WO2015008860A1 - Package for electrical element - Google Patents

Abstract

This package is provided with an electrical element (103), a substrate (121) for mounting the electrical element (103), and a container (100) for housing the electrical element (103). The container (100) is constituted by a cover part (101) and a container body (102). The container (100) hermetically seals the electrical element (103) and the space above the electrical element (103). This package is also provided with a heater (105) incorporated within the substrate (121), and flexible printed wiring (107) for electrically connecting the electrical element (103) and the outside of the container (100).

Description

Electrical element package

The present invention relates to a package of an electric element that contains the electric element and is hermetically sealed.

Electrical elements such as laser diodes, MEMS (Micro Electro Mechanical Systems) sensor elements, and liquid crystal elements are hermetically sealed in a predetermined container in order to prevent changes in characteristics due to changes in environmental conditions such as humidity. For example, the wavelength selective switch MEMS mirror array module disclosed in Non-Patent Document 1 is affected by a capacitance change due to humidity when it is exposed to the environment due to electric drive. In addition, in a fine structure manufactured using a MEMS manufacturing technique, there is a possibility that interference and sticking of a mechanical movable part may be caused by foreign matter that has entered from the outside. In order to avoid these problems, the module as described above is hermetically sealed in the container.

Such a conventional package will be described with reference to FIG. FIG. 7 is a configuration diagram showing a configuration of a generally used package. FIG. 7 schematically shows a cross section. This package includes a container 700 composed of a lid 701 and a container body 702. The lid 701 and the container main body 702 are joined by seam welding, solder joining, or the like to form a shielded space 703 in which substances from the outside are blocked. For example, in the lid 701, a glass optical window 713 is bonded to a window frame portion 712 made of Kovar. The container main body 702 includes a ceramic substrate 705, a ceramic frame 710, and a Kovar frame 711. The shielding space 703 is obtained by joining the lower surface peripheral part of the window frame 712 and the upper surface of the frame part 711.

An electric element 704 such as a laser diode, a MEMS sensor element, or a liquid crystal element is disposed in the shielding space 703 of the container 700 configured as described above. An electric element 704 is fixed on the ceramic substrate 705 by an adhesive layer 709 such as solder. Electrical elements such as laser diodes, MEMS sensor elements, and liquid crystal elements may require temperature adjustment. Therefore, a temperature adjustment unit 721 including a heater 722 is provided outside the side portion of the container main body 702. In addition, the container 700 includes an optical window 713 capable of inputting / outputting light to / from the outside, and can perform optical input / output with the electrical element 704 disposed in the container 700. The shielded space 703 provides an operation area of the movable part that constitutes the MEMS. Further, the container 700 hermetically seals the electric element 704 to avoid the influence of humidity change and oxidation, and improve long-term reliability.

A plurality of metal pins 706 having a diameter of about 0.5 mm are provided on the back side of the ceramic substrate 705. Such a plurality of metal pins 706 is called a pin grid array (PGA). The electric element 704 is connected to an electric wiring (not shown) in the container main body 702 via a bonding wire 707, and is connected to a metal pin 706 via this electric wiring. The package is fixed by inserting metal pins 706 into the socket substrate 708.

Mitsuo Usui et al., “MEMS Mirror Array Module for Wavelength Selective Switch (WSS)” for Wavelength Selective Switch (WSS), IEICE Technical Report, IE2009 Technical Report, 他 R2009-7, CPM2009 -7, OPE2009-7, pp.35-39, 2009.

In the PGA package as described above, the frame portion 710 and the like are generally formed relatively thick. In addition, the heater 722 for temperature adjustment is disposed on the outer side of the side of the container body 702 away from the electric element 704. In addition, a metal pin 706 is provided between the heater 722 and the electric element 704. For this reason, the heat generated from the heater 722 escapes to the socket substrate 708 via the metal pins 706. Therefore, most of the heat generated from the heater 722 is consumed for heating the metal pins 706 and the socket substrate 708, and therefore, more electric power is required to adjust the temperature of the target electric element 704. was there. Further, in the above structure, for example, in order to obtain a large amount of heat generation, the volume of the heater 722 itself is increased, and there is a problem that the entire structure becomes thick and large.

The present invention has been made to solve the above-described problems, and aims to further reduce the size and thickness of an electrical element package that requires temperature adjustment, and to further reduce power consumption. And

An electrical element package according to the present invention includes an electrical element and a substrate on which the electrical element is mounted, a container that accommodates the electrical element and hermetically seals together with a space above the electrical element, and a temperature control unit provided on the substrate. And a connecting means for making an electrical connection between the electric element and the outside of the container.

As described above, according to the present invention, since the substrate on which the electric element is mounted is provided with the temperature adjusting means, the package of the electric element requiring temperature adjustment is further reduced in size and thickness, and the consumption is reduced. An excellent effect that electric power can be further reduced is obtained.

FIG. 1A is a cross-sectional view showing a configuration of an electrical element package according to Embodiment 1 of the present invention. FIG. 1B is a cross-sectional view showing the configuration of the electrical element package according to Embodiment 1 of the present invention. FIG. 1C is a plan view showing the configuration of the electrical element package according to Embodiment 1 of the present invention. FIG. 2A is a plan view illustrating a configuration example of a heater. FIG. 2B is a plan view illustrating a configuration example of the heater. FIG. 2C is a plan view illustrating a configuration example of the heater. FIG. 2D is a plan view illustrating a configuration example of the heater. FIG. 3 is a cross-sectional view showing a configuration of an electrical element package according to Embodiment 2 of the present invention. FIG. 4A is a cross-sectional view showing a configuration of an electrical element package according to Embodiment 3 of the present invention. FIG. 4B is a cross-sectional view showing the configuration of the electrical element package according to Embodiment 3 of the present invention. FIG. 4C is a plan view showing a configuration of an electrical element package according to Embodiment 3 of the present invention. FIG. 5A is a cross-sectional view showing a configuration of a package of another electric element according to Embodiment 3 of the present invention. FIG. 5B is a cross-sectional view showing a configuration of a package of another electric element according to Embodiment 3 of the present invention. FIG. 6 is a cross-sectional view showing the configuration of the electrical element package according to Embodiment 4 of the present invention. FIG. 7 is a cross-sectional view showing a configuration of an electrical element package.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.

[Embodiment 1]
First, Embodiment 1 of the present invention will be described with reference to FIGS. 1A to 1C. 1A shows a cross section taken along line aa in FIG. 1C, and FIG. 1B shows a cross section taken along line bb in FIG. 1C.

The electrical element package in Embodiment 1 includes an electrical element 103, a substrate 121 on which the electrical element 103 is mounted, and a container 100 that houses the electrical element 103. The container 100 includes a lid portion 101 and a container main body 102. The container 100 hermetically seals the electric element 103 together with the space above the electric element 103. In the first embodiment, the substrate 121 is made of ceramic which is an insulator.

Further, this package includes a heater 105 built in the substrate 121 and a flexible printed wiring 107 that makes electrical connection between the electric element 103 and the outside of the container 100. In the first embodiment, a part of the substrate 121 constitutes the bottom of the container main body 102. Moreover, the heater 105 should just be provided in the area | region where the electric element 103 is arrange | positioned among the board | substrates 121. FIG.

Here, the lid portion 101 includes a window frame portion 111 made of Kovar and an optical window 104 made of sapphire. In FIG. 1C, the opening area of the optical window 104 is indicated by a dotted line. The container body 102 includes a substrate 121, a frame portion 122 made of ceramic, and a Kovar frame portion 123. For example, the substrate 121 and the frame portion 122 are integrally molded. Inside the frame portion 122, the electric element 103 is fixed on the substrate 121 in a region where the heater 105 is incorporated, by an adhesive layer 124 made of solder, resin, or the like. The adhesive layer 124 can be made more thermally conductive if it is made of a metal such as solder.

In the container main body 102, an internal wiring structure 106 made of a conductive material is formed. A terminal connected to one end of the internal wiring structure 106 is disposed inside the container main body 102. The terminal of the electric element 103 is connected to this terminal via a bonding wire 108. In addition, a terminal connected to the other end of the internal wiring structure 106 is disposed outside the container body 102. A flexible printed wiring 107 is connected to this terminal. The flexible printed wiring 107 can electrically connect the electric element 103 and the outside of the container 100. Some internal wiring structures 106 are also connected to the heater 105 inside the substrate 121.

The substrate 121 and the container body 102 are formed by laminating an unfired green sheet and a wiring structure and firing them.

The green sheet is manufactured as follows. For example, first, a slurry in which the above powder is dispersed in a dispersion medium made of an organic solvent such as 2-propanol is prepared by adding a polyvinyl binder and a surfactant to a metal oxide powder such as alumina. To do. Next, the produced slurry is formed by, for example, a well-known doctor blade method to form a slurry layer, and the slurry layer is dried to remove the dispersion medium to obtain a green sheet.

On the above-described green sheet, a wiring pattern and a portion to be the heater 105 are formed by screen printing using a paste material containing a metal material, and a new green sheet is laminated thereon to form the shape of the container body 102 And By firing these, a substrate 121 and a container body 102 which are made of alumina ceramic and have a heater 105 and an internal wiring structure 106 therein can be produced.

Next, the heater 105 will be described. As described above, by forming the internal wiring structure 106 in the substrate 121 constituting the bottom of the container body 102, the internal wiring structure 106 can be arranged in a wide area in the region where the electric element 103 is fixed. Can do. In this region, the resistance value of the wiring in the region can be increased by designing the shape of the wiring, such as reducing the wiring width of the wiring constituting the internal wiring structure 106 and increasing the wiring length. Moreover, the wiring in the said area | region can also be comprised from a metal material with high electrical resistance. The wiring formed in this manner becomes a resistance heating element that generates resistance by flowing current, and can become the heater 105. The heater 105 adjusts the temperature of the electric element 103 disposed inside the container 100. For example, the temperature adjustment is performed by controlling the output of the heater 105 as the temperature adjusting means so that the temperature value measured by the temperature measuring means (not shown) approaches a predetermined temperature setting value.

As described above, by incorporating the heater 105 in the substrate 121 constituting the container body 102, the package can be thinned. Further, by increasing the area where the region where the heater 105 is formed and the region where the electric element 103 is arranged is increased, or by reducing the distance between the heater 105 and the electric element 103, the heat conduction is consequently increased. Can be improved. As a result, the temperature of the electric element 103 mounted on the substrate 121 can be adjusted with a small amount of heat generation (power consumption). Since the amount of generated heat can be reduced, the volume of the heater 105 itself can be reduced, and the package can be downsized. As described above, it is possible to reduce the thickness of the package and reduce the power consumption of the temperature adjustment mechanism.

Next, the internal wiring structure 106 will be described. The internal wiring structure 106 electrically connects the inside and outside of the shielding space in the container 100. Furthermore, the internal wiring structure 106 is electrically connected to the flexible printed wiring 107 outside the shielding space. When the electrical element 103 is inside the shielded space, the electrical element 103 is connected to the outside by connecting the terminal of the electrical element 103 and the terminal disposed inside the shielded space of the internal wiring structure 106 with a bonding wire 108 or the like. Can be electrically connected.

The electrical element 103 is, for example, a MEMS sensor element. In this case, external light is input to the MEMS sensor element through the optical window 104 through which light passes, or light is output from the MEMS sensor element to the outside. In this case, it is necessary to make the optical axis of the electric element 103 coincide with an external target. When the container 100 is mechanically fixed to the external structure, when the temperature is adjusted by the heater 105, stress is applied to the container body 102 or the electric element 103 due to the difference between the coefficient of thermal expansion of the container 100 and the coefficient of thermal expansion of the external structure. Causes a problem that the position shifts with respect to a predetermined optical axis. For example, in PGA, since the package is mechanically fixed by inserting metal pins into a socket substrate that is an external structure, the above-described problem occurs.

In contrast, by electrically connecting to the outside using the flexible printed wiring 107 and avoiding mechanical fixation with the external structure, stress from the external structure acts on thermal deformation during temperature adjustment. Can not be. As a result, the above-described positional deviation can be suppressed.

As a method of electrically connecting to the outside, instead of the flexible printed wiring 107, as a connecting means, either or both of a coil and an antenna are provided on the container body and the outside of the container, and the connecting means in the vicinity of the space is separated. It is good also as a structure which exchanges an electric signal and electric power wirelessly. Further, as the connecting means, an optical connecting means including a light receiving element and a light emitting element is provided on the container body and the outside of the container so that the electrical connection between the electric element and the outside of the container is performed wirelessly through optical communication. It may be. For example, a light receiving element may be provided inside the container, and light from a light emitting element disposed outside the container may be received by the light receiving element and converted into electric power or an electric signal.

In the conventional pin grid array, a plurality of metal pins having a diameter of about 0.5 mm are provided on the bottom surface of the package. Further, in the quad flat package (QFP), a plurality of metal leads having a width of about 0.5 mm are provided on each side of the bottom of the package. In these conventional package structures, the package becomes thick and it is difficult to reduce the thickness. Further, in the conventional package, since there are a plurality of metal bodies in the vicinity of the heater, heat conduction to the outside of the package increases, and heat for heating the built-in electric element leaks.

On the other hand, according to the first embodiment, the flexible printed wiring 107 extending in the horizontal direction together with the substrate 121 is used as the connecting means instead of the pins and leads, so that the package can be thinned. is there. Further, since the flexible printed wiring 107 is separated from the heater in the horizontal direction along the substrate 121, heat from the heater is difficult to escape. Furthermore, the flexible printed wiring itself has a low thermal conductivity because it is composed of, for example, a wiring having a cross section of about 200 μm in width and a thickness of about 20 μm and a length of several centimeters. Accordingly, the amount of heat generated by the heater can be reduced. Since the amount of generated heat can be reduced, the volume of the heater itself can be reduced and the size can be reduced. According to the first embodiment, it is possible to reduce the thickness of the package of the electric element and reduce the power consumption of the temperature adjustment mechanism.

Here, a heater constituted by wiring built in the substrate will be described with reference to the planes of FIGS. 2A to 2D. 2A to 2D are plan views showing wiring patterns serving as heaters. For example, as shown in FIG. 2A, the heater wiring pattern is formed in a coil shape, and the wiring interval is denser toward the periphery and the wiring interval is coarser toward the center. In the heater region where the heater is formed, a temperature distribution in which the temperature becomes lower in the peripheral portion is likely to occur due to conduction to the outside. On the other hand, with the above-described configuration, the amount of heat conducted to the outside can be compensated. Thereby, a uniform temperature distribution in the heater region can be realized.

Further, as shown in FIG. 2B, adjacent wirings may be arranged in parallel to each other, and current directions of adjacent wirings may be opposite to each other. Generally, in a resistance heating type heater, when a large current flows, a magnetic field is generated according to Ampere's law, and the influence on an electric element and light cannot be controlled. On the other hand, with the above-described configuration, the adjacent magnetic lines cancel out the generated magnetic fields, so that the influence of the magnetic field due to the heater current can be reduced.

Further, as shown in FIG. 2C, adjacent wirings may be arranged in parallel to each other, the intervals between the respective wirings may be equal, and the current directions of the adjacent wirings may be the same. In FIG. 2C, it is coiled. By adopting such a configuration, it is possible to generate a magnetic field whose intensity decreases in the direction from the center to the periphery in a direction (normal direction) perpendicular to the plane of the heater region at the center of the heater region. . By making the heater current an alternating current (Alternate Current), it is possible to control electric elements and light with an alternating magnetic field generated by the alternating current while generating constant heat if averaged over time it can.

In addition, the wiring pattern used as a heater can be variously combined by the above-described three configurations. For example, as shown in FIG. 2D, a coil shape may be used, adjacent wirings may be parallel to each other, intervals between the respective wirings may be equal, and current directions of adjacent wirings may be reversed.

[Embodiment 2]
Next, Embodiment 2 of the present invention will be described with reference to FIG. FIG. 3 is a cross-sectional view showing a configuration of an electrical element package according to Embodiment 2 of the present invention.

The electrical element package in Embodiment 2 includes the electrical element 103, a chip carrier 323 on which the electrical element 103 is mounted, and a container 100 that houses the electrical element 103. The container 100 includes a lid portion 101 and a container main body 102. The container 100 hermetically seals the electric element 103 together with the space above the electric element 103. In the second embodiment, the chip carrier 323 is made of ceramic which is an insulator. The electric element 103 is fixed on the chip carrier 323 by an adhesive layer 324 made of solder, resin, or the like. Note that the adhesive layer 324 can be made more thermally conductive if it is made of a metal such as solder.

The package also includes a heater 305 built in the chip carrier 323 and a flexible printed wiring 107 that electrically connects the electric element 103 and the outside of the container 100. In the second embodiment, a part of the container support substrate 321 constitutes the bottom of the container main body 102. The chip carrier 323 is accommodated in the container 100 together with the electric element 103.

Here, the lid portion 101 includes a window frame portion 111 made of Kovar and an optical window 104 made of sapphire. The container body 102 includes a container support substrate 321 made of ceramic, a frame portion 122 made of ceramic, and a frame portion 123 made of Kovar. For example, the container support substrate 321 and the frame part 122 are integrally molded. Inside the frame portion 122, the chip carrier 323 is fixed on the container support substrate 321 by an adhesive layer 322 made of solder, resin, or the like.

Note that the adhesive layer 322 is preferably made of a resin or the like and has a lower thermal conductivity than the adhesive layer 324. By doing so, it is possible to suppress the heat generated from the heater 305 from escaping to the container support substrate 321 side. As a result, the temperature of the electric element 103 can be adjusted with a smaller amount of heat generation than in the first embodiment.

As a material for the adhesive layer 322, it is required that there is little degassing in order to use it in a hermetically sealed container and that the electric element is not displaced with respect to a predetermined optical axis. In order to satisfy the latter requirement, the difference in thermal expansion coefficient from the ceramic constituting the chip carrier and container is small, the curing shrinkage of the adhesive is small, and the glass transition temperature is small in order to reduce misalignment during high temperature storage and operation. Higher is suitable. Epotek's 353ND and NTT Advanced Technology's AT4291A are materials for the adhesive layer 322 as an adhesive that takes into account differences in thermal expansion, cure shrinkage, and glass transition temperature. As mentioned.

In the container main body 102, an internal wiring structure 106 made of a conductive material is formed. A terminal connected to one end of the internal wiring structure 106 is disposed inside the container main body 102. The terminal of the electric element 103 is connected to this terminal via a bonding wire 108. In addition, a terminal connected to the other end of the internal wiring structure 106 is disposed outside the container body 102. A flexible printed wiring 107 is connected to this terminal. The flexible printed wiring 107 can electrically connect the electric element 103 and the outside of the container 100.

The container body 102 including the container support substrate 321 is formed by laminating unfired green sheets and wiring structures in the same manner as the substrate 121 (see FIGS. 1A, 1B, and 1C) in Embodiment 1 described above, and firing these. It is formed by doing. A wiring pattern is formed on the green sheet by screen printing using a paste material containing a metal material, and a new green sheet is laminated thereon to obtain the shape of the container body 102. By firing these, the container body 102 made of alumina ceramic and having the internal wiring structure 106 therein can be produced.

Next, the heater 305 will be described. In the second embodiment, an internal wiring structure is formed in the chip carrier 323, and in the region where the electric element 103 is fixed, the wiring width of the wiring constituting the built-in internal wiring structure is reduced and the wiring length is increased. For example, the resistance value of the wiring can be increased by designing the shape of the wiring. Moreover, the wiring in the said area | region can also be comprised from a metal material with high electrical resistance. The wiring formed in this manner becomes a resistance heating element that generates resistance by flowing current, and can become the heater 305. The heater 305 adjusts the temperature of the electric element 103 disposed inside the container 100 and fixed on the chip carrier 323.

As described above, by incorporating the heater 305 in the chip carrier 323, the package can be thinned. Further, by increasing the area where the region where the heater 305 is formed and the region where the electric element 103 is arranged is increased, or by reducing the separation distance between the heater 305 and the electric element 103, heat conduction is consequently achieved. Can be improved. As a result, the temperature of the target electric element 103 can be adjusted with a small amount of heat generation (power consumption). Since the amount of generated heat can be reduced, the volume of the heater 305 itself can be reduced, and the package can be downsized. As described above, it is possible to reduce the thickness of the package and reduce the power consumption of the temperature adjustment mechanism. Other configurations are the same as those of the first embodiment described above.

[Embodiment 3]
Next, Embodiment 3 of the present invention will be described with reference to FIGS. 4A to 4C. 4A shows a cross section taken along line aa in FIG. 4C, and FIG. 4B shows a cross section taken along line bb in FIG. 4C.

The electrical element package in Embodiment 3 includes an electrical element 103, a substrate 121 on which the electrical element 103 is mounted, and a container 100 that houses the electrical element 103. The container 100 includes a lid portion 101 and a container main body 102. The container 100 hermetically seals the electric element 103 together with the space above the electric element 103. In the third embodiment, the substrate 121 is made of ceramic which is an insulator.

Further, this package includes a heater 105 built in the substrate 121 and a flexible printed wiring 107 that makes electrical connection between the electric element 103 and the outside of the container 100. In the third embodiment, a part of the substrate 121 constitutes the bottom of the container main body 102.

Also, the lid 101 includes a window frame portion 111 made of Kovar and an optical window 104 made of sapphire. The container body 102 includes a substrate 121, a frame portion 122 made of ceramic, and a Kovar frame portion 123. For example, the substrate 121 and the frame portion 122 are integrally molded. Inside the frame portion 122, the electric element 103 is fixed on the substrate 121 in a region where the heater 105 is incorporated, by an adhesive layer 124 made of solder, resin, or the like.

In the container main body 102, an internal wiring structure 106 made of a conductive material is formed. A terminal connected to one end of the internal wiring structure 106 is disposed inside the container main body 102. The terminal of the electric element 103 is connected to this terminal via a bonding wire 108. In addition, a terminal connected to the other end of the internal wiring structure 106 is disposed outside the container body 102. A flexible printed wiring 107 is connected to this terminal. The flexible printed wiring 107 can electrically connect the electric element 103 and the outside of the container 100. Some internal wiring structures 106 are also connected to the heater 105 inside the substrate 121.

The configuration described above is the same as that of the first embodiment described above. In the third embodiment, the substrate 121 and the container 100 are fixed to a fixed component 401 having an opening. The four corners of the substrate 121 arranged in the opening of the fixed component 401 are fixed to the fixing portion 402 of the fixed component 401 by the adhesive layer 403. Further, the flexible printed wiring 107 is connected to a terminal connection portion 404 formed on the fixed component 401.

For example, the adhesive layer 403 is an adhesive composed of a resin. The adhesive layer 403 should just be comprised from the material whose heat conductivity is low compared with metals, such as solder. The region fixed by the adhesive layer 403 is preferably as small as possible, and the adhesive layer 403 is preferably thick. By doing in this way, the thermal conductivity between the board | substrate 121 and the fixing component 401 can be made lower. Further, the portion where the terminal connecting portion 404 is fixed may be formed integrally with the fixing component 401 or may be a separate body.

It is possible to suppress the heat from the heater 105 from leaking to the fixed part 401 by fixing the fixed part 401 in this way. As a result, since the heat generation amount of the heater 105 can be reduced, the volume of the heater 105 itself can be reduced and the size can be reduced, and the package can be thinned and the power consumption of the temperature adjustment mechanism can be reduced. Moreover, as shown to FIG. 4C, the stress in the fixing | fixed part 402 can be relieve | moderated with respect to the thermal deformation of the container main body 102 by setting it as the shape which protruded the fixing | fixed part 402. As shown in FIG.

Further, as shown in FIGS. 5A and 5B, the fixed component 401 may be disposed on the same side as the electric element 103 with respect to the substrate 121 constituting the container body 102. By arranging in this way, the overall thickness does not change even if the fixing component 401 is provided, and the overall thickness can be further reduced.

[Embodiment 4]
The fourth embodiment is an example in which a Peltier element is used as the temperature adjusting means. As shown in FIG. 6, the electric element 603 may be accommodated in a container 600 including a container main body 601 and a lid 602 together with a chip carrier 604 composed of a Peltier element. In this case, the temperature adjusting means is a chip carrier 604 composed of a Peltier element. In this package, the container main body 601 includes a container support substrate 611 and a frame portion 612. The lid portion 602 includes a frame portion 621 and an optical window 622.

Further, a metal part 605 penetrating the container support substrate 611 is provided, and the chip carrier 604 is disposed thereon. The metal part 605 may be made of CuW having the same thermal expansion coefficient as that of the container support substrate 611 made of ceramic and having high thermal conductivity. The chip carrier 604 may be fixed on the metal portion 605 with an adhesive layer 607 made of AuSn, and the electric element 603 may be fixed on the chip carrier 604 with an adhesive layer 608 made of AuSn. A heat sink 606 is provided on the back side of the metal part 605 (outside the container 600). As described above, by using the chip carrier 604 formed of Peltier elements, the temperature of the electric element 603 such as a laser diode element can be adjusted more precisely.

As described above, the electrical element package according to the present invention includes an electrical element, a substrate on which the electrical element is mounted, a container that houses the electrical element and is hermetically sealed together with a space above the electrical element, and the substrate. Temperature control means provided and connection means for making electrical connection between the electric element and the outside of the container are provided. As a result, according to the present invention, the package of the electric element that requires temperature adjustment can be made smaller and thinner, and the power consumption can be further reduced.

In the electrical element package, the substrate may constitute a part of the container. Further, the temperature adjusting means may be built in the substrate. The electric element may be housed in a container together with the substrate, and the temperature adjusting means may be built in the substrate. In these configurations, the substrate may be made of ceramic, and the temperature adjusting means may be made of a resistance heating element.

On the other hand, in the package described above, the temperature adjusting means may be a substrate composed of Peltier elements, and the electric element may be housed in a container together with the substrate composed of Peltier elements.

Further, in any of the above-described electrical element packages, the connecting means may be constituted by flexible printed wiring. Further, in any of the electrical element packages described above, the connection means may include at least one of a coil and an antenna, and may electrically connect the electrical element and the outside of the container wirelessly. . In any of the packages described above, the connection means includes optical connection means including a light receiving element and a light emitting element, and the electrical connection between the electrical element and the outside of the container is performed wirelessly via optical communication. May be.

The present invention is not limited to the embodiment described above, and many modifications and combinations can be implemented by those having ordinary knowledge in the art within the technical idea of the present invention. It is obvious. For example, the sealing structure may be resin sealing.

DESCRIPTION OF SYMBOLS 100 ... Container, 101 ... Cover part, 102 ... Container main body, 103 ... Electrical element, 104 ... Optical window, 105 ... Heater (temperature adjustment means), 106 ... Internal wiring structure, 107 ... Flexible printed wiring (connection means), 108 DESCRIPTION OF SYMBOLS Bonding wire 111 ... Window frame part 121 ... Substrate 122 ... Frame part 123 ... Frame part 124 ... Adhesive layer

Claims (8)

An electrical element and a substrate on which the electrical element is mounted;
A container that houses the electrical element and hermetically seals together with a space above the electrical element;
Temperature adjusting means provided on the substrate;
An electrical element package comprising: the electrical element and connection means for making electrical connection between the outside of the container. The electrical device package according to claim 1,
The substrate is composed of a part of the container,
The temperature adjusting means is a package of an electric element built in the substrate. The electrical device package according to claim 1,
The electrical element is accommodated in the container together with the substrate,
The temperature adjusting means is a package of an electric element built in the substrate. The electrical device package according to claim 1,
The substrate is made of ceramic;
The temperature adjusting means is a package of an electric element composed of a resistance heating element. The electrical device package according to claim 1,
The substrate includes a Peltier element, and the temperature adjusting means is the substrate composed of a Peltier element, and the electric element is a package of an electric element accommodated in the container together with the substrate. The electrical device package according to claim 1,
The connection means is a package of electric elements composed of flexible printed wiring. The electrical device package according to claim 1,
The connection means is composed of at least one of a coil and an antenna, and is an electrical element package that wirelessly connects the electrical element and the outside of the container. The electrical device package according to claim 1,
The connection means includes an optical connection means including a light receiving element and a light emitting element, and is an electrical element package that performs an electrical connection between the electrical element and the outside of the container wirelessly through optical communication.

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