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WO2016200015A1 - Three-dimensional printer and operation method therefor - Google Patents

Three-dimensional printer and operation method therefor Download PDF

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Publication number
WO2016200015A1
WO2016200015A1 PCT/KR2016/002076 KR2016002076W WO2016200015A1 WO 2016200015 A1 WO2016200015 A1 WO 2016200015A1 KR 2016002076 W KR2016002076 W KR 2016002076W WO 2016200015 A1 WO2016200015 A1 WO 2016200015A1
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WO
WIPO (PCT)
Prior art keywords
light
irradiation module
light irradiation
guide bar
liquid resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2016/002076
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French (fr)
Korean (ko)
Inventor
엄태관
김병국
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Osstem Implant Co Ltd
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Osstem Implant Co Ltd
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Filing date
Publication date
Application filed by Osstem Implant Co Ltd filed Critical Osstem Implant Co Ltd
Publication of WO2016200015A1 publication Critical patent/WO2016200015A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C67/00Shaping techniques not covered by groups B29C39/00 - B29C65/00, B29C70/00 or B29C73/00
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B33ADDITIVE MANUFACTURING TECHNOLOGY
    • B33YADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y30/00Apparatus for additive manufacturing; Details thereof or accessories therefor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B33ADDITIVE MANUFACTURING TECHNOLOGY
    • B33YADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y50/00Data acquisition or data processing for additive manufacturing
    • B33Y50/02Data acquisition or data processing for additive manufacturing for controlling or regulating additive manufacturing processes

Definitions

  • the present invention relates to a three-dimensional printer and a method of operation thereof, and more particularly, to a three-dimensional printer and a method of operating the three-dimensional three-dimensional object made possible with a large-area slice cross-sectional layer.
  • a three-dimensional printer refers to a device for manufacturing a three-dimensional object in a lamination method similar to that used in a conventional inkjet printer, not milling or cutting. Because these three-dimensional printers are computer controlled, they can be produced in a variety of forms and are easier to use than other manufacturing technologies. Such a three-dimensional printing technology is called the third industrial revolution, and has brought a great change in manufacturing technology throughout the industry.
  • Three-dimensional printing technology can be classified into six types of photocuring lamination, laser sintering lamination, resin extrusion lamination, inkjet lamination, polyjet lamination and thin film lamination.
  • Photocuring lamination method is to cure the photocuring resin (Photo Curing resin) with a laser beam or strong ultraviolet (UV, Ultraviolet Ray) to produce a three-dimensional object, such a photocuring lamination method SLA (Stereo Lithography Apparatus, (Digital Light Processing).
  • SLA Stepo Lithography Apparatus, (Digital Light Processing).
  • the laser sintering lamination method is a method of producing a three-dimensional object by sintering a powder material from a laser beam at high pressure and high temperature.
  • Such a laser sintering lamination method includes SLS (Selective Laser Sintering).
  • the resin extrusion lamination method is a method of manufacturing a three-dimensional object by extruding a wire-shaped material to the injection head, this resin extrusion lamination method is FDM (Fused Deposition Modeling).
  • the inkjet lamination method is a method of manufacturing a three-dimensional object by spraying a binder in a liquid state onto a material from a printer head nozzle, and such inkjet lamination method includes CJP (Color Jetting Printing).
  • the polyjet lamination method is a mixture of photocuring and inkjet method to produce a three-dimensional object by spraying the material from the print head and curing with ultraviolet rays.
  • the polyjet lamination method includes MJP (Multi Jet Printing) and Polyjet. have.
  • the thin film lamination method is a method of manufacturing a three-dimensional object by cutting a thin plate-like material with a precision cutter, and then heat-bonded, such a thin film lamination method is LOM (Laminated Object Manufacturing), PLT (Paper Lamination Technology).
  • the DLP method is a mask projection image curing method, and the three-dimensional object of the shape to be produced by selectively projecting and curing light on the photocurable resin To manufacture.
  • the DLP method lowers the mold and produces the product in a downward direction unlike the mold.
  • a three-dimensional object is manufactured by projecting light from a commonly known beam projector onto a photocurable liquid resin.
  • a beam projector having a high pixel count may be used in consideration of the size of the manufactured three-dimensional solid object, but in this case, the price of the three-dimensional printer is expensive.
  • Korean Patent Registration No. 10-1430582 discloses a three-dimensional printer device configured to improve the stability in the production of three-dimensional object by configuring the extruder of the three-dimensional printer with a multi-feeder and a rotary multi-nozzle
  • a three-dimensional printer apparatus does not disclose a method for effectively producing a three-dimensional solid object for a large-area slice cross-sectional layer.
  • Patent Document 1 Korean Patent Registration No. 10-1430582 (2014.08.08)
  • the technical problem of the present invention for solving the above problems is to provide a three-dimensional printer and a method of operating the three-dimensional three-dimensional object having a large cross-sectional slice layer.
  • an embodiment of the present invention includes a light irradiation module for irradiating light; A container unit provided on the light irradiation module and accommodating the photocurable liquid resin; A mold for moving the photocurable liquid resin cured to sequentially cure the photocurable liquid resin contained in the container portion; It provides a three-dimensional printer comprising a; and the transfer unit for controlling the two-dimensional planar movement of the light irradiation module in the longitudinal and width directions.
  • the light irradiation module the light source; A light control unit controlling an irradiation area of light transmitted from the light source; And a housing accommodating the light source and the light control unit therein.
  • the transfer unit X-axis transfer unit to form a pair in a state spaced apart from each other, to move the light irradiation module in the longitudinal direction;
  • a Y-axis feeder which is seated and supported by the X-axis feeder and moves the light irradiation module in a widthwise movement.
  • the X-axis transfer unit the first guide bar for guiding the light irradiation module in the longitudinal direction;
  • a first motor coupled to one end of the first guide bar to rotate the first guide bar;
  • a first plate coupled to the first guide bar and moved according to the rotation of the first motor;
  • a first fixing part coupled to the other end of the first guide bar;
  • a support part supporting the first motor and the first fixing part.
  • the Y-axis transfer unit for guiding the light irradiation module in the width direction;
  • a second motor coupled to one end of the second guide bar to rotate the second guide bar;
  • a second plate coupled to the second guide bar and moved according to the rotation of the second motor;
  • a second fixing part coupled to the other end of the second guide bar, wherein the light irradiation module is seated and fixed to the second plate, and the second motor and the second fixing part are seated on the first plate. Can be fixed.
  • the light control unit the reflection unit for changing the path of the light transmitted to the light source; And a lens for adjusting an irradiation area of light transmitted from the reflector.
  • the reflector may be made of a digital micromirror device (DMD).
  • DMD digital micromirror device
  • the transfer unit may move the light irradiation module for each section of the slice cross-sectional layer.
  • One embodiment of the present invention comprises the steps of a) irradiating light with a photocurable liquid resin; And b) sequential curing is performed by the light irradiated with the photocurable liquid resin, and moving the cured photocurable liquid resin to an upper portion.
  • the light irradiation The module provides a method of operating a three-dimensional printer, which is moved by the partitions of the slice cross-sectional layer to cure the photocurable liquid resin.
  • the light irradiation module is made to be selectively moved in the longitudinal direction and the width direction by the transfer unit, the area capable of curing the photocurable liquid resin from the light irradiation module can be widened. That is, the light irradiation module configured to be movable on a plane may produce a three-dimensional object having a larger shape than a conventional fixed type light irradiation module.
  • the three-dimensional printer partitions the slice cross-sectional layer of the large area, and then moves the light irradiation module for each divided section, thereby making the large-dimensional three-dimensional solid object Can be manufactured precisely.
  • FIG. 1 is a schematic configuration diagram of a three-dimensional printer according to an embodiment of the present invention.
  • FIG. 2 is a schematic perspective view showing a transfer unit according to an embodiment of the present invention.
  • FIG 3 is an exemplary view of a light irradiation module according to an embodiment of the present invention.
  • FIG. 4 is an operational state diagram showing a process of moving the light irradiation module for a large cross-sectional slice layer in accordance with an embodiment of the present invention.
  • FIG. 1 is a schematic configuration diagram of a three-dimensional printer according to an embodiment of the present invention
  • Figure 2 is a schematic perspective view showing a transfer unit according to an embodiment of the present invention
  • Figure 3 is an embodiment of the present invention 4 is an exemplary view illustrating a light irradiation module
  • FIG. 4 is an operation state diagram illustrating a process of moving a light irradiation module to a slice cross-sectional layer of a large area according to an embodiment of the present invention.
  • the 3D printer 1000 may include a light irradiation module 100, a container part 200, a molding stand 300, and a transfer part 400.
  • the light irradiation module 100 is configured to irradiate light with the photocurable liquid resin 1 contained in the container portion 200, and the light irradiation module 100 corresponds to slice data divided into cross-sectional layers of a three-dimensional solid object.
  • the three-dimensional solid object is manufactured by irradiating light to a region to cure and curing the photocurable liquid resin 1.
  • the thickness of the cross-sectional layer of the three-dimensional solid material in which the photocurable liquid resin 1 is cured is usually made of a thickness of 50 ⁇ m, but may be variously manufactured in a thickness other than 50 ⁇ m.
  • the light irradiation module 100 may include a light source 110, a light control unit 120, and a housing 130.
  • the light source 110 is a structure which provides light to the photocurable liquid resin 1 in which hardening is performed.
  • the photocurable liquid resin 1 is cured when exposed to light for a predetermined time or more, and the photocurable liquid resin 1 accommodated in the container part 200 is sequentially formed by the light provided from the light source 110. Hardening can be made and can be produced in three-dimensional solids.
  • UV ultraviolet
  • EB electron beam
  • the light source 110 uses visible light when the photocurable liquid resin 1 is cured in the visible light region, and uses ultraviolet light when curing is performed in the ultraviolet light region. It can be selectively used according to the chemical liquid resin (1). On the contrary, of course, the photocurable liquid resin 1 may be selectively used in accordance with the light source 110.
  • the light control unit 120 is made to irradiate the light provided from the light source 110 to the container 200.
  • the light adjuster 120 may include a reflector 121 and a lens 122.
  • the reflector 121 is configured to change the path of the light provided from the light source 110.
  • the reflector 121 may be formed of a digital micromirror device (DMD) chipset. That is, the reflector 121 may be a reflective indicator in which a very small mirror is placed on the semiconductor.
  • DMD digital micromirror device
  • the reflector 121 having the DMD chipset may rotate independently of each mirror to vary the path of the light provided from the light source 110. That is, the reflector 121 may vary the path of the light provided to the light source 110 through the blinking or selective control of each pixel.
  • the reflector 121 is not necessarily limited to the DMD chipset, and may be various configurations capable of changing the path of the light provided from the light source 110.
  • the lens 122 is configured to adjust the irradiation area of the light transmitted from the reflector 121.
  • the lens 122 refracts the light transmitted from the reflector 121 to adjust the irradiation area of the light.
  • the lens 122 and the reflector 121 may selectively adjust the irradiation area of the light through the mutual distance control.
  • the lens 122 and the reflector 121 adjust the irradiation area of the light through the mutual distance control
  • the lens 122 and the reflector 121 may be adjusted by the individual movement, the lens 122
  • only one configuration of the reflector 121 may be selectively moved, and the distance between the lens 122 and the reflector 121 may be adjusted.
  • the housing 130 forms an external shape of the light irradiation module 100, and accommodates the light source 110 and the light control unit 120 therein.
  • the housing 130 is made to protect the light source 110 and the light control unit 120 from the outside.
  • the mold 300 may include a molding plate 310 and the Z-axis transfer unit (320).
  • the mold 300 is a container that is not cured by the uncured photocurable liquid resin (1) by sequentially moving the molding plate 310 in the upper side, that is, the height direction using the Z-axis transfer unit 320 The lowermost part of the part 200 is moved to be positioned.
  • the photocurable liquid resin 1 is sequentially cured for each slice cross-sectional layer in the molding plate 310, and a three-dimensional solid object can be produced.
  • the light irradiation module 100 is made to be able to move in the two-dimensional plane in the longitudinal direction and the width direction is possible to manufacture a three-dimensional solid object even if the slice cross-sectional layer of the three-dimensional object.
  • the transfer unit 400 may include an X-axis transfer unit 410 and a Y-axis transfer unit 420. have.
  • the X-axis transfer unit 410 is a configuration for selectively moving the light irradiation module 100 in the longitudinal direction
  • the Y-axis transfer unit 420 is a configuration for selectively moving the light irradiation module 100 in the width direction. .
  • the X-axis transfer part 410 may include a first guide bar 411, a first motor 412, a first plate 413, a first fixing part 414, and a support part 415.
  • the first guide bar 411 is configured to guide the light irradiation module 100 in the longitudinal direction. That is, the light irradiation module 100 may be selectively moved in the longitudinal direction along the first guide bar 411.
  • the first guide bar 411 is formed with a threaded ball insertion groove guides the ball. That is, the first plate 413 is coupled in a state in which the first guide bar 411 and the plurality of balls are in contact with each other, so that the first plate 413 is connected to the first guide bar in accordance with the rotation of the first guide bar 411. 411 may be selectively moved along the length direction.
  • the pair of first plates 413 are configured to support and fix the second motor 422 and the second fixing part 424, respectively.
  • the first motor 412 is coupled to one end of the first guide bar 411 and selectively rotates the first guide bar 411. For example, when the first motor 412 rotates in the forward direction, the light irradiation module 100 is moved to the first motor 412 side. On the contrary, when the first motor 412 rotates in the reverse direction, the first motor 412 rotates in the reverse direction. 1 The light irradiation module 100 may be moved to the fixing part 414 side.
  • the light irradiation module 100 may be selectively moved along the first guide bar 411 according to the rotation direction of the first motor 412.
  • the first fixing part 414 is provided at the other end of the first guide bar 411 and is configured to stably support the first guide bar 411.
  • the first fixing part 414 may be a bearing.
  • the support 415 is configured to support the first motor 412 and the first fixing part 414.
  • the support part 415 may be fixedly installed on an inner surface of a casing (not shown) forming an external shape of the 3D printer 1000.
  • the X-axis transfer unit 410 forms a pair in a spaced state, and is made to support the Y-axis transfer unit 420.
  • the Y-axis feeder 420 may include a second guide bar 421, a second motor 422, a second plate 423, and a second fixing part 424.
  • the second guide bar 421 is configured to guide the light irradiation module 100 in the width direction. That is, the light irradiation module 100 may be selectively moved in the width direction along the second guide bar 421.
  • the second guide bar 421 is formed with a threaded ball insertion groove is guided ball. That is, the second plate 423 is coupled in a state in which the second guide bar 421 and the plurality of balls are in contact with each other, so that the second plate 423 may be the second guide bar according to the rotation of the second guide bar 421. It may be selectively moved along the width direction of the 421.
  • the light irradiation module 100 is fixed to the second plate 423 to be seated and fixed.
  • the second motor 422 is coupled to one end of the second guide bar 421 and selectively rotates the second guide bar 421. For example, when the second motor 422 is rotated in the forward direction, the light irradiation module 100 is moved to the second motor 422 side. On the contrary, when the second motor 422 is rotated in the reverse direction, the second motor 422 is rotated in the reverse direction. The light irradiation module 100 may be moved to the 2 fixing part 424 side.
  • the light irradiation module 100 may be selectively moved along the second guide bar 421 according to the rotation direction of the second motor 422.
  • the second fixing part 424 is provided at the other end of the second guide bar 421 and is configured to stably support the second guide bar 421.
  • This second fixing part 424 may be a bearing.
  • the transfer unit 400 may selectively move the light irradiation module 100 in the longitudinal direction and the width direction on a two-dimensional plane. Accordingly, even when the slice cross-sectional layer irradiated from the light irradiation module 100 has a large area, the transfer part 400 may manufacture the three-dimensional solid object with high precision by selectively moving the light irradiation module 100 on a plane. .
  • the transfer unit 400 is configured to move the light irradiation module 100 for each partition of the slice cross-sectional layer when the slice cross-sectional layer of the three-dimensional solid object to be manufactured has a large area. That is, the light irradiation module 100 moved by the transfer unit 400 for each division of the slice cross-sectional layer irradiates light with the photocurable liquid resin 1 to proceed to cure the photocurable liquid resin 1 for each division. Let's go.
  • 4 (a) shows the light irradiation module 100 in a zigzag as the transfer unit 400 is moved from the first compartment 510 to the fourth compartment 540 with respect to the slice section layer divided into four.
  • 4B illustrates a case in which the transfer part 400 is moved counterclockwise with respect to the slice cross-sectional layer divided into four parts.
  • the transfer unit 400 may move the light irradiation module 100 for each partition of the slice cross-sectional layer and harden the slice cross-sectional layer of a large area.
  • the upper boundary surface and the left boundary surface of the fourth compartment 540 are not cured, and the second compartment 520 is not finished.
  • the lower boundary surface and the right boundary surface of the third compartment 530 may be firmly coupled.
  • the light irradiation module 100 is moved in a zigzag to cure the photocurable liquid resin 1. It is preferable. That is, the coupling between the boundary surfaces of the fourth compartment 540 from the first compartment 510 where curing is performed may be securely performed.
  • the movement path of the light irradiation module 100 does not necessarily move only in a zigzag form, but may have various movement paths.
  • the number of partitions partitioned with respect to the large-area slice cross-sectional layer is not necessarily limited to four, but may be variously set according to the size of the large area and the resolution of the light irradiation module 100.
  • the light irradiation module 100 is irradiated with light to the photocurable liquid resin (1).
  • the light irradiation module 100 selectively irradiates light to the photocurable liquid resin 1 by selectively adjusting the irradiation area and the path of the light.
  • the light irradiation module 100 irradiates light to a region corresponding to slice data divided into a cross-sectional layer of a three-dimensional solid object to cure the photocurable liquid resin 1 to produce a three-dimensional solid object.
  • the light irradiation module 100 is moved by partitions to cure the slice cross-sectional layer of a large area.
  • the mold 300 moves the photocurable liquid resin 1 sequentially cured from the light irradiation module 100 to the upper part to manufacture a three-dimensional solid object.
  • housing 200 container part
  • first fixing portion 415 support portion
  • fourth compartment 1000 three-dimensional printer

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)

Abstract

One embodiment of the present invention provides a three-dimensional printer and an operation method therefor, the three-dimensional printer comprising: a light emission module which emits light; a container part which is provided on the upper part of the light emission module and accommodates a photocurable liquid resin; a molding base which, in order to enable the photocurable liquid resin accommodated in the container part to be consecutively cured, moves the photocurable liquid resin that is cured to an upper part; and a transfer part which controls the movement of the light emission module on a two-dimensional plane in the length direction and width direction.

Description

3차원 프린터 및 그의 작동방법3D printer and its operation method

본 발명은 3차원 프린터 및 그의 작동방법에 관한 것으로, 보다 상세하게는 대면적의 슬라이스 단면 층을 갖는 3차원 입체물의 제조가 가능하도록 이루어진 3차원 프린터 및 그의 작동방법에 관한 것이다.The present invention relates to a three-dimensional printer and a method of operation thereof, and more particularly, to a three-dimensional printer and a method of operating the three-dimensional three-dimensional object made possible with a large-area slice cross-sectional layer.

일반적으로 3차원 프린터는 밀링 또는 절삭이 아닌, 기존 잉크젯 프린터에서 쓰이는 것과 유사한 적층 방식으로 입체물로 제작하는 장치를 말한다. 이러한 3차원 프린터는 컴퓨터로 제어되기 때문에 만들 수 있는 형태가 다양하고 다른 제조 기술에 비해 사용하기가 쉽다. 이와 같은, 3차원 프린팅 기술은 제 3의 산업혁명으로 불리며, 산업 전반에 걸쳐 제조 기술의 큰 변화를 가져오고 있다.In general, a three-dimensional printer refers to a device for manufacturing a three-dimensional object in a lamination method similar to that used in a conventional inkjet printer, not milling or cutting. Because these three-dimensional printers are computer controlled, they can be produced in a variety of forms and are easier to use than other manufacturing technologies. Such a three-dimensional printing technology is called the third industrial revolution, and has brought a great change in manufacturing technology throughout the industry.

3차원 프린팅 기술에는 크게 광경화 적층방식, 레이저 소결 적층방식, 수지 압출 적층방식, 잉크젯 적층방식, 폴리젯 적층방식 및 박막 적층방식의 6가지 정도로 나뉠 수 있다.Three-dimensional printing technology can be classified into six types of photocuring lamination, laser sintering lamination, resin extrusion lamination, inkjet lamination, polyjet lamination and thin film lamination.

광경화 적층방식은 레이저 빔이나 강한 자외선(UV, Ultraviolet Ray)으로 광경화성 액상 수지(Photo Curing resin)를 경화시키며 입체물을 제조하는 방식으로, 이러한 광경화 적층방식에는 SLA(Stereo Lithography Apparatus), DLP(Digital Light Processing)가 있다.Photocuring lamination method is to cure the photocuring resin (Photo Curing resin) with a laser beam or strong ultraviolet (UV, Ultraviolet Ray) to produce a three-dimensional object, such a photocuring lamination method SLA (Stereo Lithography Apparatus, (Digital Light Processing).

레이저 소결 적층방식은 레이저 빔으로부터 분말상태의 재료를 고압, 고온으로 소결시켜 입체물을 제조하는 방식으로, 이러한 레이저 소결 적층방식에는 SLS(Selective Laser Sintering)가 있다.The laser sintering lamination method is a method of producing a three-dimensional object by sintering a powder material from a laser beam at high pressure and high temperature. Such a laser sintering lamination method includes SLS (Selective Laser Sintering).

수지 압출 적층방식은 와이어 형태의 재료를 사출헤드로 압출하며 입체물을 제조하는 방식으로, 이러한 수지 압출 적층방식에는 FDM(Fused Deposition Modeling)이 있다.The resin extrusion lamination method is a method of manufacturing a three-dimensional object by extruding a wire-shaped material to the injection head, this resin extrusion lamination method is FDM (Fused Deposition Modeling).

잉크젯 적층방식은 프린터 헤드 노즐에서 액체상태의 결합제를 재료에 분사하여 입체물을 제조하는 방식으로, 이러한 잉크젯 적층방식에는 CJP(Color Jetting Printing)가 있다.The inkjet lamination method is a method of manufacturing a three-dimensional object by spraying a binder in a liquid state onto a material from a printer head nozzle, and such inkjet lamination method includes CJP (Color Jetting Printing).

폴리젯 적층방식은 광경화 방식과 잉크젯 방식의 혼합 형태로 프린터 헤드에서 재료를 분사함과 동시에 자외선으로 경화시켜 입체물을 제조하는 방식으로, 이러한 폴리젯 적층방식에는 MJP(Multi Jet Printing), Polyjet이 있다.The polyjet lamination method is a mixture of photocuring and inkjet method to produce a three-dimensional object by spraying the material from the print head and curing with ultraviolet rays. The polyjet lamination method includes MJP (Multi Jet Printing) and Polyjet. have.

박막 적층방식은 얇은 판모양의 재료를 정밀커터로 자른 후, 열을 가열하여 접착시킴으로써 입체물을 제조하는 방식으로, 이러한 박막 적층방식에는 LOM(Laminated Object Manufacturing), PLT(Paper Lamination Technology)가 있다.The thin film lamination method is a method of manufacturing a three-dimensional object by cutting a thin plate-like material with a precision cutter, and then heat-bonded, such a thin film lamination method is LOM (Laminated Object Manufacturing), PLT (Paper Lamination Technology).

이와 같은, 다양한 3차원 프린팅 기술 중 광경화 적층방식의 DLP 방식을 구체적으로 살펴보면, DLP 방식은 마스크 투영 이미지 경화방식으로, 광경화성 수지에 광을 선택적으로 투영하여 경화시킴으로써 제작하고자 하는 형상의 입체물을 제조하게 된다.Looking specifically at the DLP method of the photocuring lamination method among the various three-dimensional printing techniques, the DLP method is a mask projection image curing method, and the three-dimensional object of the shape to be produced by selectively projecting and curing light on the photocurable resin To manufacture.

이러한 DLP 방식은 일반적으로 조형판이 하강하며 제품을 생산하는 것과 달리 조형판이 위로 이동하며 아래방향으로 제품을 생성하게 된다.In general, the DLP method lowers the mold and produces the product in a downward direction unlike the mold.

DLP 방식은 흔히 알고 있는 빔 프로젝터로부터 제공되는 광을 광경화성 액상 수지로 투사하여 입체물을 제조하게 된다.In the DLP method, a three-dimensional object is manufactured by projecting light from a commonly known beam projector onto a photocurable liquid resin.

그러나, 일정 픽셀수를 갖는 빔 프로젝터로부터 해당 픽셀수보다 더 큰 대면적(large scale)의 슬라이스 단면 층에 대한 3차원 입체물을 제조할 경우, 제조되는 입체물의 정밀도가 저하되는 문제가 있다.However, when a three-dimensional solid object is manufactured from a beam projector having a certain number of pixels for a slice cross-sectional layer having a larger size than that of the corresponding pixel number, there is a problem in that the precision of the produced stereoscopic object is deteriorated.

따라서, 제조되는 3차원 입체물의 크기를 고려하여 고픽셀수의 빔 프로젝터를 사용할 수도 있으나, 이 경우 3차원 프린터의 가격이 비싸지는 문제가 있다.Therefore, a beam projector having a high pixel count may be used in consideration of the size of the manufactured three-dimensional solid object, but in this case, the price of the three-dimensional printer is expensive.

한편, 한국등록특허 제10-1430582호(선행문헌 1)에는 3차원 프린터의 압출기를 멀티 공급기와 회전형 멀티 노즐로 구성하여 입체물의 제작시 안정성을 향상시키도록 이루어진 3차원 프린터 장치를 개시하고 있으나, 이러한 3차원 프린터 장치에는 대면적의 슬라이스 단면 층에 대해 3차원 입체물을 효과적으로 제조하기 위한 방법에 대한 내용이 개시되어 있지 않다.On the other hand, Korean Patent Registration No. 10-1430582 (prior document 1) discloses a three-dimensional printer device configured to improve the stability in the production of three-dimensional object by configuring the extruder of the three-dimensional printer with a multi-feeder and a rotary multi-nozzle However, such a three-dimensional printer apparatus does not disclose a method for effectively producing a three-dimensional solid object for a large-area slice cross-sectional layer.

이와 같이, 고픽셀수의 빔 프로젝터가 구비되지 않고도 대면적의 슬라이스 단면 층에 대해 정밀하게 3차원 입체물을 제조할 수 있는 3차원 프린팅 기술에 대해 다양한 연구개발이 필요하다.As such, various research and developments are required for a three-dimensional printing technology capable of precisely manufacturing a three-dimensional solid object for a large-area slice cross-sectional layer without providing a high pixel beam projector.

(특허문헌 1) 선행문헌 1 : 한국등록특허 제10-1430582호(2014.08.08)(Patent Document 1) Prior Document 1: Korean Patent Registration No. 10-1430582 (2014.08.08)

상기와 같은 문제점을 해결하기 위한 본 발명의 기술적 과제는, 대면적의 슬라이스 단면 층을 갖는 3차원 입체물의 제조가 가능하도록 이루어진 3차원 프린터 및 그의 작동방법을 제공하는 것이다.The technical problem of the present invention for solving the above problems is to provide a three-dimensional printer and a method of operating the three-dimensional three-dimensional object having a large cross-sectional slice layer.

상기 기술적 과제를 달성하기 위하여, 본 발명의 일실시예는 광을 조사하는 광 조사 모듈; 상기 광 조사 모듈의 상부에 구비되며, 광경화성 액상 수지를 수용하는 용기부; 상기 용기부 내에 수용된 상기 광경화성 액상 수지가 순차적으로 경화되도록 경화된 상기 광경화성 액상 수지를 상부로 이동시키는 조형대; 및 상기 광 조사 모듈을 길이 방향과 폭 방향으로 2차원의 평면상 이동을 제어하는 이송부;를 포함하는 3차원 프린터를 제공한다.In order to achieve the above technical problem, an embodiment of the present invention includes a light irradiation module for irradiating light; A container unit provided on the light irradiation module and accommodating the photocurable liquid resin; A mold for moving the photocurable liquid resin cured to sequentially cure the photocurable liquid resin contained in the container portion; It provides a three-dimensional printer comprising a; and the transfer unit for controlling the two-dimensional planar movement of the light irradiation module in the longitudinal and width directions.

본 발명의 일실시예에 있어서, 상기 광 조사 모듈은, 광원; 상기 광원으로부터 전달되는 광의 조사 면적을 조절하는 광 조절부; 및 상기 광원 및 광 조절부를 내부에 수용하는 하우징;을 포함할 수 있다.In one embodiment of the present invention, the light irradiation module, the light source; A light control unit controlling an irradiation area of light transmitted from the light source; And a housing accommodating the light source and the light control unit therein.

본 발명의 일실시예에 있어서, 상기 이송부는, 서로 이격된 상태로 한 쌍을 이루며, 상기 광 조사 모듈을 길이 방향으로 이동시키는 X축 이송부; 및 상기 X축 이송부에 안착 지지되며, 상기 광 조사 모듈을 폭 방향 이동으로 이동시키는 Y축 이송부;를 포함할 수 있다.In one embodiment of the present invention, the transfer unit, X-axis transfer unit to form a pair in a state spaced apart from each other, to move the light irradiation module in the longitudinal direction; And a Y-axis feeder which is seated and supported by the X-axis feeder and moves the light irradiation module in a widthwise movement.

본 발명의 일실시예에 있어서, 상기 X축 이송부는, 상기 광 조사 모듈을 길이 방향으로 안내하는 제1 가이드바; 상기 제1 가이드바의 일단부에 결합되며 상기 제1 가이드바를 회전시키는 제1 모터; 상기 제1 가이드바와 결합되며, 상기 제1 모터의 회전에 따라 이동되는 제1 플레이트; 상기 제1 가이드바의 타단부에 결합되는 제1 고정부; 및 상기 제1 모터와 제1 고정부를 지지하는 지지부;를 포함할 수 있다.In one embodiment of the present invention, the X-axis transfer unit, the first guide bar for guiding the light irradiation module in the longitudinal direction; A first motor coupled to one end of the first guide bar to rotate the first guide bar; A first plate coupled to the first guide bar and moved according to the rotation of the first motor; A first fixing part coupled to the other end of the first guide bar; And a support part supporting the first motor and the first fixing part.

본 발명의 일실시예에 있어서, 상기 Y축 이송부는, 상기 광 조사 모듈을 폭 방향으로 안내하는 제2 가이드바; 상기 제2 가이드바의 일단부에 결합되며 상기 제2 가이드바를 회전시키는 제2 모터; 상기 제2 가이드바와 결합되며, 상기 제2 모터의 회전에 따라 이동되는 제2 플레이트; 및 상기 제2 가이드바의 타단부에 결합되는 제2 고정부;를 포함하며, 상기 제2 플레이트에는 상기 광 조사 모듈이 안착 고정되고, 상기 제2 모터와 제2 고정부는 상기 제1 플레이트에 안착 고정될 수 있다.In one embodiment of the present invention, the Y-axis transfer unit, the second guide bar for guiding the light irradiation module in the width direction; A second motor coupled to one end of the second guide bar to rotate the second guide bar; A second plate coupled to the second guide bar and moved according to the rotation of the second motor; And a second fixing part coupled to the other end of the second guide bar, wherein the light irradiation module is seated and fixed to the second plate, and the second motor and the second fixing part are seated on the first plate. Can be fixed.

본 발명의 일실시예에 있어서, 상기 광 조절부는, 상기 광원으로 전달되는 광의 경로를 변화시키는 반사부; 및 상기 반사부로부터 전달되는 광의 조사 면적을 조절하는 렌즈;를 포함할 수 있다.In one embodiment of the present invention, the light control unit, the reflection unit for changing the path of the light transmitted to the light source; And a lens for adjusting an irradiation area of light transmitted from the reflector.

본 발명의 일실시예에 있어서, 상기 반사부는 디지털 마이크로미러 디바이스(DMD : Digital Micromirror Device)로 이루어질 수 있다.In one embodiment of the present invention, the reflector may be made of a digital micromirror device (DMD).

본 발명의 일실시예에 있어서, 상기 이송부는 제조되는 입체물의 슬라이스 단면 층이 대면적일 경우, 슬라이스 단면 층의 구획부별로 상기 광 조사 모듈을 이동시킬 수 있다.In one embodiment of the present invention, if the slice cross-sectional layer of the three-dimensional object to be manufactured is a large area, the transfer unit may move the light irradiation module for each section of the slice cross-sectional layer.

본 발명의 일실시예는 a) 광경화성 액상 수지로 광을 조사하는 단계; 및 b) 상기 광경화성 액상 수지로 조사된 광에 의해 순차적인 경화가 이루어지며, 경화된 상기 광경화성 액상 수지를 상부로 이동시키는 단계;를 포함하며, 제조되는 입체물이 대면적일 경우, 상기 광 조사 모듈은 슬라이스 단면 층의 구획부별로 이동되며 상기 광경화성 액상 수지를 경화시키는 것을 특징으로 하는 3차원 프린터의 작동방법을 제공한다.One embodiment of the present invention comprises the steps of a) irradiating light with a photocurable liquid resin; And b) sequential curing is performed by the light irradiated with the photocurable liquid resin, and moving the cured photocurable liquid resin to an upper portion. When the three-dimensional object manufactured is a large area, the light irradiation The module provides a method of operating a three-dimensional printer, which is moved by the partitions of the slice cross-sectional layer to cure the photocurable liquid resin.

상기에서 설명한 본 발명에 따른 3차원 프린터 및 그의 작동방법의 효과를 설명하면 다음과 같다.Referring to the effects of the three-dimensional printer and its operation method according to the present invention described above are as follows.

본 발명에 따르면, 광 조사 모듈은 이송부에 의해 길이 방향과 폭 방향으로 선택적인 이동이 가능하도록 이루어짐에 따라 광 조사 모듈로부터 광경화성 액상 수지를 경화시킬 수 있는 면적을 넓힐 수 있다. 즉, 평면상에서 이동 가능하도록 이루어진 광 조사 모듈은 종래의 고정된 형태의 광 조사 모듈보다 더 큰 형태의 입체물을 제조할 수 있다.According to the present invention, as the light irradiation module is made to be selectively moved in the longitudinal direction and the width direction by the transfer unit, the area capable of curing the photocurable liquid resin from the light irradiation module can be widened. That is, the light irradiation module configured to be movable on a plane may produce a three-dimensional object having a larger shape than a conventional fixed type light irradiation module.

다시 말해서, 경화를 통해 제조되는 입체물의 슬라이스 단면 층이 대면적일 경우에는 3차원 프린터는 대면적의 슬라이스 단면 층을 구획한 후, 구획된 구간별로 광 조사 모듈을 이동시킴으로써, 대면적의 3차원 입체물을 정밀하게 제조할 수 있다.In other words, when the slice cross-sectional layer of the three-dimensional object manufactured by curing has a large area, the three-dimensional printer partitions the slice cross-sectional layer of the large area, and then moves the light irradiation module for each divided section, thereby making the large-dimensional three-dimensional solid object Can be manufactured precisely.

본 발명의 효과는 상기한 효과로 한정되는 것은 아니며, 본 발명의 상세한 설명 또는 특허청구범위에 기재된 발명의 구성으로부터 추론가능한 모든 효과를 포함하는 것으로 이해되어야 한다.The effects of the present invention are not limited to the above-described effects, but should be understood to include all the effects deduced from the configuration of the invention described in the detailed description or claims of the present invention.

도 1은 본 발명의 일실시예에 따른 3차원 프린터의 개략적인 구성도이다.1 is a schematic configuration diagram of a three-dimensional printer according to an embodiment of the present invention.

도 2는 본 발명의 일실시예에 따른 이송부를 보여주는 개략적인 사시도이다.2 is a schematic perspective view showing a transfer unit according to an embodiment of the present invention.

도 3은 본 발명의 일실시예에 따른 광 조사 모듈의 예시도이다.3 is an exemplary view of a light irradiation module according to an embodiment of the present invention.

도 4는 본 발명의 일실시예에 따른 대면적의 슬라이스 단면 층에 대한 광 조사 모듈이 이동되는 과정을 보여주는 작동 상태도이다.4 is an operational state diagram showing a process of moving the light irradiation module for a large cross-sectional slice layer in accordance with an embodiment of the present invention.

이하에서는 첨부한 도면을 참조하여 본 발명을 설명하기로 한다. 그러나 본 발명은 여러 가지 상이한 형태로 구현될 수 있으며, 따라서 여기에서 설명하는 실시예로 한정되는 것은 아니다. 그리고 도면에서 본 발명을 명확하게 설명하기 위해서 설명과 관계없는 부분은 생략하였으며, 명세서 전체를 통하여 유사한 부분에 대해서는 유사한 도면 부호를 붙였다.Hereinafter, with reference to the accompanying drawings will be described the present invention. As those skilled in the art would realize, the described embodiments may be modified in various different ways, all without departing from the spirit or scope of the present invention. In the drawings, parts irrelevant to the description are omitted in order to clearly describe the present invention, and like reference numerals designate like parts throughout the specification.

명세서 전체에서, 어떤 부분이 다른 부분과 "연결"되어 있다고 할 때, 이는 "직접적으로 연결"되어 있는 경우뿐 아니라, 그 중간에 다른 부재를 사이에 두고 "간접적으로 연결"되어 있는 경우도 포함한다. 또한 어떤 부분이 어떤 구성요소를 "포함"한다고 할 때, 이는 특별히 반대되는 기재가 없는 한 다른 구성요소를 제외하는 것이 아니라 다른 구성요소를 더 구비할 수 있다는 것을 의미한다.Throughout the specification, when a part is "connected" to another part, it includes not only "directly connected" but also "indirectly connected" with another member in between. . In addition, when a part is said to "include" a certain component, this means that it may further include other components, without excluding the other components unless otherwise stated.

이하 첨부된 도면을 참고하여 본 발명의 실시예를 상세히 설명하기로 한다.Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

도 1은 본 발명의 일실시예에 따른 3차원 프린터의 개략적인 구성도이고, 도 2는 본 발명의 일실시예에 따른 이송부를 보여주는 개략적인 사시도이며, 도 3은 본 발명의 일실시예에 따른 광 조사 모듈의 예시도이고, 도 4는 본 발명의 일실시예에 따른 대면적의 슬라이스 단면 층에 대한 광 조사 모듈이 이동되는 과정을 보여주는 작동 상태도이다.1 is a schematic configuration diagram of a three-dimensional printer according to an embodiment of the present invention, Figure 2 is a schematic perspective view showing a transfer unit according to an embodiment of the present invention, Figure 3 is an embodiment of the present invention 4 is an exemplary view illustrating a light irradiation module, and FIG. 4 is an operation state diagram illustrating a process of moving a light irradiation module to a slice cross-sectional layer of a large area according to an embodiment of the present invention.

도 1 내지 도 4에서 보는 바와 같이, 3차원 프린터(1000)는 광 조사 모듈(100), 용기부(200), 조형대(300) 및 이송부(400)를 포함할 수 있다.As shown in FIGS. 1 to 4, the 3D printer 1000 may include a light irradiation module 100, a container part 200, a molding stand 300, and a transfer part 400.

광 조사 모듈(100)은 용기부(200) 내에 수용된 광경화성 액상 수지(1)로 광을 조사하는 구성으로, 이러한 광 조사 모듈(100)은 3차원 입체물의 단면 층으로 분할한 슬라이스 데이터에 대응하는 영역으로 광을 조사하여 광경화성 액상 수지(1)를 경화시킴으로써 3차원 입체물을 제조하게 된다.The light irradiation module 100 is configured to irradiate light with the photocurable liquid resin 1 contained in the container portion 200, and the light irradiation module 100 corresponds to slice data divided into cross-sectional layers of a three-dimensional solid object. The three-dimensional solid object is manufactured by irradiating light to a region to cure and curing the photocurable liquid resin 1.

이때, 광경화성 액상 수지(1)의 경화가 이루어지는 3차원 입체물의 단면 층의 두께는 대개 50㎛의 두께로 이루어지는 것이 바람직하나, 50㎛ 이외에 두께로 다양하게 제조될 수도 있음은 물론이다.At this time, it is preferable that the thickness of the cross-sectional layer of the three-dimensional solid material in which the photocurable liquid resin 1 is cured is usually made of a thickness of 50 μm, but may be variously manufactured in a thickness other than 50 μm.

이러한 광 조사 모듈(100)은 광원(110), 광 조절부(120) 및 하우징(130)을 포함할 수 있다.The light irradiation module 100 may include a light source 110, a light control unit 120, and a housing 130.

광원(110)은 경화가 이루어지는 광경화성 액상 수지(1)에 광을 제공하는 구성이다.The light source 110 is a structure which provides light to the photocurable liquid resin 1 in which hardening is performed.

여기서 광경화성 액상 수지(1)는 일정시간 이상으로 광에 노출될 시, 경화가 이루어지는 것으로, 용기부(200)에 수용된 광경화성 액상 수지(1)는 광원(110)으로부터 제공되는 광에 의해 순차적으로 경화가 이루어지며 3차원의 입체물로 제조될 수 있다.Here, the photocurable liquid resin 1 is cured when exposed to light for a predetermined time or more, and the photocurable liquid resin 1 accommodated in the container part 200 is sequentially formed by the light provided from the light source 110. Hardening can be made and can be produced in three-dimensional solids.

이러한 광원(110)에는 가시광선, 자외선(UV, Ultraviolet Ray), 전자빔(EB, Electron Beam) 등이 사용될 수 있다.As the light source 110, visible light, ultraviolet (UV), and electron beam (EB) may be used.

이때, 광원(110)은 광경화성 액상 수지(1)가 가시광선 영역에서 경화가 이루어지는 경우에는 가시광선을 사용하고, 자외선 영역에서 경화가 이루어지는 경우에는 자외선을 사용하는 등, 광원(110)은 광경화성 액상 수지(1)에 따라 선택적으로 사용될 수 있다. 이와 반대로, 광원(110)에 따라 광경화성 액상 수지(1)를 선택적으로 사용할 수 있음은 물론이다.In this case, the light source 110 uses visible light when the photocurable liquid resin 1 is cured in the visible light region, and uses ultraviolet light when curing is performed in the ultraviolet light region. It can be selectively used according to the chemical liquid resin (1). On the contrary, of course, the photocurable liquid resin 1 may be selectively used in accordance with the light source 110.

한편, 광 조절부(120)는 광원(110)으로부터 제공되는 광을 용기부(200)로 조사하도록 이루어진다. 이러한 광 조절부(120)는 반사부(121)와 렌즈(122)를 포함할 수 있다.On the other hand, the light control unit 120 is made to irradiate the light provided from the light source 110 to the container 200. The light adjuster 120 may include a reflector 121 and a lens 122.

반사부(121)는 광원(110)으로부터 제공되는 광의 경로를 변경하도록 이루어진다.The reflector 121 is configured to change the path of the light provided from the light source 110.

이와 같은, 반사부(121)는 디지털 마이크로미러 디바이스(DMD, Digital Micromirror Device) 칩셋으로 이루어질 수 있다. 즉, 반사부(121)는 아주 작은 모양의 거울을 반도체 위에 넣은 반사식 표시기일 수 있다.As such, the reflector 121 may be formed of a digital micromirror device (DMD) chipset. That is, the reflector 121 may be a reflective indicator in which a very small mirror is placed on the semiconductor.

이러한 DMD 칩셋을 갖는 반사부(121)는 각 거울마다 독립적인 회동이 가능하도록 이루어져 광원(110)으로부터 제공되는 광의 경로를 다양하게 변화시킬 수 있다. 즉, 반사부(121)는 각 픽셀의 점멸 또는 선택적인 제어를 통해 광원(110)으로 제공된 광의 경로를 다양하게 변화시킬 수 있다.The reflector 121 having the DMD chipset may rotate independently of each mirror to vary the path of the light provided from the light source 110. That is, the reflector 121 may vary the path of the light provided to the light source 110 through the blinking or selective control of each pixel.

여기서 반사부(121)는 반드시 DMD 칩셋으로 한정되지 않으며, 광원(110)으로부터 제공되는 광의 경로를 변경할 수 있는 다양한 구성이 될 수 있음은 물론이다.Here, the reflector 121 is not necessarily limited to the DMD chipset, and may be various configurations capable of changing the path of the light provided from the light source 110.

렌즈(122)는 반사부(121)로부터 전달된 광의 조사 면적을 조절하도록 이루어진다.The lens 122 is configured to adjust the irradiation area of the light transmitted from the reflector 121.

이러한 렌즈(122)는 반사부(121)로부터 전달되는 광을 굴절시켜 광의 조사 면적을 조절하게 된다. 이때, 렌즈(122)와 반사부(121)는 상호 간격 조절을 통해 광의 조사 면적을 선택적으로 조절할 수도 있다.The lens 122 refracts the light transmitted from the reflector 121 to adjust the irradiation area of the light. In this case, the lens 122 and the reflector 121 may selectively adjust the irradiation area of the light through the mutual distance control.

여기서 렌즈(122)와 반사부(121)가 상호 간격 조절을 통해 광의 조사 면적을 조절할 경우, 렌즈(122)와 반사부(121)는 개별적인 이동을 통해 간격 조절이 이루어질 수도 있고, 렌즈(122) 또는 반사부(121) 중 어느 하나의 구성만 선택적으로 이동되며 렌즈(122)와 반사부(121) 간의 간격 조절이 이루어질 수도 있다.Here, when the lens 122 and the reflector 121 adjust the irradiation area of the light through the mutual distance control, the lens 122 and the reflector 121 may be adjusted by the individual movement, the lens 122 Alternatively, only one configuration of the reflector 121 may be selectively moved, and the distance between the lens 122 and the reflector 121 may be adjusted.

하우징(130)은 광 조사 모듈(100)의 외형을 이루며, 내부에는 광원(110) 및 광 조절부(120)를 수용하게 된다. 이러한 하우징(130)은 외부로부터 광원(110) 및 광 조절부(120)를 보호하도록 이루어진다.The housing 130 forms an external shape of the light irradiation module 100, and accommodates the light source 110 and the light control unit 120 therein. The housing 130 is made to protect the light source 110 and the light control unit 120 from the outside.

한편, 조형대(300)는 조형 플레이트(310)와 Z축 이송부(320)를 포함할 수 있다.On the other hand, the mold 300 may include a molding plate 310 and the Z-axis transfer unit (320).

이러한 조형대(300)는 Z축 이송부(320)를 이용하여 조형 플레이트(310)를 3차원 입체물의 상부측 방향 즉, 높이 방향으로 순차적으로 이동시킴으로써, 경화되지 않은 광경화성 액상 수지(1)가 용기부(200)의 최하면으로 이동되어 위치되도록 한다.The mold 300 is a container that is not cured by the uncured photocurable liquid resin (1) by sequentially moving the molding plate 310 in the upper side, that is, the height direction using the Z-axis transfer unit 320 The lowermost part of the part 200 is moved to be positioned.

따라서, 조형 플레이트(310)에는 광경화성 액상 수지(1)가 슬라이스 단면 층마다 순차적으로 경화되며 3차원 입체물이 제조될 수 있다.Therefore, the photocurable liquid resin 1 is sequentially cured for each slice cross-sectional layer in the molding plate 310, and a three-dimensional solid object can be produced.

이때, 광 조사 모듈(100)은 길이 방향과 폭 방향의 2차원의 평면상 이동이 가능하도록 이루어져 입체물의 슬라이스 단면 층이 대면적일 경우에도 3차원 입체물의 제조가 가능하다.At this time, the light irradiation module 100 is made to be able to move in the two-dimensional plane in the longitudinal direction and the width direction is possible to manufacture a three-dimensional solid object even if the slice cross-sectional layer of the three-dimensional object.

예로, 종래의 일정 픽셀수를 갖는 DMD 칩셋을 구비한 광 조사 모듈(100)을 고정시킨 상태에서 광의 조사 면적만을 넓혀 3차원 입체물을 제조하는 경우에는 제조되는 입체물의 정밀도 떨어지는 문제가 있었으나, 본 발명에서는 광 조사 모듈(100)을 길이 방향과 폭 방향으로 이동시킴으로써, 고해상도의 광을 광경화성 액상 수지(1)에 조사함으로써 슬라이스 단면 층이 대면적일 경우라 정밀도가 높은 3차원 입체물을 제조할 수 있다.For example, when manufacturing a three-dimensional solid object by expanding only the irradiation area of light in a state where the conventional light irradiation module 100 having the DMD chipset having a predetermined number of pixels is fixed, there is a problem that the precision of the three-dimensional object to be manufactured is deteriorated. In this case, by moving the light irradiation module 100 in the longitudinal direction and the width direction, the high-resolution light is irradiated to the photocurable liquid resin 1 so that a highly accurate three-dimensional solid object can be produced when the slice cross-sectional layer has a large area. .

도 2는 볼 스크류(ball screw) 방식을 적용한 이송부(400)의 일실시예로, 도 2를 참조하면, 이송부(400)는 X축 이송부(410)와 Y축 이송부(420)를 포함할 수 있다. 2 is an embodiment of a transfer unit 400 applying a ball screw method, referring to FIG. 2, the transfer unit 400 may include an X-axis transfer unit 410 and a Y-axis transfer unit 420. have.

여기서 X축 이송부(410)는 광 조사 모듈(100)을 길이 방향으로 선택적으로 이동시키기 위한 구성이고, Y축 이송부(420)는 광 조사 모듈(100)을 폭 방향으로 선택적으로 이동시키기 위한 구성이다.Here, the X-axis transfer unit 410 is a configuration for selectively moving the light irradiation module 100 in the longitudinal direction, the Y-axis transfer unit 420 is a configuration for selectively moving the light irradiation module 100 in the width direction. .

X축 이송부(410)는 제1 가이드바(411), 제1 모터(412), 제1 플레이트(413), 제1 고정부(414) 및 지지부(415)를 포함할 수 있다.The X-axis transfer part 410 may include a first guide bar 411, a first motor 412, a first plate 413, a first fixing part 414, and a support part 415.

제1 가이드바(411)는 광 조사 모듈(100)을 길이 방향으로 안내하도록 이루어진다. 즉, 광 조사 모듈(100)은 제1 가이드바(411)를 따라 길이 방향으로 선택적으로 이동될 수 있다.The first guide bar 411 is configured to guide the light irradiation module 100 in the longitudinal direction. That is, the light irradiation module 100 may be selectively moved in the longitudinal direction along the first guide bar 411.

이러한 제1 가이드바(411)에는 볼이 안내되는 나사산 형태의 볼 삽입홈이 형성된다. 즉, 제1 플레이트(413)는 제1 가이드바(411)와 다수개의 볼이 접촉된 상태로 결합되어 제1 가이드바(411)의 회전에 따라 제1 플레이트(413)는 제1 가이드바(411)의 길이 방향을 따라 선택적으로 이동될 수 있다.The first guide bar 411 is formed with a threaded ball insertion groove guides the ball. That is, the first plate 413 is coupled in a state in which the first guide bar 411 and the plurality of balls are in contact with each other, so that the first plate 413 is connected to the first guide bar in accordance with the rotation of the first guide bar 411. 411 may be selectively moved along the length direction.

여기서 한 쌍을 이루는 제1 플레이트(413)는 제2 모터(422)와 제2 고정부(424)를 각각 지지 고정하도록 이루어진다.Here, the pair of first plates 413 are configured to support and fix the second motor 422 and the second fixing part 424, respectively.

제1 모터(412)는 제1 가이드바(411)의 일단부에 결합되며 제1 가이드바(411)를 선택적으로 회전시키게 된다. 예로, 제1 모터(412)가 정방향으로 회전이 이루어질 경우에는 제1 모터(412)측으로 광 조사 모듈(100)을 이동시키고, 이와 반대로 제1 모터(412)가 역방향으로 회전이 이루어질 경우에는 제1 고정부(414)측으로 광 조사 모듈(100)을 이동시킬 수도 있다.The first motor 412 is coupled to one end of the first guide bar 411 and selectively rotates the first guide bar 411. For example, when the first motor 412 rotates in the forward direction, the light irradiation module 100 is moved to the first motor 412 side. On the contrary, when the first motor 412 rotates in the reverse direction, the first motor 412 rotates in the reverse direction. 1 The light irradiation module 100 may be moved to the fixing part 414 side.

이와 같이, 제1 모터(412)의 회전 방향에 따라 광 조사 모듈(100)은 제1 가이드바(411)를 따라 선택적으로 이동될 수 있다.As such, the light irradiation module 100 may be selectively moved along the first guide bar 411 according to the rotation direction of the first motor 412.

제1 고정부(414)는 제1 가이드바(411)의 타단부에 구비되며, 제1 가이드바(411)를 안정적으로 지지하도록 이루어진다. 이러한 제1 고정부(414)는 베어링이 될 수도 있다.The first fixing part 414 is provided at the other end of the first guide bar 411 and is configured to stably support the first guide bar 411. The first fixing part 414 may be a bearing.

지지부(415)는 제1 모터(412)와 제1 고정부(414)를 지지하도록 이루어진다. 이러한 지지부(415)는 예로, 3차원 프린터(1000)의 외형을 이루는 케이싱(미도시)의 내측면에 고정 설치될 수도 있다.The support 415 is configured to support the first motor 412 and the first fixing part 414. For example, the support part 415 may be fixedly installed on an inner surface of a casing (not shown) forming an external shape of the 3D printer 1000.

이와 같은, X축 이송부(410)는 이격된 상태로 한 쌍을 이루며, Y축 이송부(420)를 지지하도록 이루어진다.As such, the X-axis transfer unit 410 forms a pair in a spaced state, and is made to support the Y-axis transfer unit 420.

한편, Y축 이송부(420)는 제2 가이드바(421), 제2 모터(422), 제2 플레이트(423), 제2 고정부(424)를 포함할 수 있다.The Y-axis feeder 420 may include a second guide bar 421, a second motor 422, a second plate 423, and a second fixing part 424.

제2 가이드바(421)는 광 조사 모듈(100)을 폭 방향으로 안내하도록 이루어진다. 즉, 광 조사 모듈(100)은 제2 가이드바(421)를 따라 폭 방향으로 선택적으로 이동될 수 있다.The second guide bar 421 is configured to guide the light irradiation module 100 in the width direction. That is, the light irradiation module 100 may be selectively moved in the width direction along the second guide bar 421.

이러한 제2 가이드바(421)에는 볼이 안내되는 나사산 형태의 볼 삽입홈이 형성된다. 즉, 제2 플레이트(423)는 제2 가이드바(421)와 다수개의 볼이 접촉된 상태로 결합되어 제2 가이드바(421)의 회전에 따라 제2 플레이트(423)는 제2 가이드바(421)의 폭 방향을 따라 선택적으로 이동될 수 있다.The second guide bar 421 is formed with a threaded ball insertion groove is guided ball. That is, the second plate 423 is coupled in a state in which the second guide bar 421 and the plurality of balls are in contact with each other, so that the second plate 423 may be the second guide bar according to the rotation of the second guide bar 421. It may be selectively moved along the width direction of the 421.

이러한 제2 플레이트(423)에는 광 조사 모듈(100)이 안착 고정되도록 이루어진다.The light irradiation module 100 is fixed to the second plate 423 to be seated and fixed.

제2 모터(422)는 제2 가이드바(421)의 일단부에 결합되며 제2 가이드바(421)를 선택적으로 회전시키게 된다. 예로, 제2 모터(422)가 정방향으로 회전이 이루어질 경우에는 제2 모터(422)측으로 광 조사 모듈(100)을 이동시키고, 이와 반대로 제2 모터(422)가 역방향으로 회전이 이루어질 경우에는 제2 고정부(424)측으로 광 조사 모듈(100)을 이동시킬 수 있다.The second motor 422 is coupled to one end of the second guide bar 421 and selectively rotates the second guide bar 421. For example, when the second motor 422 is rotated in the forward direction, the light irradiation module 100 is moved to the second motor 422 side. On the contrary, when the second motor 422 is rotated in the reverse direction, the second motor 422 is rotated in the reverse direction. The light irradiation module 100 may be moved to the 2 fixing part 424 side.

이와 같이, 제2 모터(422)의 회전 방향에 따라 광 조사 모듈(100)은 제2 가이드바(421)를 따라 선택적으로 이동될 수 있다.As such, the light irradiation module 100 may be selectively moved along the second guide bar 421 according to the rotation direction of the second motor 422.

제2 고정부(424)는 제2 가이드바(421)의 타단부에 구비되며, 제2 가이드바(421)를 안정적으로 지지하도록 이루어진다. 이러한 제2 고정부(424)는 베어링이 될 수도 있다.The second fixing part 424 is provided at the other end of the second guide bar 421 and is configured to stably support the second guide bar 421. This second fixing part 424 may be a bearing.

여기서 제2 모터(422)와 제2 고정부(424)는 각각의 제1 플레이트(413)에 안착 지지 고정되도록 이루어진다. 따라서, 이송부(400)는 광 조사 모듈(100)을 2차원의 평면상에서 길이 방향과 폭 방향으로 선택적으로 이동시킬 수 있다. 이에 따라, 광 조사 모듈(100)로부터 조사되는 슬라이스 단면 층이 대면적일 경우라도, 이송부(400)는 광 조사 모듈(100)을 평면상에서 선택적으로 이동시킴으로써 정밀도가 높은 3차원 입체물을 제조할 수 있다.Here, the second motor 422 and the second fixing part 424 may be seated and fixed to each of the first plates 413. Therefore, the transfer unit 400 may selectively move the light irradiation module 100 in the longitudinal direction and the width direction on a two-dimensional plane. Accordingly, even when the slice cross-sectional layer irradiated from the light irradiation module 100 has a large area, the transfer part 400 may manufacture the three-dimensional solid object with high precision by selectively moving the light irradiation module 100 on a plane. .

도 4를 참조하면, 이송부(400)는 제조되는 3차원 입체물의 슬라이스 단면 층이 대면적일 경우, 슬라이스 단면 층의 구획부별로 광 조사 모듈(100)을 이동시키도록 이루어진다. 즉, 이송부(400)에 의해 슬라이스 단면 층의 구획부별로 이동된 광 조사 모듈(100)은 광경화성 액상 수지(1)로 광을 조사하여 구획부별로 광경화성 액상 수지(1)의 경화를 진행시키게 된다.Referring to FIG. 4, the transfer unit 400 is configured to move the light irradiation module 100 for each partition of the slice cross-sectional layer when the slice cross-sectional layer of the three-dimensional solid object to be manufactured has a large area. That is, the light irradiation module 100 moved by the transfer unit 400 for each division of the slice cross-sectional layer irradiates light with the photocurable liquid resin 1 to proceed to cure the photocurable liquid resin 1 for each division. Let's go.

도 4의 (a)는 이송부(400)가 4개로 구획된 슬라이스 단면 층에 대해 제1구획부(510)로부터 제4구획부(540)까지 이동됨에 있어, 지그재그로 광 조사 모듈(100)을 이동시킨 경우이고, 도 4의 (b)는 이송부(400)가 4개로 구획된 슬라이스 단면 층에 대해 반시계 방향으로 이동된 경우이다.4 (a) shows the light irradiation module 100 in a zigzag as the transfer unit 400 is moved from the first compartment 510 to the fourth compartment 540 with respect to the slice section layer divided into four. 4B illustrates a case in which the transfer part 400 is moved counterclockwise with respect to the slice cross-sectional layer divided into four parts.

이와 같이, 이송부(400)는 광 조사 모듈(100)을 슬라이스 단면 층의 구획부별로 이동시키며 대면적의 슬라이스 단면 층을 경화시킬 수 있다.As such, the transfer unit 400 may move the light irradiation module 100 for each partition of the slice cross-sectional layer and harden the slice cross-sectional layer of a large area.

도 4의 (a)에서 보여지는 도면을 기준으로, 광 조사 모듈(100)이 제1구획부(510)에 광을 조사한 후, 제2구획부(520)를 조사하는 과정에서 경화가 진행중인 제1구획부(510)의 우측 경계면과 제2구획부(520)의 좌측 경계면은 견고한 접합이 이루어진다.Based on the drawing shown in FIG. 4A, after the light irradiation module 100 irradiates light to the first compartment 510, curing is in progress in the process of irradiating the second compartment 520. The right boundary of the first compartment 510 and the left boundary of the second compartment 520 are firmly bonded.

다음으로, 광 조사 모듈(100)이 제3구획부(530)에 광을 조사하는 과정에서 경화가 마무리되지 않은 제1구획부(510)의 하측 경계면과 제3구획부(530)의 상측 경계면은 견고한 접합이 이루어질 수 있다.Next, the lower boundary surface of the first compartment 510 and the upper boundary surface of the third compartment 530 that are not cured in the process of irradiating light to the third compartment 530 by the light irradiation module 100. Silver bonding can be achieved.

다음으로, 광 조사 모듈(100)이 제4구획부(540)에 광을 조사하는 과정에서 제4구획부(540)의 상측 경계면과 좌측 경계면은 경화가 마무리되지 않은 제2구획부(520)의 하측 경계면과 제3구획부(530)의 우측 경계면과 견고히 결합될 수 있다.Next, in the process of irradiating light to the fourth compartment 540 by the light irradiation module 100, the upper boundary surface and the left boundary surface of the fourth compartment 540 are not cured, and the second compartment 520 is not finished. The lower boundary surface and the right boundary surface of the third compartment 530 may be firmly coupled.

이와 같이, 대면적의 슬라이스 단면 층을 4개의 구획부로 구획하여 광경화성 액상 수지(1)를 경화시킬 경우에는, 광 조사 모듈(100)을 지그재그로 이동시키며 광경화성 액상 수지(1)를 경화시키는 것이 바람직하다. 즉, 경화가 이루어지는 제1구획부(510)로부터 제4구획부(540)의 각 경계면 간의 결합이 견고히 이루어질 수 있다.As described above, when the large-area slice cross-sectional layer is partitioned into four compartments to cure the photocurable liquid resin 1, the light irradiation module 100 is moved in a zigzag to cure the photocurable liquid resin 1. It is preferable. That is, the coupling between the boundary surfaces of the fourth compartment 540 from the first compartment 510 where curing is performed may be securely performed.

여기서, 광 조사 모듈(100)의 이동 경로는 반드시 지그재그 형태로만 이동되지 않고, 다양한 이동 경로를 가질 수 있음은 물론이다.Here, the movement path of the light irradiation module 100 does not necessarily move only in a zigzag form, but may have various movement paths.

또한, 대면적의 슬라이스 단면 층에 대해 구획되는 구획부의 개수도 반드시 4개로 한정되지 않으며, 대면적의 크기 및 광 조사 모듈(100)의 해상도 등에 따라 다양하게 설정될 수 있음은 물론이다.In addition, the number of partitions partitioned with respect to the large-area slice cross-sectional layer is not necessarily limited to four, but may be variously set according to the size of the large area and the resolution of the light irradiation module 100.

이러한 3차원 프린터(1000)의 작동방법을 살펴보면, 먼저 광 조사 모듈(100)은 광경화성 액상 수지(1)로 광을 조사하게 된다. 이때, 광 조사 모듈(100)은 광의 조사 면적 및 경로 등을 선택적으로 조절하여 광경화성 액상 수지(1)로 광을 조사하게 된다.Looking at the operation of the three-dimensional printer 1000, first, the light irradiation module 100 is irradiated with light to the photocurable liquid resin (1). In this case, the light irradiation module 100 selectively irradiates light to the photocurable liquid resin 1 by selectively adjusting the irradiation area and the path of the light.

이러한 광 조사 모듈(100)은 3차원 입체물의 단면 층으로 분할한 슬라이스 데이터에 대응하는 영역으로 광을 조사하여 광경화성 액상 수지(1)를 경화시킴으로써 3차원 입체물을 제조하게 된다.The light irradiation module 100 irradiates light to a region corresponding to slice data divided into a cross-sectional layer of a three-dimensional solid object to cure the photocurable liquid resin 1 to produce a three-dimensional solid object.

이때, 광 조사 모듈(100)은 슬라이스 단면 층이 대면적인 경우에는, 구획부별로 이동되며 대면적의 슬라이스 단면 층을 경화시키게 된다.At this time, when the slice cross-sectional layer is a large area, the light irradiation module 100 is moved by partitions to cure the slice cross-sectional layer of a large area.

다음으로, 조형대(300)는 광 조사 모듈(100)로부터 순차적으로 경화된 광경화성 액상 수지(1)를 상부로 이동시키며 3차원 입체물을 제조하게 된다.Next, the mold 300 moves the photocurable liquid resin 1 sequentially cured from the light irradiation module 100 to the upper part to manufacture a three-dimensional solid object.

다만, 이는 본 발명의 바람직한 일실시예에 불과할 뿐, 본 발명의 권리 범위가 이러한 실시예의 기재 범위에 의하여 제한되는 것은 아니다.However, this is only a preferred embodiment of the present invention, the scope of the present invention is not limited by the scope of these embodiments.

전술한 본 발명의 설명은 예시를 위한 것이며, 본 발명이 속하는 기술분야의 통상의 지식을 가진 자는 본 발명의 기술적 사상이나 필수적인 특징을 변경하지 않고서 다른 구체적인 형태로 쉽게 변형이 가능하다는 것을 이해할 수 있을 것이다. 그러므로 이상에서 기술한 실시예들은 모든 면에서 예시적인 것이며 한정적이 아닌 것으로 이해해야만 한다. 예를 들어, 단일형으로 설명되어 있는 각 구성 요소는 분산되어 실시될 수도 있으며, 마찬가지로 분산된 것으로 설명되어 있는 구성 요소들도 결합된 형태로 실시될 수 있다.The foregoing description of the present invention is intended for illustration, and it will be understood by those skilled in the art that the present invention may be easily modified in other specific forms without changing the technical spirit or essential features of the present invention. will be. Therefore, it should be understood that the embodiments described above are exemplary in all respects and not restrictive. For example, each component described as a single type may be implemented in a distributed manner, and similarly, components described as distributed may be implemented in a combined form.

본 발명의 범위는 후술하는 특허청구범위에 의하여 나타내어지며, 특허청구범위의 의미 및 범위 그리고 그 균등 개념으로부터 도출되는 모든 변경 또는 변형된 형태가 본 발명의 범위에 포함되는 것으로 해석되어야 한다.The scope of the present invention is represented by the following claims, and it should be construed that all changes or modifications derived from the meaning and scope of the claims and their equivalents are included in the scope of the present invention.

부호의 설명Explanation of the sign

1: 광경화성 액상 수지 100: 광 조사 모듈1: photocurable liquid resin 100: light irradiation module

110: 광원 120: 광 조절부110: light source 120: light control unit

121: 반사부 122: 렌즈121: reflector 122: lens

130: 하우징 200: 용기부130: housing 200: container part

300: 조형대 310: 조형 플레이트300: molding table 310: molding plate

320: Z축 이송부 400: 이송부320: Z axis transfer unit 400: transfer unit

410: X축 이송부 411: 제1 가이드바410: X axis transfer unit 411: first guide bar

412: 제1 모터 413: 제1 플레이트412: first motor 413: first plate

414: 제1 고정부 415: 지지부414: first fixing portion 415: support portion

420: Y축 이송부 421: 제2 가이드바420: Y-axis feed section 421: second guide bar

422: 제2 모터 423: 제2 플레이트422: second motor 423: second plate

424: 제2 고정부 510: 제1구획부424: second fixing part 510: first compartment

520: 제2구획부 530: 제3구획부520: second compartment 530: third compartment

540: 제4구획부 1000: 3차원 프린터540: fourth compartment 1000: three-dimensional printer

Claims (9)

광을 조사하는 광 조사 모듈;A light irradiation module for irradiating light; 상기 광 조사 모듈의 상부에 구비되며, 광경화성 액상 수지를 수용하는 용기부;A container unit provided on the light irradiation module and accommodating the photocurable liquid resin; 상기 용기부 내에 수용된 상기 광경화성 액상 수지가 순차적으로 경화되도록 경화된 상기 광경화성 액상 수지를 상부로 이동시키는 조형대; 및A mold for moving the photocurable liquid resin cured to sequentially cure the photocurable liquid resin contained in the container portion; And 상기 광 조사 모듈을 길이 방향과 폭 방향으로 2차원의 평면상 이동을 제어하는 이송부;를 포함하는 3차원 프린터.And a transfer unit which controls the light irradiation module to move in two planes in a length direction and a width direction. 제1항에 있어서,The method of claim 1, 상기 광 조사 모듈은,The light irradiation module, 광원;Light source; 상기 광원으로부터 전달되는 광의 조사 면적을 조절하는 광 조절부; 및A light control unit controlling an irradiation area of light transmitted from the light source; And 상기 광원 및 광 조절부를 내부에 수용하는 하우징;을 포함하는 것을 특징으로 하는 3차원 프린터.And a housing accommodating the light source and the light control unit therein. 제1항에 있어서,The method of claim 1, 상기 이송부는,The transfer unit, 서로 이격된 상태로 한 쌍을 이루며, 상기 광 조사 모듈을 길이 방향으로 이동시키는 X축 이송부; 및An X-axis transfer unit forming a pair in a state spaced apart from each other and moving the light irradiation module in a longitudinal direction; And 상기 X축 이송부에 안착 지지되며, 상기 광 조사 모듈을 폭 방향 이동으로 이동시키는 Y축 이송부;를 포함하는 것을 특징으로 하는 3차원 프린터.And a Y-axis feeder which is seated and supported by the X-axis feeder and moves the light irradiation module to move in the width direction. 제3항에 있어서,The method of claim 3, 상기 X축 이송부는,The X-axis transfer unit, 상기 광 조사 모듈을 길이 방향으로 안내하는 제1 가이드바;A first guide bar guiding the light irradiation module in a longitudinal direction; 상기 제1 가이드바의 일단부에 결합되며 상기 제1 가이드바를 회전시키는 제1 모터;A first motor coupled to one end of the first guide bar to rotate the first guide bar; 상기 제1 가이드바와 결합되며, 상기 제1 모터의 회전에 따라 이동되는 제1 플레이트;A first plate coupled to the first guide bar and moved according to the rotation of the first motor; 상기 제1 가이드바의 타단부에 결합되는 제1 고정부; 및A first fixing part coupled to the other end of the first guide bar; And 상기 제1 모터와 제1 고정부를 지지하는 지지부;를 포함하는 것을 특징으로 하는 3차원 프린터.And a support for supporting the first motor and the first fixing part. 제4항에 있어서,The method of claim 4, wherein 상기 Y축 이송부는,The Y-axis transfer unit, 상기 광 조사 모듈을 폭 방향으로 안내하는 제2 가이드바;A second guide bar guiding the light irradiation module in a width direction; 상기 제2 가이드바의 일단부에 결합되며 상기 제2 가이드바를 회전시키는 제2 모터;A second motor coupled to one end of the second guide bar to rotate the second guide bar; 상기 제2 가이드바와 결합되며, 상기 제2 모터의 회전에 따라 이동되는 제2 플레이트; 및A second plate coupled to the second guide bar and moved according to the rotation of the second motor; And 상기 제2 가이드바의 타단부에 결합되는 제2 고정부;를 포함하며,And a second fixing part coupled to the other end of the second guide bar. 상기 제2 플레이트에는 상기 광 조사 모듈이 안착 고정되고, 상기 제2 모터와 제2 고정부는 상기 제1 플레이트에 안착 고정되는 것을 특징을 하는 3차원 프린터.The light irradiation module is seated and fixed to the second plate, and the second motor and the second fixing part is three-dimensional printer, characterized in that seated and fixed to the first plate. 제2항에 있어서,The method of claim 2, 상기 광 조절부는,The light control unit, 상기 광원으로 전달되는 광의 경로를 변화시키는 반사부; 및A reflector for changing a path of light transmitted to the light source; And 상기 반사부로부터 전달되는 광의 조사 면적을 조절하는 렌즈;를 포함하는 것을 특징을 하는 3차원 프린터.3D printer comprising a; lens for adjusting the irradiation area of the light transmitted from the reflecting portion. 제6항에 있어서,The method of claim 6, 상기 반사부는 디지털 마이크로미러 디바이스(DMD : Digital Micromirror Device)인 것을 특징으로 하는 3차원 프린터.The reflector is a three-dimensional printer, characterized in that a digital micromirror device (DMD). 제1항에 있어서,The method of claim 1, 상기 이송부는 제조되는 입체물의 슬라이스 단면 층이 대면적일 경우, 슬라이스 단면 층의 구획부별로 상기 광 조사 모듈을 이동시키는 것을 특징으로 하는 3차원 프린터.And the transfer unit moves the light irradiation module for each partition portion of the slice cross-sectional layer when the slice cross-sectional layer of the three-dimensional object to be manufactured has a large area. a) 광경화성 액상 수지로 광을 조사하는 단계; 및a) irradiating light with the photocurable liquid resin; And b) 상기 광경화성 액상 수지로 조사된 광에 의해 순차적인 경화가 이루어지며, 경화된 상기 광경화성 액상 수지를 상부로 이동시키는 단계;를 포함하며,b) sequential curing is performed by the light irradiated with the photocurable liquid resin, and moving the cured photocurable liquid resin to the top; 제조되는 입체물이 대면적일 경우, 상기 광 조사 모듈은 슬라이스 단면 층의 구획부별로 이동되며 상기 광경화성 액상 수지를 경화시키는 것을 특징으로 하는 3차원 프린터의 작동방법.When the three-dimensional object to be manufactured is a large area, the light irradiation module is moved by each section of the slice cross-sectional layer and operating method of the three-dimensional printer, characterized in that to cure the photocurable liquid resin.
PCT/KR2016/002076 2015-06-09 2016-03-02 Three-dimensional printer and operation method therefor Ceased WO2016200015A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020150081513A KR20160144837A (en) 2015-06-09 2015-06-09 Three dimensional printer and method for operating the same
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US20210221060A1 (en) * 2017-11-24 2021-07-22 Wonkwang E&Tech Co., Ltd. 3d printer
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