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WO2016006719A8 - Surface protective film - Google Patents

Surface protective film Download PDF

Info

Publication number
WO2016006719A8
WO2016006719A8 PCT/JP2015/075156 JP2015075156W WO2016006719A8 WO 2016006719 A8 WO2016006719 A8 WO 2016006719A8 JP 2015075156 W JP2015075156 W JP 2015075156W WO 2016006719 A8 WO2016006719 A8 WO 2016006719A8
Authority
WO
WIPO (PCT)
Prior art keywords
protective film
surface protective
substrate
energy ray
adhesive layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2015/075156
Other languages
French (fr)
Japanese (ja)
Other versions
WO2016006719A1 (en
Inventor
克彦 堀米
知親 富永
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lintec Corp
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2014139704A external-priority patent/JP6613516B2/en
Application filed by Lintec Corp filed Critical Lintec Corp
Publication of WO2016006719A1 publication Critical patent/WO2016006719A1/en
Publication of WO2016006719A8 publication Critical patent/WO2016006719A8/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/16—Layered products comprising a layer of synthetic resin specially treated, e.g. irradiated
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)

Abstract

This surface protective film 10 is adhered to an optical or electronic member and is used to protect the surface of said member. The surface protective film is provided with a substrate 11, and an adhesive layer 12 that is provided to one surface of the substrate 11 and comprises an energy ray curable adhesive composition. A portion of the adhesive layer 12 is cured by means of an energy ray, producing a cured portion 12A.
PCT/JP2015/075156 2014-07-07 2015-09-04 Surface protective film Ceased WO2016006719A1 (en)

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
JP2014-139704 2014-07-07
JP2014139704A JP6613516B2 (en) 2014-07-07 2014-07-07 Surface protection film
JP2014191337 2014-09-19
JP2014-191337 2014-09-19
JP2015072975 2015-03-31
JP2015-072975 2015-03-31
JP2015-098349 2015-05-13
JP2015098349 2015-05-13

Publications (2)

Publication Number Publication Date
WO2016006719A1 WO2016006719A1 (en) 2016-01-14
WO2016006719A8 true WO2016006719A8 (en) 2016-03-31

Family

ID=55064340

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2015/075156 Ceased WO2016006719A1 (en) 2014-07-07 2015-09-04 Surface protective film

Country Status (1)

Country Link
WO (1) WO2016006719A1 (en)

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0623344B2 (en) * 1987-09-18 1994-03-30 日東電工株式会社 UV curable adhesive tape or sheet
JPH01251737A (en) * 1988-03-31 1989-10-06 Toyo Ink Mfg Co Ltd Adhesive sheet for fixing semiconductor wafer
JPH0578629A (en) * 1991-09-18 1993-03-30 Furukawa Electric Co Ltd:The Radiation curable adhesive tape
JP3045107B2 (en) * 1997-06-20 2000-05-29 日本電気株式会社 Assembly method of solid-state imaging device
JP4268411B2 (en) * 2002-09-13 2009-05-27 積水化学工業株式会社 Semiconductor chip manufacturing method and dicing adhesive tape
JP2004300333A (en) * 2003-03-31 2004-10-28 Lintec Corp Easy-peelable pressure-sensitive adhesive sheet, method for producing and using the same
JP4283596B2 (en) * 2003-05-29 2009-06-24 日東電工株式会社 Tip workpiece fixing method
JP4763251B2 (en) * 2004-05-06 2011-08-31 富士通セミコンダクター株式会社 Imaging apparatus, manufacturing method thereof, and camera module
JP2007254619A (en) * 2006-03-24 2007-10-04 Panac Co Ltd Re-releasable colored adhesive film
JP5060744B2 (en) * 2006-07-26 2012-10-31 リンテック株式会社 Optical functional film bonding adhesive, optical functional film and method for producing the same
JP5554503B2 (en) * 2008-03-18 2014-07-23 リンテック株式会社 Removable process film
JP5456440B2 (en) * 2009-01-30 2014-03-26 日東電工株式会社 Dicing tape integrated wafer back surface protection film

Also Published As

Publication number Publication date
WO2016006719A1 (en) 2016-01-14

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