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WO2015144081A1 - 传冷散热模块化组件、组装方法及半导体冰箱 - Google Patents

传冷散热模块化组件、组装方法及半导体冰箱 Download PDF

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Publication number
WO2015144081A1
WO2015144081A1 PCT/CN2015/075170 CN2015075170W WO2015144081A1 WO 2015144081 A1 WO2015144081 A1 WO 2015144081A1 CN 2015075170 W CN2015075170 W CN 2015075170W WO 2015144081 A1 WO2015144081 A1 WO 2015144081A1
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WIPO (PCT)
Prior art keywords
heat
cold
cooling
hot end
hot
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2015/075170
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English (en)
French (fr)
Inventor
陶海波
张奎
李鹏
王晶
刘建如
李春阳
戚斐斐
吴淑娟
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Haier Group Corp
Qingdao Haier Co Ltd
Original Assignee
Haier Group Corp
Qingdao Haier Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Haier Group Corp, Qingdao Haier Co Ltd filed Critical Haier Group Corp
Publication of WO2015144081A1 publication Critical patent/WO2015144081A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D19/00—Arrangement or mounting of refrigeration units with respect to devices or objects to be refrigerated, e.g. infrared detectors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00—Machines, plants or systems, using electric or magnetic effects
    • F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D11/00—Self-contained movable devices, e.g. domestic refrigerators
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • H10W40/43—
    • H10W40/611—
    • H10W40/73—
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
    • F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
    • F25B2321/023—Mounting details thereof
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
    • F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
    • F25B2321/025—Removal of heat
    • F25B2321/0252—Removal of heat by liquids or two-phase fluids
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
    • F28F1/32—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means having portions engaging further tubular elements
    • H10W40/226—

Definitions

  • the present invention relates to refrigeration technology, and more particularly to a cooling and cooling modular assembly, an assembly method, and a semiconductor refrigerator.
  • the cold end cooling device, the heat conducting block, the semiconductor cooling sheet and the hot end heat dissipating device are often designed separately and separately installed in the refrigerator. This not only makes the assembly process of the refrigerator too complicated, and is extremely inconvenient to disassemble and repair, and it is also difficult to ensure good thermal contact between the cold contact cooling device, the heat conducting block, the semiconductor cooling fin and the hot end heat dissipating device, and heat loss is easily generated.
  • the cold and hot ends of the semiconductor refrigerating sheet are directly brought into direct contact with the aluminum finned heat sink to conduct heat conduction between the solids, thereby realizing the cooling amount of the semiconductor refrigerating sheet to be transferred to the inside of the refrigerator.
  • the heat transfer mode not only has low heat transfer efficiency, but also requires a large area of heat-dissipating aluminum fins, which occupies a large space.
  • a cooling and cooling modular assembly for a semiconductor refrigerator comprising: a hot end heat sink at a proximal side, a cold end cold water device at a distal side, and a sandwich a semiconductor refrigerating sheet and a heat conducting block between the hot end heat sink and the cold end cooling device, wherein a hot end of the semiconductor refrigerating sheet contacts a heat transfer surface of the hot end heat sink to pass the a hot end heat dissipating device radiates heat of the hot end to a surrounding environment; a cold end of the semiconductor refrigerating sheet contacts a proximal surface of the heat conducting block, and a distal surface of the heat conducting block and the cold end pass The cooling surface of the cold device contacts the same; and the cooling and cooling module further includes the cold end cooling device, the heat conducting block, the semiconductor cooling sheet and the assembled together by a foaming process The hot end heat dissipating device is foamed to form an insulating layer between the cold surface of the cold
  • the hot end heat dissipating device comprises: a hot end substrate, a distal surface thereof serving as a heat transfer surface of the hot end heat dissipating device; at least one hot end heat pipe, each of the hot end heat pipes being closed at both ends and Internally sealed with a refrigerant, each of the hot end heat pipes is embedded in the hot end substrate; a hot end fin configured to be in thermal contact with the hot end heat pipe; and a hot end fan configured to be fixed at the hot end Dissipating heat to the hot end fins on the fin;
  • the cold end cooling device comprises: a cold end substrate, the proximal surface of which is a cold surface of the cold end cooling device; at least one cold end heat pipe, Each of the cold end heat pipes is closed at both ends and is internally sealed with a refrigerant, and each of the cold end heat pipes is embedded in the cold end substrate; the cold end fins are configured to be in thermal contact with the cold end heat pipes;
  • An end fan configured to be fixed to the cold end fin
  • the hot end substrate and the cold end substrate are fixedly connected by a fastener to sandwich the heat conducting block and the semiconductor cooling sheet on a distal surface of the hot end substrate and the cold Between the proximal surfaces of the end substrates.
  • the fastener is a fastening bolt
  • the fastening bolt is connected to the cold end substrate through the hot end substrate, and after the foaming, the fastening bolt is located at the A portion between the proximal surface of the cold end substrate and the distal surface of the hot end substrate is surrounded by the insulating layer formed by foaming.
  • the fastening bolt is further provided with a heat insulating gasket configured to isolate a contact portion between the fastening bolt and the cold end substrate or the fastening bolt and the hot end substrate.
  • the cold end heat pipe is inserted into the cold end fin and welded to the cold end fin; the hot end heat pipe is inserted into the hot end fin and soldered to the heat End fins.
  • At least one of the cooling surface and at least one of a distal surface of the thermally conductive block, at least one of the cold end and a proximal surface of the thermally conductive block, and the hot end And a heat conductive silicone layer formed by coating a thermal conductive grease on at least one of the heat transfer surfaces.
  • a method for assembling a cooling and cooling modular assembly for a semiconductor refrigerator comprising: step A, a cold end cooling device, a heat conducting block, a semiconductor cooling sheet, and a hot end heat sink And being assembled with each other in turn; in step B, foaming the cold end cooling device, the heat conducting block, the semiconductor cooling sheet and the heat sink heat dissipating device that have been assembled together by a foaming process to form An insulating layer between the cooling surface of the cold-end cooling device and the heat transfer surface of the heat-end heat dissipating device, the insulating layer surrounding the semiconductor refrigerating sheet and the heat-conducting block in a circumferential direction, The cold end cooling device, the heat conducting block, the semiconductor refrigeration sheet, the The hot end heat sink and the insulating layer form the cooling and cooling modular assembly.
  • the assembling method further includes: step C, opening a hole larger than the size of the heat insulating layer or the size of the heat insulating layer on the casing of the semiconductor refrigerator, and the cooling and cooling module The assembly is placed into the hole such that the hole accommodates the insulating layer; and in step D, the gap between the hole and the contact surface of the insulating layer is filled and sealed.
  • the hot end heat dissipating device comprises: a hot end substrate, a distal surface thereof serving as a heat transfer surface of the hot end heat dissipating device; at least one hot end heat pipe, each of the hot end heat pipes being closed at both ends and Internally sealed with a refrigerant, each of the hot end heat pipes is embedded in the hot end substrate; a hot end fin configured to be in thermal contact with the hot end heat pipe; and a hot end fan configured to be fixed at the hot end Dissipating heat to the hot end fins on the fin;
  • the cold end cooling device comprises: a cold end substrate, the proximal surface of which is a cold surface of the cold end cooling device; at least one cold end heat pipe, Each of the cold end heat pipes is closed at both ends and is internally sealed with a refrigerant, and each of the cold end heat pipes is embedded in the cold end substrate; the cold end fins are configured to be in thermal contact with the cold end heat pipes;
  • An end fan configured to be fixed to the cold end fin
  • the step A includes: connecting a fastening bolt through the hot end substrate to the cold end substrate to sandwich the heat conducting block and the semiconductor refrigerating sheet on the hot end substrate The distal surface is between the proximal surface of the cold end substrate.
  • a semiconductor refrigerator including the cooling and cooling module of one of the above technical solutions is provided.
  • the cooling and cooling module of the invention is designed and manufactured as a whole, and when the semiconductor refrigerator is assembled, the cold-end cooling device, the heat-conducting block, the semiconductor cooling plate and the hot-end heat sink, and the heat-dissipating heat-dissipating modular component of the heat-insulating layer are included. After being assembled as a whole, it is assembled into a semiconductor refrigerator. Compared with the prior art, the cold end cooling device, the heat conducting block, the semiconductor cooling fin and the hot end heat sink are respectively assembled into the refrigerator.
  • the invented cooling and cooling modular assembly can reduce the assembly process of the semiconductor refrigerator, can be easily installed and disassembled, and can ensure good thermal contact between the various contact surfaces, thereby avoiding heat loss.
  • the present invention can improve the heat transfer efficiency of the cooling and cooling modular assembly by transferring the temperature of the cold and hot ends of the semiconductor refrigerating sheet by phase change heat transfer using a heat pipe.
  • FIG. 1 is a schematic structural view of a cooling and cooling module of a cooling device according to an embodiment of the present invention
  • FIG. 2 is a schematic diagram of a thermal insulation layer, a thermal block, and a semiconductor refrigeration chip connection structure of the cooling and cooling module according to the embodiment shown in FIG. 1;
  • FIG. 3 is a schematic structural view of a heat sink heat dissipating device of the cooling and cooling module according to the embodiment shown in FIG. 1;
  • FIG. 4 is a schematic structural view of a cold-end cooling device according to the embodiment of the embodiment shown in FIG. 1;
  • FIG. 5 is a schematic structural view of a fastening bolt and a heat insulating gasket of a cooling and cooling module assembly according to an embodiment of the present invention
  • FIG. 6 is a schematic structural view of a fastening bolt with a heat insulating gasket installed in a cooling and cooling modular assembly according to an embodiment of the present invention
  • FIG. 7 is a schematic structural view of a semiconductor refrigerator mounted with a cooling and cooling module of the embodiment of the present invention.
  • FIG. 8 is a flow chart of a method of assembling a cooling and cooling modular assembly in accordance with one embodiment of the present invention.
  • Cooling and cooling modular components 100 Cooling and cooling modular components 100,
  • 801 to 804 are the individual steps of the assembly method.
  • FIG. 1 is a block diagram of a cooling and cooling modular assembly 100 in accordance with one embodiment of the present invention. It should be noted that, in FIG. 1 and the following embodiments, the direction near the hot end heat sink 10 is near, and the direction near the cold end cooler 20 is far.
  • the cooling and cooling module 100 for a semiconductor refrigerator may include: a hot end heat sink 10 on the near side, a cold end cooling device 20 on the far side, and a sandwich The semiconductor refrigerating sheet 30 and the heat conducting block 40 between the hot end heat sink 10 and the cold end cooling device 20. As can be seen from FIG.
  • the hot end of the semiconductor refrigerating sheet 30 is in contact with the heat transfer surface of the hot end heat sink 10 to dissipate the heat of the hot end to the surrounding environment through the hot end heat sink 10; the cold of the semiconductor refrigerating sheet 30 The end is in contact with the proximal surface of the thermally conductive block 40, and the distal surface of the thermally conductive block 40 is in contact with the cold side of the cold end cooling device 20.
  • the heat transfer contact surfaces of the cooling and cooling modular assembly 100 need to be coated with a material such as thermal grease to enhance heat transfer.
  • a material such as thermal grease to enhance heat transfer.
  • At least one of the faces has a layer of thermally conductive silicone formed of a thermally conductive silicone grease. The thermal grease layer acts on the one hand to transfer heat and on the other hand to bond.
  • the cooling and cooling modular assembly 100 can further include an insulating layer 50 that surrounds the semiconductor cooling fins 30 and the thermally conductive block 40 in the circumferential direction.
  • the insulating layer 50 is generally formed by foaming the assembled cold end cooling device 20, the heat conducting block 40, the semiconductor refrigerating sheet 30, and the hot end heat sink 10 by a foaming process. It may be located between the cold side of the cold end cooling device 20 and the heat transfer surface of the hot end heat sink 10. Insulation 50 mainly plays a role in heat insulation and connection fixation.
  • FIG. 3 is a schematic diagram of the structure of the hot end heat dissipating device 10 of the cooling and cooling module 100 according to the embodiment of FIG. 1.
  • the hot end heat sink 10 includes a hot end substrate 11, at least one hot end heat pipe 12, hot end fins 13, and a hot end fan 14.
  • the distal surface of the hot end substrate 11 serves as a heat transfer surface of the hot end heat sink 10.
  • Each of the hot end heat pipes 12 is closed at both ends and is internally sealed with a refrigerant and embedded in the hot end substrate 11.
  • the hot end heat pipe 12 transfers heat generated by the hot end of the semiconductor refrigerating sheet 30 through the refrigerant phase change, relative to the semiconductor refrigerating sheet.
  • the hot end of 30 is in direct contact with the hot end fins 13, which improves heat transfer efficiency.
  • the hot end fins 13 are in thermal contact with the hot end heat pipe 12, and the hot end fan 14 is fixed to the hot end fins 13 to dissipate heat to the hot end fins 13.
  • the hot end fan 14 is forcedly convected by the hot end fan 13 to accelerate the heat transfer from the hot end of the semiconductor refrigerating sheet 30 to the hot end fin 13 to the surrounding environment, thereby increasing the heat exchange effect.
  • the hot end substrate 11 may be made of a metal material having good heat transfer properties such as copper or aluminum.
  • the hot end heat pipe 12 is embedded in the hot end substrate 11 and then soldered or otherwise mechanically fixed to ensure that Good contact between the person and the largest possible contact surface, the contact surface can be coated with materials such as thermal grease to enhance heat transfer.
  • the hot end heat pipe 12 can be inserted into the hot end fins 13, and the hot end heat pipes 12 can be welded to the hot end fins 13 by soldering or the like. This allows the hot end fins 13 and the hot end heat pipe 12 to have good contact, thereby ensuring that the heat of the hot end heat pipe 12 can be transferred to the hot end fins 13.
  • the hot end substrate 11 and the cold end substrate 21 of the cold end cooling device 20 are fixedly connected by fasteners to sandwich the heat conducting block 40 and the semiconductor refrigerating sheet 30 on the hot end substrate 11.
  • the distal surface is in contact with the proximal surface of the cold end substrate 21 so that the cooling and cooling modular assembly 100 of the embodiment of the present invention is fixed and then foamed.
  • the fastener may be a fastening bolt 60 that is connected to the cold end substrate 21 through the hot end substrate 11 , and after the foaming, the fastening bolt 60 is located on the proximal surface of the cold end substrate 21 and A portion between the distal surfaces of the hot end substrate 11 is surrounded by the insulating layer 50 formed by foaming.
  • the hot end heat pipe 12 extends upward from the contact end with the hot end substrate 11 to the other end in contact with the hot end fins 13, and the hot end heat dissipating device 10 except the hot end
  • the other components of the substrate 11 are located at the upper portion of the cold-end cooling device 20, which is merely an example of the present invention and does not limit the cooling and cooling modular assembly 100 of the present invention.
  • the heat The end heat sink 10 can be located at the cold end except for other components of the hot end substrate 11.
  • Other parts of the cold device 20 are, for example, located at or below their level.
  • the cold end cooling device 20 includes a cold end substrate 21, at least one cold end heat pipe 22, cold end fins 23, and a cold end fan 24.
  • the proximal surface of the cold end substrate 21 is the cold side of the cold end cooling device 20.
  • Each of the cold-end heat pipes 22 is closed at both ends and is internally sealed with a refrigerant and embedded in the cold-end substrate 21.
  • the cold-end heat pipe 22 transmits the cold amount generated by the cold end of the semiconductor refrigeration sheet 30 through the refrigerant phase change, and the semiconductor is cooled.
  • the cold end of the sheet 30 is in direct contact with the cold end fins 23, which improves heat transfer efficiency.
  • the cold end fins 23 are in thermal contact with the cold end heat pipe 22, and the cold end fan 24 is fixed to the cold end fins 23 to spread the cold amount of the cold end fins 23.
  • the cold end fan 23 is engaged with the cold end fan 23 for forced convection, so that the cold heat dissipating modular assembly 100 is installed in the refrigerator case 200, and the cold end of the semiconductor refrigerating piece 30 is transferred to the cold end fin 23.
  • the amount of cold is evenly distributed in the cooling compartment of the refrigerator.
  • the cold end substrate 21 may be made of a metal material having good heat transfer properties such as copper or aluminum.
  • the cold end heat pipe 22 is embedded in the cold end substrate 21 and then welded or otherwise mechanically fixed to ensure the Good contact and the largest possible contact surface, the contact surface can be coated with materials such as thermal grease to enhance heat transfer.
  • the cold end heat pipe 22 can be inserted into the cold end fins 23, and the cold end heat pipes 22 can be welded to the cold end fins 23 by soldering or other means. This allows the cold end fins 23 and the cold end heat pipes 22 to have good contact, thereby ensuring that the cold end heat pipe 22 can be transferred to the cold end fins 23.
  • the cold-end heat pipe 22 is U-shaped, which is only a preferred embodiment of the present invention, and can save the space of the refrigerator and facilitate installation, and does not affect the present invention.
  • the cooling and cooling modular assembly 100 constitutes a limitation. In other embodiments of the invention, it may be other shapes, for example the cold end heat pipe 22 may be a straight tube.
  • FIG. 5 is a schematic structural view of a fastening bolt 60 and a heat insulating gasket 61 of the cooling and cooling module assembly 100 according to an embodiment of the present invention.
  • FIG. 6 is a schematic structural view of a fastening bolt 60 to which a heat insulating gasket 61 is mounted, in accordance with an embodiment of the present invention.
  • the fastening bolt 60 can also be provided with a heat insulating gasket 61.
  • the heat insulating gasket 61 is used to isolate a contact portion between the fastening bolt 60 and the hot end substrate 11.
  • a heat insulating gasket 61 that isolates a contact portion of the fastening bolt 60 from the cold end substrate 21 may also be provided. This prevents the cold and heat of the hot and cold ends from being transmitted through the fastening bolts 60.
  • the heat generated by the hot end of the semiconductor refrigerating sheet 30 is transferred to the hot end substrate 11 and the hot end heat pipe 12 embedded in the hot end substrate 11, and then passed through the heat.
  • the end heat pipe 12 is transferred to the hot end fins 13, and the heat is discharged to the outer space through the hot end fan 14.
  • the cold amount generated by the cold end of the semiconductor refrigerating piece 30 is first transferred to the cold end substrate 21 through the heat conducting block 40 and embedded therein.
  • the cold-end heat pipe 22 in the cold-end substrate 21 is transferred to the cold-end fins 23 through the cold-end heat pipe 22, and then the cold-end heat is blown to the inside of the refrigerator through the cold-end fan 24, thereby realizing refrigeration of the refrigerator.
  • FIG. 7 is a schematic structural view of a semiconductor refrigerator in which the cooling and cooling module assembly 100 of the embodiment of the present invention is mounted.
  • the cold end cooling device 20, the heat conducting block 40, the semiconductor refrigerating sheet 30 and the hot end heat dissipating device 10 may be fixedly connected and then foamed to form an integrally assembled cooling and cooling module 100.
  • the heat transfer and cooling modular assembly 100 is then assembled as a unit into a semiconductor refrigerator.
  • the holes may be reserved in advance on the casing 200 of the semiconductor refrigerator, and the size of the holes is equal to or slightly larger than the size of the heat insulating layer 50.
  • the cooling and cooling modular assembly 100 is assembled to the refrigerator, it can be placed directly into the reserved hole in the casing 200. As shown in FIG.
  • the insulating layer 50 can be brought into contact with the case 200. Sealing the contact surface of the cooling and cooling modular assembly 100 with the housing 200 (or the contact surface of the thermal insulation layer 50 with the housing 200), the thermal insulation layer 50 and the housing can be filled by filling the sealing surface with the sealing adhesive. The gap of 200 fills the seal.
  • the present invention discloses a semiconductor refrigerator equipped with the cooling and cooling modular assembly 100 of any of the above embodiments.
  • FIG. 8 is a flow chart of a method of assembling a cooling and cooling modular assembly 100 in accordance with one embodiment of the present invention.
  • the assembly method of the cooling and cooling module assembly 100 for a semiconductor refrigerator may include:
  • step 801 the cold-end cold-cooling device 20, the heat-conducting block 40, the semiconductor refrigerating sheet 30, and the hot-end heat sink 10 are sequentially connected to each other and assembled.
  • Step 802 foaming the cold end cooling device 20, the heat conducting block 40, the semiconductor refrigerating sheet 30, and the hot end heat dissipating device 10 that have been assembled together to form a cooling surface of the cold end cooling device 20
  • the heat insulating layer 50 surrounds the semiconductor refrigerating sheet 30 and the heat conducting block 40 in the circumferential direction with the heat insulating layer 50 between the heat transfer surfaces of the heat sink heat dissipating device 10, and the cold end cooling device 20, the heat conducting block 40, and the semiconductor refrigerating sheet 30.
  • the hot end heat dissipating device 10 and the heat insulating layer 50 form a cooling and cooling module 100.
  • the assembling method may further include:
  • Step 803 the semiconductor 200 of the semiconductor refrigerator 200 is larger than the size of the thermal insulation layer 50 or the size of the thermal insulation layer 50, the cooling and cooling module 100 is placed into the hole, so that the hole accommodates the insulation layer 50;
  • step 804 the gap between the hole and the contact surface of the heat insulating layer 50 is filled and sealed.
  • the hot end heat dissipating device 10 and the cold end cooling device 20 mentioned in the assembling method of the embodiment of the present invention may be the same as the cooling and heat dissipating modular assembly 100 in any of the above embodiments of the present invention.
  • the hot end heat sink 10 may include: a hot end substrate 11, at least one hot end heat pipe 12, hot end fins 13 and a hot end fan 14; 20 may include a cold end substrate 21, at least one cold end heat pipe 22, cold end fins 23, and a cold end fan 24.
  • the distal surface of the hot end substrate 11 serves as a heat transfer surface of the heat sink heat dissipating device 10, and each of the hot end heat pipes 12 is closed at both ends and is internally sealed with a refrigerant and embedded in the hot end substrate 11, the hot end fins 13 and The hot end heat pipe 12 is in thermal contact, the hot end fan 14 is fixed on the hot end fin 13 to dissipate heat to the hot end fin 13; the near side surface of the cold end substrate 21 is the cold side of the cold end cold transfer device 20, each The cold-end heat pipe 22 is closed at both ends and is internally sealed with refrigerant and embedded in the cold-end substrate 21, the cold-end fins 23 are in thermal contact with the cold-end heat pipe 22, and the cold-end fan 24 is fixed on the cold-end fins 23 to spread the cold. The amount of cold of the end fins 23.
  • the step 801 may include: connecting the fastening bolt 60 through the hot end substrate 11 to the cold end substrate 21 to sandwich the heat conductive block 40 and the semiconductor refrigerating sheet 30 on the hot end substrate 11.
  • the distal surface is between the proximal surface of the cold end substrate 21.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Devices That Are Associated With Refrigeration Equipment (AREA)

Abstract

一种传冷散热模块化组件（100）、组装方法及半导体冰箱，包括：处于近侧的具有热管（12）的热端散热装置（10）、处于远侧的具有热管（22）的冷端传冷装置（20）及夹置它们之间的半导体制冷片（30）和导热块（40），其中，导热块（40）设置在半导体制冷片（30）和冷端传冷装置（20）之间。上述部件组装在一起后，对其进行发泡从而形成在冷端传冷装置（20）的传冷面与热端散热装置（10）的传热面之间的周向上将半导体制冷片（30）和导热块（40）包围住的保温层（50）。

Description

传冷散热模块化组件、组装方法及半导体冰箱 技术领域
本发明涉及制冷技术，特别是涉及一种传冷散热模块化组件、组装方法及半导体冰箱。
背景技术
现有技术中，冷端传冷装置、导热块、半导体制冷片和热端散热装置往往分别设计且分别单独安装到冰箱中。这不仅使得冰箱的装配流程过于复杂、拆卸维修极其不便，也难以保证冷端传冷装置、导热块、半导体制冷片和热端散热装置的各个接触面进行良好热接触，容易产生热损失。
另外，在现有技术中，往往将半导体制冷片的冷热端分别与铝制翅片式散热器直接接触而进行固体间的热传导，实现将半导体制冷片的冷量传递到冰箱内部、将其热端的热量传递到冰箱外部的过程。该传热方式不仅传热效率低，且需要较大面积的散热铝翅片，占用了较大空间。
发明内容
本发明的一个目的在于克服现有技术的制冷设备的至少一个缺陷，提供一种可便捷安装、拆卸且可保证各个接触面间良好热接触的传冷散热模块化组件、组装方法及半导体冰箱。
本发明一个进一步的目的是要提升传冷散热模块化组件的传热效率。
根据本发明的一个方面，提供了一种用于半导体冰箱的传冷散热模块化组件，包括：处于近侧的热端散热装置、处于远侧的冷端传冷装置、以及夹置在所述热端散热装置与所述冷端传冷装置之间的半导体制冷片和导热块，其中所述半导体制冷片的热端与所述热端散热装置的传热面接触抵靠，以通过所述热端散热装置将所述热端的热量散发到周围环境；所述半导体制冷片的冷端与所述导热块的近侧表面接触抵靠，所述导热块的远侧表面与所述冷端传冷装置的传冷面接触抵靠；而且所述传冷散热模块化组件还包括通过发泡工艺对已组装在一起的所述冷端传冷装置、所述导热块、所述半导体制冷片和所述热端散热装置进行发泡从而形成在所述冷端传冷装置的传冷面与所述热端散热装置的传热面之间的保温层，所述保温层在周向上将所述半导 体制冷片和所述导热块包围住。
可选地，所述热端散热装置包括：热端基板，其远侧表面作为所述热端散热装置的传热面；至少一根热端热管，每根所述热端热管两端封闭且内部封闭有冷媒，每根所述热端热管镶嵌于所述热端基板中；热端翅片，配置成与所述热端热管热接触；以及热端风机，配置成固定在所述热端翅片上，对所述热端翅片进行散热；所述冷端传冷装置包括：冷端基板，其近侧表面为所述冷端传冷装置的传冷面；至少一根冷端热管，每根所述冷端热管两端封闭且内部封闭有冷媒，每根所述冷端热管镶嵌于所述冷端基板中；冷端翅片，配置成与所述冷端热管热接触；以及冷端风机，配置成固定在所述冷端翅片上，散布所述冷端翅片的冷量。
可选地，所述热端基板与所述冷端基板通过紧固件固定连接，以将所述导热块和所述半导体制冷片夹置于所述热端基板的远侧表面与所述冷端基板的近侧表面之间。
可选地，所述紧固件为紧固螺栓，所述紧固螺栓穿过所述热端基板与所述冷端基板相连接，在进行所述发泡后，所述紧固螺栓位于所述冷端基板的近侧表面和所述热端基板的远侧表面之间的部分被发泡形成的所述保温层包围住。
可选地，所述紧固螺栓还设有隔热垫圈，配制成隔绝所述紧固螺栓与所述冷端基板或所述紧固螺栓与所述热端基板的接触部位。
可选地，所述冷端热管穿插于所述冷端翅片中，并焊接于所述冷端翅片；所述热端热管穿插于所述热端翅片中，并焊接于所述热端翅片。
可选地，所述传冷面与所述导热块的远侧表面中的至少一个面上、所述冷端与所述导热块的近侧表面中的至少一个面上、以及所述热端与所述传热面中的至少一个面上具有涂覆导热硅脂形成的导热硅脂层。
根据本发明的另一方面，提供了一种用于半导体冰箱的传冷散热模块化组件的组装方法，包括：步骤A，将冷端传冷装置、导热块、半导体制冷片及热端散热装置依次相互连接组装在一起；步骤B，通过发泡工艺对已组装在一起的所述冷端传冷装置、所述导热块、所述半导体制冷片和所述热端散热装置进行发泡从而形成在所述冷端传冷装置的传冷面与所述热端散热装置的传热面之间的保温层，所述保温层在周向上将所述半导体制冷片和所述导热块包围住，所述冷端传冷装置、所述导热块、所述半导体制冷片、所述 热端散热装置及所述保温层形成所述传冷散热模块化组件。
可选地，所述组装方法还包括：步骤C，在所述半导体冰箱的箱体上开设大于所述保温层的尺寸或与所述保温层的尺寸一致的孔洞，将所述传冷散热模块化组件放置到所述孔洞，使所述孔洞容纳所述保温层；步骤D，将所述孔洞与所述保温层的接触面的间隙填充密封。
可选地，所述热端散热装置包括：热端基板，其远侧表面作为所述热端散热装置的传热面；至少一根热端热管，每根所述热端热管两端封闭且内部封闭有冷媒，每根所述热端热管镶嵌于所述热端基板中；热端翅片，配置成与所述热端热管热接触；以及热端风机，配置成固定在所述热端翅片上，对所述热端翅片进行散热；所述冷端传冷装置包括：冷端基板，其近侧表面为所述冷端传冷装置的传冷面；至少一根冷端热管，每根所述冷端热管两端封闭且内部封闭有冷媒，每根所述冷端热管镶嵌于所述冷端基板中；冷端翅片，配置成与所述冷端热管热接触；以及冷端风机，配置成固定在所述冷端翅片上，散布所述冷端翅片的冷量。
可选地，所述步骤A包括：将紧固螺栓穿过所述热端基板与所述冷端基板相连接，以将所述导热块和所述半导体制冷片夹置于所述热端基板的远侧表面与所述冷端基板的近侧表面之间。
根据本发明的又一方面，提供了一种半导体冰箱，所述半导体冰箱包括上述技术方案之一的传冷散热模块化组件。
本发明的传冷散热模块化组件作为一个整体设计制造，在半导体冰箱组装时，将包括冷端传冷装置、导热块、半导体制冷片和热端散热装置、保温层的传冷散热模块化组件作为一个整体装配好后，再组装到半导体冰箱中，这相比于现有技术中，将冷端传冷装置、导热块、半导体制冷片和热端散热装置分别组装到冰箱中的方式，本发明的传冷散热模块化组件能减少半导体冰箱组装的工艺流程，可以便捷安装和拆卸，且能够保证各个接触面间良好热接触，从而避免热量损失。
进一步地，本发明由于使用热管通过相变传热传递半导体制冷片的冷热端的温度，因此能够提升传冷散热模块化组件的传热效率。
根据下文结合附图对本发明具体实施例的详细描述，本领域技术人员将会更加明了本发明的上述以及其他目的、优点和特征。
附图说明
后文将参照附图以示例性而非限制性的方式详细描述本发明的一些具体实施例。附图中相同的附图标记标示了相同或类似的部件或部分。本领域技术人员应该理解，这些附图未必是按比例绘制的。附图中：
图1是根据本发明一个实施例的传冷散热模块化组件的结构示意图；
图2是根据图1所示实施例的传冷散热模块化组件的保温层、导热块、半导体制冷片连接结构示意图；
图3是根据图1所示实施例的传冷散热模块化组件的热端散热装置的结构示意图；
图4是根据图1所示实施例的传冷散热模块化组件的冷端传冷装置的结构示意图；
图5是根据本发明一个实施例的传冷散热模块化组件的紧固螺栓与隔热垫圈的示意性结构图；
图6是根据本发明一个实施例的传冷散热模块化组件的安装有隔热垫圈的紧固螺栓的示意性结构图；
图7是安装有本发明实施例的传冷散热模块化组件的半导体冰箱的结构示意图；
图8是根据本发明一个实施例的传冷散热模块化组件的组装方法的流程图；
附图中使用的附图标记如下：
热端散热装置          10，
热端基板              11，
热端热管              12，
热端翅片              13，
热端风机              14，
冷端传冷装置          20，
冷端基板              21，
冷端热管              22，
冷端翅片              23，
冷端风机              24，
半导体制冷片          30，
导热块                40，
保温层                50，
紧固螺栓              60，
隔热垫圈              61，
传冷散热模块化组件    100，
箱体                  200，
801至804为组装方法的各个步骤。
具体实施方式
图1是根据本发明一个实施例的传冷散热模块化组件100的结构示意图。需要说明的是，在图1及下文的实施例中，靠近热端散热装置10的方向为近侧，靠近冷端传冷装置20的方向为远侧。在图1所示的实施例中，该用于半导体冰箱的传冷散热模块化组件100可以包括：处于近侧的热端散热装置10、处于远侧的冷端传冷装置20、以及夹置在热端散热装置10与冷端传冷装置20之间的半导体制冷片30和导热块40。由图1可以看出，半导体制冷片30的热端与热端散热装置10的传热面接触抵靠，以通过热端散热装置10将热端的热量散发到周围环境；半导体制冷片30的冷端与导热块40的近侧表面接触抵靠，导热块40的远侧表面与冷端传冷装置20的传冷面接触抵靠。
在本发明的一个实施例中，传冷散热模块化组件100的各个传热接触面上需要涂抹导热硅脂等材料以加强传热。具体地，传冷面与导热块40的远侧表面中的至少一个面上、冷端与导热块40的近侧表面中的至少一个面上、以及热端与热端散热装置10的传热面中至少一个面上具有涂覆导热硅脂形成的导热硅脂层。导热硅脂层一方面能起到传递热量的作用，另一方面也能起到粘接固定作用。
图2是根据图1实施例的传冷散热模块化组件100的保温层50、导热块40、半导体制冷片30连接结构示意图。由图2可以看出，传冷散热模块化组件100还可包括在周向上将半导体制冷片30和导热块40包围住的保温层50。该保温层50一般通过发泡工艺对已组装在一起的冷端传冷装置20、导热块40、半导体制冷片30和热端散热装置10进行发泡而形成。其可以位于冷端传冷装置20的传冷面与热端散热装置10的传热面之间。保温层 50主要起绝热和连接固定作用。
图3是根据图1实施例的传冷散热模块化组件100的热端散热装置10的结构示意图。在图3的实施例中，热端散热装置10包括：热端基板11、至少一根热端热管12、热端翅片13以及热端风机14。热端基板11的远侧表面作为热端散热装置10的传热面。每根热端热管12两端封闭且内部封闭有冷媒且镶嵌于热端基板11中，热端热管12通过制冷剂相变传递半导体制冷片30的热端产生的热量，相对于将半导体制冷片30的热端直接与热端翅片13接触，这样能够提高传热效率。热端翅片13与热端热管12热接触，热端风机14固定在热端翅片13上以对热端翅片13进行散热。在热端翅片13上配合热端风机14进行强制对流，可以加速将半导体制冷片30的热端传递到热端翅片13的热量散发到周围环境，增加换热效果。
在本发明的另一个实施例中，热端基板11可以采用铜、铝等传热性能较好的金属材料，热端热管12嵌入到热端基板11后通过焊接或者其他的机械固定，保证二者之间良好的接触和尽可能大的接触面，其接触面可涂抹导热硅脂等材料加强传热。
在本发明的一个实施例中，热端热管12可以穿插于热端翅片13中，热端热管12可以通过锡焊或者其他方式焊接于热端翅片13。这样使热端翅片13和热端热管12具有良好的接触，从而保证热端热管12的热量能够传到热端翅片13中去。
在本发明的一个实施例中，热端基板11与冷端传冷装置20的冷端基板21通过紧固件固定连接，以将导热块40和半导体制冷片30夹置于热端基板11的远侧表面与冷端基板21的近侧表面之间，以便本发明实施例的传冷散热模块化组件100被固定好后进行发泡。具体地，紧固件可以为紧固螺栓60，紧固螺栓60穿过热端基板11与冷端基板21相连接，在进行发泡后，紧固螺栓60位于冷端基板21的近侧表面和热端基板11的远侧表面之间的部分被发泡形成的保温层50包围住。
需要理解的是，在图3所示的实施例中，热端热管12从与热端基板11的接触端向上延伸到达与热端翅片13接触的另一端，热端散热装置10除了热端基板11的其他部件位于冷端传冷装置20的上部，其仅仅为本发明的一个范例，并不对本发明的传冷散热模块化组件100构成限制，在本发明的其他实施例中，该热端散热装置10除了热端基板11的其他部件可位于冷端传 冷装置20的其他部位，例如位于其下部或与其平齐。
图4是根据图1实施例的传冷散热模块化组件100的冷端传冷装置20的结构示意图。在图4所示的实施例中，冷端传冷装置20包括：冷端基板21、至少一根冷端热管22、冷端翅片23以及冷端风机24。冷端基板21的近侧表面为冷端传冷装置20的传冷面。每根冷端热管22两端封闭且内部封闭有冷媒且镶嵌于冷端基板21中，冷端热管22通过制冷剂相变传递半导体制冷片30的冷端产生的冷量，相对于将半导体制冷片30的冷端直接与冷端翅片23接触，这样能够提高传热效率。冷端翅片23与冷端热管22热接触，冷端风机24固定在冷端翅片23上以散布冷端翅片23的冷量。在冷端翅片23上配合冷端风机24进行强制对流，可以使得将传冷散热模块化组件100安装在冰箱箱体200后，将半导体制冷片30的冷端传递到冷端翅片23的冷量在冰箱的制冷间室内均匀分布。
在本发明的一个实施例中，冷端基板21可以采用铜、铝等传热性能较好的金属材料，冷端热管22嵌入到冷端基板21后通过焊接或者其他的机械固定，保证二者之间良好的接触和尽可能大的接触面，其接触面可涂抹导热硅脂等材料加强传热。
在本发明的另一个实施例中，冷端热管22可以穿插于冷端翅片23中，冷端热管22可以通过锡焊或者其他方式焊接于冷端翅片23。这样使冷端翅片23和冷端热管22具有良好的接触，从而保证冷端热管22的冷量能够传到冷端翅片23中去。
需要理解的是，在图4所示的实施例中，冷端热管22呈U形，其仅仅为本发明的一个优选实施例，能够起到节约冰箱空间、便于安装的作用，并不对本发明的传冷散热模块化组件100构成限制。在本发明的其他实施例中，其可以为其他形状，例如冷端热管22可以为直管。
图5是根据本发明一个实施例的传冷散热模块化组件100的紧固螺栓60与隔热垫圈61的示意性结构图。图6是根据本发明一个实施例的传冷散热模块化组件100的安装有隔热垫圈61的紧固螺栓60的示意性结构图。由图5、图6可以看出，紧固螺栓60还可以设有隔热垫圈61。该隔热垫圈61用于隔绝紧固螺栓60与热端基板11的接触部位。在本发明的其他实施例中，还可以设置隔绝紧固螺栓60与冷端基板21的接触部位的隔热垫圈61。这样可防止冷热端的冷量和热量通过紧固螺栓60进行传递。
在上述实施例中，当传冷散热模块化组件100工作时，半导体制冷片30的热端产生的热量传递给热端基板11和嵌入到热端基板11中的热端热管12，再通过热端热管12传递到热端翅片13中，再通过热端风机14将热量排至外部空间；半导体制冷片30的冷端产生的冷量先通过导热块40传递给冷端基板21和嵌入到冷端基板21中的冷端热管22，再通过冷端热管22传递到冷端翅片23，再通过冷端风机24将冷量散热至冰箱内部，从而实现冰箱制冷。
图7是安装本发明实施例的传冷散热模块化组件100的半导体冰箱的结构示意图。在进行装配时，可以先将冷端传冷装置20、导热块40、半导体制冷片30和热端散热装置10固定连接后，进行发泡，形成一个整体装配好的传冷散热模块化组件100，然后将此传冷散热模块化组件100作为一个整体组装到半导体冰箱中。具体地，可以在半导体冰箱的箱体200上提前预留孔洞，孔洞的尺寸与保温层50尺寸一致或略大于保温层50尺寸。在将传冷散热模块化组件100往冰箱上装配时，将其直接放置进入箱体200上的预留孔洞即可。如图7所示，在放置完毕后，可以使得保温层50与箱体200接触。将传冷散热模块化组件100与箱体200的接触面密封(或者说，保温层50与箱体200的接触面)，可以通过在该接触面填充密封胶的方式将保温层50与箱体200的间隙填充密封。
由图7还可以看出，本发明公开了一种半导体冰箱，该半导体冰箱安装有上述任一实施例的传冷散热模块化组件100。
图8是根据本发明一个实施例的传冷散热模块化组件100的组装方法的流程图。在图8所示的实施例中，用于半导体冰箱的传冷散热模块化组件100的组装方法可包括：
步骤801，将冷端传冷装置20、导热块40、半导体制冷片30及热端散热装置10依次相互连接组装在一起。
步骤802，通过发泡工艺对已组装在一起的冷端传冷装置20、导热块40、半导体制冷片30和热端散热装置10进行发泡从而形成在冷端传冷装置20的传冷面与热端散热装置10的传热面之间的保温层50，保温层50在周向上将半导体制冷片30和导热块40包围住，冷端传冷装置20、导热块40、半导体制冷片30、热端散热装置10及保温层50形成传冷散热模块化组件100。
在本发明的另一个实施例中，该组装方法还可以包括：
步骤803，在半导体冰箱的箱体200上开设大于保温层50的尺寸或与保温层50的尺寸一致的孔洞，将传冷散热模块化组件100放置到孔洞，使孔洞容纳保温层50；
步骤804，将孔洞与保温层50的接触面的间隙填充密封。
需要说明的是，在本发明实施例的组装方法中提到的热端散热装置10和冷端传冷装置20可以与本发明上述任一实施例中的传冷散热模块化组件100相同。或者说，在本发明实施例的组装方法中，热端散热装置10可包括：热端基板11、至少一根热端热管12、热端翅片13以及热端风机14；冷端传冷装置20可包括：冷端基板21、至少一根冷端热管22、冷端翅片23以及冷端风机24。其中，热端基板11的远侧表面作为热端散热装置10的传热面，每根热端热管12两端封闭且内部封闭有冷媒且镶嵌于热端基板11中，热端翅片13与热端热管12热接触，热端风机14固定在热端翅片13上以对热端翅片13进行散热；冷端基板21的近侧表面为冷端传冷装置20的传冷面，每根冷端热管22两端封闭且内部封闭有冷媒且镶嵌于冷端基板21中，冷端翅片23与冷端热管22热接触，冷端风机24固定在冷端翅片23上以散布冷端翅片23的冷量。
在本发明的一个实施例中，步骤801可包括：将紧固螺栓60穿过热端基板11与冷端基板21相连接，以将导热块40和半导体制冷片30夹置于热端基板11的远侧表面与冷端基板21的近侧表面之间。
至此，本领域技术人员应认识到，虽然本文已详尽示出和描述了本发明的多个示例性实施例，但是，在不脱离本发明精神和范围的情况下，仍可根据本发明公开的内容直接确定或推导出符合本发明原理的许多其他变型或修改，例如对热端热管12或冷端热管22的形状的改变。因此，本发明的范围应被理解和认定为覆盖了所有这些其他变型或修改。

Claims (12)

  1. 一种用于半导体冰箱的传冷散热模块化组件，包括：处于近侧的热端散热装置、处于远侧的冷端传冷装置、以及夹置在所述热端散热装置与所述冷端传冷装置之间的半导体制冷片和导热块，其中
    所述半导体制冷片的热端与所述热端散热装置的传热面接触抵靠，以通过所述热端散热装置将所述热端的热量散发到周围环境；
    所述半导体制冷片的冷端与所述导热块的近侧表面接触抵靠，所述导热块的远侧表面与所述冷端传冷装置的传冷面接触抵靠；而且
    所述传冷散热模块化组件还包括通过发泡工艺对已组装在一起的所述冷端传冷装置、所述导热块、所述半导体制冷片和所述热端散热装置进行发泡从而形成在所述冷端传冷装置的传冷面与所述热端散热装置的传热面之间的保温层，所述保温层在周向上将所述半导体制冷片和所述导热块包围住。
  2. 根据权利要求1所述的传冷散热模块化组件，其中
    所述热端散热装置包括：
    热端基板，其远侧表面作为所述热端散热装置的传热面；
    至少一根热端热管，每根所述热端热管两端封闭且内部封闭有冷媒，每根所述热端热管镶嵌于所述热端基板中；
    热端翅片，配置成与所述热端热管热接触；以及
    热端风机，配置成固定在所述热端翅片上，对所述热端翅片进行散热；
    所述冷端传冷装置包括：
    冷端基板，其近侧表面为所述冷端传冷装置的传冷面；
    至少一根冷端热管，每根所述冷端热管两端封闭且内部封闭有冷媒，每根所述冷端热管镶嵌于所述冷端基板中；
    冷端翅片，配置成与所述冷端热管热接触；以及
    冷端风机，配置成固定在所述冷端翅片上，散布所述冷端翅片的冷量。
  3. 根据权利要求2所述的传冷散热模块化组件，其中
    所述热端基板与所述冷端基板通过紧固件固定连接，以将所述导热块和所述半导体制冷片夹置于所述热端基板的远侧表面与所述冷端基板的近侧表面之间。
  4. 根据权利要求3所述的传冷散热模块化组件，其中
    所述紧固件为紧固螺栓，所述紧固螺栓穿过所述热端基板与所述冷端基板相连接，在进行所述发泡后，所述紧固螺栓位于所述冷端基板的近侧表面和所述热端基板的远侧表面之间的部分被发泡形成的所述保温层包围住。
  5. 根据权利要求4所述的传冷散热模块化组件，其中
    所述紧固螺栓还设有隔热垫圈，配制成隔绝所述紧固螺栓与所述冷端基板或所述紧固螺栓与所述热端基板的接触部位。
  6. 根据权利要求2所述的传冷散热模块化组件，其中
    所述冷端热管穿插于所述冷端翅片中，并焊接于所述冷端翅片；
    所述热端热管穿插于所述热端翅片中，并焊接于所述热端翅片。
  7. 根据权利要求2所述的传冷散热模块化组件，其中
    所述传冷面与所述导热块的远侧表面中的至少一个面上、所述冷端与所述导热块的近侧表面中的至少一个面上、以及所述热端与所述传热面中的至少一个面上具有涂覆导热硅脂形成的导热硅脂层。
  8. 一种用于半导体冰箱的传冷散热模块化组件的组装方法，包括：
    步骤A，将冷端传冷装置、导热块、半导体制冷片及热端散热装置依次相互连接组装在一起；
    步骤B，通过发泡工艺对已组装在一起的所述冷端传冷装置、所述导热块、所述半导体制冷片和所述热端散热装置进行发泡从而形成在所述冷端传冷装置的传冷面与所述热端散热装置的传热面之间的保温层，所述保温层在周向上将所述半导体制冷片和所述导热块包围住，所述冷端传冷装置、所述导热块、所述半导体制冷片、所述热端散热装置及所述保温层形成所述传冷散热模块化组件。
  9. 根据权利要求8所述的组装方法，还包括：
    步骤C，在所述半导体冰箱的箱体上开设大于所述保温层的尺寸或与所述保温层的尺寸一致的孔洞，将所述传冷散热模块化组件放置到所述孔洞，使所述孔洞容纳所述保温层；
    步骤D，将所述孔洞与所述保温层的接触面的间隙填充密封。
  10. 根据权利要求9所述的组装方法，其中
    所述热端散热装置包括：
    热端基板，其远侧表面作为所述热端散热装置的传热面；
    至少一根热端热管，每根所述热端热管两端封闭且内部封闭有冷媒，每根所述热端热管镶嵌于所述热端基板中；
    热端翅片，配置成与所述热端热管热接触；以及
    热端风机，配置成固定在所述热端翅片上，对所述热端翅片进行散热；
    所述冷端传冷装置包括：
    冷端基板，其近侧表面为所述冷端传冷装置的传冷面；
    至少一根冷端热管，每根所述冷端热管两端封闭且内部封闭有冷媒，每根所述冷端热管镶嵌于所述冷端基板中；
    冷端翅片，配置成与所述冷端热管热接触；以及
    冷端风机，配置成固定在所述冷端翅片上，散布所述冷端翅片的冷量。
  11. 根据权利要求10所述的组装方法，其中
    所述步骤A包括：将紧固螺栓穿过所述热端基板与所述冷端基板相连接，以将所述导热块和所述半导体制冷片夹置于所述热端基板的远侧表面与所述冷端基板的近侧表面之间。
  12. 一种半导体冰箱，包括如权利要求1-7中任一项所述的传冷散热模块化组件。
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