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WO2014067173A1 - Led灯条及用该led灯条的背光模组 - Google Patents

Led灯条及用该led灯条的背光模组 Download PDF

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Publication number
WO2014067173A1
WO2014067173A1 PCT/CN2012/084262 CN2012084262W WO2014067173A1 WO 2014067173 A1 WO2014067173 A1 WO 2014067173A1 CN 2012084262 W CN2012084262 W CN 2012084262W WO 2014067173 A1 WO2014067173 A1 WO 2014067173A1
Authority
WO
WIPO (PCT)
Prior art keywords
heat dissipation
pcb board
disposed
base
bar
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2012/084262
Other languages
English (en)
French (fr)
Inventor
张田
萧宇均
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TCL China Star Optoelectronics Technology Co Ltd
Original Assignee
Shenzhen China Star Optoelectronics Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen China Star Optoelectronics Technology Co Ltd filed Critical Shenzhen China Star Optoelectronics Technology Co Ltd
Priority to US13/806,751 priority Critical patent/US9028092B2/en
Publication of WO2014067173A1 publication Critical patent/WO2014067173A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133628—Illuminating devices with cooling means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]

Definitions

  • the present invention relates to the field of liquid crystal display, and in particular to an LED light bar and a backlight module using the same. Background technique
  • Liquid crystal display has many advantages such as thin body, power saving, and no radiation, and has been widely used.
  • Most of the liquid crystal display devices on the market are backlight type liquid crystal displays, which include a liquid crystal panel and a backlight module.
  • the working principle of the liquid crystal panel is to place liquid crystal molecules in two parallel glass. There are many vertical and horizontal small wires between the two glass plates.
  • the liquid crystal molecules are controlled to change direction by energization or not, and the light of the backlight module is refracted. Picture. Since the liquid crystal panel itself does not emit light, it is necessary to display the image normally by the light source provided by the backlight module. Therefore, the backlight module becomes one of the key components of the liquid crystal display device.
  • the backlight module is divided into a side-in type backlight module and a direct-type backlight module according to different incident positions of the light source.
  • a light source such as a CCFL (Cold Cathode Fluorescent Lamp) or an LED (Light Emitting Diode) is disposed behind the liquid crystal panel, and a surface light source is directly formed and supplied to the liquid crystal panel.
  • CCFL Cold Cathode Fluorescent Lamp
  • LED Light Emitting Diode
  • the side-lit backlight module is provided with an LED light bar disposed on the edge of the back panel behind the liquid crystal panel, and the light emitted by the LED strip enters the light guide plate from the light incident surface of the light guide plate, and is reflected and After being diffused, it is emitted from the light-emitting surface of the light guide plate to form a surface light source to be supplied to the liquid crystal panel.
  • the LED chip is usually soldered on a PCB board (printed circuit board), and the PCB board is mounted on the heat dissipation strip by screwing or thermal adhesive bonding, and the heat dissipation strip is further Mounted on the backplane, the PCB board usually adopts a MCPCB (metal core PCB) with a better heat dissipation of the substrate or an FR4 substrate with a copper layer and a heat conductive via passage to increase heat conduction to the heat dissipation substrate.
  • MCPCB metal core PCB
  • the heat dissipation path of the backlight module is: LED chip ⁇ thermal interface material layer ⁇ ?8 board ⁇ thermal interface material layer ⁇ heat strip ⁇ backboard.
  • the heat dissipation path is long, and the heat dissipation effect is poor due to the limitation of the PCB board process, and the temperature of the backlight module is too high, thereby affecting the backlight quality.
  • the object of the present invention is to provide an LED light bar, which has a simple process and an overall heat dissipation path. Shorter, it can achieve good heat dissipation.
  • Another object of the present invention is to provide a backlight module in which the LED strip has a good heat dissipation effect and improves the quality of the backlight module.
  • the present invention provides an LED light bar, comprising: a heat dissipation strip, a PCB board disposed on the heat dissipation strip, an LED chip disposed on the heat dissipation strip and electrically connected to the PCB board, and disposed on the LED chip and the heat dissipation A layer of thermal interface material between the strips.
  • the heat dissipation strip includes a base portion and a protrusion portion disposed on the base portion, the PCB board is disposed on a base portion of the two sides of the protrusion portion, the LED chip is disposed on the protrusion portion, and the PCB board is soldered Or adhesively disposed on the base, the LED chip is electrically connected to the PCB by soldering.
  • the base portion has a rectangular cross section, and the heat dissipation strip is disposed in an inverted T shape.
  • the base portion has an L-shaped cross section, and includes a first mounting portion and a second mounting portion vertically connected to the first mounting portion, and the protruding portion is disposed on the first mounting portion.
  • the PCB board is an FR4 board or an MCPCB board.
  • the present invention also provides a backlight module, comprising: a back plate, a light guide plate disposed in the back plate, and an LED light bar mounted on the back plate, the LED light bar includes a heat dissipation strip and a PCB board disposed on the heat dissipation strip The LED chip disposed on the heat dissipation strip and electrically connected to the PCB board and the thermal interface material layer disposed between the LED chip and the heat dissipation strip.
  • the heat dissipation strip includes a base portion and a protrusion portion disposed on the base portion, the PCB board is disposed on a base portion of the two sides of the protrusion portion, the LED chip is disposed on the protrusion portion, and the PCB board is soldered Or adhesively disposed on the base, the LED chip is electrically connected to the PCB by soldering.
  • the base portion has a rectangular cross section, and the heat dissipation strip is disposed in an inverted T shape.
  • the base portion has an L-shaped cross section, and includes a first mounting portion and a second mounting portion vertically connected to the first mounting portion, and the protruding portion is disposed on the first mounting portion.
  • the PCB board is an FR4 board or an MCPCB board.
  • the invention also provides an LED light bar, comprising: a heat dissipation strip, a PCB board disposed on the heat dissipation strip, an LED chip disposed on the heat dissipation strip and electrically connected to the PCB board, and disposed between the LED chip and the heat dissipation strip Thermal interface material layer;
  • the heat dissipation strip includes a base portion and a protrusion portion disposed on the base portion, the PCB board is disposed on a base portion on both sides of the protrusion portion, and the LED chip is disposed on the protrusion portion, the PCB board Provided on the base by soldering or gluing, the LED chip is electrically connected to the PCB by soldering;
  • the base portion has a rectangular cross section, and the heat dissipation strip is disposed in an inverted T shape;
  • the PCB board is an FR4 board or an MCPCB board.
  • the invention has the beneficial effects that the LED light bar of the invention and the backlight module using the LED light bar can avoid the heat transfer in the prior art by using the LED chip on the heat dissipation strip with better heat conduction effect.
  • the process of the PCB board is simple in process, and the overall heat dissipation path is short, which can achieve good heat dissipation effect, thereby ensuring backlight quality.
  • FIG. 1 is a schematic structural view of an embodiment of an LED light bar of the present invention
  • Figure 2 is a partial enlarged view of a portion A in Figure 1;
  • FIG. 3 is a schematic structural view of the LED chip of FIG. 1;
  • FIG. 4 is a schematic structural view of another embodiment of an LED light bar of the present invention.
  • FIG. 5 is a schematic structural view of an embodiment of a backlight module of the present invention.
  • FIG. 6 is a schematic structural view of another embodiment of a backlight module of the present invention. detailed description
  • the present invention provides an LED light bar 20 , comprising: a heat dissipation strip 2 , a PCB board 4 disposed on the heat dissipation strip 2 , and a heat dissipation strip 2 disposed on the heat dissipation strip 2 and electrically connected to the PCB board 4 .
  • the LED chip 6 and the thermal interface material layer 8 disposed between the LED chip 6 and the heat dissipation strip 2, the LED chip 6 of the present invention directly contacts the heat dissipation strip 2, and the heat generated by the LED chip 6 is directly transmitted to the thermal interface material layer 8 to
  • the heat strip 2 is further exchanged with the heat by the heat strip 2 to realize the heat dissipation mode of the LED strip 20, and the heat is transferred from the layer of the thermal interface material to the PCB board, and the PCB board is externally compared with the prior art LED chip.
  • the heat dissipation mode of the heat exchange is better, and the heat dissipation effect of the LED light bar 20 is effectively reduced, thereby prolonging the service life of the LED light bar 20.
  • the heat strip 2 is made of a highly thermally conductive material, such as aluminum, which includes a base 22 and a raised portion 24 provided on the base 22.
  • the PCB board 4 is an FR4 board or an MCPCB board, and the PCB board 4
  • the LED chip 6 is disposed on the base portion 22 of the convex portion 24, and the LED chip 6 is disposed on the base portion 22 by soldering or gluing.
  • the LED chip 6 is electrically connected to the PCB board 4 by soldering.
  • the base portion 22 has a rectangular cross section, so that the heat dissipation strip 2 is disposed in an inverted T shape.
  • the thermal interface material layer 8 can be a heat sink layer or a heat sink material coating.
  • the base portion 22 has an L-shaped cross section, and includes a first mounting portion 222 and a vertical connection.
  • the second mounting portion 224 on the first mounting portion 222 is disposed on the first mounting portion 222.
  • the present invention further provides a backlight module, including: a back plate 40 , a light guide plate 60 disposed in the back plate 40 , and an LED light bar mounted on the back plate 40 . 20.
  • the LED light bar 20 includes: a heat dissipation strip 2, a PCB board 4 disposed on the heat dissipation strip 2, an LED chip 6 disposed on the heat dissipation strip 2 and electrically connected to the PCB board 4, and the LED chip 6 and the heat dissipation strip.
  • the thermal interface material layer 8 between the two, the LED chip 6 of the present invention directly contacts the heat dissipating strip 2, and the heat generated by the LED chip 6 is directly transmitted to the heat dissipating strip 2 by the thermal interface material layer 8, and then transmitted to the back by the heat dissipating strip 2.
  • the board 40 is further exchanged with the outside by the back board 40 to realize the heat dissipation mode of the LED strip 20, and the heat is transferred from the layer of the thermal interface material to the PCB board by the LED chip of the prior art, and the heat transfer is performed on the PCB board.
  • the heat dissipation mode of the back plate and the back plate is further exchanged with the outside, and the heat dissipation effect of the invention is better, the temperature in the LED light bar 20 and the backlight module can be effectively reduced, and the service life of the LED light bar 20 is extended. Extends the life of the backlight module.
  • the heat dissipating strip 2 is made of a highly thermally conductive material, such as aluminum, which includes a base portion 22 and a raised portion 24 provided on the base portion 22.
  • the PCB board 4 is an FR4 board or an MCPCB board.
  • the PCB board 4 is disposed on the base 22 on both sides of the boss portion 24.
  • the LED chip 6 is disposed on the boss portion 24.
  • the PCB board The board 4 is disposed on the base 22 by soldering or gluing, and the LED chip 6 is electrically connected to the PCB board 4 by soldering.
  • the backboard 40 includes a bottom plate 42 and a side plate 44 vertically connected to the bottom plate 42.
  • the LED light bar 20 is mounted on the side plate 44 of the back plate 40.
  • the base portion 22 has a rectangular cross section, so that the heat dissipation strip 2 is disposed in an inverted T shape.
  • the thermal interface material layer 8 can be a heat sink layer or a heat sink material coating.
  • FIG. 6 is a structural diagram of another embodiment of a backlight module according to the present invention.
  • the base portion 22 of the heat strip 2 of the LED strip 20 has an L-shaped cross section, and includes a first mounting portion 222 and is vertically connected to the first mounting portion 222.
  • the second mounting portion 224, the protruding portion 24 is disposed on the first mounting portion 222, and the first mounting portion 222 is mounted on the side plate 44 of the backboard 40.
  • the second mounting portion 224 is mounted on the bottom plate 42 of the backing plate 40.
  • the LED light bar of the present invention and the backlight module using the LED light bar can prevent the heat transfer in the prior art from being poorly radiated by setting the LED chip on the heat dissipation strip with better heat conduction effect.
  • the process of the PCB board has a simple process and a short heat dissipation path, which can achieve a good heat dissipation effect, thereby ensuring the backlight quality.

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Planar Illumination Modules (AREA)

Abstract

提供了一种LED灯条（20）及采用该LED灯条（20）的背光模组，LED灯条（20）包括：散热条（2）、设于散热条（2）上的PCB板（4）、设于散热条（2）上并电性连接于PCB板（4）的LED芯片（6）及设于LED芯片（6）与散热条（2）之间的热界面材料层（8）。该LED灯条（20）及采用该LED灯条（20）的背光模组，通过将LED芯片（6）设于导热效果较好的散热条（2）上，避免了现有技术中热量传递需经过散热较差的PCB板（4）的过程，其工艺简单，整体散热路径较短，可实现良好的散热效果，进而保证背光质量。

Description

LED灯条及用该 LED灯条的背光模组 技术领域
本发明涉及液晶显示领域， 尤其涉及一种 LED灯条及用该 LED灯条 的背光模组。 背景技术
液晶显示装置 （LCD, Liquid Crystal Display )具有机身薄、 省电、 无 辐射等众多优点， 得到了广泛的应用。 现有市场上的液晶显示装置大部分 为背光型液晶显示器， 其包括液晶面板及背光模组（backlight module ) 。 液晶面板的工作原理是在两片平行的玻璃当中放置液晶分子， 两片玻璃中 间有许多垂直和水平的细小电线， 通过通电与否来控制液晶分子改变方 向， 将背光模组的光线折射出来产生画面。 由于液晶面板本身不发光， 需 要借由背光模组提供的光源来正常显示影像， 因此， 背光模组成为液晶显 示装置的关键组件之一。 背光模组依照光源入射位置的不同分成侧入式背 光模组与直下式背光模组两种。 直下式背光模组是将发光光源例如 CCFL(Cold Cathode Fluorescent Lamp , 阴极萤光灯管）或 LED(Light Emitting Diode发光二极管)设置在液晶面板后方， 直接形成面光源提供给 液晶面板。 而侧入式背光模组是将发光光源 LED 灯条（lightbar )设于液 晶面板侧后方的背板边缘， LED灯条发出的光线从导光板一侧的入光面进 入导光板， 经反射和扩散后从导光板出光面出射， 以形成面光源提供给液 晶面板。
现有的 LED 背光模组的散热设计中， LED 芯片通常焊接于 PCB板 (印刷电路板）上， 该 PCB板通过螺钉锁附或导热胶贴附等方式安装于散 热条上， 该散热条再安装于背板上， 所述 PCB板通常采用基板散热较好的 MCPCB板 ( metal core PCB, 金属基印刷电路板）或者做有铜层和导热过 孔通道以增加热传导到散热基板的 FR4基板， 而采用以上两种 PCB 板 时， 背光模组的散热路径为： LED芯片→热界面材料层→? 8板→热界面 材料层→散热条→背板。 该散热路径较长， 因 PCB板工艺的限制其散热效 果较差， 易照成背光模组温度过高， 从而影响背光质量。 发明内容
本发明的目的在于提供一种 LED 灯条， 其工艺简单， 整体散热路径 较短， 可实现良好的散热效果。
本发明的另一目的在于提供一种背光模组， 其 LED 灯条的散热效果 好， 提升了背光模组的品质。
为实现上述目的， 本发明提供一种 LED 灯条， 包括： 散热条、 设于 散热条上的 PCB板、 设于散热条上并电性连接于 PCB板的 LED芯片及设 于 LED芯片与散热条之间的热界面材料层。
所述散热条包括基部及设于基部上的凸起部， 所述 PCB板设于该凸起 部两侧的基部上， 所述 LED芯片设于该凸起部上， 所述 PCB板通过焊接 或胶粘的方式设于该基部上， 所述 LED 芯片通过焊接方式电性连接于 PCB板上。
所述基部的截面呈矩形， 所述散热条呈倒 T形设置。
所述基部的截面呈 L形， 其包括第一安装部及垂直连接于该第一安装 部上的第二安装部， 所述凸起部设于该第一安装部上。
所述 PCB板为 FR4板或 MCPCB板。
本发明还提供一种背光模组， 包括： 背板、 设于背板内的导光板及安 装于背板上的 LED灯条， 该 LED灯条包括散热条、 设于散热条上的 PCB 板、 设于散热条上并电性连接于 PCB板的 LED芯片及设于 LED芯片与散 热条之间的热界面材料层。
所述散热条包括基部及设于基部上的凸起部， 所述 PCB板设于该凸起 部两侧的基部上， 所述 LED芯片设于该凸起部上， 所述 PCB板通过焊接 或胶粘的方式设于该基部上， 所述 LED 芯片通过焊接方式电性连接于 PCB板上。
所述基部的截面呈矩形， 所述散热条呈倒 T形设置。
所述基部的截面呈 L形， 其包括第一安装部及垂直连接于该第一安装 部上的第二安装部， 所述凸起部设于该第一安装部上。
所述 PCB板为 FR4板或 MCPCB板。
本发明还提供一种 LED 灯条， 包括： 散热条、 设于散热条上的 PCB 板、 设于散热条上并电性连接于 PCB板的 LED芯片及设于 LED芯片与散 热条之间的热界面材料层；
其中， 所述散热条包括基部及设于基部上的凸起部， 所述 PCB板设于 该凸起部两侧的基部上， 所述 LED芯片设于该凸起部上， 所述 PCB板通 过焊接或胶粘的方式设于该基部上， 所述 LED 芯片通过焊接方式电性连 接于 PCB板上；
其中， 所述基部的截面呈矩形， 所述散热条呈倒 T形设置； 其中 , 所述 PCB板为 FR4板或 MCPCB板。
本发明的有益效果： 本发明 LED灯条及用该 LED灯条的背光模组， 通过将 LED 芯片设于导热效果较好的散热条上， 避免了现有技术中热量 传递需经过散热较差的 PCB板的过程， 其工艺简单， 整体散热路径较短， 可实现良好的散热效果， 进而保证背光质量。
为了能更进一步了解本发明的特征以及技术内容， 请参阅以下有关本 发明的详细说明与附图， 然而附图仅提供参考与说明用， 并非用来对本发 明加以限制。 附图说明
下面结合附图， 通过对本发明的具体实施方式详细描述， 将使本发明 的技术方案及其它有益效果显而易见。
附图中，
图 1为本发明 LED灯条一实施例的结构示意图；
图 2为图 1中 A处的局部放大图；
图 3为图 1中 LED芯片的结构示意图；
图 4为本发明 LED灯条另一实施例的结构示意图；
图 5为本发明背光模组的一实施例的结构示意图；
图 6为本发明背光模组的另一实施例的结构示意图。 具体实施方式
为更进一步阐述本发明所采取的技术手段及其效果， 以下结合本发明 的优选实施例及其附图进行详细描述。
请参阅图 1至图 3 , 本发明提供一种 LED灯条 20, 包括： 散热条 2、 设于散热条 2上的 PCB板 4、 设于散热条 2上并电性连接于 PCB板 4的 LED芯片 6及设于 LED芯片 6与散热条 2之间的热界面材料层 8 , 本发明 的 LED芯片 6直接与散热条 2接触， LED芯片 6发出的热量由热界面材 料层 8 直接传递给散热条 2 , 再由散热条 2 与外部进行热交换， 以实现 LED灯条 20的散热模式， 相比现有技术的 LED芯片将热量由热界面材料 层传递给 PCB板， PCB板再与外部进行热交换的散热模式， 本发明的散 热效果更好， 能有效降低 LED灯条 20的温度， 进而延长 LED灯条 20的 使用寿命。
所述散热条 2 由高导热材料制成， 如铝， 其包括基部 22及设于基部 22上的凸起部 24。 所述 PCB板 4为 FR4板或 MCPCB板， 该 PCB板 4 设于该凸起部 24 两侧的基部 22上， 所述 LED 芯片 6设于该凸起部 24 上， 优选的， 所述 PCB板 4通过焊接或胶粘的方式设于该基部 22上， 所 述 LED芯片 6通过焊接方式电性连接于 PCB板 4上。
在本实施例中， 所述基部 22 的截面呈矩形， 进而使得所述散热条 2 呈倒 T字形设置。
所述热界面材料层 8可为散热胶层或散热材料涂层。
请参阅图 4, 为本发明 LED灯条 20，的另一实施例的结构示意图， 在 本实施例中， 所述基部 22，的截面呈 L形， 其包括第一安装部 222，及垂直 连接于该第一安装部 222，上的第二安装部 224，， 所述凸起部 24，设于该第 一安装部 222，上。
请参阅图 5 , 同时参阅图 1 至图 3 , 本发明还提供一种背光模组， 包 括： 背板 40、 设于背板 40内的导光板 60及安装于背板 40上的 LED灯条 20。
所述 LED灯条 20包括： 散热条 2、 设于散热条 2上的 PCB板 4、 设 于散热条 2上并电性连接于 PCB板 4的 LED芯片 6及设于 LED芯片 6与 散热条 2之间的热界面材料层 8, 本发明的 LED芯片 6直接与散热条 2接 触， LED芯片 6发出的热量由热界面材料层 8直接传递给散热条 2, 再由 散热条 2传递给背板 40, 再由背板 40与外部进行热交换， 以实现 LED灯 条 20的散热模式， 相比现有技术的 LED芯片将热量由热界面材料层传递 给 PCB 板， PCB 板再将热量传递给背板， 背板再与外部进行热交换的散 热模式， 本发明的散热效果更好， 能有效降低 LED灯条 20及背光模组内 的温度， 延长了 LED灯条 20的使用寿命， 进一步延长了背光模组的使用 寿命。
所述散热条 2 由高导热材料制成， 如铝， 其包括基部 22及设于基部 22上的凸起部 24。 所述 PCB板 4为 FR4板或 MCPCB板， 该 PCB板 4 设于该凸起部 24 两侧的基部 22上， 所述 LED 芯片 6设于该凸起部 24 上， 优选的， 所述 PCB板 4通过焊接或胶粘的方式设于该基部 22上， 所 述 LED芯片 6通过焊接方式电性连接于 PCB板 4上。
所述背板 40包括底板 42及垂直连接于底板 42的侧板 44, 所述 LED 灯条 20安装于背板 40的侧板 44上。
在本实施例中， 所述基部 22 的截面呈矩形， 进而使得所述散热条 2 呈倒 T字形设置。
所述热界面材料层 8可为散热胶层或散热材料涂层。
请参阅图 6, 为本发明背光模组的另一实施例的结构示意图， 同时参 阅图 4, 在本实施例中， 所述 LED灯条 20，的散热条 2，的基部 22，的截面 呈 L形， 其包括第一安装部 222，及垂直连接于该第一安装部 222，上的第二 安装部 224，， 所述凸起部 24，设于该第一安装部 222，上， 所述第一安装部 222，安装于背板 40的侧板 44上， 所述第二安装部 224，安装于背板 40的 底板 42上。
综上所述， 本发明 LED 灯条及用该 LED 灯条的背光模组， 通过将 LED 芯片设于导热效果较好的散热条上， 避免了现有技术中热量传递需经 过散热较差的 PCB板的过程， 其工艺简单， 整体散热路径较短， 可实现良 好的散热效果， 进而保证背光质量。
以上所述， 对于本领域的普通技术人员来说， 可以根据本发明的技术 方案和技术构思作出其他各种相应的改变和变形， 而所有这些改变和变形 都应属于本发明权利要求的保护范围。

Claims

权 利 要 求
1、 一种 LED灯条， 包括： 散热条、 设于散热条上的 PCB板、 设于散 热条上并电性连接于 PCB板的 LED芯片及设于 LED芯片与散热条之间的 热界面材料层。
2、 如权利要求 1所述的 LED灯条， 其中， 所述散热条包括基部及设 于基部上的凸起部， 所述 PCB板设于该凸起部两侧的基部上， 所述 LED 芯片设于该凸起部上， 所述 PCB板通过焊接或胶粘的方式设于该基部上， 所述 LED芯片通过焊接方式电性连接于 PCB板上。
3、 如权利要求 2所述的 LED灯条， 其中， 所述基部的截面呈矩形， 所述散热条呈倒 T形设置。
4、 如权利要求 2所述的 LED灯条， 其中， 所述基部的截面呈 L形， 其包括第一安装部及垂直连接于该第一安装部上的第二安装部， 所述凸起 部设于该第一安装部上。
5、 如权利要求 1所述的 LED灯条， 其中， 所述 PCB板为 FR4板或
MCPCB板。
6、 一种背光模组， 包括： 背板、 设于背板内的导光板及安装于背板 上的 LED灯条， 该 LED灯条包括散热条、 设于散热条上的 PCB板、 设于 散热条上并电性连接于 PCB板的 LED芯片及设于 LED芯片与散热条之间 的热界面材料层。
7、 如权利要求 6 所述的背光模组， 其中， 所述散热条包括基部及设 于基部上的凸起部， 所述 PCB板设于该凸起部两侧的基部上， 所述 LED 芯片设于该凸起部上， 所述 PCB板通过焊接或胶粘的方式设于该基部上， 所述 LED芯片通过焊接方式电性连接于 PCB板上。
8、 如权利要求 7 所述的背光模组， 其中， 所述基部的截面呈矩形， 所述散热条呈倒 T形设置。
9、 如权利要求 7 所述的背光模组， 其中， 所述基部的截面呈 L形， 其包括第一安装部及垂直连接于该第一安装部上的第二安装部， 所述凸起 部设于该第一安装部上。
10、 如权利要求 7所述的背光模组， 其中， 所述 PCB板为 FR4板或
MCPCB板。
11、 一种 LED灯条， 包括： 散热条、 设于散热条上的 PCB板、 设于 散热条上并电性连接于 PCB板的 LED芯片及设于 LED芯片与散热条之间 的热界面材料层；
其中， 所述散热条包括基部及设于基部上的凸起部， 所述 PCB板设于 该凸起部两侧的基部上， 所述 LED芯片设于该凸起部上， 所述 PCB板通 过焊接或胶粘的方式设于该基部上， 所述 LED 芯片通过焊接方式电性连 接于 PCB板上；
其中， 所述基部的截面呈矩形， 所述散热条呈倒 T形设置；
其中， 所述 PCB板为 FR4板或 MCPCB板。
PCT/CN2012/084262 2012-10-31 2012-11-08 Led灯条及用该led灯条的背光模组 Ceased WO2014067173A1 (zh)

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