WO2014077124A1 - Production method for film formation mask and film formation mask - Google Patents

Abstract

Provided is a production method for a film formation mask comprising: a step for forming a mask member in which a resin film is brought into close contact with a magnetic metal member comprising a plurality of thin film patterns on a substrate and a plurality of first and second through holes that are provided to positions corresponding to a plurality of alignment marks on the substrate side; a step for stretching the mask member on one end surface of a frame and joining the peripheral edge of the magnetic metal member to one end surface of the frame; and a step for irradiating a film section within the first through holes with laser light in order to form an opening pattern having the same shape and dimensions as the thin film patterns and irradiating the film section within the second through holes with laser light in order to form mask-side alignment marks.

Description

Method for manufacturing film formation mask and film formation mask

The present invention relates to a method for manufacturing a film forming mask having an opening pattern corresponding to a plurality of thin film patterns formed on a substrate, and more particularly to a method for manufacturing a film forming mask capable of forming an opening pattern and an alignment mark with high positional accuracy. And a film forming mask.

In the conventional method for manufacturing a film-formation mask, the end of a mask sheet made of nickel or a nickel alloy having a plurality of opening patterns is fixed by spot welding to a frame (for example, see Patent Document 1).

JP 2006-241547 A

However, in such a conventional method of manufacturing a film formation mask, since the opening pattern and the alignment mark are formed on the mask sheet before being fixed to the frame, the mask sheet is stretched around the end of the frame. There is a problem that the position of the opening pattern and the alignment mark shifts when the mask sheet is extended. Therefore, the film formation mask cannot be aligned with respect to the film formation substrate with high accuracy, and the thin film pattern cannot be formed with high positional accuracy.

Therefore, an object of the present invention is to provide a film forming mask manufacturing method and a film forming mask capable of addressing such problems and forming an opening pattern and an alignment mark with high positional accuracy.

In order to achieve the above object, a film forming mask manufacturing method according to a first invention is a film forming mask manufacturing method for forming a plurality of thin film patterns on a substrate, wherein the plurality of thin film patterns are formed. And a magnetic metal member and a resin provided with a plurality of first and second through holes having a shape dimension larger than that of the thin film pattern and the substrate side alignment mark at positions corresponding to the plurality of substrate side alignment marks provided in advance on the substrate A first step of forming a mask member in close contact with a made film, and a frame-like frame provided with openings of a size including the plurality of first and second through holes of the magnetic metal member A second step in which the mask member is stretched on an end face, and a peripheral edge of the magnetic metal member is joined to one end face of the frame; and a position corresponding to the thin film pattern in the first through hole. The film portion is irradiated with laser light to form an opening pattern having the same shape and dimension as the thin film pattern, and the film portion at a position corresponding to the substrate-side alignment mark in the second through hole is irradiated with laser light. And a third step of forming a mask side alignment mark.

Preferably, in the third step, an opening pattern is formed in each of the film portions in the plurality of first through holes while the laser light irradiation position is moved by a predetermined distance, and an XY plane is formed. A step of reading and storing the coordinates of each of the opening patterns, calculating the average value by reading the coordinates of each of the stored opening patterns, and the center position in the opening pattern forming region where the plurality of opening patterns are formed It is desirable to perform a step of calculating coordinates, and a step of forming the mask side alignment mark at a position in the second through hole that is a predetermined distance away from the calculated center position coordinate.

Alternatively, the third step includes the step of forming the mask side alignment mark in the film portion in one second through hole selected from the plurality of second through holes, and the mask side formed The opening pattern is formed in each of the film portions in the plurality of first through holes while stepping the irradiation position of the laser beam by a predetermined distance with respect to the alignment mark, and the other first You may perform the step of forming another mask side alignment mark in the film part in 2 through-holes.

More preferably, the plurality of first through holes have a rectangular shape and are provided in a matrix at regular intervals on the magnetic metal member, and the plurality of opening patterns are respectively in the plurality of first through holes. It is desirable to form one by one.

Alternatively, the plurality of first through holes have a stripe shape and are provided in parallel to the magnetic metal member at regular intervals, and the plurality of opening patterns have a stripe shape and have the plurality of the plurality of the first through holes. One each may be formed in the first through hole.

The film forming mask according to the second invention is a film forming mask manufactured by the manufacturing method of the first invention.

According to the present invention, after a mask member in which a resin film is in close contact with a magnetic metal member having a plurality of first and second through holes is stretched on a frame, an opening pattern is formed in the first through holes. Since the mask side alignment mark is formed in the second through hole, when the mask member is stretched on the frame, the mask member extends so that the positions of the first and second through holes are Even if they are shifted, the opening pattern and the mask side alignment mark can be formed as designed. Therefore, it is possible to improve the formation position accuracy of the opening pattern and the mask side alignment mark.

It is a flowchart which shows embodiment of the manufacturing method of the film-forming mask by this invention. It is a figure which shows the film-forming mask manufactured by the manufacturing method of this invention, (a) is a top view, (b) is sectional drawing. It is process drawing explaining formation of the member for masks. It is process drawing explaining joining of the member for masks to a flame | frame. It is explanatory drawing shown about formation of the opening pattern and mask side alignment mark with respect to a film. It is explanatory drawing shown about the other example of formation of the opening pattern with respect to a film, and a mask side alignment mark.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. FIG. 1 is a flowchart showing an embodiment of a method for manufacturing a film formation mask according to the present invention. This film forming mask manufacturing method is for forming a plurality of thin film patterns on a substrate, and a first step S1 for forming a mask member in which a magnetic metal member and a resin film are in close contact with each other. The second step S2 for joining the mask member to the frame, and the third step S3 for forming the opening pattern and the mask side alignment mark on the film are included. Hereinafter, each step will be described in detail.

2A and 2B are diagrams showing a film formation mask manufactured by the manufacturing method of the present invention, in which FIG. 2A is a plan view and FIG. 2B is a cross-sectional view.
The film formation mask has a plurality of rectangular first through holes 1 corresponding to a plurality of thin film patterns to be formed on the substrate at the same arrangement pitch as the thin film pattern and having a larger dimension than the thin film pattern in a matrix. A magnetic metal member 3 having a second through-hole 2 having a larger dimension than the substrate-side alignment mark corresponding to the substrate-side alignment mark formed in advance on the substrate, and the thin-film pattern corresponding to a plurality of thin-film patterns A mask for aligning the substrate-side alignment mark corresponding to the substrate-side alignment mark previously formed on the substrate, having the same arrangement pitch as the thin film pattern and the same opening pattern 4 in the form of a matrix. The opening pattern 4 is located in the first through hole 1 and the film 6 having the side alignment mark 5 Click-side alignment marks 5 are closely so as to be located in the second through-hole 2 has a structure formed by bonding one end face 7a of the frame 7 of the frame to the periphery of the magnetic metal member 3.

The first step S1 includes a plurality of first and second layers having a shape dimension larger than that of the thin film pattern and the substrate side alignment mark at positions corresponding to the plurality of thin film patterns and the plurality of substrate side alignment marks provided in advance on the substrate. This is a step of forming a mask member 11 in which the magnetic metal member 3 provided with the through holes 1 and 2 and the resin film 6 are in close contact.

More specifically, as shown in FIG. 3 (a), for example, polyimide or polyethylene terephthalate (PET) is provided on one surface 8a of a magnetic metal sheet 8 made of a material such as nickel, nickel alloy, invar or invar alloy having a thickness of 30 μm to 50 μm. ) And the like are applied and dried to form a resin film 6 having a thickness of 10 to 30 μm and transmitting visible light. In this case, the resin liquid may be applied to the inside of the peripheral area of the magnetic metal sheet 8 by screen printing.

Next, as shown in FIG. 3B, a resist is applied on the other surface 8b of the magnetic metal sheet 8 by spraying, for example, and then dried to form a resist film, and then using a photomask. After exposing the resist film, development is performed to form a plurality of first openings 9 having a shape dimension larger than that of the thin film pattern at positions corresponding to the plurality of thin film patterns, and to the substrate side alignment mark provided on the substrate. A resist mask 10 having a second opening (not shown) having a shape dimension larger than that of the substrate side alignment mark is formed at a corresponding position.

Subsequently, as shown in FIG. 3C, the magnetic metal sheet 8 is wet-etched using the resist mask 10 to remove the portion of the magnetic metal sheet 8 corresponding to the first opening 9 of the resist mask 10. Then, the first through-hole 1 is formed, and the magnetic metal member 3 is formed by removing the portion of the magnetic metal sheet 8 corresponding to the second opening and forming the second through-hole 2. Thereby, the mask member 11 in which the magnetic metal member 3 and the resin film 6 are brought into close contact with each other is formed. In addition, the etching liquid for etching the magnetic metal sheet 8 is appropriately selected according to the material of the magnetic metal sheet 8 to be used, and a known technique can be applied.

The second step S2 includes one end face of a frame-like frame 7 made of invar or invar alloy provided with an opening 12 having a size including the plurality of first and second through holes 1 and 2 of the magnetic metal member 3. In this step, the mask member 11 is stretched over 7 a and the peripheral edge of the magnetic metal member 3 is joined to the one end surface 7 a of the frame 7.

More specifically, as shown in FIG. 4A, the mask member 11 has a size that does not cause the mask member 11 to bend in the side (arrow direction) parallel to the surface of the mask member 11. It is positioned above the frame 7 in a tensioned state.

Next, as shown in FIG. 4B, the mask member 11 is stretched on one end surface 7 a of the frame 7 in a state where tension is applied in the side parallel to the surface, and the peripheral portion of the magnetic metal member 3 is stretched. And the frame 7 are spot-welded.

Before the mask member 11 is joined to the frame 7, the opening pattern 4 and the mask side alignment mark 5 may be formed on the film 6. In this case, the mask member 11 is formed on the surface of the mask member 11 as described above. Even if a tension is applied to the parallel sides so that the mask member 11 does not bend, the mask member 11 is as thin as several tens of μm, so that it may be slightly extended. Therefore, after bonding to the frame 7, the opening pattern 4 and the mask side alignment mark 5 may be displaced from the normal positions, and alignment with the substrate may not be achieved. In order to solve such a problem, the present invention is characterized in that the opening pattern 4 and the mask side alignment mark 5 are formed after the mask member 11 is joined to the frame 7. Hereinafter, the process of forming the opening pattern 4 and the mask side alignment mark 5 will be described.

In the third step S3, the film 6 at the position corresponding to the thin film pattern in the first through hole 1 is irradiated with the laser light L to form the opening pattern 4 having the same shape and dimension as the thin film pattern, and the second penetration In this step, the mask side alignment mark 5 is formed by irradiating the portion of the film 6 in the hole 2 corresponding to the substrate side alignment mark with the laser beam L.

More specifically, as shown in FIG. 5A, first, in the first through hole 1 at the upper left corner, for example, the third harmonic of an excimer laser or YAG laser having a wavelength of 400 nm or less, for example, KrF248 nm. or using fourth harmonic, the energy density of the cross-sectional shape perpendicular to the optical axis is shaped in the same shape and size as the thin film pattern is irradiated with a laser beam L of ^{1J / cm 2 ~ 20J / cm} 2, the film 6 To form an opening pattern 4.

Hereinafter, similarly, by moving a stage (not shown) on which the mask member 11 is placed, the irradiation position of the laser light L is indicated by an arrow in FIG. 5A at the same pitch as the arrangement pitch of the thin film pattern. In this way, the opening pattern 4 is respectively formed in the film 6 in each first through-hole 1 while stepping vertically and horizontally from the first through-hole 1 in the upper left corner to the first through hole 1 in the lower right corner. Then, the position of each formed opening pattern 4 is measured, and the XY coordinates (x ₁ , y ₁ ), (x ₁ , y ₂ ), (x ₁ , y ₃ ),. x _n , y _m ) is read and stored in memory.

Subsequently, the XY coordinates of each opening pattern 4 are read from the memory,
x _c = Σx _i / n
y _c = Σy _j / m
Is calculated to calculate the coordinates (x _c , y _c ) of the center position of the opening pattern forming region where the plurality of opening patterns 4 are formed.

Next, as shown in FIG. 5B, the second through-holes that are separated from each other by a predetermined distance in the X and Y directions with reference to the center position coordinates (x _c , y _c ) of the opening pattern formation region. 2, the mask side alignment mark 5 is laser processed at the positions of the XY coordinates (x _p , y _q ), (x _r , y _s ), (x _t , _yu ), and (x _v , y _w ). In this way, the film formation mask shown in FIG. 2 is manufactured.

Thus, if the mask-side alignment mark 5 is formed with reference to the center position coordinates (x _c , y _c ) in the opening pattern formation region, the accumulated error of the opening pattern 4 based on the mechanical error of the stage moving mechanism. Are averaged, and the formation position accuracy of the mask side alignment mark 5 is improved.

FIG. 6 is a plan view showing another embodiment of the third step S3.
In this case, first, for example, the mask side alignment mark 5 is formed in the second through hole 2 located at the upper left corner of the figure, and the laser is based on the design dimensions based on the mask side alignment mark 5. While moving the irradiation position of the light L stepwise in the XY direction, the film 6 portion in each first through hole 1 is laser processed, and another mask side alignment mark 5 is formed on the film 6 portion in the other second through hole 2. Is laser processed. Also in this case, since the opening pattern 4 and the mask side alignment mark 5 are formed in a state where the mask member 11 is stretched around the frame 7, the formation position accuracy of the opening pattern 4 and the mask side alignment mark 5 is improved. .

In the above embodiment, the case where the stage is moved stepwise according to the mechanical accuracy and the opening pattern 4 is formed by changing the irradiation position of the laser beam L has been described. However, the present invention is not limited to this, and the opening pattern 4 is formed. The mask member 11 is placed on a reference substrate on which a reference pattern that is an irradiation target of the laser beam L is formed corresponding to the formation position (design value), and the reference pattern of the reference substrate is moved stepwise. The opening pattern 4 may be formed by irradiating the laser beam L with the aim of.

In the above description, the plurality of first through holes 1 have a rectangular shape and are provided in a matrix at regular intervals on the magnetic metal member 3, and the plurality of opening patterns 4 are formed in the plurality of first through holes 1. However, the present invention is not limited to this, and the plurality of first through holes 1 have a stripe shape and are provided in parallel on the magnetic metal member 3 at regular intervals. The plurality of opening patterns 4 may have a stripe shape and may be formed one by one in the plurality of first through holes 1.

DESCRIPTION OF SYMBOLS 1 ... 1st through-hole 2 ... 2nd through-hole 3 ... Magnetic metal member 4 ... Opening pattern 5 ... Mask side alignment mark 7 ... Frame 11 ... Mask member 12 ... Opening of frame

Claims (8)

A method of manufacturing a film formation mask for forming a plurality of thin film patterns on a substrate,
A plurality of first and second through holes having a shape dimension larger than that of the thin film pattern and the substrate side alignment mark are provided at positions corresponding to the plurality of thin film patterns and a plurality of substrate side alignment marks provided in advance in the substrate. A first step of forming a mask member in which a magnetic metal member and a resin film are brought into close contact;
The mask member is stretched on one end surface of a frame-like frame provided with an opening having a size including the plurality of first and second through holes of the magnetic metal member, and the one end surface of the frame is A second step of joining the periphery of the magnetic metal member;
The film portion at a position corresponding to the thin film pattern in the first through hole is irradiated with laser light to form an opening pattern having the same shape and dimension as the thin film pattern, and the substrate side alignment in the second through hole A third step of forming a mask-side alignment mark by irradiating the film portion at a position corresponding to the mark with laser light;
A method of manufacturing a film-forming mask, characterized in that: The third step includes
While moving the laser beam irradiation position by a predetermined distance, an opening pattern is formed in each of the film portions in the plurality of first through holes, and the coordinates of each opening pattern in the XY plane are read. Saving step;
Reading the stored coordinates of each of the opening patterns, calculating an average value, and calculating center position coordinates in an opening pattern forming region in which a plurality of the opening patterns are formed;
Forming the mask-side alignment mark at a position within the second through-hole that is a fixed distance away from the calculated center position coordinate;
The method of manufacturing a film forming mask according to claim 1, wherein: The third step includes forming the mask alignment mark on the film portion in one second through hole selected from the plurality of second through holes;
The opening pattern is formed in each of the film portions in the plurality of first through holes while stepping the irradiation position of the laser beam by a predetermined distance with reference to the formed mask side alignment mark. And forming another mask side alignment mark on the film portion in the other second through hole,
The method of manufacturing a film forming mask according to claim 1, wherein: The plurality of first through holes have a rectangular shape and are provided in a matrix at regular intervals on the magnetic metal member, and the plurality of opening patterns are formed one by one in the plurality of first through holes, respectively. The method of manufacturing a film formation mask according to any one of claims 1 to 3, wherein: The plurality of first through holes have a stripe shape and are provided in parallel to the magnetic metal member at regular intervals, and the plurality of opening patterns have a stripe shape and have the plurality of the first through holes. The method of manufacturing a film formation mask according to any one of claims 1 to 3, wherein the film formation mask is formed one by one in each through hole. A film formation mask manufactured by the manufacturing method according to any one of claims 1 to 3. A film formation mask manufactured by the manufacturing method according to claim 4. A film forming mask manufactured by the manufacturing method according to claim 5.

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