WO2015093794A1 - Composition for forming dicing film adhesive layer, and dicing film - Google Patents

Abstract

The present invention relates to a composition for forming a dicing film adhesive layer, a dicing film containing an adhesive layer comprising the composition, a dicing die bonding film containing the dicing film, and a method for dicing a semiconductor wafer by using the dicing die bonding film, the composition comprising: a polymer additive comprising one or more types of polymers selected from the group consisting of a polymer containing a (meth)acrylate-based functional group and a nonpolar functional group, a (meth)acrylate-based polymer containing at least one fluorine, and a silicone modified (meth)acrylate-based polymer containing a reactive functional group; an adhesive binder; and a photoinitiator, wherein the weight ratio of the polymer additive to the adhesive binder is 0.01-4.5%.

Description

 【Specification】

 [Name of invention]

Dicing film adhesive layer forming composition and ^' dicing film

 Technical Field

 The present invention relates to a composition for forming a dicing film adhesion layer and a dicing film.

 [Technique to become background of invention]

 In general, the manufacturing process of the semiconductor chip includes a process of forming a fine pattern on the wafer and a process of polishing and packaging the wafer to meet the specifications of the final device.

 The packaging process includes a wafer inspection process for inspecting a defect of a semiconductor chip; A dicing step of cutting the wafer into separate chips; A die bonding process of attaching the separated chip to a circuit film (ci rcui t f i lm) or a mounting plate of a lead frame; A wire bonding process of connecting the chip pad provided on the semiconductor chip and the circuit pattern of the circuit film or the lead frame with electrical connection means such as wire; A molding process of wrapping the outside with an encapsulant to protect the internal circuit and other components of the semiconductor chip; Trim process for cutting the dam bar connecting the lead and the lead; Forming process of bending the lead into a desired shape; And a finished product inspection process for inspecting defects of the finished package.

Dicing step, the diamond wafer to the wheel, such as the process proceeds the ^'standing after the laminate, the process of dicing the film to come appropriate conditions and the rear face of the wafer in order to secure the predetermined is cut to a thickness of eu The wafer. In addition, a die bonding film (adhesive film) is used to attach the diced individual chips to the circuit board.

 On the other hand, the dicing process is a step of cutting a semiconductor wafer with a dicing blade, and irradiating ultraviolet rays to the base film of the semiconductor wafer, for cutting the semiconductor wafer. Picking up the individual chips separated by the step, there is a problem that the fixation between the film occurs during the pick-up process and the peel strength between the film is too low, the success of the pick-up of the chip is lowered or the chip crack occurs during the pickup .

 [Content of invention]

Problem to be solved The present invention is a dicing for providing a dicing die-bonding film that can prevent the sticking between the films in the dicing process to increase the pick-up success rate and exhibit a relatively high die share strength to prevent the peeling phenomenon due to the adhesive force degradation It is to provide a composition for forming a film adhesion layer.

 In addition, the present invention is to provide the dicing die-bonding film. In addition, the present invention is to provide a dicing method of a semiconductor wafer using the dicing die bonding film.

 [Measures of problem]

 In the present specification, the group consisting of a polymer containing a (meth) acrylate-based functional group and a non-polar functional group, a (meth) acrylate-based polymer containing at least one fluorine and a silicone-modified (meth) acrylate-based polymer containing a semi-functional group A polymer additive comprising at least one polymer selected from; Adhesive binders; And a photoinitiator, wherein the weight ratio of the polymer additive to the adhesive binder is

The composition for dicing film adhesion layer formation which is 0.01%-4.5% is provided.

 The polymer including the (meth) acrylate-based functional group and the non-polar functional group may include a repeating unit represented by the following Chemical Formula 1.

 In Formula 1, ¾ is hydrogen, an alkyl group having 1 to 20 carbon atoms, ¾ is hydrogen, an alkyl group having 1 to 20 carbon atoms, a polyester group or a polyether group, and n is an integer of 1 to 300.

The (meth) acrylate polymer containing one or more fluorine may include a (meth) acrylate polymer substituted with a perfluoroalkyl group having 1 to 10 carbon atoms or a fluorinated alkenyl group having 1 to 10 carbon atoms. The silicone-modified (meth) acrylate-based polymer including the reactive functional group may include at least one ^"" semi-active functional group selected from the group consisting of a hydroxy group, an alkylene alcohol having 1 to 10 carbon atoms, an epoxy, an amino group, a thi group, or a carboxyl group. It may include a silicone-modified (meth) acrylate-based polymer substituted above.

 The polymer additive may further include one or more organic solvents selected from the group consisting of alcohols, ethers, acetates and ketones.

 1% by weight to 50% by weight of each of the polymer including the (meth) acrylate-based functional group and the non-polar functional group and the silicone-modified (meth) acrylate-based polymer including the semi-aromatic functional group? It may have an acid value of 10 mg OH / g to 50 mg KOH / g based on an organic solution of ¾.

 The adhesive binder may be a (meth) acrylate-based polymer or a (meth) acrylate-based one or more substituted or unsubstituted one or more functional groups selected from the group consisting of a hydroxyl group, an isocyanate group, a vinyl group, and a (meth) acrylate group. Copolymers may be included.

 The adhesive binder may include an internal adhesive binder in which an acrylate having a carbon-carbon double bond is added to the side chain of the (meth) acrylate resin. For example, a polymer resin in which 1 wt% to 45 wt% of a (meth) acrylate functional group is added to the main chain of the (meth) acrylate base resin as a side chain may be used as the intrinsic adhesive binder.

 The adhesive binder may include a polymer resin having a weight average molecular weight of 100, 000 to 1, 500, 000.

 The photoinitiator is a group consisting of benzoin and its alkyl ethers, acetophenones, anthraquinones, thioxanthones, ketals, benzophenones, α-aminoacetophenones, acylphosphine oxides, and oxime esters. It may include one or more selected from.

 The photoinitiator may include 0.01 to 5 parts by weight based on 100 parts by weight of the adhesive binder.

The composition for forming a dicing film adhesive layer may further include a curing agent. The curing agent may include at least one selected from the group consisting of an isocyanate compound, an aziridine compound, an epoxy compound, and a metal chelate compound. Can be.

 The dicing film adhesive layer-forming composition may include 0.01 to 30 parts by weight of the curing agent relative to 100 parts by weight of the adhesive binder. In addition, in the present specification, a dicing film comprising a base film and a pressure-sensitive adhesive formed on at least one surface of the base film, wherein the pressure-sensitive adhesive layer comprises the composition for forming a .dielectric film pressure-sensitive adhesive layer of claim 1 to be provided. Can be.

 The base film has a thickness of 10 to 200 IM, and the adhesive layer has a thickness of 0.5 μπι to 50.

 In addition, in the present specification, the dicing film; And an adhesive layer formed on at least one surface of the dicing film, a dicing die bonding film may be provided.

 In addition, in the present specification, the dicing die bonding film; And a wafer stacked on at least one surface of the dicing die-bonding film; a preprocessing step of partially or partially dividing the semiconductor wafer; Expanding the semiconductor wafer after the pretreatment step; And irradiating ultraviolet rays to the base film of the expanded semiconductor wafer and picking up individual chips separated by the division of the semiconductor wafer.

 【Effects of the Invention】

 Dicing film adhesive layer for providing a dicing die-bonding film that can prevent the sticking between the films in the dicing process to increase the pick-up success rate and exhibit a relatively high die share strength to prevent the peeling phenomenon due to the decrease in adhesion A dicing method comprising a dicing film comprising the composition for forming and the adhesive layer comprising the composition and the dicing film, and a dicing method of a semiconductor wafer using the dicing die bonding film is provided.

 [Specific contents to carry out invention]

Hereinafter, a dicing method according to a specific embodiment of the present invention, a dicing die bonding film, and a dicing method of a semiconductor wafer will be described in detail. According to one embodiment of the invention, a (meth) acrylate-based polymer and a non-polar functional group, a polymer, a (meth) acrylate-based polymer containing at least one fluorine and a silicone modified (meth) acrylate-based containing a semi-functional group A polymer additive comprising at least one polymer selected from the group consisting of polymers; Adhesive binders; And a photoinitiator, wherein the weight ratio of the polymer additive to the adhesive binder is 0.01% to 4.5%, and a dicing film adhesive layer-forming composition may be provided.

 Previously, there were problems that fixation between films occurred during the picking process during the dicing process, and that the peeling success between chips was reduced due to excessive peel strength between films.

 Accordingly, the inventors of the present invention provide a polymer comprising a (meth) acrylate-based functional group and a non-polar functional group, a (meth) acrylate-based polymer containing at least one fluorine, and a silicone-modified (meth) acrylate-based polymer containing a reactive functional group. When using a dicing film comprising a pressure-sensitive adhesive layer formed from the composition for forming a dicing film pressure-sensitive adhesive layer containing a polymer additive containing at least one polymer selected in a specific content, the anti-fixing between the film and the fill between the film Through the experiments, it is possible to improve the pick-up success rate of chips by lowering the strength, to exhibit a relatively high die share strength, to prevent delamination due to deterioration of adhesion force, and to improve the reliability of the semiconductor manufacturing process. The invention has been completed.

 Each of the (meth) acrylate-based polymer and the non-polar functional group, the (meth) acrylate-based polymer containing at least one fluorine and the silicone-modified (meth) acrylate-based polymer including the semi-aromatic functional group, each of the Certain nonpolar moieties that are present within the molecule, while more compatible with the adhesive binder and can be easily combined, can be exposed to the top of the increasingly adherent layer made from the composition to impart releasability and slippage.

 Accordingly, the polymer additive may be more effective in providing releasability and slippage as the non-polar part is positioned on the surface of the adhesive layer while minimizing transfer by reacting with the adhesive binder.

In particular, the polymer additive is 0.01% to 4.5% compared to the adhesive binder, —_

Or 0.1% to 2% by weight, and despite the relatively low usage, the adhesive layer of the dicing film prepared from the dicing film adhesive layer-forming composition of the embodiment may have a peel strength, for example, UV. 180 degrees peeling force and tack strength and peeling force against SUS can be greatly increased before and after irradiation.

 If the weight ratio of the polymer additive to the pressure-sensitive adhesive is too low, the adhesive layer of the die film prepared from the dicing film adhesive layer-forming composition of the embodiment is peel strength, for example, 180 degrees peeling force before and after uv irradiation and Tack strength and

Peeling force against SUS can be greatly increased.

 In addition, if the weight ratio of the polymer additive to the adhesive binder is too high, the adhesive strength of the dicing film prepared from the dicing film adhesive layer-forming composition of the embodiment may lower the peel strength to some extent, the die of the adhesive layer As the shear strength is significantly lowered, peeling may occur due to a decrease in adhesive strength, and thus, reliability may be degraded during semiconductor manufacturing.

 The polymer including the (meth) acrylate-based functional group and the non-polar functional group may include a repeating unit represented by the following Chemical Formula 1.

 [Formula 1]

 In Formula 1, ^ is hydrogen, an alkyl group having 1 to 20 carbon atoms, ¾ is hydrogen, an alkyl group having 1 to 20 carbon atoms, a polyester group or a polyether group, n is an integer of 1 to 300.

Examples of commercially available products of the polymer including the (meth) acrylate-based functional groups and non-polar functional groups include BYKO-350, BYK-352, BYK-354, BYK-355, BYK-356, BY -358N, BYK-361N, BYK- 380, BYK-392 or BYK-394, but the specific examples of the polymer additives are not limited thereto. The (meth) acrylate-based polymer containing one or more of the bloso is substituted with a perfluoroalkyl group having 1 to 10 carbon atoms or a fluorinated alkenyl group having 1 to 10 carbon atoms.

It may contain a (meth) acrylate-based polymer.

 Examples of commercially available products of the (meth) acrylate-based polymer containing one or more of fluorine include Psentant 222F (manufactured by Neos), F470 (DIC), F489 (DIC), or V-8FM. In addition, specific examples of the polymer additives are not limited thereto.

 The silicone-modified (meth) acrylate-based polymer including the semi-functional group includes one or more reactive functional groups selected from the group consisting of a hydroxy group, an alkylene alcohol having 1 to 10 carbon atoms, an epoxy, an amino group, a thiol group, or a carboxyl group. Silicone-modified (meth) acrylate-based polymer may be included.

 More specific examples of the silicone-modified (meth) acrylate-based polymer containing the reactive functional group include a hydroxy functional silicone-modified polyacrylate, examples of commercially available products thereof include BYK SIL-CLEAN 3700, Specific examples of the polymer additives are not limited thereto.

 1 type selected from the group consisting of a polymer including the (meth) acrylate-based functional group and a non-polar functional group, a (meth) acrylate-based polymer including one or more fluorine, and a silicone-modified (meth) acrylate-based polymer containing a reactive functional group The polymer additive including the above polymer may further include one or more organic solvents selected from the group consisting of alcohols, ethers, acetates, and ketones.

 The polymer additive may include 1 to 50% by weight of the polymer and the remaining amount of the organic solvent.

 10 mg KOH / g based on the organic solution of 1% by weight to 50% by weight of each of the polymer including the (meth) acrylate-based functional group and the non-polar functional group and the silicone-modified (meth) acrylate-based polymer including the semi-aromatic functional group And an acid value of from 50 mg KOH / g, or 20 mg KOH / g to 40 mg KOH / g.

On the other hand, the adhesive binder may use a polymer resin known to be able to be used to form a tack of the dicing film without great limitation, for example A polymer resin in which a predetermined reactive functional group is substituted or a polymer resin in a main chain including a reactive functional group can be used.

 Specifically, the adhesive binder is a (meth) acrylate polymer or (meth) in which at least one functional group selected from the group consisting of a hydroxyl group, an isocyanate group, a vinyl group, and a (meth) acrylate group is substituted or unsubstituted It may include an acrylate copolymer.

 In addition, the pressure-sensitive adhesive binder may be an internal pressure-sensitive adhesive binder in which an acrylate having a carbon to carbon double bond is added to the side chain of the (meth) acrylate resin. For example, a polymer resin in which 1 wt% to 45 wt% of a (meth) acrylate functional group is added to the main chain of the (meth) acrylate base resin as a side chain may be used as the internal adhesive binder.

 The adhesive binder may include a polymer resin having a weight average molecular weight of 100, 000 to 1, 500, 000.

 Specifically, the (meth) acrylate polymer or (meth) acrylate type in which at least one functional group selected from the group consisting of the hydroxy group, the isocyanate group, the vinyl group and the (meth> acrylate group) is substituted or unsubstituted The copolymer may have a weight average molecular weight of 100, 000 to 1, 500, 000.

 In the present specification, (meth) acrylate is meant to include both acrylate [acryl ate] and (meth) acrylate [(meth) acrylate].

 Such a (meth) acrylate polymer or a (meth) acrylate copolymer may be, for example, a polymer or copolymer of a (meth) acrylic acid ester monomer and a crosslinkable functional group-containing monomer.

At this time, examples of the (meth) acrylic acid ester monomer include alkyl (meth) acrylate, and more specifically, a monomer having an alkyl group having 1 to 12 carbon atoms, pentyl (meth) acrylate, and n-butyl (meth). ) Acrylate, ethyl (meth) acrylate, methyl (meth) acrylate, nucleus (meth) acrylate, n-octyl (meth) acrylate, isooctyl (meth) acrylate, 2-ethylyl nucleus (meth) Or a mixture of one or more kinds of acrylate, dodecyl (meth) acrylate or decyl (meth) acrylate. The higher the carbon number of the alkyl monomer is used, the lower the glass transition temperature of the final copolymer, What is necessary is just to select the appropriate monomer according to the glass transition temperature of interest.

 In addition, examples of the crosslinkable functional group-containing monomer include one or more kinds of hydroxy group-containing monomers, carboxyl group-containing monomers, or nitrogen-containing monomers. At this time, examples of the hydroxyl group-containing compound include 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, and the like. Examples of the carboxyl group-containing compound include (meth) acrylic acid. And the like, and examples of the nitrogen-containing monomer include (meth) acrylonitrile, N ᅳ vinyl pyrrolidone or N ᅳ vinyl caprolactam, but are not limited thereto. The (meth) acrylate resin may further include vinyl acetate, styrene, or acrylonitrile carbon-carbon double defect-containing low molecular weight compounds and the like from the viewpoint of improving other functionalities such as compatibility.

 In addition, the internal pressure-sensitive adhesive binder to which the acrylate having a carbon-carbon double bond is added to the side chain of the (meth) acrylate resin may have a weight average molecular weight of 100, 000 to 1, 500, 000.

 When the weight average molecular weight of the polymer resin included in the adhesive binder is too low, the coating property or the cohesion of the dicing film adhesive layer-forming composition of the embodiment may be lowered, the peeling of the adhesive layer formed from the composition of the embodiment Residue may remain on the adherend or the adhesive layer may be destroyed.

 In addition, when the weight average molecular weight of the polymer resin included in the adhesive binder is too high, ultraviolet curing of the composition for forming a die-film adhesive layer of the embodiment may not occur in a small amount, thereby peeling off the adhesive layer formed from the composition. The force may not be significantly lowered, which may lower the pickup success.

 On the other hand, the dicing film adhesive layer-forming composition may further comprise an ultraviolet curable compound.

 The type of the UV-curable compound is not particularly limited, and for example, a polyfunctional compound having a weight average molecular weight of about 500 to 300, 000 (ex. Polyfunctional urethane acrylate, polyfunctional acrylate monomer or oligomer, etc.) Can be used. The average person skilled in the art can easily select the appropriate compound according to the intended use.

The content of the ultraviolet curable compound is 100 parts by weight of the above-mentioned adhesive binder 5 to 400 parts by weight, preferably 10 to 200 parts by weight, relative to the total amount. If the content of the ultraviolet curable compound is less than 5 parts by weight, there is a risk that the drop in adhesive strength after curing is not divided, the pick-up property may be degraded. There is a fear that it will not be made easily.

 On the other hand, specific examples of the photoinitiator included in the composition for forming a dicing film adhesive layer of the above embodiment is not limited, and conventionally known photoinitiators may be used without particular limitation O. For example, as the photoinitiator, benzoin and its alkyl ethers, acetophenones, anthraquinones, thioxanthones, ketals, benzophenones, α-aminoacetophenones, acylphosphine oxides, and oximes Esters or two or more kinds thereof can be used.

The amount of the photoinitiator is determined in consideration with such type and characteristics of the adhesive binder used and the properties and characteristics of the adhesive layer to be produced, and ^', for example, the embodiment dicing film composition for adhesive layer formation is the adhesive binder 100 It may include 0.01 to 8 parts by weight of the photoinitiator relative to parts by weight.

 On the other hand, the composition for forming a dicing film adhesion layer of the embodiment may further comprise a curing agent. When the composition for forming the dicing film pressure-sensitive adhesive layer of the embodiment is coated with the base film, the curing agent may react with the reactor of the pressure-sensitive adhesive or react at a temperature of 30 to 50 ° C. to form a crosslink. In addition, the predetermined semi-unggi contained in the curing agent remains in the non-ungung state, and further cross-linking is carried out through UV irradiation before pickup, thereby lowering the adhesive force of the adhesive layer.

 The curing agent may include one or more selected from the group consisting of an isocyanate compound, an aziridine compound, an epoxy compound, and a metal chelate compound.

The amount of the curing agent may be determined in consideration of the physical properties and properties of the adhesive layer to be prepared and the type and characteristics of the adhesive binder used, for example, the composition for forming a dicing film adhesive layer of the embodiment is 100 weight of the adhesive binder. It may comprise 0.1 to 30 parts by weight of the curing agent relative to parts. On the other hand, according to another embodiment of the invention, the base film and the base film It includes a pressure-sensitive adhesive layer formed on at least one surface, wherein the pressure-sensitive adhesive layer may be provided with a dicing film comprising a composition for forming a die film adhesion layer of the above-described embodiment. The type of the base film is not particularly limited, and for example, a plastic film or a metal foil known in the art may be used. For example, the base film may include low density polyethylene, linear polyethylene, medium density polyethylene, high density polyethylene, ultra low density polyethylene, random copolymer of polypropylene, block copolymer of polypropylene, homopolypropylene, polymethylpentene (po l ymethyl pent ene), ethylene-vinyl acetate copolymer, ethylene-methacrylic acid copolymer, ethylene-methyl methacrylate copolymer, ethylene-ionomer copolymer, ethylene-vinyl alcohol copolymer, polybutene, styrene copolymer or And a combination of two or more of these. The meaning of the base film including a mixture of two or more polymers in the above means that a film having a structure in which two or more layers of films including each of the aforementioned polymers are laminated or a single layer containing two or more of the aforementioned polymers includes both films. do.

The thickness of the base film is not particularly limited, and is usually formed in a thickness of 10 kPa to 200 kPa, preferably 50 kPa to 180. If the thickness is less than 10 mm, the control of the cut depth may become unstable in the dicing process. If the thickness exceeds 200 mm, a large amount of burrs may be generated or the elongation is lowered in the dicing process. the extreme pending process there is a concern not done not ^"accurately.

 The base film may be subjected to conventional physical or chemical treatments such as matt treatment, corona discharge treatment, primer treatment or crosslinking treatment, as necessary. The adhesive layer has a thickness of 0. 5 im to 50 μηι, or 5 to 30 days.

 The contents of the dicing film adhesive layer-forming composition included in the adhesive layer include all the contents described above with respect to the embodiment. On the other hand, according to another embodiment of the invention, the dicing film; And an adhesive layer formed on at least one surface of the dicing film.

Specific contents relating to the dicing film include all the above-mentioned contents. The adhesive charge may include an epoxy resin, a low elastic high molecular weight resin, and a curing agent for an adhesive layer. The epoxy resin may include an epoxy resin for general adhesives known in the art, for example, an epoxy resin containing two or more epoxy groups in a molecule and having a weight average molecular weight of 100 to 5,000.

 The epoxy resin may form a hard crosslinked structure through a curing process, and may exhibit excellent adhesion, heat resistance, and mechanical strength.

 More specifically, as the epoxy resin, it is particularly preferable to use an epoxy resin having an average epoxy equivalent of 100 to 1,000. If the epoxy equivalent of the said epoxy resin is less than 100, a crosslinking density will become high too much, and there exists a possibility that an adhesive film may show a hard property as a whole, and when the epoxy equivalent of the said epoxy resin exceeds 1,000, there exists a possibility that heat resistance may fall.

 As an example of the said epoxy resin, Bifunctional epoxy resin, such as a bisphenol A epoxy resin or a bisphenol F epoxy resin; Or cresol novolac epoxy resin, phenol novolac epoxy resin, tetrafunctional epoxy resin, biphenyl type epoxy resin, triphenol methane type epoxy resin, alkyl modified triphenol methane type epoxy resin, naphthalene type epoxy resin, dicyclopentadiene One kind or two or more kinds of polyfunctional epoxy resins having three or more functional groups, such as a type epoxy resin or a dicyclopentadiene modified phenol type epoxy resin, are not limited thereto.

 It is preferable to use the mixed resin of a bifunctional epoxy resin and a polyfunctional epoxy resin as said epoxy resin.

The term “multifunctional epoxy resin” refers to an epoxy resin having three or more functional groups: That is, in general, a bifunctional epoxy resin has excellent flexibility and flowability at high temperatures, but has low heat resistance and curing rate, while a functional group The polyfunctional epoxy resin having three or more has a fast curing rate and shows excellent heat resistance due to high crosslinking density, but is inferior in flexibility and flowability. Therefore, by appropriately mixing and using the above two kinds of resins, it is possible to suppress chip scattering and burr generation during the dicing process while controlling the elasticity and tack characteristics of the adhesive layer. The low elastic high molecular weight resin is a soft segment in the adhesive It can play a role of imparting the relaxation characteristics at high temperatures. As the high molecular weight resin, it may be blended with the epoxy resin to cause viscoelasticity after formation of a crosslinked structure without causing breakage during film formation, and any resin component may be used as long as it has excellent compatibility with other components and storage stability. Can be.

 The specific kind of the low elastic high molecular weight resin is not particularly limited as long as it satisfies the above-described characteristics. For example, polyimide, polyetherimide, polyesterimide, polyamide, polyether sulfone, polyether ketone, polyolefin Or a mixture of one or more kinds of polyvinyl chloride phenoxy, semi-acrylonitrile butadiene rubber or a (meth) acrylate resin. Specific examples of the (meth) acrylate-based resin may include an acrylic copolymer including (meth) acrylic acid and derivatives thereof, and examples of (meth) acrylic acid and derivatives thereof include (meth) acrylic acid; Alkyl (meth) acrylate containing a C1-C12 alkyl group, such as methyl (meth) acrylate or ethyl (meth) acrylate; (Meth) acrylonitrile or (meth) acrylamide; And other co-polymerizable monomers.

 The (meth) acrylate resin may also include one or more functional groups such as glycidyl group, hydroxy group, carboxyl group and amine group, and such functional group may be glycidyl (meth) acrylate, hydroxy ( It can introduce | transduce by copolymerizing monomers, such as a meth) acrylate, hydroxyethyl (meth) acrylate, or carboxy (meth) acrylate.

 The curing agent that can be included in the adhesive composition is not particularly limited as long as it can react with the epoxy resin and / or the low elastic high molecular weight resin to form a crosslinked structure. For example, a curing agent capable of forming a crosslinked structure by simultaneously reacting with the two components may be used. Such a curing agent forms a crosslinked structure with the soft and hard segments in the adhesive, respectively, to improve heat resistance, and at the same time, the interface between the two components. It can act as a cross-linking agent of two segments in to improve the reliability of the semiconductor package.

The thickness of the adhesive layer is not particularly limited, but may be, for example, in the range of 1 to 100 Ά, or 3 to 50. On the other hand, according to another embodiment of the invention, the dicing die bonding film; And a wafer stacked on at least one surface of the dicing die-bonding film; a pre-processing step of partially or partially dividing the semiconductor wafer. Comprising: Extreme pending the ^{'pre-treatment} step after the semiconductor wafer; And irradiating ultraviolet rays to the base film of the expanded semiconductor wafer, and picking up individual chips separated by the division of the semiconductor wafer.

 It includes all the above-mentioned content regarding the dicing die-bonding film. Except for the detailed steps of the dicing method, a device, a method, and the like, which are commonly used for a dicing method of a known semiconductor wafer, may be used without particular limitation.

By using a dicing die-bonding film including the dicing film, it is possible to minimize the burr phenomenon that may occur during the dicing process of the semiconductor wafer to prevent contamination of the semiconductor chip and improve the reliability and life of the semiconductor chip. Can be. Specific embodiments of the present invention are described in more detail in the following examples. However, the embodiments described _below. The examples are only illustrative of specific embodiments of the invention, but the content of the present invention is not limited by the following examples. Example 1

 2 parts by weight of isocyanate-based curing agent (polyfunctional isocyanate oligomer), 0.2 parts by weight of BYK-Si lean 3700 (BYK), and 1 part by weight of the photo-curable adhesive binder resin, the photocuring agent, and the increased amount of the photopolymerizable binder resin are UV curable adhesive compositions. Prepared. As the photocurable adhesive binder resin, a polymer resin (Mw 300, 000) in which 20 wt% of an acrylate functional group was added to the main chain of the acrylic base resin as a side chain was used.

The UV-curable pressure-sensitive adhesive composition was coated on one side of a polyolefin film of 100 μm and dried to prepare a dicing film including an adhesive layer of 100 μm. Example 2 2 parts by weight of an isocyanate-based curing agent (polyfunctional isocyanate oligomer), 0.2 parts by weight of BYK-Si lean 394 (by KK), and 1 part by weight of the polylocker TP0 as a photoinitiator with respect to 100 parts by weight of the photocurable adhesive binder resin. Prepared. As the photocurable adhesive binder resin, a polymer resin (Mw 300, 000) in which 20 wt% of an acrylate functional group was added to the main chain of the acrylic base resin as a side chain was used.

 The UV-curable adhesive composition was coated on one side of a polyolefin film of 100 μm and dried to prepare a dicing film including an adhesive layer of 100 μm. Comparative Example 1

 The UV curable adhesive composition was prepared by mixing 2 parts by weight of an isocyanate-based curing agent (polyfunctional isocyanate oligomer) with respect to 100 parts by weight of the photocurable pressure-sensitive adhesive binder resin and 1 part by weight of the multilocker TP0 as a photoinitiator. As the photocurable adhesive binder resin, a polymer resin (Mw 300, 000) in which 20 wt% of an acrylate functional group was added to the main chain of the acrylic base resin as a side chain was used.

 The UV-curable pressure-sensitive adhesive composition was coated on one side of a polyolefin film of 100 μm and dried to prepare a dicing film including an adhesive layer of 100 μl. Comparative Example 2

 2 parts by weight of an isocyanate-based curing agent (polyfunctional isocyanate oligomer), 5 parts by weight of BYK-Sil clean 3700 (BYK), and 1 part by weight of the Darocer TP0 as a photoinitiator, based on 100 parts by weight of the photocurable adhesive binder resin. Prepared. As the photocurable adhesive binder resin, a polymer resin (Mw 300, 000) in which 20 wt% of an acrylate functional group was added to the main chain of the acrylic base resin as a side chain was used.

 The UV-curable pressure-sensitive adhesive composition was coated on one side of a polyolefin film of 100 μm and dried to prepare a dicing film including an adhesive layer of 100 μm. Comparative Example 3

Isocyanate based on 100 parts by weight of photocurable adhesive binder resin 2 parts by weight of a curing agent (polyfunctional isocyanate oligomer), silicone compound oil L one 7500 (Si wet). A UV curable pressure-sensitive adhesive composition was prepared by 5 parts by weight and 1 part by weight of the darocalor TPO as a photoinitiator. As the photocurable adhesive binder resin, a polymer resin (Mw 300, 000) in which 20 wt% of an acrylate functional group was added to the main chain of the acrylic base resin as a side chain was used.

 The UV-curable adhesive composition was coated on one side of a polyolefin film of 100 μm and dried to prepare a dicing film including an adhesive layer of 100 μm. Test Example

 The peeling force, tack test, and pick-up success rate of the dicing films prepared according to Examples 1 to 2 and Comparative Examples 1 to 3 were measured as follows, and the results are shown in the following table and

2 is shown.

1. Determination of 180 degree peeling force between die-bonding film / dicing film (before and after UV curing) For measuring peeling force between the die-bonding film and the PSA layer, the adhesive film was laminated with a dicing film in silver and left for 1 hour. After that, a sample having a width of 25 mm was produced, and the peel strength was measured at 180 degrees at a speed of 300 kW / min, and the value after UV irradiation was further measured. The measurement was performed three or more times per sample to describe the average value.

2. Measurement of 90 degree peel force between SUS and dicing film (before UV curing)

 A dimming film of 25 mm width was prepared, and SUS 304 was made to adhere and adhered. After hardening for 1 hour after adhesion, the 90 degree peeling strength was measured at the speed of 300 kPa / min. The measurement was performed three or more times per sample to describe the average value.

3. Tack test (before and after UV curing)

 Place the adhesive layer of the dicing film on the plate facing up, the diameter

Tack strength was measured using a 1 inch ball type probe. At this time, the force applied to the probe was 800gf, the contact time was 0.01 seconds, the measurement speed of detaching the probe was 1 醒 / s, and the instrument used for the measurement was a texture analyzer. 4. Pickup success rate

 Dicing die-bonding films and wafers prepared from dicing films prepared according to the examples and comparative examples were laminated at 7C C conditions. Subsequently, ultraviolet irradiation was performed on the number and the dicing film surface which carried out the dicing process on the following conditions using the dicing equipment (made by NEON company) on the following conditions. Thereafter, 200 chips were picked up by a die bonder (Shinkawa Co., Ltd.), and the number of chips not picked up was measured and expressed in percentage. [Dicing Condition]

 Blade ： 27HEDD

 Blade rotation speed ： 40, 000rpm

 Speed ： 30mm / s

 ¾ size ： 10 瞧 X 10 隱

 cut depth ： 70um

[UV irradiation condition]

 Lamp ： metal ha 1 i de type

Illuminance ： 70mW / cni ² (Illuminance measurement: UV meter)

Irradiation amount ： 200mJ / cm ² or more (Radiation dose measurement: UV meter)

[Pickup condition]

 Expanding ： ½ηι

 Fin height ： 0.1mm

 Pickup strength ： lOOgf

5. Die Shear Strength

After cutting to 5 隱 5mm using 500um thick wafer coated with dioxide, and dicing die-bonding film, lamination at 60 ° C condition, and removing the dicing film by irradiation with UV, chip size adhesive film Cut only leaving. The top chip of 5 크기 x 5mm size was placed on the bottom chip of 10 讓 × 10mm size, pressed for 2 seconds with a force of 2kgf on a hot plate of 130 ^° C, and then cured at 125 ^° C for 1 hour. After the test specimen prepared as described above was cured at 175 ^° C for 2 hours, the die share strength of the upper chip was measured at 250 degrees.

Table 1

【table. 2】

상기 표 1 및 표 2에 나타난 바와 같이， 상기 실시예 1 내지 2에서 제조된 다이성 필름은 비교예 1 에서 제조된 다이싱 필름에 비하여 UV 조사 전 후에 180도 박리력 및 택 강도가 상대적으로 낮고 SUS 박리력 또한 상대적으로 낮으며 높은 픽업 성공율을 나타낸다는 점이 확인되었다.

As shown in Table 1 and Table 2, the dichroic film prepared in Examples 1 to 2 has a relatively low 180-degree peeling force and tack strength before and after UV irradiation as compared to the dicing film prepared in Comparative Example 1 It was also confirmed that the SUS peeling force was also relatively low, indicating a high pickup success rate.

 In addition, the dicing film prepared in Examples 1 to 2 exhibits a relatively high die share strength compared to the dicing films prepared in Comparative Examples 2 to 3 can prevent the peeling phenomenon due to the adhesive force decrease and thus ripple It has been found that low cracks can be suppressed and the reliability of the semiconductor manufacturing process can be improved.

Claims

【Patent Claims】 【Claim 1】 (Meta)C H Polymer containing acrylate functional group and non-polar functional group, fluorine 2 A polymer additive containing one or more types of polymers selected from the group consisting of o R c C—— I—— (meth)acrylate-based polymers containing at least 1 and silicone-modified (meth)acrylate-based polymers containing semi-male functional groups. ; Adhesive binder; and Contains a photoinitiator; A composition for forming a dicing film adhesive layer, wherein the weight ratio of the polymer additive to the adhesive binder is 0.01% to 4.5%. 【Claim 2】 In clause 1, A composition for forming a dicing film adhesive layer, wherein the polymer containing the (meth)acrylate-based functional group and the non-polar functional group includes a repeating unit of the following formula (1): [Formula 1] =0 2n In group L Formula 1, is hydrogen, an alkyl group having 1 to 20 carbon atoms, R ₂ is hydrogen, an alkyl group having 1 to 20 carbon atoms, . It is a polyester group or a polyether group, and n is an integer from 1 to 300. [Claim 3] In clause 1, The (meth)acrylate-based polymer containing at least one fluorine is substituted with a perfluoroalkyl group having 1 to 10 carbon atoms or a fluorinated alkenyl group having 1 to 10 carbon atoms. A composition for forming a dicing film adhesive layer containing a (meth)acrylate-based polymer. 【Claim 4】 In clause 1, The silicone-modified (meth)acrylate-based polymer containing the semi-male functional group is substituted with at least one semi-male functional group selected from the group consisting of a hydroxy group, an alkylene alcohol having 1 to 10 carbon atoms, an epoxy group, an amino group, a thiol group, or a carboxyl group. Composition for forming a dicing film adhesive layer containing a silicon-modified (meth)acrylate-based polymer. 【Claim 5】 In paragraph 1, The composition for forming a dicing film adhesive layer, wherein the polymer additive further includes at least one organic solvent selected from the group consisting of alcohols, ethers, acetates, and ketones. 【Claim 6】 . In clause 5, Each of the polymer containing the (meth)acrylate functional group and the non-polar functional group and the silicone-modified (meth)acrylate polymer containing the semi-male functional group is 10 nig KOH/g based on an organic solution of 1% to 50% by weight. A composition for forming a dicing film adhesive having an acid value of from 50 nig KOH/g. 【Claim 7】 In clause 1, The adhesive binder includes a hydroxy group, an isocyanate group, a vinyl group, and Containing a (meth)acrylate-based polymer or (meth)acrylate-based copolymer in which one or more functional groups selected from the group consisting of (meth)acrylate groups are substituted or unsubstituted, Composition for forming a dicing film adhesive layer. 【Claim 8】 According to clause 1, The adhesive binder is a composition for forming ^an adhesive layer on a dicing film, comprising an intrinsic adhesive binder in which an acrylate having a carbon-carbon double bond is added to the side chain of a (meth)acrylate resin. 【Claim 9】 In clause 1, The adhesive binder is a composition for forming a dicing film adhesive layer, comprising a polymer resin having a weight average molecular weight of 100,000 to 1,500,000. 【Claim 10】 In paragraph 1, The photoinitiator is a group consisting of benzoin and its alkyl ethers, acetophenones, anthraquinones, thioxanthone, ketal, benzophenone, α-aminoacetophenone, acylphosphine oxide, and oxime ester. A composition for forming a dicing film adhesive layer, comprising at least one selected from . 【Claim 11】 In clause 1, A composition for forming a dicing film adhesive layer, comprising 0.01 to 8 parts by weight of the photoinitiator relative to 100 parts by weight of the adhesive binder. 【Claim 12】 In clause U, A composition for forming a dicing film adhesive layer, further comprising a curing agent. 【Claim 13】 In clause 12 The composition for forming a dicing film adhesive layer, wherein the curing agent includes at least one selected from the group consisting of isocyanate-based compounds, aziridine-based compounds, epoxy-based compounds, and metal chelate-based compounds. 【Claim 14】 In clause 12, A composition for forming a dicing film adhesive layer, comprising 0.1 to 30 parts by weight of the curing agent relative to 100 parts by weight of the adhesive binder. 【Claim 15】 It includes a base film and an adhesive layer formed on at least one side of the base film, The adhesive layer is a dicing film comprising the composition for forming a die-type film adhesive layer of claim 1. , , 【Claim 16】 In clause 15, The thickness of the base film is 10 mi to 200 iM, The thickness of the adhesive layer is 0.5 to 50, dicing film. ' 【Claim 17】 The dicing film of claim 15; And a dicing die-bonding film comprising an adhesive formed on at least one side of the dicing film. 【Claim 18】 The dicing die bonding film of claim 17; and a wafer laminated on at least one side of the dicing die-bonding film; a pretreatment step of completely dividing or partially processing a semiconductor wafer to enable division; Expanding the semiconductor wafer after the preprocessing step; and UV rays are irradiated on the base film of the expanded semiconductor wafer, and A dicing method of a semiconductor wafer, including the step of picking up individual chips separated by dividing the semiconductor wafer.