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WO2014010334A1 - Spring terminal - Google Patents

Spring terminal Download PDF

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Publication number
WO2014010334A1
WO2014010334A1 PCT/JP2013/065439 JP2013065439W WO2014010334A1 WO 2014010334 A1 WO2014010334 A1 WO 2014010334A1 JP 2013065439 W JP2013065439 W JP 2013065439W WO 2014010334 A1 WO2014010334 A1 WO 2014010334A1
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WO
WIPO (PCT)
Prior art keywords
spring
coil spring
pedestal
spring terminal
terminal according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2013/065439
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French (fr)
Japanese (ja)
Inventor
笠松　俊史
輝明 飯田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Toko Meter Systems Co Ltd
Original Assignee
Toshiba Toko Meter Systems Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Toko Meter Systems Co Ltd filed Critical Toshiba Toko Meter Systems Co Ltd
Publication of WO2014010334A1 publication Critical patent/WO2014010334A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/28—Clamped connections, spring connections
    • H01R4/48—Clamped connections, spring connections utilising a spring, clip, or other resilient member
    • H01R4/4854—Clamped connections, spring connections utilising a spring, clip, or other resilient member using a wire spring
    • H01R4/4863—Coil spring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • H01R13/2421—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means using coil springs

Definitions

  • the present invention relates to a spring terminal mounted on a substrate on which an electronic component or the like is mounted.
  • the circuit board on which electronic parts are mounted is provided with a conduction part to the block side terminal.
  • a surface mount spring terminal provided with a coil spring is employed.
  • FIG. 1 is a diagram showing an example of a conventional spring terminal (Patent Document 1).
  • the spring terminal shown in FIG. 1 has a metal base 102 and a conductive coil spring 103.
  • the metal base portion 102 is provided with a top surface 106 for sucking by the suction nozzle 111 of the automatic mounting machine and a soldering surface 108 that can be soldered and that faces downward when the top surface 106 faces upward.
  • the coil spring 103 is attached in electrical conduction with the metal base 102 with the top surface 106 exposed to the inner peripheral side.
  • the top surface 106 of the protrusion 105 is exposed on the inner peripheral surface of the coil spring 103, the top surface 106 can be adsorbed to the nozzle by inserting the suction nozzle 111 through the inner periphery of the coil spring 103.
  • the coil spring 103 was compressed when the coil spring 103 was attached to the convex portion 105 of the metal base 102. For this reason, the coil spring 103 could not be suppressed stably.
  • An object of the present invention is to provide a spring terminal capable of improving the reliability of a coil spring without variation in the height of the coil spring and a load at a specified height after the coil spring is attached.
  • a spring terminal includes a conductive coil spring and a base having a nozzle suction surface for suction by a suction nozzle, and the coil spring is formed in a tapered shape. And a loosely wound portion that is loosely wound and a tightly wound portion that is tightly wound with a diameter smaller than that of the loosely wound portion, and a recess for pushing the tightly wound portion of the coil spring into the pedestal Is formed.
  • the tightly wound portion that is integrally formed with the coil spring and does not affect the spring elasticity is pressed by the cylindrical pushing jig 30, the tightly wound portion is pushed into the recess of the pedestal. Accordingly, a spring terminal that can improve the reliability of the coil spring without changing the height of the coil spring after mounting the coil spring that affects the spring elasticity is provided because the sparsely wound portion that affects the spring elasticity is not pressed. can do.
  • FIG. 1 is a view showing an example of a conventional spring terminal.
  • FIG. 2 is a schematic configuration diagram of a spring terminal according to the first embodiment of the present invention.
  • FIG. 3 is a cross-sectional view of the spring terminal shown in FIG.
  • FIG. 4 is a view showing the suction nozzle in the AA ′ sectional view of the spring terminal shown in FIG.
  • FIG. 5 is a diagram showing a detailed configuration of each part of the spring terminal according to the first embodiment of the present invention.
  • FIG. 6 is a diagram showing the configuration of the anti-displacement bonding portion of the spring terminal according to Embodiment 1 of the present invention.
  • FIG. 7 is a schematic configuration diagram of a spring terminal according to the second embodiment of the present invention.
  • FIG. 8 is a diagram showing the configuration of the solder joint portion of the spring terminal according to the second embodiment of the present invention.
  • FIG. 2 is a schematic configuration diagram of a spring terminal according to the first embodiment of the present invention.
  • 3 is a cross-sectional view taken along the line AA ′ of the spring terminal shown in FIG. 2, and also shows a cylindrical pushing jig 30.
  • FIG. 4 is a view showing the suction nozzle 40 in the AA ′ sectional view of the spring terminal shown in FIG.
  • FIG. 5 is a diagram illustrating a detailed configuration of each part of the spring terminal according to the first embodiment of the present invention.
  • the spring terminal according to the first embodiment includes the coil spring 10 and the pedestal 20, and is a component that can be reflow mounted on a board on which electronic components are mounted.
  • the reflow means that a spring terminal as a component is placed on a substrate coated with a solder paste and soldered.
  • the coil spring 10 has conductivity and is formed of a wire such as piano wire, beryllium copper, or stainless steel.
  • the coil spring 10 has a conical coil portion 11 (sparsely wound portion of the present invention) formed of a taper-like or conical spring and a loosely wound spring, and has a cylindrical shape with a smaller diameter than the conical coil portion 11 and is tightly wound. It consists of the contact
  • the pedestal 20 has conductivity and is made of a sheet metal such as brass, phosphor bronze, beryllium copper, stainless steel or the like.
  • the coil spring 10 and the pedestal 20 may be plated with tin.
  • the pedestal 20 has a flat portion 20a and a bent portion 20b bent at a substantially right angle with respect to the flat portion 20a.
  • a cylindrical recess 21 is formed at a substantially central portion of the flat portion 20a. The tightly wound portion 12 of the coil spring 10 is pushed into the recess 21.
  • a nozzle suction surface 23 for suction by the suction nozzle 40 is provided on the upper surface of the bottom surface of the recess 21 to mount the spring terminal on the substrate.
  • the tip of the bent portion 20b of the pedestal 20 is further bent at a substantially right angle with respect to the bent portion 20b to form a horizontal flat plate, and this horizontal flat plate has a solder joint for bonding solder to the substrate.
  • a portion 24 is provided.
  • a coil fixing for fixing the tightly wound portion 12 to the concave portion 21 of the pedestal 20 at a plurality of locations on the outer peripheral surface of the cylindrical concave portion 21 formed in the pedestal 20 and at intermediate positions in the depth direction of the concave portion 21 A claw portion 22 is formed.
  • the pedestal 20 is formed with a coil spring guiding portion 25 for guiding the coil spring 10 into the concave portion 21 of the pedestal 20.
  • the coil spring guide portion 25 has a conical taper formed at the connecting portion between the flat portion 20 a and the cylindrical recess 21.
  • an anti-displacement adhesion portion 26 is formed on the bottom surface of the bottom surface of the recess 21 of the pedestal 20.
  • the misalignment countermeasure adhesive portion 26 is bonded to an adhesive applied on the substrate, and the pedestal 20 is fixed to the substrate when the spring terminal is mounted on the substrate.
  • the non-shrinkable tightly wound portion 12 formed on the coil spring 10 is pressed by the cylindrical pressing jig 30. Then, the tightly wound portion 12 is pushed into the concave portion 21 of the base 20. Therefore, since the sparsely wound portion that affects the spring elasticity is not pressed, the height of the coil spring 10 does not vary after the coil spring 10 is attached to the base, and the load at the specified height does not vary. Further, the reliability of the coil spring 10 can be improved.
  • the coil fixing claw portion 22 for fixing the coil spring 10 to the concave portion 21 is formed on the outer peripheral surface of the concave portion 21, when the tight winding portion 12 is pushed into the concave portion 21, the winding of the tight winding portion 12 is performed.
  • the coil fixing claw portion 22 is caught between the wires, and the tightly wound portion 12 can be reliably fixed to the concave portion 21.
  • the solder can be joined to the solder joint portion 24 and the solder can be joined to the substrate by reflow.
  • the pedestal 20 is provided with a coil spring guiding portion 25 in which a conical taper is formed at a connecting portion between the flat portion 20a of the pedestal 20 and the concave portion 21 in order to guide the coil spring 10 into the concave portion 21. Since the coil spring 10 is drawn into the recess 21 with the outer diameter of the coil spring 10, the positioning can be easily performed when the coil spring 10 is assembled.
  • the spring terminal is mounted on the substrate. Later, when it is difficult to fix the spring terminal to the substrate at the time of reflow, the anti-displacement bonding portion 26 is bonded to the adhesive applied on the substrate, and the base 20 can be fixed to the substrate.
  • the spring terminal can be easily mounted on the substrate by an automatic machine, and the spring terminal can be used as a reflow reel packaging component.
  • FIG. 7 is a schematic configuration diagram of a spring terminal according to the second embodiment of the present invention.
  • FIG. 8 is a diagram illustrating the configuration of the solder joint portion of the spring terminal according to the second embodiment of the present invention.
  • the spring terminal according to the first embodiment is configured such that the pedestal 20 includes the flat portion 20a, the curved portion 20b, and the solder joint portion 24.
  • the spring terminal according to the second embodiment includes only the flat portion of the pedestal 20A. It is characterized by being configured.
  • the configuration of the flat portion shown in FIG. 7 is the same as the configuration of the flat portion 20a of the first embodiment.
  • the flat portion has a recess 21, a coil fixing claw portion 22, a nozzle suction surface 23, and a coil.
  • a spring lead-in portion 25 is formed.
  • solder joint portion 27 for joining the solder to the substrate is provided on the lower surface of the bottom surface of the recess 21 of the base 20A.
  • the curved portion 20b and the solder joint portion 24 are deleted from the pedestal 20A, and the pedestal 20A is configured only by the flat portion, so that the material cost can be reduced. . Therefore, it is possible to provide a spring terminal that can be reflow-mounted on a substrate at a low cost.
  • a solder joint portion 27 is provided on the lower surface of the bottom surface of the recess 21 of the pedestal 20A in place of the misalignment countermeasure adhesion portion 26 of the first embodiment.
  • the mounting area of the spring terminal on the substrate can be reduced.
  • this invention is not limited to the spring terminal which concerns on Example 1 and Example 2.
  • FIG. 1 the coil fixing claw portion 22 is caught between the windings of the tight winding portion 12. You may make it fix by pressing on a surface.

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  • Coupling Device And Connection With Printed Circuit (AREA)

Description

ばね端子Spring terminal

　本発明は、電子部品などを搭載した基板に実装されるばね端子に関する。 The present invention relates to a spring terminal mounted on a substrate on which an electronic component or the like is mounted.

　電子部品などを搭載した回路基板にはブロック側端子との導通部が設けられている。ブロック側端子と前記導通部との安定的な接触を確保するためとコストとを低減するために、コイルばねを備えた表面実装ばね端子が採用されている。 The circuit board on which electronic parts are mounted is provided with a conduction part to the block side terminal. In order to secure stable contact between the block-side terminal and the conducting portion and to reduce the cost, a surface mount spring terminal provided with a coil spring is employed.

　図１は、従来のばね端子の一例を示す図である（特許文献１）。図１に示すばね端子は、金属基部１０２と、導電性のコイルばね１０３とを有する。金属基部１０２には、自動実装機の吸着ノズル１１１により吸着するための頂面１０６と半田付け可能で頂面１０６を上向きにしたときに下向きとなる半田付け面１０８とが設けられている。コイルばね１０３は、頂面１０６を内周側に露呈させて金属基部１０２に電気的に導通して取り付けられている。 FIG. 1 is a diagram showing an example of a conventional spring terminal (Patent Document 1). The spring terminal shown in FIG. 1 has a metal base 102 and a conductive coil spring 103. The metal base portion 102 is provided with a top surface 106 for sucking by the suction nozzle 111 of the automatic mounting machine and a soldering surface 108 that can be soldered and that faces downward when the top surface 106 faces upward. The coil spring 103 is attached in electrical conduction with the metal base 102 with the top surface 106 exposed to the inner peripheral side.

　突起１０５の頂面１０６がコイルばね１０３の内周面に露呈しているので、コイルばね１０３の内周に、吸着ノズル１１１を挿通させることにより、頂面１０６をノズル吸着することができる。 Since the top surface 106 of the protrusion 105 is exposed on the inner peripheral surface of the coil spring 103, the top surface 106 can be adsorbed to the nozzle by inserting the suction nozzle 111 through the inner periphery of the coil spring 103.

　なお、従来のこの種のばね端子の技術として、例えば、特許文献２に記載されたコイルばねコネクタが知られている。 As a conventional technology of this type of spring terminal, for example, a coil spring connector described in Patent Document 2 is known.

特開２００９－３８００５号公報JP 2009-38005 A 特開２００２－１７０６１７号公報JP 2002-170617 A

　しかしながら、コイルばね１０３が金属基部１０２の凸部１０５に取り付けられる際に、コイルばね１０３が圧縮されていた。このため、コイルばね１０３を安定して抑えることができなかった。 However, the coil spring 103 was compressed when the coil spring 103 was attached to the convex portion 105 of the metal base 102. For this reason, the coil spring 103 could not be suppressed stably.

　また、コイルばね１０３が凸部１０５に取り付られる時に、過度な応力がコイルばね１０３に発生する。このため、取り付けした後のコイルばね１０３の高さがばらついたり、コイルばね１０３が劣化して信頼性が低下するという課題を有していた。 Further, when the coil spring 103 is attached to the convex portion 105, excessive stress is generated in the coil spring 103. For this reason, the height of the coil spring 103 after attachment varied, or the coil spring 103 deteriorated and had the subject that reliability fell.

　本発明の課題は、コイルばねを取り付け後にコイルばねの高さと指定高さ時の荷重がばらつくことなく、コイルばねの信頼性を向上することができるばね端子を提供する。 An object of the present invention is to provide a spring terminal capable of improving the reliability of a coil spring without variation in the height of the coil spring and a load at a specified height after the coil spring is attached.

　上記課題を解決するために、本発明に係るばね端子は、導電性のコイルばねと、吸着ノズルにより吸着するためのノズル吸着面を有する台座とを有し、前記コイルばねは、テーパ状に形成され且つ疎巻きされた疎巻き部と、前記疎巻き部よりも小さい径で密着巻きされた密着巻き部とを有し、前記台座には、前記コイルばねの前記密着巻き部を押し込むための凹部が形成されていることを特徴とする。 In order to solve the above problems, a spring terminal according to the present invention includes a conductive coil spring and a base having a nozzle suction surface for suction by a suction nozzle, and the coil spring is formed in a tapered shape. And a loosely wound portion that is loosely wound and a tightly wound portion that is tightly wound with a diameter smaller than that of the loosely wound portion, and a recess for pushing the tightly wound portion of the coil spring into the pedestal Is formed.

　本発明によれば、コイルばねに一体で形成されたばね弾性に影響していない密着巻き部が円柱状押込み治具３０により押圧されると、密着巻き部が台座の凹部に押し込まれる。従って、ばね弾性に影響する疎巻き部を押圧しないため、ばね弾性に影響するコイルばねを取り付け後にコイルばねの高さがばらつくことなく、コイルばねの信頼性を向上することができるばね端子を提供することができる。 According to the present invention, when the tightly wound portion that is integrally formed with the coil spring and does not affect the spring elasticity is pressed by the cylindrical pushing jig 30, the tightly wound portion is pushed into the recess of the pedestal. Accordingly, a spring terminal that can improve the reliability of the coil spring without changing the height of the coil spring after mounting the coil spring that affects the spring elasticity is provided because the sparsely wound portion that affects the spring elasticity is not pressed. can do.

図１は従来のばね端子の一例を示す図である。FIG. 1 is a view showing an example of a conventional spring terminal. 図２は本発明の実施例１に係るばね端子の概略構成図である。FIG. 2 is a schematic configuration diagram of a spring terminal according to the first embodiment of the present invention. 図３は図２に示すばね端子のＡ－Ａ´断面図に円柱状押込み治具も示す図である。FIG. 3 is a cross-sectional view of the spring terminal shown in FIG. 図４は図２に示すばね端子のＡ－Ａ´断面図に吸着ノズルも示す図である。FIG. 4 is a view showing the suction nozzle in the AA ′ sectional view of the spring terminal shown in FIG. 図５は本発明の実施例１に係るばね端子の各部の詳細な構成を示す図である。FIG. 5 is a diagram showing a detailed configuration of each part of the spring terminal according to the first embodiment of the present invention. 図６は本発明の実施例１に係るばね端子のズレ対策接着部の構成を示す図である。FIG. 6 is a diagram showing the configuration of the anti-displacement bonding portion of the spring terminal according to Embodiment 1 of the present invention. 図７は本発明の実施例２に係るばね端子の概略構成図である。FIG. 7 is a schematic configuration diagram of a spring terminal according to the second embodiment of the present invention. 図８は本発明の実施例２に係るばね端子のはんだ接合部の構成を示す図である。FIG. 8 is a diagram showing the configuration of the solder joint portion of the spring terminal according to the second embodiment of the present invention.

　以下、本発明の実施の形態に係るばね端子が、図面を参照しながら詳細に説明される。 Hereinafter, a spring terminal according to an embodiment of the present invention will be described in detail with reference to the drawings.

（実施例１）
　図２は、本発明の実施例１に係るばね端子の概略構成図である。図３は、図２に示すばね端子のＡ－Ａ´断面図であり、円柱状押込み治具３０も示す図である。図４は、図２に示すばね端子のＡ－Ａ´断面図に吸着ノズル４０も示す図である。図５は、本発明の実施例１に係るばね端子の各部の詳細な構成を示す図である。 (Example 1)
FIG. 2 is a schematic configuration diagram of a spring terminal according to the first embodiment of the present invention. 3 is a cross-sectional view taken along the line AA ′ of the spring terminal shown in FIG. 2, and also shows a cylindrical pushing jig 30. FIG. FIG. 4 is a view showing the suction nozzle 40 in the AA ′ sectional view of the spring terminal shown in FIG. FIG. 5 is a diagram illustrating a detailed configuration of each part of the spring terminal according to the first embodiment of the present invention.

　実施例１のばね端子は、コイルばね１０と台座２０とからなり、電子部品などを搭載する基板にリフロー実装可能な部品である。ここで、リフローとは、はんだペーストを塗布した基板上に部品であるばね端子を載せてはんだ接合することである。 The spring terminal according to the first embodiment includes the coil spring 10 and the pedestal 20, and is a component that can be reflow mounted on a board on which electronic components are mounted. Here, the reflow means that a spring terminal as a component is placed on a substrate coated with a solder paste and soldered.

　コイルばね１０は、導電性を有し、ピアノ線、ベリリウム銅、ステンレス等の線材で形成されている。コイルばね１０は、テーパ状即ち円錐状に形成され且つ疎巻きされたばねからなる円錐コイル部１１（本発明の疎巻き部）と、円錐コイル部１１よりも小径で円筒状をなし、密着巻きされたばねからなる収縮性のない密着巻き部１２とからなる。 The coil spring 10 has conductivity and is formed of a wire such as piano wire, beryllium copper, or stainless steel. The coil spring 10 has a conical coil portion 11 (sparsely wound portion of the present invention) formed of a taper-like or conical spring and a loosely wound spring, and has a cylindrical shape with a smaller diameter than the conical coil portion 11 and is tightly wound. It consists of the contact | adherence winding part 12 which does not have a contractibility which consists of a spring.

　台座２０は、導電性を有し、黄銅、リン青銅、ベリリウム銅、ステンレス等の板金製で形成されている。コイルばね１０、台座２０は、錫メッキ等を施しても良い。台座２０は、平坦部２０ａと、この平坦部２０ａに対して略直角に折り曲げられた曲部２０ｂとを有し、平坦部２０ａの略中央部分には円筒状の凹部２１が形成されている。この凹部２１には、コイルばね１０の密着巻き部１２が押し込まれるように構成されている。 The pedestal 20 has conductivity and is made of a sheet metal such as brass, phosphor bronze, beryllium copper, stainless steel or the like. The coil spring 10 and the pedestal 20 may be plated with tin. The pedestal 20 has a flat portion 20a and a bent portion 20b bent at a substantially right angle with respect to the flat portion 20a. A cylindrical recess 21 is formed at a substantially central portion of the flat portion 20a. The tightly wound portion 12 of the coil spring 10 is pushed into the recess 21.

　凹部２１の底面の上面には、ばね端子を基板に実装するために、吸着ノズル４０により吸着するためのノズル吸着面２３が設けられている。 A nozzle suction surface 23 for suction by the suction nozzle 40 is provided on the upper surface of the bottom surface of the recess 21 to mount the spring terminal on the substrate.

　台座２０の曲部２０ｂの先端部分は、曲部２０ｂに対してさらに略直角に折り曲げられて水平な平板になっており、この水平な平板には、基板に、はんだを接合するためのはんだ接合部２４が設けられている。 The tip of the bent portion 20b of the pedestal 20 is further bent at a substantially right angle with respect to the bent portion 20b to form a horizontal flat plate, and this horizontal flat plate has a solder joint for bonding solder to the substrate. A portion 24 is provided.

　また、台座２０に形成された円筒状の凹部２１の外周面で且つ凹部２１の深さ方向の中間位置には複数箇所に、密着巻き部１２を台座２０の凹部２１に固定させるためのコイル固定爪部２２が形成されている。 Further, a coil fixing for fixing the tightly wound portion 12 to the concave portion 21 of the pedestal 20 at a plurality of locations on the outer peripheral surface of the cylindrical concave portion 21 formed in the pedestal 20 and at intermediate positions in the depth direction of the concave portion 21 A claw portion 22 is formed.

　また、台座２０には、コイルばね１０を台座２０の凹部２１に誘い込むためのコイルばね誘い込み部２５が形成されている。このコイルばね誘い込み部２５は、平坦部２０ａと円筒状の凹部２１との連結部分に円錐状のテーパが形成されてなる。 Further, the pedestal 20 is formed with a coil spring guiding portion 25 for guiding the coil spring 10 into the concave portion 21 of the pedestal 20. The coil spring guide portion 25 has a conical taper formed at the connecting portion between the flat portion 20 a and the cylindrical recess 21.

　また、図６に示すように、台座２０の凹部２１の底面の下面にはズレ対策接着部２６が形成されている。ズレ対策接着部２６は、基板上に塗布された接着剤と接着され、ばね端子を基板に実装したときに台座２０が基板に固定されるようになっている。 Further, as shown in FIG. 6, an anti-displacement adhesion portion 26 is formed on the bottom surface of the bottom surface of the recess 21 of the pedestal 20. The misalignment countermeasure adhesive portion 26 is bonded to an adhesive applied on the substrate, and the pedestal 20 is fixed to the substrate when the spring terminal is mounted on the substrate.

　このように構成された実施例１に係るばね端子によれば、図３に示すように、コイルばね１０に形成された収縮性のない密着巻き部１２が円柱状押込み治具３０により押圧されると、密着巻き部１２が台座２０の凹部２１に押し込まれる。従って、ばね弾性に影響する疎巻き部を押圧しないため、コイルばね１０を台座に取り付け後にコイルばね１０の高さがばらつくことなく、指定高さ時の荷重もばらつかない。また、コイルばね１０の信頼性を向上することができる。 According to the spring terminal according to the first embodiment configured as described above, as shown in FIG. 3, the non-shrinkable tightly wound portion 12 formed on the coil spring 10 is pressed by the cylindrical pressing jig 30. Then, the tightly wound portion 12 is pushed into the concave portion 21 of the base 20. Therefore, since the sparsely wound portion that affects the spring elasticity is not pressed, the height of the coil spring 10 does not vary after the coil spring 10 is attached to the base, and the load at the specified height does not vary. Further, the reliability of the coil spring 10 can be improved.

　また、凹部２１の外周面にはコイルばね１０を凹部２１に固定させるためのコイル固定爪部２２が形成されているので、密着巻き部１２が凹部２１に押し込まれると、密着巻き部１２の巻線間にコイル固定爪部２２が引っ掛かり、密着巻き部１２が凹部２１に確実に固定できる。 Further, since the coil fixing claw portion 22 for fixing the coil spring 10 to the concave portion 21 is formed on the outer peripheral surface of the concave portion 21, when the tight winding portion 12 is pushed into the concave portion 21, the winding of the tight winding portion 12 is performed. The coil fixing claw portion 22 is caught between the wires, and the tightly wound portion 12 can be reliably fixed to the concave portion 21.

　また、台座２０には、はんだを基板に接合するためのはんだ接合部２４が設けられているので、はんだ接合部２４にはんだが接合されて、基板にリフローではんだを接合することができる。 Further, since the pedestal 20 is provided with the solder joint portion 24 for joining the solder to the substrate, the solder can be joined to the solder joint portion 24 and the solder can be joined to the substrate by reflow.

　また、台座２０には、コイルばね１０を凹部２１に誘い込むために、台座２０の平坦部２０ａと凹部２１との連結部分に円錐状のテーパが形成されてなるコイルばね誘い込み部２５を設けたので、コイルばね１０の外径でコイルばね１０を凹部２１に誘い込むため、コイルばね１０の組み立て時に容易に位置決めが行える。 In addition, the pedestal 20 is provided with a coil spring guiding portion 25 in which a conical taper is formed at a connecting portion between the flat portion 20a of the pedestal 20 and the concave portion 21 in order to guide the coil spring 10 into the concave portion 21. Since the coil spring 10 is drawn into the recess 21 with the outer diameter of the coil spring 10, the positioning can be easily performed when the coil spring 10 is assembled.

　また、凹部２１の底面の下面には、基板上に塗布された接着剤と接着され台座２０を基板に固定するためのズレ対策接着部２６が形成されているので、ばね端子を基板に実装した後、リフロー時にばね端子を基板に固定するのが困難である場合には、ズレ対策接着部２６が基板上に塗布された接着剤と接着され台座２０を基板に固定することができる。 In addition, since the bottom surface of the concave portion 21 is formed with an anti-displacement bonding portion 26 for fixing the pedestal 20 to the substrate by being bonded to the adhesive applied on the substrate, the spring terminal is mounted on the substrate. Later, when it is difficult to fix the spring terminal to the substrate at the time of reflow, the anti-displacement bonding portion 26 is bonded to the adhesive applied on the substrate, and the base 20 can be fixed to the substrate.

　また、凹部２１の底面の上面にはノズル吸着面２３が設けられているので、自動機により容易にばね端子を基板に実装でき、ばね端子をリフロー用リール梱包部品とすることができる。 Also, since the nozzle suction surface 23 is provided on the upper surface of the bottom surface of the recess 21, the spring terminal can be easily mounted on the substrate by an automatic machine, and the spring terminal can be used as a reflow reel packaging component.

（実施例２）
　図７は、本発明の実施例２に係るばね端子の概略構成図である。図８は、本発明の実施例２に係るばね端子のはんだ接合部の構成を示す図である。実施例１に係るばね端子は、台座２０が平坦部２０ａと、曲部２０ｂと、はんだ接合部２４を有して構成されたが、実施例２のばね端子は、台座２０Ａが平坦部のみで構成されることを特徴とする。図７に示す平坦部の構成は、実施例１の平坦部２０ａの構成と同じであり、平坦部には、図示していないが、凹部２１、コイル固定爪部２２、ノズル吸着面２３、コイルばね誘い込み部２５が形成されている。 (Example 2)
FIG. 7 is a schematic configuration diagram of a spring terminal according to the second embodiment of the present invention. FIG. 8 is a diagram illustrating the configuration of the solder joint portion of the spring terminal according to the second embodiment of the present invention. The spring terminal according to the first embodiment is configured such that the pedestal 20 includes the flat portion 20a, the curved portion 20b, and the solder joint portion 24. However, the spring terminal according to the second embodiment includes only the flat portion of the pedestal 20A. It is characterized by being configured. The configuration of the flat portion shown in FIG. 7 is the same as the configuration of the flat portion 20a of the first embodiment. Although not shown, the flat portion has a recess 21, a coil fixing claw portion 22, a nozzle suction surface 23, and a coil. A spring lead-in portion 25 is formed.

　また、図８に示すように、台座２０Ａの凹部２１の底面の下面には、はんだを基板に接合するためのはんだ接合部２７が設けられている。 Further, as shown in FIG. 8, a solder joint portion 27 for joining the solder to the substrate is provided on the lower surface of the bottom surface of the recess 21 of the base 20A.

　このように構成された実施例２に係るばね端子によれば、台座２０Ａから曲部２０ｂとはんだ接合部２４を削除し、台座２０Ａが平坦部のみで構成されているので、材料費を削減できる。従って、低コストで基板にリフロー実装可能なばね端子を提供できる。 According to the spring terminal according to the second embodiment configured as described above, the curved portion 20b and the solder joint portion 24 are deleted from the pedestal 20A, and the pedestal 20A is configured only by the flat portion, so that the material cost can be reduced. . Therefore, it is possible to provide a spring terminal that can be reflow-mounted on a substrate at a low cost.

　台座２０Ａの凹部２１の底面の下面には、実施例１のズレ対策接着部２６の代わりに、はんだ接合部２７が設けられる。また、ばね端子の基板上の実装面積を小さくすることができる。 A solder joint portion 27 is provided on the lower surface of the bottom surface of the recess 21 of the pedestal 20A in place of the misalignment countermeasure adhesion portion 26 of the first embodiment. In addition, the mounting area of the spring terminal on the substrate can be reduced.

　なお、本発明は、実施例１及び実施例２に係るばね端子に限定されるものではない。実施例１及び実施例２に係るばね端子では、コイル固定爪部２２が密着巻き部１２の巻線間に引っ掛かるとしているが、例えば、コイル固定爪部２２で密着巻き部１２を凹部２１の外周面に押し付けて固定するようにしても良い。 In addition, this invention is not limited to the spring terminal which concerns on Example 1 and Example 2. FIG. In the spring terminals according to the first and second embodiments, the coil fixing claw portion 22 is caught between the windings of the tight winding portion 12. You may make it fix by pressing on a surface.

Claims (5)

　導電性のコイルばねと、吸着ノズルにより吸着するためのノズル吸着面を有する台座とを有し、
　前記コイルばねは、テーパ状に形成され且つ疎巻きされた疎巻き部と、
　前記疎巻き部よりも小さい径で密着巻きされた密着巻き部とを有し、
　前記台座には、前記コイルばねの前記密着巻き部を押し込むための凹部が形成されているばね端子。 A conductive coil spring and a pedestal having a nozzle suction surface for suction by the suction nozzle;
The coil spring is formed in a tapered shape and is loosely wound,
A tightly wound portion wound tightly with a smaller diameter than the loosely wound portion,
A spring terminal in which a concave portion is formed on the pedestal to push in the tightly wound portion of the coil spring. 　前記台座に形成された凹部の外周面には前記コイルばねを前記凹部に固定させるためのコイル固定爪部が形成されている請求項１記載のばね端子。 The spring terminal according to claim 1, wherein a coil fixing claw portion for fixing the coil spring to the concave portion is formed on an outer peripheral surface of the concave portion formed in the pedestal. 　前記台座には、はんだを基板に接合するためのはんだ接合部が設けられている請求項１又は請求項２記載のばね端子。 3. The spring terminal according to claim 1 or 2, wherein the pedestal is provided with a solder joint for joining the solder to the substrate. 　前記台座には、前記コイルばねを前記凹部に誘い込むために、前記台座の平坦部と前記凹部との連結部分にテーパが形成されてなるコイルばね誘い込み部が設けられている請求項１又は請求項２記載のばね端子。 The coil spring guide part formed by the taper being formed in the connection part of the flat part of the said base and the said recessed part is provided in the said base in order to guide the said coil spring to the said recessed part. 2. The spring terminal according to 2. 　前記凹部の底面の下面には、接着剤を塗布して前記台座を基板に固定するためのズレ対策接着部が形成されている請求項１又は請求項２記載のばね端子。 3. The spring terminal according to claim 1 or 2, wherein an anti-displacement adhesion portion for applying an adhesive to fix the pedestal to the substrate is formed on the lower surface of the bottom surface of the recess.
PCT/JP2013/065439 2012-07-10 2013-06-04 Spring terminal Ceased WO2014010334A1 (en)

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