WO2017049791A1 - Electronic component and electronic assembly - Google Patents

Abstract

An electronic component (100) and an electronic assembly. The electronic assembly comprises a circuit board (200) and the electronic component (100), and the electronic component (100) comprises a component main body (101) and a first soldering leg (102) connected to the component main body (101), wherein the centre of gravity of the electronic component (100) is balanced by providing a limiting member (104) on the first soldering leg (102), so that the electronic component (100) can be naturally positioned when being mounted without the occurrence of shifting due to gravity, thus the electronic component (100) can be firmly fixed on the circuit board (200), thereby reducing the possibility of insufficient soldering of the soldering leg, and improving the production efficiency.

Description

Electronic component and electronic component Technical field

The utility model relates to the field of electronics, in particular to an electronic component and an electronic component.

Background technique

At present, the connectors on the circuit board of the power module on the market usually adopt a straight-in soldering pin fixing method. When the center of gravity of the electronic component is not located between the soldering legs, it is easy to be skewed during soldering, thereby causing soldering feet. In the case of virtual welding, the distance between the electronic components and the surrounding electronic components is shortened, and the solder joints will affect the conduction of the electronic components, so that the electronic components can not work normally, there will be potential quality hazards, directly Affects production efficiency.

Utility model content

The main technical problem to be solved by the utility model is to provide an electronic component and an electronic component, which solves the problem that in the prior art, when the electronic component is installed, the electronic component is deviated from the normal position due to the action of gravity, and the soldering foot is soldered. In order to prevent the electronic components from working properly, there are potential quality hazards that directly affect production efficiency.

In order to solve the above technical problem, the present invention provides an electronic component, including a component body and a first soldering leg connected to the component body, and a limiting component disposed at a lower end of the first soldering leg. Connecting a center of gravity of the limiting member to a center of gravity of the component body through the first soldering leg; when mounting, the lower end of the first soldering leg passes through a corresponding via hole on the circuit board to The device body is fixed on the circuit board; the limiting member is in close contact with the bottom surface of the circuit board.

Further, the first solder fillet is disposed at an end of the component body.

Further, the electronic component is a current bus bar.

Further, a portion of the first soldering foot that is in contact with the via hole wall is in an interference fit or a transition fit with the via hole.

Further, the method further includes a second solder fillet connected to the component body, and a distance between the at least one of the first solder fillet and the second solder fillet is greater than or less than a corresponding via of the circuit board The distance between them.

Further, a support member connected to the component body is further disposed, the support member is located on a side opposite to the limiting member; and when mounted, the support member is in close contact with the top surface of the circuit board.

Further, a second soldering leg is further included, and the portion of the second soldering foot that is in contact with the via hole wall is in an interference fit or transition fit with the via hole.

Further, at least two second solder fillets are further included, and a distance between at least two of the second solder fillets is greater or smaller than a distance between corresponding via holes on the circuit board.

In order to solve the above technical problem, the present invention further provides an electronic component, comprising: a circuit board and the electronic component described above, the electronic component comprising a component body and a first solder connected to the component body The foot further includes a limiting member disposed at a lower end of the first soldering leg, and a center of gravity of the limiting member is connected to a center of gravity of the component body Passing through the first solder fillet; the lower end of the first solder fillet fixes the component body on the circuit board through a corresponding via hole on the circuit board; the limiting member and the circuit board The bottom is close.

The beneficial effects of the utility model are:

The utility model provides an electronic component and an electronic component. The electronic component comprises a component body and a first soldering leg. The center of gravity of the electronic component is balanced by providing a limiting component on the first soldering leg, so that the electronic component It can be naturally positioned during installation, and will not be offset by gravity, so that the electronic components are firmly fixed on the circuit board, reducing the probability of solder joint soldering and improving production efficiency.

Further, the electronic component further includes a second soldering leg, and the second soldering leg generates an interference between the second soldering leg and the circuit board by causing the second soldering leg to have an interference fit or a transition fit with the corresponding via hole. Friction, further strengthening the fixation between the electronic components and the circuit board.

DRAWINGS

1 is a schematic structural view of an electronic component according to Embodiment 1 of the present invention;

2 is a schematic structural view of an electronic component according to Embodiment 2 of the present invention;

3 is a flow chart of an electronic component according to Embodiment 3 of the present invention;

4 is a schematic view showing a distance between a first solder fillet and a via hole according to Embodiment 1 of the present invention;

5 is a schematic view showing a distance between a second solder fillet and a via hole according to Embodiment 2 of the present invention;

FIG. 6 is a schematic view of a second soldering foot provided in Embodiment 2 of the present invention.

detailed description

The present invention will be further described in detail below with reference to the accompanying drawings.

Embodiment 1

This embodiment provides an electronic component, please refer to FIG. 1;

The electronic component in the embodiment includes a component body 101 and a first solder fillet 102 connected to the component body 101, and further includes a limiting component 104 disposed at a lower end of the first soldering leg 102. The limiting component 104 The center of gravity of the center of gravity of the component body 101 passes through the first solder fillet 102; when mounted, the lower end of the first solder fillet 102 passes through the corresponding via 201 on the circuit board 200 to secure the component body 101 to the circuit board. 200, and the limiting member 104 is in close contact with the bottom surface of the circuit board 200. Specifically, the center of gravity of the limiting member 104 and the center of gravity of the component body 101 passing through the first soldering leg 102 means that the center of gravity of the limiting member 104 and the center of gravity of the component body 101 are respectively located at the first soldering foot 102. end. Further, the component body 101 and the first solder fillet 102 are preferably integrally formed.

Further, the position of the limiting member 104 and the bottom surface of the circuit board 200 means that the first soldering foot 102 passes through the corresponding via hole 201 on the circuit board 200 and is located on the first soldering leg 102 after installation. The member 104 is in close contact with the bottom surface of the circuit board 200, and the limiting member 104 is subjected to a pressure having a downward component of the circuit board 200. The pressure generated by the pressure is opposite to the direction of the moment generated by the gravity of the component body 101, and has a limit. Component body 101 is offset by gravity The role of the component body 101 is effectively positioned.

Further, the first solder fillet 102 may be provided one or more at different positions of the component. Preferably, the first solder fillet 102 may be disposed at the end of the component body 101, that is, disposed on the component body. The edge portion of the 101, correspondingly, the limiting member 104 is disposed on a side of the first solder fillet 102 opposite to the majority of the volume of the component body 101, and even directly protrudes outside the component body 101, so that the limiting member can be made The effect of 104 is the best.

Further, the limiting member 104 may be a rigid member extending perpendicular to the first solder fillet 102 and away from the first solder fillet 102; or may be an elastic member that can easily pass through when corresponding to the mounting The through hole 201, after the installation is completed, the elastic member is in close contact with the bottom of the circuit board 200, and cannot easily pass through the corresponding through hole 201. The structure of the elastic member may be free at the upper end and fixed at the lower end at the first welding. The metal piece at the lower end of the foot 102, and in the natural form of the metal piece, the upper end is away from the first solder fillet 102. The limiting member 104 may be a structure integrally formed with the first soldering leg 102, or may be an additional fixed structure. Regardless of the structure, as long as the limiting member 104 and the first soldering leg 102 are fixedly connected, The limiting member 104 does not disengage from the first solder fillet 102 without destroying the connection between the first solder fillet 102 and the limiting member 104.

Further, during installation, a portion of the first solder fillet 102 that is in contact with the corresponding via hole 201, that is, a portion of the first solder fillet 102 in the corresponding via 201, has an interference fit or transition fit with the via 201. . Specifically, the interference fit refers to the maximum limit dimension Dmax of the via 201, and the relationship between the minimum limit dimension dmin of the portion of the first solder fillet 102 in the corresponding via 201 is Dmax<dmin; the transition fit refers to The relationship between the maximum limit dimension Dmax of the hole 201 and the minimum limit dimension dmin of the portion of the first solder fillet 102 in the corresponding via 201 is Dmax>dmin, and the minimum limit dimension Dmin of the via 201, and the first solder fillet 102 The relationship of the maximum limit size dmax of the portion corresponding to the via hole 201 is Dmin < dmax. After installation, the interference fit or transition fit of the portion of the first solder fillet 102 that contacts the corresponding via 201 and the corresponding via 201 provides for more stable positioning of the component body 101 on the circuit board 200.

Further, the second solder fillet 103 is further included, and the distance between the at least one first solder fillet 102 and the second solder fillet 103 is greater or smaller than the distance between the corresponding via holes on the circuit board 200. Specifically, referring to FIG. 4, since the positions of the via holes 201 on the circuit board 200 are fixed and correspond to the positions of each of the first solder fillets 102 and the second solder fillets 103, a first solder fillet is now used. The position of the 102 and/or the third second solder fillet 1033 is set to be shifted from the position of the corresponding via 201, and the distance between the disposed first solder fillet 102 and the second second solder fillet 1032 is l1. The distance between the first via hole 2011 corresponding to the first solder fillet 102 and the second via hole 2012 corresponding to the second second solder fillet 1032 is L1, and the relationship between l1 and L1 is l1 < L1; The distance between the set third second solder fillet 1033 and the second second solder fillet 1032 is 12, and the third second solder fillet 1033 corresponds to the third via 2013 and the second second The distance between the second vias 2012 corresponding to the solder fillets 1032 is L2, and the relationship between l2 and L2 is l2>L2. When mounted, the first solder fillet 102, which is offset from the position of the corresponding via 201, will be in close contact with the hole wall of the via 201 after mounting, resulting in a circuit between the circuit board 200 where the first solder fillet 102 and the via 201 are blocked. The friction of relative motion trends. The frictional force can effectively prevent the displacement between the first solder fillet 102 and the circuit board 200, and further strengthen the fixing of the component body 101.

Further, the supporting member 105 is further connected to the component body, and the supporting member 105 is located on a side opposite to the limiting member 104. When installed, the supporting member 105 is in close contact with the top surface of the circuit board 200. Specifically, the support member 105 In close contact with the top surface of the circuit board 200, the support member 105 receives the pressure from the circuit board 200 having an upward component, which can effectively prevent the component body 101 from being tilted due to the action of gravity, and can serve as a fulcrum to make the limiting member 104 better. The function of the electronic component 100 can also be inserted into the depth of the circuit board 200.

Further, a chamfer 1021 is further disposed at a lower end of the first solder fillet 102, and the chamfer 1021 is disposed on an opposite side of the limiting member 104, that is, on the same side of the support member 105. The oblique insertion hole 102 is inserted into the through hole 201, and the chamfer 1021 is provided to facilitate the first solder fillet 102 to pass through the through hole 201 relatively easily.

Further, the electronic component in the embodiment is a current bus bar, and the current bus bar has an irregular shape, and the position of the center of gravity is not between the legs, and is difficult to locate during installation, and the method in this embodiment is adopted. The structure of the first solder fillet 102 enables the positioning of the current busbar.

Embodiment 2

This embodiment provides an electronic component, please refer to FIG. 2;

The electronic component in this embodiment includes the component body 101 and the second solder fillet 103, and the portion of the second solder fillet 103 that contacts the hole wall of the corresponding via 201, that is, the second solder fillet 103 is in the corresponding via hole. The portion in 201 has an interference fit or transition fit with the via 201. The explanation of the interference fit and the transition fit is the same as that in the first embodiment, and will not be described here. After installation, the interference fit or transition fit of the portion of the second solder fillet 103 that contacts the corresponding via 201 and the corresponding via 201 allows the component body 101 to be positioned more securely on the circuit board 200. Further, the component body 101 and the second solder fillet 103 are preferably integrally formed.

Further, the second solder fillet 103 has at least two, and the distance between at least two of the second solder fillets 103 is greater or smaller than the distance between the corresponding via holes on the circuit board 200. Specifically, referring to FIG. 5 and FIG. 6, since the positions of the via holes 201 on the circuit board 200 are fixed and correspond to the positions of each of the second solder fillets 103, the first second solder fillet 1031 is now available. And/or the position of the third second soldering leg 1033 is set to be shifted from the position of the corresponding via 201, and the distance between the disposed first second soldering leg 1031 and the second second soldering leg 1032 is H1, and the distance between the first via 201 corresponding to the first second solder fillet 1031 and the second via 2012 corresponding to the second second solder fillet 1032 is H1, the relationship between h1 and H1 H1<H1; the distance between the set third second solder fillet 1033 and the second second solder fillet 1032 is h2, and the third second solder fillet 1033 corresponds to the third via 2013 The distance between the second vias 2012 corresponding to the second second solder fillet 1032 is H2, and the relationship between h2 and H2 is h2>H2. When mounted, the second solder fillet 103, which is offset from the position of the corresponding via 201, will be in close contact with the hole wall of the via 201 after mounting, resulting in a circuit between the circuit board 200 where the second solder leg 103 and the via 201 are blocked. The friction of relative motion trends. The frictional force can effectively prevent displacement between the second solder fillet 103 and the circuit board 200, and further strengthen the fixing of the component body 101. Further, the second solder fillet 103 may be disposed in a manner to change the position of the second solder fillet 103 on the component body 101 as shown in FIG. 5, or may change the second solder fillet 103 as shown in FIG. 6. The shape of the lower end can achieve the fixing of the component body 101 on the circuit board 200. Similarly, the first solder fillet 102 can be similarly arranged.

Embodiment 3

This embodiment provides an electronic component, please refer to FIG. 3;

The electronic component provided in this embodiment includes an electronic component 100 and a circuit board 200. The electronic component 100 includes a component body 101 and a first solder fillet 102 connected to the component body 101, and further includes a lower end of the first solder fillet 102. The connecting limit member 104, the center of gravity of the limiting member 104 and the center of gravity of the component body 101 pass through the first solder fillet 102; the lower end of the first solder fillet 102 passes through the corresponding via 201 on the circuit board 200. The component body is fixed on the circuit board 200; the limiting component 104 is in close contact with the bottom surface of the circuit board 200. Specifically, the center of gravity of the limiting member 104 and the center of gravity of the component body 101 passing through the first soldering leg 102 means that the center of gravity of the limiting member 104 and the center of gravity of the component body 101 are respectively located at the first soldering foot 102. The terminal member 104 is located on the first solder fillet 102, and the center of gravity of the component body 101 is not on the solder fillet.

Further, the limiting member 104 and the bottom surface of the circuit board 200 are in close contact with each other, after the first soldering leg 102 passes through the corresponding via hole 201 on the circuit board 200, the limiting member 104 and the circuit on the first soldering leg 102 The bottom surface of the board 200 is in close contact with each other, and has a function of restricting the component body 101 from being displaced by gravity, and effectively positioning the component body 101.

Preferably, the first solder fillet 102 is disposed at an end of the component body 101, that is, at an edge portion of the component body 101. Accordingly, the limiting component 104 is disposed on the first solder fillet 102 and the component body 101. The opposite side of the volume, even directly extending outside the component body 101, can achieve the best effect of the limiting member 104.

Further, the first solder fillet 102 further includes a support member 105. The support member 105 is located on a side opposite to the limiting member 104. The support member 105 is in close contact with the top surface of the circuit board 200. Specifically, the support member 105 is in close contact with the top surface of the circuit board 200, which can effectively prevent the component body 101 from being tilted due to the action of gravity, and can serve as a fulcrum to make the limiting member 104 function better, and can also be used as an electronic component. 100 is inserted into the depth of the board 200.

Further, the electronic component 100 in this embodiment further includes a second solder fillet 103, and the second solder fillet 103 is in contact with the corresponding via hole 201, that is, the second solder fillet 103 is in the corresponding via 201. The inner portion has an interference fit or a transition fit with the via 201. The explanation of the interference fit and the transition fit is the same as that in the first embodiment, and will not be described here. The interference fit or transition fit of the portion of the second solder fillet 103 that contacts the corresponding via 201 and the corresponding via 201 allows the component body 101 to be positioned more securely on the circuit board 200.

Further, the second solder fillet 103 has at least two, and the distance between at least two of the second solder fillets 103 is greater or smaller than the distance between the corresponding via holes on the circuit board 200. The specific setting manner is the same as that in the second embodiment, and details are not described herein again.

The above is a further detailed description of the present invention in conjunction with the specific embodiments, and the specific implementation of the present invention is not limited to the description. For those skilled in the art to which the present invention pertains, a number of simple deductions or substitutions may be made without departing from the spirit and scope of the invention.

Claims (10)

An electronic component, comprising: a component body and a first soldering leg connected to the component body; and a limiting component disposed at a lower end of the first soldering leg, a center of gravity of the limiting component a wire of the center of gravity of the component body passes through the first solder fillet; when installed, a lower end of the first solder fillet passes through a corresponding via hole on the circuit board to fix the component body to the circuit The limiting member is in close contact with the bottom surface of the circuit board. The electronic component according to claim 1, wherein said first solder fillet is provided at an end of said component body. The electronic component of claim 1 wherein said electronic component is a current bus. The electronic component of claim 1 wherein said portion of said first solder fillet that contacts said via hole wall is in an interference fit or transition fit with said via. The electronic component according to any one of claims 1 to 4, further comprising a second solder fillet, and a distance between the at least one of the first solder fillet and the second solder fillet is greater or less The distance between the corresponding vias on the board. The electronic component according to any one of claims 1 to 4, further comprising a support member connected to the component body, the support member being located on a side opposite to the limiting member; The support member is in close contact with the top surface of the circuit board. The electronic component according to any one of claims 1 to 4, further comprising a second solder fillet, a portion of the second solder fillet contacting the via hole wall, and the via hole Fit or transition fit. The electronic component according to any one of claims 1 to 4, further comprising at least two second solder fillets, and a distance between at least two of the second solder fillets is greater or smaller than the circuit The distance between the corresponding vias on the board. The electronic component according to claim 7, wherein said second solder fillet has at least two, and a distance between at least two of said second solder fillets is greater or smaller than corresponding on said circuit board The distance between the holes. An electronic component, comprising: a circuit board and the electronic component according to any one of claims 1 to 9, the electronic component comprising a component body and a first body connected to the component body a soldering leg, a lower end of the first soldering leg is provided with a limiting member, and a center of gravity of the limiting member and a center of gravity of the component body passes through the first soldering leg; the first soldering leg The lower end is fixed on the circuit board through corresponding via holes on the circuit board; the limiting member is in close contact with the bottom surface of the circuit board.

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