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WO2015121999A1 - Insulated wire, rotary electric machinery, and method for producing insulated wire - Google Patents

Insulated wire, rotary electric machinery, and method for producing insulated wire Download PDF

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Publication number
WO2015121999A1
WO2015121999A1 PCT/JP2014/053576 JP2014053576W WO2015121999A1 WO 2015121999 A1 WO2015121999 A1 WO 2015121999A1 JP 2014053576 W JP2014053576 W JP 2014053576W WO 2015121999 A1 WO2015121999 A1 WO 2015121999A1
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WO
WIPO (PCT)
Prior art keywords
insulated wire
resin
resin layer
insulating resin
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2014/053576
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French (fr)
Japanese (ja)
Inventor
康太郎 荒谷
悟 天羽
義昭 岡部
孝仁 村木
唯 新井
智和 棚瀬
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Hitachi Ltd
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Hitachi Ltd
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Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to PCT/JP2014/053576 priority Critical patent/WO2015121999A1/en
Publication of WO2015121999A1 publication Critical patent/WO2015121999A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/40Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00Apparatus or processes specially adapted for manufacturing conductors or cables
    • H01B13/06Insulating conductors or cables
    • H01B13/14Insulating conductors or cables by extrusion
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/36Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes condensation products of phenols with aldehydes or ketones
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F5/00Coils
    • H01F5/06Insulation of windings
    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02KDYNAMO-ELECTRIC MACHINES
    • H02K3/00Details of windings
    • H02K3/04Windings characterised by the conductor shape, form or construction, e.g. with bar conductors
    • H02K3/12Windings characterised by the conductor shape, form or construction, e.g. with bar conductors arranged in slots
    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02KDYNAMO-ELECTRIC MACHINES
    • H02K3/00Details of windings
    • H02K3/30Windings characterised by the insulating material

Definitions

  • the present invention relates to an insulated wire.
  • Patent Document 1 discloses a self-bonding enameled wire in which an insulating material is applied and baked on a conductor, and a fusion layer is formed on the conductor, from the viewpoint of reducing the number of steps by impregnating varnish-less.
  • Patent Document 2 discloses a DC power cable in which an insulator layer is formed by extrusion coating on the outer periphery of a conductor using an extruder.
  • the heat resistance of the insulated wire can be secured.
  • various properties such as pressure resistance, mechanical strength, chemical stability, water resistance and moisture resistance are required of the insulated wire.
  • Patent Document 2 in order to manufacture an insulated wire by a method using an extruder, the temperature at which the material is heated prior to extrusion molding is thermally cured at the coating portion on the insulated wire after extrusion molding It must be lower than the temperature.
  • the enameled wire of Patent Document 1 has a sulfone group-containing polyhydroxy polyether resin obtained by copolymerizing a bisphenol A epoxy unit and a bisphenol S epoxy unit, and this enameled wire has a melting temperature of 200 ° C. Since it is too high and it can not manufacture with the method using the extruder of patent document 2, it can not manufacture.
  • An object of the present invention is to provide an insulated wire excellent in heat resistance and pressure resistance and a rotary electric machine using the same.
  • an insulating resin layer is formed on the outer periphery of the conductor, and the insulating resin layer has a thermoplastic phenoxy resin and a crosslinking agent.
  • an insulated wire excellent in heat resistance and pressure resistance can be provided.
  • the insulated wire according to the present embodiment mainly includes a conductor and an insulating resin layer.
  • This insulated wire is suitable for the winding of a rotating electrical machine, and is an insulated wire that can be used in a high density environment where the wires are in close contact with each other by being wound.
  • the conductor according to the present embodiment is a linear conductor similar to the core wire of a general insulated wire, and is formed of a copper wire, an aluminum wire, an alloy wire thereof, or the like.
  • the copper wire may be made of any of tough pitch copper, oxygen free copper and deoxidized copper, and may be any of soft copper wire and hard copper wire. Moreover, the plating copper wire by which tin, nickel, silver, aluminum, etc. were plated on the surface may be sufficient.
  • the aluminum wire may be any of hard aluminum wire, semi-hard aluminum wire and the like. Also, as alloy wires, copper-tin alloy, copper-silver alloy, copper-zinc alloy, copper-chromium alloy, copper-zirconium alloy, aluminum-copper alloy, aluminum-silver alloy, aluminum-zinc alloy, aluminum-iron alloy And aluminum alloy (Aldrey Aluminum).
  • alloy wires copper-tin alloy, copper-silver alloy, copper-zinc alloy, copper-chromium alloy, copper-zirconium alloy, aluminum-copper alloy, aluminum-silver alloy, aluminum-zinc alloy, aluminum-iron alloy And aluminum alloy (Aldrey Aluminum).
  • the shape of the conductor according to the present embodiment may be either a round wire having a circular cross section or a flat wire having a rectangular cross section. Moreover, any of a single wire formed of one conductor and a stranded wire formed by twisting a plurality of conductors may be used.
  • the insulating resin layer according to this embodiment is characterized by using a thermoplastic phenoxy resin having a bisphenol A skeleton and a bisphenol F skeleton.
  • a phenoxy resin having a bisphenol A skeleton and a bisphenol F skeleton “YP-70” (Toto Kasei Co., Ltd.) can be used.
  • the phenoxy resin may be an acrylic modified phenoxy resin or a vinyl modified phenoxy resin. Acrylic modification is 1 type of vinyl modification.
  • the main component (50% by weight or more of the entire insulating resin layer as a whole) is made of a thermoplastic resin and crosslinked by heat treatment after the extrusion process. Therefore, after the extrusion process and before the heat treatment, it does not flow. In this non-flowing state, the insulating resin layer has self-bonding properties. The insulating resin layer is converted to a thermosetting resin by crosslinking, and the heat resistance is improved.
  • thermoplastic resin which the insulating resin layer which concerns on this embodiment contains, a phenoxy resin is preferable.
  • a crosslinking agent for crosslinking a thermoplastic resin a bismaleimide compound, an epoxy compound, and block isocyanate are mentioned.
  • an epoxy compound it is preferable to contain an imidazole as a catalyst.
  • epoxy compound bisphenol A type epoxy resin “grade name: 828” or “grade name: 1001” “grade name: 1004” “grade name: 1007” (manufactured by Japan Epoxy Resins Co., Ltd.) can be used.
  • blocked isocyanates examples include Duranate series “17B-60P” and “TPA-B80E” (manufactured by Asahi Kasei Chemicals Corporation).
  • the crosslinkable part can be converted from a hydroxyl group to an acrylate group, so that not only itself can be crosslinked alone, but also the bismaleimide compounds described above can be used.
  • an acrylate modified isocyanate isocyanate monomer series "Karenz MOI”, “Kalens AOI” (made by Showa Denko KK), etc. are mentioned.
  • the insulating resin layer according to the present embodiment contains an epoxy-containing compound such as bisphenol A epoxy resin “grade name: 1001” as a crosslinking agent, an amine-based catalyst, an imidazole, an aromatic sulfonium salt or the like as a catalyst Can be used. Furthermore, you may use a phenol resin and an acid anhydride as an additive. In addition, the additive demonstrated here contributes to a crosslinking reaction by the effect
  • Examples of amine catalysts include meta-xylene diamine and trimethylhexamethylene diamine.
  • Examples of imidazoles include 2-phenylimidazole and diazabicycloundecene.
  • Examples of acid anhydrides include tetrahydrophthalic anhydride and hexahydrophthalic anhydride.
  • the film thickness of the insulating resin layer according to the present embodiment is preferably 50 ⁇ m or more. If the film thickness of the insulating resin layer is 50 ⁇ m or more, the pressure resistance of the insulated wire can be secured in a high density state where the insulated wires are in close contact with each other.
  • another insulating resin layer may be included inside the insulating resin layer.
  • the insulated wire according to the present embodiment is wound, for example, as a winding around a stator core of a stator.
  • the rotary electric machine is provided with general motor components such as a rotor and an output shaft.
  • the rotary electric machine is suitable as, for example, a power generation device or a power generation device in a home electric appliance, an industrial electric appliance, a ship, a railway, an electric car, etc. by being provided with an insulated wire excellent in heat resistance and pressure resistance.
  • a power generation device or a power generation device in a home electric appliance an industrial electric appliance, a ship, a railway, an electric car, etc.
  • an insulated wire excellent in heat resistance and pressure resistance.
  • it has the property of being hard to cause dielectric breakdown due to heat, partial discharge, surge voltage and the like.
  • FIG. 4 is an enlarged view of the stator.
  • the conductor 2 and the resin film 12 are provided inside the core material (magnetic steel sheet) 11.
  • the conductor 2 and the resin film 12 are configured by the insulated wire 1.
  • Method of manufacturing insulated wire Next, the manufacturing method of the insulated wire which concerns on this embodiment is demonstrated using FIG.
  • the extrusion molding using the thermoplastic resin of the insulated wire 1 according to the present embodiment is performed using an extrusion molding machine 21 such as a crosshead die having a die according to a desired wire shape.
  • the insulating resin material 22 forming the resin layer is introduced into the hopper of the extrusion molding machine 21, supplied to the cylinder, heated to a temperature above the glass transition temperature, and brought into a molten state. Thereafter, the insulating resin material 22 which has been heated and melted is supplied to the crosshead while being kneaded by a screw provided in the cylinder.
  • the insulating resin material 22 is a resin mixture containing at least a thermoplastic phenoxy resin and a crosslinking agent (see resin mixture 1-4 described later).
  • a linear conductor core 23 is passed through the crosshead.
  • the outer periphery of the conductor core wire 23 is covered with the insulating resin material 22 melted when passing through the crosshead, and the insulated wire 1 is formed. It becomes possible to control the film thickness of the insulating resin layer of the insulated wire 1 by the quantity of the insulating resin material 22 to coat. As described above, in order to ensure pressure resistance, it is desirable to set the film thickness to 50 ⁇ m or more.
  • the insulating resin material 22 coated on the insulated wire 1 is in a state before the thermoplastic resin is crosslinked, it has a self-bonding property. Therefore, in the present invention, when manufacturing a stator, a rotor, etc. of a rotating electrical machine using the insulated wire 1, it is possible to bond using the self-fusion property of the insulated wire 1 without using a varnish. . Therefore, since the impregnation process to the varnish conventionally required when manufacturing a stator etc. can be skipped, this invention has the effect that productivity improves in manufacture of a stator etc. for rotary battle machines.
  • the temperature (first heating temperature) when the thermoplastic phenoxy resin used for the insulating resin material 22 is in a molten state is in the range of 100 to 140 ° C., and the thermosetting (crosslinking) of the thermoplastic phenoxy resin contained in the resin mixture It is desirable that the temperature (second heating temperature) at the time of)) is in the range of 160 to 180.degree. C., and the first heating temperature is 20.degree. Lower than the second heating temperature.
  • 80 g of tetrahydrofuran is placed in a 200 g polymer container with a lid, to which 16 g of an acrylic modified phenoxy resin "YP-70" (Toho Kasei Co., Ltd.) and 4 g of polyphenylmethane maleimide "BMI-2000" as a crosslinking agent (Daiwa Kasei Kogyo Co., Ltd. The solution was added and allowed to stand for one day to dissolve all the ingredients. After casting this solution to a Teflon solution, the tetrahydrofuran was removed by drying.
  • a resin mixture 1 having a thermoplastic phenoxy resin and bismaleimide was obtained.
  • the resin mixture 1 was formed on the outer periphery of a round wire with a diameter of 1 mm by extrusion molding to manufacture an insulated wire in which the insulating resin layer formed of the resin mixture 1 was formed.
  • the film thickness of the insulating resin layer was 0.2 mm.
  • the insulating resin layer having a thermoplastic phenoxy resin and a crosslinking agent has self-bonding properties. Therefore, when the insulated wire is fixed to the coil, it can be easily fixed without using a varnish.
  • FIG. 1 is a schematic cross-sectional view of the insulated wire according to the first embodiment.
  • the conductor 2 is a core wire having a circular cross section, and the insulating resin layer 3 mainly composed of phenoxy resin (that occupies 50% by weight or more of the whole insulating resin layer) It is covered.
  • tetrahydrofuran In a 200 g lidded polymer container, 80 g of tetrahydrofuran is placed, into which 16 g of phenoxy resin “YP-70” (Toto Kasei Co., Ltd.), 2 g of bisphenol A epoxy resin “grade name: 1001” as a crosslinking agent, 0 as a catalyst .5 g of imidazole-based curing catalyst "P-200” (manufactured by Japan Epoxy Resins Co., Ltd.) and 2 g of phenol resin H-4 (Meiwa Kasei Co., Ltd.) as an additive were added and allowed to stand overnight to dissolve all components. The solution was cast into a Teflon solution and the tetrahydrofuran was removed by drying.
  • phenoxy resin “YP-70” Toto Kasei Co., Ltd.
  • bisphenol A epoxy resin “grade name: 1001” as a crosslinking agent
  • P-200 imidazole-based
  • a resin mixture 2 having a thermoplastic phenoxy resin, an epoxy resin, an imidazole and a phenol resin was obtained.
  • a resin mixture 2 was formed on the outer periphery of a 1 mm ⁇ 2 mm rectangular wire by extrusion molding, to produce an insulated wire in which an insulating resin layer formed of the resin mixture 2 was formed.
  • the thickness of the insulating resin layer was 0.2 mm.
  • FIG. 3 is a schematic cross-sectional view of the insulated wire according to the second embodiment.
  • the conductor 2 has a core wire having a rectangular cross section, and the insulating resin layer 3 mainly composed of a thermoplastic phenoxy resin covers the entire periphery of the conductor 2.
  • the insulated wire of the present invention can be configured.
  • a phenoxy resin, a bisphenol A type epoxy resin, a phenol resin, and an imidazole-based curing catalyst are dissolved in tetrahydrofuran, and a resin mixture 2 is obtained after solvent drying.
  • resin mixture 2 may be obtained by directly melt-kneading a phenoxy resin, a bisphenol A type epoxy resin, a phenol resin, and an imidazole-based curing catalyst at an extrusion molding temperature or less.
  • 80 g of tetrahydrofuran is placed in a 200 g polymer container with a lid, 14 g of phenoxy resin "YP-70" (Tohto Kasei Co., Ltd.) and 2 g of bisphenol A epoxy resin "grade name: 1001" as a crosslinking agent are added as a catalyst 0.5 g of imidazole based curing catalyst "P-200" (manufactured by Japan Epoxy Resins Co., Ltd.), 2 g of phenol resin H-4 (Meiwa Kasei) as an additive, 2 g of bismaleimide "BMI-2000" (Daiwa Kasei Kogyo Co., Ltd.) Made in a company), and allowed to stand for one day to dissolve all the ingredients. The solution was cast into a Teflon solution and the tetrahydrofuran was removed by drying.
  • a resin mixture 3 having a thermoplastic phenoxy resin, an epoxy resin, an imidazole, a phenol resin and a bismaleimide was obtained.
  • the resin mixture 3 was formed on the outer periphery of a round wire with a diameter of 1 mm by extrusion molding to manufacture an insulated wire in which the insulating resin layer formed of the resin mixture 3 was formed.
  • the thickness of the insulating resin layer was 0.2 mm.
  • the insulated wire according to the third embodiment has a circular cross section as shown in FIG. 1 as in the first embodiment.
  • Example 3 When Example 3 is compared with Example 2, it was also confirmed that the heat resistance of the direction of Example 3 is improved by addition of bismaleimide. Furthermore, it was also confirmed that the adhesion to the core wire was improved by 20% or more by the addition of bismaleimide.
  • tetrahydrofuran In a 200 g lidded polymer container, 80 g of tetrahydrofuran is placed, into which 14 g of phenoxy resin "YP-70" (Toho Kasei Co., Ltd.), 3 g of duranate "17B-60P” as a crosslinking agent, 3 g of polyphenylmethane maleimide as an additive "BMI-2000" (manufactured by Daiwa Kasei Kogyo Co., Ltd.) was added and allowed to stand for one day to dissolve all components. The solution was cast into a Teflon solution and the tetrahydrofuran was removed by drying.
  • a resin mixture 4 having a thermoplastic phenoxy resin, duranate and a maleimide compound was obtained.
  • a resin mixture 4 was formed on the outer periphery of a 1 mm ⁇ 2 mm rectangular wire by extrusion molding, to produce an insulated wire in which an insulating resin layer formed of the resin mixture 4 was formed.
  • the thickness of the insulating resin layer was 0.2 mm.
  • the insulated wire according to the third embodiment has a flat cross section as shown in FIG. 3 as in the second embodiment.
  • An insulated wire according to an example in which two insulating resin layers were laminated on a conductor was manufactured.
  • a copper round wire with a diameter of 1 mm was used as the conductor.
  • the inner layer in the resin laminate was formed of a thermosetting polyimide varnish "Sun Ever SE-150" (manufactured by Nissan Chemical Industries, Ltd.), and the insulating resin layer of the outer layer was formed of the above-mentioned resin mixture 4.
  • thermosetting polyimide was applied to the outer periphery of a 1 mm diameter circular wire and temporarily dried at room temperature. And it baked at 300 degreeC in a thermostat for 1 hour, and formed the resin layer (inner layer) of polyimide. In addition, the film thickness of the formed resin layer (inner layer) was about 0.01 mm. Then, the insulated wire in which the insulation resin layer which comprises resin mixture 4 by extrusion molding was formed in the perimeter of this resin layer (inner layer) was manufactured. The film thickness of the resin layer (outer layer) was 0.2 mm.
  • FIG. 2 is a schematic cross-sectional view of an insulated wire according to a fifth embodiment.
  • the conductor 2 has a core wire having a circular cross section, and the inner layer insulating resin layer 4 which is a thermosetting polyimide covers the entire circumference of the conductor 2.
  • the outer periphery is covered with the phenoxy resin mixture shown by the resin mixture 4 which is the insulating resin layer 3.
  • thermosetting polyimide layer As an inner-layer insulating resin layer.
  • An insulated wire according to an example in which two insulating resin layers were laminated on a conductor was manufactured.
  • a copper round wire with a diameter of 1 mm was used as the conductor.
  • the inner layer in the resin laminate was formed of thermoplastic polyphenylene sulfide "Toprene” (Toto Kasei Co., Ltd.), and the insulating resin layer of the outer layer was formed of the above-mentioned resin mixture 3.
  • a thermoplastic polyphenylene sulfide resin layer (inner layer) was formed on the outer periphery of a round wire with a diameter of 1 mm by extrusion molding.
  • the film thickness of the formed resin layer (inner layer) was about 0.1 mm.
  • the insulated wire in which the insulated resin layer which comprises resin mixture 3 by extrusion molding was formed in the perimeter of this resin layer (inner layer) was manufactured.
  • the film thickness of the resin layer (outer layer) was 0.1 mm.
  • the insulated wire according to the sixth embodiment has a circular cross section including two insulating resin layers as shown in FIG. 3 as in the fifth embodiment.
  • Example 3 Compared with Example 3, the improvement of heat resistance was also confirmed by having provided the thermoplastic polyphenylene sulfide resin layer as an inner-layer insulating resin layer.
  • Comparative Example 1-5 The insulated wire according to Comparative Example 1-5 was manufactured as a configuration having no crosslinking agent in each of the insulated wires according to Example 1-6, and an attempt was made to confirm heat resistance. However, heat sag of the insulating resin layers of all the insulated wires of Comparative Example 1-6 was observed, and the heat resistance index could not be determined.
  • the activation energy of the thermal decomposition reaction was calculated by plotting the weight loss time at each of the measured temperatures, and the temperature which requires 20,000 hours to reduce the weight of 5% by mass was determined as a heat resistance index.
  • the heat resistance indexes of the insulated wire according to Example 1-6 were 180 ° C., 190 ° C., 200 ° C., 200 ° C., 210 ° C., and 210 ° C. in this order.
  • the heat resistance index means a holding temperature which requires 20,000 hours for holding the resin composition at a constant temperature and reducing the weight by 5% by weight.
  • the following acceleration method is used. First, the time until the weight is reduced by 5% by weight at two or more different holding temperatures is measured. Next, using the Arrhenius equation of the following equation (1), taking the reciprocal of each holding temperature (absolute temperature) on the horizontal axis, and plotting the logarithm of the time to decrease by 5% by weight on the vertical axis The activation energy Ea (unit: kcal / mol) of the decomposition reaction of the insulating resin involved in the reduction of the weight can be derived. Further, in the equation (1), ⁇ is referred to as a conversion time, which is a constant specific to the resin composition used. This constant ⁇ can be determined from the intercept of the above plot. R is a gas constant (value is 1.987 cal / K.mol), T is a holding temperature (unit: K: absolute temperature).
  • the weight is reduced by 5% by substituting the activation energy and the conversion time determined for 20,000 hours on the left side of the equation (1) and the right side.
  • the holding temperature T which requires 20,000 hours can be calculated, and this holding temperature becomes a heat resistance index.
  • SYMBOLS 1 Insulated electric wire, 2 ... Conductor, 3 ... Insulating resin layer, 4 ... Inner layer insulating resin layer 11 ... Core material, 12 ... Resin film 21 ... Extrusion molding machine, 22 ... Insulating resin material, 23 ... Conductor core wire

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
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  • Organic Insulating Materials (AREA)

Abstract

The present invention addresses the problem of providing an insulated wire having excellent heat resistance and pressure resistance, and a rotary electric machine that uses the same. This insulated wire has an insulating resin layer formed around the outer periphery of a conductor. The insulating resin layer comprises a thermoplastic phenoxy resin and a crosslinking agent, and the phenoxy resin has a bisphenol A-type skeleton and a bisphenol F-type skeleton.

Description

絶縁電線、回転電機及び絶縁電線の製造方法Insulated wire, rotary electric machine, and method of manufacturing insulated wire

 本発明は、絶縁電線に関するものである。 The present invention relates to an insulated wire.

 現在、家庭用電気機器、産業用電気機器、船舶、鉄道、電気自動車等に用いられる駆動用モータ等の回転電機のさらなる小型化や高出力化が進められている。 At present, further miniaturization and higher output of rotary electric machines such as drive motors used for household electric appliances, industrial electric appliances, ships, railways, electric vehicles and the like are being promoted.

 回転電機の小型化や高出力化を図るためには回転電機の巻線の高密度化や占積率の向上を要するが、巻線の高密度化に際しては巻線の自己発熱や近接した巻線間の部分放電によってもたらされる絶縁破壊を防止することが必要である。また、駆動用モータへの適用が拡大しているインバータ制御においても、スイッチングにより発生するサージ電圧に伴う絶縁破壊を防止することが必要である。 In order to achieve downsizing and high output of the rotating electrical machine, it is necessary to increase the density and space ratio of the windings of the rotating electrical machine. However, when increasing the density of the windings, the self-heating of the windings and adjacent windings It is necessary to prevent the dielectric breakdown caused by the partial discharge between the lines. Further, also in inverter control, the application of which to a driving motor is expanding, it is necessary to prevent dielectric breakdown caused by a surge voltage generated by switching.

 そのため、巻線とされる絶縁電線に用いられる絶縁樹脂には、より優れた耐熱性及び耐電圧性(以下、耐圧性という。)が求められている。 Therefore, more excellent heat resistance and voltage resistance (hereinafter referred to as pressure resistance) are required for the insulating resin used for the insulated wire as a winding.

 そこで、特許文献1は、含浸ワニスレスによる工数低減などの観点から、導体上に絶縁材料を塗布・焼付し、その上に融着層を形成した自己融着性エナメル線を開示する。特許文献2は、押出機を使用して導体の外周に押出被覆して絶縁体層を形成した直流電力ケーブルを開示する。 Therefore, Patent Document 1 discloses a self-bonding enameled wire in which an insulating material is applied and baked on a conductor, and a fusion layer is formed on the conductor, from the viewpoint of reducing the number of steps by impregnating varnish-less. Patent Document 2 discloses a DC power cable in which an insulator layer is formed by extrusion coating on the outer periphery of a conductor using an extruder.

特開2012-87246号公報JP 2012-87246 A 特開2009-114267号公報JP, 2009-114267, A

 導体の外周を耐熱性に優れた樹脂材料で被覆することにより、絶縁電線の耐熱性を確保することができる。しかしながら、絶縁電線には一般に耐熱性のみならず、耐圧性、機械的強度、化学的安定性、耐水・耐湿性等の種々の特性が要求される。特に、巻線の耐圧性を確保するためには導体を一定程度以上の膜厚で被覆する必要がある。 By covering the outer periphery of the conductor with a resin material excellent in heat resistance, the heat resistance of the insulated wire can be secured. However, in general, not only heat resistance but also various properties such as pressure resistance, mechanical strength, chemical stability, water resistance and moisture resistance are required of the insulated wire. In particular, in order to secure the pressure resistance of the winding, it is necessary to coat the conductor with a film thickness of a certain degree or more.

 特許文献1に開示されるように、塗布、焼付工程により絶縁電線に十分な膜厚を有する絶縁樹脂層を形成するためには、塗布、焼付工程を多数回繰り返す必要があり、製造コストが高くなるという問題がある。 As disclosed in Patent Document 1, in order to form the insulating resin layer having a sufficient film thickness on the insulated wire by the coating and baking steps, the coating and baking steps need to be repeated many times, and the manufacturing cost is high. Problem of becoming

 一方、特許文献2のように、押出機を用いた方法で絶縁電線を製造するためには、押出成形する前に材料を加熱する温度を、押出成形後に絶縁電線への被覆部分を熱硬化する温度より低くしなければならない。しかし、特許文献1のエナメル線は、ビスフェノールA型エポキシ単位とビスフェノールS型エポキシ単位とを共重合させて得られるスルホン基含有ポリヒドロキシポリエーテル樹脂を有し、このエナメル線は溶融温度が200℃以上と高すぎるため、特許文献2の押出機を用いた方法で製造することができない。 On the other hand, as in Patent Document 2, in order to manufacture an insulated wire by a method using an extruder, the temperature at which the material is heated prior to extrusion molding is thermally cured at the coating portion on the insulated wire after extrusion molding It must be lower than the temperature. However, the enameled wire of Patent Document 1 has a sulfone group-containing polyhydroxy polyether resin obtained by copolymerizing a bisphenol A epoxy unit and a bisphenol S epoxy unit, and this enameled wire has a melting temperature of 200 ° C. Since it is too high and it can not manufacture with the method using the extruder of patent document 2, it can not manufacture.

 本発明の課題は、耐熱性及び耐圧性に優れた絶縁電線及びそれを用いた回転電機を提供することにある。 An object of the present invention is to provide an insulated wire excellent in heat resistance and pressure resistance and a rotary electric machine using the same.

 本発明に係る絶縁電線は、導体の外周に絶縁樹脂層が形成され、前記絶縁樹脂層は熱可塑性のフェノキシ樹脂及び架橋剤を有する。 In the insulated wire according to the present invention, an insulating resin layer is formed on the outer periphery of the conductor, and the insulating resin layer has a thermoplastic phenoxy resin and a crosslinking agent.

 本発明によれば、耐熱性および耐圧性に優れた絶縁電線を提供することができる。 According to the present invention, an insulated wire excellent in heat resistance and pressure resistance can be provided.

本発明に係る絶縁電線の一例を示す説明図である。It is an explanatory view showing an example of the electric insulated wire concerning the present invention. 本発明に係る絶縁電線の一例を示す説明図である。It is an explanatory view showing an example of the electric insulated wire concerning the present invention. 本発明に係る絶縁電線の一例を示す説明図である。It is an explanatory view showing an example of the electric insulated wire concerning the present invention. 本発明に係る回転電機の説明図である。It is explanatory drawing of the rotary electric machine which concerns on this invention. 本発明に係る絶縁電線の製造方法の説明図である。It is explanatory drawing of the manufacturing method of the insulated wire which concerns on this invention.

 以下に本発明の一実施形態に係る絶縁電線及びそれを用いた回転電機について詳細に説明する。 Hereinafter, an insulated wire according to an embodiment of the present invention and a rotating electrical machine using the same will be described in detail.

 本実施形態に係る絶縁電線は、主に導体と絶縁樹脂層とを備える。この絶縁電線は回転電機の巻線に好適であり、捲回されることによって電線間が密接した状態となる高密度環境で使用され得る絶縁電線である。 The insulated wire according to the present embodiment mainly includes a conductor and an insulating resin layer. This insulated wire is suitable for the winding of a rotating electrical machine, and is an insulated wire that can be used in a high density environment where the wires are in close contact with each other by being wound.

 本実施形態に係る導体は一般的な絶縁電線の芯線と同様の線状の導体であり、銅線、アルミ線、これらの合金線等で形成される。 The conductor according to the present embodiment is a linear conductor similar to the core wire of a general insulated wire, and is formed of a copper wire, an aluminum wire, an alloy wire thereof, or the like.

 銅線としてはタフピッチ銅、無酸素銅及び脱酸銅のいずれを材質としたものでもよく、軟銅線及び硬銅線のいずれでもよい。また、錫、ニッケル、銀、アルミニウム等が表面にめっきされためっき銅線であってもよい。 The copper wire may be made of any of tough pitch copper, oxygen free copper and deoxidized copper, and may be any of soft copper wire and hard copper wire. Moreover, the plating copper wire by which tin, nickel, silver, aluminum, etc. were plated on the surface may be sufficient.

 アルミ線としては硬アルミ線、半硬アルミ線等のいずれでもよい。また、合金線としては銅-錫合金、銅-銀合金、銅-亜鉛合金、銅-クロム合金、銅-ジルコニウム合金、アルミニウム-銅合金、アルミニウム-銀合金、アルミニウム-亜鉛合金、アルミニウム-鉄合金、イ号アルミ合金(Aldrey Aluminium)等が挙げられる。 The aluminum wire may be any of hard aluminum wire, semi-hard aluminum wire and the like. Also, as alloy wires, copper-tin alloy, copper-silver alloy, copper-zinc alloy, copper-chromium alloy, copper-zirconium alloy, aluminum-copper alloy, aluminum-silver alloy, aluminum-zinc alloy, aluminum-iron alloy And aluminum alloy (Aldrey Aluminum).

 本実施形態に係る導体の形状としては、断面が円形状の丸線及び断面が矩形状の平角線のいずれでもよい。また、一本の導体で形成される単線及び複数本の導体が撚り合わされて形成される撚り線のいずれでもよい。 The shape of the conductor according to the present embodiment may be either a round wire having a circular cross section or a flat wire having a rectangular cross section. Moreover, any of a single wire formed of one conductor and a stranded wire formed by twisting a plurality of conductors may be used.

 本実施形態に係る絶縁樹脂層はビスフェノールA型骨格とビスフェノールF型骨格を有する熱可塑性のフェノキシ樹脂を用いることに特徴がある。ビスフェノールA型骨格とビスフェノールF型骨格を有するフェノキシ樹脂として、「YP-70」(東都化成)を用いることができる。なお、フェノキシ樹脂はアクリル変性フェノキシ樹脂またはビニル変性フェノキシ樹脂でも良い。なお、アクリル変性はビニル変性の1種である。 The insulating resin layer according to this embodiment is characterized by using a thermoplastic phenoxy resin having a bisphenol A skeleton and a bisphenol F skeleton. As a phenoxy resin having a bisphenol A skeleton and a bisphenol F skeleton, “YP-70” (Toto Kasei Co., Ltd.) can be used. The phenoxy resin may be an acrylic modified phenoxy resin or a vinyl modified phenoxy resin. Acrylic modification is 1 type of vinyl modification.

 本実施形態に係る絶縁樹脂層は、主成分(全体の絶縁樹脂層全体の50重量%以上)を熱可塑性樹脂で構成し、押出しプロセス後の加熱処理により架橋するものである。従って、押出しプロセス後であって、かつ加熱処理前は、流動しない状態となる。この流動しない状態において、絶縁樹脂層は自己融着性を有する。なお、この絶縁樹脂層は架橋により熱硬化性樹脂へ変換され、耐熱性が向上する。 In the insulating resin layer according to the present embodiment, the main component (50% by weight or more of the entire insulating resin layer as a whole) is made of a thermoplastic resin and crosslinked by heat treatment after the extrusion process. Therefore, after the extrusion process and before the heat treatment, it does not flow. In this non-flowing state, the insulating resin layer has self-bonding properties. The insulating resin layer is converted to a thermosetting resin by crosslinking, and the heat resistance is improved.

 本実施形態に係る絶縁樹脂層が含有する熱可塑性樹脂としては、フェノキシ樹脂が好ましい。また、熱可塑性樹脂を架橋するための架橋剤としては、ビスマレイミド化合物、エポキシ化合物、ブロックイソシアネートが挙げられる。なお、エポキシ化合物を架橋剤として用いる場合には、イミダゾールを触媒として含むことが好ましい。 As a thermoplastic resin which the insulating resin layer which concerns on this embodiment contains, a phenoxy resin is preferable. Moreover, as a crosslinking agent for crosslinking a thermoplastic resin, a bismaleimide compound, an epoxy compound, and block isocyanate are mentioned. In addition, when using an epoxy compound as a crosslinking agent, it is preferable to contain an imidazole as a catalyst.

 エポキシ化合物としては、ビスフェノールA型エポキシ樹脂「グレード名:828」や「グレード名:1001」「グレード名:1004」「グレード名:1007」(ジャパンエポキシレジン社製)などが使用可能である。 As the epoxy compound, bisphenol A type epoxy resin “grade name: 828” or “grade name: 1001” “grade name: 1004” “grade name: 1007” (manufactured by Japan Epoxy Resins Co., Ltd.) can be used.

 ブロックイソシアネートとしてはデュラネートシリーズ「17B-60P」や「TPA-B80E」(旭化成ケミカルズ社製)などがあげられる。 Examples of blocked isocyanates include Duranate series "17B-60P" and "TPA-B80E" (manufactured by Asahi Kasei Chemicals Corporation).

 ビスマレイミド化合物としては、4,4’-ジフェニルメタンビスマレイミド「BMI-1000」(大和化成工業株式会社製)、ポリフェニルメタンマレイミド「BMI-2000」(大和化成工業株式会社製)、m-フェニレンビスマレイミド「BMI-3000」(大和化成工業株式会社製)、ビスフェノールAジフェニルエーテルビスマレイミド「BMI-4000」(大和化成工業株式会社製)、3,3’-ジメチル-5,5’-ジエチル-4,4’-ジフェニルメタンビスマレイミド「BMI-5000」、「BMI-5100」(大和化成工業株式会社製)、4-メチル-1,3-フェニレンビスマレイミド「BMI-7000」(大和化成工業株式会社製)等が挙げられる。 As the bismaleimide compound, 4,4'-diphenylmethane bismaleimide "BMI-1000" (made by Daiwa Kasei Kogyo Co., Ltd.), polyphenylmethane maleimide "BMI-2000" (made by Daiwa Kasei Kogyo Co., Ltd.), m-phenylene bis Maleimide "BMI-3000" (manufactured by Daiwa Kasei Kogyo Co., Ltd.), bisphenol A diphenyl ether bismaleimide "BMI-4000" (manufactured by Daiwa Kasei Kogyo Co., Ltd.), 3,3'-dimethyl-5,5'-diethyl-4, 4'-diphenylmethane bismaleimide "BMI-5000", "BMI-5100" (manufactured by Daiwa Kasei Kogyo Co., Ltd.), 4-methyl-1,3-phenylene bismaleimide "BMI-7000" (manufactured by Daiwa Kasei Kogyo Co., Ltd.) Etc.

 フェノキシ樹脂をアクリレート変性イソシアネートと反応させれば、架橋部を水酸基からアクリレート基に変換できるので、それ自身が単独で架橋可能であるばかりでなく、上記に記載のビスマレイミド化合物を用いることができる。アクリレート変性イソシアネートとしては、イソシアネートモノマーシリーズ「カレンズMOI」や「カレンズAOI」(昭和電工株式会社製)等が挙げられる。 When the phenoxy resin is reacted with the acrylate-modified isocyanate, the crosslinkable part can be converted from a hydroxyl group to an acrylate group, so that not only itself can be crosslinked alone, but also the bismaleimide compounds described above can be used. As an acrylate modified isocyanate, isocyanate monomer series "Karenz MOI", "Kalens AOI" (made by Showa Denko KK), etc. are mentioned.

 本実施形態に係る絶縁樹脂層が、架橋剤としてビスフェノールA型エポキシ樹脂「グレード名:1001」のようなエポキシ含有化合物を含む場合には、触媒としてアミン系触媒、イミダゾール類、芳香族スルホニウム塩などを用いることができる。さらに、添加剤としてフェノール樹脂、酸無水物を用いても良い。なお、ここで説明する添加剤とは、触媒の作用により、架橋反応に寄与するものである。 When the insulating resin layer according to the present embodiment contains an epoxy-containing compound such as bisphenol A epoxy resin “grade name: 1001” as a crosslinking agent, an amine-based catalyst, an imidazole, an aromatic sulfonium salt or the like as a catalyst Can be used. Furthermore, you may use a phenol resin and an acid anhydride as an additive. In addition, the additive demonstrated here contributes to a crosslinking reaction by the effect | action of a catalyst.

 アミン系触媒としてメタキシレンジアミンやトリメチルヘサメチレンジアミンなどが挙げられる。イミダゾール類として2-フェニルイミダゾールやジアザビシクロウンデセンなどが挙げられる。酸無水物としてテトラヒドロ無水フタル酸やヘキサヒドロ無水フタル酸などが挙げられる。 Examples of amine catalysts include meta-xylene diamine and trimethylhexamethylene diamine. Examples of imidazoles include 2-phenylimidazole and diazabicycloundecene. Examples of acid anhydrides include tetrahydrophthalic anhydride and hexahydrophthalic anhydride.

 本実施形態に係る絶縁樹脂層の膜厚は、50μm以上とすることが好ましい。絶縁樹脂層の膜厚が50μm以上であれば、絶縁電線同士が密接する程度の高密度な状態において絶縁電線の耐圧性を確保することができる。 The film thickness of the insulating resin layer according to the present embodiment is preferably 50 μm or more. If the film thickness of the insulating resin layer is 50 μm or more, the pressure resistance of the insulated wire can be secured in a high density state where the insulated wires are in close contact with each other.

 本実施形態に係る絶縁電線において絶縁樹脂層の内側に、別の絶縁樹脂層を含んでも良い。 In the insulated wire according to the embodiment, another insulating resin layer may be included inside the insulating resin layer.

 本実施形態に係る絶縁電線は、例えば、ステータが有するステータコアに巻線として捲回される。回転電機は上述のステータの他に、ロータ、出力軸等の一般的なモータの構成要素を備えている。 The insulated wire according to the present embodiment is wound, for example, as a winding around a stator core of a stator. In addition to the above-described stator, the rotary electric machine is provided with general motor components such as a rotor and an output shaft.

 回転電機は、耐熱性及び耐圧性に優れた絶縁電線を備えることにより、例えば、家庭用電気機器、産業用電気機器、船舶、鉄道、電気自動車等における動力発生装置や発電装置として好適であり、特に小型又は高出力の回転電機においても、熱、部分放電、サージ電圧等によって絶縁破壊を生じ難い性質を有するものである。 The rotary electric machine is suitable as, for example, a power generation device or a power generation device in a home electric appliance, an industrial electric appliance, a ship, a railway, an electric car, etc. by being provided with an insulated wire excellent in heat resistance and pressure resistance. In particular, even in a small-sized or high-power rotary electric machine, it has the property of being hard to cause dielectric breakdown due to heat, partial discharge, surge voltage and the like.

 図4はステータの拡大図である。コア材(電磁鋼板)11の内部には導体2及び樹脂皮膜12が備えられている。本実施形態は絶縁電線1で導体2及び樹脂皮膜12を構成するものである。
<絶縁電線の製造方法>
 次に、図5を用いて、本実施形態に係る絶縁電線の製造方法について説明する。
FIG. 4 is an enlarged view of the stator. The conductor 2 and the resin film 12 are provided inside the core material (magnetic steel sheet) 11. In the present embodiment, the conductor 2 and the resin film 12 are configured by the insulated wire 1.
<Method of manufacturing insulated wire>
Next, the manufacturing method of the insulated wire which concerns on this embodiment is demonstrated using FIG.

 本実施形態に係る絶縁電線1の熱可塑性樹脂を用いた押出成形は、所望の電線形状に応じた口金を有するクロスヘッドダイ等の押出成形機21を用いて行われる。 The extrusion molding using the thermoplastic resin of the insulated wire 1 according to the present embodiment is performed using an extrusion molding machine 21 such as a crosshead die having a die according to a desired wire shape.

 樹脂層を形成する絶縁樹脂材料22は押出成形機21のホッパに投入され、シリンダに供給されて、ガラス転移温度以上の温度まで加熱されて溶融状態とされる。その後、加熱されて溶融した絶縁樹脂材料22は、シリンダ内に備えられるスクリュで混練されながらクロスヘッドに供給される。なお、絶縁樹脂材料22とは、少なくとも熱可塑性のフェノキシ樹脂及び架橋剤を含有する樹脂混合物(後述の樹脂混合物1-4を参照)である。 The insulating resin material 22 forming the resin layer is introduced into the hopper of the extrusion molding machine 21, supplied to the cylinder, heated to a temperature above the glass transition temperature, and brought into a molten state. Thereafter, the insulating resin material 22 which has been heated and melted is supplied to the crosshead while being kneaded by a screw provided in the cylinder. The insulating resin material 22 is a resin mixture containing at least a thermoplastic phenoxy resin and a crosslinking agent (see resin mixture 1-4 described later).

 このクロスヘッドには線状の導体芯線23が通過させられている。導体芯線23の外周には、クロスヘッドを通過する際に溶融した絶縁樹脂材料22が被覆され、絶縁電線1が形成される。被覆する絶縁樹脂材料22の量により、絶縁電線1の絶縁樹脂層の膜厚を制御することが可能となる。前述したように、耐圧性確保のため、膜厚を50μm以上とすることが望ましい。 A linear conductor core 23 is passed through the crosshead. The outer periphery of the conductor core wire 23 is covered with the insulating resin material 22 melted when passing through the crosshead, and the insulated wire 1 is formed. It becomes possible to control the film thickness of the insulating resin layer of the insulated wire 1 by the quantity of the insulating resin material 22 to coat. As described above, in order to ensure pressure resistance, it is desirable to set the film thickness to 50 μm or more.

 絶縁電線1に被覆された絶縁樹脂材料22は、熱可塑性樹脂が架橋される前の状態であるため、自己融着性を有する。よって、本発明においては、絶縁電線1を用いて回転電機のステータ、ロータ等を製造する際にワニスを用いず、絶縁電線1が有する自己融着性を利用して接着することが可能となる。よって、従来固定子等を製造する際に必要であったワニスへの含浸工程を省くことができるので、本発明は回転戦機用の固定子等製造において生産性が向上する効果を有する。 Since the insulating resin material 22 coated on the insulated wire 1 is in a state before the thermoplastic resin is crosslinked, it has a self-bonding property. Therefore, in the present invention, when manufacturing a stator, a rotor, etc. of a rotating electrical machine using the insulated wire 1, it is possible to bond using the self-fusion property of the insulated wire 1 without using a varnish. . Therefore, since the impregnation process to the varnish conventionally required when manufacturing a stator etc. can be skipped, this invention has the effect that productivity improves in manufacture of a stator etc. for rotary battle machines.

 絶縁樹脂材料22に用いる熱可塑性フェノキシ樹脂を溶融状態にするときの温度(第1の加熱温度)は100~140℃の範囲であり、樹脂混合物に含まれる熱可塑性のフェノキシ樹脂の熱硬化(架橋)するときの温度(第2の加熱温度)は160~180℃の範囲であり、第1の加熱温度の方が第2の加熱温度より20度低いことが望ましい。 The temperature (first heating temperature) when the thermoplastic phenoxy resin used for the insulating resin material 22 is in a molten state is in the range of 100 to 140 ° C., and the thermosetting (crosslinking) of the thermoplastic phenoxy resin contained in the resin mixture It is desirable that the temperature (second heating temperature) at the time of)) is in the range of 160 to 180.degree. C., and the first heating temperature is 20.degree. Lower than the second heating temperature.

 次に、本発明の実施例を示して具体的に説明するが、本発明の技術的範囲はこれらに限定されるものではない。 EXAMPLES The present invention will next be described in detail by way of examples, which should not be construed as limiting the technical scope of the present invention.

 200gのふた付きポリマ容器に80gのテトラヒドロフランを入れ、これに16gのアクリル変性フェノキシ樹脂「YP-70」(東都化成)、架橋剤として4gのポリフェニルメタンマレイミド「BMI-2000」(大和化成工業株式会社製)を加えて、1昼夜放置して全成分を溶解させた。この溶液をテフロン溶液にキャストした後に、テトラヒドロフランを乾燥除去した。 80 g of tetrahydrofuran is placed in a 200 g polymer container with a lid, to which 16 g of an acrylic modified phenoxy resin "YP-70" (Toho Kasei Co., Ltd.) and 4 g of polyphenylmethane maleimide "BMI-2000" as a crosslinking agent (Daiwa Kasei Kogyo Co., Ltd. The solution was added and allowed to stand for one day to dissolve all the ingredients. After casting this solution to a Teflon solution, the tetrahydrofuran was removed by drying.

 これにより、熱可塑性フェノキシ樹脂及びビスマレイミドを有する樹脂混合物1を得た。つぎに、樹脂混合物1を直径1mmの丸線の外周に押出成形により形成して、樹脂混合物1で構成する絶縁樹脂層が形成された絶縁電線を製造した。絶縁樹脂層の膜厚は、0.2mmとした。 Thus, a resin mixture 1 having a thermoplastic phenoxy resin and bismaleimide was obtained. Next, the resin mixture 1 was formed on the outer periphery of a round wire with a diameter of 1 mm by extrusion molding to manufacture an insulated wire in which the insulating resin layer formed of the resin mixture 1 was formed. The film thickness of the insulating resin layer was 0.2 mm.

 熱可塑性のフェノキシ樹脂及び架橋剤を有する絶縁樹脂層は自己融着性を有する。そのため、絶縁電線をコイルに固着処理する際、ワニスを用いることなく容易に固着することができる。 The insulating resin layer having a thermoplastic phenoxy resin and a crosslinking agent has self-bonding properties. Therefore, when the insulated wire is fixed to the coil, it can be easily fixed without using a varnish.

 図1は、実施例1に係る絶縁電線の断面模式図である。絶縁電線1において、導体2は断面が円形状の芯線をなしており、フェノキシ樹脂を主成分(絶縁樹脂層全体の50重量%以上を占める)とする絶縁樹脂層3が導体2の全周を被覆している。 FIG. 1 is a schematic cross-sectional view of the insulated wire according to the first embodiment. In the insulated wire 1, the conductor 2 is a core wire having a circular cross section, and the insulating resin layer 3 mainly composed of phenoxy resin (that occupies 50% by weight or more of the whole insulating resin layer) It is covered.

 200gのふた付きポリマ容器に80gのテトラヒドロフランを入れ、これに16gのフェノキシ樹脂「YP-70」(東都化成)、架橋剤として2gのビスフェノールA型エポキシ樹脂「グレード名:1001」と、触媒として0.5gのイミダゾール系硬化触媒「P-200」(ジャパンエポキシレジン社製)、添加剤として2gのフェノール樹脂H-4(明和化成)を加えて、1昼夜放置して全成分を溶解させた。この溶液をテフロン溶液にキャストした後、テトラヒドロフランを乾燥除去した。 In a 200 g lidded polymer container, 80 g of tetrahydrofuran is placed, into which 16 g of phenoxy resin “YP-70” (Toto Kasei Co., Ltd.), 2 g of bisphenol A epoxy resin “grade name: 1001” as a crosslinking agent, 0 as a catalyst .5 g of imidazole-based curing catalyst "P-200" (manufactured by Japan Epoxy Resins Co., Ltd.) and 2 g of phenol resin H-4 (Meiwa Kasei Co., Ltd.) as an additive were added and allowed to stand overnight to dissolve all components. The solution was cast into a Teflon solution and the tetrahydrofuran was removed by drying.

 これにより、熱可塑性フェノキシ樹脂、エポキシ樹脂、イミダゾール及びフェノール樹脂を有する樹脂混合物2を得た。つぎに、樹脂混合物2を1mm×2mm平角線の外周に押出成形により形成して、樹脂混合物2で構成する絶縁樹脂層が形成された絶縁電線を製造した。なお、絶縁樹脂層の膜厚は0.2mmとした。 Thus, a resin mixture 2 having a thermoplastic phenoxy resin, an epoxy resin, an imidazole and a phenol resin was obtained. Next, a resin mixture 2 was formed on the outer periphery of a 1 mm × 2 mm rectangular wire by extrusion molding, to produce an insulated wire in which an insulating resin layer formed of the resin mixture 2 was formed. The thickness of the insulating resin layer was 0.2 mm.

 図3は、実施例2に係る絶縁電線の断面模式図である。絶縁電線1において、導体2は、断面が平角状の芯線をなしており、熱可塑性フェノキシ樹脂を主成分とする絶縁樹脂層3が導体2の全周を被覆している。このように平角状の芯線であっても、本発明の絶縁電線を構成することが可能である。 FIG. 3 is a schematic cross-sectional view of the insulated wire according to the second embodiment. In the insulated wire 1, the conductor 2 has a core wire having a rectangular cross section, and the insulating resin layer 3 mainly composed of a thermoplastic phenoxy resin covers the entire periphery of the conductor 2. Thus, even with a rectangular core wire, the insulated wire of the present invention can be configured.

 本実施例ではフェノキシ樹脂、ビスフェノールA型エポキシ樹脂、フェノール樹脂、そしてイミダゾール系硬化触媒をテトラヒドロフランに溶解し、溶媒乾燥後に樹脂混合物2を得ている。ただし、直接、フェノキシ樹脂、ビスフェノールA型エポキシ樹脂、フェノール樹脂、そしてイミダゾール系硬化触媒を押出し成型温度以下で溶融混練させて樹脂混合物2を得ても構わない。 In this example, a phenoxy resin, a bisphenol A type epoxy resin, a phenol resin, and an imidazole-based curing catalyst are dissolved in tetrahydrofuran, and a resin mixture 2 is obtained after solvent drying. However, resin mixture 2 may be obtained by directly melt-kneading a phenoxy resin, a bisphenol A type epoxy resin, a phenol resin, and an imidazole-based curing catalyst at an extrusion molding temperature or less.

 200gのふた付きポリマ容器に80gのテトラヒドロフランを入れ、これに14gのフェノキシ樹脂「YP-70」(東都化成)、架橋剤として2gのビスフェノールA型エポキシ樹脂「グレード名:1001」を加え、触媒として0.5gのイミダゾール系硬化触媒「P-200」(ジャパンエポキシレジン社製)、添加剤として2gのフェノール樹脂H-4(明和化成)、2gのビスマレイミド「BMI-2000」(大和化成工業株式会社製)、を加えて、1昼夜放置して全成分を溶解させた。この溶液をテフロン溶液にキャストした後、テトラヒドロフランを乾燥除去した。 80 g of tetrahydrofuran is placed in a 200 g polymer container with a lid, 14 g of phenoxy resin "YP-70" (Tohto Kasei Co., Ltd.) and 2 g of bisphenol A epoxy resin "grade name: 1001" as a crosslinking agent are added as a catalyst 0.5 g of imidazole based curing catalyst "P-200" (manufactured by Japan Epoxy Resins Co., Ltd.), 2 g of phenol resin H-4 (Meiwa Kasei) as an additive, 2 g of bismaleimide "BMI-2000" (Daiwa Kasei Kogyo Co., Ltd.) Made in a company), and allowed to stand for one day to dissolve all the ingredients. The solution was cast into a Teflon solution and the tetrahydrofuran was removed by drying.

 これにより、熱可塑性フェノキシ樹脂、エポキシ樹脂、イミダゾール、フェノール樹脂及びビスマレイミドを有する樹脂混合物3を得た。つぎに、樹脂混合物3を直径1mmの丸線の外周に押出成形により形成して、樹脂混合物3で構成する絶縁樹脂層が形成された絶縁電線を製造した。なお、絶縁樹脂層の膜厚は0.2mmとした。 Thus, a resin mixture 3 having a thermoplastic phenoxy resin, an epoxy resin, an imidazole, a phenol resin and a bismaleimide was obtained. Next, the resin mixture 3 was formed on the outer periphery of a round wire with a diameter of 1 mm by extrusion molding to manufacture an insulated wire in which the insulating resin layer formed of the resin mixture 3 was formed. The thickness of the insulating resin layer was 0.2 mm.

 実施例3に係る絶縁電線は、実施例1と同じく、図1のような円形状の断面を有する。 The insulated wire according to the third embodiment has a circular cross section as shown in FIG. 1 as in the first embodiment.

 実施例3を実施例2と比較すると、ビスマレイミドの添加により、実施例3の方の耐熱性が向上していることも確認された。さらに、ビスマレイミドの添加により芯線との密着性が20%以上向上していることも確認された。 When Example 3 is compared with Example 2, it was also confirmed that the heat resistance of the direction of Example 3 is improved by addition of bismaleimide. Furthermore, it was also confirmed that the adhesion to the core wire was improved by 20% or more by the addition of bismaleimide.

 200gのふた付きポリマ容器に80gのテトラヒドロフランを入れ、これに14gのフェノキシ樹脂「YP-70」(東都化成)、架橋剤として3gのデュラネート「17B-60P」、添加剤として3gのポリフェニルメタンマレイミド「BMI-2000」(大和化成工業株式会社製)を加えて、1昼夜放置して全成分を溶解させた。この溶液をテフロン溶液にキャストした後、テトラヒドロフランを乾燥除去した。 In a 200 g lidded polymer container, 80 g of tetrahydrofuran is placed, into which 14 g of phenoxy resin "YP-70" (Toho Kasei Co., Ltd.), 3 g of duranate "17B-60P" as a crosslinking agent, 3 g of polyphenylmethane maleimide as an additive "BMI-2000" (manufactured by Daiwa Kasei Kogyo Co., Ltd.) was added and allowed to stand for one day to dissolve all components. The solution was cast into a Teflon solution and the tetrahydrofuran was removed by drying.

 これにより、熱可塑性フェノキシ樹脂、デュラネート及びマレイミド化合物を有する樹脂混合物4を得た。つぎに、樹脂混合物4を1mm×2mm平角線の外周に押出成形により形成して、樹脂混合物4で構成する絶縁樹脂層が形成された絶縁電線を製造した。なお、絶縁樹脂層の膜厚は0.2mmとした。 Thereby, a resin mixture 4 having a thermoplastic phenoxy resin, duranate and a maleimide compound was obtained. Next, a resin mixture 4 was formed on the outer periphery of a 1 mm × 2 mm rectangular wire by extrusion molding, to produce an insulated wire in which an insulating resin layer formed of the resin mixture 4 was formed. The thickness of the insulating resin layer was 0.2 mm.

 実施例3に係る絶縁電線は、実施例2と同じく、図3のような平角状の断面を有する。 The insulated wire according to the third embodiment has a flat cross section as shown in FIG. 3 as in the second embodiment.

 導体に2層の絶縁樹脂層が積層されてなる実施例に係る絶縁電線を製造した。導体としては、直径1mmの銅製の丸線を用いた。また、樹脂積層体における内層は、熱硬化性ポリイミドワニス「サンエバーSE-150」(日産化学工業株式会社製)で形成し、外層の絶縁樹脂層は上述の樹脂混合物4で形成した。 An insulated wire according to an example in which two insulating resin layers were laminated on a conductor was manufactured. A copper round wire with a diameter of 1 mm was used as the conductor. Further, the inner layer in the resin laminate was formed of a thermosetting polyimide varnish "Sun Ever SE-150" (manufactured by Nissan Chemical Industries, Ltd.), and the insulating resin layer of the outer layer was formed of the above-mentioned resin mixture 4.

 直径1mmの丸線の外周に、熱硬化性ポリイミドを塗布し、室温で仮乾燥させた。そして、恒温槽において300℃で1時間焼成してポリイミドの樹脂層(内層)を形成した。なお、形成された樹脂層(内層)の膜厚は約0.01mmであった。続いて、この樹脂層(内層)の外周に押出成形により樹脂混合物4で構成する絶縁樹脂層が形成された絶縁電線を製造した。なお、樹脂層(外層)の膜厚は0.2mmとした。 A thermosetting polyimide was applied to the outer periphery of a 1 mm diameter circular wire and temporarily dried at room temperature. And it baked at 300 degreeC in a thermostat for 1 hour, and formed the resin layer (inner layer) of polyimide. In addition, the film thickness of the formed resin layer (inner layer) was about 0.01 mm. Then, the insulated wire in which the insulation resin layer which comprises resin mixture 4 by extrusion molding was formed in the perimeter of this resin layer (inner layer) was manufactured. The film thickness of the resin layer (outer layer) was 0.2 mm.

 図2は、実施例5に係る絶縁電線の断面模式図である。絶縁電線1において、導体2は断面が円形状の芯線をなしており、熱硬化性ポリイミドである内層絶縁樹脂層4が導体2の全周を被覆している。その外周を絶縁樹脂層3である樹脂混合物4で示されたフェノキシ樹脂混合物で被覆している。 FIG. 2 is a schematic cross-sectional view of an insulated wire according to a fifth embodiment. In the insulated wire 1, the conductor 2 has a core wire having a circular cross section, and the inner layer insulating resin layer 4 which is a thermosetting polyimide covers the entire circumference of the conductor 2. The outer periphery is covered with the phenoxy resin mixture shown by the resin mixture 4 which is the insulating resin layer 3.

 また、実施例4と比較すると、内層絶縁樹脂層として熱硬化性ポリイミド層を設けたことにより耐熱性の向上も確認された。 Moreover, compared with Example 4, the heat resistant improvement was also confirmed by having provided the thermosetting polyimide layer as an inner-layer insulating resin layer.

 導体に2層の絶縁樹脂層が積層されてなる実施例に係る絶縁電線を製造した。導体としては、直径1mmの銅製の丸線を用いた。また、樹脂積層体における内層は、熱可塑性ポリフェニレンサルファイド「トープレン」(東都化成)で形成し、外層の絶縁樹脂層は上述の樹脂混合物3で形成した。 An insulated wire according to an example in which two insulating resin layers were laminated on a conductor was manufactured. A copper round wire with a diameter of 1 mm was used as the conductor. Further, the inner layer in the resin laminate was formed of thermoplastic polyphenylene sulfide "Toprene" (Toto Kasei Co., Ltd.), and the insulating resin layer of the outer layer was formed of the above-mentioned resin mixture 3.

 直径1mmの丸線の外周に、押出成形により熱可塑性ポリフェニレンサルファイド樹脂層(内層)を形成した。なお、形成された樹脂層(内層)の膜厚は約0.1mmであった。続いて、この樹脂層(内層)の外周に押出成形により樹脂混合物3で構成する絶縁樹脂層が形成された絶縁電線を製造した。なお、樹脂層(外層)の膜厚は0.1mmとした。 A thermoplastic polyphenylene sulfide resin layer (inner layer) was formed on the outer periphery of a round wire with a diameter of 1 mm by extrusion molding. In addition, the film thickness of the formed resin layer (inner layer) was about 0.1 mm. Then, the insulated wire in which the insulated resin layer which comprises resin mixture 3 by extrusion molding was formed in the perimeter of this resin layer (inner layer) was manufactured. The film thickness of the resin layer (outer layer) was 0.1 mm.

 実施例6に係る絶縁電線は、実施例5と同じく、図3のような絶縁樹脂層を2層備えた円形状の断面を有する。 The insulated wire according to the sixth embodiment has a circular cross section including two insulating resin layers as shown in FIG. 3 as in the fifth embodiment.

 また、実施例3と比較すると、内層絶縁樹脂層として熱可塑性ポリフェニレンサルファイド樹脂層を設けたことにより耐熱性の向上も確認された。
<比較例>
 実施例1-6に係る絶縁電線のそれぞれにおいて架橋剤を有さない構成として、比較例1-5に係る絶縁電線を製造し、耐熱性の確認を試みた。しかし、比較例1-6の全ての絶縁電線の絶縁樹脂層の熱ダレが観測され、耐熱指数を求めることはできなかった。
Moreover, compared with Example 3, the improvement of heat resistance was also confirmed by having provided the thermoplastic polyphenylene sulfide resin layer as an inner-layer insulating resin layer.
Comparative Example
The insulated wire according to Comparative Example 1-5 was manufactured as a configuration having no crosslinking agent in each of the insulated wires according to Example 1-6, and an attempt was made to confirm heat resistance. However, heat sag of the insulating resin layers of all the insulated wires of Comparative Example 1-6 was observed, and the heat resistance index could not be determined.

 以上の結果から、絶縁電線の耐熱性や形状維持性が、絶縁樹脂層のフェノキシ樹脂が架橋されているかいないかに依存していることが確認された。すなわち、押出成形後の加熱処理により熱硬化性樹脂への変換が可能であることによる絶縁電線であることに由来する効果と結論される。 From the above results, it has been confirmed that the heat resistance and shape maintenance of the insulated wire depend on whether or not the phenoxy resin of the insulating resin layer is crosslinked. That is, it is concluded that the effect derived from being an insulated wire is that conversion to a thermosetting resin is possible by heat treatment after extrusion molding.

 比較例1では、樹脂混合物1で用いたビスマレイミドを除いて樹脂混合物を作成した。 In Comparative Example 1, the bismaleimide used in the resin mixture 1 was removed to prepare a resin mixture.

 比較例2では、樹脂混合物2で用いたイミダゾールを除いて樹脂混合物を作成した。 In Comparative Example 2, the imidazole used in Resin Mixture 2 was removed to prepare a resin mixture.

 比較例3では、樹脂混合物3で用いたイミダゾール、ビスマレイミドを除いて樹脂混合物を作成した。 In Comparative Example 3, the imidazole and bismaleimide used in the resin mixture 3 were removed to prepare a resin mixture.

 比較例4、5では、樹脂混合物4で用いたデュラネートを除いて樹脂混合物を得た。 In Comparative Examples 4 and 5, the resin mixture was obtained by removing the duranate used in the resin mixture 4.

 比較例6では、樹脂混合物3で用いたイミダゾール、ビスマレイミドを除いて樹脂混合物を得た。
<耐熱性の評価>
 実施例1-6に係る絶縁電線を恒温槽において180℃で2時間焼成して、耐熱性を確認した。製造された絶縁電線を200℃、220℃及び240℃の恒温槽内に静置し、5質量%の重量が減少する重量減少時間をそれぞれ計測した。
In Comparative Example 6, the imidazole and bismaleimide used in the resin mixture 3 were removed to obtain a resin mixture.
<Evaluation of heat resistance>
The insulated wire according to Example 1-6 was fired in a thermostat at 180 ° C. for 2 hours to confirm heat resistance. The manufactured insulated wire was allowed to stand in a thermostat at 200 ° C., 220 ° C. and 240 ° C., and the weight loss time at which the weight of 5% by mass decreased was measured.

 計測された各温度における重量減少時間をプロットすることにより、熱分解反応の活性化エネルギーを算出し、5質量%の重量が減少するのに2万時間を要する温度を耐熱指数として求めた。その結果、実施例1-6に係る絶縁電線の耐熱指数は、順に180℃、190℃、200℃、200℃、210℃、210℃であった。 The activation energy of the thermal decomposition reaction was calculated by plotting the weight loss time at each of the measured temperatures, and the temperature which requires 20,000 hours to reduce the weight of 5% by mass was determined as a heat resistance index. As a result, the heat resistance indexes of the insulated wire according to Example 1-6 were 180 ° C., 190 ° C., 200 ° C., 200 ° C., 210 ° C., and 210 ° C. in this order.

 ここで、本明細書において、耐熱指数とは樹脂組成物を一定温度で保持して重量が5重量%減少するのに2万時間を要する保持温度を意味するものとする。 Here, in the present specification, the heat resistance index means a holding temperature which requires 20,000 hours for holding the resin composition at a constant temperature and reducing the weight by 5% by weight.

 実際に耐熱指数を求めるに際しては、以下の加速方法を用いる。先ず、2種類以上の異なる保持温度において重量が5重量%減少するまでの時間を計測する。つぎに、以下の(1)式のアレニウスの式を用いて、横軸に各保持温度(絶対温度)の逆数を取り、縦軸に5重量%減少するまでの時間の対数をプロットすることにより、重量の減少に関わる絶縁樹脂の分解反応の活性化エネルギーEa(単位はkcal/mol)を導出することができる。また、(1)式において、θは換算時間と言われ、使用した樹脂組成物に特有な定数となる。この定数θは、上記プロットの切片から求めることができる。Rは気体定数(値は1.987cal/K ・mol)、Tは保持温度(単位はK:絶対温度)である。

Figure JPOXMLDOC01-appb-I000001
When actually determining the heat resistance index, the following acceleration method is used. First, the time until the weight is reduced by 5% by weight at two or more different holding temperatures is measured. Next, using the Arrhenius equation of the following equation (1), taking the reciprocal of each holding temperature (absolute temperature) on the horizontal axis, and plotting the logarithm of the time to decrease by 5% by weight on the vertical axis The activation energy Ea (unit: kcal / mol) of the decomposition reaction of the insulating resin involved in the reduction of the weight can be derived. Further, in the equation (1), θ is referred to as a conversion time, which is a constant specific to the resin composition used. This constant θ can be determined from the intercept of the above plot. R is a gas constant (value is 1.987 cal / K.mol), T is a holding temperature (unit: K: absolute temperature).
Figure JPOXMLDOC01-appb-I000001

 上記のプロットから活性化エネルギーと換算時間を求めたら、(1)式の左辺に2万時間、右辺に求めた活性化エネルギーと換算時間を代入することにより、重量が5重量%減少するのに2万時間を要する保持温度Tを算出でき、この保持温度が耐熱指数となる。

Figure JPOXMLDOC01-appb-T000002
When the activation energy and the conversion time are determined from the above plot, the weight is reduced by 5% by substituting the activation energy and the conversion time determined for 20,000 hours on the left side of the equation (1) and the right side. The holding temperature T which requires 20,000 hours can be calculated, and this holding temperature becomes a heat resistance index.
Figure JPOXMLDOC01-appb-T000002

 1…絶縁電線、2…導体、3…絶縁樹脂層、4…内層絶縁樹脂層
 11…コア材、12…樹脂皮膜
 21…押出成形機、22…絶縁樹脂材料、23…導体芯線
DESCRIPTION OF SYMBOLS 1 ... Insulated electric wire, 2 ... Conductor, 3 ... Insulating resin layer, 4 ... Inner layer insulating resin layer 11 ... Core material, 12 ... Resin film 21 ... Extrusion molding machine, 22 ... Insulating resin material, 23 ... Conductor core wire

Claims (20)

 導体の外周に絶縁樹脂層が形成された絶縁電線であって、
 前記絶縁樹脂層は熱可塑性のフェノキシ樹脂及び架橋剤を有し、
 前記フェノキシ樹脂はビスフェノールA型骨格とビスフェノールF型骨格を有することを特徴とする絶縁電線。
An insulated wire in which an insulating resin layer is formed on the outer periphery of a conductor,
The insulating resin layer has a thermoplastic phenoxy resin and a crosslinking agent,
An insulated wire characterized in that the phenoxy resin has a bisphenol A skeleton and a bisphenol F skeleton.
 請求項1に記載の絶縁電線であって、
 前記絶縁樹脂層は自己融着性を有することを特徴とする絶縁電線。
The insulated wire according to claim 1, wherein
An insulated wire characterized in that the insulating resin layer has a self-bonding property.
 請求項1または2に記載の絶縁電線であって、
 前記架橋剤はビスマレイミド化合物であることを特徴とする絶縁電線。
The insulated wire according to claim 1 or 2, wherein
The insulated wire characterized in that the crosslinking agent is a bismaleimide compound.
 請求項1または2に記載の絶縁電線であって、
 前記架橋剤はエポキシ化合物であり、
 前記絶縁樹脂層はイミダゾールを含むことを特徴とする絶縁電線。
The insulated wire according to claim 1 or 2, wherein
The crosslinker is an epoxy compound,
The said insulated resin layer contains an imidazole, The insulated wire characterized by the above-mentioned.
 請求項1または2に記載の絶縁電線であって、
 前記架橋剤はブロックイソシアネートであることを特徴とする絶縁電線。
The insulated wire according to claim 1 or 2, wherein
The said crosslinking agent is block isocyanate, The insulated wire characterized by the above-mentioned.
 請求項1乃至5のいずれかに記載の絶縁電線であって、
 前記フェノキシ樹脂が前記絶縁樹脂層全体の50重量%以上を占めることを特徴とする絶縁電線。
The insulated wire according to any one of claims 1 to 5, wherein
An insulated wire characterized in that the phenoxy resin accounts for 50% by weight or more of the whole insulating resin layer.
 請求項1乃至6のいずれかに記載の絶縁電線であって、
 前記絶縁樹脂層の膜厚は50μm以上であることを特徴とする絶縁電線。
An insulated wire according to any one of claims 1 to 6, wherein
The film thickness of the said insulating resin layer is 50 micrometers or more, The insulated wire characterized by the above-mentioned.
 請求項1乃至7のいずれかに記載の絶縁電線であって、
 前記フェノキシ樹脂の熱硬化温度は160~180℃であることを特徴とする絶縁電線。
The insulated wire according to any one of claims 1 to 7, wherein
An insulated wire characterized in that a thermosetting temperature of the phenoxy resin is 160 to 180 ° C.
 請求項1乃至8のいずれかに記載の絶縁電線であって、
 前記絶縁樹脂層は押出しプロセスにより形成された絶縁電線。
The insulated wire according to any one of claims 1 to 8, wherein
The insulated resin layer is an insulated wire formed by an extrusion process.
 請求項1乃至9のいずれかに記載の絶縁電線であって、
 2層の絶縁樹脂層を有し、
 外層を前記絶縁樹脂層により、内層を外層と異なる絶縁樹脂層により構成することを特徴とする絶縁電線。
The insulated wire according to any one of claims 1 to 9, wherein
Has two insulating resin layers,
An insulated wire comprising an outer layer of the insulating resin layer and an inner layer of an insulating resin layer different from the outer layer.
 請求項10に記載の絶縁電線であって、
 前記内層の絶縁樹脂層はポリイミドワニスを含むことを特徴とする絶縁電線。
The insulated wire according to claim 10, wherein
An insulated wire characterized in that the insulating resin layer of the inner layer contains a polyimide varnish.
 導体の外周に絶縁樹脂層が形成された絶縁電線を備えた回転電機であって、
 前記絶縁樹脂層は熱可塑性のフェノキシ樹脂及び架橋剤を有し、
 前記フェノキシ樹脂はビスフェノールA型骨格とビスフェノールF型骨格を有することを特徴とする回転電機。
A rotating electrical machine comprising an insulated wire having an insulating resin layer formed on the outer periphery of a conductor,
The insulating resin layer has a thermoplastic phenoxy resin and a crosslinking agent,
The phenoxy resin has a bisphenol A skeleton and a bisphenol F skeleton.
 絶縁電線の製造方法であって、
 熱可塑性のフェノキシ樹脂及び架橋剤を含む樹脂混合物を加熱して溶融状態とする加熱工程と、
 前記溶融状態とされた樹脂混合物を押出し成形により導体に被覆する導体被覆工程と、を有し、
 前記フェノキシ樹脂はビスフェノールA型骨格とビスフェノールF型骨格を有することを特徴とする絶縁電線の製造方法。
A method of manufacturing an insulated wire,
Heating a resin mixture containing a thermoplastic phenoxy resin and a crosslinking agent to a molten state;
A conductor coating step of coating a conductor by extrusion molding the resin mixture in the molten state;
The method for producing an insulated wire, wherein the phenoxy resin has a bisphenol A skeleton and a bisphenol F skeleton.
 請求項13に記載の絶縁電線の製造方法であって、
 前記架橋剤はビスマレイミド化合物であることを特徴とする絶縁電線の製造方法。
It is a manufacturing method of the insulated wire according to claim 13,
The method for producing an insulated wire, wherein the crosslinking agent is a bismaleimide compound.
 請求項13に記載の絶縁電線の製造方法であって、
 前記架橋剤はエポキシ化合物であり、
 前記樹脂混合物作成工程において、イミダゾールを触媒として加えることを特徴とする絶縁電線の製造方法。
It is a manufacturing method of the insulated wire according to claim 13,
The crosslinker is an epoxy compound,
The manufacturing method of the insulated wire characterized by adding an imidazole as a catalyst in the said resin mixture creation process.
 請求項13に記載の絶縁電線の製造方法であって、
 前記架橋剤はブロックイソシアネートであることを特徴とする絶縁電線の製造方法。
It is a manufacturing method of the insulated wire according to claim 13,
The method for producing an insulated wire, wherein the crosslinking agent is a blocked isocyanate.
 請求項13乃至16のいずれかに記載の絶縁電線の製造方法であって、
 前記フェノキシ樹脂が前記樹脂混合物全体の50重量%以上を占めることを特徴とする絶縁電線の製造方法。
A method of manufacturing an insulated wire according to any one of claims 13 to 16, wherein
The method for producing an insulated wire, wherein the phenoxy resin accounts for 50% by weight or more of the entire resin mixture.
 請求項13乃至17のいずれかに記載の絶縁電線の製造方法であって、
 前記加熱工程の加熱温度が100~140℃であり、前記樹脂混合物の熱硬化温度が160~180℃であることを特徴とする絶縁電線の製造方法。
A method of manufacturing an insulated wire according to any one of claims 13 to 17, wherein
A manufacturing method of an insulated wire characterized in that a heating temperature in the heating step is 100 to 140 ° C., and a thermosetting temperature of the resin mixture is 160 to 180 ° C.
 請求項13乃至17のいずれかに記載の絶縁電線の製造方法であって、
 前記加熱工程の加熱温度が、前記樹脂混合物の熱硬化温度よりも20℃以上低いことを特徴とする絶縁電線の製造方法。
A method of manufacturing an insulated wire according to any one of claims 13 to 17, wherein
The manufacturing method of the insulated wire characterized by the heating temperature of the said heating process being 20 degreeC or more lower than the thermosetting temperature of the said resin mixture.
 請求項13乃至19のいずれかに記載の絶縁電線の製造方法であって、
 前記導体に被覆された樹脂混合物を、前記加熱工程の加熱温度よりも高い温度で加熱して、前記架橋剤により前記フェノキシ樹脂を架橋することを特徴とする絶縁電線の製造方法。
A method of manufacturing an insulated wire according to any one of claims 13 to 19, wherein
A method of manufacturing an insulated wire, comprising heating the resin mixture coated on the conductor at a temperature higher than the heating temperature in the heating step to crosslink the phenoxy resin with the crosslinking agent.
PCT/JP2014/053576 2014-02-17 2014-02-17 Insulated wire, rotary electric machinery, and method for producing insulated wire Ceased WO2015121999A1 (en)

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