミド樹脂組成物におけるポリアミド6の含有量を98.7質量%とし、エチレン-エチルアクリレート共重合体(ZE742)の含有量を1質量%とし、酸化防止剤の含有量を0.1質量%とし、アイオノマー樹脂の含有量を0.2質量%としたこと以外は、実施例1と同様にしてポリアミドフィルムを作製した。
ポリアミド樹脂組成物におけるポリアミド6の含有量を96.1質量%とし、エチレン-エチルアクリレート共重合体(ZE742)の含有量を3質量%とし、酸化防止剤の含有量を0.3質量%とし、アイオノマー樹脂の含有量を0.6質量%としたこと以外は、実施例1と同様にしてポリアミドフィルムを作製した。
ポリアミド6のみを用いてポリアミドフィルムを実施例1と同様にしてポリアミドフィルムを作製した。
ポリアミド樹脂組成物におけるポリアミド6の含有量を99.9質量%とし、エチレン-エチルアクリレート共重合体(ZE708)及びアイオノマー樹脂を用いなかったこと以外は実施例1と同様にしてポリアミドフィルムを作製した。
ポリアミド樹脂組成物におけるポリアミド6の含有量を99.0質量%とし、エチレン-エチルアクリレート共重合体(ZE708)の含有量を1質量%とし、酸化防止剤及びアイオノマー樹脂を用いなかったこと以外は実施例1と同様にしてポリアミドフィルムを作製した。
ポリアミド樹脂組成物におけるポリアミド6の含有量を97.0質量%とし、エチレン-エチルアクリレート共重合体(ZE708)の含有量を3質量%とし、酸化防止剤及びアイオノマー樹脂を用いなかったこと以外は実施例1と同様にしてポリアミドフィルムを作製した。
ポリアミド樹脂組成物におけるポリアミド6の含有量を99.0質量%とし、エチレン-エチルアクリレート共重合体、酸化防止剤を使用しなかったこと、アイオノマー樹脂の含有量を1質量%としたこと以外は、実施例1と同様にしてポリアミドフィルムを作製した。
ポリアミド樹脂組成物におけるポリアミド6の含有量を97.0質量%とし、エチレン-エチルアクリレート共重合体、酸化防止剤を使用しなかったこと、アイオノマー樹脂の含有量を3質量%としたこと以外は、実施例1と同様にしてポリアミドフィルムを作製した。
ポリアミド樹脂組成物におけるポリアミド6の含有量を98.8質量%とし、エチレン-エチルアクリレート共重合体(ZE708)の含有量を1質量%、アイオノマー樹脂の含有量を0.2質量%とし、酸化防止剤を使用しなかったこと以外は、実施例1と同様にしてポリアミドフィルムを作製した。
ポリアミド樹脂組成物におけるポリアミド6の含有量を98.9質量%とし、エチレン-エチルアクリレート共重合体(ZE708)の含有量を1質量%、酸化防止剤の含有量を0.1質量%とし、アイオノマー樹脂を使用しなかったこと以外は、実施例1と同様にしてポリアミドフィルムを作製した。
ポリアミド樹脂組成物におけるポリアミド6の含有量を99.6質量%とし、エチレン-エチルアクリレート共重合体(ZE708)の含有量を0.25質量%とし、酸化防止剤の含有量を0.1質量%とし、アイオノマー樹脂の含有量を0.05質量%としたこと以外は、実施例1と同様にしてポリアミドフィルムを作製した。
上記実施例1~5、ならびに、比較例1~8のそれぞれにおいて厚み50μmのフィルムを2枚ずつ作製し、各例において作製した2枚のうちの1枚に135℃の水蒸気雰囲気下に30分保持する熱水処理を行った。以下、熱水処理を行わなかったフィルムを「熱水処理前フィルム」とし、熱水処理を行ったフィルムを「熱水処理後フィルム」とする。
日本電色工業(株)製、Haze Meterにより、ASTM D-1003に準じて、二軸延伸したフィルムの曇価(ヘイズ率)を測定した。具体的には、厚み100μmのフィルムを岩本製作所製の二軸延伸機BIX-703型を用いて、100℃で、60秒間予熱した後、Tダイ成形時の押出方向(MD方向)及びその直角方向(TD方向)の2方向に、150mm/秒の変形速度で3.0倍に延伸した後、200℃の加熱空気で30秒間熱処理を行い、その後、冷却して延伸槽から取り出して、厚み15μm程度の二軸延伸フィルムを得た。得られた二軸延伸フィルムを用いて上記の曇価を測定した。
エー・アンド・デイ製、テンシロン万能材料試験機、RTA-10KNにより、ASTM D-882に準じて、引張速度300mm/分、チャック間距離50mmの条件にて、厚み50μmの熱水処理前フィルム及び熱水処理後フィルムのそれぞれの引張破断伸度(%)を測定した。熱水処理後の引張破断伸びの伸度保持率(%)は下記の式から算出した。
理学工業(株)製、恒温槽付ゲルボフレックステスターにより、MIL-B-131Cに従い、23℃、50%相対湿度(RH)環境下で1000回の屈曲テストを、厚み50μmの熱水処理前フィルム及び熱水処理後フィルムのそれぞれに対して行った後、そのフィルムを記録紙上に設置後、墨汁を塗り、記録紙上に記録された黒点の数を測定した。その結果、個数が90個未満を「○」、個数が90個以上、120個未満を「△」、個数が120個以上を「×」と判断した。
さらに、実施例1と比較例3、実施例2と比較例4の比較から明らかな通り、酸化防止剤とアイオノマー樹脂を配合することにより、ヘイズを格段に低くすることが可能になった。
また、酸化防止剤を含まないと(比較例5~7)、熱水処理後の各種物性が格段に劣る結果となった。特に、ポリアミド樹脂のみからなるフィルムを用いた場合(比較例1)などよりも性能が劣っていた。
アイオノマー酸化防止剤を含まないと(比較例8)、ヘイズが高くなってしまった。
ポリアミド樹脂組成物として、ポリアミド樹脂としてポリアミド6、オレフィン系エラストマーとしてUBEポリエチレンZE708、アイオノマー樹脂としてハイミラン1706を表3に示す質量比となるように、配合した。
得られたポリアミド樹脂組成物を実施例1に従い、厚みが100μmの未延伸単層フィルムを成形した。さらに、ヘイズの項目に記載の方法と同様にして、厚み15μmの延伸単層フィルムを得た。得られた延伸単層フィルムの引張弾性率を(引張試験機(エー・アンド・デイ製、テンシロン万能材料試験機RTA-10KN)により、ASTM D-882)に従い、23℃、50%相対湿度(RH)の雰囲気下で測定した。結果を下記表3に示す。
Claims (11)
- ポリアミド樹脂と、
0.1質量%~5質量%のオレフィン系エラストマーと、
0.01質量%~1質量%の酸化防止剤と、
0.01質量%~3質量%のアイオノマー樹脂と、
を含む、ポリアミド樹脂組成物。 - 前記ポリアミド樹脂が脂肪族ポリアミド樹脂を含む、請求項1に記載のポリアミド樹脂組成物。
- 前記ポリアミド樹脂がポリアミド6を含む、請求項1に記載のポリアミド樹脂組成物。
- 前記オレフィン系エラストマーが、エチレン-エチルアクリレート共重合体を含む、請求項1~3のいずれか一項に記載のポリアミド樹脂組成物。
- 前記オレフィン系エラストマーが、エチレン-エチルアクリレート共重合体を含み、前記エチレン-エチルアクリレート共重合体におけるアクリル酸含有量が5質量%~30質量%である、請求項1~3のいずれか一項に記載のポリアミド樹脂組成物。
- 前記酸化防止剤がフェノール系酸化防止剤を含む、請求項1~5のいずれか一項に記載のポリアミド樹脂組成物。
- 前記アイオノマー樹脂が、エチレン-メタクリル酸共重合体及びエチレン-アクリル酸共重合体の少なくとも一方を含む、請求項1~6のいずれか一項に記載のポリアミド樹脂組成物。
- 前記オレフィン系エラストマー及びアイオノマー樹脂が、それぞれ独立に、エチレン-メタクリル酸共重合体及びエチレン-アクリル酸共重合体の少なくとも一方を含む、請求項1~7のいずれか一項に記載のポリアミド樹脂組成物。
- 前記ポリアミド樹脂組成物に含まれるポリアミド樹脂の99質量%以上が脂肪族ポリアミド樹脂である、請求項1~8のいずれか一項に記載のポリアミド樹脂組成物。
- 請求項1~9のいずれか一項に記載のポリアミド樹脂組成物を含むフィルム。
- 延伸フィルムである、請求項10に記載のフィルム。
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| JP2017547801A JP6838555B2 (ja) | 2015-10-30 | 2016-10-25 | ポリアミド樹脂組成物、フィルム |
| KR1020187014647A KR20180079366A (ko) | 2015-10-30 | 2016-10-25 | 폴리아미드 수지 조성물 및 필름 |
| CN201680063088.9A CN108350270B (zh) | 2015-10-30 | 2016-10-25 | 聚酰胺树脂组合物、膜 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2018221378A1 (ja) * | 2017-05-30 | 2018-12-06 | 宇部興産株式会社 | ポリアミド樹脂組成物及びそれを用いた離型フィルム |
| WO2020195979A1 (ja) | 2019-03-26 | 2020-10-01 | 三井・ダウ ポリケミカル株式会社 | 樹脂組成物及び成形体 |
| JP2022149536A (ja) * | 2021-03-25 | 2022-10-07 | Ube株式会社 | ポリアミド樹脂組成物、それを含むフィルム及びフィルム積層体、並びにペレット混合物 |
| WO2023243672A1 (ja) | 2022-06-14 | 2023-12-21 | Ube株式会社 | ポリアミド樹脂組成物、並びにそれを含むフィルム及びフィルム積層体 |
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- 2016-10-25 CN CN201680063088.9A patent/CN108350270B/zh active Active
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| KR20210137095A (ko) | 2019-03-26 | 2021-11-17 | 미츠이·다우 폴리케미칼 가부시키가이샤 | 수지 조성물 및 성형체 |
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| JP7666059B2 (ja) | 2021-03-25 | 2025-04-22 | Ube株式会社 | ポリアミド樹脂組成物、それを含むフィルム及びフィルム積層体、並びにペレット混合物 |
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| TW201728680A (zh) | 2017-08-16 |
| KR20180079366A (ko) | 2018-07-10 |
| JP6838555B2 (ja) | 2021-03-03 |
| JPWO2017073559A1 (ja) | 2018-08-23 |
| CN108350270A (zh) | 2018-07-31 |
| CN108350270B (zh) | 2021-05-11 |
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