WO2016037905A1 - Modular computer system and server module - Google Patents

Abstract

The invention relates to a modular computer system (1) comprising a chassis (2) with a plurality of receiving bays (7) for receiving corresponding function modules (13), in particular server modules (22). The modular computer system (1) comprises at least one cooling device (12) arranged in the interior of the chassis (2) and configured for mutual cooling of function modules (13) arranged in a first receiving bay (7a) and in a second receiving bay (7b), and at least one control device arranged in the chassis (2) for controlling the cooling device (12). The control device is thereby connected at least to a first connection (18) of a first receiving bay (7a) and a second connection (18) of a second receiving bay (7b) and is additionally configured to receive at least one first control value for controlling the cooling device (12) via the first connection (18) and to receive at least one second control value for controlling the cooling device (12) via the second connection (18). From the at least one first and at least one second control value received, the control value is selected which corresponds to a higher cooling output and is used for controlling the cooling device (12). The invention further relates to a server module (22) for use in a modular computer system (1).

Description

description

Modular Computer System and Server Module The invention relates to a modular computer system,

comprising a chassis having a plurality of

Receptacles for receiving corresponding

Function modules, in particular server modules. The invention further relates to a server module for a modular

Computer system and a rack assembly with at least one rack-mounted in the rack housing modular computer system.

As demand for IT services increases worldwide, the demand for computing power continues to grow. It takes apart from the mere provision of

Computing power and the associated space and

Energy needs play an important role. This applies to both relatively small server arrangements, such as those found in IT departments of small and medium-sized enterprises, as well as data centers of large companies or specialized providers of IT services.

In order to be able to expand computing power as required, various approaches to building expandable computer systems are known from the prior art. A relatively straightforward approach is to install server computers in server racks with a standard form factor, typically a 19-inch rack bay, and add server servers as needed to complement other server computers. The individual server computers work relatively independently. In particular, such server computers have individual power supplies and network interfaces on. Such systems are relatively inexpensive, but require a relatively large amount of space and

Administrative burden. An alternative approach is to integrate individual, so-called blade servers into a blade server system. This includes a blade system in addition to the actual blade servers arranged thereon

Processors and main memories a number of

Infrastructure components such as power supplies, network switches, network interfaces, and mass storage devices that each blade server accesses as shared resources. In addition, each blade system typically includes one or more of so-called

Management blades for monitoring, administration and management

Administration of the remaining components is used. Blade server systems allow high computational density, but are relatively expensive. This is among other things on the

Due to the large number of special components needed to build up a functioning blade server system.

In a third approach, which is referred to inter alia as a modular computer system or as a multi-node computer system, a plurality of server modules in one

shared chassis. Because the server modules

Some do not have their own closed housing, they are sometimes referred to as a "skinless" server. Through the chassis, the individual server modules can be connected to a common power supply, cooling and similar simple or standardized components such as hard drives, but the server modules themselves are largely independent server computers. In particular, such modular computer systems do not require a central management instance, as is common, for example, with blade server systems. They allow a high computational density at a relatively low cost of the overall system.

A modular computer system of the type described above is known, for example, from the international application

WO 2013/068250 AI known. The server system disclosed therein comprises at least one located in the chassis

Printed circuit board for contacting in slots

recorded server slots, wherein the circuit board has at least a first microcontroller. The

Server system further includes one in the first

Slot arranged and with the at least one

Board-coupled first server slot, wherein the first server slot has a first system management controller. In this case, the first microcontroller and the first system management controller are coupled to one another via at least one first signal line, and the first microcontroller is configured to provide the system management controller at least one chassis-specific one

Provide configuration value. By the named

In particular, arrangement is enabled to be chassis-specific over a network and system management controller of a single server bay

 To access server system configuration data without the chassis itself having a network interface.

A challenge in such computer systems is the use of information provided via the chassis

 Simplify or improve system components to improve integration of the modular computer system.

At the same time, the structure of the chassis itself or the components are kept as simple as possible in order to limit their price and complexity.

Against this background, the present application describes a modular computer system comprising a chassis with a plurality of receiving wells for receiving

corresponding functional modules, in particular

Server modules, at least one arranged inside the chassis cooling device, for the common cooling of in a first receiving shaft and in a second

Receiving shaft arranged functional modules is arranged, and at least one arranged in the chassis

Control device for controlling the cooling device. The control device is connected to at least a first connection of a first receiving shaft and a second connection of a second receiving shaft and thereto

set, at least a first control value for controlling the cooling device via the first connection and at least one second via the second connection

Receive control value for driving the cooling device, upon receiving at least a first and at least one second control value to select the control value corresponding to a higher cooling capacity, and to use the selected control value for driving the cooling device.

Due to the above-mentioned features, a largely independent control of the cooling device is made possible by a plurality of functional modules accommodated in a common chassis. In this case, the control device of the chassis selects only one of a plurality of requested control values, which corresponds to a relatively higher cooling capacity, so that sufficient cooling is ensured for the functional modules accommodated in the chassis. By the simple Design of the control device can also on the

Provision of redundant components in the chassis of the

modular computer system are largely dispensed with. In at least one embodiment, the controller is via a serial bus system with one in the first

Receiving shaft recorded first functional module and recorded in a second receiving shaft second

Function module connected, wherein the serial bus system is adapted to the simultaneous transmission of the

prevent at least a first control value and the at least one second control value. By using a serial bus system, the number of line connections required to transmit the control values can be kept low. In this case, a mutual interference in the transmission of control values can be prevented by means of the bus.

In at least one embodiment is in the first

Receiving shaft a first server module with a first

System management module arranged and in the second

Receiving shaft arranged a second server module with a second system management block. In this case, the first and the second system management module are configured to provide the at least one first or the at least one second control value via a system management bus to the control device in order to provide a

To regulate cooling device. By providing the

Control values through system management modules from

Server modules can be based on their own hardware component

Control of the cooling device can be omitted. It is advantageous that system management components largely work independently of other software components of a server module and are therefore particularly fail-safe.

According to at least one embodiment, the first

Server module and / or the second server module on a plurality of mutually independent computer nodes, each providing its own control value. According to at least one further embodiment, all the connections for the plurality of receiving wells contained in the chassis are connected to the control device. In both cases, the

 Control device configured to select that control value of all the transferring control values, which corresponds to the highest requested cooling capacity, so that always a sufficient cooling for the computer node with the highest cooling demand is ensured.

According to at least one embodiment, the

 Control device designed as a microcontroller with a plurality of registers, each receiving shaft

at least one register for storing a

corresponding control value is assigned and a

Data processing unit of the microcontroller a

Extreme value of values stored in the plurality of registers for controlling the cooling device. By using a microcontroller with registers associated with the receiving slots, an extreme value of a plurality of individual control values can be detected and selected independently in a simple manner. In at least one embodiment, the microcontroller is configured to monitor an update of registers associated with the receiving slots in a predetermined first period of time and to provide a predetermined control value for to use at least one designated as occupied receiving shaft, if a the receiving shaft assigned

Register has not been updated within the predetermined first period. In particular, insufficient cooling of a function module can be avoided by the measures mentioned, which provides no or no current control value for the cooling device.

According to at least one embodiment, the

Microcontroller has a function for testing the at least one cooling device and a status register for storing a result value. In this case, the microcontroller is set up for a first request of the test function by a recorded in a receiving shaft

Function module to perform the function for testing the least a cooling device and a result of the

Store function for testing in the status register. Upon further request of the test function by a functional module received in a receiving slot within a predetermined second period of time after receipt of the first request, the stored result value is provided for testing without re-calling the function. By caching a result value can on the

repeated execution of functions, in particular of a function for testing the at least one

 Cooling device to be dispensed within such a predetermined period.

According to another aspect of the invention is a

Server module for use in a modular computer system, in particular the above-mentioned computer system described. The server module includes at least one system board for receiving system components, at least one Module connection for electrical contacting of the modular computer system and at least one circuit for determining a control value for controlling a cooling device. In this case, the at least one circuit is set up to provide the control value via the at least one module connection for a cooling device arranged outside the server module.

Such a server module is suitable for use in a chassis without its own complex control electronics for a cooling device.

In at least one embodiment, the server module has at least one system management module, wherein the system management module is configured to determine the control value for controlling a cooling device based on a measured temperature and / or a specific utilization of at least one system component of the server module. By using a system management module, a simple and reliable determination of a control value for cooling the server module can be carried out

In particular, a firmware component stored in a memory module of the server module, for example a firmware component of a BIOS or of a system management module, is suitable for determining the control value.

Further advantageous embodiments are described in the appended claims and the following detailed

Description of an embodiment disclosed.

The invention will now be described with reference to an exemplary modular computer system with reference to FIGS attached figures described in detail. In the figures and the description, individual instances of similar components are distinguished from one another by an alphabetical suffix. If no suffix is specified, all components are referred to. In the figures show:

FIG. 1 is a front perspective view of a chassis of a modular computer system;

Figure 2 is a rear perspective view of the chassis according to

 FIG. 1,

FIG. 3 is a schematic representation of the system structure of the modular computer system.

Figure 4 is a perspective view of different

 Functional units of the modular computer system,

Figure 5 is a schematic representation of different

 Configurations of the modular computer system,

Figure 6 is a schematic representation of the compound of

 Functional modules with components of the chassis,

Figure 7 is a schematic representation of the electrical

 Connection between a microcontroller and

 Coolers,

FIG. 8 is a flowchart of a control method of FIG

 Microcontroller according to Figure 7 and

FIG. 9 is a flowchart of a test method of the

Microcontroller according to FIG. 7. Before discussing the details of the solution according to the invention, the general system structure of a modular computer system according to the exemplary embodiment used will first be described with reference to FIGS. 1 to 5. In the described computer system is a so-called multi-node system in which a plurality of logically largely independently operating server modules are arranged in a common chassis.

FIG. 1 shows a perspective front view of a

Chassis 2 for such a modular computer system 1. In the embodiment, the chassis 2 corresponds to a

Standard format, especially a 19-inch rack format for insertion in a corresponding rack housing. For this purpose, the chassis 2 in the region of a front two

Attachment tabs 3a and 3b, with which the chassis 2 is fixed to vertical hole rails 6 of the otherwise not shown rack housing. To be used for attachment

For example, thumbscrews or other known fasteners. The chassis 2 according to FIG. 1 has a height of two so-called height units of 44.45 millimeters each. Of course, the use of other heights to accommodate larger or other than the components described below is possible.

To the available, from the front of the

To make optimum use of the rack housing out of reachable area, control panels 4a and 4b are arranged on the attachment tabs 3a and 3b, which display different control data or for example

Input of control data. The space available between the operating panels 4a and 4b is used in the

Embodiment for receiving memory slots in a standard format, especially hard disk modules. In the illustrated embodiment can be in the

middle area a total of 24 HDD modules with

Arrange disk drives in the 2, 5-inch format, which are divided into four groups 5a to 5d of memory bays.

The described modular computer system 1 serves to accommodate up to four individual functional modules, in particular

Server modules, in corresponding receiving slots 7a to 7d. The function modules are from one in Figure 2

shown inserted back into the chassis 2. Although the individual receiving wells 7a to 7d are shown separated by dashed lines in Figure 2, it is noted that a physical

 Separation in the chassis 2 is not required. In this way, in particular larger functional modules in

adjacent receiving wells 7a to 7d are recorded, as described below with reference to FIG 5. In a lateral area of the back of the chassis 2 has two more

Receiving shafts 8a and 8b for receiving two

corresponding power supplies on. These too

Receptacles are not physically separate from each other

separated .

Figure 3 shows a schematic plan view of the

System Structure of the Modular Computer System 1. It can be seen that further components are arranged inside the chassis 2 in addition to the aforementioned components. In particular, the chassis 2 comprises a perpendicular to

Insertion direction of functional modules 13 arranged first circuit board 9. The first circuit board 9 is sometimes referred to as midplane, as they are inside a housing is arranged and can be contacted from two sides by other components. About the first circuit board 9, the individual functional modules 13 and other components of the modular computer system 1 are interconnected. For electrical contacting, each of the functional modules 13 has a module connection 17, which can be plugged into a corresponding terminal 18 of the first printed circuit board 9. In addition, the modular computer system 1 in the

 Embodiment four second circuit boards 10a to lOd, each one of the groups 5a to 5d of

Memory slots 14 are assigned. About the second

Printed circuit boards 10a to 10d can be contacted by a group 5 of in each case six memory slots 14, for example via standardized SAS or SATA connectors. The four second circuit boards 10a to 10d are over four

corresponding circuit board connector IIa to lld connected to the first circuit board 9. Both

PCB connectors IIa to lld can themselves be printed circuit boards with corresponding connectors.

Between the first circuit board 9 and the second

Printed circuit boards 10a to 10d are arranged in the exemplary embodiment four cooling devices 12a to 12d. Both

 Cooling devices 12a to 12d are each double ventilator systems, with two axially behind one another

arranged single fans. The cooling devices 12a to 12d suck air from the front through the groups 5a to 5d of

Memory slots 14 and blow them through in the

Receiving shafts 7a to 7d inserted functional modules 13 and power supplies 15 out of the chassis 2 out. Finally, it can be seen in FIG. 3 that the power packs 15 do not extend over the entire depth between the rear side of the chassis 2 and the first printed circuit board 9. For electrical contacting, a connection structure 16 is therefore arranged between the power supply units 15 and the first circuit board 9, which is particularly suitable for the transmission of large currents.

FIG. 4 shows a perspective view of the various system components of the modular computer system 1 without the associated chassis 2.

In the illustration according to FIG. 4, the structure of the connection structure 16 can be seen in detail. In addition to two copper plates 19, the connecting structure 16 of the

Further, a third circuit board 20, the

Control components of the power supplies 15 via a not visible in the figure system management bus with more

System components of the modular computer system 1 connects. In the embodiment, copper bars 21 on the

 Rear side of the circuit board 9 arranged to transmit the over the connection structure 16 of the power supplies

to transmit electric power to the function modules 13 received in the receiving wells 7a to 7d.

The first printed circuit board 9 and the second printed circuit boards 10a to 10d have, in addition to the connections required for the connection of the various functional modules 13 or memory slots 14, openings which allow ventilation of the components installed in the chassis 2.

Furthermore, it can be seen that in the illustrated

Embodiment, the function module 13 as a server module 22nd is designed. In the exemplary embodiment, the server module 22 has a system board concealed in FIG. 4 and two processors 23a and 23b arranged thereon with a total of four allocated memory banks 24. At the back of the server module 22 are various

 Connector, for example, for connecting the server module 22 to a local area network, provided.

FIG. 5 schematically shows different possibilities for equipping the modular computer system 1

 Function Modules 13. In a first configuration 25, each of the receiving bays 7a to 7d has its own one

Function module 13a to 13d, for example, a server module 22 equipped. In a second configuration 26, only two functional modules 13a and 13b, each having a double width, are arranged in respectively two adjacent receiving slots 7a and 7c or 7b and 7d. In a third configuration 27, in each case two functional modules 13a and 13b with a double overall height are arranged in two receiving shafts 7a and 7b or 7c and 7d lying one above the other. This configuration is particularly flexible, for example, because a server module 22 with a single height with an overlying

Add-on module, such as a high-performance computing module with one or more graphics processors, can be combined. Finally, in Figure 5 is a fourth

 Configuration 28 can be seen in the only one

Function module 13 with a double width and twice the height of all receiving shafts 7a to 7d fills. The following is the connection of each

Function modules 13 with other components of the chassis 2 described in detail. It should be noted at this point that the functional modules 13, in particular in the form of Server modules 22, work largely independently. In particular, each of the functional modules 13 is connected to its own, corresponding group 5 of memory modules. Each communicates with the outside world

Function modules 13 own network or other

Communication interface. Accordingly, for

Structure of the individual functional modules 13 largely

Standard components are used. When executed as server modules 22, for example, each of the

Function Modules 13 is a system board

Printed circuit board with components arranged thereon, such as

For example, processors 23 and memory banks 24. A system management usually takes place via a data network and a system management component of the individual

Server modules 22 instead. For the system integration of the

Modular computer system 1 is therefore inter alia a standard-compliant connection of the individual functional modules 13 of importance. Figure 6 shows schematically the connection of four

 Server modules 22a to 22d with the various components of the chassis 2. As can be seen from FIG. 6, each of the server modules 22a to 22d is connected via three bus systems 34, 36 and 45 to the respective other server modules 22a to 22d or to a chassis interface module. Unit 31 connected.

In particular, so-called system management modules 32, also known as "intelligent remote management controllers" (iRMC), the server modules 22 via a first

Interface module 33 with a so-called IPMB bus 34 for communication with neighboring server modules 22nd

connected. Furthermore, the system management blocks 32 via a second interface module 35 and a serial system management bus 36 connected to various components of the chassis interface unit 31.

In particular, the system management bus 36 is used to connect the system management modules 32 to control modules (not shown in FIG. 6) of the power supplies 15, a

 Ambient temperature sensor 37, a so-called chassis FRU memory 39 for storing a chassis identifier, a

capacitor-buffered light path controller 40 for storing and outputting error conditions via so-called "customer soap service" (CSS) light emitting diodes, a first

 Microcontroller 41 for exchanging control data via the control panels 4a and 4b, a second microcontroller 42 for connecting a flash memory 43 and a third

Microcontroller 44 for controlling the cooling devices 12a to 12d. In addition to the system management bus 36 are the

Server modules 22a to 22d also independent of the

System management blocks 32 connected via a further serial bus system 45 with the first microcontroller 41 for connection to the control panels 4a and 4b. Each of the

Control panels 4a and 4b are connected to the first via their own, further serial bus system 47a or 47b

Microcontroller 41 connected.

In the exemplary embodiment, the bus systems 34, 36, 45, 47a and 47b are each designed as serial bus systems. It should be noted that the various serial

Bus systems 34, 36, 45, 47a and 47b only one each

require relatively small number of signal lines of the connected components. Thus, only relatively few lines must be provided on the first circuit board 9, which improves in particular the ventilation and thus cooling of the modular computer system 1. By means of bus-specific methods, parallel accesses by different functional modules 13 to the bus systems 34, 36 and 45 are avoided. In the case of the IPMB bus system 34 and the system management bus 36, the bus masters, such as the system management chips 32, monitor according to the I2C protocol whether bus lines are already being driven by another bus subscriber while they are transmitting data themselves. If such a collision is detected, the recognizing bus user waits for a predetermined period of time before restarting a transaction. In this way it is ensured that only one transaction takes place on the system management bus 36 at a time. For the serial

Bus systems 45, 47a and 47b is the first microcontroller 41 single bus master, so that there are no conflicts.

Finally, it can be seen in FIG. 6 that the two power supplies 15 are connected via a dedicated control circuit 46

connected to each other. The control circuit 46 allows, inter alia, a monitoring of the provided by the power supplies 15 secondary DC supply voltage and a primary AC line voltage independently of the

System management bus 36. Also, the control circuit 46 requires only a few control lines for connection to the power supplies 15. For example, each of the power supplies 15 has a

Control line for signaling a fault of the primary supply voltage, a control line for signaling a stable secondary supply voltage and a third control line for switching on the respective power supply 15 on. The different control lines are through the

Control circuit 46 evaluated by means of a discrete circuit and to the individual server modules 22nd

forwarded or queried by the server modules 22, combined and forwarded to the power supplies 15. With reference to the figures 7 to 9, the control of the cooling devices 12a to 12d of the modular

Computer system 1 described.

In the described embodiment, the fan control is largely dependent on the individual server modules 22 themselves

performed. The combination of the individual

Server modules 22 provided control signals for

actual control of the individual cooling devices 12a to 12d is based on a relatively simple control logic by the third microcontroller 44. As a result, the third microcontroller 44 only one of the individual server modules 22 requested control value

he is also referred to as a so-called satellite controller. Because of the very simple control logic of the

Satellite controller can be omitted on the side of the chassis 2 on the provision of redundant components, without significantly increasing the risk of failure of the cooling required for all components.

As can be seen in FIG. 7, each of the four cooling modules 12a to 12d has two fans 70a and 70b. The

Cooling devices 12a and 12b together form a first cooling group 71a. The cooling devices 12c and 12d together form a second cooling group 71b. The fans 70 of the

Cooling groups 71a and 71b respectively cool two functional modules 13 accommodated one above the other in the receiving wells 7a and 7b or 7c and 7d. In addition, the power supplies 15 each have their own cooling fans which operate independently of the server modules 22 and the third microcontroller 44, respectively. For each of the cooling groups 71a and 71b, the

Microcontroller 44 a separate, pulse width modulated drive signal available. The duty cycle of the pulse width modulated control signal is a relative

Speed based on a maximum speed of the fans 70a and 70b. In the exemplary embodiment, the first fan 70a has a slight effect with the same activation

lower speed than the downstream arranged in the flow direction second fan 70b. Each of the cooling devices 12a to 12d returns three control signals to the microcontroller 44. In addition to a first control signal, the installation of the respective cooling device 12a to 12d in a

indicates corresponding recording of the chassis 2, each of the fans 70a and 70b provides its own speed signal back to the microcontroller 44. By means of the control signals of the

 Microcontroller 44 always monitor the presence and function of the corresponding cooling devices 12a to 12d.

FIG. 8 shows a flow diagram of a control method for the third microcontroller 44.

In a first step S20, a number of a receiving shaft 7 to be considered next is set to the value of the first receiving shaft 7a and a last-used system control value S is deleted. In one

Subsequent step S21 checks whether the associated receiving shaft 7a is occupied by a function module 13. For this purpose, for example, a corresponding

Configuration register of the chassis 2 are queried. If the receiving shaft 7a is not occupied, the control variable n for the number of the next to be considered

Receiving shaft 7 is increased in step S22 and the process continues with the next receiving shaft 7 in step S21. If the currently considered receiving shaft 7 is occupied by a function module 13, one of the respective

Receiving slot 7 associated register value r _n des

Microcontroller 44 read in step S23. The

Register values r _n can be used, for example, by the

System management block 32 of an associated server module 22 are updated via the system management bus 36. In this case, each server module 22 independently updates, that is to say without an explicit request by the microcontroller 44, an assigned register value r _n . The register value r _n provided by the function module 13 indicates a cooling power required for the respective function module 13, for example as a relative value in comparison with a maximum cooling power. In this case, as described with reference to the described in Figure 6 parallel bus access by different functional modules 13.

In a subsequent step S24 checks the

Microcontroller 44, whether the contained in the control register register value r _{n has been} updated within a predetermined period. For example, it can be monitored whether a value r _{n has} ever been written into the corresponding control register via the system management bus 36. Alternatively, a value r _n contained in the control register can also be compared with a buffered value. Does not regularly update the register value r _n instead, the third micro-controller 44 detects a possible fault of the function module 13 and thus used in step S25 instead of contained in the register value a

Default value S _fa n, such as a control value s, which corresponds to 80 or 100% of the maximum cooling capacity. In this way, even in the event of a failure of the controller the individual functional modules 13, such as a crash of a server module 22, always an adequate cooling

ensured. Otherwise, that is when the register value r _{n is} updated in the described period, the value r contained in the register _n is selected in step S26 as the control value s for the associated receiving shaft. 7

In a further step S27, the control value s assigned to the receiving shaft 7 is compared with a current system control value S for the fan control. If the newly selected control value s is greater than the previously used system control value S, the newly selected value s is set as the new system control value S in step S28. Otherwise, the existing system control value S remains unchanged. Subsequently, in step S22, the control variable n is increased for the receiving shaft 7 to be considered.

In step S29, it is checked whether all the receiving bays 7 have been passed through. If not, it will

Procedure in step S21 continued with the next receiving shaft 7. If the last register value r _{n has been} considered, the determined system control value S is used to drive the cooling devices 12 in step S30. Subsequently, the control starts again with step S20.

The control loop shown in FIG. 8 ensures that in each case the highest of one

Function module 13 requested control value s for controlling the cooling devices 12a to 12d is used. In the described embodiment, the fans 70a and 70b of all cooling devices 12a to 12d are controlled with the same system control value S. In a further possible embodiment, the third microcontroller 44 determines for the The first cooling group 71a and the second cooling group 71b each have a separate system control value Si or S2 based on the register values _{rn of} the receiving wells 7a and 7b, and 7c and 7d, respectively.

At the same time, the described control algorithm implements a monitoring of the functional modules 13 with respect to a regular updating of the required register values r _n . The control algorithm described is particularly simple and therefore less susceptible to error. The provision of a second, redundant microcontroller 44 can thus be dispensed with. In addition, each functional module 13, in particular each system management module 32 of each server module 22a to 22d, can determine its own control value s without disturbing neighboring functional modules 13.

In the described embodiment, the

Fan control further on a test function. The call of the test function is asynchronous and independent of other functional modules 13, for example by the

 System management modules 32 of the individual server modules 22. In order to avoid mutually overlapping test runs or to prevent unnecessary test runs, the third microcontroller 44 executes the method illustrated in FIG. 9 with the aid of a flow chart with respect to the test function.

In a first step S31, the microcontroller 44 checks whether a test function of one of the function modules 13 by transmitting a corresponding command via the

System Management Bus 36 was requested. If this is not the case or if another function has been requested, the method illustrated in FIG. 9 ends. If the execution of a test function was requested, it is checked in step S32 whether since the last call

Test a time t has elapsed, which is greater than a predetermined interval T _max between successive test runs. For example, the modular

 Computer system 1 to perform a fan test only once in 24 hours.

If no fan test has yet been carried out or if the last fan test is longer than the time period T _max , a function for testing the fan is activated by the microcontroller 44 in a step S33. For example, the

Fan speed controlled by the microcontroller 44 to one or more target speeds and the self-adjusting actual speed based on the returned

Tacho signals are monitored. The step S33

The test function test () returns a result value e indicating whether or to what degree the given fan speed has been reached. This value e is cached in a result variable.

Subsequently, in a step S34, a timer has become zero since the activation of the last test

reset. In a step S35, the optional

Result value e to the requesting function module 13

returned. Alternatively, the result value e can also be stored only internally or, in particular in the event of a fault, displayed via a corresponding status display of an operating panel of the chassis 2.

On the other hand, in step S32, it was recognized that the last one

Test run has taken place at a time that is less than the predetermined interval T _max , provides the Microcontroller 44 the result value e in optional step S35 without re-performing the fan test back. If the requesting function module 13 expects no result value e, the processing aborts at this point without further action.

The described control algorithm makes it possible to easily avoid a conflict between parallel requirements of the test function by different function modules 13. In addition, on a repeated

Performing fan tests within a predetermined interval T _{max be} waived.

Reference sign list

1 modular computer system

 2 chassis

 3 fastening strap

 4 control panel

 5 group of memory slots

 6 hole rail

 7 receiving slot (for function module)

8 additional receiving slot (for power supply)

9 first circuit board

 10 second circuit board

 11 PCB connectors

 12 cooling device

 13 function module

 14 memory slot

 15 power supply

 16 connection structure

 17 module connection

 18 (corresponding) connection

 19 copper plate

 20 third circuit board

 21 copper rail

 22 server module

 23 processor

 24 memory bank

 25 first configuration

 26 second configuration

 27 third configuration

 28 fourth configuration

 31 chassis interface unit

 32 System Management Module

33 first interface module 34 IPMB bus system

 35 second interface module

36 system management bus

 37 Ambient temperature sensor

39 chassis FRU memory

 40 light path controllers

 41 first microcontroller (for the control panels)

42 second microcontroller (for the flash memory)

43 flash memory

44 third microcontroller (for the

 Coolers)

 45 serial bus system

 46 control circuit

 47 serial bus system

70 fans

 71 cooling group

S20 to S35 process steps

Claims

claims Modular computer system (1) comprising  a chassis (2) having a plurality of receiving slots (7) for receiving corresponding functional modules (13), in particular server modules (22);  at least one cooling device (12) arranged in the interior of the chassis (2) and arranged for the common cooling of functional modules (13) arranged in a first receiving shaft (7a) and in a second receiving shaft (7b); and  at least one in the chassis (2) arranged  Control device for controlling the cooling device (12);  wherein the control device at least with a first terminal (18) of a first receiving shaft (7a) and a second terminal (18) of a second  Receiving shaft (7b) connected and adapted to, via the first terminal (18) at least a first control value for controlling the cooling device (12) and via the second connection (18) at least one second control value for controlling the cooling device (12) to select from the received at least a first and at least a second control value that control value corresponding to a higher cooling capacity, and the selected control value for  To use control of the cooling device (12). Modular computer system (1) according to claim 1, further comprising at least one inside the chassis (2) arranged circuit board (8), wherein the first and second terminal (18) and / or the control device on the circuit board (8) are arranged. - 2 \ Modular computer system (1) according to claim 1 or 2, wherein the control device is connected via a serial bus system to a first functional module (13a) accommodated in the first receiving shaft (7a) and a second functional module (13b) accommodated in the second receiving shaft (7b); and the serial bus system is adapted to the to prevent simultaneous transmission of the at least one first control value and the at least one second control value. Modular computer system (1) according to one of claims 1 to 3, wherein a first server module (22a) having a first system management module (32) is arranged in the first receiving shaft (7a); in the second receiving shaft (7b) a second Server module (22b) with a second system management block (32) is arranged; and the first and the second system management module (32) are set up to transfer the at least one first or the at least one second control value via a System management bus (36) to the control device provide to regulate the cooling device (12). A modular computer system (1) according to claim 4, wherein the first server module (22a) and / or the second server module (22b) comprises a plurality of mutually independent ones Computer node, wherein for each of the independent computer nodes a the respective computer node assigned control value and to the Control device is transmitted, wherein the control device is adapted to those  Control value of all transferred control values  to select the highest cooling capacity. 6. Modular computer system (1) according to one of claims 1 to 5, wherein  each of the receiving wells (7) at least one terminal (18) for electrical contacting of a in the respective receiving shaft (7) received  Function module (13) comprises;  all connections (18) for those in the chassis (2)  included plurality of receiving wells (7) are connected to the control device; and  the control device is adapted to receive control values of function modules (13) arranged in each of the plurality of receiving wells (7) and to select that control value of all transmitted control values which corresponds to the highest cooling power. 7. Modular computer system (1) according to one of claims 1 to 6, wherein the control device as  Pulse width control is configured, wherein the  Control values a speed value and / or a  Duty cycle value include and the control device is configured to, based on the received speed values or duty cycle values  Pulse width modulated control signal for driving a pulse width controlled fan (70) to produce. Modular computer system (1) according to one of claims 1 to 7, in which the control device is designed as a microcontroller (44) with a plurality of registers, wherein at least one register for storing a corresponding control value is associated with each receiving shaft (7) and a data processing unit of the microcontroller (44) is adapted to Extreme value of in the majority of registers stored values for controlling the cooling device (12) to determine. Modular computer system (1) according to claim 8, wherein the microcontroller (44) is adapted to a Update the receiving slots (7) associated register to monitor in a predetermined first period of time and a predetermined control value for at least one marked as occupied To use the receiving shaft (7), if a Recording slot (7) associated register was not updated within the predetermined first period. Modular computer system (1) according to claim 8 or 9, wherein the microcontroller (44) has a function for testing the at least one cooling device (12) and a Status register for storing a result value, wherein the microcontroller (44) thereto is set up, at a first request the Test function by a functional module (13) accommodated in a receiving shaft (7) to carry out the function of testing the at least one cooling device (12) and a result value of the function for testing in the Save status register and another Requesting the test function by one in one Recording slot (7) recorded functional module (13) within a predetermined second period of time after receiving the first request the stored Provide result value without calling the function again. Modular computer system (1) according to one of claims 8 to 10, wherein the microcontroller (44) has a function for monitoring the cooling device (12) and is adapted to detect a fault of the cooling device (12) a predetermined control signal to at least one further component of the modular Computer system (1) to transmit. Server module (22) for use in a modular Computer system (1), in particular the computer system (1) according to one of claims 1 to 11, comprising: at least one system board for receiving System components; at least one module connection (17) for making electrical contact with the modular computer system (1); and at least one circuit for determining a Control value for controlling a cooling device (12); wherein the at least one circuit is adapted to apply the control value over the at least one Module connection (17) for a outside the server module (22) arranged cooling device (12) to provide. Server module (22) according to claim 12, comprising at least one system management module (32), wherein the System management module (32) is adapted to determine the control value for controlling the cooling device (12) based on a measured temperature and / or a specific utilization of at least one system component of the server module (22). 14. server module (22) according to claim 13, wherein the system management block (32) via a  System management bus (36) with the at least one  Module connection (17) is connected and adapted to transmit the control value via the system management bus (36) and cancel a transmission of the control value and detectable restart after a predetermined waiting time in a detection of simultaneous use of the system management bus (36) by another bus subscriber. 15. server module (22) according to any one of claims 12 to 14,  comprising at least one stored in a memory module of the server module (22) firmware component, wherein the firmware component is adapted to based on a measured temperature and / or a specific utilization of at least one system component of  Server module (22) to determine a required for cooling the server module (22) speed value or duty cycle value for a pulse width control for controlling the cooling device (12) as a control value and the determined  Transfer control value to a predetermined receiver within the chassis (2).