WO2016200372A1

WO2016200372A1 - Tactile enabled neurophysiological sensor

Info

Publication number: WO2016200372A1
Application number: PCT/US2015/034867
Authority: WO
Inventors: Dale DALKE
Original assignee: NEUROTOPIA Inc
Current assignee: NEUROTOPIA Inc
Priority date: 2015-06-08
Filing date: 2015-06-09
Publication date: 2016-12-15
Anticipated expiration: 2017-12-08
Also published as: CN106236077A

Abstract

Preferably, an embodiment of a tactile enabled sensor includes at least a sensor assembly (200) providing at least a sensor probe (712). The sensor probe including a main body portion having a plurality of conductive spires (714) extending from a first side of the main body, and a compressible electrically conductive member confinement feature (716) extending from an opposite side of the main body. Each of the plurality of conductive spires passes through spire apertures provided by a sensor probe support member (710). The plurality of conductive spires conduct brainwave signals of a subject An oscillation device (566) communicates with the sensor assembly, wherein said sensor assembly is in communication with a signal processing circuit (204) in electrical communication with the oscillation device and the brainwave signals of the subject. The oscillation device selectively agitates the plurality of conductive spires in response to an electrical state of the brainwave signal of the subject.

Description

TACTILE ENABLED NEUROPHYSIOLOGICAL SENSOR

Background

The present Invention relates to the field of sensors. More particularly, the present invention relates to tactile enabled sensors for use in collecting brainwave data from subjects.

In accordance with preferred embodiments, a tactile enabled sensor ine lades at least a sensor assembly providing at least a sensor probe. The sensor probe including a main body portion having a plurality of conductive spires extending from a first, side of the main body, and a compressible electrically conductive member confinement feature extending from an opposite side of the main body. Each of the plurality of conductive spires passes through spire apertures provided by a sensor probe support member, which supports the sensor probe. The plurality of conductive spires conduct brainwave sigtiais of a subject. An. osciiiaiion. device communicates with the sensor assembly, wherein said sensor assembly is in. communication with a signal processing circuit, in electrical communication with the oscillation de vice and the brainwave signals of the subject. The oscillation device selectively agitates the plurality of conductive spires in. response to an electrical state of of the brainwave signal of the subject.

Preferably, the tactile enabled sensor further includes at least a

compressible electrically sympathetic member in electrical communication with said sensor assembly. The compressible electrically sympathetic member is isol ated from a cranium of the subject by the sensor assembly , Isolation of the compressible electrically sympathetic member from the cranium of the subject precludes a bond between the cranium of the subject and the compressible electrically sympathetic member. The main, body portion electrically couples each of the plurality of conductive spires one to the other. These and various other features and advantages that characterize the claimed invention will be apparent upon reading the following detailed description and upon review of the associated drawings.

Brief Description of the Drawings

The present invention fat illustrated by way of example and not limitation in die figures of die accompanying drawings, in which like references indicate similar elements and in which:

FIG. 1 is a top plan view of an embodiment exemplary of the inventive sensor probe assembly.

FIG.2 is a view in elevation of an embodiment exemplary of a conductive pin of the mventive sensor probe assembly of FIG.1.

FIG.3 is a front side view in eievation of an embodiment exemplary of the

inventive sensor probe assembly of FIG. I.

FIG.4 is a front side view in elevation of an embodiment exemplary of the

inventive sensor probe assembly illustrative of a flexible, electrically conductive pin securement member and associated plurality of electrically conductive pins matted thereto, of an embodiment exemplary of the inventive sensor probe assembly of FIG. I.

FIG.5 is a top plan view of an alternate embodiment exemplary of the inventive sensor probe assembly.

FIG.6 is a view in front elevation of an alternate embodiment exemplary an

electrically conductive pin of the inventive sensor probe assembly of FIG.

5.

FIG.7 is a front side view in elevation of an alternate embodiment exemplary of the inventive sensor probe assembly of FIG.5.

FIG.8 is a front side view in elevation of an alternate embodiment exemplary of the inventive sensor probe assembly ilhistrative of a flexible, electrically conductive pin securement member and associated plurality of electrically conductive pins nutted thereto, of an embodiment exemplary of the inventive sensor probe assembly of FIG.5.

FIG.9 is a front elevation view of an embodiment exemplary of an electrically conductive pin of FIG.6, showing a bead portion, a tip portion, and a body portion disposed there between.

FIG. 10 is a front elevation view of an embodiment exemplary of an electrically conductive pin of FIG.2, showing a head portion havh^ a corivex shape, a tip portion, and a body portion disposed there between.

FIG. 11 is a front elevation view of an alternate embodiment exemplary of an electrically conductive pin of FIG.2, showing a head portion having a concave shape, a tip portion, and a body portion disposed mere between, FIG. 12 is a front elevation view of an embodiment exemplary of an electrically conductive pin of FIG.2, showing a head portion having a substantially flat top surface, a tip portion, and a body portion disposed there between. FIG. 13 is a partial cutaway front elevation view of an alternate tip configuration for any of the electrically conductive pins of FIGS.9, 10, 11, or 12.

FIG.14 is a cross-section, partial cutaway front elevation view of an alternate tip configuration for any of the electrically conductive pins of FIGS.9, 10, 11, or 12.

FIG. 15 is a partial cutaway front elevation view of an arlernatrve tip configuration for any of the electrically conductive pins of FIGS.9, J 0, 11, or J 2.

FIG. 16 is a partial cutaway front elevation view of an alternate tip configuration for any of the electrically conductive pins of FIGS.9, 10, 11, or 12.

FIG. 17 is a flowchart of a method of producing an embodiment exemplary of the inventive sensor probe assembly of either FIG. 1 or FIG.5.

FIG. 18 is a front elevation view of an embodiment exemplary of the present novel sensor assembly.

FIG. 19 is a bottom pun view of the novel sensor assembly of FIG. J 8.

FIG.20 is a front elevation, exploded view of the novel sensor assembly of FIG.

18. FIG.21 is a front elevation view of an alternate embodiment exemplary of the present novel sensor assembly.

FIG.22 is a side elevation view of an alternate embodiment exemplary of the present novel sensor assembly of FIG.21.

FIG.23 is a side elevation view of an altemate embodiment exemplary of the present novel sensor assembly of FIG.21, communicating with a brainwave processing system.

FIG.24 is a schematic of a preferred signal processing circuit of the embodiment exemplary of the present novel sensor assembly of either FIGS.18, 21, or 23.

FIG.25 is a flowchart of a method of using en enmodmient exemplary of me inventive sensor assembly of either FIGS. 18, 21 , or 23.

FIG.26 is a front elevation, exploded view of me alternative embodiment

exemplary novel sensor assembly of FIG.26, configured to support an oscillation device.

FIG.27 is a front elevation view of an alternative embodiment exemplary of the present novel sensor assembly, configured to support an oscillation device. FIG.28 is a side elevation view of the alternative embodiment exemplary of the present novel sensor assembly of FIG.26, configured to support an oscillation device.

FIG.29 is a side elevation view of the alternative embodiment exemplary novel sensor assembly of FIG.26, configured to support an oscillation device, and corrmuinicatirig with a brainwave processing system.

FIG.30 is a front elevation, exploded view of an alternate alternative enuxxhment exemplary of the present novel sensor assembly, configured to support an oscillation device and a capacitance probe assembly.

FIG.31 is a front elevation, cross-section view of the alternate anernative

embodiment exemplary of the present novel sensor assembly of FIG.30, configured to support an oscillation device and having the capacitance probe assembly attached thereto. FIG.32 is a side elevation, crossHsection view of the alternate alternative ernbodiment exemplary of the present novel of FIG, 30, with the capacitance probe assembly secured thereon.

FTG.33 is a bottom plan view of the alternate alternative embodiment exemplary of the present novel sensor assembly of FIG.30,

FIG.34 is a side elevation view of the alternate alternative embodiment exemplary of the present novel sensor assembly of FIG.30, with the oscillation device and capacitance probe assembly attached thereto, and comrriunieating with a brainwave processing system.

FIG.35 is a schematic of the preferred alternate alternative embodiment exemplary of the capacitance probe assembly of the present novel sensor assembly of

FIG.34.

FIG.36 is a flowchart of a method of using the alternate alternative embodiment exemplary of the present novel sensor assembly of FIG.30, with the oscillation device and capacitance probe assembly attached thereto.

FIG.37 is a cross section view in elevation of an alternate embodiment of a

housing of the inventive sensor probe assembly.

FIG.38 is a view in elevation of a signal conductor of the alternate; embodiment, exemplary of the present novel sensor assembly for cornmunicating brainwave signals to (he brainwave processing system.

FIG.39 is a view in elevation of a compressible electrically conchictive member of the alternate embodiment, exemplary of the present novel sensor assembly. FTG.40 is a cross section view in elevation of a sensor probe providing a plurality of conductive spires.

FIG.41 is a cross section view in elevation of a sensor probe support member tor the sensor probe of FIG.40, of the alternate embodiment exemplary of the present novel sensor assembly.

FIG.42 is a cross section view in elevation of an alternate embodiment exemplary of the present novel sensor sub-assembly.

FTG.43 is a plan view of a quantity ofneurodiagnostic electrode paste for use on the spires of the sensor probe of of FIG.40. FIG.44 is a cross section view in elevation of a cover for the spires of die sensor probe of of FIG, 40.

FIG.45 is a cross sectional view in elevation of an alternate embodiment

exemplary of the present novel sensor assembly.

FIG.46 is a cross sectional view in elevation of an alternate sensor probe assembly formed from the combination of die sensor probe of FIG.40, with the sensor probe support member of FIG.41.

FIG.47 is a cross sectional view in elevation of an oscillation device of the present invention.

FIG.48 is a cross sectional side elevation view of the alternative embodiment exemplary novel sensor assembly of FIG.45, configured to support an oscillation device of FIG, 47.

It wUI be readily understood mat elements of the present invention, as generally described and illustrated in die figures herein, could be arranged and designed in a wide variety of different configurations. Referring now in detail to the drawings of the preferred embodiments, a sensor probe assembly 10, of FIG..1, (also referred to herein as assembly 10) of a first preferred embodiment, while useable for a wide variety of bk>-physiological seating applications, it is particularly adapted for use as neurophysiological signal sensor component.

Accordingly, the assembly 10 of the first preferred embodiment, of FIG. 1 , will be described in conjunction with the merits of the use of the sensor probe assembly 10 as a neurophysiological signal sensor component.

In a prrferred entoodimem of FIG. 1, the sensor probe assembly 10 includes at least a conductive pin securement member 12, which hosts a plurality of conductive pins 14. Preferably, the plurality of conductive pins 14 are electrically conductive, and when in pressing contact with the conductive pin securement member 12, as shown by FIG.3, form the sensor probe assembly 10 that yields a low mipedance neurophysiological signal sensor component In a preferred embodiment, the conductive pins 14, an example of which is shown by FIO.2, include at least a bead portion 16, a tip portion 18, and a body portion 20 disposed between the head portion 16 and the tip portion 18. Preferably, each coiiduetive pin J4 is ibniied

steel, titanium, bronze, or a gold plating on a rigid substrate selected from a group including at least polymers and metals. Preferably, the head portion 16 has a diameter greater than the diameter of roe body portion 20.

As shown by FIG.4, the conductive pin securement member 12 is preferably flexible and formed from a polymer. The electrical conductivity of the conductive pin securement member 12 is preferably attained by the inclusion of conductive particles embedded within the polymer. One such combination is a carbon filed silicon sheet material provided by Stockwell Elastomerics, Inc. of Philadelphia, Pennsylvania. However, as known in the art, conductive polymers may be formed from a plurality of polymer materials filled with comhjctive particles, the shape of which may be formed using well known mamrfacturing techniques that include at least molding, extrusion dies and sliced to thickness, farmed in sheets and: die cot; cut with hot wire equipment; high pressure water jets, or steel rule dies.

FIG.5 shows an alternate embodiment of a sensor probe assembly 22, which is preferably foiroed fix^

plurality of alternate preferred conductive pins 24. As shown by FIG.6, preferably each alternate preferred conductive pin 24 includes a head portion 26, a tip portion 28, and a body portion 30, wherein the head portion 26 and the tip portion 28 have diameters substantially equal to the body portion 30. However, a skilled artisan will appreciate that conductive pins may have head, tip and body portion diameters different from one another. For example, the body portion may have a diameter greater than either the tip portion or head portion to accommodate insert molding of the conductive pins into a coriductive pin securemerit member. It is further understood that the conductive pins may take on a profile that includes a bend in the body, tip, or head portions, as opposed to the cylindrical configuration of any suitable cross section geometric shape of the conductive pins shown by FIG.2 and FIG.6. It is still ftirther understood, that the conductive pirui may be fanned by a plurality of individual components, including without limitation a spring, or may be formed from a coiled or other form of spring alone.

As with the preferred conductive pins 14, the alternate preferred conductive pins 24 are formed from a non-corrosive material, such as stainless steel, titanium, bronze, or a precious metal plating on a rigid substrate selected from a group including at least polymers and metals.

FIG.7 shows the conductive pins 24 protruding through each die top and bottom surfaces, 32 and 34 respectfully, to accommodate improved conductivity of the alternate sensor probe assembly 22, with mating components. While FIG.8 shows that the alternate sensor probe assembly 22 preferably retains the flexibility characteristics of sensor probe assembly 10 of FIG.4.

FIGS.9, 10, 11, and 12 show just a few of a plurality of head

configurations suitable for use on conductive pins. The particular configuration selected is a function of the device or component with which the conductive pins electrically cooperate. When a connector is used to interface with the sensor probe assembly, such as 10 or 22, the precise configuration will depend on toe type and configuration of the pins associated with the connector, including whether die pins are male or female pins.

FIGS 13, 14 (a cross section view), IS, and 16 show just a few of a plurality of tip configurations suitable for use on conductive pins. The particular configuration selected is a function of the materials used to form the conductive pins, and the environment in which the conductive pin will be placed. Examples of the use environment include where on the cranium the sensor will be placed, whether hair is present, and the sensitivity of the subject to the tips of the conductrvepins,

FIG. 17 shows a method 100, of making a sensor probe assembly, such as 10 or 22. The method begins at start step 102, and proceeds to process step 104, where a flexible conductive pin securement material is provided (also referred to herein as a flexible, electrically conductive, polymer substrate). At process step 106, a flexible, electrically conductive pin securement member (such as 12) is formed from the flexible, electrically conductive, polymer substrate.

The process continues at process step 108, a plurality of electrically conductive phis (such as 14) is provided. At process step J 10, each of the plurality of electrically conductive pins are affixed to the flexible, electrically conductive, pin securement member, and the process concludes at end process step 112 with the Jbrmation of a sensor probe assembly.

Turning to FIG. 18, shown therein is an embodiment of a novel, urventive, sensor assembly 200. Preferably, the sensor assembly 200 includes at least a sensor probe assembly 10, which provides a plurality of conductive pins 14, and a compressible electrically conductive member 202, in electrical (XHmmraication with the sensor probe assembly. Preferably, the compressible electrically conductive member 202 is formed from a polyurethane polymer filled with conductive particles, which are preferably carbon particles. One such combination is alow density black conductive Polyurethane open cell flexible conductive foam material provided by Correct Products, Inc. of Richardson, Texas. However, as known in the art, conductive polymers may be formed from a plurality of polymer materials filled with conductive particles, the shape of which may be formed using well known man torturing techniques that include at least molding, extrusion dies and sliced to tfuckness, formed in sheets and: die cut; cut with hot wire equipment; high pressure water jets , or steel rule dies.

As further shown by FIG 18, the embodiment of the novel, inventive, sensor assembly 200 includes at least a signal processing circuit 204, in electrical conununication with the compressible electrically conductive member 202, and a housing 206, confining the sensor probe assembly 10, the compressible electrically conductive member 202, and the signal processing circuit 204, to form the sensor assembly 200.

FIG 19 shows the preferred embodiment of the sensor assembly 200 to be of a continuous curvilinear configuration, however, those skilled in the arts will recognize that any geometric shape may be presented by the sensor assembly 200. It is further noted that the sensor probe assembly 10, is confined by the housing .206 in such 8 manner that the sensor probe assembly 10, can be replaced without the disassembly of the entire sensor assembly 200.

The right side cross-section view and elevation of the preferred

embodiment of the sensor assembly 200 of FIG 20, reveals a rigid conductive member 208, and a plurality of standoffs 210, disposed between the signal processing circuit 204. and the electrically conductive member 202 (shown in its decompressed form). Prdferably, the rigid conductive member 208 is in electrical interaction with a signal conductor 212, and the signal conductor 212 is in electrical communication with signal processing circuit 204. These standoffs 210, are preferably attached to the signal processing circuit 204, and functions to provide a slight compressive load on the compressible electrically conductive member 202. The compressive load allows for decompression of the compressible electrically conductive member 202 while the probe assembly is being exchanged. This particular feature promotes stability of the rest of components within the housing 206, when the sertsor probe assembly is absent from the remaining components of the sensor assembly 200.

As is further shown by FIG 20, the housing 206, of FIG 18, preferahly inchides a component chamber 214, and a confinement cover 216. The component chamber 214 preferably includes a confinement cover retention feature 218_» which interacts with a retention member 220 of the confinement cover 216. In a preferred embodiment, the confinement cover 216 ^Msnaps" onto the component chamber 214. In a preferred embodiment, the component chamber 214 and the confinement cover 216 are formed from a shape retaining material diet provides sufficient flexibility to allow the retention member 220 of the confinement cover 216 to pass by tin confmentemcov^ retention feahire 2J8 of nw component charmre214, and then lock together the confinement cover 216 with the component chamber 214. As those skilled m the art will recognize that there are a number of engine materials suitable for this purpose including, but not limited to, metals, polymers, carbon fiber materials, and laminates.

in the preferred embodiment of the sensor assembly 200, the confinement cover 216 further includes at least a signal processing circuit retention feature 222 and a connector pin 224 supported fay the signal processing circuit retention .feature 222, while the component chamber 214 further includes at least: a sensor probe assembly retention feature 226: a side wall 228 disposed between the confinement cover retention feature 218 and the sensor probe assembly retention feature 226; ami a holding feature 230 provided by the side wall 228 and adjacent in the confinement cover retention feature 218.

In the preferred embodiment of the sensor assembly 200, the

compressibility of the compressible electrically conductive member 202 promotes an ability to change out the sensor probe assembly 10, without disturbing the interaction of die signal processing circuit 204 and the rigid conductive member 208, enr to change out the processing circuit 204 and the rigid conductive member 208 without disturbing the sensor probe assembly 10. When the sensor probe assembly 10 is removed from the preferred embodiment of the sensor assembly 200, the compressible electrically conductive member 202 explains to interact with the sensor prooe assembly retention feature 226 thus maintaining the rigid conductive number 208 in pressing contact with standoffs 210. When the signal processing circuit 204, standoffs 210, and the rigid conductive member 208 axe removed from the preferred embodiment of the sensor assembly 200, the compressibie electrically conductive member 202 explains to interact with the hdding feature 230 to preclude the inadvertent removal of the sensor probe assembly 10 from communication with the sensor probes assembly retention feature 226,

As will be recognized by skilled artisans, his the collaborative effect of the pin or pins 14 of the sensor probe assembly lOintetrcting with the cisniumofthe subject that promotes transference of brainwave signals of the subject to the signal processing circuit 204. To promote die conveyance of the brainwave signal, the sensor prooe assembly 10 furth^

cooperating in retention contact with the plurality of conductive pins 14.

HQ 21 shows an alternate preferred embodiment of a novel, inventive, standalone sensor assembly 300. Preferably, the standalone sensor assembly 300 includes at least' an electrically conductive member 302 forming a first plate 304 of a capacitor 306, a dielectric material 308, adjacent the first plate 304, a second plate 310 of. the capacitor 306 communicating with the dielectric materia! 308. FIG, 21 further shows a housing 314 confining the first plate 304 of the capacitor 306, the dielectric material 308, the second plate 3.10, and the signal processing circuit 312 to form the standalone sensor assembly 300,

FIG,. 22 shows the standalone sensor assembly 300 further includes a communication port 316, useful for transferring processed signals to an external system for analysis, and that the housing 3.14 preferably includes a component chamber 318, and a confinement cover 320, The component chamber 318 preferably includes a confinement cover retention feature 322, which interacts with a retention member 324 of the confinement cover 320. In a preferred embodiment, the confinement cover 320 "snaps" onto the component chamber 3.18_*

In a preferred embodiment, the component chamber 318 and the confinement cover 320 are formed from a shape retaking material that provides sufficient flexibility to allow the retention member 324 of the confinement cover 320 to pass by the confinement cover retention feature 322 of the component chamber 3.18, and then lock together the confinement cover 320 with the component chamber 318, As those skilled in the art will recognize that there are a number of engineering materials suitable for this purpose including, but not limited to, metals, polymers, carbon fiber materials, and laminates.

In a preferred embodiment, the electrically conductive member 302 forming the first plate 304 of the capacitor 306 includes at least, but is not li mited to, a plurality of at least partially insulated pins 326, communicating with a coiiductive member 328, wherein the conductive member is in direct contact adjacency with the dielectric material 308. The plurality of at least partially insulated pins 326, each preferably have four degrees of freedom le,: yaw; pitch; roll; and ¾ axis. The multiple degrees of freedom, accommodates the topography differences in the cranium of different subjects, to promote a subject adaptable, alternate preferred embodiment of the novel, inventive, standalone sensor assembly 300. FIG..23 shows an alternative preferred embodiment of the novel, in venti ve, standalone sensor assembly 330, having a plurality of alternate conductive pins 332; however, the remaining components are substantially equal to the

cotrespondiBg remaining components of the preferred embodiment of the novel inventive, standalone sensor assembly 200, Further shown by FIG, 23, is a brainwave processing system 334, which may be, for example, an

Electroencephalography (BEG) 334,

As is shown by FIG. 24, a preferred embodiment of the si gnal, processing circuit 204 includes at least, but is not limited to, a printed circuit member 400, and a processor 402, interacting with said printed circuit member 400, the processor 402 receiving signals from a sensor probe assembly , such as 200 of FIG. 18 , and communicating the signals to a brainwave processing system, such as 334 of FIG, 23.

The preferred embodiment of the signal processing circuit 204 further includes at least, but is not limited to, a differential amplifier 404, interacting with the printed circuit member 400, a reference signal 406 communicating with the differential amplifier 404, and a subject signal 408 provided by a sensor probe assembly, such as 200 of FIG. .18, when, the sensor probe assembly 200 is in.

electrical contact with a cranium of^'a subject. Preferably, the differential amplifier 404 compares the reference signal 406 to the subject signal 408 and discards common signal patterns presented by said reference and subject signals, 404 and 406, to provide a native brainwave signal 410, of the subject.

Further, the preferred embodiment of the signal processing circuit 204 includes at. least, but is not limited to, an analog to digital converter with a digital signal processing core 412, interacting with the differential amplifier 404 and processing the native brainwave signal 410, provided by the differential amplifier 404, and outputting a digital signal representative of the native brainwave signal, and an infinite impulse response filter 414, interacting with the analog to digital, converter 412, to serve as a band pass filter for said digital signal.

Still, further, the preferred embodiment of the signal processing circuit 204 shown, in FIG.24, includes at least, but is not limited to, a memory 416, also referred to herein, as a buffer 416, communicating with the processor 402, and storing processed native brainwave signals, and a communication port 418 communicating with the buffer 416, the communication port is preferably responsive to the processor 402 for communicating processed native brainwave signals to the brainwave processing system 334.

FIG. 25 shows a method 500, of using a signal processing circuit, such as 400, of FIG. 24. The method begins at start step 502, and proceeds to process step 504, where a brainwave reference signal (such as 406) of a subject is pro vided. At process step 506, a raw brainwave signal (such as 408) of the subject is captured. At process step 508, the signal profiles of the reference arid raw brainwave signals are compared, and signal profiles common, to both are removed, and at process step 510, a native brainwave signal (such as 410} is produced from the result of the removal of signal profiles common to both the reference and raw brainwave signals.

The process continues at process step 512, where the native brainwave signal is converted to a digital band of frequency signal, and passed to an IIR band pass filter (such, as 414} at process step 514. At process step 516, an. absolute value of the digitized signal received from the IRR filter is determined by a processor (such as 402}. It is noted that in a preferred embodiment the Oil filter is programmable and responsive to the processor, and that multiple IIR. filters may be employed to capture a multitude of discrete band frequencies (typically having about a 5Ez spread, such as 10 to 15Hz out of a signal having a frequency range of about 0.5Hz to 45Hz} ), or the programmable IIR. filter may be programed to collect a certain, number of discrete, common, frequency band samples, each sample obtained over a predetermined amount of time, and then reprogriimed to obtain a number of different, discrete, common frequency band samples.

The process continues at process step 518, where the processor determines if a predetermined number of samples of the absolute value each discrete baud frequency of interest has been stored in a buffer (such as 416). If the number of captured desired samples has not been met, the process reverts to process step 504, If the number of captured desired samples has been met, the process proceeds to process step 520. At process step 520, the processor determines an equivalent RMS (root mean square) value for each of the plurality of discrete band frequency, absolute value sets of samples, and those values are provided to a brainwave processing system (such as 334) at process step 522. At process step 524, the process ends.

The right side cross-section view in elevation of the preferred embodiment of the sensor assembly 550 of FIG 26 reveals an electrical element 552, and a plurality of standoffs 210, disposed between the signal processing circuit 204, and an electrically sympathetic member 554. Preferably, the electrical element 552 is a rigid conductive member 532 in electrical mtemction with the signal conductor 212, and the signal conductor 212 is in electrical commiuiication with the signal processing circuit 204. In one preferred embodiment, the electrically sympathetic member 554 is a compressible electrically conductive member 554, and the standoffs 210, are preferably attached to the signal processing circuit 204, and functions to provide a slight compressive load on die compressible electrically conductive member 554. The compressive load allows for decompression of me cotnpressiMe dectricatty conductive member 554 while (he probe assembly 5SS is being exchanged. This particular feature promotes stability of the rest of components within a housing 556, when the seraor probe assembly is absent from the remaining components of the sensor assembly 550.

As is fiirtber shown by FIG 26, the housing 556, preferably includes the component chamber 214, and a confinement cover 558. The cornponent chamber 214 preferably includes a corrtlnement cover retention feature 218, which interacts whh a retention member 560 of the confinement cover 558. In a preferred embodiment, the confinement cover 558 "snaps" onto the component chamber

214. In a preferred embodiment, the component chamber 214 and the confmement cover 558 are formed from a shape retaining material that provides sufficient flexibility to allow the retention member 560 of the confinement cover 558 to pass by the confinement cover retention feature 218 of the component chamber 214, and then lock togemer the c«ifit«roent cover 558 with the componeitt chamber 214. As those skilled in the art will recognize that there are a number of engineering materials suitable for this purpose including, but not limited to, metals, polymers, carbon fiber materials, and laminates.

In the preferred embodiment of the sensor assembly 550, the confinement cover 558 further includes at least a signal processing circuit retention feature 562, the connector pin 564 supported by the signal processing circuit retention feature 562, and an oscillation device conductor 564, while die component chamber 214 further includes at least: a sensor probe assembly retention feature 226; a side wall 228 disposed between (he confinement cover retention feature218 and the sensor probe assembly retention feature 226; and a holding feature 230 provided by the side wall 228 and adjacent in the confinement cover retention feature 218.

Preferably, the oscillation device conductor 564 passes signals between the signal processing circuit 204 and an oscillation device 566, which is responsive to the signal processing circuit 204.

In the preferred embodiment of the sensor assembly 550, the

compressibility of the compressible electrically conductive member 202 promotes an ability to change out the sensor probe assembly 555, without disturbing the interaction of the signal processing ciicuto

552, or to change out the processing circuit 204 and the rigid conductive member 552 without disturbing the sensor probe assembly 555. When the sensor probe assembly SS5 is removed from the preferred embodiment of the sensor assembly 550, the compressible electrically conductive member 554 explains to interact with trie sensor probe assembly retention feature 226 thus maintaining the rigid conductive number 208 in pressing contact with the standofls 210. When the signal processing circuit 204, standoffs 210, and the rigid conductive member 552 are removed from the preferred embodiment of me sensor assembly 550, the compressible electrically conductive member 554 explains to interact with the holding feature 230 to preclude the inadvertemirntnoval of the sensor probe assembly 555 from conununication with the sensor probes assembly retention feature 226.

lb promote the conveyance of the brainwave signal, the sensor probe assembly 555 further provides a conductive aecurement member 557 cooperating in retention contact with an electrically conductive surface 559, which in one preferred embodi ment is a plurality of electrically conductive surfaces 559, In one embodiment, as will be recognized by skilled artisans, it is the collaborative effect of plurality of electrically conductive surfaces 559 of the sensor probe assembly 555 interacting with the cranium of the subject that promotes transference of brainwave signals of the subject to the signal processing circuit 204.

FIG 27 shows an alternate preferred embodiment of a novel, inventive, standalone sensor assembly 570. Preferably, the standalone sensor assembly 570 includes at least an electrically conductive member 572 forming a first plate 574 of a capacitor 576, an electrically responsive member 578, which in a preferred embodiment is a dielectric material 578, adjacent the first plate 574, a second plate 580 of the capacitor 576 communicating with the dielectric material 578. and a signal processing circuit 312 in electrical communication with said capacitor 576. FIG.27 further sh ows a housing 556 confining the first plate 574 of the capacitor 576. the dielectric material 578, the second plate 580, and the signal processing circuit 3.12 to form the standalone sensor assembly 570.

FIG. 28 shows the standalone sensor assembly 570 further includes a communication port 582, useful for transferring processed signals to an external system for analysis, and that the housing 556 preferably includes a component chamber 214, and a confinement cover 558, The component chamber 2.14 preferably includes a confinement cover retention feature 218, which, interacts with a retention member 560 of the confinement cover 558, In a preferred embodiment, the confinement cover 558 "snaps" onto the component chamber 21.4, and a signal conductor 584 of the communication port 582, and the oscillation, device conductor 564 each make an. electrical connection with the signal processing circuit 31.2,

In a preferred embodiment, the electrically conductive member 572 forming the first plate 574 of the capacitor 576 includes at least, but is not limited to, a plurality of at least partially insulated pins 586, communicating with, a conductive member 554, wherein the conductive member is in direct contact adjacency with the dielectric material.578. The plurality of at least partially insulated pins 586, each preferably have four degrees of freedom i.e.: yaw; pitch; roll; and z axis. The multiple degrees of freedom, accommodates the topography differences in the cranium of different, subjects, to promote a subject adaptable, alternate preferred embodiment of the novel, inventive, standalone sensor assembly 570.

In a preferred embodiment illustrated by Fi.Ci 29, the preferred oscillation device 566 is shown to include at least, but. not limited to, an oscillation device controller 588, responsive to the signal processing circuit 3.12, the oscillation device, controller 588 is preferably in electrical communication with an electrical support, member 590. The preferred oscillation device 566 further preferably includes a vibration inducing member 592 responsive to the oscillation device controller 588, and a status indicator 594 in. electrical communication with, and responsive to the signal processing circuit 312, Preferably the vibration inducing member 592 provides a staior 596 responsive to the oscillation device controller 588, and an out of balance rotor 598 responsive to the stater 596. Preferably, the preferred oscillation device 566 also includes a tactile housing 599, confining the vibration inducing member 592, the oscillation device controller 588, and said status indicator 594. hi one embodiment the status indicator 594 is an LED, which blinks in unison with captured brainwave activity. In another embodiment, the preferred oscillation device 566 is responsi ve to a condition of the conducti ve pins 59? interfacing with the scalp of a subject presen ts a circuit with, an excessi ve level, of impedance. Activation, of the preferred oscillation device 566 promotes the breakthrough of the h igh resistance epidermal .layer of skin on the scalp of the subject and .unproved electrical contact, lit another embodiment, the preferred oscillation device 566 provides tactile feedback to the subject to provide awareness of a particular brain state of interest to the subject.

FIG, 29 further shows a preferred brainwave processing system 600, which includes at least, but not limited to, a central processing unit ("CPU") 602 that communicates with the sensor assembly 550 through a multi-channel input/output CW) circuit 604. The CPU 602 further electronically interacts with a communication control circuit 606, which accommodates communication -with remote devices, including, but not limited to wireless communications, in a preferred embodiment, the preferred brainwave processing system 600 farther provides a memory means 608, which may be either a memory (either volatile or non-volatile), or a storage device such as, but not limited to, a flash memory, a solid state disc drive, or a disc drive, or which may be incorporated into the CPU 602. In any case, the memory means 608 facilitates storage of an operating code purposefully written to control the operations of the sensor assembly 550.

The memory means 608 further preferably stores mental exercise routines for a subject, which can be called upon by the CPU 602 in response to a brain state of the subject different than a desired brain state of the subject Preferably, when a particular, desired brain state of the subject is not shown to be present, the CPU 602 preferably selects a mental or physiological exercise to be performed by the subject. The CPU 602 may direct the agitation of the subject cranium by signaling the activation of the oscillation device 566 of the sensor assembly 550, which provides an alert to the subject to, for example without limitation, coinmence with a breathing exercise.

Alternatively, for example without limitation, the CPU 602 may comimnricate through a multi-functional user interface 610 to download commands to an external device, such as but not limited to: an MP3 player, a smart phone; tablet; or a video game delivery device, which presents the selected exercise to the subject. The CPU 602 preferably further processes performance data received from the sensor assembly 550, and stores the processed performance data (either physiological or neurological) in the storage means 608 for delivery to an external database upon a request from said database for said stored perfbnnance data.

FIGS.30 and 31 provide an alternate alternative preferred embodiment of a capacitance sensor assembly 612, which includes a capacitance probe assembly 614, communicating with the signal processing circuit 312. Preferably, the capacitance probe assembly 614 includes a first conductor 616 in direct electrical contact whh a dtelectric material 618, and a second conductor 620 in direct electrical contact with the dielectric material 618. The capacitance probe assembly 614 farmer preferably includes a capacitance probe shield 622, which provides a plurality of vent apertures 624 that assist in modulating die thermal enviroimient surrounding a capacitance signal processing circuit 626.

HQ 31 shows the capacitance sensor assembly 612 preferably includes the oscillation device conductor 564, which preferably passes signals between the signal processing circuit 3 J 2 and the osculation device 566 of FIG 32, as well as the cornraunication port 582, useful for transferring processed signals to a brainwave processing system (such as 600 of FIG 29) for analysis.

In a preferred embodiment, a component chamber 628, similar In function to the component chamber 214 of FIG 28, provides a plurality of attachment tangs 630 used to secure die capacitance probe assembly 614 firmly positioned within the component chamber 628 of the capacitance sensor assembly 612, as shown by FIG 33. In one etnbodiment of the capacitance sensor assembly 612, the capacitance probe assembly 614 is offset from die signal processing circuit 312 by a compressible member 632, and communicated with the signal processing circuit 312 via an electrical connection assembly 634 of FIG 31.

FIG 34 shows the capacitance sensor assei^

oscillation device 566, and communicating with the brainwave processing system 334, which may be, for example, an Electroencephalography (EEG) 334, or in the ahematrve the preferred brainwave processing system 600. Collectively- the capacitance sensor assembly 612 configured with the oscillation device 566 form a preferred capacitance sensor 651.

An exemplary circuit of the capacitance signal processing circuit 626, of die capacitance probe assembly 614 that senses, amplifies and acquires the raw brainwave signal 408 (of FIG.24), is shown in FIG.35. Preferably, the signal on die skin of a subject capacitively couples to a first conductor of a capacitance element. Preferably, the capacitance element further includes at least, but is not limited to: a dielectric material in pressing contact with the fust conductor; and a second conductor in pressing contact with and separated from the first conductor by the dielectric material. Preferably, the capacitance element provides the acquired brainwave signal 408 to the signal processing circuit 312 (of FIG.21). In a preferred embodiment, amplification of tiie taw brainwave signal 408 is accomplished by an instrumentation amplifier, such as the INA 116 provided by Texas Ihstrumems, Inc. of Dallas Texas, is preferably configured for a gain of 50. This component has been seen to have an extremely low input bias current of 3 fA (typical) and an input current noise of 0.1

(typical). It also features guard pin outputs, which follow the positive and negative inputs with a gain of 1.

Preferably, in addi tion to using the positive guard to support a guard ring around the positive input pin, it is also used to drive a shielding metal plate that minimizes electric field pick up from sources other than the scalp. This shield is preferably implemented as an inner layer of metal on the printed circuit above the sensor metal layer. As those skilled in the art will recognize, because it is actively driven to duplicate the input voltage, it avoids parasitic capacitance division of signal gain.

Although the input bias current is extremely small, Ά has been noted that if left unattended, it will drive the togh-impedance positive input node of the amplifier toward one of the supply rails. A means of combating mis is a preferred use of a reset circuit whkh includes two transistors and two resistors. Preferably, the transistors ate turned on by an external circuit when the input voltage nears the common-mode input range of the amplifier. When not driven, the base and emitter nodes of die transistors are pulled up by the guard output. Preferably, this is done to minimize leakage currents (and especially the resultant current noise) from me transistors. In a preferred embodiment, the negative amplifier input is made to track the slowly changing positive input with the feedback loop consisting of R4 and C4. In a preferred embodiment, this loop also serves to cut off input signals of frequencies below about 1 Hz.

FIG.36 shows a method 650, of using a signal processing circuit, such as 312, of FIG.27. The process begins at start step 652, and proceed to process step 654, where a brainwave reference signal (such as 406) of a subject is provided. At process step 656, a capacitance sensor (such as 612 configured with an oscillation device such as 566) in contact adjacency with a cranium of the subject is agitated. At process step 658, a raw brainwave signal (such as 408) of the subject' is capt.ii.red using the capacitance sensor. At process step 660, the signal, profiles of the reference and raw brainwave signals are compared, and signal profiles common to both are removed, and at process step 662, & native brain wave signal (such as 410) is produced from the result: of the .removal of signal, profiles common to both the reference and raw brainwave signals.

The process continues at process step 664, the native brainwave signal is converted to a digital baud of frequency signal, and passed to an !IR band pass filter (such as 414) at process step 666, At process step 668, an absolute value of the digitized signal received from the HR filter is determined by a processor (such as 402). it is noted that in a preferred, embodiment the HR filter is programmable and responsive to the processor, and that multiple HR filters may be employed to capture a multitude of discrete band frequencies (typically having about a SHz spread, such as 10 to 15H2 out of a signal having a frequency range of about 0.5Hz to 45H_Z), or the programmable HR filter may be programed to collect a certain number of discrete, common frequency band samples, each sample obtained over a predetermined amount of time, and then reprogramed to obtain a number of different, discrete, common frequency band samples.

The process continues at process step 670, the processor determines if a predetermined number of samples of the absolute value each discrete hand frequency of interest has been stored in a memory means (such as 608), If the number of captured desired samples has not been, met, the process reverts to process step 654. if the number of captured desired samples has been met, the process proceeds to process step 672. At process step 672, the processor determines an equivalent RMS (root mean square) value for each of the plurality of discrete band frequency , absolute value sets of samples, and those val ues are provided to a brainwave processing system (such as 334) at process step 674. At process step 676, the process ends.

FIG. 37 shows a cross section view in ele vation of an alternate embodiment of a housing 700 of the inventive sensor probe assembly_* Preferably, the housing 700 provides a retention boss 702, which serves to center a compressible electrically conductive member, such as 704 of FIG, 39, and a retention feature 706, which cooperates with an. attachment feature 70S, of a sensor probe support member 710, of FIG. 41, to secure the sensor probe support member 710 to the housing 700,

FIG. 40 shows a preferred sensor probe 712, providing a plurality of conductive spires 714, and a compressible electrically conductive member confinement feature 716. The compressible electrically conductive member confinement feature 716 interacts with the compressible electrically conductive member 704, of FIG, 39, to maintain, stability and alignment of the compressible electrically conductive member 704, within the housing 700, of FIG. 37. in a preferred embodiment, the sensor probe 712, is formed from a conductive polymer, which may be formed from a plurality of polymer materials filled with conducti ve particles, the shape of which may be formed using well known manufacturing techniques that include at least molding. The spires 714, are shaped to

conveniently interact with a cranium of a subject, and provide ample contact with the cranium of the subject to effectively conduct brain wave signals of the subject to and through the compressible electrically conductive member 704, which is in electrical communication with a signal conductor 7.18, of FIG, 38. hi a preferred embodiment the signal conductor 718 carries the subjects brainwave signal to a brain wave processing circuit, such as a brainwave processing system 334 (of FIG. 23) via a communication aperture 719, of FIG . 37. The communication aperture

719, providing access for the signal conductor 7.18, which is in. electrical communication with each the compressible electrically conductive member 704, of FIG. 39, and the brain wave processing system 334. Preferably, the compressible electrically conductive member 704 is formed from an. electrically conductive compassion spring.

FIG.42 is a cross section view In elevation of a novel sensor sub-assembly

720, which is preferably .formed from the union of at least: the housing 700; the compressible electrically conductive member 704; the sensor probe support member 710; the sensor probe 712; and the signal conductor 718. With the addition of a. film of neurodiagnosti.c electrode paste 722, (such as Ten20® conductive .neurodiagnosti.c electrode paste by Weaver and Company, 565 Nuela Way, Unit B, Aurora, Colorado 80011) of ΠΟ.43, to the spins 714 of FIG.42, and the inclusion of a cover 724 of FIG, 44, for the spires 714 coated with a film of neurodiagnostic electrode paste 722, to the sensor sub-assembly 720. a sensor assembly 726 of FIG.45 is formed. The neunxKagwetic electrode paste 722. promotes improved conductivity of the subjects brain wave signals to the brainwave processing system 334, of FIG.23, and continues to improve die conductivity of the spires 7 J 4 as the film coated spires adjust to the chemistry present on the subjects cranium.

FIG.46 is a cross sectional view in elevation of an alternate sensor probe assembly 728, formed from die combination of die sensor probe 712, of FIG.40, whh the sensor probe support member 710, of FIG.41.

In a preferred embodiment illustrated by FIG 47, the preferred oscillation device 566 is shown to include at least, but not limited to, an oscillation device controller S88, responsive to the signal processing circuit 3 J 2, the oscillation device controller 588 is preferably in electrical comrmmication with an electrical support member 590. The preferred oscillation device 566 further preferably includes a vibration inducing member 592 responsive to the oscillation device controller 588, and a status indicator 594 in electrical conununication with and responsive to the signal processing circuit 312. Preferably the vibration inducing member 592 provides a stator 596 responsive to the oscillation device controller 588, and an out of balance rotor 598 responsive to the stator 596. Preferably, the preferred oscillation device 566 also includes a tactile housing 599, confining the vibration inducing member 592, the oscillation device controller 588, and said status indicator 594. In one embodiment the status indicator 594 is an LED, which blinks in unison with captured brainwave activity. In another embodiment, me preferred oscillation device 566 is responsive to a condition of the conductive pins 714, of FIG 45, mterfceing with the scalp of a subject presents a circuit with an excessive level of impedance. Activation of die preferred oscillation device 566 promotes the breakthrough of the high resistance epidermal layer of skin on the scalp of the subject and improved dectrical contact In another embc<fiment, (he preJerred oscillation device 566 provides tactile feedback to die subject to provide awareness of a particular brain state of interest to the subject.

FIG.48 shows die union of the sensor assembly 726 of FIG.45, with the preferred oscillation device 566 of FIG 47, forms an alternate tactile enabled neurophysiological sensor 730.

As will be apparent to those skilled in the art, a number of modifications could be made to the preferred embodhnents which would not depart from the spirit or the scope of the present invention. While the presently preJerred embodiments have been described for purposes of this disclosure, numerous changes and modifications will be apparent to those skilled in the art Insofar as these changes and modifications are within the purview of the appended claims, they are to be considered as part of the present invention.

Claims

1. A tactile enabled sensor comprising:

a sensor assembly providing at least a sensor probe, the sensor probe

including a main body portion having a plurality of conductive spires extending from a first side of the main body, and a compressible electrically conductive member confinement feature extending from an opposite side of the main body, each of the plurality of conductive spires passing through spire apertures provided by a sensor probe support member supporting said sensor probe, the p!uxality of conductive spires conducting brainwave signals of a subject;

an oscillation device communicating with said sensor assembly, wherein said sensor assembly is in conummkation with a signal processing circuit in electrical cornmunication with the oscillation device and the brainwave signals of the subject, die oscillation device selectively agitates said plurality of conductive spires in response to an electrical state of the brahrwave signal of the subject; and a compressible electrically sympathetic member in electrical

communication with said sensor assembly, the compressible electrically sympathetic member is isolated from a cranium of the subject by the sensor assembly, the isolation of the compressible electrically sympathetic member from the cranium of the subject precludes a bond between the cranium of the subject and the compressible electrically sympathetic member, the main body portion electrically couples each of the plurality of conductive spires one to the other.

2. The tactile enabled sensor of claim 1 , in which said sensor assembly further comprising, a signal conductor interacting with said compressible electrically sympathetic member and conrniunicaring signals facilitated by said plurality of conductive spires to said signal processing circuit.

3. The tactile enabled sensor of claim 2, in which said sensor assembly further comprising a housing interacting with said sensor probe support member and confining said compressible electrically sympathetic member.

4. The tactile enabled sensor of claim 3, in which said oscillation device comprising:

an oscillation device controller responsive to said signal processing circuit; a vibration inducing member responsive to said oscillation device

controller;

a status indicator responsive to said signal processing circuit; and a tactile bousing confining said vibration uiducing member, said oscillation device controller, and said status indicator.

5. The tactile enabled sensor of claim 4, in which said compressible electrically sympathetic member is formed from an electrically conductive compression spring.

6. The tactile enabled sensor of claim 5, in which said sensor assembly further comprising a comrmtnication port interacting with said signal processing circuit and communicaiing inJbnnation between said signal processing circuit and a brainwave processing system.

7. The tactile enabled sensor of claim 6. in which said sensor assembly further comprising an oscillator port interacting with said oscillation device controller to facilitate activation of said vibration inducing member.

8. The tactile enabled sensor of claim 7, in which title bousing provides a retention boss, which serves to center the compressible electrically conductive member.

9. The tactile enabled sensor of claim 8, in which the compressible electrically conductive member confinement feature interacts with the

compressible electrically conductive member, the compressible electrically conductive member confinement feature maintains stability and alignment of the compressible electrically conductive member within the housing.

10. The tactile enabled sensor of claim 9, said housing further comprising a communication aperture, the communication aperture providing access for a signal conductor in electrical communication with each the compressible electrically conductive member and the brainwave processing system.

11. The tactile enabled sensor of claim 10, farther comprising a cover cooperating with the sensor probe support member, die cover maintaining an integrity of the spires supporting the film of neurodiagnostic electrode paste applied to said spires.

12. The tactile enabled sensor of claim 1, in which the sensor probe is formed from a polymer.

13. The tactile enabled sensor of claim 12, in which the polymer is impregnated with conductive particles

14. The tactile enabled sensor of claim 13, wherein the conductive particles comprise carbon.

15. The tactile enabled sensor of clairo 11 , in which said housing further includes at least a retention feature, which cooperates with an attachment feature of the sensor probe support member, the retention feature in cooperation with the attachment feature secures the sensor probe support member to the housing.

16. The tactile enabled sensor of claim 8, in which the sensor probe is formed from a polymer.

17. The tactile enabled sensor of claim 16, in which the polymer is impregnated with conductive particles

18. The tactile enabled sensor of claim 17, wherein the conductive particles comprise carbon.

19. The tactile enabled sensor of claim 18, in which said housing further includes at least a retention feature, which cooperates with an attachment feature of the sensor probe support member, the retention feature in cooperation with the attachment feature secures the sensor probe support member to the housing.

20. The tactile enabled sensor of claim 16, in which said signal processing circuit comprising:

a printed circuit supporting a processor;

a differentia! amplifier interacting with said printed circuit member;

a reference signal corrununicating with said differential amplifier; and a subject signal provided by said sensor probe assembly, when said sensor probe assembly is in electrical contact with a cranium of a subject, wherein said differential amplifier compares said reference signal to said subject signal and discards common signal rwtterns presented by said reference and subject signals to provide a native brainwave signal of the subject

21. The tactile enabled sensor of claim 20, in which the signal processing circuit further comprising:

an analog to digita] converter with a digital signal processing core

responsive to said processor and interacting with said differential amplifier, said analog to digital converter processing said native brainwave signal provided by said differential amplifier and outputting a digital signal representative of said native brainwave signal;

an infinite hnpulse response filter interacting with said analog to digital converter to serve as a band pass filter for said digital signal; and a memory cornmunicating with said processor and storing a plurality of native brainwave signals, wherein said processor operates on a predetermined number of the plurality of said native brainwave signals to provide an equivalent root mean square value of the predetermined number of the plurality of said native brainwave signals, and further wherein the communication port communicating with the memory and responsive to the processor provides the equivalent root mean square value of the predetermined number of the plurality of said native brainwave signals to said brainwave processing system.