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WO2014073682A1 - Composition de résine et article moulé - Google Patents

Composition de résine et article moulé Download PDF

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Publication number
WO2014073682A1
WO2014073682A1 PCT/JP2013/080439 JP2013080439W WO2014073682A1 WO 2014073682 A1 WO2014073682 A1 WO 2014073682A1 JP 2013080439 W JP2013080439 W JP 2013080439W WO 2014073682 A1 WO2014073682 A1 WO 2014073682A1
Authority
WO
WIPO (PCT)
Prior art keywords
fluororesin
resin composition
resin
polyether ketone
aromatic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2013/080439
Other languages
English (en)
Japanese (ja)
Inventor
雅巳 西海
有希 上田
増田　晴久
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Daikin Industries Ltd
Original Assignee
Daikin Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Daikin Industries Ltd filed Critical Daikin Industries Ltd
Priority to JP2014545786A priority Critical patent/JP5907282B2/ja
Publication of WO2014073682A1 publication Critical patent/WO2014073682A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/44—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
    • H01B3/443—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins from vinylhalogenides or other halogenoethylenic compounds
    • H01B3/445—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins from vinylhalogenides or other halogenoethylenic compounds from vinylfluorides or other fluoroethylenic compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/307—Other macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2650/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G2650/28—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule characterised by the polymer type
    • C08G2650/38—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule characterised by the polymer type containing oxygen in addition to the ether group
    • C08G2650/40—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule characterised by the polymer type containing oxygen in addition to the ether group containing ketone groups, e.g. polyarylethylketones, PEEK or PEK
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H01B13/06—Insulating conductors or cables
    • H01B13/14—Insulating conductors or cables by extrusion

Definitions

  • the present invention relates to a resin composition and a molded article.
  • thermoplastic resins such as polyamide resins, polycarbonate resins, polyacetal resins, etc.
  • Electrical and electronic parts have been put into practical use.
  • sliding applications such as gears and bearing retainers, the replacement of metal sliding members with plastic sliding members is progressing, but the sliding members used under conditions such as high load, high temperature, and high speed rotation.
  • the above-mentioned thermoplastic resin has insufficient slidability, and problems such as wear, melting, cracking and chipping may occur.
  • fluororesins are excellent in properties such as slidability, heat resistance, chemical resistance, solvent resistance, weather resistance, flexibility, electrical properties, etc., and are widely used in automobiles, industrial machines, OA equipment, electrical and electronic equipment, etc. Used in the field.
  • the fluororesin is particularly excellent in slidability, and its low coefficient of friction is prominent among the resins.
  • it is often inferior to physical heat resistance as indicated by mechanical properties and deflection temperature under load compared to crystalline heat-resistant thermoplastic resin, and dimensions compared to amorphous heat-resistant thermoplastic resin. In some cases, the stability is inferior, and the range of use is limited.
  • Patent Document 1 includes (A) 70 to 99% by mass of a polyaryl ketone resin and (B) 30 to 1% by mass of a fluororesin, and (B) average particles of the fluororesin dispersed in the resin composition.
  • a resin composition having a diameter of 0.1 to 30 ⁇ m has been proposed.
  • thermoplastic resin In addition to the purpose of improving the slidability, it is known to add a fluororesin to the thermoplastic resin.
  • a fine powder of PEEK resin is mixed in a PFA resin aqueous dispersion at a PFA: PEEK weight ratio of 75:25 to 70:30, and this dispersion is roughened according to a conventional method. It is disclosed that a PFA-PEEK composite coating film having adhesion durability is formed by directly applying to a metal surface and baking it.
  • Patent Document 3 discloses a thermoplastic resin containing a mixture of a polyaryl ketone resin and a thermoplastic fluororesin, wherein the continuous phase of the mixture is the thermoplastic fluororesin, and the dispersed phase is a polyaryl ketone resin. A composition is described.
  • the resin compositions containing polyaryl ketone resins and fluororesins that have been developed so far have a problem of delamination during injection molding, and when polymolds are obtained by extrusion.
  • the present invention has been made in view of the above situation, has excellent electrical characteristics, friction characteristics, chemical resistance, can prevent delamination phenomenon during injection molding, and can extrude during extrusion molding. It is an object of the present invention to provide a resin composition capable of eliminating problems such as unevenness in thickness of a product and foreign matter, particularly tearing in the case of forming a thin film.
  • an aromatic polyetherketone resin is in the form of particles having a specific particle size in a specific fluororesin.
  • the resin composition in which the mass ratio of the aromatic polyetherketone resin to the fluororesin is in a specific range is excellent in electrical characteristics, friction characteristics, chemical resistance, and delamination phenomenon during injection molding.
  • the present invention has found that there are no defects such as uneven thickness of the extrudate and foreign matter, particularly tearing when forming a thin film without agglomeration of aromatic polyetherketone resin particles during extrusion molding. It came to be completed.
  • the aromatic polyetherketone resin (I) is dispersed in the form of particles in the fluororesin (II), and fluorine relative to the total mass of the aromatic polyetherketone resin (I) and the fluororesin (II).
  • the mass ratio of the resin (II) is more than 50 mass% and 99 mass% or less, and the average dispersed particle size in the fluororesin (II) of the aromatic polyether ketone resin (I) is 1 ⁇ m or less. It is a resin composition characterized by these.
  • the melt viscosity ratio (I) / (II) between the aromatic polyether ketone resin (I) and the fluororesin (II) is preferably 1.0 to 5.0.
  • the fluororesin (II) preferably has a melt flow rate of 0.1 to 100 g / 10 min.
  • the aromatic polyether ketone resin (I) is preferably a polyether ether ketone.
  • the resin composition of the present invention is preferably a kneaded product obtained by melt-kneading the aromatic polyether ketone resin (I) and the fluororesin (II).
  • the present invention is also a molded article formed from the resin composition.
  • the molded article of the present invention is preferably used for electric wire coating.
  • the molded article of the present invention is preferably used for semiconductor parts.
  • the present invention also provides an insulated wire having a conductor (A) and an insulating layer (B) formed on the outer periphery of the conductor (A), wherein the insulating layer (B) is formed from the resin composition. It is also an electric wire.
  • the present invention is also a method for producing an insulated wire having a conductor (A) and an insulating layer (B), wherein the method comprises molding the resin composition and forming an insulating layer on the outer periphery of the conductor (A). It is also a manufacturing method of an insulated wire including the process of forming (B).
  • the resin composition of the present invention has the above-described configuration, it has excellent electrical characteristics, friction characteristics, and chemical resistance, can prevent delamination during injection molding, and can exhibit uneven thickness of the extrudate during extrusion molding. In addition, it is possible to eliminate defects such as tears in the case of forming a thin film and foreign matters.
  • the resin composition of the present invention contains an aromatic polyether ketone resin (I) and a fluororesin (II).
  • the aromatic polyether ketone resin (I) is preferably at least one selected from the group consisting of polyether ketone, polyether ether ketone, polyether ketone ketone and polyether ketone ether ketone ketone, More preferably, it is at least one selected from the group consisting of ether ketones and polyether ether ketones, and more preferably polyether ether ketones.
  • the aromatic polyether ketone resin (I) preferably has a melt viscosity of 0.10 to 2.00 kNsm ⁇ 2 at 60 sec ⁇ 1 and 390 ° C. When the melt viscosity is in the above range, a decrease in strength in the resin composition of the present invention can be suppressed.
  • a more preferred lower limit for the melt viscosity is 0.20 kNsm -2 .
  • the upper limit of the melt viscosity is more preferably 1.70 kNsm -2 , further preferably 1.50 kNsm -2 .
  • the melt viscosity of the aromatic polyether ketone resin (I) is measured according to ASTM D3835.
  • the aromatic polyether ketone resin (I) preferably has a glass transition temperature of 130 ° C. or higher. More preferably, it is 135 degreeC or more, More preferably, it is 140 degreeC or more. When the glass transition temperature is in the above range, a resin composition having excellent heat resistance can be obtained. The glass transition temperature is measured by a differential scanning calorimetry (DSC) apparatus.
  • DSC differential scanning calorimetry
  • the aromatic polyether ketone resin (I) preferably has a melting point of 300 ° C. or higher. More preferably, it is 320 degreeC or more. When the melting point is in the above range, the heat resistance of the obtained molded product can be improved. The melting point is measured by a differential scanning calorimetry (DSC) apparatus.
  • DSC differential scanning calorimetry
  • the perfluoroethylenically unsaturated compound represented by the general formula (1) is selected from the group consisting of hexafluoropropylene, perfluoro (methyl vinyl ether), perfluoro (ethyl vinyl ether) and perfluoro (propyl vinyl ether). It is preferably at least one, and more preferably at least one selected from the group consisting of hexafluoropropylene and perfluoro (propyl vinyl ether).
  • the fluororesin (II) is preferably a perfluoropolymer from the viewpoints of electrical characteristics, friction characteristics, and chemical resistance.
  • the fluororesin (II) is preferably composed of 87 to 99 mol% of TFE and 1 to 13 mol% of a perfluoroethylenically unsaturated compound represented by the general formula (1). More preferably, it is a fluororesin composed of 90 to 99 mol% of TFE and 1 to 10 mol% of a perfluoroethylenically unsaturated compound represented by the above general formula (1), and more preferably 93 to It is a fluororesin composed of 99 mol% TFE and 1 to 7 mol% of a perfluoroethylenically unsaturated compound represented by the above general formula (1).
  • the fluororesin (II) preferably has a melt viscosity of 0.3 to 5.0 kNsm ⁇ 2 at 60 sec ⁇ 1 and 390 ° C.
  • a more preferable lower limit of the melt viscosity is 0.4 kNsm -2 , and further preferably 0.5 kNsm -2 .
  • the upper limit of the melt viscosity is more preferably 4.5 kNsm -2 , further preferably 4.0 kNsm -2 .
  • the melt viscosity of the fluororesin (II) is measured according to ASTM D3835.
  • the fluororesin (II) preferably has a melt flow rate (MFR) measured at 372 ° C. under a load of 5000 g of 0.1 to 100 g / 10 min, preferably 5 to 50 g / 10 min. More preferred is 10 to 50 g / 10 min.
  • MFR melt flow rate
  • the MFR of the fluororesin (II) is measured using a melt indexer (manufactured by Toyo Seiki Seisakusho) in accordance with ASTM D3307-01.
  • the melting point of the fluororesin (II) is not particularly limited, but it is preferable in molding that the fluororesin (II) is already melted at a temperature at which the aromatic polyetherketone resin (I) used in molding is melted.
  • the temperature is preferably not higher than the melting point of the aromatic polyether ketone resin (I).
  • the melting point of the fluororesin (II) is preferably 230 to 350 ° C.
  • the fluororesin (II) may be treated with fluorine gas by a known method or may be treated with ammonia.
  • the mass ratio of the fluororesin (II) to the total mass of the aromatic polyetherketone resin (I) and the fluororesin (II) is more than 50 mass% and 99 mass% or less.
  • the resin composition of the present invention has excellent electrical characteristics, friction characteristics, and chemical resistance. If the content of the fluororesin (II) exceeds 99 by mass ratio with the aromatic polyetherketone resin (I), the strength of the resin composition of the present invention tends to decrease. There exists a tendency for the electrical property and chemical resistance in the resin composition of invention to fall.
  • a more preferable range of the mass ratio of the fluororesin (II) to the total mass of the aromatic polyetherketone resin (I) and the fluororesin (II) is 55% by mass or more and 95% by mass or less. More preferably, it is 60 mass% or more and 90 mass%.
  • the resin composition of the present invention comprises a melt viscosity ratio (I) / (II) (aromatic polyetherketone resin (I) / fluororesin (II) of aromatic polyetherketone resin (I) and fluororesin (II). )) Is preferably 1.0 to 5.0.
  • the melt viscosity ratio (I) / (II) is in the above range, the aromatic polyetherketone resin (I) is dispersed in the fluororesin (II) in finer particles with an average dispersed particle size of 1 ⁇ m or less. It becomes possible to make it.
  • the melt viscosity ratio (I) / (II) is more than 1.0 and more preferably 5.0 or less, more preferably 1.1 to 4.0, and 1.1 to 3.0. It is particularly preferred.
  • the aromatic polyether ketone resin (I) is dispersed in the form of particles in the fluororesin (II).
  • the delamination phenomenon can be prevented at the time of injection molding, and at the time of extrusion molding, there are problems such as uneven thickness of the extrudate and foreign matter, particularly tearing when thin film molding is performed. Can be eliminated.
  • the average dispersed particle size of the aromatic polyetherketone resin (I) in the fluororesin (II) is 1 ⁇ m or less.
  • the average dispersed particle size of the aromatic polyetherketone resin (I) is preferably 0.7 ⁇ m or less, and more preferably 0.5 ⁇ m or less. More preferably, it is 0.3 ⁇ m or less.
  • the lower limit of the average dispersed particle size is not particularly limited, but may be 0.01 ⁇ m.
  • the average dispersed particle size of the aromatic polyetherketone resin (I) is obtained by observing the resin composition of the present invention with a confocal laser microscope or by using an ultrathin film from a press sheet prepared from the resin composition of the present invention. It can be obtained by cutting out a section, performing microscopic observation of the ultrathin section with a transmission electron microscope, and binarizing the obtained image with an optical analyzer.
  • the resin composition of the present invention contains an aromatic polyether ketone resin (I) and a fluororesin (II), but may contain other components as necessary.
  • Fibrous reinforcement materials such as whisker, such as potassium titanate, glass fiber, asbestos fiber, carbon fiber, ceramic fiber, potassium titanate fiber, aramid fiber, and other high-strength fibers
  • Inorganic fillers such as calcium carbonate, talc, mica, clay, carbon powder, graphite and glass beads; colorants; inorganic or organic fillers usually used such as flame retardants; stabilizers such as minerals and flakes; silicone oil Lubricants such as molybdenum disulfide; pigments; conductive agents such as carbon black; impact resistance improvers such as rubber; and other additives.
  • a mixing machine such as a compounding mill, a Banbury mixer, a pressure kneader, and an extruder that are usually used to mix a resin composition such as a molding composition. It can be performed according to the conditions. Since the average dispersed particle size of the aromatic polyetherket
  • the resin composition of the present invention is obtained by mixing the aromatic polyetherketone resin (I) and the fluororesin (II) with a twin screw extruder having a screw configuration with an L / D of 35 or more. It is preferable to be obtained.
  • Examples of the method for producing the resin composition of the present invention include a method in which the aromatic polyether ketone resin (I) and the fluororesin (II) are mixed in a molten state. By thoroughly kneading the aromatic polyether ketone resin (I) and the fluororesin (II), the resin composition of the present invention having a desired dispersion state can be obtained. Since the dispersion state affects the moldability at the time of injection molding or extrusion molding, the kneading method should be selected appropriately.
  • the aromatic polyetherketone resin (I) and the fluororesin (II) are introduced into a mixer at an appropriate ratio, and the above-mentioned other components are added as desired. And a method of producing by melting and kneading the resin (I) and (II) above the melting point.
  • the resin composition of the present invention is a kneaded product obtained by melt-kneading the aromatic polyether ketone resin (I) and the fluororesin (II).
  • the other components may be added to the aromatic polyether ketone resin (I) and the fluororesin (II) in advance and mixed, or the aromatic polyether ketone resin (I) and the fluororesin (II). You may add when mix
  • the temperature at the time of the melt kneading may be appropriately set depending on the kind of the aromatic polyetherketone resin (I) and the fluororesin (II) to be used, but it is preferably, for example, 360 to 400 ° C.
  • the kneading time is usually 1 minute to 1 hour.
  • a molded article formed from the resin composition of the present invention is also one aspect of the present invention.
  • Molded articles formed from the resin composition of the present invention include CMP retainer rings, etching rings, silicon wafer carriers, IC chip trays and other semiconductor / liquid crystal manufacturing equipment parts, insulating films, small size in the electric / electronic / semiconductor field.
  • the molded product formed from the resin composition of the present invention can also be suitably used as a molded product for sliding members. Since the molded product for sliding members molded using the resin composition has a low coefficient of dynamic friction, it can be suitably used as a sliding member. Moreover, since it contains a fluororesin, it is excellent in chemical resistance, weather resistance, non-adhesiveness, water repellency, electrical properties and the like. Although it does not specifically limit as said molded article for sliding members, For example, a sealing material, a gear, an actuator, a piston, a bearing, a bearing retainer, a bush, a switch, a belt, a bearing, a cam, a roller, a socket etc. are mentioned.
  • the above-mentioned bearing is a member that is installed on the outer periphery of the shaft and used in contact with the shaft, such as an inner ring of a rolling bearing, a sliding bearing, etc., and normally supports a shaft that rotates or linearly moves. And holds the acting load.
  • the bearing can be used alone or in combination with other members.
  • rolling bearings such as ball bearings, roller bearings, radial bearings, thrust bearings
  • sliding bearings such as perfect circle bearings, partial bearings, multi-face bearings; oilless bearings; air bearings; magnetic bearings, etc. Used for.
  • the gears are usually mounted on a rotating shaft and used for power transmission.
  • spur gears for example, spur gears, helical gears, racks, internal gears, bevel gears, miter gears, screw gears, worm gears, drives A gear, an idle gear, etc. are mentioned.
  • the seal ring is usually attached to a shaft that rotates or moves in the axial direction, and serves to seal oil between a shaft of a transmission or a cylinder of a piston, for example.
  • a seal ring can be used for various applications. For example, it can be used as a seal ring for an automatic transmission such as an automobile or an engine piston of an automobile, a ship, a construction vehicle, an industrial machine, or the like. it can.
  • the molding temperature is preferably a temperature equal to or higher than the melting point of the fluororesin (II) used.
  • the molding temperature is preferably a temperature lower than the lower one of the decomposition temperature of the fluororesin (II) and the decomposition temperature of the aromatic polyether ketone resin (I).
  • Such a molding temperature may be 250 to 400 ° C., for example.
  • the molded product of the present invention is generally a thermoplastic resin composition such as injection molding, extrusion molding, press molding, blow molding, calendar molding, casting molding, etc., depending on the type, application, shape, etc. of the target molded product. It can shape
  • the resin composition of the present invention can prevent delamination during injection molding, it can be suitably used for the production of semiconductor components such as wafer carriers, chuck arms, and CMP rings.
  • Semiconductor parts such as wafer carriers, chuck arms, and CMP rings formed from the resin composition of the present invention have less strength reduction due to suppression of delamination during injection molding, and cracks, chips, etc. during use The characteristic that it is possible to suppress the troubles of is exhibited.
  • the resin composition of the present invention can eliminate problems such as uneven thickness of the extrudate and foreign matter, particularly tearing when thin film molding is performed during extrusion molding, it is preferably used for the production of an insulating layer of an insulated wire. Can do.
  • the insulating layer has excellent insulating properties, exhibits a low dielectric constant, and is easy to handle the wire. Will also be excellent.
  • the insulating layer is excellent in heat resistance, mechanical strength, tensile elongation, and crack resistance, and the insulating layer does not peel from the conductor even when the insulated wire is used at a high temperature.
  • the molded article formed from the resin composition of this invention can be used suitably for an electric wire coating
  • the insulated wire of this invention can be used suitably also for a thin wire with a thin thickness of an insulating layer (B).
  • the insulating layer (B) formed on the outer periphery of the conductor (A) may be in contact with the conductor (A), or another layer between the conductor (A). For example, it may be formed through another resin layer.
  • the insulating layer (B) is preferably in contact with the conductor (A), and in that case, an insulated wire in which the adhesion between the conductor (A) and the insulating layer (B) is strong can be obtained.
  • the thickness of the insulating layer (B) is not particularly limited, but is preferably 1 to 100 ⁇ m, for example. More preferably, it is 2 to 60 ⁇ m, and still more preferably 3 to 40 ⁇ m. Moreover, it can also be thinned to 30 ⁇ m or less. Reducing the thickness of the insulating layer (B) is advantageous in that it has excellent heat dissipation performance.
  • An insulating layer (B) can be obtained by forming the resin composition of this invention in the outer periphery of a conductor (A), and the insulated wire of this invention manufactures the resin composition of this invention mentioned above, for example. It can be manufactured by a manufacturing method including a step and a step of forming the insulating layer (B) on the outer periphery of the conductor (A) by molding the resin composition of the present invention. That is, a method for producing an insulated wire having a conductor (A) and an insulating layer (B), the method comprising molding the resin composition of the present invention and forming an insulating layer ( A method for manufacturing an insulated wire including the step of forming B) is also one aspect of the present invention.
  • the method for forming the insulating layer (B) is not particularly limited, and a method usually used for forming the insulating layer can be adopted as the various conditions. Further, the insulating layer (B) may be formed directly on the conductor (A), or may be formed through another layer, for example, another resin layer.
  • the insulating layer (B) is formed by melting and extruding the resin composition on the surface of the conductor (A) or the surface of the resin layer of the conductor (A) on which another resin layer has been formed in advance.
  • a resin composition is melt-extruded to produce a film, the film is slit to a predetermined size, and then the surface of the conductor (A) or the surface of the resin layer of the conductor (A) in which another resin layer is formed in advance.
  • the film can be formed by a method of winding the film.
  • the forming temperature is a temperature equal to or higher than the melting point of the fluororesin (II) used.
  • the molding temperature is preferably a temperature lower than the lower one of the decomposition temperature of the fluororesin (II) and the decomposition temperature of the aromatic polyether ketone resin (I).
  • Such a molding temperature may be 250 to 400 ° C., for example.
  • the molding temperature is more preferably 320 to 400 ° C.
  • the insulated wire of the present invention may be heated after forming the insulating layer (B).
  • the heating may be performed at a temperature near the melting point of the fluororesin (II).
  • the insulating layer (B) is formed on the outer periphery of the conductor (A). Another layer such as another resin layer may be provided between the conductor (A) and the insulating layer (B). Moreover, the insulated wire of this invention may have another layer, for example, another resin layer, in the outer periphery of an insulating layer (B).
  • the other resin layer is different from the insulating layer (B).
  • the other resin layer is, for example, a layer made of at least one resin selected from the group consisting of aromatic polyetherketone resin, fluororesin, polyamideimide, polyetherimide, polyethersulfone, and polyphenylene sulfide. It is preferable.
  • the material for forming the conductor (A) is not particularly limited as long as the material has good conductivity, and examples thereof include copper, copper alloy, copper clad aluminum, aluminum, silver, gold, and galvanized iron.
  • the shape of the conductor is not particularly limited, and may be circular or flat. In the case of a circular conductor, the diameter of the conductor may be 0.3 to 2.5 mm.
  • the insulated wire of the present invention can be suitably used for wrapping wires, automotive wires, robot wires, and the like. Moreover, it can be used suitably also as a coil winding (magnet wire), and if the insulated wire of the present invention is used, it is difficult to cause damage in winding processing.
  • the above winding is suitable for motors, rotating electrical machines, compressors, transformers, etc., requires high voltage, high current and high thermal conductivity, requires high-density winding processing, and is downsized. -It has the characteristics that it can sufficiently withstand the use with high output motors. Moreover, it is suitable also as an electric wire for power distribution, power transmission, or communication.
  • melt viscosity of the aromatic polyetherketone resin was measured at 60 sec ⁇ 1 and 390 ° C. according to ASTM D3835.
  • the ultra-thin slice adhered to the copper sheet mesh was observed using a transmission electron microscope (H7100FA manufactured by Hitachi, Ltd.).
  • the negative film obtained by microscopic observation was converted into an electronic image with a scanner (GT-9400UF manufactured by EPSON), and the electronic image was binarized using an optical analysis device (LUZEX AP manufactured by Nireco). The average dispersed particle size was determined.
  • the pellets of the resin composition produced in the examples and comparative examples are supplied to an electric wire forming machine having a screw outer diameter of 30 mm ⁇ , and a coated electric wire having a coating thickness of 0.1 mm having a copper round wire having an outer diameter of 1.0 mm ⁇ as a core wire. Manufactured. Thereafter, using a micrometer, the thickness of the formed electric wire was measured at 300 mm intervals in the width direction, and the thickness unevenness of the electric wire coating was determined. Judgment criteria: ⁇ : The thickness difference of the wire coating is less than ⁇ 5% ⁇ : The thickness difference of the wire coating is ⁇ 5% or more
  • Aromatic polyetherketone resin (I-1) polyetheretherketone (melt viscosity; 1.19 kNsm ⁇ 2 )
  • Aromatic polyether ketone resin (I-2) Polyether ether ketone (melt viscosity; 1.32 kNsm ⁇ 2 )
  • Aromatic polyether ketone resin (I-3) Polyether ether ketone (melt viscosity; 0.31 kNsm ⁇ 2 )
  • Fluororesin (II-1) Tetrafluoroethylene / hexafluoropropylene copolymer (trade name: NEOFLON NP101, manufactured by Daikin Industries, Ltd.
  • ⁇ Comparative Example 1> Using only the aromatic polyetherketone resin (I-1), a press sheet was prepared by the method described above, and the dynamic friction coefficient, the relative dielectric constant, and the elongation retention after immersion in sulfuric acid were measured. Then, using only the aromatic polyether ketone resin (I-1), the presence or absence of delamination when performing injection molding, thickness unevenness when performing extrusion molding, and when performing wire molding The thickness unevenness was determined by the above determination method.
  • the resin composition of the present invention is excellent in electrical characteristics, friction characteristics and chemical resistance, and can prevent delamination during injection molding. Also, during extrusion molding, the thickness unevenness of the extrudate and foreign matter, particularly thin film molding, can be prevented. In this case, it is possible to eliminate problems such as tearing and the like, and since it is excellent in moldability, it can be suitably used as a molding material for various industrial uses including electric wire coating applications and semiconductor component applications. *

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Insulated Conductors (AREA)
  • Organic Insulating Materials (AREA)

Abstract

La présente invention concerne une composition de résine qui : présente d'excellentes propriétés électriques, caractéristiques de frottement et résistance chimique ; lorsqu'elle est utilisée dans le moulage par injection, prévient le délaminage ; lorsqu'elle est utilisée en extrusion, élimine les variations d'épaisseur et les matières étrangères dans les articles extrudés ; et en particulier, lorsqu'elle est utilisée pour former des films minces, élimine les problèmes tels que la déchirure. La présente invention concerne une composition de résine qui contient une résine aromatique de polyéther-cétone (I) et une résine fluorée (II), et est caractérisé en ce que : ladite résine fluorée (II) est un copolymère de tétrafluoroéthylène et d'un composé perfluoroéthylène insaturé qui peut être représenté par la formule générale (1) (dans laquelle Rf1 représente soit -CF3 ou -ORf2 et Rf2 représente un groupe perfluoroalkyle en C1 - 5) ; la résine de polyéthercétone aromatique (I) est dispersée à l'intérieur de la résine fluorée (II) sous la forme de particules ; la résine fluorée (II) constitue plus de 50 % mais pas plus de 99 % de la masse totale de la résine de polyéthercétone aromatique (I) et la résine fluorée (II) ; et le diamètre moyen des particules de résine de polyéthercétone aromatique (I) dispersées à l'intérieur de la résine fluorée (II) est d'au plus 1 µm. (1) CF2=CF-Rf1
PCT/JP2013/080439 2012-11-12 2013-11-11 Composition de résine et article moulé Ceased WO2014073682A1 (fr)

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Cited By (3)

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CN109219332A (zh) * 2017-07-03 2019-01-15 信越聚合物株式会社 电磁波屏蔽膜及其制造方法、以及带有电磁波屏蔽膜的印刷电路板及其制造方法
CN116057113A (zh) * 2020-08-07 2023-05-02 大金工业株式会社 膜、绕包电线被覆材料、柔性印刷电路基板用膜和层积体
US12437897B2 (en) 2019-04-26 2025-10-07 Daikin Industries, Ltd. Magnet wire and coil

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JPH11209548A (ja) * 1998-01-20 1999-08-03 Asahi Glass Co Ltd 含フッ素樹脂組成物
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JPS63118357A (ja) * 1986-11-06 1988-05-23 Yobea Rulon Kogyo Kk 四フツ化エチレン樹脂組成物
JPH01301744A (ja) * 1987-12-18 1989-12-05 E I Du Pont De Nemours & Co フルオロエラストマーとポリ（エーテル−ケトン−ケトン）との硬化可能なブレンド
JP2008511691A (ja) * 2004-08-09 2008-04-17 ユニバーシティ オブ フロリダ リサーチ ファウンデーション，インコーポレイティド 低摩擦および低摩耗ポリマー／ポリマー複合物
JP2006274073A (ja) * 2005-03-29 2006-10-12 Mitsubishi Plastics Ind Ltd 樹脂組成物、その樹脂成形体、及び樹脂組成物の製造方法
JP2010189599A (ja) * 2009-02-20 2010-09-02 Olympus Corp 熱可塑性樹脂組成物、並びに医療製品及び内視鏡操作部
WO2012005133A1 (fr) * 2010-07-05 2012-01-12 清華大学 Composition de résine et article moulé

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109219332A (zh) * 2017-07-03 2019-01-15 信越聚合物株式会社 电磁波屏蔽膜及其制造方法、以及带有电磁波屏蔽膜的印刷电路板及其制造方法
US12437897B2 (en) 2019-04-26 2025-10-07 Daikin Industries, Ltd. Magnet wire and coil
CN116057113A (zh) * 2020-08-07 2023-05-02 大金工业株式会社 膜、绕包电线被覆材料、柔性印刷电路基板用膜和层积体

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