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WO2015024775A1 - Procédé pour déposer un métal sur un substrat, en particulier pour la métallisation de cellules et modules solaires - Google Patents

Procédé pour déposer un métal sur un substrat, en particulier pour la métallisation de cellules et modules solaires Download PDF

Info

Publication number
WO2015024775A1
WO2015024775A1 PCT/EP2014/066847 EP2014066847W WO2015024775A1 WO 2015024775 A1 WO2015024775 A1 WO 2015024775A1 EP 2014066847 W EP2014066847 W EP 2014066847W WO 2015024775 A1 WO2015024775 A1 WO 2015024775A1
Authority
WO
WIPO (PCT)
Prior art keywords
metal
substrate
laser
sensitizer
based molecules
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2014/066847
Other languages
English (en)
Inventor
Michel Ngamo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TotalEnergies Marketing Services SA
Original Assignee
Total Marketing Services SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Total Marketing Services SA filed Critical Total Marketing Services SA
Publication of WO2015024775A1 publication Critical patent/WO2015024775A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
    • C23C18/06—Coating on selected surface areas, e.g. using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals

Definitions

  • Another known method comprises Cu plating.
  • a seed layer is deposited by a vapour deposition (PVD) or a sputtering process (TiCu). Then a plating resist layer is deposed and patterned. After then, a seed layer is etched and the plating resist layer is removed before the final Cu plating.
  • PVD vapour deposition
  • TiCu sputtering process
  • the polyester substrate is submitted to UV radiation that may be emitted by a laser.
  • the particles in the base layer of this document are ready to be plated or to accept a metal deposition and the laser action is only to reveal these particles to make them accessible for plating afterwards. In fact, the plating takes place on the base layer with its revealed particles, but not on the substrate itself.
  • the base layer has therefore the function to fix the particles to be plated on the substrate.
  • US 4 042 730 describes a classical process for electro-less plating that uses separate sensitization and activation process. However, this process is not selective enough and needs various mechanical manipulations that should be avoided because of the low thickness of the substrates in particular when used with solar modules and/or solar cells.
  • the substrate may be made of any non-conducting material, like an insulator, an encapsulant, a plastic, a glass, a dielectric layer, an oxide layer of a solar cell or a silicon based material.

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Photovoltaic Devices (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrodes Of Semiconductors (AREA)

Abstract

L'invention concerne un procédé pour déposer un métal sur un substrat (1), comprenant les étapes suivantes : - dépôt d'un sensibilisateur (9), comprenant des molécules à base d'un métal activable par laser, à l'état neutre sur le substrat (1), - activation desdites molécules à base d'un métal activable par laser du sensibilisateur (9) par activation laser (103) de façon à créer des ions métalliques à partir desdites molécules à base d'un métal activable par laser, qui catalysent des zones (11) sur le substrat, - dépôt chimique du métal sur lesdites zones catalysées (11) du substrat (1).
PCT/EP2014/066847 2013-08-19 2014-08-05 Procédé pour déposer un métal sur un substrat, en particulier pour la métallisation de cellules et modules solaires Ceased WO2015024775A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP13290195.0A EP2840165A1 (fr) 2013-08-19 2013-08-19 Procédé pour le dépôt de métal sur un substrat, en particulier de métallisation de cellules et modules solaires
EP13290195.0 2013-08-19

Publications (1)

Publication Number Publication Date
WO2015024775A1 true WO2015024775A1 (fr) 2015-02-26

Family

ID=49326613

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2014/066847 Ceased WO2015024775A1 (fr) 2013-08-19 2014-08-05 Procédé pour déposer un métal sur un substrat, en particulier pour la métallisation de cellules et modules solaires

Country Status (2)

Country Link
EP (1) EP2840165A1 (fr)
WO (1) WO2015024775A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102019220458A1 (de) * 2019-12-20 2021-06-24 Vitesco Technologies Germany Gmbh Verfahren zur Herstellung einer Leiterplatte und Leiterplatte
CN114786342A (zh) * 2022-04-27 2022-07-22 四川大学 一种基于激光技术的柔性可弯折金属图案及其制备方法和用途

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1367872A2 (fr) * 2002-05-31 2003-12-03 Shipley Co. L.L.C. Matériau diélectrique activé par laser et méthode de son utilisation dans un procédé de dépôt sans courant
WO2008087172A1 (fr) * 2007-01-19 2008-07-24 Basf Se Procédé de fabrication de surfaces structurées électro-conductrices
WO2011072506A1 (fr) * 2009-12-17 2011-06-23 Byd Company Limited Procédé de métallisation de surface, procédé de préparation d'un article en plastique et article en plastique réalisé à partir de ce dernier

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1367872A2 (fr) * 2002-05-31 2003-12-03 Shipley Co. L.L.C. Matériau diélectrique activé par laser et méthode de son utilisation dans un procédé de dépôt sans courant
WO2008087172A1 (fr) * 2007-01-19 2008-07-24 Basf Se Procédé de fabrication de surfaces structurées électro-conductrices
WO2011072506A1 (fr) * 2009-12-17 2011-06-23 Byd Company Limited Procédé de métallisation de surface, procédé de préparation d'un article en plastique et article en plastique réalisé à partir de ce dernier

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102019220458A1 (de) * 2019-12-20 2021-06-24 Vitesco Technologies Germany Gmbh Verfahren zur Herstellung einer Leiterplatte und Leiterplatte
CN114786342A (zh) * 2022-04-27 2022-07-22 四川大学 一种基于激光技术的柔性可弯折金属图案及其制备方法和用途
CN114786342B (zh) * 2022-04-27 2024-02-27 四川大学 一种基于激光技术的柔性可弯折金属图案及其制备方法和用途

Also Published As

Publication number Publication date
EP2840165A1 (fr) 2015-02-25

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