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WO2014095066A1 - Procédé de montage d'un module à diode laser - Google Patents

Procédé de montage d'un module à diode laser Download PDF

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Publication number
WO2014095066A1
WO2014095066A1 PCT/EP2013/003857 EP2013003857W WO2014095066A1 WO 2014095066 A1 WO2014095066 A1 WO 2014095066A1 EP 2013003857 W EP2013003857 W EP 2013003857W WO 2014095066 A1 WO2014095066 A1 WO 2014095066A1
Authority
WO
WIPO (PCT)
Prior art keywords
heat sink
joining
laser diode
diode element
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2013/003857
Other languages
German (de)
English (en)
Inventor
Dalibor Dadic
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Jenoptik Optical Systems GmbH
Original Assignee
Jenoptik Laser GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jenoptik Laser GmbH filed Critical Jenoptik Laser GmbH
Publication of WO2014095066A1 publication Critical patent/WO2014095066A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0235—Method for mounting laser chips
    • H01S5/02355—Fixing laser chips on mounts
    • H01S5/0236—Fixing laser chips on mounts using an adhesive
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0235—Method for mounting laser chips
    • H01S5/02355—Fixing laser chips on mounts
    • H01S5/02365—Fixing laser chips on mounts by clamping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/024—Arrangements for thermal management
    • H01S5/02469—Passive cooling, e.g. where heat is removed by the housing as a whole or by a heat pipe without any active cooling element like a TEC
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/024—Arrangements for thermal management
    • H01S5/02476—Heat spreaders, i.e. improving heat flow between laser chip and heat dissipating elements
    • H01S5/02492—CuW heat spreaders
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
    • H01S5/4031—Edge-emitting structures

Definitions

  • the present invention relates to a method for producing a diode laser module with a laser diode element and two heat sinks, with which the waste heat of the laser diode can be dissipated on both sides according to the preamble of claim 1, as well as a diode laser module produced by this method.
  • a diode laser module which contains a laser diode, which is connected on both sides with a respective heat spreader.
  • Heat spreader is connected in each case a heat sink.
  • the heat sinks are electrically connected to one side of the laser diode. During operation of the diode laser module, a voltage difference occurs between the two heat sinks. Therefore, a short circuit between the two heatsinks should be avoided.
  • the heat sinks are therefore connected to each other according to DE 102010042087 A1 by means of an electrically insulating adhesive.
  • Such diode laser modules are provided with a reusable clamping device during assembly, which compresses the heat sinks during the curing of the adhesive.
  • the curing of the adhesive is preferably carried out in an oven or on a hot plate.
  • Clamping devices are required, which are each occupied for the duration of curing of the adhesive. Since the reusable clamping devices take up a lot of space, an optimal use of, for example, a furnace volume for adhesive curing is not possible. These devices must also be removed after gluing the heat sink again and cleaned. For this purpose, further handling steps are to be performed with the diode laser modules. If, for example, a container is used to hold a plurality of diode laser modules in which the half-finished diode laser modules are inserted during the curing of the adhesive, the diode laser modules for removing the clamping device must be removed individually after the adhesive has cured. The removal of the clamping devices is therefore a hindrance, especially in mass production.
  • Adhesive layer bonded together. This arrangement is for components of the
  • CONFIRMATION COPY required strength and stability for diode laser modules.
  • the metallic spring clip requires an electrical insulation layer that could easily be damaged during assembly.
  • a spring clip made of plastic would not be sufficient because the clamping force is too low.
  • Laser diode is thermally and electrically contacted with a clamping device.
  • the clamping force is generated by means of screws.
  • the connection is force-fitting, gluing both heatsink is not provided. But screwed connections have several disadvantages. On the one hand holes in the heat sinks are required, the
  • the object of the invention is to provide a simple and reliable method for constructing such diode laser modules with double-sided cooling, in which two heat sinks are used, between which an electrical voltage difference occurs during operation of the diode laser module.
  • the heatsink should be with an electrically insulating
  • Joining means are interconnected.
  • a cost-effective method is to be used, which can be realized with a small amount of time.
  • the process must be reproducible and allow easy quality control of the finished parts.
  • the method should be suitable for mounting air-cooled diode laser modules.
  • the object is achieved by the use of at least one electrically insulating spring element which presses the heat sinks against one another during the joining process.
  • the spring element exerts only a weak clamping force.
  • the clamping force is increased by the shrinkage of the joining agent during curing.
  • the spring element may remain on the diode laser module after mounting because it does not hinder the operation of the module.
  • the method for mounting a diode laser module comprises the following steps:
  • Joining surface of the first joining surface comes to lie at least partially opposite to a predetermined minimum distance from the electrical insulation and the electrically insulating joining means at least partially wets the distance between the cooling bodies both joining surfaces,
  • the laser diode element is disposed between the first and the second heat sink and the p-side pad of the laser diode element is thermally connected to the first heat sink and the n-side pad of the
  • Laser diode element is thermally connected to the second heat sink.
  • a method according to the invention is characterized in that at least one electrically insulating spring element is attached to the first and second heat sink prior to the solidification of the joining means such that the heat sinks are fixed to one another by a clamping force.
  • a laser diode element which has a p-side and an n-side connection surface is brought between a first heat sink and a second heat sink.
  • the first heat sink and the second heat sink may be identical or mirror-symmetrical. Alternatively, it may also be advantageous to use asymmetric embodiments in which the first and second heat sinks are different in size.
  • the laser diode element may, for example, be a diode laser beam.
  • Diode laser bar is a semiconductor chip having a number of parallel arranged
  • Broadband emitters may contain. Typically, the width of the chip about 10mm, the length 1 mm to 6 mm and the height 0.05 mm to 0.2 mm.
  • the diode laser bar is electrically contacted on a p-side and an n-side contact surface.
  • Contact surfaces are the two largest surfaces of the semiconductor chip, which are arranged opposite one another.
  • the laser diode element may also be a laser diode unit which comprises a first heat spreader electrically and thermally connected to the p side of a laser bar and / or a second heat spreader electrically and thermally connected to the n side of the laser bar.
  • the first and / or the second heat spreader may have a heat transfer section that extends beyond the region of the joint between the laser bar and the heat spreader.
  • the first and the second heat spreader can with each other with an electrically insulating joining means be connected.
  • the heat spreaders should have a high thermal conductivity. In a preferred embodiment, they may for example consist of copper or of a metal-diamond composite material. For some applications, an expansion-adapted material such as tungsten-copper or molybdenum-copper is preferable. For example, burrs for improving the electrical contact with the heat sinks may be present at the edges of the heat spreaders.
  • the heatsink can be designed as air cooling body. For this purpose, they advantageously have cooling fins, which may be smooth or wavy. Heat sink from a
  • the heat sink can also have channels through which they are cooled with a liquid or a gaseous cooling medium.
  • Such heat sink can be made for example of copper.
  • Heat sink has a first joining surface and the second heat sink has a second joining surface.
  • the first and / or the second joining surface may be formed as a continuous surface or consist of several non-contiguous partial surfaces.
  • an electrically insulating joining agent can be applied before joining the two heat sink.
  • the two heat sinks are assembled with the laser diode element which is arranged between the two heat sinks.
  • a heat conducting means can advantageously be introduced between the n-side connection surface of the laser diode element and the corresponding contact surface of the first heat sink, as well as between the p-side connection surface of the laser diode element and the corresponding contact surface of the second heat sink. This serves to improve the thermal connection.
  • Thermal conduction can be formed, for example, as a metal foil, for example of tin, lead, indium, cadmium or an alloy of two or more of these metals.
  • a heat-conducting foil for example a carbon foil.
  • such a heat conduction agent can also be formed as a metallic coating, for example of tin, lead, indium, cadmium or gold, which is at least on
  • Such a coating may additionally or alternatively be applied to the n-side and / or the p-side contact surface of the laser diode element.
  • a heat conducting means can also be a further joining means, for example a thermal adhesive. If the contact surfaces and contact surfaces are made sufficiently flat, can also be dispensed with a heat conduction.
  • the first heat sink may have a first receiving groove with a bottom and two side walls
  • the second heat sink may have a second groove opposite the first groove Receiving groove having a bottom and two side walls.
  • the laser diode element may be incorporated in the first and second receiving grooves.
  • the first and second joining surfaces come to lie opposite each other and the joining means now bridges the distance between the first and the second joining surface and thereby wets both joining surfaces.
  • the wetting of the joining surfaces does not have to take place over the entire surface, but the joining agent can also be easily underdosed, so that not the entire first and second joining surfaces are wetted over the entire surface.
  • a certain minimum distance between the first heat sink and the second heat sink is required.
  • the heat sinks are formed so that the distance to each other outside the joints is greater than between the first and the second joining surface.
  • the distance of the first to the second joining surface then represents this minimum distance. This distance can be determined by the laser diode element, this then has the function of a spacer due to its fixed thickness. The distance of the first to the second joining surface can therefore be advantageous by the
  • Laser diode element itself be set.
  • further spacers made of an electrically insulating material as a spacer between the heat sinks may be introduced.
  • At least one electrically insulating spring element is attached to the first and second heat sink, which fixes the heat sink to each other.
  • the spring element may preferably consist of a plastic.
  • the spring element Under electrically insulating is understood here that no current or a negligible current during operation of the laser diode element flows through the spring element.
  • a low electrical conductivity of the spring element may even be advantageous in order to avoid electrostatic charging of the heat sink during the manufacturing process.
  • the electrical resistance of the spring element should preferably be greater than 50 ohms, advantageously values between 100 ohms and 10 k ohms. This can be achieved for example by plastics which have been equipped by additives with a low electrical conductivity. Alternatively, a coating of a spring element made of non-conductive plastic with a thin metallic layer would be possible to produce a defined low conductivity.
  • a current of 2 mA flows through the spring element.
  • the nominal current flowing through the laser bar is typically between 20A and 200A. Since the current flow through the spring element, for example, is less than one-thousandth of the laser current, it is irrelevant.
  • Non-conductive spring elements are also such Spring elements with low electrical conductivity also considered as electrically insulating in the context of the invention.
  • at least two spring elements can be used, but it can also be three or four or more.
  • the spring element may have an elastically stretchable central portion and on each side an end portion (first and second Ein Wegabites) for suspending the spring element in the starting points of the heat sink.
  • the elastically stretchable portion may serve the generation of the clamping force and the Ein Wegabête for suspending the spring element in provided starting points on the heat sinks.
  • the end portions may be resilient, so that the clamping force is applied at least partially through the end portions.
  • the central portion may be rigid.
  • the located between the heat sinks laser diode element is also fixed due to the suspension of the spring elements.
  • the method according to the invention can also be embodied such that the laser diode element is already connected to the first or the second heat sink before the first and second heat sinks are joined together (step e). This connection can be done for example by a soldering process or by gluing with an electrically and thermally conductive adhesive.
  • the spring elements represent only a mounting aid, so that the heat sink and the laser diode element can not slip during assembly. For the trouble-free operation of the diode laser module, a stronger fixation of the heat sink is necessary. After mounting the spring elements, the semi-finished diode laser modules are sufficiently stabilized for the further manufacturing process.
  • Clamping by the spring elements allows, for example, a restacking of the semi-finished diode laser modules before the curing of the joining agent.
  • the diode laser modules can be placed in a space-saving container so as to further treat them, for example, in this container in the oven.
  • the joining agent may, for example, be an adhesive, for example an acrylate adhesive or preferably an epoxy resin adhesive.
  • the joining agent can also be of an inorganic nature, for example a cement or a silicate-based joining agent.
  • known curing methods for adhesives are suitable, for example, curing at room temperature, curing at an elevated temperature or curing by light.
  • shrinkage of the joining agent during curing may occur. This increases the clamping force.
  • the distance between the first and the second heat sink is isolated by the electrically insulating joining means.
  • the first heat sink is in thermal contact with the laser diode element via the p-side pad.
  • the electrical contact can likewise be formed via this connection surface.
  • the second heat sink is in thermal contact with the laser diode element via the n-side pad.
  • the electrical contact can likewise be formed via this connection surface.
  • the p-side pad of the laser diode element may be electrically connected to the first heat sink, which is particularly advantageous.
  • Pad of the laser diode element may be electrically connected to the second heat sink, which is particularly advantageous.
  • the advantages of said electrical connection are that no electrical insulation between the pads of the laser diode element and the heat sinks is required, and that the contacting of the diode laser module can be done via the heat sink. In fact, an electrical insulation at this point could even disadvantageously hinder the heat transfer.
  • the spring elements according to the invention can remain on the finished diode laser module.
  • a single removal of the diode laser modules from the container for the purpose of removing the clamping device and reinserting the diode laser modules in this or another container can thus be dispensed with.
  • an electrical current is conducted through the laser diode element, wherein a voltage difference between the two heat sinks occurs. The operational readiness is thereby not impaired, since the spring elements are electrically insulating and thus do not cause a short circuit.
  • diode lasers with double-sided cooling can be constructed inexpensively and reliably in a high, easily controllable quality.
  • Figure 1 shows a first heat sink
  • FIG. 2 a first heat sink and a laser diode element
  • FIG. 3 a first heat sink, a laser diode element and a second heat sink
  • FIG. 5 shows a first heat sink, a laser diode element, a second heat sink after suspension of the spring elements Fig.6 a first heat sink in a second embodiment
  • FIGS. 1 to 5 A first exemplary embodiment of the method according to the invention is shown in FIGS. 1 to 5.
  • a laser diode element 10 having a p-side and an n-side pad is interposed between a first heat sink 20 and a second heat sink 30.
  • the heat sinks 20, 30 are designed as air cooling body. For this purpose they have cooling ribs 27 and consist of an aluminum alloy.
  • the first heat sink 20 and the second heat sink 30 are provided in the region of the first and the second contact surface 21, 31 with an indium layer, which serves as a heat conducting means 50.
  • a prefabricated laser diode element 10 is provided. This laser diode element consists of a laser bar 1 1, and a p-side and an n-side heat spreader 12, 13, which by means of a second electrically insulating
  • each heat spreader 12, 13 are formed over a larger area than the laser bar 1 1, so that they extend beyond the plane of the rear facet of the laser bar. This means that the heat spreaders are made longer than the resonator length of the laser bar. Thus, each heat spreader has a heat transfer section, which extends beyond the region of the joint between the laser bar and the heat spreader.
  • the laser diode element 10 is placed with the p-side contact surface on the first contact surface 21 of the first heat sink 20.
  • the indium layer subsequently ensures good heat transfer, which is required in the finished diode laser module.
  • Indium layer can also find another heat conducting use
  • thermal adhesive that can be used as a second joining agent before placing the
  • Laser diode element is applied to the contact surface.
  • the first contact surface is arranged in a receiving groove 24 which is formed by two side surfaces 25 and a bottom surface, which is simultaneously the contact surface 21.
  • the second heat sink is formed in the same way with a receiving groove 34 having side surfaces 35. These receiving grooves were introduced into the first and second heat sink, so that the distance of the first and second joining surface is less than the height of the laser diode element 10.
  • the laser diode element may have a height of 5 mm, while the distance of the
  • Joining surfaces i. the joint gap thickness should be only 0.5 mm.
  • the first and the second joining surfaces each consist of two partial surfaces 23a and 23b or 33a and 33b.
  • the first joint surface 23 (consisting of the sub-surfaces 23a and 23b) is provided with a bead of epoxy resin adhesive by applying a bead of adhesive on each of the two faces 23a and 23b of the first joint surface.
  • the second heat sink 30 is placed such that the second contact surface 31 comes to rest on the n-side contact surface 15 of the laser diode element (see Fig. 2, 3).
  • Indium layer on the second contact surface 31 ensures afterwards a good
  • Indium layer can also find another heat conducting use, For example, a thermal adhesive that is applied as a second joining means before placing the second heat sink on the contact surface 15 and / or the contact surface 31.
  • the two heat sinks are combined with the laser diode element 10, which is arranged between the two heat sinks, as shown in Fig. 2 and Fig.3.
  • the first 23 and second joining surface 33 come to lie opposite each other and the joining means 40 now bridges the distance between the first and the second joining surface and wets both joining surfaces.
  • the second heat sink 30 With placing the second heat sink 30 with its contact surface 31 on the n-side contact surface 15 of the laser diode element 10 so the second joining surface 33 takes its predetermined distance to the first joining surface 23 a. Since the glue bead is thicker than this distance, both are now
  • the heat sinks are designed so that they have the smallest distance from one another in the area of the joining surfaces. This distance is determined by the fact that the heat sink with their contact surfaces 21, 31 on the
  • the adhesive for example, in an oven at elevated temperature, for example at 60 ° C, cured.
  • the adhesive shrinks and generates a further clamping force which presses the contact surfaces of the laser diode element even more strongly against the contact surfaces of the heat sink.
  • This clamping force generated by the adhesive is considerably greater than the clamping force applied by the spring elements.
  • the spring elements remain on the diode laser module, although they no longer have any function, because the cured adhesive ensures the permanent fixation of the heat sink.
  • the operational readiness of the diode laser module is thereby not affected, since the spring elements are electrically insulating and thus do not cause a short circuit.
  • the inventive method can also be carried out such that the
  • Laser diode element is connected before the joining of the first and second heat sink with the first or the second heat sink. This connection can be done for example by a soldering process or by gluing with an electrically and thermally conductive adhesive.
  • the heat sink without receiving groove are executed.
  • the joining surface 23 and the contact surface 21 of the first heat sink 20 lie in one plane and can be formed as a continuous surface.
  • the second heat sink may be prepared in such a way that a heat conducting means 50, for example an indium layer, is applied to its contact surface 31.
  • a heat conducting means 50 for example an indium layer
  • the laser diode element is in this example a laser bar 1 1, which has a metallization on the p-side contact surface and on the n-side contact surface.
  • This laser bar is soldered with the p-side contact surface on the preloaded contact surface 21 of the first heat sink.
  • an indium-containing solder is suitable.
  • a spacer 70 is provided in the vicinity of the side remote from the laser diode element edge of the first heat sink, with which the distance of the first and second joining surface is maintained.
  • the first joining surface 23 is provided with a bead of a joining agent 40 (Fig. 7).
  • a joining agent a known epoxy resin adhesive is used here.
  • the second joining surface on the second heat sink could in principle also be provided with joining means.
  • the heat sinks are assembled so that the abutment surface 31 of the second heat sink 30 on the n-side contact surface of the
  • Laser diode element rests and the upper surface of the spacer on the second
  • Joining surface 33 comes to rest (see Fig. 7-9).
  • the joining middle bead 40 on the first joining surface 23 touches the opposite second not provided with joining means
  • Joining surface 33 If both joining surfaces had been provided with joining compound beads, the applied joining compound beads of both joining surfaces would touch each other. In both cases, the distance between the first and the second joining surface is at least partially bridged by the joining agent. The compound beads are pressed a little bit wide.
  • the amount of joining agent is metered so that the
  • Laser diode element remains around a space in which no joining agent can get.
  • a Wetting of the laser diode element 1 1 with joining agent would namely damage the laser diode element.
  • An advantageous development, not shown, is that around the contact surfaces around a depression is provided which prevents creep of the joining means to the laser diode element.
  • the heat sinks 20, 30 may be designed such that the spring elements 60 do not protrude beyond the cooling ribs, but are arranged in a space-saving manner within the rib structure.
  • Fig. 1 1 further examples of spring elements are shown.
  • the spring element may have a rigid center 64 when elastically deformable end portions 62, 63 are present.
  • the spring element may be designed concavely with elastically stretchable middle part.

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Semiconductor Lasers (AREA)

Abstract

L'invention concerne un procédé de montage d'un module à diode laser (1), comprenant les étapes suivantes consistant à : a) fournir un élément diode laser (10) pourvu d'une surface de connexion à p faces et d'une surface de connexion à n faces, b) fournir un premier corps de refroidissement (20) pourvu d'au moins une première surface d'assemblage, c) fournir un deuxième corps de refroidissement (30) pourvu d'au moins une deuxième surface d'assemblage, d) appliquer un agent adhésif (40) électro-isolant et durcissable sur la première et/ou la deuxième surface d'assemblage, e) réunir le premier et le deuxième corps de refroidissement, de telle manière que la deuxième surface d'assemblage vienne se situer au moins en partie à l'opposé de la première surface d'assemblage à une distance minimale prédéfinie de l'isolation, et que l'agent adhésif électro-isolant imprègne au moins en partie les deux surfaces d'assemblage en couvrant la distance entre les corps de refroidissement. L'élément diode laser est disposé entre le premier et le deuxième corps de refroidissement et la surface de connexion à n faces de l'élément diode laser est reliée thermiquement au premier corps de refroidissement et la surface de connexion à p faces de l'élément diode laser est reliée thermiquement au deuxième corps de refroidissement. L'invention est caractérisée en ce qu'au moins un élément ressort électro-isolant (60) est appliqué sur le premier et le deuxième corps de refroidissement avant le durcissement de l'agent adhésif, de telle manière que les corps de refroidissement sont fixés les uns par rapport aux autres par une force de serrage.
PCT/EP2013/003857 2012-12-21 2013-12-19 Procédé de montage d'un module à diode laser Ceased WO2014095066A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102012025495.4A DE102012025495B4 (de) 2012-12-21 2012-12-21 Verfahren zur Herstellung eines Diodenlasermoduls
DE102012025495.4 2012-12-21

Publications (1)

Publication Number Publication Date
WO2014095066A1 true WO2014095066A1 (fr) 2014-06-26

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Application Number Title Priority Date Filing Date
PCT/EP2013/003857 Ceased WO2014095066A1 (fr) 2012-12-21 2013-12-19 Procédé de montage d'un module à diode laser

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DE (1) DE102012025495B4 (fr)
WO (1) WO2014095066A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104934851A (zh) * 2015-06-19 2015-09-23 郑州大学 一种用于半导体激光器叠阵封装的夹具
CN115000034A (zh) * 2021-03-02 2022-09-02 三菱电机株式会社 半导体功率模块

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102014012855A1 (de) * 2014-09-03 2015-10-01 Jenoptik Laser Gmbh Diodenlaser und Herstellungsverfahren für einen Diodenlaser
DE102018212159A1 (de) 2018-07-20 2020-01-23 Robert Bosch Gmbh Aufbau und Verfahren zum Verbinden einer ersten und einer zweiten Baugruppe durch Verkleben
DE102018121857B4 (de) 2018-09-07 2023-05-11 Jenoptik Optical Systems Gmbh Vorrichtung zum Betreiben eines lichtemittierenden Halbleiterbauelements
KR102624495B1 (ko) 2021-06-25 2024-01-11 포샨 후아즈 어드밴스드 머티리얼즈 컴퍼니 리미티드 마이크로채널 히트싱크 및 이의 제조방법
CN113587692B (zh) * 2021-06-25 2022-06-14 佛山华智新材料有限公司 微通道热沉及其制造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3566958A (en) * 1968-12-18 1971-03-02 Gen Systems Inc Heat sink for electrical devices
DE102008027468A1 (de) * 2008-06-06 2009-12-17 Jenoptik Laserdiode Gmbh Wärmeübertragungsvorrichtung mit einem Halbleiterbauelement sowie Anschlussvorrichtung für ihren Betrieb
DE102009040835A1 (de) * 2009-09-09 2011-03-10 Jenoptik Laserdiode Gmbh Verfahren zum thermischen Kontaktieren einander gegenüberliegender elektrischer Anschlüsse einer Halbleiterbauelement-Anordnung
US20110069731A1 (en) * 2009-09-21 2011-03-24 Gokay M Cem Scalable thermally efficient pump diode assemblies

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3509429A (en) * 1968-01-15 1970-04-28 Ibm Heat sink assembly for semiconductor devices
US4393393A (en) 1979-08-13 1983-07-12 Mcdonnell Douglas Corporation Laser diode with double sided heat sink
FR2815677B1 (fr) * 2000-10-25 2003-07-25 Commissariat Energie Atomique Procede et dispositif d'alignement passif de supports, en particulier de plaques portant des composants optiques
ES2191559B1 (es) 2002-02-18 2005-02-01 Monocrom, S.L. Modulo laser.
DE102010042087A1 (de) 2010-10-06 2012-04-12 Jenoptik Laser Gmbh Lasermodul mit einer Laserdiodeneinheit und einem Kühler

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3566958A (en) * 1968-12-18 1971-03-02 Gen Systems Inc Heat sink for electrical devices
DE102008027468A1 (de) * 2008-06-06 2009-12-17 Jenoptik Laserdiode Gmbh Wärmeübertragungsvorrichtung mit einem Halbleiterbauelement sowie Anschlussvorrichtung für ihren Betrieb
DE102009040835A1 (de) * 2009-09-09 2011-03-10 Jenoptik Laserdiode Gmbh Verfahren zum thermischen Kontaktieren einander gegenüberliegender elektrischer Anschlüsse einer Halbleiterbauelement-Anordnung
US20110069731A1 (en) * 2009-09-21 2011-03-24 Gokay M Cem Scalable thermally efficient pump diode assemblies

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104934851A (zh) * 2015-06-19 2015-09-23 郑州大学 一种用于半导体激光器叠阵封装的夹具
CN104934851B (zh) * 2015-06-19 2018-08-14 郑州大学 一种用于半导体激光器叠阵封装的夹具
CN115000034A (zh) * 2021-03-02 2022-09-02 三菱电机株式会社 半导体功率模块

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