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WO2017045604A1 - Dispositif électronique portable et son procédé d'encapsulation - Google Patents

Dispositif électronique portable et son procédé d'encapsulation Download PDF

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Publication number
WO2017045604A1
WO2017045604A1 PCT/CN2016/098987 CN2016098987W WO2017045604A1 WO 2017045604 A1 WO2017045604 A1 WO 2017045604A1 CN 2016098987 W CN2016098987 W CN 2016098987W WO 2017045604 A1 WO2017045604 A1 WO 2017045604A1
Authority
WO
WIPO (PCT)
Prior art keywords
electronic components
flexible substrate
unit
same type
islands
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2016/098987
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English (en)
Chinese (zh)
Inventor
圣阿加塔·法比奥
耶尔沃利诺·艾莉娜
董明智
张国旗
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Beijing Deft Electronics Technology Co Ltd
Original Assignee
Beijing Deft Electronics Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Beijing Deft Electronics Technology Co Ltd filed Critical Beijing Deft Electronics Technology Co Ltd
Publication of WO2017045604A1 publication Critical patent/WO2017045604A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1322—Encapsulation comprising more than one layer

Definitions

  • the present disclosure relates to the field of flexible circuit technology, for example, to a wearable electronic device and a method of packaging the same.
  • Lilypad the 's miniaturized development platform for wearable devices. Flora's flash and SRAM are twice as large as LilyPad, and Flora is smaller than LilyPad.
  • These platforms have a small system architecture that is compatible with electrician boards and provides device development for specific functions.
  • PC is a convenient, flexible and easy to use open source electronic prototype platform, including hardware (various models of chicken board) and software (Arduino IDE).
  • the flexible (Limber) platform can be folded and stretchable, but lacks the important functions of the wearable device: the flexible platform does not contain any wireless charging module, cannot replace the battery, and therefore cannot be embedded in the clothes; Therefore, it cannot be integrated on clothing; the addition of sensor modules is limited, so platform development is limited.
  • the wearable device development platform in the related art has at least defects such as less functions, large occupied space, and inconvenient storage.
  • the present disclosure provides a packaging method of a wearable electronic device to realize the advantages of multiple functions, small space occupation, and convenient storage.
  • the present disclosure also proposes a packaging system for a wearable electronic device.
  • a method of packaging a wearable electronic device comprising:
  • a plurality of electronic components and a Light Emitting Diode (LED) flexible display module in a plurality of unit islands are packaged on a flexible substrate in a multi-layer component package, and a plurality of electronic components in each unit island Directly connected between the plurality of unit islands is connected by a communication bus provided on the flexible substrate.
  • LED Light Emitting Diode
  • one unit island is: an area divided on a flexible substrate and capable of accommodating the same type of electronic components, and/or a printed circuit board (PCB) capable of integrating the same type of electronic components;
  • PCB printed circuit board
  • the categorizing the plurality of electronic components in the electronic device includes:
  • the same type of electronic components are integrated on one PCB unit island, and then multiple PCB unit islands are interconnected through a flexible substrate.
  • the plurality of electronic components and the LED flexible display module in the plurality of unit islands are packaged on the flexible substrate in a multi-layer component package, including:
  • Chip On Flex, or Chip On Film, COF Chip On Flex, or Chip On Film, COF
  • the LED flexible display module is packaged on a flexible substrate.
  • packaging the LED flexible display module on the flexible substrate comprises:
  • the LED array is packaged on a flexible substrate, and the LED array packaged on the flexible substrate forms an LED flexible display module.
  • the flexible substrate is a PI substrate.
  • the plurality of electronic components include at least one processor unit, a sensor unit, a Bluetooth communication module, and a power module.
  • the present disclosure also employs a wearable electronic device, including:
  • a flexible substrate a plurality of unit islands packaged on a flexible substrate in a multi-layer component package
  • An LED flexible display module and a plurality of electronic components integrated in the plurality of unit islands
  • Direct connection between a plurality of electronic components in each unit island, and a plurality of unit islands are connected by a communication bus disposed on the flexible substrate;
  • the plurality of electronic components in each unit island are the same type of electronic components.
  • a unit island comprising an area partitioned on a flexible substrate and capable of accommodating the same type of electronic components, and/or a PCB capable of integrating the same type of electronic components;
  • the same type of electronic components include: the function of the electronic component, the package size, and a plurality of electronic components having the same communication requirements between the plurality of electronic components.
  • the flexible substrate is a PI substrate.
  • the plurality of electronic components include at least one processor unit, a sensor unit, a Bluetooth communication module, and a power module.
  • a wearable electronic device and a packaging method thereof includes: classifying a plurality of electronic components in the electronic device, and classifying the same type of electronic components into one unit island;
  • the plurality of electronic devices and the LED flexible display module are packaged on the flexible substrate in a multi-layer component stacking manner, and a plurality of electronic components in each unit island are directly connected, and a plurality of unit islands are disposed through each other.
  • the electronic device having the required function can be integrated into the wearable casing, and the connection of each module in the electronic device can be reasonably arranged without directly losing the function of the electronic device, and the bare chip of the plurality of modules can be directly packaged in the flexible state.
  • the defects in the related art such as less function, large space occupation and inconvenient storage, can be overcome, so as to realize the advantages of multiple functions, small space occupation and convenient storage.
  • FIG. 1 is a schematic structural diagram of a package system of a wearable electronic device according to the present disclosure
  • FIG. 2 is a flow chart of a method of packaging a wearable electronic device of the present disclosure.
  • PCB island 1-PCB unit island (PCB island);
  • the LED array is displayed on the backside of the flexible substrate.
  • a wearable electronic device and a packaging method thereof are provided according to an embodiment of the present disclosure, as shown in FIG. 1 and FIG. 2, in accordance with an embodiment of the present disclosure.
  • a flexible substrate package suitable for a wearable device integration platform that is, a solution for optimally packaging multiple modules in a system based on a flexible substrate without sacrificing system functionality is proposed.
  • An embodiment of the present disclosure provides a method for packaging a wearable electronic device, including:
  • the flexible substrate may be a polyimide (PI) substrate, and other similar polymer materials may be used as the substrate, such as polyethylene terephthalate (PET). a substrate and a polycarbonate (PC) substrate, etc.; and/or a plurality of electronic components including at least one processor unit, a sensor unit, a Bluetooth communication module, and a power module;
  • PI polyimide
  • PC polycarbonate
  • the unit island may be selected as: an area divided on a flexible substrate and capable of accommodating the same type of electronic components, and/or a PCB board capable of integrating the same type of electronic components;
  • an operation of categorizing a plurality of electronic components in an electronic device having a function desired by a user may include:
  • Dividing a plurality of unit islands on a flexible substrate directly integrating the same type of electronic components into a unit island on the flexible substrate; and/or integrating the same type of electronic components on a PCB unit island, and then Interconnecting PCB unit islands through a flexible substrate;
  • a plurality of electronic components and LED flexible display modules in a plurality of unit islands are packaged on a flexible substrate in a multi-layer component package, and a plurality of electronic components in each unit island are directly connected. a plurality of unit islands connected by a communication bus disposed on the flexible substrate;
  • the operation of packaging a plurality of electronic components and LED flexible display modules in a plurality of unit islands on a flexible substrate in a multi-layer component package comprising:
  • a bare chip of a plurality of electronic components in a plurality of unit islands is directly packaged on a flexible substrate; and an LED flexible display module is packaged on the flexible substrate;
  • the operation of packaging the LED flexible display module on the flexible substrate comprises: packaging the LED array on the flexible substrate, and the LED array packaged on the flexible substrate directly forms the LED flexible display module.
  • the technical solution of the present disclosure directly encapsulates the die by using a flexible substrate, thereby making the system function complete, and having the flexible characteristics of the flexible substrate, and reducing the volume, thereby making the system more favorable for being worn, and also for The design of the system brings more flexibility.
  • the electronic system will be integrated in the wearable electronic device. Therefore, the architecture of the system includes: at least one processor unit, a sensor unit, a display module, a Bluetooth communication module, a battery, and the like. The system will also increase the available modules as appropriate for different applications.
  • Methods for classifying a system as a unit island can include:
  • the integration of the plurality of unit islands may include: directly encapsulating in the PI substrate; or connecting to the flexible substrate in the form of a PCB unit island.
  • the LED array is packaged on the PI substrate, so that the display module of the system is reduced in volume, and has flexible characteristics, and the cost is greatly reduced.
  • an embodiment of the present disclosure provides a wearable electronic device including a flexible substrate (such as a flexible substrate 4), a plurality of unit islands encapsulated on a flexible substrate in a multi-layer component package.
  • LED flexible display module such as LED display arrays 6, 7 on the back side of the flexible substrate
  • a plurality of electronic components integrated with electronic devices disposed in a plurality of unit islands and capable of constituting a desired function of the user;
  • the plurality of electronic components are directly connected, and the plurality of unit islands are connected by a communication bus disposed on the flexible substrate;
  • the plurality of electronic components in each of the unit islands are the same type of electronic components, and the functions of the same type of electronic components
  • the package size and communication requirements between multiple electronic components are the same.
  • the unit island includes a region partitioned on a flexible substrate and capable of accommodating the same type of electronic components, and/or a PCB board (such as PCB unit island 1) capable of integrating the same type of electronic components.
  • the flexible substrate can be a PI substrate; and/or the plurality of electronic components include at least one processor unit, a sensor unit (such as an energy harvester 5), a Bluetooth communication module, and a power module (such as a microbattery 3).
  • the operations to be performed include:
  • a bare chip of a plurality of electronic devices in a plurality of unit islands (such as an IC bare chip set 2) is directly packaged on a flexible substrate; and the LED array is packaged on a flexible substrate The LED array packaged on the flexible substrate directly forms the LED flexible display module.
  • the technical solution of the present disclosure utilizes a COF flexible substrate packaging technology (fixing an IC to a die-bonding technology on a flexible circuit board, using a soft additional circuit board as a package chip carrier to bond the chip to the flexible substrate circuit) Technology), integrate multiple circuit modules, displays, batteries, Bluetooth and other modules, without reasonable loss of system performance, reasonably arrange the connection of the multiple modules, directly package the die of multiple modules on the flexible substrate
  • the system is greatly reduced in size, with full functionality and foldability.
  • the technical solution of the present disclosure is implemented as follows:
  • the module is packaged on the PI substrate to maintain the reliability of the system while having the PI
  • the foldable features make the entire system easy to wear.
  • the packaging process is based on a stacked package of multi-layer components, including LED display components, multiple systems Component module (island) and PI substrate.
  • the LED array is integrated on a flexible substrate to realize a flexible display function and as a display module of the wearable system, the system is reduced in volume and has foldable characteristics.
  • FIG. 1 is a diagram illustrating the LED array display.
  • the complete system is directly optimized by the bare chip: in order to reduce the system volume and at the same time make the system components better communicate with each other, the bare chip is directly integrated into the system; the different electronic components are classified and integrated.
  • a different unit a plurality of units are connected to each other in the form of an island, so that the volume of the system is greatly reduced while the system is intact, and the internal structure is optimized.
  • the direct integration operation of the bare chip is that the bare chip is directly packaged in the flexible substrate, which can be called a chip on board (CoB) in technology; the advantage is to reduce the volume and reduce the cost; the operation process includes: solid For the steps of crystal, wire bonding and encapsulation, a conventional chip packaging process can also be used.
  • each unit island is based on a PI substrate to ensure system flexibility. Due to the flexibility of the PI substrate and the material reliability, as well as the mature characteristics of the perforated leads during the packaging process, it can be used to interconnect the classified unit islands based on the PI substrate to ensure the flexible characteristics of the system.
  • Adding a waterproof layer to the integrated system combined with the flexible characteristics of the system, enables the system to be embedded in the textile article to facilitate the wearability of the electronic device.
  • the flexible package itself is a waterproof package, and the PI substrate acts to isolate water vapor, so that the components and modules integrated inside are protected from moisture and pollution in the environment.
  • the wearable electronic device and the packaging method thereof provided by the embodiments of the present disclosure can overcome the defects of the related technologies, such as less functions, large space occupation, and inconvenient storage, so as to achieve multiple functions, occupy small space, and accommodate Convenient advantages.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

L'invention concerne un dispositif électronique portable et son procédé d'encapsulation. Le procédé d'encapsulation consiste à : trier de multiples composants électroniques d'un dispositif électronique selon différents types, et attribuer des composants électroniques du même type à un seul îlot unitaire; encapsuler, par l'intermédiaire d'un empilage et d'une encapsulation de partie multi-couche et sur un substrat flexible, les multiples composants électroniques dans de multiples îlots unitaires et un module d'affichage à diodes électroluminescentes (DEL) flexible, les composants électroniques à l'intérieur de chaque îlot unitaire étant directement connectés les uns aux autres, et les multiples îlots unitaires étant connectés par l'intermédiaire d'un bus de communication disposé sur le substrat flexible.
PCT/CN2016/098987 2015-09-17 2016-09-14 Dispositif électronique portable et son procédé d'encapsulation Ceased WO2017045604A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201510595865.1A CN105163491B (zh) 2015-09-17 2015-09-17 一种可穿戴电子设备的封装方法
CN201510595865.1 2015-09-17

Publications (1)

Publication Number Publication Date
WO2017045604A1 true WO2017045604A1 (fr) 2017-03-23

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CN (1) CN105163491B (fr)
WO (1) WO2017045604A1 (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105163491B (zh) * 2015-09-17 2018-03-06 北京代尔夫特电子科技有限公司 一种可穿戴电子设备的封装方法
FR3058610B1 (fr) * 2016-11-10 2018-11-16 Bioserenity Dispositif electronique textile pour vetements intelligents
CN110136588A (zh) * 2019-05-29 2019-08-16 浙江荷清柔性电子技术有限公司 一种一体化柔性显示终端及制备方法
CN113721329A (zh) * 2021-08-16 2021-11-30 深圳太辰光通信股份有限公司 一种柔性板封装的光模块及其封装方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104146771A (zh) * 2014-07-18 2014-11-19 小米科技有限责任公司 可穿戴式设备及其制造方法
US9019710B2 (en) * 2012-10-11 2015-04-28 Apple Inc. Devices having flexible printed circuits with bent stiffeners
CN104661473A (zh) * 2015-02-28 2015-05-27 京东方科技集团股份有限公司 一种组装穿戴设备
CN104752438A (zh) * 2013-12-26 2015-07-01 英特尔公司 用于柔性电子通信设备的方法和装置
CN105163491A (zh) * 2015-09-17 2015-12-16 北京代尔夫特电子科技有限公司 一种可穿戴电子设备的封装方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5550159B1 (ja) * 2013-09-12 2014-07-16 太陽誘電株式会社 回路モジュール及びその製造方法
CN203840632U (zh) * 2014-03-25 2014-09-17 许振宇 一种模块化的柔性电路结构

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9019710B2 (en) * 2012-10-11 2015-04-28 Apple Inc. Devices having flexible printed circuits with bent stiffeners
CN104752438A (zh) * 2013-12-26 2015-07-01 英特尔公司 用于柔性电子通信设备的方法和装置
CN104146771A (zh) * 2014-07-18 2014-11-19 小米科技有限责任公司 可穿戴式设备及其制造方法
CN104661473A (zh) * 2015-02-28 2015-05-27 京东方科技集团股份有限公司 一种组装穿戴设备
CN105163491A (zh) * 2015-09-17 2015-12-16 北京代尔夫特电子科技有限公司 一种可穿戴电子设备的封装方法

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CN105163491B (zh) 2018-03-06

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