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WO2014082402A1 - 防止液体飞溅的清洗装置及具有该装置的清洗系统 - Google Patents

防止液体飞溅的清洗装置及具有该装置的清洗系统 Download PDF

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Publication number
WO2014082402A1
WO2014082402A1 PCT/CN2013/073572 CN2013073572W WO2014082402A1 WO 2014082402 A1 WO2014082402 A1 WO 2014082402A1 CN 2013073572 W CN2013073572 W CN 2013073572W WO 2014082402 A1 WO2014082402 A1 WO 2014082402A1
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WIPO (PCT)
Prior art keywords
liquid
wall
upper casing
cleaning
cleaning device
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PCT/CN2013/073572
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English (en)
French (fr)
Inventor
刘效岩
吴仪
冯晓敏
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Beijing Sevenstar Electronics Co Ltd
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Beijing Sevenstar Electronics Co Ltd
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Application filed by Beijing Sevenstar Electronics Co Ltd filed Critical Beijing Sevenstar Electronics Co Ltd
Priority to US14/127,972 priority Critical patent/US9266151B2/en
Publication of WO2014082402A1 publication Critical patent/WO2014082402A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B17/00—Methods preventing fouling
    • B08B17/02—Preventing deposition of fouling or of dust
    • B08B17/025—Prevention of fouling with liquids by means of devices for containing or collecting said liquids
    • H10P72/0414—
    • H10P72/0462—

Definitions

  • the present invention relates to the field of semiconductor cleaning processes, and in particular to a cleaning device for preventing liquid splashing and a cleaning system having the same.
  • the technical problem to be solved by the present invention is to provide a cleaning device for preventing liquid splashing and a cleaning system having the same, which overcomes the inability of the existing wafer cleaning device and the cleaning system to effectively prevent chemical reagents and cleaning during high-speed rotation of the wafer.
  • the present invention provides a cleaning device for preventing splashing of liquid, comprising an upper case and a lower case, wherein the upper case is movable up and down relative to the lower case, the upper case including an inner wall of the upper case and an outer wall of the upper case.
  • a hollow cavity is formed between the inner wall of the upper casing and the outer wall of the upper casing, and the inner wall of the upper casing is provided with a plurality of liquid inlet holes, and the liquid inlet holes are all communicated with the hollow cavity.
  • the upper case is coupled to the driving column for driving the upper case to move up and down relative to the lower case.
  • the hollow cavity has a thickness of 0.3-0.8 cm.
  • the thickness of the inner wall of the upper case is not greater than the thickness of the outer wall of the upper case.
  • the inlet hole is circular and has a diameter of 0.5 to 1.5 cm.
  • liquid inlet holes are evenly distributed along the circumferential direction of the inner wall of the upper casing.
  • the lower casing is provided with a liquid discharging hole, and the liquid discharging hole communicates with the bottom of the hollow cavity.
  • the present invention also provides a cleaning system including the cleaning device for preventing splashing of liquid.
  • the cleaning device further includes a clamping device disposed inside the cleaning device for preventing liquid splashing, the clamping device including a chuck for supporting, clamping, and driving the wafer The wafer is rotated.
  • the cleaning device for preventing liquid splashing provided by the present invention and the cleaning system having the same can realize chemical reagents and/or cleaning during high-speed rotation of the object to be cleaned by adding a liquid inlet hole and a hollow cavity to the upper casing.
  • the particles pass through the liquid inlet hole into the hollow cavity and are discharged through the liquid discharge hole to obtain the best cleaning effect of the object to be cleaned; and the structure of the cleaning device and the cleaning system is simple and easy to clean, the process is easy to realize, and the waste liquid is also easy to collect. .
  • FIG. 1 is a schematic structural view of a cleaning device for preventing liquid splashing according to an embodiment of the present invention
  • Figure 2 is a longitudinal cross-sectional view of a cleaning system having a cleaning device for preventing liquid splashing in Figure 1 according to a second embodiment of the present invention
  • Figure 3 is a cross-sectional view of the upper case of Figure 1;
  • Figure 4 is a bottom plan view of the upper case of Figure 1;
  • 1 upper shell; 2: lower shell; 3: liquid inlet hole; 4: hollow cavity; 5: drive column; 6: wafer; 7: chuck; 8: chuck chucking unit.
  • connection In the description of the present invention, it should be noted that the terms “installation”, “connected”, and “connected” are to be understood broadly, and may be fixed or detachable, for example, unless otherwise explicitly defined and defined. Connected, or integrally connected; can be mechanical or electrical; can be directly connected, or indirectly connected through an intermediate medium, can be the internal communication of the two components.
  • Connected, or integrally connected can be mechanical or electrical; can be directly connected, or indirectly connected through an intermediate medium, can be the internal communication of the two components.
  • the specific meaning of the above terms in the present invention can be understood in a specific case by those skilled in the art.
  • the wafer described in the present invention may be a silicon wafer of a pure silicon substrate or a silicon wafer with a copper interconnection structure.
  • the high position refers to a position where the upper case 1 rises
  • the low position refers to a position where the upper case 1 is lowered.
  • the cleaning device for preventing liquid splashing comprises: an upper casing 1 and a lower casing 2; the lower casing 2 is located at a lower portion of the cleaning device, and the upper casing 1 is opposite to the lower casing. 2 moving up and down, before the cleaning process begins, the upper casing 1 moves upward relative to the lower casing 2, and the upper casing 1 is raised to protect the inner wafer 6 and prevent the splashed liquid from splashing into the cleaning device during the cleaning process. Outside; after the cleaning process is completed, the upper casing 1 moves downward relative to the lower casing 2, and the upper casing 1 is lowered to facilitate the removal of the wafer 6 therein.
  • the upper casing 1 is a non-solid structure, which comprises an inner wall of the upper casing and an outer wall of the upper casing, a hollow cavity is formed between the inner wall of the upper casing and the outer wall of the upper casing, and the inner wall of the upper casing is provided with a plurality of liquid inlet holes 3, each of which enters The liquid holes 3 are all communicated with the hollow cavity 4. Under the premise of ensuring the strength of the upper casing 1, the greater the number of the liquid inlet holes 3, the better, so that all the splashed liquid enters the hollow cavity through the liquid inlet hole 3.
  • the liquid splashed during the high-speed rotation can enter the hollow cavity 4 through the liquid inlet hole 3, and the upper casing 1 is connected with the driving column 5 for driving the vertical movement of the upper casing 1 relative to the lower casing 2,
  • the number of the driving columns 5 may be plural, and evenly distributed along the edge of the upper casing 1, preferably three (as shown in FIG. 1); the driving column 5 is a cylinder (not shown) drive.
  • the inner wall of the upper shell and the outer wall of the upper shell may be a cylindrical structure or an annular structure, and the sum of the wall thicknesses of the inner wall of the upper shell and the outer wall of the upper shell may be 1.2-2 cm, and the wall thickness may be increased or decreased according to actual needs.
  • the liquid inlet holes 3 disposed on the inner wall of the upper casing are evenly distributed according to a certain rule, such as uniformly distributed along the circumferential direction of the inner wall of the upper casing, and the inlet hole 3 is preferably circular, and the diameter thereof is 0.5-1.5 cm, of course, the liquid inlet hole
  • the shape of 3 may also be a triangle, a square, a pentagonal star or the like; the inner wall of the upper casing is thinner to facilitate the liquid to enter the hollow cavity 4 from the liquid inlet hole 3, and the thickness of the outer wall of the upper casing may be set as the case may be, but To ensure the overall strength of the upper casing 1, the wall thickness of the inner wall of the upper casing may be set to be less than or equal to the wall thickness of the outer wall of the upper casing; the thickness of the hollow cavity 4 is 0.3-0.8 cm; the thickness of the hollow cavity 4 may also be according to the inner wall of the upper casing.
  • the specific wall thickness of the outer wall of the upper casing is set, and
  • the lower casing 2 is provided with a liquid discharging hole (not shown), and the liquid discharging hole communicates with the bottom of the hollow cavity 4.
  • the drain hole is for discharging the liquid flowing into the bottom portion of the hollow chamber 4.
  • the cleaning device concentrates the waste liquid generated in the cleaning process into the hollow cavity 4 and discharges through the liquid discharge hole, so that the collection of the waste liquid is simple and easy to operate.
  • the device for preventing liquid splashing can be used in the cleaning process of the wafer 6, and the process is as follows:
  • Step S1 before the start of the process, the cylinder drives the upper casing 1 to rise by the driving column 5, but it is ensured that at least a part of the bottom of the upper casing 1 and the top of the lower casing 2 overlap; the wafer 6 is placed on the chuck 7, on the chuck 7.
  • a chuck chucking unit 8 is provided, and the chuck chucking unit 8 chucks the wafer 6.
  • Step S2 after the start of the process, the liquid drawn from the wafer 6 rotating at a high speed enters the hollow cavity 4 through the liquid inlet hole 3, and the liquid reflected by the hollow cavity 4 hits the liquid inlet hole 3, and then splits and breaks, preventing it from splashing again.
  • the liquid in the hollow cavity 4 flows from the cavity 4 in the bottom of the upper casing 1 into the liquid discharge hole in the lower casing 2. And discharged through the drain hole.
  • the chuck 7 is rotated at a high speed, and the upper case 1 and the lower case 2 of the washing operation unit are in a stationary state.
  • Step S3 at the end of the process, the cylinder drives the lower casing 2 to descend through the driving column 5, and the chuck 7 is in a loose state, and the wafer 6 is released.
  • step S1 the upper casing 1 is raised to a high position, and at this time, the lower portion of the upper casing 1 and the upper portion of the lower casing 2 are at least partially overlapped to ensure the liquid entering the hollow cavity 4 through the liquid inlet hole 3. After flowing out from the bottom of the hollow cavity 4, it can flow into the liquid discharge hole on the lower casing 2 and be discharged through the liquid discharge hole; in step S3, the upper casing 1 is lowered to be in a low position, and the upper casing 1 and the lower casing 2 are substantially coincident. .
  • the cleaning device for preventing liquid splashing provided by the invention can realize that during the high-speed rotation of the wafer, the chemical reagent and/or the cleaned particles enter the hollow cavity through the liquid inlet hole by adding the liquid inlet hole and the hollow cavity on the upper shell.
  • the liquid is discharged through the liquid discharge hole, and a small amount of liquid reflected by the hollow cavity is further split and broken after hitting the liquid inlet hole, and can not be splashed back to the surface of the wafer, thereby avoiding the splashing liquid in the cleaning process of the ordinary cleaning device.
  • the process is easy to implement, the waste liquid is easy to collect, and the cleaning degree of the wafer is ensured to the greatest extent.
  • a cleaning system includes the above-mentioned cleaning device for preventing liquid splashing, the cleaning system further comprising a clamping device for holding the object to be cleaned, the clamping device being arranged to prevent liquid splashing
  • the clamping device includes a chuck 7 for supporting, clamping, and rotating the wafer 6.
  • the chuck 7 is provided with a chuck chucking unit 8 for chucking and releasing the wafer 6.
  • the upper casing 1 is at a high position, the wafer 6 is rotated at a high speed, and the chuck 7 is in a chucked state; while the process is stopped, the upper casing 1 is at a low position, the wafer 6 stops rotating, and the chuck 7 is in a loose state. In order to facilitate the release of the wafer.
  • the cleaning system can effectively prevent the chemical reagents and the cleaned particles from being thrown on the sidewalls of the upper shell and then splashed back onto the surface of the wafer to re-contaminate the surface of the wafer during the high-speed rotation of the wafer.
  • the velocity of the enthalpy in the tangential direction of the rotating wafer enters the hollow cavity through the liquid inlet hole on the upper casing, and flows into the lower casing through the liquid discharge hole, and a small amount of liquid reflected by the hollow cavity penetrates the liquid inlet hole and further splits. It is broken and cannot be splashed back to the surface of the wafer, thus achieving the purpose of preventing the liquid from splashing back onto the surface of the wafer and causing contamination of the wafer.
  • the cleaning system has a simple structure and is easy to clean, the process is easy to implement, the waste liquid is easy to collect, and the cleaning degree of the wafer is ensured to the maximum extent.
  • the cleaning device for preventing liquid splash provided by the present invention and the cleaning system having the same can be used not only for cleaning the disk and the like, but also for cleaning any object which causes liquid splash during the cleaning process.
  • the operation process and method are the same as those of the wafer, and the same effect can be achieved.
  • the cleaning device for preventing liquid splashing provided by the present invention and the cleaning system having the same can realize chemical reagents and/or cleaning during high-speed rotation of the object to be cleaned by adding a liquid inlet hole and a hollow cavity to the upper casing.
  • the particles pass through the liquid inlet hole into the hollow cavity and are discharged through the liquid discharge hole to obtain the best cleaning effect of the object to be cleaned; and the structure of the cleaning device and the cleaning system is simple and easy to clean, the process is easy to realize, and the waste liquid is also easy to collect. .

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  • Cleaning Or Drying Semiconductors (AREA)

Abstract

本发明涉及半导体清洗工艺技术领域，具体涉及一种防止液体飞溅的清洗装置及具有该装置的清洗系统。该防止液体飞溅的清洗装置，包括上壳和下壳，上壳可相对下壳上下运动，上壳包括上壳内壁和上壳外壁，上壳内壁和上壳外壁之间形成中空腔，上壳内壁上设有多个进液孔，进液孔与中空腔相通。本发明提供的防止液体飞溅的清洗装置及具有该装置的清洗系统，通过在上壳上加设进液孔和中空腔，可实现在被清洗物的高速旋转过程中，化学试剂和/或清洗下来的颗粒通过进液孔进入中空腔内并通过排液孔排出，获得被清洗物的最佳的清洁效果；并且清洗装置和清洗系统的结构简单易清洗，工艺易实现，废液还便于收集。

Description

防止液体飞溅的清洗装置及具有该装置的清洗系统
技术领域
本发明涉及半导体清洗工艺技术领域，具体涉及一种防止液体飞溅的清洗装置及具有该装置的清洗系统。
背景技术
随着硅片晶圆直径的增加和特征尺寸的减小，对硅片表面的洁净度的要求也越来越高。目前的清洗设备主要通过在高速旋转的晶片表面上喷射清洗液来达到清洗的目的。但是在高速旋转的过程中，清洗液会在离心力的作用下被甩出而打在清洗腔侧壁上，其被清洗腔侧壁反弹后会重新飞溅到晶片表面，使晶片受到污染，如果不能及时防止这种污染，会严重影响清洗的效果。目前，一般是通过在清洗腔内添加额外的部件使得清洗腔结构复杂来防止这种污染的，但是这样会使得后续对清洗腔的清洗工作不易进行。
发明内容
（一）要解决的技术问题
本发明要解决的技术问题是提供一种防止液体飞溅的清洗装置及具有该装置的清洗系统，以克服现有的晶片清洗装置和清洗系统不能有效防止在晶片高速旋转过程中，化学试剂和清洗下来的颗粒甩出打在上壳侧壁又重新飞溅到晶片表面而对晶片造成污染以及晶片清洗装置结构复杂不宜清洗的缺陷。
（二）技术方案
为了解决上述技术问题，本发明提供了一种防止液体飞溅的清洗装置包括上壳和下壳，所述上壳可相对下壳上下运动，所述上壳包括上壳内壁和上壳外壁，所述上壳内壁和所述上壳外壁之间形成中空腔，所述上壳内壁上设有多个进液孔，所述进液孔均与所述中空腔相通。
进一步地，所述上壳连接驱动柱，其用来驱动上壳相对于下壳进行上下运动。
进一步地，所述上壳处于高位置时，其底部和下壳的顶部至少有一部分重合。
进一步地，所述中空腔的厚度为0.3-0.8cm。
进一步地，所述上壳内壁的厚度不大于上壳外壁的厚度。
进一步地，所述进液孔为圆形，其直径为0.5-1.5cm。
进一步地，所述进液孔沿上壳内壁周向均匀分布。
进一步地，所述下壳上设有排液孔，所述排液孔与所述中空腔的底部相通。
本发明还提供一种清洗系统，包括该防止液体飞溅的清洗装置。
进一步地，所述清洗装置还包括夹持装置，所述夹持装置设置于所述防止液体飞溅的清洗装置的内部，所述夹持装置包括卡盘，其用来支撑、卡紧晶片并带动晶片旋转。
（三）有益效果
本发明提供的防止液体飞溅的清洗装置及具有该装置的清洗系统，通过在上壳上加设进液孔和中空腔，可实现在被清洗物的高速旋转过程中，化学试剂和/或清洗下来的颗粒通过进液孔进入中空腔内并通过排液孔排出，获得被清洗物的最佳的清洁效果；并且清洗装置和清洗系统的结构简单易清洗，工艺易实现，废液还便于收集。
附图说明
图1是本发明实施例一防止液体飞溅的清洗装置的结构示意图；
图2是本发明实施例二具有图1中防止液体飞溅的清洗装置的清洗系统的纵向剖视图；
图3是图1中上壳的剖面图；
图4是图1中上壳的仰视图；
其中，1：上壳；2：下壳；3：进液孔；4：中空腔；5：驱动柱；6：晶片；7：卡盘；8：卡盘卡紧单元。
具体实施方式
下面结合附图和实施例，对本发明的具体实施方式作进一步详细描述。以下实施例用于说明本发明，但不用来限制本发明的范围。
在本发明的描述中，需要说明的是，术语“中心”、“纵向”、“横向”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”“内”、“外”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本发明和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本发明的限制。此外，术语“第一”、“第二”、“第三”等仅用于描述目的，而不能理解为指示或暗示相对重要性。
在本发明的描述中，需要说明的是，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或一体地连接；可以是机械连接，也可以是电连接；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通。对于本领域的普通技术人员而言，可以具体情况理解上述术语在本发明中的具体含义。
本发明中所述的晶片可为纯硅衬底的硅片或带有铜互连结构的硅片。本实施例中所述高位置是指上壳1上升后所处的位置，低位置是指上壳1下降后所处的位置。当上壳1处于高位置时，上壳1的顶部和下壳2的顶部至少有一部分重合；当上壳2处于低位置时，上壳1和下壳2基本重合。
实施例一
如图1-图4所示，为本发明提供的防止液体飞溅的清洗装置，该装置包括：上壳1和下壳2；下壳2位于本清洗装置的下部，上壳1可相对下壳2上下运动，清洗过程开始前，上壳1相对于下壳2向上运动，将上壳1上升，以对内部的晶片6起保护作用，并避免清洗过程中飞溅出的液体溅到本清洗装置的外面；清洗过程完成后，上壳1相对于下壳2向下运动，将上壳1降下以方便取出其中的晶片6。具体的，上壳1为非实体结构，其包括上壳内壁和上壳外壁，上壳内壁和上壳外壁之间形成中空腔，上壳内壁上设有多个进液孔3，每个进液孔3均与中空腔4相通，在保证上壳1强度的前提下，进液孔3的数量越多越好，以使飞溅出的液体全部通过进液孔3进入到中空腔内。这样，高速旋转过程中飞溅出的液体便可通过进液孔3进入到中空腔4中，上壳1连有驱动柱5，其用来驱动上壳1相对于下壳2的上下运动，其与上壳1的边缘连接，驱动柱5的数量可为多个，并沿上壳1的边缘均匀分布，优选为三个（如图1所示）；驱动柱5采用气缸（图未示）驱动。
具体的，上壳内壁和上壳外壁均可为圆柱形结构或环形结构，上壳内壁和上壳外壁的壁厚之和可为1.2-2cm，也可根据实际需求增大或减小壁厚；设置在上壳内壁上的进液孔3按一定规律均匀分布，如沿上壳内壁的周向均匀分布，进液孔3优选为圆形，其直径为0.5-1.5cm，当然进液孔3的形状也可为三角形、正方形、五角星形或其他形状；上壳内壁要较薄，以利于液体从进液孔3进入到中空腔4中，上壳外壁厚度可视具体情况设置，但要保证上壳1整体的强度，可以设置成上壳内壁的壁厚小于或等于上壳外壁的壁厚；中空腔4的厚度为0.3-0.8cm；中空腔4的厚度也可根据上壳内壁和上壳外壁的具体壁厚进行设置，在保证上壳1整体强度的前提下，以利于飞溅出的液体在中空腔4中顺畅流动为佳。
进一步的，下壳2上设有排液孔（图未示），排液孔与中空腔4的底部相通。排液孔用来排出从中空腔4底部流入到其中的液体。本清洗装置将清洗过程中产生的废液集中到中空腔4内并通过排液孔排出使得废液的收集简单易操作。
该防止液体飞溅的装置可用于晶片6的清洗工艺中，其工艺过程如下：
步骤S1、工艺开始前，气缸通过驱动柱5驱动上壳1上升，但要保证上壳1的底部和下壳2的顶部至少有一部分重合；晶片6放到卡盘7上，卡盘7上设有卡盘卡紧单元8，卡盘卡紧单元8卡紧晶片6。
步骤S2、工艺开始后，由高速旋转的晶片6甩出的液体通过进液孔3进入到中空腔4，经中空腔4反射的液体碰到进液孔3后分裂破碎，阻止其重新飞溅到晶片6表面，中空腔4的液体从上壳1底部中空腔4流入下壳2上的排液孔。并通过排液孔排出。在整个步骤中，卡盘7在高速旋转，而清洗操作单元的上壳1和下壳2处于静止状态。
步骤S3、工艺结束时，气缸通过驱动柱5驱动下壳2下降，卡盘7处于松动状态，放开晶片6。
需要说明的是：在步骤S1中，上壳1上升后处于高位置，此时上壳1下部和下壳2上部至少有一部分重合，以保证通过进液孔3进入到中空腔4中的液体从中空腔4底部流出后，能流入下壳2上的排液孔并通过排液孔排出；在步骤S3中，上壳1下降后处于低位置，此时上壳1和下壳2基本重合。
本发明提供的防止液体飞溅的清洗装置，通过在上壳上加设进液孔和中空腔，可实现在晶片高速旋转过程中，化学试剂和/或清洗下来的颗粒通过进液孔进入中空腔内并通过排液孔排出，少量经中空腔反射的液体碰到进液孔后进一步分裂破碎，也无法飞溅回晶片表面，从而避免了普通清洗装置在清洗过程中，飞溅出的液体打在清洗腔侧壁后又反弹到晶片表面的而对晶片造成的污染，并且清洗装置结构简单易清洗，工艺易实现，废液易收集，最大程地保证了晶片的清洗度。
实施例二
如图2所示，一种清洗系统，包括以上所述的防止液体飞溅的清洗装置，该清洗系统还包括夹持装置，其用来夹持被清洗物，该夹持装置设置于防止液体飞溅的清洗装置的内部，被清洗物以晶片6为例进行说明。具体的，该夹持装置包括卡盘7，其用来支撑、卡紧晶片6并带动晶片6旋转。卡盘7上设有卡盘卡紧单元8，其用来卡紧和放开晶片6。在开始工艺时，上壳1处于高位置，晶片6在高速旋转，卡盘7处于卡紧状态；而在停止工艺时，上壳1处于低位置，晶片6停止旋转，卡盘7处于松动状态以利于放开晶片。
本清洗系统能够有效防止在晶片高速旋转过程中，化学试剂和清洗下来的颗粒甩出打在上壳侧壁上后又重新飞溅到晶片表面、重新污染晶片表面的作用。甩出的速度沿旋转晶片切线方向的液体通过上壳上的进液孔进入到中空腔，并流入下壳中通过排液孔排出，少量经中空腔反射的液体碰到进液孔后进一步分裂破碎，无法飞溅回晶片表面，从而实现了阻止液体重新飞溅到晶片表面而对晶片造成污染的目的。此外，本清洗系统结构简单易清洗，工艺易实现，废液易收集，最大程地保证了晶片的清洗度。
需要说明的是：本发明提供的防止液体飞溅的清洗装置及具有该装置的清洗系统不仅可用于晶片等盘状物的清洗，还可用于任何在清洗过程中会产生液体飞溅现象的物体的清洗，操作过程和方法与晶片的操作过程和方法相同，并且均能达到相同的效果。
以上所述仅是本发明的优选实施方式，应当指出，对于本技术领域的普通技术人员来说，在不脱离本发明技术原理的前提下，还可以做出若干改进和替换，这些改进和替换也应视为本发明的保护范围。
工业实用性
本发明提供的防止液体飞溅的清洗装置及具有该装置的清洗系统，通过在上壳上加设进液孔和中空腔，可实现在被清洗物的高速旋转过程中，化学试剂和/或清洗下来的颗粒通过进液孔进入中空腔内并通过排液孔排出，获得被清洗物的最佳的清洁效果；并且清洗装置和清洗系统的结构简单易清洗，工艺易实现，废液还便于收集。

Claims (1)

  1. 权 利 要 求 书
    1、一种防止液体飞溅的清洗装置，其特征在于，包括上壳和下壳，所述上壳可相对下壳上下运动，所述上壳包括上壳内壁和上壳外壁，所述上壳内壁和所述上壳外壁之间形成中空腔，所述上壳内壁上设有多个进液孔，所述进液孔均与所述中空腔相通。
    2、如权利要求1所述的防止液体飞溅的清洗装置，其特征在于，所述上壳连接驱动柱，其用来驱动上壳相对于下壳进行上下运动。
    3、如权利要求1所述的防止液体飞溅的清洗装置，其特征在于，所述上壳处于高位置时，其底部和下壳的顶部至少有一部分重合。
    4、如权利要求1所述的防止液体飞溅的清洗装置，其特征在于，所述中空腔的厚度为0.3-0.8cm。
    5、如权利要求1所述的防止液体飞溅的清洗装置，其特征在于，所述上壳内壁的厚度不大于上壳外壁的厚度。
    6、如权利要求1所述的防止液体飞溅的清洗装置，其特征在于，所述进液孔为圆形，其直径为0.5-1.5cm。
    7、如权利要求1所述的防止液体飞溅的清洗装置，其特征在于，所述进液孔沿上壳内壁周向均匀分布。
    8、如权利要求1所述的防止液体飞溅的清洗装置，其特征在于，所述下壳上设有排液孔，所述排液孔与所述中空腔的底部相通。
    9、一种清洗系统，其特征在于，包括权利要求1-8任一项所述的防止液体飞溅的清洗装置。
    10、如权利要求9所述的清洗系统，其特征在于，还包括夹持装置，所述夹持装置设置于所述防止液体飞溅的清洗装置的内部，所述夹持装置包括卡盘，其用来支撑、卡紧晶片并带动晶片旋转。
PCT/CN2013/073572 2012-11-28 2013-04-01 防止液体飞溅的清洗装置及具有该装置的清洗系统 Ceased WO2014082402A1 (zh)

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