WO2015062760A1 - Method for pressing or laminating at least two substrates, as well as release film and press insert for a corresponding method - Google Patents

Abstract

The invention relates to a method for pressing or laminating at least two substrates (10, 20) comprising the following steps: providing the substrates (10, 20) to be pressed or laminated in a press (P) having at least one heatable press plate (30, 32); providing a preferably single-layer release film (40, 41) between the substrates (10, 20) and the press plate (30, 32), said release film (40, 41) being made of a polyimide or a material, preferably a thermosetting polymer such as polyimide, that is temperature resistant and dimensionally stable (at least during the process cycle) up to at least 300°C, preferably up to at least 350°C, and particularly preferably up to at least 400°C; and pressing or laminating the substrates (10, 20) while applying heat via the press plate (30, 32). The invention also relates to a release film (40, 41) and a press insert (E) for a corresponding high-temperature method.

Description

Process for pressing or laminating at least two substrates and release film and press inlay for a corresponding process

The present invention relates to a method for

Pressing or laminating at least two substrates in a press with at least one heatable press plate under heat by means of this press plate, and a release film for a corresponding method for

High-temperature compression or high-temperature lamination and also a press inlay for said process

comprising a release film and a buffer layer.

The pressing or lamination of a plurality of substrates under heat in a press is basically known in order to heat the substrates together

connect. Such substrates may be, for example, a structured printed circuit board on the one hand and a cover film for protecting the conductor tracks on the other hand, wherein it is the circuit board itself, for example, a

multilayer board can act.

For high-frequency applications in electronics

(for example in radar technology) serve as

Base materials in printed circuit boards those with a very good damping behavior - e.g. Fiberglass Reinforced PTFE Laminates - to avoid skipping signals from a trace to an adjacent trace or from one trace to the next.

The trend towards more and more applications on mobile

Communication devices requires the requirement for a Increasing the clock frequencies to well over 10GHz for the PCBs used. A particular challenge in this context is the wiring in the

Devices; In particular, when these are very thin circuit boards, which are often performed at the same time in Feinstleiter- and multi-layer technology.

As base materials in both flexible and rigid-flexible circuit boards u.a. metallized polyimide (PI) films which, after patterning with a PI cover film, are provided over the conductive (copper) traces to protect the latter. As an adhesive on the underside of the PI cover film, so that it can be connected in the course of a lamination with the circuit board, were previously used adhesives based on epoxy or acrylic, which were laminated in heating presses at temperatures of <200 ° C. Alternatively, the lamination of the cover sheet also takes place on non-adhesive, metallized PI films.

Due to the previously described tendency to higher

Signal frequencies and thus the signals do not "jump" over the traces, are used in the art as cover films increasingly those in which a cement based on PTFE is used

 Polyimide composite films coated on both sides with a PTFE adhesive and used for multilayer construction

serve flexible printed circuit boards. However, PTFE adhesives require a significantly higher melting temperature of more than 280 ° C, as a rule. At these temperatures, however, commonly used release films based on release-coated films fail

Polyethylene terephthalate (PET), polyethylene naphthalates (PEN) or polyamides (PA). Likewise come

conventional coatings (e.g., silicones) at these temperatures are out of the question. Also slides out

fluorinated polymers, such as ethylene-tetrafluoroethylene (ETFE) or polyvinyl fluoride (PVF), have not proven to be sufficiently thermally stable, so they can not be used sensibly at temperatures of about 300 ° C, and also have too high elongation at break. Also, corresponding materials load up in a particularly strong way statically. Even sheets of sintered PTFE prove to be of little use, since they are during the

Laminating process at temperatures above 280 ° C to soften too much and thus it can lead to a shearing on the edge of (copper) conductor tracks.

In the prior art, attempts have hitherto been made to help by using several layers of such PTFE films. So that the package does not become too "spongy" due to the strong softening of the PTFE films, the release film package is additionally stabilized

 Metal foils of copper and / or aluminum inserted. A method with appropriate release films is technically and commercially complex due to the cutting costs for the many films used in conjunction with a high installation costs in the baling chamber. In addition, the provision of different films and requires

Foil materials a high cost.

It is therefore an object of the present invention to provide a method for pressing or laminating at least two substrates, which also at high

Process temperatures of over 280 ° C stable and safe can be performed, and a release film and a Press inlay to provide a release film that can be easily and effectively used in said process. This object is solved by the subject matter of the independent claims. The dependent claims form the central idea of the invention in particular

advantageously continue. According to a first aspect, the invention relates to a

Method for pressing or laminating at least second substrates, comprising the following steps:

Providing the substrates to be pressed or laminated in a press with at least one heatable press plate, providing a preferably single-layer release film between the substrates on the one hand and the press plate on the other hand, wherein the release film is made of a material, preferably a thermosetting polymer such as polyimide, which - preferably

at least for the duration of the process cycle - to at least 300 ° C, preferably to at least 350 ° C, more preferably to at least 400 ° C

is temperature resistant and dimensionally stable, and

Finally, pressing or laminating the substrates under heat by means of the pressing plate. According to another aspect of the invention, the release film used is made of a polyimide.

It has been found that with the inventive method, for example when using a release film of a thermosetting polymer such as in particular polyimides, for example, have a decomposition temperature of> 470 ° C, the release film even under the process typical Pressing or laminating a great

Having dimensional stability. Under dimensional stability according to the present invention, the behavior of the release film material with respect to the constancy of his

Expansion in length, width and thickness under the influence of temperature understood. One (high or good)

Dimensional stability is therefore characterized by the ability of a material to change its shape and shape under changing or different conditions - in this case especially the temperature - not or only insignificantly.

In addition, a shearing on the edge of (copper) conductor tracks can be avoided because the release film according to the invention does not soften even at process temperatures of above 300 ° C.

In particular, when using polyimides, the release film at the same time sufficient flexibility for the embedding of the conductor tracks with a height of, for example, -S 35μηι to be covered, metallized circuit board surface. In addition to the above

(Laminating) processes, the process with the

described release film not only for substrates

comprising a circuit board and a cover sheet

(Preferably facing one of the circuit board

Adhesive layer based on PTFE), but also for other substrates based on

 Liquid crystal polymers or other Schichtpresstoffen, Elektroisoliermaterialien and the like, wherein the

Substrates preferably 2-dimensional surface but can also be formed 3-dimensional surface.

 For example, between the substrates a

Adhesive layer, preferably based on PTFE, be provided, which is melted during the lamination process, that the two substrates over the adhesive layer

are connected to each other or are. Preferably, in this connection, at least one of the substrates on the surface facing the other substrate may be the one

Have adhesive layer.

 In summary, it is thus possible with the method according to the invention that in particular due to the

Use of the new release film material and construction the press package altogether manages with fewer layers and particularly preferably can be formed single-layered (whether with or without coating, as in further

will be described). Due to the lower thickness of the press package as a whole and a strong reduction in the number of auxiliary materials (no additional

Metal foils made of copper and / or aluminum required), the energy expenditure to be applied for the process can be significantly reduced because of the heated

Press plates outgoing temperature less

 Must penetrate auxiliary materials. This results in considerable economic and technical advantages

compared to the previous design of the designed for appropriate temperatures, known press pack.

According to a preferred embodiment, the release film used in the method further comprises an anti-adhesive surface at least on the side facing the substrates, wherein the anti-adhesive surface

preferably as a coating, for example. By means of a

Coating method is formed. Such an anti-adhesive surface or coating can be created in particular by means of a plasma process. In a plasma process, for example, in a

Vacuum chamber preferably two gases ionized, wherein the atoms of the gases finally on the release film

lay down and the anti-adhesive surface or

Form coating. The anti-adhesive

 For this purpose, the surface / coating preferably has an application thickness of <Ιμιη, so that due to the very thin coating in the context of the invention, there is also talk of a change in the surface. Such a treated release film surface is / is consequently placed in an anti-adhesive state and has the advantage that it does not leave any residues in contact with the laminated product (for example printed circuit board).

leaves, which would be suitable, subsequent

galvanic deposits or soldering processes on the

Complicate circuit board. A subsequent dry cleaning of the PCB surface is for the

inventive method thus no longer required; at least not because of the use of

described, new release film in the invention

Process for pressing / laminating the substrates (eg lamination process of a cover film on a printed circuit board). Furthermore, it can be avoided by means of the thus described release film with anti-adhesive coating / surface that the pressing plate by any emerging during the pressing process adhesive materials (eg. At the edge of the substrates or already provided

Openings / holes in the substrates, for example. For

Vias) accidentally bonded to the substrates to be pressed. In this way, the number of broke of the pressed / laminated product can be safely and significantly reduced.

According to a preferred embodiment, between the release film and the press plate at least one preferably to at least 300 ° C, more preferably to at least 350 ° C and most preferably to at least 400 ° C temperature resistant buffer layer

be provided to process-related

Compensate for surface fluctuations and bumps. This buffer layer may preferably comprise aramid fibers and further preferably comprises inorganic fillers and preferably high temperature resistant

Polymer binder on. Under temperature resistant is understood in the context of the invention that the materials at least the given temperatures or

Process temperatures while maintaining their (chemical and / or physical) properties withstand or can be used up to these, in the present case preferably temperatures above 280 ° C, preferably above 320 ° C and more preferably above 380 ° C, ie in particular high temperature range. In this case can also be spoken of high temperature resistant. The buffer layer preferably has a thickness of <1mm.

This also allows the buffer layer during the

 Placing several layers very well on the

adapt to different surface structures of the printed circuit boards. The same applies to different ones

Process cycles, in which one can therefore provide stratified according to the requirements of multiple buffer layers.

The press itself can be at least two

have opposite pressing plates, of which at least one, preferably both are heated. In this case, one of the aforementioned release films is provided between the substrates on the one hand and the respective press plate on the other. The respective Press plate may further include the substrates and the

Separation film and, if available, also have the buffer layer facing press plate. According to a particularly preferred embodiment, the method is a high-temperature method in which the process temperature (ie the injection or

Laminating temperature) up to 280 ° C, preferably up to 320 ° C and particularly preferably up to 380 ° C. The release film preferably has a thickness of <200 μm, particularly preferably <25 μm. The release film is also preferably two- or three-dimensionally flat. According to a further aspect, the invention relates to a

Release film for a process for high-temperature compression or high-temperature lamination of at least two substrates for insertion between the substrates on the one hand and a preferably heatable pressure plate on the other hand, wherein the release film of a thermosetting polymer,

is preferably made of a polyimide, and wherein the release film on at least one of its two sides an anti-adhesive surface (for example, preferably applied by a plasma method anti-adhesive

Coating). The anti-adhesive surface or coating preferably has a thickness of <Ιμιη, particularly preferably -S 50nm, most preferably of <20nm. According to a further aspect, the invention relates to a press insert for a method for high-temperature compression or high-temperature lamination of at least two substrates, comprising (at least) one release film, which is produced from a thermosetting polymer, preferably from a polyimide, as well as (at least) a buffer layer preferably lying flat against the release film, which has aramid fibers and preferably also inorganic filler materials and preferably

having high temperature resistant polymer binder. The single buffer layer may preferably have a thickness of <1 mm, wherein the buffer layer also several

Buffer layer components may comprise, which then each have a thickness of preferably -S 1mm. Likewise, the release film may preferably have the aforementioned anti-adhesive surface or coating at least on the

Have buffer layer facing away from side. By means of

Press insert, the advantages of the release film combined with the advantages of the buffer layer, which u.a.

characterized by being process-related

Surface fluctuations and bumps in the

Balancing process balances. The buffer layer preferably provided in the press insert according to the invention is particularly good at very high

 Process temperatures of over 300 ° C suitable, as it provides even at correspondingly high temperatures over several hours a good balance, for example, due to mechanical processes unevenness or unevenness. The buffer layer is preferably free of silicone or other volatiles and may

be provided in particular with a homogeneous, flat, closed and free of loose particles formed surface, so that it by such

Buffer material is avoided that residues on the

Product or material (for example, the pressure plate or the release film) remain behind. In summary, it should be noted that it is both the primary objective of the method according to the invention as well as the release film and the pressing system, a

appropriate / temperature-resistant and dimensionally stable release film in / for the corresponding context to use / provide due to their

Temperature stability and dimensional stability already leads to a safe and stable process and the inheritance of leaving behind

Residues in contact with the pressed or

laminated substrates largely prevented.

The last-mentioned effect can additionally be achieved by the provision of a corresponding anti-adhesive surface or

Coating can be further improved.

Further advantages, refinements and developments of the invention will be described below with reference to the drawing of the accompanying figure. The only FIG. 1 shows schematically a structure for a method according to the invention for pressing or laminating at least two substrates 10, 20.

According to FIG. 1, the substrates may comprise, for example, a (multilayer) printed circuit board 10 on the one hand and a cover foil 20 on the other hand. According to a preferred

Ausgestaltungsform can hereby be used as a base material for a corresponding flexible or rigid-flexible

Circuit board u.a. metallized polyimide films serve, whereby the circuit board with (copper)

) Conductor tracks can be structured. As a cover sheet 20 may preferably be a polyimide cover sheet for the protection of

(Copper) conductor tracks of the printed circuit board 10 are used. So that the cover film 20 can be connected to the printed circuit board 10, the cover film 20 preferably has an adhesive 21 (on the side facing the printed circuit board 10), which is particularly preferably made on the basis of PTFE. In particular adhesives based on PTFE require high process or laminating temperatures of over 280 ° C in order to produce a secure connection between cover sheet 20 and circuit board 10. However, it is also conceivable that the

Substrates 10, 20 others to be pressed or closed

laminating substrates; For example, substrates based on liquid crystal polymers (LCP) or other laminates,

Electrical insulating materials and the like. Preferably, the substrates 10, 20 are formed two- or three-dimensionally flat. Furthermore, more than two substrates 10, 20 may be provided. In order to press or laminate the substrates 10, 20, they are provided in a press P. For this purpose, the press P has at least one heatable press plate 30, 32. According to the preferred embodiment shown, however, the press P has at least two

opposite pressing plates 30, 32, of which at least one, but preferably both are heatable. Due to the heat energy emitted by the heated press plates, the pressing or lamination of the

Supported substrates 10, 20, for example, by the adhesive 21 provided on a substrate 10, 20 (for example, cover film 20) by the heat supply by means of the press plates 30, 32 with the other substrate

(For example, printed circuit board 10) melts and thus a thermal connection between the at least two substrates 10, 20 is produced. For example, between the substrates 10, 20 - preferably at least on one of the substrates 10 facing surface 45, 46 of another substrate 20 - an adhesive layer, preferably based on PTFE, be provided which is melted during the lamination process such that the two substrates 10th , 20 are interconnected via the adhesive layer / are.

For example, at the edges of the substrate package to be pressed or laminated or over into the

Printed circuit board 10 already introduced holes - for example, for vias - emerging from multilayer printed circuit boards during the pressing or laminating on the press components (for example, the press plates 30, 32) to avoid, according to the invention a release film 40, 41 between the substrates 10, 20 on the one hand and the one or the

Press plate (s) 30, 32 provided on the other hand. So, as shown in Fig. 1, two opposing pressure plates 30, 32 are provided, it is between the

Substrates 10, 20 on the one hand and the respective

Press plate 30, 32 on the other hand each a release film 40, 41 are provided.

According to one aspect of the invention, the release film 40, 41 is made of a polyimide. Polyimides have that

Advantage that they have a very high dimensional stability as thermoset polymers. In addition, you can

Polyimides even at particularly high process temperatures (ie in the present pressing or laminating temperatures) of above 300 ° C up to 400 ° C are used, since they themselves have a decomposition temperature of about 470 ° C.

According to another aspect, the release film 40, 41 is made of a material which is up to at least 300 ° C, preferably to at least 350 ° C, and especially

preferably to at least 400 ° C - at least over the or during the process cycle - temperature resistant and dimensionally stable. As such materials, especially thermosetting polymers are suitable, such as the aforementioned polyimides. By means of such a release film 40, 41 it can also be made possible that it is preferably single-layered since it is dimensionally stable even at process temperatures of up to 400 ° C. and does not become "spongy." Therefore, additional stabilizing films can be used

For example, be dispensed copper or aluminum. Furthermore, the energy expenditure for the

Method when using a corresponding release film 40, 41 are reduced insofar as that of the heated press plates 30, 32 outgoing temperature less auxiliary materials and a total of only (single) release film 40, 41 with a lower thickness (ie thickness) must penetrate. The release film 40, 41 used in the method according to the invention can, due to their

special properties have a thickness of only <200 microns, preferably even a thickness of only <25 microns, while still the required

Temperature resistance and dimensional stability has.

Moreover, in order to prevent a release film surface or side 45, 46 of the release film 40, 41 leaving residues in contact with the laminated substrate package S, the subsequent galvanic deposits or

Soldering processes on the circuit board 10 would complicate the release film 40, 41 may have an anti-adhesive surface or coating B at least on the substrates 10, 20 facing side 45, 46. This anti-adhesive surface or coating B is preferably applied to the release film 40, 41 by means of a plasma process

applied or created on the release film surface 45, 46 and can thus be provided particularly thin. The anti-adhesive surface or coating 45, 46 preferably has a thickness of <1 μm, particularly preferably less than 50 nm, very particularly preferably less than 20 nm. As can be seen from Fig. 1, between the

respective release film 40, 41 and the corresponding

Press plate 30, 32 each have a buffer layer 50, 51st

be provided. The buffer layer 50, 51 has the task, process-related surface fluctuations and

To compensate for unevenness in the pressing process or lamination process. The buffer layer 50, 51 is for this purpose

preferably temperature resistant to at least 300 ° C, more preferably to at least 350 ° C and most preferably to at least 400 ° C.

According to a particularly preferred embodiment, the buffer layer 50, 51 has aramid fibers. Such a buffer layer may further comprise inorganic fillers and preferably high temperature resistant polymer binders. The buffer layer 50, 51 is particularly well suited for pressing or laminating prepregs or PTFE and polyimide / glass laminates at very high temperatures of over 300 ° C, as they are also at correspondingly high Temperatures over several hours provides a good balance, for example, due to mechanical processes caused by unevenness or unevenness; for example, even if it is provided in several layers. These

Unevenness can, for example, by a

Summation of tolerances by the press P, the

Press plates 30, 32, as well as the material to be pressed or laminated (for example, substrates 10, 20) be conditional. A buffer layer 50, 51 provided according to the preferred embodiment is free of silicone or other volatile constituents and can in particular be provided with a homogeneous, flat,

be provided closed and free of loose particles formed surface, so that it is avoided by such a buffer material that residues on the product or material (for example, the pressure plate 30, 32 or the release film 40, 41) remain. The single buffer layer 50, 51 preferably has a thickness (ie thickness) of less than 1mm and especially

preferably a thickness of less than 0.9mm or even less than 0.8mm, and may be provided in any geometric shape and size (dimensions) according to the customer's requirements. The density of the buffer material is preferably 0.86 +/- 0.05 g / cm ³ and has

preferably a basis weight of 740 +/- 10g / m ² . The above-described buffer layer 50, 51 also has a particularly high breaking strength, for example in the longitudinal direction of more than 4.0 MPa and in the transverse direction of more than 3.0 MPa. As shown in FIG. 1 also can be seen, the

Pressing device P further each press plate 30, 32 a the substrates 10, 20 and the release film 40, 41 and, if present, also the buffer layer 50, 51 facing Press plate 31, 33 which is adapted to be pressed or laminated substrates 10, 20 and for a uniform heat and

Pressure distribution ensures.

In summary, a method for pressing or laminating at least two substrates 10, 20 is thus provided according to the invention, which comprises the following steps:

In a first preferred step, the

pressing or to be laminated substrates 10, 20 in a press P with at least one heatable

Press plate 30, 32 provided. In another

Step is between the substrates 10, 20 on the one hand and the / the press plate (s) 30, 32 on the other hand a

above-described release film 40, 41 is provided, which is preferably single-layered and more preferably made of a polyimide or at least one material which is temperature resistant and dimensionally stable up to at least 300 ° C, preferably to at least 350 ° C, more preferably to at least 400 ° C; such as a thermoset polymer such as polyimides. In a final step, the substrates 10, 20 are pressed or laminated with the introduction of heat by means of the press plate (s) 30, 32.

The method may preferably be described as

High-temperature process can be performed, in which the process temperature (ie in this case Verpress- or

Laminating) up to 280 ° C, preferably up to 320 ° C and particularly preferably up to 380 ° C, for example, in a Verpress- or Laminating process to fuse a PTFE-based adhesive accordingly and thus to allow a thermal connection of this adhesive can be used only at correspondingly high process temperatures.

Basically, it is conceivable according to an embodiment that between the substrates 10, 20, preferably at least on one of the substrates 20 facing surface of another substrate 10, an adhesive layer, preferably based on PTFE, which in the

 Laminating process is melted so that the two substrates 10, 20 (insoluble) are connected to each other via the adhesive layer / are. As already mentioned above, the present invention is also directed to the release film 40, 41 itself, which is for a method for high temperature lamination or

High-temperature compression of at least two substrates 10, 20 for insertion between the substrates 10, 20 on the one hand and a preferably heatable press plate 30, 32 on the other hand is suitable. Such a release film 40, 41 is in this case made of a thermosetting polymer, preferably made of a polyimide. The

Release film 40, 41 also has an anti-adhesive surface or coating B on at least one of its two sides / surfaces 45, 46. The anti-adhesive

Surface / coating B particularly preferably has a thickness of <1 μm, particularly preferably of <50 μm, very particularly preferably of <20 μm.

Furthermore, the present invention is also applicable to a

Press deposit E for a corresponding procedure for

High temperature compression or high temperature lamination at least two substrates 10, 20 directed. The

corresponding press inlay E has for this purpose a release film 40, 41 produced from a thermosetting polymer, preferably from a polyimide, and also a buffer layer 50, 51 which preferably bears flat on the release film 40, 41 and which has aramid fibers and preferably also inorganic filler materials and preferably high-temperature-resistant polymer binders having. The buffer layer 50, 51 of the press inlay E preferably has a thickness of <1 mm, particularly preferably <0.9 mm. Furthermore, the buffer layer can be multi-layered

be formed and several preferably flat

layered buffer layer components, each preferably having a thickness of less than 1mm, more preferably less than 0.9mm.

The used in the aforementioned press inlay E

Release film 40, 41 may further include an anti-adhesive

Surface or coating of the type described above at least on the buffer layer 50, 51 facing away from side / surface 45, 46 and particularly

preferably also have a thickness of <.

The invention is not limited to the preceding ones

Embodiments limited as long as they are from

 Subject of the following claims are included. Furthermore, the preceding embodiments in any way with each other and can be combined.

Claims

 claims Method for pressing or laminating at least two substrates (10, 20), comprising the following steps:  Provide the to be pressed or to laminating substrates (10, 20) in a press (P) with at least one heatable press plate (30, 32),  Providing a preferably single-ply Separating film (40, 41) between the substrates (10, 20) on the one hand and the pressing plate (30, 32) on the other hand, wherein the separating film (40, 41) made of a material, preferably a thermosetting polymer such as Polyimide, which is temperature resistant and dimensionally stable up to at least 300 ° C, preferably to at least 350 ° C, more preferably to at least 400 ° C, and  Pressing or laminating the substrates (10, 20) while supplying heat by means of the pressing plate (30, 32). Method for pressing or laminating at least two substrates (10, 20), comprising the following steps:  Provide the to be pressed or to laminating substrates) 10, 20) in a press (P) with at least one heatable press plate (30, 32),  Providing a preferably single-ply Separation film (40, 41) between the substrates (10, 20) on the one hand and the press plate (30, 32) on the other hand, wherein the release film (40, 41) is made of a polyimide, and Pressing or laminating the substrates (10, 20) while supplying heat by means of the pressing plate (30, 32). 3. The method according to claim 1 or 2, wherein the  Release film (40, 41) at least on the substrates (10, 20) facing side (45, 46) has an anti-adhesive surface (B), wherein the anti-adhesive  Surface (B) is preferably formed as a coating, for example. By means of a plasma process, and preferably a thickness of <lym, especially  preferably <50 nm, very particularly preferably of <20 nm. Method according to one of the preceding claims, wherein between the release film (40, 41) and the press plate (30, 32) in each case at least one, preferably up to at least 300 ° C, particularly preferably up to  At least 350 ° C and most preferably at least 400 ° C temperature-resistant buffer layer (50, 51) is provided to process-related  Surface fluctuations and bumps  to balance out. A method according to claim 4, wherein the buffer layer (50, 51) comprises aramid fibers and preferably further comprises inorganic fillers and preferably high temperature resistant polymer binders  and wherein the buffer layer (50, 51)  preferably has a thickness of <1mm. 6. The method according to any one of the preceding claims, wherein the press (P) at least two themselves opposing press plates (30, 32), of which at least one is heatable, and wherein between the substrates (10, 20) on the one hand and the respective pressure plate (30, 32) on the other hand in each case a release film (40, 41) is provided. 7. The method according to any one of the preceding claims, wherein the respective pressure plate (30, 32) a the substrates (10, 20) and the release film (40, 41) and, if present, also the buffer layer (50, 51) facing the press plate ( 31, 33). 8. The method according to any one of the preceding claims, wherein between the substrates (10, 20), preferably at least on one of the other substrate (10) facing surface (45, 46) of a substrate (20), an adhesive layer, preferably based on PTFE, is provided, which is melted during the lamination process such that the two substrates (10, 20) are connected to one another via the adhesive layer. 9. The method according to any one of the preceding claims, wherein the substrates (10, 20), a printed circuit board (10) and a cover sheet (20) preferably with the  Printed circuit board (10) facing adhesive layer on PTFE Base, or substrates based on  Liquid crystal polymers or others  Laminated, Elektroisoliermaterialien and the like are. 10. The method according to one of the preceding Claims, wherein the substrates (10, 20) are two- or three-dimensional surface. 11. Method according to one of the preceding  Claims, wherein the method is a high temperature process, wherein the process temperatures up to 280 ° C, preferably up to 320 ° C and particularly preferably up to 380 ° C. 12. release film (40, 41) for a method for  High temperature compression or process for  High-temperature lamination of at least two substrates (10, 20) for insertion between the substrates (10, 20) on the one hand and a preferably heatable  Press plate (30, 32) on the other hand, wherein the  Separating film (40, 41) made of a thermosetting  Polymer, preferably made of a polyimide, and wherein the release film (40, 41) a  antiadhesive surface (B), in particular an antiadhesive coating preferably applied by means of plasma, at least on one of its two sides (45, 46), the  antiadhesive surface (B) preferably has a thickness of <lym, more preferably <50nm, most preferably of <20nm. 13. Press deposit (E) for a procedure for  High-temperature compression or high-temperature lamination of at least two substrates (10, 20), comprising:  a release film (40, 41) consisting of a  thermosetting polymer, preferably from one  Polyimide, is manufactured, as well a buffer layer (50, 51) preferably lying flat against the release film (40, 41), which aramid fibers and preferably further inorganic  Fillers and preferably  high temperature resistant polymer binder, and wherein the buffer layer (50, 51) preferably has a thickness of <1mm. 14. Press insert (E) according to claim 13, wherein the release film (40, 41) at least on the buffer layer (50, 51) facing away from the side (45, 46) further comprises an anti-adhesive surface (B), preferably, for example, by plasma produced Coating, wherein the anti-adhesive surface (B) is preferably a thickness of <lym, especially  preferably <50 nm, particularly preferably <20 nm. 15. The method according to any one of claims 2 to 11, release film (40, 41) according to claim 12 or  A press insert according to claim 13 or 14, wherein the release film (40, 41) is at least 300 ° C,  preferably up to at least 350 ° C, especially  preferably to at least 400 ° C temperature resistant and dimensionally stable. 16. The method according to any one of claims 1 to 11 and 15, release film (40, 41) according to claim 12 or 15 or press insert (E) according to one of claims 13 to 15, wherein the release film (40, 41) has a thickness of <200ym, preferably of <25ym. 17. The method according to any one of claims 1 to 11, 15 and 16, release film (40, 41) according to any one of claims 13, 15 or 16 or press insert (E) according to one of Claims 13 to 16, wherein the release film (40, 41) is two- or three-dimensionally flat