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WO2016117342A1 - Dispositif de refroidissement et dispositif électronique dans lequel ce dernier est installé - Google Patents

Dispositif de refroidissement et dispositif électronique dans lequel ce dernier est installé Download PDF

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Publication number
WO2016117342A1
WO2016117342A1 PCT/JP2016/000298 JP2016000298W WO2016117342A1 WO 2016117342 A1 WO2016117342 A1 WO 2016117342A1 JP 2016000298 W JP2016000298 W JP 2016000298W WO 2016117342 A1 WO2016117342 A1 WO 2016117342A1
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WO
WIPO (PCT)
Prior art keywords
heat receiving
heat
cooling device
refrigerant
internal path
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2016/000298
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English (en)
Japanese (ja)
Inventor
杉山　誠
辰乙 郁
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Intellectual Property Management Co Ltd
Original Assignee
Panasonic Intellectual Property Management Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2015013845A external-priority patent/JP2016138706A/ja
Priority claimed from JP2015146703A external-priority patent/JP2016138740A/ja
Application filed by Panasonic Intellectual Property Management Co Ltd filed Critical Panasonic Intellectual Property Management Co Ltd
Publication of WO2016117342A1 publication Critical patent/WO2016117342A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F9/00—Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
    • F28F9/22—Arrangements for directing heat-exchange media into successive compartments, e.g. arrangements of guide plates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H10W40/73—

Definitions

  • the present invention relates to a cooling device for an electronic device in which electronic components such as a central processing unit (CPU), a large scale integrated circuit (LSI), an insulated gate bipolar transistor (IGBT), and a diode are mounted, and an electronic device in which the electronic device is mounted. It is.
  • CPU central processing unit
  • LSI large scale integrated circuit
  • IGBT insulated gate bipolar transistor
  • this type of cooling device has the following configuration.
  • the conduit portion 130 of the casing 112 is adjacent to the evaporator portion 132 where the refrigerant boils due to the heat of the inverter 108 that is a heating element, and the evaporator portion 132 in the conduit portion 130.
  • a circulation part 134 through which the refrigerant circulates directly from the inlet 114 toward the outlet 116.
  • the evaporator part 132 is provided with a plurality of fins 140 that protrude from the bottom wall part 120 toward the circulation part 134, and the refrigerant flows through the gaps between the plurality of fins 140 (for example, Patent Document 1).
  • the inverter 108 which is a heating element is installed horizontally, the bottom wall portion 120 of the housing 112 is filled with the liquid phase refrigerant, and is directed from the bottom wall portion 120 toward the circulation portion 134.
  • the refrigerant flows through the gaps between the protruding plurality of fins 140.
  • the heat of the heating element is cooled by the latent heat of vaporization when the liquid-phase refrigerant evaporates, so it is necessary to spread the liquid-phase refrigerant over the entire surface of the fin 140. is there.
  • most of the refrigerant (gas phase refrigerant) evaporated on the surface of the fin 140 passes through the circulation part 134, and the liquid phase refrigerant is formed on the surface of the fin 140 located far from the inlet 114 by the flow of the gas phase refrigerant. The action of supplying is reduced.
  • the surface of the fin 140 is covered with a thick liquid phase refrigerant layer.
  • the thick liquid phase refrigerant layer becomes a thermal resistance, and an ideal state in which the thin liquid phase refrigerant layer covers the fin 140 can be created. Therefore, the cooling performance is lowered.
  • the pressure near the outlet 116 is low due to the action of a radiator (not shown).
  • the liquid-phase refrigerant that has flowed into the housing 112 (heat receiving portion) from the inflow port 114 receives the heat generated from the inverter 108, becomes a two-phase refrigerant of a gas phase and a liquid phase, and is in a high pressure state. This is because the volume expands when the refrigerant changes from the liquid phase to the gas phase.
  • the two-phase refrigerant having a high pressure flows into the outlet 116 having a low pressure.
  • the flow of the gas-phase refrigerant generated when the liquid-phase refrigerant changes to the gas phase involves the liquid-phase refrigerant located in the vicinity of the liquid-phase refrigerant and the liquid-phase refrigerant located downstream of the flow.
  • the liquid-phase refrigerant is supplied to the fin 140 surface on the outlet 116 side located downstream of the refrigerant flow.
  • the refrigerant flow passes through a path having a small flow resistance, the refrigerant flow in the housing 112 is unevenly distributed, and in the gap between the fins 140, the refrigerant is more likely to flow in the gap located at the center portion, and is located at the end.
  • the fin 140 located in the region where the refrigerant does not easily flow is in a so-called dry-out state in which the refrigerant is not supplied and cannot be cooled, and the temperature of the inverter 108 increases. Further, in order to suppress dryout, an excessive amount of liquid phase refrigerant is required, and as a result, a thick liquid phase refrigerant layer becomes a thermal resistance, and an ideal state in which the thin liquid phase refrigerant layer covers the fin 140 is created. Cannot be performed and cooling performance is lowered.
  • the present invention prevents the local dryout in the heat receiving part by supplying the liquid refrigerant uniformly to a region far from the side surface where the outlet is formed, and there is no need to fill the heat receiving part with an excessive amount of liquid phase refrigerant.
  • a cooling device with high cooling performance capable of forming a thin liquid phase refrigerant layer in a heat receiving part is provided.
  • the heat receiving part in the cooling device that cools by the phase change of the refrigerant, the heat receiving part, the heat radiating path, the heat radiating part, and the return path are sequentially connected to form a refrigerant circulation path.
  • the heat receiving part has a rectangular parallelepiped shape with a maximum front and rear surface, a heat receiving plate in which a heating element is installed on at least one of the front and rear surfaces, a heat dissipation internal path provided in the upper part of the heat receiving part, and a lower part of the heat receiving part. And a return internal path.
  • the heat receiving part includes a fin portion provided between the heat dissipation internal path and the return internal path, an outlet connecting the heat dissipation path and the heat dissipation internal path, and an inlet connecting the return path and the return internal path.
  • the fin portion is provided with a plurality of flat fins projecting inward from the heat receiving plate so that the refrigerant flow path constituted by the gaps between the fins communicates the return internal path and the heat dissipation internal path, and returns
  • the internal path includes a partition plate between the inflow port and the fin portion.
  • the present invention uniformly supplies liquid phase refrigerant to a region far from the side surface where the inflow port is formed, thereby preventing local dryout in the heat receiving part and receiving heat with an excessive amount of liquid phase refrigerant. It is not necessary to fill the inside of the unit, and a thin liquid phase refrigerant layer can be formed in the heat receiving unit, so that a cooling device with high cooling performance can be provided.
  • the partition plate provided between the return internal path and the fin portion blocks the flow of the liquid refrigerant flowing into the return internal path from the inlet to the fin portion. Therefore, a part of the liquid-phase refrigerant flows out to the fin portion after reaching the end of the partition plate on the side far from the side surface where the inlet is formed.
  • the refrigerant vaporized in the vicinity of the inflow port rises in the vicinity of the side surface where the inflow port is formed and flows into the outflow port, so-called shortcut state. Hard to become.
  • the flow where the refrigerant rises to the fin portion is blocked by the partition plate to the side far from the side where the inlet is formed, that is, the region near the other side opposite to the side where the inlet is formed. After reaching the end of the plate, it will flow out into the fins.
  • the refrigerant that has flowed out to the fin portion receives heat from the fin, becomes a two-phase refrigerant of a gas phase and a liquid phase, and flows into an outlet having a low pressure.
  • the heat receiving part in the cooling device that cools by the phase change of the refrigerant, the heat receiving part, the heat radiating path, the heat radiating part, and the return path are sequentially connected to form a refrigerant circulation path.
  • the heat receiving part has a rectangular parallelepiped shape with a maximum front and rear surface, a heat receiving plate in which a heating element is installed on at least one of the front and rear surfaces, a heat dissipation internal path provided in the upper part of the heat receiving part, and a lower part of the heat receiving part. And a return internal path.
  • the heat receiving part includes a fin portion provided between the heat dissipation internal path and the return internal path, an outlet connecting the heat dissipation path and the heat dissipation internal path, and an inlet connecting the return path and the return internal path.
  • the fin portion is provided with a plurality of flat fins projecting inward from the heat receiving plate so that the refrigerant flow path constituted by the gaps between the fins communicates the return internal path and the heat dissipation internal path, and returns
  • the internal path includes a pipe line that is open at both ends connected to the inflow port.
  • the present invention uniformly supplies liquid phase refrigerant to a region far from the side surface where the inflow port is formed, thereby preventing local dryout in the heat receiving part and receiving heat with an excessive amount of liquid phase refrigerant. It is not necessary to fill the inside of the unit, and a thin liquid phase refrigerant layer can be formed in the heat receiving unit, so that a cooling device with high cooling performance can be provided.
  • the flow of the liquid phase refrigerant flowing into the return internal path from the flow inlet to the fin portion is blocked by the pipe line open at both ends connected to the flow inlet provided in the return internal path. Therefore, a part of the liquid-phase refrigerant flows out to the fin portion after reaching the end of the pipeline on the side far from the side surface where the inlet is formed.
  • the refrigerant vaporized in the vicinity of the inflow port rises in the vicinity of the side surface where the outflow port is formed and flows into the outflow port in a so-called shortcut state. Hard to become.
  • the flow where the refrigerant rises to the fin portion is blocked by the pipe line to the side far from the side where the inlet is formed, that is, the region near the other side opposite to the side where the inlet is formed. After reaching the end of the road, it will flow out to the fins.
  • the refrigerant that has flowed out to the fin portion receives heat from the fin, becomes a two-phase refrigerant of a gas phase and a liquid phase, and flows into an outlet having a low pressure.
  • FIG. 1 is a schematic diagram of an electronic apparatus equipped with a cooling device according to a first embodiment of the present invention.
  • FIG. 2 is a diagram showing the appearance of the heat receiving portion of the cooling device according to the first embodiment of the present invention.
  • FIG. 3 is an exploded perspective view of the heat receiving portion of the cooling device according to the first embodiment of the present invention.
  • FIG. 4 is an exploded perspective view of the heat receiving portion of the cooling device according to the first embodiment of the present invention.
  • FIG. 5 is a view showing a 5-5 cross section of FIG. 6A is a cross-sectional view taken along the line 6A-6A in FIG.
  • FIG. 6B is an enlarged view of region 6B of FIG. 6A.
  • FIG. 7 is an exploded perspective view of the heat receiving portion of the cooling device according to the second embodiment of the present invention.
  • FIG. 8 is an exploded perspective view of the heat receiving portion of the cooling device according to the second embodiment of the present invention.
  • FIG. 9 is a view showing a cross section of the heat receiving portion of the cooling device according to the second embodiment of the present invention.
  • FIG. 10 is a diagram showing the appearance of the heat receiving portion of the cooling device according to the third embodiment of the present invention.
  • FIG. 11 is an exploded perspective view of the heat receiving portion of the cooling device according to the third embodiment of the present invention.
  • FIG. 12 is an exploded perspective view of the heat receiving portion of the cooling device according to the third embodiment of the present invention.
  • FIG. 13 is a view showing a 13-13 cross section of FIG.
  • FIG. 14A is a cross-sectional view taken along the line 14A-14A of FIG.
  • FIG. 14B is an enlarged view of region 14B of FIG. 14A.
  • FIG. 15 is an exploded perspective view of the heat receiving portion of the cooling device according to the fourth embodiment of the present invention.
  • FIG. 16 is an exploded perspective view of the heat receiving portion of the cooling device according to the fourth embodiment of the present invention.
  • FIG. 17 is a diagram showing a cross section of the heat receiving portion of the cooling device according to the fourth embodiment of the present invention.
  • FIG. 18 is an exploded perspective view of the heat receiving portion of the cooling device according to the fifth embodiment of the present invention.
  • FIG. 19 is an exploded perspective view of the heat receiving portion of the cooling device according to the sixth embodiment of the present invention.
  • FIG. 20 is a schematic view showing a conventional cooling device.
  • FIG. 1 is a schematic view of an electronic apparatus equipped with the cooling device according to the first embodiment of the present invention.
  • the electronic device 50 is provided with a first heating element 28, a second heating element 29, and a cooling device 1, which are power semiconductor elements, in a case 51.
  • the cooling device 1 includes a heat receiving part 3 for cooling the first heat generating element 28 and the second heat generating element 29 and a heat radiating part 4.
  • the heat receiving part 3 and the heat radiating part 4 are constituted by the heat radiating path 5 and the feedback path 6. Are connected. With this configuration, the inside of the cooling device 1 becomes a sealed space, and although not shown in FIG. 1, the inside of the cooling device 1 is sealed after the refrigerant is depressurized.
  • the refrigerant chlorofluorocarbons, fluorinated solvents and the like are used, but are not limited thereto.
  • Aluminum is suitable for the material of the heat receiving part 3, the heat radiating part 4, and the first fin 22 and the second fin 23, which will be described later, but is not limited thereto.
  • the return path 6 includes a backflow prevention unit 8 that prevents backflow of the refrigerant.
  • the backflow prevention unit 8 has a valve structure for preventing backflow
  • the return path 6 is a pipe that is thinner than the heat dissipation path 5, and the return path 6 itself serves as the backflow prevention unit 8. It may be. Furthermore, if it is designed so that the gas-phase refrigerant does not flow backward from the heat receiving section 3 to the return path 6 during stable operation, the same effect and action are obtained.
  • the cooling device 1 also includes a cooling fan 7 for cooling the heat transported to the heat radiating section 4 by the refrigerant.
  • a cooling fan 7 for cooling the heat transported to the heat radiating section 4 by the refrigerant.
  • the air cooling system using the cooling fan 7 is used, but a water cooling system or other systems may be used.
  • the cooling device 1 is one in which the inside is decompressed and then a refrigerant is enclosed, and the inside of the cooling device 1 becomes the saturation pressure of the refrigerant according to the external temperature due to the action of the refrigerant.
  • the heat of the first heating element 28 and the second heating element 29 is transferred to the refrigerant through the heat receiving portion 3, and the refrigerant changes from the liquid phase to the gas phase, so that the first heating element 28 and the second heating element 29 are changed.
  • the refrigerant vaporized in the heat receiving unit 3 becomes a gas-liquid two-phase mixed flow with an unboiling liquid phase refrigerant, moves from the heat receiving unit 3 to the heat radiating unit 4 through the heat radiating path 5, and is a cooling fan. 7 is cooled again and liquefied again to become a liquid-phase refrigerant, and returns to the heat receiving unit 3 through the return path 6 and the backflow prevention unit 8.
  • the backflow prevention unit 8 is provided in the return path 6 and has a greater flow resistance of the refrigerant than the heat dissipation path 5, the refrigerant vaporized in the heat receiving unit 3 is returned to the return path 6. To prevent backflow. Therefore, the refrigerant is vaporized in the heat receiving part 3, the vaporized refrigerant passes through the heat radiation path 5 and is liquefied in the heat radiation part 4, and the liquefied refrigerant passes through the return path 6 and is supplied again into the heat receiving part 3.
  • the first heating element 28 and the second heating element 29 are cooled by repeating the cycle.
  • FIG. 2 is a diagram illustrating an appearance of the heat receiving unit 3 of the cooling device 1 according to the present embodiment.
  • 3 and 4 are exploded perspective views of the heat receiving portion 3 of the cooling device 1 according to the present embodiment.
  • FIG. 5 is a diagram showing a cross section of the heat receiving unit 3 of the cooling device 1 according to the present embodiment, taken along line 5-5 in FIG.
  • the heat receiving portion 3 has a rectangular parallelepiped shape with the front and rear surfaces having a maximum area. Further, as shown in the figure, the heat receiving portion 3 is installed so that the front surface and the rear surface are in the vertical direction. A heat receiving plate 15 on which the first heating element 28 is installed is provided on the front surface, and a heat receiving plate 16 on which the second heating element 29 is installed on the rear surface.
  • the heat receiving plate 15 provided with the first heat generating element 28 is provided on the front surface of the heat receiving unit 3, and the heat receiving plate 16 provided with the second heat generating element 29 is provided on the rear surface of the heat receiving unit 3. Further, a heat receiving plate in which a heating element is installed on either the front surface or the rear surface of the heat receiving unit 3 may be provided.
  • the first heating element 28 is in contact with the heat receiving plate 15 and thermally connected
  • the second heating element 29 is in contact with the heat receiving plate 16 and thermally connected.
  • the heat receiving plates 15 and 16 are appropriately provided with fixing screw holes 19 for fixing the first heating element 28 and the second heating element 29, and the first heating element 28 is fixed to the heat receiving plate 15 with screws.
  • the second heating element 29 is fixed to the heat receiving plate 16 with screws.
  • the heat receiving unit 3 is installed in the vertical direction so as to be sandwiched between the first heating element 28 and the second heating element 29.
  • a space is provided as a heat dissipation internal path 24 in the upper part of the heat receiving part 3 having a rectangular parallelepiped shape, and a space for providing a return internal path 25 is provided in the lower part of the heat receiving part 3. Furthermore, the center part between the heat radiation internal path 24 and the return internal path 25 of the heat receiving part 3 is defined as the fin part 2.
  • an outlet 20 that connects the heat dissipation path 5 and the heat dissipation internal path 24 and an inlet 21 that connects the return path 6 and the return internal path 25 are formed.
  • the outlet 20 and the inlet 21 are provided on the same side surface of the heat receiving unit 3.
  • the side surface on which the outflow port 20 and the inflow port 21 are provided is a side surface that connects the front surface and the rear surface on which the heat receiving plates 15 and 16 are provided.
  • a plurality of flat fins 22 projecting from the heat receiving plate 15 to the inside of the heat receiving unit 3 are arranged in parallel, and a plurality of flat fins 23 protruding from the heat receiving plate 16 to the inside of the heat receiving unit 3 are arranged in parallel.
  • the fins 22 and the fins 23 are arranged so that the refrigerant flow path between the fins is in the vertical direction. That is, it arrange
  • a partition plate 30 is provided between the return internal path 25 and the fin portion 2 in parallel with the bottom surface of the heat receiving portion 3.
  • the partition plate 30 protrudes from the side surface of the heat receiving part 3 in which the inlet 21 and the outlet 20 are installed, and extends toward the other side facing the side. In the present embodiment, it extends from the intermediate point between the side surface of the heat receiving part 3 where the partition plate 30 is installed and the other side surface facing this side surface to a position far from the side surface where the inlet 21 and the outlet 20 are installed. Has been.
  • the liquid-phase refrigerant that has flowed out of the inlet 21 into the return internal path 25 is provided with the inlet 21 by the partition plate 30 provided between the inlet 21 and the fin portion 2 in the return internal path 25.
  • the partition plate 30 protrudes from the side surface on which the inflow port 21 and the outflow port 20 are formed, and is farther from the side surface on which the inflow port 21 and the outflow port 20 are formed than an intermediate point between this side surface and the other side surface facing this side surface. It extends to the position.
  • the refrigerant flows out to the return internal path 25 after reaching the open end of the partition plate 30 on the side far from the side surface on which the inflow port 21 and the outflow port 20 are formed, and then flows out to the fin portion 2.
  • all of the liquid-phase refrigerant flowing out from the return path 6 into the heat receiving unit 3 flows into the heat receiving unit 3 from the side surface where the inlet 21 and the outlet 20 are formed. It is difficult for the liquid-phase refrigerant to be supplied to the other side surface opposite to.
  • the fin portion located on the other side surface facing this side surface It becomes easy to generate a so-called shortcut state in which the liquid-phase refrigerant cannot be supplied at 2.
  • the return internal path 25 close to the side far from the side where the inlet 21 and the outlet 20 are formed, that is, the other side opposite to the side where the inlet 21 and the outlet 20 are formed. Is supplied with a liquid-phase refrigerant.
  • the liquid-phase refrigerant that has flowed out to the return internal path 25 is partially vaporized by the heat of the first heating element 28 and the second heating element 29, and is diffused into the return internal path 25.
  • the liquid-phase refrigerant that has diffused into the return internal path 25 only receives heat from the fin 22 and the fin 23 in the entire area of the fin portion 2 by the two-phase refrigerant that has flowed out into the fin portion 2.
  • Sufficient liquid phase refrigerant is supplied, and finally flows into the outlet 20 having a low pressure. Further, since the pressure on the side surface where the inflow port 21 and the outflow port 20 are formed is low due to the action of the heat radiating portion 4 (see FIG.
  • the cooling device 1 with high cooling performance can be provided as in the present embodiment.
  • the partition plate 30 is provided so as to be in contact with the side surface of the heat receiving unit 3 provided with the outlet 20 and the inlet 21 and the front and rear surfaces of the heat receiving unit 3. This is to prevent the refrigerant from flowing out from the gap between the partition plate 30 and these wall surfaces.
  • the partition plate 30 may be configured to have a plurality of openings 31.
  • the partition plate 30 provided between the inlet 21 and the fin portion 2 in the return internal path 25 forms the side far from the side surface on which the inlet 21 and the outlet 20 are formed, that is, the inlet 21 and the outlet 20.
  • the liquid-phase refrigerant is supplied to the return internal path 25 close to the other side surface facing the side surface. A part of the liquid-phase refrigerant that has flowed out into the return internal path 25 is vaporized by the heat of the first heat generating element 28 and the second heat generating element 29, and is diffused into the return internal path 25 by its diffusion action.
  • the liquid-phase refrigerant diffused in the return internal path 25 is sufficient to receive heat from the fins 22 and 23 throughout the fin portion 2 for the two-phase refrigerant of the gas phase and the liquid phase flowing out to the fin portion 2.
  • the liquid refrigerant is supplied, and the heat-received refrigerant finally flows into the outlet 20 having a low pressure.
  • the fin portion 2 is located in a region far from the side surface where the inflow port 21 and the outflow port 20 are formed. Since the refrigerant that has flowed out easily flows to the side surface on which the inlet 21 and the outlet 20 are formed, the refrigerant is supplied to the entire fin portion 2.
  • the intervals at which the plurality of openings 31 are provided may be shortened as the distance from the side surface on which the inflow port 21 and the outflow port 20 are formed. Since the pressure on the side surface on which the inflow port 21 and the outflow port 20 are formed is low due to the action of the heat radiating portion 4 following the outflow port 20, the refrigerant flows to the outflow port 20 closer to the side surface on which the inflow port 21 and the outflow port 20 are formed. It becomes easy, and it becomes difficult for a refrigerant
  • the area close to the side surface on which the inflow port 21 and the outflow port 20 are formed has fewer openings 31. And the flow of the refrigerant
  • the area of the plurality of openings 31 may be configured to increase as the distance from the side surface on which the inflow port 21 and the outflow port 20 are formed. Since the pressure on the side surface on which the inflow port 21 and the outflow port 20 are formed is low due to the action of the heat radiating portion 4 following the outflow port 20, the refrigerant flows to the outflow port 20 closer to the side surface on which the inflow port 21 and the outflow port 20 are formed. It becomes easy, and it becomes difficult for a refrigerant
  • the area near the side surface on which the inlet 21 and the outlet 20 are formed decreases the area of the opening 31.
  • coolant which flows out into the fin part 2 is suppressed.
  • region far from the side surface in which the inflow port 21 and the outflow port 20 were formed enlarges the area of the opening part 31, and promotes the flow of the refrigerant
  • the diameter of the outlet 20 may be larger than the diameter of the inlet 21.
  • a liquid-phase refrigerant flows through the inflow port 21, and a liquid-phase and gas-phase refrigerant flows through the outflow port 20, but the liquid-phase refrigerant that has flowed into the heat receiving unit 3 from the inflow port 21.
  • the refrigerant receives heat from the fins 22 or 23 and changes from a liquid phase to a gas phase refrigerant, the volume of the refrigerant expands. Therefore, by increasing the diameter of the outlet 20 and the subsequent heat dissipation path 5, the pressure loss can be reduced and the two-phase refrigerant can easily flow into the outlet 20 and the subsequent heat dissipation path 5. As a result, the flow resistance when the refrigerant circulates is reduced, and the cooling performance of the cooling device 1 can be improved.
  • FIG. 6A is a cross-sectional view of the heat receiving portion of the cooling device in the present embodiment, and is a cross-sectional view of 6A-6A in FIG.
  • FIG. 6B is an enlarged view of the heat receiving portion of the cooling device in the present embodiment, and is an enlarged view of region 6B in FIG. 6A.
  • the fins 22 are adjacent to each other.
  • the fins of the fins 23 may be arranged so as to protrude in the gaps of the fins leaving a slight gap around the fins. That is, the fin 23 is inserted into the gap between the fins adjacent to the fin 22 until the tip of the fin leaves a slight gap from the surface of the heat receiving plate 15. A slight gap is left between both surfaces of the fins 23 and the fins 22 of the fins 22.
  • the gap between the fins of the fin 22 is slightly larger than the thickness of the fin 23 and the short side of the fin is slightly smaller than the distance between the heat receiving plate 15 and the heat receiving plate 16. This slight gap becomes a refrigerant flow path.
  • the fins 23 are arranged so as to protrude in the gaps between the fins 23 and the adjacent fins, leaving a slight gap around the fins 22. That is, the fins of the fins 22 are inserted into the gaps between the fins adjacent to the fins 23 until the tips of the fins leave a slight gap from the surface of the heat receiving plate 16. A slight gap is left between both surfaces of the fins 22 and the fins 23 of the fins 23.
  • the gap between the fins of the fin 23 is slightly larger than the thickness of the fin 22 and the short side of the fin is slightly smaller than the distance between the heat receiving plate 15 and the heat receiving plate 16. This slight gap becomes a refrigerant flow path.
  • the gap between the fins that is, the flow path cross-sectional area of the refrigerant can be reduced.
  • Fins are made by extruding or cutting an aluminum material.
  • the distance between the fins is limited to some extent due to the strength of the extrusion mold (for example, if the fin height is about 10 mm, the fin interval is about 4 mm). I have to open it.
  • the cutting process it is possible to reduce the fin interval to about 1 mm.
  • the heat receiving plate 15 provided with the fins 22 and the heat receiving plate 16 provided with the fins 23 face each other with the fins 22 and 23 facing each other, and the other fin is inserted into the gap between the fins, leaving a slight gap between the fins.
  • the gap between the fins 22 and the fins 23 that are engaged with each other becomes smaller than the gap between the fins of the fin 22 and the gap between the fins of the fin 23.
  • the gap between the fin 22 and the fin 23 serves as a refrigerant flow path.
  • the flow rate of the refrigerant flowing through the flow path is increased as compared with the case where the flow path cross-sectional area is large. Since the refrigerant circulates from below to above, this upward force is applied to the circulating liquid-phase refrigerant, so that the liquid-phase refrigerant is unlikely to fall downward. Further, the cooling device 1 of the present embodiment keeps the entire surfaces of the fins 22 and the fins 23 wet with the liquid-phase refrigerant, the liquid-phase refrigerant flows at a higher speed, and the thickness of the liquid-phase refrigerant is reduced. Can be thinned.
  • the cooling device 1 with high cooling performance can be provided by the action of latent heat of vaporization.
  • the heat receiving part 3 has a flat rectangular parallelepiped shape with the largest front and rear surfaces, and the front and rear surfaces are installed in the vertical direction.
  • the material of the parts of these heat receiving parts 3 is aluminum.
  • the side surface of the heat receiving part 3 is composed of two surfaces connecting the front surface, the rear surface, and the front surface and the rear surface.
  • the front surface and the rear surface are a heat receiving plate 15 having a contact surface 9 on the outer surface and a heat receiving plate 16 having a contact surface 10 on the outer surface, and two surfaces connecting the front surface and the rear surface to either the heat receiving plate 15 or the heat receiving plate 16;
  • the top surface and the bottom surface are integrally molded.
  • the heat receiving plate 16 is formed by integrally cutting the two surfaces connecting the front surface and the rear surface, the top surface, and the bottom surface. Then, a circular opening is formed as an outflow port 20 in the upper part of one of the two surfaces connecting the front surface and the rear surface, and as an inflow port 21 in the lower part. The diameter of the outlet 20 is larger than the diameter of the inlet 21.
  • the heat receiving plate 15 is formed with a plurality of plate-like fins 22 arranged in parallel with one surface, and the contact surface 9 is integrally provided on the other surface.
  • the heat receiving plate 15 is formed by extruding aluminum and then cutting.
  • the fin 22 is provided from the upper end to the lower end of the heat receiving plate 15 only by extrusion molding, and there is no space for the heat dissipation internal path 24 and the return internal path 25. This is because it is extrusion molding, so that the shape is continuously the same from upstream to downstream and the fins 22 cannot be provided only at the center.
  • the upper and lower portions of the heat receiving plate 15 are provided in order to provide a space to be the heat dissipation internal path 24 in the upper part of the heat receiving plate 15 and to provide a space to be the return internal path 25 in the lower part.
  • the fin 22 is cut. The depth of cutting is further deepened from the base of the fin 22 while leaving the thickness of the contact surface 9 serving as the outline.
  • the heat receiving plate 16 is formed by cutting a rectangular parallelepiped aluminum having a maximum area on the front and rear surfaces.
  • the heat receiving plate 16 has a plurality of plate-like fins 23 and a partition plate 30 arranged in parallel on one surface, leaving two surfaces connecting the front surface and the rear surface, a top surface, and a bottom surface, and a contact surface 10 on the other surface. Is provided by cutting.
  • a circular opening is cut and provided as an inflow port 20 at the upper part of one of the surfaces connecting the main surfaces provided in the heat receiving plate 16 and as an inflow port 21 at the lower part of the same surface.
  • a plurality of fixing screw holes 19 are also cut and provided in the upper and lower portions of the heat receiving plate 15 and the heat receiving plate 16, respectively.
  • the heat receiving plate 15 and the heat receiving plate 16 are opposed so that the fins of the fins 22 and the fins 23 are engaged, and the heat receiving plate 15 and the heat receiving plate 16 are joined by brazing.
  • the piping of the heat dissipation path 5 is brazed to the outlet 20 of the heat receiving plate 16 via the heat dissipation path connecting member 11, and the piping of the return path 6 is connected to the inlet 21 via the return path connecting member 12. Join with brazing.
  • said manufacturing method is an example and is not restricted to this.
  • FIG. 7 and 8 are exploded perspective views of the heat receiving portion 3 of the cooling device 1 according to the second embodiment of the present invention.
  • FIG. 9 is a diagram showing a cross section of the heat receiving portion 3 of the cooling device 1 in the present embodiment.
  • the return internal path 25 is provided with a pipe line 32 connected to the inlet 21 and having both ends opened.
  • the pipe line 32 extends from the intermediate point between the side surface on which the inflow port 21 and the outflow port 20 are formed and the other side surface facing the side surface to a side far from the side surface on which the inflow port 21 and the outflow port 20 are formed. You may make it the structure which has. Thereby, by supplying the refrigerant to a region far from the side surface where the inlet 21 and the outlet 20 are formed, local dryout in the heat receiving unit 3 is prevented, and the heat receiving unit 3 is filled with an excessive amount of liquid phase refrigerant. There is no need, and a thin liquid-phase refrigerant layer can be formed in the heat receiving part 3, and the cooling device 1 with high cooling performance can be provided.
  • the return internal path 25 includes the pipe line 32 that is connected to the inlet 21 and is open at both ends, the liquid refrigerant of the return path 6 passes through the pipe line 32 from the inlet 21. , Flows out into the return internal path 25.
  • the pipe 32 protrudes from the side surface on which the inflow port 21 and the outflow port 20 are formed, and extends to a position far from the side surface on which the inflow port 21 and the outflow port 20 are formed from an intermediate point between the side surface and the other side surface facing the side surface. Has been.
  • the refrigerant flows out to the return internal path 25 after reaching the open end of the pipe line 32 on the side far from the side surface on which the inflow port 21 and the outflow port 20 are formed, and then flows out to the fin portion 2.
  • all of the liquid-phase refrigerant flowing out from the return path 6 into the heat receiving unit 3 flows into the heat receiving unit 3 from the side surface on which the inlet 21 and the outlet 20 are formed. It is difficult for the liquid-phase refrigerant to be supplied to the other side surface opposite to.
  • the fin portion located on the other side surface facing this side surface The so-called dry-out state in which the liquid phase refrigerant cannot be supplied in 2 is likely to occur.
  • the return internal path 25 close to the side far from the side where the inlet 21 and the outlet 20 are formed, that is, the other side opposite to the side where the inlet 21 and the outlet 20 are formed. Is supplied with a liquid-phase refrigerant.
  • the liquid-phase refrigerant that has flowed out to the return internal path 25 is partially vaporized by the heat of the first heating element 28 and the second heating element 29, and is diffused into the return internal path 25.
  • the liquid-phase refrigerant that has diffused into the return internal path 25 only receives heat from the fin 22 and the fin 23 in the entire area of the fin portion 2 by the two-phase refrigerant that has flowed out into the fin portion 2.
  • Sufficient liquid phase refrigerant is supplied, and finally flows into the outlet 20 having a low pressure. Further, since the pressure on the side surface where the inflow port 21 and the outflow port 20 are formed is low due to the action of the heat radiating portion 4 (see FIG.
  • the refrigerant that has flowed into the heat receiving portion 3 from the inlet port 21 flows into the inlet 21 and the flow path through the pipe line 32.
  • the refrigerant is supplied to a region far from the side surface where the outlet 20 is installed. Therefore, the cooling device 1 with high cooling performance can be provided as in the present embodiment.
  • the pipe line 32 may be configured to have a plurality of openings 33.
  • the pipe line 32 provided in the return internal path 25 it is close to the side far from the side where the inlet 21 and the outlet 20 are formed, that is, the other side opposite to the side where the inlet 21 and the outlet 20 are formed.
  • Liquid phase refrigerant is supplied to the return internal path 25.
  • a part of the liquid-phase refrigerant that has flowed out into the return internal path 25 is vaporized by the heat of the first heat generating element 28 and the second heat generating element 29, and is diffused into the return internal path 25 by its diffusion action.
  • the liquid-phase refrigerant diffused in the return internal path 25 is sufficient to receive heat from the fins 22 and 23 throughout the fin portion 2 for the two-phase refrigerant of the gas phase and the liquid phase flowing out to the fin portion 2.
  • the liquid refrigerant is supplied, and the heat-received refrigerant finally flows into the outlet 20 having a low pressure.
  • the fin portion 2 is located in a region far from the side surface where the inflow port 21 and the outflow port 20 are formed. Since the refrigerant that has flowed out easily flows to the side surface on which the inlet 21 and the outlet 20 are formed, the refrigerant is supplied to the entire fin portion 2.
  • the schematic configuration of the cooling device in the present embodiment is the same as that of the cooling device 1 in the first embodiment shown in FIG. 1, and in the following description, the same configuration as that of the cooling device 1 in the first embodiment is used. Elements are denoted by the same reference numerals and description thereof is omitted.
  • FIG. 10 is a diagram illustrating an appearance of the heat receiving unit 3 of the cooling device 1 according to the present embodiment.
  • 11 and 12 are exploded perspective views of the heat receiving portion 3 of the cooling device 1 of the present embodiment.
  • FIG. 13 is a cross-sectional view of the heat receiving section 3 of the cooling device 1 of the present embodiment, and is a cross-sectional view taken along line 13-13 of FIG.
  • the heat receiving portion 3 has a rectangular parallelepiped shape with the front and rear surfaces having the maximum area.
  • the heat receiving unit 3 is installed so that the front surface and the rear surface are in the vertical direction.
  • a heat receiving plate 15 on which the first heating element 28 is installed is provided on the front surface, and a heat receiving plate 16 on which the second heating element 29 is installed on the rear surface.
  • the heat receiving plate 15 provided with the first heat generating element 28 is provided on the front surface of the heat receiving unit 3, and the heat receiving plate 16 provided with the second heat generating element 29 is provided on the rear surface of the heat receiving unit 3. Further, a heat receiving plate in which a heating element is installed on either the front surface or the rear surface of the heat receiving unit 3 may be provided.
  • the first heating element 28 is in contact with the heat receiving plate 15 and thermally connected
  • the second heating element 29 is in contact with the heat receiving plate 16 and thermally connected.
  • the heat receiving plate 15 and the heat receiving plate 16 are appropriately provided with fixing screw holes 19 for fixing the first heating element 28 and the second heating element 29, and the first heating element 28 is fixed to the heat receiving plate 15 with screws.
  • the second heating element 29 is fixed to the heat receiving plate 16 with screws.
  • the heat receiving unit 3 is installed in the vertical direction so as to be sandwiched between the first heating element 28 and the second heating element 29.
  • a space is provided as a heat dissipation internal path 24 in the upper part of the heat receiving part 3 having a rectangular parallelepiped shape, and a space for providing a return internal path 25 is provided in the lower part of the heat receiving part 3. Furthermore, the center part between the heat radiation internal path 24 and the return internal path 25 of the heat receiving part 3 is defined as the fin part 2.
  • an outlet 20 that connects the heat dissipation path 5 and the heat dissipation internal path 24 and an inlet 21 that connects the return path 6 and the return internal path 25 are formed.
  • the inflow port 21 is formed in one side surface of the heat receiving part 3, and the outflow port 20 is provided in the other side surface facing this side surface.
  • the side surface on which the outflow port 20 is provided and the side surface on which the inflow port 21 is provided are two opposing side surfaces that connect the front surface and the rear surface on which the heat receiving plates 15 and 16 are provided.
  • a plurality of flat fins 22 projecting from the heat receiving plate 15 to the inside of the heat receiving unit 3 are arranged in parallel, and a plurality of flat fins 23 protruding from the heat receiving plate 16 to the inside of the heat receiving unit 3 are arranged in parallel.
  • the fins 22 and the fins 23 are arranged so that the refrigerant flow path between the fins is in the vertical direction. That is, it arrange
  • a partition plate 30 is provided between the inlet 21 and the fin portion 2 and is arranged substantially parallel to the bottom surface of the heat receiving portion 3.
  • the partition plate 30 has at least one opening 31.
  • the thin liquid phase refrigerant layer can be formed in the heat receiving portion 3 and the cooling device 1 with high cooling performance can be provided.
  • the partition plate 30 provided between the inflow port 21 and the fin portion 2 blocks the flow of the liquid refrigerant flowing into the return internal path 25 from the inflow port 21 directly to the fin portion 2. Since the partition plate 30 has at least one opening 31, the liquid refrigerant flowing into the return internal path 25 from the inlet 21 flows out from the opening 31 to the fin portion 2. Since the opening 31 is configured to supply the liquid-phase refrigerant substantially uniformly into the space between the partition plate 30 and the fin portion 2, the liquid-phase refrigerant that has flowed out to the return internal path 25 is opened. It will be supplied to the whole fin part 2 from 31.
  • the liquid-phase refrigerant that has flowed into the return internal path 25 from the inlet 21 is partially vaporized by the heat of the first heating element 28 and the second heating element 29, The diffusion action diffuses into the return internal path 25.
  • excess liquid phase refrigerant is supplied in the fin portion 2 region in the vicinity of the side surface where the inflow port is formed.
  • the further away from the side surface on which the inflow port 21 is formed the smaller the supply amount of the liquid-phase refrigerant, and the more likely the so-called local dryout state occurs.
  • the liquid phase refrigerant that has flowed out from the inlet 21 to the return internal path 25 is allowed to flow into the fin portion near the inlet by the partition plate 30 provided between the inlet 21 and the fin portion 2. It is possible to suppress an increase in the excessive liquid phase refrigerant. Therefore, a part of the liquid-phase refrigerant that has flowed out to the return internal path 25 is vaporized by the heat of the heating element, and is diffused to the return internal path 25 by its diffusion action.
  • the opening 31 provided in the partition plate 30 is configured to supply the liquid-phase refrigerant substantially uniformly into the space between the partition plate 30 and the fin portion 2, so that the liquid diffused in the return internal path 25
  • the phase refrigerant is supplied from the opening 31 to the entire fin portion 2 in a well-balanced manner.
  • the two-phase refrigerant of the gas phase and the liquid phase that has flowed out to the fin portion 2 is supplied with sufficient liquid-phase refrigerant to receive heat from the fin in the entire area of the fin portion 2, and finally the low-pressure flow
  • the refrigerant flows into the outlet 20 and is supplied to the entire fin portion 2.
  • the heat receiving part 3 has a plurality of openings 31, and the interval at which the plurality of openings 31 are provided may be configured to be shorter as the distance from the side surface where the outlet 20 is formed.
  • the refrigerant Since the pressure on the side surface on which the outflow port 20 is formed is low due to the action of the heat radiating unit 4 following the outflow port, the refrigerant is more likely to flow through the outflow port 20 closer to the side surface on which the outflow port 20 is formed. As the distance from the outlet increases, the refrigerant hardly flows to the outlet 20. By shortening the interval at which the plurality of openings 31 are provided away from the side surface on which the outflow port 20 is formed, the area close to the side surface on which the outflow port 20 is formed reduces the number of openings 31 and Suppresses the flow of refrigerant flowing out.
  • the liquid-phase refrigerant that has flowed into the return internal path 25 from the inlet 21 is partially vaporized by the heat of the heating element, and the diffusion thereof. Due to the action, it diffuses into the return internal path 25.
  • the liquid phase refrigerant is supplied in the fin portion 2 region in the vicinity of the side surface on which the inflow port 21 is formed.
  • the further away from the side surface on which the inflow port 21 is formed the smaller the supply amount of the liquid-phase refrigerant, and the more likely the so-called local dryout state occurs.
  • the partition plate 30, in the return internal path 25 the liquid-phase refrigerant is supplied almost evenly from the side surface side where the inflow port 21 is formed to the side surface side where the outflow port 20 is formed. That is, due to the effect of the partition plate 30, excessive liquid phase refrigerant is supplied in the fin portion 2 region near the inlet 21, and local supply due to an insufficient supply amount of liquid phase refrigerant in the fin portion 2 region near the outlet 20. Dryout can be suppressed.
  • the refrigerant is likely to flow through the fin part 2 area near the outlet 20, and the fin part 2 area near the inlet 21 that is less susceptible to the pressure reducing effect due to the action of the heat radiating part 4 It becomes difficult for the refrigerant to flow. Therefore, the interval at which the plurality of openings 31 are provided is shortened as the distance from the side surface on which the outlet 20 is formed. That is, by reducing the number of openings 31 in the region close to the side surface on which the outlet 20 is formed, the balance of the amount of refrigerant in the liquid phase flowing out from the openings 31 into the space between the partition plate 30 and the fins 2 is achieved.
  • the outlet 20 side is small and the inlet 21 side is large.
  • the outflowed liquid-phase refrigerant flows from the inlet 21 side to the outlet 20 side in the space between the partition plate 30 and the fin portion 2, and as a result, substantially uniform on the upstream side of the fin portion 2.
  • the amount of liquid-phase refrigerant becomes so that a substantially uniform liquid-phase refrigerant is supplied to the entire fin portion 2.
  • the heat receiving part 3 has a plurality of openings 31, and the area of the plurality of openings 31 may be configured to increase as the distance from the side surface on which the outlet 20 is formed.
  • region far from the side surface in which the outflow port 20 was formed enlarges the area of the opening part 31, and promotes the flow of the refrigerant
  • FIG. As a result, the liquid phase refrigerant is supplied to the entire fin portion 2.
  • the liquid-phase refrigerant that has flowed into the return internal path 25 from the inlet 21 is partially vaporized by the heat of the heating element, and the diffusion thereof. Due to the action, it diffuses into the return internal path 25 but directly flows into the fin portion 2 in the vicinity of the inflow port 21, so that excess liquid phase refrigerant is present in the fin portion 2 region near the side surface where the inflow port 21 is formed. Supplied.
  • the further away from the side surface on which the inflow port 21 is formed the smaller the supply amount of the liquid-phase refrigerant, and the more likely the so-called local dryout state occurs.
  • the partition plate 30, in the return internal path 25 the liquid-phase refrigerant is supplied almost evenly from the side surface side where the inflow port 21 is formed to the side surface side where the outflow port 20 is formed. That is, due to the effect of the partition plate 30, excessive liquid phase refrigerant is supplied in the fin portion 2 region near the inlet 21, and local supply due to an insufficient supply amount of liquid phase refrigerant in the fin portion 2 region near the outlet 20. Dryout can be suppressed.
  • the refrigerant is likely to flow through the fin part 2 area near the outlet 20, and the fin part 2 area near the inlet 21 that is less susceptible to the pressure reducing effect due to the action of the heat radiating part 4 It becomes difficult for the refrigerant to flow. Therefore, the area where the plurality of openings 31 are provided is increased as the distance from the side surface where the outlet 20 is formed, that is, the area close to the side surface where the outlet 20 is formed is reduced by reducing the area of the opening 31.
  • the balance of the amount of refrigerant in the liquid phase flowing out from the opening 31 can be reduced so that the outflow port 20 side is small and the inflow port 21 side is large. Since the phase refrigerant flows from the inlet 21 side to the outlet 20 side in the space between the partition plate 30 and the fin portion 2, as a result, the liquid phase refrigerant amount is substantially uniform on the upstream side of the fin portion 2. Thus, a substantially uniform liquid-phase refrigerant is supplied to the entire fin portion 2.
  • FIG. 14A is a cross-sectional view of the heat receiving portion of the cooling device according to the present embodiment, and is a cross-sectional view of 14A-14A in FIG.
  • FIG. 14B is an enlarged view of the heat receiving portion of the cooling device in the present embodiment, and is an enlarged view of region 14B in FIG. 14A.
  • the first heating element 28, the second heating element 29, the heat receiving plate 15, and the heat receiving plate 16 shown in FIGS. 14A and 14B are the same as the first heating element 28 and the second heating element 28 shown in FIGS. 6A and 6B in the first embodiment.
  • the configuration is the same as that of the heating element 29, the heat receiving plate 15, and the heat receiving plate 16, and the description is omitted.
  • the electronic device carrying the cooling device 1 in this Embodiment.
  • 15 and 16 are exploded perspective views of the heat receiving portion 3 of the cooling device 1 according to the present embodiment.
  • FIG. 17 is a diagram showing a cross section of the heat receiving portion 3 of the cooling device 1 in the present embodiment.
  • the return internal path 25 includes a pipe 32 connected to the inflow port 21 in the return internal path 25.
  • the pipe line 32 may be configured to have at least one opening 33.
  • the return internal path 25 includes a pipe line 32 connected to the inflow port 21. Since the pipe line 32 has at least one opening 33, the liquid refrigerant in the return path flows into the pipe line 32 from the inlet and flows out into the return internal path 25 from the opening 33 provided in the pipe line 32. . Since the opening 33 is configured to supply the liquid-phase refrigerant to the return internal path 25 substantially uniformly, the liquid-phase refrigerant that has flowed out to the return internal path 25 is supplied to the entire fin portion 2. .
  • the liquid-phase refrigerant flowing into the return internal passage 25 from the inlet 21 is partially vaporized by the heat of the first heating element 28 and the second heating element 29, The diffusion action diffuses into the return internal path 25.
  • excessive liquid phase refrigerant is supplied in the fin portion 2 region in the vicinity of the side surface on which the inflow port 21 is formed.
  • the further away from the side surface on which the inflow port 21 is formed the smaller the supply amount of the liquid-phase refrigerant, and the more likely the so-called local dryout state occurs in the fin portion 2 region located near the outflow port 20.
  • the liquid phase refrigerant flowing out from the inlet 21 to the return internal path 25 is excessive in the fin portion 2 in the vicinity of the inlet 21 due to the pipe line 32 connected to the inlet 21.
  • the pipe line 32 connected to the inlet 21 As a result, it is possible to suppress an increase in the liquid phase refrigerant, and a part of the liquid phase refrigerant that has flowed out to the return internal path 25 is vaporized by the heat of the heating element.
  • the diffusion action diffuses into the return internal path 25.
  • the opening 33 provided in the pipe line 32 is configured to supply the liquid refrigerant substantially uniformly to the return internal path 25, so that the liquid phase refrigerant diffused in the return internal path 25 is finned.
  • the two-layer refrigerant of the gas phase and the liquid phase that has flowed out to the fin portion 2 is supplied with sufficient liquid-phase refrigerant to receive heat from the fin portion 2 over the entire fin portion 2, and finally the pressure is reduced.
  • the refrigerant flows into the low outlet 20 and the refrigerant is supplied to the entire fin portion 2.
  • the heat receiving part 3 has a plurality of openings 33, and the interval at which the plurality of openings 33 are provided may be shortened as the distance from the side surface on which the outlet 20 is formed.
  • the refrigerant Since the pressure on the side surface on which the outflow port 20 is formed is low due to the action of the heat radiating unit 4 following the outflow port, the refrigerant is more likely to flow through the outflow port 20 closer to the side surface on which the outflow port 20 is formed. As the distance from the outlet increases, the refrigerant hardly flows to the outlet 20. By shortening the interval at which the plurality of openings 33 are provided away from the side surface on which the outflow port 20 is formed, the area close to the side surface on which the outflow port 20 is formed is reduced in the number of openings 33 and Suppresses the flow of refrigerant flowing out.
  • the heat receiving unit 3 may have a plurality of openings 33, and the area of the plurality of openings 33 may be configured to increase as the distance from the side surface on which the outlet 20 is formed.
  • the refrigerant Since the pressure on the side surface on which the outflow port 20 is formed is low due to the action of the heat radiating unit 4 following the outflow port, the refrigerant is more likely to flow through the outflow port 20 closer to the side surface on which the outflow port 20 is formed. As the distance from the outlet increases, the refrigerant hardly flows to the outlet 20. By shortening the interval at which the plurality of openings 33 are provided away from the side surface on which the outlet 20 is formed, the area close to the side surface on which the outlet 20 is formed reduces the area of the opening 33, Suppresses the flow of refrigerant flowing out.
  • the schematic configuration of the cooling device in the present embodiment is the same as that of the cooling device 1 in the first embodiment shown in FIG. 1, and in the following description, the same configuration as that of the cooling device 1 in the first embodiment is used. Elements are denoted by the same reference numerals and description thereof is omitted.
  • FIG. 18 is an exploded perspective view of the heat receiving unit 3 of the cooling device 1 according to the fifth embodiment of the present invention.
  • a plurality of partition walls 34 are provided in parallel to the fins 22 and the fins 23 between the front surface and the rear surface of the heat receiving unit 3, that is, between the heat receiving plate 15 and the heat receiving plate 16.
  • two partition walls 34 are provided, but one partition wall 34 may be provided.
  • the partition wall 34 is arrange
  • the partition wall 34 is formed with a heat dissipation internal path opening 35 that penetrates the heat dissipation internal path 24 above the heat receiving portion 3 and a feedback internal path opening 36 that penetrates the feedback internal path 25 below.
  • the heat dissipation internal path opening 35 and the return internal path opening 36 have a structure in which the partition wall 34 is provided avoiding the heat dissipation internal path 24 and the return internal path 25 even if the opening is actually formed in the partition wall 34. It may be a thing.
  • the refrigerant flowing out into the fin part 2 in the heat receiving part 3 has a lower pressure. And it is easy to flow to the side surface where the outlet 20 is formed.
  • the lateral width of the heat receiving unit 3 may be increased. In such a case, the distance between the side surface on which the inflow port 21 and the outflow port 20 are formed and the opposite side surface becomes longer.
  • the refrigerant supplied into the partitioned space flows through the fins 22 and 23 in the space and radiates heat after exchanging heat with the fins 22 and 23. It flows to the heat radiation path 5 side through the heat radiation internal path opening 35 provided in the internal path 24 and the partition wall 34. Therefore, even when the lateral width of the heat receiving portion 3 is large, dryout in a region far from the side surface on which the inflow port 21 and the outflow port 20 are formed can be suppressed.
  • FIG. 19 is an exploded perspective view of the heat receiving portion 3 of the cooling device 1 according to the sixth embodiment of the present invention.
  • the present embodiment is provided with a partition wall 34 as in the fifth embodiment.
  • the function and effect of the partition wall 34 are the same as in the fifth embodiment.
  • a plurality of partition walls 34 are provided in parallel to the fins 22 and the fins 23 between the front surface and the rear surface of the heat receiving unit 3, that is, between the heat receiving plate 15 and the heat receiving plate 16.
  • two partition walls 34 are provided, but one partition wall 34 may be provided.
  • the partition wall 34 is arrange
  • the partition wall 34 is formed with a heat radiation internal path opening 35 that penetrates the heat radiation internal path 24 at the top of the heat receiving portion 3 and a pipe opening 37 that penetrates the pipe 32 at the bottom.
  • the heat radiation internal path opening 35 may be a structure in which an opening is actually formed in the partition wall 34, or a structure in which the partition wall 34 is provided avoiding the heat radiation internal path 24.
  • the refrigerant flowing out into the fin part 2 in the heat receiving part 3 has a lower pressure. And it is easy to flow to the side surface where the outlet 20 is formed.
  • the lateral width of the heat receiving unit 3 may be increased. In such a case, the distance between the side surface on which the inflow port 21 and the outflow port 20 are formed and the opposite side surface becomes longer.
  • the refrigerant supplied into the partitioned space flows through the fins 22 and 23 in the space and radiates heat after exchanging heat with the fins 22 and 23. It flows to the heat radiation path 5 side through the heat radiation internal path opening 35 provided in the internal path 24 and the partition wall 34. Therefore, even when the lateral width of the heat receiving portion 3 is large, dryout in a region far from the side surface on which the inflow port 21 and the outflow port 20 are formed can be suppressed.
  • the cooling device since the cooling device according to the present invention has high cooling performance, electronic components such as a central processing unit (CPU), a large scale integrated circuit (LSI), an insulated gate bipolar transistor (IGBT), and a diode are mounted. It is useful as a cooling device for electronic equipment.
  • CPU central processing unit
  • LSI large scale integrated circuit
  • IGBT insulated gate bipolar transistor

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  • Physics & Mathematics (AREA)
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  • General Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
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  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

L'invention concerne un dispositif de refroidissement qui effectue un refroidissement par l'intermédiaire du changement de phase d'un caloporteur, une partie de réception de chaleur (3) étant pourvue d'une plaque de réception de chaleur (9) dans laquelle un élément émettant de la chaleur est disposé sur la surface avant et/ou la surface arrière. La partie de réception de chaleur (3) est pourvue d'un passage intérieur de rayonnement de la chaleur (24) dans une partie supérieure et d'un passage intérieur de retour (25) dans une partie inférieure. Une partie à ailettes (2) est disposée entre le passage intérieur de rayonnement de la chaleur (24) et le passage intérieur de retour (25). La partie à ailettes (2) est pourvue d'une pluralité d'ailettes planes (22) qui font saillie à partir de la plaque de réception de chaleur (9) vers l'intérieur, de sorte que le passage intérieur de rayonnement de la chaleur (24) et le passage intérieur de retour (25) communiquent par l'intermédiaire de canaux de caloporteur entre les ailettes (22, 23). Une sortie (20) et une entrée (21) sont ménagées sur la même surface latérale de la partie de réception de chaleur (3) et une plaque de séparation (30) est disposée entre l'entrée (21) et la partie à ailettes (2).
PCT/JP2016/000298 2015-01-21 2016-01-21 Dispositif de refroidissement et dispositif électronique dans lequel ce dernier est installé Ceased WO2016117342A1 (fr)

Applications Claiming Priority (6)

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JP2015009847 2015-01-21
JP2015-009847 2015-01-21
JP2015-013845 2015-01-28
JP2015013845A JP2016138706A (ja) 2015-01-28 2015-01-28 冷却装置およびこれを搭載した電子機器
JP2015146703A JP2016138740A (ja) 2015-01-21 2015-07-24 冷却装置およびこれを搭載した電子機器
JP2015-146703 2015-07-24

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Publication number Priority date Publication date Assignee Title
JPWO2017150415A1 (ja) * 2016-03-04 2019-01-10 日本電気株式会社 冷却システムと冷却器および冷却方法
US10326186B2 (en) * 2016-10-24 2019-06-18 Hyundai Motor Company Apparatus for cooling battery
CN111447805A (zh) * 2020-05-11 2020-07-24 珠海格力电器股份有限公司 散热效率高的散热组件、电器盒及空调
WO2020174593A1 (fr) * 2019-02-26 2020-09-03 住友精密工業株式会社 Dispositif de refroidissement

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