WO2014013831A1 - Module and module manufacturing method - Google Patents

Description

Module and method for manufacturing the module

The present invention relates to a module in which an electronic component mounted on a mounting surface of a module substrate is sealed with a resin, and a method for manufacturing the module.

Conventionally, various modules in which electronic components having a sensor function, a filter function, and the like are mounted on a module substrate are known. As shown in a conventional module 500 of FIG. 5, this type of module is a module substrate 501, various electronic components 502 mounted on the mounting surface of the module substrate 501, and a wiring substrate that covers the electronic component 502. And a resin layer 503 provided on the mounting surface 501. The module substrate 501 is formed by laminating a plurality of insulating layers formed of a resin material or a ceramic material. The module substrate 501 includes a pattern electrode formed of a metal material such as Au, Ag, Cu, Pt, or Pd. A wiring electrode 504 made of a via conductor is provided.

The resin layer 503 is formed of a thermosetting resin material such as phenol resin or epoxy resin, or a photocurable resin material such as photocurable epoxy resin, polyimide resin, or acrylic resin on the mounting surface of the module substrate 501. It is filled and formed. In this way, the electronic component 502 mounted on the mounting surface of the module substrate 501 is covered with the resin layer 503, so that the electronic component 502 is protected by the resin layer 503. In addition, the module 500 is used by being mounted on another board such as a mother board included in various apparatuses, for example, but the resin on the mounting surface of the module board 501 by mounting the electronic component 502 is filled with resin. As a result, an adsorption surface for adsorbing and holding the module 500 by the conveyance device having an adsorption mechanism for conveying the module 500 onto another substrate such as a mother substrate is formed by the upper surface of the resin layer 503. Improved handling.

JP 2010-80901 A (paragraphs 0056, 0057, FIG. 3, etc.)

By the way, in recent years, mobile communication terminals such as mobile phones and personal digital assistants that support communication according to a plurality of communication standards such as GSM (registered trademark) (Global System for Mobile Communications) standard and CDMA (Code Division Multiple Access) standard have been rapidly increasing. Is popular. The mother board provided in these communication portable terminals has a duplexer that demultiplexes transmission signals and reception signals having different frequencies, a power amplifier that amplifies the transmission signals, a low noise amplifier that amplifies the reception signals, and the like. However, there is a demand for further reduction in the thickness of the communication portable terminal, and a further reduction in the height of the module mounted on the mother board is desired.

However, conventionally, an adsorption surface for adsorbing and holding the module 500 by the conveying device that conveys the module 500 onto another substrate such as a mother substrate is formed by the upper surface of the resin layer 503, and the resin layer 503 is the module layer 503. It was a hindrance to the 500 height reduction. Further, in order to prevent the characteristics of the electronic component 502 included in the module 500 from fluctuating or deteriorating due to heat generation, it is desirable to take measures against heat dissipation in the module 500. However, a reduction in the height of the module 500 is required. Therefore, a heat dissipation measure that does not increase the thickness of the module 500 is desired.

The present invention has been made in view of the above problems, and has as its first object to provide a technique capable of reducing the height of a module without impairing handling properties, and suppresses an increase in the thickness of the module. A second object is to provide a technique capable of improving the heat dissipation performance.

In order to achieve the first object, the module of the present invention includes a module substrate, an electronic component mounted on the mounting surface of the module substrate, and the mounting surface so as to cover a side surface of the electronic component. And an upper surface of each of the electronic component and the resin layer forms the same surface.

The module manufacturing method of the present invention includes a step of mounting an electronic component on the mounting surface of the module substrate, and a step of forming a resin layer by filling the mounting surface with resin so as to cover the side surface of the electronic component. And a step of grinding or polishing the resin layer and the electronic component such that the upper surfaces of the electronic component and the resin layer form the same surface.

In the invention configured as described above, the same surface is formed by the upper surface of each of the electronic component mounted on the mounting surface of the module substrate and the resin layer provided on the mounting surface so as to cover the side surface of the electronic component. . Therefore, even though the thickness of the resin layer is suppressed by the thickness of the electronic component, the module is transported by the transport device by holding the same surface formed by the upper surfaces of the electronic component and the resin layer by suction. Therefore, it is possible to reduce the height of the module without impairing handling properties.

In order to achieve the second object, the module of the present invention is characterized in that a metal film is formed on at least a part of the upper surfaces of the electronic component and the resin layer.

The module manufacturing method of the present invention is further characterized by further comprising a step of forming a metal film on at least a part of the upper surfaces of the electronic component and the resin layer.

In the invention configured as described above, the electronic component provided on the mounting surface of the module substrate and the metal film formed on at least a part of the upper surface of the resin layer function as a heat sink, so screen printing, vapor deposition, sputtering, etc. By forming the metal film thinly on at least a part of the upper surfaces of the electronic component and the resin layer by this method, the heat dissipation of the module can be improved while suppressing an increase in the thickness of the module.

The resin layer may be provided on the periphery of the electronic component with a conductor wall disposed so that one principal surface thereof faces the side surface of the electronic component connected to the metal film. A conductor via connected to the metal film may be provided around the electronic component.

With this configuration, the heat generated in the electronic component is dissipated from the metal film on the top surface of the resin layer through the conductor walls and conductor vias provided around the electronic component of the resin layer, so the heat dissipation of the module Can be further improved.

The metal film is provided so as to cover an upper surface of the electronic component, and a conductor for electrically connecting the metal film and a wiring electrode formed on the module substrate is provided on the resin layer. It may be done.

With this configuration, the metal film provided to cover the upper surface of the electronic component is electrically connected to the wiring electrode formed on the module substrate via the conductor provided on the resin layer. Since it functions as a shield electrode, the shield performance of the module can be improved. Further, if a conductor wall or a conductor via connected to a metal film electrically connected to the wiring electrode formed on the module substrate via a conductor is provided around the electronic component of the resin layer, the module substrate When other electronic components are mounted on the mounting surface, electrical interference between the electronic components can be suppressed.

The electronic component includes an element substrate formed of a piezoelectric body, an insulating layer disposed so as to surround a predetermined region of one main surface of the element substrate, and the element substrate stacked on the insulating layer. A cover layer forming a space surrounded by the insulating layer, and a SAW filter element formed by providing a comb electrode in the predetermined region, the cover layer facing the mounting surface The upper surface formed by the other main surface of the element substrate may be exposed from the resin layer and mounted on the mounting surface.

With this configuration, the cover layer is arranged in a laminated manner on the insulating layer disposed so as to surround a predetermined region of one main surface of the element substrate formed by the piezoelectric substrate, so that the gap between the element substrate and the cover layer is achieved. An electronic component having a SAW filter element formed by providing a comb electrode in a predetermined region of the element substrate in a space formed by being surrounded by an insulating layer is provided with a cover layer facing the mounting surface. The upper surface formed by the other main surface of the substrate is exposed from the resin layer and mounted on the mounting surface of the module substrate. Therefore, an electronic component having a SAW filter element is not a structure in which a SAW filter element is provided on a package substrate formed of a resin material or a ceramic material as in the prior art, but a comb-tooth electrode is provided directly on a piezoelectric substrate. Since the device substrate formed in this way is formed into a wafer level-chip size package (WL-CSP) structure that is cut out, the module formed by mounting electronic components on the module substrate is further reduced in height and size Can be achieved.

In addition, the electronic component is mounted on the mounting surface of the module substrate, and the mounting surface and the cover layer are formed by filling the resin between the mounting surface and the cover layer of the electronic component to form a resin layer. In addition to improving the mounting strength of the electronic component, the strength of the cover layer of the electronic component can be improved.

In addition, since the metal film is provided on the other main surface of the element substrate (piezoelectric element), heat generated by applying electric power to the comb electrodes provided in a predetermined region of the one main surface of the element substrate is generated. Since the heat is efficiently dissipated through the metal film, it is possible to prevent the generated heat from damaging the SAW filter element or changing or deteriorating the characteristics of the SAW filter element. Therefore, the power dissipation of the electronic component can be improved by improving the heat dissipation of the module.

According to the present invention, the same surface is formed by the upper surface of each of the electronic component mounted on the mounting surface of the module substrate and the resin layer provided on the mounting surface so as to cover the side surface of the electronic component. Although the thickness of the layer is suppressed to the thickness of the electronic component, the module can be transported by the transport device by sucking and holding the same surface formed by the upper surfaces of the electronic component and the resin layer, The module can be reduced in height without impairing handling properties.

It is a figure which shows 1st Embodiment of the joule of this invention. It is a block diagram which shows the electric constitution of the module of FIG. It is a figure which shows 2nd Embodiment of the module of this invention. It is a figure which shows 3rd Embodiment of the module of this invention. It is a figure which shows the conventional module.

<First Embodiment>
1st Embodiment of the module provided with the electronic component of this invention is described with reference to FIG. 1 and FIG. FIG. 1 is a diagram showing a first embodiment of a module including the electronic component of the present invention. FIG. 2 is a block diagram showing an electrical configuration of the module of FIG. In FIGS. 1 and 2, only main components according to the present invention are shown, and other components are not shown. 3 and 4 showing the second and third embodiments described later are also illustrated in the same manner as in FIG. 1, and thus the description thereof is omitted below.

(module)
A module 1 shown in FIGS. 1 and 2 is mounted on a mother board provided in a communication portable terminal such as a mobile phone or a portable information terminal. In this embodiment, the module 1 includes a transmission filter element 14 and a reception filter element 15. A duplexer 10 (duplexer: equivalent to the “electronic component” of the present invention), a module substrate 2, a matching circuit 3, a ground electrode 4, and various electronic components such as a switch IC, a filter, a resistor, a capacitor, and a coil. (Not shown), a resin layer 7 and a metal film 8 are provided and formed as a high-frequency antenna switch module.

Further, electronic components such as the duplexer 10 and the chip coil 3a are mounted on the electrode 2b provided on the mounting surface 2a of the module substrate 2, and the wiring pattern 5 provided on the module substrate 2 (“ Electrically connected to a plurality of mounting electrodes 6 formed on the back surface of the module substrate 2 via the wiring electrodes ”. When the module 1 is mounted on the mother board, the module 1 is connected to various signal lines and power lines such as the antenna line ANT, the ground line GND, the transmission signal line Tx, and the reception signal line Rx provided in the mother board. Thus, transmission / reception signals are input / output between the mother board and the module 1.

In this embodiment, the module substrate 2 is integrally formed as a ceramic laminate by laminating and firing a plurality of dielectric layers formed of ceramic green sheets. That is, the ceramic green sheet forming each dielectric layer is a sheet in which a slurry in which a mixed powder such as alumina and glass is mixed with an organic binder and a solvent is formed into a sheet by a molding machine. So that it can be fired at a low temperature. Then, via holes are formed on the ceramic green sheet cut into a predetermined shape by laser processing, etc., and the formed via holes are filled with a conductive paste containing Ag, Cu, etc. Via conductors are formed, various electrode patterns are formed by printing with a conductive paste, and each dielectric layer is formed.

Also, via conductors and electrode patterns are appropriately formed in each dielectric layer, so that wiring for connecting the duplexer 10 mounted on the module substrate 2 and electronic components such as the chip coil 3a to the module substrate 2 A pattern 5, a ground electrode 4, a mounting electrode 6 and the like are formed. That is, the electrode pattern and the via conductor are appropriately provided in each dielectric layer to form the ground electrode 4, the wiring pattern 5, the mounting electrode 6, and the like, so that the duplexer 10 mounted on the module substrate 2 and Electronic components such as the chip coil 3a and the mounting electrode 6 are electrically connected to each other. At this time, a circuit element such as a capacitor or a coil is formed by the electrode pattern and via conductor formed in each dielectric layer, or a filter circuit or a matching circuit 3 is formed by the formed circuit element such as a capacitor or coil. May be.

In this embodiment, the matching circuit 3 is formed by a chip coil 3a which is a chip component mounted on the mounting surface 2a of the module substrate 2, and is provided on the output side of the transmission filter element 14 and the input side of the reception filter element 15. It is connected via the common terminal 17 c of the duplexer 10.

The ground electrode 4 is disposed below the duplexer 10, provided on the mounting surface 2 a of the module substrate 2, and electrically connected to the ground line GND. The ground electrode 4 is connected to the ground terminal electrode of the duplexer 10 by a connection electrode such as a solder ball (not shown).

The resin layer 7 is provided on the mounting surface 2 a so as to cover the side surface of the duplexer 10, and the same surface is formed by the upper surfaces of the duplexer 10 and the resin layer 7. In this embodiment, among the electronic components mounted on the mounting surface 2a of the module substrate 2, the height from the mounting surface 2a of the duplexer 10 is the highest, and the other electronic components are mounted on the mounting surface 2a. A device whose height is lower than the height of the duplexer 10 is mounted on the mounting surface 2a.

The metal film 8 is formed of a metal such as Au (gold), Ag (silver), or Cu (copper) on the top surfaces of the duplexer 10 and the resin layer 7 by a method such as screen printing, vapor deposition, or sputtering. .

(Demultiplexer)
The duplexer 10 has a wafer level-chip size package (WL-CSP) structure, an element substrate 11, an insulating layer 12, a cover layer 13, and a transmission filter element 14 and a reception that have different high-frequency signal pass bands. And a filter element 15.

In this embodiment, the element substrate 11 is formed of a piezoelectric body such as lithium niobate, lithium tantalate, or quartz. Further, comb electrodes 14a and 15a (IDT electrodes) formed of Al, Cu, or the like are provided in a predetermined region of one main surface 11a of the element substrate 11 to constitute a SAW (surface acoustic wave) filter element. The transmission filter element 14 and the reception filter element 15 are formed by the SAW filter elements constituted by the comb electrodes 14a and 15a, respectively.

Further, the duplexer 10 includes a transmission terminal 17 a connected to the input side of the transmission filter element 14, a reception terminal 17 b connected to the output side of the reception filter element 15, and the output side and reception of the transmission filter element 14. A common terminal 17c (antenna terminal) connected to the input side of the filter element 15 and a ground terminal 17d are provided. In this embodiment, the reception filter element 15 has a balanced output type reception filter.

Further, on one main surface 11a of the element substrate 11, a terminal electrode 14b connected to the comb electrode 14a forming the transmission filter element 14 and a terminal connected to the comb electrode 15a forming the reception filter element 15 are provided. An electrode 15b is provided.

The insulating layer 12 is disposed so as to surround a predetermined region in which the comb electrodes 14a and 15a on one main surface 11a of the element substrate 11 are provided. The insulating layer 12 is formed by forming a resin layer on one main surface 11a of the element substrate 11 provided with the comb electrodes 14a and 15a and the terminal electrodes 14b and 15b by using a photosensitive epoxy resin or polyimide resin. Later, through a photolithography process, the resin layer is removed from the predetermined region where the comb electrodes 14a and 15a are provided and the region of the terminal electrodes 14b and 15b.

The cover layer 13 is laminated on the insulating layer 12 to form a space surrounded by the insulating layer 12 between the cover layer 13 and the element substrate 11, and the comb electrodes 14a and 15a (transmission filter elements) are formed in the formed space. 14 and the reception filter element 15) are arranged. The cover layer 13 may be formed by, for example, filling a connection hole of a resin layer that is laminated on the insulating layer 12 with a photosensitive epoxy resin or polyimide resin through a photolithography process with a paste of Cu or Al or via-filling. For example, the electrodes 14c and 15c connected to the terminal electrodes 14b and 15b are formed by plating. The duplexer 10 is formed by forming mounting solder balls 14d and 15d on the electrodes 14c and 15c that are connected to the connection terminals 14b and 15b and exposed from the cover layer 13, respectively.

In this embodiment, the transmission filter element 14 and the reception filter element 15 included in the duplexer 10 are formed by SAW filter elements. However, by forming the element substrate 11 from, for example, a Si substrate, the transmission filter element is formed. 14 and the reception filter element 15 may be formed of BAW filter elements. In the duplexer 10, the cover layer 13 faces the mounting surface 2 a of the module substrate 2, and the upper surface formed by the other main surface of the element substrate 11 is exposed from the resin layer 7 and mounted on the mounting surface 2 a. ing.

(Production method)
Next, an outline of an example of a method for manufacturing the module 1 of FIG. 1 will be described.

First, via holes are formed on a ceramic green sheet formed in a predetermined shape with a laser or the like, and a conductor paste is filled inside or via fill plating is performed to form a via conductor (wiring pattern 5) for interlayer connection. Electrode patterns such as the mounting electrode 2a, the ground electrode 4, the land-like wiring pattern 5 and the mounting electrode 6 on the mounting surface 2a are printed with a conductive paste to form each dielectric layer constituting the module substrate 2. A ceramic green sheet is prepared. Each ceramic green sheet is provided with a plurality of via conductors and electrode patterns so that a large number of module substrates 2 can be formed at a time.

Next, each dielectric layer is laminated to form a laminate. And the groove | channel for dividing | segmenting into each module board | substrate 2 after baking is formed so that the area | region of each module board | substrate 2 may be enclosed. Subsequently, the assembly of the module substrates 2 is formed by firing the laminate at a low temperature.

Subsequently, before being divided into individual module substrates 2, various electronic components such as the duplexer 10 and the chip coil 3 a are mounted on the mounting surface 2 a of the assembly of the module substrates 2. Next, the mounting surface 2 a of the assembly of the module substrates 2 is filled with resin so as to cover the side surfaces of the duplexer 10, and the resin layer 7 is provided on each module substrate 2 by heat curing. Thus, an assembly of modules 1 is formed.

Subsequently, the resin layer 7 and the element substrate 11 of the duplexer 10 are ground or polished so that the respective top surfaces of the duplexer 10 and the resin layer 7 form the same surface. Then, after the metal film 8 is formed on the surfaces formed by the top surfaces of the duplexer 10 and the resin layer 7, the assembly of the modules 1 is divided individually, and the module 1 is completed.

In the module 1 thus formed, the transmission signal output from the transmission signal line Tx of the mother board to the transmission terminal 17a of the duplexer 10 via the mounting electrode 6 and the wiring pattern 5 is transmitted to the transmission filter element 14. To the module board 2 side from the common terminal 17c, and output to the antenna line ANT of the mother board via the wiring pattern 5 (matching circuit 3) and the mounting electrode 6. The A reception signal input from the antenna line ANT of the mother board to the common terminal 17c of the duplexer 10 via the mounting electrode 6 and the wiring pattern 5 (matching circuit 3) is input to the reception filter element 15. Predetermined filtering is performed, the signal is output from the reception terminal 17 b to the module substrate 2, and is output to the reception signal line Rx of the mother substrate via the wiring pattern 5 and the mounting electrode 6.

The module substrate 2 provided with the wiring pattern 5 and the module 1 including the duplexer 10 having the WL-CSP structure are not limited to the above-described manufacturing method, and may be formed by a known general manufacturing method. The module substrate 2 can be formed of a printed circuit board, LTCC, alumina substrate, glass substrate, composite material substrate, single layer substrate, multilayer substrate, etc. using resin, ceramic, polymer material, etc. What is necessary is just to form the module board | substrate 2 by selecting an optimal material suitably according to a use purpose.

As described above, in this embodiment, each of the duplexer 10 mounted on the mounting surface 2a of the module substrate 2 and the resin layer 7 provided on the mounting surface 2a so as to cover the side surface of the duplexer 10 are provided. The same surface is formed by the upper surface of each. Therefore, although the thickness of the resin layer 7 is suppressed to the thickness of the duplexer 10, the same surface formed by the upper surfaces of the duplexer 10 and the resin layer 7 is held by suction, etc. Since the module 1 can be transported by a transport device (not shown) having the above, the module 1 can be reduced in height without impairing handling properties.

Further, since the duplexer 10 provided on the mounting surface 2a of the module substrate 2 and the metal film 8 formed on the upper surface of the resin layer 7 function as a heat sink, the demultiplexing is performed by a method such as screen printing, vapor deposition, or sputtering. By thinly forming the metal film 8 on the upper surfaces of the container 10 and the resin layer 7, it is possible to improve the heat dissipation of the module 1 while suppressing an increase in the thickness of the module 1.

Further, the cover layer 13 is laminated and disposed on the insulating layer 12 disposed so as to surround a predetermined region of the one main surface 11a of the element substrate 11 formed of the piezoelectric substrate, whereby the element substrate 11, the cover layer 13, A duplexer 10 having a SAW filter element formed by providing comb electrodes 14a and 15a in a predetermined region of the element substrate 11 in a space formed by being surrounded by an insulating layer 12 between The layer 13 faces the mounting surface 2 a, and the upper surface formed by the other main surface of the element substrate 11 is exposed from the resin layer 7 and mounted on the mounting surface 2 a of the module substrate 2.

Therefore, the duplexer 10 including the SAW filter element is not a structure in which the SAW filter element is provided on the package substrate formed of a resin material or a ceramic material as in the conventional case, but the comb-tooth electrode 14a directly on the piezoelectric substrate. , 15a is formed in a wafer level-chip size package (WL-CSP) structure in which the element substrate 11 is cut out, and thus the duplexer 10 is mounted on the module substrate 2 and formed. The module 1 can be further reduced in height and size.

In addition, in a state where the duplexer 10 is mounted on the mounting surface 2a of the module substrate 2, the resin layer 7 is also formed by filling the resin between the mounting surface 2a and the cover layer 13 of the duplexer 10. Therefore, the mounting strength of the duplexer 10 can be improved by the resin filled between the mounting surface 2a and the cover layer 13, and the strength of the cover layer 13 of the duplexer 10 can be improved.

In addition, since the metal film 8 is provided on the other main surface of the element substrate 11 formed of the piezoelectric element, power is supplied to the comb electrodes 14a and 15a provided in a predetermined region of the one main surface 11a of the element substrate 11. Since the heat generated by the application is efficiently dissipated through the metal film 8, the generated heat may damage the SAW filter element, or the characteristics of the SAW filter element may fluctuate or deteriorate. Can be prevented. Therefore, the heat resistance of the duplexer 10 can be improved by improving the heat dissipation of the module 1.

Further, when the resin layer 7 and the element substrate 11 of the duplexer 10 are ground and the same surface is formed by the upper surfaces of the duplexer 10 and the resin layer 7, the adsorption by the adsorption mechanism of the transport device is obstructed. A minute unevenness is formed on the upper surface of the module 1 to such an extent that it does not occur. Accordingly, since the metal film 8 is formed on the upper surface of the module 1 having minute irregularities, the minute irregularities are formed on the upper surface of the metal film 8, so that the heat dissipation efficiency by the metal film 8 functioning as a heat sink is improved. be able to.

In this embodiment, the chip coil 3a is mounted on the mounting surface 2a of the module substrate 2 in order to form the matching circuit 3 connected to the transmission filter element 14 and the reception filter element 15, but the transmission filter element 14 or a chip component such as a chip capacitor is mounted on the mounting surface 2a together with the chip coil 3a or in place of the chip coil 3a according to the configuration of the circuit connected to the reception filter element 15 or 14. Also good.

Second Embodiment
Next, a second embodiment of the present invention will be described with reference to FIG. FIG. 3 is a diagram showing a second embodiment of the module of the present invention.

This embodiment is different from the first embodiment described above in that, as shown in FIG. 3, one main surface facing the side surface of the duplexer 10 is in contact with the periphery of the duplexer 10 of the resin layer 7. The conductive wall 8 a (corresponding to the “conductor” of the present invention) is provided connected to the metal film 8. Of the metal film 8 provided so as to cover the upper surface of the duplexer 10 (the other main surface of the element substrate 11) and the wiring pattern 5 provided on the module substrate 2, it is connected to the ground line GND. The wiring pattern 5 is electrically connected by the conductor wall 8a. In this embodiment, the side surface of the resin layer 7 is also covered with the metal film 8. Since other configurations are the same as those in the first embodiment, description of the configuration is omitted by giving the same reference numerals.

With this configuration, the same effects as those of the first embodiment described above can be achieved, and the following effects can be achieved. That is, since the heat generated in the duplexer 10 is radiated from the metal film 8 on the upper surface of the resin layer 7 through the conductor wall 8a provided around the duplexer 10 of the resin layer 7, The heat dissipation can be further improved.

Further, the metal film 8 provided so as to cover the upper surface of the duplexer 10 is electrically connected to the wiring pattern 5 formed on the module substrate 2 via the conductor wall 8 a provided on the resin layer 7. As a result, it is grounded and functions as a shield electrode, so that the shielding property of the module 1 can be improved. In addition, since the conductor wall 8a that is electrically connected to the wiring pattern 5 of the module substrate 2 and is grounded is provided around the duplexer 10, the conductor wall 8a is mounted on the mounting surface 2a of the module substrate 2. The electrical interference between the electronic component (chip coil 3a and the like) and the duplexer 10 can be suppressed.

Further, since the side surface of the resin layer 7 is also covered with the metal film 8, the heat dissipation efficiency of the module 1 can be further improved.

In this embodiment, the conductor wall 8a is disposed in contact with the side surface of the duplexer 10 in order to improve the thermal conductivity. However, a gap is provided between the conductor wall 8a and the duplexer 10. In this state, the conductor wall 8 a may be disposed around the duplexer 10 of the resin layer 7.

<Third Embodiment>
Next, a second embodiment of the present invention will be described with reference to FIG. FIG. 4 is a diagram showing a third embodiment of the module of the present invention.

As shown in FIG. 4, this embodiment is different from the second embodiment described above in that a via conductor 8b connected to the metal film 8 around the duplexer 10 of the resin layer 7 (the “conductor” of the present invention). Is equivalent). Of the metal film 8 provided so as to cover the upper surface of the duplexer 10 (the other main surface of the element substrate 11) and the wiring pattern 5 provided on the module substrate 2, it is connected to the ground line GND. The wiring pattern 5 is electrically connected by the via conductor 8b. Since other configurations are the same as those in the first embodiment, description of the configuration is omitted by giving the same reference numerals.

With this configuration, the same effects as those of the second embodiment described above can be achieved.

It should be noted that the present invention is not limited to the above-described embodiment, and various modifications other than those described above can be made without departing from the spirit of the present invention. You may combine. For example, in the above-described embodiment, the duplexer 10 is described as an example of the electronic component of the present invention. However, the electronic component may be a semiconductor element such as a BAW filter, a power amplifier, or a switch IC. It may be anything. The metal film 8 only needs to be provided on at least a part of the upper surface of the module 1.

In the above-described embodiment, the module in which one duplexer is mounted on the module substrate has been described as an example. However, a module is formed by mounting two or more duplexers on the module substrate. In this case, a switch IC may be mounted on the module substrate, and a duplexer to be used may be selected and switched by the switch IC from a plurality of duplexers mounted on the module substrate.

In the above embodiment, the transmission filter element 14 and the reception filter element 15 are arranged in the same space, but two spaces surrounded by the insulating layer 12 are formed between the element substrate 11 and the cover layer 13. The transmission filter element 14 and the reception filter element 15 may be arranged in each space. With this configuration, the transmission filter element 14 and the reception filter element 15 are separated from each other in structure, so that, for example, heat generated when power is applied to the transmission filter element 14 is generated by the reception filter element 15. The influence on the characteristics can be suppressed. The transmission filter element and the reception filter element can be configured as individual electronic components and mounted on the mounting surface 2a of the module substrate 2 to achieve the same effect.

That is, in the above-described embodiment, the duplexer 10 formed as WL-CSP integrally including the transmission filter element 14 and the reception filter element 15 has been described as an example, but a plurality of element substrates, cover layers, and A duplexer may be formed by an insulating layer. In this case, an element having a WL-CSP structure in which a transmission filter element is disposed in a space surrounded by an insulating layer formed between the element substrate and the cover layer; Two WL-CSP elements each having a reception filter element arranged in a space surrounded by an insulating layer formed between the element substrate and the cover layer are prepared, and these two elements are connected to the module substrate 2. A duplexer may be configured by mounting on the board.

The present invention can be widely applied to modules in which electronic components mounted on a mounting surface of a module substrate are sealed with resin.

1 module 2 module substrate 2a mounting surface 5 wiring pattern (wiring electrode)
7 Resin layer 8 Metal film 8a Conductor wall (conductor)
8b Via conductor (conductor)
10 Demultiplexer (electronic component)
11 Element substrate 12 Insulating layer 13 Cover layer 14a, 15a Comb electrode

Claims (8)

A module board;
Electronic components mounted on the mounting surface of the module substrate;
A resin layer provided on the mounting surface so as to cover the side surface of the electronic component;
The module in which the upper surfaces of the electronic component and the resin layer form the same surface. The module according to claim 1, wherein a metal film is formed on at least a part of the upper surfaces of the electronic component and the resin layer. 3. A conductive wall disposed on the periphery of the electronic component of the resin layer so that one principal surface thereof faces a side surface of the electronic component is connected to the metal film. Module described in. 4. The module according to claim 2, wherein a conductor via connected to the metal film is provided around the electronic component of the resin layer. The metal film is provided so as to cover an upper surface of the electronic component, and the resin layer is provided with a conductor that electrically connects the metal film and a wiring electrode formed on the module substrate. The module according to claim 2, wherein the module is a module. The electronic component is
An element substrate formed of a piezoelectric body;
An insulating layer disposed so as to surround a predetermined region of one main surface of the element substrate;
A cover layer that is stacked on the insulating layer and forms a space surrounded by the insulating layer with the element substrate;
A SAW filter element formed by providing comb electrodes in the predetermined region,
6. The cover layer is opposed to the mounting surface, and an upper surface formed by the other main surface of the element substrate is exposed from the resin layer and mounted on the mounting surface. The module according to any one of the above. Mounting electronic components on the mounting surface of the module substrate;
Forming a resin layer by filling the mounting surface with a resin so as to cover the side surface of the electronic component;
And a step of grinding or polishing the resin layer and the electronic component such that the upper surfaces of the electronic component and the resin layer form the same surface. The method for manufacturing a module according to claim 7, further comprising a step of forming a metal film on at least a part of the upper surfaces of the electronic component and the resin layer.

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