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WO2016039079A1 - Film stratifié fonctionnel, et procédé de fabrication de celui-ci - Google Patents

Film stratifié fonctionnel, et procédé de fabrication de celui-ci Download PDF

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Publication number
WO2016039079A1
WO2016039079A1 PCT/JP2015/073044 JP2015073044W WO2016039079A1 WO 2016039079 A1 WO2016039079 A1 WO 2016039079A1 JP 2015073044 W JP2015073044 W JP 2015073044W WO 2016039079 A1 WO2016039079 A1 WO 2016039079A1
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WIPO (PCT)
Prior art keywords
film
layer
functional
laminate
gas barrier
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Ceased
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English (en)
Japanese (ja)
Inventor
英二郎 岩瀬
内海　京久
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Fujifilm Corp
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Fujifilm Corp
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Priority to JP2016547793A priority Critical patent/JP6316971B2/ja
Publication of WO2016039079A1 publication Critical patent/WO2016039079A1/fr
Anticipated expiration legal-status Critical
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B1/00—Layered products having a non-planar shape
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
    • C23C16/42—Silicides
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/08—Oxides

Definitions

  • the present invention relates to a functional laminate film and a method of producing a functional laminate film.
  • LCDs Liquid crystal display devices
  • LCDs consume less power, and their use is expanding year by year as a space-saving image display device. Further, in liquid crystal display devices in recent years, further power saving, color reproducibility improvement and the like are required as LCD performance improvement.
  • a quantum dot is a state of electrons whose movement direction is restricted in all three dimensions, and when semiconductor nanoparticles are three-dimensionally surrounded by a high potential barrier, these nanoparticles It becomes a dot.
  • Quantum dots exhibit various quantum effects. For example, the “quantum size effect” occurs in which the density of states (energy levels) of electrons is discretized. According to this quantum size effect, it is possible to control the light absorption wavelength and the light emission wavelength by changing the size of the quantum dot.
  • quantum dots are dispersed in a resin or the like and, for example, are disposed and used as a quantum dot film for wavelength conversion between a backlight and a liquid crystal panel.
  • excitation light enters the film containing quantum dots from the backlight, the quantum dots are excited to emit fluorescence.
  • white light can be embodied by emitting light with a narrow half-width of red light, green light, and blue light. Since the fluorescence due to the quantum dot has a narrow half width, it is possible to make white light obtained by selecting the wavelength appropriately high brightness or to be designed to be excellent in color reproducibility.
  • quantum dots are easily degraded by moisture and oxygen, and there is a problem that the light emission intensity is reduced by the photooxidation reaction. Therefore, a gas barrier film is laminated
  • a gas barrier film is laminated
  • a gas barrier film is laminated
  • a quantum dot layer only protecting both main surfaces of the quantum dot layer with the gas barrier film causes a problem that moisture and oxygen infiltrate from the end face not protected by the gas barrier film and the quantum dots are degraded. Therefore, it has been proposed to
  • Patent Document 1 describes a composition in which a quantum dot phosphor is dispersed in a silicon-containing olefin (co) polymer at a concentration of 0.01% by mass to 20% by mass, and the quantum dots are dispersed.
  • covers the whole surface of the molded resin body is described. Further, it is described that the gas barrier layer is a gas barrier film in which a silica film or an alumina film is formed on at least one surface of a resin layer.
  • Patent Document 2 describes a display backlight unit provided with a remote phosphor film including a light emitting quantum dot (QD) group, and sandwiching the QD phosphor material between two gas barrier films, the QD phosphor material being The structure which has the inactive area
  • QD quantum dot
  • a film including quantum dots used for LCD is a thin film of about 50 ⁇ m to 350 ⁇ m. It is very difficult to coat the entire surface of a thin quantum dot layer with a gas barrier film, and there is a problem that productivity is poor. Moreover, when a gas barrier film is bend
  • the resin layer and the protective layer are formed by so-called damfill method, for example. That is, after forming a protective layer on the periphery of one gas barrier film, a resin layer is formed in the area surrounded by the protective layer, and then the other gas barrier film is laminated on the protective layer and the resin layer It is conceivable to produce a film containing quantum dots.
  • the light incident on the quantum dot layer may leak from the end face to reduce the light utilization efficiency.
  • the gas barrier film is laminated on both sides of the quantum dot layer, light reflected at the interface between the quantum dot layer and the gas barrier film is increased. After several times in the layer, the risk of leakage from the end face increases.
  • the object of the present invention is to solve the problems of the prior art as described above, and it is possible to prevent the quantum dots from being deteriorated by moisture and oxygen, and to reduce light leakage from the end face, and roll-to-roll. It is an object of the present invention to provide a highly functional functional laminated film that can be produced by a roll method and a method for producing a functional laminated film.
  • the inventor of the present invention has attached a long protective film formed by laminating a first protective film, a gas barrier film, a functional layer, a gas barrier film and a second protective film in this order.
  • Half-cut process of half-cutting the protective film-attached laminate from the first protective film side to a part of the second protective film while conveying the laminate in the longitudinal direction, and half-cut of the protective film-attached laminate By forming a protective layer forming an end face protective layer made of an inorganic material on the exposed surface, the end face protective layers are easily formed on the four end faces of the functional layer by a roll-to-roll method.
  • the present invention provides a functional laminated film having the following constitution and a method for producing the same.
  • the end face protective layer is formed so that the thickness in the direction perpendicular to the end face of the functional layer laminate gradually increases from one main surface to the other main surface of the functional layer laminate.
  • the functional laminated film as described in (1) or (2) whose inorganic material which comprises an end surface protective layer is a silicon nitride.
  • the end face protective layer capable of preventing quantum dots from being deteriorated by moisture and oxygen and reducing light leakage from the end face can be easily manufactured by a roll-to-roll method. It is possible to provide a functional laminated film having productivity and a method of producing a functional laminated film.
  • FIG. 1 (A) is a cross-sectional view conceptually showing an example of the functional laminated film of the present invention
  • Fig. 1 (B) is a top view of Fig. 1 (A).
  • FIG. 5 (A) is a top view conceptually showing an example of a laminate with a protective film for explaining a half cut process in the manufacturing method of the present invention
  • FIG. 5 (B) is a half cut process.
  • a numerical range represented using “to” means a range including numerical values described before and after “to” as the lower limit value and the upper limit value.
  • Fig. 1 (A) is a cross-sectional view conceptually showing an example of the functional laminate film of the present invention
  • Fig. 1 (B) is a top view of the functional laminate film shown in Fig. 1 (A).
  • a functional laminate film 10a shown in FIGS. 1A and 1B includes a functional layer laminate 11 having two gas barrier films 14 laminated on both main surfaces of the functional layer 12 and the functional layer 12; And an end face protective layer 16 a formed to cover the four end faces of the functional layer stack 11.
  • the functional layer 12 is a layer for expressing a desired function such as wavelength conversion.
  • the functional layer 12 is a quantum dot layer formed by dispersing a large number of quantum dots in a matrix such as a resin, and has a function of converting the wavelength of light incident on the functional layer 12 and emitting it.
  • the functional layer 12 when blue light emitted from a backlight (not shown) is incident on the functional layer 12, the functional layer 12 has a wavelength of at least a part of the blue light as red light or green light due to the effect of quantum dots contained therein. Convert and emit.
  • blue light is light having an emission center wavelength in a wavelength band of 400 nm to 500 nm
  • green light is light having an emission center wavelength in a wavelength band of 500 nm to 600 nm
  • red light Is light having an emission center wavelength in a wavelength band of more than 600 nm and not more than 680 nm.
  • the wavelength conversion function expressed by the quantum dot layer is not limited to the configuration for wavelength converting blue light to red light or green light, and it is possible to convert at least a part of incident light to light of different wavelengths. Just do it.
  • the quantum dot is excited at least by the incident excitation light to emit fluorescence.
  • the type of quantum dot contained in the quantum dot layer is not particularly limited, and various known quantum dots may be appropriately selected according to the required wavelength conversion performance and the like.
  • quantum dots With regard to quantum dots, reference can be made to, for example, JP-A-2012-169271 paragraphs 0060 to 0066, but the present invention is not limited to those described herein.
  • a quantum dot a commercial item can be used without any restriction.
  • the emission wavelength of the quantum dot can usually be adjusted by the composition and size of the particle.
  • the quantum dots are preferably distributed uniformly in the matrix, but may be distributed in the matrix with bias. Further, only one type of quantum dot may be used, or two or more types may be used in combination. When two or more types are used in combination, two or more types of quantum dots having different wavelengths of emitted light may be used.
  • known quantum dots include a quantum dot (A) having an emission center wavelength in a wavelength range of 600 nm to 680 nm, a quantum dot (B) having an emission center wavelength in a wavelength range of 500 nm to 600 nm ), A quantum dot (C) having an emission center wavelength in a wavelength band of 400 nm to 500 nm, the quantum dot (A) is excited by excitation light to emit red light, and the quantum dot (B) is green light The quantum dot (C) emits blue light.
  • White light can be embodied by the green light being emitted and the blue light transmitted through the quantum dot layer.
  • White light can be embodied by the green light emitted by the light emitting diode and the blue light emitted by the quantum dot (C).
  • quantum rod having a rod-like shape and having directivity and emitting polarized light may be used.
  • the type of matrix of the quantum dot layer there is no particular limitation on the type of matrix of the quantum dot layer, and various resins used in known quantum dot layers can be used.
  • polyester resins for example, polyethylene terephthalate, polyethylene naphthalate
  • (meth) acrylic resins for example, polyvinyl chloride resins, polyvinylidene chloride resins and the like can be mentioned.
  • a curable compound having a polymerizable group can be used as a matrix.
  • the type of the polymerizable group is not particularly limited, but is preferably a (meth) acrylate group, a vinyl group or an epoxy group, more preferably a (meth) acrylate group, and still more preferably an acrylate group.
  • the respective polymerizable groups may be the same or different.
  • a resin containing the following first polymerizable compound and second polymerizable compound can be used as a matrix.
  • the first polymerizable compound is one or more selected from the group consisting of a bifunctional or higher functional (meth) acrylate monomer, and a monomer having two or more functional groups selected from the group consisting of an epoxy group and an oxetanyl group.
  • a compound Preferably it is a compound.
  • examples of the difunctional (meth) acrylate monomer include neopentyl glycol di (meth) acrylate, 1,9-nonanediol di (meth) acrylate, tripropylene glycol di (meth) acrylate ) Acrylate, ethylene glycol di (meth) acrylate, tetraethylene glycol di (meth) acrylate, neopentyl glycol di (meth) acrylate hydroxypivalate, polyethylene glycol di (meth) acrylate, dicyclopentenyl (meth) acrylate, dicyclo Pentenyloxyethyl (meth) acrylate, dicyclopentanyl di (meth) acrylate and the like are mentioned as preferable examples.
  • bifunctional or higher functional (meth) acrylate monomers as the trifunctional or higher functional (meth) acrylate monomers, ECH modified glycerol tri (meth) acrylate, EO modified glycerol tri (meth) acrylate, PO modified glycerol tri (meth) ) Acrylate, pentaerythritol triacrylate, pentaerythritol tetraacrylate, EO modified phosphate triacrylate, trimethylolpropane tri (meth) acrylate, caprolactone modified trimethylolpropane tri (meth) acrylate, EO modified trimethylolpropane tri (meth) acrylate PO-modified trimethylolpropane tri (meth) acrylate, tris (acryloxyethyl) isocyanurate, dipentaerythritol hexa (meth) a Lilate, dipentaerythritol penta (meth) a Li
  • Examples of the monomer having two or more functional groups selected from the group consisting of an epoxy group and an oxetanyl group include aliphatic cyclic epoxy compounds, bisphenol A diglycidyl ether, bisphenol F diglycidyl ether, bisphenol S diglycidyl ether, bromine Brominated bisphenol A diglycidyl ether, brominated bisphenol F diglycidyl ether, brominated bisphenol S diglycidyl ether, hydrogenated bisphenol A diglycidyl ether, hydrogenated bisphenol F diglycidyl ether, hydrogenated bisphenol S diglycidyl ether, 1,4 -Butanediol diglycidyl ether, 1,6-hexanediol diglycidyl ether, glycerin triglycidyl ether, trimethylolpropane triglycidyl ether Polyethylene glycol diglycidyl ether, polypropylene glycol diglycidyl ether; poly
  • the monomer having two or more functional groups selected from the group consisting of an epoxy group and an oxetanyl group may be produced by any method, for example, Maruzen KK Publishing, Fourth Edition Experimental Chemistry Lecture 20 Organic Synthesis II, 213 ⁇ , 1992 Ed. By Alfred Hasfner, The chemistry of heterocyclic compounds-Small Ring Heterocycles part 3 Oxiranes, John & Wiley and Sons, An Interscience Publication, New York, 1985, Yoshimura, Bonding, Vol. 29, No. 12, 32, 1985, Yoshimura, Bonding, Volume 30, No. 5, 42, 1986, Yoshimura, Bonding, Volume 30, No. 7, 42, 1986, JP-A-11-100378, Patent No. 2906245, Patent No. 2926262, etc. Can be synthesized.
  • the second polymerizable compound has a functional group having hydrogen bonding property in the molecule, and has a polymerizable group capable of polymerizing reaction with the first polymerizable compound.
  • a functional group which has hydrogen bondability a urethane group, a urea group, or a hydroxyl group etc. are mentioned.
  • the polymerizable group capable of polymerizing reaction with the first polymerizable compound for example, when the first polymerizable compound is a bifunctional or more (meth) acrylate monomer, it may be a (meth) acryloyl group, and When the polymerizable compound is a monomer having two or more functional groups selected from the group consisting of an epoxy group and an oxetanyl group, it may be an epoxy group or an oxetanyl group.
  • diisocyanates such as TDI, MDI, HDI, IPDI, HMDI, etc. and poly (propylene oxide) diol, poly (tetramethylene oxide) diol, ethoxylated bisphenol A, ethoxylated bisphenol Reaction of S spiro glycol, caprolactone modified diol, polyol such as carbonate diol, and hydroxy acrylate such as 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, glycidol di (meth) acrylate, pentaerythritol triacrylate Monomers and oligomers obtained by the reaction, as described in JP-A-2002-265650, JP-A-2002-355936, and JP-A-2002-06723.
  • diisocyanates such as TDI, MDI, HDI, IPDI, HMDI, etc. and poly (propylene oxide) diol, poly (t
  • polyfunctional urethane monomers described in JP-like it can be mentioned polyfunctional urethane monomers described in JP-like. Specifically, adducts of TDI and hydroxyethyl acrylate, adducts of IPDI and hydroxyethyl acrylate, adducts of HDI and pentaerythritol triacrylate (PETA), and adducts of TDI and PETA remained.
  • Compounds obtained by reacting isocyanate and dodecyloxyhydroxypropyl acrylate, adducts of 6,6 nylon and TDI, adducts of pentaerythritol, TDI and hydroxyethyl acrylate, and the like can be mentioned, but are not limited thereto. Absent.
  • the (meth) acrylate monomer containing a urethane group examples include AH-600, AT-600, UA-306H, UA-306T, UA-306I, UA-510H, manufactured by Kyoeisha Chemical Co., Ltd. UF-8001G, DAUA-167, UA-160TM manufactured by Shin-Nakamura Chemical Co., Ltd., UV-4108F manufactured by Osaka Organic Chemical Industry Co., Ltd., UV-4117F, etc. may be mentioned. These can be used singly or in combination of two or more.
  • the compound synthesize combined by reaction of the compound which has an epoxy group, and (meth) acrylic acid can be mentioned.
  • Representative ones are classified into bisphenol A type, bisphenol S type, bisphenol F type, epoxidized oil type, phenol novolak type and alicyclic type according to the compound having an epoxy group.
  • (meth) acrylate obtained by reacting (meth) acrylic acid with an adduct of bisphenol A and epichlorohydrin, and epichlorohydrin with phenol novolak reacted with (meth) acrylic acid (Meth) acrylate, (meth) acrylate obtained by reacting (meth) acrylic acid with an adduct of bisphenol S and epichlorohydrin, and (meth) acrylic acid with an adduct of bisphenol S and epichlorohydrin ( Mention may be made of (meth) acrylates, (meth) acrylates obtained by reacting (meth) acrylic acid with epoxidized soybean oil, and the like.
  • (meth) acrylate monomer containing a hydroxyl group although the (meth) acrylate monomer etc. which have a carboxy group or a phosphoric acid group at the terminal can be mentioned, it is not limited to these.
  • the second polymerizable compound containing a hydroxyl group examples include epoxy esters manufactured by Kyoeisha Chemical Co., Ltd., M-600A, 40 EM, 70 PA, 200 PA, 80 MFA, 300 M, 3002 A, 3000 MK, 3000 A, 4-hydroxybutyl acrylate manufactured by Nippon Kasei Co., Ltd., monofunctional acrylate A-SA manufactured by Shin-Nakamura Chemical Co., Ltd., monofunctional methacrylate SA, monofunctional acrylate ⁇ -carboxyethyl acrylate manufactured by Daicel Ornex Co., Ltd. And JPA-514 manufactured by Johoku Chemical Industry Co., Ltd. These can be used singly or in combination of two or more.
  • the mass ratio of the first polymerizable compound to the second polymerizable compound may be 10:90 to 99: 1, preferably 10:90 to 90:10. It is also preferable that the content of the first polymerizable compound is larger than the content of the second polymerizable compound, specifically, (content of the first polymerizable compound) / (second polymerizable compound) The content is preferably 2 to 10.
  • the matrix further contains a monofunctional (meth) acrylate monomer.
  • a monofunctional (meth) acrylate monomer acrylic acid and methacrylic acid, derivatives thereof, more specifically, monomers having one polymerizable unsaturated bond ((meth) acryloyl group) of (meth) acrylic acid in the molecule Can be mentioned.
  • the compound is mentioned to the following as those specific examples, this invention is not limited to this.
  • the monofunctional (meth) acrylate monomer is preferably contained in an amount of 1 to 300 parts by mass, preferably 50 to 150 parts by mass, per 100 parts by mass of the total mass of the first polymerizable compound and the second polymerizable compound. More preferably, it is included.
  • the first polymerizable compound, the second polymerizable compound, and the monofunctional (meth) acrylate monomer have a long-chain alkyl group having 4 to 30 carbon atoms.
  • the long chain alkyl group is more preferably a long chain alkyl group having 12 to 22 carbon atoms. This is because the dispersibility of the quantum dot is improved. As the dispersibility of the quantum dots is improved, the amount of light orthogonal to the light conversion layer from the light conversion layer is increased, which is effective to improve the front luminance and the front contrast.
  • the monofunctional (meth) acrylate monomer having a long-chain alkyl group having 4 to 30 carbon atoms include butyl (meth) acrylate, octyl (meth) acrylate, lauryl (meth) acrylate and oleyl (meth) acrylate.
  • lauryl (meth) acrylate, oleyl (meth) acrylate and stearyl (meth) acrylate are particularly preferable.
  • trifluoroethyl (meth) acrylate pentafluoroethyl (meth) acrylate, (perfluorobutyl) ethyl (meth) acrylate, perfluorobutyl-hydroxypropyl (meth) acrylate, (perfluoro (perfluoro)
  • a compound having a fluorine atom such as hexyl) ethyl (meth) acrylate, octafluoropentyl (meth) acrylate, perfluorooctylethyl (meth) acrylate, tetrafluoropropyl (meth) acrylate and the like may be included.
  • the total amount of resin to be a matrix in the quantum dot layer is not particularly limited, but it is preferably 90 to 99.9 parts by mass, and 92 to 99 parts by mass with respect to 100 parts by mass of the quantum dot layer. It is more preferable that it is a part.
  • the thickness of the quantum dot layer is not particularly limited, but is preferably 5 to 200 ⁇ m, and more preferably 10 to 150 ⁇ m in terms of handleability and light emission characteristics.
  • the thickness is intended to be an average thickness, and the average thickness is obtained by measuring the thickness of 10 or more arbitrary points of the quantum dot layer and arithmetically averaging them.
  • a quantum dot layer there is no limitation in particular in the formation method of a quantum dot layer, What is necessary is just to form by a well-known method. For example, it can be formed by preparing a coating composition in which quantum dots, a resin serving as a matrix, and a solvent are mixed, and coating the coating composition on the gas barrier film 14 and curing. In addition, you may add a polymerization initiator, a silane coupling agent, etc. to the coating composition used as a quantum dot layer as needed.
  • the gas barrier film 14 is a film having gas barrier properties, which is laminated on the main surface of the functional layer 12. That is, the gas barrier film 14 is a member for covering the main surface of the functional layer 12 and suppressing the infiltration of moisture and oxygen from the main surface of the functional layer 12.
  • the gas barrier film 14 preferably has a water vapor transmission rate of 1 ⁇ 10 ⁇ 3 [g / (m 2 ⁇ day)] or less. Further, the gas barrier film 14 preferably has an oxygen permeability of 1 ⁇ 10 ⁇ 2 [cc / (m 2 ⁇ day ⁇ atm)] or less.
  • a gas barrier film 14 having low water vapor permeability and low oxygen permeability that is, high gas barrier properties, it is possible to prevent moisture and oxygen from entering the functional layer 12 and to prevent deterioration of the functional layer 12 more suitably.
  • the water vapor transmission rate was measured by Mocon method.
  • the water vapor transmission rate exceeds the measurement limit of Mocon method, it is measured by the calcium corrosion method (the method described in JP-A-2005-283561).
  • the oxygen permeability was measured under the conditions of a temperature of 40 ° C. and a humidity of 90% RH using a measuring apparatus (manufactured by Nippon AI Co., Ltd.) by an APIMS method (atmospheric pressure ionization mass spectrometry).
  • the thickness of the gas barrier film 14 is preferably 5 ⁇ m to 100 ⁇ m, more preferably 10 ⁇ m to 70 ⁇ m, and particularly preferably 15 ⁇ m to 55 ⁇ m.
  • the material for forming the end face protective layer 16 is It is preferable in that it enters the back side of the small-opened cutting portion v and enables the end face protective layer 16 to be easily formed.
  • the gas barrier film 14 one having at least one organic layer and at least one inorganic layer as the gas barrier layer 22 on the gas barrier support 20 is suitably used.
  • FIG. 2 sectional drawing which represents an example of a gas barrier film notionally is shown.
  • the gas barrier film 14 shown in FIG. 2 has a gas barrier layer 22 having an inorganic layer 26 and an organic layer 24 and a gas barrier support 20 for supporting the gas barrier layer 22.
  • the gas barrier film 14 only needs to have at least one inorganic layer 26 on the gas barrier support 20, and one combination of the inorganic layer 26 and the organic layer 24 serving as the base of the inorganic layer 26 is required. It is preferable to have the above. Therefore, the gas barrier film 14 may have two combinations of the inorganic layer 26 and the organic layer 24 of the base, or may have three or more.
  • the organic layer 24 acts as a base layer for properly forming the inorganic layer 26. The larger the number of combinations of the combination of the base organic layer 24 and the inorganic layer 26, the better the gas barrier properties. A gas barrier film can be obtained.
  • the outermost surface of the gas barrier film 14 is preferably the inorganic layer 26, and the functional layer 12 is preferably laminated on the inorganic layer 26 side.
  • gas barrier support 20 of the gas barrier film 14 various known gas barrier films used as a support can be used.
  • films made of various plastics are suitably used in terms of easy thinning and weight reduction and being suitable for flexibility.
  • polyethylene polyethylene
  • PEN polyethylene naphthalate
  • PA polyethylene terephthalate
  • PVC polyvinyl chloride
  • PVA polyvinyl alcohol
  • PAN polyacritonitrile
  • PI polyimide
  • transparent polyimide polymethyl methacrylate resin
  • PC polycarbonate
  • PP polypropylene
  • PS polystyrene
  • ABS cyclic olefin copolymer
  • COC cycloolefin polymer
  • Plastic films made of COP and triacetyl cellulose
  • the thickness of the gas barrier support 20 may be appropriately set depending on the application and size.
  • the thickness of the gas barrier support 20 is preferably about 10 ⁇ m to 100 ⁇ m.
  • the gas barrier support 20 may be provided with functions such as reflection prevention, retardation control, and light extraction efficiency improvement on the surface of such a plastic film.
  • the gas barrier layer 22 has an inorganic layer 26 mainly exhibiting gas barrier properties, and an organic layer 24 to be a base layer of the inorganic layer 26.
  • the organic layer 24 is to be a base layer of the inorganic layer 26 that mainly exhibits gas barrier properties in the gas barrier film 14.
  • the organic layer 24 various known gas barrier films used as the organic layer 24 can be used.
  • the organic layer 24 is a film containing an organic compound as a main component, and basically, one formed by crosslinking a monomer and / or an oligomer can be used.
  • the gas barrier film 14 also functions as a cushion of the inorganic layer 26 by having the organic layer 24 to be the base. Therefore, when the inorganic layer 26 receives an impact from the outside during a half cut process to be described later, damage to the inorganic layer 26 can be prevented by the cushioning effect of the organic layer 24. Thereby, in the functional laminated film 10a, the gas barrier film 14 appropriately exhibits the gas barrier performance, and the deterioration of the functional layer 12 due to moisture or oxygen can be suitably prevented.
  • the gas barrier film 14 includes the organic layer 24 serving as the base of the inorganic layer 26, thereby embedding the irregularities on the surface of the gas barrier support 20, foreign substances adhering to the surface, etc.
  • the film formation surface can be made appropriate.
  • a high gas barrier performance can be obtained such that the water vapor transmission rate is 1 ⁇ 10 ⁇ 3 [g / (m 2 ⁇ day)] or less.
  • various organic compounds can be used as a material for forming the organic layer 24.
  • polyester acrylic resin, methacrylic resin, methacrylic acid-maleic acid copolymer, polystyrene, transparent fluorine resin, polyimide, fluorinated polyimide, polyamide, polyamide imide, polyether imide, cellulose acylate, polyurethane, poly Thermoplastic resins such as ether ether ketone, polycarbonate, alicyclic polyolefin, polyarylate, polyether sulfone, polysulfone, fluorene ring modified polycarbonate, alicyclic modified polycarbonate, fluorene ring modified polyester, acryloyl compound, etc. or polysiloxane, other
  • a film of an organosilicon compound is preferably exemplified. A plurality of these may be used in combination.
  • the organic layer 24 composed of a radically polymerizable compound and / or a polymer of a cationically polymerizable compound having an ether group as a functional group is preferable in terms of excellent glass transition temperature and strength.
  • a glass transition temperature of 120 ° C. is mainly composed of acrylate and / or methacrylate monomer or oligomer polymer.
  • the above acrylic resin and methacrylic resin are suitably exemplified as the organic layer 24.
  • bifunctional or more, particularly trifunctional or more such as dipropylene glycol di (meth) acrylate (DPGDA), trimethylolpropane tri (meth) acrylate (TMPTA) and dipentaerythritol hexa (meth) acrylate (DPHA).
  • DPGDA dipropylene glycol di (meth) acrylate
  • TMPTA trimethylolpropane tri (meth) acrylate
  • DPHA dipentaerythritol hexa
  • the acrylic resin and methacrylic resin which have as a main component the polymer of the monomer and oligomer of the acrylate and / or the methacrylate of these are illustrated suitably. It is also preferable to use a plurality of these acrylic resins and methacrylic resins.
  • the inorganic layer 26 can be formed on the base having a firm skeleton, so that the inorganic layer 26 can be formed more densely and has high gas barrier properties. .
  • the thickness of the organic layer 24 is preferably 0.5 ⁇ m to 5 ⁇ m.
  • the thickness of the organic layer 24 is preferably 0.5 ⁇ m to 5 ⁇ m.
  • the thickness of the organic layer 24 is more preferably 1 ⁇ m to 5 ⁇ m.
  • each smooth layer may be the same or may be different from each other.
  • the formation material of each organic layer may be same or different. However, in terms of productivity and the like, it is preferable to form all the organic layers of the same material.
  • the organic layer 24 may be formed by a known method such as a coating method or flash evaporation. Further, in order to improve the adhesion to the inorganic layer 26 which is the lower layer of the organic layer 24, the organic layer 24 preferably contains a silane coupling agent.
  • An inorganic layer 26 is formed on the organic layer 24 with the organic layer 24 as a base.
  • the inorganic layer 26 is a film containing an inorganic compound as a main component, and the gas barrier film 14 mainly exhibits gas barrier properties.
  • inorganic layer 26 various films made of inorganic compounds such as oxides, nitrides, oxynitrides and the like that exhibit gas barrier properties can be used.
  • metal oxides such as aluminum oxide, magnesium oxide, tantalum oxide, zirconium oxide, titanium oxide, indium tin oxide (ITO); metal nitrides such as aluminum nitride; metal carbides such as aluminum carbide; silicon oxide, Silicon oxides such as silicon oxynitride, silicon oxycarbide, silicon oxynitride carbide; silicon nitrides such as silicon nitride and silicon carbonitride; silicon carbides such as silicon carbide; hydrides of these; mixtures of two or more of these; Films made of inorganic compounds such as these hydrogen-containing substances are preferably exemplified.
  • films made of silicon oxides, silicon nitrides, silicon oxynitrides and silicon compounds such as silicon oxides are suitably exemplified in that they have high transparency and can exhibit excellent gas barrier properties.
  • a film made of silicon nitride has high transparency in addition to more excellent gas barrier properties, and is preferably exemplified.
  • the materials for forming the inorganic layers 26 may be different from each other. However, in consideration of productivity and the like, it is preferable to form all the inorganic layers 26 with the same material.
  • the thickness of the inorganic layer 26 may be appropriately determined according to the material to be formed, so as to express the desired gas barrier properties. According to the study of the present inventor, the thickness of the inorganic layer 26 is preferably 10 to 200 nm. By setting the thickness of the inorganic layer 26 to 10 nm or more, the inorganic layer 26 that stably exhibits sufficient gas barrier performance can be formed. In addition, the inorganic layer 26 is generally brittle, and if it is too thick, there is a possibility that cracking, cracks, peeling, etc. may occur. However, when the thickness of the inorganic layer 26 is 200 nm or less, cracking may occur. It can prevent.
  • the thickness of the inorganic layer 26 is preferably 10 nm to 100 nm, and particularly preferably 15 nm to 75 nm. In the case where the gas barrier film has a plurality of inorganic layers 26, the thickness of each inorganic layer 26 may be the same or different.
  • the inorganic layer 26 may be formed by a known method according to the forming material. Specifically, vapor deposition methods such as plasma CVD such as CCP-CVD and ICP-CVD, sputtering such as magnetron sputtering and reactive sputtering, and vacuum deposition are suitably exemplified.
  • plasma CVD such as CCP-CVD and ICP-CVD
  • sputtering such as magnetron sputtering and reactive sputtering
  • vacuum deposition are suitably exemplified.
  • the end face protective layer 16 a is a member formed so as to cover four end faces of the functional layer laminate 11 having the functional layer 12 and two gas barrier films 14 stacked so as to sandwich the functional layer 12.
  • the end face protective layer 16 a is a member made of an inorganic material and exhibiting gas barrier properties, and is a member for suppressing the infiltration of moisture and oxygen from the end face of the functional layer 12.
  • the end face protective layer 16 a preferably has a water vapor transmission rate of 1 ⁇ 10 ⁇ 1 [g / (m 2 ⁇ day)] or less.
  • a low water vapor transmission rate ie, high gas barrier property
  • the thickness of the end face protective layer 16 a in the direction perpendicular to the end face of the functional layer stack 11 is from the one main surface side of the functional layer stack 11 to the other main surface It is formed to become thicker gradually as it goes to the side.
  • the end face protective layer 16a is formed by the method for producing a functional laminate film of the present invention described later, the end face protective layer 16a is formed with an inclined thickness in the direction perpendicular to the end face of the functional layer laminate 11 as shown in the example. Ru. This point will be described in detail later.
  • the thickness in the direction perpendicular to the end face of the functional layer laminate 11 in the end face protective layer 16a is formed to be inclined, when forming the end face protective layer 16a, it is connected with the adjacent inorganic film When the second protective film is peeled off, the end face protective layer 16a can be prevented from peeling off or cracking. Therefore, a high quality functional laminated film can be stably produced.
  • the thickness of the end face protective layer 16a in the direction perpendicular to the end face of the functional layer laminate 11 is preferably in the range of 5 nm to 500 nm, more preferably 10 nm to 200 nm, and 15 nm to 100 nm. Is particularly preferred.
  • the thickness of the end face protective layer 16a is preferably in the range of 5 nm to 500 nm, more preferably 10 nm to 200 nm, and 15 nm to 100 nm. Is particularly preferred.
  • the thickness of the end face protective layer 16a is preferably in the range of 5 nm to 500 nm, more preferably 10 nm to 200 nm, and 15 nm to 100 nm. Is particularly preferred.
  • the thickness of the end face protective layer 16a in the direction perpendicular to the end face of the functional layer stack 11 is from the one main surface side of the functional layer stack 11 to the other main surface side.
  • the thickness of the end face protective layer 16b is made substantially uniform as in the functional laminated film 10b shown in FIG. 3, although the present invention is not limited thereto. It is also good.
  • the end face protective layer 16a is formed to cover the entire end face of the four end faces of the functional layer stack 11, but the invention is not limited thereto. It may be a configuration formed on at least one of the end faces.
  • the functional laminated film 10a has a rectangular shape, and the end face protective layers 16a are formed on the four end faces, but the functional laminated film of the present invention is limited to the rectangular shape. Therefore, the end face protective layer may be formed so as to cover at least one of the end faces, and preferably formed so as to cover the entire circumference.
  • the end face protective layer 16a As a forming material of the end face protective layer 16a, various films made of inorganic compounds such as oxides, nitrides, oxynitrides and the like which exhibit gas barrier properties similar to the inorganic layer 26 can be used.
  • films made of silicon compounds such as silicon oxides, silicon nitrides, silicon oxynitrides and silicon oxides are suitably exemplified in that they can exhibit excellent gas barrier properties and have a high refractive index.
  • a film made of silicon nitride has a high refractive index in addition to a more excellent gas barrier property, and is preferably exemplified.
  • the functional laminate film 10a shown in FIG. 1 has three layers of the gas barrier film 14, the functional layer 12, and the gas barrier film 14, and the end face protective layer 16a is disposed on the end face, but the present invention Is not limited to this, and may have other layers. For example, it may have a hard coat layer, an optical compensation layer, a transparent conductive layer, and the like.
  • the production method of the present invention is A preparing step of preparing a long protective film provided laminate formed by laminating a first protective film, a gas barrier film, a functional layer, a gas barrier film and a second protective film in this order; A half-cut step of half-cutting the laminate with protective film from the first protective film side to a part of the second protective film while conveying the long laminate with the protective film in the longitudinal direction; A protective layer forming step of forming an end face protective layer made of an inorganic material on the half-cut and exposed surface of the laminate with protective film while conveying the half-cut laminate with protective film in the longitudinal direction; It is a manufacturing method of a functional lamination film which has ,.
  • the protective film provided laminate 30a is formed by laminating a second protective film 32b, a gas barrier film 14, a functional layer 12, a gas barrier film 14 and a first protective film 32a in this order. It is a long member.
  • the functional layer 12 and the two gas barrier films 14 constitute the functional layer laminate 11 in the functional laminate film 10a described above.
  • the first protective film 32 a and the second protective film 32 b are members for supporting a laminate of the functional layer 12 and the gas barrier film 14 when performing a half cut process and a protective layer forming process described later. It is laminated on one gas barrier film 14 and the other gas barrier film 14 respectively.
  • the first protective film 32a and the second protective film 32b have the same structure except that the arrangement position is different. Therefore, in the following description, the first protective film 32a and the second protective film 32b are used. When it is not necessary to distinguish between the two members, the two members are collectively referred to as a protective film 32.
  • the protective film 32 is peeled off from the functional laminated film 10 produced after the half cut process and protective layer formation process which are mentioned later. Therefore, as the protective film 32, a film-like member exhibiting appropriate adhesiveness with the gas barrier film 14, that is, a so-called release film can be used.
  • the protective film 32 is not particularly limited, and various known release films can be used.
  • the protective film 32 is made of polyethylene (PE), polyethylene naphthalate (PEN), polyamide (PA), polyethylene terephthalate (PET), polyvinyl chloride (PVC), polyvinyl alcohol (PVA), polyacritonitrile ( PAN), polyimide (PI), transparent polyimide, polymethyl methacrylate resin (PMMA), polycarbonate (PC), polyacrylate, polymethacrylate, polypropylene (PP), polystyrene (PS), ABS, cyclic olefin copolymer (COC)
  • COP cycloolefin polymer
  • TAC triacetyl cellulose
  • the protective film 32 may be configured to have a release layer on the surface of a substrate made of a resin film.
  • a release layer By forming a release layer on the surface of the base material, the adhesive strength with the gas barrier film 14 can be adjusted to an appropriate level of adhesiveness that allows peeling.
  • silicone resin, fluorine resin, polyethylene vinyl acetate, etc. can be used as a material for the release layer.
  • the thickness of the protective film 32 is not particularly limited. However, even after half cutting in a half cutting process described later, the half cutting is performed to leave a part of the second protective film 32 b and remain integrated.
  • the thickness of the end face can be easily adjusted, and when the end face protective layer 16 is formed on the half-cut cut surface 34 in the protective layer forming step, the material for forming the end face protective layer 16 is a small opening
  • the second protective film 32b preferably has a thickness of 5 ⁇ m to 100 ⁇ m, more preferably 10 ⁇ m to 70 ⁇ m, and 15 ⁇ m, because the second protective film 32b has a thickness of 5 ⁇ m to 100 ⁇ m in that the end face protective layer 16 can be easily formed It is preferable to set the thickness to 55 ⁇ m.
  • the thickness of the first protective film 32a is preferably 5 ⁇ m to 100 ⁇ m from the viewpoint of the balance between productivity such as handleability at the time of winding in a roll and ease of bonding, and 10 ⁇ m. It is more preferably 70 ⁇ m, and preferably 15 ⁇ m to 55 ⁇ m.
  • the manufacturing method of the laminated body 30a with a protective film there is no limitation in particular in the manufacturing method of the laminated body 30a with a protective film.
  • a member in which the gas barrier film 14 and the protective film 32 are adhered and laminated is formed, and the functional layer 12 is laminated on the surface of the laminated member on the gas barrier film 14 side or functions on the surface of the gas barrier film 14 After the layer 12 is formed directly, the other laminated member to which the gas barrier film 14 and the protective film 32 are stuck is laminated on the functional layer 12 so that the laminate with protective film 30a can be produced.
  • FIG. 5 (A) is a top view conceptually showing an example of a laminate with a protective film for explaining a half cut process
  • FIG. 5 (B) is a protective film after the half cut process is performed. It is a sectional view showing an example of an attachment layered product notionally.
  • a half cut process is a process of making a cut in the predetermined shape used as the functional laminated film 10a, conveying the elongate laminated body with a protective film 30a to a longitudinal direction.
  • the layered product 30b with a protective film shown in FIG. 5 (A) shows a state of being half-cut into a predetermined shape sequentially while being transported from left to right in the figure.
  • a rectangular position indicated by a solid line indicates a cutting portion v which is half-cut in a frame shape, and is half-cut and conveyed to the downstream side.
  • a rectangular line indicated by a broken line at substantially the center indicates a position where a half cut is performed next and becomes a cutting portion v.
  • the protective film-laminated laminate 30b is further conveyed in the longitudinal direction, and is half-cut at the rectangular position indicated by the alternate long and short dash line in the figure.
  • Each of the portions surrounded by the half-cut cut portions v in this way becomes one functional laminated film 10 through the protective film formation step.
  • the cut portion v of the half-cut laminate 30b with protective film cuts the first protective film 32a, the gas barrier film 14, the functional layer 12, and the gas barrier film 14, Reaches a portion of the protective film 32b of An end face protective layer 16 is formed on the cut surface 34 which has been half-cut and exposed in this manner in a protective layer forming step described later. That is, the cut surface 34 is a surface including the end face of the functional layer laminate 11 in the functional laminate film 10.
  • the half-cutting process while conveying the long protective film-laminated laminate 30 a in the longitudinal direction, cutting is sequentially performed in a predetermined shape to perform half-cutting.
  • the half cutting may be performed while conveying the long protective film-laminated laminate 30 a in the longitudinal direction, or the conveyance and the half cutting may be performed alternately and intermittently.
  • the configuration is such that half cutting is performed for each continuous cutting portion v.
  • the present invention is not limited thereto, and a plurality of cutting portions v may be half cut at once.
  • a cutting method using a cutter such as a Thomson blade type, a die cutter, or a cutting blade
  • a cutting method using laser processing such as a CO 2 laser, a Yag laser, or a helium neon laser
  • the Thomson blade type is suitably used from the viewpoint of the price of equipment and productivity.
  • a cutting method using a laser is suitably used, and in particular, an inexpensive CO 2 laser is suitably used.
  • the cutting portion v can be opened to a larger size, and the end face protective layer 16 can be formed more suitably in the protective layer forming step described later.
  • the thickness at which the second protective film 32b is cut is preferably 5% to 80% of the thickness of the second protective film 32b, and more preferably 10% to 50%.
  • the cut portion v can be opened larger in the protective layer forming step described later, and the end face protective layer 16 is formed on the cut surface 34. It can form more suitably.
  • the cut amount of the second protective film 32b is set to 80% or less of the thickness, it is possible to suppress the second protective film 32b from being cut and separated during transportation or the like.
  • the half cut laminate 30b with a protective film is subjected to a protective layer forming step.
  • the protective layer forming step is a step of forming the end face protective layer 16 on the cut surface 34 which is half-cut and exposed while conveying the protective film provided laminate 30 b in the longitudinal direction.
  • the end face protective layer 16 is a member made of an inorganic material and having gas barrier properties. Therefore, in the protective layer forming step, the end face protective layer 16 may be formed by a known method in accordance with the forming material of the end face protective layer 16 to be formed.
  • vapor deposition methods such as plasma CVD such as CCP-CVD and ICP-CVD, sputtering such as magnetron sputtering and reactive sputtering, and vacuum deposition are suitably exemplified.
  • plasma CVD which is a gas-based film forming method capable of being introduced into the small-opened cutting portion v, is preferable.
  • the film forming apparatus 50 shown in FIG. 6 is basically a roll-to-roll film forming apparatus based on known plasma CVD.
  • the film forming apparatus 50 shown in FIG. 6 forms the end face protective layer 16 by plasma CVD on the cut surface 34 of the protective film with laminate 30 b while conveying the half cut laminate with protective film 30 b in the longitudinal direction.
  • the membrane is used to produce a functional laminated film.
  • the film forming apparatus 50 feeds out the protective film-attached laminate 30b from the laminate roll 36 formed by winding the long protective film-attached laminate 30b in a roll, and conveys it in the longitudinal direction while the end face protective layer 16 Is a device for forming a film by so-called roll-to-roll (roll-to-roll) in which the laminate 30b with a protective film on which the end face protective layer 16 is formed is rolled up.
  • a film forming apparatus 50 shown in FIG. 6 is an apparatus capable of forming a film by CCP (Capacitively Coupled Plasma capacitively coupled plasma) -CVD on the laminate 30b with a protective film, and comprises a vacuum chamber 52 and An unwinding chamber 54, a film forming chamber 58, and a drum 60, which are formed in the vacuum chamber 52, are configured.
  • CCP Capacitively Coupled Plasma capacitively coupled plasma
  • the long protective film-laminated laminate 30b is supplied from the laminate roll 36 of the unwinding chamber 54, and while being wound around the drum 60 and conveyed in the longitudinal direction, the film forming chamber At 58, the film is deposited and then again wound around the winding shaft 64 in the unwinding chamber 54.
  • the drum 60 is a cylindrical member, and rotates in the counterclockwise direction with an axis passing through the center of a circle and perpendicular to the sheet of the drawing as a rotation axis.
  • the drum 60 is transported in the longitudinal direction while being held at a predetermined position by winding around the predetermined region of the peripheral surface with the protective film with a laminated body 30b guided along a predetermined path by a guide roller 63a of an unwinding chamber 54 described later. Then, the sheet is conveyed into the film forming chamber 58 and sent to the guide roller 63 b of the unwinding chamber 54.
  • the drum 60 also functions as a counter electrode of the film forming electrode 66 of the film forming chamber 58 described later. That is, the drum 60 and the film forming electrode 66 constitute an electrode pair. Further, a bias power supply 72 is connected to the drum 60.
  • the bias power supply 72 is a power supply that supplies bias power to the drum 60.
  • the bias power supply 72 is basically a known bias power supply used in various plasma CVD apparatuses.
  • the unwinding chamber 54 is constituted by the inner wall surface 52a of the vacuum chamber 52, the circumferential surface of the drum 60, and partitions 56a and 56b extending from the inner wall surface 52a to the vicinity of the circumferential surface of the drum 60.
  • Such an unwinding chamber 54 includes the above-described winding shaft 64, guide rollers 63a and 63b, a rotating shaft 62, and an evacuation unit 76.
  • the guide rollers 63a and 63b are normal guide rollers for guiding the protective film-laminated laminated body 30b along a predetermined conveyance path.
  • the winding shaft 64 is a winding shaft of a known long object that winds up the film-formed laminate 30b with a protective film.
  • a laminate roll 36 which is a roll of the long laminate 30b with a protective film, is mounted on the rotating shaft 62.
  • the protective film-laminated laminate 30b passes the guide roller 63a, the drum 60, and the guide roller 63b to reach the take-up shaft 64 in a predetermined path. Be passed through.
  • the vacuum evacuation unit 76 is a vacuum pump for reducing the pressure in the unwinding chamber 54 to a predetermined degree of vacuum.
  • the vacuum evacuation unit 76 sets the inside of the unwinding chamber 54 at a pressure that does not affect the pressure of the film forming chamber 58.
  • a film forming chamber 58 is disposed downstream of the unwinding chamber 54 in the transport direction of the protective film-laminated laminate 30 b.
  • the film forming chamber 58 includes an inner wall surface 52a, a circumferential surface of the drum 60, and partition walls 56a and 56b extending from the inner wall surface 52a to the vicinity of the circumferential surface of the drum 60.
  • the film forming chamber 58 is for forming a film on the cut surface 34 of the protective film-attached laminate 30b by CCP (Capacitively Coupled Plasma (capacitively coupled plasma))-CVD.
  • CCP Capacitively Coupled Plasma (capacitively coupled plasma)-CVD.
  • a source gas supply unit 68, a high frequency power supply 70, and an evacuation unit 74 is an evacuation unit 74.
  • the film forming electrode 66 constitutes an electrode pair together with the drum 60 in the film forming apparatus 50 at the time of film formation by CCP-CVD.
  • the film forming electrode 66 is disposed such that the discharge surface, which is one largest surface, faces the circumferential surface of the drum 60.
  • the film formation electrode 66 generates plasma for film formation between the discharge surface thereof and the circumferential surface of the drum 60 forming the electrode pair to form a film formation region.
  • the film forming electrode 66 may be a so-called shower electrode in which a large number of through holes are formed entirely on the discharge surface.
  • the source gas supply unit 68 is a known gas supply unit used in a vacuum film forming apparatus such as a plasma CVD apparatus, and supplies the source gas to the inside of the film forming electrode 66.
  • the source gas supplied by the source gas supply unit 68 may be appropriately selected according to the forming material of the end face protective layer 16 to be formed into a film.
  • the high frequency power supply 70 is a power supply that supplies plasma excitation power to the film forming electrode 66.
  • the high frequency power source 70 all known high frequency power sources used in various plasma CVD apparatuses can be used.
  • the vacuum exhaust unit 74 exhausts the inside of the film forming chamber 58 to maintain a predetermined film forming pressure for forming a gas barrier film by plasma CVD, and is used for a vacuum film forming apparatus. , It is a well-known evacuation means.
  • FIG. 7 shows a partially enlarged cross-sectional view for explaining the state of the protective film-attached laminate wound around the drum.
  • the opening amount of the cut portion v can be increased to make the film formation on the cut surface 34 easier. it can.
  • the cutting portion v shown in FIG. 7 represents the cutting portion v extending in the width direction orthogonal to the transport direction
  • the protective film provided laminate 30b is wound around the drum 60, and an appropriate tension is applied.
  • the opening amount of the cut portion v extending in the transport direction is increased, and the film formation on the cut surface 34 can be made easier.
  • a functional layer such as a quantum dot layer, which is easily deteriorated by moisture or oxygen
  • laminating a gas barrier film on both main surfaces of the functional layer is performed.
  • the entire periphery of the functional layer is protected with a gas barrier film, or gas barrier properties are provided in the region sandwiched by the gas barrier film around the functional layer.
  • the structure which forms a protective layer is proposed.
  • it is very difficult to cover the entire periphery of a thin functional layer of about 50 ⁇ m with a gas barrier film and there is a risk that the barrier layer may be broken and the gas barrier properties may be degraded, and the productivity is poor. .
  • the functional film of the structure which forms a protective layer around a functional layer forms a functional layer in the area
  • the so-called dam fill method is used.
  • dam-fill method in the case of manufacturing by so-called roll-to-roll method in which each layer is formed while conveying a long member in the longitudinal direction, protective layers are formed only on two end faces in the width direction. It is impossible to form a protective layer on all four end faces of the functional layer.
  • after producing by a roll-to-roll method it can not process to a desired size, either. Therefore, there is a problem that the roll-to-roll method can not be easily produced and the productivity is poor.
  • the protective film-laminated laminate 30a was half-cut from the first protective film 32a side to a part of the second protective film 32b, and half-cut and exposed
  • the end face protective layer 16 a can be easily formed on the end face of the functional layer 12 by a roll-to-roll method. Therefore, productivity can be improved. Further, since the end face protective layer 16a can be reliably formed on the end face of the functional layer 12, it is possible to reliably prevent the functional layer 12 from being deteriorated by moisture or oxygen.
  • the end face protective layer 16a is formed on the cut surface 34 while being half-cut, the end face protective layer 16a is formed thin on the back side of the cut part v, that is, on the second protective film 32b side.
  • the opening surface side of the cutting portion v, that is, the first protective film 32a side is formed thick. That is, basically, the end face protective layer 16a of the functional laminate film produced by the production method of the present invention has one thickness in the direction perpendicular to the end face of the functional layer laminate 11 being one main surface of the functional layer laminate 11 It is formed to be gradually thicker as it goes from the side to the other main surface side.
  • the inorganic film adheres to other than the end face such as the surface of the gas barrier film 14 It can prevent that it does.
  • the end face protective layer 16a may be made uniform by adjusting the film forming conditions in the protective layer forming step, the opening of the cutting portion v, or the like, or the end face protective layer formed to be inclined. A process may be performed to make the thickness 16a uniform.
  • so-called roll-to-roll in which a long substrate is transported in the longitudinal direction of the substrate and wound around a drum to form a film.
  • roll-to-roll in which a long substrate is transported in the longitudinal direction of the substrate and wound around a drum to form a film.
  • the present invention is not limited to this configuration, the present invention is not limited to this, and is a roll-to-roll device, in which a plate-like electrode pair disposed facing to each other is provided in a film forming chamber.
  • the long substrate may be transported in the longitudinal direction, and the source gas may be supplied between the substrate and the electrode to form a film.
  • the first protective film 32a and the second protective film 32b are peeled from the protective film provided laminate 30b on which the end face protective layer 16 is formed, and the function as shown in FIG. Laminated film 10 is produced.
  • the half-cut laminate 30b with a protective film is temporarily wound in a roll, and then the protective layer forming step is performed.
  • the present invention is not limited thereto.
  • the half cutting process and the protective layer forming process may be performed continuously in RtoR.
  • the protective film provided laminate 30b having the end face protective layer 16 formed thereon is temporarily wound around the winding shaft 64 in a roll, and then the protective film peeling step is performed.
  • the invention is not limited thereto, and the protective layer forming step and the protective film peeling step may be performed continuously in RtoR.
  • the half cut process, the protective layer forming process, and the protective film peeling process may be performed continuously in RtoR.
  • Example 1 As Example 1, the functional laminated film 10 shown in FIG. 1 was produced.
  • ⁇ Functional laminated film> [Preparation Process of Protective Film-Coated Laminate] (Gas barrier film)
  • a gas barrier film in which the organic layer 24 and the inorganic layer 26 were formed on the gas barrier support 20 was used.
  • the gas barrier support 20 a polyethylene terephthalate film (PET film, Cosmo Shine A4300 manufactured by Toyobo Co., Ltd.) having a thickness of 50 ⁇ m, a width of 1000 mm, and a length of 100 m was used.
  • the protective film 32 was attached in advance to the back surface of the gas barrier support 20, ie, the surface opposite to the surface on which the organic layer 24 and the inorganic layer 26 are formed.
  • a 50 ⁇ m thick CT50 manufactured by Panac Corporation was used as the protective film 32.
  • the organic layer 24 was formed on the surface of the gas barrier support 20.
  • the material of the organic layer 24 was coated on the gas barrier support 20 by a coating method, dried, and then irradiated with ultraviolet rays to perform polymerization, thereby forming a film having a thickness of 1 ⁇ m.
  • a coating solution for forming the organic layer 24 the mass ratio of the polymerizable compound TMPTA (manufactured by Daicel Cytech Co., Ltd.) and the ultraviolet polymerization initiator (manufactured by Lamberti, ESACURE KTO 46) at a weight ratio of 95: 5 It weighed so that it became and these were dissolved in methyl ethyl ketone, and the coating liquid of 15% of solid content concentration was prepared.
  • the prepared polymerizable composition is applied onto the gas barrier support 20 by RtoR using a die coater, passed through a drying zone at 50 ° C. for 3 minutes, and then irradiated with ultraviolet light (total irradiation amount: approximately 600 mJ / cm 2 ) It was UV cured to form an organic layer 24.
  • PE PAC2-30-T, manufactured by San-A Kaken Co., Ltd.
  • PE was attached as a protective film for an organic layer with a pass roll immediately after the formation of the organic layer 24, conveyed, and wound up.
  • a 50 nm thick film is formed on the organic layer 24.
  • the inorganic layer 26 was formed.
  • As source gases silane gas (SiH 4 ), ammonia gas (NH 3 ), nitrogen gas (N 2 ) and hydrogen gas (H 2 ) were used.
  • the amount of gas supplied was 160 sccm for silane gas, 370 sccm for ammonia gas, 240 sccm for nitrogen gas, and 590 sccm for hydrogen gas.
  • the film-forming pressure was 40 Pa. That is, the inorganic layer 26 is a silicon nitride film.
  • the plasma excitation power was 2.5 kW at a frequency of 13.56 MHz.
  • the gas barrier film 14 was produced.
  • the water vapor transmission rate of the manufactured gas barrier film 14 is measured by a Ca corrosion method
  • the water vapor transmission rate at a temperature of 40 ° C. and a humidity of 90% RH is 1 ⁇ 10 ⁇ 4 [g / (m 2 ⁇ day)]
  • the oxygen permeability was measured by APIMS method, and the oxygen permeability at a temperature of 40 ° C. and a humidity of 90% RH was 1 ⁇ 10 ⁇ 3 [cc / (m 2 ⁇ day ⁇ atm)].
  • PE PAC2-30-T, manufactured by San-Ai Kaken Co., Ltd.
  • the protective film for the inorganic layer was peeled off with a RtoR coating device, and then the coating composition was applied on the inorganic layer 26 of the gas barrier film 14 by a coating method.
  • the coating composition of the functional layer 12 the following each component was mixed and the quantum dot dispersion liquid was prepared.
  • Quantum dot A emission maximum: 520 nm
  • Quantum dot B emission maximum: 630 nm
  • Monofunctional methacrylate (lauryl methacrylate) 70 parts by mass
  • Bifunctional acrylate (dipropylene glycol di) Acrylate) 20 parts by mass trifunctional acrylate (trimethylolpropane triacrylate) 10 parts by mass
  • the coating composition was previously stirred for 10 minutes with a dissolver at 150 rpm for about 30 minutes and simultaneously subjected to ultrasonic degassing (the ultrasonic transmitter used is Bransonic 8800 manufactured by Bransonic 8800, and a plastic container is interposed with water) This solution was irradiated with an ultrasonic power of 280 W and a frequency of 40 kH). After that, the coating composition was prepared by carrying out a filtration treatment with a filter (PALL profile II, pore diameter 100 ⁇ m) with a filtration accuracy of 100 ⁇ m. Coating was performed using a die coater.
  • the same gas barrier film 14 with a protective film 32 as described above was laminated with the inorganic layer 26 facing the coating composition side. Thereafter, ultraviolet rays are irradiated (total irradiation amount: approximately 300 mJ / cm 2 ) to perform UV curing, thereby forming the functional layer 12 having a thickness of 70 ⁇ m, and a protective film provided laminate 30a is produced.
  • the Thomson blade is used to make a size of 160 mm ⁇ 90 mm, from the first protective film 32a side to a part of the second protective film 32b.
  • Half cut and die cut The Thomson blade used was a double-edge Thomson blade with a blade angle of 20 °.
  • the half cut amount adjusted the lower limit stop position of the blade edge, and half cut so that the remaining thickness of the half cut position of the second protective film 32b would be 20 ⁇ m.
  • the half-cut laminate 30b with a protective film was wound in a roll and subjected to the protective layer forming step.
  • the end face protective layer 16a was formed into a film on the half-cut laminated body 30b with a protective film using the film-forming apparatus as shown in FIG. As the end face protective layer 16a, a silicon nitride film was formed in the same manner as the inorganic layer. After the protective layer forming step, the first protective film 32a and the second protective film 32b were peeled off to obtain a functional laminate film 10a having a size of 160 mm ⁇ 90 mm. The thickness of the end face protective layer 16a was 25 nm to 10 nm and was inclined.
  • Example 2 In the protective layer forming step, a functional laminated film 10a was produced in the same manner as in Example 1 except that an alumina film was formed as an end face protective layer 16a by sputtering. Specifically, the half-cut laminated body with protective film 30b is loaded into a general sputtering apparatus, and an alumina sintered body is used as a target, and the end face protective layer 16a made of an alumina film is formed by DC magnetron sputtering. It formed. The thickness of the end face protective layer 16a was 8 nm to 2 nm.
  • Example 3 A functional laminate film 10a was produced in the same manner as in Example 1 except that the thickness of the gas barrier support 20 was 100 ⁇ m. The thickness of the end face protective layer 16a was 15 nm to 5 nm.
  • Example 4 A functional laminate film 10a was produced in the same manner as in Example 1 except that the thickness of the gas barrier support 20 was 25 ⁇ m. The thickness of the end face protective layer 16a was 35 nm to 20 nm.
  • Example 5 A functional laminate film 10a was produced in the same manner as in Example 1 except that the thickness of the first protective film 32a and the second protective film 32b was 100 ⁇ m. The thickness of the end face protective layer 16a was 12 nm to 5 nm.
  • Example 6 A functional laminate film 10a was produced in the same manner as in Example 1 except that the thickness of the first protective film 32a and the second protective film 32b was 25 ⁇ m. The thickness of the end face protective layer 16a was 35 nm to 20 nm.
  • Comparative Example 1 A functional laminated film was produced in the same manner as in Example 1 except that the protective layer forming step was not performed and the end face protective layer was not formed.
  • the gas barrier property test that is, the durability test was performed on the functional laminated films of Examples 1 to 6 and Comparative Example 1 produced. Specifically, the functional laminate film immediately after preparation and the functional laminate film after standing for 100 hours in an environment of temperature 60 ° C. and humidity 90% RH are incorporated into the following liquid crystal display device, and uneven brightness is obtained. It measured and gas barrier property was evaluated by the change of the luminance nonuniformity before and behind humidification.
  • a commercially available liquid crystal display device (Panasonic product name: THL42D2) is disassembled, a functional laminated film is added on the light guide plate on the side with the liquid crystal cell, and the backlight unit is changed to the following B narrow band backlight unit And manufactured a backlight unit and a liquid crystal display.
  • the B narrow band backlight unit used is provided with a blue light emitting diode (Nichia B-LED: Blue, main wavelength 465 nm, half width 20 nm) as a light source.
  • luminance unevenness was evaluated when the liquid crystal display was displayed in white.
  • the luminance was measured with a luminance meter (SR3, manufactured by TOPCON) installed at a distance of 740 mm at five points at equal intervals except for both ends 50 mm in the diagonal direction on the front of the display device.
  • the difference between the respective luminances measured at 10 points was calculated from the calculated average value, and the maximum value thereof was divided by the average luminance and the value represented as a percentage was regarded as luminance unevenness.
  • the functional laminate film of the present invention has higher gas barrier properties than the comparative example.
  • the end face protective layer when the end face protective layer is formed by plasma CVD, the end face protective layer can be easily formed thicker than when formed by sputtering, and the gas barrier property at the end face is made more It turns out that you can raise it.
  • the thinner the gas barrier support and the protective film the easier the end face protective layer can be formed, and It can be seen that the gas barrier properties can be further enhanced.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Physical Vapour Deposition (AREA)
  • Chemical Vapour Deposition (AREA)

Abstract

L'invention fournit un film stratifié fonctionnel à haute productivité et un procédé de fabrication de celui-ci, lequel film stratifié fonctionnel permet de supprimer la dégradation d'une boîte quantique due à une humidité et à un oxygène, et en outre permet d'atténuer des fuites de lumière provenant de faces extrémité, ce qui permet une manufacture selon une technique de rouleau à rouleau. Le procédé de fabrication de l'invention possède : une étape de demie découpe au cours de laquelle un stratifié allongé avec film protecteur constitué par stratification dans l'ordre d'un premier film protecteur, d'un film barrière aux gaz, d'une couche fonctionnelle, d'un film barrière aux gaz et d'un second film protecteur, est transporté dans une direction longitudinale, et ce stratifié avec film protecteur est soumis à une demie découpe depuis le premier film protecteur jusqu'à une partie du second film protecteur ; et une étape de formation de couche protectrice au cours de laquelle une couche protectrice de faces extrémité constituée d'un matériau inorganique, est formée sur les faces du stratifié avec film protecteur exposées par la demie découpe.
PCT/JP2015/073044 2014-09-12 2015-08-17 Film stratifié fonctionnel, et procédé de fabrication de celui-ci Ceased WO2016039079A1 (fr)

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JP2017538166A (ja) * 2014-12-05 2017-12-21 オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングＯｓｒａｍ Ｏｐｔｏ Ｓｅｍｉｃｏｎｄｕｃｔｏｒｓ ＧｍｂＨ 変換要素、オプトエレクトロニクス半導体部品、および変換要素の製造方法
US20180179643A1 (en) * 2015-06-17 2018-06-28 Fujifilm Corporation Laminated film and method for manufacturing laminated film
CN111512454A (zh) * 2017-12-21 2020-08-07 富士胶片株式会社 波长转换部件、背光单元及液晶显示装置
JPWO2021235024A1 (fr) * 2020-05-21 2021-11-25
JP2023505715A (ja) * 2019-12-12 2023-02-10 メルク パテント ゲゼルシャフト ミット ベシュレンクテル ハフツング 組成物
JP2023070086A (ja) * 2021-11-04 2023-05-18 南亞塑膠工業股▲分▼有限公司 光学フィルム及びその製造方法、並びにバックライトモジュール
JP2023076803A (ja) * 2021-11-23 2023-06-02 南亞塑膠工業股▲分▼有限公司 光学フィルム及びその製造方法、並びにバックライトモジュール
WO2024043127A1 (fr) * 2022-08-25 2024-02-29 大日本印刷株式会社 Feuille de conversion de longueur d'onde, et rétroéclairage et dispositif d'affichage à cristaux liquides l'utilisant
DE112023001442T5 (de) 2022-03-18 2025-01-02 Nichia Corporation Wellenlängenumwandlungselement und verfahren zu seiner herstellung

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WO2013154133A1 (fr) * 2012-04-13 2013-10-17 シャープ株式会社 Corps de diffusion de la lumière, film de corps de diffusion de la lumière, substrat de corps de diffusion de la lumière, dispositif de corps de diffusion de la lumière, dispositif électroluminescent, dispositif d'affichage et dispositif d'éclairage

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Publication number Priority date Publication date Assignee Title
JP2017538166A (ja) * 2014-12-05 2017-12-21 オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングＯｓｒａｍ Ｏｐｔｏ Ｓｅｍｉｃｏｎｄｕｃｔｏｒｓ ＧｍｂＨ 変換要素、オプトエレクトロニクス半導体部品、および変換要素の製造方法
US20180179643A1 (en) * 2015-06-17 2018-06-28 Fujifilm Corporation Laminated film and method for manufacturing laminated film
CN111512454A (zh) * 2017-12-21 2020-08-07 富士胶片株式会社 波长转换部件、背光单元及液晶显示装置
JP2023505715A (ja) * 2019-12-12 2023-02-10 メルク パテント ゲゼルシャフト ミット ベシュレンクテル ハフツング 組成物
JPWO2021235024A1 (fr) * 2020-05-21 2021-11-25
JP7265093B2 (ja) 2020-05-21 2023-04-25 株式会社クレハ 組成物の製造方法
JP2023070086A (ja) * 2021-11-04 2023-05-18 南亞塑膠工業股▲分▼有限公司 光学フィルム及びその製造方法、並びにバックライトモジュール
JP2023076803A (ja) * 2021-11-23 2023-06-02 南亞塑膠工業股▲分▼有限公司 光学フィルム及びその製造方法、並びにバックライトモジュール
DE112023001442T5 (de) 2022-03-18 2025-01-02 Nichia Corporation Wellenlängenumwandlungselement und verfahren zu seiner herstellung
WO2024043127A1 (fr) * 2022-08-25 2024-02-29 大日本印刷株式会社 Feuille de conversion de longueur d'onde, et rétroéclairage et dispositif d'affichage à cristaux liquides l'utilisant

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