Classifications

• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
  • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
  • B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
  • B23K37/00—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass
  • B23K37/06—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass for positioning the molten material, e.g. confining it to a desired area
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
  • B23K2101/00—Articles made by soldering, welding or cutting
  • B23K2101/36—Electric or electronic devices
  • B23K2101/38—Conductors
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
  • B23K2101/00—Articles made by soldering, welding or cutting
  • B23K2101/36—Electric or electronic devices
  • B23K2101/40—Semiconductor devices

Definitions

• the present invention relates to the area of ultrasonic welding.
• the present invention relates to the area of ultrasonic welding of components in power electronic modules.
• Ultrasonic welding is used in general for joining two workpieces, which comprise a contact surface for contacting the respective other workpiece. At least the contact surface is made of plastics, metal or any other material suitable for ultrasonic welding.
• the welding tool for performing the ultrasonic welding process comprises a sonotrode, which is brought into contact with one of the workpieces, i.e. a first workpiece. The sonotrode introduces ultrasonic vibration into the first workpiece, so that the contact surface of the first workpiece is moved with high frequency over the contact surface of the other workpiece, i.e. a second workpiece, and heat is generated in a welding region at the contact surfaces of the two workpieces creating an ultrasonic welding joint.
• Ultrasonic welding is for example used in state-of-the-art power
• the electrical terminal is the first workpiece, and the substrate is the second workpiece.
• each single semiconductor has a maximum voltage and current
• the power semiconductors are frequently combined in parallel and/or in series within the power semiconductor modules to enable the use in high power applications.
• the power semiconductors are frequently combined in parallel and/or in series within the power semiconductor modules to enable the use in high power applications.
• they commonly comprise multiple substrates, on which the power semiconductors are mounted.
• the substrates are provided with contacts for emitter, collector and base, so that the substrates can easily be connected within the power semiconductor modules.
• the substrates are typically mounted on a common base plate, which can be part of a housing of the power semiconductor module or which can be held within a housing of the power semiconductor module.
• a common base plate which can be part of a housing of the power semiconductor module or which can be held within a housing of the power semiconductor module.
• power semiconductor modules typically four or six substrates are combined, each provided with four to six power semiconductors
• IGBT insulated gate bipolar transistors
• RC-IGBT reverse conducting insulated gate bipolar transistors
• a substrate can comprise four IGBTs and two power diodes.
• the substrates are electrically connected to terminals, which provide a connection of the metallizations within the module.
• the electric terminals can be connected to electric contacts of the power module.
• the electrical terminal is placed onto the metallization of the substrate and ultrasonic welded onto the metallization with the welding tool.
• the sonotrode of the welding tool is brought into contact with the electrical terminal, so that ultrasonic vibrations are introduced into it.
• the ultrasonic energy locally heats the material of the electrical terminal and/or the metallization at its contact surface creating an ultrasonic welding joint.
• These particles consist of the material of the first and/or the second workpiece and can originate from the welding region as well as from a contact region between the first workpiece and the sonotrode.
• the area of deposition can have a radius of up to several centimeters around the welding region.
• the welding tool frequently cleans itself using ultrasonic vibrations, which results in more particles being ejected from and/or dropped off the welding tool.
• These particles can be deposited on the workpieces or other parts, where they can cause different problems, as explained further below. Therefore, depositing of particles out of the welding region during the ultrasonic welding process has to be avoided.
• Particles deposited onto semiconductors, substrates, or any place within the power semiconductor module can act as sources for partial discharge and electrical insulation breakdown during operation at high voltages, if they are not completely removed. If an electrical voltage is applied during the operation of the power
• a particle can lead to an electrical shortcut, an insulation breakdown or partial discharge, especially when a particle is located in an unfavorable position, e.g. where an electrical field is present during the operation of the power semiconductor module.
• an electrical shortcut e.g. an insulation breakdown or partial discharge
• this can cause problems.
• the present invention provides an ultrasonic welding device for welding a first workpiece onto a second workpiece comprising an ultrasonic welding tool with a sonotrode for contacting the first workpiece, a confinement structure attached or attachable to the ultrasonic welding tool, whereby the confinement structure is arranged and attached or attachable to the ultrasonic welding tool to surround a welding region, in particular where the first workpiece is welded onto the second workpiece.
• the present invention also provides a method for ultrasonic welding a first workpiece to a second workpiece, comprising welding the first workpiece to the second workpiece using the ultrasonic welding device.
• the basic idea of the invention is to control and/or minimize the deposition of particles on the workpieces or other components to which belong the workpieces.
• the use of the confinement structure around the welding region can trap particles as soon as they are ejected from the welding region. Regions out of the confinement structure are shielded from the particles. Especially hot and fast particles can be trapped by the confinement structure, since fast particles usually have a shallow ejection angle compared to contact surfaces of the workpieces. Accordingly, problems usually caused by these particles are reduced or overcome.
• the confinement structure can be brought in place at the time the two workpieces are welded together.
• the confinement structure may be provided to fully surround the welding region, e.g. in cases where the welding region is located in a central area of the contact surface of the second workpiece, or the confinement structure may be provided to merely surround the welding region partially, e.g. when the welding region is located in a corner of the contact surface of the second workpiece and only the contact surface of this second workpiece has to be protected from depositing particles thereon.
• the confinement structure is arranged to surround also a contact region where the sonotrode contacts the first workpiece, so that also particles originating from this area can be trapped.
• the confinement structure is uncoupled from the ultrasonic welding tool, in particular from the sonotrode, so that ultrasonic vibrations are not introduced into the confinement structure and/or the oscillation of the ultrasonic welding tool is not affected by the confinement structure.
• the confinement structure can reliably trap the particles without danger of damaging the workpieces.
• the confinement structure can comprise any suitable material, e.g. metal, plastic, silicone, paper, cardboard, or other organic material.
• the confinement structure can have any suitable cross section, e.g. a rectangular, cylindrical, conical, or funnel-shaped cross section.
• the ultrasonic welding device can be used for welding a single first workpiece onto the second workpiece, or multiple first workpieces simultaneously onto the second workpiece.
• the welding tool can have a single sonotrode for contacting multiple first workpieces, or multiple sonotrodes for individually contacting the first workpieces.
• the ultrasonic welding device can have a single confinement structure to commonly surround the welding regions where the first workpieces are welded onto the second workpiece, or multiple
• the structure is moveable in an axial direction longitudinal and relative to the ultrasonic welding tool, in particular in axial direction from the first workpiece to the second workpiece.
• This direction refers typically to a direction vertical to the contact surface of the two workpieces. Therefore, the placement of the sonotrode for contacting the first workpiece can be separated from the placement of the confinement structure to surround the welding region.
• the structure is moveable to form a surface contact with the second workpiece. Since the welding region is on top of the second workpiece, the surface contact of the confinement structure can reliably trap particles originating from this region.
• the confinement structure comprises a tubular body.
• the tubular body can have any suitable shape.
• the tubular body can be easily provided, e.g. by cutting from a tube. With its closed structure, it can prevent particles from leaving the region inside the confinement structure.
• the tubular body is provided to extend along the sonotrode and surrounding the sonotrode.
• the tubular body has a wall thickness of less than 1 mm, preferably less than 0.1 mm.
• a thin wall facilitates the positioning of the ultrasonic welding device and in particular the positioning of the confinement structure.
• the structure comprises a curtain structure.
• the curtain can adapt to different shapes of the workpieces, so that the workpieces can be reliably
• the curtain structure is made of a soft material, which further facilitates adaptation to the workpieces. Furthermore, damages of the workpieces can be avoided.
• the curtain structure comprises individual curtain elements. Further preferred, the curtain elements overlap to reduce the risk of particles escaping from inside the confinement structure.
• the structure comprises a brush structure.
• the brush structure can be easily provided and can reliably trap particles during the welding process.
• the brush structure comprises individual bristles, which together form the brush structure.
• the bristles are arranged in multiple layers to reduce the risk of particles escaping from inside the confinement structure.
• bristles of the brush structure are made of a flexible material, in particular a flexible plastic or silicone.
• the flexible material can adapt to the shape of the workpieces to reliably trap particles within the confinement structure.
• the flexible material can adapt to height differences of the second workpiece.
• the risk of damaging the workpieces or any other component in or around the welding region is reduced.
• the risk of scratching the workpieces is reduced.
• the risk of deforming wire bonds already provided on the substrate e.g. for connection of a metallization of the substrate to a contact pad of a semiconductor, is reduced.
• the confinement structure comprises an anti-static material.
• the antistatic material is preferably provided at an interior side of the confinement structure. Further preferred, the confinement structure is covered by the antistatic material. Still further preferred, the confinement structure is made of the antistatic material.
• the antistatic material reduces or avoids static charge of the workpieces, so that particles do not stick thereto. Therefore, the particles can easily be removed if deposited thereon.
• the confinement structure comprises a sticky material.
• the sticky material is preferably provided at an interior side of the confinement structure. Further preferred, the confinement structure is covered by the sticky material. Still further preferred, the confinement structure is made of the sticky material.
• Particles generated during the ultrasonic welding process can stick to the sticky material of the confinement structure and can be automatically removed after the ultrasonic welding process.
• welding device comprises a pump for extracting air from an area
• the pump preferably applies a vacuum or an underpressure to the area surrounded by the confinement structure to remove particles torn off during the ultrasonic welding process.
• the pump can also be used for a cleaning process after finishing the ultrasonic welding process, either by suction or blowing away particles, in particular from the two workpieces.
• the cleaning step comprises the additional step of cleaning particles from the workpieces.
• the cleaning step is performed in an area surrounded by the confinement structure during the welding process, since particles are supposed to be trapped in this area.
• the cleaning step can be applied entirely to the workpieces. Cleaning can comprise cleaning using an air blast, an ultrasonic bath, a dish washer or others.
• the confinement structure can be cleaned when attached to the welding tool.
• the confinement structure is attachable to the welding tool and can be removed for cleaning purposes.
• different steps can be applied for cleaning, including washing.
• the confinement structure can be cleaned in an ultrasonic bath, e.g. with ethanol or de-ionized water.
• Fig. 1 shows a sectional view of a ultrasonic welding device
• FIG. 2 shows a frontal view of a ultrasonic welding device accord to a second embodiment
• Fig. 3 shows a detailed bottom view of a sonotrode and a brush structure of the ultrasonic welding device according to the second embodiment
• Fig. 4 shows a lateral view of a sonotrode and a confinement
• Fig. 1 shows an ultrasonic welding device 1 for welding two workpieces 2, 3 together according to a first embodiment.
• the ultrasonic welding device 1 comprises in this embodiment an ultrasonic welding tool 4, from which Fig. 1 only shows a sonotrode 5.
• the ultrasonic welding device 1 in this embodiment is used for welding an electrical terminal 2 as first workpiece onto a ceramic substrate 3 as second workpiece.
• the electrical terminal 2 is welded onto a metallization of the substrate 3.
• the ultrasonic welding device 1 further comprises a confinement structure 6, which is attached to the sonotrode 5, as indicated in Fig. 1.
• the confinement structure 6 is provided in this embodiment as a tubular body made of a sticky and antistatic plastic.
• the tubular body 6 has a
• the tubular body 6 has a wall thickness of approximately 0.1 mm, and a gap 7 is provided between the confinement structure 6 and the electrical terminal 2 with a width of approximately 0.5 mm.
• the ultrasonic welding device 1 further comprises a pump for extracting air from an area surrounded by the confinement structure 6.
• the pump is not shown in Fig. 1.
• the electrical terminal 2 is located on the substrate 3. Contact surfaces of the two workpieces 2, 3 are contacted to each other to form a welding region 8.
• the ultrasonic welding device 1 is moved towards the electrical terminal 2 from the top, so that the sonotrode 5 contacts a top surface 9 of the electrical terminal 2. Since the confinement structure 6 is attached to the sonotrode 5, it is moved towards the substrate 3 to surround the welding region 8 and a contact region 10 where the sonotrode 5 contacts the electrical terminal 2.
• the particles 1 1 are trapped by the confinement structure 6 and can be partially removed during the welding process by the pump, which extracts air from the area surrounded by the confinement structure 6. Partially, the particles 1 1 stick to the confinement structure 6.
• the ultrasonic welding device 1 is moved away from the electrical terminal 2. Particles 1 1 remaining on the workpieces 2, 3 are removed by a cleaning step, e.g. using an air blast, an ultrasonic bath or a dish washer.
• washing step includes an ultrasonic bath, e.g. with ethanol or de-ionized water.
• Figs. 2 and 3 refer to an ultrasonic welding device 1 according to a second embodiment.
• the ultrasonic welding device 1 is similar to the ultrasonic welding device 1 of the first embodiment, so that only differences between the ultrasonic welding devices 1 are explained. Also the welding method using the ultrasonic welding device 1 of the second embodiment can be performed as described with reference to the ultrasonic welding device 1 of the first embodiment.
• the ultrasonic welding device 1 of the second embodiment comprises a confinement structure 20 with a brush structure 21 formed by individual bristles 22
• the confinement structure 20 has a circular cross section in this
• the bristles 22 in this embodiment are made of a flexible, sticky and antistatic silicone.
• the bristles 22 are arranged in two layers forming a closed brush structure 21 for trapping particles 1 1 therein.
• the confinement structure 20 is in a way not shown in the figures moveable in an axial direction from the electrical terminal 2 to the substrate 3 relative to the ultrasonic welding tool 4, in particular relative to the sonotrode 5, which is surrounded by the confinement structure 20. Thereby, the confinement structure 20 is moveable to form a surface contact with the substrate 3.
• Fig. 4 shows an ultrasonic welding device 1 according to a third
• the ultrasonic welding device 1 is similar to the ultrasonic welding device 1 of the second embodiment. It only differs from the ultrasonic welding device 1 of the second embodiment in the design of the sonotrode 5, which is provided as a bending oscillator in this embodiment.

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• Engineering & Computer Science (AREA)
• Mechanical Engineering (AREA)
• Physics & Mathematics (AREA)
• Optics & Photonics (AREA)
• Lining Or Joining Of Plastics Or The Like (AREA)

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Cited By (5)

Citations (3)

• 2013
  • 2013-05-21 WO PCT/EP2013/060355 patent/WO2014000975A1/fr not_active Ceased

Patent Citations (3)

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