[go: up one dir, main page]

WO2015088186A1 - Cooling control device for server rack comprising flexible duct - Google Patents

Cooling control device for server rack comprising flexible duct Download PDF

Info

Publication number
WO2015088186A1
WO2015088186A1 PCT/KR2014/011848 KR2014011848W WO2015088186A1 WO 2015088186 A1 WO2015088186 A1 WO 2015088186A1 KR 2014011848 W KR2014011848 W KR 2014011848W WO 2015088186 A1 WO2015088186 A1 WO 2015088186A1
Authority
WO
WIPO (PCT)
Prior art keywords
duct
cooling
server rack
supplied
temperature
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2014/011848
Other languages
French (fr)
Korean (ko)
Inventor
태효식
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HANKYUNG-INET CO LTD
Original Assignee
HANKYUNG-INET CO LTD
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by HANKYUNG-INET CO LTD filed Critical HANKYUNG-INET CO LTD
Publication of WO2015088186A1 publication Critical patent/WO2015088186A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20718—Forced ventilation of a gaseous coolant
    • H05K7/20736—Forced ventilation of a gaseous coolant within cabinets for removing heat from server blades
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/18—Construction of rack or frame
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Definitions

  • the present invention relates to a server rack, and more particularly to a server rack capable of performing a cooling function using a duct made of a flexible material so that the computing equipment mounted therein can operate smoothly. It relates to a cooling control device for a server rack having a flexible duct that can be controlled.
  • server racks on which servers, repeaters, exchangers, and various network equipment are mounted.
  • computing equipment such as servers mounted in the server rack generates heat during its operation to increase the temperature inside the server rack.
  • Such computing equipment operates smoothly at a certain temperature range, whereas if the temperature is too high, There is a risk of loss of life or malfunction.
  • the server rack is provided with a cooling device for maintaining the internal temperature within a predetermined range, and performs the cooling operation by supplying cool air into the server rack from the cooling device.
  • a cooling device for maintaining the internal temperature within a predetermined range, and performs the cooling operation by supplying cool air into the server rack from the cooling device.
  • a rectangular pillar-shaped duct is adopted on both sides of the inner front of the server rack, and the server is mounted in a space between the two ducts, so that the horizontal of the server rack is provided. It causes the width to increase. In this case, if the space between both ducts is adjusted as narrow as possible to the horizontal width of the server, there is a risk of damaging the server by colliding with the duct outer wall when mounting the server.
  • cooling of the server is performed using conduits extending from both sides of the server rack, and ducts for supplying cold air to the conduits are provided on both sides of the server rack. Positioning is a cause of increasing the horizontal width of the server rack, there is a problem that there is a risk of damage to the server by a collision as described above.
  • An object of the present invention for solving the above problems, while supplying cold air to each computer equipment mounted on the server rack using a duct made of a flexible material to expand in accordance with the internal air pressure to form a tube shape, the inside of the server rack It is an object of the present invention to provide a cooling control apparatus for a server rack having a flexible duct capable of controlling the cooling to be performed properly in consideration of the temperature and the pressure of the duct.
  • the cooling control apparatus of the server rack provided with the flexible duct of the present invention for achieving the above object, the main body case having a vertical plate formed vertically by connecting a plurality of horizontal plates and the plurality of horizontal plates, the main body case Located in the cooling module to form a refrigeration cycle to perform the cooling function inside the main body case, made of a flexible material to expand in accordance with the internal air pressure by the cold air supplied from the cooling module to form a tube shape, the cooling module A duct which extends from and is attached to at least one of the inner surfaces of the vertical plate and the horizontal plate and has at least one cold air discharge port for supplying the cold air supplied from the cooling module to the computer equipment mounted inside the main body case; Temperature sensor for measuring the temperature inside the main body case, the air pressure in the duct The amount of cold air supplied to the duct by controlling the temperature of the cooling air supplied to the duct by the cooling module according to the pressure sensor to be measured, and the measurement result of the temperature sensor. It characterized in that it comprises a control module for controlling the.
  • the control module is characterized in that the cooling air temperature supplied by the cooling module is gradually lowered as the temperature inside the main body case increases. .
  • the control module controls the amount of cold air to maintain a predetermined range of the internal air pressure of the duct, the predetermined range is the duct maintains the tube shape It is characterized in that it is determined in the range between the minimum air pressure and the maximum air pressure that can prevent damage to the duct.
  • the control module although the cooling air temperature supplied by the cooling module has reached the minimum temperature that can be supplied to the cooling module, the measurement result of the temperature sensor Accordingly, when it is necessary to increase the output of the cooling module, it is characterized in that the control to increase the amount of cold air in the range in which the internal air pressure of the duct is maintained below the maximum air pressure.
  • the duct is formed in the vertical direction along the inner surface of the vertical plate, or formed in the horizontal direction along the inner surface of the horizontal plate, the cold air discharge port Characterized in that spaced apart from each other in the direction of the computer equipment.
  • the said duct is characterized by forming a cylinder, an elliptic cylinder, or a prismatic shape according to internal air pressure.
  • the duct includes at least one protrusion formed protruding away from each other in the direction of the computer equipment, the cold air outlet connects the inside and the outside of the duct It characterized in that formed in the form of a channel penetrating the protrusion so as to.
  • the cold air discharge port is characterized in that formed in the form of a hole passing through the outer surface of the duct.
  • the duct is characterized in that the material consisting of cloth, rubber, synthetic resin or silicon.
  • the duct expands to a certain shape to supply cold air to a location adjacent to the computer equipment.
  • the required space for the duct can be minimized and the server rack can be miniaturized.
  • FIG. 1 is a perspective view showing a server rack according to an embodiment of the present invention.
  • FIG. 2 is an exemplary view showing some functional blocks of a cooling control device according to an embodiment of the present invention.
  • FIG. 3 is a front view illustrating a state of a duct before supplying cold air according to the embodiment of FIG. 1.
  • FIG. 4 is an exemplary front view illustrating a state in which the cold air is supplied and expanded according to the embodiment of FIG. 1.
  • FIG. 5 is a partially enlarged view illustrating a state of the duct before and after supplying cold air according to the embodiment of FIG. 1.
  • FIG. 6 is a front view illustrating a state of the duct before supplying cold air according to another embodiment of the present invention.
  • FIG. 7 is a front view illustrating a state in which the cold air is supplied and expanded according to the embodiment of FIG. 6.
  • FIG. 8 is a partially enlarged view illustrating a state of the duct before and after supplying cold air according to an embodiment of FIG. 6.
  • the present invention relates to a cooling technology of a server rack equipped with computing equipment such as a server therein.
  • computing equipment such as a server therein.
  • FIG. 1 is a perspective view showing a server rack 100 according to an embodiment of the present invention
  • Figure 2 is an exemplary view showing some functional blocks of the cooling control apparatus according to an embodiment of the present invention
  • Figure 3 is Figure 1
  • the cooling control device of the server rack 100 of the present embodiment the main body case 10, the cooling module 20, the duct 30, the temperature sensor 40, the pressure sensor 50 ) And a control module 60.
  • the main body case 10 includes a plurality of horizontal plates 11 positioned up and down, and a plurality of vertical plates 12 vertically connected by connecting the horizontal plates 11 to form an appearance of the server rack 100.
  • the horizontal plate 11 and the vertical plate 12 of the body case 10 may be made of a rigid material such as metal.
  • a plurality of horizontal shelves 1 are positioned inside the main body case 10, and computing equipment 2 such as a server is mounted on the shelves 1.
  • computing equipment 2 such as a server is mounted on the shelves 1.
  • the front of the main body case 10 is a door (3) is opened and closed to mount the computer equipment (2), the door 3 is the number of the main body case 10 through a connecting mechanism such as a hinge It is attached to the direct plate 12.
  • the cooling module 20 supplies cooling air to the duct 30 through a cooling cycle to perform a cooling operation inside the body case 10.
  • the cooling module 20 is an evaporator that performs the function of absorbing the external heat while the encapsulated refrigerant evaporates, a compressor for compressing the evaporated or expanded refrigerant, and the compressed refrigerant to discharge heat to the outside while condensing It may include a condenser and an expansion valve for expanding the condensed refrigerant supplied to the condenser.
  • the cooling module 20 is located below the main body case 10, but according to the embodiment, the cooling module 20 may be located anywhere inside or outside the main body case 10.
  • the duct 30 serves to guide the cooling air supplied from the cooling module 20 to be supplied into the main body case 10.
  • one end is connected to the cooling module 20 side, and from the cooling module 20.
  • At least one cold air discharge port 33 for supplying the cold air introduced into the computing device 2 mounted inside the main body case 10 is formed.
  • the duct 30 of the present embodiment is extended from the cooling module 20 is installed in the vertical direction on the inner surface of the vertical plate 12 of the main body case 10, in accordance with the embodiment the duct 30 is a vertical plate ( 12) and may be attached to one or more of the inner surface of the horizontal plate (11).
  • the duct 30 may be formed in a vertical direction along an inner surface of the left and right horizontal plates 11 and may be formed in a horizontal direction along an inner surface of the upper vertical plate 12.
  • the duct 30 may be attached to the vertical plate 12 or the horizontal plate 11 by using an adhesive, a socket structure or a bolt, etc., wherein the duct 30 is attached to the vertical plate 12 or the horizontal plate 11. It is also possible to employ a separate coupling member for coupling.
  • the cold air discharge ports 33 are formed to be spaced apart from each other in the direction of the computer equipment 2 to supply the air inside the duct 30 to the computer equipment 2.
  • Duct 30 is made of a flexible material that forms a certain shape according to the internal air pressure, such as cloth, rubber, synthetic resin, or silicon, and when cold air is supplied from the cooling module 20, it expands according to the increase in the internal air pressure to Form the tube shape.
  • the duct 30 may form a cylinder, an elliptic cylinder, or a prismatic cylinder according to the internal air pressure, and in this case, the coupling portion with the vertical plate 12 or the horizontal plate 11 is flat to a certain degree. Can be.
  • the duct 30 includes at least one protrusion 31 formed to protrude spaced apart from each other in the direction of the computer equipment (2).
  • the cold air discharge port 33 is formed in a channel shape penetrating the protrusion 31 to connect the inside and the outside of the duct 30.
  • the cool air inside the duct 30 is discharged to a position closer to the computer equipment 2 through the channel of the protrusion 31, and as a result, the cooling efficiency of the computer equipment 2 is improved.
  • the temperature sensor 40 serves to measure the temperature inside the body case 10, and may employ various temperature sensing elements therefor.
  • the temperature sensor 40 detects a temperature situation that changes as the computing equipment 2 mounted in the server rack 100 operates, and may measure a temperature such as the inner surface of the main body case 10 or the shelf 1. It can be installed anywhere it is.
  • the pressure sensor 50 serves to measure the air pressure according to the cold air in the duct 30, and may employ various pressure sensing elements for this purpose.
  • the pressure sensor 50 detects a situation of air pressure as cold air is supplied from the cooling module 20 to the duct 30, and is located at a suitable place for measuring air pressure inside the duct 30, such as the inner surface of the duct 30. Can be installed.
  • the control module 60 controls the cooling module 20 according to the measurement results of the temperature sensor 40 and the pressure sensor 50 to adjust the temperature and amount of the cold air supplied to the duct 30.
  • the control module 60 may include a calculation unit, a memory or an application program storage therefor.
  • control module 60 controls the temperature of the cold air supplied to the duct 30 from the cooling module 20 to gradually decrease as the temperature measured by the temperature sensor 40, the server rack 100
  • the computing equipment (2) mounted on the) creates a temperature environment that can operate smoothly.
  • control module 60 controls so that the amount of cold air supplied from the cooling module 20 to the duct 30 gradually increases as the temperature measured by the temperature sensor 40 increases. At this time, the control module 60 controls the amount of cold air so that the air pressure inside the duct 30 measured by the pressure sensor 50 maintains a certain range.
  • the range of the internal air pressure of the duct 30 is defined as the range between the minimum air pressure defined so that the duct 30 maintains the tube shape and the maximum air pressure that can prevent the duct 30 from being damaged.
  • the duct 30 of the present embodiment is made of a flexible material that forms a predetermined shape according to the internal air pressure, such as cloth, rubber, synthetic resin, or silicon.
  • the internal air pressure of the duct 30 is excessively low, the cold air discharge port 33 The discharge amount of the cold air through the) is reduced, in particular, the air pressure inside the duct 30 in a portion relatively far from the cooling module 20 is low, the cold air discharge amount in the corresponding portion is lowered.
  • the control module 60 prevents the cooling efficiency inside the main body case 10 from being lowered by maintaining the air pressure in the duct 30 to be equal to or greater than the minimum air pressure.
  • the control module 60 may prevent damage to the duct 30 by preventing the air pressure in the duct 30 to be equal to or less than the maximum air pressure, and prevent the cooling efficiency from being lowered.
  • the control module 60 increases the temperature inside the body case 10 measured by the temperature sensor 40, so that the temperature of the cooling air supplied from the cooling module 20 to the duct 30 is increased by the cooling module 20. While controlling to reach the minimum supplyable temperature, it may be determined that the output of the cooling module 20 needs to be increased by increasing the temperature as a result of the measurement of the temperature sensor 40. In this case, the control module 60 may control the cooling module 20 to increase the amount of cold air in a range in which the internal air pressure of the duct 30 is less than or equal to the maximum air pressure, thereby preventing damage to the duct 30. It is possible to maximize the cooling efficiency while preventing.
  • the duct 30 for supplying the cool air from the cooling module 20 to the computer equipment 2 is contracted and expanded depending on whether the cold air is supplied, and thus, installed using the minimum space in the server rack 100. It is possible to, and contribute to the miniaturization of the server rack (100).
  • the control module 60 of the cooling control device adjusts the temperature and the amount of the cool air supplied from the cooling module 20 to the duct 30 so that the duct 30 can adequately supply the cool air and is not damaged.
  • the cooling operation inside the case 10 can be efficiently controlled.
  • FIG. 6 is a front view illustrating a state of the duct 32 before supplying cold air according to another embodiment of the present invention
  • FIG. 7 is an duct 32 expanded and supplied with cold air according to the embodiment of FIG. 6.
  • Figure 8 is a front view showing the state
  • Figure 8 is a partially enlarged view showing the state of the duct 32 before and after the cold air supply according to an embodiment of FIG.
  • the cooling control apparatus of the server rack 200 of the present embodiment is the main body case 10, the cooling module 20, the duct 32, the temperature sensor 40, the pressure sensor 50 and the control module 60 is configured.
  • the main body case 10 includes a plurality of horizontal plates 11 positioned up and down, and a plurality of vertical plates 12 vertically connected by connecting the horizontal plates 11 to form an appearance of the server rack 200.
  • the computer equipment 2 is mounted on the shelf 1 inside the main body case 10, and the door 3 is positioned on the front surface thereof.
  • the cooling module 20 supplies cooling air to the duct 32 through a cooling cycle to perform a cooling operation inside the body case 10.
  • the duct 32 serves to guide the cool air supplied from the cooling module 20 to be supplied into the body case 10.
  • the duct 32 extends from the cooling module 20 and is attached to the inner surface of the vertical plate 12 of the main body case 10 in the vertical direction.
  • Duct 32 of the present embodiment is made of a flexible material that forms a predetermined shape according to the internal air pressure, such as cloth, rubber, synthetic resin or silicon, and supplies cold air to the computer equipment 2 mounted inside the body case 10 At least one cold air outlet 34 for the purpose.
  • the cold air outlet 34 is formed in the form of one or more holes through the outer surface of the duct 32, each cold air outlet 34 is spaced apart from each other.
  • the duct 32 expands in accordance with an increase in the internal air pressure to form a cylinder, an elliptic cylinder or a prismatic cylinder.
  • FIG. 6 and 8 (a) of the left side shows a state in which no cold air is supplied to the duct 32.
  • the duct 32 is reduced in volume due to a relatively low internal air pressure, thereby taking a contracted form. Done.
  • the shelf 1 is not obstructed to provide a space for mounting the computer equipment 2.
  • the computer equipment 2 is mounted on the shelf 1 in such a state, the computer equipment 2 is not caught by the duct 32, and even if the diarrhea is caught, damage is prevented according to the ductile material of the duct 32.
  • FIG. 7 (b) and 8 (b) show the state in which cold air is supplied to the duct 32.
  • the duct 32 has its volume increased as the internal air pressure is relatively increased, thereby taking an expanded form. do.
  • the duct 32 expands, it partially covers a part of the shelf 1, and supplies cold air through a hole-type cold air discharge port 34 formed near the computer equipment 2.
  • the temperature sensor 40 serves to measure the temperature inside the body case 10, and may employ various temperature sensing elements therefor.
  • the pressure sensor 50 serves to measure the air pressure according to the cold air in the duct 32, and may employ various pressure sensing elements therefor.
  • the control module 60 controls the cooling module 20 according to the measurement results of the temperature sensor 40 and the pressure sensor 50 to adjust the temperature and amount of cold air supplied to the duct 32.
  • the control module 60 controls the temperature of the cold air supplied from the cooling module 20 to the duct 32 to gradually decrease as the temperature measured by the temperature sensor 40 rises.
  • control module 60 controls to gradually increase the amount of cold air supplied from the cooling module 20 to the duct 32 as the temperature measured by the temperature sensor 40 increases, and the control module 60 Controls the amount of cold air so that the air pressure in the duct 32 measured by the pressure sensor 50 is maintained in a certain range.
  • the range of the internal air pressure of the duct 32 is defined as the range between the minimum air pressure defined so that the duct 32 maintains the tube shape and the maximum air pressure which can prevent the duct 32 from being damaged.
  • the control module 60 the temperature inside the main body case 10 measured by the temperature sensor 40 increases, and thus the temperature of the cooling air supplied from the cooling module 20 to the duct 32 is increased by the cooling module 20. While controlling to reach the minimum supplyable temperature, it may be determined that the output of the cooling module 20 needs to be increased by increasing the temperature as a result of the measurement of the temperature sensor 40. In this case, the control module 60 may control the cooling module 20 to increase the amount of cold air in a range in which the internal air pressure of the duct 32 is less than or equal to the maximum air pressure, thereby preventing damage to the duct 32. It is possible to maximize the cooling efficiency while preventing.
  • the duct 32 for supplying the cool air from the cooling module 20 to the computer equipment 2 is contracted and expanded depending on whether the cold air is supplied, the duct 32 is installed using the minimum space in the server rack 200. It is possible to, and contributes to the miniaturization of the server rack (200).
  • the control module 60 of the cooling control device adjusts the temperature and the amount of the cool air supplied from the cooling module 20 to the duct 32 so that the duct 32 can properly supply the cool air and is not damaged.
  • the cooling operation inside the case 10 can be efficiently controlled.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The present invention relates to a cooling control device for a server rack comprising a flexible duct capable of uniformly cooling all computerization equipment, securing a space for loading the computerization equipment using the duct in a contracted state before cool air is supplied, and of supplying cool air to positions close to the computerization equipment through the duct which expands to a specific shape when cool air is supplied, thereby minimizing the space required for the duct and the protruding portions, reducing the size of the server rack, and controlling the temperature of the cool air supplied by a cooling module according to the temperature inside the server rack, wherein by controlling the amount of cool air supplied by the cooling module within a range that maintains an appropriate air pressure inside the duct, efficient cooling and prevention of damage to the duct can be achieved.

Description

플렉서블 덕트를 구비한 서버랙의 냉방 제어 장치Cooling control device for server rack with flexible duct

본 발명은 서버랙과 관련한 것으로, 더욱 상세하게는 내부에 탑재된 전산장비가 원활히 동작할 수 있도록, 유연한 소재로 이루어진 덕트를 이용해 냉방 기능을 수행할 수 있는 서버랙에 대하여, 냉방 상태를 적절하게 제어할 수 있는 플렉서블 덕트를 구비한 서버랙의 냉방 제어 장치에 관한 것이다.The present invention relates to a server rack, and more particularly to a server rack capable of performing a cooling function using a duct made of a flexible material so that the computing equipment mounted therein can operate smoothly. It relates to a cooling control device for a server rack having a flexible duct that can be controlled.

통상 기업이나 연구소 등에서는 서버, 중계기, 교환기, 각종 네트워크 장비 등이 탑재되는 서버랙(server rack)을 구비하고 있다. 그런데 서버랙에 탑재되는 서버 등의 전산장비는 그 동작 중에 열을 발생하여 서버랙 내부의 온도를 상승시키게 되는데, 이러한 전산장비는 일정 온도 구간에서는 원활히 동작하는 반면, 온도가 너무 높은 경우 장비 자체의 수명 저하나 오작동을 일으킬 위험이 존재한다.In general, companies and research institutes include server racks on which servers, repeaters, exchangers, and various network equipment are mounted. However, computing equipment such as servers mounted in the server rack generates heat during its operation to increase the temperature inside the server rack. Such computing equipment operates smoothly at a certain temperature range, whereas if the temperature is too high, There is a risk of loss of life or malfunction.

이에 서버랙은 내부의 온도를 일정 범위 이내로 유지하기 위한 냉방장치를 구비하고, 해당 냉방장치로부터 서버랙 내부로 냉기를 공급하여 냉방 동작을 수행한다. 그런데 냉방장치로부터의 냉기는 각 전산장비에 고르게 전달되기 어려워, 냉기를 전산장비의 흡기팬 근처에 전달하기 위한 방안이 필요하며, 이 경우 냉방장치로부터의 냉기를 전산장비 근처로 유도하기 위한 파이프 등이 위치하는 별도의 공간이 필요하다.The server rack is provided with a cooling device for maintaining the internal temperature within a predetermined range, and performs the cooling operation by supplying cool air into the server rack from the cooling device. However, since the cold air from the air conditioner is difficult to be evenly transmitted to each computer equipment, there is a need for a method for delivering the cool air near the intake fan of the computer equipment. Separate space is required.

일 예로 선행기술문헌인 미국등록특허 제7074123호를 참조하면, 서버랙의 내부 전면 양측에 직사각 기둥 모양의 덕트를 채용하고 있으며, 양 덕트의 사이 공간으로 서버를 마운트하도록 되어 있어, 서버랙의 수평 폭을 증가시키는 원인이 된다. 이때 서버의 수평 폭에 맞추어 양 덕트 사이의 공간을 최대한 좁게 조정하는 경우, 서버의 마운트시 덕트 외벽과 충돌함으로써 서버가 손상될 위험이 존재한다.For example, referring to US Patent No. 7094123, which is a prior art document, a rectangular pillar-shaped duct is adopted on both sides of the inner front of the server rack, and the server is mounted in a space between the two ducts, so that the horizontal of the server rack is provided. It causes the width to increase. In this case, if the space between both ducts is adjusted as narrow as possible to the horizontal width of the server, there is a risk of damaging the server by colliding with the duct outer wall when mounting the server.

또한 선행기술문헌인 미국등록특허 제6882531호를 참조하면, 서버랙의 양측으로부터 신장된 도관(conduit)을 이용해 서버의 냉각을 수행하는데, 해당 도관으로 냉기를 공급하기 위한 덕트가 서버랙의 양측에 위치하여 서버랙의 수평 폭을 증가시키는 원인이 되며, 상기와 마찬가지로 충돌에 의한 서버의 손상 위험이 존재하는 문제가 있다.Also, referring to US Patent No. 6882531, which is a prior art document, cooling of the server is performed using conduits extending from both sides of the server rack, and ducts for supplying cold air to the conduits are provided on both sides of the server rack. Positioning is a cause of increasing the horizontal width of the server rack, there is a problem that there is a risk of damage to the server by a collision as described above.

상기와 같은 문제점을 해결하기 위한 본 발명의 목적은, 내부 공기압에 따라 팽창하여 튜브 모양을 형성하도록 유연한 소재로 이루어진 덕트를 이용해 서버랙에 탑재된 각 전산장비로 냉기를 공급하되, 서버랙 내부의 온도 및 덕트의 압력을 고려하여 적절하게 냉방이 이루어지도록 제어할 수 있는 플렉서블 덕트를 구비한 서버랙의 냉방 제어 장치를 제공하기 위한 것이다.An object of the present invention for solving the above problems, while supplying cold air to each computer equipment mounted on the server rack using a duct made of a flexible material to expand in accordance with the internal air pressure to form a tube shape, the inside of the server rack It is an object of the present invention to provide a cooling control apparatus for a server rack having a flexible duct capable of controlling the cooling to be performed properly in consideration of the temperature and the pressure of the duct.

상기와 같은 목적을 달성하기 위한 본 발명의 플렉서블 덕트를 구비한 서버랙의 냉방 제어 장치는, 복수의 수평판과 상기 복수의 수평판을 연결하여 수직 형성된 수직판을 구비한 본체 케이스, 상기 본체 케이스에 위치하며 냉동사이클을 구성하여 상기 본체 케이스 내부의 냉방 기능을 수행하는 냉방모듈, 상기 냉방모듈로부터 공급된 냉기에 의한 내부 공기압에 따라 팽창하여 튜브 모양을 형성하도록 유연한 소재로 이루어지고, 상기 냉방모듈로부터 신장되어 상기 수직판 및 상기 수평판의 내면 중 하나 이상에 부착 설치되며, 상기 냉방모듈로부터 공급된 냉기를 상기 본체 케이스 내부에 탑재된 전산장비로 공급하기 위한 적어도 하나의 냉기 토출구가 형성된 덕트, 상기 본체 케이스 내부의 온도를 측정하는 온도 센서, 상기 덕트 내부의 공기압을 측정하는 압력 센서, 및 상기 온도 센서의 측정 결과에 따라 상기 냉방모듈이 상기 덕트로 공급하는 냉기의 온도를 제어하고, 상기 압력 센서의 측정 결과에 따라 상기 냉방모듈이 상기 덕트로 공급하는 냉기의 양을 제어하는 제어모듈을 포함하는 것을 특징으로 한다.The cooling control apparatus of the server rack provided with the flexible duct of the present invention for achieving the above object, the main body case having a vertical plate formed vertically by connecting a plurality of horizontal plates and the plurality of horizontal plates, the main body case Located in the cooling module to form a refrigeration cycle to perform the cooling function inside the main body case, made of a flexible material to expand in accordance with the internal air pressure by the cold air supplied from the cooling module to form a tube shape, the cooling module A duct which extends from and is attached to at least one of the inner surfaces of the vertical plate and the horizontal plate and has at least one cold air discharge port for supplying the cold air supplied from the cooling module to the computer equipment mounted inside the main body case; Temperature sensor for measuring the temperature inside the main body case, the air pressure in the duct The amount of cold air supplied to the duct by controlling the temperature of the cooling air supplied to the duct by the cooling module according to the pressure sensor to be measured, and the measurement result of the temperature sensor. It characterized in that it comprises a control module for controlling the.

본 발명의 플렉서블 덕트를 구비한 서버랙의 냉방 제어 장치에 있어서, 상기 제어모듈은 상기 본체 케이스 내부의 온도가 상승함에 따라 상기 냉방모듈이 공급하는 냉기 온도가 점진적으로 낮아지도록 제어하는 것을 특징으로 한다.In the cooling control apparatus of the server rack provided with the flexible duct of the present invention, the control module is characterized in that the cooling air temperature supplied by the cooling module is gradually lowered as the temperature inside the main body case increases. .

본 발명의 플렉서블 덕트를 구비한 서버랙의 냉방 제어 장치에 있어서, 상기 제어모듈은 상기 덕트의 내부 공기압이 일정 범위를 유지하도록 냉기의 양을 제어하되, 상기 일정 범위는 상기 덕트가 튜브 모양을 유지하도록 정해진 최소 공기압과, 상기 덕트의 파손을 방지할 수 있는 최대 공기압 사이의 범위로 정해지는 것을 특징으로 한다.In the cooling control apparatus of the server rack provided with the flexible duct of the present invention, the control module controls the amount of cold air to maintain a predetermined range of the internal air pressure of the duct, the predetermined range is the duct maintains the tube shape It is characterized in that it is determined in the range between the minimum air pressure and the maximum air pressure that can prevent damage to the duct.

본 발명의 플렉서블 덕트를 구비한 서버랙의 냉방 제어 장치에 있어서, 상기 제어모듈은 상기 냉방모듈이 공급하는 냉기 온도가 상기 냉방모듈이 공급가능한 최소의 온도에 도달하였으나, 상기 온도 센서의 측정 결과에 따라 상기 냉방모듈의 출력을 높일 필요가 있는 경우, 상기 덕트의 내부 공기압이 상기 최대 공기압 이하를 유지하는 범위에서 냉기의 양이 증가하도록 제어하는 것을 특징으로 한다.In the cooling control apparatus of the server rack provided with the flexible duct of the present invention, the control module, although the cooling air temperature supplied by the cooling module has reached the minimum temperature that can be supplied to the cooling module, the measurement result of the temperature sensor Accordingly, when it is necessary to increase the output of the cooling module, it is characterized in that the control to increase the amount of cold air in the range in which the internal air pressure of the duct is maintained below the maximum air pressure.

본 발명의 플렉서블 덕트를 구비한 서버랙의 냉방 제어 장치에 있어서, 상기 덕트는 상기 수직판의 내면을 따라 수직 방향으로 형성되거나, 상기 수평판의 내면을 따라 수평 방향으로 형성되고, 상기 냉기 토출구는 상기 전산장비 방향으로 서로 이격하여 형성된 것을 특징으로 한다.In the cooling control apparatus of the server rack provided with the flexible duct of the present invention, the duct is formed in the vertical direction along the inner surface of the vertical plate, or formed in the horizontal direction along the inner surface of the horizontal plate, the cold air discharge port Characterized in that spaced apart from each other in the direction of the computer equipment.

본 발명의 플렉서블 덕트를 구비한 서버랙의 냉방 제어 장치에 있어서, 상기 덕트는 내부 공기압에 따라 원기둥, 타원기둥이나 각기둥 모양을 형성하는 것을 특징으로 한다.In the cooling control apparatus of the server rack provided with the flexible duct of this invention, The said duct is characterized by forming a cylinder, an elliptic cylinder, or a prismatic shape according to internal air pressure.

본 발명의 플렉서블 덕트를 구비한 서버랙의 냉방 제어 장치에 있어서, 상기 덕트는 상기 전산장비 방향으로 서로 이격하여 돌출 형성된 적어도 하나의 돌출부를 포함하고, 상기 냉기 토출구는 상기 덕트의 내부와 외부를 연결하도록 상기 돌출부를 관통한 채널 형태로 형성된 것을 특징으로 한다.In the cooling control apparatus of the server rack provided with the flexible duct of the present invention, the duct includes at least one protrusion formed protruding away from each other in the direction of the computer equipment, the cold air outlet connects the inside and the outside of the duct It characterized in that formed in the form of a channel penetrating the protrusion so as to.

본 발명의 플렉서블 덕트를 구비한 서버랙의 냉방 제어 장치에 있어서, 상기 냉기 토출구는 상기 덕트의 외면을 관통한 홀 형태로 형성된 것을 특징으로 한다.In the cooling control apparatus of the server rack provided with the flexible duct of the present invention, the cold air discharge port is characterized in that formed in the form of a hole passing through the outer surface of the duct.

본 발명의 플렉서블 덕트를 구비한 서버랙의 냉방 제어 장치에 있어서, 상기 덕트는 천, 고무, 합성수지 또는 실리콘을 포함한 소재로 이루어진 것을 특징으로 한다.In the cooling control apparatus of the server rack provided with the flexible duct of the present invention, the duct is characterized in that the material consisting of cloth, rubber, synthetic resin or silicon.

본 발명의 플렉서블 덕트를 구비한 서버랙의 냉방 제어 장치에 따르면 다음과 같은 효과를 기대할 수 있다.According to the cooling control apparatus of the server rack provided with the flexible duct of the present invention, the following effects can be expected.

첫째, 서버랙에 탑재된 각 전산장비의 위치로 냉기를 공급함으로써, 모든 전산장비를 고르게 냉각할 수 있다.First, by supplying cold air to the location of each computer equipment mounted in the server rack, it is possible to cool all the computer equipment evenly.

둘째, 냉기를 공급하기 전 수축된 상태의 덕트를 이용해 전산장비의 탑재를 위한 공간을 확보할 수 있고, 냉기가 공급되는 경우 덕트가 일정 모양으로 팽창하여 전산장비와 인접한 위치로 냉기를 공급할 수 있어, 덕트를 위한 필요 공간이 최소화되고 서버랙의 소형화를 달성할 수 있다.Second, it is possible to secure a space for mounting computer equipment by using the contracted duct before supplying cold air, and when cold air is supplied, the duct expands to a certain shape to supply cold air to a location adjacent to the computer equipment. In addition, the required space for the duct can be minimized and the server rack can be miniaturized.

셋째, 서버랙 내부의 온도에 따라 냉방모듈이 공급하는 냉기의 온도를 제어하되, 덕트의 내부 공기압이 적정 수준을 유지하는 범위에서 냉방모듈의 냉기 공급 양을 조절하여, 효율적인 냉방 동작이 이루어지도록 함과 동시에 덕트의 파손을 방지할 수 있다.Third, while controlling the temperature of the cooling air supplied by the cooling module according to the temperature inside the server rack, by controlling the amount of cooling air supply of the cooling module in a range that maintains the proper level of the internal air pressure of the duct, efficient cooling operation is achieved. At the same time, damage to the duct can be prevented.

도 1은 본 발명의 일 실시예에 따른 서버랙을 나타낸 사시도이다.1 is a perspective view showing a server rack according to an embodiment of the present invention.

도 2는 본 발명의 일 실시예에 따른 냉방 제어 장치의 일부 기능 블록을 나타낸 예시도이다.2 is an exemplary view showing some functional blocks of a cooling control device according to an embodiment of the present invention.

도 3은 도 1의 실시예에 따라 냉기를 공급하기 전 덕트의 모습을 나타낸 정면 예시도이다.3 is a front view illustrating a state of a duct before supplying cold air according to the embodiment of FIG. 1.

도 4는 도 1의 실시예에 따라 냉기가 공급되어 팽창한 덕트의 모습을 나타낸 정면 예시도이다.4 is an exemplary front view illustrating a state in which the cold air is supplied and expanded according to the embodiment of FIG. 1.

도 5는 도 1의 실시예에 따라 냉기 공급 전후의 덕트의 모습을 나타낸 부분 확대도이다.5 is a partially enlarged view illustrating a state of the duct before and after supplying cold air according to the embodiment of FIG. 1.

도 6은 본 발명의 다른 일 실시예에 따라 냉기를 공급하기 전 덕트의 모습을 나타낸 정면 예시도이다.6 is a front view illustrating a state of the duct before supplying cold air according to another embodiment of the present invention.

도 7은 도 6의 실시예에 따라 냉기가 공급되어 팽창한 덕트의 모습을 나타낸 정면 예시도이다.FIG. 7 is a front view illustrating a state in which the cold air is supplied and expanded according to the embodiment of FIG. 6.

도 8은 도 6의 일 실시예에 따라 냉기 공급 전후의 덕트의 모습을 나타낸 부분 확대도이다.8 is a partially enlarged view illustrating a state of the duct before and after supplying cold air according to an embodiment of FIG. 6.

하기의 설명에서는 본 발명의 실시예를 이해하는데 필요한 부분만이 설명되며, 그 이외 부분의 설명은 본 발명의 요지를 흩트리지 않도록 생략될 것이라는 것을 유의하여야 한다.In the following description, only parts necessary for understanding the embodiments of the present invention will be described, it should be noted that the description of other parts will be omitted so as not to distract from the gist of the present invention.

이하에서 설명되는 본 명세서 및 청구범위에 사용된 용어나 단어는 통상적이거나 사전적인 의미로 한정해서 해석되어서는 아니 되며, 발명자는 그 자신의 발명을 가장 최선의 방법으로 설명하기 위해 용어의 개념으로 적절하게 정의할 수 있다는 원칙에 입각하여 본 발명의 기술적 사상에 부합하는 의미와 개념으로 해석되어야만 한다. 따라서 본 명세서에 기재된 실시예와 도면에 도시된 구성은 본 발명의 바람직한 실시예에 불과할 뿐이고, 본 발명의 기술적 사상을 모두 대변하는 것은 아니므로, 본 출원시점에 있어서 이들을 대체할 수 있는 다양한 균등물과 변형예들이 있을 수 있음을 이해하여야 한다.The terms or words used in the specification and claims described below should not be construed as being limited to the ordinary or dictionary meanings, and the inventors are appropriate to the concept of terms in order to explain their invention in the best way. It should be interpreted as meanings and concepts in accordance with the technical spirit of the present invention based on the principle that it can be defined. Therefore, the embodiments described in the present specification and the configuration shown in the drawings are only preferred embodiments of the present invention, and do not represent all of the technical idea of the present invention, and various equivalents may be substituted for them at the time of the present application. It should be understood that there may be variations and variations.

본 발명은 내부에 서버 등의 전산장비를 탑재하는 서버랙의 냉방 기술과 관련한 것이다. 이하, 첨부된 도면을 참조하여 본 발명의 실시예를 보다 상세하게 설명하기로 한다.The present invention relates to a cooling technology of a server rack equipped with computing equipment such as a server therein. Hereinafter, with reference to the accompanying drawings will be described in detail an embodiment of the present invention.

도 1은 본 발명의 일 실시예에 따른 서버랙(100)을 나타낸 사시도이고, 도 2는 본 발명의 일 실시예에 따른 냉방 제어 장치의 일부 기능 블록을 나타낸 예시도이고, 도 3은 도 1의 실시예에 따라 냉기를 공급하기 전 덕트(30)의 모습을 나타낸 정면 예시도이고, 도 4는 도 1의 실시예에 따라 냉기가 공급되어 팽창한 덕트(30)의 모습을 나타낸 정면 예시도이며, 도 5는 도 1의 실시예에 따라 냉기 공급 전후의 덕트(30)의 모습을 나타낸 부분 확대도이다.1 is a perspective view showing a server rack 100 according to an embodiment of the present invention, Figure 2 is an exemplary view showing some functional blocks of the cooling control apparatus according to an embodiment of the present invention, Figure 3 is Figure 1 According to an embodiment of the front exemplary view showing the state of the duct 30 before supplying the cold air, Figure 4 is a front illustration showing the state of the duct 30 is expanded and supplied with cold air according to the embodiment of FIG. 5 is a partially enlarged view showing a state of the duct 30 before and after the cold air supply according to the embodiment of FIG. 1.

도 1 내지 도 5를 참조하면, 본 실시예의 서버랙(100)의 냉방 제어 장치는, 본체 케이스(10), 냉방모듈(20), 덕트(30), 온도 센서(40), 압력 센서(50) 및 제어모듈(60)을 포함하여 구성된다.1 to 5, the cooling control device of the server rack 100 of the present embodiment, the main body case 10, the cooling module 20, the duct 30, the temperature sensor 40, the pressure sensor 50 ) And a control module 60.

본체 케이스(10)는 상하로 위치한 복수의 수평판(11)과, 해당 수평판(11)을 연결하여 수직으로 형성된 복수의 수직판(12)을 포함하여, 서버랙(100)의 외관을 이룬다. 본체 케이스(10)의 수평판(11)과 수직판(12)은 금속과 같은 견고한 소재로 이루어질 수 있다.The main body case 10 includes a plurality of horizontal plates 11 positioned up and down, and a plurality of vertical plates 12 vertically connected by connecting the horizontal plates 11 to form an appearance of the server rack 100. . The horizontal plate 11 and the vertical plate 12 of the body case 10 may be made of a rigid material such as metal.

본체 케이스(10)의 내부에는 복수의 수평 선반(1)이 위치하며, 해당 선반(1)에 서버 등의 전산장비(2)가 탑재된다. 그리고 본체 케이스(10)의 전면에는 전산장비(2)를 탑재하기 위해 여닫히는 도어(door)(3)가 위치하며, 도어(3)는 경첩과 같은 연결기구를 통해 본체 케이스(10)의 수직판(12)에 부착된다.A plurality of horizontal shelves 1 are positioned inside the main body case 10, and computing equipment 2 such as a server is mounted on the shelves 1. And the front of the main body case 10 is a door (3) is opened and closed to mount the computer equipment (2), the door 3 is the number of the main body case 10 through a connecting mechanism such as a hinge It is attached to the direct plate 12.

냉방모듈(20)은 냉각사이클을 통해 덕트(30)로 냉기를 공급하여 본체 케이스(10) 내부의 냉방 동작을 수행한다. 이때, 냉방모듈(20)은 봉입된 냉매가 증발하면서 외부의 열을 흡수하는 기능을 수행하는 증발기와, 증발 또는 팽창된 냉매를 압축하는 압축기와, 압축된 냉매가 응축하면서 외부로 열을 방출하는 응축기와, 응축된 냉매를 팽창시켜 응축기로 공급하는 팽창밸브를 포함할 수 있다.The cooling module 20 supplies cooling air to the duct 30 through a cooling cycle to perform a cooling operation inside the body case 10. At this time, the cooling module 20 is an evaporator that performs the function of absorbing the external heat while the encapsulated refrigerant evaporates, a compressor for compressing the evaporated or expanded refrigerant, and the compressed refrigerant to discharge heat to the outside while condensing It may include a condenser and an expansion valve for expanding the condensed refrigerant supplied to the condenser.

본 실시예에서 냉방모듈(20)은 본체 케이스(10)의 하부에 위치하지만, 실시예에 따라서 냉방모듈(20)은 본체 케이스(10) 내부 또는 외부의 어느 곳에도 위치할 수 있다.In the present embodiment, the cooling module 20 is located below the main body case 10, but according to the embodiment, the cooling module 20 may be located anywhere inside or outside the main body case 10.

덕트(30)는 냉방모듈(20)로부터 공급된 냉기가 본체 케이스(10) 내부로 공급되도록 인도하는 역할을 하며, 이를 위해 일단이 냉방모듈(20) 측과 연결되고, 냉방모듈(20)로부터 내부로 인입된 냉기를 본체 케이스(10) 내부에 탑재된 전산장비(2)로 공급하기 위한 적어도 하나의 냉기 토출구(33)가 형성된다.The duct 30 serves to guide the cooling air supplied from the cooling module 20 to be supplied into the main body case 10. For this purpose, one end is connected to the cooling module 20 side, and from the cooling module 20. At least one cold air discharge port 33 for supplying the cold air introduced into the computing device 2 mounted inside the main body case 10 is formed.

본 실시예의 덕트(30)는 냉방모듈(20)로부터 신장되어 본체 케이스(10)의 수직판(12)의 내면에 수직 방향으로 부착 설치되었으며, 실시예에 따라서는 덕트(30)가 수직판(12) 및 수평판(11)의 내면 중 하나 이상에 부착 설치될 수 있다. 예를 들어, 덕트(30)는 좌우 수평판(11)의 내면을 따라 수직 방향으로 형성되고, 상단의 수직판(12) 내면을 따라 수평 방향으로 형성된 형태를 취할 수 있다. 덕트(30)는 접착제, 소켓 구조나 볼트 등을 이용해 수직판(12) 또는 수평판(11)에 부착 설치될 수 있으며, 이때 덕트(30)를 수직판(12) 또는 수평판(11)에 결합시키기 위한 별도의 결합부재를 채용할 수도 있다. 이 경우 냉기 토출구(33)는 전산장비(2) 방향으로 서로 이격하여 형성되어, 덕트(30) 내부의 공기를 전산장비(2)로 공급한다.The duct 30 of the present embodiment is extended from the cooling module 20 is installed in the vertical direction on the inner surface of the vertical plate 12 of the main body case 10, in accordance with the embodiment the duct 30 is a vertical plate ( 12) and may be attached to one or more of the inner surface of the horizontal plate (11). For example, the duct 30 may be formed in a vertical direction along an inner surface of the left and right horizontal plates 11 and may be formed in a horizontal direction along an inner surface of the upper vertical plate 12. The duct 30 may be attached to the vertical plate 12 or the horizontal plate 11 by using an adhesive, a socket structure or a bolt, etc., wherein the duct 30 is attached to the vertical plate 12 or the horizontal plate 11. It is also possible to employ a separate coupling member for coupling. In this case, the cold air discharge ports 33 are formed to be spaced apart from each other in the direction of the computer equipment 2 to supply the air inside the duct 30 to the computer equipment 2.

덕트(30)는 천, 고무, 합성수지 또는 실리콘과 같이 내부 공기압에 따라 일정 모양을 형성하는 유연한 소재로 이루어지며, 냉방모듈(20)로부터의 냉기가 공급되면, 내부 공기압의 증가에 따라 팽창하여 특정 튜브 모양을 형성한다. 예를 들어 덕트(30)는 내부 공기압에 따라 원기둥, 타원기둥이나 각기둥 모양을 형성할 수 있으며, 이때 수직판(12) 또는 수평판(11)과의 결합 부분이 일정 정도 평평한 모양의 튜브 형태가 될 수 있다.Duct 30 is made of a flexible material that forms a certain shape according to the internal air pressure, such as cloth, rubber, synthetic resin, or silicon, and when cold air is supplied from the cooling module 20, it expands according to the increase in the internal air pressure to Form the tube shape. For example, the duct 30 may form a cylinder, an elliptic cylinder, or a prismatic cylinder according to the internal air pressure, and in this case, the coupling portion with the vertical plate 12 or the horizontal plate 11 is flat to a certain degree. Can be.

도 3 및 도 5 좌측의 (a)도면은 덕트(30)에 냉기가 공급되지 않은 상태를 나타내는데, 이 경우 덕트(30)는 내부 공기압이 상대적으로 낮음에 따라 그 부피가 줄어들어 수축된 형태를 취하게 된다. 그리고 덕트(30)가 수축됨에 따라 선반(1)을 가리지 않게 되어 전산장비(2)를 탑재하기 위한 공간을 제공하게 된다. 이러한 상태에서 선반(1)에 전산장비(2)를 탑재하는 경우, 전산장비(2)가 덕트(30)에 걸리지 않게 되고, 설사 걸리더라도 덕트(30)의 연성 재질에 따라 전산장비(2)의 파손이 방지된다.3 and 5, (a) of the left side shows a state in which cold air is not supplied to the duct 30, in which case the duct 30 is reduced in volume as the internal air pressure is relatively low, thereby taking a contracted form. Done. As the duct 30 is contracted, the shelf 1 is not obstructed to provide a space for mounting the computer equipment 2. When the computer equipment 2 is mounted on the shelf 1 in such a state, the computer equipment 2 does not get caught in the duct 30, and even if the diarrhea is caught, the computer equipment 2 depends on the ductile material of the duct 30. Breakage is prevented.

도 4 및 도 5 우측의 (b)도면은 덕트(30)에 냉기가 공급되는 상태를 나타내는데, 이 경우 덕트(30)는 내부 공기압이 상대적으로 높아짐에 따라 그 부피가 늘어나 팽창된 형태를 취하게 된다. 이 경우 덕트(30)가 팽창함에 따라 비로소 선반(1)의 일부분을 가리게 되며, 전산장비(2)와 가까운 쪽에 형성된 냉기 토출구(33)를 통해 냉기를 공급한다.4 and 5 (b) on the right side show the state in which cold air is supplied to the duct 30, in which case the duct 30 increases in volume as the internal air pressure is relatively increased to take an expanded form. do. In this case, as the duct 30 expands, it partially covers a part of the shelf 1 and supplies cold air through a cold air discharge port 33 formed near the computer equipment 2.

이때 덕트(30)는 전산장비(2) 방향으로 서로 이격하여 돌출 형성된 적어도 하나의 돌출부(31)를 포함한다. 그리고 냉기 토출구(33)는 덕트(30)의 내부와 외부를 연결하도록 돌출부(31)를 관통한 채널 형태로 형성된다. 본 실시예에서 덕트(30) 내부의 냉기는 돌출부(31)의 채널을 통해 전산장비(2)와 좀 더 인접한 위치로 토출되며 그 결과 전산장비(2)의 냉각 효율이 개선된다.At this time, the duct 30 includes at least one protrusion 31 formed to protrude spaced apart from each other in the direction of the computer equipment (2). The cold air discharge port 33 is formed in a channel shape penetrating the protrusion 31 to connect the inside and the outside of the duct 30. In the present embodiment, the cool air inside the duct 30 is discharged to a position closer to the computer equipment 2 through the channel of the protrusion 31, and as a result, the cooling efficiency of the computer equipment 2 is improved.

온도 센서(40)는 본체 케이스(10) 내부의 온도를 측정하는 역할을 하며, 이를 위한 각종 온도 감지 소자를 채용할 수 있다.The temperature sensor 40 serves to measure the temperature inside the body case 10, and may employ various temperature sensing elements therefor.

온도 센서(40)는 서버랙(100) 내부에 탑재된 전산장비(2)가 동작함에 따라 변화되는 온도 상황을 감지하며, 본체 케이스(10)의 내면이나 선반(1) 등 온도를 측정할 수 있는 어느 곳에도 설치될 수 있다.The temperature sensor 40 detects a temperature situation that changes as the computing equipment 2 mounted in the server rack 100 operates, and may measure a temperature such as the inner surface of the main body case 10 or the shelf 1. It can be installed anywhere it is.

압력 센서(50)는 덕트(30) 내부의 냉기에 따른 공기압을 측정하는 역할을 하며, 이를 위한 각종 압력 감지 소자를 채용할 수 있다.The pressure sensor 50 serves to measure the air pressure according to the cold air in the duct 30, and may employ various pressure sensing elements for this purpose.

압력 센서(50)는 냉방모듈(20)로부터 덕트(30)에 냉기가 공급됨에 따른 공기압의 상황을 감지하며, 덕트(30)의 내면 등 덕트(30) 내부에서 공기압을 측정하기에 적절한 장소에 설치될 수 있다.The pressure sensor 50 detects a situation of air pressure as cold air is supplied from the cooling module 20 to the duct 30, and is located at a suitable place for measuring air pressure inside the duct 30, such as the inner surface of the duct 30. Can be installed.

제어모듈(60)은 온도 센서(40)와 압력 센서(50)의 측정 결과에 따라 냉방모듈(20)을 제어하여, 덕트(30)로 공급되는 냉기의 온도와 양을 조절한다. 제어모듈(60)은 이를 위한 연산유닛, 메모리나 응용 프로그램 저장소를 포함할 수 있다.The control module 60 controls the cooling module 20 according to the measurement results of the temperature sensor 40 and the pressure sensor 50 to adjust the temperature and amount of the cold air supplied to the duct 30. The control module 60 may include a calculation unit, a memory or an application program storage therefor.

본 발명에서 제어모듈(60)은 온도 센서(40)에서 측정한 온도가 상승함에 따라 냉방모듈(20)에서 덕트(30)로 공급되는 냉기의 온도가 점진적으로 낮아지도록 제어하여, 서버랙(100)에 탑재된 전산장비(2)가 원활히 동작할 수 있는 온도 환경을 조성한다.In the present invention, the control module 60 controls the temperature of the cold air supplied to the duct 30 from the cooling module 20 to gradually decrease as the temperature measured by the temperature sensor 40, the server rack 100 The computing equipment (2) mounted on the) creates a temperature environment that can operate smoothly.

또한 제어모듈(60)은 온도 센서(40)에서 측정한 온도가 상승함에 따라 냉방모듈(20)에서 덕트(30)로 공급되는 냉기의 양이 점진적으로 많아지도록 제어한다. 이때 제어모듈(60)은 압력 센서(50)에서 측정한 덕트(30) 내부의 공기압이 일정 범위를 유지하도록 냉기의 양을 제어한다. 이 경우 덕트(30)의 내부 공기압의 범위는 덕트(30)가 튜브 모양을 유지하도록 정해진 최소 공기압과, 덕트(30)의 파손을 방지할 수 있는 최대 공기압 사이의 범위로 정해진다.In addition, the control module 60 controls so that the amount of cold air supplied from the cooling module 20 to the duct 30 gradually increases as the temperature measured by the temperature sensor 40 increases. At this time, the control module 60 controls the amount of cold air so that the air pressure inside the duct 30 measured by the pressure sensor 50 maintains a certain range. In this case, the range of the internal air pressure of the duct 30 is defined as the range between the minimum air pressure defined so that the duct 30 maintains the tube shape and the maximum air pressure that can prevent the duct 30 from being damaged.

즉, 본 실시예의 덕트(30)는 천, 고무, 합성수지 또는 실리콘과 같이 내부 공기압에 따라 일정 모양을 형성하는 유연한 소재로 이루어지는데, 덕트(30)의 내부 공기압이 과도하게 낮은 경우 냉기 토출구(33)를 통한 냉기의 토출량이 떨어지게 되고, 특히 냉방모듈(20)로부터 상대적으로 먼 부분에서의 덕트(30) 내부 공기압이 낮아 해당 부분에서의 냉기 토출량이 떨어지게 된다. 이에 제어모듈(60)은 덕트(30) 내부의 공기압이 최소 공기압 이상이 되도록 유지함으로써 본체 케이스(10) 내부의 냉각 효율이 저하되는 것을 방지한다.That is, the duct 30 of the present embodiment is made of a flexible material that forms a predetermined shape according to the internal air pressure, such as cloth, rubber, synthetic resin, or silicon. When the internal air pressure of the duct 30 is excessively low, the cold air discharge port 33 The discharge amount of the cold air through the) is reduced, in particular, the air pressure inside the duct 30 in a portion relatively far from the cooling module 20 is low, the cold air discharge amount in the corresponding portion is lowered. Accordingly, the control module 60 prevents the cooling efficiency inside the main body case 10 from being lowered by maintaining the air pressure in the duct 30 to be equal to or greater than the minimum air pressure.

또한 덕트(30) 내부의 공기압이 과도하게 높은 경우 연성의 소재로 이루어진 덕트가 찢어지는 등 파손이 발생할 수 있고, 이 경우 파손 부분으로 냉기가 유출되어 본체 케이스(10) 내부에 대한 냉각 효율이 떨어지게 된다. 이에 제어모듈(60)은 덕트(30) 내부의 공기압이 최대 공기압 이하가 되도록 유지함으로써 덕트(30)의 파손을 방지하고, 냉각 효율이 저하되는 것을 방지할 수 있다.In addition, if the air pressure in the duct 30 is excessively high, damage may occur, such as a duct made of a ductile material, and in this case, cold air flows out to the damaged part to reduce cooling efficiency of the inside of the body case 10. do. Accordingly, the control module 60 may prevent damage to the duct 30 by preventing the air pressure in the duct 30 to be equal to or less than the maximum air pressure, and prevent the cooling efficiency from being lowered.

한편 제어모듈(60)은 온도 센서(40)가 측정한 본체 케이스(10) 내부의 온도가 상승하여, 냉방모듈(20)이 덕트(30)로 공급하는 냉기의 온도가 냉방모듈(20)이 공급가능한 최소의 온도에 도달하도록 제어하였으나, 온도 센서(40)의 측정 결과 온도가 더욱 상승하여 냉방모듈(20)의 출력을 높일 필요가 있다고 판단할 수 있다. 이 경우 제어모듈(60)은 덕트(30)의 내부 공기압이 최대 공기압 이하를 유지하는 범위에서 냉기의 양이 증가하도록 냉방모듈(20)을 제어할 수 있으며, 이에 따라 덕트(30)의 파손을 방지하면서 냉방 효율을 극대화할 수 있다.On the other hand, the control module 60 increases the temperature inside the body case 10 measured by the temperature sensor 40, so that the temperature of the cooling air supplied from the cooling module 20 to the duct 30 is increased by the cooling module 20. While controlling to reach the minimum supplyable temperature, it may be determined that the output of the cooling module 20 needs to be increased by increasing the temperature as a result of the measurement of the temperature sensor 40. In this case, the control module 60 may control the cooling module 20 to increase the amount of cold air in a range in which the internal air pressure of the duct 30 is less than or equal to the maximum air pressure, thereby preventing damage to the duct 30. It is possible to maximize the cooling efficiency while preventing.

본 실시예에서 냉방모듈(20)로부터의 냉기를 전산장비(2)로 공급하는 덕트(30)는, 냉기 공급 여부에 따라 수축 및 팽창하므로, 서버랙(100)내 최소한의 공간을 이용하여 설치하는 것이 가능하며, 서버랙(100)의 소형화에 기여하게 된다. 또한 냉방 제어 장치의 제어 모듈(60)은 덕트(30)가 냉기를 적절하게 공급할 수 있으면서도 파손되지 않도록, 냉방모듈(20)이 덕트(30)로 공급하는 냉기의 온도와 양을 조절함으로써, 본체 케이스(10) 내부의 냉방동작을 효율적으로 제어할 수 있다.In the present embodiment, the duct 30 for supplying the cool air from the cooling module 20 to the computer equipment 2 is contracted and expanded depending on whether the cold air is supplied, and thus, installed using the minimum space in the server rack 100. It is possible to, and contribute to the miniaturization of the server rack (100). In addition, the control module 60 of the cooling control device adjusts the temperature and the amount of the cool air supplied from the cooling module 20 to the duct 30 so that the duct 30 can adequately supply the cool air and is not damaged. The cooling operation inside the case 10 can be efficiently controlled.

본 발명의 다른 일 실시예에 다른 서버랙(200)의 냉방 제어 장치의 구성 및 동작에 대해서는 도 6 내지 도 8을 참조하여 좀 더 상세하게 설명하기로 한다.The configuration and operation of the cooling control device of the server rack 200 according to another embodiment of the present invention will be described in more detail with reference to FIGS. 6 to 8.

도 6은 본 발명의 다른 일 실시예에 따라 냉기를 공급하기 전 덕트(32)의 모습을 나타낸 정면 예시도이고, 도 7은 도 6의 실시예에 따라 냉기가 공급되어 팽창한 덕트(32)의 모습을 나타낸 정면 예시도이며, 도 8은 도 6의 일 실시예에 따라 냉기 공급 전후의 덕트(32)의 모습을 나타낸 부분 확대도이다.6 is a front view illustrating a state of the duct 32 before supplying cold air according to another embodiment of the present invention, and FIG. 7 is an duct 32 expanded and supplied with cold air according to the embodiment of FIG. 6. Figure 8 is a front view showing the state, Figure 8 is a partially enlarged view showing the state of the duct 32 before and after the cold air supply according to an embodiment of FIG.

도 6 내지 도 8을 참조하여 설명하는 서버랙(200) 냉방 제어 장치의 각 구성 중, 도 1 내지 도 5를 참조하여 설명한 서버랙(100)의 냉방 제어 장치의 구성과 유사한 부분에 대해서는, 자세한 설명을 생략하고, 차이점을 중심으로 설명하기로 한다.Among the components of the server rack 200 cooling control apparatus described with reference to FIGS. 6 to 8, the portions similar to the configurations of the cooling control apparatus of the server rack 100 described with reference to FIGS. 1 to 5 are described in detail. The description will be omitted and the explanation will be focused on the differences.

도 2 및 도 6 내지 도 8을 참조하면, 본 실시예의 서버랙(200)의 냉방 제어 장치는 본체 케이스(10), 냉방모듈(20), 덕트(32), 온도 센서(40), 압력 센서(50) 및 제어모듈(60)을 포함하여 구성된다.2 and 6 to 8, the cooling control apparatus of the server rack 200 of the present embodiment is the main body case 10, the cooling module 20, the duct 32, the temperature sensor 40, the pressure sensor 50 and the control module 60 is configured.

본체 케이스(10)는 상하로 위치한 복수의 수평판(11)과, 해당 수평판(11)을 연결하여 수직으로 형성된 복수의 수직판(12)을 포함하여, 서버랙(200)의 외관을 이룬다. 본체 케이스(10) 내부의 선반(1) 상에는 전산장비(2)가 탑재되고, 전면에는 도어(3)가 위치한다.The main body case 10 includes a plurality of horizontal plates 11 positioned up and down, and a plurality of vertical plates 12 vertically connected by connecting the horizontal plates 11 to form an appearance of the server rack 200. . The computer equipment 2 is mounted on the shelf 1 inside the main body case 10, and the door 3 is positioned on the front surface thereof.

냉방모듈(20)은 냉각사이클을 통해 덕트(32)로 냉기를 공급하여 본체 케이스(10) 내부의 냉방 동작을 수행한다.The cooling module 20 supplies cooling air to the duct 32 through a cooling cycle to perform a cooling operation inside the body case 10.

덕트(32)는 냉방모듈(20)로부터 공급된 냉기가 본체 케이스(10) 내부로 공급되도록 인도하는 역할을 한다. 덕트(32)는 냉방모듈(20)로부터 신장되어 본체 케이스(10)의 수직판(12)의 내면에 수직 방향으로 부착 설치되었다.The duct 32 serves to guide the cool air supplied from the cooling module 20 to be supplied into the body case 10. The duct 32 extends from the cooling module 20 and is attached to the inner surface of the vertical plate 12 of the main body case 10 in the vertical direction.

본 실시예의 덕트(32)는 천, 고무, 합성수지 또는 실리콘과 같이 내부 공기압에 따라 일정 모양을 형성하는 유연한 소재로 이루어지며, 본체 케이스(10) 내부에 탑재된 전산장비(2)로 냉기를 공급하기 위한 적어도 하나의 냉기 토출구(34)를 포함한다. 이때, 냉기 토출구(34)는 덕트(32)의 외면을 관통한 하나 이상의 홀 형태로 형성되며, 각 냉기 토출구(34)는 서로 간격을 두고 이격하여 위치한다.Duct 32 of the present embodiment is made of a flexible material that forms a predetermined shape according to the internal air pressure, such as cloth, rubber, synthetic resin or silicon, and supplies cold air to the computer equipment 2 mounted inside the body case 10 At least one cold air outlet 34 for the purpose. At this time, the cold air outlet 34 is formed in the form of one or more holes through the outer surface of the duct 32, each cold air outlet 34 is spaced apart from each other.

이때, 냉방모듈(20)로부터 튜브 형태의 덕트(32) 내부로 냉기가 공급되면, 덕트(32)는 내부 공기압의 증가에 따라 팽창하여 원기둥, 타원기둥이나 각기둥 모양 등을 형성하게 된다.At this time, when cold air is supplied from the cooling module 20 into the tube-shaped duct 32, the duct 32 expands in accordance with an increase in the internal air pressure to form a cylinder, an elliptic cylinder or a prismatic cylinder.

도 6 및 도 8 좌측의 (a)도면은 덕트(32)에 냉기가 공급되지 않은 상태를 나타내는데, 이 경우 덕트(32)는 내부 공기압이 상대적으로 낮음에 따라 그 부피가 줄어들어 수축된 형태를 취하게 된다. 그리고 덕트(32)가 수축됨에 따라 선반(1)을 가리지 않게 되어 전산장비(2)를 탑재하기 위한 공간을 제공하게 된다. 이러한 상태에서 선반(1)에 전산장비(2)를 탑재하는 경우, 전산장비(2)가 덕트(32)에 걸리지 않게 되고, 설사 걸리더라도 덕트(32)의 연성 재질에 따라 파손이 방지된다.6 and 8 (a) of the left side shows a state in which no cold air is supplied to the duct 32. In this case, the duct 32 is reduced in volume due to a relatively low internal air pressure, thereby taking a contracted form. Done. As the duct 32 is contracted, the shelf 1 is not obstructed to provide a space for mounting the computer equipment 2. When the computer equipment 2 is mounted on the shelf 1 in such a state, the computer equipment 2 is not caught by the duct 32, and even if the diarrhea is caught, damage is prevented according to the ductile material of the duct 32.

도 7 및 도 8 우측의 (b)도면은 덕트(32)에 냉기가 공급되는 상태를 나타내는데, 이 경우 덕트(32)는 내부 공기압이 상대적으로 높아짐에 따라 그 부피가 늘어나 팽창된 형태를 취하게 된다. 이 경우 덕트(32)가 팽창함에 따라 비로소 선반(1)의 일부분을 가리게 되며, 전산장비(2)와 가까운 쪽에 형성된 홀 형태의 냉기 토출구(34)를 통해 냉기를 공급한다.7 (b) and 8 (b) show the state in which cold air is supplied to the duct 32. In this case, the duct 32 has its volume increased as the internal air pressure is relatively increased, thereby taking an expanded form. do. In this case, as the duct 32 expands, it partially covers a part of the shelf 1, and supplies cold air through a hole-type cold air discharge port 34 formed near the computer equipment 2.

온도 센서(40)는 본체 케이스(10) 내부의 온도를 측정하는 역할을 하며, 이를 위한 각종 온도 감지 소자를 채용할 수 있다.The temperature sensor 40 serves to measure the temperature inside the body case 10, and may employ various temperature sensing elements therefor.

압력 센서(50)는 덕트(32) 내부의 냉기에 따른 공기압을 측정하는 역할을 하며, 이를 위한 각종 압력 감지 소자를 채용할 수 있다.The pressure sensor 50 serves to measure the air pressure according to the cold air in the duct 32, and may employ various pressure sensing elements therefor.

제어모듈(60)은 온도 센서(40)와 압력 센서(50)의 측정 결과에 따라 냉방모듈(20)을 제어하여, 덕트(32)로 공급되는 냉기의 온도와 양을 조절한다. 제어모듈(60)은 온도 센서(40)에서 측정한 온도가 상승함에 따라 냉방모듈(20)에서 덕트(32)로 공급되는 냉기의 온도가 점진적으로 낮아지도록 제어한다.The control module 60 controls the cooling module 20 according to the measurement results of the temperature sensor 40 and the pressure sensor 50 to adjust the temperature and amount of cold air supplied to the duct 32. The control module 60 controls the temperature of the cold air supplied from the cooling module 20 to the duct 32 to gradually decrease as the temperature measured by the temperature sensor 40 rises.

또한 제어모듈(60)은 온도 센서(40)에서 측정한 온도가 상승함에 따라 냉방모듈(20)에서 덕트(32)로 공급되는 냉기의 양이 점진적으로 많아지도록 제어하며, 이때 제어모듈(60)은 압력 센서(50)에서 측정한 덕트(32) 내부의 공기압이 일정 범위를 유지하도록 냉기의 양을 제어한다. 이 경우 덕트(32)의 내부 공기압의 범위는 덕트(32)가 튜브 모양을 유지하도록 정해진 최소 공기압과, 덕트(32)의 파손을 방지할 수 있는 최대 공기압 사이의 범위로 정해진다.In addition, the control module 60 controls to gradually increase the amount of cold air supplied from the cooling module 20 to the duct 32 as the temperature measured by the temperature sensor 40 increases, and the control module 60 Controls the amount of cold air so that the air pressure in the duct 32 measured by the pressure sensor 50 is maintained in a certain range. In this case, the range of the internal air pressure of the duct 32 is defined as the range between the minimum air pressure defined so that the duct 32 maintains the tube shape and the maximum air pressure which can prevent the duct 32 from being damaged.

한편 제어모듈(60)은 온도 센서(40)가 측정한 본체 케이스(10) 내부의 온도가 상승하여, 냉방모듈(20)이 덕트(32)로 공급하는 냉기의 온도가 냉방모듈(20)이 공급가능한 최소의 온도에 도달하도록 제어하였으나, 온도 센서(40)의 측정 결과 온도가 더욱 상승하여 냉방모듈(20)의 출력을 높일 필요가 있다고 판단할 수 있다. 이 경우 제어모듈(60)은 덕트(32)의 내부 공기압이 최대 공기압 이하를 유지하는 범위에서 냉기의 양이 증가하도록 냉방모듈(20)을 제어할 수 있으며, 이에 따라 덕트(32)의 파손을 방지하면서 냉방 효율을 극대화할 수 있다.Meanwhile, in the control module 60, the temperature inside the main body case 10 measured by the temperature sensor 40 increases, and thus the temperature of the cooling air supplied from the cooling module 20 to the duct 32 is increased by the cooling module 20. While controlling to reach the minimum supplyable temperature, it may be determined that the output of the cooling module 20 needs to be increased by increasing the temperature as a result of the measurement of the temperature sensor 40. In this case, the control module 60 may control the cooling module 20 to increase the amount of cold air in a range in which the internal air pressure of the duct 32 is less than or equal to the maximum air pressure, thereby preventing damage to the duct 32. It is possible to maximize the cooling efficiency while preventing.

본 실시예에서 냉방모듈(20)로부터의 냉기를 전산장비(2)로 공급하는 덕트(32)는, 냉기 공급 여부에 따라 수축 및 팽창하므로, 서버랙(200)내 최소한의 공간을 이용하여 설치하는 것이 가능하며, 서버랙(200)의 소형화에 기여하게 된다. 또한 냉방 제어 장치의 제어 모듈(60)은 덕트(32)가 냉기를 적절하게 공급할 수 있으면서도 파손되지 않도록, 냉방모듈(20)이 덕트(32)로 공급하는 냉기의 온도와 양을 조절함으로써, 본체 케이스(10) 내부의 냉방동작을 효율적으로 제어할 수 있다.In this embodiment, since the duct 32 for supplying the cool air from the cooling module 20 to the computer equipment 2 is contracted and expanded depending on whether the cold air is supplied, the duct 32 is installed using the minimum space in the server rack 200. It is possible to, and contributes to the miniaturization of the server rack (200). In addition, the control module 60 of the cooling control device adjusts the temperature and the amount of the cool air supplied from the cooling module 20 to the duct 32 so that the duct 32 can properly supply the cool air and is not damaged. The cooling operation inside the case 10 can be efficiently controlled.

한편, 본 명세서와 도면에 개시된 실시예들은 이해를 돕기 위해 특정 예를 제시한 것에 지나지 않으며, 본 발명의 범위를 한정하고자 하는 것은 아니다. 여기에 개시된 실시예들 이외에도 본 발명의 기술적 사상에 바탕을 둔 다른 변형예들이 실시 가능하다는 것은, 본 발명이 속하는 기술분야에서 통상의 지식을 가진 자에게는 자명한 것이다. 또한, 본 명세서와 도면에서 특정 용어들이 사용되었으나, 이는 단지 본 발명의 기술 내용을 쉽게 설명하고 발명의 이해를 돕기 위한 일반적인 의미에서 사용된 것이지, 본 발명의 범위를 한정하고자 하는 것은 아니다.On the other hand, the embodiments disclosed in the specification and drawings are merely presented specific examples to aid understanding, and are not intended to limit the scope of the present invention. It is apparent to those skilled in the art that other modifications based on the technical idea of the present invention can be carried out in addition to the embodiments disclosed herein. In addition, although specific terms are used in the specification and the drawings, they are only used in a general sense to easily explain the technical contents of the present invention and to help the understanding of the present invention, and are not intended to limit the scope of the present invention.

Claims (8)

복수의 수평판과 상기 복수의 수평판을 연결하여 수직 형성된 수직판을 구비한 본체 케이스;A main body case having a vertical plate vertically formed by connecting a plurality of horizontal plates and the plurality of horizontal plates; 상기 본체 케이스에 위치하며 냉동사이클을 구성하여 상기 본체 케이스 내부의 냉방 기능을 수행하는 냉방모듈;A cooling module positioned in the main body case and constituting a refrigeration cycle to perform a cooling function in the main body case; 상기 냉방모듈로부터 공급된 냉기에 의한 내부 공기압에 따라 팽창하여 튜브 모양을 형성하도록 유연한 소재로 이루어지고, 상기 냉방모듈로부터 신장되어 상기 수직판 및 상기 수평판의 내면 중 하나 이상에 부착 설치되며, 상기 냉방모듈로부터 공급된 냉기를 상기 본체 케이스 내부에 탑재된 전산장비로 공급하기 위한 적어도 하나의 냉기 토출구가 형성된 덕트;It is made of a flexible material to expand in accordance with the internal air pressure by the cold air supplied from the cooling module to form a tube shape, extending from the cooling module is attached to one or more of the inner surface of the vertical plate and the horizontal plate, A duct formed with at least one cold air outlet for supplying cold air supplied from a cooling module to a computer equipment mounted inside the main body case; 상기 본체 케이스 내부의 온도를 측정하는 온도 센서;A temperature sensor measuring a temperature inside the main body case; 상기 덕트 내부의 공기압을 측정하는 압력 센서; 및A pressure sensor measuring air pressure in the duct; And 상기 온도 센서의 측정 결과에 따라 상기 냉방모듈이 상기 덕트로 공급하는 냉기의 온도를 제어하고, 상기 압력 센서의 측정 결과에 따라 상기 냉방모듈이 상기 덕트로 공급하는 냉기의 양을 제어하는 제어모듈; 을 포함하고,A control module for controlling the temperature of the cool air supplied to the duct by the cooling module according to the measurement result of the temperature sensor, and controlling the amount of cool air supplied to the duct by the cooling module according to the measurement result of the pressure sensor; Including, 상기 제어모듈은 상기 덕트의 내부 공기압이 일정 범위를 유지하도록 냉기의 양을 제어하되,The control module controls the amount of cold air to maintain a predetermined range of the internal air pressure of the duct, 상기 일정 범위는 상기 덕트가 튜브 모양을 유지하도록 정해진 최소 공기압과, 상기 덕트의 파손을 방지할 수 있는 최대 공기압 사이의 범위로 정해지는 것을 특징으로 하는 플렉서블 냉방 덕트를 구비한 서버랙의 냉방 제어 장치.The predetermined range is determined by the range between the minimum air pressure that is determined to maintain the tube shape and the maximum air pressure that can prevent damage to the duct, characterized in that the cooling control device of the server rack having a flexible cooling duct . 제1항에 있어서,The method of claim 1, 상기 제어모듈은 상기 본체 케이스 내부의 온도가 상승함에 따라 상기 냉방모듈이 공급하는 냉기 온도가 점진적으로 낮아지도록 제어하는 것을 특징으로 하는 플렉서블 냉방 덕트를 구비한 서버랙의 냉방 제어 장치.The control module cooling control apparatus of a server rack having a flexible cooling duct, characterized in that the cooling air temperature supplied by the cooling module is gradually lowered as the temperature inside the main body case increases. 제1항에 있어서,The method of claim 1, 상기 제어모듈은 상기 냉방모듈이 공급하는 냉기 온도가 상기 냉방모듈이 공급가능한 최소의 온도에 도달하였으나, 상기 온도 센서의 측정 결과에 따라 상기 냉방모듈의 출력을 높일 필요가 있는 경우, 상기 덕트의 내부 공기압이 상기 최대 공기압 이하를 유지하는 범위에서 냉기의 양이 증가하도록 제어하는 것을 특징으로 하는 플렉서블 냉방 덕트를 구비한 서버랙의 냉방 제어 장치.The control module, when the cooling air temperature supplied by the cooling module has reached the minimum temperature that can be supplied by the cooling module, but the output of the cooling module needs to be increased according to the measurement result of the temperature sensor, the inside of the duct Cooling control device of the server rack provided with a flexible cooling duct, characterized in that for controlling the amount of cold air increases in the range that the air pressure is maintained below the maximum air pressure. 제1항에 있어서,The method of claim 1, 상기 덕트는 상기 수직판의 내면을 따라 수직 방향으로 형성되거나, 상기 수평판의 내면을 따라 수평 방향으로 형성되고,The duct is formed in the vertical direction along the inner surface of the vertical plate, or formed in the horizontal direction along the inner surface of the horizontal plate, 상기 냉기 토출구는 상기 전산장비 방향으로 서로 이격하여 형성된 것을 특징으로 하는 플렉서블 냉방 덕트를 구비한 서버랙의 냉방 제어 장치.The cooling air outlet of the server rack having a flexible cooling duct, characterized in that formed in the direction of the computer equipment spaced apart from each other. 제1항에 있어서,The method of claim 1, 상기 덕트는 내부 공기압에 따라 원기둥, 타원기둥이나 각기둥 모양을 형성하는 것을 특징으로 하는 플렉서블 냉방 덕트를 구비한 서버랙의 냉방 제어 장치.The duct is cooling control device of the server rack having a flexible cooling duct, characterized in that to form a cylinder, elliptic cylinder or prismatic shape according to the internal air pressure. 제1항에 있어서,The method of claim 1, 상기 덕트는 상기 전산장비 방향으로 서로 이격하여 돌출 형성된 적어도 하나의 돌출부를 포함하고,The duct includes at least one protrusion formed to project apart from each other in the direction of the computer equipment, 상기 냉기 토출구는 상기 덕트의 내부와 외부를 연결하도록 상기 돌출부를 관통한 채널 형태로 형성된 것을 특징으로 하는 플렉서블 냉방 덕트를 구비한 서버랙의 냉방 제어 장치.The cooling air discharge port is a cooling control device of a server rack having a flexible cooling duct, characterized in that formed in the form of a channel passing through the projection to connect the inside and the outside of the duct. 제1항에 있어서,The method of claim 1, 상기 냉기 토출구는 상기 덕트의 외면을 관통한 홀 형태로 형성된 것을 특징으로 하는 플렉서블 냉방 덕트를 구비한 서버랙의 냉방 제어 장치.The cooling air outlet of the server rack provided with a flexible cooling duct, characterized in that formed in the form of a hole penetrating the outer surface of the duct. 제1항에 있어서,The method of claim 1, 상기 덕트는 천, 고무, 합성수지 또는 실리콘을 포함한 소재로 이루어진 것을 특징으로 하는 플렉서블 냉방 덕트를 구비한 서버랙의 냉방 제어 장치.The duct is a cooling device of the server rack having a flexible cooling duct, characterized in that made of a material containing a cloth, rubber, synthetic resin or silicon.
PCT/KR2014/011848 2013-12-11 2014-12-04 Cooling control device for server rack comprising flexible duct Ceased WO2015088186A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2013-0153852 2013-12-11
KR1020130153852A KR101533005B1 (en) 2013-12-11 2013-12-11 Air-conditioning control device of server rack with flexible cooling duct

Publications (1)

Publication Number Publication Date
WO2015088186A1 true WO2015088186A1 (en) 2015-06-18

Family

ID=53371438

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2014/011848 Ceased WO2015088186A1 (en) 2013-12-11 2014-12-04 Cooling control device for server rack comprising flexible duct

Country Status (2)

Country Link
KR (1) KR101533005B1 (en)
WO (1) WO2015088186A1 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101816060B1 (en) 2016-09-12 2018-01-08 주식회사 씨엔씨알 The server rack
US20180014433A1 (en) * 2015-05-07 2018-01-11 Dhk Storage, Llc Computer Server Heat Regulation Utilizing Integrated Precision Air Flow
CN113825347A (en) * 2021-09-17 2021-12-21 武汉兴和云网科技股份有限公司 High-performance computing desktop cloud system and device based on SPICE open source protocol
CN114144016A (en) * 2020-09-03 2022-03-04 中国联合网络通信集团有限公司 Cabinet cooling system and control method thereof

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101950215B1 (en) * 2017-07-11 2019-02-20 네이버비즈니스플랫폼 주식회사 Apparatus for swing type coil and method for cooling using the swing type coil

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR19990032436A (en) * 1997-10-18 1999-05-15 윤종용 Refrigerator
WO2002039024A2 (en) * 2000-11-09 2002-05-16 Storck Jr Gary A Raised floor air handling unit
JP2002374086A (en) * 2001-06-15 2002-12-26 Hitachi Ltd Cooling method for rack-mounted information processor
JP2005229126A (en) * 2005-03-15 2005-08-25 Tateyama Alum Ind Co Ltd Electronic device accomodating rack

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR19990032436A (en) * 1997-10-18 1999-05-15 윤종용 Refrigerator
WO2002039024A2 (en) * 2000-11-09 2002-05-16 Storck Jr Gary A Raised floor air handling unit
JP2002374086A (en) * 2001-06-15 2002-12-26 Hitachi Ltd Cooling method for rack-mounted information processor
JP2005229126A (en) * 2005-03-15 2005-08-25 Tateyama Alum Ind Co Ltd Electronic device accomodating rack

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20180014433A1 (en) * 2015-05-07 2018-01-11 Dhk Storage, Llc Computer Server Heat Regulation Utilizing Integrated Precision Air Flow
KR101816060B1 (en) 2016-09-12 2018-01-08 주식회사 씨엔씨알 The server rack
CN114144016A (en) * 2020-09-03 2022-03-04 中国联合网络通信集团有限公司 Cabinet cooling system and control method thereof
CN113825347A (en) * 2021-09-17 2021-12-21 武汉兴和云网科技股份有限公司 High-performance computing desktop cloud system and device based on SPICE open source protocol

Also Published As

Publication number Publication date
KR101533005B1 (en) 2015-07-02
KR20150068077A (en) 2015-06-19

Similar Documents

Publication Publication Date Title
WO2015088186A1 (en) Cooling control device for server rack comprising flexible duct
WO2016068552A2 (en) Rackmount server system and method for controlling same
US20210033234A1 (en) Air-based cooling for data center rack
WO2015080472A1 (en) Refrigerator
WO2018105928A1 (en) Vehicle thermal management system
US8961278B2 (en) Single rack cold air containment
WO2015012588A1 (en) Indoor unit of air conditioner and method of connecting refrigerant pipe thereof
RU2344578C1 (en) System and method for cooling instrument and distribution cabinets
WO2018110863A1 (en) Refrigerator
WO2015053554A1 (en) Control box, and outdoor unit of air conditioner comprising same
WO2017069487A1 (en) Air-conditioning system
US10999954B2 (en) Modular roof mounted cooling system and method for data center
WO2018021863A1 (en) Refrigerator
KR101816060B1 (en) The server rack
US6542361B2 (en) System for cooling computer components housed within a computer casing
WO2012002698A2 (en) Heat exchanger
WO2013062287A1 (en) Regenerative air-conditioning apparatus
WO2020027462A1 (en) Refrigerator
WO2013133574A1 (en) Electronic component cooling device built into aircraft
WO2010128693A1 (en) Air conditioner system
WO2013168886A1 (en) Air conditioning apparatus for network room rack
WO2011013948A2 (en) Refrigerator
WO2017047934A1 (en) Accumulator fixing device for compressor, and air-conditioning apparatus including same
KR101533004B1 (en) Server rack with flexible cooling duct
WO2016178489A1 (en) Dehumidification device for control panel

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 14869851

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

32PN Ep: public notification in the ep bulletin as address of the adressee cannot be established

Free format text: NOTING OF LOSS OF RIGHTS PURSUANT TO RULE 112(1) EPC

122 Ep: pct application non-entry in european phase

Ref document number: 14869851

Country of ref document: EP

Kind code of ref document: A1