WO2015114742A1 - Electronic apparatus cooling device - Google Patents

Abstract

The purpose of the present invention is to provide an electronic apparatus cooling device which suppresses occurrence of temperature variation within a housing when cooling an electronic apparatus, and prevents adhesion of condensation water onto the electronic apparatus. In order to resolve the above problem to be addressed, an electronic apparatus cooling device is characterized in comprising: a housing comprising a storage chamber which stores an electronic apparatus, a compressor chamber which is a space which stores a compressor and which is located below the storage chamber, and at least a first opening and closing door which is placed so as to be closable on a side-surface of the housing; a first evaporator which is provided on the first opening and closing door, and which absorbs, using a refrigerant, heat in air flowing within the storage chamber; a first compressor which is stored within the compressor chamber, and which compresses the refrigerant which has passed through the first evaporator; and first drain water collection means which is disposed below the first evaporator, and which collects drain water that has been generated at the first evaporator and guides same to the compressor chamber.

Description

Electronic equipment cooling device

The present invention relates to an electronic device cooling apparatus for cooling an electronic device such as a server device.

An apparatus equipped with an electronic device such as an integrated circuit needs to be cooled because operation may become unstable and malfunction may occur when the temperature of the electronic device rises due to heat generation. Here, when the air in the apparatus is cooled below the dew point temperature by cooling, drain water is generated, and the water adheres to the electronic device, which may damage the electronic device.

As a conventional technique for preventing dew condensation in an apparatus equipped with such an electronic device, there is a cooling apparatus described in Japanese Patent No. 4660427 (Patent Document 1).

In Patent Document 1, “a storage chamber for storing a heating element and a cooling unit in which a refrigerant circuit is configured by a compressor, a condenser, an expansion valve, an evaporator, and the like are provided. A cooling device that cools the heating element by circulating to the storage chamber, and includes a control device that controls the valve opening of the expansion valve and controls the operation of the compressor based on the air temperature in the storage chamber. The control device performs an evaporation temperature control operation for controlling the valve opening degree of the expansion valve based on the evaporation temperature of the refrigerant in the evaporator so that the evaporation temperature becomes a predetermined condensation avoidance temperature capable of avoiding condensation on the heating element. When the degree of superheat of the refrigerant in the evaporator falls below a predetermined liquid return risk value, expansion is performed based on the degree of refrigerant superheat in the evaporator so that the degree of superheat becomes a predetermined liquid return avoidance value. The valve opening of the valve Cooling system ", wherein a switch to Gosuru superheat control operation is disclosed (see the claims).

Patent Document 1 describes that “the refrigerant is stored in the evaporator 16 from the cooling chamber 15 in which the evaporator 16 is disposed by maintaining the evaporation temperature of the refrigerant at a temperature higher than a predetermined dew condensation avoiding temperature. It is possible to cool the server 2 while effectively avoiding the inconvenience that dew condensation occurs in the server 2 or the like as a heating element in the storage chamber 4 due to a marked decrease in the temperature of the cool air discharged into the chamber 4. Is possible "(paragraph 0048).

Japanese Patent No. 4660427

¡The amount of heat generated by the electronic device cooling device varies depending on operating conditions such as calculation processing. Since the amount of fluctuation increases as more electronic devices are mounted, it is important for a user who wants to store more servers in the electronic device cooling device to cool the fluctuating heating element to a uniform temperature without unevenness. .

Here, if the entire storage chamber is to be cooled with a cooler arranged at the lower part of the apparatus as in Patent Document 1, the lower air is lower in temperature than the upper part in order to bring the upper air to a desired temperature. It is necessary to. Therefore, temperature distribution may occur in the storage room.

Further, in Patent Document 1, the expansion valve is controlled so that the evaporator inlet temperature becomes the dew condensation avoidance temperature, but a specific method for determining the dew condensation avoidance temperature of the air in the storage having different dew points depending on the humidity is disclosed. Furthermore, when the temperature distribution occurs in the storage chamber as described above, it is not possible to determine the dew condensation avoidance temperature.

Also, the air in the storage room before the cooling is started is ambient air, and there is a possibility that the amount of moisture is large when the surroundings of the apparatus are installed in a high temperature / high humidity environment. In such a case, the heat exchanger condenses due to cooling, and if this moisture is present in the storage chamber, it may be scattered to the electronic device and cause a problem.

The present invention has been made in order to solve the above-described conventional technical problems, and suppresses occurrence of temperature unevenness in the housing when the electronic device is cooled, and condensation water adheres to the electronic device. An object of the present invention is to provide an electronic device cooling apparatus that prevents the above-described problem.

In order to solve the above problems, for example, the configuration described in the claims is adopted.

The present application includes a plurality of means for solving the above-mentioned problems. For example, a storage chamber for storing an electronic device and a compressor that is a space for storing a compressor and is located below the storage chamber. A housing having a chamber and a first opening / closing door installed on the side of at least one housing so as to be openable / closable; and provided in the first opening / closing door; A first evaporator that absorbs heat; a first compressor that is housed in the compressor chamber and that compresses the refrigerant that has passed through the first evaporator; and a lower part of the first evaporator, And a first drain water collecting means for collecting the drain water generated in the first evaporator and leading it to the compressor chamber.

Thus, the electronic device cooling device of the present invention provides an electronic device cooling device that suppresses the generation of a temperature village in the casing when the electronic device is cooled and prevents condensation water from adhering to the electronic device. be able to.

It is a perspective view which shows the structure of the electronic device cooling device of 1st Example which concerns on this invention. It is a figure which shows the II-II cross section of FIG. 1 about the electronic cooling device of 1st Example which concerns on invention. It is a figure which shows the detailed structure of the drain water moving means of FIG. 2 about the electronic cooling device of 1st Example which concerns on this invention. It is a control flow figure of the electronic cooling device of the 1st example concerning the present invention. It is a block diagram of a control system in the cooling operation of the electronic cooling device of the first embodiment according to the present invention. It is sectional drawing which shows the structure of the electronic cooling device of 2nd Example which concerns on this invention. It is a control flow figure of the electronic cooling device of the 2nd example concerning the present invention. It is a block diagram of a control system in the cooling operation of the electronic cooling device of the second embodiment according to the present invention. It is a flowchart of control in the dehumidification operation of the electronic cooling device of the second embodiment according to the present invention.

Hereinafter, an electronic device cooling apparatus according to first to second embodiments of the present invention will be described in detail with reference to FIGS. 1 to 7. In the following description, an example in which a server is housed and cooled as an electronic device will be described. However, an electronic device other than the server may be used as long as the electronic device generates heat by operation.

First, the configuration of the electronic device cooling apparatus according to the first embodiment of the present invention will be described with reference to FIGS.

FIG. 1 is a perspective view showing a configuration of the electronic device cooling apparatus 0 of the present embodiment, and shows a state in which the front door 2 and the rear door 3 are opened. The electronic device cooling apparatus 0 of the present embodiment stores a storage chamber 5 that stores a server 8, a condenser chamber 7 that stores a condenser, a condenser fan 13 provided on the ceiling surface of the casing, and a compressor. And a compressor chamber 6, and a duct 4 is provided in the storage chamber 5 at the ceiling and the bottom, respectively.

Further, the back side door 3 is provided with an evaporator 12 that cools the air in the storage chamber 5, and the front side door 2 and the back side door 3 are provided with openings 16, in the condenser chamber 7 and in the compressor chamber. The air in 6 can be circulated with the surrounding air.

FIG. 2 is a diagram showing a cross section during the cooling operation of the electronic device cooling apparatus 0 of FIG. 1 with the front door 2 and the rear door 3 closed. The solid arrows in FIG. 2 indicate the flow of air circulating in the storage chamber 5, and the white arrows indicate the flow of air passing through the condenser chamber 7.

The casing of the electronic device cooling device 0 is composed of a cabinet 1, a front door 2, and a rear door 3. The rear door 3 includes an evaporator 12 and a door fan 14, and the evaporator 12 can exchange heat with the air circulating in the housing.

The casing of the electronic device cooling device 0 is divided into a condenser chamber 7, a storage chamber 5, and a compressor chamber 6. In the storage room 5, ducts 4 are provided at the ceiling and bottom, respectively, and a server 8 is mounted as an electronic device in the other space. Here, a plurality of servers 8 are stacked and arranged, but may be arranged alone in a part of the storage chamber 5. Each server 8 is provided with a blower 15, and the internal heat generating components can be cooled by circulating the surrounding air.

During the cooling operation in which the front door 2 and the back door 3 are closed, the duct 4 connects the flow path passing through the front door 2 and the flow path provided in the back door 3 and passing through the evaporator 11. It has become. Further, the opening 16 provided in the front door 2 and the back door 3 allows the air in the condenser chamber 7 and the compressor chamber 6 to circulate with the ambient air.

A condenser 10 and a condenser fan 13 are arranged in the condenser chamber 7, and a compressor 9 and an expansion valve 11 are arranged in the compressor chamber 6, and the compressor 9, the condenser 10, and the expansion valve 11 are arranged. The evaporator 12 is sequentially connected by a refrigerant pipe to form a back side refrigeration cycle. A flexible tube is used for a part of the pipe connecting the evaporator 12 and the expansion valve 10 and a part of the pipe connecting the evaporator 12 and the compressor 9. As a result, even when the door is opened, continuous operation is possible, and there is no inconvenience that the operation of the apparatus is stopped every time maintenance is performed.

The bottom of the evaporator 12 is provided with a drain pan 100 having an inclined bottom plate, and a guide 106 for moving drain water to the duct 4 at the bottom of the storage chamber 5 is connected to the inclined portion of the bottom plate.

The drain pan 100 is disposed at a position higher than the duct 4 at the bottom of the storage chamber 5, and the tip of the guide 106 is disposed in the duct 4 at the bottom of the storage chamber 5. Further, the duct 4 at the bottom of the storage chamber 5 has a part of the surface where the storage chamber 5 and the compressor chamber 6 are in contact with each other, the storage chamber 5 and the compressor chamber 6 communicate with each other, and the compressor 9 is disposed. The structure is such that the water storage tank 102 is connected by a guide 101. Further, a water leakage sensor 103 is provided on the wall surface of the water storage tank 102.

FIG. 3 is a diagram showing a detailed configuration of the water storage tank 102 of the electronic cooling device of the present embodiment. As shown in FIG. 3, drain water from the duct is collected in the water storage tank 102 via the guide 101. A compressor 9 is disposed in the water storage tank 102, and the drain water can be naturally evaporated by the surface of the high-temperature compressor 9. Further, a water leakage sensor 103 is provided on the inner wall of the water storage tank 102. When the water leakage sensor 103 detects moisture, the user is notified of the information, and the user opens the valve 105 so that the moisture is electronically cooled. 0 can be released to the outside.

Referring back to FIG. 2, the compressor 9 will be described. The compressor 9 is a variable capacity compressor capable of capacity control. As such a compressor, a piston type, a rotary type, a scroll type, a screw type, or a centrifugal type can be adopted. Specifically, the compressor 9 is a scroll type compressor, capacity control is possible by inverter control, and the rotational speed is variable from low speed to high speed. Although it is assumed that the R410A refrigerant is charged in the refrigeration cycle, for example, HFO1234yf, R134a, and the like can be used, and the refrigerant is not limited here. The condenser chamber 7 is provided with a blower 18 so that heat can be exchanged between the outside air flowing in from the openings provided in the upper portions of the front door 2 and the rear door 3 and the condenser 10.

In addition, the electronic device cooling device 0 includes an outside air temperature sensor 202 and a storage room temperature sensor 201 as sensors for detecting the air temperature. As sensors for detecting the refrigerant temperature, a sensor 203 for detecting the evaporator inlet temperature and a sensor 204 for detecting the compressor suction temperature are provided. The electronic device cooling apparatus 0 of the present embodiment adjusts the rotation speed of the compressor 9, the condenser fan 13, and the evaporator fan 12, and the opening degree of the expansion valve 11, based on the temperatures detected by the above-described sensors. A control device 200 (not shown) is provided (see FIG. 4 for the operation flow of the control device 200).

First, the flow of the refrigerant will be described. The refrigerant that has been pressurized by the compressor 9 to become a high-temperature and high-pressure gas is sent to the condenser 10. The refrigerant sent to the condenser 10 dissipates heat to the outside air in the process of passing through the condenser 10, and changes in phase from a gas to a two-phase state and to a liquid. Thereafter, the refrigerant passes through the expansion valve 11 and is depressurized to be in a low-pressure two-phase state. The refrigerant that has entered the low-pressure two-phase state then absorbs heat from the air in the storage chamber 5 in the process of passing through the evaporator 12, changes again from the two-phase state to gas, and is returned to the compressor 9. .

Next, the flow of air circulating in the electronic device cooling device 0 will be described. The air around the server 8 is taken into the server by a blower 15 built in the server 8 and becomes high temperature due to exhaust heat of the server 8. The air that has passed through the server 8 passes through the evaporator 12 by the fan 14 built in the back side door 3, is cooled, and is sent to the front side door 2 through the duct 4. That is, the air cooled by the evaporator 12 flows through the storage chamber 5 and is warmed by cooling the server 8. The warmed air is cooled by the evaporator 12, then moves through the duct 4 toward the front door 2, and returns to the windward side of the server 8. Finally, the cooling operation will be described with reference to FIGS.

FIG. 5 shows a block diagram of a control system in the cooling operation of the electronic cooling device of the present embodiment.

The control system of the electronic device cooling apparatus 200 according to the present embodiment includes a control apparatus 200, a sensor 201 that detects a server inlet temperature, a sensor 202 that detects an outside temperature, and a temperature that detects a refrigerant temperature at an evaporator inlet. A sensor 203 and a temperature sensor 204 for detecting the refrigerant temperature on the suction side of the compressor are provided. In the following description, the temperature detected by each sensor is described with the same reference numeral as the sensor. The server inlet temperature 201 is the temperature of the air that flows into the storage chamber 5 in order to cool the server 8 that is an electronic device.

The control device 200 is constituted by a microcomputer, and temperature data detected by each of the temperature sensors is input to the control device 200.

In this embodiment (including other embodiments described below), the target air inlet temperature is set to cool the air circulating in the housing. Therefore, regardless of the room temperature of the room in which the electronic device cooling device 0 is installed, the electronic devices such as the server 8 disposed in the electronic device cooling device 0 can be cooled with cooling air having a desired temperature. Specifically, the actual server intake air temperature is detected by the sensor 201 and the outside air temperature is detected by the sensor 202, and the rotation speed of the compressor 9 and the opening degree of the expansion valve 11 are set so as to reach the target server intake air temperature set by the user. To control. Also, in order for the compressor 9 to operate correctly, the degree of superheat (compressor suction temperature 204−evaporator inlet temperature 203) of the rear side cycle is confirmed, and if the target value is exceeded, the expansion valve 11 is adjusted. And correct it to the target value. Further, the rotational speed of the condenser fan 13 is controlled to an appropriate value according to the rotational speed of the compressor 9. As described above, the control system of the electronic device cooling apparatus 0 uses the temperature detected by each temperature sensor and the target server inlet temperature, and follows the control flow described later to open the expansion valve 11 and rotate the compressor 9. Control number and.

FIG. 4 shows a control flow of the compressor 9 and the expansion valve 11 in the cooling operation of this embodiment.

When the electronic apparatus cooling device 0 is turned on, the control device 200 reads the target server intake air temperature set by the user from the memory in the control device (S1). Further, the actual server inlet temperature is detected by the sensor 201, and the outside temperature is detected by the sensor 202 (S1). As described above, the target server inlet temperature is configured so that the user can change the setting as appropriate.
Next, based on the target inlet temperature, the rotational speed of the compressor 9 and the opening of the expansion valve 11 are determined (S2), and the operation of the compressor 9 and the expansion valve 11 is started (S3). Thereafter, the degree of superheat (compressor suction temperature 204−evaporator inlet temperature 203) of the rear side cycle is confirmed (S4), and if it is within the target range, the process proceeds to the next step. If the degree of superheat in the rear-side cycle deviates from the target value, the expansion valve is adjusted to correct the target value (S5).

Finally, the server inlet temperature 201 is confirmed (S6), and if it is the target value, the operation is continued as it is, but if it is outside the target value, the rotation speed of the compressor 9 is adjusted (S7), Return to the superheat degree confirmation (S4) again As described above, the electronic device cooling apparatus 0 of the present embodiment cools the server 8 with the circulating air. Condensation does not occur above the moisture of the air, and there is a low possibility that the server 8 will malfunction due to drain water.

However, in reality, the manufacturing cost and the weight of the casing main body are increased, and it is difficult to completely seal the storage chamber 5. Therefore, when ambient air mixes with the air inside the storage chamber 5 through a gap between the casings, and the ambient temperature and humidity are high, the humidity of the air in the storage chamber may be increased. Therefore, in order to maintain the reliability of the electronic device cooling apparatus 0 capable of cooling the server regardless of the temperature and humidity of the surrounding environment where it is installed, a structure for appropriately treating drain water is important. A method for treating drain water when condensation occurs in the electronic cooling device 0 of the present embodiment will be described below.

When the evaporation temperature of the refrigerant for setting the temperature in the storage chamber 5 to a desired temperature is lower than the dew point of the air in the storage chamber 5, the air in the storage chamber 5 is condensed when cooled by the evaporator 12. This produces drain water. The drain water is collected by the drain pan 100 at the bottom of the evaporator 12 and moves to the duct 4 at the bottom of the storage chamber 5 through the guide 101. Since the duct 4 communicates with the water storage tank 102 in the compressor room, the drain water moved to the duct 4 is collected in the water storage tank 102.

Although the duct 4 is partially open to the compressor chamber 6, if the amount of drain water in the water storage tank is higher than the connection position of the pipe 104 by being connected to the water storage tank 102 by the pipe 104, In addition, air does not flow between the compressor chamber 6 and the storage chamber 5.

In addition, when the water in the water storage tank increases due to the operation for a long time and the water leakage sensor 103 detects moisture, the information is notified to the user, and the user opens the valve 105 to remove the moisture from the electronic cooling device 0. Can be released.

In the electronic device cooling apparatus 0 of the present embodiment, the drain water can be effectively moved from the bottom of the evaporator 12 of the back side door 3 which is a movable part to the duct 4 by the drain pan 100 and the guide 101. Even when opening and closing, leakage of drain water can be suppressed.

Further, since the compressor 9 is arranged in the water storage tank 102, the drain water naturally evaporates from the surface of the high-temperature compressor 9, and when the drain water is low, the cooling operation can be continued without maintenance. Further, when the water cooled by the evaporator 12 touches the surface of the compressor 9, an increase in the temperature of the compressor 9 can be suppressed, and the reliability of the compressor can be improved.

Generally, there is a possibility that the cost and weight of the apparatus increase in order to make a completely sealed cabinet for cooling the server. On the other hand, a simple structure such as a general server rack can prevent dust and dust from entering, but when operating for a long time in a high-temperature and high-humidity environment, the air around the device is taken into the cabinet, and these air Is cooled by the evaporator, there is a possibility that drain water is generated under the evaporator. For this reason, it is necessary to consider not only the air originally present in the storage chamber but also the moisture of the ambient air flowing in from the gaps between the devices.

Here, as described above, in the present embodiment, it is possible to suppress the leakage of drain water from an evaporator installed in a movable part such as a door and to reduce the surface temperature of the compressor, thereby increasing the temperature. -A highly efficient and highly reliable electronic device cooling apparatus that cools a heating element uniformly even in a high humidity environment can be provided at low cost. This makes it possible to cool electronic devices evenly, even when the amount of heat generated is such that multiple servers are stacked and housed in the housing, or when the device is installed in a high-temperature, high-humidity environment. It is possible to provide a cooling device that can cool an electronic device with high efficiency without causing condensation.

Next, the configuration of the electronic device cooling apparatus according to the second embodiment of the present invention will be described with reference to FIGS.

FIG. 6 is an example of a configuration diagram showing an electronic device cooling apparatus 0 ′ according to the second embodiment of the present invention.

In the electronic device cooling device 0 ′ of FIG. 6, a part of the description is omitted for the parts having the same functions as the configurations and the controls denoted by the same reference numerals shown in FIGS. .

The casing of the electronic device cooling device 0 'is composed of a cabinet 1, a front door 2, and a rear door 3. The front door 2 includes an evaporator 12a and a fan 14a, and the rear door 3 includes an evaporator 12b and a fan 14b. The evaporators 12a and 12b can exchange heat with the air circulating in the housing. It has become. The cabinet 1 is provided with a condenser chamber 8, a server storage chamber 5, and a duct 4, and a server 8 is mounted in the storage chamber 5.

The compressor 9a, the condenser 10a, the expansion valve 11a, and the evaporator 12a are sequentially connected by a refrigerant pipe to form a front side refrigeration cycle, and the compressor 9b, the condenser 10b, the expansion valve 11b, and the evaporator 12b are formed by a refrigerant pipe. They are sequentially connected to form a back side refrigeration cycle, and the electronic device cooling apparatus 0 ′ of the present embodiment has two refrigeration cycles. Further, a flexible tube is used for a part of the pipe connecting the evaporators 12a and 12b and the expansion valves 11a and 11b and a part of the pipe connecting the evaporators 12a and 12b and the compressors 9a and 9b.

A drain pan 100a with an inclined bottom plate is provided below the front-side evaporator 12a, and a guide 101a for moving drain water to the duct 4 at the bottom of the storage chamber 5 is connected to the inclined portion of the bottom plate. Yes. A front side water leakage sensor 103a is arranged at the lower end of the bottom plate of the drain pan 100a. In addition, a drain pan 100b having an inclined bottom plate is also provided below the back side evaporator 12b. The drain pans 100a and 100b are arranged at a position higher than the duct 4 at the bottom of the storage chamber 5, and the tips of the guides 101a and 101b are arranged in the duct 4 at the bottom of the storage chamber 5. In addition, the duct 4 at the bottom of the storage chamber 5 has a part of the surface where the storage chamber 5 and the compressor chamber 6 are in contact with each other, and allows the storage chamber 5 and the compressor chamber 6 to communicate with each other. The structure is connected to the water storage tank 102a or 102b in which the compressor 9b is disposed. Here, the water storage tanks 102a and 102b are connected by a pipe 106, and each drain water can be circulated. A water leakage sensor 103b is provided on the wall surface of the water storage tank 102b in which the rear side compressor is disposed.

In addition, the electronic device cooling apparatus 0 ′ includes a sensor 201 that detects the server inlet temperature and a sensor 202 that detects the outside air temperature as sensors that detect the air temperature, and the front side cycle as a sensor that detects the refrigerant temperature. The sensor 203a for detecting the evaporator inlet temperature, the sensor 204a for detecting the compressor suction temperature, the sensor 203b for detecting the evaporator inlet temperature, and the sensor 204b for detecting the compressor suction temperature in the rear side cycle. , Each has. The electronic device cooling device 0 ′ of the present embodiment is based on the temperatures detected by the sensors that detect the air temperature and the sensors that detect the refrigerant temperature, and the rotation speeds of the compressors 9a and 9b and the expansion valves 11a, A control device 200 ′ (control block, refer to FIG. 7 and FIG. 8 for the control flow) for adjusting the opening degree of 11b is provided.

Since the flow of the refrigerant is the same as in Example 1, it is omitted. The flow of air circulating in the electronic device cooling device 0 ′ will be described below. The air around the server 8 is taken into the server by a blower 15 built in the server 8 and becomes high temperature due to exhaust heat of the server 8. After passing through the server 8, it passes through the evaporator 12b by the fan 14b built in the back side door 3, where it is cooled for the first time. Thereafter, the air that has moved to the duct 4 passes through the evaporator 12a by the fan 14a built in the front door 2, is cooled for the second time, and is discharged to the suction side of the server 8. That is, the electronic device cooling device 0 ′ of the present embodiment forms a circulating flow in which the air in the casing flows through the evaporator 12a, the storage chamber 5, and the evaporator 12b, and circulates back to the evaporator 12a.

Next, the cooling operation will be described.

FIG. 7 shows a control flow of the compressor 9 and the expansion valve 11 in the cooling operation of this embodiment. The basic operation of the cooling operation in the present embodiment shown in FIG. 7 is the same as the control flow described in the first embodiment, but the control targets are the compressors 9a and 9b, the expansion valves 11a and 11b, the condensation These are dexterous fans 13a and 13b. Further, the adjustment amount of the rotational speeds of the front-side compressor 9a and the rear-side compressor 9b in S9 in the figure is the same rotational speed.

FIG. 8 shows a block diagram of a control system in the cooling operation and the dehumidifying operation of the electronic cooling device of the present embodiment. The main operation is the same as in the first embodiment. That is, the server inlet temperature is detected by the sensor 201 and the outside air temperature is detected by the sensor 202, and the rotation speed of the compressor 9 and the opening degree of the expansion valve 11 are controlled so as to reach the target server inlet temperature. Also, in order for the compressor 9 to operate correctly, the degree of superheat (compressor suction temperature 204−evaporator inlet temperature 203) of the rear side cycle is confirmed, and if the target value is exceeded, the expansion valve 11 is adjusted. And correct it to the target value. Further, the rotational speed of the condenser fan 13 is controlled to an appropriate value according to the rotational speed of the compressor 9.

Further, as control different from the first embodiment, the presence or absence of moisture is detected from the front side water leakage sensor 103b, and when moisture is detected, the electronic device cooling device 0 'performs the dehumidifying operation in addition to the cooling operation.

FIG. 9 shows a control flow of the compressor 9 and the expansion valve 11 in the dehumidifying operation of this embodiment.

Since the electronic device cooling apparatus 0 ′ of the present embodiment includes the front-side evaporator 12a on the wind of the server 8, condensation occurs in the evaporator 12a when the humidity of the air circulating in the storage chamber 5 is high. There is a possibility that the inconvenience of drain water adhering to the server 8 occurs.

On the other hand, since the electronic device cooling apparatus 0 'of the present embodiment includes the front-side water leakage sensor 103a, it detects that condensation occurs in the front-side evaporator 12a and performs a dehumidifying operation.

The dehumidifying operation will be described below. FIG. 9 shows a control flow of the compressors 9a and 9b and the expansion valves 11a and 11b in the dehumidifying operation of this embodiment. When it is detected by the front-side water leakage sensor 103a that condensation has occurred on the front-side evaporator 12a, the control device 200 ′ switches the control of the electronic cooling device 0 ′ from the cooling operation to the dehumidifying operation. The control device 200 ′ reads out the target server inlet temperature and target server humidity set by the user from the memory in the control device (S1). Further, the actual server inlet temperature is detected by the sensor 20, and the outside temperature is detected by the sensor 25 (S1).
First, based on the target inlet temperature, the condensation temperature, the number of rotations of the two compressors 9a and 9b, and the opening degree of the expansion valves 11a and 11b are determined (S2), and the compressors 9a and 9b and the expansion valve 11a and The operation of 11b is started (S3). Here, the dew condensation temperature is a dew point temperature calculated based on the target server humidity and the target server intake air temperature assumed by the user. This condensation temperature can be obtained from an air diagram. Specifically, when the target server inlet temperature is 25 ° C. and the target server humidity is 30%, the condensation temperature is 6.2 ° C.

After that, the back side evaporation temperature (back side evaporator inlet temperature) 203b is confirmed (S4), and if it is within the target range, the measurement for a predetermined time is started and the process proceeds to the next step. This predetermined time is a dehumidifying operation time determined by the volume of the storage chamber 5 and the flow rate of the circulating air, and is 120 seconds here.

If the rear-side evaporation temperature 203b deviates from the target value, the rear-side expansion valve 11b is adjusted to correct the target value (S7). Next, the superheat degree of the front-side cycle (front-side evaporator outlet temperature 204a-evaporator inlet temperature 203a) is confirmed (S5), and if it is within the target range, the process proceeds to the next step. If the superheat degree of the front-side cycle deviates from the target value, the front-side expansion valve 11a is adjusted to correct it to the target value (S8).

Finally, the server inlet air temperature 201 is confirmed (S6), and if it is the target value, the operation is continued as it is, but if it is outside the target value, the rotation of the front side compressor 9a and the rear side compressor 9b Adjust the number (S9), and again check the back side evaporation temperature (back side evaporator inlet temperature) 203b and the front side cycle superheat (front side evaporator outlet temperature 204a-evaporator inlet temperature 203a) (S4, S5) Return to). Here, the amount of adjustment of the rotational speeds of the front-side compressor 9a and the rear-side compressor 9b is the same rotational speed. After that, after a predetermined time has passed (S10), the control device 200 switches the control operation from the dehumidifying operation to the cooling operation.

The electronic device cooling device 0 'according to the present embodiment can obtain the effects described below by using the above-described structure and control method.

First, in the dehumidifying operation, the back side evaporator 12b cools the air in the storage room 5 to the dew condensation temperature for a certain period of time, and if the air in the storage room 5 is higher than the target humidity, the back side evaporator 12b Condensation occurs and falls to the back side drain pan 100b, and is collected from there through the duct 4 to the water storage tank 102b. Thus, the electronic device cooling device 0 ′ of the present embodiment avoids the moisture from adhering to the server 8 by performing the dehumidifying operation when the humidity of the air in the storage chamber 5 is high. Reliability can be maintained. In addition, since it has a structure connected to the front water storage tank under the front side evaporator, drain water in the meantime is collected in the front water storage tank 102a and leaks from the front door until the dehumidifying operation is completed. There will be no malfunction. In addition, since the front-side water storage tank 102a and the rear-side water storage tank 102b communicate with each other through the pipe 106, not only the surface temperature of the rear-side compressor 9b but also the front-side compression by the drain water collected by the dehumidifying operation. The surface temperature of the machine 9a can also be reduced, and the reliability of the compressor can be improved.

As described above, the electronic device cooling device 0 ′ of the present embodiment includes a mechanism and a control for appropriately treating drain water, and thus the front-side evaporator 12a and the rear-side evaporator 12b installed in the movable part. Server 8 can be evenly distributed even in high-temperature and high-humidity environments by suppressing the leakage of drain water from the air and the surface temperature of the front compressor 9a and the rear compressor 9b. Therefore, it is possible to provide a highly efficient and highly reliable electronic device cooling apparatus that cools at a low cost.

0 ... Electronic equipment cooling device
1 ... cabinet
2… Front side door
3 ... Back side door
4 ... Duct
5 ... Storage room
6 ... Compressor room
7… Condenser room
8 ... Server
9 ... Compressor
10 ... Condenser
11 ... Expansion valve
12 ... Evaporator
13… Condenser fan
14 ... Fan
15 ... Blower
16 ... Opening
100 ... Drain pan
101 ... Guide
102 ... Water tank
103 ... Water leakage sensor
104,105… Piping
200 ... Control device
201 ... Server inlet temperature sensor
202… Outside air temperature sensor
203 ... Evaporator inlet temperature sensor
204 ... Evaporator outlet temperature sensor

Claims (10)

A storage chamber for storing an electronic device; a compressor chamber which is a space for storing a compressor and which is positioned at a lower portion of the storage chamber; and a first opening / closing door which is openably / closably installed on a side surface of at least one housing A housing having
A first evaporator provided in the first open / close door and absorbing heat of the air flowing through the storage chamber by a refrigerant;
A first compressor housed in the compressor chamber and compressing the refrigerant via the first evaporator;
An electronic device cooling apparatus, comprising: a first drain water collecting means disposed under the first evaporator and collecting drain water generated in the first evaporator and guiding the drain water to the compressor chamber. In claim 1,
The bottom of the storage chamber is provided with a duct for passing air cooled by the first evaporator,
A part of the duct is provided with an opening through which the storage chamber and the compressor chamber communicate with each other and the drain water collected by the drain water collecting means flows into the compressor chamber. apparatus. In claim 2,
An electronic device cooling apparatus comprising a guide for circulating the drain water from the opening to the compressor chamber. In claim 2,
The drain water collecting means is a drain pan provided at a lower portion of the first evaporator, wherein one end of the drain pan is disposed in the duct so that the collected drain water flows into the duct. Electronic equipment cooling device. In claim 1,
The compressor chamber is provided with a first water storage tank for storing drain water collected by the drain water collecting means, and the first compressor is provided in the first water storage tank. Electronic equipment cooling device. In claim 5,
An electronic device cooling apparatus, wherein a water leakage sensor is provided on an inner wall of the first water storage tank. The claim 1, further comprising:
A condenser chamber for storing a condenser in the upper part of the storage chamber;
A first condenser housed in the condenser chamber and dissipating heat of the refrigerant compressed by the first compressor to the outside air and sending it to the first evaporator,
The air that circulates in the storage chamber and is cooled by the first evaporator is sent to the side surface of the casing facing the first opening / closing door via a duct disposed in the storage chamber, and the electronic An electronic device cooling device that cools the device from the side surface of the opposite housing. The claim 7 further comprising:
The case side surface provided with the open / close door is a second open / close door provided on the side surface of the case opposite to the electronic device,
A second evaporator that is provided in the second opening / closing door, absorbs heat of the air flowing through the storage chamber by a refrigerant, and sends the heat to the electronic device;
A second compressor that is housed in the compressor chamber and compresses the refrigerant that has passed through the second evaporator;
A second condenser housed in the condenser chamber and dissipating heat of the refrigerant compressed by the second compressor to the outside air to send to the second evaporator;
Electronic equipment comprising: a second drain water collecting means disposed under the second evaporator and collecting drain water generated in the second evaporator and guiding the drain water to the compressor chamber. Cooling system. In claim 8,
The second drain water collecting means is provided with a water leakage sensor,
When the water leakage sensor detects moisture, a dehumidifying operation is performed in which the evaporation temperature of the refrigerant in the first evaporator is lower than the evaporation temperature of the refrigerant in the second evaporator. Electronic equipment cooling device. In claim 8,
The compressor chamber has a first water storage tank for storing the drain water collected by the drain water collecting means, and a second water storage for storing the drain water collected by the second drain water collecting means. A tank,
The first compressor is provided in the first water tank, and the second compressor is provided in the second water tank. The first water tank and the second water tank are An electronic device cooling device characterized in that a part thereof is in communication.

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