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WO2016011609A1 - Source de lumière à led et lampe à led - Google Patents

Source de lumière à led et lampe à led Download PDF

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Publication number
WO2016011609A1
WO2016011609A1 PCT/CN2014/082783 CN2014082783W WO2016011609A1 WO 2016011609 A1 WO2016011609 A1 WO 2016011609A1 CN 2014082783 W CN2014082783 W CN 2014082783W WO 2016011609 A1 WO2016011609 A1 WO 2016011609A1
Authority
WO
WIPO (PCT)
Prior art keywords
led light
light source
emitting
connection
led
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2014/082783
Other languages
English (en)
Chinese (zh)
Inventor
杜鹏
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Goym Photoelectric Technology Co Ltd
Original Assignee
Shenzhen Goym Photoelectric Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen Goym Photoelectric Technology Co Ltd filed Critical Shenzhen Goym Photoelectric Technology Co Ltd
Priority to PCT/CN2014/082783 priority Critical patent/WO2016011609A1/fr
Priority to CN201480076757.7A priority patent/CN106463589A/zh
Publication of WO2016011609A1 publication Critical patent/WO2016011609A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls

Definitions

  • the present invention relates to the field of LED technologies, and in particular, to an LED light source and an LED lamp.
  • the LED package generally adopts the following processes: an epitaxial layer is formed on the substrate by chemical deposition, an electrode is arranged on the epitaxial layer, an LED chip is obtained, and the LED chip is fixed on the substrate by flip-chip or formal mounting, and is mounted on the substrate.
  • a cup-shaped bracket is fixed on the upper surface, and the electrode of the LED chip is connected with the related circuit by a gold wire, and the glass-shaped bracket is injected into the cup-shaped bracket, and a hemispherical encapsulation layer is formed on the surface of the lED chip by the cup-shaped bracket.
  • the existing process requires a substrate, and needs to be flip-chip or mounted on the substrate. It needs a gold wire and requires a bracket.
  • the LED light source includes a substrate, an epitaxial layer, an electrode, a substrate, a cup holder, a gold wire, and a package.
  • the prior art process is cumbersome, high in cost, and low in efficiency, and the LED light source made is complicated in structure and high in cost.
  • the invention provides an LED light source and an LED lamp, which solves the problems of complicated structure and high cost of the existing LED light source.
  • the present invention adopts the following technical solutions:
  • An LED light source comprising a light emitting unit and an encapsulation layer, wherein
  • the light emitting unit includes a substrate, an epitaxial structure fabricated on the substrate, a first connection unit, and a second connection unit;
  • the epitaxial structure includes a single light emitting epitaxial layer structure or at least two electrically connected light emitting epitaxial layers a structure having at least one end N-type semiconductor layer and at least one end P-type semiconductor layer;
  • the first connection unit being electrically connected to each of the end N-type semiconductor layers, the second connection The unit is electrically connected to each of the end P-type semiconductor layers, and the first connection unit and the second connection unit are further configured to access an external circuit;
  • the encapsulation layer is obtained by sealing a part or an entire area of the light-emitting unit except the connection area of the first connection unit, the second connection unit and the external circuit on the light-emitting unit.
  • the encapsulation area includes at least a main light exit area of the light emitting unit.
  • the luminescent epitaxial layer structure comprises at least an N-type semiconductor layer, a light-emitting layer and a P-type semiconductor layer from a near to far distance from the substrate; or at least: N from the near to the far side of the substrate a semiconductor layer, a light emitting layer, a P-type semiconductor layer, and a metal reflective layer; or at least: an N-type semiconductor layer from the near to far side of the substrate, a light-emitting layer, and a P-type semiconductor layer having a reflective function.
  • the first connecting unit includes a first connecting end disposed on the epitaxial structure and electrically connected to each of the end N-type semiconductor layers, and extending beyond the epitaxial structure and used for The first connection end is connected to the second connection end of the external circuit;
  • the second connection unit includes a third connection end disposed on the epitaxial structure and electrically connected to each of the end P-type semiconductor layers, And a fourth connection extending beyond the epitaxial structure and for connecting the third connection to the external circuit.
  • the first connection end is disposed on the epitaxial structure through a metal paste and electrically connected to each of the end N-type semiconductor layers; and/or the third connection end is disposed on the epitaxial structure through a metal paste and Each of the end P-type semiconductor layers is electrically connected.
  • the second connection end and/or the fourth connection end extend beyond the epitaxial structure to form a floating end, or extend beyond the epitaxial structure and with the portion of the epitaxial structure on the substrate
  • the outer region is bonded; or extends beyond the epitaxial structure and is fixed by the intermediate structure to a region on the substrate that is outside the portion occupied by the epitaxial structure.
  • the shape of the second connecting end and/or the fourth connecting end is one or more of a Z shape, a T shape, an L shape, a ten shape, a square shape, an elliptical shape, a circular shape, and an irregular shape.
  • the first connecting unit and/or the second connecting unit are a one-piece sheet structure.
  • the inscribed circle diameter of the connection region of the first connection unit and/or the second connection unit and the external circuit is 200 micrometers to 1500 micrometers.
  • the substrate is one of sapphire, silicon, glass, silicon carbide materials.
  • the encapsulation layer is used to encapsulate an area of the main light-emitting surface of the light-emitting unit except the connection area of the first connection unit, the second connection unit and the external circuit; or for encapsulating the a main light-emitting surface of the light-emitting unit, an opposite surface of the main light-emitting surface except a connection region of the first connection unit, the second connection unit, and the external circuit; or a main light-emitting unit for encapsulating the light-emitting unit
  • the encapsulation layer is a conjoined encapsulation layer.
  • the encapsulation layer is curved.
  • An LED lamp comprising at least one LED light source, and at least two metal connectors for powering each of the LED light sources; the LED light source being the LED light source of any of the above.
  • the LED lamp comprises at least two of the LED light sources; the at least two LED light sources are arranged side by side, or arranged in a shape of a letter, a fold, and the main light exiting surface of each LED light source faces outward.
  • the LED lamp comprises at least three of the LED light sources; the at least three LED light sources are arranged in a polygonal shape, and a main light-emitting surface of each LED light source faces outward; or the at least three LED light sources are arranged in a star shape. And the main light-emitting surface of each LED light source faces outward.
  • the main light-emitting surface of at least one of the LED light sources of the LED lamp is at an angle of 20 to 60 degrees from the horizontal plane.
  • the main light-emitting surface of at least one of the LED light sources of the LED lamp is at an angle of 45 degrees to the horizontal.
  • the LED lamp further comprises a housing for housing each of the LED light source and the at least two metal connectors.
  • the LED lamp further includes a power supply module and/or a bracket; the power supply module is connected to the at least two metal connectors for supplying power to each of the LED light sources through the at least two metal connectors;
  • the bracket is configured to support at least one of each of the LED light source, the metal connector, and the power supply module; the housing is further configured to receive the power supply module and/or the bracket.
  • the housing is also filled with a shielding gas.
  • the LED lamp further comprises a main control module electrically connected to the at least two metal connectors for controlling the power supply of the metal connector to each of the LED light sources.
  • the LED lamp comprises at least two of the LED light sources, and the at least two LED light sources generate different colors of light after being energized.
  • the LED light sources that generate different color lights after being energized are connected in parallel with each other, and the LED light sources that generate the same color light are connected in series after being energized.
  • the LED lamp further includes a communication module electrically connected to the main control module, configured to receive a control instruction of the external control terminal and transmit the control instruction to the main control module, where the main control module is configured to be used according to the control instruction
  • the metal connector is controlled to supply power to each of the LED light sources.
  • the invention provides an LED light source and an LED lamp.
  • the encapsulation layer is obtained by directly sealing on the illumination unit without using the substrate and the bracket. Therefore, the LED light source provided by the invention does not include the existing LED light source.
  • the substrate and the bracket simplify the structure of the LED light source and reduce the cost.
  • first connecting unit and the second connecting unit extend out of the second connecting end and the fourth connecting end outside the epitaxial structure for connecting with an external circuit, so that no gold wire is needed; the first connecting end and the third connecting end
  • the terminals are disposed on the epitaxial structure and are electrically connected to the end N-type semiconductor layer and the end P-type semiconductor layer, respectively, so that it is not necessary to additionally fabricate electrodes for the light-emitting epitaxial layer structure. Therefore, the composition of the LED light source can be further simplified, and the cost can be reduced.
  • FIG. 1 is a schematic structural diagram of a light emitting unit according to Embodiment 1 of the present invention.
  • FIG. 2 is a schematic structural diagram of another light emitting unit according to Embodiment 1 of the present invention.
  • FIG. 3 is a schematic structural diagram of another light emitting unit according to Embodiment 1 of the present invention.
  • FIG. 4 is a schematic structural diagram of another light emitting unit according to Embodiment 1 of the present invention.
  • FIG. 5 is a schematic structural diagram of another light emitting unit according to Embodiment 1 of the present invention.
  • FIG. 6 is a schematic structural diagram of another light emitting unit according to Embodiment 1 of the present invention.
  • FIG. 7 is a schematic structural diagram of an LED light source according to Embodiment 2 of the present invention.
  • FIG. 8 is a schematic structural diagram of another LED light source according to Embodiment 2 of the present invention.
  • FIG. 9 is a schematic structural diagram of another LED light source according to Embodiment 2 of the present invention.
  • FIG. 10 is a schematic structural diagram of an LED lamp according to Embodiment 3 of the present invention.
  • Figure 11 is a schematic view showing the connection relationship between the LED light source and the metal connecting member in the LED lamp shown in Figure 10;
  • FIG. 12 is a schematic structural diagram of another LED lamp according to Embodiment 3 of the present invention.
  • FIG. 13 is a schematic structural diagram of another LED lamp according to Embodiment 3 of the present invention.
  • FIG. 14 is a schematic structural diagram of another LED lamp according to Embodiment 3 of the present invention.
  • FIG. 15 is a schematic structural diagram of another LED lamp according to Embodiment 3 of the present invention.
  • FIG. 16 is a schematic structural diagram of another LED lamp according to Embodiment 3 of the present invention.
  • the invention provides an LED light source, comprising a light emitting unit and an encapsulation layer, excluding a substrate and a bracket.
  • the LED light source is composed of a light emitting unit and an encapsulation layer.
  • the light emitting unit comprises a substrate, an epitaxial structure fabricated on the substrate, a first connecting unit and a second connecting unit; and the epitaxial structure comprises a single light emitting epitaxial layer structure or at least two electrically connected light emitting epitaxial layer structures, The at least two electrically connected light emitting epitaxial layer structures are electrically connected by series, parallel or series and mixed; the epitaxial structure has at least one end N-type semiconductor layer and at least one end P-type semiconductor layer; A connection unit is electrically connected to each of the end N-type semiconductor layers, and a second connection unit is electrically connected to each of the end P-type semiconductor layers, and the first connection unit and the second connection unit are also used to access the external a circuit; the encapsulation layer is obtained by sealing a
  • luminescent epitaxial layer structures There are four types of luminescent epitaxial layer structures:
  • the first type includes at least: an N-type semiconductor layer, a light-emitting layer, a P-type semiconductor layer, and a metal reflective layer, and the N-type semiconductor layer, the light-emitting layer, the P-type semiconductor layer, and the metal reflective layer are close to the substrate Laminated on the substrate in order to the far side; the metal reflective layer has a light reflecting function.
  • the second type includes at least: an N-type semiconductor layer, a light-emitting layer, and a P-type semiconductor layer having a reflective function, and the N-type semiconductor layer, the light-emitting layer, and the P-type semiconductor layer having a reflective function are close to the substrate
  • the substrate is laminated on the substrate in order of distance; the P-type semiconductor layer having a reflective function has a light reflecting function.
  • the substrate is a transparent substrate, and the light emitted by the light-emitting layer is reflected by the metal reflective layer or the P-type semiconductor layer having a reflective function, and the substrate has an epitaxial layer.
  • the opposite side of the structure side (assuming that the side having the epitaxial structure is the front side of the substrate, the opposite side of which is the back side of the substrate) is the main light exiting surface.
  • a third type comprising at least an N-type semiconductor layer, a light-emitting layer, and a P-type semiconductor layer, and having no light-emitting function, the N-type semiconductor layer, the light-emitting layer, and the P-type semiconductor layer being sequentially from near to far from the substrate Laminated on the substrate.
  • the fourth type is a vertical structure of the light emitting epitaxial layer structure, wherein the substrate is a metal substrate, and at least includes: a P-type semiconductor layer, a light-emitting layer, and an N-type semiconductor layer, and the P-type semiconductor layer, the light-emitting layer, and the N-type semiconductor layer are stacked on the metal substrate in this order from the near side to the far side.
  • each of the light emitting epitaxial layers has the same structure, and may be the first, second, and third light emitting epitaxial layer structures.
  • the epitaxial structure comprises a single luminescent epitaxial layer structure
  • the epitaxial structure has an end N-type semiconductor layer and an end P-type semiconductor layer
  • the end N-type semiconductor layer is an N-type semiconductor layer of the single luminescent epitaxial layer structure
  • the end P-type semiconductor layer is a P-type semiconductor layer of the single light-emitting epitaxial layer structure.
  • the epitaxial structure includes at least two electrically connected luminescent epitaxial layer structures
  • the epitaxial structure has an end N-type semiconductor layer and an end P-type a semiconductor layer
  • an N-type semiconductor of a light-emitting epitaxial layer structure at one end of the series circuit is used as an end N-type semiconductor layer of the epitaxial structure
  • a P-type semiconductor layer of a light-emitting epitaxial layer structure at the other end is an end P-type semiconductor of the epitaxial structure.
  • the N-type semiconductor layer of each of the light-emitting epitaxial layer structures serves as an end N-type semiconductor layer of the epitaxial structure
  • the P-type semiconductor layer is an end P-type semiconductor layer of the epitaxial structure, that is, the epitaxial structure has an end N-type semiconductor layer and an end P-type semiconductor layer of the same number as the light-emitting epitaxial layer structure.
  • An N-type semiconductor having a light-emitting epitaxial layer structure at one end of the entire circuit formed by all the light-emitting epitaxial layer structures is used as an end N-type semiconductor layer of the epitaxial structure, and a P-type semiconductor layer having a light-emitting epitaxial layer structure at the other end is the epitaxial structure. End P-type semiconductor layer.
  • the method for forming the first connecting unit and the second connecting unit is not limited, and includes, but is not limited to, first forming the first connecting unit, the second connecting unit, and then connecting the first connecting unit and each end portion.
  • the N-type semiconductor layer is electrically connected
  • the second connection unit is electrically connected to each of the end P-type semiconductor layers, and each part is left for accessing an external circuit. Or directly fabricating the first connecting unit and the second connecting unit in the epitaxial structure.
  • the illuminating epitaxial layer structure in the epitaxial structure is the first, two or three types described above, the first connecting unit and the second connecting unit are formed on the same side of the substrate. If the illuminating epitaxial layer structure in the epitaxial structure is the fourth one, preferably, the metal substrate is simultaneously used as the second connecting unit, and no second connecting unit is provided, wherein the vertical structure of the luminescent epitaxial layer structure is P type A portion of the metal substrate occupied by the semiconductor layer is electrically connected to the P-type semiconductor layer, and a portion of the metal substrate extending beyond the luminescent epitaxial layer structure of the vertical structure is used for accessing an external circuit.
  • the first connecting unit and the second connecting unit may be electrically connected to the external circuit by means of electric welding; or electrically connected to the external circuit through the connecting terminal.
  • connection area of the first connection unit and the external circuit, and the connection area of the second connection unit and the external circuit are in a zigzag shape, a T shape, an L shape, a ten shape, a square shape, an elliptical shape, a circular shape, and an irregular shape.
  • zigzag shape a T shape, an L shape, a ten shape, a square shape, an elliptical shape, a circular shape, and an irregular shape.
  • the first connecting unit and/or the second connecting unit are a one-piece sheet structure.
  • the first connecting unit and the second connecting unit of the integrated sheet structure may be fabricated first, and then one end is disposed on the epitaxial structure through the metal paste, and is respectively electrically connected to each end N-type semiconductor layer and the end P-type semiconductor layer. Sexually connect and reserve the other end to extend beyond the epitaxial structure for external circuitry.
  • the connecting region of the first connecting unit and the external circuit has an inscribed circle diameter of 200 ⁇ m to 1500 ⁇ m. And/or the inscribed circle diameter of the connection region of the second connection unit to the external circuit is 200 micrometers to 1500 micrometers. This size is different from the electrode size of existing LED chips, and the connection area of this size can be directly and firmly connected to an external circuit.
  • the substrate is one of sapphire, silicon, glass, silicon carbide materials.
  • the sapphire substrate is a transparent substrate.
  • the light exiting region of the light emitting unit refers to a region on the light emitting unit that actually emits light, and preferably includes an outer surface of the light emitting epitaxial layer structure, and if it is a transparent substrate, a mapping region in which the light emitting epitaxial layer structure is mapped on the other side of the substrate.
  • the main light exit area refers to the area with the highest light extraction efficiency, and the surface where the main light emitting area is located is the main light exit surface of the light emitting unit.
  • the opposite side of the substrate having the epitaxial structure (assuming the side having the epitaxial structure)
  • the front surface of the substrate is the back surface of the substrate, which is the main light-emitting surface of the light-emitting unit; and for the light-emitting unit having the epitaxial structure composed of the third and fourth light-emitting epitaxial layer structures, the fourth type is opaque to the substrate.
  • the third type regardless of whether the substrate is transparent or not, has no light-emitting function, and the side having the epitaxial structure on the substrate is the main light-emitting surface of the light-emitting unit.
  • the encapsulation layer is used to encapsulate an area of the main light-emitting surface of the light-emitting unit except the connection area of the first connection unit, the second connection unit and the external circuit; or a main light-emitting surface for encapsulating the light-emitting unit, and the relative An area on the two sides except the connection area of the first connection unit, the second connection unit, and the external circuit; or a main light-emitting surface for encapsulating the light-emitting unit, an opposite surface of the main light-emitting surface, and a main light-emitting surface a portion or all sides between the opposite faces, that is, regions on at least three sides except the connection regions of the first connection unit, the second connection unit, and the external circuit.
  • the encapsulation layer is a conjoined encapsulation layer.
  • the specific sealing process includes but is not limited to: mobile continuous injection molding, molding sealing, printing and sealing, wherein
  • the aligning trajectory of the luminescent epitaxial layer structure is a continuous continuous injection molding, and after curing, a continuous encapsulation layer is formed on the front surface, sometimes even if only one or two surfaces are glued, since the colloid is fluid, finally
  • the encapsulation layers on each side may also be integrated into one, eventually becoming a large conjoined encapsulation layer.
  • Molding sealant that is, putting the light-emitting unit into the mold, clamping the upper and lower molds with a hydraulic press and vacuuming, then heating the solid epoxy into the inlet of the injection lane to make it liquid, and using the hydraulic ejector Turning downwards, the liquid epoxy is pressed into the mold rubber passage, and the epoxy enters the molding unit of each of the light emitting units along the rubber passage, covering the current surface of the light emitting unit except the first connecting unit and the second connecting unit.
  • the area outside the connection area with the external circuit is cured and molded by a certain clamping pressure and temperature to obtain a joint encapsulation layer.
  • the molding and sealing method is particularly suitable for sealing the entire area of the light-emitting unit except the connection area of the first connection unit, the second connection unit and the external circuit.
  • Printing encapsulant that is, using printing technology to print fluorescent glue layer by layer on the current surface of the light emitting unit except for the connection area of the first connecting unit, the second connecting unit and the external circuit, adjacent
  • the luminescent epitaxial layer structure can be continuously printed or intermittently printed, and if continuous printing is used, a continuous encapsulation layer is formed after curing.
  • Embodiment 1 is a diagrammatic representation of Embodiment 1:
  • the embodiment provides a light emitting unit including a substrate, an epitaxial structure fabricated on the substrate, a first connecting unit, and a second connecting unit.
  • the epitaxial structure includes a single light emitting epitaxial layer structure A1 or at least two electrical connections.
  • the epitaxial structure has at least one end N-type semiconductor layer and at least one end P-type semiconductor layer;
  • the first connecting unit comprises a first connecting end and a second connecting end, the first connection The end is disposed on the epitaxial structure and electrically connected to each end N-type semiconductor layer, the second connection end extends beyond the epitaxial structure and is used for connecting the first connection end to the external circuit, and the second connection unit includes the third connection And a fourth connection end, the third connection end is disposed on the epitaxial structure and electrically connected to each end P-type semiconductor layer, and the fourth connection end extends beyond the epitaxial structure and is used for connecting the third connection end to the external Circuit.
  • the luminescent epitaxial layer structure has the above four types. If the epitaxial structure includes at least two electrically connected light emitting epitaxial layer structures, preferably, each of the light emitting epitaxial layers has the same structure, and may be the first, second, and third light emitting epitaxial layer structures.
  • the first connection end and the third connection end are disposed on the same side of the substrate, and the first connection end and the third connection end are formed.
  • the electrode fabricated on the epitaxial layer of the existing LED chip including but not limited to: the first connection end is formed by metal paste on the epitaxial structure and electrically connected to each end N-type semiconductor layer, or the first connection The terminal is directly deposited on the epitaxial structure and electrically connected to each end of the N-type semiconductor layer; after the third connection end is fabricated, the metal paste is disposed on the epitaxial structure and electrically connected to each end P-type semiconductor layer, or The three terminals are directly deposited on the epitaxial structure and electrically connected to the respective P-type semiconductor layers.
  • Metal pastes include, but are not limited to, creamy gold, silver, copper, aluminum, tin, or paste metal alloys.
  • the metal substrate is simultaneously used as the second connecting unit, and no second connecting unit is provided, wherein the fourth luminescent epitaxial layer structure is P-type.
  • a portion of the metal substrate occupied by the semiconductor layer is a third connection end, and a portion of the metal substrate extending beyond the structure of the light-emitting epitaxial layer of the vertical structure serves as a fourth connection end.
  • the epitaxial structure includes a single luminescent epitaxial layer structure A1, and is a third luminescent epitaxial layer structure having an end N-type semiconductor layer and an end P-type semiconductor layer, the single illuminating
  • the N-type semiconductor layer of the epitaxial layer structure A1 is an end N-type semiconductor layer of the epitaxial structure
  • the P-type semiconductor layer is an end P-type semiconductor layer of the epitaxial structure
  • the first connection end 2121 is disposed on the luminescent epitaxial layer structure A1.
  • the third connection end 2131 is disposed on the luminescent epitaxial layer structure A1 and electrically connected to the P-type semiconductor layer,
  • the second connection end 2122 and the fourth connection end 2132 extend beyond the illuminating epitaxial layer structure A1 and are used to connect the first connection end 2121 and the third connection end 2131 to an external circuit.
  • the epitaxial structure includes at least two light emitting epitaxial layer structures (A1 to An) electrically connected in series, and each of the light emitting epitaxial layer structures (A1 to An) is the third type, adjacent light emitting epitaxial layer.
  • the structures are connected in series by an electrical connection structure B fabricated on the substrate. Since all of the light-emitting epitaxial layer structures (A1 to An) are connected in series, the epitaxial structure has only one end N-type semiconductor layer and one end P-type semiconductor layer, and the N-type semiconductor of the light-emitting epitaxial layer structure A1 at one end of the series circuit is used.
  • the end N-type semiconductor layer of the epitaxial structure, the P-type semiconductor layer of the other end of the light-emitting epitaxial layer structure An is an end P-type semiconductor layer of the epitaxial structure, and the first connection end 2121 is disposed on the light-emitting epitaxial layer structure A1.
  • the third connection end 2131 is electrically connected to the P-type semiconductor layer of the luminescent epitaxial layer structure An, and is electrically connected to the N-type semiconductor layer of the luminescent epitaxial layer structure A1.
  • the second connecting end 2122 and the fourth connecting end 2132 respectively extend beyond the light emitting epitaxial layer structures A1 and An and are used for connecting the first connecting end 2121 and the third connecting end 2131 to an external circuit.
  • each of the light-emitting epitaxial layer structures (A1 to An) in the epitaxial structure is electrically connected in parallel, and each of the light-emitting epitaxial layer structures (A1 to An) is the third one described above.
  • the epitaxial structure has n end N-type semiconductor layers and n end P-type semiconductor layers, and each of the N-type semiconductors of the light-emitting epitaxial layer structure (A1 to An) serves as an end N-type semiconductor layer of the epitaxial structure.
  • the P-type semiconductor layer is an end P-type semiconductor layer of the epitaxial structure, the first connection end includes n first connection portions, and the third connection end includes n third connection portions, wherein each of the light-emitting epitaxial layer structures emits light
  • Each of the epitaxial layer structures (A1 to An) is provided with a first connecting portion and a third connecting portion.
  • the first connecting portion is disposed on the light emitting epitaxial layer structure and electrically connected to the N-type semiconductor layer of the light emitting epitaxial layer structure.
  • a third connecting portion is disposed on the luminescent epitaxial layer structure and electrically connected to the P-type semiconductor layer of the luminescent epitaxial layer structure, and the second connecting end extends beyond the epitaxial structure and is used for all the n first connecting portions
  • the external circuit that is, one end of the second connection end is electrically connected to the n first connection parts, and the other end is connected to the external circuit; the fourth connection end extends beyond the epitaxial structure and is respectively used for the n third
  • the connecting portion is connected to the external circuit, that is, one end of the fourth connecting end is electrically connected to the n third connecting portions, and the other end is connected to the external circuit.
  • the second connection end and the fourth connection end may extend beyond the epitaxial structure to form a floating end; or extend beyond the epitaxial structure and conform to a region outside the portion occupied by the epitaxial structure on the substrate; or extend the epitaxial structure
  • the outer structure is fixed to an area outside the portion occupied by the epitaxial structure on the substrate.
  • the second connecting end 2122 and the fourth connecting end 2132 extend beyond the epitaxial structure to form a floating end, and are horizontally suspended; as shown in FIG. 3, the second connecting end 2122 and the fourth connection The end 2132 is suspended downward; as shown in FIG. 4, the second connecting end 2122 and the fourth connecting end 2132 are suspended upward; as shown in FIG.
  • the second connecting end 2122 and the fourth connecting end 2132 extend beyond the extension structure and Adhering to a region other than the portion occupied by the epitaxial structure on the substrate; as shown in FIG. 6, the second connection end 2122 and the fourth connection end 2132 extend beyond the epitaxial structure and are fixed to the substrate through the intermediate structure 214.
  • the intermediate structure 214 may be a floating point, or may be an epitaxial layer which is extra when an epitaxial structure is formed on the substrate.
  • the second connection end and the fourth connection end are electrically connected to the external circuit by means of electric welding; or are electrically connected to the external circuit through the connection terminal.
  • one end of the connection terminal is electrically connected to the external circuit, and the other end has a connection port.
  • the connection port can be matched with the shape of the second connection end, and the second connection end is received therein and electrically connected to the external circuit, or
  • the connecting port houses the second connecting end and a part of the substrate under the second connecting end together and electrically connects the second connecting end to the external circuit.
  • the shape of the second connecting end and the fourth connecting end is one or more of a Z shape, a T shape, a U shape, an L shape, a ten shape, a square shape, an elliptical shape, a circular shape and an irregular shape.
  • the first connecting unit and the second connecting unit are an integrated sheet structure.
  • the inscribed circle diameter of the connection region of the second connection end and the external circuit is 200 micrometers to 1500 micrometers.
  • the inscribed circle diameter of the connection region of the fourth connection terminal and the external circuit is 200 micrometers to 1500 micrometers. This size is different from the size of the electrodes of the existing LED chip, and the second connection end and the fourth connection end of this size can be directly and firmly connected to an external circuit.
  • the substrate is one of sapphire, silicon, glass, silicon carbide materials.
  • the first connecting unit and the second connecting unit extend beyond the second connecting end and the fourth connecting end of the epitaxial structure for connecting with external related circuits, so that no gold wire is needed;
  • a connecting end and a third connecting end are disposed on the epitaxial structure and are electrically connected to each end N-type semiconductor layer and each end P-type semiconductor layer, so that it is not necessary to additionally fabricate an electrode for the light-emitting epitaxial layer structure.
  • the encapsulation can also be performed directly on the illumination unit, eliminating the need for a substrate and a support.
  • Embodiment 2 is a diagrammatic representation of Embodiment 1:
  • the embodiment provides an LED light source, comprising a light emitting unit and an encapsulation layer, wherein the light emitting unit is any one of the structures in the first embodiment, and the encapsulation layer is disposed on the light emitting unit, except for the second connection end and the fourth connection
  • the partial or integral area of the light emitting unit assembly outside the connection area of the end and the external circuit is sealed, and the sealing area includes at least the main light exit area of the light emitting unit.
  • the encapsulation step does not require a substrate, does not require a bracket, and does not require a gold wire before sealing.
  • the obtained LED light source does not have a substrate, a bracket, or a gold wire.
  • the obtained LED light source is composed of a light emitting unit and an encapsulation layer 220 formed by sealing on the light emitting unit.
  • the light exiting region of the light emitting unit refers to a region on the light emitting unit that actually emits light, and preferably includes an outer surface of the light emitting epitaxial layer structure, and if it is a transparent substrate, a mapping region in which the light emitting epitaxial layer structure is mapped on the other side of the substrate.
  • the main light exit area refers to the area with the highest light extraction efficiency, and the surface where the main light emitting area is located is the main light exit surface of the light emitting unit.
  • the opposite side of the substrate having the epitaxial structure (assuming the side having the epitaxial structure)
  • the front surface of the substrate is the front surface of the substrate, which is the main light-emitting surface of the light-emitting unit; for the light-emitting unit having the epitaxial structure composed of the third and fourth light-emitting epitaxial layer structures, the light emitted by the light-emitting layer is not
  • the side that is reflected and has an epitaxial structure on the substrate is the main light-emitting surface of the light-emitting unit.
  • the encapsulation layer is used to encapsulate an area other than the connection area of the second connection end, the fourth connection end and the external circuit on the main light-emitting surface of the light-emitting unit, that is, the other surface of the light-emitting unit assembly is not sealed, such as 7 and FIG. 8; or, the encapsulation layer is used to encapsulate the main light-emitting surface of the light-emitting unit and the opposite surface of the main light-emitting surface except the connection area of the second connection end, the fourth connection end and the external circuit.
  • the LED light sources shown in FIGS. 7 and 8 are all obtained by the following manufacturing method: in the area other than the connection area of the second connection end 2122, the fourth connection end 2132 and the external circuit on the main light-emitting surface of the light-emitting unit, along The arrangement trajectory of the luminescent epitaxial layer structure (A1 to An) is a mobile continuous injection molding, which is cured to form a joint encapsulation layer 220.
  • the difference is that the substrate in FIG. 7 is a transparent substrate, and each of the light-emitting epitaxial layer structures (A1 to An) connected in series includes a metal mirror layer or a P-type semiconductor layer having a reflective function, and thus has a substrate thereon.
  • the opposite side of the side of the epitaxial structure (assuming that the side having the epitaxial structure is the front side of the substrate, the opposite side of which is the back side of the substrate) is the main light-emitting surface of the light-emitting unit.
  • the substrate in FIG. 8 is a non-transparent substrate (or each of the light-emitting epitaxial layer structures (A1 to An) has no light-emitting function, for example, no metal mirror layer, and the P-type semiconductor layer does not have a reflective function), on the substrate.
  • the side having the epitaxial structure is the main light-emitting surface of the light-emitting unit. Therefore, the LED light source shown in FIG.
  • the LED light source shown in FIG. 8 is a mobile continuous injection on the side having an epitaxial structure on the substrate, and the cured encapsulation layer 220 is formed on the side having the epitaxial structure except the second connection end 2122.
  • the fourth connection end 2132 is packaged integrally with an area other than the connection area of the external circuit.
  • the main light-emitting surfaces of the respective light-emitting epitaxial layer structures (A1 to An) may be separately packaged and packaged into a plurality of independent package layers.
  • the LED light source shown in FIG. 9 is obtained by the following method: firstly placing one of the main light-emitting surfaces of the light-emitting unit or its opposite surface face up; on the upward facing side, in addition to the second connection end 2122, the fourth connection In a region other than the connection region of the terminal 2132 and the external circuit, the continuous aligning is performed along the alignment trajectory of the luminescent epitaxial layer structure (A1 to An), and after curing, a joint encapsulation layer is formed on the surface; The unit is flipped 180 degrees, that is, the other side of the main light-emitting surface of the light-emitting unit or the opposite surface thereof is facing upward, and the light-emitting unit is fixed by the bracket and the un-filled area of the light-emitting unit, so that the light-emitting unit is sealed.
  • the area of the glue is suspended; further than the connection area of the second connection end 2122, the fourth connection end 2132 and the external circuit on the upward side (the other side of the main light-emitting surface of the light-emitting unit or the opposite side thereof)
  • the continuous injection molding is carried out. Due to the fluidity of the colloid, the main illuminating surface after curing and the connected encapsulation layer formed on the opposite surface thereof are integrated into one body.
  • Final formation A conjoined encapsulation layer 220 enclosing the four sides of the illumination unit integrates the entire unit of the illumination unit except the connection area of the second connection end 2122 and the fourth connection end 2132 with the external circuit.
  • the LED light source provided in the second embodiment includes the light emitting unit provided in the first embodiment and the encapsulation layer directly encapsulated on the light emitting unit, and does not require a gold wire, does not require a substrate and a bracket, and does not even need to have a structure for each light emitting epitaxial layer. Making additional electrodes simplifies the structure of the LED light source and reduces costs.
  • Embodiment 3 is a diagrammatic representation of Embodiment 3
  • the present invention also provides an LED lamp comprising at least one LED light source, and at least two metal connectors for powering each of the LED light sources, the LED light source being any one of the LED light sources of the second embodiment. If the LED lamp comprises two or more of the LED light sources, the LED light sources may be connected in series, in parallel, or in series and parallel to form at least one circuit, and the at least two metal connectors are connected to each other.
  • the power supply module can be an integral part of the LED light or an external module independent of the LED light.
  • the metal connector is made of a hard material for supplying power to each of the LED light sources, and is also for supporting each of the LED light sources, thereby maintaining each of the LED light sources in a fixed position.
  • at least two of the metal connectors are made of a material having a high thermal conductivity through which heat of the LED light source connected thereto can be dissipated to the lamp cap. Materials with high thermal conductivity such as copper.
  • the main light-emitting surface of at least one of the LED light sources is at an angle of 20 to 60 degrees with respect to the horizontal plane, and more preferably at an angle of 45 degrees.
  • the light emitted by the main light exiting surface can be emitted at a preset angle, so that the target area corresponding to the entire angle is illuminated.
  • the LED lamp comprises at least two of the LED light sources, preferably, the at least two LED light sources are arranged side by side, or arranged in a shape of a letter, a fold, and the main light exiting surface of each LED light source faces outward.
  • the colors of the at least two LED light sources after energization may be the same or different.
  • the LED lamp comprises at least three of the LED light sources, preferably, the at least three LED light sources are arranged in a polygonal shape, and the main light-emitting surface of each LED light source faces outward; or the at least three LED light sources are arranged in a star shape Shape, and the main light-emitting surface of each LED light source faces outward.
  • the main light-emitting surface facing outward can cause the light emitted from the main light-emitting surface to be emitted outward, thereby improving the illumination brightness.
  • the LED lamp further comprises a power supply module connected to the at least two metal connectors for supplying power to each of the LED light sources through the at least two metal connectors.
  • the power supply module includes a power converter to convert external alternating current into direct current.
  • the LED lamp further includes a bracket for supporting at least one of the LED light source, the metal connector, and the power supply module.
  • the position of the supported portion is fixed.
  • the bracket is made of soft glass that is transparent with respect to visible light, thereby suppressing loss of light from the LED light source by the bracket, and also preventing the LED light source from forming a shadow due to the bracket.
  • the LED lamp further comprises a housing for housing each of the LED light source and the at least two metal connectors.
  • the utility model is further configured to receive the power supply module and/or the bracket.
  • the housing is also filled with a shielding gas.
  • the housing comprises a lamp cap and a hollow and light-transmissive lampshade, the lamp cover is closed at one end and the other end has an opening, and each of the LED light sources is disposed in a hollow state by a metal connector made of at least two rigid materials.
  • the lamp cap includes a threaded portion on the side and an eyelet portion at the bottom of the lamp cap; if the LED lamp further includes a power supply module, the power supply module is received in the lamp cap, and the at least two metal connectors are from the opening of the lamp cover The portion extending into the lamp cap is connected to the power supply module, and the power supply module is further connected to the threaded portion and the eyelet portion of the lamp cap, and is connected to the external DC power source through the threaded portion and the eyelet portion of the lamp cap, and is converted and passed through the at least two metals.
  • the connecting member supplies power to each of the LED light sources; if the LED light has no power supply module, the at least two metal connecting members directly intersect with the threaded portion and the hole of the lamp cap Portion connected by a threaded portion, an eyelet access to external power supply module.
  • the LED lamp further includes a bracket, the bracket can extend from the opening portion of the lamp cover into the lamp cover, and the bracket, the opening portion of the lamp cover and the lamp cap are installed in such a manner that the opening portion of the lamp cover is blocked, and each of the LED light sources passes through the hollow state.
  • the bracket is disposed at a substantially central position within the hollow shade, in which case the metal connector need not support other components.
  • the LED lamp further includes a main control module electrically connected to the at least two metal connectors for controlling the power supply of the metal connector to each LED light source, including controlling power, power off, and brightness of each LED light source. Wait.
  • the LED lamp can emit monochromatic light, can be mixed, and its color, brightness, saturation, etc. can be controlled.
  • the LED lamp comprises at least two LED light sources, and the at least two LED light sources generate different colors of light after being energized, and the power supply of each LED light source is controlled by the main control module, so that the color of the LED light can be switched.
  • the LED light sources that generate different color lights after being energized are connected in parallel with each other, and the LED light sources that generate the same color light are connected in series after being energized.
  • the LED lamp further includes a communication module electrically connected to the main control module, configured to receive a control instruction of the external control terminal and transmit the control instruction to the main control module, where the main control module is configured to control the metal connection according to the control instruction
  • the power supply to each LED light source Including controlling the power, power off, brightness, etc. of each LED light source.
  • the external control terminal is a mobile phone, a remote controller, or the like.
  • the communication module is a WIFI module, a Bluetooth module, a ZigBee communication module, and the like.
  • the lamp housing 311 includes a base 311 and a lamp cover 312.
  • the lamp cover 312 is hollow and transparent. One end is closed, and the other end has an opening. The opening of the lamp cover 312 is mounted in a blocked manner.
  • the lamp cover 312 is filled with a protective gas.
  • the lamp cap 311 is filled with a protective gas.
  • the threaded portion 3111 on the side and the eyelet portion 3112 at the bottom of the base 311 are included.
  • the first LED light source 34 and the second LED light source 35 are supported by the bracket 36 at a substantially central position in the lamp cover 312 and arranged in a line shape.
  • the substrates of the first LED light source 34 and the second LED light source 35 are The transparent substrate is thus light-emitting on all six sides (only the arrows show the four-sided light-emitting condition in the figure, the front and rear sides of the LED light are not shown), the main light-emitting surface is the back surface of the substrate, and the main light-emitting surface is closed toward the lampshade 312.
  • the main light-emitting surface of each of the first LED light source 34 and the second LED light source 35 is parallel to the horizontal plane.
  • the bracket 36 is T-shaped and connected to the first LED light source 34.
  • the portion between the second LED light source 35 and the second LED light source 35 is a hollow structure for routing to electrically connect the first LED light source 34 and the second LED light source 35.
  • the first LED light source 34 is electrically connected to the second connection end 2132 of the front surface of the substrate and the second connection end 2122' of the second LED light source 35 on the front surface of the substrate.
  • the first metal connection member 321 and the first An LED light source 34 is electrically connected to the second connection end 2122 of the front surface of the substrate, and the second metal connection member 322 is electrically connected to the fourth connection end 2132' of the second LED light source 35 on the front surface of the substrate.
  • the first LED The light source 34 and the second LED light source 35 are connected in series by two metal connectors (321, 322).
  • the power supply module 3 is housed in the lamp cap 311.
  • the two metal connectors (321, 322) extend from the opening of the lamp cover 312 into the lamp cap 311 and are connected to the power supply module 33.
  • the power supply module 33 is also connected to the threaded portion 3111 of the base 311.
  • the 3112 is respectively connected, and the external DC power source is connected through the threaded portion 3111 of the lamp cap and the eyelet portion 3112, and is converted to supply power to the first LED light source 34 and the second LED light source 35 through the two metal connectors (321, 322).
  • the LED lamp further includes a third LED light source 37.
  • the bracket 36 has an umbrella structure, and the first LED light source 34 and the second LED are provided.
  • the light source 35 and the third LED light source 37 are supported by a bracket 36 at a substantially central position within the globe 312 and are enclosed in a triangular shape.
  • the three LED light sources are connected in series by two metal connectors (321, 322).
  • the main light-emitting surfaces of the three LED light sources face the closed end of the lampshade 312. When the LED light is installed in a vertical horizontal plane, the main light-emitting surfaces of the three LED light sources are at an angle of 45 degrees to the horizontal plane.
  • the LED lamp further includes a third LED light source 37 and a fourth LED light source 38.
  • the bracket 36 has an umbrella structure and the first LED.
  • the light source 34, the second LED light source 35, the third LED light source 37, and the fourth LED light source 38 are supported by the bracket 36 at a substantially central position within the globe 312, and are arranged in a star shape.
  • This embodiment is arranged in a special type.
  • the star shape, that is, the cross shape, the LED lamp shown in the present embodiment includes a parallel circuit, and the first LED light source 34 and the second LED light source 35 are connected in series through two metal connectors (321, 322), and through the other two metals.
  • the third LED light source 37 and the fourth LED light source 38 connected in series with the connectors (323, 324) are connected in parallel.
  • the main light-emitting surfaces of the four LED light sources face the closed end of the lampshade 312. When the LED light is installed in a vertical horizontal plane, the main light-emitting surfaces of the four LED light sources are horizontal to the horizontal plane.
  • the LED lamp further includes a third LED light source 37, a fourth LED light source 38, a fifth LED light source 39, and a sixth LED light source. 40.
  • a total of six LED light sources, together with the first LED light source 34 and the second LED light source 35, are supported by a bracket 36 of an umbrella structure at a substantially central position within the globe 312 and are hexagonal.
  • the LED lamp shown in this embodiment is connected to two parallel circuits through two metal connectors (321, 322), and the first LED light source 34, the second LED light source 35 and the third LED light source 37 are connected in series, and the fourth LED light source. 38.
  • the other circuit in which the fifth LED light source 39 and the sixth LED light source 40 are connected in series is connected in parallel.
  • the main light-emitting surfaces of the six LED light sources face the closed end of the lampshade 312. When the LED light is installed in a vertical horizontal plane, the main light-emitting surfaces of the six LED light sources are horizontal to the horizontal plane.
  • the LED lamp further includes a third LED light source 37, and a total of three LEDs of the first LED light source 34 and the second LED light source 35.
  • the two metal connectors (321, 322) made of a hard material are supported at substantially central positions within the globe 312 and arranged side by side.
  • the three LED light sources are connected in series by two metal connectors (321, 322).
  • the respective main light-emitting surfaces face the closed end of the lampshade 312. When the LED light is installed in a vertical horizontal plane, the main light-emitting surfaces of the three LED light sources are horizontal to the horizontal. This embodiment does not require a separate bracket.
  • the third LED light source 37, the first LED light source 34, and the second LED light source 35 have a total of three LED light sources made of a hard material.
  • the two metal connectors (321, 322) are supported at substantially central positions within the globe 312 and are arranged in a folded configuration.
  • the three LED light sources are connected in series by two metal connectors (321, 322).
  • the respective main light-emitting surfaces face the closed end of the lampshade 312. When the LED light is installed in a vertical horizontal plane, the main light-emitting surfaces of the three LED light sources are horizontal to the horizontal. This embodiment does not require a separate bracket.
  • the LED lamp provided by the invention adopts the LED light source provided by the invention, has a simplified structure, is simple to install, and reduces the cost.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Led Device Packages (AREA)

Abstract

L'invention concerne une source de lumière à LED et une lampe à LED. La lampe à LED comprend la source de lumière à LED. La source de lumière à LED comprend une unité d'émission de lumière et une couche d'encapsulation. L'unité d'émission de lumière comprend un substrat et une structure épitaxiale (A1), une première unité de connexion et une deuxième unité de connexion fabriquées sur le substrat. La structure épitaxiale (A1) est pourvue d'au moins une couche en semiconducteur de type N de partie d'extrémité et au moins une couche en semiconducteur de type P de partie d'extrémité. La première unité de connexion est reliée électriquement à chaque couche en semiconducteur de type N de partie d'extrémité, la deuxième unité de connexion est reliée électriquement à chaque couche en semiconducteur de type P de partie d'extrémité, et les première et deuxième unités de connexion sont également utilisées pour accéder à un circuit externe. La couche d'encapsulation (220) est obtenue en effectuant un scellement adhésif sur l'unité d'émission de lumière sur une partie de l'unité d'émission de lumière excluant les zones qui relient les première et deuxième unités de connexion au circuit externe ou sur la totalité de la surface. La structure selon la présente invention permet de résoudre les problèmes de complexité et de coûts élevés des structures de source de lumière à LED existantes.
PCT/CN2014/082783 2014-07-23 2014-07-23 Source de lumière à led et lampe à led Ceased WO2016011609A1 (fr)

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PCT/CN2014/082783 WO2016011609A1 (fr) 2014-07-23 2014-07-23 Source de lumière à led et lampe à led
CN201480076757.7A CN106463589A (zh) 2014-07-23 2014-07-23 一种led光源及led灯

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US20240175556A1 (en) * 2022-04-26 2024-05-30 Ledvance Llc Lamp including reduced phosphor light emitting diode filaments

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