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WO2014073905A1 - Capteur optique de proximité et procédé pour sa fabrication - Google Patents

Capteur optique de proximité et procédé pour sa fabrication Download PDF

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Publication number
WO2014073905A1
WO2014073905A1 PCT/KR2013/010136 KR2013010136W WO2014073905A1 WO 2014073905 A1 WO2014073905 A1 WO 2014073905A1 KR 2013010136 W KR2013010136 W KR 2013010136W WO 2014073905 A1 WO2014073905 A1 WO 2014073905A1
Authority
WO
WIPO (PCT)
Prior art keywords
cavity
housing plate
light
pcb substrate
optical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2013/010136
Other languages
English (en)
Korean (ko)
Inventor
송청담
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SHIN-OH ELECTRONICS Co Ltd
Original Assignee
SHIN-OH ELECTRONICS Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020120126984A external-priority patent/KR101336781B1/ko
Priority claimed from KR1020120145372A external-priority patent/KR101457069B1/ko
Priority claimed from KR1020130067779A external-priority patent/KR101476994B1/ko
Application filed by SHIN-OH ELECTRONICS Co Ltd filed Critical SHIN-OH ELECTRONICS Co Ltd
Priority to CN201390001048.3U priority Critical patent/CN205209633U/zh
Publication of WO2014073905A1 publication Critical patent/WO2014073905A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J1/00—Photometry, e.g. photographic exposure meter
    • G01J1/02—Details
    • G01J1/04—Optical or mechanical part supplementary adjustable parts
    • G01J1/0407—Optical elements not provided otherwise, e.g. manifolds, windows, holograms, gratings
    • G01J1/0414—Optical elements not provided otherwise, e.g. manifolds, windows, holograms, gratings using plane or convex mirrors, parallel phase plates, or plane beam-splitters
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S17/00—Systems using the reflection or reradiation of electromagnetic waves other than radio waves, e.g. lidar systems
    • G01S17/02—Systems using the reflection of electromagnetic waves other than radio waves
    • G01S17/04—Systems determining the presence of a target
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
    • G01S7/48—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S17/00
    • G01S7/481—Constructional features, e.g. arrangements of optical elements
    • G01S7/4811—Constructional features, e.g. arrangements of optical elements common to transmitter and receiver
    • G01S7/4813—Housing arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/40—Optical elements or arrangements
    • H10F77/413—Optical elements or arrangements directly associated or integrated with the devices, e.g. back reflectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/50—Encapsulations or containers

Definitions

  • the present invention relates to a roughness sensor that implements a function of an illuminance sensor and a proximity sensor, and more particularly, to an optical roughness sensor that can increase light efficiency, improve EMI shielding characteristics, and reduce manufacturing cost of a light source, and to manufacture the same. It is about a method.
  • proximity sensor is a sensor that detects the proximity of an object without physical contact, and according to the sensing principle, a magnetic proximity sensor, an ultrasonic proximity sensor, an electrostatic proximity sensor, an inductive proximity sensor, an optical proximity sensor, etc. Separated by.
  • Optical Proximity Sensor consists of light emitting device that emits light and light receiving device that detects light.Infrared light emitting diode (IR LED) is mainly used as light emitting device, and phototransistor or photodiode is used as light receiving device. Used.
  • the illumination sensor is for detecting the brightness of the human eye, it consists of a light receiving element for detecting a visible light region. Therefore, since the optical proximity sensor and the illuminance sensor have similar parts, the trend is to use the illuminance sensor that integrates the illuminance sensor and the proximity sensor in small electronic products such as smart phones that require the illuminance sensor and the proximity sensor at the same time. .
  • the illuminance sensor is usually implemented as a light emitting unit and a light receiving unit as one assembly.
  • the light emitting unit emits infrared rays
  • the light receiving unit detects infrared rays of the light emitting unit reflected from an object to detect an infrared light receiving unit and surrounding visible light for detecting proximity. It consists of a visible light receiving unit for detecting the illuminance.
  • Conventional muscle illuminance sensor uses an injection molded lens to increase the light efficiency of the light source to secure a certain distance from which the object (subject) starts to be detected, but to prevent leakage of light. It is necessary to take additional measures such as sealing material, and the method of forming a reflector on a single-layer PCB plate is also difficult to form a uniform through-hole in the plate, so that the yield is remarkably low and the reality is insufficient. ) Designed without considering shielding, there is a problem in that reliability is reduced in a noise environment and costs are increased by using an expensive ceramic substrate.
  • an object of the present invention is to form a through-hole in a single layer plate (plate) and to coat the metal to form a reflector accurately and simply, this plate It also serves as a housing to protect the device being accommodated. Accordingly, an object of the present invention is to improve the light efficiency of the light source, improve the EMI shielding characteristics, and improve the manufacturing process, thereby reducing manufacturing costs. It is to provide a sensor and a method of manufacturing the same.
  • another object of the present invention is to form a through hole in a plate of a single layer (plate), and then coated with a dielectric on it to prevent oxidation in the air while using silver having good reflection properties of infrared rays It is to provide an optical roughness sensor and a method of manufacturing the same that can be lowered.
  • the senor of the present invention constitutes a side wall of a first cavity for mounting an IR LED chip, and has an inverted conical hole and an optical sensor cut off at a tip having a diameter larger than a lower diameter.
  • Conical hole is formed with the cut-out of the corner of the second cavity for mounting the integrated ASIC chip and the end diameter serving as the opening is smaller than the diameter of the lower part, and the surface roughness so that the side wall of the first cavity is well reflected
  • a housing plate formed to have a mirror surface and having a metal-coated reflector integrated therein;
  • a circuit pattern is formed to be bonded to the housing plate to form a first cavity and a second cavity, and to mount the elements accommodated on the bottom surface of the first cavity and the bottom surface of the second cavity and to be connected for electrical connection.
  • IR LED chip mounted on the PCB substrate on the bottom surface of the first cavity formed by the housing plate and the PCB substrate and emitting infrared light when power is supplied; And mounted on the bottom PCB board of the second cavity formed by the housing plate and the PCB board to drive the IR LED chip when power is supplied, and to detect proximity by receiving infrared rays reflected from an object, and to detect nearby visible light. It is characterized in that it comprises a photo sensor integrated ASIC chip for detecting the illuminance of the line.
  • the method of the present invention forms a first cavity hole for mounting an IR LED chip on a housing plate, and a second cavity hole for mounting an ASIC chip with an optical sensor integrated thereon, in whole or in part.
  • the roughness sensor according to the present invention can easily form a reflector by forming a through hole in a plate, thereby improving light efficiency of the light source, improving EMI shielding properties, and protecting the device in which the plate is accommodated. It also serves as a housing, simplifying the structure, improving the process and reducing manufacturing costs.
  • the roughness sensor according to the present invention coated silver on a cavity for accommodating infrared LEDs, and then coated a dielectric thereon to prevent oxidation in the air and improve light efficiency while using silver having good reflection characteristics of infrared rays.
  • a dielectric thereon to prevent oxidation in the air and improve light efficiency while using silver having good reflection characteristics of infrared rays.
  • the roughness sensor according to the present invention may use any one of plastic, rubber, silicone, foam, sponge, resin, and metal as the upper cap, and in the case of rubber, silicone, foam, and sponge, the adhesion to the mechanism is improved, and There is an additional effect that can prevent the parts from being destroyed by this.
  • FIG. 2 is a side cross-sectional view of an optical roughness sensor according to a first embodiment of the present invention
  • FIG. 3 is a perspective view of the housing plate shown in FIG.
  • FIG. 4 is a side cross-sectional view of an optical roughness sensor according to a second embodiment of the present invention.
  • FIG. 5 is a side cross-sectional view of an optical roughness sensor according to a third embodiment of the present invention.
  • FIG. 6 is a side cross-sectional view of an optical roughness sensor according to a fourth embodiment of the present invention.
  • FIG. 7 is a block diagram illustrating an optical roughness sensor according to the present invention.
  • FIG. 1 is a schematic diagram illustrating a manufacturing procedure of a roughness sensor according to the present invention.
  • the manufacturing process of the roughness sensor according to the present invention includes forming a hole for a reflector and a mounting space in a square plate and coating a metal with a first sub-assembly process (S1 to S3), and a rectangular PCB.
  • the copper foil layer is formed, after the gold plating, the through hole is processed, and a pad for connecting with the outside is formed to mount the LED chip on the bottom part of the PCB board and the ASIC chip on the other part of the bottom board PCB.
  • a predetermined encapsulation process may be performed before or after the step S10. This process is based on a general purpose and a method of application, and thus is not particularly limited.
  • sidewalls of a cavity for mounting an IR LED chip and an ASIC chip are formed by forming through holes having a predetermined shape in a square plate (S1, S2).
  • the shape of the through hole for the cavity is a cone with a cut off or a cone with a cut off, a cylinder, an oval with a cut off, an inverted cone with a cut off, a square cone with a cut off, an inverted prismatic cone, an elliptical column, a square column, Or a variety of shapes, such as the double bond type of the above form (for example, a cylinder is possible on the square column) is possible.
  • the rectangular plate formed with the cavity also serves as a housing for accommodating the element.
  • the square plate is referred to as a 'housing plate'.
  • the housing plate is formed of a metal or plastic material by processing or injection molding, and all or a part of the reflector formed on the plate is coated with a metal such as gold or silver, thereby implementing the reflector integrated housing structure (S3).
  • the plated silver may be coated with a dielectric to prevent oxidation in the air while using silver having good reflection characteristics of infrared rays, thereby lowering the manufacturing cost.
  • the optical thickness of the dielectric thin film it is possible to increase the reflectance of the reflected light in the desired wavelength range to enhance the light reflected from the silver without loss, and as a dielectric, SiO 2 , TiO 2 , Al 2 O 3 And the like can be used.
  • the housing plate and the PCB are bonded to each other to complete an assembly having a first cavity in which an IR LED chip is mounted and a second cavity in which an ASIC chip is mounted (S10).
  • the cap is attached to the upper portion of the housing plate as necessary (S11).
  • the upper cap may be made of plastic, silicone, rubber, foam, sponge, resin, or metal. In the case of rubber, silicone, foam, and sponge, the upper cap may have an additional effect of improving device adhesion. You can get it.
  • the manufacturing cost can be reduced by easily forming holes in the housing plate using processing technology or injection molding.
  • the roughness sensor according to the present invention can increase the light efficiency by the reflector structure itself integrated into the housing plate for protecting the element to be accommodated, so that the condensation of the radiated light through the reflector is increased and consequently reflected from the subject to the light sensor Since the amount of light reached increases, it is possible to detect light reflected from a subject at a greater distance.
  • the integration time can be shortened, so that the proximity detection response speed or the output signal processing speed can be increased, and the metal such as gold is coated on the reflective surface to increase the light efficiency. Can be.
  • FIG. 2 is a side cross-sectional view of an optical roughness sensor according to a first embodiment of the present invention
  • 3 is a perspective view of a housing plate 110 used in the first embodiment of the present invention.
  • the optical roughness sensor 100 has an inverted corner of the sidewall 114a of the first cavity 112 for mounting the IR LED chip 140.
  • Conical holes hereinafter referred to simply as 'inverted cones'
  • conical holes hereinafter referred to as simply 'conical holes'
  • the side wall (114a) constituting the first cavity (112) is formed to have a mirror surface with a roughness of the surface so that the reflection is good, the reflector-integrated housing plate material 110 and the metal plate coated, the housing plate material 110 and Are bonded to form a first cavity 112 and a second cavity 118, and an IR LED chip 140 and an optical sensor integrated ASIC chip 150 on the bottom surfaces of the first cavity 112 and the second cavity 118.
  • a hole having a diameter of an end serving as an opening having a conical shape smaller than a diameter of a lower portion is formed, and is bonded to the PCB substrate 120 to form a second cavity 118.
  • the IR LED 140 When mounted on a PCB board on the bottom of the cavity, when the power is supplied, the IR LED 140 is driven and an infrared light reflected from the object is received to detect proximity and to detect the illuminance of visible light in the surroundings.
  • Cone formed in housing plate for drawing light It consists of an opening (118a) formed at the hole edge.
  • the IR LED chip 140 and the ASIC 150 are bonded to the PCB substrate 120 through the adhesive 162.
  • the housing plate 110 of the first embodiment includes a first cavity hole 112 formed in an inverted cone shape in which the diameter of the end serving as the opening 112a is larger than the diameter of the lower portion.
  • the second cavity hole 118 is formed in a conical shape having a diameter smaller than the diameter of the lower end of the tip 118a.
  • the side wall 114a constituting the first cavity 112 may be formed. It has a roughness of the surface to reflect well and is formed to be a mirror surface, and a metal such as gold is coated. The coating of metal is applied to all or part of the housing plate 110.
  • a silver coated layer 10 coated with silver having good infrared reflecting properties is formed on the sidewall 114a, and to prevent oxidation of silver on the silver coated layer.
  • Dielectric is coated to form dielectric layer 20.
  • the housing plate 110 of the first embodiment forms an inverted cone reflector in the first cavity 112 to efficiently radiate the light emitted from the IR LED 140 toward the opening 112a, and the housing plate (
  • the metal cavity is formed of a metal hole formed in the second cavity 118 and a metal layer formed on the PCB substrate 120 bonded to the housing plate, so that the second cavity is made of a metal body to be accommodated in the second cavity 118. It is possible to greatly shield the device from electromagnetic noise.
  • the housing plate 110 When the housing plate 110 is made of a plastic material, if necessary, that is, when the influence from electromagnetic noise occurs, the plate 110 is coated with a metal to shield the electromagnetic noise.
  • an opening 112a is formed at an end of an inverted conical hole formed in the housing plate 110 to emit light of the IR LED 140 from the first cavity 112, and the ASIC chip also is formed in the second cavity 118.
  • An opening 118a is formed at the end of the conical hole formed in the housing plate 110 to introduce light to the light receiving portion side of the 150.
  • the roughness sensor 100 has an inverted cone shape in which the diameter of the tip, which serves as the opening 112a, is greater than the diameter of the lower portion of the housing plate 110 that protects the received device. While forming a hole, a diagonal sidewall 114a is formed to be a mirror surface and coated with a metal. Then, the copper foil layer 122a is formed on the upper surface of the PCB substrate 120, and gold plating is performed. Then, the IR LED 140 is mounted thereon, and then coupled with the housing plate 110 to form a stem having a reflector shape. ) Constitutes a first cavity 122. Since the light emitted from the IR LED 140 of the first cavity 112 configured as described above is reflected by a reflector having an inverted cone shape, the light emitted can be efficiently passed through the opening 112a of the upper portion of the housing plate. have.
  • the plate 110 having a cavity is used as a housing, but considering that the height capable of constructing the reflector in the first cavity 112 is up to the thickness (height) of the plate, the plate 110 is a single layer. Since the thickness is sufficient to serve as the housing, it can afford to secure the height of the side wall of the reflector, thereby making it possible to lengthen the reflection path, which is a major factor for increasing the light condensing of the light emitted from the IR LED 140, and sufficiently reflects the light. I can make it big.
  • the present invention provides a single layer of reflector-integrated housing plate with a simple structure, thereby increasing space utilization and making it possible to fully utilize the height of the single layer, thereby easily securing a sufficient reflection path. The light efficiency can be increased.
  • the reflector configured in this way has a high emissivity in the direction of the direction of the opening surface as the light emitted in any direction from the IR LED passes through a long reflective path with a predetermined angle of inclined surface, so that the light condensation is increased without the lens and radiated within the required angle.
  • the amount of light is easily increased, and the light distribution of the emitted light and the amount of light are also easily adjusted by adjusting the angle of the reflection surface of the side wall.
  • the roughness sensor 100 can increase the light efficiency by the reflector structure itself integrated into the housing combined plate for protecting the element to be accommodated, so that the light condensation of the radiation is increased through the reflector
  • the amount of light that is reflected from the subject and reaches the light sensor also increases, so if you use a light sensor with a fixed detection power and an IR LED with a fixed self-emission light, It is possible to detect and reduce the integration time by quickly accumulating the required amount of critical light in the ASIC chip 150 integrated with the optical sensor, thereby increasing the proximity sensing response speed or the output signal processing speed, and the reflection surface of the metal such as gold
  • the coating can be performed to increase the light efficiency.
  • the detection distance of the subject can be further increased, and conversely, depending on the application, the detection distance may be lowered to a certain level required for use. In this way, the amount of emitted light of the IR LED 140 is increased. It is possible to reduce the area of the LED chip, which is one of the main factors to determine the cost, which also reduces the cost.
  • the light emitted to the side of the IR LED 140 may also be radiated to the opening 112a by the reflecting surface configured up to the side of the IR LED.
  • the light-receiving unit for detecting the light emitted from the first cavity (C1) reflected by the object is conical shape of the end of the end portion that serves as the opening 118a in the housing plate 110 is smaller than the diameter of the lower portion
  • the sidewalls 114b of the furnace holes are formed, the copper foil layer 122b is formed on the upper surface of the PCB substrate 120, and gold plating is performed.
  • the ASIC chip 150 having an optical sensor is mounted thereon, and then metal is coated.
  • the second cavity 118 is configured by combining with the housing plate 110.
  • the second cavity 118 configured as described above has the advantage that the EMI shielding property is improved even in the strong electromagnetic noise environment in which the ASIC chip 150 is shielded by the metal on the sidewall part and the lower part.
  • the housing plate 110 uses a plate of metal or plastic, and a metal coating is applied to all or part of the plate, in particular, in the case of applying a metal coating to only a portion of the plate 110 of plastic, the effect of electromagnetic noise is In a generated environment, a metal coating may be applied to the side walls of the second cavity 118 to prepare for electromagnetic noise.
  • first cavity 112 and the second cavity 118 are made of an opaque plastic-based material coated with metal or metal, the light emitted from the IR LED 140 is transferred to the photosensor of the ASIC chip 150. It is also possible to prevent leakage and cross talk.
  • the material of the reflector integrated housing plate 110 uses a conventional metal or an injection molded opaque plastic material, and the metal coated on the housing plate 110 uses a material that effectively reflects infrared rays such as gold.
  • PCB substrate 120 uses a material used for the PCB, for example FR-4.
  • FIG. 4 is a side cross-sectional view of an optical roughness sensor according to a second embodiment of the present invention.
  • the optical roughness sensor 200 includes an inverted conical hole constituting a side wall of the first cavity 212 for mounting the IR LED chip 240.
  • a housing plate 210 having a square column-shaped hole constituting the side wall of the second cavity 218 and the housing plate 210 to be joined to form a first cavity 212 and a second cavity 218, and Square PCB board with circuit pattern formed to mount IR LED chip 240 and optical sensor integrated ASIC chip 250 on the bottom surface of first cavity 212 and second cavity 218 and connect them for electrical connection.
  • An IR LED chip 240 mounted on the PCB substrate on the bottom surface of the first cavity 212 formed by the housing plate 210 and the PCB substrate 220, and emits infrared rays when the power is supplied. And mounted on the PCB substrate on the bottom surface of the second cavity 212 formed by the housing plate 210 and the PCB substrate 220 to supply power. If also drive the IR LED chip 240 and the light-receiving as well as the infrared ray reflected by the object to detect a close-up and consists of a light sensor-integrated ASIC chip 250, which detects the intensity of visible light in the surrounding. Through-holes 224a and 224b and connection pads 226-1 to 226-5 for signal connection are formed in the PCB substrate 220.
  • the optical roughness sensor 200 of the second exemplary embodiment may connect the ASIC chip 250 and the reverse conical sidewall 214a of the first cavity 212 to accommodate the IR LED chip 240 in the housing plate 210.
  • a hole for the straight wall sidewall 214b of the second cavity 218 for receiving is formed, and the PCB substrate 220 has an IR LED (on the PCB substrate 220 of the bottom surface 222a of the first cavity 212).
  • 240 is mounted and the ASIC chip 250 is mounted on the PCB substrate 220 of the bottom surface 222b of the second cavity 218.
  • light is introduced into the light-receiving side of the ASIC chip 250 from the end of the inverted conical hole formed in the housing plate 210 and the second cavity 218 to emit light of the IR LED chip 240 from the first cavity 212.
  • Openings 212a and 218a are formed at the ends of the rectangular pillar-shaped holes formed in the housing plate 210, respectively.
  • the roughness sensor 200 has a diameter of the lower end of the end portion serving as the opening 212a in the housing plate 210 for protecting the received device. While forming a hole in a larger inverted cone shape, the diagonal side wall 214a is formed to be a mirror surface and coated with metal, and a copper foil layer 222a is formed on the upper surface of the PCB substrate 220, and then gold plating is performed. After mounting the IR LED 240 thereon, the first cavity 212 is configured as a kind of stem structure having a reflector shape by combining with the housing plate 210.
  • the light emitted from the IR LED 240 of the first cavity configured as described above is reflected by a reflector having an inverted cone shape, there is an advantage that the emitted light can be efficiently passed through the opening (Apature) 212a above the housing plate.
  • the light receiving unit for detecting the light emitted from the first cavity 212 reflected by the object is formed in the housing plate 210 to form a hole in a straight wall for mounting the ASIC 250 including a processor
  • the side wall 214b of the second cavity 218 is formed, the copper foil layer 222b is formed at the center of the upper surface of the PCB substrate 220, and gold plating is performed thereon, and then the ASIC chip 250 is mounted thereon.
  • the second cavity 218 is combined with the coated housing plate 210 to form the second cavity 218.
  • the ASIC chip 250 is shielded by the metal on the sidewall and the lower portion, so that EMI shielding characteristics are improved even in the surrounding strong electromagnetic noise environment.
  • the housing plate 210 uses a metal or plastic-based plate, and the metal coating is applied to all or part of the reflector formed on the plate, in particular, in the case of applying a metal coating to only a part of the plate 210 of plastic
  • a metal coating may be applied to the side walls of the second cavity 218 to prepare for electromagnetic noise.
  • a silver coated layer 10 coated with silver having good infrared reflection characteristics is formed on the sidewall 214a as shown in the enlarged view of FIG. 4, and oxidation of silver on the silver coated layer is performed.
  • oxidation of silver on the silver coated layer is performed.
  • dielectric is coated to form a dielectric layer 20.
  • first cavity 212 and the second cavity 218 are made of a metal or metal-based opaque plastic material, light emitted from the IR LED 240 is transferred to the photosensor of the ASIC chip 250. It is also possible to prevent leakage and cross talk.
  • FIG. 5 is a side cross-sectional view of an optical roughness sensor according to a third embodiment of the present invention.
  • an inverted conical hole constituting the sidewall of the first cavity 312 for mounting the IR LED chip 340 is formed, and the sidewall of the inverted conical hole ( 314a is formed to have a mirror surface with good surface roughness to reflect well, and the reflector-integrated housing plate material 310 coated with metal and the housing plate material 310 are joined to form a first cavity 312, A rectangular PCB substrate 320 having a circuit pattern formed thereon so as to mount the IR LED chip 340 on the bottom surface 322a of the cavity and to be connected for electrical connection, and by the housing plate 310 and the PCB substrate 320.
  • the hole 314b is formed in the shape of a small cone and bonded to the PCB substrate 320 to form a second cache.
  • the tee 318 is formed and mounted on the PCB substrate 310 at the bottom of the second cavity 318, when the power is supplied, the IR LED 340 is driven and the infrared light reflected from the object is received to detect proximity.
  • the roughness sensor 300 is coupled with a housing plate 310 in which a reflector is integrated while protecting an element accommodated in the configuration of the present invention described in the first embodiment.
  • an opening 332 for emitting light of the IR LED 340 is formed on the first cavity 312 in which the IR LED 340 is mounted, and the light receiving part of the ASIC chip 350 is disposed on the second cavity 318.
  • An upper cap 330 having an opening 332 for introducing light to the side is further configured.
  • a silver coated layer 10 coated with silver having good infrared reflection characteristics is formed on the sidewall 314a as shown in the enlarged view of FIG. 5, and oxidation of silver on the silver coated layer is performed.
  • oxidation of silver on the silver coated layer is performed.
  • dielectric is coated to form a dielectric layer 20.
  • the first embodiment can be applied to a smart phone, etc. without the addition of a separate component to implement the effect of the present invention, but the optical and mechanical conformation of the light emission and incoming in the mobile phone to which the product of the first embodiment is applied
  • the additional upper cap 330 is configured as described above, the present invention freely adjusts the distance or aperture between the openings of the upper cap 330 without changing other components. There is an advantage that can facilitate easy matching.
  • the upper cap 330 may be formed of plastic, rubber, silicone, foam, sponge, resin, or metal. In the case of silicone, rubber, foam, and sponge, the adhesion Additional effects can be obtained.
  • FIG. 6 is a side cross-sectional view of an optical roughness sensor according to a fourth embodiment of the present invention.
  • the optical roughness sensor 400 has a housing plate 410 in which a reflector is integrated while protecting an element accommodated in the configuration of the invention described in the second embodiment. ) And an opening 432 for emitting the light of the IR LED 440 is formed on the first cavity 412 on which the IR LED 440 is mounted, and the ASIC chip 450 is disposed on the second cavity 418.
  • the upper cap 430 of the quadrangular formed with an opening 432 for introducing light to the light-receiving portion side of the) is further configured.
  • a silver coated layer 10 coated with good infrared reflection characteristics is formed on the sidewall 414a as shown in the enlarged view of FIG. 4, and oxidation of silver on the silver coated layer is performed.
  • oxidation of silver on the silver coated layer is performed.
  • dielectric is coated to form a dielectric layer 20.
  • the second embodiment can be applied to a smart phone, etc. without the addition of a separate component to implement the effect of the present invention, but the optical and mechanical conformation of the light emission and incoming in the mobile phone to which the product of the second embodiment is applied
  • the additional upper cap 430 is configured as described above, the present invention freely adjusts the distance or aperture between the openings of the upper cap 430 without changing other components. There is an advantage that can facilitate easy matching.
  • the upper cap 430 may be formed of plastic, rubber, silicon, foam, sponge, resin, or metal, and in the case of silicon, rubber, foam, and sponge Additional effects can be obtained.
  • the ASIC chips 150 to 450 and the IR LEDs 140 to 440 are connected to each other through a copper foil pattern or wiring bonding of a PCB (not shown), and holes or via holes 124 to 424.
  • a PCB not shown
  • the housing plate which is itself metal or metal-coated, may be connected to the connection terminal formed on the bottom surface of the PCB substrate and grounded through a hole or via hole, if necessary.
  • the PCB substrates 120 to 420 have a structure in which a copper foil layer is formed on the FR-4 substrate.
  • one of the conventional methods is encapsulation with resin, epoxy, and silicon.
  • FIG. 7 is a block diagram illustrating an optical roughness sensor according to the present invention.
  • the roughness sensor includes an infrared light emitting diode (IR LED) 140 emitting infrared rays, an infrared ray sensing unit 151 for receiving infrared rays reflected from an object, and infrared sensing
  • An analog-to-digital converter 152 for converting the analog detection signal of the unit 151 to digital, an illumination intensity sensing unit 153 for sensing the illumination of visible light in the surroundings, and an analog sensing signal for converting the analog sensing signal of the illumination sensing unit into digital
  • An interface and a controller 156 for controlling the driver 157, and an IR LED driver 157 for driving the infrared light emitting diode 140.
  • the IR detector 151, the ADCs 152 and 154, the illumination intensity detector 153, the DSP 155, the interface and the controller 156, and the IR LED driver 157 are implemented by the ASIC chip 150.
  • the interface and controller 156 communicates with an external controller 42 in an I2C interface.
  • the IR detector 151 is an infrared photodiode for sensing proximity and the illuminance detector 153 is a photodiode for sensing illuminance of visible light in the surroundings.
  • the controller 42 exchanges data via the interrupt line INTB, SCL line, and SDA line.

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Remote Sensing (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Photometry And Measurement Of Optical Pulse Characteristics (AREA)
  • Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)

Abstract

La présente invention concerne un capteur optique de proximité qui est capable d'améliorer le rendement optique d'une source lumineuse, qui présente des caractéristiques améliorées de protection contre les IEM et qui peut être fabriqué à un coût de fabrication réduit. Le capteur de la présente invention comporte: une plaque de logement intégrée à un réflecteur comprenant un trou tronconique inversé et un trou tronconique, le trou tronconique inversé formant une paroi latérale d'une première cavité servant à monter une puce de DEL à IR et présentant une extrémité supérieure servant d'ouverture d'un diamètre plus grand que le diamètre de son extrémité inférieure, le trou tronconique formant une paroi latérale d'une deuxième cavité servant à monter une puce ASIC intégrée avec un capteur optique et présentant une extrémité supérieure servant d'ouverture d'un diamètre plus petit que le diamètre de son extrémité inférieure, chaque trou présentant une paroi latérale présentant une surface de miroir dotée d'un éclairage de surface pour une réflexion aisée, la totalité ou une partie de la plaque étant revêtue de métal, et la plaque servant de logement pour protéger des éléments logés dans celle-ci; un substrat de PCB qui est collé à la plaque de logement de façon à former une première cavité et une deuxième cavité, et sur lequel est formé un tracé de circuit de façon à monter des éléments reçus sur la surface inférieure de la première cavité et la surface inférieure de la deuxième cavité et à permettre un câblage en vue d'une liaison électrique; la puce de DEL à IR qui est montée sur le substrat de PCB à la surface inférieure de la première cavité formée par la plaque de logement et le substrat de PCB, et qui émet un rayon infrarouge lorsqu'elle est alimentée; et la puce ASIC intégrée avec capteur optique montée sur le substrat de PCB à la surface inférieure de la deuxième cavité formée par la plaque de logement et le substrat de PCB et de façon à exciter, lorsqu'elle est alimentée, la puce de DEL à IR et à recevoir des rayons infrarouges réfléchis par un objet de façon à détecter la proximité et à détecter ainsi l'intensité d'éclairage de la lumière visible ambiante.
PCT/KR2013/010136 2012-11-09 2013-11-08 Capteur optique de proximité et procédé pour sa fabrication Ceased WO2014073905A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201390001048.3U CN205209633U (zh) 2012-11-09 2013-11-08 光学近照度传感器

Applications Claiming Priority (6)

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KR10-2012-0126984 2012-11-09
KR1020120126984A KR101336781B1 (ko) 2012-11-09 2012-11-09 광학 근조도 센서 및 그 제조방법
KR10-2012-0145372 2012-12-13
KR1020120145372A KR101457069B1 (ko) 2012-12-13 2012-12-13 광학 근조도 센서
KR1020130067779A KR101476994B1 (ko) 2013-06-13 2013-06-13 광학 근조도 센서 및 그 제조방법
KR10-2013-0067779 2013-06-13

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WO2017101253A1 (fr) * 2015-12-18 2017-06-22 深圳市金立通信设备有限公司 Dispositif de télémétrie laser, dispositif d'imagerie, et terminal associé
CN112071832A (zh) * 2020-09-14 2020-12-11 深圳帝显高端制造方案解决有限公司 一种带红外触摸功能rgb-led芯片单元
US11486817B2 (en) * 2019-10-30 2022-11-01 Ricoh Company, Ltd. Detecting device, detecting unit, and detecting system
TWI873140B (zh) * 2019-05-29 2025-02-21 瑞士商Ａｍｓ國際有限公司 減少光學感測器模組中之光學串擾之裝置及方法
EP4546006A1 (fr) * 2023-10-25 2025-04-30 STMicroelectronics International N.V. Module de capteur optique

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EP3486955A4 (fr) * 2016-07-14 2020-03-11 KYOCERA Corporation Boîtier pour des photocapteurs, dispositif de photocapteur et module électronique
EP3139159A1 (fr) * 2016-08-23 2017-03-08 Sensirion AG Ensemble de capteurs
CN106449543A (zh) * 2016-08-30 2017-02-22 张为凤 一种光电子半导体器件
CN106449437A (zh) * 2016-08-30 2017-02-22 张为凤 一种光电子半导体器件的制造方法
CN106449864B (zh) * 2016-08-30 2018-05-29 江苏派诺光电科技股份有限公司 一种光探测器件的制造方法
CN106298747B (zh) * 2016-08-30 2018-07-24 南通威尔电机有限公司 一种光探测器件
CN109116443B (zh) * 2018-10-17 2021-08-27 深圳南方德尔汽车电子有限公司 雨量阳光传感器
FR3100380B1 (fr) * 2019-09-03 2021-10-01 St Microelectronics Grenoble 2 Dispositif électronique comprenant des composants électroniques optiques et procédé de fabrication
CN111954376A (zh) * 2020-08-27 2020-11-17 贵州航天凯山石油仪器有限公司 一种控制发光元件与光敏元件之间距离的方法及光耦结构

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WO2016105230A1 (fr) * 2014-12-24 2016-06-30 Общество С Ограниченной Ответственостью "Микросенсор Технолоджи" Dispositif pour déterminer des substances chimiques dans un milieu à analyser
WO2017101253A1 (fr) * 2015-12-18 2017-06-22 深圳市金立通信设备有限公司 Dispositif de télémétrie laser, dispositif d'imagerie, et terminal associé
TWI873140B (zh) * 2019-05-29 2025-02-21 瑞士商Ａｍｓ國際有限公司 減少光學感測器模組中之光學串擾之裝置及方法
US11486817B2 (en) * 2019-10-30 2022-11-01 Ricoh Company, Ltd. Detecting device, detecting unit, and detecting system
CN112071832A (zh) * 2020-09-14 2020-12-11 深圳帝显高端制造方案解决有限公司 一种带红外触摸功能rgb-led芯片单元
EP4546006A1 (fr) * 2023-10-25 2025-04-30 STMicroelectronics International N.V. Module de capteur optique
FR3154815A1 (fr) * 2023-10-25 2025-05-02 Stmicroelectronics International N.V. Module de capteur optique

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