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WO2016068444A1 - Film conducteur anisotrope et dispositif à semi-conducteur utilisant ce film - Google Patents

Film conducteur anisotrope et dispositif à semi-conducteur utilisant ce film Download PDF

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Publication number
WO2016068444A1
WO2016068444A1 PCT/KR2015/006826 KR2015006826W WO2016068444A1 WO 2016068444 A1 WO2016068444 A1 WO 2016068444A1 KR 2015006826 W KR2015006826 W KR 2015006826W WO 2016068444 A1 WO2016068444 A1 WO 2016068444A1
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Prior art keywords
anisotropic conductive
conductive film
particles
meth
acrylate
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Ceased
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PCT/KR2015/006826
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English (en)
Korean (ko)
Inventor
김지연
박경수
강경구
박영우
신영주
정광진
최현민
황자영
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Samsung SDI Co Ltd
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Samsung SDI Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D5/00—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
    • B05D5/12—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain a coating with specific electrical properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H01B13/06—Insulating conductors or cables
    • H01B13/18—Applying discontinuous insulation, e.g. discs, beads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/44—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D99/00—Subject matter not provided for in other groups of this subclass

Definitions

  • the present invention relates to an anisotropic conductive film and a semiconductor device using the same.
  • Anisotropic conductive film generally refers to a film-like adhesive in which conductive particles are dispersed in a resin such as epoxy.
  • the film is electrically conductive in the film thickness direction and insulated in the plane direction. It means a polymer film having anisotropy and adhesion.
  • An object of the present invention is to provide an anisotropic conductive film that exhibits excellent connection characteristics even at fine pitch by including the conductive particles insulated and metal alloy particles having a melting point of 140 ° C. or less.
  • an anisotropic conductive film comprising metal alloy particles having a melting point of 140 ° C. or less, and insulated conductive particles.
  • the first to-be-connected member containing the first electrode; A second to-be-connected member containing a second electrode; And a semiconductor device connected by the anisotropic conductive film described herein, which is located between the first to-be-connected member and the second to-be-connected member to connect the first electrode and the second electrode.
  • the anisotropic conductive film according to one embodiment of the present invention by including the conductive particles insulated and metal alloy particles having a melting point of 140 °C or less, excellent insulation resistance even at a fine pitch, low connection resistance after initial and reliability evaluation, the electrode There is an advantage that the chance of liver shortness is low.
  • FIG. 1 shows a first to-be-connected member 50 including a first electrode 70, a second to-be-connected member 60 including a second electrode 80, and the first to-be-connected member and the first to-be-connected member.
  • 2 is a cross-sectional view of a semiconductor device 30 according to an example of the present invention, including an anisotropic conductive film as described herein positioned between a member to be connected and connecting the first electrode and the second electrode.
  • One example of the present invention relates to an anisotropic conductive film comprising metal alloy particles having a melting point of 140 ° C. or less, and conductive particles insulated.
  • Metal alloy particles that can be used in the present invention has a melting point of 140 °C or less, two or more from the group consisting of Sn, Sb, Pb, Ag, Bi, In, An, Cd, Mn, Fe, Zn, Al, and As It may be prepared by alloying the selected metal. Specifically, it may be prepared by alloying two or more metals selected from the group consisting of Sn, Bi, In, An, and Sb. In embodiments, the metal alloy particles may be Sn-Bi, Sn-In, An-Bi, or Sn-An.
  • the melting point of the metal alloy particles may be specifically 70 °C to 140 °C, more specifically 80 °C to 140 °C range.
  • the temperature of the electrode portion tends to be higher than the temperature of the space portion, and the melting point of the metal alloy particles is 140 ° C. or less, because the temperature difference between the electrode portion and the space portion is melted near the electrode portion, but relatively less melted near the space portion. This is related to improving both the connection properties and the insulation properties.
  • the connection characteristics are improved by being connected with the insulated conductive particles, whereas the metal alloy particles are melted relatively little in the vicinity of the space part, which may be advantageous in terms of insulation.
  • the shape of the metal alloy particles may be spherical, plate-like or needle-shaped, specifically, may be spherical or plate-like.
  • the particle diameter of the metal alloy particles may be 1 to 10 ⁇ m. Specifically, the size may be 3 to 6 ⁇ m. In the above range, both the connection improvement property and the insulation may be good.
  • the metal alloy particles may be included in 5% by weight to 30% by weight relative to the total weight of solids of the anisotropic conductive film, specifically, may be included in 10% by weight to 20% by weight. In the above range, short between electrodes can be prevented and connection characteristics are excellent.
  • Insulated conductive particles Insulated conductive particles
  • the conductive particles used in the present invention are not particularly limited and may be used without limitation as long as they are insulated.
  • Non-limiting examples of the conductive particles that can be insulated and used in the present invention include metal particles including Au, Ag, Ni, Cu, solder, and the like.
  • the insulating treatment may be performed by coating at least a portion of the surface of the conductive particles with an insulating resin, or insulating fine particles being continuously or discontinuously fixed to at least a portion of the surface of the conductive particles, or by coating a core layer containing a polymer resin with a metal component. As mentioned above, it may include insulating treatment with insulating resin or insulating fine particles.
  • Non-limiting examples of the insulating resin include a solid epoxy resin, phenoxy resin, vinyl polymer, polyester resin, alkylated cellulose resin, flux resin and the like.
  • the method for coating the insulating resin on the conductive particles is not particularly limited and may be appropriately selected according to the purpose.
  • the electrically conductive particle is disperse
  • the insulating fine particles may be crosslinkable polymerizable fine particles, and examples of such crosslinkable polymerizable fine particles include radical polymerization, and may include divinylbenzene, 1,4-divinyloxybutane, divinyl sulfone, diallyl phthalate, and diallyl.
  • Allyl compounds such as acrylamide, triallyl (iso) cyanurate, and trially trimellitate, (poly) ethylene glycol di (meth) acrylate, (poly) propylene glycol di (meth) acrylate, pentaerythritol Tetra (meth) acrylate, pentaerythritol tri (meth) acrylate, pentaerythritol di (meth) acrylate, trimethylolpropane tri (meth) acrylate, dipentaerythritol hexa (meth) acrylate, dipenta
  • An acrylate crosslinking compound such as erythritol penta (meth) acrylate and glycerol tri (meth) acrylate, can be included.
  • the method for producing the above insulating resin fine particles is not particularly limited, and for example, an emulsion polymerization method, a soap-free emulsion polymerization method, a seed polymerization method and the like can be used.
  • the method of fixing the insulating fine particles to the conductive particles includes a dry method using physical / mechanical friction, or a spray drying method, a vacuum deposition coating method, a core shell fashion method, and a fixing method by wet treatment.
  • the insulating fine particles should not be released from the metal surface layer on the curable resin and the crude liquid, and should be deformable and crushed when heated and pressed.
  • As an example of the method for fixing the insulating fine particles it is possible to impart a physical adhesive force to the metal surface by a slight deformation of the surface of the fine particles, and at the same time to impart a chemical bonding force by a functional group on the surface of the fine particles.
  • the insulating fine particles are nucleophilic groups, for example, carboxyl groups, hydroxy groups, glycol groups, aldehyde groups, oxazole groups, silane groups, silanol groups, amine groups, ammonium groups, amides, which are metal affinity functional groups.
  • nucleophilic groups for example, carboxyl groups, hydroxy groups, glycol groups, aldehyde groups, oxazole groups, silane groups, silanol groups, amine groups, ammonium groups, amides, which are metal affinity functional groups.
  • the particle size of the insulating fine particles fixed to the conductive particles may have a size of about 0.5 to 15% of the core particle size, and specifically, may have a particle size corresponding to 1 to 10%.
  • an epoxy reactive functional group may be bonded to the surface of the polymer core material to have an epoxy reactive functional group at its terminal.
  • the polymer core material may be any one of high crosslinked organic polymer particles, silica particles, inorganic particles including titanium dioxide particles, organic / inorganic composite particles, and metal oxide particles.
  • the high crosslinked organic polymer particles may be prepared using a polymer using a crosslinkable polymerizable monomer alone or a copolymer of a crosslinkable polymerizable monomer with at least one general polymerizable monomer based on 30% by weight or more of the total amount of the polymerizable monomer.
  • crosslinkable polymerizable monomer the same ones as the above-mentioned crosslinked polymer fine particles can be used.
  • the general polymerizable monomer is capable of radical polymerization, styrene-based monomers such as styrene, ⁇ -methyl styrene, m-chloromethyl styrene, ethyl vinyl benzene, methyl (meth) acrylate, ethyl (meth) acryl Rate, propyl (meth) acrylate, n-butyl (meth) acrylate, isobutyl (meth) acrylate, t-butyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, n-octyl (meth Acrylate monomers such as) acrylate, lauryl (meth) acrylate, stearyl (meth) acrylate, vinyl chloride, vinyl acetate, vinyl ether, vinyl propionate, vinyl butyrate, and the like.
  • styrene-based monomers such as sty
  • any polymer resin having an epoxy group can be used without limitation, and specifically, glycidyl methacrylate, epoxy acrylate; Epoxy methacrylates; Or an epoxy compound having two epoxy groups in one molecule of an unsaturated group-containing dicarboxylic acid compound obtained by reacting an acid anhydride (ai) of a tribasic acid and / or a tetrabasic acid with an unsaturated group-containing monoalcohol (a-ii).
  • Acid-modified epoxy (meth) acrylate compound obtained by making polybasic acid anhydride react with the reaction product obtained by making the unsaturated compound containing epoxy group and the unsaturated group containing monocarboxylic acid react with two epoxy groups in 1 molecule obtained by making it react, and the said Acid-modified epoxy (meth) acrylate compounds;
  • the epoxy compound etc. which have two or more epoxy groups in 1 molecule can be used.
  • the polymer resin that can be used to prepare the core layer may be present in the form of spherical fine particles, and the polymer resin that may be used may include phenol resin, urea resin, melamine resin, fluorine resin, polyester resin, epoxy resin, silicone resin, and poly Thermosetting polymer resins such as mid resins, polyurethane resins, propylene resins, polyolefin resins, and the like; And polyethylene resins, polypropylene resins, polybutylene resins, polymethacrylic acid resins, methylene resins, polystyrene resins, acrylonitrile-styrene resins, acrylonitrile-styrene-butadiene resins, vinyl resins, divinylbenzene resins, poly Thermoplastic polymer resins such as amide resins, polyester resins, polycarbonate resins, polyacetal resins, pioneoma resins, polyether sulfone resins, polypheny
  • the composition of the insulating fine particles described above may be used as the polymer resin of the core layer.
  • the said polymer resin can form a core fine particle by emulsion polymerization method.
  • the formed core fine particles may be metal plated, and then at least a part of the metal plated layer may be subjected to an insulation treatment with the above-described insulating resin or insulating fine particles.
  • the metal plating may be performed using an electroless plating method, and the metal plating layer may be a layer such as Au, Ag, Ni, or Cu.
  • the metal plating may be a nickel plating layer or a gold plating layer.
  • the metal plating layer may then be further insulated with an insulating resin or insulating particulate as described herein, or in another example, the metal plating layer may be thin filmed with a crosslinked organic particle layer.
  • a thin film may form a continuous or discontinuous coating on the fine particles by the composite of the plated polymer resin particles and the crosslinked organic particles using a hybridizer.
  • the crosslinked organic particles may be obtained by emulsion polymerization of styrene and acrylonitrile, and the structure of the final organic fine particles may be adjusted to a crosslinked or hyperbranched structure by adding an appropriate amount of bifunctional epoxy acrylate. If the conductive particles are used as they are in the fine pitch electrode as it is, there is a possibility that a short may occur. Therefore, in the present invention, the possibility of the occurrence of a short can be reduced by insulatingly using the conductive particles.
  • the diameter of the insulated conductive particles may range from 1 to 20 ⁇ m, specifically, 1 to 10 ⁇ m, and more specifically 1 to 5 ⁇ m. Excellent connection characteristics can be obtained even at a fine pitch in the above range.
  • the conductive particles may be included in an amount of 5 to 50% by weight, specifically 5 to 40% by weight, and more specifically 5 to 38% by weight, based on the total weight of solids of the anisotropic conductive film. In the above range, the conductive particles can be easily pressed between the terminals to ensure stable connection reliability, and the connection resistance can be reduced by improving the conductance.
  • the anisotropic conductive film may further include a binder resin in addition to the insulated conductive particles and metal alloy particles.
  • binder resins that can be used in the present invention include polyimide resins, polyamide resins, phenoxy resins, polymethacrylate resins, polyacrylate resins, polyurethane resins, polyester resins, polyesterurethane resins, Polyvinyl butyral resin, styrene-butyrene-styrene (SBS) resin and epoxy modified body, styrene-ethylene-butylene-styrene (SEBS) resin and its modified body, or acrylonitrile butadiene rubber (NBR ) And its hydrogenated bodies. These can be used individually or in mixture of 2 or more types. Specifically, the binder resin may use a phenoxy resin.
  • the binder resin of the present invention may be included in 10 to 60% by weight relative to the total weight of solids of the anisotropic conductive film, specifically, may be included in 15 to 50% by weight. In the above range, the flowability and adhesion of the composition for an anisotropic conductive film can be improved.
  • the anisotropic conductive film of the present invention may further include a cured portion.
  • curing agent of the said epoxy resin is mentioned.
  • a curing system containing an epoxy resin and a curing agent of the epoxy resin can be used.
  • the (meth) acrylate-based polymerizable material is not particularly limited as long as it is a material having a (meth) acrylate which is polymerized by radicals. And (meth) acrylate oligomers or (meth) acrylate monomers.
  • one or more oligomers selected from the group of known (meth) acrylate oligomers can be used without limitation, and preferably, urethane-based (meth) acrylate, epoxy-based (meth) acrylate, poly Ester (meth) acrylate, fluorine (meth) acrylate, fluorene (meth) acrylate, silicone (meth) acrylate, phosphoric acid (meth) acrylate, maleimide modified (meth) acrylate, acrylate Oligomers, such as (methacrylate), can be used individually or in combination of 2 or more types, respectively.
  • the (meth) acrylate monomer that can be used herein, one or more monomers selected from the group of known (meth) acrylate monomers can be used without limitation.
  • a radical polymerization initiator which can be used here, a peroxide type or an azo type can be used, for example.
  • the peroxide initiator include t-butyl peroxylaurate, 1,1,3,3-t-methylbutylperoxy-2-ethyl hexanonate, 2,5-dimethyl-2,5-di (2-ethylhexanoyl peroxy) hexane, 1-cyclohexyl-1-methylethyl peroxy-2-ethyl hexanonate, 2,5-dimethyl-2,5-di (m-toluoyl peroxy) hexane , t-butyl peroxy isopropyl monocarbonate, t-butyl peroxy-2-ethylhexyl monocarbonate, t-hexyl peroxy benzoate, t-butyl peroxy acetate, dicumyl peroxide, 2,5, -di
  • examples of the epoxy resin include bisphenol A type epoxy resins, bisphenol F type epoxy resins, bisphenol S type epoxy resins, phenol novolac type epoxy resins, and cresols.
  • Novolak-type epoxy resin, bisphenol A novolak-type epoxy resin, bisphenol F novolak-type epoxy resin, alicyclic epoxy resin, glycidyl ester type epoxy resin, glycidylamine type epoxy resin, hydantoin type epoxy resin, iso Cyanurate type epoxy resin, aliphatic chain epoxy resin, etc. are mentioned. These epoxy resins may be halogenated or hydrogenated.
  • Onium salt compounds such as an aromatic diazonium salt, an aromatic sulfonium salt, an aliphatic sulfonium salt, an aromatic iodine aluminum salt, a phosphonium salt, a pyridinium salt, and a serenium salt;
  • Complex compounds such as metal arene complexes and silanol / aluminum complexes;
  • Compounds having an electron capturing function including tosyreto groups such as benzoin tosylato- and o-nitrobenzyl tosylato-, may be used. More specifically, sulfonium salt compounds such as aromatic sulfonium salt compounds or aliphatic sulfonium salt compounds having high cation generation efficiency can be used.
  • the curing agent of such an epoxy resin has a salt structure
  • hexafluoroantimonate, hexafluorophosphate, tetrafluoroborate, pentafluorophenyl borate, or the like can be used as the counter ion.
  • the (meth) acrylate-based radically polymerizable material or epoxy resin may be included in an amount of 10 to 40% by weight based on solids in the composition for an anisotropic conductive film. Within this range, the physical properties such as adhesion, appearance, etc. may be excellent and stable after reliability.
  • the radical polymerization initiator or the epoxy curing agent may be included in 0.5 to 15% by weight based on solids in the composition for the anisotropic conductive film. Specifically, 1 to 10% by weight may be included. Within this range, sufficient reaction occurs for curing and excellent physical properties can be expected in bonding strength, reliability and the like after bonding through the formation of a suitable molecular weight.
  • the anisotropic conductive film of the present invention may further include inorganic particles.
  • recognition property can be provided to an anisotropic conductive film and the short between electroconductive particles can be prevented.
  • Non-limiting examples of the inorganic particles silica (Si, SiO 2 ), Al 2 O 3 , TiO 2 , ZnO, MgO, ZrO 2 , PbO, Bi 2 O 3 , MoO 3 , V 2 O 5 , Nb 2 O 5 , Ta 2 O 5 , WO 3 or In 2 O 3 .
  • the inorganic particles may be silica.
  • the silica may be a silica produced by a liquid phase method, such as a sol gel method, a precipitation method, or a gas phase method such as flame oxidation, a non-pulverized silica obtained by pulverizing silica gel, or fumed silica. ), Fused silica may be used, and the shape may be spherical, plate-shaped, needle-shaped, crushed, edgeless, or the like, and may be used alone or in combination of two or more thereof.
  • the inorganic particles may be included in an amount of 1 to 20% by weight, and specifically 1 to 10% by weight, based on the total weight of solids of the anisotropic conductive film. Outflow of the conductive particles into the space portion can be prevented in the above range.
  • the anisotropic conductive film of the present invention may further include additives such as polymerization inhibitors, antioxidants, heat stabilizers to provide additional physical properties without inhibiting the basic physical properties.
  • the additive is not particularly limited, but may be included in an amount of 0.01 to 10% by weight of the anisotropic conductive film based on the total weight of solids of the anisotropic conductive film.
  • the anti-polymerization agent can be selected from the group consisting of hydroquinone, hydroquinone monomethyl ether, p-benzoquinone, phenothiazine and mixtures thereof.
  • the antioxidant may be a phenolic or hydroxy cinnamate-based material, and specifically, tetrakis- (methylene- (3,5-di-t-butyl-4-hydroxycinnamate) methane, 3,5 -Bis (1,1-dimethylethyl) -4-hydroxy benzene propanoic acid thiol di-2,1-ethanediyl ester and the like can be used.
  • the anisotropic conductive film composition is dissolved in an organic solvent such as toluene and liquefied, and then stirred for a predetermined time within a range of speeds at which the conductive particles are not crushed, which is a predetermined thickness, for example, 10-50 ⁇ m, on the release film.
  • An anisotropic conductive film can be obtained by applying to a thickness and then drying for a certain time to volatilize toluene or the like.
  • the anisotropic conductive film according to an aspect of the present invention may be a single layer structure or a multilayer structure in which an insulating resin layer is laminated on a conductive layer.
  • the first insulating resin layer and the second insulating resin layer may be laminated, and a four-layer structure may be formed by laminating another third insulating resin layer on any one of the insulating resin layers.
  • the anisotropic conductive film has a one- or two-layer structure, and the metal alloy particles and the conductive particles insulated may be included in the same layer, for example, the conductive layer.
  • laminated means that another layer is formed on one surface of an arbitrary layer, and may be used in combination with a coating or lamination.
  • an anisotropic conductive film having a multilayer structure including a conductive layer and an insulating resin layer separately even if the content of inorganic particles such as silica is high, since the layers are separated, the conductive particles do not interfere with the crimping of the conductive particles. Since the flowability of the composition for anisotropic conductive films can be influenced, an anisotropic conductive film with fluidity can be controlled.
  • the first to-be-connected member containing the first electrode A second to-be-connected member containing a second electrode; And a semiconductor device connected by the anisotropic conductive film according to the present specification, which is located between the first to-be-connected member and the second to-be-connected member to connect the first electrode and the second electrode.
  • the first to-be-connected member may be, for example, a chip on film (COF) or a flexible printed circuit board (fPCB), and the second to-be-connected member may be, for example, a glass panel, a printed circuit board (PCB) or It may be a flexible printed circuit board (fPCB).
  • COF chip on film
  • fPCB flexible printed circuit board
  • the first connection member 50 including the first electrode 70 and the second connected member 60 including the second electrode 80
  • an anisotropic conductive adhesive layer comprising conductive particles 3 as described herein for interposing the first electrode and the second electrode and positioned between the first to-be-connected member and the second to-be-connected member.
  • the electrode of the semiconductor device according to the present invention may have a fine pitch.
  • the fine pitch may be 5 to 50 ⁇ m, more specifically 5 to 40 ⁇ m, and even more specifically 9 to 20 ⁇ m.
  • Example 1 Manufacture of anisotropic conductive film
  • SLS sodium lauryl sulfate
  • DI water ultrapure water
  • St styrene
  • N 2 nitrogen
  • KPS potassium persulfate
  • the insulating resin fine particles were formed on the surface of the conductive particles (AUL-704, an average particle diameter of 4 ⁇ m, SEKISUI, Japan) by using a physical impact method (hybridizer) to prepare the insulated conductive particles (compared to conductive balls). Content: 4% by weight, coverage 68%, insulation layer thickness 50nm, withstand voltage 0.3kV).
  • the binder resin portion serving as the matrix for forming the film is 32 parts by weight of a phenoxy resin (PKHH, Inchemrez, USA) dissolved in a xylene / ethyl acetate azeotrope mixed solvent at 40% by volume, and propylene is a curing part with a curing reaction.
  • PKHH phenoxy resin
  • oxide epoxy resin EP-4000S, Adeka, Japan
  • bisphenol A epoxy resin JER834, Mitsubishi Chemical, Japan
  • nano silica R812, size 7nm, Degussa, Germany
  • thermosetting cationic polymerization catalyst SI-60L, SANSHIN CHEMICAL, Japan
  • the solvent was volatilized for 5 minutes in the 60 degreeC dryer, and the 16-micrometer-thick dried anisotropic conductive film was obtained.
  • Example 1 the anisotropic conductive film of Example 2 was manufactured under the same conditions and methods as in Example 1 except that 7 parts by weight of the insulating particles and 13 parts by weight of solder balls were used as the metal alloy particles. It was.
  • Example 1 the anisotropic conductive film of Example 3 was manufactured under the same conditions and methods as in Example 1 except that 13 parts by weight of the insulating particles and 7 parts by weight of solder balls were used as the metal alloy particles. It was.
  • Comparative example 1 Preparation of an anisotropic conductive film
  • Example 1 the anisotropic conductive film of Comparative Example 1 was prepared under the same conditions and methods as in Example 1, except that 20 parts by weight of the conductive particles insulated were used, and the solder balls were not included as the metal alloy particles. Prepared.
  • Example 1 the same conditions and methods as in Example 1 were used except that instead of the insulated conductive particles, non-insulated conductive particles (AUL-704, 4 ⁇ m average particle size, SEKISUI, Japan) were used.
  • An anisotropic conductive film of Comparative Example 2 was prepared.
  • Example 1 it carried out by the same conditions and methods as Example 1 except having used Sn-Pb (average particle diameter 4 micrometers, melting
  • Sn-Pb average particle diameter 4 micrometers, melting
  • connection resistance was measured in the same manner (according to ASTM D177), and the connection after reliability evaluation was measured. and a resistance (T 1).
  • connection resistance measurement is a 4 point probe method, which can be used as a resistance measuring device.
  • the resistance is measured between 4 points using 4 probes connected to the device.
  • the resistance measuring instrument applies 1mA and calculates and displays the resistance based on the measured voltage.
  • the formed anisotropic conductive film was cut into 2 mm x 25 mm, bonded to the insulation resistance evaluation material, and evaluated. At this time, the anisotropic conductive film was pressed on a 0.5 mm thick glass substrate at 70 ° C., 1 MPa, and 1 sec. The PET film was peeled off to place the anisotropic conductive film on the glass substrate. Then, the chips (chip length 19.5 mm, chip width 1.5 mm, bump spacing 8 mu m) were arranged side by side, and then main compression was performed at 150 ° C, 70 MPa, and 5 sec. 50V was applied to it, and the short-circuit was examined at 100 points by the two-terminal method.
  • the anisotropic conductive films of Examples 1 to 3 showed low connection resistance after initial connection resistance and reliability evaluation, and short circuit between electrodes did not occur.
  • the anisotropic conductive film of Comparative Example 1 containing no metal alloy particles showed high connection resistance after initial connection resistance and reliability evaluation, and in Comparative Example 2, in which the conductive particles were not subjected to insulation treatment, short circuit occurred.
  • Comparative Example 3 using the metal alloy particles having a melting point exceeding 140 °C the connection resistance after the initial connection resistance and reliability evaluation were all high.

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  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical & Material Sciences (AREA)
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  • Engineering & Computer Science (AREA)
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Abstract

La présente invention concerne : un film conducteur anisotrope comprenant des particules d'alliage métallique ayant un point de fusion égal ou inférieur à 140 °C et des particules conductrices qui ont été traitées thermiquement ; et un dispositif à semi-conducteur connecté par ce film.
PCT/KR2015/006826 2014-10-30 2015-07-02 Film conducteur anisotrope et dispositif à semi-conducteur utilisant ce film Ceased WO2016068444A1 (fr)

Applications Claiming Priority (2)

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KR1020140149091A KR101768282B1 (ko) 2014-10-30 2014-10-30 이방 도전성 필름 및 이를 이용한 반도체 장치
KR10-2014-0149091 2014-10-30

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WO2016068444A1 true WO2016068444A1 (fr) 2016-05-06

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KR (1) KR101768282B1 (fr)
TW (1) TWI592947B (fr)
WO (1) WO2016068444A1 (fr)

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US20210261829A1 (en) * 2020-02-26 2021-08-26 Korea Advanced Institute Of Science And Technology Anisotropic conductive adhesives for thermo-compression bonding containing solder conductive particles and flux additives and method of connecting electronic parts using the same

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WO2026005503A1 (fr) * 2024-06-26 2026-01-02 엔젯 주식회사 Composition de matériau conducteur anisotrope

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20210261829A1 (en) * 2020-02-26 2021-08-26 Korea Advanced Institute Of Science And Technology Anisotropic conductive adhesives for thermo-compression bonding containing solder conductive particles and flux additives and method of connecting electronic parts using the same
US11732162B2 (en) * 2020-02-26 2023-08-22 Korea Advanced Institute Of Science And Technology Anisotropic conductive adhesives for thermo-compression bonding containing solder conductive particles and flux additives and method of connecting electronic parts using the same

Also Published As

Publication number Publication date
TWI592947B (zh) 2017-07-21
KR101768282B1 (ko) 2017-08-14
TW201616515A (zh) 2016-05-01
KR20160050591A (ko) 2016-05-11

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