WO2015032102A1 - Circuit board machining process - Google Patents
Circuit board machining process Download PDFInfo
- Publication number
- WO2015032102A1 WO2015032102A1 PCT/CN2013/083161 CN2013083161W WO2015032102A1 WO 2015032102 A1 WO2015032102 A1 WO 2015032102A1 CN 2013083161 W CN2013083161 W CN 2013083161W WO 2015032102 A1 WO2015032102 A1 WO 2015032102A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- circuit board
- copper foil
- circuit
- substrate
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
Definitions
- the invention relates to the technical field of circuit boards, and in particular to a circuit board processing technology.
- the pollution existing in the existing circuit board processing technology is well known, and the pollution problem is a common problem of the entire industry.
- Each circuit board manufacturer has to spend a lot of manpower and financial resources for pollution prevention and control, and optimize the process as much as possible to reduce pollution.
- these process optimizations are the solution to the problem of palliative.
- the processing of the circuit board is to use a substrate with a copper foil, and a circuit is formed on the substrate by an etching process, and then a series of processing steps such as cleaning and drying are finally obtained to obtain a finished board.
- the etching process uses a certain concentration of sulfuric acid to etch the copper foil layer to produce a large amount of copper-containing waste acid solution, and in the post-treatment process of the circuit board, for example, the cleaning process also produces waste alkali liquor.
- the waste acid solution is mainly a copper solution whose medium is hydrochloric acid (pH 1), and the waste alkali liquid is mainly a copper ammonia solution of ammonium chloride-ammonia water (pH 9-10), which is highly polluting to the environment. Due to the high price of copper, circuit board manufacturers usually recycle copper ions for such copper-containing waste liquids, so that even if the pollution is reduced, the recycling cost is very high.
- the present invention provides a circuit board processing process that avoids the use of an etching process.
- the technical solution of the present invention is: a circuit board processing process, the steps of which are:
- the copper foil is processed by laser, and the copper foil used for the circuit is separated from the unnecessary copper foil;
- the circuit board substrate with the copper foil line is fixed by heat pressing to form a circuit board with a line.
- the subsequent processing steps of the circuit board are further included.
- the copper-clad adhesive is an epoxy resin or a biphenyl-containing epoxy resin.
- the method for fixing the circuit board on the processing platform in the step (1) comprises fixing after flattening, flattening under vacuum conditions, or adhering with glue having a viscosity lower than that of the copper-clad adhesive.
- the circuit board processing technology of the invention changes the processing method of the traditional circuit board etching circuit, and adopts the physical processing method, that is, the laser directly processes the circuit on the copper foil, and the beneficial effect is obvious compared with the prior art:
- the process adopts laser processing method with high degree of automation, high precision control and easy operation.
- the step of laminating copper foil simplifies the process and saves costs.
- the viscosity of the glue is only lower than the viscosity of the copper-clad glue.
- Many types of glues are available, for example: Nippon Chemical Co., Ltd. NC-3000 In the series of epoxy resins, in order to facilitate the separation of the useful line copper foil and the non-line copper foil after processing in the post-process, it is preferable that the viscosity is less than one-half or more of the copper-clad glue.
- the copper foil is processed by a laser to separate the copper foil from the unnecessary copper foil;
- the conventional circuit board generally refers to a copper clad laminate, which is a plate-shaped material which is obtained by immersing a reinforcing material in a resin, coated with copper foil on one or both sides, and hot pressed, also called a copper clad laminate. It is the basic material for PCB circuit board, also called substrate; when used for multi-layer board production, it is also called core board (CORE).
- the circuit board substrate according to the present invention is a plate-shaped base material before the copper foil is uncovered, and includes a paper substrate, a fiberglass cloth substrate, a synthetic fiber cloth substrate, a non-woven substrate, a composite substrate, and a metal substrate, which are most commonly used nowadays. Also included are CEM-1, FR4 boards.
- circuit board substrate is press-contacted on the copper foil, and the copper foil circuit is attached to the substrate by lifting the circuit board substrate; finally, the circuit board is formed by hot-pressing the fixed circuit board substrate and the copper foil line.
- the copper foil is fixed to the working platform by means of gluing.
- the copper foil can be directly laid flat on the working platform, fixed by mechanical positioning, or fixed under vacuum conditions. It can be used on the platform.
- the whole processing environment is vacuum, which is conducive to laser processing accuracy under vacuum conditions.
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Laser Beam Processing (AREA)
Abstract
Description
本发明涉及线路板技术领域，具体涉及一种线路板加工工艺。 The invention relates to the technical field of circuit boards, and in particular to a circuit board processing technology.
现有线路板加工工艺中存在的污染是人所共知的，污染问题是整个行业的共性难题。各个线路板厂家都要花费大量的人力和财力用于污染的防治，并尽可能的优化工艺以减少污染。但这些工艺优化均是治标不治本的解决办法。我们知道，线路板的加工均是采用附有铜箔的基板，通过蚀刻工艺在基板上形成线路，再经过清洗烘干等一系列的处理工序最终获得成品板。蚀刻工艺是采用一定浓度的硫酸对铜箔层进行腐蚀，产生大量的含铜废酸液，另外线路板后处理过程中例如清洗工序也会产生废碱液。废酸液主要是介质为盐酸(pH1)的铜溶液，废碱液主要是介质为氯化铵-氨水(pH9～10)铜氨溶液,对环境污染较大。由于铜价格较高，对于这类含铜废液,线路板厂家通常都要将铜离子回收再利用，这样即使减少污染，但回收成本非常高。 The pollution existing in the existing circuit board processing technology is well known, and the pollution problem is a common problem of the entire industry. Each circuit board manufacturer has to spend a lot of manpower and financial resources for pollution prevention and control, and optimize the process as much as possible to reduce pollution. However, these process optimizations are the solution to the problem of palliative. We know that the processing of the circuit board is to use a substrate with a copper foil, and a circuit is formed on the substrate by an etching process, and then a series of processing steps such as cleaning and drying are finally obtained to obtain a finished board. The etching process uses a certain concentration of sulfuric acid to etch the copper foil layer to produce a large amount of copper-containing waste acid solution, and in the post-treatment process of the circuit board, for example, the cleaning process also produces waste alkali liquor. The waste acid solution is mainly a copper solution whose medium is hydrochloric acid (pH 1), and the waste alkali liquid is mainly a copper ammonia solution of ammonium chloride-ammonia water (pH 9-10), which is highly polluting to the environment. Due to the high price of copper, circuit board manufacturers usually recycle copper ions for such copper-containing waste liquids, so that even if the pollution is reduced, the recycling cost is very high.
为从根本上解决上述问题，本发明提供一种可避免采用蚀刻工艺的线路板加工工艺。 In order to fundamentally solve the above problems, the present invention provides a circuit board processing process that avoids the use of an etching process.
本发明的技术方案为：一种线路板加工工艺，其步骤为： The technical solution of the present invention is: a circuit board processing process, the steps of which are:
（1） 将铜箔对位固定于加工平台上； (1) Fixing the copper foil in position on the processing platform;
（2）按设计好的线路文件，采用激光对铜箔进行加工，把用于线路的铜箔与不需要的铜箔分开； (2) According to the designed circuit file, the copper foil is processed by laser, and the copper foil used for the circuit is separated from the unnecessary copper foil;
（3）按设计好的线路文件，将线路板基板对应有线路的位置涂抹覆铜胶； (3) Apply copper-clad glue to the position of the circuit board corresponding to the line according to the designed line file;
（4）将线路板基板对位压接在铜箔上，提起线路板基板则铜线路粘附于基板上； (4) pressing the circuit board substrate in position on the copper foil, and lifting the circuit board substrate to adhere the copper line to the substrate;
（5）将带有铜箔线路的线路板基板采用热压固定形成带线路的线路板。 (5) The circuit board substrate with the copper foil line is fixed by heat pressing to form a circuit board with a line.
具体的，所述步骤（5）后还包括线路板的后续处理工序。 Specifically, after the step (5), the subsequent processing steps of the circuit board are further included.
具体的，所述覆铜胶为环氧树脂胶或含联苯结构型环氧树脂。 Specifically, the copper-clad adhesive is an epoxy resin or a biphenyl-containing epoxy resin.
具体的，步骤(1)中将线路板固定在加工平台上的方法包括平置后固定、在真空条件下平置或采用粘度低于覆铜胶的胶粘附。 Specifically, the method for fixing the circuit board on the processing platform in the step (1) comprises fixing after flattening, flattening under vacuum conditions, or adhering with glue having a viscosity lower than that of the copper-clad adhesive.
本发明所述线路板加工工艺改变传统线路板蚀刻线路的加工方法，采用物理加工的方式，即采用激光直接在铜箔上加工出线路，与现有技术相比较，有益效果明显： The circuit board processing technology of the invention changes the processing method of the traditional circuit board etching circuit, and adopts the physical processing method, that is, the laser directly processes the circuit on the copper foil, and the beneficial effect is obvious compared with the prior art:
（1） 该工艺从根本上解决了蚀刻线路工艺的污染问题，可以说是线路 (1) The process fundamentally solves the pollution problem of the etching circuit process, which can be said to be the line
板行业的革命性改进； Revolutionary improvements in the board industry;
（2） 该工艺采用激光加工方式，自动化程度高，精确控制度极高，过程更易操作； (2) The process adopts laser processing method with high degree of automation, high precision control and easy operation.
（3） 省去了蚀刻液回收再处理的工序，大大节约企业成本； (3) The process of recycling and reprocessing the etching solution is omitted, which greatly saves the cost of the enterprise;
（4）采用铜箔直接进行线路加工后再与基板压合形成线路板，省去基 (4) Using copper foil to directly perform line processing and then pressing with the substrate to form a circuit board, eliminating the base
板覆铜箔的步骤，简化工艺，节约成本。 The step of laminating copper foil simplifies the process and saves costs.
下面结合具体实施例对本发明作进一步的详细说明。 The present invention will be further described in detail below in conjunction with specific embodiments.
实施例 Example
（1）在特定环境和特殊的加工平台上涂覆一定粘度的胶，将铜箔对位粘附于加工平台上。该胶的粘度只要低于覆铜胶粘度即可，可选胶类很多例如:日本化药公司NC-3000 系列环氧树脂， 为了在后工序中能够方便的将加工后的有用的线路铜箔和非线路铜箔分开，优选粘度低于覆铜胶二分之一以上的胶类。 (1) Apply a certain viscosity of glue to a specific environment and a special processing platform to adhere the copper foil to the processing platform. The viscosity of the glue is only lower than the viscosity of the copper-clad glue. Many types of glues are available, for example: Nippon Chemical Co., Ltd. NC-3000 In the series of epoxy resins, in order to facilitate the separation of the useful line copper foil and the non-line copper foil after processing in the post-process, it is preferable that the viscosity is less than one-half or more of the copper-clad glue.
（2）然后按设计好的线路文件，采用激光对铜箔进行加工，把线路铜箔与不需要的铜箔通过分开； (2) Then, according to the designed circuit file, the copper foil is processed by a laser to separate the copper foil from the unnecessary copper foil;
（3）按设计好的线路文件，在未覆铜箔的线路板基板上对应有线路的位置涂抹覆铜胶。现有的线路板基本一般是指覆铜板，其是将补强材料浸以树脂，一面或两面覆以铜箔，经热压而成的一种板状材料，也称为覆铜箔层压板，是做PCB线路板的基本材料，也叫基材；用于多层板生产时，也叫芯板（CORE）。本发明所述的线路板基板是未覆铜箔前的板状基材材料，包括纸基板、玻纤布基板、合成纤维布基板、无纺布基板、复合基板、金属基板，现在最常用的还包括CEM-1，FR4板。 (3) According to the designed circuit file, apply copper-clad glue on the circuit board substrate without copper foil corresponding to the line. The conventional circuit board generally refers to a copper clad laminate, which is a plate-shaped material which is obtained by immersing a reinforcing material in a resin, coated with copper foil on one or both sides, and hot pressed, also called a copper clad laminate. It is the basic material for PCB circuit board, also called substrate; when used for multi-layer board production, it is also called core board (CORE). The circuit board substrate according to the present invention is a plate-shaped base material before the copper foil is uncovered, and includes a paper substrate, a fiberglass cloth substrate, a synthetic fiber cloth substrate, a non-woven substrate, a composite substrate, and a metal substrate, which are most commonly used nowadays. Also included are CEM-1, FR4 boards.
（4）将上述线路板基板对位压接在铜箔上，提起线路板基板则铜箔线路附于基板上；最后采用热压固定线路板基板及铜箔线路形成线路板。这里，还需对留在工作平台上的非线路铜箔做处理，一般采用推刮等物理方法处理即可。该剩余铜箔可方便的回收再利用。 (4) The above-mentioned circuit board substrate is press-contacted on the copper foil, and the copper foil circuit is attached to the substrate by lifting the circuit board substrate; finally, the circuit board is formed by hot-pressing the fixed circuit board substrate and the copper foil line. Here, it is also necessary to treat the non-line copper foil left on the working platform, and generally adopt a physical method such as push-scraping. The remaining copper foil can be easily recycled and reused.
后续还需要对线路板进行表面清理、线路检测等等工序。这些工序本领域技术人员采用常规处理方式即可，再此不再赘述。 Subsequent processes such as surface cleaning, line inspection, etc. are required for the board. These processes may be performed by those skilled in the art using conventional processing methods, and will not be described again.
上述实施例中，采用胶粘的方式将铜箔固定到工作平台上，实际操作中，可以直接将铜箔铺平平置在工作平台上，结合机械定位方式固定；或者在真空条件下固定在工作平台上均可，此时整个加工环境为真空，真空条件下有利于激光加工精度。 In the above embodiment, the copper foil is fixed to the working platform by means of gluing. In actual operation, the copper foil can be directly laid flat on the working platform, fixed by mechanical positioning, or fixed under vacuum conditions. It can be used on the platform. At this time, the whole processing environment is vacuum, which is conducive to laser processing accuracy under vacuum conditions.
上述实施例仅为本发明的其中一种实现方式，其描述较为具体和详细，不能因此而理解为对本发明专利范围的限制。应当指出的是，对于本领域的普通技术人员来说，在不脱离本发明构思的前提下，还可以做出若干变形和改进，这些显而易见的替换形式均属于本发明的保护范围。 The above embodiments are only one of the implementations of the present invention, and the description thereof is more specific and detailed, and is not to be construed as limiting the scope of the invention. It should be noted that a number of variations and modifications may be made by those skilled in the art without departing from the spirit and scope of the invention.
Claims (4)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2013/083161 WO2015032102A1 (en) | 2013-09-09 | 2013-09-09 | Circuit board machining process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2013/083161 WO2015032102A1 (en) | 2013-09-09 | 2013-09-09 | Circuit board machining process |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2015032102A1 true WO2015032102A1 (en) | 2015-03-12 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/CN2013/083161 Ceased WO2015032102A1 (en) | 2013-09-09 | 2013-09-09 | Circuit board machining process |
Country Status (1)
| Country | Link |
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| WO (1) | WO2015032102A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118413943A (en) * | 2024-05-28 | 2024-07-30 | 深圳市基石新材料技术有限公司 | Preparation method of thick copper circuit board |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002033566A (en) * | 2000-07-18 | 2002-01-31 | Oki Electric Ind Co Ltd | Method for forming wiring pattern of printed wiring board |
| US7014727B2 (en) * | 2003-07-07 | 2006-03-21 | Potomac Photonics, Inc. | Method of forming high resolution electronic circuits on a substrate |
| CN101472404A (en) * | 2007-12-25 | 2009-07-01 | 富葵精密组件(深圳)有限公司 | Multi-layer circuit board and manufacturing method thereof |
| CN101951734A (en) * | 2010-09-30 | 2011-01-19 | 深圳市大族激光科技股份有限公司 | Method for processing micro through hole of flexible circuit board |
| CN201854501U (en) * | 2010-11-23 | 2011-06-01 | 罗海宁 | Circuit board |
-
2013
- 2013-09-09 WO PCT/CN2013/083161 patent/WO2015032102A1/en not_active Ceased
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002033566A (en) * | 2000-07-18 | 2002-01-31 | Oki Electric Ind Co Ltd | Method for forming wiring pattern of printed wiring board |
| US7014727B2 (en) * | 2003-07-07 | 2006-03-21 | Potomac Photonics, Inc. | Method of forming high resolution electronic circuits on a substrate |
| CN101472404A (en) * | 2007-12-25 | 2009-07-01 | 富葵精密组件(深圳)有限公司 | Multi-layer circuit board and manufacturing method thereof |
| CN101951734A (en) * | 2010-09-30 | 2011-01-19 | 深圳市大族激光科技股份有限公司 | Method for processing micro through hole of flexible circuit board |
| CN201854501U (en) * | 2010-11-23 | 2011-06-01 | 罗海宁 | Circuit board |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118413943A (en) * | 2024-05-28 | 2024-07-30 | 深圳市基石新材料技术有限公司 | Preparation method of thick copper circuit board |
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