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WO2014034014A1 - Appareil d'acquisition d'informations et appareil de détection d'objets - Google Patents

Appareil d'acquisition d'informations et appareil de détection d'objets Download PDF

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Publication number
WO2014034014A1
WO2014034014A1 PCT/JP2013/004475 JP2013004475W WO2014034014A1 WO 2014034014 A1 WO2014034014 A1 WO 2014034014A1 JP 2013004475 W JP2013004475 W JP 2013004475W WO 2014034014 A1 WO2014034014 A1 WO 2014034014A1
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WO
WIPO (PCT)
Prior art keywords
laser light
light source
laser
information acquisition
holder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2013/004475
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English (en)
Japanese (ja)
Inventor
信雄 岩月
楳田　勝美
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Electric Co Ltd
Original Assignee
Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Electric Co Ltd filed Critical Sanyo Electric Co Ltd
Publication of WO2014034014A1 publication Critical patent/WO2014034014A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • G01B11/25—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures by projecting a pattern, e.g. one or more lines, moiré fringes on the object
    • G01B11/2513—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures by projecting a pattern, e.g. one or more lines, moiré fringes on the object with several lines being projected in more than one direction, e.g. grids, patterns
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
    • G01S7/48—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S17/00
    • G01S7/481—Constructional features, e.g. arrangements of optical elements
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01V—GEOPHYSICS; GRAVITATIONAL MEASUREMENTS; DETECTING MASSES OR OBJECTS; TAGS
    • G01V8/00—Prospecting or detecting by optical means
    • G01V8/10—Detecting, e.g. by using light barriers
    • G01V8/20—Detecting, e.g. by using light barriers using multiple transmitters or receivers
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/28—Systems for automatic generation of focusing signals
    • G02B7/30—Systems for automatic generation of focusing signals using parallactic triangle with a base line
    • G02B7/32—Systems for automatic generation of focusing signals using parallactic triangle with a base line using active means, e.g. light emitter
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03K—PULSE TECHNIQUE
    • H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
    • H03K17/94—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the way in which the control signals are generated
    • H03K17/941—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the way in which the control signals are generated using an optical detector
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S17/00—Systems using the reflection or reradiation of electromagnetic waves other than radio waves, e.g. lidar systems
    • G01S17/02—Systems using the reflection of electromagnetic waves other than radio waves
    • G01S17/06—Systems determining position data of a target
    • G01S17/46—Indirect determination of position data
    • G01S17/48—Active triangulation systems, i.e. using the transmission and reflection of electromagnetic waves other than radio waves
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03K—PULSE TECHNIQUE
    • H03K2217/00—Indexing scheme related to electronic switching or gating, i.e. not by contact-making or -breaking covered by H03K17/00
    • H03K2217/94—Indexing scheme related to electronic switching or gating, i.e. not by contact-making or -breaking covered by H03K17/00 characterised by the way in which the control signal is generated
    • H03K2217/941—Indexing scheme related to electronic switching or gating, i.e. not by contact-making or -breaking covered by H03K17/00 characterised by the way in which the control signal is generated using an optical detector
    • H03K2217/94102—Indexing scheme related to electronic switching or gating, i.e. not by contact-making or -breaking covered by H03K17/00 characterised by the way in which the control signal is generated using an optical detector characterised by the type of activation
    • H03K2217/94108—Indexing scheme related to electronic switching or gating, i.e. not by contact-making or -breaking covered by H03K17/00 characterised by the way in which the control signal is generated using an optical detector characterised by the type of activation making use of reflection

Definitions

  • the present invention relates to an object detection apparatus that detects an object in a target area based on a state of reflected light when light is projected onto the target area, and an information acquisition apparatus suitable for use in the object detection apparatus.
  • An object detection apparatus using a so-called distance image sensor as an information acquisition apparatus can detect not only a planar image on a two-dimensional plane but also the shape and movement of the detection target object in the depth direction.
  • light in a predetermined wavelength band is projected from a laser light source or LED (Light-Emitting-Diode) onto a target area, and the reflected light is received by a light-receiving element such as a CMOS image sensor.
  • reflected light from the target area of laser light having a dot pattern is received by a light receiving element. Based on the light receiving position of the dot on the light receiving element, the distance to each part of the detection target object (irradiation position of each dot on the detection target object) is detected using triangulation (for example, non-patent) Reference 1).
  • a CAN package type semiconductor laser is used as a laser light source.
  • the apparatus in order to save space, the apparatus is required to be thin in the projection direction of the laser beam with respect to the target area.
  • a configuration in which the output optical axis of the laser light source is bent by a mirror or the like and the laser light is projected onto the target area can be used.
  • a CAN package type semiconductor laser it is necessary to secure an arrangement space corresponding to the diameter of the CAN, and it is difficult to effectively reduce the thickness of the information acquisition device.
  • the present invention has been made in view of this point, and provides an information acquisition device and an object detection device capable of effectively reducing the thickness of the device.
  • the first aspect of the present invention relates to an information acquisition device.
  • An information acquisition apparatus includes: a projection unit that projects a laser beam of a dot pattern onto a target region; a light receiving unit that images the target region; and a base on which the projection unit and the light receiving unit are arranged side by side.
  • the projection unit includes a frame package type laser light source, a collimator lens that converts the laser light emitted from the laser light source into parallel light, a mirror that reflects the laser light transmitted through the collimator lens, A diffractive optical element that converts the laser light reflected by the mirror into laser light having a predetermined dot pattern in the target area and projects the laser light on the target area.
  • the laser light source, the collimator lens, and the diffractive optical element are installed on the base so that the laser light source, the collimator lens, and the mirror are arranged in a straight line and the diffractive optical element faces a target region. Is done. Further, the laser light source is arranged on the base so that one surface in the thickness direction of the frame constituting the laser light source faces the surface of the base.
  • the second aspect of the present invention relates to an object detection apparatus.
  • the object detection apparatus according to this aspect includes the information acquisition apparatus according to the first aspect.
  • an information acquisition device and an object detection device capable of effectively reducing the thickness of the device.
  • the present invention is applied to an information acquisition apparatus of a type that irradiates a target area with laser light having a predetermined dot pattern.
  • the projection unit 100 corresponds to a “projection unit” described in the claims.
  • the opening 111a corresponds to the “accommodating portion” described in the claims.
  • the notch 111b corresponds to an “open portion” described in the claims.
  • the step portions 111c, 111d, and 111f correspond to “wall surfaces” recited in the claims.
  • the opening 111g corresponds to an “opening portion” described in the claims.
  • the groove 111 i corresponds to a “groove” described in the claims.
  • the inclined surfaces 111m and 111n correspond to “inclined surfaces” recited in the claims.
  • the wall surfaces 111o and 111p correspond to “wall surfaces” recited in the claims.
  • the convex portion 112a corresponds to a “contact portion” described in the claims.
  • the mountain folded portion 112d corresponds to a “deformed portion” described in the claims.
  • the DOE 140 corresponds to a “diffractive optical element” recited in the claims.
  • the light receiving unit 200 corresponds to a “light receiving unit” recited in the claims.
  • the projection housing portion 410 corresponds to “a structure for mounting the laser light source, the collimator lens, and the mirror” recited in the claims.
  • the opening 411a corresponds to an “opening” described in the claims.
  • the description of the correspondence between the above claims and the present embodiment is merely an example, and the invention according to the claims is not limited to the present embodiment.
  • FIG. 1 shows a schematic configuration of an object detection apparatus 1 according to the present embodiment.
  • the object detection device 1 includes an information acquisition device 2 and an information processing device 3.
  • the television 4 is controlled by a signal from the information processing device 3.
  • the information acquisition device 2 projects infrared light over the entire target area, and receives the reflected light with a CMOS image sensor, whereby the distance between each part of the object in the target area (hereinafter referred to as “three-dimensional distance information”). To get.
  • the acquired three-dimensional distance information is sent to the information processing apparatus 3 via the cable 5.
  • the information processing device 3 is, for example, a controller for TV control, a game machine, a personal computer, or the like.
  • the information processing device 3 detects an object in the target area based on the three-dimensional distance information received from the information acquisition device 2, and controls the television 4 based on the detection result.
  • the information processing apparatus 3 detects a person based on the received three-dimensional distance information and detects the movement of the person from the change in the three-dimensional distance information.
  • the information processing device 3 is a television control controller
  • the information processing device 3 detects the person's gesture from the received three-dimensional distance information and outputs a control signal to the television 4 in accordance with the gesture.
  • the application program to be installed is installed.
  • the information processing device 3 when the information processing device 3 is a game machine, the information processing device 3 detects the person's movement from the received three-dimensional distance information, and displays a character on the television screen according to the detected movement. An application program that operates and changes the game battle situation is installed.
  • FIG. 2 is a diagram showing the configuration of the information acquisition device 2 and the information processing device 3.
  • the information acquisition device 2 includes a projection optical system 10 and a light receiving optical system 20 as a configuration of an optical unit.
  • the projection optical system 10 and the light receiving optical system 20 are arranged in the information acquisition device 2 so as to be aligned in the X-axis direction.
  • the projection optical system 10 includes a laser light source 110, a collimator lens 120, a mirror 130, and a diffractive optical element (DOE: Diffractive Optical Element) 140.
  • the light receiving optical system 20 includes an aperture 210, an imaging lens 220, a filter 230, and a CMOS image sensor 240.
  • the information acquisition device 2 includes a CPU (Central Processing Unit) 21, a laser driving circuit 22, an imaging signal processing circuit 23, an input / output circuit 24, and a memory 25 as a circuit unit.
  • CPU Central Processing Unit
  • the laser light source 110 outputs a laser beam having a narrow wavelength band with a wavelength of about 830 nm in a direction approaching the light receiving optical system 20 (X-axis positive direction).
  • the collimator lens 120 converts the laser light emitted from the laser light source 110 into substantially parallel light.
  • the mirror 130 reflects the laser light incident from the collimator lens 120 side in the direction toward the DOE 140 (Z-axis direction).
  • the DOE 140 has a diffraction pattern on the incident surface. Due to the diffractive action of this diffraction pattern, the laser light incident on the DOE 140 is converted into laser light having a predetermined dot pattern and irradiated onto the target area.
  • the diffraction pattern of the DOE 140 has, for example, a structure in which a step type diffraction hologram is formed in a predetermined pattern.
  • the diffraction hologram is adjusted in pattern and pitch so as to convert the laser light that has been made substantially parallel light by the collimator lens 120 into a laser light having a dot pattern.
  • the DOE 140 irradiates the target region with the laser beam incident from the mirror 130 as a laser beam having a dot pattern that spreads radially.
  • the laser light reflected from the target area enters the imaging lens 220 through the aperture 210.
  • the aperture 210 stops the light from the outside so as to match the F number of the imaging lens 220.
  • the imaging lens 220 collects the light incident through the aperture 210 on the CMOS image sensor 240.
  • the filter 230 is a band-pass filter that transmits light in the infrared wavelength band including the emission wavelength (about 830 nm) of the laser light source 110 and cuts the wavelength band of visible light.
  • the CMOS image sensor 240 receives the light collected by the imaging lens 220 and outputs a signal (charge) corresponding to the amount of received light to the imaging signal processing circuit 23 for each pixel.
  • the output speed of the signal is increased so that the signal (charge) of the pixel can be output to the imaging signal processing circuit 23 with high response from the light reception in each pixel.
  • the CPU 21 controls each unit according to a control program stored in the memory 25. With this control program, the CPU 21 is provided with the functions of a laser control unit 21a for controlling the laser light source 110 and a distance acquisition unit 21b for generating three-dimensional distance information.
  • the laser drive circuit 22 drives the laser light source 110 according to a control signal from the CPU 21.
  • the imaging signal processing circuit 23 controls the CMOS image sensor 240, and sequentially captures the signal (charge) of each pixel generated by the CMOS image sensor 240 for each line at a predetermined imaging interval. Then, the captured signals are sequentially output to the CPU 21. Based on the signal (imaging signal) supplied from the imaging signal processing circuit 23, the CPU 21 calculates the distance from the information acquisition device 2 to each part of the detection target by processing by the distance acquisition unit 21b.
  • the input / output circuit 24 controls data communication with the information processing device 3.
  • the information processing apparatus 3 includes a CPU 31, an input / output circuit 32, and a memory 33.
  • the information processing device 3 is configured to communicate with the television 4 and to read information stored in an external memory such as a CD-ROM and install it in the memory 33.
  • an external memory such as a CD-ROM
  • the configuration of these peripheral circuits is not shown for the sake of convenience.
  • the CPU 31 controls each unit according to a control program (application program) stored in the memory 33.
  • a control program application program
  • the CPU 31 is provided with the functions of an object detection unit 31a for detecting an object in the image and a function control unit 31b for controlling the function of the television 4 according to the movement of the object.
  • Such a control program is read from a CD-ROM by a drive device (not shown) and installed in the memory 33, for example.
  • the object detection unit 31a extracts the shape of the object in the image from the three-dimensional distance information supplied from the information acquisition device 2, and detects the movement of the extracted object shape.
  • the function control unit 31b executes a predetermined process according to the detection result by the object detection unit 31a. For example, when the control program is a game program, the function control unit 31b executes a process for operating a character on the television screen in accordance with a human movement (gesture) detected by the object detection unit 31a.
  • the control program is a program for controlling the function of the television 4
  • the function control unit 31 b performs the function (channel switching) of the television 4 based on a signal from the object detection unit 31 a according to a person's movement (gesture). And volume adjustment, etc.) are executed.
  • the input / output circuit 32 controls data communication with the information acquisition device 2.
  • the projection optical system 10 and the light receiving optical system 20 are installed side by side with a predetermined distance in the X axis direction so that the projection center of the projection optical system 10 and the imaging center of the light receiving optical system 20 are aligned on a straight line parallel to the X axis. Is done.
  • FIG. 3A is a diagram schematically showing the irradiation state of the laser light on the target region
  • FIG. 3B is a diagram schematically showing the light receiving state of the laser light in the CMOS image sensor 240.
  • FIG. 3B shows a flat surface (screen) in the target area and a light receiving state when a person is present in front of the screen.
  • the projection optical system 10 irradiates the target area with laser light having a dot pattern (hereinafter, the entire laser light having this pattern is referred to as “DP light”).
  • DP light the entire laser light having this pattern
  • the light flux region of DP light is indicated by a solid line frame.
  • dot regions hereinafter simply referred to as “dots” generated by the diffraction action by the DOE 140 are scattered according to the dot pattern by the diffraction action by the DOE 140.
  • the DP light reflected thereby is distributed on the CMOS image sensor 240 as shown in FIG.
  • the entire DP light receiving area on the CMOS image sensor 240 is indicated by a broken line frame, and the DP light receiving area incident on the imaging effective area of the CMOS image sensor 240 is indicated by a solid line frame.
  • the light of Dt0 on the target area shown in FIG. 3A enters the position of Dt0 ′ shown in FIG. 3B on the CMOS image sensor 240.
  • FIG. 4 is a diagram for explaining a distance detection method according to the present embodiment.
  • a flat reflection plane RS perpendicular to the Z-axis direction is disposed at a predetermined distance Ls from the projection optical system 10.
  • the emitted DP light is reflected by the reflection plane RS and enters the CMOS image sensor 240 of the light receiving optical system 20.
  • an electrical signal for each pixel in the effective imaging area is output from the CMOS image sensor 240.
  • the output electric signal value (pixel value) for each pixel is developed on the memory 25 of FIG.
  • reflection image an image composed of all pixel values obtained by reflection from the reflection plane RS
  • reflection plane RS is referred to as a “reference plane”.
  • the DP light (DPn) corresponding to the region Sn on the reference image is reflected by the object, and is in a region Sn ′ different from the region Sn.
  • the projection optical system 10 and the light receiving optical system 20 are adjacent to each other in the X-axis direction, the displacement direction of the region Sn ′ with respect to the region Sn is parallel to the X-axis.
  • the region Sn ′ is displaced in the positive direction of the X axis with respect to the region Sn. If the object is at a position farther than the distance Ls, the region Sn ′ is displaced in the negative X-axis direction with respect to the region Sn.
  • the distance Lr from the projection optical system 10 to the portion of the object irradiated with DP light (DPn) is triangulated using the distance Ls. Calculated based on Similarly, the distance from the projection optical system 10 is calculated for the part of the object corresponding to another region.
  • Non-Patent Document 1 The 19th Annual Conference of the Robotics Society of Japan (September 18-20, 2001) Proceedings, P1279-1280).
  • FIG. 5 is an exploded perspective view showing the configuration of the information acquisition apparatus 2 according to the present embodiment.
  • the information acquisition device 2 includes a projection unit 100, a light receiving unit 200, a circuit board 300, and a base 400.
  • the CPU 21, the laser drive circuit 22, the input / output circuit 24, and the memory 25 shown in FIG. 2 are arranged on the circuit board 300, and the imaging signal processing circuit 23 is arranged on the image sensor circuit board 241.
  • the projection unit 100 includes a laser holder 111, a collimator lens holder 121, and a pressing spring 122 in addition to the projection optical system 10 (laser light sources 110 to DOE 140) shown in FIG.
  • the laser holder 111 holds the laser light source 110
  • the collimator lens holder 121 holds the collimator lens 120
  • the holding spring 122 is used to mount the collimator lens holder 121 on the base 400.
  • the light receiving unit 200 includes a lens barrel 250, an imaging lens holder 260, and an image sensor circuit board 241 in addition to the above-described light receiving optical system 20 (aperture 210 to CMOS image sensor 240).
  • the lens barrel 250 holds the aperture 210 and the imaging lens 220, and the imaging lens holder 260 holds the lens barrel 250 and the filter 230.
  • a CMOS image sensor 240 is installed on the image sensor circuit board 241.
  • the image sensor circuit board 241 is connected to the circuit board 300 by the FPC 301.
  • FIG. 5 shows the aperture 210 among the aperture 210 and the imaging lens 220 held in the lens barrel 250.
  • the filter 230 is attached to the surface on the negative side of the Z-axis of the imaging lens holder 260.
  • Projection unit 100 is installed on the surface of base 400 on the negative side of the Z-axis.
  • the aperture 210, the imaging lens 220, and the filter 230 are installed on the surface on the negative side of the Z-axis of the base 400 via the lens barrel 250 and the imaging lens holder 260.
  • FIG. 6A is an exploded perspective view of the laser light source 110 and the laser holder 111.
  • FIG. 6B is a perspective view showing the structure in a state where the laser light source 110 and the laser holder 111 are assembled.
  • the X-axis positive direction is the forward direction
  • the Y-axis positive direction is the left direction
  • the Z-axis positive direction is the upward direction.
  • the laser light source 110 is attached to the laser holder 111 by a leaf spring 112.
  • a jig mounting member 113 is mounted on the laser holder 111.
  • the jig mounting member 113 is used when adjusting the position of the laser light source 110. That is, when the position of the laser light source 110 is adjusted with respect to the base 400, a jig for position adjustment is mounted on the jig mounting member 113.
  • FIG. 7A is a perspective view of the laser light source 110 and the leaf spring 112 viewed from the Z axis positive side (upper side)
  • FIG. 7B is a perspective view of the laser light source 110 and the leaf spring 112 on the Z axis negative side (lower side).
  • FIG. 7C is a perspective view of the laser holder 111 and the jig mounting member 113 as viewed from the Z axis positive side (upper side)
  • FIG. 7D shows the laser holder 111 and the jig mounting member 113 in the Z axis negative direction. It is the perspective view seen from the side (lower side).
  • the laser light source 110 is a frame package type semiconductor laser.
  • the laser light source 110 includes a frame 110a, a mold 110b, a laser element 110c, and three terminals 110d.
  • the frame 110a has a flat shape in the Z-axis direction.
  • the frame 110a is made of metal or the like having excellent thermal conductivity in order to dissipate heat generated by the laser element 110c.
  • a mold 110b is formed on the frame 110a.
  • the mold 110b is a resin frame member opened in the positive direction of the X axis.
  • the laser element 110c is disposed at a central position surrounded by the mold 110b on the frame 110a.
  • the laser element 110c is electrically connected to the three terminals 110d by wires or the like. Each terminal 110 d is electrically connected to the laser drive circuit 22 mounted on the circuit board 300.
  • a central portion on the front side of the frame 110a is formed with a protrusion 110e protruding forward in a comb shape.
  • the left end front surface portion 110f and the right end front surface portion 110g of the frame 110a are each a plane parallel to the YZ plane.
  • a step portion 110h is formed on the right side surface of the frame 110a, and the right side surface of the step portion 110h is a plane parallel to the XZ plane.
  • the boundary between the right end front surface portion 110g and the step portion 110h is a smooth curved surface with chamfered corners.
  • the lower surface 110i of the frame 110a is a plane parallel to the XY plane.
  • the frame 110a is formed with two flange portions 110j and 110k symmetrically on the outside of the mold 110b.
  • the upper surfaces of the two flange portions 110j and 110k are planes parallel to the XY plane.
  • the step 110h is formed on the side edge of the flange 110k.
  • the leaf spring 112 is a spring-like plate-like member, and has a shape in which the front end portion and the left and right end portions are bent downward as shown in the figure.
  • convex portions 112a and 112b projecting downward are formed on the left and right edges of the leaf spring 112.
  • the tips of the convex portions 112a and 112b are each arcuate.
  • An opening 112c is provided at the center of the leaf spring 112, and a mountain fold 112d is formed so as to protrude obliquely upward from the front edge of the opening 112c.
  • the cross section of the XZ plane has an arc shape at the top of the mountain folded portion 112d.
  • a flange 112e bent in a hook shape is formed in the center of the rear end of the leaf spring 112.
  • the laser holder 111 is a substantially cubic holding member.
  • the laser holder 111 is made of a metal (zinc, magnesium, etc.) having excellent thermal conductivity in order to dissipate heat generated by the laser light source 110.
  • the laser holder 111 has an opening 111 a in the center for accommodating the laser light source 110 and the leaf spring 112. Further, a notch 111 b following the opening 111 a is formed on the left side surface of the laser holder 111 so as to follow the shape of the laser light source 110.
  • the opening 111a of the laser holder 111 has an upper left-right width smaller than a lower left-right width. Further, the width in the left-right direction of the upper portion of the opening 111a is slightly larger than the width in the left-right direction of the leaf spring 112, and the width in the left-right direction of the lower portion of the opening 111a is slightly larger than the width in the left-right direction of the laser light source 110. It has become.
  • Step portions 111c and 111d and a circular opening 111e continuing to the outside are formed on the inner side surface in front of the opening 111a.
  • the rear side surfaces of the step portions 111c and 111d are planes parallel to the YZ plane.
  • a stepped portion 111f and a rectangular opening 111g extending to the outside are formed on the inner side surface on the right side of the opening 111a.
  • the left side surface of the step portion 111f is a plane parallel to the XZ plane.
  • the bottom surface of the opening 111a is a flat portion 111h parallel to the XY plane, and a groove 111i for injecting heat gel is formed following the flat portion 111h.
  • a groove 111 j that engages with the flange 112 e of the leaf spring 112 is formed on the upper surface of the laser holder 111.
  • grooves 111k for mounting the jig mounting member 113 are formed on the lower and right side surfaces of the laser holder 111.
  • the front side surface of the laser holder 111 is a flat portion 111l parallel to the YZ plane.
  • the jig mounting member 113 has a shape that sandwiches the laser holder 111 from side to side and fits into the groove 111k. As shown in FIG. 7C, the jig mounting member 113 is formed with an L-shaped step 113a. The jig mounting member 113 has a reduced thickness in the front-rear direction due to the formation of the step 113a. The jig mounting member 113 is mounted on the laser holder 111 by fitting the portion of the jig mounting member 113 where the step 113 a is formed into the groove 111 k of the laser holder 111.
  • the laser light source 110 when the laser light source 110 is mounted on the laser holder 111, the laser light source 110 and the leaf spring 112 are viewed from the rear with the leaf spring 112 superimposed on the laser light source 110. It is inserted into the opening 111 a of the laser holder 111. The laser light source 110 is pushed forward until the movement is restricted by the inner surface of the opening 111a. Further, the leaf spring 112 is pushed forward until the flange 112e is engaged with the groove 111j of the laser holder 111.
  • the mountain fold 112d of the leaf spring 112 is pressed by the inner surface above the opening 111a to bend downward, and the bottom surface of the laser light source 110 is pressed against the flat portion 111h of the opening 111a by the restoring force of the mountain fold 112d. .
  • the configuration in which the laser light source 110 is pressed against the flat portion 111h of the opening 111a by the leaf spring 112 is an example of the configuration according to claim 6.
  • FIG. 8A and 8B are cross-sectional views showing how the laser light source 110 is attached to the laser holder 111.
  • FIG. 7A and 7B are sectional views when the laser light source 110 and the laser holder 111 shown in FIG. 6A are cut along the A-A ′ plane.
  • the wall surfaces 111o and 111p are planes parallel to the XZ plane, and the distance between the wall surfaces 111o and 111p is slightly larger than the lateral width of the protrusion 110e.
  • the position of the laser light source 110 in the front-rear direction is determined by the left end front surface portion 110f and the right end front surface portion 110g contacting the step portions 111c and 111d of the laser holder 111, respectively. Is done. Further, in the laser light source 110, the protrusion 110e fits between the wall surfaces 111o and 111p of the laser holder 111, and the stepped portion 110h abuts on the stepped portion 111f on the inner side surface of the laser holder 111 in the X axis positive direction. Thus, the position in the left-right direction is determined. Thereby, the emission part of the laser element 110 c of the laser light source 110 is positioned at the center of the opening 111 e of the laser holder 111.
  • the left side surface of the laser holder 111 is provided with a notch 111b, so that the left end front portion 110f of the laser light source 110 can be seen by looking inside through the notch 111b. It can be easily confirmed whether the laser holder 111 is in contact with the stepped portion 111c. Further, since the opening 111g is provided on the right side surface of the laser holder 111, the right end front surface portion 110g of the laser light source 110 is formed on the step portion 111d of the laser holder 111 by looking inside through the opening 111g. It can be easily confirmed whether or not they are in contact.
  • the configuration in which the notch 111b and the opening 111g are provided in order to confirm the mounting state of the laser light source 110 with respect to the laser holder 111 is an example of the configuration according to claim 8.
  • FIGS. 9A to 9D are views showing a state in which the laser light source 110 and the leaf spring 112 are completely inserted into the opening 111a of the laser holder 111.
  • FIG. 9A and 9B are perspective views of the laser holder 111 viewed from the left side and the right side, respectively.
  • FIGS. 9C and 9D are views of the laser holder 111 viewed from the left side and the right side, respectively.
  • the laser light source 110 is arranged so that the convex portions 112a and 112b of the leaf spring 112 abut on the upper surfaces of the flange portions 110j and 110k, respectively.
  • the position is determined. That is, as described above, the upper surface of the flange portions 110j and 110k of the laser light source 110 is pushed downward by the convex portions 112a and 112b of the leaf spring 112 by the restoring force of the elastically deformed mountain fold portion 112d, and the laser The lower surface 110i of the light source 110 is pressed against the flat portion 111h of the opening 111a. As a result, the laser light source 110 is positioned in the vertical direction.
  • the adhesive is applied to the boundary portion between the laser light source 110 and the laser holder 111, and the laser light source 110 is connected to the laser holder.
  • the adhesive is fixed to 111.
  • the heat gel flows into the groove 111 i of the laser holder 111, and the gap between the laser light source 110 and the laser holder 111 is filled.
  • the heat generated by the laser element 110c of the laser light source 110 is efficiently transmitted to the laser holder 111 via the frame 110a.
  • the configuration in which the groove 111 i is provided in the laser holder 111 in order to apply the heat gel in the gap between the laser light source 110 and the laser holder 111 is an example of the configuration according to claim 9.
  • the jig mounting member 113 is fitted into the groove 111k of the laser holder 111 from the lower side, and the jig mounting member 113 is mounted on the laser holder 111. Thereby, as shown in FIG.6 (b), the assembly of the laser light source 110 and the laser holder 111 is completed.
  • FIG. 10A is an exploded perspective view of the collimator lens 120 and the collimator lens holder 121.
  • FIGS. 10B and 10C are perspective views showing a state in which the collimator lens 120 is mounted on the collimator lens holder 121.
  • FIG. 10D is a perspective view showing the holding spring 122.
  • the collimator lens holder 121 is a bottomed cylindrical frame member having a substantially circular outline in a front view and having an opening 121a.
  • an opening 121b having a diameter smaller than that of the opening 121a is formed at the center of the side surface on the X-axis negative side of the collimator lens holder 121.
  • the opening 121 b is for guiding the laser beam to the mirror 130.
  • two holes 121c and 121d for allowing an adhesive to flow when the collimator lens 120 and the collimator lens holder 121 are bonded and fixed are formed to be aligned in the Y-axis direction.
  • flat portions 121e and 121f parallel to the XY plane are formed symmetrically in the Z-axis direction.
  • the diameter of the opening 121a is slightly larger than the diameter of the collimator lens 120.
  • the collimator lens 120 is fitted into the opening 121a from the positive side of the X axis until the surface in the negative direction of the X axis of the collimator lens 120 contacts the bottom of the opening 121a (see FIG. 10C). In this state, the adhesive flows into the holes 121c and 121d, and the collimator lens 120 is bonded and fixed to the collimator lens holder 121.
  • the holding spring 122 is a leaf spring having a spring property, and has a step 122a one step lower in the center.
  • the holding spring 122 has a symmetrical shape in the Y-axis direction.
  • the holding spring 122 is formed with two flanges 122 b for mounting the holding spring 122 to the base 400.
  • FIG. 11A is a perspective view of the base 400 viewed from the Z-axis negative side
  • FIG. 11B is a perspective view of the base 400 viewed from the Z-axis positive side.
  • the base 400 has a plate-like shape that is long in the X-axis direction, and includes a projection housing portion 410 for housing the projection unit 100, and the light receiving unit 200.
  • the light receiving housing part 420 for housing the battery is integrally formed.
  • the base 400 is made of a metal having high thermal conductivity such as zinc or magnesium.
  • the base 400 is formed with convex portions 400a to 400d for mounting the circuit board 300, and further, screw holes 400e and 400f for screwing the circuit board 300 are formed.
  • the projection unit 100 and the light receiving unit 200 are mounted on the base 400 so that they are aligned in the X-axis direction.
  • the base 400 functions as a heat sink that radiates heat generated by the laser light source 110 and the like to the outside.
  • the surface on the negative side of the Z-axis of the projection housing part 410 (the installation surface of the optical member) is one step lower in the positive direction of the Z-axis than the light-receiving housing part 420.
  • FIG. 12A is a perspective view of the periphery of the projection housing 410 viewed from the Z-axis negative side.
  • FIG. 12B is a perspective view of the periphery of the projection housing 410 viewed from the Y axis positive side.
  • FIG. 12C is a perspective view of the periphery of the projection housing 410 viewed from the Z axis positive side.
  • the projection housing 410 has a structure for mounting the laser holder 111, the collimator lens holder 121, and the mirror 130 on the surface on the negative side of the Z-axis.
  • the projection housing 410 includes a step 411 that is one step lower in the Z-axis positive direction, a wall portion 412 that protrudes in the Z-axis negative direction, a collimator lens holder mounting portion 413, and a mirror mounting portion 414.
  • the projection housing unit 410 has a configuration in which a structure for mounting the laser holder 111, the collimator lens holder 121, and the mirror 130 is provided on the surface on the negative side of the Z-axis. It is an example.
  • a circular opening 411a is formed at the center of the step portion 411, and square holes 411b and 411c are formed at two corners.
  • the wall portion 412 is a plane parallel to the YZ plane, and a U-shaped notch 412a is formed at the center.
  • the width in the Y-axis direction of the notch 412a is wider than the width in the Y-axis direction of the opening 111e of the laser holder 111 (see FIG. 7D), and the flat portion 111l of the laser holder 111 (see FIG. 7D). Narrower than the width in the Y-axis direction.
  • the height from the step portion 411 to the upper end (end portion in the Z-axis negative direction) of the wall portion 412 is slightly larger than the width of the laser holder 111 in the Z-axis direction. Further, the width of the step portion 411 in the Y-axis direction is considerably wider than the width of the laser holder 111 in the Y-axis direction.
  • the structure which provides the step part 411 in the projection housing part 410 of the base 400 is an example of the structure of Claim 4.
  • the collimator lens holder mounting portion 413 has a bottom surface 413a parallel to the XY plane, and an inclination inclined from the XY plane by a predetermined angle in the in-plane direction of the YZ plane and in the negative Z-axis direction. Surfaces 413b and 413c are formed. A substantially rectangular opening 413d is formed at the center of the bottom surface 413a.
  • a pressing spring mounting portion 413e for mounting the pressing spring 122 is formed in the Y-axis positive / negative direction of the collimator lens holder mounting portion 413.
  • the holding spring mounting portion 413e is provided with an engaging portion that engages with the flange 122b of the holding spring 122 to prevent the holding spring 122 from coming off.
  • the mirror mounting portion 414 is composed of two inclined surfaces inclined by 45 ° from the XY plane in the in-plane direction of the XZ plane and in the negative Z-axis direction.
  • the width in the Y-axis direction between the two inclined surfaces is narrower than the width of the mirror 130 in the Y-axis direction.
  • the mirror 130 is tilted by restricting the displacement of the mirror 130 in the X-axis positive direction at a position away from the end in the Z-axis positive direction by a predetermined distance from the end of the mirror mounting portion 414 in the X-axis positive direction.
  • Two convex portions 414a for fixing with are formed.
  • a DOE mounting portion 415 is formed on the front surface (Z-axis positive direction) of the projection housing portion 410.
  • the DOE mounting portion 415 has a contour that allows the DOE 140 to be fitted with a slight gap, and has a flat bottom surface 415 a that is one step lower than the surface of the base 400.
  • the depth in the Z-axis direction of the bottom surface 415a is slightly deeper than the thickness of the DOE 140.
  • the bottom surface 415a is a plane parallel to the XY plane.
  • the DOE mounting portion 415 is formed with wall surfaces 415b to 415e that face the outer periphery of the DOE 140 with a slight gap.
  • the wall surfaces 415b and 415d are planes parallel to the XZ plane, and the wall surfaces 415c and 415e are planes parallel to the YZ plane.
  • An opening 415f for guiding laser light from the laser light source 110 to the DOE 140 is formed in the center of the bottom surface 415a of the DOE mounting portion 415. Further, substantially U-shaped bonding grooves 415g to 415j for applying an adhesive when the DOE 140 is bonded to the base 400 are formed at the four corners of the DOE mounting portion 415.
  • the mirror 130 when assembling the projection unit 100, the mirror 130 is first placed on the mirror mounting portion 414. At this time, the end on the positive side of the Z axis of the mirror 130 is pressed against the two convex portions 414a. In this state, the mirror 130 is bonded and fixed. As a result, the mirror 130 is mounted on the projection housing 410 so as to have an inclination of 45 ° in the in-plane direction of the YZ plane with respect to the XY plane.
  • the collimator lens holder 121 to which the collimator lens 120 is attached is placed on the inclined surfaces 413b and 413c.
  • the flat portion 121f (see FIG. 10B) of the collimator lens holder 121 does not contact the bottom surface 413a of the collimator lens holder mounting portion 413, and the circumferential portion of the collimator lens holder 121 and the inclined surfaces 413b and 413c. Are in line contact with each other.
  • the holding spring 122 is attached to the holding spring mounting portion 413e of the collimator lens holder 121.
  • the stepped portion 122a of the holding spring 122 bends in the negative Z-axis direction, and the flat portion 121e of the collimator lens holder 121 is pressed in the positive Z-axis direction by the restoring force.
  • the collimator lens holder 121 is pressed against the inclined surfaces 413b and 413c, and the movement in the Y-axis direction and the Z-axis direction is suppressed.
  • a jig is attached to the laser holder 111 on which the laser light source 110 is mounted, and the flat portion 111l (see FIG. 7B) on the outer surface of the laser holder 111 in the positive direction of the X axis is the X axis of the wall portion 412. Pressed against the negative side.
  • FIG. 13A is a perspective view showing a state in which the laser holder 111 is pressed against the wall 412 by a jig.
  • the illustration of the position adjusting jig is omitted.
  • a predetermined gap exists between the laser holder 111 and the step portion 411 in the Z-axis direction and the Y-axis direction.
  • the laser holder 111 is displaced in the in-plane direction of the YZ plane while being pressed against the wall portion 412 by a jig.
  • the position of the laser light source 110 in the in-plane direction of the YZ plane is adjusted so that the optical axis of the laser light source 110 and the optical axis of the collimator lens 120 coincide with each other while the laser light source 110 is displaced. This adjustment is performed with the laser light turned on.
  • the position of the collimator lens 120 is adjusted.
  • the X-axis of the collimator lens 120 is used so that the collimator lens holder 121 is displaced in the X-axis direction using a jig so that the focal position of the collimator lens 120 is an appropriate position with respect to the light emission point of the laser light source 110.
  • Direction adjustment is performed.
  • This configuration is an example of the configuration described in claim 2.
  • the configuration in which the laser light source 110 is installed on the base 400 via the laser holder 111 in this way is an example of the configuration according to claim 3.
  • both the frame 110a and the laser holder 111 of the laser light source 110 are made of metal, and the gap between the frame 110a and the laser holder 111 is filled with the heat gel. Therefore, the heat generated by the laser light source 110 is efficiently transmitted to the base 400 via the laser holder 111 and the heat gel. Thus, the transmitted heat of the laser light source 110 is efficiently radiated to the outside by the base 400 having a large surface area.
  • the configuration in which the heat gel is applied through the opening 411a is an example of the configuration according to claim 5.
  • an adhesive is evenly applied to the left and right at positions where the collimator lens holder 121 and the inclined surfaces 413b and 413c of the collimator lens holder mounting portion 413 come into contact with each other through the opening 413d. Thereby, the collimator lens holder 121 is bonded and fixed to the projection housing portion 410.
  • the DOE 140 is fitted into the DOE mounting portion 415. Since the bottom surface 415a of the DOE mounting portion 415 is a plane parallel to the XY plane, the position of the DOE 140 in the Z-axis direction with respect to the projection housing portion 410 is determined by installing the DOE 140 on the bottom surface 415a of the DOE mounting portion 415. Is done. Further, the side surface on the Y axis positive side and the side surface in the X axis negative direction of the DOE 140 are pressed against the wall surfaces 415b and 415c, respectively, and the positions of the DOE 140 in the Y axis direction and the X axis direction are determined. In this state, the adhesive flows into the adhesive grooves 415g to 415j, and the DOE 140 is fixed to the projection housing part 410.
  • the imaging lens holder 260 (see FIG. 5) is attached to the light receiving housing portion 420 (see FIGS. 11A and 11B) of the base 400. As shown in FIGS. 11A and 11B, the light receiving housing 420 has an opening into which the lens barrel 250 (see FIG. 5) is fitted.
  • the imaging lens holder 260 is attached to the surface on the negative side of the Z-axis of the light receiving housing portion 420 so that the lens barrel 250 is fitted into the opening (see FIG. 5).
  • the image sensor circuit board 241 is attached to the surface on the negative side of the Z-axis of the imaging lens holder 260.
  • a recess (not shown) for accommodating the CMOS image sensor 240 is provided on the surface on the negative side of the Z-axis of the imaging lens holder 260.
  • the CMOS image sensor 240 is accommodated in the recess.
  • the circuit board 300 is fixed to the Z-axis negative side surface of the base 400 by screws 401 and 402.
  • notches 300a to 300d (see FIG. 5) formed at the four corners engage with the convex portions 400a to 400d (see FIG. 11A) of the base 400, and the surface on the Z axis positive side Is superimposed on the base 400 from the negative side of the Z-axis so as to contact the upper surface of the wall between the convex portions 400a and 400c and the upper surface of the projection housing portion 410 (see FIG. 11A).
  • the screws 401 and 402 are screwed into the screw holes 400e and 400f via the screw grooves 300e and 300f (see FIG. 5), and the circuit board 300 is mounted on the base 400.
  • FIG. 14A is a perspective view of the information acquisition device 2 with the circuit board 300 mounted on the base 400 as viewed from the Z-axis negative side, and FIG. 14B shows the information acquisition device 2 with the Z-axis positive. It is the perspective view seen from the side.
  • FIG. 15 is a schematic diagram showing the configuration of the projection optical system 10 and the light receiving optical system 20 of the information acquisition apparatus 2 according to the present embodiment.
  • the outgoing optical axis is parallel to the X axis, and the Z axis positive side surface of frame 110 a is parallel to the Z axis negative side surface of base 400. It is installed to become.
  • Laser light emitted from the laser light source 110 is converted into substantially parallel light by the collimator lens 120. Then, the laser light transmitted through the collimator lens 120 is reflected in the positive direction of the Z axis by the mirror 130 and enters the DOE 140.
  • the laser light source 110, the collimator lens 120, and the mirror 130 of the projection optical system 10 are arranged along the surface of the base 400.
  • the height can be reduced.
  • the laser light source 110 is configured by a frame package type semiconductor laser
  • the height in the Z-axis direction of the information acquisition device 2 can be further reduced as follows.
  • the step part 411 is formed in the position of the laser holder 111 of the base 400, the height of the information acquisition apparatus 2 in the Z-axis direction can be further reduced as follows.
  • FIGS. 16A and 16B are perspective views showing the configurations of the laser light source 110 and the base 400 according to the present embodiment, respectively.
  • FIGS. 16C and 16D are perspective views showing configurations of a laser light source 160 and a base 400 according to a comparative example, respectively.
  • a frame package type semiconductor laser is used as the laser light source 110.
  • a step portion 411 is provided, and a circular opening 411a is formed in the step portion 411.
  • the opening 411a is used for applying a heat gel. For this reason, the diameter of the opening 411a is smaller than the width of the laser holder 111 in the X-axis direction and the width in the Y-axis direction.
  • a CAN package type semiconductor laser is used as the laser light source 160 in the comparative example shown in FIG.
  • the CAN package type semiconductor laser has a shape in which a laser element is arranged on a base having a substantially circular outline, and the laser element is covered with a circular CAN slightly smaller than the base.
  • the laser light source 160 has a larger dimension in the Z-axis direction than the frame package type laser light source 110.
  • a rectangular opening 411d larger than the width of the laser holder 161 in the X-axis direction and the Y-axis direction is formed in the step portion 411 of the base 400.
  • the laser holder 161 is configured to fit into the opening 411d.
  • FIG. 17A is a schematic diagram of a main part of the configuration of FIG. 16A viewed in the X-axis positive direction
  • FIG. 17B is a schematic view of the configuration of FIG. 16B viewed in the X-axis positive direction.
  • the dimension ha of laser holder 111 in the Z-axis direction is kept small. Can do.
  • a CAN package type semiconductor laser is used for laser light source 160. Therefore, the dimension hb of laser holder 161 in the Z-axis direction is the dimension in the present embodiment. It becomes larger than ha.
  • the X-axis direction and the Y-axis of the laser holder 161 are placed on the step 411 as described above.
  • An opening 411d larger than the width in the direction is provided, and it is necessary to let the laser holder 161 escape from the opening 411d in the positive direction of the Z axis.
  • the laser holder 161 is positioned on the step portion 411, and the heat radiation gel is applied to the gap between the step portion 411 and the laser holder 161. Can take.
  • this causes a problem that the height Hc of the base 400 in the Z-axis direction increases and the thickness of the information acquisition device 2 increases.
  • the information acquisition apparatus 2 can be thinned while improving the heat dissipation characteristics.
  • the optical axis of the laser light source 110 is bent by the mirror 130, the size of the projection optical system 10 is reduced in the projection direction (Z-axis direction) of the laser light with respect to the target region.
  • the information acquisition device 2 can be thinned.
  • a thin frame package type semiconductor laser is used as the laser light source 110, and the surface on the Z-axis positive side of the frame 110 a of the semiconductor laser passes through the laser holder 111 on the surface (step portion 411). Since the laser light source 110 is installed so as to face the surface of the information acquisition device 2, the information acquisition device 2 can be further thinned.
  • the information acquisition device 2 can be further reduced in thickness.
  • the opening 411a for allowing the heat gel to flow is formed in the step portion 411 of the base 400, the gap between the base 400 and the laser holder 111 can be easily filled with the heat gel. . Therefore, the heat generated by the laser light source 110 can be efficiently transmitted to the base 400 via the laser holder 111. Thereby, the heat of the laser light source 110 can be efficiently radiated to the outside.
  • the laser light source 110 is pressed against the laser holder 111 by the leaf spring 112, the movement of the laser light source 110 in the Z-axis direction is suppressed, and the laser light source 110 is attached to the laser holder 111. Can be performed smoothly.
  • the notch 111b is formed on the side surface of the laser holder 111, the inside of the laser holder 111 can be seen through the notch 111b, and the laser light source 110 is attached to the laser holder 111. Can be carried out smoothly and appropriately.
  • the opening 111g is formed on the side surface of the laser holder 111, the inside of the laser holder 111 can be seen through the opening 111g, and the mounting work of the laser light source 110 on the laser holder 111 can be performed. It can be performed smoothly and appropriately.
  • the laser holder 111 is provided with the groove 111i for allowing the heat gel to flow in, so that the gap between the laser light source 110 and the laser holder 111 can be easily filled. Therefore, heat generated by the laser light source 110 can be efficiently transferred to the laser holder 111.
  • the step portion 411 is formed on the base 400, but the step portion 411 may not be formed as shown in FIG.
  • the height Hd of the base 400 is thicker than the height Ha of the base 400 in the above embodiment, as shown in FIG. 18B, the CAN package type laser light source 160 is used.
  • the base 400 can be configured to be smaller than the height He.
  • coating a heat gel was formed in the step part 411 of the base 400, as shown in FIG.18 (c), even if the opening 411a is not formed. good.
  • there is another means for applying the heat gel between the laser holder 111 and the step portion 411 such as applying a heat gel to the step portion 411 in advance before mounting the laser holder 111 on the base 400. It should be used.
  • the projection housing part 410 for installing the projection optical system 10 is formed on the surface opposite to the target area of the base 400 (Z-axis negative side).
  • the projection housing part 410 may be formed on the surface of the base 400 on the target region side (Z-axis positive side), and the projection optical system 10 may be installed.
  • the information acquisition device 2 can be thinned by using a thin frame package type semiconductor laser as the laser light source 110.
  • a step 403 is provided near the center of the base 400 in order to align the exit pupil of the projection optical system 10 and the entrance pupil of the light receiving optical system 20.
  • the light receiving optical system 20 may also be installed on the target area side (Z axis positive side) surface of the base 400 without providing the step 403.
  • the laser light source 110 is arranged so that the frame 110 a is parallel to the surface of the base 400.
  • the laser light source 110 has one surface in the thickness direction of the frame 110 a on the surface of the base 400.
  • the frame 110a is disposed so as to be inclined at a predetermined angle in the in-plane direction of the YZ plane from a position parallel to the surface of the base 400, as shown in FIG. Also good.
  • the laser light source 110 may be inclined by a predetermined angle in the in-plane direction of the XZ plane.
  • the frame 110a of the laser light source 110 is arranged so as to be parallel to the surface of the base 400 because the thickness of the base 400 can be minimized.
  • the laser light source 110, the collimator lens 120, and the mirror 130 are arranged in a straight line, and the DOE 140 faces the target area.
  • the configuration in which the laser light source 110, the collimator lens 120, and the DOE 140 are disposed is an example of a configuration according to claim 11.
  • the configuration including the circuit board 300 that is electrically connected to the projection unit 10 and the light receiving unit 20 and arranged substantially in parallel with the direction in which the laser light source 110, the collimator lens 120, and the mirror 130 are arranged in a straight line It is an example of the structure of Claim 12.
  • the laser holder 111 and the jig mounting member 113 are configured as separate members.
  • a jig adjusting hole may be directly formed in the laser holder 111.
  • the projection housing part 410 is formed integrally with the base 400, but may be constituted by another member.
  • the dimension of the information acquisition device 2 in the Z-axis direction can be more effectively suppressed when the projection housing part 410 is formed integrally with the base 400 as in the above embodiment.
  • the filter 230 is disposed to remove light in a wavelength band other than the wavelength band of the laser light irradiated to the target region. For example, light other than the laser light irradiated to the target region is used. In the case where a circuit configuration for removing the signal component from the signal output from the CMOS image sensor 240 is arranged, the filter 230 may be omitted. In the above embodiment, the CMOS image sensor 240 is used as the light receiving element, but a CCD image sensor can be used instead. Furthermore, the configurations of the projection optical system 10 and the light receiving optical system 20 can be changed as appropriate. The present invention can also be applied to control modes other than control inputs such as televisions.
  • the base 400 described in the above embodiment may also serve as a cabinet that forms a housing of the device.
  • the information acquisition device or the object detection device of the present invention is incorporated in a device such as a television or a personal computer, the information acquisition device or the object detection device is attached to the back surface of the cabinet constituting the device.
  • the cabinet will act as a base, thus eliminating the need to separate the cabinet and base.

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PCT/JP2013/004475 2012-08-30 2013-07-23 Appareil d'acquisition d'informations et appareil de détection d'objets Ceased WO2014034014A1 (fr)

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CN108152825A (zh) * 2016-12-02 2018-06-12 欧姆龙汽车电子株式会社 物体检测装置
CN108490577A (zh) * 2018-03-12 2018-09-04 广东欧珀移动通信有限公司 结构光投射器、图像获取装置和电子设备
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CN107015236B (zh) * 2015-10-15 2019-10-11 阿自倍尔株式会社 光电传感器
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CN108490577A (zh) * 2018-03-12 2018-09-04 广东欧珀移动通信有限公司 结构光投射器、图像获取装置和电子设备
CN112262451A (zh) * 2018-07-10 2021-01-22 欧姆龙株式会社 输入装置
CN112262451B (zh) * 2018-07-10 2024-04-23 欧姆龙株式会社 输入装置

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