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WO2016043006A1 - Composition de résine photosensible développable à l'eau pour impression flexographique et plaque originale en résine photosensible pour impression flexographique - Google Patents

Composition de résine photosensible développable à l'eau pour impression flexographique et plaque originale en résine photosensible pour impression flexographique Download PDF

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Publication number
WO2016043006A1
WO2016043006A1 PCT/JP2015/074140 JP2015074140W WO2016043006A1 WO 2016043006 A1 WO2016043006 A1 WO 2016043006A1 JP 2015074140 W JP2015074140 W JP 2015074140W WO 2016043006 A1 WO2016043006 A1 WO 2016043006A1
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WIPO (PCT)
Prior art keywords
photosensitive resin
parts
resin composition
flexographic printing
water
Prior art date
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Ceased
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PCT/JP2015/074140
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English (en)
Japanese (ja)
Inventor
渉 川島
準 蓮池
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Toyobo Co Ltd
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Toyobo Co Ltd
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Priority to JP2015547168A priority Critical patent/JP5863086B1/ja
Publication of WO2016043006A1 publication Critical patent/WO2016043006A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/037—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyamides or polyimides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers

Definitions

  • the present invention relates to a water-developable photosensitive resin composition for flexographic printing and a photosensitive resin original plate for flexographic printing, which suppresses adhesion of dust, dust, paper powder, etc. to a relief and prevents printed material defects.
  • a photosensitive resin printing plate generally used as a flexographic printing plate is formed as follows. First, the photosensitive resin as a raw material is irradiated with active light, and only the photosensitive layer in the relief portion is cured by a radical polymerization reaction (exposure process). Next, the uncured resin other than the relief portion is dissolved and removed with a predetermined cleaning solution (developer) or swelled and dispersed and mechanically removed (development process).
  • This forming method is a method in which only a cured portion appears as a relief on the plate surface. The formation method is preferably used because a fine relief can be formed in a short time.
  • the high-hardness plate using the polyamide-based photosensitive resin composition has resistance to the ink that forms a coating film by ultraviolet irradiation, and is therefore used for printing applications using UV ink and UV varnish. Yes.
  • a low hardness letterpress printing plate that can be used for flexographic printing has a problem of surface adhesion that is considered to be due to flexibility, and there is a problem that dust, dust, paper dust, etc. adhere to the printing plate surface. It was.
  • Patent Document 1 proposes a photosensitive resin composition comprising a polyurethane prepolymer containing a specific benzoic acid derivative as an adhesion reducing additive. This document describes that the relief surface is made non-adhesive by irradiating germicidal radiation after subjecting the photosensitive resin composition to exposure and development.
  • Patent Document 2 proposes a method for detackifying the surface of many flexographic printing plates obtained by a production method including a washing (developing) step and a post-exposure step.
  • This method is a method using a cleaning liquid containing a hydrogen abstracting agent (for example, benzophenone).
  • a hydrogen abstracting agent for example, benzophenone
  • the surface of the flexographic printing plate relief is formed by irradiating radiation (for example, sterilizing beam for benzophenone) that activates the hydrogen abstracting agent after washing off the uncured resin with such a cleaning liquid.
  • irradiating radiation for example, sterilizing beam for benzophenone
  • an adhesion reducing additive is contained in the photosensitive resin composition or the cleaning liquid and attempts are made to improve by irradiation with ultraviolet rays, but the effect may change depending on the irradiation time of ultraviolet rays.
  • exposure time depends on paper dust at the time of printing (a phenomenon in which ink or printing support or paper dust existing in the environment adheres to the relief during printing) There was a problem and there was a need for improvement.
  • the present invention has been made against the background of the problems of the prior art. That is, the object of the present invention is to provide a high-quality flexographic printing plate precursor that satisfies the requirements of reducing the adhesion of dust, dust, and paper dust to the relief and UV ink resistance while being a low-hardness plate used for flexographic printing. It is in providing a conductive resin composition.
  • the present invention comprises the following configurations (1) to (4).
  • a photosensitive resin composition for flexographic printing (D) The fatty acid is one or a mixture of two or more selected from fatty acids having 12 to 22 carbon atoms, and the proportion of (d) fatty acid in the photosensitive resin composition is 0.5 to 8.0% by weight.
  • a water-developable photosensitive resin composition for flexographic printing (2) The photosensitive resin composition for flexographic printing according to (1), wherein the (a) polyamide block copolymer has a urea bond and / or a urethane bond in addition to the amide bond. (3) It includes a photosensitive resin layer composed of the water-developable photosensitive resin composition for flexographic printing described in (1) or (2), a support, and an adhesive layer for bonding them.
  • the photosensitive resin composition for flexographic printing of the present invention contains a specific amount of a long-chain fatty acid having a specific number of carbon atoms, the photosensitive resin original plate using this has a relief surface while maintaining relief reproducibility. As a result, it becomes difficult for dust, dust, and paper dust to adhere to the relief, and it is possible to make it difficult to cause a defect of missing printed matter.
  • the photosensitive resin composition for flexographic printing of the present invention is particularly suitable for a flexographic printing original plate using UV ink or UV varnish.
  • the photosensitive resin original plate for flexographic printing of the present invention includes a photosensitive resin layer composed of the photosensitive resin composition for flexographic printing of the present invention, an adhesive layer, and a support, and the adhesive layer is sensitive to the support and the photosensitive layer. In order to improve the adhesiveness of the resin layer, it is provided between them.
  • the support used for the photosensitive resin original plate of the present invention is flexible, but a material excellent in dimensional stability is preferable, for example, a metal support such as steel, aluminum, copper, nickel, a polyethylene terephthalate film, Mention may be made of a thermoplastic resin support such as a polyethylene naphthalate film, a polybutylene terephthalate film, or a polycarbonate film. Among these, a polyethylene terephthalate film having excellent dimensional stability and sufficiently high viscoelasticity is particularly preferable.
  • the thickness of the support is preferably from 50 to 350 ⁇ m, and preferably from 100 to 250 ⁇ m, from the standpoint of mechanical properties, shape stabilization, or handleability during plate making.
  • the adhesive layer used in the photosensitive resin original plate of the present invention is provided between the support and the photosensitive resin layer so as to bond both.
  • the adhesive layer may be formed from one layer or a plurality of layers.
  • the adhesive layer preferably contains a binder component and a pigment, and further contains a leveling agent and a curing agent.
  • binder component used in the adhesive layer examples include polyester resin, epoxy resin, polyamide resin, polyimide resin, phenol resin, butadiene resin, polyurethane resin, polystyrene-polyisoprene copolymer resin, and the like. Can be used in or mixed.
  • particularly preferred binder components are polyester resins and polyurethane resins in terms of solvent resistance.
  • the photosensitive resin layer used for the photosensitive resin original plate of the present invention is composed of the photosensitive resin composition of the present invention.
  • the photosensitive resin composition of the present invention comprises (a) a polyamide and / or a polyamide block copolymer, (b) a crosslinking agent having one or more unsaturated groups, (c) a photopolymerization initiator, and (d) Consists of fatty acids.
  • the photosensitive resin composition may further contain other additives such as a thermal polymerization inhibitor, a plasticizer, a dye, a pigment, a fragrance, or an antioxidant.
  • Polyamide and / or polyamide block copolymer is a polymer compound having 70% by weight or more of structural units composed of amide bonds in the molecule.
  • Examples include polyether amides, polyether ester amides, tertiary nitrogen-containing polyamides, ammonium salt-type tertiary nitrogen atom-containing polyamides, addition polymers of amide compounds having one or more amide bonds and organic diisocyanate compounds.
  • ammonium salt type tertiary nitrogen atom-containing polyamide is preferred.
  • the tertiary nitrogen atom-containing polyamide and the ammonium salt type tertiary nitrogen atom-containing polyamide are contained, the developability is improved by containing an organic acid.
  • the organic acid include, but are not limited to, acetic acid, lactic acid, and methacrylic acid.
  • the polyamide block copolymer may have a urea bond and / or a urethane bond in addition to the amide bond.
  • the UV ink has poor UV ink resistance of the photosensitive resin layer because the composition component similar to that of the photosensitive resin composition used for the printing original plate is used. Resistance to UV ink can be improved by using a polyamide having an amide bond and / or a polyamide block copolymer.
  • the proportion of component (a) in the photosensitive resin composition is preferably 25 to 75% by weight.
  • the polyamide block copolymer is preferably a polyalkylene glycol from the viewpoint that flexibility can be imparted. Specific examples of the alkylene glycol include polyethylene glycol and copolymers thereof.
  • crosslinking agent having one or more unsaturated groups examples include dipentaerythritol, pentaerythritol, trimethylolpropane, glycerin, ethylene glycol, diethylene glycol, triethylene glycol, phthalic acid, ethylene oxide adduct, bisphenol Diglycidyl ether acrylic acid adduct of A or bisphenol F, ethylene glycol di (meth) acrylate, neopentyl glycol di (meth) acrylate, glycerol di (meth) acrylate, trimethylolpropane tri (meth) acrylate, pentaerythritol penta ( Addition reaction product of poly (glycidyl ether) such as (meth) acrylate and dipentaerythritol penta (meth) acrylate and (meth) acrylic acid, such as adipic acid The reaction adducts of valence carboxylic acid and glycerin,
  • Examples of the photopolymerization initiator include benzophenones, benzoins, acetophenones, benzyls, benzoin alkyl ethers, benzyl alkyl ketals, anthraquinones, thioxanthones, and the like.
  • the proportion of component (c) in the photosensitive resin composition is preferably in the range of 0.01 to 10% by weight.
  • the fatty acid is a fatty acid having 12 to 22 carbon atoms, preferably 14 to 22 carbon atoms, more preferably 16 to 22 carbon atoms, or a mixture of two or more.
  • fatty acids include lauric acid, myristic acid, palmitic acid, margaric acid, stearic acid, arachidic acid, and behenic acid. Palmitic acid, margaric acid having 16 to 22 carbon atoms, Stearic acid, arachidic acid and behenic acid are preferred.
  • the proportion of the (d) fatty acid in the photosensitive resin composition is 0.5 to 8.0% by weight, more preferably 1.0 to 7.0% by weight, and still more preferably 2.0 to 6%. .5% by weight.
  • the proportion of (d) fatty acid is less than the above range, the tackiness cannot be reduced, and when the proportion of (d) fatty acid is more than the above range, the tackiness can be reduced.
  • fatty acid can be used not only by a single type but by mixing two or more types.
  • a part of carboxylic acid may be metalized and esterified in the range which does not affect the adhesive reduction.
  • the fatty acid has a constant chain length of the alkyl chain, which is a hydrophobic component, and is present in a certain amount of proportion in the photosensitive resin layer.
  • the adhesiveness can be reduced, and as a result, it is possible to effectively prevent a printed matter from being lost due to adhesion of dust, dust, paper powder, etc. to the relief.
  • the thermal polymerization inhibitor is used to improve the thermal stability of the photosensitive resin layer.
  • the thermal polymerization inhibitor include hydroquinones, benzoquinones, phenols, catechols, aromatic amine compounds, bicrinic acids, phenothiazines, ⁇ -naphthoquinones, anthraquinones, nitro compounds, sulfur compounds and the like.
  • the amount of the thermal polymerization inhibitor used is preferably 0.001 to 2% by weight, more preferably 0.005 to 1% by weight of the photosensitive resin composition. These compounds can be used not only as a single kind but also as a mixture of two or more kinds.
  • the thickness of the photosensitive resin layer is preferably 0.1 to 10 mm. If the thickness of the photosensitive resin layer is small, the relief depth required for use as a printing plate material cannot be obtained. If the thickness is large, the weight of the printing plate material may be suppressed, and there may be a practical defect in handling. is there.
  • the photosensitive resin plate composition can be molded into the photosensitive resin layer by any known method such as hot pressing, casting, melt extrusion, solution casting, etc., in addition to the melt molding method.
  • the photosensitive resin original plate can be produced by laminating a photosensitive resin layer formed into a sheet shape on a support through an adhesive layer. Moreover, when supplying as a laminated body which laminated
  • a plastic film for example, a 125 ⁇ m thick polyester film coated with a transparent, non-adhesive polymer compound having a thickness of 1 to 3 ⁇ m dispersed or dissolved in a developer is used.
  • the photosensitive resin original plate having such a laminated structure is exposed by applying actinic rays from above a negative film or a positive film having a transparent image portion in close contact with the photosensitive resin layer. As a result, only the exposed portion is insolubilized and cured.
  • a light source such as a high pressure mercury lamp, an ultrahigh pressure mercury lamp, a metal halide lamp, a xenon lamp, or a chemical lamp, usually centered on a wavelength of 300 to 450 nm.
  • a non-exposed portion is dissolved and removed with an appropriate solvent, particularly neutral water, to obtain a printing plate having a clear image portion.
  • an appropriate solvent particularly neutral water
  • the effect of using the photosensitive resin composition of the present invention is shown by the following examples, but the present invention is not limited thereto.
  • the part in an Example means a weight part.
  • surface also means a weight part.
  • a transparent pale yellow alcohol-soluble end having a specific viscosity of 1.5 was essentially a primary amino group, and an oligomer having a number average molecular weight of about 3,000 in which amide bonds were bonded in a block form was obtained.
  • An organic diisocyanate compound having isocyanate groups substantially at both ends obtained by dissolving 46 parts of this oligomer in 200 parts of methanol and then reacting 1000 parts of polypropylene glycol (weight average molecular weight: 1000) with 369 parts of hexamethylene diisocyanate. 9 parts were gradually added with stirring. Both reactions were completed at 65 ° C. in about 15 minutes.
  • This solution was placed in a petri dish coated with Teflon (registered trademark), and methanol was removed by evaporation, followed by drying under reduced pressure to obtain a polyamide block copolymer (polymer compound 1).
  • This polyamide block copolymer is a high molecular compound having a specific viscosity of 2.0, containing 82% by weight of a block component of a structural unit comprising an amide bond, and containing a urea bond and a urethane bond in addition to the amide bond. It was.
  • a transparent pale yellow alcohol-soluble end having a specific viscosity of 1.5 was essentially a primary amino group, and an oligomer having a number average molecular weight of about 3,000 in which amide bonds were bonded in a block form was obtained.
  • This solution was placed in a petri dish coated with Teflon (registered trademark), and methanol was removed by evaporation, followed by drying under reduced pressure to obtain a polyamide block copolymer (polymer compound 2).
  • This polyamide block copolymer is a high molecular compound having a specific viscosity of 2.1, containing 90% by weight of a block unit of a structural unit comprising an amide bond, and containing a urea bond and a urethane bond in addition to the amide bond. It was.
  • a 2 ⁇ m-thick polyvinyl alcohol film (AH-26, manufactured by Nippon Synthetic Chemical Co., Ltd.) was coated on a 125 ⁇ m polyester film to prepare a cover part.
  • Example 1 (Preparation of photosensitive resin plate composition) 55 parts of the above polymer compound 1 were dissolved by heating in 100 parts of methanol at 65 ° C., and 9.0 parts of N-ethyltoluenesulfonic acid amide, 0.001 part of 1,4-naphthoquinone, 0 part of hydroquinone monomethyl ether were used as plasticizers. .1 part was added and dissolved by stirring for 30 minutes.
  • photosensitive resin plate (Preparation of photosensitive resin plate)
  • the photosensitive resin composition is cast in contact with the adhesive layer of the support part, and the total thickness of the laminator is 1390 ⁇ m, so that the coating side of the cover part is in contact with the photosensitive resin composition.
  • a photosensitive resin plate having a sheet-like laminate having a resin layer thickness of 932 ⁇ m was prepared. Details of the photosensitive resin composition and evaluation results are shown in Table 1.
  • Example 2 Preparation of photosensitive resin plate composition
  • 55 parts of the above polymer compound 2 were dissolved by heating in 100 parts of methanol at 65 ° C., and 9.0 parts of N-ethyltoluenesulfonic acid amide, 0.001 part of 1,4-naphthoquinone, 0 part of hydroquinone monomethyl ether were used as plasticizers. .1 part was added and dissolved by stirring for 30 minutes.
  • Example 3 Preparation of photosensitive resin plate composition
  • 55 parts of the above polymer compound 3 were dissolved by heating in 100 parts of methanol at 65 ° C., and 9.0 parts of N-ethyltoluenesulfonic acid amide, 0.001 part of 1,4-naphthoquinone, 0 part of hydroquinone monomethyl ether were used as plasticizers. .1 part was added and dissolved by stirring for 30 minutes.
  • Example 4 Preparation of photosensitive resin plate composition
  • 55 parts of the above polymer compound 1 were dissolved by heating in 100 parts of methanol at 65 ° C., and 9.0 parts of N-ethyltoluenesulfonic acid amide, 0.001 part of 1,4-naphthoquinone, 0 part of hydroquinone monomethyl ether were used as plasticizers. .1 part was added and dissolved by stirring for 30 minutes.
  • Example 5 Preparation of photosensitive resin plate composition
  • 55 parts of the above polymer compound 3 were dissolved by heating in 100 parts of methanol at 65 ° C., and 9.0 parts of N-ethyltoluenesulfonic acid amide, 0.001 part of 1,4-naphthoquinone, 0 part of hydroquinone monomethyl ether were used as plasticizers. .1 part was added and dissolved by stirring for 30 minutes.
  • Example 6 Preparation of photosensitive resin plate composition
  • 55 parts of the above polymer compound 1 were dissolved by heating in 100 parts of methanol at 65 ° C., and 9.0 parts of N-ethyltoluenesulfonic acid amide, 0.001 part of 1,4-naphthoquinone, 0 part of hydroquinone monomethyl ether were used as plasticizers. .1 part was added and dissolved by stirring for 30 minutes.
  • Comparative Example 1 (Preparation of photosensitive resin plate composition) 55 parts of the above polymer compound 1 were dissolved by heating in 100 parts of methanol at 65 ° C., and 9.0 parts of N-ethyltoluenesulfonic acid amide, 0.001 part of 1,4-naphthoquinone, 0 part of hydroquinone monomethyl ether were used as plasticizers. .1 part was added and dissolved by stirring for 30 minutes.
  • Comparative Example 2 Preparation of photosensitive resin plate composition
  • 55 parts of the above polymer compound 3 were dissolved by heating in 100 parts of methanol at 65 ° C., and 9.0 parts of N-ethyltoluenesulfonic acid amide, 0.001 part of 1,4-naphthoquinone, 0 part of hydroquinone monomethyl ether were used as plasticizers. .1 part was added and dissolved by stirring for 30 minutes.
  • Comparative Example 3 Preparation of photosensitive resin plate composition
  • 55 parts of the above polymer compound 1 were dissolved by heating in 100 parts of methanol at 65 ° C., and 9.0 parts of N-ethyltoluenesulfonic acid amide, 0.001 part of 1,4-naphthoquinone, 0 part of hydroquinone monomethyl ether were used as plasticizers. .1 part was added and dissolved by stirring for 30 minutes.
  • Comparative Example 4 Preparation of photosensitive resin plate composition
  • 55 parts of the above polymer compound 1 were dissolved by heating in 100 parts of methanol at 65 ° C., and 9.0 parts of N-ethyltoluenesulfonic acid amide, 0.001 part of 1,4-naphthoquinone, 0 part of hydroquinone monomethyl ether were used as plasticizers. .1 part was added and dissolved by stirring for 30 minutes.
  • the photosensitive resin composition is placed in contact with the adhesive layer of the support, and the total thickness of the photosensitive resin layer is 1390 ⁇ m so that the coating side of the cover is in contact with the photosensitive resin composition.
  • a photosensitive resin plate was produced by heat press heated to 100 ° C. so as to form a sheet-like laminate having a thickness of 932 ⁇ m. Details of the photosensitive resin composition and evaluation results are shown in Table 1.
  • Example 7 Preparation of photosensitive resin plate composition
  • 50 parts of the above polymer compound 1 is dissolved in 100 parts of methanol by heating at 65 ° C., and 9.0 parts of diethylene glycol, 0.001 part of 1,4-naphthoquinone and 0.1 part of hydroquinone monomethyl ether are added as plasticizers.
  • 1 part of stearic acid, 9 parts of lactic acid, 18 parts of water, 1 part of benzyl dimethyl ketal as a photopolymerization initiator, and 30 parts of acrylic acid adduct of glycerin diglycidyl ether as a photopolymerizable unsaturated compound were added for 30 minutes.
  • the mixture was dissolved with stirring.
  • Example 8 Preparation of photosensitive resin plate composition
  • 50 parts of the above polymer compound 1 is dissolved in 100 parts of methanol by heating at 65 ° C., and 9.0 parts of diethylene glycol, 0.001 part of 1,4-naphthoquinone and 0.1 part of hydroquinone monomethyl ether are added as plasticizers. For 30 minutes with stirring. Thereafter, 3 parts of stearic acid, 7 parts of lactic acid, 18 parts of water, 1 part of benzyl dimethyl ketal as a photopolymerization initiator, and 30 parts of an acrylic acid adduct of propylene glycol diglycidyl ether as a photopolymerizable unsaturated compound were added.
  • Example 9 Preparation of photosensitive resin plate composition
  • 50 parts of the above polymer compound 1 is dissolved in 100 parts of methanol by heating at 65 ° C., and 9.0 parts of diethylene glycol, 0.001 part of 1,4-naphthoquinone and 0.1 part of hydroquinone monomethyl ether are added as plasticizers.
  • 9.0 parts of diethylene glycol, 0.001 part of 1,4-naphthoquinone and 0.1 part of hydroquinone monomethyl ether are added as plasticizers.
  • 5 parts of stearic acid, 5 parts of lactic acid, 18 parts of water, 1 part of benzyl dimethyl ketal as a photopolymerization initiator, and 30 parts of acrylic acid adduct of glycerin diglycidyl ether as a photopolymerizable unsaturated compound were added for 30 minutes.
  • the mixture was dissolved with stirring.
  • Comparative Example 6 Preparation of photosensitive resin plate composition
  • 50 parts of the above polymer compound 1 is dissolved in 100 parts of methanol by heating at 65 ° C., and 9.0 parts of diethylene glycol, 0.001 part of 1,4-naphthoquinone and 0.1 part of hydroquinone monomethyl ether are added as plasticizers.
  • the mixture was dissolved with stirring for 30 minutes.
  • 0.2 parts of stearic acid, 9.8 parts of lactic acid, 18 parts of water, 1 part of benzyldimethyl ketal as a photopolymerization initiator, and 30 parts of an acrylic acid adduct of glycerin diglycidyl ether as a photopolymerizable unsaturated compound are added.
  • Comparative Example 7 (Preparation of photosensitive resin plate composition) 50 parts of the above polymer compound 1 is dissolved in 100 parts of methanol by heating at 65 ° C., and 9.0 parts of diethylene glycol, 0.001 part of 1,4-naphthoquinone and 0.1 part of hydroquinone monomethyl ether are added as plasticizers. For 30 minutes with stirring. Thereafter, 10 parts of stearic acid, 18 parts of water, 1 part of benzyldimethyl ketal as a photopolymerization initiator, and 30 parts of an acrylic acid adduct of propylene glycol diglycidyl ether as a photopolymerizable unsaturated compound were added and dissolved by stirring for 30 minutes. It was.
  • the polyester film of 125 ⁇ m is peeled off and the inspection negative film is vacuum-adhered, and the height is higher than the surface of the photosensitive resin by using actinic rays (light source Philips 10R, illuminance 9 mW / cm 2 at 365 nm). Irradiation was performed at an exposure time of 16 steps from a distance of 5 cm. Inspection negative film image is halftone dot 150 lines 2%-95% Independent points Diameter 200 ⁇ m, 300 ⁇ m Independent thin lines 40 ⁇ m, 50 ⁇ m Relief depth Line with slit width 300 ⁇ m Step guide What has a gray scale negative film for sensitivity measurement was used.
  • ⁇ Image is missing, there is no twist, halftone dots, independent points, independent thin lines are reproduced, In addition, a slit depth of 300 ⁇ m and a slit depth of 50 ⁇ m or more could be reproduced.
  • ⁇ The image was missing, there was no distortion, and halftone dots, independent points, and independent thin lines were not reproduced. Reproduced with slit width of 300 ⁇ m and slit depth of 50 ⁇ m or less
  • the adhesive layer film surface of the produced relief was attached to an iron plate with a double-sided tape, and the relief was tilted and installed so that the inclination angle was 5 °. Thereafter, a steel sphere having a diameter of 11 mm and a weight of 5.5 g was placed on the surface of the upper part of the relief, and the time for rolling 120 mm was measured and evaluated.
  • the evaluation results were displayed according to the following criteria. ⁇ : Rolled within 3 seconds ⁇ : Rolled over 3 seconds within 10 seconds ⁇ : Rolled over 10 seconds
  • the solid print omission evaluation was carried out by using a Flexure printing machine (manufactured by MK Corporation: FPR302) using Bestcure (manufactured by T & K TOKA Co., Ltd.) as ink and Thunderbird coated paper as printing paper.
  • anilox uses an 800-line anilox roll
  • cushion sheet uses SA3120LL18 (manufactured by ROGERS CORPORATION), and adjusts the printing pressure (distance where the relief is pushed into the paper) so that the solid ink density is 1.6 abs.
  • the printing speed was 40 m / min, and the number of missing prints at the time when 1000 shots were printed was evaluated.
  • the evaluation results were displayed according to the following criteria.
  • ⁇ Number of omissions is less than 5
  • Number of omissions is 5 or more and less than 10
  • Number of omissions is 10 or more
  • Example 10 After storing the raw plate for 7 days or more using the raw plate described in Example 1, the polyester film of 125 ⁇ m is peeled off to give a solid image of 150 ⁇ 100 mm (image capable of exposing the entire surface of 150 ⁇ 100 mm). The film was brought into vacuum contact, and irradiated with an actinic ray (light source Philips 10R, illuminance 9 mW / cm 2 at 365 nm) from a distance of 5 cm above the surface of the photosensitive resin for an exposure time of 16 steps. Next, with a brush type washer (120 ⁇ m ⁇ nylon brush, JW-A2-PD type produced by JEOL Ltd.), tap water was used as a developer and developed at 30 ° C. to obtain a relief image. After that, a relief obtained by drying with warm air for 10 minutes at 70 ° C. and post-exposure with the same actinic ray for 1 minute was prepared. Thereafter, various evaluations were performed. The evaluation results are shown in Table 3.
  • Example 11 After storing the raw plate for 7 days or more using the raw plate described in Example 1, the polyester film of 125 ⁇ m is peeled off to give a solid image of 150 ⁇ 100 mm (image capable of exposing the entire surface of 150 ⁇ 100 mm).
  • the film was brought into vacuum contact, and irradiated with an actinic ray (light source Philips 10R, illuminance 9 mW / cm 2 at 365 nm) from a distance of 5 cm above the surface of the photosensitive resin for an exposure time of 16 steps.
  • an actinic ray light source Philips 10R, illuminance 9 mW / cm 2 at 365 nm
  • tap water was used as a developer and developed at 30 ° C. to obtain a relief image.
  • the present invention it is possible to produce a relief having a low surface adhesiveness, further reduce defects during printing, and it is very easy to improve printing quality. It is expected to contribute greatly to the world.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Materials For Photolithography (AREA)

Abstract

　L'invention concerne une composition de résine photosensible de haute qualité pour une plaque originale d'impression flexographique. La composition de résine photosensible selon l'invention présente une bonne résistance d'encres UV et une adhérence réduite de poussière, saletés et poudre de papier sur un relief lorsqu'elle est façonnée en une plaque à faible dureté utilisée dans l'impression flexographique. La composition de résine photosensible développable à l'eau pour impression flexographique selon l'invention contient au moins (a) un polyamide et/ou un copolymère bloc polyamide, (b) un agent de réticulation doté d'au moins un groupe insaturé, (c) un initiateur de photopolymérisation et (d) un acide gras, la composition de résine selon l'invention se caractérisant en ce que l'acide gras (d) est un type ou un mélange d'au moins deux types d'acide gras sélectionné parmi les acides gras C12-22, et en ce que la proportion de l'acide gras (d) dans la composition de résine photosensible est comprise entre 0,5 et 8,0 % en poids.
PCT/JP2015/074140 2014-09-19 2015-08-27 Composition de résine photosensible développable à l'eau pour impression flexographique et plaque originale en résine photosensible pour impression flexographique Ceased WO2016043006A1 (fr)

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JP2015547168A JP5863086B1 (ja) 2014-09-19 2015-08-27 水現像可能なフレキソ印刷用感光性樹脂組成物及びフレキソ印刷用感光性樹脂原版

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JP2014-191164 2014-09-19
JP2014191164 2014-09-19

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WO2016043006A1 true WO2016043006A1 (fr) 2016-03-24

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016143580A1 (fr) * 2015-03-06 2016-09-15 東レ株式会社 Composition de résine photosensible et composant électronique
WO2017159199A1 (fr) * 2016-03-16 2017-09-21 東洋紡株式会社 Composition de résine photosensible pour impression flexographique permettant un développement à l'eau, et plaque originale de résine photosensible pour impression flexographique obtenue à l'aide de celle-ci
US11656551B2 (en) 2017-09-05 2023-05-23 Toyobo Co., Ltd. Water-developable photosensitive resin composition for flexographic printing and photosensitive resin original plate for flexographic printing obtained therefrom

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08286361A (ja) * 1996-03-08 1996-11-01 Asahi Chem Ind Co Ltd 印刷版の製造方法およびこの方法で得られた印刷版
JP2000075481A (ja) * 1998-08-28 2000-03-14 Macdermid Inc 印刷用プレ―トを構成するのに有用な感光性樹脂組成物
JP2000206677A (ja) * 1999-01-14 2000-07-28 Macdermid Inc フレキソ印刷板用感光性樹脂組成物
JP2003307834A (ja) * 2002-04-15 2003-10-31 Unitika Ltd 感光性樹脂印刷版用粘着防止層組成物、及びそれを用いた保護フィルム
JP2012022229A (ja) * 2010-07-16 2012-02-02 Toray Ind Inc 感光性樹脂印刷版原版

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08286361A (ja) * 1996-03-08 1996-11-01 Asahi Chem Ind Co Ltd 印刷版の製造方法およびこの方法で得られた印刷版
JP2000075481A (ja) * 1998-08-28 2000-03-14 Macdermid Inc 印刷用プレ―トを構成するのに有用な感光性樹脂組成物
JP2000206677A (ja) * 1999-01-14 2000-07-28 Macdermid Inc フレキソ印刷板用感光性樹脂組成物
JP2003307834A (ja) * 2002-04-15 2003-10-31 Unitika Ltd 感光性樹脂印刷版用粘着防止層組成物、及びそれを用いた保護フィルム
JP2012022229A (ja) * 2010-07-16 2012-02-02 Toray Ind Inc 感光性樹脂印刷版原版

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016143580A1 (fr) * 2015-03-06 2016-09-15 東レ株式会社 Composition de résine photosensible et composant électronique
WO2017159199A1 (fr) * 2016-03-16 2017-09-21 東洋紡株式会社 Composition de résine photosensible pour impression flexographique permettant un développement à l'eau, et plaque originale de résine photosensible pour impression flexographique obtenue à l'aide de celle-ci
US11656551B2 (en) 2017-09-05 2023-05-23 Toyobo Co., Ltd. Water-developable photosensitive resin composition for flexographic printing and photosensitive resin original plate for flexographic printing obtained therefrom

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