WO2016195260A1 - Adhesion member, and stack structure and mobile terminal comprising same - Google Patents

Abstract

Disclosed are an adhesion member, and a stack structure and a mobile terminal comprising the same. A stack structure according to an exemplary embodiment comprises: a printed circuit board having at least one electronic element on one surface thereof; a first adhesion member having one surface thereof adhered to the other surface of the printed circuit board; and an electromagnetic wave shield having one surface thereof adhered to the other surface of the first adhesion member, wherein the first adhesion member comprises: a metal base member comprising a metal mesh; a first adhesion layer, provided on one surface of the metal base member, for adhering the metal base member to the other surface of the printed circuit board; and a second adhesion layer, provided on the other surface of the metal base member, for adhering the metal base member to the electromagnetic wave shield.

Description

Adhesive member, laminated structure and mobile terminal having same

Embodiments of the present invention relate to electromagnetic wave shielding technology, and more particularly, to an adhesive member, a laminated structure having the same, and a mobile terminal.

Recently, as miniaturization and high performance of electronic devices are accelerated, the density of electronic components mounted in electronic devices is increasing. Electronic components mounted in electronic devices radiate electromagnetic waves and cause EMI (Electro Magnetic Interference) problems. In addition, when such an electromagnetic wave is exposed to the human body, which adversely affects the human body, research for blocking an electromagnetic wave generated from an electronic device is being conducted.

As a countermeasure for electromagnetic wave blocking, a technique of absorbing or blocking electromagnetic waves with an electromagnetic shielding material is mainly used. For example, the ferrite sheet may be attached to a printed circuit board (PCB) having an antenna pattern to block electromagnetic waves generated from the antenna pattern. At this time, the ferrite sheet is attached to the printed circuit board double-sided adhesive tape.

1 is a cross-sectional view illustrating a state in which a ferrite sheet is attached to a printed circuit board through a double-sided adhesive tape.

Referring to FIG. 1, an antenna pattern 20 is formed on one surface of a printed circuit board 10, and the ferrite sheet 40 is adhered to the other surface of the printed circuit board 10 through a double-sided adhesive tape 30. Here, the double-sided adhesive tape 30 is a polyethylene terephthalate (PET) film 31, a first adhesive layer 33 provided on the upper surface of the PET film 31, and a second adhesive layer provided on the lower surface of the PET film 31. (35).

Conventionally, the ferrite sheet 40 is bonded to the printed circuit board 10 through the double-sided adhesive tape 30, in this case eddy current or electromagnetic waves generated in the printed circuit board 10 with only the ferrite sheet 40 There is a limit to blocking.

An embodiment of the present invention is to provide an adhesive member and a laminated structure and a mobile terminal having the same to improve the electromagnetic shielding effect.

According to an exemplary embodiment, a stack structure includes: a printed circuit board having at least one electronic element provided on one surface thereof; A first adhesive member having one surface bonded to the other surface of the printed circuit board; And an electromagnetic shielding material having one surface bonded to the other surface of the first adhesive member, wherein the first adhesive member comprises: a metal base member including a metal mesh; A first adhesive layer provided on one surface of the metal base member and bonding the metal base member to the other surface of the printed circuit board; And a second adhesive layer provided on the other surface of the metal base member and adhering the metal base member to the electromagnetic shielding material.

The first adhesive member may shield eddy current generated in the electronic element through the metal mesh.

The metal base member may include an edge line provided along an edge of the metal base member; A plurality of first mesh lines provided in the first direction and spaced apart from each other inside the edge line; And a plurality of second mesh lines provided in a second direction different from the first direction and spaced apart from each other and intersecting the plurality of first mesh lines, respectively, inside the edge line.

At least one of the edge line, the first mesh line, and the second mesh line may have one surface and the other surface in a plane.

The metal base member may include at least one plate portion in a planar region; And a mesh portion connected to the plate portion and formed in the form of a metal mesh.

In the metal base member, an area of the plate portion may be smaller than that of the mesh portion.

The laminated structure may further include a second adhesive member adhered to the other surface of the electromagnetic shielding material and including a metal mesh.

An adhesive member according to an exemplary embodiment may include an adhesive member that is directly or indirectly adhered to a mechanism on which an electronic element is provided, the adhesive member including a metal mesh and shielding an eddy current generated in the electronic element; And an adhesive layer provided on at least one of one surface and the other surface of the metal base member.

The metal base member may include an edge line provided along an edge of the metal base member; A plurality of first mesh lines provided in the first direction and spaced apart from each other inside the edge line; And a plurality of second mesh lines provided in a second direction different from the first direction and spaced apart from each other and intersecting the plurality of first mesh lines, respectively, inside the edge line.

The metal base member may include at least one plate portion in a planar region; And a mesh portion connected to the plate portion and formed in the form of a metal mesh.

In the metal base member, an area of the plate portion may be smaller than that of the mesh portion.

According to the exemplary embodiment, the adhesive member includes a metal base member formed in the form of a metal mesh, thereby shielding an eddy current generated in the printed circuit board. In other words, by using a new type of adhesive member having a metal base member (instead of a general double-sided adhesive tape), the eddy current generated in the printed circuit board can be confined to the metal base member, thereby improving the shielding effect against the eddy current. In addition, since the adhesive member shields the eddy current generated from the printed circuit board, the electromagnetic shielding effect is also increased, that is, the adhesive member shields the eddy current generated from the printed circuit board to compensate for the electromagnetic shielding material. The effect is even higher.

1 is a cross-sectional view illustrating a state in which a ferrite sheet is attached to a printed circuit board through a double-sided adhesive tape.

2 is an exploded perspective view showing a laminated structure according to an exemplary embodiment

3 illustrates an adhesive member according to an exemplary embodiment.

4 illustrates a metal base member according to another exemplary embodiment.

5 is an exploded perspective view showing a laminated structure according to another exemplary embodiment

Fig. 6 is a cross sectional view of a laminate structure according to another exemplary embodiment.

FIG. 7 is a diagram illustrating a distance relationship between a first pattern, a second pattern, and a second electromagnetic shielding material according to an exemplary embodiment. FIG.

Hereinafter, specific embodiments of the present invention will be described with reference to the drawings. However, this is only an exemplary embodiment and the present invention is not limited thereto.

In describing the present invention, when it is determined that the detailed description of the known technology related to the present invention may unnecessarily obscure the subject matter of the present invention, the detailed description thereof will be omitted. In addition, terms to be described below are terms defined in consideration of functions in the present invention, which may vary according to the intention or custom of a user or an operator. Therefore, the definition should be made based on the contents throughout the specification.

The technical spirit of the present invention is determined by the claims, and the following embodiments are merely means for effectively explaining the technical spirit of the present invention to those skilled in the art to which the present invention pertains.

Meanwhile, directional terms such as upper side, lower side, one side, the other side, and the like are used in connection with the orientation of the disclosed drawings. Since the components of the embodiments of the present invention can be positioned in various orientations, the directional terminology is used for the purpose of illustration and not limitation.

2 is an exploded perspective view illustrating a laminated structure according to an exemplary embodiment.

Referring to FIG. 2, the stacked structure 100 may include a printed circuit board 102, a first adhesive member 104, an electromagnetic shielding member 106, and a second adhesive member 108. In an exemplary embodiment, the stacked structure 100 may be mounted in a mobile terminal (eg, a smart phone, mobile phone, tablet, notebook, wearable device such as a smart watch, etc.). However, the present invention is not limited thereto, and the stacked structure 100 may be mounted in various other electronic devices.

An antenna pattern 111 may be provided on one surface of the printed circuit board 102. However, the present invention is not limited thereto, and an electronic component such as an active element and a passive element that generate electromagnetic waves (or eddy currents) as well as a pattern for wireless communication may be provided on one surface of the printed circuit board 102. Can be. In the present invention, the printed circuit board 102 may be referred to as including a flexible printed circuit board (FPCB).

The first adhesive member 104 may be provided on the other surface of the printed circuit board 102. The first adhesive member 104 may be provided between the printed circuit board 102 and the electromagnetic shielding member 106 to bond the printed circuit board 102 to the electromagnetic shielding member 106. In addition, the first adhesive member 104 may provide an eddy current generated from the printed circuit board 102 (more specifically, an electronic component, an electronic circuit, a circuit pattern, an antenna pattern, etc. provided on one surface of the printed circuit board 102). It may be provided to serve to shield. To this end, the first adhesive member 104 may include a metal mesh.

The electromagnetic wave shield 106 serves to shield electromagnetic waves generated from the printed circuit board 102 (more specifically, electronic components, electronic circuits, circuit patterns, antenna patterns, etc. provided on one surface of the printed circuit board 102). do. One surface of the electromagnetic shielding member 106 may be adhered to the other surface side of the printed circuit board 102 by the first adhesive member 104. The electromagnetic shielding member 106 may be formed in a sheet form.

The second adhesive member 108 may be adhered to the other surface of the electromagnetic shielding member 106. That is, one surface of the second adhesive member 108 may be adhered to the other surface of the electromagnetic shielding member 106. The second adhesive member 108 may include a metal mesh to shield the eddy current generated from the printed circuit board 102. A release film (not shown) may be adhered to the other surface of the second adhesive member 108. The first adhesive member 104 is directly bonded to the printed circuit board 102, but the second adhesive member 108 is indirectly bonded to the printed circuit board 102 through the electromagnetic shielding material 106.

Here, by bonding the first adhesive member 104 and the second adhesive member 108 including the metal mesh to both sides of the electromagnetic shielding member 106, the eddy current generated in the printed circuit board 102 is the first adhesive member ( 104 and absorbed into the metal mesh of the second adhesive member 108, respectively. Therefore, compared with the case where only the electromagnetic wave shielding material 106 is used, electromagnetic wave shielding efficiency can be improved more.

Here, although the first adhesive member 104 and the second adhesive member 108 including the metal mesh are illustrated as being adhered to both surfaces of the electromagnetic shielding member 106, the present invention is not limited thereto, and the first adhesive member 104 is not limited thereto. It may be adhered to one surface of the electromagnetic shielding member 106. Details of the adhesive members 104 and 108 will be described later with reference to FIG. 3.

3 is a view showing an adhesive member according to an exemplary embodiment.

Referring to FIG. 3, the adhesive member 104 may include a metal base member 121, a first adhesive layer 123, and a second adhesive layer 125.

The metal base member 121 serves to support the adhesive member 104. The metal base member 121 may be in the form of a metal mesh. That is, the metal base member 121 may include an edge line 121a, a plurality of first mesh lines 121b, and a plurality of second mesh lines 121c.

The edge line 121a may be provided at the outermost side (ie, the edge) of the metal base member 121. The edge line 121a may be provided in a quadrangular shape. The plurality of first mesh lines 121b may be provided along the first direction and spaced apart from the inside of the edge line 121a. Both ends of each of the plurality of first mesh lines 121b may be connected to the edge line 121a. The plurality of second mesh lines 121c may be provided along the second direction crossing the first direction and spaced apart from the inside of the edge line 121a. Each of the plurality of second mesh lines 121c may cross the plurality of first mesh lines 121b. Both ends of each of the plurality of second mesh lines 121c may be connected to the edge line 121a. The first direction and the second direction may be provided to be orthogonal, but the present invention is not limited thereto and may cross obliquely. In addition, some areas may be orthogonal and some areas may cross obliquely. In addition, the shape of the mesh may be formed in various shapes other than the square.

The plurality of first mesh lines 121b may be spaced apart from each other at the same interval, or may be spaced at different intervals from each other. Similarly, the plurality of second mesh lines 121c may be spaced apart from each other at the same interval, or may be spaced at different intervals. In addition, the spacing between the first mesh lines 121b and the spacing between the second mesh lines 121c may be the same or different.

The first adhesive layer 123 may be provided on the upper surface of the metal base member 121. That is, the first adhesive layer 123 is formed on the top surface of the edge line 121a, the first mesh line 121b, and the second mesh line 121c, and includes the edge line 121a, the first mesh line 121b, and the first adhesive layer 123. It may be provided along the two mesh lines 121c. The first adhesive layer 123 may adhere the upper surface of the adhesive member 104 to the printed circuit board 102.

The second adhesive layer 125 may be provided on the bottom surface of the metal base member 121. That is, the second adhesive layer 125 may include the edge line 121a, the first mesh line 121b, and the first line on the bottom surface of the edge line 121a, the first mesh line 121b, and the second mesh line 121c. It may be provided along the two mesh lines 121c. The second adhesive layer 123 may adhere the lower surface of the adhesive member 104 to the electromagnetic shielding material 106.

The first adhesive layer 123 and the second adhesive layer 125 may be made of, for example, an acrylic adhesive, but are not limited thereto and may include various other adhesives.

The upper and lower surfaces of the edge line 121a, the first mesh line 121b, and the second mesh line 121c may be formed in a flat surface, respectively. For example, the edge line 121a, the first mesh line 121b, and the second mesh line 121c may be provided to form a cross section thereof. In this case, the first adhesive layer 123 and the second adhesive layer 125 are formed on the upper and lower surfaces of the edge line 121a, the first mesh line 121b, and the second mesh line 121c. The first mesh line 121b and the second mesh line 121c may be provided in surface contact with each other. That is, the first adhesive layer 123 and the second adhesive layer 125 are provided on the upper and lower surfaces of the edge line 121a, the first mesh line 121b, and the second mesh line 121c, respectively, with predetermined widths. The first adhesive layer 123 and the second adhesive layer 125 may be stably maintained, and the adhesive member 104 may have a certain level of adhesive force.

Here, although the first adhesive layer 123 and the second adhesive layer 125 are respectively provided on both surfaces of the metal base member 121, the present invention is not limited thereto, and the adhesive layer may be provided on only one surface of the metal base member 121. It may be arranged.

As described above, the adhesive member 104 includes a metal base member 121 formed in the form of a metal mesh, thereby shielding an eddy current generated in the printed circuit board 102. That is, by using a new type of adhesive member 104 having a metal base member 121 instead of a general double-sided adhesive tape, the eddy current generated in the printed circuit board 102 can be trapped in the metal base member 121. Thus, the shielding effect against eddy currents can be improved.

And, since the adhesive member 104 shields the eddy current generated in the printed circuit board 102, the electromagnetic wave shielding effect is also increased. That is, since the adhesive member 104 supplements the electromagnetic shielding member 106 by shielding the eddy current generated from the printed circuit board 102, the electromagnetic shielding effect is further enhanced.

Fig. 4 is a view showing a metal base member according to another exemplary embodiment. Here, the part which differs from the metal base member shown in FIG. 3 is demonstrated mainly.

Referring to FIG. 4A, the metal base member 121 may include a plate part 150 and a mesh part 160. The plate part 150 is an area having a plane having a predetermined area, unlike the mesh part 160. The plate part 150 may be provided along the edge of the metal base member 121. An opening may be provided inside the plate part 150. Plate portion 150 may be provided having a predetermined width.

The mesh unit 160 may be provided in connection with the plate unit 150 inside the plate unit 150. The mesh unit 160 includes a plurality of first mesh lines 160b provided along the first direction and spaced apart from each other, and a plurality of second mesh lines 160c provided along the second direction crossing the first direction and spaced apart from each other. ) May be included.

Here, by providing the plate portion 150 in the edge portion of the metal base member 121, the first adhesive layer 123 and the second adhesive layer 125 is wider while enhancing the mechanical strength of the metal base member 121. It can form in an area.

Referring to FIG. 4B, the metal base member 121 may include a plurality of plate parts 150 and a mesh part 160. The plurality of plate parts 150 may be provided to be spaced apart from each other, and may be connected to each other through the mesh part 160. The metal base member 121 may include at least four plate parts 150. In this case, the four plate parts 150 may be provided at the upper left corner, the upper right corner, the lower left corner, and the lower right corner of the metal base member 121, respectively. In addition, in addition to this, a plurality of plate parts 150 may be provided at the edges of the metal base member 121 or inside the metal base member 121. Here, the plurality of plate parts 150 is shown as being made of a rectangular shape, but is not limited to this may be made in a variety of other shapes.

In the metal base member 121, an area occupied by the plate part 150 may be smaller than an area occupied by the mesh part 160. That is, when the plate portion 150 in the form of a metal film is formed with a larger area than the mesh portion 160, the shielding due to the electromagnetic wave reflection is larger than the shielding due to the electromagnetic wave absorption, so that the area occupied by the plate portion 150 is the mesh portion. It can be made smaller than the area occupied by 160. Preferably, the area of the plate part 150 may be 1/3 or less of the total area of the metal base member 121.

Fig. 5 is an exploded perspective view showing a laminated structure according to another exemplary embodiment.

Referring to FIG. 5, the laminated structure 200 may include a printed circuit board 202, a first double-sided adhesive member 204, a first electromagnetic wave shielding material 206, a second double-sided adhesive member 208, and a second electromagnetic wave shielding material. And may include 210. A printed circuit board 202 may be provided on the uppermost layer of the stacked structure 200, and a second electromagnetic shielding material 210 may be provided on the lowermost layer of the stacked structure 200. The stacked structure 200 is a printed circuit board 202, a first double-sided adhesive member 204, a first electromagnetic wave shielding material 206, and a second double-sided surface from the printed circuit board 202 to the second electromagnetic wave shielding material 210. The adhesive member 208 and the second electromagnetic shielding material 210 may be stacked in this order.

That is, the first double-sided adhesive member 204 may be provided between the printed circuit board 202 and the first electromagnetic shielding material 206 to bond the printed circuit board 202 and the first electromagnetic shielding material 206 to each other. The second double-sided adhesive member 208 may be provided between the first electromagnetic wave shielding material 206 and the second electromagnetic wave shielding material 210 to bond the first electromagnetic wave shielding material 206 and the second electromagnetic shielding material 210 to each other. The first double-sided adhesive member 204 and the second double-sided adhesive member 208 may be adhesive members including the metal mesh shown in FIGS. 2 to 4, but are not limited thereto, and a general double-sided adhesive tape may be used. .

The first pattern 211 and the second pattern 213 may be provided on one surface of the printed circuit board 202. The first pattern 211 may be a pattern for wireless charging. That is, the first pattern 211 may be a pattern for transmitting or receiving wireless charging power. The first pattern 211 may be provided to satisfy a frequency band of a magnetic induction scheme (for example, a wireless power consortium (WPC) or a power matters alliance (PMA)) of the wireless charging scheme. For example, when the wireless charging method is WPC, the first pattern 211 may be provided to correspond to the band 100 ~ 205 kHz. When the wireless charging method is PMA, the first pattern 211 may be provided to correspond to the 277 to 357 kHz band or the 118 to 153 kHz band. However, the present invention is not limited thereto, and the first pattern 211 may be provided to satisfy frequency bands of various wireless charging schemes (for example, magnetic resonance schemes and magnetic induction schemes).

The second pattern 213 may be a pattern for short range wireless communication. For example, the second pattern 213 may be a pattern for transmitting or receiving a signal in NFC communication (eg, 13.56 MHz band) or Bluetooth communication (eg, 2.4 GHz band). That is, the second pattern 213 may be provided to transmit or receive a signal of a high frequency band relatively than the first pattern 211. The second pattern 213 may be provided to be spaced apart from the first pattern 211 on one surface of the printed circuit board 202. The second pattern 213 may be provided on the outer side of the first pattern 211 on one surface of the printed circuit board 202. That is, the second pattern 213 may be provided along the edge of the printed circuit board 202. The first pattern 211 may have a line width wider than that of the second pattern 213 inside the second pattern 213.

One of the first electromagnetic shielding member 206 and the second electromagnetic shielding member 210 may be a ferrite sheet, and the other may be a metal magnetic thin sheet. The ferrite sheet is prepared by mixing the ferrite powder and the binder resin, for example, Mn-Zn ferrite, Ni-Zn-Cu ferrite, Mn-Mg ferrite may be used as the ferrite powder. The metal magnetic thin sheet may be one in which a ribbon or strip of a Fe-based magnetic alloy or a Co-based magnetic alloy is flake-processed into a plurality of fine pieces (or a plurality of cracks are formed). As the Fe-based magnetic alloy, for example, a Fe-Si-B alloy or a Fe-Si-B-Co alloy can be used, and as the Co-based magnetic alloy, for example, a Co-Fe-Ni-Si-B alloy Or Co-Fe-Cr-Si-B alloy may be used, but is not limited thereto.

For example, the first electromagnetic wave shielding material 206 may be a ferrite sheet, and the second electromagnetic wave shielding material 210 may be a metal magnetic thin sheet. In this case, the first electromagnetic shielding material 206 shields electromagnetic waves generated in the second pattern 213 for short range wireless communication, and the second electromagnetic shielding material 210 is generated in the first pattern 211 for wireless charging. The electromagnetic wave can be shielded. That is, electromagnetic waves generated in the second pattern 213 in the relatively high frequency band are shielded using a ferrite sheet, and electromagnetic waves generated in the first pattern 211 in the relatively low frequency band are shielded using a metal magnetic thin sheet. You can.

However, in the case of the metal magnetic thin sheet, since the magnetic permeability is high, the short-range wireless communication by the second pattern 213 may be impeded. That is, in the case of wireless charging by the first pattern 211, since it is not performing communication but merely transferring wireless power, it is hardly affected by the metal magnetic thin sheet, but is short-range wireless by the second pattern 213. Communication is affected by metal magnetic thin sheets having high magnetic permeability, which may interfere with communication.

Therefore, in the exemplary embodiment, the metal magnetic thin sheet is formed only in a region corresponding to the first pattern 211, and is not formed in the region in which the second pattern 213 is provided, whereby the metal magnetic thin sheet is formed in the second sheet. The short-range wireless communication by the pattern 213 can be prevented. A detailed description thereof will be described later with reference to FIG. 6.

Fig. 6 is a cross sectional view of a laminate structure according to another exemplary embodiment.

Referring to FIG. 6, a first pattern 211 for wireless charging and a second pattern 213 for short range wireless communication may be provided on one surface of the printed circuit board 202 spaced apart from each other. A region where the first pattern 211 is formed on one surface of the printed circuit board 202 is called a first pattern region (hereinafter referred to as a "wireless charging pattern region"), and the second pattern 213 is formed. The area to be referred to as a second pattern area (hereinafter, may be referred to as a "near field wireless communication pattern area").

The first electromagnetic shielding material 206 may be adhered to the lower portion of the printed circuit board 202 through the first double-sided adhesive member 204. The first electromagnetic shielding material 206 may be a ferrite sheet. The first electromagnetic shielding material 206 may shield electromagnetic waves generated in the second pattern 213. The first electromagnetic shielding material 206 may be provided in a size corresponding to that of the printed circuit board 202. That is, the first electromagnetic shielding material 206 may be provided in the wireless charging pattern region as well as the short range wireless communication pattern region. In this case, the first electromagnetic shielding material 206 may partially shield not only the electromagnetic wave generated in the second pattern 213 but also the electromagnetic wave generated in the first pattern 211.

The second electromagnetic shielding member 210 may be adhered to the lower portion of the first electromagnetic shielding member 206 through the second double-sided adhesive member 208. The second electromagnetic shielding material 210 may be a metal magnetic thin film sheet. The second electromagnetic shielding material 210 may shield the electromagnetic waves generated in the first pattern 211. In addition, the second electromagnetic shielding material 210 may serve to improve the transmission efficiency of the wireless power transmitted from the first pattern 211. That is, the second electromagnetic shielding material 210 blocks the electromagnetic wave generated in the first pattern 211 from being transmitted to the lower side of the printed circuit board 202, while the wireless power transmitted from the first pattern 211 is printed circuit. It can be well transferred to the upper side of the substrate 202. In this case, the second electromagnetic shielding material 210 may be provided limited to the wireless charging pattern region. That is, the second electromagnetic shielding member 210 is formed only in the wireless charging pattern region and is not formed in the short range wireless communication pattern region, thereby preventing the second electromagnetic shielding member 210 from interfering with short-range wireless communication by the second pattern 213. You can prevent it.

Here, the second electromagnetic shielding material 210 may be provided with the same size as the wireless charging pattern region, but is not limited thereto and may be provided with a larger size than the wireless charging pattern region. That is, the second electromagnetic shielding member 210 may be provided to extend outward from the wireless charging pattern region while covering the wireless charging pattern region. In this case, the electromagnetic wave shielding and the wireless power transmission effect by the second electromagnetic shielding member 210 can be improved. When the second electromagnetic shielding member 210 is extended to the outside of the wireless charging pattern region, the second electromagnetic shielding member 210 may be provided to be spaced apart from the second pattern 213 by a predetermined threshold shielding distance or more. Two different values may be applied to the critical shielding distance according to the separation distance between the first pattern 211 and the second pattern 213.

In detail, when the second pattern 213 is provided outside the first pattern 211, the first pattern 211 and the second pattern 213 are spaced apart from each other without being spaced at equal intervals in all areas. The distance may vary. Here, in the case where the separation distance between the first pattern 211 and the second pattern 213 is equal to or less than the first separation distance, the second electromagnetic shielding member 210 may be a predetermined distance from the second pattern 213. It may be provided to be greater than or equal to one critical shielding distance. The first critical shielding distance is a distance shorter than the first spacing distance. The first critical shielding distance affects the short range wireless communication by the second electromagnetic wave shielding material 210 due to the second pattern 213, but the short range wireless communication efficiency due to the second pattern 213 becomes higher than or equal to a preset level. Can be set. That is, the first critical shielding distance may be set to a minimum distance at which the second electromagnetic shielding member 210 should be spaced apart from the second pattern 213 so that the short-range wireless communication efficiency by the second pattern 213 is equal to or greater than a preset level. Can be.

In the case where the separation distance between the first pattern 211 and the second pattern 213 is greater than or equal to the second separation distance, the second electromagnetic shielding member 210 may be a predetermined distance from the second pattern 213. It may be provided to be more than two critical shielding distance. Here, the second separation distance is a distance longer than the first separation distance. The second critical shielding distance is shorter than the second separation distance and longer than the first critical shielding distance. The second threshold shielding distance may be set to be greater than or equal to the first separation distance. The second critical shielding distance may be set as long as the second electromagnetic shielding member 210 does not interfere with short-range wireless communication by the second pattern 213.

7 is a diagram illustrating a distance relationship between a first pattern, a second pattern, and a second electromagnetic shielding material according to an exemplary embodiment. Here, the first electromagnetic shielding material is omitted for convenience of description.

Referring to FIG. 7, a first pattern 211 and a second pattern 213 may be provided on one surface of the printed circuit board 202. The second pattern 213 may be provided outside the first pattern 211. The first pattern 211 and the second pattern 213 may each be provided in a spiral form. The second electromagnetic shielding material 210 may be formed to correspond to the first pattern 211. The second electromagnetic shielding material 210 may be provided wider than a region in which the first pattern 211 is formed (that is, a wireless charging pattern region). That is, the second electromagnetic shielding member 210 may be provided to extend to the outside (that is, the second pattern 213 side) in the wireless charging pattern region. In this case, the second electromagnetic shielding member 210 may be provided to be spaced apart from the second pattern 213 by a predetermined threshold shielding distance or more.

Here, the distance between the first pattern 211 and the second pattern 213 may be different for each region. In an exemplary embodiment, the first separation distance may be set to 1.5 mm and the first critical shielding distance may be set to 0.2 mm. The second electromagnetic shielding material in the region where the distance between the first pattern 211 and the second pattern 213 is 1.5 mm or less (in the region where the distance between the first pattern 211 and the second pattern 213 is 1.1 mm in FIG. 7). The distance between the 210 and the second pattern 213 may be set to be 0.2 mm or more (in FIG. 7, the distance between the second electromagnetic wave shield 210 and the second pattern 213 is 0.55 mm apart). . That is, in the region where the distance between the first pattern 211 and the second pattern 213 is 1.5 mm or less, the second electromagnetic shielding member 210 is extended to the second pattern 213, and the second electromagnetic shielding member 210 is provided. May be spaced apart from the second pattern 213 by at least 0.2 mm.

Further, in an exemplary embodiment, the second separation distance may be set to 5 mm and the second threshold shielding distance may be set to 1.5 mm. An area where the distance between the first pattern 211 and the second pattern 213 is 5 mm or more (in FIG. 7, an area between 6.93 mm, 6.029 mm, and 5.721 mm between the first pattern 211 and the second pattern 213). In this case, the distance between the second electromagnetic shielding member 210 and the second pattern 213 may be set to be 1.5 mm or more. That is, in the region where the distance between the first pattern 211 and the second pattern 213 is 5 mm or more, the second electromagnetic shielding member 210 is extended to the second pattern 213 and provided with the second pattern 213 and 1.5. It may be provided to be spaced apart more than mm.

As described above, in the region where the separation distance between the first pattern 211 and the second pattern 213 is equal to or less than the first separation distance, the separation distance between the second electromagnetic shielding member 210 and the second pattern 213 is the first critical shielding distance. The separation distance between the second electromagnetic wave shielding material 210 and the second pattern 213 is a second threshold in an area where the separation distance between the first pattern 211 and the second pattern 213 is equal to or greater than the second separation distance. By allowing the shielding distance to be greater than or equal to, the second electromagnetic shielding member 210 is extended to the second pattern 213 while extending the second electromagnetic shielding member 210 outward from the wireless charging pattern region to improve the electromagnetic shielding and the wireless power transmission effect. It is possible to prevent the interference in the short-range wireless communication.

Although the present invention has been described in detail with reference to exemplary embodiments above, those skilled in the art to which the present invention pertains can make various modifications without departing from the scope of the present invention with respect to the above-described embodiments. I will understand. Therefore, the scope of the present invention should not be limited to the described embodiments, but should be defined by the claims below and equivalents thereof.

Claims (12)

A printed circuit board on which at least one electronic element is provided; A first adhesive member having one surface bonded to the other surface of the printed circuit board; And One surface includes an electromagnetic shielding material bonded to the other surface of the first adhesive member, The first adhesive member, A metal base member comprising a metal mesh; A first adhesive layer provided on one surface of the metal base member and bonding the metal base member to the other surface of the printed circuit board; And And a second adhesive layer provided on the other surface of the metal base member and adhering the metal base member to the electromagnetic shielding material. The method according to claim 1, The first adhesive member, And shielding the eddy currents generated in the electronic element through the metal mesh. The method according to claim 1, The metal base member, An edge line provided along an edge of the metal base member; A plurality of first mesh lines provided in the first direction and spaced apart from each other inside the edge line; And And a plurality of second mesh lines provided in a second direction different from the first direction and spaced apart from each other and intersecting the plurality of first mesh lines, respectively, inside the edge line. The method according to claim 3, At least one of the border line, the first mesh line, and the second mesh line may be One side and the other side is a planar structure, respectively. The method according to claim 1, The metal base member, At least one plate portion in the planar region; And Connected to the plate portion, comprising a mesh portion made of a metal mesh, laminated structure. The method according to claim 1, In the metal base member, the area of the plate portion is provided smaller than the area of the mesh portion, laminated structure. The method according to claim 1, The laminated structure, And a second adhesive member adhered to the other surface of the electromagnetic shielding member and comprising a metal mesh. An adhesive member that is directly or indirectly adhered to an appliance provided with an electronic element, A metal base member including a metal mesh and shielding an eddy current generated in the electronic element; And And an adhesive layer provided on at least one of one surface and the other surface of the metal base member. The method according to claim 8, The metal base member, An edge line provided along an edge of the metal base member; A plurality of first mesh lines provided in the first direction and spaced apart from each other inside the edge line; And And a plurality of second mesh lines provided in a second direction different from the first direction and spaced apart from each other and intersecting the plurality of first mesh lines, respectively, inside the edge line. The method according to claim 8, The metal base member, At least one plate portion in the planar region; And An adhesive member connected to the plate portion and including a mesh portion formed in the form of a metal mesh. The method according to claim 10, In the metal base member, the area of the plate portion is provided smaller than the area of the mesh portion, the adhesive member. A mobile terminal in which the laminated structure according to any one of claims 1 to 7 is embedded.

Images