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WO2016051971A1 - Stratifié, stratifié conducteur et son procédé de fabrication, capteur de panneau tactile, panneau tactile, et film de transfert - Google Patents

Stratifié, stratifié conducteur et son procédé de fabrication, capteur de panneau tactile, panneau tactile, et film de transfert Download PDF

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Publication number
WO2016051971A1
WO2016051971A1 PCT/JP2015/072889 JP2015072889W WO2016051971A1 WO 2016051971 A1 WO2016051971 A1 WO 2016051971A1 JP 2015072889 W JP2015072889 W JP 2015072889W WO 2016051971 A1 WO2016051971 A1 WO 2016051971A1
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WIPO (PCT)
Prior art keywords
layer
group
plated
forming
substrate
Prior art date
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Ceased
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PCT/JP2015/072889
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English (en)
Japanese (ja)
Inventor
直井　憲次
直樹 塚本
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Fujifilm Corp
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Fujifilm Corp
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Priority to JP2016551619A priority Critical patent/JP6275861B2/ja
Publication of WO2016051971A1 publication Critical patent/WO2016051971A1/fr
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Ceased legal-status Critical Current

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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated

Definitions

  • the present invention relates to a laminate, a conductive laminate and a manufacturing method thereof, a touch panel sensor, a touch panel, and a transfer film.
  • a conductive film having a conductive layer (conductive thin wire) formed on a substrate is used in various applications, and in particular, with the recent increase in the rate of mounting touch panels on mobile phones and portable game devices, The demand for conductive films for capacitive touch panel sensors capable of multipoint detection is rapidly expanding.
  • Various methods for producing the conductive layer have been proposed.
  • a resin having a functional group and a polymerizable group that interacts with a plating catalyst or a precursor thereof, and a polymerization initiator are used.
  • a patterned coating layer is formed using the resin composition layer (layer to be plated forming layer) that is included, and a plating catalyst is applied to the patterned coating layer, and then the plating treatment is performed.
  • a method of forming a metal layer corresponding to a conductive layer on a plating layer has been proposed.
  • a decorative layer is disposed on a substrate that can be a protective substrate such as a protective cover glass, and a detection electrode or the like is directly formed thereon.
  • the shape of the formed layer to be plated becomes wider than the opening shape of the mask, and the pattern to be plated with a desired accuracy A layer could not be formed.
  • This invention makes it a subject to provide the laminated body which can form a pattern-like to-be-plated layer with the outstanding pattern precision in view of the said situation. Moreover, this invention also makes it a subject to provide an electroconductive laminated body and its manufacturing method, a touch panel sensor, a touch panel, and a transfer film.
  • the present inventors have found that the above problem can be solved by using a laminate having a predetermined configuration. That is, the present inventors have found that the above problem can be solved by the following configuration.
  • the laminate according to any one of (1) to (3), wherein the thickness of the layer to be plated is 0.01 to 20 ⁇ m.
  • the laminate according to any one of (1) to (4), wherein the ratio of the thickness of the adhesive layer to the thickness of the decorative layer is 2 or more.
  • the above ratio represents the thickness of the adhesive layer / the thickness of the decorative layer.
  • (6) Perform an exposure process in a pattern on the layer to be plated in the laminate according to any one of (1) to (5) to remove the unexposed areas of the layer to be plated And a step of forming a patterned plating layer, A plating catalyst or a precursor thereof is applied to the patterned layer to be plated, and the patterning layer to which the plating catalyst or its precursor is applied is plated, and a metal layer is formed on the patterned layer to be plated. And a step of forming the conductive laminate.
  • a substrate including the conductive laminate according to (7).
  • a touch panel including the conductive laminate according to (7).
  • a temporary support A layer for forming a plating layer containing a compound X or a composition Y, which will be described later, disposed on the temporary support; And a pressure-sensitive adhesive layer disposed on the layer for forming a layer to be plated.
  • the laminated body which can form a pattern-like to-be-plated layer with the outstanding pattern precision can be provided.
  • an electroconductive laminated body and its manufacturing method, a touch panel sensor, a touch panel, and a transfer film can also be provided.
  • One feature of the laminate of the present invention is that an adhesive layer is disposed between the substrate and the layer to be plated.
  • the present inventors refer to the method described in Patent Document 1 and arrange a layer to be plated on a substrate having a decorative layer (for example, a glass substrate) to form a pattern. When this exposure is carried out, it has been found that the pattern accuracy of the formed layer to be plated is poor. The reason will be described with reference to FIG. As shown in FIG. 1, a mask 50 having an opening is disposed on a laminate including a substrate 12, a decorative layer 14 disposed in a peripheral region of the substrate 12, and a layer-forming layer 18.
  • the distance D between the layer to be plated 18 on the substrate 12 and the mask 50 increases due to the presence of a step due to the decorative layer 14.
  • a part of the light (open arrow) entering from the opening is irradiated to the plated layer forming layer 18 while spreading, and as a result, the patterned plated layer to be formed is mask 50. It becomes larger than the shape of the opening.
  • the adhesive layer 16 is disposed between the layer to be plated 18 and the substrate 12, so that the step of the decorative layer 14 is achieved by the function of the adhesive layer 16. Is absorbed, and the flatness of the surface of the adhesive layer 16 opposite to the substrate 12 is improved.
  • the distance D between the mask 50 and the layer to be plated forming layer 18 can be further reduced. Therefore, since the distance that the light entering from the opening spreads is reduced, the pattern accuracy of the patterned plated layer to be formed is further improved.
  • FIG. 3 shows a cross-sectional view of one embodiment of the laminate of the present invention.
  • the laminate 10 includes a substrate 12, a decorative layer 14, an adhesive layer 16, and a layer for forming a layer to be plated 18.
  • the patterned layer forming layer 18 is subjected to a patterned exposure process to form a patterned plated layer. That is, the laminated body 10 corresponds to a precursor laminated body for producing a patterned plated layer-containing laminated body.
  • the configuration of each member included in the laminate 10 will be described in detail.
  • substrate can support the decoration layer and adhesion layer mentioned later, there will be no restriction
  • substrate can be used.
  • the type of the substrate is not particularly limited, and examples thereof include an insulating substrate. More specifically, a resin substrate, a ceramic substrate, a glass substrate, and the like can be used. From the point of function as a protective cover for a touch panel, A glass substrate is preferred.
  • the thickness (mm) of the substrate is not particularly limited, but is preferably 0.05 to 2 mm, more preferably 0.1 to 1 mm, from the viewpoint of the balance between handleability and thinning.
  • the substrate preferably transmits light appropriately. Specifically, the total light transmittance of the substrate is preferably 85 to 100%.
  • a decoration layer is a layer arrange
  • the peripheral region is a region close to the outer peripheral edge extending from the outer peripheral edge of the substrate to the center side, and is usually formed in a frame shape (usually a rectangular frame shape), but is not limited to this form. It is optional such as a mold, an egg shape, and a round shape.
  • the decorating layer for example, a layer colored black or white is used.
  • the material of a decoration layer is not restrict
  • the colored resin composition containing binder resin and a coloring agent is mentioned.
  • a metal layer can also be used for a decoration layer.
  • the method for forming the decorative layer is not particularly limited as long as it can be formed on the substrate.
  • printing methods such as gravure printing and screen printing, ink jet methods, photolithography methods and the like can be mentioned.
  • a vacuum evaporation method, sputtering method, etc. are mentioned, for example.
  • the thickness of the decorative layer is appropriately selected depending on the purpose, but is often 2 to 80 ⁇ m, and is preferably 2 to 50 ⁇ m, more preferably 2 to 30 ⁇ m from the viewpoint of thinning the touch panel.
  • the thickness of said decoration layer is an average thickness, and is the value which measured the thickness of arbitrary 10 points
  • the ratio of the thickness of the decorative layer to the thickness of the layer for forming a plated layer is often 0.1 to 8000, and is preferably 4 to 8000. More cases. In many cases, the decorative layer is thicker than a layer for forming a layer to be plated which will be described later. Further, the difference between the thickness of the decorative layer and the thickness of the layer to be plated (the thickness of the decorative layer ⁇ the thickness of the layer for forming the layer to be plated) is often 5 ⁇ m or more, more preferably 10 ⁇ m or more. Many. The upper limit is not particularly limited, but is often 80 ⁇ m or less. In addition, the thickness of the said decoration layer and the thickness of the layer for to-be-plated layer formation intend average thickness, respectively.
  • An adhesion layer is a layer arrange
  • the kind in particular of the material (adhesive) which comprises an adhesion layer is not restrict
  • the (meth) acrylic resin is a concept including an acrylic resin and a methacrylic resin.
  • the adhesive layer is substantially free of acid groups.
  • the plating catalyst or its precursor is applied to the adhesive layer, and the metal layer (plating film) is formed only at a desired position. Can be formed more easily.
  • the acid group include a carboxylic acid group, a sulfonic acid group, and a phosphoric acid group. Note that the fact that acid groups are not substantially contained in the adhesive layer specifically means that the total content of acid groups in the adhesive is 1 ⁇ 10 ⁇ 3 mol% or less. It is preferable that it is 10-4 mol% or less. Although a minimum in particular is not restrict
  • the method for forming the pressure-sensitive adhesive layer is not particularly limited, and examples thereof include a method for forming a pressure-sensitive adhesive layer by applying a pressure-sensitive adhesive layer-forming composition containing a predetermined component, and a method for using a transfer film described in detail later. .
  • the thickness of the pressure-sensitive adhesive layer is not particularly limited, but is preferably 50 to 300 ⁇ m from the point that the pattern accuracy of the pattern-form plated layer to be formed is more excellent (hereinafter, also simply referred to as “the effect of the present invention is more excellent”). 50 to 250 ⁇ m is more preferable, and 60 to 220 ⁇ m is even more preferable.
  • the thickness of the pressure-sensitive adhesive layer is an average thickness, and is an arithmetic average value obtained by measuring the thickness of any 10 points of the pressure-sensitive adhesive layer.
  • the thickness of the adhesive layer in the laminate is intended to be the thickness of the adhesive layer at the position where the adhesive layer is in contact with the substrate, and between the surface of the adhesive layer in contact with the substrate and the opposite surface. Intended for length.
  • the relationship between the thickness of the pressure-sensitive adhesive layer and the thickness of the decorative layer is not particularly limited as long as the effect of the present invention is obtained, but the thickness of the pressure-sensitive adhesive layer and the decorative layer are more advantageous in that the effect of the present invention is more excellent.
  • the thickness ratio (thickness of the adhesive layer / thickness of the decorative layer) is preferably 2 or more, and more preferably 3 or more.
  • the upper limit is not particularly limited, but is preferably less than 5 from the viewpoint of thinning.
  • the thickness of the adhesive layer and the thickness of the decorative layer each mean an average thickness.
  • an insulating protective film layer described in JP2013-161203A may be disposed between the adhesive layer and the substrate.
  • An optical adjustment layer described in JP 2012-203701 A may be used as the insulating protective film layer.
  • the layer for forming a layer to be plated is a layer that is disposed on the adhesive layer, and is a layer that is subjected to a patterned exposure process to form a patterned layer to be plated.
  • the layer for forming a layer to be plated includes at least the following compound X or composition Y.
  • Compound X a functional group that interacts with the plating catalyst or its precursor (hereinafter, also simply referred to as “interactive group”) and a compound composition having a polymerizable group Y: interaction with the plating catalyst or its precursor
  • interactive group a functional group that interacts with the plating catalyst or its precursor
  • Y interaction with the plating catalyst or its precursor
  • Compound X is a compound having an interactive group and a polymerizable group.
  • the interactive group is intended to be a functional group capable of interacting with the plating catalyst or its precursor applied to the patterned layer to be plated.
  • a functional group capable of forming an electrostatic interaction with the plating catalyst or its precursor.
  • a nitrogen-containing functional group, a sulfur-containing functional group, an oxygen-containing functional group, or the like that can form a coordination group with a plating catalyst or a precursor thereof can be used.
  • Nitrogen-containing functional groups such as nitro group, nitroso group, azo group, diazo group, azide group, cyano group, cyanate group; ether group, hydroxyl group, phenolic hydroxyl group, carboxylic acid group, carbonate group, carbonyl group, Ester group, group containing N-oxide structure, containing S-oxide structure Group,
  • a salt thereof can also be used.
  • ionic polar groups such as carboxylic acid groups, sulfonic acid groups, phosphoric acid groups, and boronic acid groups, ether groups.
  • a cyano group is particularly preferable, and a carboxylic acid group (carboxyl group) or a cyano group is more preferable.
  • Compound X may contain two or more interactive groups.
  • the polymerizable group is a functional group that can form a chemical bond by applying energy, and examples thereof include a radical polymerizable group and a cationic polymerizable group.
  • a radical polymerizable group is preferable from the viewpoint of more excellent reactivity.
  • radical polymerizable groups include acrylic acid ester groups (acryloyloxy groups), methacrylic acid ester groups (methacryloyloxy groups), itaconic acid ester groups, crotonic acid ester groups, isocrotonic acid ester groups, maleic acid ester groups, and the like.
  • Examples include unsaturated carboxylic acid ester groups, styryl groups, vinyl groups, acrylamide groups, and methacrylamide groups.
  • a methacryloyloxy group, an acryloyloxy group, a vinyl group, a styryl group, an acrylamide group, and a methacrylamide group are preferable, and a methacryloyloxy group, an acryloyloxy group, and a styryl group are more preferable.
  • compound X two or more polymerizable groups may be contained. Further, the number of polymerizable groups contained in the compound X is not particularly limited, and may be one or two or more.
  • the compound X may be a low molecular compound or a high molecular compound.
  • a low molecular weight compound intends a compound having a molecular weight of less than 1000, and a high molecular weight compound intends a compound having a molecular weight of 1000 or more.
  • the low molecular compound having a polymerizable group corresponds to a so-called monomer.
  • the polymer compound may be a polymer having a predetermined repeating unit. Moreover, as a compound, only 1 type may be used and 2 or more types may be used together.
  • the weight average molecular weight of the polymer is not particularly limited, but is preferably 1000 or more and 700,000 or less, and more preferably 2000 or more and 200,000 or less, from the viewpoint of better handleability such as solubility. In particular, from the viewpoint of polymerization sensitivity, it is preferably 20000 or more.
  • the method for synthesizing such a polymer having a polymerizable group and an interactive group is not particularly limited, and a known synthesis method (see paragraphs [0097] to [0125] of Patent Publication 2009-280905) is used.
  • a repeating unit having a polymerizable group represented by the following formula (a) (hereinafter also referred to as a polymerizable group unit as appropriate) and an interaction represented by the following formula (b)
  • a copolymer containing a repeating unit having a functional group (hereinafter also referred to as an interactive group unit as appropriate).
  • R 1 to R 5 are each independently a hydrogen atom or a substituted or unsubstituted alkyl group (for example, a methyl group, an ethyl group, a propyl group, a butyl group) Etc.).
  • the kind of the substituent is not particularly limited, and examples thereof include a methoxy group, a chlorine atom, a bromine atom, or a fluorine atom.
  • R 1 is preferably a hydrogen atom, a methyl group, or a methyl group substituted with a bromine atom.
  • R 2 is preferably a hydrogen atom, a methyl group, or a methyl group substituted with a bromine atom.
  • R 3 is preferably a hydrogen atom.
  • R 4 is preferably a hydrogen atom.
  • R 5 is preferably a hydrogen atom, a methyl group, or a methyl group substituted with a bromine atom.
  • X, Y, and Z each independently represent a single bond or a substituted or unsubstituted divalent organic group.
  • the divalent organic group include a substituted or unsubstituted divalent aliphatic hydrocarbon group (preferably having 1 to 8 carbon atoms, for example, an alkylene group such as a methylene group, an ethylene group, and a propylene group), a substituted or unsubstituted group.
  • a divalent aromatic hydrocarbon group (preferably having 6 to 12 carbon atoms, such as a phenylene group), —O—, —S—, —SO 2 —, —N (R) — (R: alkyl group), And —CO—, —NH—, —COO—, —CONH—, or a combination thereof (for example, an alkyleneoxy group, an alkyleneoxycarbonyl group, an alkylenecarbonyloxy group, and the like).
  • X, Y, and Z are each a single bond, an ester group (—COO—), an amide group (—CONH—), an ether group (—), because the polymer is easily synthesized and the adhesion of the metal layer is more excellent.
  • O— or a substituted or unsubstituted divalent aromatic hydrocarbon group is preferable, and a single bond, an ester group (—COO—), or an amide group (—CONH—) is more preferable.
  • L 1 and L 2 each independently represent a single bond or a substituted or unsubstituted divalent organic group.
  • a divalent organic group it is synonymous with the divalent organic group described by X, Y, and Z mentioned above.
  • L 1 is an aliphatic hydrocarbon group or a divalent organic group having a urethane bond or a urea bond (for example, an aliphatic hydrocarbon) in terms of easy polymer synthesis and better adhesion of the metal layer. Group), and those having a total carbon number of 1 to 9 are preferred.
  • the total number of carbon atoms of L 1 means the total number of carbon atoms contained in the divalent organic group or a substituted or unsubstituted represented by L 1.
  • L 2 may be a single bond, a divalent aliphatic hydrocarbon group, a divalent aromatic hydrocarbon group, or a combination of these in terms of better adhesion of the metal layer. preferable. Among these, L 2 preferably has a single bond or a total carbon number of 1 to 15, and is particularly preferably unsubstituted. Incidentally, the total number of carbon atoms of L 2, means the total number of carbon atoms contained in the divalent organic group or a substituted or unsubstituted represented by L 2.
  • W represents an interactive group.
  • the definition of the interactive group is as described above.
  • the content of the polymerizable group unit is preferably 5 to 50 mol% with respect to all repeating units in the polymer from the viewpoint of reactivity (curability, polymerization) and suppression of gelation during synthesis, 5 to 40 mol% is more preferable.
  • the content of the interactive group unit is preferably 5 to 95 mol%, preferably 10 to 95 mol%, based on all repeating units in the polymer, from the viewpoint of adsorptivity to the plating catalyst or its precursor. More preferred.
  • the repeating unit represented by the formula (A) is the same as the repeating unit represented by the above formula (a), and the description of each group is also the same.
  • R 5, X and L 2 in the repeating unit represented by formula (B) is the same as R 5, X and L 2 in the repeating unit represented by formula (b), a description of each group Is the same.
  • Wa in the formula (B) represents a group that interacts with the plating catalyst or its precursor, excluding the hydrophilic group represented by V described later or its precursor group. Of these, a cyano group and an ether group are preferable.
  • each R 6 independently represents a hydrogen atom or a substituted or unsubstituted alkyl group.
  • U represents a single bond or a substituted or unsubstituted divalent organic group.
  • the definition of a bivalent organic group is synonymous with the divalent organic group represented by X, Y, and Z mentioned above.
  • U is a single bond, an ester group (—COO—), an amide group (—CONH—), an ether group (—O—), or an ether group because the polymer is easily synthesized and the adhesion of the metal layer is more excellent.
  • a substituted or unsubstituted divalent aromatic hydrocarbon group is preferred.
  • L 3 represents a single bond or a substituted or unsubstituted divalent organic group.
  • the definition of a divalent organic group is synonymous with the divalent organic group represented by L 1 and L 2 described above.
  • L 3 is a single bond, a divalent aliphatic hydrocarbon group, a divalent aromatic hydrocarbon group, or a combination thereof in terms of easy polymer synthesis and better adhesion of the metal layer.
  • V represents a hydrophilic group or a precursor group thereof.
  • the hydrophilic group is not particularly limited as long as it is a hydrophilic group, and examples thereof include a hydroxyl group and a carboxylic acid group.
  • the precursor group of the hydrophilic group means a group that generates a hydrophilic group by a predetermined treatment (for example, treatment with acid or alkali). For example, a carboxyl group protected with THP (2-tetrahydropyranyl group) Group and the like.
  • the hydrophilic group is preferably an ionic polar group in terms of interaction with the plating catalyst or its precursor.
  • the ionic polar group examples include a carboxylic acid group, a sulfonic acid group, a phosphoric acid group, and a boronic acid group.
  • a carboxylic acid group is preferable from the viewpoint of moderate acidity (does not decompose other functional groups).
  • the preferred content of each unit in the second preferred embodiment of the polymer is as follows.
  • the content of the repeating unit represented by the formula (A) is 5 to 50 with respect to all the repeating units in the polymer from the viewpoint of reactivity (curability, polymerizability) and suppression of gelation during synthesis.
  • the mol% is preferable, and 5 to 30 mol% is more preferable.
  • the content of the repeating unit represented by the formula (B) is preferably 5 to 75 mol% with respect to all the repeating units in the polymer, from the viewpoint of adsorptivity to the plating catalyst or its precursor, and 10 to 70 mol. % Is more preferable.
  • the content of the repeating unit represented by the formula (C) is preferably from 10 to 70 mol%, preferably from 20 to 60 mol%, based on all repeating units in the polymer, from the viewpoints of developability with an aqueous solution and moisture-resistant adhesion. Is more preferable, and 30 to 50 mol% is more preferable.
  • the polymer can be prepared by known methods (eg, the methods in the literature listed above).
  • R 11 to R 13 each independently represents a hydrogen atom or a substituted or unsubstituted alkyl group.
  • the unsubstituted alkyl group include a methyl group, an ethyl group, a propyl group, and a butyl group.
  • the substituted alkyl group include a methyl group, an ethyl group, a propyl group, and a butyl group substituted with a methoxy group, a chlorine atom, a bromine atom, or a fluorine atom.
  • R 11 is preferably a hydrogen atom or a methyl group.
  • R 12 is preferably a hydrogen atom.
  • R 13 is preferably a hydrogen atom.
  • L 10 represents a single bond or a divalent organic group.
  • the divalent organic group include a substituted or unsubstituted aliphatic hydrocarbon group (preferably having 1 to 8 carbon atoms), a substituted or unsubstituted aromatic hydrocarbon group (preferably having 6 to 12 carbon atoms), —O —, —S—, —SO 2 —, —N (R) — (R: alkyl group), —CO—, —NH—, —COO—, —CONH—, or a combination thereof (for example, alkylene Oxy group, alkyleneoxycarbonyl group, alkylenecarbonyloxy group, etc.).
  • a substituted or unsubstituted aliphatic hydrocarbon group a methylene group, an ethylene group, a propylene group, or a butylene group, or these groups are substituted with a methoxy group, a chlorine atom, a bromine atom, a fluorine atom, or the like Those are preferred.
  • the substituted or unsubstituted aromatic hydrocarbon group an unsubstituted phenylene group or a phenylene group substituted with a methoxy group, a chlorine atom, a bromine atom, a fluorine atom or the like is preferable.
  • one preferred embodiment of L 10 includes —NH—aliphatic hydrocarbon group— or —CO—aliphatic hydrocarbon group—.
  • W is synonymous with the definition of W in Formula (b), and represents an interactive group.
  • the definition of the interactive group is as described above.
  • Formula (X) as a suitable aspect of W, an ionic polar group is mentioned, A carboxylic acid group is more preferable.
  • R 10 represents a hydrogen atom, a metal cation, or a quaternary ammonium cation.
  • metal cations include alkali metal cations (sodium ions, calcium ions), copper ions, palladium ions, silver ions, and the like.
  • a metal cation a monovalent or bivalent thing is mainly used, and when bivalent thing (for example, palladium ion) is used, n mentioned later represents 2.
  • the quaternary ammonium cation include tetramethylammonium ion and tetrabutylammonium ion.
  • L 10 in the formula (1) are the same as defined in L 10 in the above-mentioned formula (X), a single bond, or a divalent organic group.
  • the definition of the divalent organic group is as described above.
  • R 11 ⁇ R 13 in the formula (1) has the same meaning as the definition of R 11 ⁇ R 13 in the above-mentioned formula (X), represents a hydrogen atom or a substituted or unsubstituted alkyl group,.
  • the preferred embodiments of R 11 to R 13 are as described above.
  • n represents an integer of 1 or 2. Especially, it is preferable that n is 1 from a viewpoint of the availability of a compound.
  • a compound represented by the formula (2) may be mentioned.
  • L 11 represents an ester group (—COO—), an amide group (—CONH—), or a phenylene group. Among them, the L 11 is an amide group, solvent resistance (e.g., alkali solvent resistance) is improved.
  • L 12 represents a single bond, a divalent aliphatic hydrocarbon group (preferably having 1 to 8 carbon atoms, more preferably 3 to 5 carbon atoms), or a divalent aromatic hydrocarbon group. The aliphatic hydrocarbon group may be linear, branched or cyclic. When L 12 is a single bond, L 11 represents a phenylene group.
  • the molecular weight of the compound represented by the formula (1) is not particularly limited, but is preferably from 100 to 1,000, more preferably from 100 to 300, from the viewpoints of volatility, solubility in a solvent, film formability, and handleability. preferable.
  • composition Y is a composition containing a compound having an interactive group and a compound having a polymerizable group. That is, the layer for forming a layer to be plated includes two types of compounds, that is, a compound having an interactive group and a compound having a polymerizable group. The definitions of the interactive group and the polymerizable group are as described above.
  • the compound having an interactive group is a compound having an interactive group. The definition of the interactive group is as described above.
  • Such a compound may be a low molecular compound or a high molecular compound.
  • the polymer for example, polyacrylic acid
  • the polymer which has a repeating unit represented by the formula (b) mentioned above is mentioned.
  • the compound having an interactive group does not contain a polymerizable group.
  • the compound having a polymerizable group is a so-called monomer, and is preferably a polyfunctional monomer having two or more polymerizable groups in that the formed layer to be plated is more excellent in hardness. Specifically, it is preferable to use a monomer having 2 to 6 polymerizable groups as the polyfunctional monomer.
  • the molecular weight of the polyfunctional monomer used is preferably 150 to 1000, more preferably 200 to 700, from the viewpoint of molecular mobility during the crosslinking reaction that affects the reactivity.
  • the interval (distance) between a plurality of polymerizable groups is preferably 1 to 15 atoms, and more preferably 6 or more and 10 or less.
  • the compound having a polymerizable group may contain an interactive group.
  • One preferred form of the compound having a polymerizable group is a compound represented by the following formula (1).
  • R 20 represents a polymerizable group.
  • L represents a single bond or a divalent organic group.
  • the definition of the divalent organic group is as described above.
  • Q represents an n-valent organic group.
  • n-valent organic group a group represented by the following formula (1A), a group represented by the following formula (1B),
  • n represents an integer of 2 or more, and preferably 2 to 6.
  • the mass ratio of the compound having an interactive group and the compound having a polymerizable group is not particularly limited, From the viewpoint of the balance between the strength of the plating layer and the plating suitability, 0.1 to 10 is preferable, and 0.5 to 5 is more preferable.
  • the content of compound X (or composition Y) in the layer to be plated forming layer is not particularly limited, but is preferably 50% by mass or more and 80% by mass or more with respect to the total mass of the layer to be plated layer forming. More preferred.
  • the upper limit is not particularly limited, but is preferably 99.5% by mass or less.
  • the layer for forming a layer to be plated may contain components other than the compound X and the composition Y.
  • the layer for forming a layer to be plated may contain a polymerization initiator. By including the polymerization initiator, the reaction between the polymerizable groups during the exposure processing proceeds more efficiently.
  • a polymerization initiator A well-known polymerization initiator (what is called a photoinitiator) etc. can be used.
  • polymerization initiators examples include benzophenones, acetophenones, ⁇ -aminoalkylphenones, benzoins, ketones, thioxanthones, benzyls, benzyl ketals, oxime esters, anthrones, tetramethylthiuram monosulfide Bisacylphosphine oxides, acylphosphine oxides, anthraquinones, azo compounds and the like, and derivatives thereof.
  • the content of the polymerization initiator in the layer to be plated is not particularly limited, but is 0.01 to 1% by mass with respect to the total mass of the layer to be plated in terms of curability of the layer to be plated. It is preferably 0.1 to 0.5% by mass.
  • additives for the layer to be plated, other additives (for example, sensitizers, curing agents, polymerization inhibitors, antioxidants, antistatic agents, fillers, particles, flame retardants, surfactants, lubricants, plasticizers) Etc.) may be added as necessary.
  • the thickness of the layer for forming a layer to be plated is not particularly limited, but is preferably 0.01 to 20 ⁇ m, more preferably 0.1 to 10 ⁇ m, and further preferably 0.1 to 5 ⁇ m.
  • the thickness of the layer for forming a layer to be plated is an average thickness, and is an arithmetic average value obtained by measuring the thickness of any 10 points of the adhesive layer.
  • the relationship between the thickness of the layer to be plated and the thickness of the pressure-sensitive adhesive layer is not particularly limited as long as the effect of the present invention can be obtained.
  • the ratio of the thickness between the thickness and the adhesive layer is preferably 3 ⁇ 10 -5 ⁇ 1.0, 1 ⁇ 10 -4 ⁇ 0. More preferably, it is 001.
  • the thickness of the layer to be plated and the thickness of the adhesive layer are intended to be average thicknesses, respectively.
  • the method for producing the laminate is not particularly limited.
  • the transfer film in which the layer to be plated and the adhesive layer are arranged in this order on the temporary support is used to decorate the adhesive layer side of the transfer film.
  • the method of forming in order is mentioned. Below, the method of using the said transfer film and the method of forming each layer in order are demonstrated.
  • a transfer film having a temporary support, a layer to be plated forming layer disposed on the temporary support, and an adhesive layer disposed on the layer to be plated is prepared.
  • the adhesive layer side of the transfer film is bonded onto a substrate having a decorative layer disposed in the peripheral region, and the temporary support is peeled off to obtain a desired laminate.
  • the transfer film used in this embodiment has a temporary support, a layer for forming a layer to be plated, and an adhesive layer in this order.
  • the definitions (components, thickness, etc.) of the layer to be plated forming layer and the adhesive layer are as described above.
  • the peeling film mentioned later may be arrange
  • the temporary support is a substrate that supports the layer to be plated and the adhesive layer until the adhesive layer is bonded onto the substrate in which the decorative layer is disposed in the peripheral region, and the substrate and the adhesive layer are bonded together. After separation. That is, the temporary support is in close contact with the layer to be plated forming layer so as to be peelable.
  • the type of the temporary support is not particularly limited as long as it can be peeled off from the layer to be plated, and a known temporary support can be used, and a so-called release film (separator) can be used. .
  • a film preferably a resin film
  • a release treatment with a silicone-based release agent or other release agent, or a film that itself has releasability
  • the release treatment include application of a silicone release agent, application of a long-chain alkyl release agent, and application of a fluorine release agent.
  • the resin film a known film can be used.
  • various resin films such as a polyethylene film, a polypropylene film, a polyethylene terephthalate film, and polystyrene can be used.
  • the thickness of the temporary support is not particularly limited, but is preferably from 25 to 150 ⁇ m, more preferably from 38 to 100 ⁇ m, from the viewpoint of excellent handleability.
  • the method for producing the transfer film is not particularly limited, and a composition containing compound X or composition Y is applied onto a temporary support to form a layer for forming a layer to be plated, and then on the layer for forming a layer to be plated.
  • a method of forming an adhesive layer by applying the composition for forming an adhesive layer to the adhesive layer.
  • the composition used for forming the layer for forming a layer to be plated contains at least the compound X or the composition Y, but the composition contains a solvent from the viewpoint of handleability. It is preferable.
  • Solvents that can be used are not particularly limited. For example, water; alcohol solvents such as methanol, ethanol, propanol, ethylene glycol, 1-methoxy-2-propanol, glycerin, propylene glycol monomethyl ether; acids such as acetic acid; acetone, methyl ethyl ketone Ketone solvents such as cyclohexanone; amide solvents such as formamide, dimethylacetamide and N-methylpyrrolidone; nitrile solvents such as acetonitrile and propionitrile; ester solvents such as methyl acetate and ethyl acetate; dimethyl carbonate and diethyl carbonate Other examples include carbonate solvents such as ether solvents, glycol solvents, amine solvents,
  • the content of the solvent in the composition is not particularly limited, but is preferably 50 to 98% by mass and more preferably 70 to 95% by mass with respect to the total amount of the composition. If it is in the said range, the handleability of a composition is excellent and it is easy to control a layer thickness.
  • the composition for forming the adhesive layer only needs to contain at least the component (adhesive) that forms the adhesive layer described above, and may contain other components.
  • the composition for forming an adhesive layer may contain the above solvent from the viewpoint of handleability.
  • the method for applying the composition for forming the layer to be plated and the composition for forming the adhesive layer is not particularly limited, and a known method (for example, spin coating, die coating, dip coating, etc.) can be used. Also, from the viewpoint of handleability and production efficiency, after applying the composition for forming the layer to be plated or the composition for forming the adhesive layer, a drying treatment is performed as necessary to remove the remaining solvent. May be.
  • the conditions for the drying treatment are not particularly limited, but are preferably carried out at room temperature to 220 ° C. (preferably 50 to 120 ° C.) for 1 to 30 minutes (preferably 1 to 10 minutes) from the viewpoint of better productivity. .
  • Manufacturing method (2) As a 2nd embodiment of the manufacturing method of a laminated body, the method of manufacturing each layer in order is mentioned. Specifically, there is a method of forming a decorative layer on a substrate, then forming an adhesive layer, and further forming a layer for forming a layer to be plated. The method for forming each layer is as described above.
  • Pattern-like to-be-plated layer containing laminated body and its manufacturing method The said laminated body is used in order to form the pattern-like to-be-plated layer to which a plating catalyst or its precursor is provided. That is, the said laminated body is used in order to manufacture a pattern-like to-be-plated layer containing laminated body.
  • a method for forming a patterned plated layer using the laminate will be described in detail.
  • Examples of the method for forming the patterned layer to be plated include a method of performing an exposure process on the layer for forming a layer to be plated in the laminate to remove a non-exposed region of the layer for forming a layer to be plated. . More specifically, first, as shown in FIG. 4A, an exposure process is performed on a predetermined amount of region (exposure region 20) of the layer 18 to be plated. In the exposed region 20 irradiated with light, polymerization between the polymerizable groups, reaction between the substrate and the polymerizable group, etc. proceeds and hardens to become an insoluble part. This insoluble portion becomes a so-called plated layer. Next, as shown in FIG.
  • a pattern-form plated layer 22 is formed by removing a region (unexposed region) that has not been subjected to the exposure process of the plated layer forming layer 18. .
  • an exposure process method will be described in detail, and then an unexposed area removal process will be described in detail.
  • exposure with light having an optimum wavelength is performed according to the material of the layer to be plated used.
  • UV (ultraviolet) lamp light irradiation with visible light, or the like is used.
  • the light source include a mercury lamp, a metal halide lamp, a xenon lamp, a chemical lamp, and a carbon arc lamp.
  • an electron beam, an X-ray, an ion beam, a far infrared ray, etc. can be used.
  • the exposure time varies depending on the reactivity of the material of the layer for forming a layer to be plated and the light source, but is usually between 10 seconds and 5 hours.
  • the exposure energy may be about 10 to 8000 mJ, preferably 50 to 3000 mJ.
  • the method in particular which implements the said exposure process in a pattern form is not restrict
  • the method for removing the unexposed region is not particularly limited, and examples thereof include a method in which a solvent for dissolving the layer to be plated is brought into contact with the layer to be plated. More specifically, a method in which an alkaline solution is used as a developer can be mentioned.
  • an alkaline solution is used as a developer.
  • the method of immersing is preferable.
  • the dipping time is preferably about 1 to 30 minutes from the viewpoint of productivity and workability.
  • a patterned plated layer-containing laminate having a patterned plated layer contains an interactive group.
  • This laminated body can be suitably applied to an application for forming a metal film (conductive film). That is, a metal layer can be formed on a pattern-like to-be-plated layer by providing a plating catalyst or its precursor to the pattern-like to-be-plated layer in a laminated body, and also performing a plating process. That is, the pattern of the metal layer can be controlled by controlling the shape of the patterned layer to be plated. Moreover, the adhesiveness with respect to the board
  • the step of forming the metal layer metal layer forming step
  • a plating catalyst or a precursor thereof is applied to the patterned plating layer in the patterned plated layer-containing laminate, and plating is performed on the patterned plating layer to which the plating catalyst or the precursor is applied.
  • This is a step of performing a treatment to form a metal layer on the patterned layer to be plated. More specifically, by performing this step, as shown in FIG. 4C, a metal layer 24 is formed on the patterned layer to be plated 22, and a conductive laminate 26 is obtained.
  • process X which provides a plating catalyst or its precursor to a pattern-like to-be-plated layer
  • process Y process of performing a plating process with respect to the pattern-like to-be-plated layer to which the plating catalyst or its precursor was provided.
  • a plating catalyst or a precursor thereof is applied to the patterned layer to be plated.
  • the interactive group derived from the compound adheres (adsorbs) the applied plating catalyst or its precursor depending on its function. More specifically, a plating catalyst or a precursor thereof is applied on the surface of the patterned layer to be plated.
  • the plating catalyst or a precursor thereof functions as a catalyst or an electrode for plating treatment. Therefore, the type of plating catalyst or precursor used is appropriately determined depending on the type of plating treatment.
  • the plating catalyst used or its precursor is an electroless plating catalyst or its precursor.
  • the electroless plating catalyst or its precursor will be described in detail.
  • any catalyst can be used as long as it becomes an active nucleus at the time of electroless plating.
  • a metal (Ni) having catalytic ability for autocatalytic reduction reaction and those known as metals capable of electroless plating with a lower ionization tendency).
  • Specific examples include Pd, Ag, Cu, Ni, Pt, Au, and Co. Of these, Ag, Pd, Pt, and Cu are particularly preferable because of their high catalytic ability.
  • a metal colloid may be used as the electroless plating catalyst.
  • the electroless plating catalyst precursor used in this step can be used without particular limitation as long as it can become an electroless plating catalyst by a chemical reaction.
  • the metal ions of the metals mentioned as the electroless plating catalyst are mainly used.
  • the metal ion that is an electroless plating catalyst precursor becomes a zero-valent metal that is an electroless plating catalyst by a reduction reaction.
  • the metal ion that is the electroless plating catalyst precursor may be changed to a zero-valent metal by a reduction reaction separately to be used as an electroless plating catalyst.
  • the electroless plating catalyst precursor may be immersed in an electroless plating bath and changed to a metal (electroless plating catalyst) by a reducing agent in the electroless plating bath.
  • the metal ion that is the electroless plating catalyst precursor is preferably applied to the patterned layer to be plated using a metal salt.
  • the metal salt used is not particularly limited as long as it is dissolved in a suitable solvent and dissociated into a metal ion and a base (anion), and M (NO 3 ) n , MCl n , M 2 / n (SO 4 ), M 3 / n (PO 4 ) (M represents an n-valent metal atom), and the like.
  • a metal ion the thing which said metal salt dissociated can be used suitably. For example, Ag ion, Cu ion, Ni ion, Co ion, Pt ion, Pd ion can be mentioned.
  • a zero-valent metal can also be used as a catalyst used for direct electroplating without electroless plating.
  • Examples of a method for applying a plating catalyst or a precursor thereof to a patterned layer to be plated include, for example, a solution in which a plating catalyst or a precursor thereof is dispersed or dissolved in an appropriate solvent (a plating catalyst or a precursor thereof and a solvent).
  • the catalyst-giving liquid containing the liquid is prepared, and the solution is applied onto the patterned layer to be plated, or the laminate having the patterned layer to be plated is immersed in the solution.
  • water and an organic solvent are used suitably.
  • the organic solvent is preferably a solvent that can penetrate the patterned layer to be plated, for example, acetone, methyl acetoacetate, ethyl acetoacetate, ethylene glycol diacetate, cyclohexanone, acetylacetone, acetophenone, 2- (1-cyclohexenyl) cyclohexanone.
  • acetone methyl acetoacetate, ethyl acetoacetate, ethylene glycol diacetate, cyclohexanone, acetylacetone, acetophenone, 2- (1-cyclohexenyl) cyclohexanone.
  • Propylene glycol diacetate, triacetin, diethylene glycol diacetate, dioxane, N-methylpyrrolidone, dimethyl carbonate, dimethyl cellosolve and the like can be used.
  • the pH of the catalyst-providing liquid containing the plating catalyst or its precursor and the solvent is not particularly limited. It is preferably 0 to 7.0, more preferably 3.2 to 6.8, and even more preferably 3.5 to 6.6.
  • the method for preparing the catalyst-imparting solution is not particularly limited, and a predetermined metal salt is dissolved in an appropriate solvent, and the pH is adjusted to a predetermined range using an acid or an alkali as necessary.
  • the concentration of the plating catalyst or its precursor in the solution (catalyst imparting solution) is not particularly limited, but is preferably 0.001 to 50% by mass, and more preferably 0.005 to 30% by mass.
  • the contact time is preferably about 30 seconds to 24 hours, more preferably about 1 minute to 1 hour.
  • the amount of adsorption of the plating catalyst or precursor of the patterned plating layer varies depending on the type of plating bath used, the type of catalytic metal, the interactive base type of the patterned plating layer, the method of use, etc. From the viewpoint of properties, 5 to 1000 mg / m 2 is preferable, 10 to 800 mg / m 2 is more preferable, and 20 to 600 mg / m 2 is particularly preferable.
  • a plating treatment is performed on the patterned layer to which the plating catalyst or its precursor is applied.
  • the method for the plating treatment is not particularly limited, and examples thereof include electroless plating treatment or electrolytic plating treatment (electroplating treatment).
  • the electroless plating process may be performed alone, or after the electroless plating process, the electrolytic plating process may be further performed.
  • so-called silver mirror reaction is included as a kind of the electroless plating process. Therefore, for example, the deposited metal ions may be reduced by a silver mirror reaction or the like to form a desired patterned metal layer, and then an electrolytic plating process may be performed.
  • the procedures of the electroless plating process and the electrolytic plating process will be described in detail.
  • the electroless plating treatment refers to an operation of depositing a metal by a chemical reaction using a solution in which metal ions to be deposited as a plating are dissolved.
  • the electroless plating in this step is performed, for example, by washing a laminate including a pattern-like plated layer provided with an electroless plating catalyst to remove excess electroless plating catalyst (metal), and then electroless plating bath It is preferable to immerse in As the electroless plating bath used, a known electroless plating bath can be used.
  • a substrate provided with a patterned plating layer provided with an electroless plating catalyst precursor is immersed in an electroless plating bath in a state where the electroless plating catalyst precursor is adsorbed or impregnated in the patterned plating layer Is preferably immersed in an electroless plating bath after the laminate is washed with water to remove excess electroless plating catalyst precursor (such as a metal salt).
  • electroless plating catalyst precursor such as a metal salt
  • reduction of the electroless plating catalyst precursor and subsequent electroless plating are performed in the electroless plating bath.
  • the electroless plating bath used here a known electroless plating bath can be used as described above.
  • the reduction of the electroless plating catalyst precursor may be performed as a separate step before electroless plating by preparing a catalyst activation liquid (reducing liquid) separately from the embodiment using the electroless plating liquid as described above. Is possible.
  • composition of a general electroless plating bath in addition to a solvent (for example, water), 1. 1. metal ions for plating; 2. reducing agent; Additives (stabilizers) that improve the stability of metal ions are mainly included.
  • the plating bath may contain known additives such as a plating bath stabilizer.
  • the organic solvent used in the electroless plating bath needs to be a solvent that can be used in water, and from this point, ketones such as acetone and alcohols such as methanol, ethanol, and isopropanol are preferably used. Copper, tin, lead, nickel, gold, silver, palladium, and rhodium are known as the types of metals used in the electroless plating bath.
  • the immersion time in the electroless plating bath is preferably about 1 minute to 6 hours, and more preferably about 1 minute to 3 hours.
  • the electroplating layer to which the catalyst or its precursor is applied Plating can be performed.
  • an electroplating process can be performed as needed after the said electroless-plating process.
  • the thickness of the formed metal layer can be adjusted as appropriate.
  • a method of electroplating a conventionally known method can be used.
  • a metal used for electroplating copper, chromium, lead, nickel, gold
  • the conductive laminate having a metal layer obtained by the above-described treatment can be applied to various applications, such as a touch panel (or touch panel sensor), a semiconductor chip, various electric wiring boards, FPC (Flexible printed circuits), COF (Chip on Film, TAB (Tape Automated Bonding), antenna, multilayer wiring board, mother board and the like can be applied.
  • a touch panel sensor capactance type touch panel sensor.
  • the metal layer in the conductive laminate functions as a detection electrode or a lead wiring in the touch panel sensor.
  • a touch panel sensor for example, a liquid crystal display device, an organic EL (electro-luminescence) display device
  • a touch panel a so-called capacitive touch panel is preferably exemplified.
  • FIG. 5 One embodiment in the case of applying the conductive laminate to the touch panel sensor is shown in FIG. As shown in FIG. 5, in the conductive laminate 126, the patterned plated layer 22 disposed on the adhesive layer 16, the detection electrode 28 and the lead wiring 30 disposed on the patterned plated layer 22, Have Note that the detection electrode 28 and the lead-out wiring 30 are composed of the metal layers described above.
  • the pattern-form plated layer 22 is formed at a position where the detection electrode 28 and the lead-out wiring 30 are to be disposed, and a metal layer is formed thereon. It is done. That is, the patterned plated layer 22 is disposed between the detection electrode 28 and the lead-out wiring 30 and the adhesive layer 16.
  • the detection electrode 28 functions as a sensing electrode that senses a change in capacitance when a touch panel sensor including the metal layer-containing laminate is incorporated as a member of the touch panel. Constitute.
  • the detection electrode 28 has a role of detecting the input position in the X direction of the operator's finger approaching the input area of the touch panel sensor, and has a function of generating a capacitance between the detection electrode 28 and the finger. Yes.
  • the detection electrodes 28 are electrodes that extend in the first direction (X direction) and are arranged at a predetermined interval in a second direction (Y direction) orthogonal to the first direction.
  • the lead-out wiring 30 is a member that plays a role for applying a voltage to the detection electrode 28.
  • the adhesive layer 32 is further extended in the Y direction and arranged at a predetermined interval in the X direction.
  • a plurality of detection electrodes 34 are further arranged to form a touch panel sensor that detects a change in mutual capacitance between the detection electrodes 28 and 34 and identifies the input position of the operator's finger. Is done.
  • a lead wire (not shown) is connected to the detection electrode 34.
  • a touch panel is configured by arranging a display device (not shown) on the detection electrode 34.
  • the present invention is not limited to this mode, and the pattern detection that can detect the X direction and the Y direction as the metal layer. Electrodes and lead wires may be arranged.
  • the detection electrode extending in the X direction and the detection electrode extending in the Y direction can be disposed as metal layers only on one side of the adhesive layer with the layer to be plated interposed therebetween.
  • an insulating layer is disposed between the detection electrode extending in the X direction and the detection electrode extending in the Y direction.
  • a lead-out wiring is directly provided for each of a plurality of detection area patterns (nodes) arranged in a predetermined area on the adhesive layer via a layer to be plated.
  • the ethyl acetate phase was washed four times with 300 mL of distilled water, dried over magnesium sulfate, and 80 g of raw material A was obtained by distilling off ethyl acetate.
  • 47.4 g of raw material A, 22 g of pyridine, and 150 mL of ethyl acetate were placed in a 500 mL three-necked flask and cooled in an ice bath.
  • 25 g of acrylic acid chloride was added dropwise while adjusting the internal temperature to 20 ° C. or lower. Then, it was raised to room temperature and reacted for 3 hours. After completion of the reaction, 300 mL of distilled water was added to stop the reaction.
  • a 500 mL three-necked flask was charged with 8 g of N, N-dimethylacetamide and heated to 65 ° C. under a nitrogen stream.
  • monomer M1 14.3 g, acrylonitrile (manufactured by Tokyo Chemical Industry Co., Ltd.) 3.0 g, acrylic acid (manufactured by Tokyo Chemical Industry) 6.5 g, V-65 (manufactured by Wako Pure Chemical Industries) 0.4 g of N
  • a solution of 8 g of N-dimethylacetamide was added dropwise over 4 hours. After completion of the dropwise addition, the reaction solution was further stirred for 3 hours.
  • the measurement was performed by dissolving the polymer in acetone and using KBr crystals. As a result of IR measurement, a peak was observed in the vicinity of 2240 cm ⁇ 1 , and it was found that acrylonitrile, which is a nitrile unit, was introduced into the polymer. Further, it was found from the acid value measurement that acrylic acid was introduced as a carboxylic acid group-containing unit. Further, it was dissolved in heavy DMSO (dimethyl sulfoxide) and measured by Bruker 300 MHz NMR (AV-300). 4.
  • DMSO dimethyl sulfoxide
  • composition Isopropanol (IPA), polymer 1, polyacrylic acid, methylenebisacrylamide (MBA), IRGACURE127 (manufactured by BASF) were prepared according to Table 1, and compositions 1 and 2 were obtained. In Table 1, the content of each component is displayed as mass% with respect to the total amount of the composition.
  • a PET film (A4300 manufactured by Toyobo Co., Ltd.) is prepared as a temporary support, the composition 1 is spin-coated on the PET film, dried at 80 ° C. for 5 minutes, and a layer for forming a layer to be plated (average thickness: 0.00). 2 ⁇ m) was formed.
  • FA-512AS manufactured by Hitachi Chemical Co., Ltd.
  • EHA 2-ethylhexyl acrylate
  • DDA dodecyl acrylate
  • HOA 2-hydroxyethyl acrylate
  • AIBN 2,2'-azobis (isobutyronitrile)
  • Coronate L55E manufactured by Nippon Polyurethane
  • isocyanate crosslinking agent was added to a solid content of 0.3% by mass and stirred well, and the resulting liquid was added to the layer for forming a layer to be plated.
  • it is coated with an applicator so that the dry film thickness (average thickness of the pressure-sensitive adhesive layer) is 75 ⁇ m, and dried at 100 ° C. for 3 minutes to form a pressure-sensitive adhesive layer.
  • a transfer film provided with an adhesive layer.
  • Example 2 A laminate 2 was produced according to the same procedure as in Example 1 except that the average thickness of the layer to be plated was changed from 0.2 ⁇ m to 1.0 ⁇ m.
  • Example 3 A laminate 3 was manufactured according to the same procedure as in Example 1 except that the average thickness of the layer to be plated was changed from 0.2 ⁇ m to 2.0 ⁇ m.
  • Example 4 A laminate 4 was produced according to the same procedure as in Example 1 except that the composition to be used was changed from the composition 1 to the composition 2.
  • Example 5 The laminated body 5 was manufactured according to the procedure similar to Example 1 except having used the glass substrate with an insulating layer prepared according to the following procedures instead of the glass substrate with a decoration layer.
  • a glass substrate with an insulating layer is formed by applying V-9510 (made by DIC and forming an insulating layer (average thickness: 30 ⁇ m) on the surface of the glass substrate with a decorative layer manufactured above on the side where the decorative layer is present. Manufactured.
  • Example 6 To the polymer solution prepared in Example 1, Coronate L55E (manufactured by Nippon Polyurethane) as an isocyanate crosslinking agent was added so that the solid content was 0.3% by mass, and the resulting liquid was stirred well. On the glass substrate with a decorative layer used in 1), an application layer was applied so that the dry film thickness (average thickness of the adhesive layer) was 75 ⁇ m, and dried at 100 ° C. for 3 minutes to form an adhesive layer. Next, the composition 1 was spin-coated on the adhesive layer, and dried at 80 ° C. for 5 minutes to form a layer for forming a layer to be plated (average thickness: 0.2 ⁇ m), thereby producing a laminate.
  • Coronate L55E manufactured by Nippon Polyurethane
  • composition 1 is spin-coated on the surface of the decorative layer-side glass substrate and dried at 80 ° C. for 5 minutes to form a layer to be plated (average thickness: 0.2 ⁇ m). Thus, the laminate 10 was manufactured. In this embodiment, the adhesive layer is not disposed.
  • a mesh-like layer to be plated (specifically, the length of one side of the opening 40 as shown in FIG. 7).
  • UV irradiation energy amount: 2J, 10 mW, wavelength: 256 nm
  • a photomask capable of obtaining W1 of 200 ⁇ m and the width W2 of the layer 42 to be plated is 5 ⁇ m, and 1 mass% carbonic acid at 40 ° C. It was immersed in an aqueous sodium solution for 5 minutes and developed to produce a mesh-like plated layer. The photomask was placed at a position 5 ⁇ m away from the top of the laminate surface.
  • the distance between the photomask and the layer to be plated disposed on the glass substrate is the thickness of the decorative layer. Min further away.
  • the glass substrate having the layer to be plated is made of Pd catalyst applying liquid MAT-2 (manufactured by Uemura Kogyo). The sample was immersed in a 5-fold diluted MAT-2A alone at room temperature for 5 minutes and washed twice with pure water.
  • the “Pd catalyst application liquid MAT-2 (manufactured by Uemura Kogyo Co., Ltd.) diluted MAT-2A 5 times” corresponds to a catalyst application liquid containing palladium ions, and its pH is 3.5. there were.
  • the obtained mesh copper layer was visually observed from a position of 30 cm on the glass substrate and evaluated according to the following criteria. This evaluation was performed by three testers, and the numerical values shown in Table 2 described later represent an average value of the three evaluations.
  • the width W2 of the layer to be plated obtained by the visibility evaluation was measured, and when the width was 4 to 6 ⁇ m, “A” was given, and when it was less than 4 ⁇ m or more than 6 ⁇ m, “B” was given.
  • the width of the portion where the layer to be plated is formed is 5 ⁇ m, and the above “A” intends that the variation from the opening of the photomask is small.
  • variety W2 is the value which measured the width
  • a patterned plating layer can be formed with excellent pattern accuracy, and as a result, a mesh line having a predetermined shape can be formed. It was also excellent in visibility.
  • Comparative Example 1 in which no adhesive layer was used, the desired effect was not obtained.
  • a photomask having a detection electrode and a lead-out wiring as shown in FIG. 5 is disposed on the layer for forming a layer to be plated of the laminate produced in Example 1, and UV irradiation (energy amount: 2 J, 10 mW, wavelength: 256 nm), immersed in a 1% by mass sodium carbonate aqueous solution at 40 ° C. for 5 minutes and developed to produce a patterned layer to be plated.
  • a similar plating process performed in the ⁇ visibility> evaluation was performed on the patterned layer to be plated, and a first detection electrode and a first lead wiring having a shape as shown in FIG. 5 were produced.
  • the adhesive layer A, the second detection electrode, and the second lead-out wiring were disposed on the formed first detection electrode and the first lead-out wiring.
  • the first detection electrodes are electrodes that extend in the first direction (X direction) and are arranged at a predetermined interval in a second direction (Y direction) orthogonal to the first direction.
  • the electrodes extend in the second direction (Y direction) and are arranged at a predetermined interval in a first direction (X direction) orthogonal to the second direction.
  • the laminate having the first detection electrode and the second detection electrode prepared above was bonded onto the display device via the adhesive layer A, and a touch panel in which the glass substrate constitutes the touch surface was prepared. Instead of the laminate used in Example 1, the laminates produced in Examples 2 to 6 were used, and touch panels were produced according to the above procedure.
  • Example 7 Using the obtained laminate, a touch panel in which a glass substrate constitutes a touch surface was produced.
  • both sides means an aspect in which the detection electrode extending in the X direction and the detection electrode extending in the Y direction are opposed to each other through the adhesive layer as shown in FIG.
  • one side intends a mode in which detection electrodes capable of detection in the X direction and the Y direction are arranged only on one side of the pressure-sensitive adhesive layer A having the pattern-like plated layer.
  • the touch panel formed using the laminate of the present invention can form a predetermined electrode pattern and is excellent in operability.

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  • Chemically Coating (AREA)

Abstract

La présente invention concerne : un stratifié dans lequel une couche à motifs destinée à être plaquée peut être mise en forme avec une excellente précision de motif; un stratifié conducteur et un procédé de production du stratifié conducteur; un capteur de panneau tactile; un panneau tactile; et un film de transfert. Un stratifié selon la présente invention comprend : un substrat; une couche décorative qui est disposée sur une région périphérique du substrat; une couche adhésive qui est disposée sur le substrat et sur la couche décorative; et une couche destinée à former une couche à plaquer, qui est disposée sur la couche adhésive et qui contient un constituant prédéfini.
PCT/JP2015/072889 2014-09-29 2015-08-13 Stratifié, stratifié conducteur et son procédé de fabrication, capteur de panneau tactile, panneau tactile, et film de transfert Ceased WO2016051971A1 (fr)

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JP2016551619A JP6275861B2 (ja) 2014-09-29 2015-08-13 積層体、導電性積層体およびその製造方法、タッチパネルセンサー、タッチパネル、転写フィルム

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WO2018012203A1 (fr) * 2016-07-15 2018-01-18 富士フイルム株式会社 Procédé de production de carte de circuit imprimé et carte de circuit imprimé
WO2019044998A1 (fr) * 2017-09-01 2019-03-07 富士フイルム株式会社 Film précurseur, procédé de fabrication de film conducteur double face, et capteur de panneau tactile
US20200278610A1 (en) * 2017-12-27 2020-09-03 Fujifilm Corporation Transfer film, electrode protective film, laminate, capacitive input device, and manufacturing method of touch panel
WO2021014801A1 (fr) * 2019-07-19 2021-01-28 住友化学株式会社 Stratifié optique et son procédé de production

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WO2018012203A1 (fr) * 2016-07-15 2018-01-18 富士フイルム株式会社 Procédé de production de carte de circuit imprimé et carte de circuit imprimé
JPWO2018012203A1 (ja) * 2016-07-15 2019-04-18 富士フイルム株式会社 配線基板の製造方法、及び、配線基板
WO2019044998A1 (fr) * 2017-09-01 2019-03-07 富士フイルム株式会社 Film précurseur, procédé de fabrication de film conducteur double face, et capteur de panneau tactile
US20200278610A1 (en) * 2017-12-27 2020-09-03 Fujifilm Corporation Transfer film, electrode protective film, laminate, capacitive input device, and manufacturing method of touch panel
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WO2021014801A1 (fr) * 2019-07-19 2021-01-28 住友化学株式会社 Stratifié optique et son procédé de production

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