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WO2014130047A1 - Assemblage de composant au moyen d'un matériau de fixation temporaire - Google Patents

Assemblage de composant au moyen d'un matériau de fixation temporaire Download PDF

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Publication number
WO2014130047A1
WO2014130047A1 PCT/US2013/027594 US2013027594W WO2014130047A1 WO 2014130047 A1 WO2014130047 A1 WO 2014130047A1 US 2013027594 W US2013027594 W US 2013027594W WO 2014130047 A1 WO2014130047 A1 WO 2014130047A1
Authority
WO
WIPO (PCT)
Prior art keywords
die
carrier
attach material
connector
temporary attach
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2013/027594
Other languages
English (en)
Inventor
Elizabeth Anne LOGAN
Ronald Almy HOLLIS
Gamage Sisira KANKANAM
Terry Lee Marvin Cookson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Co
Original Assignee
General Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by General Electric Co filed Critical General Electric Co
Priority to PCT/US2013/027594 priority Critical patent/WO2014130047A1/fr
Publication of WO2014130047A1 publication Critical patent/WO2014130047A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/0045—Packages or encapsulation for reducing stress inside of the package structure
    • B81B7/0048—Packages or encapsulation for reducing stress inside of the package structure between the MEMS die and the substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261—Processes for packaging MEMS devices
    • B81C1/00325—Processes for packaging MEMS devices for reducing stress inside of the package structure
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/147—Details about the mounting of the sensor to support or covering means
    • H10W74/01—
    • H10W74/019—
    • H10W74/114—
    • H10W76/47—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0264—Pressure sensors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/03—Bonding two components
    • B81C2203/032—Gluing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
    • H01L2224/92—Specific sequence of method steps
    • H01L2224/922—Connecting different surfaces of the semiconductor or solid-state body with connectors of different types
    • H01L2224/9222—Sequential connecting processes
    • H01L2224/92242—Sequential connecting processes the first connecting process involving a layer connector
    • H01L2224/92247—Sequential connecting processes the first connecting process involving a layer connector the second connecting process involving a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1203—Rectifying Diode
    • H01L2924/12033—Gunn diode
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/146—Mixed devices
    • H01L2924/1461—MEMS
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15151—Shape the die mounting substrate comprising an aperture, e.g. for underfilling, outgassing, window type wire connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape
    • H01L2924/1816—Exposing the passive side of the semiconductor or solid-state body
    • H01L2924/18165—Exposing the passive side of the semiconductor or solid-state body of a wire bonded chip
    • H10W72/01515—
    • H10W72/075—
    • H10W72/07504—

Definitions

  • the subject matter disclosed herein relates to a method of attaching a die to a carrier, and particularly to a method of attaching a die to a carrier using a temporary attach material.
  • Micro-electro-mechanical system (MEMS) devices are miniaturized mechanical elements, such as sensors, actuators, and electronics. MEMS are typically fabricated using integrated circuit (IC) processes. During fabrication of the MEMS device, a die of the MEMS device is attached to a carrier or support structure. In some applications, the die is attached to the carrier using an adhesive or epoxy.
  • IC integrated circuit
  • the stress can be created by different rates of thermal expansion between the die and the adhesive used to attach the die to the carrier. In addition to thermal expansion, stress may also be caused by differences in other material properties such as, for example, moisture adsorption or curing time.
  • the stress introduced to the die may cause issues, especially if a MEMS pressure sensor that depends on detecting small amount of strain is attached to a die. This is because the stress introduced to the die may cause the die to generate inaccurate pressure readings.
  • One approach to reduce stress introduced to a die involves using a relatively soft die attach material.
  • this approach is typically only effective for devices using a relatively large die and does not usually work when a smaller die, which has dimensions that are typically less than about 1 millimeter, is employed.
  • the soft die attach material tends to allow for too much movement of the smaller die relative to the carrier. Movement of the smaller die relative to the carrier may hinder successful wire bonding of the die to the carrier, as the smaller die tends to wobble about the soft die attach material. Therefore, it would be desirable to provide a manufacturing process that allows for a die to be attached to the carrier without introducing a significant amount of stress to the die.
  • a method of attaching a die to a carrier using a temporary attach material comprises attaching the temporary attach material between a surface of the die and a surface of the carrier.
  • the temporary attach material attaches the die to the carrier.
  • the method comprises bonding at least one connector to the die and the carrier.
  • the connector includes a first end bonded to the carrier and a second end bonded to the die.
  • the method further comprises encapsulating at least a portion of the die and at least a portion of the at least one connector by an encapsulation material.
  • the method further comprises removal of the temporary attach material such that the die is substantially detached from the carrier between the surface of the die and the surface of the carrier.
  • FIGS. 1-4 illustrate a method of attaching a die to a carrier
  • FIG 5 is a process flow diagram of the method illustrated in FIGS. 1-4;
  • FIGS. 6-9 illustrate an alternative embodiment of a method of attaching a die to a carrier
  • FIG. 10 is a process flow diagram of the method illustrated in FIGS. 6-
  • FIGS. 11-16 illustrate yet another embodiment of a method of attaching a die to a carrier.
  • FIG. 17 is a process flow diagram of the method illustrated in FIGS.
  • FIGS. 1-4 illustrate an exemplary approach for attaching a die 12 to a carrier 14.
  • the die 12 and carrier 14 may be employed in any number of applications such as, for example, a micro-electro-mechanical system (MEMS) device or an integrated circuit (IC).
  • MEMS micro-electro-mechanical system
  • IC integrated circuit
  • the die 12 and carrier 14 are part of a MEMS pressure sensor used in medical applications such as, for example, a pressure monitor in a catheter.
  • the die 12 is attached to the carrier 14 by a temporary attach material 20.
  • the temporary attach material 20 is placed between a bottom surface 22 of the die 12 and a top surface 24 of the carrier 14 to attach the die 12 to the carrier 14.
  • the temporary attach material 20 is in fluid communication with a vent hole 30 located in the carrier 14.
  • the temporary attach material 20 is generally any type of material that bonds the die 12 and the carrier 14 together and can be removed from the die 12 or carrier 14 by an appropriate approach as defined by the manufacturer of the temporary attach material 20. That is, the temporary attach material 20 is substantially removed when an appropriate cleaning or removal approach for the specific type of temporary attach material 20 is applied to the temporary attach material 20. The removal of the temporary attach material 20 causes the temporary attach material 20 to be released or removed, thereby causing the die 12 to substantially separate or detach from the top surface 24 of the carrier 14. Specifically, referring to FIG. 4, the position of the die 12 after removing the temporary attach material 20 is substantially determined by the thickness of the temporary attach material 20, and is discussed in greater detail below. [0017] Turning back to FIG.
  • the temporary attach material 20 include, for example, bonding wax, solutions of bonding wax in solvent and adhesives that are typically used in temporary applications. Specifically, in one embodiment bonding wax and adhesives currently used as temporary adhesives for applications such as, for example, wafer mounting could also be used as the temporary attach material 20.
  • commercially available examples of the temporary attach material 20 are: adhesive having the trade name MB600 available from the Master Bond Corporation located in Hackensack, NJ, and Crystalbond 590 available from Ted Pella Incorporated located in Redding, CA,
  • FIG. 2 is an illustration of a connector 36.
  • an electrical conductor such as, for example, a wire 36 is the connector, and is bonded to both of the die 12 and the carrier 14 during a wire bonding operation.
  • the wire 36 includes a first end 38 that is bonded to the carrier 14 and a second end 40 that is bonded to the die 12.
  • FIGS. 2-4 illustrate only one wire 36 connecting the die 12 to the carrier 14, it is understood that multiple wires may be used as well to connect the die 12 to the carrier 14.
  • the wire 36 is attached to a wire bond pad (not shown) located on the die 12 and a finger (not shown) located on the carrier 14.
  • the wire 36 is bonded to the die 12 and the carrier 14 by heating the die 12 and the carrier 14 to an elevated temperature, and then pressing the wire 36 to both the die 12 and the carrier 14.
  • the temporary attach material 20 that is selected can generally withstand the elevated temperatures the die 12 and carrier 14 experience during the wire bonding process. In one example, the wire bonding process requires that the die 12 and the carrier 14 being heated between the ranges of about 100°C to about 150°C.
  • FIG. 3 is an illustration of the die 12, the carrier 14, and the wire 36 being encapsulated by an encapsulation material 44 that is bonded to at least the carrier 14 and the die 12.
  • the encapsulation material 44 is an epoxy based resin or a silicone based elastomer. Encapsulation aids in protecting the die 12 and the carrier 14, as well as the wire bonds between the die 12 and the carrier
  • FIG. 4 is an illustration of the die 12 and the carrier 14, where the temporary attach material 20 has been substantially removed by a removal media. Specifically, temporary attach material 20 has been removed such that the die 12 is substantially detached from the carrier 14 at the bottom surface 22 of the die 12 and the top surface 24 of the carrier 14.
  • the removal media is introduced to the temporary attach material 20 (shown in FIGS. 1-3) through the vent hole 30.
  • the vent hole 30 receives the removal media from a source (not shown).
  • the die 12 remains held in position by the wire 36 and the encapsulant 44 at a position substantially determined by the thickness of the temporary attach material 20 shown in FIGS. 1-3. Specifically, as shown in FIG. 4 the die 12 is suspended over a portion of the carrier 14 by the encapsulant 44.
  • the removal approach is selected based on the type of temporary attach material 20. That is, the removal approach is specifically configured, as recommended by the manufacturer of the temporary attach material 20, for substantially removing the temporary attach material 20.
  • the temporary attach material 20 may be removed by heating to melt away the temporary attach material 20, and then removing any residue in alcohol.
  • the removal approach substantially removes the temporary attach material 20, where the die 12 is no longer attached to the carrier 14 along the bottom surface 22 of the die 12. Instead, referring specifically to FIG. 4, the die 12 is secured in place by the wire 36 and the encapsulation material 44. Removing the temporary attach material 20 reduces or eliminates the possibility of introducing stress created by different material properties between the die 12 and the die attach material during fabrication.
  • FIG. 5 is a process flow diagram illustrating a method 100 of attaching the die 12 to the carrier 14.
  • the method 100 begins at 102, where the temporary attach material 20 is placed between a bottom surface 22 of the die 12 and a top surface 24 of the carrier 14, where the temporary attach material 20 attaches the die 12 to the carrier 14.
  • the temporary attach material 20 is generally any type of material that bonds the die 12 and the carrier 14 together and can be substantially removed by an appropriate removal approach.
  • Method 100 may then proceed to 104.
  • At least one wire 36 is bonded to the die 12 and the carrier 14.
  • the wire 36 includes a first end 38 bonded to the carrier 14 and a second end 40 bonded to the die 12. Method 100 may then proceed to 106.
  • the die 12 and the wires 14 are encapsulated by an encapsulation material 44.
  • the encapsulation material 44 is an epoxy based resin or a silicone based elastomer. Method 100 may then proceed to 108.
  • a removal approach is employed to substantially remove the temporary attach material 20.
  • the removal media is introduced by a vent hole 30 located within the carrier 14.
  • the removal media is formulated to substantially remove the temporary attach material 20 such that the die 12 is substantially detached from the carrier 14 between the bottom surface 22 of the die 12 and the top surface 24 of the carrier 14. Method 100 may then terminate.
  • FIGS. 6-9 illustrate an alternative method of attaching a die 212 to a carrier 214.
  • the die 212 is attached to the carrier 214 by a temporary attach material 220.
  • the temporary attach material 220 is placed between a bottom surface 222 of the die 212 and a top surface 224 of the carrier 214 to attach the die 212 to the carrier 214.
  • FIG. 7 is an illustration of a first wire 236 being bonded to both of the die 212 and the carrier 214 during a first wire bonding operation.
  • the wire 236 includes a first end 238 that is bonded to the carrier 214 and a second end 240 that is bonded to the die 212.
  • FIG. 8 is an illustration of another or second wire 260 being bonded to both of the die 212 and the carrier 214 during a second wire bonding operation.
  • the wire 260 includes a first end 262 that is bonded to the carrier 214 and a second end 264 that is bonded to the die 212.
  • the second wire 260 is positioned to generally oppose the first wire 236, and is employed to substantially prevent the die 212 from inadvertently flipping over or shifting in relation to the carrier 214 during handling of the carrier 214 after the temporary attach material 220 has been substantially removed.
  • the die 212 is typically sized such that the second wire 260 provides the support needed to secure the die 212 in place relative to the carrier 214.
  • the die 212 generally includes dimensions that are less than about 1 millimeter.
  • FIG. 9 is an illustration of the die 212 and the carrier 214, where the temporary attach material 220 has been substantially removed.
  • the removal media is introduced to the temporary attach material 220 by substantially placing the assembly in the removal media, however it is understood that other approaches may be used as well for removing the temporary attach material 220.
  • the removal media causes the temporary attach material 220 to be removed from the assembly, causing the die 212 to substantially separate or detach from the top surface 224 of the carrier 214.
  • FIG. 10 is a process flow diagram illustrating a method 300 of attaching the die 212 to the carrier 214.
  • the method 300 begins at 302, where the temporary attach material 220 is placed between a bottom surface 222 of the die 212 and a top surface 224 of the carrier 214, where the temporary attach material 220 attaches the die 212 to the carrier 214.
  • Method 300 may then proceed to 304.
  • a first wire 236 is bonded to the die 212 and the carrier 214.
  • the wire 236 includes a first end 238 bonded to the carrier 214 and a second end 240 bonded to the die 212.
  • Method 300 may then proceed to 306.
  • a second wire 260 is bonded to both of the die 212 and the carrier 214 during a second wire bonding operation.
  • the wire 260 includes a first end 262 that is bonded to the carrier 214 and a second end 264 that is bonded to the die 212.
  • the second wire 260 is positioned to generally oppose the first wire 136, and is employed to substantially prevent the die 212 from inadvertently flipping over or shifting in relation to the carrier 214.
  • Method 300 may then proceed to 308.
  • the temporary attach material 220 is substantially removed by a specified approach.
  • the temporary attach material 220 is substantially removed by placing the temporary attach material 220 in a removal media. The removal media substantially removes the temporary attach material 220. Method 300 may then terminate.
  • FIGS. 11-16 an alternative approach of attaching a die 412 to a carrier 414 is disclosed, where a glob top 470 (shown in FIGS. 14-16) is placed over the die 412.
  • the glob top 470 is employed for providing protection to a wire 436, and also secures the die 412 in place during handling.
  • the glob top 470 is a material that is soft enough not to generate any significant amount of stress that could be exerted on the die 412, and may be the same type of material as the encapsulant 44 illustrated in FIGS. 3-4.
  • the glob top 470 is an epoxy based resin or a silicone based elastomer.
  • the die 412 is attached to the carrier 414 by a temporary attach material 420.
  • the temporary attach material 420 is placed between a bottom surface 422 of the die 412 and a top surface 424 of the carrier 414 to attach the die 412 to the carrier 414.
  • FIG. 12 is an illustration of a wire 436 being bonded to both of the die 412 and the carrier 414 during a wire bonding operation.
  • the wire 436 includes a first end 438 that is bonded to the carrier 414 and a second end 440 that is bonded to the die 412.
  • FIG. 12 illustrates a single wire 436, multiple wires may be used as well.
  • a second wire such as the second wire 260 may be bonded to both of the die 212 and the carrier 214 during a second wire bonding operation.
  • a second wire is employed to substantially prevent the die from inadvertently flipping over or shifting in relation to the carrier 214 during handling.
  • FIGS. 13-14 two approaches are available for substantially removing the temporary attach material 420. Specifically, a first approach is shown in FIGS. 13-14 and an alternative approach is shown in FIGS. 15-16. Referring now to FIG. 13, the temporary attach material 420 has been substantially removed. In one embodiment, the temporary attach material 420 is substantially placing the temporary attach material 420 in a removal media specified for the temporary attach material 420. When the temporary attach material 420 is removed, the die 412 is substantially detached from the carrier 414 at the bottom surface 422 of the die 412.
  • FIG. 14 is an illustration of the glob top 470 being applied to a top surface 472 of the die, the wire 436, and the carrier 414. Specifically, the glob top 470 protects the bonds between the first end 438 of the wire 436 and the carrier 414 and the second end 440 of the wire 436 and the die 412. In one embodiment, if the die 412 is employed in a device such as a MEMS pressure sensor, the glob top 470 is confined to an end 478 of the die 412 that does not include a sensing element (not shown). In the embodiment as shown in FIG.
  • glob top 470 penetrates a gap 480 located between the bottom surface 422 of the die 412 and the top surface 424 of the carrier 414.
  • the glob top 470 is employed to secure the die 412 in place securely in relation to the carrier 414 during handling of the carrier 414.
  • the glob top 470 is first applied to the top surface 472 of the die, the wire 436, and the carrier 414. Referring to FIG. 15, the glob top 470 protects the bonds between the first end 438 of the wire 436 and the carrier 414 and the second end 440 of the wire 436 and the die 412. Referring now to FIG. 16, a removal approach is employed for substantially removing the temporary attach material 420. When the temporary attach material 420 is removed, the die 412 is substantially detached from the carrier 414 at the bottom surface 422 of the die 412 and the top surface 424 of the carrier 414. In the embodiment as shown in FIG. 16, the glob top 470 does not generally penetrate the gap 480 located between the bottom surface 422 of the die 412 and the top surface 424 of the carrier 414.
  • FIG. 17 is a process flow diagram illustrating a method 500 of attaching the die 412 to the carrier 414.
  • the method 500 begins at 502, where the temporary attach material 420 is placed between a bottom surface 422 of the die 412 and a top surface 424 of the carrier 414, where the temporary attach material 420 attaches the die 412 to the carrier 214.
  • Method 500 may then proceed to 504.
  • a first wire 436 is bonded to the die 412 and the carrier 414.
  • the wire 436 includes a first end 438 bonded to the carrier 414 and a second end 440 bonded to the die 412.
  • method 500 may then proceed to 506, where the temporary attach material 420 is removed.
  • method 500 may then proceed to 510, where a glob top 470 is applied to the die 412.
  • a removal media is introduced to the temporary attach material 420.
  • the specific type of removal media employed depends on the type of temporary attach material 420.
  • the removal media substantially removes the temporary attach material 420.
  • Method 500 may then proceed to 508.
  • the glob top 470 is applied to a top surface 472 of the die, the wire 436, and the carrier 414. In the embodiment as shown in FIG. 14, a portion of the glob top 470 penetrates a gap 480 located between the bottom surface 422 of the die 412 and the top surface 424 of the carrier 414. Method 500 may then terminate.
  • 504 then proceeds to 510, where the glob top 470 is applied to a top surface 472 of the die, the wire 436, and the carrier 414.
  • Method 500 may then proceed to 512.
  • a removal media is introduced to the temporary attach material 420.
  • the removal media substantially removes the temporary attach material 420.
  • the glob top 470 does not generally penetrate the gap 480 located between the bottom surface 422 of the die 412 and the top surface 424 of the carrier 414. This is because the temporary attach material 420 was present when the glob top 470 was applied, thus preventing the ingression of the glob top 470 into the gap 480.
  • Method 500 may then terminate.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

L'invention concerne un procédé de fixation d'une matrice à un support au moyen d'un matériau de fixation temporaire. Le procédé consiste à fixer le matériau de fixation temporaire entre une surface de la matrice et une surface du support. Le matériau de fixation temporaire fixe la matrice au support. Le procédé consiste à lier au moins un raccord à la matrice et au support. Le raccord comprend une première extrémité liée au support et une seconde extrémité liée à la matrice. Le procédé consiste en outre à encapsuler au moins une partie de la matrice et au moins une partie du ou des raccords au moyen d'un matériau d'encapsulation.
PCT/US2013/027594 2013-02-25 2013-02-25 Assemblage de composant au moyen d'un matériau de fixation temporaire Ceased WO2014130047A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/US2013/027594 WO2014130047A1 (fr) 2013-02-25 2013-02-25 Assemblage de composant au moyen d'un matériau de fixation temporaire

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US2013/027594 WO2014130047A1 (fr) 2013-02-25 2013-02-25 Assemblage de composant au moyen d'un matériau de fixation temporaire

Publications (1)

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WO2014130047A1 true WO2014130047A1 (fr) 2014-08-28

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100252923A1 (en) * 2009-04-07 2010-10-07 Elpida Memory, Inc. Semiconductor device and method of manufacturing same
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