[go: up one dir, main page]

WO2016033923A1 - 有机电致发光器件及其制备方法、显示装置 - Google Patents

有机电致发光器件及其制备方法、显示装置 Download PDF

Info

Publication number
WO2016033923A1
WO2016033923A1 PCT/CN2015/070265 CN2015070265W WO2016033923A1 WO 2016033923 A1 WO2016033923 A1 WO 2016033923A1 CN 2015070265 W CN2015070265 W CN 2015070265W WO 2016033923 A1 WO2016033923 A1 WO 2016033923A1
Authority
WO
WIPO (PCT)
Prior art keywords
film
organic
electroluminescent device
inorganic
emitting unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2015/070265
Other languages
English (en)
French (fr)
Inventor
王玉林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BOE Technology Group Co Ltd
Original Assignee
BOE Technology Group Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BOE Technology Group Co Ltd filed Critical BOE Technology Group Co Ltd
Priority to US14/761,881 priority Critical patent/US9985245B2/en
Publication of WO2016033923A1 publication Critical patent/WO2016033923A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00

Definitions

  • the present invention relates to the field of display technologies, and in particular, to an organic electroluminescent device, a method for fabricating the same, and a display device.
  • OLED Organic Light Emitting Device
  • OLED devices have high requirements for packaging.
  • the packaging technology of OLED devices is becoming more and more mature, including traditional glass cover or metal cover plus dry film package, face encap, Frit Encap, thin film encapsulation (TFE, Thin Film Encap) and the like.
  • Thin film packaging technology has outstanding advantages in reducing device weight and thickness, reducing package components, reducing package cost, reducing package edge width, eliminating display dead angles, and improving curl flexibility.
  • FIG. 1 The structure of the prior art OLED after thin film encapsulation is as shown in FIG. 1 , which includes: a substrate 1 , an organic light emitting unit 2 disposed on the substrate 1 , and a pre-package layer 3 overlying the organic light emitting unit 2 ; An organic thin film 5 is deposited on the encapsulation layer 3 to form an organic electroluminescent device.
  • a general organic light emitting unit 2 includes a first electrode 201 and a second electrode 203, and an organic functional layer 202 therebetween, wherein the first electrode 201 and the second electrode 203 are directed to the organic functional layer 202. Holes and electrons are provided for light emission; a buffer layer 204 is provided on the second electrode 203 for protection; and an insulating layer 205 is provided between the first electrode 201 and the organic functional layer 202.
  • the encapsulation layer 3 is deposited at a lower power to reduce damage to the organic light-emitting unit 2 by the deposition process.
  • the organic film 5 is formed by using a fluid organic film and cured (ultraviolet curing). Since the organic film shrinks or swells during the curing process, it causes the pre-package layer 3 to shrink or expand, thereby being organic. Stress is generated on the light-emitting unit 2, and this stress causes damage to the organic light-emitting unit 2.
  • the organic film 5 is also apt to absorb water and oxygen, causing deformation to cause loss, or water oxygen absorbed by the organic film 5 is further transmitted to the organic light-emitting unit 2, reducing the service life of the organic light-emitting unit 2.
  • the object of the present invention is to solve the problem that the organic electroluminescent device in the organic electroluminescent device of the prior art generates stress to cause damage to the organic light-emitting unit, and the organic film easily absorbs water and oxygen to damage or transfer water and oxygen to the organic light-emitting unit to reduce organic
  • the problem of the service life of the light-emitting unit provides an organic electroluminescence device, a preparation method thereof, and a display device.
  • the technical solution adopted to solve the technical problem of the present invention is an organic electroluminescent device comprising a substrate, an organic light emitting unit disposed on the substrate, and a pre-package layer covering the organic light emitting unit; wherein the pre-package layer is disposed on the pre-package layer There is a first inorganic film.
  • At least one film group is sequentially disposed on the first inorganic film, and each film group is formed of an organic film and an inorganic film.
  • the number of the film groups is 2-10.
  • the projected area of the first inorganic film on the substrate is greater than or equal to the projected area of the pre-package layer on the substrate.
  • the inorganic film covers the organic film.
  • the organic film has a thickness of 100 to 2000 nm.
  • the organic film is prepared using any one of parylene, polyurea, and acrylic resin.
  • the inorganic thin film has a thickness of 100 to 500 nm.
  • the inorganic thin film is prepared by using any one of Al 2 O 3 , SiN, SiO 2 , SiNO, TiO 2 , ZrO 2 , ZnO, MgF 2 , and ZnS.
  • the projected area of the pre-package layer on the substrate is larger than the projected area of the organic light-emitting unit on the substrate.
  • the periphery of all the inorganic thin films are superposed on each other, and all the organic thin films are interposed in the inorganic thin film at intervals.
  • the technical solution adopted to solve the technical problem of the present invention is a method for preparing an organic electroluminescent device, comprising:
  • a first inorganic thin film is formed on the pre-package layer.
  • the method for preparing the organic electroluminescent device further comprises: sequentially forming at least one film group on the first inorganic film, each film group comprising an organic film and an inorganic film.
  • the inorganic film covers the organic film.
  • the first inorganic thin film entirely covers the pre-package layer and the organic light-emitting unit, and has a denser molecular structure with respect to the pre-package layer, thereby effectively preventing water and oxygen from being pre-packaged.
  • the layer invades the organic light emitting unit, thereby affecting the service life of the organic light emitting unit.
  • FIG. 1 is a schematic structural view of a prior art organic electroluminescent device after packaging
  • FIG. 2 is a schematic structural view of an organic light emitting unit in an organic electroluminescent device of the prior art
  • FIG. 3 is a schematic structural view of an organic electroluminescent device after being packaged according to Embodiment 1 of the present invention
  • the present embodiment provides an organic electroluminescent device, including: a substrate 1, an organic light emitting unit 2 disposed on the substrate 1, and a pre-package layer 3 covering the organic light emitting unit 2;
  • the first inorganic film 41 is provided on the pre-package layer 3.
  • the first inorganic thin film 41 has a denser molecular structure with respect to the pre-package layer 3, for example, it may be formed at a higher power (for example, deposition power).
  • the first inorganic thin film 41 covers the pre-package layer 3 and the organic light-emitting unit 2 as a whole, preventing water oxygen from entering the organic light-emitting unit 2 through the pre-package layer 3, and affecting the service life of the organic light-emitting unit 2.
  • At least one package module is sequentially disposed on the first inorganic film 41, and each film group is formed of an organic film 5 and an inorganic film 4.
  • the elastic deformation of the entire cladding structure realizes a smooth and dense combination between the organic film 5 and the pre-package layer 3; at the same time, the structure of the plurality of film groups is more favorable for preventing water oxygen from intruding into the organic light-emitting unit 2, and prolonging the organic light-emitting unit 2 Service life.
  • the number of the film groups is 2-10, which can well prevent the invasion of water and oxygen, and can also reduce the complexity of the process.
  • the projected area of the first inorganic film 41 on the substrate 1 is greater than or equal to the projected area of the pre-package layer 3 on the substrate 1. That is, the first inorganic thin film 41 entirely covers the pre-package layer 3 so that water oxygen is less likely to invade into the organic light-emitting unit 2.
  • the inorganic thin film 4 covers the organic thin film 5 in the one film group; thus, the periphery of the organic thin film 5 is not in contact with the outside, and the organic thin film 5 is prevented from absorbing external water and oxygen.
  • the thickness of the organic film 5 is 100-2000 nm; at this time, the organic film 5 can both function to increase the elastic deformation without making the film group too thick.
  • the organic film 5 is prepared using any one of parylene, polyurea, and acrylic resin. These materials can be cured by UV light to facilitate curing in the process.
  • the thickness of the inorganic thin film 4 is 100-500 nm; at this time, the inorganic thin film 4 can both function to block water oxygen without making the thin film group too thick.
  • the inorganic thin film 4 is prepared by using any one of Al 2 O 3 , SiN, SiO 2 , SiNO, TiO 2 , ZrO 2 , ZnO, MgF 2 , and ZnS.
  • the projected area of the pre-package layer 3 on the substrate 1 is larger than the projected area of the organic light-emitting unit 2 on the substrate 1.
  • the pre-package layer 3 is directly deposited on the substrate 1 to achieve a denser contact between the first inorganic film 41 as a sealing layer formed thereon and the substrate 1, blocking the contact of the organic light-emitting unit 2 with water and oxygen, and effectively blocking the water.
  • the adsorption of oxygen protects the organic electroluminescent device from water and oxygen and improves the lifetime of the organic electroluminescent device.
  • the embodiment provides a method for preparing the above organic electroluminescent device, comprising the following steps:
  • the method for preparing the organic electroluminescent device includes the following steps:
  • the organic light-emitting unit 2 can adopt the existing structure and preparation method in the prior art, and will not be further described herein.
  • a buffer layer 204 is formed on the second electrode 203; in this embodiment, a 50 nm organic material is vapor-deposited on the second electrode 203 at a rate of 1 ⁇ /sec under a vacuum of 2e -6 Torr by a method of thermal evaporation.
  • Tris(8-hydroxyquinoline)aluminum (Alq3) forms a matching buffer layer 204.
  • a buffer layer is prepared using N,N'-bis(1-naphthyl)-N,N'-diphenyl-1,1'-biphenyl-4-4'-diamine (NPB) material.
  • NPB N,N'-bis(1-naphthyl)-N,N'-diphenyl-1,1'-biphenyl-4-4'-diamine
  • the thickness of the buffer layer 204 may be 10-100 nm, the buffer layer 204 having a thickness within the range can effectively increase the output of light; the buffer layer 204 can also be prepared by spin coating, printing or the like.
  • the buffer layer 204 can reduce the damage of the package film to the organic light-emitting unit 2, and on the other hand, it can also match the top-emitting device to optimize the light output.
  • a pre-package layer 3 serving as a package is formed on the buffer layer 204 by using a mask having an opening, and the pre-package layer 3 covers the entire buffer layer 204.
  • the periphery of the pre-package layer 3 is along the edge of the buffer layer 204.
  • the outer extension is 0.5-2 mm, and the thickness of the pre-package layer 3 is 10-100 nm.
  • the projected area of the pre-package layer 3 on the substrate 1 is larger than the projected area of the organic light-emitting unit 2 on the substrate 1.
  • the pre-package layer 3 is directly deposited on the substrate 1 to achieve a denser contact between the first inorganic film 41 and the substrate 1 to be formed thereon, blocking the contact of the organic light-emitting unit 2 with water and oxygen, and effectively blocking the adsorption of water and oxygen.
  • the organic electroluminescent device is protected from water and oxygen, and the life of the organic electroluminescent device is improved.
  • an aluminum target was sputtered at 900 W in an oxygen-argon atmosphere under a vacuum of 2 mTorr by a reactive sputtering method.
  • a mask having an opening is disposed between the substrate 1 and the plasma, and a plasma is passed through the opening of the mask to deposit a 50 nm film of, for example, Al 2 O 3 on the buffer layer 204 to form a pre-package layer. 3.
  • the device is protected by a mask with an opening to lower the energy of the plasma deposited onto the buffer layer 204 to reduce damage to the organic electroluminescent device by deposition.
  • the material of the pre-package layer 3 is not limited to the above materials, but may be any one of Al 2 O 3 , SiN, SiO 2 , SiNO, TiO 2 , ZrO 2 , ZnO, MgF 2 , ZnS;
  • the process is not limited to the above method, but other methods such as ion beam sputtering deposition, atomic layer deposition, magnetron sputtering deposition, or enhanced chemical vapor deposition may be employed.
  • the first inorganic thin film 41 is formed on the pre-package layer 3 such that the first inorganic thin film 41 completely overlaps with the pre-package layer 3.
  • the organic electroluminescent device is not damaged during the preparation of the first inorganic thin film 41; the first inorganic thin film 41 may have a thickness of 100-500 nm.
  • a reactive sputtering method is used to sputter an aluminum target at a power of 1200 W in an oxygen-argon atmosphere under a vacuum of 2 mTorr, and a 150 nm Al 2 O 3 film is deposited on the pre-package layer 3 to form a first inorganic film. 41;
  • the first inorganic film 41 is prepared at a relatively high power (relative to the pre-package layer 3). Therefore, the molecular structure is relatively dense; the projected area of the first inorganic thin film 41 on the substrate 1 is greater than or equal to the projected area of the pre-package layer 3 on the substrate 1.
  • the first inorganic thin film 41 covers the pre-package layer 3 and the organic light-emitting unit 2 as a whole, preventing water and oxygen from intruding into the organic light-emitting unit 2 through the pre-package layer 3, and affecting the service life of the organic light-emitting unit 2.
  • the material of the first inorganic thin film 41 is not limited to the above materials, but any one of Al 2 O 3 , SiN, SiO 2 , SiNO, TiO 2 , ZrO 2 , ZnO, MgF 2 , and ZnS may be used; Limited to the above materials, other methods such as ion beam sputtering deposition, atomic layer deposition, magnetron sputtering deposition, or enhanced chemical vapor deposition may be employed.
  • An organic thin film 5 is formed on the first inorganic thin film 41.
  • the coverage area of the organic thin film 5 is smaller than that of the first inorganic thin film 41, and the boundary thereof is located within the boundary of the first inorganic thin film 41; the thickness thereof may be 100-2000 nm.
  • the organic film 5 serves to increase the elastic deformation without making the film group too thick.
  • the organic film 5 is formed of an ultraviolet light curing material, for example, using polyparadimethylene Formed from benzene (Parylene), or polyurea (Polyurea), or an acrylic resin;
  • the parylene is placed in an ultrasonic atomizer for atomization treatment, and the atomized parylene forms an organic film 5 on the first inorganic film 41 to a thickness of 1500 nm; thereafter, the organic film is formed. 5 Cured under ultraviolet light.
  • the above-mentioned ultrasonic atomization and ultraviolet curing are in the prior art, and will not be further described herein.
  • An inorganic thin film 4 is formed on the above-mentioned organic thin film 5, and the inorganic thin film 4 covers the organic thin film 5 so that the periphery of the organic thin film 5 is not in contact with the outside, and the organic thin film 5 is prevented from absorbing external water and oxygen.
  • a TiO 2 target is sputtered at a power of 1300 W in an oxygen-argon atmosphere under a vacuum of 2 mTorr, and a 1000 nm TiO 2 film is deposited on the pre-package layer 3 to form an inorganic thin film 4;
  • the film 4 is used to prevent water oxygen from intruding into the organic light-emitting unit 2 through the pre-package layer 3, thereby affecting the service life of the organic light-emitting unit 2.
  • the inorganic thin film 4 in the film group covers the organic thin film 5; thus, the periphery of the organic thin film 5 is not in contact with the outside, and the organic thin film 5 is prevented from absorbing external water and oxygen.
  • the material of the inorganic thin film 4 is not limited to the above materials, but any one of Al 2 O 3 , SiN, SiO 2 , SiNO, TiO 2 , ZrO 2 , ZnO, MgF 2 , and ZnS may be used; the preparation process is not limited to the above.
  • other methods such as ion beam sputtering deposition, atomic layer deposition, magnetron sputtering deposition, or enhanced chemical vapor deposition may be employed.
  • the first inorganic thin film 41 Since the first inorganic thin film 41 has a dense molecular structure, the elastic deformation is poor, and it is easily cracked or broken under stress; therefore, the first inorganic thin film 41 is provided with a thin film group in which the organic thin film 5 and the inorganic thin film 4 are alternately arranged.
  • the elastic deformation of the entire cladding structure is increased to achieve a smooth and dense combination between the organic film 5 and the inorganic film 4; at the same time, the structure of the plurality of film groups is more favorable for preventing water oxygen from intruding into the organic light-emitting unit 2, and extending the organic light-emitting unit 2 Service life.
  • a film group including the inorganic film 4 and the organic film 5 is prepared, so that two film groups are sequentially disposed on the first inorganic film 41, and each film group includes the organic film 5 and the cover organic film 5.
  • Inorganic film 4 it should be understood that the number of film groups can be 2-10; this can not only prevent the invasion of water and oxygen, but also reduce the complexity of the process.
  • the periphery of all the inorganic thin films 4 are superposed on each other, and all the organic thin films 5 are interspersed in the inorganic thin film 4.
  • the first inorganic thin film 41 entirely covers the pre-package layer 3 and the organic light-emitting unit 2, and the first inorganic thin film 41 has a denser molecular structure with respect to the pre-package layer 3. Therefore, water oxygen is effectively prevented from intruding into the organic light-emitting unit 2 through the pre-package layer 3, thereby affecting the service life of the organic light-emitting unit 2.
  • the embodiment of the invention further provides a display device comprising the above organic electroluminescent device. Since the organic electroluminescent device has the above package structure, the display device has the advantages of high reliability and long service life.
  • the display device can be any device for display such as a mobile phone, a television, a digital camera, or the like.

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

一种有机电致发光器件及其制备方法、显示装置。有机电致发光器件中第一无机薄膜（41）整体上将预封装层（3）和有机发光单元（2）覆盖，第一无机薄膜（41）相对于预封装层（3）具有更致密分子结构，因此能够更有效地防止水氧经预封装层（3）侵入有机发光单元（2），从而影响有机发光单元（2）的使用寿命。

Description

有机电致发光器件及其制备方法、显示装置 技术领域
本发明涉及显示技术领域，具体地，涉及一种有机电致发光器件及其制备方法、显示装置。
背景技术
在光电显示技术领域，有机电致发光器件(Organic Light Emitting Device,简称OLED)具有主动发光、亮度高、对比度高、超薄、功耗低、视角大以及工作温度范围宽等诸多优点，是一种具有广泛应用的先进新型平板显示装置。
但由于有机材料固有的特性，其易吸收水氧且受水氧侵蚀后极易损耗变质，从而使器件寿命受到很大影响，所以OLED器件对封装的要求很高。
目前OLED器件的封装技术也日趋成熟，包括传统的玻璃盖或金属盖加干燥片的封装，面封装(Face Encap)，熔接封装(Frit Encap)，薄膜封装(TFE，Thin Film Encap)等。
薄膜封装技术在减少器件重量和厚度、减少封装配件、降低封装成本、减小封装边缘宽度，消灭显示死角以及改善可卷曲柔性等方面有突出的优点。
现有技术中的OLED经薄膜封装后的结构如图1所示，其包括：基板1、设置在基板1上的有机发光单元2和覆盖在有机发光单元2上的预封装层3；在预封装层3上沉积有机薄膜5进行封装，形成有机电致发光器件。
如图2所示，一般的有机发光单元2包括第一电极201和第二电极203，以及两者之间的有机功能层202，其中，第一电极201和第二电极203向有机功能层202提供空穴和电子用于发光；在第二电极203上设有缓冲层204用于起保护作用；在第一电极201和有机功能层202之间设有绝缘层205。
封装层3是在较低的功率下沉积的，以减少沉积工艺对有机发光单元2的损伤。
有机薄膜5是采用流态的有机物成膜并经固化(紫外固化)形成的，在固化过程中由于有机薄膜会产生收缩或膨胀，因此其会带动预封装层3发生收缩或膨胀，从而在有机发光单元2上产生应力，该应力对有机发光单元2会产生损伤。
同时，有机薄膜5也易吸收水氧，发生形变产生损耗，或有机薄膜5吸收的水氧进一步传递至有机发光单元2，降低有机发光单元2的使用寿命。
发明内容
本发明的目的是解决现有技术存在的有机电致发光器件中有机薄膜固化产生应力对有机发光单元易产生损伤、同时有机薄膜易吸收水氧产生损伤或将水氧传递至有机发光单元降低有机发光单元使用寿命的问题，提供一种有机电致发光器件及其制备方法、显示装置。
解决本发明技术问题所采用的技术方案是一种有机电致发光器件，包括基板、设置在基板上的有机发光单元和覆盖有机发光单元的预封装层；其中，在所述预封装层上设有第一无机薄膜。
优选的是，在所述第一无机薄膜上依次设有至少一个薄膜组，每个薄膜组由有机薄膜和无机薄膜形成。
优选的是，所述薄膜组数量为2-10个。
优选的是，所述第一无机薄膜在基板上的投影面积大于或等于所述预封装层在基板上的投影面积。
优选的是，在每个薄膜组中，所述无机薄膜覆盖所述有机薄膜。
优选的是，所述有机薄膜的厚度为100-2000nm。
优选的是，所述有机薄膜采用聚对二甲苯、聚脲、丙烯酸树脂中的任意一种制备。
优选的是，所述无机薄膜的厚度为100-500nm。
优选的是，所述无机薄膜采用Al2O3，SiN，SiO2，SiNO，TiO2，ZrO2，ZnO，MgF2,ZnS中的任意一种制备。
优选的是，所述预封装层在基板上的投影面积大于所述有机发光单元在基板上的投影面积。
优选的是，所有无机薄膜的周边相互接触叠加，而所有有机薄膜间隔地被包裹在无机薄膜内。
解决本发明技术问题所采用的技术方案是一种有机电致发光器件的制备方法，包括：
在设置有有机发光单元的基板上形成预封装层，所述预封装层覆盖所述有机发光单元；以及
在所述预封装层上形成第一无机薄膜。
优选的是，所述有机电致发光器件的制备方法还包括：在所述第一无机薄膜上依次形成至少一个薄膜组，每个薄膜组包括有机薄膜和无机薄膜。
优选的是，在每个薄膜组中，所述无机薄膜覆盖所述有机薄膜。
本发明的有机电致发光器件及其制备方法中第一无机薄膜整体上将预封装层和有机发光单元覆盖，其相对于预封装层具有更致密分子结构，因此有效地防止水氧经预封装层侵入有机发光单元，从而影响有机发光单元的使用寿命。
附图说明
图1为现有技术中有机电致发光器件封装后的结构示意图；
图2为现有技术中有机电致发光器件中有机发光单元的结构示意图；以及
图3为本发明实施例1中有机电致发光器件封装后的结构示意图；
附图标记说明：
1.基板；2.有机发光单元；3.预封装层；4.无机薄膜；41.第一无机薄膜；5.有机薄膜；201.第一电极；202.有机功能层； 203.第二电极；204.缓冲层；205.绝缘层。
具体实施方式
为使本领域技术人员更好地理解本发明的技术方案，下面结合附图和具体实施方式对本发明作进一步详细描述。
实施例1：
如图3所示，本实施例提供一种有机电致发光器件，包括：基板1、设置在基板1上的有机发光单元2、和覆盖有机发光单元2的预封装层3；其中，在所述预封装层3上设有第一无机薄膜41。
其中，第一无机薄膜41相对于预封装层3具有更致密分子结构，例如，其可以是在更大功率(例如，沉积功率)下形成的。第一无机薄膜41整体上将预封装层3和有机发光单元2覆盖，防止水氧经预封装层3对有机发光单元2侵入，影响有机发光单元2的使用寿命。
优选的，在所述第一无机薄膜41上依次设有至少一个包模组，每个薄膜组由有机薄膜5和无机薄膜4形成。
由于第一无机薄膜41具有致密分子结构，弹性形变较差，在应力作用下容易开裂或破碎；因此，在第一无机薄膜41上设有依次交替形成的有机薄膜5和无机薄膜4，可以增加整个覆层结构的弹性形变，实现有机薄膜5和预封装层3之间的平滑致密结合；同时，多个薄膜组的结构更加有利于阻止水氧侵入有机发光单元2，延长有机发光单元2的使用寿命。
优选的，所述薄膜组数量为2-10个，这既可以很好的防止水氧的入侵，也能降低工艺的复杂程度。
优选的，所述第一无机薄膜41在基板1上的投影面积大于或等于预封装层3在基板1上的投影面积。也就是说，第一无机薄膜41整体上覆盖预封装层3，以使水氧不易入侵至有机发光单元2中。
优选的，所述一个薄膜组中所述无机薄膜4覆盖所述有机薄膜5；这样有机薄膜5的周边不与外界接触，阻止有机薄膜5吸收外界的水氧。
优选的，所述有机薄膜5的厚度为100-2000nm；此时，有机薄膜5既能起到增加弹性形变的作用，又不致使薄膜组太厚。
优选的，所述有机薄膜5采用聚对二甲苯、聚脲、丙烯酸树脂中的任意一种制备。这些材料能够通过紫外光固化，方便工艺中固化操作。
优选的，所述无机薄膜4的厚度为100-500nm；此时，无机薄膜4既能起到隔绝水氧的作用，又不致使薄膜组太厚。
优选的，所述无机薄膜4采用Al2O3，SiN，SiO2，SiNO，TiO2，ZrO2，ZnO，MgF2,ZnS中的任意一种制备。
优选的，预封装层3在基板1上的投影面积大于有机发光单元2在基板1上的投影面积。预封装层3直接沉积在基板1上，实现将要在其上形成的作为密封层的第一无机薄膜41与基板1更致密的接触，阻隔有机发光单元2与水氧的接触，有效阻隔对水氧的吸附，保护有机电致发光器件不被水氧侵蚀，提高有机电致发光器件寿命。
实施例2
本实施例提供一种上述有机电致发光器件的制备方法，包括以下步骤：
1)在设置在基板1上的有机发光单元2上形成预封装层3；
2)在预封装层3上形成第一无机薄膜41；以及
3)在所述第一无机薄膜41上依次形成构成薄膜组的有机薄膜5和无机薄膜4。
具体的，所述有机电致发光器件的制备方法包括以下步骤：
A，在基板上制备有机发光单元
在基板1上形成有机发光单元2的第一电极201和有机功能层202；在第一电极201和有机功能层202之间形成绝缘层205； 在有机功能层202和绝缘层205上形成第二电极203，有机发光单元2可以采用现有技术中已有结构和制备方法，在此不再一一赘述。
在第二电极203上形成缓冲层204；本实施例中，采用热蒸镀的方法，在2e-6Torr真空下，以1埃/秒的速率在第二电极203上蒸镀50nm的有机材料三(8-羟基喹啉)铝(Alq3)形成匹配的缓冲层204。
应当理解的是，采用N,N′-二(1-萘基)-N,N′-二苯基-1,1′-联苯-4-4′-二胺(NPB)材料制备缓冲层204也是可以的，缓冲层204的厚度可以为10-100nm，厚度在该范围内的缓冲层204可有效提高光的输出量；也可以采用旋涂、打印等方法制备缓冲层204。缓冲层204一方面可以减少封装薄膜对有机发光单元2的损伤，另一方面，也会对顶发光的器件起到匹配优化出光的作用。
B，在缓冲层上形成预封装层
采用具有开口的掩膜板在缓冲层204上形成起到封装作用的预封装层3，所述预封装层3覆盖整个缓冲层204，例如，预封装层3的四周均沿缓冲层204边缘向外延伸0.5-2mm，预封装层3的厚度为10-100nm。
也就是说，预封装层3在基板1上的投影面积大于有机发光单元2在基板1上的投影面积。预封装层3直接沉积在基板1上，实现将要在其上形成的第一无机薄膜41与基板1更致密的接触，阻隔有机发光单元2与水氧的接触，有效阻隔其对水氧的吸附，保护有机电致发光器件不被水氧侵蚀，提高有机电致发光器件寿命。
具体地，采用反应溅射的方法，在2mTorr真空下，在氧氩混合气氛围下以900W功率溅射铝靶。在基板1和等离子之间设置具有开口的掩膜板，等离子体穿过掩膜板的开口之后以较小的能量，在缓冲层204上沉积50nm的例如Al2O3薄膜，形成预封装层3。利用带开口的掩膜板对器件进行保护，使沉积到缓冲层204上的 等离子体子的能量更低，以降低沉积对有机电致发光器件的损伤。
应当理解的是，预封装层3材料不限于上述材料，而是可以采用Al2O3，SiN，SiO2，SiNO，TiO2，ZrO2，ZnO，MgF2,ZnS中的任意一种；制备工艺也不限于上述方法，而是可采用离子束溅射沉积、原子层沉积、磁控溅射沉积或增强化学气相沉积等其它方法。
C，在预封装层上形成第一无机薄膜
在预封装层3上形成第一无机薄膜41，使得第一无机薄膜41与预封装层3完全重叠。通过预封装层3的保护，第一无机薄膜41制备过程中不会对有机电致发光器件造成损伤；第一无机薄膜41厚度可以为100-500nm。
具体地，采用反应溅射的方法，在2mTorr真空下，在氧氩混合气氛围下以1200W功率溅射铝靶，在预封装层3上沉积150nm的Al2O3薄膜，形成第一无机薄膜41；该第一无机薄膜41是在较大的功率下制备的(相对于预封装层3)。因此，分子结构较为致密；所述第一无机薄膜41在基板1上的投影面积大于或等于预封装层3在基板1上的投影面积。也就是说，第一无机薄膜41整体上将预封装层3和有机发光单元2覆盖，防止水氧经预封装层3侵入有机发光单元2，影响有机发光单元2的使用寿命。
第一无机薄膜41的材料不限于上述材料，而是可以采用Al2O3，SiN，SiO2，SiNO，TiO2，ZrO2，ZnO，MgF2,ZnS中的任意一种；制备工艺也不限于上述材料，而是可采用离子束溅射沉积、原子层沉积、磁控溅射沉积或增强化学气相沉积等其它方法。
D，在第一无机薄膜上形成有机薄膜5和无机薄膜4依次交替的薄膜组
在第一无机薄膜41上形成有机薄膜5，有机薄膜5覆盖区域比第一无机薄膜41覆盖区域小，其边界位于第一无机薄膜41边界之内；其厚度可以为100-2000nm，此时，有机薄膜5既能起到增加弹性形变的作用，又不致使薄膜组太厚。
该有机薄膜5由紫外光固化材料形成，例如，采用聚对二甲 苯(Parylene)、或聚脲(Polyurea)，或丙烯酸树脂等物质形成；
例如，将聚对二甲苯置于超声雾化器中进行雾化处理，雾化后的聚对二甲苯在第一无机薄膜41上形成有机薄膜5，其厚度为1500nm；之后，将该有机薄膜5在紫外光下固化。上述的超声雾化和紫外固化为现有技术范畴，在此不再一一赘述。
在上述的有机薄膜5上形成无机薄膜4，该无机薄膜4覆盖有机薄膜5，这样有机薄膜5的周边不与外界接触，阻止有机薄膜5吸收外界的水氧。
具体地，采用反应溅射的方法，在2mTorr真空下，在氧氩混合气氛围下以1300W功率溅射TiO2靶，在预封装层3上沉积1000nm的TiO2薄膜，形成无机薄膜4；无机薄膜4用于防止水氧经预封装层3侵入有机发光单元2，影响有机发光单元2的使用寿命。同时，所述薄膜组中所述无机薄膜4覆盖所述有机薄膜5；这样有机薄膜5的周边不与外界接触，阻止有机薄膜5吸收外界的水氧。
无机薄膜4的材料不限于上述材料，而是可以采用Al2O3，SiN，SiO2，SiNO，TiO2，ZrO2，ZnO，MgF2,ZnS中的任意一种；制备工艺也不限于上述方法，而是可采用离子束溅射沉积、原子层沉积、磁控溅射沉积或增强化学气相沉积等其它方法。
由于第一无机薄膜41具有致密分子结构，弹性形变较差，在应力作用下容易开裂或破碎；因此，在第一无机薄膜41上设有有机薄膜5和无机薄膜4依次交替的薄膜组，可以增加整个覆层结构的弹性形变，实现有机薄膜5和无机薄膜4之间的平滑致密结合；同时，多个薄膜组的结构更加有利于阻止水氧侵入有机发光单元2，延长有机发光单元2的使用寿命。
重复上述的步骤，再制备一个包括无机薄膜4和有机薄膜5的薄膜组，从而在第一无机薄膜41上依次设置了两个薄膜组，而每一个薄膜组包括有机薄膜5和覆盖有机薄膜5的无机薄膜4；应当理解的是，薄膜组数量可以为2-10个；这既可以很好的防止水氧的入侵，也能降低工艺的复杂程度。
所有无机薄膜4周边相互接触叠加，所有有机薄膜5间隔包裹于无机薄膜4内。
本发明的有机电致发光器件及其制备方法中第一无机薄膜41整体上将预封装层3和有机发光单元2覆盖，并且第一无机薄膜41相对于预封装层3具有更致密分子结构，因此，有效地防止水氧经预封装层3侵入有机发光单元2，从而影响有机发光单元2的使用寿命。
本发明实施例还提供一种显示装置，包括上述的有机电致发光器件，由于有机电致发光器件具有上述的封装结构，该显示装置具有可靠性强、使用寿命长的优点。该显示装置可以为手机、电视、数码相机等任何用于显示的设备。
可以理解的是，以上实施方式仅仅是为了说明本发明的原理而采用的示例性实施方式，然而本发明并不局限于此。对于本领域内的普通技术人员而言，在不脱离本发明的精神和实质的情况下，可以做出各种变型和改进，这些变型和改进也视为本发明的保护范围。

Claims (15)

  1. 一种有机电致发光器件，包括基板、设置在基板上的有机发光单元、和覆盖有机发光单元的预封装层；
    其中，在所述预封装层上设有第一无机薄膜。
  2. 如权利要求1所述的有机电致发光器件，其中，
    在所述第一无机薄膜上依次设有至少一个薄膜组，每个薄膜组由有机薄膜和无机薄膜形成。
  3. 如权利要求2所述的有机电致发光器件，其中，
    所述薄膜组数量为2至10个。
  4. 如权利要求1至3中任一项所述的有机电致发光器件，其中，
    所述第一无机薄膜在基板上的投影面积大于或等于所述预封装层在基板上的投影面积。
  5. 如权利要求2至4中任一项所述的有机电致发光器件，其中，
    在每个薄膜组中，所述无机薄膜覆盖所述有机薄膜。
  6. 如权利要求2至5中任一项所述的有机电致发光器件，其中，
    所述有机薄膜的厚度为100-2000nm。
  7. 如权利要求2至6中任一项所述的有机电致发光器件，其中，
    所述有机薄膜采用聚对二甲苯、聚脲、丙烯酸树脂中的任意一种制备。
  8. 如权利要求2至7中任一项所述的有机电致发光器件，其中，
    所述无机薄膜的厚度为100-500nm。
  9. 如权利要求2至8中任一项所述的有机电致发光器件，其中，
    所述无机薄膜采用Al2O3，SiN，SiO2，SiNO，TiO2，ZrO2，ZnO，MgF2,ZnS中的任意一种制备。
  10. 如权利要求1至9中任一项所述的有机电致发光器件，其中，
    所述预封装层在基板上的投影面积大于所述有机发光单元在基板上的投影面积。
  11. 如权利要求2至10中任一项所述的有机电致发光器件，其中，
    所有无机薄膜的周边相互接触叠加，而所有有机薄膜间隔地被包裹在无机薄膜内。
  12. 一种有机电致发光器件的制备方法，包括：
    在设置有有机发光单元的基板上形成预封装层，所述预封装层覆盖所述有机发光单元；以及
    在所述预封装层上形成第一无机薄膜。
  13. 如权利要求12所述的有机电致发光器件的制备方法，还包括
    在所述第一无机薄膜上依次形成至少一个薄膜组，每个薄膜组包括有机薄膜和无机薄膜。
  14. 如权利要求13所述的有机电致发光器件的制备方法， 其中，在每个薄膜组中，所述无机薄膜覆盖所述有机薄膜。
  15. 一种显示装置，包括如权利要求1-11中任一项所述的有机电致发光器件。
PCT/CN2015/070265 2014-09-03 2015-01-07 有机电致发光器件及其制备方法、显示装置 Ceased WO2016033923A1 (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US14/761,881 US9985245B2 (en) 2014-09-03 2015-01-07 Organic light emitting device, manufacturing method thereof and display device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201410447024.1 2014-09-03
CN201410447024.1A CN104269498A (zh) 2014-09-03 2014-09-03 一种有机电致发光器件及其制备方法、显示装置

Publications (1)

Publication Number Publication Date
WO2016033923A1 true WO2016033923A1 (zh) 2016-03-10

Family

ID=52161004

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2015/070265 Ceased WO2016033923A1 (zh) 2014-09-03 2015-01-07 有机电致发光器件及其制备方法、显示装置

Country Status (3)

Country Link
US (1) US9985245B2 (zh)
CN (1) CN104269498A (zh)
WO (1) WO2016033923A1 (zh)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106848088B (zh) * 2015-12-07 2020-11-03 上海和辉光电有限公司 显示模组封装结构及其制备方法
CN106847760B (zh) * 2015-12-07 2019-02-12 上海和辉光电有限公司 显示模组封装结构及其制备方法
CN106848087B (zh) * 2015-12-07 2019-02-12 上海和辉光电有限公司 显示模组封装结构及其制备方法
CN105742525A (zh) 2016-03-02 2016-07-06 京东方科技集团股份有限公司 Oled器件的封装结构及显示装置
CN106057857B (zh) * 2016-07-26 2018-12-28 武汉华星光电技术有限公司 一种柔性有机发光二极管显示器及其制作方法
CN106887530B (zh) * 2017-01-20 2019-06-21 南京国兆光电科技有限公司 一种有机电致发光器件的薄膜封装结构及制备方法
CN107104199A (zh) * 2017-04-19 2017-08-29 武汉华星光电技术有限公司 显示面板及其制造方法
CN107123753A (zh) * 2017-05-15 2017-09-01 福州大学 一种薄膜封装方法
CN109279180B (zh) * 2017-07-21 2020-06-16 深圳市中科先见医疗科技有限公司 一种具有封装层的医学植入器件以及一种医学植入器件的封装方法
CN107359276B (zh) * 2017-08-28 2020-07-28 京东方科技集团股份有限公司 一种膜层结构、显示装置及膜层结构的制备方法
CN110197877B (zh) * 2018-02-26 2021-05-14 上海和辉光电股份有限公司 一种amoled显示面板
CN108448009A (zh) * 2018-04-19 2018-08-24 京东方科技集团股份有限公司 一种oled封装结构、掩膜版以及喷墨打印装置
CN110106494B (zh) * 2018-06-25 2022-01-11 广东聚华印刷显示技术有限公司 无机薄膜及其制备方法、应用以及薄膜封装结构和显示面板
CN109037487A (zh) * 2018-08-09 2018-12-18 武汉华星光电半导体显示技术有限公司 Oled显示面板及其制作方法
KR102723029B1 (ko) * 2018-10-01 2024-10-29 삼성디스플레이 주식회사 표시모듈
CN109560113A (zh) * 2018-12-04 2019-04-02 武汉华星光电半导体显示技术有限公司 柔性oled显示装置
CN110246983B (zh) * 2019-06-17 2021-06-01 武汉华星光电半导体显示技术有限公司 有机发光显示面板及其制造方法、封装薄膜
JP7415561B2 (ja) * 2020-01-06 2024-01-17 セイコーエプソン株式会社 有機エレクトロルミネッセンス装置および電子機器
JP7419821B2 (ja) 2020-01-06 2024-01-23 セイコーエプソン株式会社 有機エレクトロルミネッセンス装置および電子機器
CN111864036A (zh) * 2020-07-23 2020-10-30 昆山梦显电子科技有限公司 一种显示面板的制备方法及显示面板

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120146492A1 (en) * 2010-12-10 2012-06-14 Samsung Mobile Display Co., Ltd. Organic light-emitting display apparatus and method of manufacturing the same
US20140070195A1 (en) * 2012-09-12 2014-03-13 Samsung Display Co., Ltd. Organic light emitting device and method for preparing the same
US20140138645A1 (en) * 2012-11-20 2014-05-22 Samsung Display Co., Ltd. Organic light emtting display device

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8900366B2 (en) * 2002-04-15 2014-12-02 Samsung Display Co., Ltd. Apparatus for depositing a multilayer coating on discrete sheets
JP2009037812A (ja) * 2007-07-31 2009-02-19 Sumitomo Chemical Co Ltd 有機ｅｌ装置およびその製造方法
CN101128074A (zh) * 2007-09-20 2008-02-20 清华大学 一种有机电致发光器件及其制备方法
US8933468B2 (en) * 2012-03-16 2015-01-13 Princeton University Office of Technology and Trademark Licensing Electronic device with reduced non-device edge area
CN103325960B (zh) * 2012-03-23 2016-03-16 昆山工研院新型平板显示技术中心有限公司 有机光电子器件的薄膜封装方法
CN102623648A (zh) * 2012-04-17 2012-08-01 上海大学 面光源有机电致发光器件的图案化制作方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120146492A1 (en) * 2010-12-10 2012-06-14 Samsung Mobile Display Co., Ltd. Organic light-emitting display apparatus and method of manufacturing the same
US20140070195A1 (en) * 2012-09-12 2014-03-13 Samsung Display Co., Ltd. Organic light emitting device and method for preparing the same
US20140138645A1 (en) * 2012-11-20 2014-05-22 Samsung Display Co., Ltd. Organic light emtting display device

Also Published As

Publication number Publication date
US20160276624A1 (en) 2016-09-22
US9985245B2 (en) 2018-05-29
CN104269498A (zh) 2015-01-07

Similar Documents

Publication Publication Date Title
WO2016033923A1 (zh) 有机电致发光器件及其制备方法、显示装置
US12324308B2 (en) Organic light emitting display device having a resonance structure of proper internal reflection by including a light extraction reduction preventing layer
KR101993331B1 (ko) 유기발광표시장치 및 그 제조방법
JP5335909B2 (ja) エレクトロルミネセント・ディスプレイ装置、照明装置または表示装置、並びに、その製造プロセス
KR102184673B1 (ko) 유기 발광 표시 장치 및 유기 발광 표시 장치의 제조 방법
JP5837191B2 (ja) オプトエレクトロニクス素子のためのカプセル化構造及びオプトエレクトロニクス素子をカプセル化するための方法
JP4905783B2 (ja) 有機半導体素子
US20140034919A1 (en) Organic light emitting display device with enhanced light efficiency and manufacturing method thereof
US9082726B2 (en) Organic light-emitting display apparatus and method of manufacturing thereof
TWI821609B (zh) 具有ｕｖ固化填料的有機發光二極體（ｏｌｅｄ）顯示器裝置及製造方法
JP2012504304A (ja) 有機光電子装置及び前記装置をカプセル化する方法
WO2016169370A1 (zh) 薄膜封装结构及其制作方法和显示装置
TWI559589B (zh) 有機發光二極體之薄膜封裝
CN104347665B (zh) 制造有机发光显示设备的方法
CN103715359A (zh) 一种oled器件及其制作方法
CN205016566U (zh) 有机发光显示装置
US9061534B2 (en) Donor substrate, method of manufacturing donor substrate, and method of manufacturing organic light-emitting display device
CN109686857B (zh) 一种显示器件及其封装方法
KR20190074276A (ko) 유기발광표시장치 및 그 제조방법
CN103594644A (zh) 有机电致发光器件及其制备方法
CN111883694A (zh) 一种微显示面板的制备方法、微显示面板及微显示装置
TWM493159U (zh) 具有阻水層之有機發光元件

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 14761881

Country of ref document: US

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 15838846

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

32PN Ep: public notification in the ep bulletin as address of the adressee cannot be established

Free format text: NOTING OF LOSS OF RIGHTS PURSUANT TO RULE 112(1) EPC (EPO FORM 1205A DATED 28/06/2017)

122 Ep: pct application non-entry in european phase

Ref document number: 15838846

Country of ref document: EP

Kind code of ref document: A1