WO2014200140A1 - Method for computer-aided simulation of atomic-resolution scanning thermoelectric microscope - Google Patents
Method for computer-aided simulation of atomic-resolution scanning thermoelectric microscope Download PDFInfo
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- WO2014200140A1 WO2014200140A1 PCT/KR2013/006267 KR2013006267W WO2014200140A1 WO 2014200140 A1 WO2014200140 A1 WO 2014200140A1 KR 2013006267 W KR2013006267 W KR 2013006267W WO 2014200140 A1 WO2014200140 A1 WO 2014200140A1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01Q—SCANNING-PROBE TECHNIQUES OR APPARATUS; APPLICATIONS OF SCANNING-PROBE TECHNIQUES, e.g. SCANNING PROBE MICROSCOPY [SPM]
- G01Q30/00—Auxiliary means serving to assist or improve the scanning probe techniques or apparatus, e.g. display or data processing devices
- G01Q30/04—Display or data processing devices
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01Q—SCANNING-PROBE TECHNIQUES OR APPARATUS; APPLICATIONS OF SCANNING-PROBE TECHNIQUES, e.g. SCANNING PROBE MICROSCOPY [SPM]
- G01Q60/00—Particular types of SPM [Scanning Probe Microscopy] or microscopes; Essential components thereof
- G01Q60/10—STM [Scanning Tunnelling Microscopy] or apparatus therefor, e.g. STM probes
- G01Q60/14—STP [Scanning Tunnelling Potentiometry]
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- the present invention relates to a computer aided simulation method of atomic level-resolution scanning thermoelectric microscopes.
- Scanning tunneling microscopy is a technique for displaying atomic-resolution images of the surface of a material based on a vacuum tunneling current generated locally by applying an external voltage between the material and the probe.
- an external voltage since an external voltage must be applied, Fermi electrons may be disturbed by the voltage, and the scanable area is narrow.
- a sharp probe must be made to generate a localized current, and the difficulty of this process is that the yield is not high.
- a scanning thermoelectric microscope may be considered as an alternative to supplement the disadvantages of the scanning tunneling microscope, but in general, heat is known to be difficult to localize in space, so it is not practical to implement.
- the present invention relates to a computer-aided simulation method of atomic-resolution scanning thermoelectric microscope, which aims to provide a method of knowing the surface morphology of a material through simulation without using the actual scanning thermoelectric microscope.
- the present invention relates to a computer-aided simulation method of atomic-resolution scanning thermoelectric microscopy, wherein a predetermined local region of a material Computer simulations of the thermoelectric voltage V for atomic level image display for
- Seebeck coefficient Is the intrinsic property of the material expressed as electrical conductivity as Seebeck coefficient for the local area.
- a Seebeck coefficient defined as follows may be used.
- the temperature change between the probe and the material surface is displayed. Is preferably defined by the following equation.
- the present invention provides a method for simulating atomic-resolution scanning thermoelectric microscopes.
- FIG. 1 is a conceptual diagram of a scanning thermoelectric microscope to which the method according to the present invention is applied.
- FIG. 2 is a view showing a simulation result image according to the present invention.
- FIG. 3 is a view showing an image displayed through an experiment according to the prior art.
- the probe 10 of the scanning thermoelectric microscope is in contact with the graphene material 20 (graphene) at a first temperature T 1 and the graphene material is at a second temperature T 2 . It is desirable for the environment to maintain an ultra-high vacuum.
- the drawings and the specification are described as graphene, but the simulation method of the present invention should not be construed as being limited to graphene.
- thermoelectric voltage is generated by the difference between the first temperature and the second temperature, which can be accurately measured by a high-impedance voltmeter in an actual scanning thermoelectric microscope.
- ⁇ is the electrical conductivity, Is the local Seebeck coefficient.
- This diffusion driving force serves as a basis for generating thermal voltage.
- the temperature gradient ⁇ T is determined by heat transfer properties such as the intrinsic thermal conductivity of the material and the interfacial conductance between the probe and the material.
- Equation 1 is represented by Equation 2 as follows.
- Equation 4 may be simplified to Equation 5 as follows.
- the local Seebeck coefficient may be derived or obtained by defining electric conductivity, electron transmission function, local state density, etc. by other methods other than the following methods. do.
- the local Seebeck coefficient in the structure shown in FIG. 1 is the energy-and position-dependent electron transmission function between the probe and the material from the Landauer formula. It can be represented by the following equation (6).
- T is the absolute temperature
- f is the Fermi-Dirac distribution function at temperature T.
- ⁇ means a delta function
- Equation 6 may be rewritten as Equation 8 as follows.
- Equation 8 It can be seen from Equation 8 that the Seebeck coefficient is strongly related to the electrical state near the Fermi level.
- thermoelectric image simulation with atomic resolution a step function temperature change is required at the interface between the spherical probe and the material surface, and the spherical temperature profile is assumed to be expressed as
- Is the temperature of the probe Is the temperature of the material
- R is the tip radius of the probe
- Center of tip of probe : Refers to Gaussian broadening, which indicates the degree of sudden change in temperature change.
- the contact distance z 0 between the tip of the probe and the workpiece is kept constant on the workpiece surface.
- Equation 9 is not the only temperature profile to which the present invention is applied.
- FIG. 2 (a) shows the Seebeck coefficient displayed by the computer-aided simulation method according to the present invention
- FIG. 2 (b) shows the simulated thermoelectric voltage image. Simulation of the images shown in (a) and (b) of FIG. 2 was performed on n-doped pure graphene. A part shown in white in FIG. 2B is an atom, and a part shown in black is a void. 3 shows an image of a defect-free region of bilayer graphene on silicon carbide (SiC) as an image tested by the method disclosed in the above-described S. Cho paper. have. Notable identity is found between FIGS. 2B and 3.
- SiC silicon carbide
- T 315K
- z 0 3 ms
- ⁇ T 3K
- R 0.75 ms
- ⁇ 0.3 ms, respectively.
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Abstract
Description
본 발명은 원자수준-해상도 주사 열전 현미경의 컴퓨터 원용 시뮬레이션 방법에 관한 것이다.The present invention relates to a computer aided simulation method of atomic level-resolution scanning thermoelectric microscopes.
소재의 표면을 원자수준-해상도로 볼 수 있는 방법으로 미국특허 제4,343,993호에 개시되어 있는 주사 터널링 현미경(Scanning Tunneling Microscope) 기술이 있다. 주사 터널링 현미경은 소재와 탐침 사이에 외부 전압을 인가하여 국지적으로(localized) 발생하는 진공 터널링 전류에 기초하여 소재 표면의 원자수준-해상도 이미지를 표시하는 기술이다. 그런데 외부 전압을 인가해야 하기 때문에 전압에 의해 페르미 전자가 방해받을 가능성이 있고 스캔할 수 있는 영역이 좁은 단점이 있다. 그리고 국지화된 전류를 발생시키기 위해 날카로운 탐침을 만들어야 하는데, 이 과정의 어려움 때문에 생산성(yield)도 높지 않은 단점이 존재한다.One way to view the surface of a material in atomic-resolution is the Scanning Tunneling Microscope technology disclosed in US Pat. No. 4,343,993. Scanning tunneling microscopy is a technique for displaying atomic-resolution images of the surface of a material based on a vacuum tunneling current generated locally by applying an external voltage between the material and the probe. However, since an external voltage must be applied, Fermi electrons may be disturbed by the voltage, and the scanable area is narrow. In addition, a sharp probe must be made to generate a localized current, and the difficulty of this process is that the yield is not high.
이러한 주사 터널링 현미경의 단점을 보완할 수 있는 대안으로 주사 열전 현미경(scanning thermoelectric microscope)이 고려될 수 있지만 일반적으로 열은 공간에서 국지화되기(localization)가 어려운 것으로 알려져 있어서 실제로 구현하기가 여의치 않다.A scanning thermoelectric microscope may be considered as an alternative to supplement the disadvantages of the scanning tunneling microscope, but in general, heat is known to be difficult to localize in space, so it is not practical to implement.
최근에 주사 열전 현미경을 이용하여 원자수준-해상도로 소재의 표면을 볼 수 있는 기술이 2013년에 공개된 논문 S. Cho, S. D. Kang, W. Kim, E.-S. Lee, S.-J. Woo, K.-J. Kong, I. Kim, H.-D. Kim, T. Zhang, J. A. Stroscio, Y.-H. Kim, and H.-K. Lyeo, "Thermoelectric imaging of structural disorder in epitaxial graphene" arXiv: 1305.2845 (http://arxiv.org/abs/1305.2845) 에 개시되어 있다.Recently, a technique for scanning the surface of a material in atomic-resolution using scanning thermoelectric microscope was published in 2013. S. Cho, S. D. Kang, W. Kim, E.-S. Lee, S.-J. Woo, K.-J. Kong, I. Kim, H.-D. Kim, T. Zhang, J. A. Stroscio, Y.-H. Kim, and H.-K. Lyeo, "Thermoelectric imaging of structural disorder in epitaxial graphene" arXiv: 1305.2845 (http://arxiv.org/abs/1305.2845).
그러나 이 논문에 의하더라도 실제 장치를 구현하여 주사 열전 현미경으로 소재의 표면을 관찰해야 하며 그러한 장치 없이 미리 소재의 표면 형상을 시뮬레이션하는 기술은 아직 개발되지 않고 있다.However, even with this paper, a real device must be implemented to observe the surface of the material with a scanning thermoelectric microscope, and a technique for simulating the surface shape of the material without such a device has not been developed yet.
본 발명은, 원자수준-해상도의 주사 열전 현미경의 컴퓨터 원용 시뮬레이션 방법에 관한 것으로서, 실제 주사 열전 현미경에 의하지 않고도 시뮬레이션을 통해 소재의 표면 형태를 알 수 있는 방법을 제공하는 것을 목적으로 한다.The present invention relates to a computer-aided simulation method of atomic-resolution scanning thermoelectric microscope, which aims to provide a method of knowing the surface morphology of a material through simulation without using the actual scanning thermoelectric microscope.
본 발명은 원자수준-해상도 주사 열전 현미경의 컴퓨터 원용 시뮬레이션 방법에 관한 것으로서, 소재의 소정의 국지 영역 에 대한 원자 레벨 이미지 표시를 위한 열전압(thermoelectric voltage) V를 아래 수학식에 의해서 컴퓨터가 계산하는 시뮬레이션 방법에 관한 것이다.FIELD OF THE INVENTION The present invention relates to a computer-aided simulation method of atomic-resolution scanning thermoelectric microscopy, wherein a predetermined local region of a material Computer simulations of the thermoelectric voltage V for atomic level image display for
여기에서,From here,
: 적분변수 : Integral variable
S: 지벡 계수(Seebeck Coefficient)S: Seebeck Coefficient
: 국지 영역의 온도 그래디언트(temperature gradient) : Temperature gradient of the local area
은 국지 영역에 대한 지벡 계수(Seebeck coefficient)로서 전기전도도로 표현되는 소재의 고유 특성이다. 본 발명에서는 다음과 같이 정의되는 지벡 계수를 사용할 수 있다. Is the intrinsic property of the material expressed as electrical conductivity as Seebeck coefficient for the local area. In the present invention, a Seebeck coefficient defined as follows may be used.
여기에서,From here,
e: 전자 전하량e: amount of electron charge
T: 절대 온도T: absolute temperature
EF: 페르미 에너지E F : Fermi Energy
f: 온도 T에서의 페르미-디랙 분포 함수(Fermi-Dirac distribution function)f: Fermi-Dirac distribution function at temperature T
: 소재의 브릴루앙 영역(Brillouin zone)의 k 번째 지점에서 i번째 고유상태(eigenstate) : I-eigenstate at the k-th point of the Brillouin zone of the material
: 소재의 브릴루앙 영역(Brillouin zone)의 k 번째 지점에서 i번째 고유값(eigenvalue) Is the i th eigenvalue at the k th point of the Brillouin zone of the material.
δ: 델타 함수(delta function)δ: delta function
본 발명에 의한 시뮬레이션 방법에 있어서, 탐침과 소재 표면 사이의 온도 변화를 표시하는 는 아래 수학식에 의해서 정의되는 것이 바람직하다.In the simulation method according to the present invention, the temperature change between the probe and the material surface is displayed. Is preferably defined by the following equation.
: 탐침의 온도 : Probe temperature
: 소재의 온도 Material temperature
: 누적 분포 함수(cumulative distribution function; CDF) Cumulative distribution function (CDF)
R: 탐침의 팁 반경R: Tip radius of the probe
: 탐침의 팁 중앙 : Center of tip of probe
: 온도변화의 급작성 정도를 표시하는 가우시안 확장(Gaussian broadening) : Gaussian broadening indicating the degree of sudden change in temperature change
본 발명에 의하면 원자수준-해상도의 주사 열전 현미경의 시뮬레이션 방법이 제공된다.The present invention provides a method for simulating atomic-resolution scanning thermoelectric microscopes.
도 1은 본 발명에 의한 방법이 적용되는 주사 열전 현미경의 개념도를 도시한 도면.1 is a conceptual diagram of a scanning thermoelectric microscope to which the method according to the present invention is applied.
도 2는 본 발명에 의한 시뮬레이션 결과 이미지를 표시한 도면.2 is a view showing a simulation result image according to the present invention.
도 3은 선행 기술에 따른 실험을 통해 표시되는 이미지를 도시한 도면.3 is a view showing an image displayed through an experiment according to the prior art.
이하에서는 첨부 도면을 참조하여 본 발명에 대해 구체적으로 설명한다. 주사 열전 현미경의 탐침(10)이 제1 온도(T1)으로 그래핀 소재(20; graphene)에 접촉하고 그래핀 소재는 제2 온도(T2)에 놓여 있다. 주위 환경은 초고진공 상태(ultra-high vacuum)를 유지하는 것이 바람직하다. 편의를 위해 도면과 본 명세서에서는 그래핀으로 설명하지만 본 발명의 시뮬레이션 방법이 그래핀에 제한되는 것으로 해석되어서는 아니된다.Hereinafter, the present invention will be described in detail with reference to the accompanying drawings. The
제1 온도와 제2 온도 차이에 의해서 열전압(thermoelectric voltage)이 발생하며 이 열전압은 실제 주사 열전 현미경에서는 고임피던스 전압계(high-impedance voltmeter)에 의해서 정확하게 측정될 수 있다.The thermoelectric voltage is generated by the difference between the first temperature and the second temperature, which can be accurately measured by a high-impedance voltmeter in an actual scanning thermoelectric microscope.
전기 전도 시스템에 온도 구배(▽T; temperature gradient)가 존재하면 정전계()와 온도 구배(▽T)하의 입자 확산 구동력에 따라 전자 또는 대전 입자가 흐르게 된다. 국지 영역()에서 전체 전류 밀도 는 다음과 같이 표현된다.If there is a temperature gradient (▽ T) in the electrically conducting system, And charged particles flow in accordance with the particle diffusion driving force under the " Local area ( Total current density Is expressed as
수학식 1
σ는 전기전도도이고, 은 국지 지벡 계수(local Seebeck coefficient)이다.σ is the electrical conductivity, Is the local Seebeck coefficient.
이 확산 구동력으로서 열전압 발생의 기초가 된다. 온도 구배(▽T)는 소재의 고유 열전도도(thermal conductivity)와 탐침-소재간의 경계면 열전도율(interfacial conductance) 등 열전달 성질에 의해서 결정된다. This diffusion driving force serves as a basis for generating thermal voltage. The temperature gradient ▽ T is determined by heat transfer properties such as the intrinsic thermal conductivity of the material and the interfacial conductance between the probe and the material.
도 1의 측정 환경에서 열전압은 개방 회로 조건이며, 개방 회로 조건에서는 전체 전류 밀도가 0이기 때문에 수학식 1은 다음과 같은 수학식 2로 된다.In the measurement environment of FIG. 1, the thermal voltage is an open circuit condition, and in the open circuit condition, since the total current density is 0, Equation 1 is represented by Equation 2 as follows.
수학식 2
외부 전기장이 인가되지 않는 상태에서는, 은 단지 열-유도 대전 분포 으로부터 야기되는 전기장이다. 가우스 법칙을 이 전기장과 대전 밀도 사이에 적용하면 가 되며, 따라서 다음과 같은 수학식 3이 도출된다.In the absence of an external electric field, Is just a heat-induced charging distribution Electric field resulting from Applying Gaussian law between this electric field and the charge density Therefore, the following equation (3) is derived.
수학식 3
열유도 대전 밀도의 분포 는 국지 지벡 계수 와 공간 온도 프로파일 로부터 정확하게 추적될 수 있다.Distribution of heat induced charge density The local Seebeck coefficient And space temperature profiles Can be accurately tracked from
에 대한 포아송 방정식으로부터 유도되는 하트리 정전 포텐셜(Hartree electrostatic potential) 은 열전압과 등가이며, 위 수학식 3에 의해서 다음과 같은 수학식 4가 도출된다. Hartree electrostatic potential derived from the Poisson equation for Is equivalent to the thermal voltage, and the following Equation 4 is derived from Equation 3 above.
수학식 4
여기에서 은 적분변수이다. 온도 구배(▽T)는 무한대에서 0이기 때문에 수학식 4는 다음과 같은 수학식 5로 단순화될 수 있다.From here Is an integral variable. Since the temperature gradient ▽ T is 0 at infinity, Equation 4 may be simplified to Equation 5 as follows.
수학식 5
다음으로 원자 수준의 해상도를 위한 국부 지벡 계수 을 구하는 방법에 대해서 살펴 본다. 국부 지벡 계수는 이하의 방법 이외에 공지되어 있는 다른 방법으로 전기전도도, 전자투과함수, 국부상태밀도 등을 정의하여 도출하거나 구할 수 있으며, 이하의 내용에 국부 지벡 계수 정의가 제한되는 것으로 해석되어서는 아니된다. Next, a local Seebeck coefficient for atomic resolution Let's look at how to obtain. The local Seebeck coefficient may be derived or obtained by defining electric conductivity, electron transmission function, local state density, etc. by other methods other than the following methods. do.
도 1에 도시된 구조에서 국부 지벡 계수는 란다우어 공식(Landauer formula)로부터 탐침과 소재 사이의 에너지-위치 의존 전자 투과 함수(energy-and position-dependent electron transmission function) 로 다음과 같은 수학식 6으로 표현될 수 있다.The local Seebeck coefficient in the structure shown in FIG. 1 is the energy-and position-dependent electron transmission function between the probe and the material from the Landauer formula. It can be represented by the following equation (6).
수학식 6
여기에서 e는 전자 전하량이고, T는 절대온도, 는 페르미 에너지, f는 온도 T에서의 페르미-디랙 분포 함수(Fermi-Dirac distribution function)이다.Where e is the amount of electron charge, T is the absolute temperature, Is the Fermi energy, f is the Fermi-Dirac distribution function at temperature T.
금속으로 되어 있는 탐침과 전기전도성 소재 양쪽의 전자 파동 함수는 접촉을 통해서 중첩된다. 이 파동함수 중첩이 미미할 때 은 국부 상태 밀도 로 근사화될 수 있고 이를 수학식 7에 표시하면 다음과 같다.The electromagnetic wave functions of both the metal probe and the electrically conductive material overlap by contact. When this wave function overlap is insignificant Silver local state density It can be approximated by and represented in Equation 7 as follows.
수학식 7
은 소재의 브릴루앙 영역(Brillouin zone)의 k 번째 지점에서 i번째 고유상태(eigenstate)이고, 는 소재의 브릴루앙 영역(Brillouin zone)의 k 번째 지점에서 i번째 고유값(eigenvalue)이다. 여기에서 δ는 델타 함수(delta function)를 의미한다. Is the i th eigenstate at the k th point of the Brillouin zone of the material, Is the i th eigenvalue at the k th point of the Brillouin zone of the material. Here, δ means a delta function.
수학식 6은 다음과 같은 수학식 8로 고쳐쓸 수 있다.Equation 6 may be rewritten as Equation 8 as follows.
수학식 8
수학식 8로부터 지벡 계수가 페르미 준위 근처에서의 전기적 상태에 강력하게 관련되어 있음을 알 수 있다.It can be seen from Equation 8 that the Seebeck coefficient is strongly related to the electrical state near the Fermi level.
원자 수준의 해상도를 가지는 열전 이미지 시뮬레이션을 위해서 구형 탐침과 소재 표면 사이의 경계면에서 스텝 함수형 온도 변화가 필요하고, 구형 온도 프로파일(spherical temperature profile)을 다음의 수학식 9로 가정한다.For thermoelectric image simulation with atomic resolution, a step function temperature change is required at the interface between the spherical probe and the material surface, and the spherical temperature profile is assumed to be expressed as
수학식 9
는 탐침의 온도, 는 소재의 온도, 는 누적 분포 함수(cumulative distribution function; CDF), R는 탐침의 팁 반경, : 탐침의 팁 중앙, : 온도 변화의 급작성 정도를 표시하는 가우시안 확장(Gaussian broadening)을 가리킨다. 그리고 탐침의 팁과 소재의 접촉 거리(z0)는 소재면 상에서 일정하게 유지된다. Is the temperature of the probe, Is the temperature of the material, Is the cumulative distribution function (CDF), R is the tip radius of the probe, : Center of tip of probe, : Refers to Gaussian broadening, which indicates the degree of sudden change in temperature change. And the contact distance z 0 between the tip of the probe and the workpiece is kept constant on the workpiece surface.
본 발명에 의한 시뮬레이션 방법의 적용에 있어서 온도 프로파일은 위 수학식 9와 다른 프로파일이 사용될 수도 있으며, 수학식 9가 본 발명이 적용되기 위한 유일한 온도 프로파일은 아니다.In the application of the simulation method according to the present invention, a temperature profile different from Equation 9 may be used, and Equation 9 is not the only temperature profile to which the present invention is applied.
도 2의 (a)에는 본 발명에 의한 컴퓨터 원용 시뮬레이션 방법에 의해서 표시되는 지벡 계수가 도시되어 있고, 도 2의 (b)에는 시뮬레이션된 열전 전압 이미지가 표시되어 있다. 도 2의 (a)와 (b)에 표시된 이미지의 시뮬레이션은 n 도핑된 순수 그래핀에 대해서 수행되었다. 도 2의 (b)에 흰색으로 보이는 부분이 원자, 검정색으로 보이는 부분이 보이드(void)이다. 도 3에는 전술한 S. Cho의 논문에 개시되어 있는 방법으로 실험한 이미지로서 실리콘 카바이드(SiC) 상의 2층 그래핀(bilayer graphene)의 결함이 없는 영역(defect-free region)의 이미지가 표시되어 있다. 도 2의 (b)와 도3 사이에는 주목할만한 동일성이 발견된다.FIG. 2 (a) shows the Seebeck coefficient displayed by the computer-aided simulation method according to the present invention, and FIG. 2 (b) shows the simulated thermoelectric voltage image. Simulation of the images shown in (a) and (b) of FIG. 2 was performed on n-doped pure graphene. A part shown in white in FIG. 2B is an atom, and a part shown in black is a void. 3 shows an image of a defect-free region of bilayer graphene on silicon carbide (SiC) as an image tested by the method disclosed in the above-described S. Cho paper. have. Notable identity is found between FIGS. 2B and 3.
도 2에 도시된 시뮬레이션의 조건은, 각각 T = 315K, z0 = 3Å, △T = 3K, R = 0.75Å, δ = 0.3Å이다.The conditions of the simulation shown in FIG. 2 are T = 315K, z 0 = 3 ms, ΔT = 3K, R = 0.75 ms, δ = 0.3 ms, respectively.
이상 첨부 도면을 참조하여 본 발명에 대해서 설명하였지만 본 발명의 권리범위는 후술하는 특허청구범위에 의해서 결정되며 전술한 설명에 제한되는 것으로 해석되어서는 아니된다. 그리고 특허청구범위에 기재된 발명의, 당업자에게 자명한 개량, 변경 및/또는 수정도 본 발명의 권리범위에 포함된다는 점이 이해되어야 한다.Although the present invention has been described above with reference to the accompanying drawings, the scope of the present invention is determined by the claims below and should not be construed as limited to the foregoing description. And it should be understood that improvements, changes, and / or modifications apparent to those skilled in the art of the invention described in the claims are included in the scope of the present invention.
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030169798A1 (en) * | 2001-12-17 | 2003-09-11 | Cordes Steven Alan | Scanning heat flow probe |
| US20030186471A1 (en) * | 2002-03-28 | 2003-10-02 | International Business Machines Corporation | Method and apparatus for measuring dopant profile of a semiconductor |
| KR20090115426A (en) * | 2008-05-02 | 2009-11-05 | 고려대학교 산학협력단 | Thermal Physics Measurement Method Using Scanning Probe Microscope |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030169798A1 (en) * | 2001-12-17 | 2003-09-11 | Cordes Steven Alan | Scanning heat flow probe |
| US20030186471A1 (en) * | 2002-03-28 | 2003-10-02 | International Business Machines Corporation | Method and apparatus for measuring dopant profile of a semiconductor |
| KR20090115426A (en) * | 2008-05-02 | 2009-11-05 | 고려대학교 산학협력단 | Thermal Physics Measurement Method Using Scanning Probe Microscope |
Non-Patent Citations (2)
| Title |
|---|
| BIAN ET AL.: "Three-dimensional modeling of nanoscale Seebeck measurements by scanning thermoelectric microscopy", APPLIED PHYSICS LETTERS, vol. 87, 29 July 2005 (2005-07-29), pages 053115 - 053118 * |
| LI, SHI: "Scanning Thermal and Thermoelectric Microscopy", HANDBOOK OF MICROSCOPY FOR NANOTECHNOLOGY, 14 June 2005 (2005-06-14), pages 183 - 205 * |
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