WO2015005411A1 - エポキシ樹脂組成物、プリプレグおよび炭素繊維強化複合材料 - Google Patents
エポキシ樹脂組成物、プリプレグおよび炭素繊維強化複合材料 Download PDFInfo
- Publication number
- WO2015005411A1 WO2015005411A1 PCT/JP2014/068387 JP2014068387W WO2015005411A1 WO 2015005411 A1 WO2015005411 A1 WO 2015005411A1 JP 2014068387 W JP2014068387 W JP 2014068387W WO 2015005411 A1 WO2015005411 A1 WO 2015005411A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- epoxy resin
- resin composition
- formula
- carbon
- composition according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
- CJSMAFKHKCZRCX-OCAPTIKFSA-N C[C@H]1C=CC=C[C@H]1C Chemical compound C[C@H]1C=CC=C[C@H]1C CJSMAFKHKCZRCX-OCAPTIKFSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
- B32B27/26—Layered products comprising a layer of synthetic resin characterised by the use of special additives using curing agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
- C08G59/3227—Compounds containing acyclic nitrogen atoms
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
- C08G59/38—Epoxy compounds containing three or more epoxy groups together with di-epoxy compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
- C08G59/4223—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof aromatic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/44—Amides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/5033—Amines aromatic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/504—Amines containing an atom other than nitrogen belonging to the amine group, carbon and hydrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
- C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
- C08J5/243—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using carbon fibres
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/02—Fibres or whiskers
- C08K7/04—Fibres or whiskers inorganic
- C08K7/06—Elements
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
- C08J2363/02—Polyglycidyl ethers of bis-phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
Definitions
- the present invention relates to an epoxy resin composition, a prepreg, and a carbon fiber reinforced composite material. More specifically, the present invention relates to an epoxy resin composition that provides a carbon fiber reinforced composite material suitable as a structural material having excellent tensile strength and compressive strength, and a prepreg and a carbon fiber reinforced composite material.
- carbon fiber reinforced composite materials using carbon fibers as reinforced fibers have been utilized for structural materials such as aircraft and automobiles, sports such as tennis rackets, golf shafts, fishing rods, and the like, using their high specific strength and specific modulus. It has been used for general industrial purposes.
- the carbon fiber reinforced composite material is produced by using a prepreg, which is a sheet-like intermediate material in which a reinforcing fiber is impregnated with an uncured matrix resin, and curing the prepreg.
- a resin transfer molding method or the like is used in which an intermediate is obtained by pouring the above resin to cure the intermediate.
- a carbon fiber reinforced composite material is usually obtained by laminating a plurality of prepregs and then applying heat and pressure.
- a thermosetting resin, particularly an epoxy resin is often used from the viewpoint of productivity such as processability.
- the resin composition giving a carbon fiber reinforced composite material having excellent compressive strength comprises tetraglycidyldiaminodiphenylmethane, a bifunctional epoxy resin such as bisphenol A type epoxy resin or diglycidyl resorcinol, and 3,3′-diaminodiphenyl sulfone.
- Patent Document 3 An epoxy resin composition (see Patent Document 3), an epoxy resin composition comprising a polyfunctional epoxy resin and a diglycidylaniline derivative, and 4,4′-diaminodiphenylsulfone (see Patent Document 4), a polyfunctional epoxy resin and a special An epoxy resin composition composed of an epoxy resin having a skeleton and 3,3′-diaminodiphenyl sulfone (see Patent Document 5) is disclosed.
- Japanese Patent Laid-Open No. 11-241230 JP-A-9-235397 International Publication No. 96/17006 Pamphlet JP 2003-26768 A JP 2002-363253 A
- Patent Document 1 In general, the higher the strength of the reinforcing fiber, the more difficult it is to use the original strength of the fiber, but the proposal of Patent Document 1 does not mention the strength that is manifested when a carbon fiber reinforced composite material is used. . It is also known that the tensile strength utilization rate varies greatly depending on the matrix resin to be combined even with reinforcing fibers having the same strength and the molding conditions. In particular, when the curing temperature is 180 ° C. or higher, there is a problem that high strength is hardly expressed from thermal stress strain remaining in the fiber-reinforced composite material at the time of curing, and thus it is possible to obtain such a high-strength carbon fiber. Even if it is possible, in order to develop the strength as a carbon fiber reinforced composite material, it is necessary to clear further technical issues.
- Patent Documents 3 to 5 Although these can improve the compressive strength, it is difficult to achieve both the tensile strength and the compressive strength at a high level.
- an object of the present invention is to provide an epoxy resin composition, a prepreg, and a carbon fiber reinforced composite material that are excellent in tensile strength and compressive strength and give a carbon fiber reinforced composite material suitable as a structural material.
- the epoxy resin composition of the present invention has any one of the following constitutions (i) to (iii). That is, (I) An epoxy resin composition containing at least components [A1] and [B], and a carbon corresponding to the benzene ring carbon of the main skeleton of the formula (1) attributed to a peak of 130 ppm in a solid 13 C-NMR spectrum An epoxy resin composition having a nucleus relaxation time T 1 C of 42 seconds or more; [A1]: Curing agent represented by formula (1)
- N represents 1 to 5.
- R 1 to R 6 are each a hydrogen atom, an aliphatic hydrocarbon group having 1 to 4 carbon atoms, an alicyclic hydrocarbon group having 4 or less carbon atoms, and a halogen atom. And represents at least one selected from the group consisting of: When X in the formula is —C ( ⁇ O) O— or —NHC ( ⁇ O) —, the direction may be either.
- Z represents —C ( ⁇ O) O—
- n represents 0 to 5.
- R 1 to R 6 represent a hydrogen atom, an aliphatic hydrocarbon group having 1 to 4 carbon atoms, and a carbon number. Represents at least one selected from the group consisting of an alicyclic hydrocarbon group of 4 or less and a halogen atom, and the direction of Z in the formula may be any.
- the prepreg of the present invention has the following configuration. That is, A prepreg obtained by impregnating carbon fiber with the epoxy resin composition.
- the carbon fiber reinforced composite material of the present invention has the following configuration. That is, An epoxy resin cured product obtained by curing an epoxy resin composition and a carbon fiber reinforced composite material comprising carbon fibers.
- the average particle size of the [A1] component particles is preferably less than 20 ⁇ m.
- the relaxation time T 1 C of the carbon nucleus corresponding to the benzene ring carbon of the main skeleton of the formula (1) belonging to 130 ppm in the solid 13 C-NMR spectrum is 48 seconds. The above is preferable.
- X in the formula (1) is preferably —NHC ( ⁇ O) —.
- the epoxy resin composition (i) of the present invention is preferably a curing agent in which the [A1] component has a structure represented by the formula (2) or the formula (3).
- N represents 1 to 5.
- R 1 to R 6 are each a hydrogen atom, an aliphatic hydrocarbon group having 1 to 4 carbon atoms, an alicyclic hydrocarbon group having 4 or less carbon atoms, and a halogen atom. It represents at least one selected from the group consisting of: When X in the formula is —C ( ⁇ O) O— or —NHC ( ⁇ O) —, the direction may be either.
- n in the above formula (2) or the above formula (3) is preferably 1 to 3.
- the epoxy resin composition (ii) of the present invention is preferably a curing agent in which the [A2] component has a structure represented by formula (5) or formula (6).
- R 1 to R 6 are a hydrogen atom, an aliphatic hydrocarbon group having 1 to 4 carbon atoms, an alicyclic hydrocarbon group having 4 or less carbon atoms, and It represents at least one selected from the group consisting of halogen atoms, and the direction of Y in the formula may be any).
- the epoxy resin composition (i) or (ii) of the present invention preferably has a curing heating value measured by differential scanning calorimetry (DSC) at a heating rate of 5 ° C./min. Less than 450 J / g. .
- n in the above formula (7) is preferably 0 in the [A3] component.
- the epoxy resin composition (i), (ii) or (iii) of the present invention is preferably an epoxy resin in which the [B] component is represented by the formula (8).
- T is selected from —CH 2 —, —O—, —CO—, —C ( ⁇ O) O—, —S—, —SO 2 —, —NHC ( ⁇ O) —).
- N represents 0 to 5.
- R 1 to R 6 are each a hydrogen atom, an aliphatic hydrocarbon group having 1 to 4 carbon atoms, an alicyclic hydrocarbon group having 4 or less carbon atoms, and a halogen atom. It represents at least one selected from the group consisting of:
- T in the formula (8) is —C ( ⁇ O) O— or —NHC ( ⁇ O) —, the direction may be either.
- T in the above formula (8) is —SO 2 — or —NHC ( ⁇ O) —. It is preferable.
- the blending amount of the component [B] is 40 to 90% by mass with respect to the total amount of the epoxy resin in the epoxy resin composition. Is preferred.
- the epoxy resin composition (i), (ii) or (iii) of the present invention is an active hydrogen of the amino group of the [A1] or [A2] or [A3] component with respect to all epoxy groups in the epoxy resin composition
- the total equivalence ratio is preferably 0.5 to 0.9.
- the epoxy resin composition (i), (ii) or (iii) of the present invention preferably further contains the following [C] component.
- [C] Epoxy resin having one or more amine-type glycidyl groups or ether-type glycidyl groups having one or more ring structures of 4 or more members and directly linked to the ring structure.
- the product (i), (ii) or (iii) preferably includes an epoxy resin having a structure in which the [C] component is represented by the formula (9).
- R 1 and R 2 are each an aliphatic hydrocarbon group having 1 to 4 carbon atoms, an alicyclic hydrocarbon group having 3 to 6 carbon atoms, an aromatic hydrocarbon group having 6 to 10 carbon atoms, It represents at least one selected from the group consisting of a halogen atom, an acyl group, a trifluoromethyl group and a nitro group, n is an integer of 0 to 4, m is an integer of 0 to 5.
- R 1 and R 2 are When there are a plurality of them, they may be the same or different, and Q is —CH 2 —, —O—, —CO—, —C ( ⁇ O) O—, —S—, —SO 2 —.
- the blending amount of the component [B] is 40 to 90% by mass with respect to the total amount of epoxy resin in the epoxy resin composition, [C The blending amount of the component is preferably 10 to 60% by mass.
- the epoxy resin composition (i), (ii) or (iii) of the present invention preferably contains diaminodiphenyl sulfone as a curing agent.
- the above-mentioned epoxy resin composition (i), (ii) or (iii) of the present invention preferably has a rubber state elastic modulus of 15 MPa or less of a cured epoxy resin cured at 180 ° C. for 2 hours.
- the above-mentioned epoxy resin composition (i), (ii) or (iii) of the present invention preferably has a flexural modulus of 4.5 GPa or more of a cured epoxy resin cured at 180 ° C. for 2 hours.
- the cured epoxy resin cured at 180 ° C. for 2 hours has a rubbery elastic modulus of 15 MPa or less and a flexural modulus of 4 It is preferably 5 GPa or more.
- the epoxy resin composition (i), (ii) or (iii) of the present invention preferably further contains a thermoplastic resin [D] that can be dissolved in the epoxy resin composition.
- the epoxy resin composition (i), (ii) or (iii) of the present invention preferably contains 1 to 40 parts by mass of the [D] component with respect to 100 parts by mass of the total amount of epoxy resin.
- the epoxy resin composition (i), (ii) or (iii) of the present invention preferably contains 1 to 40 parts by mass of the [D] component with respect to 100 parts by mass of the total amount of epoxy resin.
- the epoxy resin composition (i), (ii) or (iii) of the present invention preferably further includes thermoplastic resin particles [E].
- the carbon fiber reinforced composite material of the present invention comprises a cured epoxy resin obtained by curing the epoxy resin composition and carbon fibers.
- an epoxy resin composition having a low curing calorific value and excellent bending elastic modulus and toughness A prepreg can be obtained by combining this epoxy resin composition and carbon fiber, and a carbon fiber reinforced composite material having excellent tensile strength and compressive strength can be obtained by curing this prepreg.
- the present inventors have found that the above formula (1) belonging to 130 ppm in the solid 13 C-NMR spectrum in the epoxy resin composition.
- the benzene ring carbon of the main skeleton of the formula (1) attributed to the peak of 130 ppm in the solid 13 C-NMR spectrum means the benzene ring in the curing agent [A1] incorporated in the epoxy resin composition. Any carbon.
- the solid state NMR measurement of the epoxy resin composition of the present invention is carried out by the following method.
- the cured product of the epoxy resin composition of the present invention or the carbon fiber reinforced composite material is filled in the center of a solid NMR sample tube, and subjected to a solid NMR measurement apparatus (for example, CMX-300 Infinity manufactured by Chemetics) at room temperature. Is 13 C, the observation frequency is 75.2 MHz, the pulse width is 4.2 ⁇ s, and the relaxation time T 1 C of the carbon nuclei is measured by the Torchia method.
- the relaxation time T 1 C of the carbon nucleus corresponding to the benzene ring carbon of the main skeleton of the formula (1) attributed to the 130 ppm peak in the solid 13 C-NMR spectrum.
- Ask for. In the solid 13 C-NMR spectrum of the epoxy resin composition of the present invention, regardless of the type of the curing agent [A1], a peak derived from the benzene ring carbon of the main skeleton of formula (1) is observed around 110 to 160 ppm.
- the relaxation time T 1 C of the carbon nucleus corresponding to the carbon attributed to the peak observed at 130 ppm shows a good correlation with the molecular mobility of the epoxy resin skeleton.
- the relaxation time T 1 C of carbon nuclei by solid state NMR measurement is a numerical value reflecting the molecular mobility inherent in each carbon, and the longer the relaxation time T 1 C , the lower the molecular mobility.
- both the excellent tensile strength and compressive strength which are the effects of the present invention, are achieved at a high level by increasing the relaxation time T 1 C of carbon nuclei and suppressing molecular mobility. I can do it.
- the epoxy resin composition of the present invention can easily form a hydrogen bond with the surrounding functional group having hydrogen bonding property and can take a stable conjugated structure. Therefore, the molecular chain becomes rigid and the relaxation time T 1 C of the carbon nucleus corresponding to the benzene ring carbon of the main skeleton of the formula (1) assigned to the peak of 130 ppm in the solid 13 C-NMR spectrum is increased, and the epoxy resin It is thought that the phenomenon that the molecular mobility of the skeleton is lowered occurs.
- the epoxy resin composition (i) of the present invention has a relaxation time T 1 C of carbon nuclei corresponding to the benzene ring carbon of the main skeleton of formula (1) attributed to a peak of 130 ppm in the solid 13 C-NMR spectrum. It is characterized by being at least 2 seconds, preferably at least 45 seconds, more preferably at least 48 seconds.
- the epoxy resin composition (iii) of the present invention has a relaxation time T 1 C of carbon nuclei corresponding to benzene ring carbon of the main skeleton of the above formula (7) attributed to 130 ppm in a solid 13 C-NMR spectrum of 40 seconds.
- the relaxation time T 1 C of the carbon nuclei corresponding to the benzene ring carbon of the main skeleton of formula (7) attributed to the peak of 130 ppm in the solid 13 C-NMR spectrum.
- Ask for. In the solid 13 C-NMR spectrum of the epoxy resin composition of the present invention, regardless of the type of the curing agent [A3], a peak derived from the benzene ring carbon of the main skeleton of formula (7) is observed around 110 to 160 ppm.
- the relaxation time T 1 C of the carbon nucleus corresponding to the carbon attributed to the peak observed at 130 ppm shows a good correlation with the molecular mobility of the epoxy resin skeleton.
- the epoxy resin composition (iii) of the present invention is easier to form a hydrogen bond with the surrounding functional group having hydrogen bonding properties than the conventional epoxy resin composition, so that the molecular chain becomes rigid and solid.
- the relaxation time T 1 C of the carbon nucleus corresponding to the benzene ring carbon of the main skeleton of the formula (7) assigned to the peak of 130 ppm in the 13 C-NMR spectrum is increased, and the molecular mobility of the epoxy resin skeleton is decreased. The phenomenon is thought to have occurred.
- the epoxy resin composition (iii) of the present invention has a relaxation time T 1 C of carbon nuclei corresponding to the benzene ring carbon of the main skeleton of formula (7) attributed to a peak of 130 ppm in the solid 13 C-NMR spectrum. It is characterized by being at least 2 seconds, preferably at least 41 seconds.
- the present inventors have found that the aromatic resin having the structure represented by the above formula (4) in the epoxy resin composition (ii).
- Tensile strength that is a trade-off relationship by including curing agent particles [A2] and trifunctional or higher functional aromatic epoxy resins [B], which are particles of a diamine compound, and whose average particle size is less than 20 ⁇ m It has been found that an optimum structure can be obtained to achieve both high compression strength and high compression strength.
- the curing agent particle [A2] of the aromatic diamine compound having the structure represented by the formula (4), contained in the epoxy resin composition (ii) according to another aspect of the present invention, has an average particle size of less than 20 ⁇ m. It is characterized by being. When the average particle size of [A2] is 20 ⁇ m or more, the solubility in the epoxy resin may be lowered, or the curing reaction may not proceed sufficiently, so that the resulting cured epoxy resin and carbon fiber reinforced composite are obtained. The mechanical properties and heat resistance of the material may be reduced.
- Y in the formula (4) of [A2] is —NHC ( ⁇ O) —, which may be in any direction.
- R 1 to R 6 are each a hydrogen atom, an aliphatic hydrocarbon group having 1 to 4 carbon atoms, or an alicyclic hydrocarbon group having 4 or less carbon atoms, and these may be the same or different It may be. If the structure of R 1 to R 6 is too large, compatibility with other components in the epoxy resin composition may be impaired, and the effect of improving the strength of the cured epoxy resin may not be obtained.
- the average particle diameter of the particles is preferably less than 20 ⁇ m.
- the solubility in the epoxy resin may be lowered, or the curing reaction may not sufficiently proceed. Therefore, the resulting cured epoxy resin and carbon fiber reinforced composite are obtained.
- the mechanical properties and heat resistance of the material may be significantly reduced.
- X in the formula (1) of [A1] represents —CH 2 —, —O—, —CO—, —C ( ⁇ O) O—, —S—, —SO 2 —, —NHC ( ⁇ O).
- each of R 1 to R 6 is at least one selected from the group consisting of a hydrogen atom, an aliphatic hydrocarbon group having 1 to 4 carbon atoms, an alicyclic hydrocarbon group having 4 or less carbon atoms, and a halogen atom. These may be the same or different. If the structure of R 1 to R 6 is too large, compatibility with other components in the epoxy resin composition may be impaired, and the effect of improving the strength of the cured epoxy resin may not be obtained.
- the curing agent [A1] or the curing agent particle [A2] or the curing agent [A3] is used in order to achieve both high tensile strength and compression strength in the obtained carbon fiber reinforced composite material. ] Is included.
- the curing agent [A1] having the structure represented by the formula (1) when used, a high tensile strength and a compressive strength can be imparted to the obtained carbon fiber reinforced composite material.
- X in (1) is —NHC ( ⁇ O) — are preferably used.
- —NHC ( ⁇ O) — tends to form a hydrogen bond with the surrounding functional group having hydrogen bonding in the molecule, and there is a bond due to —NHC ( ⁇ O) — between the benzene rings. Therefore, when the X in the formula (1) is —NHC ( ⁇ O) — in the curing agent [A1], the molecular chain of the epoxy resin skeleton is rigid. Therefore, the relaxation time T 1 C of carbon nuclei by solid state NMR measurement may become long. As a result, high tensile strength and compressive strength can be imparted to the carbon fiber reinforced composite material.
- curing agent [A1] examples include 4-amino-N- [4-[(4-aminobenzoyl) amino] phenyl] benzamide, 4-amino-N- [3-[(4-aminobenzoyl) amino].
- curing agent particles [A2] examples include 4-amino-N- [4-[(4-aminobenzoyl) amino] phenyl] benzamide, 4-amino-N- [3-[(4-aminobenzoyl).
- curing agent [A3] examples include 4-aminophenyl-4-aminobenzoate, 4-aminophenyl-3-aminobenzoate, 4-aminophenyl-2-aminobenzoate, and 3-aminophenyl-4-amino.
- R 1 to R 6 are preferably hydrogen atoms from the viewpoint of compatibility with other epoxy resins. From the viewpoint of flame retardancy, one in which a part of R 1 to R 6 is substituted with a halogen atom such as Cl or Br is also a preferred form.
- the curing agent [A1] has the following formula: It is preferable that it is an aromatic diamine compound which has a structure represented by (2) or following formula (3).
- N represents 1 to 5.
- R 1 to R 6 are each a hydrogen atom, an aliphatic hydrocarbon group having 1 to 4 carbon atoms, an alicyclic hydrocarbon group having 4 or less carbon atoms, and a halogen atom. It represents at least one selected from the group consisting of: When X in the formula is —C ( ⁇ O) O— or —NHC ( ⁇ O) —, the direction may be either.
- aromatic diamine compounds include 4,4 ′-(1,4-phenylenebis (methylene) dianiline, 3,4 ′-(1,4-phenylenebis (methylene) dianiline, 4,4 ′-(1 , 3-phenylenebis (methylene) dianiline, 4,4 ′-(1,4-phenylenebis (oxy) dianiline, 3,4 ′-(1,4-phenylenebis (oxy) dianiline, 4,4 ′-( 1,3-phenylenebis (oxy) dianiline, 1,4-phenylenebis ((4-aminophenyl) methanone), (4- (3-aminobenzoyl) phenyl) (4-aminophenyl) methanone, 1,3- Phenylenebis ((4-aminophenyl) methanone), bis (4-aminophenyl) terephthalate, 3-aminophenyl-4-aminophenyl terephthalate, bis 4-aminopheny
- the curing agent [A1] is expressed by the above formula (2).
- T 1 C of the carbon nucleus corresponding to the benzene ring carbon of the main skeleton of the formula (1) assigned to the peak of 130 ppm in the solid 13 C-NMR spectrum is less than 42 seconds, The tensile strength and compressive strength of the carbon fiber reinforced composite material are impaired.
- the heating value of curing measured at a heating rate of 5 ° C./min is 450 J / g or more, and heat generated during the curing reaction of the epoxy resin composition is accumulated inside.
- the member may overheat during the molding of the carbon fiber reinforced composite material, affecting not only the mechanical properties such as the flexural modulus and toughness of the cured epoxy resin, but also a problem in safety during molding due to abnormal heat generation. is there.
- n is 6 or more, the compatibility of the curing agent [A1] with the epoxy resin is impaired, the effect of improving the strength of the cured epoxy resin cannot be obtained, or the viscosity of the epoxy resin composition is remarkably increased. The processability and handling of the product may be impaired.
- the curing agent particles [A2] are preferably aromatic diamine compounds having a structure represented by the following formula (5) or the following formula (6).
- R 1 to R 6 are a hydrogen atom, an aliphatic hydrocarbon group having 1 to 4 carbon atoms, an alicyclic hydrocarbon group having 4 or less carbon atoms, and It represents at least one selected from the group consisting of halogen atoms, and the direction of Y in the formula may be any).
- aromatic diamine compounds include 4-amino-N- [4-[(4-aminobenzoyl) amino] phenyl] benzamide, 4-amino-N- [3-[(4-aminobenzoyl) amino] phenyl.
- the curing agent [A3] is expressed by the formula (7).
- aromatic diamine compounds include 4-aminophenyl-4-aminobenzoate, 4-aminophenyl-3-aminobenzoate, 4-aminophenyl-2-aminobenzoate, 3-aminophenyl-4-aminobenzoate, 3 -Aminophenyl-3-aminobenzoate, 3-aminophenyl-2-aminobenzoate, 2-aminophenyl-4-aminobenzoate, 2-aminophenyl-3-aminobenzoate, 2-aminophenyl-2-aminobenzoate Is done.
- 4-aminophenyl-4-aminobenzoate As a commercial product of 4-aminophenyl-4-aminobenzoate, 4-BAAB (manufactured by Nippon Pure Chemicals Co., Ltd.) can be mentioned.
- n 6 or more
- the molecular weight between crosslinking points in the curing agent [A3] becomes too large, and it is difficult to form hydrogen bonds with the surrounding functional groups having hydrogen bonding properties.
- the compatibility of the curing agent [A3] with the epoxy resin may be impaired, and the strength improvement effect of the cured epoxy resin may not be obtained.
- the viscosity of an epoxy resin composition rises remarkably, and the processability and handling property of prepreg manufacture may be impaired.
- the addition amount of the curing agent [A1] or the curing agent particles [A2] or the curing agent [A3] is such that the equivalent ratio of the total active hydrogens of amino groups of all curing agent components to all epoxy groups in the epoxy resin composition is Preferably it is 0.5 to 0.9, more preferably 0.5 to 0.8.
- the blending amount of the curing agent [A1], the curing agent particles [A2], or the curing agent [A3] in the epoxy resin is within the above preferable range, the effect of improving the bending elastic modulus and toughness of the cured epoxy resin, and obtaining The effect of improving the tensile strength and compressive strength of the carbon fiber reinforced composite material obtained is large, and the compatibility between the curing agent [A1] or the curing agent particles [A2] or the curing agent [A3] and the epoxy resin composition is impaired. And sufficient strength improvement effect of the cured epoxy resin can be obtained.
- a curing agent other than the curing agent [A1], the curing agent particles [A2], or the curing agent [A3] may be used in combination.
- the curing agent other than the curing agent [A1] or the curing agent particles [A2] or the curing agent [A3] include dicyandiamide, aromatic amine curing agents, aminobenzoic acid esters, various acid anhydrides, phenol novolac resins, Cresol novolac resin, polyphenol compound, imidazole derivative, aliphatic amine, tetramethylguanidine, thiourea addition amine, carboxylic acid anhydride such as methylhexahydrophthalic anhydride, carboxylic acid hydrazide, carboxylic acid amide, polymercaptan and three And Lewis acid complexes such as boron fluoride ethylamine complex.
- an aromatic amine curing agent is preferably used because an epoxy resin cured product having excellent heat resistance and mechanical properties can be obtained.
- an aromatic diamine curing agent in particular, diaminodiphenylsulfone is used in combination with the curing agent [A1] or the curing agent particle [A2] or the curing agent [A3], so that the curing agent [A1] or the curing agent particle [A2] or curing is performed.
- the compatibility of the agent [A3] with the epoxy resin can be improved, the heat resistance of the resulting cured epoxy resin can be improved, and the resulting carbon fiber reinforced composite material can exhibit high tensile strength and compressive strength. Therefore, this is a preferred embodiment.
- aromatic amine curing agents include 4,4'-DABAN, 3,4'-DABAN (Nippon Pure Chemicals Co., Ltd.), Seika Cure S (Wakayama Seika Kogyo Co., Ltd.), MDA -220 (Mitsui Chemicals Co., Ltd.), “jER Cure” (registered trademark) W (Mitsubishi Chemical Co., Ltd.), and 3,3′-DAS (Mitsui Chemicals Co., Ltd.), “Lonacure” (Registered) (Trademark) M-DEA, “Lonacure” (registered trademark) M-DIPA, “Lonacure” (registered trademark) M-MIPA and “Lonzacure” (registered trademark) DETDA 80 (manufactured by Lonza) .
- compositions obtained by pre-reacting these epoxy resin and curing agent, or a part of them can be blended in the composition.
- This method may be effective for viscosity adjustment and storage stability improvement.
- the tri- or higher functional aromatic epoxy resin [B] contained in the epoxy resin composition of the present invention is an essential component for imparting excellent heat resistance and mechanical properties.
- the blending amount of the tri- or higher functional aromatic epoxy resin [B] is preferably 40 to 90% by mass, more preferably 50% with respect to 100% by mass of the total epoxy resin contained in the epoxy resin composition of the present invention. Is 90 mass%, more preferably 50-80 mass%.
- Examples of the tri- or more functional aromatic epoxy resin [B] include diaminodiphenylmethane type, aminophenol type, metaxylenediamine type, phenol novolac type, orthocresol novolak type, trishydroxyphenylmethane type, tetraphenylolethane type, Naphthalene type, biphenyl type, isocyanurate type and the like can be mentioned.
- Glycidylamine having the structural formula represented by the following formula (8) can be given high tensile strength and compressive strength to the obtained carbon fiber reinforced composite material.
- a type epoxy resin is preferably used.
- T is selected from —CH 2 —, —O—, —CO—, —C ( ⁇ O) O—, —S—, —SO 2 —, —NHC ( ⁇ O) —).
- N represents 0 to 5.
- R 1 to R 6 are each a hydrogen atom, an aliphatic hydrocarbon group having 1 to 4 carbon atoms, an alicyclic hydrocarbon group having 4 or less carbon atoms, and a halogen atom. It represents at least one selected from the group consisting of:
- T in the formula (8) is —C ( ⁇ O) O— or —NHC ( ⁇ O) —, the direction may be either.
- Such glycidylamine type epoxy resins include N, N, N ′, N′-tetraglycidyl-4,4′-diaminodiphenylmethane, N, N, N ′, N′-tetraglycidyl-3,4-diaminodiphenylmethane.
- a glycidylamine type epoxy resin in which T in the formula (8) is —SO 2 — or —NHC ( ⁇ O) — is particularly preferably used.
- T in the formula (8) when T is —SO 2 —, the thermoplastic resin that can be dissolved in the curing agent [A1], the curing agent particle [A2], the curing agent [A3] or the epoxy resin described later in the epoxy resin composition.
- the compatibility of the resin [D] with the epoxy resin may be improved, and the resulting carbon fiber reinforced composite material can exhibit high tensile strength and compressive strength.
- the tri- or higher functional aromatic epoxy resin [B] used in the present invention can be produced by reacting an aromatic amine compound represented by the following general formula (8-2) with epichlorohydrin.
- T is selected from —CH 2 —, —O—, —CO—, —C ( ⁇ O) O—, —S—, —SO 2 —, —NHC ( ⁇ O) —).
- N represents 0 to 5.
- R 1 to R 6 are each a hydrogen atom, an aliphatic hydrocarbon group having 1 to 4 carbon atoms, an alicyclic hydrocarbon group having 4 or less carbon atoms, and a halogen atom. It represents at least one selected from the group consisting of: When T in Formula (8-2) is —C ( ⁇ O) O— or —NHC ( ⁇ O) —, the direction may be either. ).
- the epoxy resin composition of the present invention as a combination of the curing agent [A1], the curing agent particle [A2] or the curing agent [A3] and a tri- or higher functional aromatic epoxy resin [B], molecular mobility is suppressed.
- the combination of the possible curing agent [A1] or curing agent particles [A2] or curing agent [A3] and the glycidylamine type epoxy resin [B] having the structure represented by the formula (8) is obtained as an epoxy It is preferably used since the relaxation time T 1 C of the carbon nuclei of the cured resin becomes long.
- the —NHC ( ⁇ O) — of each other is more likely to form a hydrogen bond in the molecule than when they are used alone, and there is a range in which a stable conjugated structure can be taken.
- diaminodiphenylmethane type epoxy resins include “ELM” (registered trademark) 434 (manufactured by Sumitomo Chemical Co., Ltd.), “Araldite” (registered trademark) MY720, “Araldite” (registered trademark) MY721, “Araldite” (Registered trademark) MY9512, “Araldite” (registered trademark) MY9663 (manufactured by Huntsman Advanced Materials Co., Ltd.), “Epototo” (registered trademark) YH-434 (manufactured by Nippon Steel & Sumikin Chemical Co., Ltd.), etc. Is mentioned.
- aminophenol type epoxy resins Commercial products of aminophenol type epoxy resins include “ELM” (registered trademark) 120, “ELM” (registered trademark) 100 (manufactured by Sumitomo Chemical Co., Ltd.), and “jER” (registered trademark) 630 (Mitsubishi Chemical). And “Araldite” (registered trademark) MY0510, “Araldite” (registered trademark) MY0600 (manufactured by Huntsman Advanced Materials Co., Ltd.), and the like. As a commercial product of the metaxylenediamine type epoxy resin, “TETRAD” (registered trademark) -X (manufactured by Mitsubishi Gas Chemical Co., Inc.) can be mentioned.
- phenol novolac type epoxy resins include “DEN” (registered trademark) 431, “DEN” (registered trademark) 438 (manufactured by Dow Chemical Co., Ltd.) and “jER”. (Registered trademark) 152, “jER” (registered trademark) 154 (manufactured by Mitsubishi Chemical Corporation), and the like.
- commercial products of ortho-cresol novolac type epoxy resin include “EOCN” (registered trademark) -1020 (manufactured by Nippon Kayaku Co., Ltd.) and “EPICLON” (registered trademark) N-660 (manufactured by DIC Corporation). Is mentioned.
- Examples of commercially available trishydroxyphenylmethane type epoxy resins include “Tactix” (registered trademark) 742 (manufactured by Huntsman Advanced Materials Corp.). Examples of commercially available tetraphenylolethane type epoxy resins include “jER” (registered trademark) 1031S (manufactured by Mitsubishi Chemical Corporation). Examples of commercially available biphenyl type epoxy resins include NC-3000 (manufactured by Nippon Kayaku Co., Ltd.). Examples of commercially available dicyclopentadiene type epoxy resins include “EPICLON” (registered trademark) HP7200 (manufactured by DIC Corporation). A commercially available isocyanurate type epoxy resin includes “TEPIC” (registered trademark) -P (manufactured by Nissan Chemical Industries, Ltd.).
- an epoxy resin other than [B] a copolymer of an epoxy resin and a thermosetting resin, or the like may be included.
- thermosetting resin used by being copolymerized with an epoxy resin include unsaturated polyester resin, vinyl ester resin, epoxy resin, benzoxazine resin, phenol resin, urea resin, melamine resin, and polyimide resin. It is done. These resin compositions and compounds may be used alone or in combination as appropriate.
- Epoxy resins other than [B] include bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, resorcinol type epoxy resin, 1,3-bisaminomethylcyclohexane type epoxy resin, urethane modified epoxy resin And hydantoin type epoxy resins.
- bisphenol A type epoxy resins include “jER” (registered trademark) 825, “jER” (registered trademark) 828 “jER” (registered trademark) 1001, “jER” (registered trademark) 1004, “jER” ( (Registered trademark) 1007 (manufactured by Mitsubishi Chemical Corporation), “EPICLON” (registered trademark) 850 (manufactured by DIC Corporation), “Epototo” (registered trademark) YD-128 (manufactured by Nippon Steel & Sumikin Chemical Co., Ltd.) Etc.
- Examples of commercially available resorcinol type epoxy resins include “Denacol” (registered trademark) EX-201 (manufactured by Nagase ChemteX Corporation).
- Commercially available products of 1,3-bisaminomethylcyclohexane type epoxy resin include “TETRAD” (registered trademark) -C (manufactured by Mitsubishi Gas Chemical Co., Inc.).
- AER4152 (Asahi Kasei Epoxy Co., Ltd. product) is mentioned as a commercial item of a urethane-modified epoxy resin.
- AY238 As a hydantoin type epoxy resin commercial item, AY238 (made by Huntsman Advanced Materials Co., Ltd.) is mentioned.
- one amine-type glycidyl group or one ether-type glycidyl group having at least one 4-membered ring structure and directly linked to the ring structure Or it is also a preferable aspect to contain the epoxy resin [C] which has two.
- the epoxy resin [C] contained in the epoxy resin composition has one or more ring structures having four or more members, and one monocyclic structure having four or more members such as cyclohexane, benzene, or pyridine. Or having at least one condensed ring structure composed of four or more rings, such as phthalimide, naphthalene, and carbazole.
- An amine-type glycidyl group or an ether-type glycidyl group directly linked to the ring structure of the epoxy resin [C] has a structure in which an N atom is bonded to a ring structure such as benzene or phthalimide, and an O atom is bonded to an ether type.
- amine type it has one or two epoxy groups
- ether type it has one epoxy group
- epoxy resin [C] having one epoxy group is referred to as [C1]
- the epoxy resin [C] having two epoxy groups is sometimes referred to as [C2]
- the amount of the epoxy resin [C] is 10 to 60% by mass with respect to 100% by mass of the total amount of the epoxy resin compounded.
- the blending amount of the epoxy resin [C] is within the above preferred range, the effect of improving the tensile strength and compressive strength of the carbon fiber reinforced composite material is sufficient, while the heat resistance is impaired.
- the epoxy resin [C1] having one epoxy group is more excellent in the effect of expressing the mechanical properties, and the epoxy resin [C2] having two epoxy groups is more heat resistant. Therefore, when the epoxy resin [C1] is used, the amount of the epoxy resin [C] is preferably 10 to 40% by mass, more preferably 15 to 30%, based on the total amount of the epoxy resin compounded.
- the epoxy resin [C2] it is preferably 25 to 60% by mass, more preferably 30 to 50% by mass, based on the total amount of the epoxy resin blended.
- epoxy resin [C1] examples include glycidylphthalimide, glycidyl-1,8-naphthalimide, glycidylcarbazole, glycidyl-3,6-dibromocarbazole, glycidylindole, glycidyl-4-acetoxyindole, and glycidyl-3-methyl.
- Indole glycidyl-3-acetylindole, glycidyl-5-methoxy-2-methylindole, o-phenylphenyl glycidyl ether, p-phenylphenyl glycidyl ether, p- (3-methylphenyl) phenyl glycidyl ether, 2,6- Dibenzylphenyl glycidyl ether, 2-benzylphenyl glycidyl ether, 2,6-diphenylphenyl glycidyl ether, 4- ⁇ -cumylphenyl glycidyl ether, o-pheno Shi phenyl glycidyl ether, p- phenoxyphenyl glycidyl ether.
- the epoxy resin [C2] having two epoxy groups is N, N-diglycidylaniline, N, N-diglycidyltoluidine, or the following general formula (9)
- R 1 and R 2 are each an aliphatic hydrocarbon group having 1 to 4 carbon atoms, an alicyclic hydrocarbon group having 3 to 6 carbon atoms, an aromatic hydrocarbon group having 6 to 10 carbon atoms, It represents at least one selected from the group consisting of a halogen atom, an acyl group, a trifluoromethyl group and a nitro group, n is an integer of 0 to 4, m is an integer of 0 to 5.
- R 1 and R 2 are When there are a plurality of them, they may be the same or different, and Q is —CH 2 —, —O—, —CO—, —C ( ⁇ O) O—, —S—, —SO 2 —.
- the epoxy resin composition has an epoxy resin composition based on 100% by mass of the total amount of the epoxy resin blended. [C2] the preferably contains 25 to 60 wt%.
- Examples of the epoxy resin [C2] having one ring structure of 4 or more members used in the present invention include N, N-diglycidylaniline, N, N-diglycidyl toluidine and the like.
- Examples of the epoxy resin [C2] having two or more structures include N, N-diglycidyl-4-phenoxyaniline, N, N-diglycidyl-4- (4-methylphenoxy) aniline, N, N-diglycidyl-4- ( 4-tert-butylphenoxy) aniline and N, N-diglycidyl-4- (4-phenoxyphenoxy) aniline.
- the epoxy resin [C2] having two or more 4-membered ring structures is obtained by adding epichlorohydrin to a phenoxyaniline derivative and cyclizing with an alkali compound. Since the viscosity increases as the molecular weight increases, N, N-diglycidyl-4-phenoxyaniline in which both R 1 and R 2 of the epoxy resin [C2] are hydrogen is particularly preferably used from the viewpoint of handleability. .
- phenoxyaniline derivative examples include 4-phenoxyaniline, 4- (4-methylphenoxy) aniline, 4- (3-methylphenoxy) aniline, 4- (2-methylphenoxy) aniline, 4- (4 -Ethylphenoxy) aniline, 4- (3-ethylphenoxy) aniline, 4- (2-ethylphenoxy) aniline, 4- (4-propylphenoxy) aniline, 4- (4-tert-butylphenoxy) aniline, 4- (4-cyclohexylphenoxy) aniline, 4- (3-cyclohexylphenoxy) aniline, 4- (2-cyclohexylphenoxy) aniline, 4- (4-methoxyphenoxy) aniline, 4- (3-methoxyphenoxy) aniline, 4- (2-methoxyphenoxy) aniline, 4- (3-phenoxy Enoxy) aniline, 4- (4-phenoxyphenoxy) aniline, 4- [4- (trifluoromethyl) phenoxy] aniline, 4- [3- (trifluoromethyl) phenoxy] aniline, 4- [4-
- the epoxy resin [C2] used in the present invention is represented by the following general formula (10)
- R 1 and R 2 are each an aliphatic hydrocarbon group having 1 to 4 carbon atoms, an alicyclic hydrocarbon group having 3 to 6 carbon atoms, an aromatic hydrocarbon group having 6 to 10 carbon atoms, halogen, Represents at least one selected from the group consisting of an atom, an acyl group, a trifluoromethyl group, and a nitro group, n is an integer of 0 to 4, m is an integer of 0 to 5.
- R 1 and R 2 are plural When present, they may be the same or different, and Q is —CH 2 —, —O—, —CO—, —C ( ⁇ O) O—, —S—, —SO 2 —, Represents one selected from —NHC ( ⁇ O) —, and when Q in formula (10) is —C ( ⁇ O) O— or —NHC ( ⁇ O) —, the direction may be either .)) And a phenoxyaniline derivative represented by epichlorohydrin.
- the method for producing an epoxy resin [C2] is a method in which two molecules of epichlorohydrin are added to one molecule of a phenoxyaniline derivative, and the following general formula (11)
- R 1 and R 2 are each an aliphatic hydrocarbon group having 1 to 4 carbon atoms, an alicyclic hydrocarbon group having 3 to 6 carbon atoms, an aromatic hydrocarbon group having 6 to 10 carbon atoms, halogen, Represents at least one selected from the group consisting of an atom, an acyl group, a trifluoromethyl group, and a nitro group, n is an integer of 0 to 4, m is an integer of 0 to 5.
- R 1 and R 2 are plural When present, they may be the same or different, and Q is —CH 2 —, —O—, —CO—, —C ( ⁇ O) O—, —S—, —SO 2 —, Represents one selected from —NHC ( ⁇ O) —, and when Q in formula (11) is —C ( ⁇ O) O— or —NHC ( ⁇ O) —, the direction may be either )),
- Q in formula (11) is —C ( ⁇ O) O— or —NHC ( ⁇ O) —, the direction may be either )
- the dichlorohydrin is formed, and the dichlorohydrin is dehydrochlorinated with an alkali compound.
- R 1 and R 2 are each an aliphatic hydrocarbon group having 1 to 4 carbon atoms, an alicyclic hydrocarbon group having 3 to 6 carbon atoms, an aromatic hydrocarbon group having 6 to 10 carbon atoms, halogen, Represents at least one selected from the group consisting of an atom, an acyl group, a trifluoromethyl group, and a nitro group, n is an integer of 0 to 4, m is an integer of 0 to 5.
- R 1 and R 2 are plural When present, they may be the same or different, and Q is —CH 2 —, —O—, —CO—, —C ( ⁇ O) O—, —S—, —SO 2 —, Represents one selected from —NHC ( ⁇ O) —, and when Q in formula (9) is —C ( ⁇ O) O— or —NHC ( ⁇ O) —, the direction may be either )) To form an epoxy compound.
- epoxy resin [C1] “Denacol” (registered trademark) Ex-731 (glycidyl phthalimide, manufactured by Nagase ChemteX Corporation), OPP-G (o-phenylphenyl glycidyl ether, manufactured by Sanko Co., Ltd.)
- examples of commercially available epoxy resins [C2] include GAN (N, N-diglycidyl aniline), GOT (N, N-diglycidyl toluidine) (manufactured by Nippon Kayaku Co., Ltd.), TORAY EPOXY PG-01 (diglycidyl-p-phenoxyaniline, manufactured by Toray Fine Chemical Co., Ltd.) and the like.
- the total amount of the epoxy resin is 100% by mass, [B].
- the blending amount of [C] is preferably 40 to 90% by weight and the blending amount of [C] is preferably 10 to 60% by weight, more preferably the blending amount of [B] is 50 to 90% by weight and the blending amount of [C]. Is 10 to 50% by mass, more preferably 50 to 80% by mass of [B] and 20 to 50% by mass of [C].
- the blending amount of the tri- or higher functional aromatic epoxy resin [B] and the epoxy resin [C] is within the above preferable range, the bending elastic modulus and heat resistance are not impaired, while the crosslinking density is not excessively increased. There is no loss of toughness.
- the compounding amount of the epoxy resin [C] is within the above preferable range, the effect of improving the mechanical properties such as tensile strength and compressive strength of the obtained carbon fiber reinforced composite material is large, while heat resistance is not impaired. .
- the epoxy resin composition of the present invention in addition to the curing agent [A1], the curing agent particles [A2], the curing agent [A3], and the tri- or higher functional aromatic epoxy resin [B], an epoxy having excellent mechanical properties
- the combination with the resin [C] is preferably used because the resulting cured epoxy resin exhibits a long carbon nucleus relaxation time T 1 C and a low rubbery elastic modulus.
- the curing agent [A1] in which X is —NHC ( ⁇ O) —, or the curing agent particles [A2] or the curing agent [A3], and the epoxy resin [C2] having two epoxy groups Can suppress the increase in the crosslinking density of the cured epoxy resin while suppressing the molecular mobility of the epoxy resin skeleton, and the obtained cured epoxy resin has a relaxation time T of carbon nuclei by solid-state NMR measurement. Since 1 C is long and exhibits a low rubbery elastic modulus, this is a preferred embodiment. As a result, the obtained carbon fiber reinforced composite material can achieve both a high level of tensile strength and compressive strength, which are trade-off relationships.
- the relaxation time T 1 C of the carbon nucleus corresponding to the benzene ring carbon of the main skeleton of the formula (1) assigned to the peak of 130 ppm in the solid 13 C-NMR spectrum is 42 seconds or more, and the rubber state
- the elastic modulus is preferably 15 MPa or less, more preferably, the relaxation time T 1 C of the carbon nucleus corresponding to the benzene ring carbon of the main skeleton of formula (1) assigned to the peak of 130 ppm in the solid 13 C-NMR spectrum.
- Is 45 seconds or more and the rubbery elastic modulus is 13 MPa or less, and more preferably, the relaxation of carbon nuclei corresponding to the benzene ring carbon of the main skeleton of formula (1) attributed to the 130 ppm peak in the solid 13 C-NMR spectrum
- the time T 1 C is 48 seconds or more and the rubber state elastic modulus is 10 MPa or less.
- thermoplastic resin [D] that can be dissolved in the epoxy resin composition. Dissolving the thermoplastic resin [D] in the epoxy resin composition often gives better results than using them alone. The brittleness of the epoxy resin composition is covered with the high toughness of the thermoplastic resin [D], and the molding difficulty of the thermoplastic resin [D] is covered with the epoxy resin composition, thereby providing a well-balanced base resin.
- the term “dissolvable in the epoxy resin composition” described here means that the thermoplastic resin [D] is mixed with an epoxy resin composition composed of a tri- or higher functional aromatic epoxy resin [B] and other epoxy resins.
- thermoplastic resin [D] can be dissolved in an epoxy resin composition comprising a tri- or higher functional aromatic epoxy resin [B] and other epoxy resins.
- the powder of the thermoplastic resin [D] is mixed with an epoxy resin composition composed of a tri- or higher functional aromatic epoxy resin [B] and other epoxy resins, and several times at a temperature lower than the melting point of the thermoplastic resin [D]. If a change in viscosity is substantially observed when evaluating a change in viscosity when held isothermal for 2 hours, for example, 2 hours, an aromatic epoxy resin [B] in which the thermoplastic resin [D] is trifunctional or higher and other You may judge that it can melt
- thermoplastic resin [D] has the property of being soluble in an epoxy resin composition composed of a tri- or higher functional aromatic epoxy resin [B] and other epoxy resins, in the process of curing the resin.
- the thermoplastic resin [D] may undergo phase separation, but from the viewpoint of enhancing the solvent resistance of the cured epoxy resin and carbon fiber reinforced composite material obtained by curing, the phase separation should not be performed during the curing process. Is more preferable.
- the thermoplastic resin [D] is an epoxy composed of a tri- or higher functional aromatic epoxy resin [B] and other epoxy resins in advance. It is more preferable to dissolve and mix in the resin composition. It becomes easy to disperse
- thermoplastic resin [D] generally comprises a carbon-carbon bond, an amide bond, an imide bond, an ester bond, an ether bond, a carbonate bond, a urethane bond, a thioether bond, a sulfone bond and a carbonyl bond in the main chain.
- a thermoplastic resin [D] having a bond selected from the group is preferred.
- the thermoplastic resin [D] may have a partially crosslinked structure, and may have crystallinity or may be amorphous.
- the glass transition temperature (Tg) of the thermoplastic resin [D] is at least 150 ° C. or higher and preferably 170 ° C. or higher.
- Tg glass transition temperature
- the glass transition temperature of the thermoplastic resin [D] to be blended is within the above preferable range, deformation due to heat hardly occurs when used as a molded body.
- things, such as a hydroxyl group, a carboxyl group, a thiol group, and an acid anhydride can react with a cationically polymerizable compound, and are used preferably.
- oligomer refers to a polymer having a relatively low molecular weight in which about 10 to 100 finite number of monomers are bonded.
- polyethersulfone is preferably used.
- polyethersulfone having an average molecular weight of 10,000 to 60,000 g / mol is more preferably used, and further preferably.
- the average molecular weight is 12,000 to 50,000 g / mol, and particularly preferably the average molecular weight is 15,000 to 30,000 g / mol.
- the average molecular weight is within the above preferred range, the tackiness of the prepreg is appropriate, the handleability is good, and the toughness of the cured epoxy resin is not lowered.
- the epoxy resin composition Viscosity is moderate and prepreg is easy.
- thermoplastic resin when a polyethersulfone having a high heat resistance with an average molecular weight of 15,000 to 30,000 g / mol is dissolved in an epoxy resin, a large amount of thermoplastic resin is epoxy-bonded to the extent that there is no problem in the prepreg process. It can be dissolved in the resin, can impart high toughness to the cured epoxy resin while maintaining the flexural modulus, and can impart high tensile strength and compressive strength to the resulting carbon fiber reinforced composite material .
- the use ratio (parts by mass) of the epoxy resin and the thermoplastic resin [D] is preferably a blending amount of the thermoplastic resin [D] with respect to a total of 100 parts by mass of the blended epoxy resin. Is in the range of 1 to 40 parts by mass, more preferably in the range of 3 to 30 parts by mass.
- the blending amount of the thermoplastic resin [D] is within the above preferred range, the viscosity of the epoxy resin composition is moderate and the processability is good, while the toughness of the cured epoxy resin is sufficiently high, and the resulting carbon fiber. The tensile strength of the reinforced composite material is not insufficient.
- thermoplastic resin particles [E] it is also preferable to mix the thermoplastic resin particles [E] with the epoxy resin composition of the present invention.
- the toughness of the epoxy resin is improved and the impact resistance is improved when a carbon fiber reinforced composite material is obtained.
- thermoplastic resin particles [E] thermoplastic resins that are the same as the various thermoplastic resins [D] exemplified above and can be used by mixing with the epoxy resin composition can be used.
- polyamide is most preferable.
- nylon 12 nylon 6, nylon 11, nylon 66, nylon 6/12 copolymer, and an epoxy compound described in Example 1 of JP-A-01-104624 are semi-solid.
- IPN (polymer interpenetrating network) nylon (semi-IPN nylon) gives particularly good adhesive strength with epoxy resin.
- thermoplastic resin particles [E] may be spherical particles, non-spherical particles, or porous particles, but the spherical shape is superior in viscoelasticity because it does not deteriorate the flow characteristics of the resin, and stress concentration is high. This is a preferred embodiment in that it has no starting point and gives high impact resistance.
- polyamide particles include SP-500, SP-10, TR-1, TR-2, 842P-48, 842P-80 (above, manufactured by Toray Industries, Inc.), “Trepearl” (registered trademark) TN ( Toray Industries, Inc.), "Orgasol” (registered trademark) 1002D, 2001UD, 2001EXD, 2002D, 3202D, 3501D, 3502D (above, manufactured by Arkema Co., Ltd.) and the like can be used.
- the epoxy resin composition of the present invention is an inorganic filler such as a coupling agent, thermosetting resin particles, silica gel, carbon black, clay, carbon nanotubes, carbon particles, and metal powder as long as the effects of the present invention are not hindered. Etc. can be blended.
- examples of carbon black include channel black, thermal black, furnace black, and ketjen black.
- the amount of the thermoplastic resin particles [E] is preferably 0.1 to 30 parts by weight, more preferably 1 to 20 parts by weight, based on 100 parts by weight of the total epoxy resin. More preferably, 5 to 15 parts by mass is blended.
- the blending amount of the thermoplastic resin particles [E] is within the above preferable range, mixing with the epoxy resin composition as the base resin is easy, and the prepreg tack and drape properties are sufficiently high, while the carbon fiber reinforced obtained The impact resistance of the composite material is not lowered.
- thermoplastic resin particles [E] that is, when the cross section thereof is observed, the state where the thermoplastic resin particles [E] are present locally can be clearly confirmed. It is preferable that the layer has a structure formed in the vicinity of the surface of the prepreg.
- the curing agent [A1] or the curing agent particle [A2] has a small mass ratio of terminal amino groups per molecular weight and a large active hydrogen equivalent of amino groups per molecule, so that the curing reaction of the epoxy resin composition It may have the effect of suppressing the amount of heat generated by curing. As a result, it is possible to suppress degradation of mechanical characteristics due to overheating when molding the carbon fiber reinforced composite material and safety problems due to abnormal heat generation.
- the calorific value when cured at a rate of temperature increase of 5 ° C./min in differential scanning calorimetry may be less than 450 J / g. Preferably, it is less than 420 J / g, more preferably less than 400 J / g.
- DSC differential scanning calorimetry
- the rubber state elastic modulus of the cured epoxy resin obtained by curing the epoxy resin composition obtained in the present invention at 180 ° C. for 2 hours is 15 MPa or less. More preferably, it is 13 MPa or less, More preferably, it is 10 MPa or less.
- the rubber state elastic modulus is 15 MPa or less, a cured epoxy resin having a sufficiently low crosslinking density and excellent toughness can be obtained.
- the flexural modulus of the cured epoxy resin obtained by curing the epoxy resin composition obtained by the present invention at 180 ° C. for 2 hours is It is preferably 4.5 GPa or more, more preferably 4.7 GPa or more.
- the epoxy resin cured product obtained by curing the epoxy resin composition obtained in the present invention at 180 ° C. for 2 hours has a flexural modulus of 4.5 GPa or more and a rubbery elastic modulus of 15 MPa or less, More preferably, the cured epoxy resin cured at 180 ° C. for 2 hours has a flexural modulus of 4.7 GPa or more and a rubbery elastic modulus of 13 MPa or less.
- the bending elastic modulus When the bending elastic modulus is 4.5 GPa or more and the rubbery state elastic modulus is 15 MPa or less, the bending elastic modulus may be improved while suppressing an increase in the crosslinking density of the cured epoxy resin, and carbon obtained In the fiber reinforced composite material, the tensile strength and the compressive strength can be compatible at a high level.
- the carbon fiber used in the present invention may be any type of carbon fiber depending on the application, but is preferably a carbon fiber having a tensile modulus of at least 200 GPa from the viewpoint of impact resistance. Moreover, from the viewpoint of strength, a carbon fiber reinforced composite material having high rigidity and mechanical properties can be obtained, and therefore, carbon fibers having a tensile strength of 4.0 GPa or more are preferably used. The tensile elongation is also an important factor, and it is preferable that the carbon fiber has a high elongation with a tensile elongation of 1.5% or more. Therefore, the carbon fiber having the characteristics that the tensile elastic modulus is at least 200 GPa, the tensile strength is at least 4.0 GPa, and the tensile elongation is at least 1.5% is most suitable.
- Carbon fibers include “Torayca” (registered trademark) T800G-24K, “Torayca” (registered trademark) T800S-24K, “Torayca” (registered trademark) T810G-24K, “Torayca” (registered trademark) T700G- 24K, “Torayca” (registered trademark) T300-3K, and “Torayca” (registered trademark) T700S-12K (above, manufactured by Toray Industries, Inc.).
- the form and arrangement of the carbon fibers can be appropriately selected from long fibers and woven fabrics arranged in one direction. However, in order to obtain a carbon fiber reinforced composite material that is lighter and more durable, It is preferably in the form of continuous fibers such as long fibers (fiber bundles) or woven fabrics arranged in one direction.
- the number of filaments in one fiber bundle is preferably in the range of 2,500 to 50,000. If the number of filaments is less than 2,500, the fiber arrangement tends to meander and cause a decrease in strength. If the number of filaments exceeds 50,000, it may be difficult to impregnate the resin during prepreg production or molding.
- the number of filaments is more preferably in the range of 2,800 to 36,000.
- the prepreg according to the present invention is obtained by impregnating carbon fiber with the epoxy resin composition of the present invention.
- the carbon fiber mass fraction of the prepreg is preferably 40 to 90% by mass, more preferably 50 to 80% by mass.
- the weight of the obtained carbon fiber reinforced composite material is moderate, and the carbon fiber reinforced composite material excellent in specific strength and specific modulus can sufficiently exhibit the advantages, while having a resin composition Insufficient impregnation of materials is less likely to occur, the voids of the resulting carbon fiber reinforced composite material can be reduced, and the mechanical properties can be improved.
- the prepreg of the present invention comprises a wet method in which the epoxy resin composition of the present invention is dissolved in a solvent such as methyl ethyl ketone and methanol to lower the viscosity and impregnated into a reinforcing fiber, and the epoxy resin composition is heated to lower the viscosity and strengthened. It can be suitably produced by a hot melt method for impregnating fibers.
- the wet method is a method of obtaining a prepreg by immersing a reinforcing fiber in a solution of an epoxy resin composition, then pulling it up and evaporating the solvent using an oven or the like.
- the hot melt method is a method in which an epoxy resin composition whose viscosity has been reduced by heating is impregnated directly into a reinforcing fiber, or a resin film in which an epoxy resin composition is coated on release paper or the like is prepared and then reinforced. This is a method of obtaining a prepreg by transferring and impregnating an epoxy resin composition by overlapping the resin film from both sides or one side of the fiber and applying heat and pressure. This hot melt method is a preferred embodiment because substantially no solvent remains in the prepreg.
- the carbon fiber reinforced composite material of the present invention is a method of laminating a plurality of prepregs produced by such a method and then heat-curing the epoxy resin composition while applying heat and pressure to the obtained laminate, etc. Can be manufactured.
- a press molding method As a method for applying heat and pressure, a press molding method, an autoclave molding method, a bagging molding method, a wrapping tape method, an internal pressure molding method, and the like are used.
- a wrapping tape method and an internal pressure molding method are preferably used for molding sports equipment.
- the wrapping tape method is a method in which a prepreg is wound around a mandrel or the like and a tubular body made of a fiber reinforced composite material is formed, and is a suitable method for producing a rod-like body such as a golf shaft or a fishing rod.
- the prepreg was wound around a mandrel, and a wrapping tape made of a thermoplastic resin film was wound outside the prepreg for fixing and applying pressure, and the epoxy resin composition was cured by heating in an oven. Thereafter, the core bar is removed to obtain a tubular body.
- the internal pressure molding method is to set a preform in which a prepreg is wound on an internal pressure applying body such as a tube made of a thermoplastic resin in a mold, and then apply high pressure gas to the internal pressure applying body to apply pressure. At the same time, the mold is heated to form a tubular body.
- This internal pressure molding method is particularly preferably used when molding a complicated shape such as a golf shaft, a bat, and a racket such as tennis or badminton.
- the carbon fiber reinforced composite material of the present invention can be manufactured by, for example, a method of laminating the above-described prepreg of the present invention in a predetermined form and curing the epoxy resin by applying pressure and heating.
- the carbon fiber reinforced composite material of the present invention can also be produced by using the above-described epoxy resin composition by a method that does not go through a prepreg.
- Examples of such a method include a method of directly impregnating the epoxy resin composition of the present invention into a reinforcing fiber and then heat-curing, that is, a hand lay-up method, a filament winding method, a pultrusion method, a resin injection. -Molding method and resin transfer molding method are used.
- a method of preparing an epoxy resin composition by mixing one or more main agents composed of an epoxy resin and one or more curing agents immediately before use is preferably employed.
- the carbon fiber reinforced composite material of the present invention is preferable for aircraft structural members, windmill blades, automobile outer plates, and computer applications such as IC trays and notebook computer housings (housing), and sports applications such as golf shafts and tennis rackets. Used.
- ⁇ Other curing agents > Seikacure S (4,4′-diaminodiphenylsulfone, manufactured by Wakayama Seika Kogyo Co., Ltd.) Amino group active hydrogen equivalent: 62 (g / eq.) 3,3′-DAS (3,3′-diaminodiphenyl sulfone, manufactured by Mitsui Chemicals Fine Co., Ltd.) Amino group active hydrogen equivalent: 62 (g / eq.) -4,4'-DABAN (4,4'-diaminobenzanilide, manufactured by Nippon Pure Chemicals Co., Ltd.) Amino group active hydrogen equivalent: 57 (g / eq.).
- Equivalent ratio of all curing agent components (mass part of component [A1] or [A2] or [A3] / amino group active hydrogen equivalent of component [A1] or [A2] or [A3] + mass of other curing agent Parts / amino group active hydrogen equivalent of other curing agent) / (parts by mass of epoxy resin component 1 / epoxy equivalent of epoxy resin component 1 + mass part of epoxy resin component 2 / epoxy equivalent of epoxy resin component 2)
- Equivalent ratio of component [A1] or [A2] or [A3] (mass part of component [A1] or [A2] or [A3] / amino group active hydrogen of component [A1] or [A2] or [A3] Equivalent) / (parts by mass of epoxy resin component 1 / epoxy equivalents by epoxy resin component 1 + mass parts by epoxy resin component 2 / epoxy equivalents by epoxy resin component 2)
- Equivalent ratio of other curing agent (mass part of other curing agent / amino group active hydrogen equivalent of other curing agent) / (mas
- Curing calorific value measurement of epoxy resin composition Curing calorific value was evaluated with a differential scanning calorimeter DSC (model number: DSC-Q2000, manufactured by TA Instruments). 5-10 mg of the cured epoxy resin obtained by the method (2) above is packed in a sealed aluminum sample pan with a capacity of 50 ⁇ L, heated from 0 ° C. to 300 ° C. at a temperature rising rate of 5 ° C./min, The DSC curve integral value (that is, the amount of heat generated by curing) in the vicinity of 300 ° C. was determined. When a plurality of exothermic peaks were observed in the mixture or the like, the total of them was adopted as the amount of heat generated by curing the composition.
- the glass transition temperature is the temperature at the intersection of the low-temperature baseline and the tangent drawn at the point where the slope of the curve where the storage modulus suddenly changes is maximized.
- the storage elastic modulus at a temperature exceeding the glass transition temperature by 50 ° C. was defined as the rubbery elastic modulus.
- This resin film is overlapped on both sides of carbon fibers (weight per unit area: 200 g / m 2 ) aligned in one direction, using a heat roll, and the epoxy resin composition is made into carbon fibers while heating and pressing at a temperature of 100 ° C. and 1 atm.
- a prepreg was obtained by impregnation.
- the obtained universal tensile tester (Instron Japan Co., Ltd., “Instron” (registered trademark) 5565 type P8564) is used in a 0 ° direction tensile test piece in a 23 ° C. environment.
- the tensile test was carried out at a test speed of 1.27 mm / min.
- the obtained 0 ° direction compression test piece was compliant with SACMA-SRM 1R-94 in an environment of 23 ° C., and a universal material testing machine (“Instron” (registered trademark) 5565 type P8564 manufactured by Instron Japan Co., Ltd.). The compression test was carried out at a test speed of 1.0 mm / min.
- Example 1 In a kneader, 70 parts by mass of tetraglycidyldiaminodiphenylmethane, 30 parts by mass of bisphenol A epoxy resin and 15 parts by mass of polyethersulfone were kneaded at 160 ° C. for 2 hours to visually confirm that the polyethersulfone was dissolved.
- a cured epoxy resin was obtained by the method described in (5) Preparation of cured product of epoxy resin composition. Using the obtained cured epoxy resin, the bending elastic modulus and rubber state were measured by the methods described in (7) Measurement of flexural modulus of cured epoxy resin and (8) Measurement of elastic modulus of rubber of cured epoxy resin. The elastic modulus was measured.
- the prepreg was obtained from the obtained epoxy resin composition by the method described in (9) Preparation of prepreg. Using the obtained prepreg, the method described in (10) Measurement of 0 ° tensile strength of carbon fiber reinforced composite material, and (11) Measurement of 0 ° compressive strength of carbon fiber reinforced composite material, 0 ° tensile strength, 0 ° The compressive strength was measured. The results are shown in Table 1.
- Examples 2 to 6, Comparative Examples 1 to 10 Except having changed the kind and compounding quantity of an epoxy resin and a hardening
- 4-APTP average particle size 3 ⁇ m
- Examples 7 to 11, Comparative Examples 11 to 16 A cured epoxy resin, a prepreg, and a carbon fiber reinforced composite material are produced in the same manner as in Example 1 except that the types and blending amounts of the epoxy resin and the curing agent are changed as shown in Tables 1, 2, and 10. Then, the flexural modulus, rubber state modulus, 0 ° tensile strength, and 0 ° compressive strength were measured. The results are shown in Tables 1, 2, and 10. Examples 7 to 11 exhibited low rubber state modulus and high flexural modulus.
- both the flexural modulus and the rubbery elastic modulus showed a tendency to increase, and a tendency to improve the 0 ° compressive strength was observed.
- Example 12 to 15 Except having changed the kind and compounding quantity of an epoxy resin and a hardening
- Example 16 and 17 Except having changed the kind and compounding quantity of an epoxy resin and a hardening
- Example 18 to 23 Except having changed the kind and compounding quantity of an epoxy resin and a hardening
- Comparative Examples 17 to 20 Except having changed the kind and compounding quantity of an epoxy resin and a hardening
- Example 24 to 29 Except having changed the kind and compounding quantity of an epoxy resin and a hardening
- Example 24 the average particle diameter of 1-N, 4-N-bis (4-aminophenyl) phenylene-1,4-dicarboxamide was changed from 3 ⁇ m to 18 ⁇ m. In contrast, the flexural modulus decreased and the 0 ° compressive strength tended to decrease slightly.
- Example 30 to 32 Except having changed the kind and compounding quantity of an epoxy resin and a hardening
- Example 30 to 32 low rubber state elastic modulus and high flexural modulus were exhibited, and both 0 ° tensile strength and 0 ° compressive strength were high.
- Example 1 and Examples 30 to 32 there was a tendency for the 0 ° tensile strength to improve as the blending amount of polyethersulfone increased.
- Example 33 to 36 Except having changed the kind and compounding quantity of an epoxy resin and a hardening
- Example 37 In a kneading apparatus, 60 parts by mass of tetraglycidyldiaminodiphenylmethane, 20 parts by mass of bisphenol A type epoxy resin, 20 parts by mass of bisphenol F type epoxy resin, and 15 parts by mass of polyethersulfone were kneaded at 160 ° C. for 2 hours. After visually confirming that the polyethersulfone was dissolved, it was cooled to 70 ° C. and 46 parts by mass of 1-N, 4-N-bis (4-aminophenyl) phenylene-1,4-dicarboxamide (average particle size) (Diameter 3 ⁇ m) was blended and kneaded to obtain an epoxy resin composition. Table 5 shows the composition and ratio (in Table 5, the numbers represent parts by mass of each component).
- the curing heat generation amount was measured by the method described in (4) Measurement of curing heat generation amount of epoxy resin composition.
- cured material was obtained from the obtained epoxy resin composition by the method as described in said (5) Hardened
- the obtained epoxy resin cured product was used to relax the carbon nucleus by the method described in (6) Measurement of relaxation time of carbon nucleus of cured epoxy resin and (8) Measurement of elastic modulus of rubber state of cured epoxy resin. Time T 1 C and rubber state elastic modulus were measured.
- a prepreg was obtained from the obtained epoxy resin composition by the method described in (9) Preparation of prepreg.
- the method described in (10) Measurement of 0 ° tensile strength of carbon fiber reinforced composite material, and (11) Measurement of 0 ° compressive strength of carbon fiber reinforced composite material, 0 ° tensile strength, 0 °
- the compressive strength was measured.
- the results are shown in Table 5. (Examples 38 to 40, Examples 44 to 48, Comparative Examples 23 to 35) Except that the types and blending amounts of the epoxy resin and the curing agent were changed as shown in Tables 5, 6, 11, and 12, the cured epoxy resin, prepreg, and carbon fiber reinforced composite material were produced in the same manner as in Example 37.
- Examples 52 to 55, Examples 58 to 61 Except having changed the kind and compounding quantity of an epoxy resin and a hardening
- Examples 56, 57, 62, 63 Except having changed the kind and compounding quantity of an epoxy resin and a hardening
- Example 41 (Examples 41, 49, 66, 73, 74) Except that the types and blending amounts of the epoxy resin and the curing agent were changed as shown in Tables 5 to 8, a cured epoxy resin, a prepreg, and a carbon fiber reinforced composite material were produced in the same manner as in Example 37.
- the relaxation time T 1 C of carbon nuclei, the calorific value, the rubber state elastic modulus, 0 ° tensile strength, and 0 ° compressive strength were measured. The results are shown in Tables 5-8.
- Example 41 In Examples 41, 49, 66, 73, and 74, the relaxation time T 1 C of the long carbon nuclei, the low heating value and the low rubber state elastic modulus were shown, and both the 0 ° tensile strength and the 0 ° compressive strength were high. It was. (Examples 42 and 50) Except having changed the kind and compounding quantity of an epoxy resin and a hardening
- Example 43 and 51 Except having changed the kind and compounding quantity of an epoxy resin and a hardening
- Example 64 and 65 Except having changed the kind and compounding quantity of an epoxy resin and a hardening
- Example 67 to 72 Except having changed the kind and compounding quantity of an epoxy resin and a hardening
- the relaxation time T 1 C , the calorific value, the rubber state elastic modulus, the 0 ° tensile strength, and the 0 ° compressive strength were measured. The results are shown in Table 8. In Examples 67 to 72, the relaxation time T 1 C of long carbon nuclei, the low heating value and the low rubber state elastic modulus were shown, and both 0 ° tensile strength and 0 ° compressive strength were high.
- Example 37 Example 44, and Examples 67 to 72, there was a tendency that the 0 ° tensile strength was improved by increasing the blending amount of polyethersulfone.
- Comparative Examples 36-39 Except having changed the kind and compounding quantity of an epoxy resin and a hardening
- Comparative Examples 36 to 38 since the components [A1] or [A2] and [C] are not included, the rubbery elastic modulus is higher than that of Example 37 and Example 44, and the heat value of curing is high. There was a tendency for the 0 ° tensile strength to decrease. In Comparative Example 39, since the component [B] was not included, the carbon nucleus relaxation time T 1 C was short compared to Example 37 and Example 44, and the 0 ° compressive strength tended to decrease.
- the carbon fiber reinforced composite material obtained from the epoxy resin composition of the present invention has high tensile strength and compressive strength, it is particularly suitable for structural materials.
- structural materials for aerospace applications, primary aircraft structural materials such as main wing, tail and floor beams, secondary structural materials such as flaps, ailerons, cowls, fairings and interior materials, rocket motor cases and satellite structural materials Preferably used.
- structural materials for moving bodies such as automobiles, ships and railway vehicles, drive shafts, leaf springs, windmill blades, pressure vessels, flywheels, paper rollers, roofing materials, cables, reinforcing bars, and repair reinforcements
- civil engineering and building material applications such as materials.
- it is suitably used for golf shafts, fishing rods, tennis, badminton and squash rackets, hockey sticks, and ski pole applications.
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Inorganic Chemistry (AREA)
- Reinforced Plastic Materials (AREA)
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
(i)少なくとも成分[A1]、[B]を含むエポキシ樹脂組成物であり、固体13C-NMRスペクトルで130ppmのピークに帰属される式(1)の主骨格のベンゼン環炭素に対応した炭素核の緩和時間T1 Cが42秒以上であるエポキシ樹脂組成物、
[A1]:式(1)で表される硬化剤
[B]:3官能以上の芳香族エポキシ樹脂
または、
(ii)少なくとも成分[A2]、[B]を含むエポキシ樹脂組成物、
[A2]:式(4)で表される構造を有する芳香族ジアミン化合物の粒子であり、該粒子の平均粒径が20μm未満である硬化剤粒子
[B]:3官能以上の芳香族エポキシ樹脂
または、
(iii)少なくとも成分[A3]、[B]を含むエポキシ樹脂組成物であり、固体13C-NMRスペクトルで130ppmのピークに帰属される式(7)の主骨格のベンゼン環炭素に対応した炭素核の緩和時間T1 Cが40秒以上であるエポキシ樹脂組成物、
[A3]:式(7)で表される硬化剤
[B]:3官能以上の芳香族エポキシ樹脂、
である。
上記エポキシ樹脂組成物を炭素繊維に含浸させてなるプリプレグ、である。
エポキシ樹脂組成物を硬化してなるエポキシ樹脂硬化物および炭素繊維を含んでなる炭素繊維強化複合材料、である。
[C]:4員環以上の環構造を1つ以上有し、かつ、環構造に直結したアミン型グリシジル基またはエーテル型グリシジル基を1個または2個有するエポキシ樹脂
本発明の上記エポキシ樹脂組成物(i)、(ii)または(iii)は、[C]成分が式(9)で表される構造を有するエポキシ樹脂を含むことが好ましい。
本発明の上記エポキシ樹脂組成物(i)、(ii)または(iii)は、エポキシ樹脂組成物中のエポキシ樹脂総量に対して、[B]成分の配合量が40~90質量%、[C]成分の配合量が10~60質量%であることが好ましい。
2,2’-(1,3-フェニレンビス(オキシ)ジアニリン、4,4’-(1,2-フェニレンビス(オキシ)ジアニリン、3,4’-(1,2-フェニレンビス(オキシ)ジアニリン、3,3’-(1,2-フェニレンビス(オキシ)ジアニリン、2,4’-(1,2-フェニレンビス(オキシ)ジアニリン、2,3’-(1,2-フェニレンビス(オキシ)ジアニリン、2,2’-(1,2-フェニレンビス(オキシ)ジアニリン、1,4-フェニレンビス((4-アミノフェニル)メタノン)、(4-(3-アミノベンゾイル)フェニル)(4-アミノフェニル)メタノン、(4-(2-アミノベンゾイル)フェニル)(4-アミノフェニル)メタノン、1,4-フェニレンビス((3-アミノフェニル)メタノン)、(4-(2-アミノベンゾイル)フェニル)(3-アミノフェニル)メタノン、1,4-フェニレンビス((2-アミノフェニル)メタノン)、1,3-フェニレンビス((4-アミノフェニル)メタノン)、(3-(3-アミノベンゾイル)フェニル)(4-アミノフェニル)メタノン、(3-(2-アミノベンゾイル)フェニル)(4-アミノフェニル)メタノン、1,3-フェニレンビス((3-アミノフェニル)メタノン)、(3-(2-アミノベンゾイル)フェニル)(3-アミノフェニル)メタノン、1,3-フェニレンビス((2-アミノフェニル)メタノン)、1,2-フェニレンビス((4-アミノフェニル)メタノン)、(2-(3-アミノベンゾイル)フェニル)(4-アミノフェニル)メタノン、(2-(2-アミノベンゾイル)フェニル)(4-アミノフェニル)メタノン、1,2-フェニレンビス((3-アミノフェニル)メタノン)、(2-(2-アミノベンゾイル)フェニル)(3-アミノフェニル)メタノン、1,2-フェニレンビス((2-アミノフェニル)メタノン)、ビス(4-アミノフェニル)テレフタレート、3-アミノフェニル-4-アミノフェニルテレフタレート、2-アミノフェニル-4-アミノフェニルテレフタレート、ビス(3-アミノフェニル)テレフタレート、2-アミノフェニル-3-アミノフェニルテレフタレート、ビス(3-アミノフェニル)テレフタレート、ビス(4-アミノフェニル)イソフタレート、3-アミノフェニル-4-アミノフェニルイソフタレート、2-アミノフェニル-4-アミノフェニルイソフタレート、ビス(3-アミノフェニル)イソフタレート、2-アミノフェニル-3-アミノフェニルイソフタレート、ビス(3-アミノフェニル)イソフタレート、ビス(4-アミノフェニル)フタレート、3-アミノフェニル-4-アミノフェニルフタレート、2-アミノフェニル-4-アミノフェニルフタレート、ビス(3-アミノフェニル)フタレート、2-アミノフェニル-3-アミノフェニルフタレート、ビス(3-アミノフェニル)フタレート、1,4-フェニレン-ビス(4-アミノベンゾエート)、4-(4-アミノベンゾイロキシ)フェニル-3-アミノベンゾエート、4-(4-アミノベンゾイロキシ)フェニル-2-アミノベンゾエート、1,4-フェニレン-ビス(3-アミノベンゾエート)、4-(3-アミノベンゾイロキシ)フェニル-2-アミノベンゾエート、1,4-フェニレン-ビス(2-アミノベンゾエート)、1,3-フェニレン-ビス(4-アミノベンゾエート)、3-(4-アミノベンゾイロキシ)フェニル-3-アミノベンゾエート、3-(4-アミノベンゾイロキシ)フェニル-2-アミノベンゾエート、1,3-フェニレン-ビス(3-アミノベンゾエート)、3-(3-アミノベンゾイロキシ)フェニル-2-アミノベンゾエート、1,3-フェニレン-ビス(2-アミノベンゾエート)、1,2-フェニレン-ビス(4-アミノベンゾエート)、2-(4-アミノベンゾイロキシ)フェニル-3-アミノベンゾエート、2-(4-アミノベンゾイロキシ)フェニル-2-アミノベンゾエート、1,2-フェニレン-ビス(3-アミノベンゾエート)、2-(3-アミノベンゾイロキシ)フェニル-2-アミノベンゾエート、1,2-フェニレン-ビス(2-アミノベンゾエート)、4,4’-(1,4-フェニレンビス(スルファンジイル)ジアニリン、3,4’-(1,4-フェニレンビス(スルファンジイル)ジアニリン、3,3’-(1,4-フェニレンビス(スルファンジイル)ジアニリン、2,4’-(1,4-フェニレンビス(スルファンジイル)ジアニリン、2,3’-(1,4-フェニレンビス(スルファンジイル)ジアニリン、2,2’-(1,4-フェニレンビス(スルファンジイル)ジアニリン、4,4’-(1,3-フェニレンビス(スルファンジイル)ジアニリン、3,4’-(1,3-フェニレンビス(スルファンジイル)ジアニリン、3,3’-(1,3-フェニレンビス(スルファンジイル)ジアニリン、2,4’-(1,3-フェニレンビス(スルファンジイル)ジアニリン、2,3’-(1,3-フェニレンビス(スルファンジイル)ジアニリン、2,2’-(1,3-フェニレンビス(スルファンジイル)ジアニリン、4,4’-(1,2-フェニレンビス(スルファンジイル)ジアニリン、3,4’-(1,2-フェニレンビス(スルファンジイル)ジアニリン、3,3’-(1,2-フェニレンビス(スルファンジイル)ジアニリン、2,4’-(1,2-フェニレンビス(スルファンジイル)ジアニリン、2,3’-(1,2-フェニレンビス(スルファンジイル)ジアニリン、2,2’-(1,2-フェニレンビス(スルファンジイル)ジアニリン、4,4’-(1,4-フェニレンビス(スルホニル)ジアニリン、3,4’-(1,4-フェニレンビス(スルホニル)ジアニリン、3,3’-(1,4-フェニレンビス(スルホニル)ジアニリン、2,4’-(1,4-フェニレンビス(スルホニル)ジアニリン、2,3’-(1,4-フェニレンビス(スルホニル)ジアニリン、2,2’-(1,4-フェニレンビス(スルホニル)ジアニリン、4,4’-(1,3-フェニレンビス(スルホニル)ジアニリン、3,4’-(1,3-フェニレンビス(スルホニル)ジアニリン、3,3’-(1,3-フェニレンビス(スルホニル)ジアニリン、2,4’-(1,3-フェニレンビス(スルホニル)ジアニリン、2,3’-(1,3-フェニレンビス(スルホニル)ジアニリン、2,2’-(1,3-フェニレンビス(スルホニル)ジアニリン、4,4’-(1,2-フェニレンビス(スルホニル)ジアニリン、3,4’-(1,2-フェニレンビス(スルホニル)ジアニリン、3,3’-(1,2-フェニレンビス(スルホニル)ジアニリン、2,4’-(1,2-フェニレンビス(スルホニル)ジアニリン、2,3’-(1,2-フェニレンビス(スルホニル)ジアニリン、2,2’-(1,2-フェニレンビス(スルホニル)ジアニリン等が挙げられる。
また、硬化剤粒子[A2]としては、例えば、4-アミノ-N-[4-[(4-アミノベンゾイル)アミノ]フェニル]ベンズアミド、4-アミノ-N-[3-[(4-アミノベンゾイル)アミノ]フェニル]ベンズアミド、4-アミノ-N-[2-[(4-アミノベンゾイル)アミノ]フェニル]ベンズアミド、3-アミノ-N-[4-[(3-アミノベンゾイル)アミノ]フェニル]ベンズアミド、3-アミノ-N-[3-[(3-アミノベンゾイル)アミノ]フェニル]ベンズアミド、3-アミノ-N-[2-[(3-アミノベンゾイル)アミノ]フェニル]ベンズアミド、2-アミノ-N-[4-[(2-アミノベンゾイル)アミノ]フェニル]ベンズアミド、2-アミノ-N-[3-[(2-アミノベンゾイル)アミノ]フェニル]ベンズアミド、2-アミノ-N-[2-[(2-アミノベンゾイル)アミノ]フェニル]ベンズアミド、3-アミノ-N-[4-[(4-アミノベンゾイル)アミノ]フェニル]ベンズアミド、2-アミノ-N-[4-[(4-アミノベンゾイル)アミノ]フェニル]ベンズアミド、2-アミノ-N-[4-[(3-アミノベンゾイル)アミノ]フェニル]ベンズアミド、3-アミノ-N-[3-[(4-アミノベンゾイル)アミノ]フェニル]ベンズアミド、2-アミノ-N-[3-[(4-アミノベンゾイル)アミノ]フェニル]ベンズアミド、2-アミノ-N-[3-[(3-アミノベンゾイル)アミノ]フェニル]ベンズアミド、3-アミノ-N-[2-[(4-アミノベンゾイル)アミノ]フェニル]ベンズアミド、2-アミノ-N-[2-[(4-アミノベンゾイル)アミノ]フェニル]ベンズアミド、2-アミノ-N-[2-[(3-アミノベンゾイル)アミノ]フェニル]ベンズアミド、4-アミノ-N-[4-[(4-アミノベンゾイル)アミノ]-2-メチルフェニル]ベンズアミド、4-アミノ-N-[4-[(4-アミノ-3-メチルベンゾイル)アミノ]フェニル]-3-メチルベンズアミド、4-アミノ-N-[3-[(4-アミノベンゾイル)アミノ]-2-メチルフェニル]ベンズアミド、4-アミノ-N-[3-[(4-アミノ-3-メチルベンゾイル)アミノ]フェニル]-3-メチルベンズアミド、3-アミノ-N-[4-[(3-アミノベンゾイル)アミノ]-2-メチルフェニル]ベンズアミド、3-アミノ-N-[4-[(3-アミノ-3-メチルベンゾイル)アミノ]フェニル]-3-メチルベンズアミド、1-N,4-N-ビス(4-アミノフェニル)フェニレン-1,4-ジカルボキシアミド、1-N,3-N-ビス(4-アミノフェニル)フェニレン-1,3-ジカルボキシアミド、1-N,2-N-ビス(4-アミノフェニル)フェニレン-1,2-ジカルボキシアミド、1-N,4-N-ビス(3-アミノフェニル)フェニレン-1,4-ジカルボキシアミド、1-N,3-N-ビス(3-アミノフェニル)フェニレン-1,3-ジカルボキシアミド、1-N,2-N-ビス(3-アミノフェニル)フェニレン-1,2-ジカルボキシアミド、1-N,4-N-ビス(2-アミノフェニル)フェニレン-1,4-ジカルボキシアミド、1-N,3-N-ビス(2-アミノフェニル)フェニレン-1,3-ジカルボキシアミド、1-N,2-N-ビス(2-アミノフェニル)フェニレン-1,2-ジカルボキシアミド、1-N,4-N-ビス(4-アミノフェニル)-2-メチルフェニレン-1,4-ジカルボキシアミド、1-N,4-N-ビス(4-アミノ-3-メチルフェニル)フェニレン-1,4-ジカルボキシアミド、1-N,3-N-ビス(4-アミノフェニル)-4-メチルフェニレン-1,3-ジカルボキシアミド、1-N,3-N-ビス(4-アミノ-3-メチルフェニル)フェニレン-1,3-ジカルボキシアミド、1-N,4-N-ビス(3-アミノフェニル)-2-メチルフェニレン-1,4-ジカルボキシアミド、1-N,4-N-ビス(3-アミノ-4-メチルフェニル)フェニレン-1,4-ジカルボキシアミド等が挙げられる。
また、硬化剤[A3]としては、例えば、4-アミノフェニル-4-アミノベンゾエート、4-アミノフェニル-3-アミノベンゾエート、4-アミノフェニル-2-アミノベンゾエート、3-アミノフェニル-4-アミノアミノベンゾエート、3-アミノフェニル-3-アミノアミノベンゾエート、3-アミノフェニル-2-アミノアミノベンゾエート、2-アミノフェニル-4-アミノアミノベンゾエート、2-アミノフェニル-3-アミノアミノベンゾエート、2-アミノフェニル-2-アミノアミノベンゾエート、ビス(4-アミノフェニル)テレフタレート、3-アミノフェニル-4-アミノフェニルテレフタレート、2-アミノフェニル-4-アミノフェニルテレフタレート、ビス(3-アミノフェニル)テレフタレート、2-アミノフェニル-3-アミノフェニルテレフタレート、ビス(3-アミノフェニル)テレフタレート、ビス(4-アミノフェニル)イソフタレート、3-アミノフェニル-4-アミノフェニルイソフタレート、2-アミノフェニル-4-アミノフェニルイソフタレート、ビス(3-アミノフェニル)イソフタレート、2-アミノフェニル-3-アミノフェニルイソフタレート、ビス(3-アミノフェニル)イソフタレート、ビス(4-アミノフェニル)フタレート、3-アミノフェニル-4-アミノフェニルフタレート、2-アミノフェニル-4-アミノフェニルフタレート、ビス(3-アミノフェニル)フタレート、2-アミノフェニル-3-アミノフェニルフタレート、ビス(3-アミノフェニル)フタレート、1,4-フェニレン-ビス(4-アミノベンゾエート)、4-(4-アミノベンゾイロキシ)フェニル-3-アミノベンゾエート、4-(4-アミノベンゾイロキシ)フェニル-2-アミノベンゾエート、1,4-フェニレン-ビス(3-アミノベンゾエート)、4-(3-アミノベンゾイロキシ)フェニル-2-アミノベンゾエート、1,4-フェニレン-ビス(2-アミノベンゾエート)、1,3-フェニレン-ビス(4-アミノベンゾエート)、3-(4-アミノベンゾイロキシ)フェニル-3-アミノベンゾエート、3-(4-アミノベンゾイロキシ)フェニル-2-アミノベンゾエート、1,3-フェニレン-ビス(3-アミノベンゾエート)、3-(3-アミノベンゾイロキシ)フェニル-2-アミノベンゾエート、1,3-フェニレン-ビス(2-アミノベンゾエート)、1,2-フェニレン-ビス(4-アミノベンゾエート)、2-(4-アミノベンゾイロキシ)フェニル-3-アミノベンゾエート、2-(4-アミノベンゾイロキシ)フェニル-2-アミノベンゾエート、1,2-フェニレン-ビス(3-アミノベンゾエート)、2-(3-アミノベンゾイロキシ)フェニル-2-アミノベンゾエート、1,2-フェニレン-ビス(2-アミノベンゾエート)等が挙げられる。なかでも、R1~R6は、他のエポキシ樹脂への相溶性の点からは水素原子であることが好ましい。また、難燃性の点から、R1~R6の一部がClやBrといったハロゲン原子で置換されているものも好ましい形態である。
このような芳香族ジアミン化合物は、4-アミノフェニル-4-アミノベンゾエート、4-アミノフェニル-3-アミノベンゾエート、4-アミノフェニル-2-アミノベンゾエート、3-アミノフェニル-4-アミノベンゾエート、3-アミノフェニル-3-アミノベンゾエート、3-アミノフェニル-2-アミノベンゾエート、2-アミノフェニル-4-アミノベンゾエート、2-アミノフェニル-3-アミノベンゾエート、2-アミノフェニル-2-アミノベンゾエートが列挙される。
<炭素繊維>
・“トレカ”(登録商標)T800G-24K-31E(フィラメント数24,000本、引張強度5.9GPa、引張弾性率294GPa、引張伸度2.0%の炭素繊維、東レ(株)製)。
<成分[A1]または[A2]または[A3]>
・4-APTP(1-N,4-N-ビス(4-アミノフェニル)フェニレン-1,4-ジカルボキシアミド(日本純良薬品(株)製)アミノ基活性水素当量:87(g/eq.)(成分[A1]、成分[A2]のいずれにも該当する。)
・4-ABPA(4-アミノ-N-[4-[(4-アミノベンゾイル)アミノ]フェニル]ベンズアミド(日本純良薬品(株)製)アミノ基活性水素当量:87(g/eq.)(成分[A1]、成分[A2]のいずれにも該当する。)。
・4-BAAB(4-アミノフェニル-4-アミノベンゾエート(日本純良薬品(株)製)アミノ基活性水素当量:57(g/eq.)(成分[A3]に該当する。)。
<成分[B]>
・“アラルダイト”(登録商標)MY721(テトラグリシジルジアミノジフェニルメタン、ハンツマン・アドバンスト・マテリアルズ(株)製)エポキシ当量:113(g/eq.)
・“アラルダイト”(登録商標)MY0600(トリグリシジル-m-アミノフェノール、ハンツマン・アドバンスト・マテリアルズ(株)製)エポキシ当量:106(g/eq.)
・“アラルダイト”(登録商標)MY0510(トリグリシジル-p-アミノフェノール、ハンツマン・アドバンスト・マテリアルズ(株)製)エポキシ当量:106(g/eq.)
・下記方法で合成したN,N,N’,N’-テトラグリシジル-4,4’-ジアミノベンズアニリド。
<その他のエポキシ樹脂>
・“jER”(登録商標)825(ビスフェノールA型エポキシ樹脂、三菱化学(株)製)エポキシ当量:175(g/eq.)
・“jER”(登録商標)828(ビスフェノールA型エポキシ樹脂、三菱化学(株)製)エポキシ当量:190(g/eq.)
・“EPICLON”(登録商標)830(ビスフェノールF型エポキシ樹脂、DIC(株)製)エポキシ当量:172(g/eq.)。
<成分[C]>
・GAN(N-ジグリシジルアニリン、日本化薬(株)製)エポキシ当量:125(g/eq.)
・TORAY EPOXY PG-01(ジグリシジル-p-フェノキシアニリン、東レ・ファインケミカル(株)製)エポキシ当量:164(g/eq.)。
<成分[D]>
・“VIRANTAGE”(登録商標)VW-10700RFP(ポリエーテルスルホン、ソルベイ・アドバンストポリマーズ(株)製)。
<その他の硬化剤>
・セイカキュアS(4,4’-ジアミノジフェニルスルホン、和歌山精化工業(株)製)アミノ基活性水素当量:62(g/eq.)
・3,3’-DAS(3,3’-ジアミノジフェニルスルホン、三井化学ファイン(株)製)アミノ基活性水素当量:62(g/eq.)
・4,4’-DABAN(4,4’-ジアミノベンズアニリド、日本純良薬品(株)製)アミノ基活性水素当量:57(g/eq.)。
(1)成分[A1]または[A2]または[A3]の平均粒径の測定
走査型電子顕微鏡にて粒子を1,000倍に拡大して写真撮影し、無作為に粒子を選び、その粒子の外接する円の直径を粒径とし、その粒径の平均値(n=50)を[A1]または[A2]または[A3]の平均粒径とした。
(2)エポキシ樹脂組成物の調整方法
混練装置で、表1~12に記載の組成と割合のエポキシ樹脂および熱可塑性樹脂を160℃で2時間混練し、熱可塑性樹脂が溶解したことを目視で確認した後、70℃に冷まして硬化剤を配合して混練し、エポキシ樹脂組成物を調整した。
(3)当量比の計算
エポキシ樹脂組成物中の全エポキシ基に対する、全硬化剤成分のアミノ基の活性水素の合計の当量比および、エポキシ樹脂組成物中の全エポキシ基に対する、成分[A1]または[A2]または[A3]またはその他の硬化剤成分のアミノ基の活性水素の合計の当量比は以下の計算式より求めた。表1~12において、成分[A1]または[A2]または[A3]またはその他の硬化剤の当量については、以下の計算から求めた当量比を表す。
成分[A1]または[A2]または[A3]の当量比=(成分[A1]または[A2]または[A3]の質量部/成分[A1]または[A2]または[A3]のアミノ基活性水素当量)/(エポキシ樹脂成分1の質量部/エポキシ樹脂成分1のエポキシ当量+エポキシ樹脂成分2の質量部/エポキシ樹脂成分2のエポキシ当量)
その他の硬化剤の当量比=(その他の硬化剤の質量部/その他の硬化剤のアミノ基活性水素当量)/(エポキシ樹脂成分1の質量部/エポキシ樹脂成分1のエポキシ当量+エポキシ樹脂成分2の質量部/エポキシ樹脂成分2のエポキシ当量)。
(4)エポキシ樹脂組成物の硬化発熱量測定
硬化発熱量は示差走査熱量計DSC(型番:DSC-Q2000、ティー・エイ・インスツルメント社製)により評価を行った。上記(2)の方法で得られたエポキシ樹脂硬化物を、容量50μLの密閉型アルミサンプルパンに5~10mg詰め、昇温速度5℃/分で0℃から300℃まで昇温し、100℃から300℃付近におけるDSC曲線の積分値(即ち、硬化発熱量)を求めた。混合物等で発熱ピークが複数観測される場合は、それらの合計をその組成物の硬化発熱量として採用した。
(5)エポキシ樹脂組成物の硬化物(エポキシ樹脂硬化物)作製
上記(2)の方法で得られたエポキシ樹脂組成物を厚さ2mmの板状キャビティーを備えた型内に注入し、次の条件でオーブン中にて加熱硬化して樹脂硬化板を得た。
(I)30℃から180℃までを速度1.5℃/minで昇温する。
(II)180℃で2時間保持する。
(III)180℃から30℃まで、速度2.5℃/minで降温する。
(6)エポキシ樹脂硬化物の炭素核の緩和時間測定
上記(5)の方法で得られたエポキシ樹脂硬化物を、固体NMRサンプル管の中央に充填し、固体NMR測定装置(Chemagnetics社製CMX-300 Infinity)に供し、観測核を13Cとし、Torchia法により炭素核の緩和時間T1 Cを測定した。詳細な測定条件を下記に示す。測定された炭素核の緩和時間T1 Cの内、硬化剤[A1]または[A2]または[A3]の主骨格のベンゼン環炭素に由来する130ppmのピークに対応した炭素核の緩和時間T1 Cを求めた。
温度:室温
化学シフト基準:シリコンゴム(内部基準:1.56ppm)
観測周波数:13C:75.2MHz
観測幅:30kHz
パルス幅 90°パルス:4.2μs
コンタクトタイム:1.5 ms
試料回転速度:10.5 kHz。
(7)エポキシ樹脂硬化物の曲げ弾性率測定
上記(5)の方法で得た厚さ2mmの樹脂硬化板から、長さ60mm、幅10mmの試験片を切り出し、材料万能試験機(インストロン・ジャパン(株)製、“インストロン”(登録商標)5565型P8564)を用い、試験速度2.5mm/分、支点間距離32mmで3点曲げ試験を行い、JIS K 7171:1994に従い曲げ弾性率を求めた。測定温度は25℃とした。
(8)エポキシ樹脂硬化物のゴム状態弾性率測定
上記(5)の方法で得た厚さ2mmの樹脂硬化板から、長さ55mm、幅12.7mmの試験片を切り出し、JIS K 7244-7:2007に従い、動的粘弾性測定装置(ティー・エイ・インスツルメント社製、ARES-2KFRTN1-FCO-STD)を使用して、ねじり振動周波数1.0Hz、発生トルク3.0×10-4~2.0×10-2N・m、昇温速度5.0℃/minの条件下で、-40~300℃の温度範囲で動的ねじり測定(DMA測定)を行い、-30~290℃の温度範囲における貯蔵弾性率を求めた。得られた温度-貯蔵弾性率曲線において低温側のベースラインと、貯蔵弾性率が急激に変化する部分の曲線の勾配が最大になるような点で引いた接線との交点の温度をガラス転移温度とし、ガラス転移温度を50℃上回る温度での貯蔵弾性率をゴム状態弾性率とした。
(9)プリプレグの作製
上記(2)の方法で得られたエポキシ樹脂組成物を、ナイフコーターを用いて樹脂目付50g/m2で離型紙上にコーティングし、樹脂フィルムを作製した。この樹脂フィルムを、一方向に引き揃えた炭素繊維(目付200g/m2)の両側に重ね合せてヒートロールを用い、温度100℃、1気圧で加熱加圧しながらエポキシ樹脂組成物を炭素繊維に含浸させプリプレグを得た。
(10)炭素繊維強化複合材料の0°の定義
JIS K 7017:1999に記載されているとおり、一方向繊維強化複合材料の繊維方向を軸方向とし、軸方向を0°軸と定義したときの軸直交方向を90°と定義する。
(11)炭素繊維強化複合材料の0°引張強度測定
一方向プリプレグを所定の大きさにカットし、一方向に6枚積層した後、真空バッグを行い、オートクレーブを用いて、温度180℃、圧力6kg/cm2、2時間で硬化させ、一方向強化材(炭素繊維強化複合材料)を得た。この一方向強化材をASTM D3039-00に準拠してタブを接着した後、0°方向を試験片の長さ方向として、長さ254mm、幅12.7mmの矩形試験片を切り出した。得られた0°方向引張試験片を23℃環境下においてASTM D3039-00に準拠し、材料万能試験機(インストロン・ジャパン(株)製、“インストロン”(登録商標)5565型P8564)を用いて、試験速度1.27mm/minで引張試験を実施した。
一方向プリプレグを所定の大きさにカットし、一方向に6枚積層した後、真空バッグを行い、オートクレーブを用いて、温度180℃、圧力6kg/cm2、2時間で硬化させ、一方向強化材(炭素繊維強化複合材料)を得た。この一方向強化材をSACMA-SRM 1R-94に準拠してタブを接着した後、0°方向を試験片の長さ方向として、長さ80mm、幅15.0mmの矩形試験片を切り出した。得られた0°方向圧縮試験片を23℃環境下においてSACMA-SRM 1R-94に準拠し、材料万能試験機(インストロン・ジャパン(株)製、“インストロン”(登録商標)5565型P8564)を用いて、試験速度1.0mm/minで圧縮試験を実施した。
(実施例1)
混練装置で、70質量部のテトラグリシジルジアミノジフェニルメタンと30質量部のビスフェノールA型エポキシ樹脂および15質量部のポリエーテルスルホンを160℃で2時間混練し、ポリエーテルスルホンが溶解したことを目視で確認した後、70℃に冷まして69質量部の1-N,4-N-ビス(4-アミノフェニル)フェニレン-1,4-ジカルボキシアミド(平均粒径3μm)を配合して混練し、エポキシ樹脂組成物を得た。表1に組成と割合を示す(表1において、数字は各成分の質量部を表す)。
(実施例2~6、比較例1~10)
エポキシ樹脂と硬化剤の種類および配合量を、表1、9に示すように変更したこと以外は、実施例1と同様の方法でエポキシ樹脂硬化物、プリプレグおよび炭素繊維強化複合材料を作製し、曲げ弾性率、ゴム状態弾性率、0°引張強度、0°圧縮強度を測定した。結果を表1、9に示す。実施例1~6では成分[A1]または[A2]として、4-APTP(平均粒径3μm)を用いることで、低いゴム状態弾性率と高い曲げ弾性率を示した。さらに、0°引張強度、0°圧縮強度とも高い値を示した。1-N,4-N-ビス(4-アミノフェニル)フェニレン-1,4-ジカルボキシアミド(平均粒径3μm)に代えて、4,4’-ジアミノジフェニルスルホン、3,3’-ジアミノジフェニルスルホン、4,4’-ジアミノベンズアニリドを用いた比較例1~10では、実施例1~6と対比して曲げ弾性率が低く、0°引張強度、0°圧縮強度とも低い値であった。
(実施例7~11、比較例11~16)
エポキシ樹脂と硬化剤の種類および配合量を、表1、2、10に示すように変更したこと以外は、実施例1と同様の方法でエポキシ樹脂硬化物、プリプレグおよび炭素繊維強化複合材料を作製し、曲げ弾性率、ゴム状態弾性率、0°引張強度、0°圧縮強度を測定した。結果を表1、2、10に示す。実施例7~11は低いゴム状態弾性率と高い曲げ弾性率を示した。テトラグリシジルジアミノジフェニルメタンの割合増加に伴い、曲げ弾性率、ゴム状態弾性率とも上昇する傾向を示し、0°圧縮強度が向上する傾向が見られた。1-N,4-N-ビス(4-アミノフェニル)フェニレン-1,4-ジカルボキシアミド(平均粒径3μm)に代えて、4,4’-ジアミノジフェニルスルホン、3,3’-ジアミノジフェニルスルホン、4,4’-ジアミノベンズアニリドを用いた比較例11~16では、実施例7~11と対比して曲げ弾性率が低く、0°引張強度、0°圧縮強度とも低い値であった。
(実施例12~15)
エポキシ樹脂と硬化剤の種類および配合量を、表2に示すように変更したこと以外は、実施例1と同様の方法でエポキシ樹脂硬化物、プリプレグおよび炭素繊維強化複合材料を作製し、曲げ弾性率、ゴム状態弾性率、0°引張強度、0°圧縮強度を測定した。結果を表2に示す。実施例12~15では、低いゴム状態弾性率と高い曲げ弾性率を示し、0°引張強度、0°圧縮強度とも高い値を示した。エポキシ樹脂組成物中の全エポキシ基に対する1-N,4-N-ビス(4-アミノフェニル)フェニレン-1,4-ジカルボキシアミド(平均粒径3μm)のアミノ基の活性水素の合計の当量比を0.7~1.3の範囲とすることにより、0°引張強度と0°圧縮強度のバランスが優れる傾向にあった。
(実施例16、17)
エポキシ樹脂と硬化剤の種類および配合量を、表2に示すように変更したこと以外は、実施例1と同様の方法でエポキシ樹脂硬化物、プリプレグおよび炭素繊維強化複合材料を作製し、曲げ弾性率、ゴム状態弾性率、0°引張強度、0°圧縮強度を測定した。結果を表2に示す。実施例16、17では、低いゴム状態弾性率と高い曲げ弾性率を示し、0°引張強度、0°圧縮強度とも高い値を示した。1-N,4-N-ビス(4-アミノフェニル)フェニレン-1,4-ジカルボキシアミド(平均粒径3μm)に代えて、一部4,4’-ジアミノベンズアニリドまたは4,4’-ジアミノジフェニルスルホンを用いたことで、実施例1と対比して樹脂弾性率が低下し、0°圧縮強度が低下する傾向にあった。
(実施例18~23)
エポキシ樹脂と硬化剤の種類および配合量を、表2、3に示すように変更したこと以外は、実施例1と同様の方法でエポキシ樹脂硬化物、プリプレグおよび炭素繊維強化複合材料を作製し、曲げ弾性率、ゴム状態弾性率、0°引張強度、0°圧縮強度を測定した。結果を表2、3に示す。実施例18~23では、低いゴム状態弾性率と高い曲げ弾性率を示し、0°引張強度、0°圧縮強度とも高い値を示した。
(比較例17~20)
エポキシ樹脂と硬化剤の種類および配合量を、表10に示すように変更したこと以外は、実施例1と同様の方法でエポキシ樹脂硬化物、プリプレグおよび炭素繊維強化複合材料を作製し、曲げ弾性率、ゴム状態弾性率、0°引張強度、0°圧縮強度を測定した。結果を表10に示す。比較例17~20では、[B]の成分を含まないため、実施例1、2および実施例18、19と対比して曲げ弾性率が低く、0°引張強度、0°圧縮強度とも低い傾向にあった。
(実施例24~29)
エポキシ樹脂と硬化剤の種類および配合量を、表3に示すように変更したこと以外は、実施例1と同様の方法でエポキシ樹脂硬化物、プリプレグおよび炭素繊維強化複合材料を作製し、曲げ弾性率、ゴム状態弾性率、0°引張強度、0°圧縮強度を測定した。結果を表3に示す。実施例24~29では、低いゴム状態弾性率と高い曲げ弾性率を示し、0°引張強度、0°圧縮強度とも高い値を示した。実施例24~29では、1-N,4-N-ビス(4-アミノフェニル)フェニレン-1,4-ジカルボキシアミドの平均粒径を3μmから18μmに変更したことで、実施例1~6と対比して曲げ弾性率が低下し、0°圧縮強度が若干低下する傾向にあった。
(実施例30~32)
エポキシ樹脂と硬化剤の種類および配合量を、表3、4に示すように変更したこと以外は、実施例1と同様の方法でエポキシ樹脂硬化物、プリプレグおよび炭素繊維強化複合材料を作製し、曲げ弾性率、ゴム状態弾性率、0°引張強度、0°圧縮強度を測定した。結果を表3、4に示す。実施例30~32では、低いゴム状態弾性率と高い曲げ弾性率を示し、0°引張強度、0°圧縮強度とも高い値を示した。実施例1および実施例30~32では、ポリエーテルスルホンの配合量が増加することで0°引張強度が向上する傾向が見られた。
(実施例33~36)
エポキシ樹脂と硬化剤の種類および配合量を、表4に示すように変更したこと以外は、実施例1と同様の方法でエポキシ樹脂硬化物、プリプレグおよび炭素繊維強化複合材料を作製し、曲げ弾性率、ゴム状態弾性率、0°引張強度、0°圧縮強度を測定した。結果を表4に示す。実施例33~36では、低いゴム状態弾性率と高い曲げ弾性率を示し、0°引張強度、0°圧縮強度とも高い値を示した。
(比較例21、22)
エポキシ樹脂と硬化剤の種類および配合量を、表10に示すように変更したこと以外は、実施例1と同様の方法でエポキシ樹脂硬化物の作製を行ったところ、1-N,4-N-ビス(4-アミノフェニル)フェニレン-1,4-ジカルボキシアミド(平均粒径30μm)のエポキシ樹脂への溶解性が低く、硬化反応が十分に進行しなかったため、エポキシ樹脂硬化物が得られなかった。上記(9)の方法でプリプレグを作製した後、上記(10)、(11)の方法で炭素繊維強化複合材料を作製する際も同様に、1-N,4-N-ビス(4-アミノフェニル)フェニレン-1,4-ジカルボキシアミド(平均粒径30μm)のエポキシ樹脂への溶解性が低く、硬化反応が十分に進行しなかったため、炭素繊維強化複合材料が得られなかった。
(実施例37)
混練装置で、60質量部のテトラグリシジルジアミノジフェニルメタン、20質量部のビスフェノールA型エポキシ樹脂、20質量部のビスフェノールF型エポキシ樹脂、および15質量部のポリエーテルスルホンを160℃で2時間混練し、ポリエーテルスルホンが溶解したことを目視で確認した後、70℃に冷まして46質量部の1-N,4-N-ビス(4-アミノフェニル)フェニレン-1,4-ジカルボキシアミド(平均粒径3μm)を配合して混練し、エポキシ樹脂組成物を得た。表5に組成と割合を示す(表5において、数字は各成分の質量部を表す)。
(実施例38~40、実施例44~48、比較例23~35)
エポキシ樹脂と硬化剤の種類および配合量を、表5、6、11、12に示すように変更したこと以外は、実施例37と同様の方法でエポキシ樹脂硬化物、プリプレグおよび炭素繊維強化複合材料を作製し、炭素核の緩和時間T1 C、硬化発熱量、ゴム状態弾性率、0°引張強度、0°圧縮強度を測定した。結果を表5、6、11、12に示す。実施例37~40、実施例44~48では成分[A1]または[A2]として、1-N,4-N-ビス(4-アミノフェニル)フェニレン-1,4-ジカルボキシアミド(平均粒径3μm)を用いることで、長い炭素核の緩和時間T1Cと低い硬化発熱量と低いゴム状態弾性率を示した。さらに、0°引張強度、0°圧縮強度とも高い値を示した。1-N,4-N-ビス(4-アミノフェニル)フェニレン-1,4-ジカルボキシアミド(平均粒径3μm)に代えて、4,4’-ジアミノジフェニルスルホン、3,3’-ジアミノジフェニルスルホン、4,4’-ジアミノベンズアニリドを用いた比較例23~35では、実施例37~40、実施例44~48と対比して短い炭素核の緩和時間T1 Cと高い硬化発熱量と高いゴム状態弾性率を示し、0°引張強度、0°圧縮強度とも低い値であった。
(実施例52~55、実施例58~61)
エポキシ樹脂と硬化剤の種類および配合量を、表6、7に示すように変更したこと以外は、実施例37と同様の方法でエポキシ樹脂硬化物、プリプレグおよび炭素繊維強化複合材料を作製し、炭素核の緩和時間T1 C、硬化発熱量、ゴム状態弾性率、0°引張強度、0°圧縮強度を測定した。結果を表6、7に示す。実施例52~55、実施例58~61では、長い炭素核の緩和時間T1 Cと低い硬化発熱量と低いゴム状態弾性率を示し、0°引張強度、0°圧縮強度とも高い値を示した。エポキシ樹脂組成物中の全エポキシ基に対する1-N,4-N-ビス(4-アミノフェニル)フェニレン-1,4-ジカルボキシアミド(平均粒径3μm)のアミノ基の活性水素の合計の当量比を0.5~0.9の範囲とすることにより、0°引張強度と0°圧縮強度のバランスが優れる傾向にあった。
(実施例56、57、62、63)
エポキシ樹脂と硬化剤の種類および配合量を、表6、7に示すように変更したこと以外は、実施例37と同様の方法でエポキシ樹脂硬化物、プリプレグおよび炭素繊維強化複合材料を作製し、炭素核の緩和時間T1 C、硬化発熱量、ゴム状態弾性率、0°引張強度、0°圧縮強度を測定した。結果を表6、7に示す。実施例56、57、62、63では、長い炭素核の緩和時間T1 Cと低い硬化発熱量と低いゴム状態弾性率を示し、0°引張強度、0°圧縮強度とも高い値を示した。1-N,4-N-ビス(4-アミノフェニル)フェニレン-1,4-ジカルボキシアミド(平均粒径3μm)に代えて、一部4,4’-ジアミノベンズアニリドまたは4,4’-ジアミノジフェニルスルホンを用いたことで、実施例37および実施例44と対比して炭素核の緩和時間T1 Cが短くなり、0°圧縮強度が低下する傾向にあった。
(実施例41、49、66、73、74)
エポキシ樹脂と硬化剤の種類および配合量を、表5~8に示すように変更したこと以外は、実施例37と同様の方法でエポキシ樹脂硬化物、プリプレグおよび炭素繊維強化複合材料を作製し、炭素核の緩和時間T1 C、硬化発熱量、ゴム状態弾性率、0°引張強度、0°圧縮強度を測定した。結果を表5~8に示す。実施例41、49、66、73、74では、長い炭素核の緩和時間T1 Cと低い硬化発熱量と低いゴム状態弾性率を示し、0°引張強度、0°圧縮強度とも高い値を示した。
(実施例42、50)
エポキシ樹脂と硬化剤の種類および配合量を、表5、6に示すように変更したこと以外は、実施例37と同様の方法でエポキシ樹脂硬化物、プリプレグおよび炭素繊維強化複合材料を作製し、炭素核の緩和時間T1 C、ゴム状態弾性率、0°引張強度、0°圧縮強度を測定した。結果を表5、6に示す。実施例42、50では成分は[A3]として、4-アミノフェニル-4-アミノベンゾエート(平均粒径3μm)を用いることで、長い炭素核の緩和時間T1 Cと低いゴム状態弾性率を示し、0°引張強度、0°圧縮強度とも高い値を示した。
(実施例43、51)
エポキシ樹脂と硬化剤の種類および配合量を、表5、6に示すように変更したこと以外は、実施例37と同様の方法でエポキシ樹脂硬化物、プリプレグおよび炭素繊維強化複合材料を作製し、炭素核の緩和時間T1 C、硬化発熱量、ゴム状態弾性率、0°引張強度、0°圧縮強度を測定した。結果を表5、6に示す。実施例43、51では、長い炭素核の緩和時間T1 Cと低い硬化発熱量と低いゴム状態弾性率を示し、0°引張強度、0°圧縮強度とも高い値を示した。実施例43、51では、1-N,4-N-ビス(4-アミノフェニル)フェニレン-1,4-ジカルボキシアミドの平均粒径を3μmから18μmに変更したことで、実施例37、44と対比して炭素核の緩和時間T1 Cが短くなり、0°圧縮強度が若干低下する傾向にあった。
(実施例64、65)
エポキシ樹脂と硬化剤の種類および配合量を、表7に示すように変更したこと以外は、実施例37と同様の方法でエポキシ樹脂硬化物、プリプレグおよび炭素繊維強化複合材料を作製し、炭素核の緩和時間T1 C、硬化発熱量、ゴム状態弾性率、0°引張強度、0°圧縮強度を測定した。結果を表7に示す。実施例64、65では、長い炭素核の緩和時間T1 Cと低い硬化発熱量と低いゴム状態弾性率を示し、0°引張強度、0°圧縮強度とも高い値を示した。実施例64、65では、N,N,N’,N’-テトラグリシジル-4,4’-ジアミノベンズアニリドの割合増加に伴い、炭素核の緩和時間T1 C、ゴム状態弾性率とも上昇する傾向を示し、0°圧縮強度が向上する傾向が見られた。
(実施例67~72)
エポキシ樹脂と硬化剤の種類および配合量を、表8に示すように変更したこと以外は、実施例37と同様の方法でエポキシ樹脂硬化物、プリプレグおよび炭素繊維強化複合材料を作製し、炭素核の緩和時間T1 C、硬化発熱量、ゴム状態弾性率、0°引張強度、0°圧縮強度を測定した。結果を表8に示す。実施例67~72では、長い炭素核の緩和時間T1 Cと低い硬化発熱量と低いゴム状態弾性率を示し、0°引張強度、0°圧縮強度とも高い値を示した。実施例37、実施例44および実施例67~72では、ポリエーテルスルホンの配合量が増加することで0°引張強度が向上する傾向が見られた。
(比較例36~39)
エポキシ樹脂と硬化剤の種類および配合量を、表12に示すように変更したこと以外は、実施例37と同様の方法でエポキシ樹脂硬化物、プリプレグおよび炭素繊維強化複合材料を作製し、炭素核の緩和時間T1 C、硬化発熱量、ゴム状態弾性率、0°引張強度、0°圧縮強度を測定した。結果を表12に示す。比較例36~38では、[A1]または[A2]および[C]の成分を含まないため、実施例37および実施例44と対比して高いゴム状態弾性率と、高い硬化発熱量を示し、0°引張強度が低下する傾向にあった。比較例39では、[B]の成分を含まないため、実施例37および実施例44と対比して短い炭素核の緩和時間T1 Cを示し、0°圧縮強度が低下する傾向にあった。
Claims (28)
- 少なくとも下記[A1]、[B]を含むエポキシ樹脂組成物であり、固体13C-NMRスペクトルで130ppmに帰属される式(1)の主骨格のベンゼン環炭素に対応した炭素核の緩和時間T1 Cが42秒以上であるエポキシ樹脂組成物。
[A1]:式(1)で表される硬化剤
(ただし式中、Xは、-CH2-、-O-、-CO-、-C(=O)O-、-S-、-SO2-、-NHC(=O)-から選ばれる1つ、nは1~5を表す。さらに、R1~R6は、水素原子、炭素数1~4の脂肪族炭化水素基、炭素数4以下の脂環式炭化水素基、およびハロゲン原子からなる群から選ばれた少なくとも一つを表す。式中のXが、-C(=O)O-、-NHC(=O)-である場合、その向きはどちらでも良い。)
[B]:3官能以上の芳香族エポキシ樹脂 - [A1]成分の粒子の平均粒径が20μm未満である請求項1に記載のエポキシ樹脂組成物。
- 固体13C-NMRスペクトルで130ppmに帰属される式(1)の主骨格のベンゼン環炭素に対応した炭素核の緩和時間T1 Cが48秒以上である請求項1または2に記載のエポキシ樹脂組成物。
- [A1]成分において、式(1)のXが-NHC(=O)-である請求項1~3のいずれかに記載のエポキシ樹脂組成物。
- [A1]成分において、式(2)または式(3)のnが1~3である請求項1~5のいずれかに記載のエポキシ樹脂組成物。
- 示差走査熱量測定(DSC)により、昇温速度5℃/分にて測定した硬化発熱量が450J/g未満である請求項1~8のいずれかに記載のエポキシ樹脂組成物。
- [A3]成分において、式(7)のnが0である請求項10に記載のエポキシ樹脂組成物。
- [B]成分において、式(8)のTが-SO2-、または-NHC(=O)-である、請求項12に記載のエポキシ樹脂組成物。
- エポキシ樹脂組成物中のエポキシ樹脂総量に対して、[B]成分の配合量が40~90質量%である請求項1~13のいずれかに記載のエポキシ樹脂組成物。
- エポキシ樹脂組成物中の全エポキシ基に対する、[A1]または[A2]または[A3]成分のアミノ基の活性水素の合計の等量比が0.5~0.9である請求項1~14のいずれかに記載のエポキシ樹脂組成物。
- さらに下記[C]成分を含む請求項1~15のいずれかに記載のエポキシ樹脂組成物。
[C]:4員環以上の環構造を1つ以上有し、かつ、環構造に直結したアミン型グリシジル基またはエーテル型グリシジル基を1個または2個有するエポキシ樹脂 - [C]成分が式(9)で表される構造を有するエポキシ樹脂を含む請求項16に記載のエポキシ樹脂組成物。
(ただし式中、R1とR2は、それぞれ炭素数1~4の脂肪族炭化水素基、炭素数3~6の脂環式炭化水素基、炭素数6~10の芳香族炭化水素基、ハロゲン原子、アシル基、トリフルオロメチル基およびニトロ基からなる群から選ばれた少なくとも一つを表す。nは0~4の整数、mは0~5の整数である。R1とR2が複数存在する場合、それぞれ同じであっても異なっていてもよい。Qは、-O-、-S-、-CO-、-C(=O)O-、-SO2-、-NHC(=O)-から選ばれる1つを表す。式中のQが、-C(=O)O-、-NHC(=O)-である場合、その向きはどちらでも良い。) - エポキシ樹脂組成物中のエポキシ樹脂総量に対して、[B]成分の配合量が40~90質量%、[C]成分の配合量が10~60質量%である請求項16または17に記載のエポキシ樹脂組成物。
- 硬化剤としてジアミノジフェニルスルホンを含む請求項1~18のいずれかに記載のエポキシ樹脂組成物。
- 180℃で2時間硬化したエポキシ樹脂硬化物のゴム状態弾性率が15MPa以下である請求項1~19のいずれかに記載のエポキシ樹脂組成物。
- 180℃で2時間硬化したエポキシ樹脂硬化物の曲げ弾性率が4.5GPa以上である請求項1~19のいずれかに記載のエポキシ樹脂組成物。
- 180℃で2時間硬化したエポキシ樹脂硬化物のゴム状態弾性率が15MPa以下であり、かつ、曲げ弾性率が4.5GPa以上である請求項1~19に記載のエポキシ樹脂組成物。
- さらに、エポキシ樹脂組成物に溶解可能な熱可塑性樹脂[D]を含む請求項1~22のいずれかに記載のエポキシ樹脂組成物。
- エポキシ樹脂総量100質量部に対して[D]成分を1~40質量部含む請求項23に記載のエポキシ樹脂組成物。
- さらに、熱可塑性樹脂粒子[E]を含む請求項1~24のいずれかに記載のエポキシ樹脂組成物。
- 請求項1~25のいずれかに記載のエポキシ樹脂組成物を炭素繊維に含浸させてなるプリプレグ。
- 請求項26に記載のプリプレグを硬化させて得られる炭素繊維強化複合材料。
- 請求項1~27のいずれかに記載のエポキシ樹脂組成物を硬化してなるエポキシ樹脂硬化物および炭素繊維を含んでなる炭素繊維強化複合材料。
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014538004A JP6406012B2 (ja) | 2013-07-11 | 2014-07-10 | エポキシ樹脂組成物、プリプレグおよび炭素繊維強化複合材料 |
| EP14823216.8A EP3020763B1 (en) | 2013-07-11 | 2014-07-10 | Epoxy resin composition, prepreg, and carbon fiber-reinforced composite material |
| US14/896,865 US10400076B2 (en) | 2013-07-11 | 2014-07-10 | Epoxy resin composition, prepreg, and carbon fiber-reinforced composite material |
| CN201480037947.8A CN105392838B (zh) | 2013-07-11 | 2014-07-10 | 环氧树脂组合物、预浸料坯及碳纤维增强复合材料 |
| KR1020167002473A KR20160030208A (ko) | 2013-07-11 | 2014-07-10 | 에폭시 수지 조성물, 프리프레그 및 탄소 섬유 강화 복합 재료 |
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013-145275 | 2013-07-11 | ||
| JP2013145275 | 2013-07-11 | ||
| JP2014-080800 | 2014-04-10 | ||
| JP2014080800 | 2014-04-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2015005411A1 true WO2015005411A1 (ja) | 2015-01-15 |
Family
ID=52280089
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/JP2014/068387 Ceased WO2015005411A1 (ja) | 2013-07-11 | 2014-07-10 | エポキシ樹脂組成物、プリプレグおよび炭素繊維強化複合材料 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US10400076B2 (ja) |
| EP (1) | EP3020763B1 (ja) |
| JP (1) | JP6406012B2 (ja) |
| KR (1) | KR20160030208A (ja) |
| CN (1) | CN105392838B (ja) |
| WO (1) | WO2015005411A1 (ja) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016204173A1 (ja) * | 2015-06-19 | 2016-12-22 | 東レ株式会社 | エポキシ樹脂組成物、プリプレグおよび繊維強化複合材料 |
| JP2017008316A (ja) * | 2015-06-25 | 2017-01-12 | 東レ株式会社 | エポキシ樹脂組成物、繊維強化複合材料、成形品および圧力容器 |
| JP2017020004A (ja) * | 2015-07-09 | 2017-01-26 | 東レ株式会社 | エポキシ樹脂組成物、プリプレグおよび繊維強化複合材料 |
| JP2017039875A (ja) * | 2015-08-21 | 2017-02-23 | 東レ株式会社 | エポキシ樹脂組成物、樹脂硬化物、プリプレグおよび繊維強化複合材料 |
| JP2017119813A (ja) * | 2015-06-25 | 2017-07-06 | 東レ株式会社 | エポキシ樹脂組成物、繊維強化複合材料、成形品および圧力容器 |
| JP2017119812A (ja) * | 2015-06-25 | 2017-07-06 | 東レ株式会社 | エポキシ樹脂組成物、繊維強化複合材料、成形品および圧力容器 |
| EP3214103A4 (en) * | 2014-10-29 | 2017-11-29 | Toray Industries, Inc. | Epoxy resin composition, cured resin, prepreg and fiber-reinforced composite material |
| US10040897B2 (en) | 2014-02-06 | 2018-08-07 | Hexcel Composites | Amino benzoates or benzamides as curing agents for epoxy resins |
| US20210355269A1 (en) * | 2016-07-25 | 2021-11-18 | The Boeing Company | Epoxy resin |
| JP7638452B1 (ja) * | 2024-02-16 | 2025-03-03 | 三菱電機株式会社 | エポキシ樹脂組成物、樹脂硬化物、樹脂シート、パワーモジュールおよびモータ用ステータ |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9637586B2 (en) * | 2015-02-12 | 2017-05-02 | Uop Llc | High temperature resistant epoxy resins for producing hollow fiber membrane modules for high temperature gas separation applications |
| RU2019125620A (ru) * | 2017-01-19 | 2021-02-19 | Торэй Индастриз, Инк. | Препрег, способ его получения и разрезной ленточный препрег |
| CN112313078A (zh) * | 2018-06-26 | 2021-02-02 | 东丽株式会社 | 预浸料坯及其制造方法、分切带预浸料坯、碳纤维增强复合材料 |
| WO2021167967A1 (en) | 2020-02-18 | 2021-08-26 | Building Materials Investment Corporation | Matrix assisted two component roof coating system and method |
| CN111303081B (zh) * | 2020-03-27 | 2022-02-01 | 中国科学院化学研究所 | 一种高强高模环氧树脂组合物及其制备方法与应用 |
| US11643555B2 (en) * | 2020-04-15 | 2023-05-09 | Elkem Silicones USA Corp. | Use of aryl group containing organopolysiloxane gums as additives to increase rheological behavior |
| CN113651947A (zh) * | 2021-07-28 | 2021-11-16 | 华南理工大学 | 一种本征导热环氧树脂固化物及其制备方法 |
Citations (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59215314A (ja) * | 1983-05-20 | 1984-12-05 | アモコ・コーポレイション | 予備含浸強化材及びそれから作る高力複合材料 |
| JPS6134021A (ja) * | 1984-07-05 | 1986-02-18 | バスフ アクチェン ゲゼルシャフト | エポキシ樹脂をベ−スとする硬化可能な組成物 |
| JPH01104624A (ja) | 1987-10-16 | 1989-04-21 | Toray Ind Inc | 樹脂微粒子を用いたプリプレグ |
| JPH02133422A (ja) * | 1988-11-14 | 1990-05-22 | Mitsubishi Heavy Ind Ltd | エポキシ樹脂用硬化剤 |
| WO1996017006A1 (en) | 1994-12-02 | 1996-06-06 | Toray Industries, Inc. | Prepreg and fiber-reinforced composite material |
| JPH08325394A (ja) * | 1995-06-01 | 1996-12-10 | Toray Ind Inc | プリプレグおよび繊維強化複合材料 |
| JPH09235397A (ja) | 1996-03-01 | 1997-09-09 | Toray Ind Inc | プリプレグおよび繊維強化プラスチック |
| JPH11241230A (ja) | 1997-12-11 | 1999-09-07 | Toray Ind Inc | 炭素繊維、炭素繊維用前駆体繊維、複合材料および炭素繊 維の製造方法 |
| JP2002363253A (ja) | 2001-06-12 | 2002-12-18 | Toray Ind Inc | エポキシ樹脂組成物、プリプレグおよび繊維強化複合材料 |
| JP2003026768A (ja) | 2001-07-13 | 2003-01-29 | Toray Ind Inc | エポキシ樹脂組成物、プリプレグおよび繊維強化複合材料 |
| JP2004035702A (ja) * | 2002-07-03 | 2004-02-05 | Toray Ind Inc | 繊維強化複合材料用エポキシ樹脂組成物、繊維強化複合材料および繊維強化複合材料の製造方法 |
| JP2004506789A (ja) | 2000-08-22 | 2004-03-04 | サイテク・テクノロジー・コーポレーシヨン | 分子鎖連結に適した組成物 |
| JP2011079983A (ja) * | 2009-10-08 | 2011-04-21 | Toray Ind Inc | 炭素繊維強化複合材料用エポキシ樹脂組成物、プリプレグおよび炭素繊維強化複合材料 |
| WO2011118106A1 (ja) * | 2010-03-23 | 2011-09-29 | 東レ株式会社 | 炭素繊維強化複合材料用エポキシ樹脂組成物、プリプレグおよび炭素繊維強化複合材料 |
| JP2012046634A (ja) * | 2010-08-26 | 2012-03-08 | Panasonic Electric Works Co Ltd | 半導体封止用エポキシ樹脂組成物とそれを用いた半導体装置 |
| JP2013018928A (ja) * | 2011-07-14 | 2013-01-31 | Sumitomo Bakelite Co Ltd | 積層板用エポキシ樹脂組成物、プリプレグ、積層板、プリント配線板、および半導体パッケージ |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02135217A (ja) * | 1988-11-16 | 1990-05-24 | Mitsubishi Heavy Ind Ltd | エポキシ樹脂 |
| US8685537B2 (en) * | 2009-03-16 | 2014-04-01 | Toray Industries, Inc. | Fiber reinforced resin composition, molding material, and method for producing fiber reinforced resin composition |
| CA2750631A1 (en) * | 2009-03-24 | 2010-09-30 | Toray Industries, Inc. | Epoxy resin composition for fiber-reinforced composite material, prepreg, and fiber-reinforced composite material |
| JP5614280B2 (ja) * | 2009-03-25 | 2014-10-29 | 東レ株式会社 | エポキシ樹脂組成物、プリプレグ、炭素繊維強化複合材料および電子電気部品筐体 |
| WO2012111764A1 (ja) * | 2011-02-16 | 2012-08-23 | 三菱レイヨン株式会社 | 繊維強化複合材料を得る製造方法、およびそれに用いるエポキシ樹脂組成物 |
| GB201402053D0 (en) * | 2014-02-06 | 2014-03-26 | Hexcel Composites Ltd | Amino benzoates or benzamides as curing agents for epoxy resins |
-
2014
- 2014-07-10 CN CN201480037947.8A patent/CN105392838B/zh not_active Expired - Fee Related
- 2014-07-10 KR KR1020167002473A patent/KR20160030208A/ko not_active Withdrawn
- 2014-07-10 WO PCT/JP2014/068387 patent/WO2015005411A1/ja not_active Ceased
- 2014-07-10 EP EP14823216.8A patent/EP3020763B1/en not_active Not-in-force
- 2014-07-10 JP JP2014538004A patent/JP6406012B2/ja not_active Expired - Fee Related
- 2014-07-10 US US14/896,865 patent/US10400076B2/en not_active Expired - Fee Related
Patent Citations (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59215314A (ja) * | 1983-05-20 | 1984-12-05 | アモコ・コーポレイション | 予備含浸強化材及びそれから作る高力複合材料 |
| JPS6134021A (ja) * | 1984-07-05 | 1986-02-18 | バスフ アクチェン ゲゼルシャフト | エポキシ樹脂をベ−スとする硬化可能な組成物 |
| JPH01104624A (ja) | 1987-10-16 | 1989-04-21 | Toray Ind Inc | 樹脂微粒子を用いたプリプレグ |
| JPH02133422A (ja) * | 1988-11-14 | 1990-05-22 | Mitsubishi Heavy Ind Ltd | エポキシ樹脂用硬化剤 |
| WO1996017006A1 (en) | 1994-12-02 | 1996-06-06 | Toray Industries, Inc. | Prepreg and fiber-reinforced composite material |
| JPH08325394A (ja) * | 1995-06-01 | 1996-12-10 | Toray Ind Inc | プリプレグおよび繊維強化複合材料 |
| JPH09235397A (ja) | 1996-03-01 | 1997-09-09 | Toray Ind Inc | プリプレグおよび繊維強化プラスチック |
| JPH11241230A (ja) | 1997-12-11 | 1999-09-07 | Toray Ind Inc | 炭素繊維、炭素繊維用前駆体繊維、複合材料および炭素繊 維の製造方法 |
| JP2004506789A (ja) | 2000-08-22 | 2004-03-04 | サイテク・テクノロジー・コーポレーシヨン | 分子鎖連結に適した組成物 |
| JP2002363253A (ja) | 2001-06-12 | 2002-12-18 | Toray Ind Inc | エポキシ樹脂組成物、プリプレグおよび繊維強化複合材料 |
| JP2003026768A (ja) | 2001-07-13 | 2003-01-29 | Toray Ind Inc | エポキシ樹脂組成物、プリプレグおよび繊維強化複合材料 |
| JP2004035702A (ja) * | 2002-07-03 | 2004-02-05 | Toray Ind Inc | 繊維強化複合材料用エポキシ樹脂組成物、繊維強化複合材料および繊維強化複合材料の製造方法 |
| JP2011079983A (ja) * | 2009-10-08 | 2011-04-21 | Toray Ind Inc | 炭素繊維強化複合材料用エポキシ樹脂組成物、プリプレグおよび炭素繊維強化複合材料 |
| WO2011118106A1 (ja) * | 2010-03-23 | 2011-09-29 | 東レ株式会社 | 炭素繊維強化複合材料用エポキシ樹脂組成物、プリプレグおよび炭素繊維強化複合材料 |
| JP2012046634A (ja) * | 2010-08-26 | 2012-03-08 | Panasonic Electric Works Co Ltd | 半導体封止用エポキシ樹脂組成物とそれを用いた半導体装置 |
| JP2013018928A (ja) * | 2011-07-14 | 2013-01-31 | Sumitomo Bakelite Co Ltd | 積層板用エポキシ樹脂組成物、プリプレグ、積層板、プリント配線板、および半導体パッケージ |
Cited By (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10040897B2 (en) | 2014-02-06 | 2018-08-07 | Hexcel Composites | Amino benzoates or benzamides as curing agents for epoxy resins |
| EP3214103A4 (en) * | 2014-10-29 | 2017-11-29 | Toray Industries, Inc. | Epoxy resin composition, cured resin, prepreg and fiber-reinforced composite material |
| CN107531879A (zh) * | 2015-06-19 | 2018-01-02 | 东丽株式会社 | 环氧树脂组合物、预浸料坯及纤维增强复合材料 |
| EP3312210A4 (en) * | 2015-06-19 | 2018-12-05 | Toray Industries, Inc. | Epoxy resin composition, prepreg, and fiber-reinforced composite material |
| US20180134837A1 (en) * | 2015-06-19 | 2018-05-17 | Toray Industries, Inc. | Epoxy resin composition, prepreg and fiber-reinforced composite material |
| WO2016204173A1 (ja) * | 2015-06-19 | 2016-12-22 | 東レ株式会社 | エポキシ樹脂組成物、プリプレグおよび繊維強化複合材料 |
| JPWO2016204173A1 (ja) * | 2015-06-19 | 2018-04-05 | 東レ株式会社 | エポキシ樹脂組成物、プリプレグおよび繊維強化複合材料 |
| JP2017119813A (ja) * | 2015-06-25 | 2017-07-06 | 東レ株式会社 | エポキシ樹脂組成物、繊維強化複合材料、成形品および圧力容器 |
| KR20180022778A (ko) * | 2015-06-25 | 2018-03-06 | 도레이 카부시키가이샤 | 에폭시 수지 조성물, 섬유 강화 복합 재료, 성형품 및 압력 용기 |
| JP2017119812A (ja) * | 2015-06-25 | 2017-07-06 | 東レ株式会社 | エポキシ樹脂組成物、繊維強化複合材料、成形品および圧力容器 |
| JP2017008316A (ja) * | 2015-06-25 | 2017-01-12 | 東レ株式会社 | エポキシ樹脂組成物、繊維強化複合材料、成形品および圧力容器 |
| KR102625584B1 (ko) | 2015-06-25 | 2024-01-17 | 도레이 카부시키가이샤 | 에폭시 수지 조성물, 섬유 강화 복합 재료, 성형품 및 압력 용기 |
| JP2017020004A (ja) * | 2015-07-09 | 2017-01-26 | 東レ株式会社 | エポキシ樹脂組成物、プリプレグおよび繊維強化複合材料 |
| JP2017039875A (ja) * | 2015-08-21 | 2017-02-23 | 東レ株式会社 | エポキシ樹脂組成物、樹脂硬化物、プリプレグおよび繊維強化複合材料 |
| US20210355269A1 (en) * | 2016-07-25 | 2021-11-18 | The Boeing Company | Epoxy resin |
| US11718707B2 (en) * | 2016-07-25 | 2023-08-08 | The Boeing Company | Epoxy resin |
| JP7638452B1 (ja) * | 2024-02-16 | 2025-03-03 | 三菱電機株式会社 | エポキシ樹脂組成物、樹脂硬化物、樹脂シート、パワーモジュールおよびモータ用ステータ |
| WO2025173256A1 (ja) * | 2024-02-16 | 2025-08-21 | 三菱電機株式会社 | エポキシ樹脂組成物、樹脂硬化物、樹脂シート、パワーモジュールおよびモータ用ステータ |
Also Published As
| Publication number | Publication date |
|---|---|
| JP6406012B2 (ja) | 2018-10-17 |
| US20160152785A1 (en) | 2016-06-02 |
| CN105392838A (zh) | 2016-03-09 |
| EP3020763A4 (en) | 2017-02-22 |
| US10400076B2 (en) | 2019-09-03 |
| JPWO2015005411A1 (ja) | 2017-03-02 |
| EP3020763A1 (en) | 2016-05-18 |
| EP3020763B1 (en) | 2018-08-29 |
| CN105392838B (zh) | 2018-12-14 |
| KR20160030208A (ko) | 2016-03-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP6406012B2 (ja) | エポキシ樹脂組成物、プリプレグおよび炭素繊維強化複合材料 | |
| JP5003827B2 (ja) | 炭素繊維強化複合材料用エポキシ樹脂組成物、プリプレグおよび炭素繊維強化複合材料 | |
| JP4811532B2 (ja) | 繊維強化複合材料用エポキシ樹脂組成物、プリプレグおよび繊維強化複合材料 | |
| JP5800031B2 (ja) | エポキシ樹脂組成物、プリプレグおよび炭素繊維強化複合材料 | |
| JP6497027B2 (ja) | エポキシ樹脂組成物、樹脂硬化物、プリプレグおよび繊維強化複合材料 | |
| KR20130108351A (ko) | 에폭시 수지 조성물, 프리프레그 및 섬유 강화 복합 재료 | |
| WO2012039456A1 (ja) | 繊維強化複合材料用エポキシ樹脂組成物、プリプレグおよび繊維強化複合材料 | |
| JP2011079983A (ja) | 炭素繊維強化複合材料用エポキシ樹脂組成物、プリプレグおよび炭素繊維強化複合材料 | |
| JP6555006B2 (ja) | エポキシ樹脂組成物、樹脂硬化物、プリプレグおよび繊維強化複合材料 | |
| JP5729023B2 (ja) | 繊維強化複合材料用エポキシ樹脂組成物、プリプレグおよび繊維強化複合材料 | |
| JP2016132709A (ja) | エポキシ樹脂組成物、プリプレグおよび繊維強化複合材料 | |
| JP2016132708A (ja) | エポキシ樹脂組成物、プリプレグおよび繊維強化複合材料 | |
| JP2020152861A (ja) | エポキシ樹脂組成物、プリプレグおよび繊維強化複合材料 | |
| JP2012067190A (ja) | 繊維強化複合材料用エポキシ樹脂組成物、プリプレグおよび繊維強化複合材料 | |
| JP5447059B2 (ja) | 炭素繊維強化複合材料用エポキシ樹脂組成物、プリプレグおよび炭素繊維強化複合材料 | |
| JP2011057851A (ja) | エポキシ樹脂組成物、プリプレグおよび繊維強化複合材料 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| WWE | Wipo information: entry into national phase |
Ref document number: 201480037947.8 Country of ref document: CN |
|
| ENP | Entry into the national phase |
Ref document number: 2014538004 Country of ref document: JP Kind code of ref document: A |
|
| 121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 14823216 Country of ref document: EP Kind code of ref document: A1 |
|
| WWE | Wipo information: entry into national phase |
Ref document number: 2014823216 Country of ref document: EP |
|
| WWE | Wipo information: entry into national phase |
Ref document number: 14896865 Country of ref document: US |
|
| NENP | Non-entry into the national phase |
Ref country code: DE |
|
| ENP | Entry into the national phase |
Ref document number: 20167002473 Country of ref document: KR Kind code of ref document: A |