WO2015004920A1 - 冷却システム、及び冷却システムにおける冷媒供給量の制御方法 - Google Patents
冷却システム、及び冷却システムにおける冷媒供給量の制御方法 Download PDFInfo
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- WO2015004920A1 WO2015004920A1 PCT/JP2014/003668 JP2014003668W WO2015004920A1 WO 2015004920 A1 WO2015004920 A1 WO 2015004920A1 JP 2014003668 W JP2014003668 W JP 2014003668W WO 2015004920 A1 WO2015004920 A1 WO 2015004920A1
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- Prior art keywords
- refrigerant
- refrigerant tank
- tank
- cooling system
- liquid
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20836—Thermal management, e.g. server temperature control
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/06—Control arrangements therefor
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20718—Forced ventilation of a gaseous coolant
- H05K7/20736—Forced ventilation of a gaseous coolant within cabinets for removing heat from server blades
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/208—Liquid cooling with phase change
Definitions
- the present invention relates to a cooling system and a method for controlling the amount of refrigerant supplied in the cooling system, and more particularly to a cooling system for a plurality of heat sources and a method for controlling the amount of refrigerant supplied in the cooling system.
- a large number of electronic devices are installed in the data center server rack.
- a large number of such server racks are arranged to constitute a data center.
- a large number of electronic devices that generate heat during operation are cooled by using air conditioning and lowering the room temperature by blowing air.
- power consumption by air conditioning is increasing.
- a locally high temperature point called a hot spot occurs.
- air conditioning is used to further lower the room temperature, a large amount of air conditioning power is required.
- Patent Document 1 proposes that a cooling refrigerant is circulated from a common cooling tower to a plurality of servers in a server room installed on a plurality of floors to cool an electronic device of the server installed in the server room. Has been.
- FIG. 10 is a configuration diagram showing an extracted main part of the drawing of Patent Document 1.
- the related cooling system disclosed in Patent Document 1 is for cooling electronic devices in which a server room 301 and a server room 302 are formed on the first and second floors of a two-story building 300, respectively. is there.
- a plurality of servers 303 are installed on the floor surface 301 a of the server room 301 and the floor surface 302 a of the server room 302.
- An evaporator 304 is disposed near each server 303.
- Each evaporator 304 is provided with a temperature sensor 312b for detecting a nearby temperature and a valve 313b inserted in a pipe near each evaporator 304.
- a cooling tower 307 is installed on the roof of the building 300.
- the refrigerant is sent from the cooling tower 307 to the evaporator 304 on each floor through the supply pipe 305.
- the refrigerant flowing in the cooling coil inside the evaporator 304 evaporates with the high-temperature air generated from the server 303, the heat of vaporization is taken away from the surroundings and gasified. Thereby, the high temperature air discharged from the server 303 itself or the server 303 is cooled.
- the refrigerant gasified by each evaporator 304 is sent to the cooling tower 307 through the return pipe 306. In the cooling tower 307, the gasified refrigerant is cooled and condensed by water cooling or air cooling to be liquefied.
- a heat exchanger 308 is further connected in parallel to the cooling tower 307 to the supply pipe 305 and the return pipe 306.
- Another cooling tower 310 is connected to the heat exchanger 308 via a refrigerator 309.
- the temperature is detected by a temperature sensor 312a provided in the middle of the piping of the cooling tower 307 and the heat exchanger 308, and a plurality of valves 313a arranged in the middle of the piping are controlled by the control unit 311 according to the detection result.
- the amount of refrigerant flowing through the heat exchanger 308 is controlled by adjusting the amount of opening of the valve 313a.
- the temperature near each evaporator 304 is detected by the temperature sensor 312b, and the valve 313b of the pipe of each evaporator 304 is controlled according to the detection result.
- the cooling tower 307 and the heat exchanger 308 are installed on the roof of the building 300, and the refrigerant from the cooling tower 307 and the heat exchanger 308 is from inside the building 300, that is, from the cooling tower 307 and the heat exchanger 308. It is sent to the evaporator 304 located on the lower side. The refrigerant is naturally circulated between the evaporator 304 and the cooling tower 307 for cooling.
- Patent Document 2 relates to a cooling system, and a phase change cooler that performs heat transport using latent heat required when a refrigerant undergoes a phase change has been proposed.
- the phase change cooler of Patent Document 2 receives heat from a heating element, takes the heat from the vapor phase refrigerant by an external fan, etc. And a condensing part that changes the phase to a liquid phase.
- the phase change cooler of Patent Document 2 includes a pipe connecting the evaporation unit and the condensation unit, and a refrigerant circulating in a state of being sealed inside.
- Patent Document 3 relates to a cooling device of a boiling cooling system, which transmits heat generated in a power conversion device to be cooled to a boiling vessel, and the liquid refrigerant in the boiling vessel is vaporized by heat from the power conversion device. It is described that the heat generated by the latent heat is absorbed. The refrigerant vapor generated in the boiling vessel condenses into a liquid by dissipating heat through heat exchange, flows down the inclined heat transfer tube to become a liquid refrigerant, and returns to the boiling vessel. It is described that heat generated in the power converter is radiated by repeating such a cycle in which the refrigerant evaporates in the boiling vessel and the refrigerant condenses in the heat transfer tube.
- the control mechanism as in Patent Document 1 uses the electronic device unit (by height) mounted on the server rack. Cannot cope with variations in calorific value. For this reason, optimal cooling cannot be performed and a hot spot may occur.
- Patent Document 3 there is only one boiling container in a closed system for circulating a refrigerant, and a plurality of boiling containers are provided in the closed system, and in this case, each boiling container is provided. It is not the structure corresponding to optimizing the refrigerant
- An object of the present invention is a cooling system that solves the problem that the control mechanism becomes complicated when the optimum amount of refrigerant is stably supplied to a plurality of cooling targets with different calorific values, which is the above-described problem. And it is providing the control method of the refrigerant
- a cooling system includes a first refrigerant tank that stores a liquid phase refrigerant, a plurality of evaporation units that vaporize the liquid phase refrigerant supplied from the first refrigerant tank, and the evaporation.
- a condensing unit for liquefying the gas-phase refrigerant vaporized in the unit, a vapor pipe for connecting the evaporating unit and the condensing unit and flowing the gas-phase refrigerant, the condensing unit, the first refrigerant tank, and the first refrigerant tank
- a cooling system comprising a liquid pipe that connects the plurality of evaporation sections and the liquid phase refrigerant flows.
- the condensing unit is disposed above the plurality of evaporating units, and the first refrigerant tank is disposed below the condensing unit.
- a method for controlling a refrigerant supply amount in a cooling system includes a refrigerant tank that stores liquid phase refrigerant, a plurality of evaporation units that vaporize the liquid phase refrigerant supplied from the refrigerant tank, and vaporized by the evaporation unit.
- the cooling system and the control method of the refrigerant supply amount in the cooling system of the present invention it is possible to stably supply the optimum amount of refrigerant to a plurality of cooling targets having different calorific values without using a complicated control mechanism. it can.
- Cooling for a plurality of server racks on which electronic devices are mounted will be described as an example.
- FIG. 1 is a configuration diagram illustrating a cooling system according to a first embodiment of the present invention.
- the cooling system according to the present embodiment includes, as an example of a first refrigerant tank, a refrigerant tank 103 that stores a liquid-phase refrigerant 106 and a plurality of vaporizers that vaporize the liquid-phase refrigerant supplied from the refrigerant tank 103.
- the evaporation unit 101 is provided.
- the cooling system according to the present embodiment includes a condensing unit 102 that liquefies the gas-phase refrigerant vaporized by the plurality of evaporating units 101, and a vapor pipe 105 that connects the evaporating unit 101 and the condensing unit 102 and flows the gas-phase refrigerant. Prepare.
- the cooling system includes a liquid pipe 104 that connects the condensing unit 102 and the refrigerant tank 103, the refrigerant tank 103, and the plurality of evaporation units 101 and through which the liquid-phase refrigerant flows.
- the condensing unit 102 is arranged vertically above as an example above the plurality of evaporating units 101, and the refrigerant tank 103 is arranged below vertically as an example below the condensing unit 102.
- the refrigerant tank 103 is disposed above the plurality of evaporation units 101 when viewed from the installation surfaces 100 a of the plurality of server racks 100.
- a heat exchanger such as a radiator can be used as the plurality of evaporators 101 and condensers 102.
- the plurality of evaporation units 101 are arranged on the back surface or the front surface of the server rack 100.
- FIG. 1 shows a case where two evaporation racks 101 whose outer shapes are vertically long are arranged one by one with respect to two server racks 100 whose outer shapes are vertically long.
- the server rack 100 is mounted with an electronic device serving as a heat source.
- Each evaporation unit 101 is a heat receiving unit that receives heat from high-temperature air generated from a heat generation source.
- the liquid pipe 104 connects the lower part of the condensing part 102 to the upper part of the refrigerant tank 103 and the lower part of the side surface of the refrigerant tank 103 to the lower part of each evaporation part 101.
- a vapor pipe 105 connects the upper part of each evaporation part 101 to the upper part of the condensing part 102.
- the refrigerant 106 is sealed in the sealed system.
- the supply of the liquid phase refrigerant to each evaporation unit 101 is naturally performed by gravity.
- the height of the liquid level in each evaporation unit 101 is determined by the height of the liquid level in the refrigerant tank 103, and does not depend on the amount of heat generated by the electronic equipment mounted on each server rack 100.
- all the evaporation parts 101 have shown the state always satisfy
- the amount of refrigerant supplied to each evaporation unit 101 is controlled by controlling the height of the liquid level in the refrigerant tank 103 by changing the position along the vertical direction of the refrigerant tank 103. It can be controlled uniformly.
- the liquid pipes 104 and the steam pipes 105 are drawn so as to extend in the horizontal direction or the vertical direction, but it is not necessary to arrange the liquid pipes 104 and the steam pipes 105 completely horizontally or vertically. .
- FIG. 2 is a configuration diagram illustrating a cooling system according to a second embodiment of the present invention.
- the same reference numerals are assigned to the same elements as those in the first embodiment, and detailed description thereof is omitted.
- This embodiment is a modification of the first embodiment, and includes a second refrigerant tank for each evaporation unit.
- the cooling system according to this embodiment is supplied from a refrigerant tank 103 that stores a liquid-phase refrigerant 106 and a refrigerant tank 103 as an example of the first refrigerant tank, as in the first embodiment. And a plurality of evaporation units 101 for vaporizing the liquid-phase refrigerant. Furthermore, the cooling system according to the present embodiment includes a condensing unit 102 that liquefies the gas-phase refrigerant vaporized by the plurality of evaporation units 101, and a vapor pipe 105 that sends the gas-phase refrigerant to the condensing unit 102.
- the cooling system includes a liquid pipe 104 that sends the liquid-phase refrigerant to the refrigerant tank 103 and from the refrigerant tank 103 to the plurality of evaporation units 101.
- the condensing unit 102 is arranged vertically above as an example above the plurality of evaporating units 101, and the refrigerant tank 103 is arranged below vertically as an example below the condensing unit 102. Yes.
- the cooling system according to the present embodiment further includes a second refrigerant tank 107, a refrigerant recovery pipe 109, a pump 108, and liquid pipes 104a and 104b.
- the second refrigerant tank 107 is provided in each pipe 104 between the refrigerant tank 103 and each evaporation unit 101, and is arranged vertically below as an example below the refrigerant tank 103.
- the second refrigerant tank 107 is provided for each server rack 100. Accordingly, the refrigerant 106 is supplied to each evaporation unit 101 via the second refrigerant tank 107.
- a liquid pipe 104a is branched from the middle of the side surface of each second refrigerant tank 107, and is connected to a refrigerant recovery pipe 109 disposed below the installation surface 100a of the server rack 100, for example, below the floor.
- the refrigerant recovery pipe 109 is connected to the refrigerant tank 103 via the liquid pipe 104b, and the pump 108 is disposed therebetween.
- a part of the refrigerant 106 in the second refrigerant tank 107 is discharged from the middle of the side surface of the second refrigerant tank 107 to the refrigerant recovery pipe 109 through the liquid pipe 104a.
- the refrigerant discharged to the refrigerant recovery pipe 109 is returned to the refrigerant tank 103 via the liquid pipe 104b by the action of the pump 108. That is, the refrigerant discharged to the refrigerant recovery pipe 109 is pumped up by the pump 108 and returned to the refrigerant tank 103.
- the pump 108 is not used and the refrigerant discharged to the refrigerant recovery pipe 109 is discharged to the refrigerant tank in the server room downstairs. May be.
- the refrigerant recovery pipe 109 extends in the left direction of the drawing. If there is also a server room downstairs, the refrigerant recovery pipe 109 extending in the left direction of the paper may be connected to a refrigerant tank in the server room downstairs.
- the supply of the liquid phase refrigerant to each evaporation unit 101 is naturally performed by gravity, as in the first embodiment.
- the height of the liquid level in each evaporation unit 101 is determined by the height of the liquid level in the second refrigerant tank 107, and does not depend on the amount of heat generated by the electronic equipment mounted on each server rack 100.
- the amount of refrigerant supplied to the evaporation unit 101 is controlled by controlling the height of the liquid level in the second refrigerant tank 107 by changing the position of the second refrigerant tank 107 along the vertical direction. Can be optimized.
- surplus refrigerant 106 in the second refrigerant tank 107 is discharged to the refrigerant recovery pipe 109 through the branched liquid pipe 104a.
- the height of the liquid level in the second refrigerant tank 107 is kept constant at the height of the branch point.
- coolant supply amount to the some evaporation part 101 is stabilized more.
- the amount of refrigerant supplied to each evaporation unit 101 is controlled by the height of the liquid level in the refrigerant tank 103, but according to the present embodiment, the level of the liquid level in the second refrigerant tank 107 is high. Now, it becomes possible to control the amount of refrigerant supplied to each evaporator 101. Thereby, the refrigerant
- FIG. 3 is a configuration diagram illustrating a cooling system according to a third embodiment of the present invention.
- the same reference numerals are assigned to elements similar to those in the first embodiment and the second embodiment, and detailed description thereof is omitted.
- the present embodiment is a modification of the second embodiment, in which a refrigerant control mechanism is provided for each second refrigerant tank.
- the cooling system includes a refrigerant tank 103 that stores a liquid-phase refrigerant 106 as an example of the first refrigerant tank, and a refrigerant tank, as in the first and second embodiments. And a plurality of evaporation units 101 that vaporize the liquid-phase refrigerant supplied from 103. Furthermore, the cooling system according to the present embodiment includes a condensing unit 102 that liquefies the gas-phase refrigerant vaporized by the plurality of evaporation units 101, and a vapor pipe 105 that sends the gas-phase refrigerant to the condensing unit 102.
- the cooling system according to the present embodiment includes a liquid pipe 104 that sends the liquid-phase refrigerant to the refrigerant tank 103 and from the refrigerant tank 103 to the plurality of evaporation units 101.
- the condensing unit 102 is disposed vertically above as an example above the plurality of evaporating units 101
- the refrigerant tank 103 is vertically disposed as an example below the condensing unit 102. It is arranged below.
- the cooling system according to the present embodiment includes the second refrigerant tank 107 as in the second embodiment.
- the second refrigerant tank 107 is provided in each pipe 104 between the refrigerant tank 103 and each evaporation unit 101, and is arranged vertically below as an example below the refrigerant tank 103.
- a refrigerant control mechanism that controls the refrigerant supply amount according to the liquid level in the second refrigerant tank 107 between the refrigerant tank 103 and the plurality of second refrigerant tanks 107, Further prepare.
- the refrigerant control mechanism is a refrigerant supply amount suppression mechanism 111 that suppresses the refrigerant supply amount in accordance with the level of the liquid level in the second refrigerant tank 107.
- Examples of the refrigerant supply amount suppression mechanism 111 include a float valve and a ball tap.
- the refrigerant 106 is supplied from the refrigerant tank 103 to the respective evaporation units 101 via the second refrigerant tank 107.
- the supply of the liquid refrigerant to each evaporation unit 101 is naturally performed by gravity, as in the first and second embodiments.
- the height of the liquid level in each evaporation unit 101 is determined by the height of the liquid level in the second refrigerant tank 107, and the amount of heat generated by the electronic equipment mounted on each server rack 100. It does not depend.
- the amount of refrigerant supplied to the evaporation unit 101 is controlled by controlling the height of the liquid level in the second refrigerant tank 107 by changing the position of the second refrigerant tank 107 along the vertical direction. Can be optimized.
- the refrigerant supply amount suppression mechanism 111 monitors the height of the liquid level in the second refrigerant tank 107, and when the liquid level becomes higher than a certain position, Reducing refrigerant supply. As a result, the height of the liquid level in the second refrigerant tank 107 can be controlled, and the amount of refrigerant supplied to each evaporator 101 is more stable.
- FIG. 4 is a configuration diagram illustrating a cooling system according to a fourth embodiment of the present invention.
- the same reference numerals are assigned to elements similar to those in the first to third embodiments, and detailed description thereof is omitted.
- the cooling system according to the present embodiment is obtained by multi-stages the evaporator 101 and the second refrigerant tank 107 in the second embodiment in the height direction.
- FIG. 4 shows a case where a plurality of five evaporation units 101 are arranged for one server rack 100.
- the second refrigerant tanks 107 are arranged for the five evaporation units 101, respectively.
- the refrigerant 106 in one second refrigerant tank 107 is supplied from the bottom surface of the second refrigerant tank 107 to the evaporation unit 101 through the liquid pipe 104.
- a part of the refrigerant 106 in the second refrigerant tank 107 is sent to the second refrigerant tank 107 arranged vertically downward as an example of a lower part by a pipe branched from the middle of the side surface of the second refrigerant tank 107.
- a part of the refrigerant 106 of the lowermost second refrigerant tank 107 passes through the liquid pipe from the middle of the side surface of each second refrigerant tank 107. It is discharged to the refrigerant recovery pipe 109.
- the refrigerant discharged to the refrigerant recovery pipe 109 is returned to the refrigerant tank 103 via the liquid pipe 104b by the action of the pump 108.
- the supply of the liquid-phase refrigerant to each evaporation unit 101 is naturally performed by gravity, as in the first to third embodiments.
- the height of the liquid level in each evaporation unit 101 is determined by the height of the liquid level in the second refrigerant tank 107, and does not depend on the amount of heat generated by the electronic equipment mounted on each server rack 100.
- the amount of refrigerant supplied to the evaporation unit 101 is controlled by controlling the height of the liquid level in the second refrigerant tank 107 by changing the position of the second refrigerant tank 107 along the vertical direction. Can be optimized.
- the excessive refrigerant 106 in the second refrigerant tank 107 is sent to the second refrigerant tank 107 arranged vertically below through the branched liquid pipe.
- the excess refrigerant 106 in the lowermost second refrigerant tank 107 is discharged to the refrigerant recovery pipe 109 through the branched liquid pipe.
- the height of the liquid level in the second refrigerant tank 107 is kept constant at the height of the branch point.
- coolant supply amount to the some evaporation part 101 is stabilized more.
- the amount of refrigerant supplied to each evaporation unit 101 is uniformly controlled using one second refrigerant tank 107 for each server rack.
- the refrigerant discharged to the refrigerant recovery pipe 109 is transferred to the downstairs server. You may discharge to the refrigerant tank of a room.
- the refrigerant recovery pipe 109 extends in the left direction of the drawing. If there is also a server room downstairs, the refrigerant recovery pipe 109 extending in the left direction of the paper may be connected to a refrigerant tank in the server room downstairs.
- FIG. 5 is a configuration diagram illustrating a cooling system according to a fifth embodiment of the present invention.
- the same reference numerals are assigned to the same elements as those in the first to fourth embodiments, and detailed description thereof is omitted.
- the evaporator 101, the second refrigerant tank 107, and the refrigerant supply amount suppression mechanism 111 in the third embodiment are multistaged in the height direction.
- the cooling system according to the present embodiment is configured such that a plurality of evaporation units 101 whose outer shapes are horizontally long are arranged in two server racks 100 whose outer shapes are vertically long.
- the cooling system according to the present embodiment includes the second refrigerant tank 107 and the refrigerant supply amount suppression mechanism 111 for each evaporation unit 101.
- the cooling system of the present embodiment is a modification of the cooling system according to the third and fourth embodiments.
- the cooling system of the present embodiment includes a refrigerant supply amount between the refrigerant tank 103 as an example of the first refrigerant tank and the plurality of second refrigerant tanks 107 according to the liquid level in the second refrigerant tank 107. Further, a refrigerant supply amount suppression mechanism 111 that suppresses the above is provided. Furthermore, between one second refrigerant tank 107 and, as an example below, a second refrigerant tank 107 disposed vertically below, refrigerant is supplied according to the level of the liquid level in the second refrigerant tank 107. A refrigerant supply amount suppression mechanism 111 that suppresses the amount is provided.
- the supply of the liquid refrigerant to each evaporation unit 101 is naturally performed by gravity, as in the first to fourth embodiments.
- the height of the liquid level in each evaporation unit 101 is determined by the height of the liquid level in the second refrigerant tank 107, and does not depend on the amount of heat generated by the electronic equipment mounted on each server rack 100.
- the liquid level in the second refrigerant tank 107 is controlled by changing the position along the vertical direction of the second refrigerant tank 107, etc.
- the refrigerant supply amount can be optimized.
- surplus refrigerant 106 in the second refrigerant tank 107 is sent to the second refrigerant tank 107 vertically below through the branched liquid pipe.
- the height of the liquid level in each second refrigerant tank 107 is kept constant at the height of the branch point.
- the second refrigerant tank 107 and the refrigerant supply amount suppression mechanism 111 are arranged for each evaporation unit 101.
- the refrigerant supply amount for each server rack 100 can be optimized, but also the refrigerant supply amount for each electronic device (by height) within each server rack 100 can be optimized.
- by performing these two measures at the same time it is possible to perform more optimal refrigerant supply.
- FIG. 6 is a configuration diagram illustrating a cooling system according to a sixth embodiment of the present invention.
- This embodiment is a modification of the cooling system of the second embodiment, and uses a refrigerant tank 203 having connection ports on the side surface and the bottom surface, and one second refrigerant tank 210 for a plurality of evaporation units 201. is there.
- the cooling system according to the present embodiment vaporizes the refrigerant tank 203 that stores the liquid-phase refrigerant 206 and the liquid-phase refrigerant supplied from the refrigerant tank 203 as an example of the first refrigerant tank.
- a plurality of evaporators 201 Furthermore, the cooling system according to the present embodiment includes a condensing unit 202 that liquefies the gas-phase refrigerant vaporized by the plurality of evaporating units 201, and a vapor pipe 205 that connects the evaporating unit 201 and the condensing unit 202 and flows the gas-phase refrigerant. Prepare.
- the cooling system includes a liquid pipe 204 that connects the condensing unit 202, the refrigerant tank 203, the refrigerant tank 203, and the plurality of evaporation units 201, and the liquid-phase refrigerant flows.
- the condensing unit 202 is disposed vertically above as an example above the plurality of evaporating units 201, and the refrigerant tank 203 is disposed below vertically as an example below the condensing unit 202.
- the refrigerant tank 203 is disposed above the plurality of evaporation units 201 when viewed from the installation surfaces 200 a of the plurality of server racks 200.
- a heat exchanger such as a radiator can be used as in the first embodiment.
- the plurality of evaporation units 201 are arranged on the back surface or the front surface of the server rack 200.
- FIG. 6 shows a case where one evaporation unit 201 having a vertically long outer shape is arranged for each of two server racks 200 having a vertically long outer shape.
- the server rack 200 is mounted with an electronic device serving as a heat source.
- the liquid pipe 204 connects the lower part of the condensing unit 202 to the upper part of the refrigerant tank 203 and the bottom surface of the refrigerant tank 203 via the second refrigerant tank 210 to the lower part of each evaporation unit 201.
- a vapor pipe 205 connects the upper part of each evaporation part 201 to the upper part of the condensing part 202.
- the refrigerant 206 is sealed in the system thus sealed.
- the liquid pipe 204a is branched from the middle of the side surface of the second refrigerant tank 210, and the refrigerant is collected below the installation surface 200a of the server rack 200, for example, below the floor.
- the refrigerant recovery pipe 209 is connected to the refrigerant tank 203 via the liquid pipe 204b, and the pump 208 is disposed therebetween.
- a part of the refrigerant 206 in the second refrigerant tank 210 is discharged from the middle of the side surface of the second refrigerant tank 210 to the refrigerant recovery pipe 209 through the liquid pipe 204a.
- the refrigerant discharged to the refrigerant recovery pipe 209 is returned to the refrigerant tank 203 via the liquid pipe 204b by the action of the pump 208.
- the pump 208 is not used and the refrigerant discharged to the refrigerant recovery pipe 209 can be discharged to the refrigerant tank in the server room downstairs. good.
- the refrigerant recovery pipe 209 and the liquid pipe 204c also extend in the left direction of the drawing. If there is a server room downstairs, the refrigerant recovery pipe 209 and the liquid pipe 204c extending in the left direction of the page may be connected to the refrigerant tank of the server room downstairs. Further, the liquid pipe 204c may be connected to a second refrigerant tank different from the illustrated second refrigerant tank 210. Further, a part of the refrigerant 206 in the refrigerant tank 203 is discharged from the lower part of the side surface of the refrigerant tank 203 through the liquid pipe 204c in the left direction of the drawing.
- the supply of the liquid-phase refrigerant to each evaporation unit 201 is naturally performed by gravity, as in the first to fifth embodiments.
- the height of the liquid level in each evaporation unit 201 is determined by the height of the liquid level in the second refrigerant tank 210 and does not depend on the amount of heat generated by the electronic devices mounted on each server rack 200.
- the amount of refrigerant supplied to the evaporation unit 201 is controlled by controlling the height of the liquid level in the second refrigerant tank 210 by changing the position along the vertical direction of the second refrigerant tank 210. Can be optimized.
- excess refrigerant 206 in the second refrigerant tank 210 is discharged to the refrigerant recovery pipe 209 through the branched liquid pipe 204a.
- the height of the liquid level in the second refrigerant tank 210 is kept constant at the height of the branch point.
- coolant supply amount to the some evaporation part 201 is stabilized more.
- coolant to each evaporation part 201 is controlled by controlling the height of the liquid level in the 2nd refrigerant
- the supply amount can be controlled uniformly.
- the liquid pipes 204, 204a, 204b, 204c and the steam pipe 205 are drawn so as to extend in the horizontal direction or the vertical direction, but the liquid pipes 204, 204a, 204b, 204c and the steam pipe are drawn. It is not necessary to arrange 205 completely horizontally or vertically.
- FIG. 7 is a configuration diagram illustrating a cooling system according to a seventh embodiment of the present invention.
- the same reference numerals are assigned to elements similar to those in the sixth embodiment, and detailed description thereof is omitted.
- the liquid level in the second refrigerant tank 210 is between the refrigerant tank 203 and the second refrigerant tank 210 as an example of the first refrigerant tank.
- a refrigerant control mechanism that suppresses the refrigerant supply amount according to the height is further provided.
- the refrigerant control mechanism is a refrigerant supply amount suppression mechanism 211 that suppresses the refrigerant supply amount in accordance with the liquid level in the second refrigerant tank 210.
- the supply of the liquid-phase refrigerant to each evaporation unit 201 is naturally performed by gravity, as in the first to sixth embodiments.
- the height of the liquid level in each evaporation unit 201 is determined by the height of the liquid level in the second refrigerant tank 210 and does not depend on the amount of heat generated by the electronic devices mounted on each server rack 200.
- the amount of refrigerant supplied to the evaporation unit 201 is controlled by controlling the height of the liquid level in the second refrigerant tank 210 by changing the position along the vertical direction of the second refrigerant tank 210. The entire operation can be optimized by uniformly controlling.
- the refrigerant supply amount suppression mechanism 211 monitors the liquid level in the second refrigerant tank 210, and there is a liquid level. If it becomes higher than the position, the supply of the refrigerant to the second refrigerant tank 210 is suppressed. As a result, the height of the liquid level in the second refrigerant tank 210 can be controlled, and the amount of refrigerant supplied to each evaporator 201 is more stable.
- FIG. 8 is a configuration diagram illustrating a cooling system according to an eighth embodiment of the present invention.
- the same reference numerals are assigned to elements similar to those in the sixth embodiment and the seventh embodiment, and detailed description thereof is omitted.
- the evaporation unit 201 and the second refrigerant tank 210 in the sixth embodiment and the seventh embodiment are multi-staged in the height direction.
- a plurality of evaporation units 201 whose outer shapes are horizontally long are arranged in two server racks 200 whose outer shapes are vertically long.
- FIG. 8 shows a case where a plurality of five evaporation units 201 are arranged for one server rack 200.
- Five five refrigerant tanks 210 are arranged for the five evaporation units 201.
- the refrigerant 206 in one second refrigerant tank 210 is supplied from the bottom surface of the second refrigerant tank 210 to the evaporation unit 201 through the liquid pipe.
- Each second refrigerant tank 210 is connected to each evaporator 201 and liquid pipe 204 at the same height.
- the liquid pipe branched from the middle of the side surface of the upper second refrigerant tank 210 is connected to the upper part of the lower second refrigerant tank 210.
- positioned in the lowest stage is connected to the refrigerant
- a part of the refrigerant 206 in the second refrigerant tank 210 passes through the liquid pipe from the middle of the side surface of the second refrigerant tank 210, and as a lower example, the second refrigerant disposed vertically below. It is supplied to the tank 210.
- a part of the refrigerant 206 of the second refrigerant tank 210 arranged at the lowermost stage is a liquid pipe from the middle of the side surface of the second refrigerant tank 210.
- the refrigerant is discharged to the refrigerant recovery pipe 209.
- the refrigerant discharged to the refrigerant recovery pipe 209 is returned to the refrigerant tank 203 as an example of the first refrigerant tank via the liquid pipe 204b by the action of the pump 208.
- the surplus refrigerant in the upper second refrigerant tank 210 moves to the lower second refrigerant tank 210 through the branched liquid pipe.
- each second refrigerant tank 210 need not be connected to the second refrigerant tank 210 immediately above, and may be connected by skipping the steps. It is not necessary for only the uppermost second refrigerant tank 210 to be connected to the refrigerant tank 203, and it may be connected to the middle second refrigerant tank 210. Further, the refrigerant tank 203 may not be provided. It is not necessary to connect only the lowermost second refrigerant tank 210 to the refrigerant recovery pipe 209, and it may also be connected to the middle second refrigerant tank 210.
- the same configuration as that of the second embodiment or the sixth embodiment may be used. That is, when the data center has a multi-story structure and there is a server room on the lower level, the pump 208 is not used and the refrigerant discharged to the refrigerant recovery pipe 209 is discharged to the refrigerant tank in the lower-level server room. May be.
- the refrigerant recovery pipe 209 extends in the left direction of the drawing. If there is also a server room downstairs, the refrigerant recovery pipe 209 extending in the left direction of the paper may be connected to a refrigerant tank in the server room downstairs.
- FIG. 9 is a configuration diagram illustrating a cooling system according to a ninth embodiment of the present invention.
- the same reference numerals are assigned to the same elements as those in the sixth to eighth embodiments, and detailed description thereof is omitted.
- the evaporator 201, the second refrigerant tank 210, and the refrigerant supply amount suppression mechanism 211 in the seventh embodiment are multistaged in the height direction.
- a plurality of evaporation units 201 whose outer shapes are horizontally long are arranged on two server racks 200 whose outer shapes are vertically long. It is a thing.
- the cooling system according to the present embodiment includes the second refrigerant tank 210 and the refrigerant supply amount suppression mechanism 211 for each evaporation unit 201.
- the liquid pipe branched from the middle of the side surface of the upper second refrigerant tank 210 is connected to the upper part of the lower second refrigerant tank 210.
- the liquid pipe is not branched from the lowermost second refrigerant tank 210.
- Each second refrigerant tank 210 is connected to each evaporation unit 201 at the same height by a liquid pipe.
- the surplus refrigerant in the upper second refrigerant tank 210 moves to the lower second refrigerant tank 210 through the branched liquid pipe.
- the refrigerant supply amount of each server rack 200 can be optimized, but also the refrigerant supply amount can be optimized for each electronic device in each server rack 200.
- each second refrigerant tank 210 need not be connected to the second refrigerant tank 210 immediately above, and may be connected by skipping the steps. It is not necessary for only the uppermost second refrigerant tank 210 to be connected to the refrigerant tank 203 as an example of the first refrigerant tank, and it may be connected to the middle second refrigerant tank 210. Further, the refrigerant supply amount suppressing mechanism 211 may not be provided in all the second refrigerant tanks 210.
- the condensing unit of the above-described embodiment is not necessarily arranged vertically above the plurality of evaporation units, and may be arranged above.
- the refrigerant tank of the above-described embodiment does not necessarily have to be arranged vertically below the condensing unit, and may be arranged below.
- a cooling system including a liquid pipe through which a liquid-phase refrigerant flows, wherein the condensing unit is disposed above the plurality of evaporating units, and the first refrigerant tank is disposed below the condensing unit.
- Cooling system (Supplementary note 2) The cooling system according to supplementary note 1, wherein the first refrigerant tank is disposed above the plurality of evaporation units. (Additional remark 3) The cooling system of Additional remark 1 or Additional remark 2 further provided with the 2nd refrigerant
- the cooling system according to any one of Appendix 3 to Appendix 5, wherein a plurality of the cooling systems are arranged.
- the plurality of evaporation units are further arranged along a direction different from the vertical direction, and the second evaporation unit corresponds to the plurality of evaporation units arranged along a direction different from the vertical direction.
- the cooling system according to any one of supplementary notes 3 to 5, wherein the refrigerant tanks are respectively disposed.
- the refrigerant tanks are respectively disposed.
- a part of the liquid-phase refrigerant stored in one second refrigerant tank flows to another second refrigerant tank located below. Or the cooling system according to appendix 9.
- a plurality of the second refrigerant tanks are arranged in the vertical direction, and a refrigerant control mechanism that controls the supply amount of the liquid-phase refrigerant connects one second refrigerant tank and another second refrigerant tank.
- a refrigerant tank for storing a liquid phase refrigerant, a plurality of evaporation units for vaporizing the liquid phase refrigerant supplied from the refrigerant tank, a condensing unit for liquefying the gas phase refrigerant vaporized in the evaporation unit, A vapor pipe that connects the evaporation section and the condensing section and flows the gas-phase refrigerant, and a liquid pipe that connects the condensing section, the refrigerant tank, the refrigerant tank, and the plurality of evaporation sections and flows the liquid phase refrigerant.
- a control method of a refrigerant supply amount in the cooling system wherein the amount of the liquid-phase refrigerant supplied to the evaporation unit in the cooling system is controlled by changing the arrangement of the refrigerant tank in the vertical direction.
- the amount of the liquid-phase refrigerant supplied to the evaporation unit in the cooling system is controlled by changing the arrangement of the refrigerant tank in the vertical direction.
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Abstract
Description
上記凝縮部は上記複数の蒸発部より上方に配置されており、上記第1冷媒タンクは上記凝縮部より下方に配置している。
上記冷媒タンクの配置を鉛直方向で変化させることによって制御する。
初めに、本発明の第1実施形態の冷却システム、及び冷却システムにおける冷媒供給量の制御方法について、説明する。図1は、本発明の第1実施形態による冷却システムを示す構成図である。
次に、本発明の第2実施形態の冷却システム、及び冷却システムにおける冷媒供給量の制御方法について、説明する。図2は、本発明の第2実施形態による冷却システムを示す構成図である。第1実施形態と同様な要素については同じ参照番号を付与することにより、詳細な説明を省略する。本実施形態は、第1実施形態の変形例であり、蒸発部毎に第2冷媒タンクを設けたものである。
次に、本発明の第3実施形態の冷却システム、及び冷却システムにおける冷媒供給量の制御方法について、説明する。図3は、本発明の第3実施形態による冷却システムを示す構成図である。第1実施形態や第2実施形態と同様な要素については同じ参照番号を付与することにより、詳細な説明を省略する。本実施形態は、第2実施形態の変形例であり、第2冷媒タンク毎に冷媒制御機構を設けたものである。
次に、本発明の第4実施形態の冷却システム、及び冷却システムにおける冷媒供給量の制御方法について、説明する。図4は、本発明の第4実施形態による冷却システムを示す構成図である。第1実施形態乃至第3実施形態と同様な要素については同じ参照番号を付与することにより、詳細な説明を省略する。本実施形態による冷却システムは、第2実施形態における蒸発部101及び第2冷媒タンク107を高さ方向に多段化したものである。
次に、本発明の第5実施形態の冷却システム、及び冷却システムにおける冷媒供給量の制御方法について、説明する。図5は、本発明の第5実施形態による冷却システムを示す構成図である。第1実施形態乃至第4実施形態と同様な要素については同じ参照番号を付与することにより、詳細な説明を省略する。本実施形態に係る冷却システムは、第3実施形態における蒸発部101及び第2冷媒タンク107及び冷媒供給量抑制機構111を高さ方向に多段化したものとなっている。本実施形態による冷却システムは、第4実施形態と同様に、外形が縦長形状の二つのサーバラック100に対し、外形が横長形状の蒸発部101を複数配置したものである。そして本実施形態に係る冷却システムは、第2冷媒タンク107及び冷媒供給量抑制機構111を蒸発部101毎に備えたものである。
次に、本発明の第6実施形態の冷却システム、及び冷却システムにおける冷媒供給量の制御方法について、説明する。図6は、本発明の第6実施形態による冷却システムを示す構成図である。本実施形態は第2実施形態の冷却システムの変形例であり、側面と底面とに接続口を有する冷媒タンク203と、複数の蒸発部201に対し一つの第2冷媒タンク210を用いたものである。
次に、本発明の第7実施形態の冷却システム、及び冷却システムにおける冷媒供給量の制御方法について、説明する。図7は、本発明の第7実施形態による冷却システムを示す構成図である。第6実施形態と同様な要素については同じ参照番号を付与することにより、詳細な説明を省略する。
次に、本発明の第8実施形態の冷却システム、及び冷却システムにおける冷媒供給量の制御方法について、説明する。図8は、本発明の第8実施形態による冷却システムを示す構成図である。第6実施形態や第7実施形態と同様な要素については同じ参照番号を付与することにより、詳細な説明を省略する。本実施形態に係る冷却システムは、第6実施形態や第7実施形態における蒸発部201及び第2冷媒タンク210を高さ方向に多段化したものとなっている。本実施形態による冷却システムは、第4実施形態や第5実施形態と同様に、外形が縦長形状の二つのサーバラック200に対し、外形が横長形状の蒸発部201を複数配置したものである。
次に、本発明の第9実施形態の冷却システム、及び冷却システムにおける冷媒供給量の制御方法について、説明する。図9は、本発明の第9実施形態による冷却システムを示す構成図である。第6実施形態乃至第8実施形態と同様な要素については同じ参照番号を付与することにより、詳細な説明を省略する。本実施形態に係る冷却システムは、第7実施形態における蒸発部201、第2冷媒タンク210及び冷媒供給量抑制機構211を高さ方向に多段化したものとなっている。本実施形態による冷却システムは、第4実施形態、第5実施形態や第8実施形態と同様に、外形が縦長形状の二つのサーバラック200に対し、外形が横長形状の蒸発部201を複数配置したものである。そして本実施形態に係る冷却システムは、第2冷媒タンク210及び冷媒供給量抑制機構211を蒸発部201毎に備えたものである。
(付記1)液相冷媒を貯蔵する第1冷媒タンクと、前記第1冷媒タンクから供給された液相冷媒を気化させる複数の蒸発部と、前記蒸発部で気化した気相冷媒を液化させる凝縮部と、前記蒸発部と前記凝縮部を接続し前記気相冷媒が流動する蒸気管と、前記凝縮部と前記第1冷媒タンク及び前記第1冷媒タンクと前記複数の蒸発部とを接続し前記液相冷媒が流動する液管とを備える冷却システムであって、前記凝縮部は前記複数の蒸発部より上方に配置されており、前記第1冷媒タンクは前記凝縮部より下方に配置している、冷却システム。
(付記2)前記第1冷媒タンクは、前記複数の蒸発部より上方に配置されている、付記1に記載の冷却システム。
(付記3)前記第1冷媒タンクより下方に配置された第2冷媒タンクをさらに備える、付記1又は付記2に記載の冷却システム。
(付記4)前記第2冷媒タンク内に貯蔵された前記液相冷媒の少なくとも一部は前記第1冷媒タンクへ流動する、付記3に記載の冷却システム。
(付記5)前記第2冷媒タンク内に貯蔵された前記液相冷媒の少なくとも一部を前記第1冷媒タンクへ流動させるポンプを有する、付記3又は付記4に記載の冷却システム。
(付記6)前記第2冷媒タンクは、前記複数の蒸発部にそれぞれ設けられている、付記3乃至付記5のいずれか一つに記載の冷却システム。
(付記7)前記第2冷媒タンク内に貯蔵された前記液相冷媒の一部を前記第1冷媒タンクへ流動させるポンプをさらに有し、前記ポンプは、前記複数の蒸発部にそれぞれ設けられた前記第2冷媒タンク内に貯蔵された前記液相冷媒の少なくとも一部を前記第1冷媒タンクへと送る、付記6に記載の冷却システム。
(付記8)前記複数の蒸発部は鉛直方向に沿って配列されており、前記鉛直方向に沿って配列された前記複数の蒸発部に対応して、前記第2冷媒タンクは鉛直方向に沿って複数配置している、付記3乃至付記5のいずれか一つに記載の冷却システム。
(付記9)前記複数の蒸発部は鉛直方向とは異なる方向に沿ってさらに配置しており、前記鉛直方向とは異なる方向に沿って配置した前記複数の蒸発部に対応して、前記第2冷媒タンクがそれぞれ配置されている、付記3乃至付記5のいずれか一つに記載の冷却システム。
(付記10)複数の前記第2冷媒タンクのうち、一の第2冷媒タンク内に貯蔵された前記液相冷媒の一部は、下方に位置する他の第2冷媒タンクに流動する、付記8又は付記9に記載の冷却システム。
(付記11)前記第2冷媒タンク内に貯蔵された前記液相冷媒の一部を前記第1冷媒タンクへ流動させるポンプをさらに有し、前記複数の前記第2冷媒タンクのうち、下方に位置する第2冷媒タンク内に貯蔵された前記液相冷媒の一部は、前記第1冷媒タンクへ前記ポンプで流動させられる、付記3乃至付記9のいずれか一つに記載の冷却システム。
(付記12)複数の前記第2冷媒タンクのうち、一の第2冷媒タンクから前記液相冷媒が前記複数の蒸発部へ流動する、付記3乃至付記11のいずれか一つに記載の冷却システム。
(付記13)前記第1冷媒タンクと前記第2冷媒タンクを接続する液管の間に配置され、前記液相冷媒の供給量を制御する冷媒制御機構をさらに含む、付記3乃至付記12のいずれか一つに記載の冷却システム。
(付記14)前記複数の第2冷媒タンクと前記第1冷媒タンクを接続する液管の間に、前記液相冷媒の供給量を制御する冷媒制御機構がそれぞれ配置している、付記3乃至付記12のいずれか一つに記載の冷却システム。
(付記15)前記第2冷媒タンクは鉛直方向に沿って複数配列されており、前記液相冷媒の供給量を制御する冷媒制御機構が一の第2冷媒タンクと他の第2冷媒タンクを接続する液管の間に配置している、付記9又は付記14に記載の冷却システム。
(付記16)液相冷媒を貯蔵する冷媒タンクと、前記冷媒タンクから供給された液相冷媒を気化させる複数の蒸発部と、前記蒸発部で気化した気相冷媒を液化させる凝縮部と、前記蒸発部と前記凝縮部を接続し前記気相冷媒が流動する蒸気管と、前記凝縮部と前記冷媒タンク及び前記冷媒タンクと前記複数の蒸発部とを接続し前記液相冷媒が流動する液管とを備える冷却システムにおける前記蒸発部へ供給する前記液相冷媒の量を、前記冷媒タンクの配置を鉛直方向で変化させることによって制御する、冷却システムにおける冷媒供給量の制御方法。
(付記17)前記冷媒タンクの鉛直方向の位置を変化させることにより、前記冷媒タンク内の前記液相冷媒の液面高さを制御し、前記蒸発部への液相冷媒の供給量を制御する、付記16に記載の冷却システムにおける冷媒供給量の制御方法。
100a、200a 設置面
101、201 蒸発部
102、202 凝縮部
103、203 冷媒タンク
104、104a、104b、204、204a、204b、204c 液管
105、205 蒸気管
106、206 冷媒
107、210 第2冷媒タンク
108、208 ポンプ
109、209 冷媒回収配管
111、211 冷媒供給量抑制機構
Claims (10)
- 液相冷媒を貯蔵する第1冷媒タンクと、
前記第1冷媒タンクから供給された液相冷媒を気化させる複数の蒸発部と、
前記蒸発部で気化した気相冷媒を液化させる凝縮部と、
前記蒸発部と前記凝縮部を接続し前記気相冷媒が流動する蒸気管と、
前記凝縮部と前記第1冷媒タンク及び前記第1冷媒タンクと前記複数の蒸発部とを接続し前記液相冷媒が流動する液管とを備える冷却システムであって、
前記凝縮部は前記複数の蒸発部より上方に配置されており、
前記第1冷媒タンクは前記凝縮部より下方に配置している、冷却システム。 - 前記第1冷媒タンクは、前記複数の蒸発部より上方に配置されている、請求項1に記載の冷却システム。
- 前記第1冷媒タンクより下方に配置された第2冷媒タンクをさらに備える、請求項1又は請求項2に記載の冷却システム。
- 前記第2冷媒タンク内に貯蔵された前記液相冷媒の少なくとも一部は前記第1冷媒タンクへ流動する、請求項3に記載の冷却システム。
- 前記第2冷媒タンク内に貯蔵された前記液相冷媒の少なくとも一部を前記第1冷媒タンクへ流動させるポンプを有する、請求項3又は請求項4に記載の冷却システム。
- 前記第2冷媒タンクは、前記複数の蒸発部にそれぞれ設けられている、請求項3乃至請求項5のいずれか一項に記載の冷却システム。
- 前記第2冷媒タンク内に貯蔵された前記液相冷媒の一部を前記第1冷媒タンクへ流動させるポンプをさらに有し、
前記ポンプは、前記複数の蒸発部にそれぞれ設けられた前記第2冷媒タンク内に貯蔵された前記液相冷媒の少なくとも一部を前記第1冷媒タンクへと送る、請求項6に記載の冷却システム。 - 前記複数の蒸発部は鉛直方向に沿って配列されており、前記鉛直方向に沿って配列された前記複数の蒸発部に対応して、前記第2冷媒タンクは鉛直方向に沿って複数配置している、請求項3乃至請求項5のいずれか一項に記載の冷却システム。
- 前記複数の蒸発部は鉛直方向とは異なる方向に沿ってさらに配置しており、前記鉛直方向とは異なる方向に沿って配置した前記複数の蒸発部に対応して、前記第2冷媒タンクがそれぞれ配置されている、請求項3乃至請求項5のいずれか一項に記載の冷却システム。
- 液相冷媒を貯蔵する冷媒タンクと、前記冷媒タンクから供給された液相冷媒を気化させる複数の蒸発部と、前記蒸発部で気化した気相冷媒を液化させる凝縮部と、前記蒸発部と前記凝縮部を接続し前記気相冷媒が流動する蒸気管と、前記凝縮部と前記冷媒タンク及び前記冷媒タンクと前記複数の蒸発部とを接続し前記液相冷媒が流動する液管とを備える冷却システムにおける前記蒸発部へ供給する前記液相冷媒の量を、
前記冷媒タンクの配置を鉛直方向で変化させることによって制御する、冷却システムにおける冷媒供給量の制御方法。
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| US14/903,205 US20160174417A1 (en) | 2013-07-12 | 2014-07-10 | Cooling system and method for controlling refrigerant supply volume in cooling system |
| JP2015526173A JPWO2015004920A1 (ja) | 2013-07-12 | 2014-07-10 | 冷却システム、及び冷却システムにおける冷媒供給量の制御方法 |
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| CN106304752A (zh) * | 2015-05-19 | 2017-01-04 | 王玉富 | 一种适用于服务器分层配置的相变换热机柜 |
| CN107580804A (zh) * | 2015-05-04 | 2018-01-12 | 谷歌有限责任公司 | 冷却数据中心中的电子设备 |
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