[go: up one dir, main page]

WO2014076078A3 - Device and method for the treatment of flat material to be treated - Google Patents

Device and method for the treatment of flat material to be treated Download PDF

Info

Publication number
WO2014076078A3
WO2014076078A3 PCT/EP2013/073617 EP2013073617W WO2014076078A3 WO 2014076078 A3 WO2014076078 A3 WO 2014076078A3 EP 2013073617 W EP2013073617 W EP 2013073617W WO 2014076078 A3 WO2014076078 A3 WO 2014076078A3
Authority
WO
WIPO (PCT)
Prior art keywords
treatment
treatment liquid
treated
discharge
flat material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2013/073617
Other languages
French (fr)
Other versions
WO2014076078A2 (en
Inventor
Ferdinand Wiener
Christian Thomas
Olaf Lorenz
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Atotech Deutschland GmbH and Co KG
Original Assignee
Atotech Deutschland GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atotech Deutschland GmbH and Co KG filed Critical Atotech Deutschland GmbH and Co KG
Priority to CN201380051293.XA priority Critical patent/CN104781452B/en
Priority to US14/427,226 priority patent/US9394622B2/en
Priority to ATA9409/2013A priority patent/AT516668B1/en
Priority to JP2015542243A priority patent/JP5938530B2/en
Publication of WO2014076078A2 publication Critical patent/WO2014076078A2/en
Publication of WO2014076078A3 publication Critical patent/WO2014076078A3/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • C25D7/0621—In horizontal cells
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/041—Cleaning travelling work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1619—Apparatus for electroless plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1619—Apparatus for electroless plating
    • C23C18/1628—Specific elements or parts of the apparatus
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1655—Process features
    • C23C18/1664—Process features with additional means during the plating process
    • C23C18/1669—Agitation, e.g. air introduction
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1675—Process conditions
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/02—Tanks; Installations therefor
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C25D17/08—Supporting racks, i.e. not for suspending
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/10—Agitating of electrolytes; Moving of racks
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Automation & Control Theory (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Coating Apparatus (AREA)

Abstract

The device (1) according to the invention is suggested for gentle treatment of a flat material (B) to be treated with a treatment liquid (F). The device (1) has the following components: at least one treatment chamber (20), in which the treatment liquid (F) can be accumulated up to a bath level (M), at least one supply device (7) for the supply of the treatment liquid (F) into the at least one treatment chamber (20), at least one transport device (30), with which the material (B) to be treated can be transported in the horizontal position in a transport plane (E) below the bath level (M) through the at least one treatment chamber (20), at least one reception area (4) for the treatment liquid (F), and at least one discharge device (40) with, respectively, at least one discharge opening (41) for the treatment liquid (F) for conveying it from the at least one treatment chamber (20) with a respective discharge rate into the at least one reception area (4). The at least one discharge device (40) respectively has at least one regulating system (43), with which the discharge rate of the treatment liquid (F) is adjustable through the at least one discharge opening (41).
PCT/EP2013/073617 2012-11-16 2013-11-12 Device and method for the treatment of flat material to be treated Ceased WO2014076078A2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
CN201380051293.XA CN104781452B (en) 2012-11-16 2013-11-12 For processing the device and method of pending flat material
US14/427,226 US9394622B2 (en) 2012-11-16 2013-11-12 Device and method for the treatment of flat material to be treated
ATA9409/2013A AT516668B1 (en) 2012-11-16 2013-11-12 Apparatus and method for treating flat material to be treated
JP2015542243A JP5938530B2 (en) 2012-11-16 2013-11-12 Apparatus and method for processing flat workpieces

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102012221012.1 2012-11-16
DE102012221012.1A DE102012221012B4 (en) 2012-11-16 2012-11-16 Device and method for treating flat items to be treated

Publications (2)

Publication Number Publication Date
WO2014076078A2 WO2014076078A2 (en) 2014-05-22
WO2014076078A3 true WO2014076078A3 (en) 2014-12-04

Family

ID=49596273

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2013/073617 Ceased WO2014076078A2 (en) 2012-11-16 2013-11-12 Device and method for the treatment of flat material to be treated

Country Status (9)

Country Link
US (1) US9394622B2 (en)
JP (1) JP5938530B2 (en)
KR (1) KR101631420B1 (en)
CN (1) CN104781452B (en)
AT (1) AT516668B1 (en)
DE (1) DE102012221012B4 (en)
MY (1) MY177802A (en)
TW (1) TWI561681B (en)
WO (1) WO2014076078A2 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105590987B (en) * 2014-10-20 2022-06-14 苏州易益新能源科技有限公司 Method for horizontal electrochemical deposition of metal
CN105063709B (en) * 2015-09-18 2018-02-23 安捷利电子科技（苏州）有限公司 Use in printed circuit board electroplanting device
DE102015121349A1 (en) * 2015-12-08 2017-06-08 Staku Anlagenbau Gmbh Apparatus for surface treatment of a continuous material and its use
CN107513742B (en) * 2017-08-29 2019-01-04 重庆鑫盟精密模具有限公司 The galvanizing rig of precision die cutting electrode silk core material
JP6910600B2 (en) * 2018-07-05 2021-07-28 株式会社ケミトロン Plating equipment
JP7691416B2 (en) 2019-09-12 2025-06-11 アトテック ドイチュラント ゲー・エム・ベー・ハー ウント コー． カー・ゲー APPARATUS FOR THE WET PROCESSING OF FLAT WORKPIECES, DEVICE FOR A CELL OF THE APPARATUS AND METHOD FOR OPERATING THE APPARATUS - Patent application
CN111587018A (en) * 2020-06-08 2020-08-25 杭州浮瓦科技有限公司 Outdoor electromechanical device protection device capable of rapidly cleaning dust screen
NL2030054B1 (en) * 2021-12-07 2023-06-22 Meco Equipment Eng B V Device and method for the electrolytic treatment of substrates.

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05331687A (en) * 1992-06-01 1993-12-14 Kawasaki Steel Corp Electrolysis device for metal strips
US6068755A (en) * 1996-12-06 2000-05-30 Canon Kabushiki Kaisha Process for forming zinc oxide film and processes for producing semiconductor device plate and photo-electricity generating device using the film
JP2010037600A (en) * 2008-08-05 2010-02-18 Dainippon Screen Mfg Co Ltd Electrodeposition apparatus
US20120231574A1 (en) * 2011-03-12 2012-09-13 Jiaxiong Wang Continuous Electroplating Apparatus with Assembled Modular Sections for Fabrications of Thin Film Solar Cells

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4385967A (en) 1981-10-07 1983-05-31 Chemcut Corporation Electroplating apparatus and method
US4459183A (en) 1981-10-07 1984-07-10 Chemcut Corporation Electroplating apparatus and method
FR2549336B1 (en) 1983-06-23 1986-11-21 Telmec Spa Tec Elett Mecc MACHINE FOR THE CONTINUOUS GOLDING OF LAMELLAR CONNECTORS OF PRINTED CIRCUITS, WITH A TRANSPORT GROUP WHICH CAN MAKE A TRANSLATION
DE3624481A1 (en) 1986-07-19 1988-01-28 Schering Ag ARRANGEMENT FOR THE ELECTROLYTIC TREATMENT OF PLATE-SHAPED OBJECTS
DE3864526D1 (en) 1987-01-26 1991-10-10 Siemens Ag GALVANIZATION DEVICE FOR PANEL-SHAPED WORKPIECES, ESPECIALLY PCB.
ATE66969T1 (en) 1987-01-26 1991-09-15 Siemens Ag GALVANIZING EQUIPMENT FOR PLATE-FORM WORKPIECES, ESPECIALLY CIRCUIT BOARDS.
JPH01252799A (en) * 1988-03-31 1989-10-09 Nkk Corp Method for circulating plating liquid in electroplating
US4986888A (en) 1988-07-07 1991-01-22 Siemens Aktiengesellschaft Electroplating apparatus for plate-shaped workpieces
JPH0456799A (en) 1990-06-22 1992-02-24 Kawasaki Steel Corp Plating solution circulating device for continuous electroplating device
US5803984A (en) * 1996-02-09 1998-09-08 Danieli Wean, A Division Of Danieli Corporation Method and apparatus for rinsing steel product
DE19633796B4 (en) 1996-08-22 2012-02-02 Hans Höllmüller Maschinenbau GmbH Device for electroplating electronic circuit boards
DE19934298A1 (en) 1998-12-22 2000-07-06 Steag Micro Tech Gmbh Device and method for treating substrates
WO2000038218A2 (en) 1998-12-22 2000-06-29 Steag Microtech Gmbh Device and method for treating substrates
DE102005062527A1 (en) * 2005-12-16 2007-06-21 Gebr. Schmid Gmbh & Co. Substrate surface treatment device for production of solar cell, has suction unit provided for suction of fluid process medium from environment of conveying unit and arranged under transport plane in vertical direction

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05331687A (en) * 1992-06-01 1993-12-14 Kawasaki Steel Corp Electrolysis device for metal strips
US6068755A (en) * 1996-12-06 2000-05-30 Canon Kabushiki Kaisha Process for forming zinc oxide film and processes for producing semiconductor device plate and photo-electricity generating device using the film
JP2010037600A (en) * 2008-08-05 2010-02-18 Dainippon Screen Mfg Co Ltd Electrodeposition apparatus
US20120231574A1 (en) * 2011-03-12 2012-09-13 Jiaxiong Wang Continuous Electroplating Apparatus with Assembled Modular Sections for Fabrications of Thin Film Solar Cells

Also Published As

Publication number Publication date
CN104781452B (en) 2016-07-13
AT516668A1 (en) 2016-07-15
TW201430176A (en) 2014-08-01
JP2015535038A (en) 2015-12-07
WO2014076078A2 (en) 2014-05-22
MY177802A (en) 2020-09-23
AT516668B1 (en) 2016-09-15
DE102012221012A1 (en) 2014-05-22
US9394622B2 (en) 2016-07-19
TWI561681B (en) 2016-12-11
JP5938530B2 (en) 2016-06-22
US20150252488A1 (en) 2015-09-10
CN104781452A (en) 2015-07-15
KR101631420B1 (en) 2016-06-16
KR20150084780A (en) 2015-07-22
DE102012221012B4 (en) 2023-01-19

Similar Documents

Publication Publication Date Title
WO2014076078A3 (en) Device and method for the treatment of flat material to be treated
ZA201804215B (en) Method and device for treating water condensed from water vapor contained in the air, and related method and system for generating potable water
MY190126A (en) Glass furnace
MY192571A (en) Treatment installation and method for treating workpieces
WO2014018236A3 (en) Support apparatus for moving proppant from a container in a proppant discharge system
MX2015003996A (en) Handling device.
MX2016004192A (en) Cleaning apparatus.
SG10202112527PA (en) Discharge device for liquid material containing solid particles, discharge method and coating device
EP2991933A4 (en) SYSTEM AND METHOD FOR TREATING HYDROSYSTEMS WITH HIGH VOLTAGE DISCHARGE AND OZONE
MX2012008248A (en) Liquid supply system for a gravity feed spray device.
AU2015299168A8 (en) Feed unit for feeding a liquid foodstuff to a beverage dispensing device and method for cleaning at least one feed unit for feeding a liquid foodstuff to a beverage dispensing device
SG11201800033QA (en) Discharge device and discharge method for liquid material containing solid particles, and coating device
RU2017113543A (en) CONTAMINATED SOIL TREATMENT SYSTEM AND APPROPRIATE METHOD
MX2016009536A (en) Package for light activated treatment composition.
PT3209700T (en) Integrated process for processing and utilising the guayule plant
MY172956A (en) Shower-type wet texturing equipment for solar silicon wafers and method thereof
WO2010088501A3 (en) Material sheet handling system and processing methods
WO2015114283A3 (en) Facility for delivery and treatment of cryogenic liquid
MX383517B (en) DEVICE AND METHOD FOR RELIABLE SUPPLY OF SUITABLE CLOGGING ELEMENTS.
NZ729423A (en) System and method for treating water or wastewater
WO2013135959A3 (en) A method and a system for treating liquid flows at a chemical pulp mill
GEP20217219B (en) Apparatus for storing organic material
WO2015051290A3 (en) Method and apparatus for loading, melting and delivering fluid
MA39786A (en) Heat-medium discharge device and heat-medium discharge method
EA201690086A1 (en) ALUMINUM SLAX PROCESSING

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 13792319

Country of ref document: EP

Kind code of ref document: A2

DPE1 Request for preliminary examination filed after expiration of 19th month from priority date (pct application filed from 20040101)
WWE Wipo information: entry into national phase

Ref document number: 14427226

Country of ref document: US

ENP Entry into the national phase

Ref document number: 20157008481

Country of ref document: KR

Kind code of ref document: A

WWE Wipo information: entry into national phase

Ref document number: ATA 9409/2013

Country of ref document: AT

ENP Entry into the national phase

Ref document number: 2015542243

Country of ref document: JP

Kind code of ref document: A

122 Ep: pct application non-entry in european phase

Ref document number: 13792319

Country of ref document: EP

Kind code of ref document: A2