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WO2014115825A1 - Dispositif électronique organique - Google Patents

Dispositif électronique organique Download PDF

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Publication number
WO2014115825A1
WO2014115825A1 PCT/JP2014/051431 JP2014051431W WO2014115825A1 WO 2014115825 A1 WO2014115825 A1 WO 2014115825A1 JP 2014051431 W JP2014051431 W JP 2014051431W WO 2014115825 A1 WO2014115825 A1 WO 2014115825A1
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WIPO (PCT)
Prior art keywords
substrate
organic electronic
barrier film
electronic device
layer
Prior art date
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PCT/JP2014/051431
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English (en)
Japanese (ja)
Inventor
誠吾 中村
信也 鈴木
村上　朝雄
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Fujifilm Corp
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Fujifilm Corp
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Priority claimed from JP2013012085A external-priority patent/JP2014143142A/ja
Priority claimed from JP2013053194A external-priority patent/JP2014179266A/ja
Application filed by Fujifilm Corp filed Critical Fujifilm Corp
Publication of WO2014115825A1 publication Critical patent/WO2014115825A1/fr
Anticipated expiration legal-status Critical
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/841—Self-supporting sealing arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants

Definitions

  • the present invention relates to an organic electronic device.
  • the present invention particularly relates to an organic electronic device having a structure in which an organic electronic element on a substrate is sealed with a barrier film.
  • organic electronic devices have been proposed in which organic electronic elements vulnerable to water and oxygen are sealed using a barrier film. Sealing of the organic electronic element formed on the substrate is usually performed by bonding a barrier film with an adhesive, but the influence of moisture intrusion from the end through the adhesive is also great. Therefore, it is necessary to ensure the durability by sufficiently securing the distance between the organic electronic element and the edge of the barrier film to increase the moisture diffusion distance.
  • the outer part of the organic electronic element on the substrate of the organic electronic device is a dead space and is preferably small.
  • Patent Document 1 discloses that the end of the barrier film provided on the organic electronic element is configured to cover the end of the glass substrate, thereby reducing the influence of moisture intrusion from the end.
  • Technology is disclosed.
  • Patent Document 2 describes a method for manufacturing a light-emitting device in which a light-emitting element is sealed with a bag-like film that includes an organic layer and an inorganic layer.
  • Patent Document 3 describes a gas barrier film excellent in flexibility.
  • An object of the present invention is to provide an organic electronic device having a structure in which organic electronic elements on a substrate are sealed.
  • an object of the present invention is to provide an organic electronic device in which an organic electronic element on a substrate is sealed with a barrier film, and the sealing of the end portion is reinforced.
  • Patent Document 1 since the end portion of the barrier film is bonded from the front surface to the back surface of the substrate, the adhesive is maintained while keeping the distance between the organic electronic element and the edge of the barrier film short. It is possible to increase the diffusion distance of moisture that has entered from the end.
  • a metal foil is specifically described as a barrier film, and an end portion of the metal foil is curved to take the above structure.
  • the present inventors have studied the case of using a transparent barrier film having an organic layer and an inorganic layer in place of the above metal foil, and completed the present invention.
  • the present invention provides the following ⁇ 1> to ⁇ 27>.
  • the upper barrier film includes a substrate, at least one organic layer, and at least one inorganic layer, An organic electronic device in which at least one part of an end part of the upper barrier film or at least part of an end part of the substrate is bent and the other is sandwiched.
  • ⁇ 2> The organic electronic device according to ⁇ 1>, wherein at least a part of the end portion of the upper barrier film is bent and sandwiches at least a part of the end portion of the substrate.
  • the substrate is a barrier film including a base material, at least one organic layer, and at least one inorganic layer.
  • ⁇ 4> The organic electronic device according to ⁇ 3>, wherein at least a part of the end part of the substrate is bent and sandwiches at least a part of the end part of the upper barrier film.
  • ⁇ 5> The organic electronic device according to ⁇ 3> or ⁇ 4>, wherein the outermost surface layer on the upper barrier film side of the substrate is an inorganic layer.
  • ⁇ 6> Any one of ⁇ 3> to ⁇ 5>, wherein at least one organic layer and at least one inorganic layer of the substrate are provided on the upper barrier film side with respect to the base material of the substrate.
  • the substrate is a glass substrate
  • ⁇ 8> The substrate according to ⁇ 1> or ⁇ 2>, wherein the substrate is a glass substrate and an end portion of the glass substrate sandwiched between at least a part of the end portions of the upper barrier film is chamfered.
  • Organic electronic devices ⁇ 9> The organic electronic device according to ⁇ 8>, wherein an end of the glass substrate sandwiched by at least a part of an end of the upper barrier film has an arc shape.
  • a radius of curvature of the arc is 0.2 mm or less.
  • ⁇ 11> The organic electronic device according to ⁇ 8>, wherein an end portion of the glass substrate sandwiched by at least a part of an end portion of the upper barrier film has a polygonal shape.
  • ⁇ 12> The organic electronic device according to ⁇ 11>, wherein a minimum angle of the polygon is 135 degrees or more.
  • a facing layer is provided on at least a part of an end of the upper barrier film or at least a part of the end of the substrate.
  • the film thickness of the counter layer is 0.5 to 1.5 times the film thickness of either the upper barrier film or the substrate on which the counter layer is provided. Organic electronic devices.
  • the upper barrier film has a shape of a rectangle 1
  • the substrate has a shape of a rectangle 2, and the end or rectangle of the upper barrier film on two sides parallel to the Y direction of the rectangle 1
  • ⁇ 17> The organic electronic device according to ⁇ 16>, wherein the ends of the two sides parallel to the X direction of the rectangle 1 and the two sides parallel to the X direction of the rectangle 2 are not bent.
  • the organic electronic device is a rectangle having two sides parallel to the Y direction and two sides parallel to the X direction, and the distance from the edges of the two sides parallel to the Y direction to the organic electronic element is the X direction.
  • ⁇ 19> The organic electronic device according to any one of ⁇ 1> to ⁇ 18>, wherein the base material has a thickness of 50 ⁇ m or less.
  • ⁇ 20> The organic electronic device according to any one of ⁇ 1> to ⁇ 18>, wherein the base material has a thickness of 25 ⁇ m or less.
  • the inorganic layer is made of a silicon compound or an aluminum compound.
  • the inorganic layer includes one or more selected from the group consisting of silicon nitride, hydrogenated silicon nitride, and hydrogenated silicon oxynitride.
  • the inorganic layer contains hydrogen of 25% atom or more and 30% atom or less.
  • ⁇ 24> The organic electronic device according to any one of ⁇ 1> to ⁇ 23>, wherein an outermost surface layer on the substrate side of the upper barrier film is an inorganic layer.
  • the at least one organic layer and the at least one inorganic layer are provided on the substrate side with respect to the base material.
  • ⁇ 26> The organic electronic device according to any one of ⁇ 1> to ⁇ 25>, wherein the organic electronic element is an organic EL element.
  • ⁇ 27> The method for producing an organic electronic device according to any one of ⁇ 13> to ⁇ 15>, wherein the opposing layer is provided on one of the upper barrier film and the substrate, and the upper barrier
  • the manufacturing method including curving the site
  • the present invention it is possible to provide an organic electronic device in which an organic electronic element is sealed with a transparent and electrically insulating film.
  • the present invention provides an organic electronic device having a structure in which an organic electronic element on a substrate is sealed with a barrier film.
  • the present invention provides an organic electronic device having a structure in which an organic electronic element on a substrate is sealed with a barrier film and the influence of moisture intrusion from an end portion is reduced.
  • the organic EL element in the present invention refers to an organic electroluminescence element.
  • (meth) acrylate is used in the meaning including both acrylate and methacrylate.
  • the present invention relates to an organic electronic device including a substrate, an organic electronic element, and a barrier film.
  • a barrier film having a function of blocking oxygen, moisture, nitrogen oxides, sulfur oxides, ozone, etc. in the atmosphere the organic electronic element is sealed (sealed) with the barrier film and the substrate.
  • Organic electronic elements that can deteriorate over time even when used under normal temperature and pressure due to oxygen or the like can be protected from deterioration.
  • the organic electronic device of this invention has the structure adhere
  • Such an organic electronic device generally has a structure including a portion including a substrate, an organic electronic element, and a barrier film in this order in the thickness direction of the substrate.
  • the barrier film that is not a substrate may be referred to as an upper barrier film.
  • the organic electronic device having the above-described structure generally includes, for example, (1) an organic electronic element is formed at the center of one surface of a substrate (in the present specification, the above-mentioned 1 of the substrate on which the organic electronic element is formed). (2) An adhesive is applied to the periphery of the organic electronic element on the surface of the substrate obtained in (1); (3) A barrier film is formed on the substrate with the adhesive. It can produce by combining with.
  • an organic electronic device is formed in a rectangular shape in the center of the surface of the rectangular substrate, and then an adhesive is applied so as to completely surround the organic electronic device on the outside of the organic electronic device on the surface.
  • a barrier film can be adhered to the substrate with the adhesive from the surface side with respect to the substrate.
  • rectangular means to include a square.
  • At least one part of the end part of the barrier film or at least part of the end part of the substrate is bent to sandwich the other.
  • the substrate is a glass substrate
  • at least a part of the end portion of the upper barrier film is bonded to the glass substrate on a surface opposite to the front surface (sometimes referred to as “back surface” in this specification). That is, a barrier film is arrange
  • a barrier film becomes a structure which covers at least one part of the edge part of a glass substrate, and the penetration
  • the upper barrier film bonded to the glass substrate on the back surface may be further bonded to the glass substrate at the edge.
  • the upper barrier film is bonded to a part of the glass substrate edge and further to the surface of the glass substrate edge. That's fine.
  • the back surface of the glass substrate to which at least a part of the end portion of the upper barrier film is bonded may be at least the back surface of the end portion of the glass substrate.
  • an opposing layer is provided at the bent portion.
  • the inventors of the present invention believe that when the barrier film is curved, cracks or the like may occur in the inorganic layer in the barrier film, and when the barrier film is curved and adhered to the substrate, the thickness direction is centered. Focusing on the fact that cracks are more likely to occur as the inorganic layer is separated or the radius of curvature is smaller, the inventors have come up with a configuration in which a counter layer is provided.
  • the opposing layer is preferably provided integrally with the upper barrier film or the substrate at the bent portion.
  • An example of the end structure of the organic electronic device of the first aspect is shown in FIG. 1 (a) to 1 (d) are examples in which the opposing layer is inside the bent portion of the upper barrier film or substrate, and FIG. 1 (e) is an example in which the opposing layer is outside the bent portion.
  • the upper barrier film in which the opposing layer is integrally formed has a side surface (edge) formed from the substrate surface to the substrate thickness at the portion where the opposing layer is provided at the end.
  • the barrier film covers at least a part of the edge of the substrate, or the substrate covers at least a part of the barrier film, and the outside air enters from the covered edge. Can be suppressed.
  • at least part of the end of the barrier film or at least part of the end of the substrate, which is disposed up to the opposite surface, is bonded to the other. It is preferable. 1 (a) to 1 (e) show a structure in which the opposing layer also sandwiches an unbent barrier film or substrate, but the opposing layer is bent as long as it is at the bent portion. No barrier film or substrate may be sandwiched.
  • the opposing layer may be bonded as shown in FIGS. 1 (a), (b), and (d), as shown in FIG. 1 (c) or (e).
  • the opposing layer may not be adhered.
  • the substrate and the upper barrier film may be bonded only through the opposing layer.
  • all the layers existing in the normal direction of the substrate may be bonded to the adjacent layers in the sandwich structure portion. As shown in (c) or (e), it may include a portion not bonded to the adjacent layer.
  • FIGS. 1 (a), (b), and (d) it may include a portion that is adhered to the edge of the substrate or the upper barrier film.
  • “at least a part of the end of the barrier film or the substrate” may be any part, for example, a barrier film or a substrate that is rectangular. It may be a portion corresponding to two opposing sides in the case, or may be all of the end portions of the barrier film or the substrate. In the substrate or barrier film in which the sandwiched substrate or barrier film is also a rectangle when at least a part of the end of the barrier film or substrate is a rectangle corresponding to two opposite sides of the barrier film or substrate, respectively. Any part corresponding to two opposing sides may be used.
  • the term “end” for a planar object such as a substrate and a barrier film means an outer peripheral portion within a specific distance range from a side surface (edge) consisting of thickness.
  • the distance is not particularly limited as long as it does not exceed the distance from the edge to the center of the plane, but may be, for example, 0.1 mm or more, 1 mm or more, 5 mm or more, 1 cm or more, 5 cm or more according to the size of the plane. 30 cm or less, 20 cm or less, 10 cm or less, 5 cm or less, and 1 cm or less.
  • the specific distance may or may not be constant with respect to the outer periphery of one object.
  • the barrier film included in the organic electronic device of the present invention may be a barrier film having a barrier laminate including at least one organic layer and at least one inorganic layer on a substrate.
  • the barrier laminate may be provided only on one side of the base film, or may be provided on both sides.
  • the barrier laminate of the present invention may be laminated in the order of the inorganic layer and the organic layer from the base film side, or may be laminated in the order of the organic layer and the inorganic layer.
  • the uppermost layer (the layer farthest from the substrate) to be laminated may be an inorganic layer or an organic layer, but is preferably an inorganic layer.
  • the barrier film may have a component other than the barrier laminate and the base material (for example, a functional layer such as an easy-adhesion layer).
  • the functional layer may be placed on the barrier laminate, between the barrier laminate and the base film, or on the side where the barrier laminate on the base film is not placed (back side).
  • the barrier film is preferably transparent.
  • An organic electronic device having a structure in which light passes from the organic electronic element to the organic electronic element through the barrier film for example, a device having a structure in which light emission is extracted from the surface on which the barrier film is installed, or the barrier film side
  • It is particularly necessary for the solar cell having a light-receiving surface it is particularly necessary for the solar cell having a light-receiving surface to be transparent.
  • the barrier film is preferably electrically insulating.
  • the barrier film used in the present invention is preferably not a barrier film containing a conductive metal foil.
  • the barrier laminate includes at least one organic layer and at least one inorganic layer, in which two or more organic layers and two or more inorganic layers are alternately laminated. Also good. Further, the barrier laminate includes a so-called gradient material layer in which the organic region and the inorganic region continuously change in the film thickness direction in the composition constituting the barrier laminate in a range not departing from the gist of the present invention. Also good.
  • the gradient material a paper by Kim et al. “Journal of Vacuum Science and Technology A Vol. 23 p971-977 (2005 American Vacuum Society) Journal of Vacuum Science and Technology A Vol.
  • the number of layers constituting the barrier laminate is not particularly limited, but typically 2 to 30 layers are preferable, and 3 to 20 layers are more preferable. Moreover, you may include other structural layers other than an organic layer and an inorganic layer.
  • the organic layer is preferably an organic layer containing an organic polymer as a main component.
  • the main component means that the first component of the component constituting the organic layer is an organic polymer, and usually 80% by weight or more of the component constituting the organic layer is an organic polymer.
  • the organic polymer include polyester, acrylic resin, methacrylic resin, methacrylic acid-maleic acid copolymer, polystyrene, transparent fluororesin, polyimide, fluorinated polyimide, polyamide, polyamideimide, polyetherimide, cellulose acylate, and polyurethane.
  • the organic layer may be made of a single material or a mixture, or may be a laminated structure of sublayers. In this case, each sublayer may have the same composition or a different composition. Further, as described above, a layer in which the interface with the inorganic layer is not clear and the composition changes continuously in the film thickness direction as disclosed in US Patent Publication No. 2004-46497 may be used.
  • the organic layer in the present invention is preferably formed by curing a polymerizable composition containing a polymerizable compound.
  • the polymerizable compound is preferably a radical polymerizable compound and / or a cationic polymerizable compound having an ether group as a functional group, more preferably a compound having an ethylenically unsaturated bond at the terminal or side chain, and / or A compound having an epoxy or oxetane at the terminal or side chain. Of these, compounds having an ethylenically unsaturated bond at the terminal or side chain are preferred.
  • Examples of compounds having an ethylenically unsaturated bond at the terminal or side chain include (meth) acrylate compounds, acrylamide compounds, styrene compounds, maleic anhydride, etc., (meth) acrylate compounds and / or Styrenic compounds are preferred, and (meth) acrylate compounds are more preferred.
  • (meth) acrylate compound As the (meth) acrylate compound, (meth) acrylate, urethane (meth) acrylate, polyester (meth) acrylate, epoxy (meth) acrylate and the like are preferable.
  • styrene compound styrene, ⁇ -methylstyrene, 4-methylstyrene, divinylbenzene, 4-hydroxystyrene, 4-carboxystyrene and the like are preferable.
  • R 11 represents a substituent, which may be the same or different.
  • n represents an integer of 0 to 5, and may be the same or different. However, at least one of R 11 contains a polymerizable group.
  • R 11 As the substituent of R 11 , —CR 12 2 — (R 12 is a hydrogen atom or a substituent), —CO—, —O—, a phenylene group, —S—, —C ⁇ C—, —NR 13 — ( R 13 is a hydrogen atom or a substituent group), —CR 14 ⁇ CR 15 — (R 14 and R 15 are each a hydrogen atom or a substituent group) and a combination of a polymerizable group.
  • a group consisting of a combination of one or more of —CR 12 2 — (wherein R 12 is a hydrogen atom or a substituent), —CO—, —O— and a phenylene group and a polymerizable group is preferable.
  • R 12 is a hydrogen atom or a substituent, but is preferably a hydrogen atom or a hydroxy group. It is preferable that at least one of R 11 includes a hydroxy group. By containing a hydroxy group, the curing rate of the organic layer is improved.
  • the molecular weight of at least one R 11 is preferably 10 to 250, and more preferably 70 to 150.
  • the position where R 11 is bonded is preferably bonded at least to the para position.
  • n represents an integer of 0 to 5, preferably an integer of 0 to 2, more preferably 0 or 1, and still more preferably 1.
  • the polymerizable group of the general formula (2) is preferably a (meth) acryloyl group or an epoxy group, and more preferably a (meth) acryloyl group.
  • the number of polymerizable groups that the general formula (2) has is preferably 2 or more, and more preferably 3 or more.
  • the upper limit is not particularly defined, but is preferably 8 or less, and more preferably 6 or less.
  • the molecular weight of the compound represented by the general formula (2) is preferably 600 to 1400, more preferably 800 to 1200.
  • the compound represented by the general formula (2) can be obtained as a commercial product.
  • the said compound is also compoundable by a well-known method.
  • epoxy acrylate can be obtained by reaction of an epoxy compound and acrylic acid. These compounds usually generate bifunctional, trifunctional, pentafunctional and isomers thereof during the reaction. When it is desired to separate these isomers, they can be separated by column chromatography, but in the present invention, they can also be used as a mixture.
  • the polymerizable compound is preferably contained in an amount of 90% by mass or more, more preferably 99% by mass or more, based on the solid content of the polymerizable composition. Two or more kinds of polymerizable compounds may be contained in the composition for forming the organic layer.
  • the polymerizable composition may contain a silane coupling agent.
  • the silane coupling agent preferably contains a polymerizable group, and particularly preferably contains a (meth) acrylate group.
  • Preferable silane coupling agents include silane coupling agents represented by the following general formula (1).
  • each R1 independently represents a hydrogen atom or a methyl group
  • R2 represents a halogen element or an alkyl group
  • R3 represents a hydrogen atom or an alkyl group
  • L represents a divalent linking group
  • n represents 0. To an integer from 2 to 2.
  • halogen element examples include a chlorine atom, a bromine atom, a fluorine atom, and an iodine atom.
  • the number of carbon atoms in the alkyl group or in the substituent containing the alkyl group among the substituents described later is preferably 1 to 12, more preferably 1 to 9, and further preferably 1 to 6.
  • Specific examples of the alkyl group include a methyl group, an ethyl group, a propyl group, a butyl group, a pentyl group, and a hexyl group.
  • the alkyl group may be linear, branched or cyclic, but a linear alkyl group is preferred.
  • the divalent linking group is preferably a linking group containing 1 to 20 carbons. Any linking group containing 1 to 12, more preferably 1 to 6 carbons may be used.
  • Examples of the divalent linking group include an alkylene group (for example, ethylene group, 1,2-propylene group, 2,2-propylene group (also called 2,2-propylidene group, 1,1-dimethylmethylene group), 1,3-propylene group, 2,2-dimethyl-1,3-propylene group, 2-butyl-2-ethyl-1,3-propylene group, 1,6-hexylene group, 1,9-nonylene group, 1 , 12-dodecylene group, 1,16-hexadecylene group, etc.), arylene group (eg, phenylene group, naphthylene group), ether group, imino group, carbonyl group, sulfonyl group, and a plurality of these divalent groups in series.
  • alkylene group for example, ethylene group,
  • divalent residues for example, a polyethyleneoxyethylene group, a polypropyleneoxypropylene group, a 2,2-propylenephenylene group, etc.
  • These groups may have a substituent.
  • bonding two or more of these groups in series may be sufficient.
  • an alkylene group, an arylene group, and a divalent group in which a plurality of these are bonded in series are preferable, and an unsubstituted alkylene group, an unsubstituted arylene group, and a divalent group in which these are bonded in series are more preferable.
  • the substituent include an alkyl group, an alkoxy group, an aryl group, and an aryloxy group.
  • the silane coupling agent is preferably contained in an amount of 1 to 30% by mass, more preferably 5 to 20% by mass, based on the solid content of the polymerizable composition. Moreover, in this invention, 2 or more types of silane coupling agents may be included, and those total amounts become the said range in this case.
  • silane coupling agent examples include silane coupling agent, but are not limited thereto.
  • the proportion of the silane coupling agent in the solid content of the polymerizable composition is preferably 1 to 20% by mass, and more preferably 2 to 10% by mass.
  • the polymerizable composition usually contains a polymerization initiator.
  • a polymerization initiator When a polymerization initiator is used, its content is preferably 0.1 mol% or more, more preferably 0.5 to 2 mol% of the total amount of compounds involved in the polymerization. By setting it as such a composition, the polymerization reaction via an active component production
  • photopolymerization initiators examples include Irgacure series (for example, Irgacure 651, Irgacure 754, Irgacure 184, Irgacure 2959, Irgacure 907, Irgacure 369, Irgacure 379, Irgacure 819, etc.), Darocur, etc., commercially available from BAFS Japan.
  • Irgacure series for example, Irgacure 651, Irgacure 754, Irgacure 184, Irgacure 2959, Irgacure 907, Irgacure 369, Irgacure 379, Irgacure 819, etc.
  • Darocur etc.
  • the polymerizable composition usually contains a solvent.
  • the solvent include ketone and ester solvents, and 2-butanone, propylene glycol monoethyl ether acetate, and cyclohexanone are preferable.
  • the content of the solvent is preferably 60 to 97% by mass of the polymerizable composition, and more preferably 70 to 95% by mass.
  • Formation method of organic layer As a method of forming an organic layer from a polymerizable composition, it is applied to a plastic film, or a functional layer on a plastic film, or an inorganic layer, and then light (for example, ultraviolet rays), electron beam, or heat ray, The method of hardening is mentioned. Application methods include dip coating, air knife coating, curtain coating, roller coating, wire bar coating, gravure coating, slide coating, or the hopper described in US Pat. No. 2,681,294. The extrusion coating method used can be adopted.
  • the organic layer may be formed by a vacuum film formation method such as flash vapor deposition.
  • the polymerizable composition is preferably cured by light.
  • the light to irradiate is usually ultraviolet light from a high pressure mercury lamp or a low pressure mercury lamp.
  • the radiation energy is preferably 0.1 J / cm 2 or more, 0.5 J / cm 2 or more is more preferable.
  • a (meth) acrylate compound is used as the polymerizable compound, the polymerization is inhibited by oxygen in the air, and therefore it is preferable to reduce the oxygen concentration or oxygen partial pressure during polymerization.
  • the oxygen concentration during polymerization is lowered by the nitrogen substitution method, the oxygen concentration is preferably 2% or less, and more preferably 0.5% or less.
  • the total pressure is preferably 1000 Pa or less, and more preferably 100 Pa or less. Further, it is particularly preferable to perform ultraviolet polymerization by irradiating energy of 0.5 J / cm 2 or more under a reduced pressure condition of 100 Pa or less.
  • the organic layer is preferably smooth and has high film hardness.
  • the smoothness of the organic layer is preferably less than 1 nm as average roughness (Ra value) of 1 ⁇ m square, and more preferably less than 0.5 nm.
  • the polymerization rate of the monomer is preferably 85% or more, more preferably 88% or more, further preferably 90% or more, and particularly preferably 92% or more.
  • the polymerization rate here means the ratio of the reacted polymerizable group among all the polymerizable groups (for example, acryloyl group and methacryloyl group) in the monomer mixture.
  • the polymerization rate can be quantified by an infrared absorption method.
  • the thickness of the organic layer is preferably 50 nm to 5000 nm, more preferably 200 nm to 4000 nm, and still more preferably 30 nm to 3000 nm.
  • the surface of the organic layer is required to be free of foreign matters such as particles and protrusions. For this reason, it is preferable that the organic layer is formed in a clean room.
  • the degree of cleanness is preferably class 10000 or less, more preferably class 1000 or less.
  • the inorganic layer is a layer in the barrier laminate, and is usually a thin film layer made of a metal compound.
  • a method for forming the inorganic layer any method can be used as long as it can form a target thin film.
  • PVD physical vapor deposition methods
  • CVD chemical vapor deposition methods
  • liquid phase growth methods such as plating and sol-gel methods.
  • the CVD method is preferred.
  • the component contained in the inorganic layer is not particularly limited as long as it satisfies the above performance.
  • An oxide, nitride, carbide, oxynitride or oxycarbide containing one or more metals selected from Sn, Zn, Ti, Cu, Ce and Ta can be preferably used.
  • an oxide, nitride or oxynitride of a metal selected from Si, Al, In, Sn, Zn and Ti is preferable
  • an oxide or nitride of Si or Al is more preferable, and particularly silicon nitride (Si Nitride) is preferred.
  • silicon nitride may be hydrogenated silicon nitride containing hydrogen, and may further be hydrogenated silicon oxynitride containing oxygen.
  • the inorganic layer contains silicon hydronitride, the inorganic layer becomes strong against tension, and similarly, the compression resistance tends to be improved. This tendency is presumed to be due to the formation of hydrogen bonds in the inorganic layer.
  • the amount of hydrogen in the inorganic layer is preferably 25-30% atomic%. When the amount of hydrogen is larger than this, there is a possibility that the barrier property and oxidation resistance are lowered.
  • the smoothness of the inorganic layer is preferably less than 1 nm as average roughness (Ra value) of 1 ⁇ m square, and more preferably 0.5 nm or less.
  • the inorganic layer is preferably formed in a clean room.
  • the degree of cleanness is preferably class 10000 or less, more preferably class 1000 or less.
  • the film thickness of the inorganic layer is one layer and is usually in the range of 5 to 500 nm, preferably 10 to 200 nm.
  • the film thickness of the inorganic layer may be larger than 20 nm, and may be 30 nm or more and 40 nm or more.
  • the film thickness of the inorganic layer may be 100 nm or less, 50 nm or less, or 35 nm or less.
  • the inorganic layer may have a laminated structure including a plurality of sublayers. In this case, each sublayer may have the same composition or a different composition. Further, as described above, as disclosed in US 2004-46497, the interface with the organic layer is not clear, and the layer may be a layer whose composition changes continuously in the film thickness direction.
  • the inorganic layer can be formed by a vacuum film forming method such as a sputtering method, a vacuum evaporation method, an ion plating method, or a plasma CVD method.
  • a vacuum film forming method such as a sputtering method, a vacuum evaporation method, an ion plating method, or a plasma CVD method.
  • the inorganic layer is a layer containing silicon nitride, it is preferably formed by a plasma CVD method.
  • the organic layer and the inorganic layer can be laminated by sequentially forming the organic layer and the inorganic layer in accordance with a desired layer structure. In particular, when at least two organic layers and at least two inorganic layers are alternately laminated, high barrier properties can be exhibited. Alternating lamination may be carried out in the order of organic layer / inorganic layer / organic layer / inorganic layer from the support side, or may be laminated in the order of inorganic layer / organic layer / inorganic layer / organic layer.
  • the barrier laminate may have a functional layer.
  • the functional layer is described in detail in paragraph numbers 0036 to 0038 of JP-A-2006-289627.
  • Examples of functional layers other than these include matting agent layers, protective layers, solvent resistant layers, antistatic layers, smoothing layers, adhesion improving layers, light shielding layers, antireflection layers, hard coat layers, stress relaxation layers, antifogging layers. , Antifouling layer, printed layer, easy adhesion layer and the like.
  • the base material of the barrier film used in the organic electronic device of the present invention is preferably a plastic film.
  • the plastic film is a film that can hold the barrier laminate, the material, film thickness, and the like are not particularly limited, and can be appropriately selected according to the purpose of use.
  • a transparent plastic film or a film with high optical properties may be preferred.
  • Specific examples of the plastic film include polyester resin, methacrylic resin, methacrylic acid-maleic acid copolymer, polystyrene resin, transparent fluororesin, polyimide, fluorinated polyimide resin, polyamide resin, polyamideimide resin, and polyetherimide resin.
  • Cellulose acylate resin Polyurethane resin, polyether ether ketone resin, polycarbonate resin, alicyclic polyolefin resin, polyarylate resin, polyether sulfone resin, polysulfone resin, cycloolefin polymer, cycloolefin copolymer, fluorene ring modified polycarbonate resin,
  • thermoplastic resins such as alicyclic modified polycarbonate resins, fluorene ring modified polyester resins, and acryloyl compounds.
  • the plastic film is preferably a polyester resin or a so-called optical film
  • the polyester resin is preferably polyethylene terephthalate (PET) or polyethylene naphthalate (PEN)
  • the optical film is more preferably a cycloolefin polymer, a cycloolefin copolymer, or a polycarbonate resin.
  • the film thickness of the plastic film is not particularly limited but is preferably thin. This is to increase the flexibility of the barrier film. By increasing the flexibility of the barrier film, it is possible to facilitate the bending for sandwiching the substrate, and it is possible to facilitate adhesion on the back surface of the substrate. If the substrate is thin, the distance of the inorganic layer from the bending center in the barrier film can be shortened, and the bending stress in the inorganic layer is reduced.
  • the substrate is usually 1 to 150 ⁇ m, more preferably 50 ⁇ m or less, and further preferably 25 ⁇ m or less.
  • the substrate As a board
  • the substrate include glass, barrier film, and metal foil.
  • the substrate is also preferably a barrier film.
  • a barrier film which is a substrate a barrier film similar to the upper barrier film provided on the organic electronic element on the substrate can be used. Both barrier films may be the same or different.
  • metal foil Aluminum foil, stainless steel foil, copper foil, tin foil, titanium foil, nickel foil, etc. are mentioned.
  • the metal foil is preferably used as a substrate with an insulating layer provided on the surface.
  • the glass substrate may be chamfered. More specifically, in the glass substrate, the edges and the front surface, and the corners formed by the edge and the back surface may be chamfered. By using a chamfered glass substrate, stress on the barrier film formed so as to cover the edge portion can be relaxed, and adhesion between the barrier film and the glass substrate on the back surface of the glass substrate can be facilitated.
  • the form of chamfering is not particularly limited, it can be performed in an arc shape (R chamfering) or a polygonal shape. That is, the glass substrate can be formed so that the end portion of the glass substrate viewed from the thickness direction has an arc shape or a polygonal arc shape.
  • the radius of curvature of the arc-shaped chamfer may be set, for example, from 1 cm to 0.1 mm according to the thickness of the glass substrate. For example, a radius of curvature of 0.2 mm or less can be used.
  • Polygonal chamfering may have a minimum angle of preferably 120 degrees or more, more preferably 135 degrees or more, and even more preferably 150 degrees or more.
  • the chamfering method may be any method known to those skilled in the art. A commercially available glass substrate that has been chamfered may be used. Moreover, the chamfering should just be given at the edge of the crow board
  • the opposing layer used in one embodiment of the present invention is provided on a barrier film or substrate to be bent. At this time, it may be provided so as to include at least a portion to be bent. Further, the opposing layer is preferably integrated with any one of the bent barrier film or the substrate so that a layer that easily causes cracking is disposed in the vicinity of the center in the thickness direction. This is because when the laminate is bent, stress is easily generated in the layer disposed on the surface, and generally, the stress increases as the distance from the thickness direction center (bending center) increases or the curvature radius decreases. Examples of the layer that easily causes cracks include an inorganic layer in the barrier film. It is preferable to provide the opposing layer only at the end including the bent portion of the barrier film or the substrate. In order to relieve the stress, it is conceivable to install a counter layer on the entire surface, but if it is installed on the entire surface, the transmittance may decrease or the amount of water contained in the organic electronic element may increase.
  • the material of the facing layer is not particularly limited, and examples thereof include plastic films such as PET (polyethylene terephthalate), metal foil, barrier film, resin coated and cured on the substrate, and rubber.
  • the barrier film at this time may be the same as or different from the barrier film provided as the upper barrier film provided for the entire sealing or as the substrate.
  • the thickness of the opposing layer is not particularly limited as long as it can be integrated with a barrier film or the like, and a layer that is prone to cracking can be disposed near the center in the thickness direction, but the barrier film or the substrate provided with the opposing layer
  • the film thickness is preferably 0.5 to 1.5 times.
  • the counter layer is preferably provided on the upper barrier film or substrate before being bent.
  • the opposing layer may be integrated with the barrier film or the substrate by bonding or the like before being bent.
  • the opposing layer itself may be applied and cured on the upper barrier film or the substrate to be integrated with the upper barrier film or the substrate.
  • substrate and a barrier film can be used. Since the adhesiveness varies depending on the type of the facing layer, it may be appropriately selected from the adhesives described below according to the facing layer used.
  • the opposing layer should just be provided in the bending part of the upper barrier film or the board
  • the opposing layer may extend outside the edge of the barrier film or substrate, or may not be reached or the edges may be aligned. When the opposing layer does not reach the edge of the barrier film or the substrate, a portion where the barrier film and the substrate can be directly bonded can be ensured at the end closer to the edge without going through the opposing layer.
  • the opposing layer can be provided, for example, as a strip film parallel to the longitudinal direction at both ends of a roll film for manufacturing a barrier film or a substrate.
  • An organic electronic device is formed by arranging an upper barrier film so as to sandwich the organic electronic device from above the surface of the substrate on which the organic electronic device is formed, and bonding the substrate and the upper barrier film.
  • the substrate and the upper barrier film may be bonded.
  • the end on the holding side is the other end. What is necessary is just to have a portion in the outer portion.
  • an upper barrier film may be provided by applying an adhesive to the outer periphery of the organic electronic element.
  • the upper barrier film is a film for sealing by a solid sealing method. May also be used.
  • the solid sealing method is a method in which a protective layer is preferably formed on an organic electronic element, and then an adhesive layer and an upper barrier film are stacked and integrated (for example, FIG. 1 (b)).
  • the adhesive layer is preferably not provided on the organic electronic element. This is because the adhesive generally contains moisture.
  • thermosetting epoxy resin a thermosetting epoxy resin, a photocurable acrylate resin, etc. are illustrated.
  • an adhesive sheet or a tape may be used.
  • As the adhesive sheet a thin sheet is preferable.
  • An adhesive sheet widely known as OCA (Optical Clear Adhesive) is exemplified.
  • the adhesive sheet or adhesive may function as a part of the counter layer or the counter layer.
  • the adhesive is applied in the direction of the outer peripheral part of the organic electronic element on the substrate surface, the edge of the substrate or the barrier film, and the curved end part directed toward the center of the device.
  • the width may be 0.1 mm or more, 1 mm or more, 2 mm or more, 5 mm or more, or 1 cm or more.
  • the total is preferably the above value.
  • the width of the adhesive In order to reduce the influence of moisture on the element, the larger the width of the adhesive, the better. For example, 1 mm or less, 2 mm or less, 5 mm or less, 1 cm depending on the size of the substrate and the purpose of use of the organic electronic device.
  • the width may be provided below or about 5 cm or less.
  • the adhesive when the counter layer is provided on the other side of the upper barrier film or the substrate integrated with each other, the adhesive is disposed on the surface of the counter layer. It may be configured as follows. At this time, the adhesive may be disposed only on the part corresponding to the surface of the opposing layer, and as shown in FIGS. 1 (a), (b), (d), it corresponds to the part where the opposing layer is not provided. An adhesive may be disposed on the portion to be performed. In the above-mentioned end portion, the adhesive may be only on one side of the sandwiched substrate or upper barrier film (for example, FIG. 1 (c)) or on both sides (for example, FIG.
  • the outside air entering from the edge portion of the upper barrier film can be obtained by adhering the edge of the upper barrier film to the substrate by providing an adhesive across the back surface, edge, and surface of the substrate.
  • the distance (adhesive width) passing through the adhesive layer can be ensured while suppressing the dead space of the organic electronic device.
  • an adhesive provided on the non-bend end may be the same as or different from the width of the adhesive provided at the bent end. Generally, in order to seal the outside air as well, it is preferable that they are substantially the same. In this case, the width of the adhesive need only be achieved by the adhesive provided on the surface.
  • the space when viewed from the normal direction of the substrate necessary for the adhesive can be suppressed, and therefore the distance from the edge of the substrate to the organic electronic element is not As compared with the bent end portion, it can be shortened, and as a result, the effective area of the organic electronic device can be increased.
  • the upper barrier film is bonded to the substrate so that the barrier laminate side is the organic electronic element side with respect to the substrate.
  • the barrier film is preferably bonded to the substrate so that the outermost surface layer on the substrate side of the upper barrier film is an inorganic layer. With the structure in which the outermost surface layer facing the organic electronic element is an inorganic layer, moisture in the space including the organic electronic element constituted by the substrate and the barrier film can be reduced.
  • a counter layer is provided on the outermost inorganic layer side of the barrier film (the counter layer is on the inside).
  • the upper barrier film when there is an inorganic layer in the outer part of the upper barrier film, that is, in the far part of the upper barrier film as viewed from the organic electronic element (for example, when the farthest layer has an inorganic layer), the upper barrier film is curved.
  • the opposing layer is provided on the farthest layer side (the opposing layer is on the outside).
  • the base material itself is weak against moisture and oxygen, it is necessary to install the base material inside the barrier layer.
  • the substrate is a barrier film and the substrate is curved.
  • organic electronic device As an example of the organic electronic element in the organic electronic device of the present invention, an element whose performance is deteriorated by a chemical component (oxygen, water, nitrogen oxide, sulfur oxide, ozone, etc.) in the air is preferably exemplified.
  • a chemical component oxygen, water, nitrogen oxide, sulfur oxide, ozone, etc.
  • an organic EL element As an example of the said device, an organic EL element, a liquid crystal display element, a thin-film transistor, a touch panel, electronic paper, a solar cell etc. can be mentioned, for example, It is preferably used for an organic EL element.
  • the organic EL element of Unexamined-Japanese-Patent No. 2012-256904 can be used.
  • the liquid crystal display element the description in paragraph No. 0044 of JP2009-172993A can be referred to.
  • Plasma treatment was performed on a smooth surface of polyethylene terephthalate (Toray, S10), and then 95 parts by weight of Compound I represented by the following structural formula and 5 parts by weight of a polymerization initiator (Lamberti, Esacure KTO46).
  • the polymerizable composition containing 2-butanone is applied to form a film having a dry film thickness of 2000 nm, and cured by irradiation with an ultraviolet ray irradiation amount of 0.5 J / cm 2 in a nitrogen atmosphere having an oxygen content of 100 ppm or less.
  • a first organic layer was produced.
  • a first inorganic layer having a thickness of 40 nm was formed on the first organic layer by vacuum film formation.
  • the first inorganic layer was formed by the composition shown in Table 1, silicon nitride (including oxygen and hydrogen in the film) was formed by plasma CVD, aluminum oxide was formed by sputtering, and silicon oxide was formed by vacuum evaporation. Further, a second organic layer was produced on the surface of the first inorganic layer in the same manner as the first organic layer. As shown in Tables 1 and 3, in some examples, a second inorganic layer was formed on the surface of the second organic layer in the same manner as the first inorganic layer.
  • An adhesive (Nagase ChemteX Corporation, XNR5516) was applied onto a substrate with a dispenser, a barrier film was bonded together, irradiated with ultraviolet rays at 6 J / cm 2 , and then cured by heating at 80 ° C. for 1 hour. The amount of adhesive was adjusted so that the adhesive width was 5 mm at the ends of the two sides parallel to the X direction. The ends of the two sides parallel to the Y direction were wrapped with a barrier film and sealed so as to have an adhesive width of 1 mm on the front surface and 4 mm on the back surface.
  • the fading rate is measured from the fading area of the metallic calcium and the original calcium area, and the durability shown in Table 2 is used. evaluated.
  • Table 1 In the barrier installation surface in Table 1, it means that the organic layer and the inorganic layer are disposed on the calcium side and sealed so as to be disposed on the surface opposite to the outside. The same applies when a barrier film is used for the substrate. Moreover, the same result is obtained also when the sealing barrier film and the substrate barrier film are exchanged and metallic calcium is deposited on the sealing barrier film.
  • Metal calcium was vapor-deposited on the glass substrate, and it sealed similarly to said example evaluated in the 1st aspect using the barrier film and the adhesive agent.
  • the adhesive amount was adjusted so that the adhesive width was about 5 mm (adhesion of two sides parallel to the X direction) and 1 mm (adhesion of two sides parallel to the Y direction).
  • the ends of the barrier film arranged as shown in FIG. 4 that do not overlap with the glass substrate of two sides parallel to the Y direction are bent to form the ends of the two sides parallel to the Y direction of the glass substrate, respectively.
  • the fading rate is measured from the fading area of metallic calcium and the original calcium area, and the durability shown in Table 2 is used. evaluated. The results are shown in Table 3.
  • “Right-angle indicates no chamfering
  • R indicates an arc-shaped chamfer (curvature radius of 0.2 mm)
  • C indicates a polygonal chamfer (inner angle of 135 °).
  • a certain amount of H was determined from the atomic ratio by measuring the number of elements and atoms in the inorganic layer by Rutherford backscattering and hydrogen forward scattering analysis.

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

　La présente invention concerne un dispositif électronique organique selon lequel un élément électronique organique sur un substrat est rendu étanche à l'aide d'un film barrière contenant un matériau de base, au moins une couche organique et au moins une couche inorganique, au moins une partie de l'extrémité du film barrière ou au moins une partie de l'extrémité du substrat étant cintrée afin de pincer l'autre parmi la au moins une partie de l'extrémité du film barrière ou la au moins une partie de l'extrémité du substrat. Il est préférable que l'épaisseur du matériau de base soit au plus de 50 µm, qu'une couche de résistance soit disposée au niveau du site cintré et, si le substrat est un substrat de verre, que le substrat de verre soit biseauté. La présente invention permet d'obtenir un dispositif électronique organique présentant une structure qui atténue l'impact de l'humidité qui pénètre à partir de ses extrémités.
PCT/JP2014/051431 2013-01-25 2014-01-24 Dispositif électronique organique Ceased WO2014115825A1 (fr)

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JP2013012085A JP2014143142A (ja) 2013-01-25 2013-01-25 有機電子デバイス
JP2013-053194 2013-03-15
JP2013053194A JP2014179266A (ja) 2013-03-15 2013-03-15 有機電子デバイス

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CN106058075A (zh) * 2016-08-04 2016-10-26 深圳爱易瑞科技有限公司 有机发光二极管显示装置和面板
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