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WO2014051230A1 - Appareil pour fabriquer un boîtier de dispositif de circuit intégré flexible - Google Patents

Appareil pour fabriquer un boîtier de dispositif de circuit intégré flexible Download PDF

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Publication number
WO2014051230A1
WO2014051230A1 PCT/KR2013/003169 KR2013003169W WO2014051230A1 WO 2014051230 A1 WO2014051230 A1 WO 2014051230A1 KR 2013003169 W KR2013003169 W KR 2013003169W WO 2014051230 A1 WO2014051230 A1 WO 2014051230A1
Authority
WO
WIPO (PCT)
Prior art keywords
integrated circuit
adhesive tape
flexible
circuit device
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2013/003169
Other languages
English (en)
Korean (ko)
Inventor
이혁
임재성
김주형
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hana Micron Co Ltd
Original Assignee
Hana Micron Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020120108924A external-priority patent/KR20140042317A/ko
Priority claimed from KR1020120108931A external-priority patent/KR20140042320A/ko
Priority claimed from KR1020120118847A external-priority patent/KR101425177B1/ko
Application filed by Hana Micron Co Ltd filed Critical Hana Micron Co Ltd
Publication of WO2014051230A1 publication Critical patent/WO2014051230A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H10P72/0456—
    • H10P72/0442—
    • H10P72/7402—
    • H10W70/611—
    • H10W70/688—
    • H10P72/742—
    • H10P72/7422—
    • H10P72/7428—
    • H10P72/7434—
    • H10P72/744—
    • H10W70/093—
    • H10W70/099—
    • H10W70/60—
    • H10W72/0198—
    • H10W72/0711—
    • H10W72/07131—
    • H10W72/07173—
    • H10W72/07183—
    • H10W72/073—
    • H10W72/07307—
    • H10W72/07337—
    • H10W72/07352—
    • H10W72/321—
    • H10W72/354—
    • H10W90/00—
    • H10W90/734—

Definitions

  • the present invention relates to devices for manufacturing flexible integrated circuit device packages. More particularly, the present invention relates to apparatus for manufacturing flexible integrated circuit device packages for manufacturing packages with flexible integrated circuit devices that can be flexed and unfolded as desired.
  • the Applicant has disclosed inventions for the transfer parts for transferring and forming a flexible integrated circuit device to a flexible substrate in order to manufacture the flexible integrated circuit device package, Korean Patent Application No. 2012-0043570 dated April 26, 2012 The Korean Patent Application No. 2012-0108924 and No. 2012-0108931 dated May 28, filed with the Korean Patent Office.
  • An object of the present invention is to provide a flexible integrated circuit device package manufacturing apparatus that can easily manufacture packages with flexible integrated circuit devices that can be flexed or bent freely and that can continuously perform manufacturing processes.
  • a flexible integrated circuit device package manufacturing apparatus for transferring and attaching a flexible integrated circuit device on a flexible substrate, on the flexible substrate A thin film forming unit forming a thin film covering the flexible integrated circuit device, a thin film removing unit removing the thin film formed on the flexible substrate so that the flexible substrate and portions of the flexible integrated circuit device are exposed, and an exposed portion of the flexible substrate. And a wiring forming portion that forms a conductive wiring that electrically connects a portion and an exposed portion of the flexible integrated circuit device.
  • the transfer part may include: a first transfer part configured to transfer the handling substrate to which the flexible integrated circuit device is attached, in a first direction, and rotate from the first direction to a second direction, on the handling substrate; A rotating portion having a body in contact with the flexible integrated circuit device in a first region and separating the flexible integrated circuit device from the handling substrate, and for transferring the flexible substrate in a second direction, wherein the flexible substrate is formed of the body and the first substrate. And a second transfer part contacting in two regions to separate the flexible integrated circuit device on the rotating part from the body and attach the flexible integrated circuit device to the flexible substrate.
  • the body of the rotating part may have an uneven structure to selectively attach the flexible integrated circuit elements from the handling substrate to the body of the rotating part.
  • the rotating portion when the flexible integrated circuit device is attached with a first attachment force to the handling substrate and with a second attachment force to the flexible substrate, substantially surrounds the body. It may include an adhesive film having a third adhesive force substantially greater than the first adhesive force and substantially less than the second adhesive force. In this case, the attachment film may have an uneven structure to selectively attach the flexible integrated circuit elements to the attachment film from the handling substrate.
  • the rotating part may rotate in place.
  • the first transfer unit, the rotation unit and the second transfer unit may move or rotate at a first speed, a second speed, and a third speed, respectively.
  • the first speed, the second speed, and / or the third speed may be adjusted to align the flexible integrated circuit elements attached on the flexible substrate from the handling substrate.
  • the transfer part may be the first integrated plate by which the flexible integrated circuit device is attached to the first adhesive tape having the first adhesive force, and the flexible integration may be performed by the third adhesive force of the third adhesive tape.
  • the flexible integrated circuit device is disposed between the first plate and the second plate to be in contact with each other, wherein the flexible integrated circuit device is separated from the first adhesive tape in the first area, and the flexible integrated circuit device is disposed in the second area.
  • a second having a second adhesive force greater than the first adhesive force and less than the third adhesive force to transfer and adhere to the substrate It may include a detachable portion having an adhesive tape.
  • the first adhesive tape and the second adhesive tape may include a curable adhesive tape that is irradiated with ultraviolet light but the adhesive force is reduced when heated
  • the third adhesive tape is the curable adhesive tape It may comprise an adhesive tape for die bonding having greater adhesion.
  • the flexible integrated circuit device package manufacturing apparatus includes a first adhesive force reducing unit for irradiating or heating ultraviolet light on the first adhesive tape before the flexible integrated circuit device comes into contact with the detachable part in the first region, and Irradiating or heating ultraviolet rays on the second adhesive tape before the flexible integrated circuit device contacts the flexible substrate in the second region, and further includes a second adhesive force reducing portion disposed between the first region and the second region. It may include.
  • the surface of the second adhesive tape may have an uneven structure to selectively transfer and attach the flexible integrated circuit elements from the first adhesive tape to the second adhesive tape.
  • the third adhesive tape may be attached to one surface of the flexible substrate in contact with the flexible integrated circuit device, or attached to one surface of the flexible integrated circuit device in contact with the flexible substrate.
  • the detachable part may further include a tape supply part supplying the second adhesive tape, and a tape recovery part recovering the second adhesive tape.
  • the second adhesive tape may be used for a single use by the tape supply part and the tape recovery part.
  • the transfer part may include a first plate having a first adhesive force and a transfer plate including the flexible integrated circuit device attached to a first adhesive tape supported by a ring frame at a periphery thereof, A second plate on which the flexible substrate for transferring and attaching the flexible integrated circuit element is placed by a third adhesive force of a third adhesive tape, and in contact with the flexible integrated circuit element on the first plate in a first region,
  • the first plate disposed between the first plate and the second plate to be in contact with the flexible substrate on the second plate in a second region, and being supplied along a circumference of the roller by rotation of the rotatable roller and the roller; Includes a removable portion having a second adhesive tape having a second adhesive force greater than the adhesive force and less than the third adhesive force Can.
  • the flexible integrated circuit device may be separated from the first adhesive tape and transferred and attached onto the second adhesive tape, and in the second region, the flexible integrated circuit may be separated from the second adhesive tape.
  • a device can be transferred and attached to the flexible substrate.
  • the first plate may include a frame support for supporting the ring frame, and a chuck table for lifting in contact with a rear surface of the first adhesive tape.
  • the chuck table may be moved up and down in a state where the ring frame is fixed using the frame support so that a predetermined tension is applied to the first adhesive tape.
  • the detachable part may further include a tape supply part supplying the second adhesive tape to the roller, and a tape recovery part recovering the second adhesive tape from the roller.
  • the second adhesive tape may be used for a single use.
  • the flexible integrated circuit device package manufacturing apparatus may further include the first plate on which the transfer substrate is placed in the first direction when the roller rotates in place from the first direction to the second direction.
  • the apparatus may further include a first transfer part for transferring and a second transfer part for transferring the second plate on which the flexible substrate is placed in the second direction.
  • the third adhesive tape may be attached to one surface of the flexible substrate in contact with the flexible integrated circuit device, or attached to one surface of the flexible integrated circuit device in contact with the flexible substrate.
  • the flexible integrated circuit device package manufacturing apparatus may further include irradiating or heating ultraviolet light on the first adhesive tape before the flexible integrated circuit device contacts the detachable portion in the first region.
  • the surface of the second adhesive tape may have an uneven structure to selectively transfer and attach the flexible integrated circuit elements from the first adhesive tape to the second adhesive tape.
  • the thin film forming unit may include a pair of rollers and a protective tape supply unit supplying a protective tape between the pair of rollers.
  • the thin film forming unit supplies the protective tape between the pair of rollers when the flexible substrate on which the flexible integrated circuit device is attached is transferred between the pair of rollers, thereby providing the flexible integrated circuit device.
  • the thin film including the protective tape may be formed on the attached flexible substrate.
  • the thin film removing unit may include a laser drilling member disposed in a path through which the flexible substrate is transferred.
  • the thin film formed on the flexible substrate may be partially removed by partially irradiating a laser onto the thin film formed on the flexible substrate from the laser drilling member.
  • the wiring forming part may include a solution receiving part accommodating a solution containing a conductive material.
  • the conductive substrate may be formed by dipping the flexible substrate on which the thin film is partially removed to the solution receiving portion.
  • the wire forming unit may have a pair of rollers disposed before and after the flexible substrate is immersed in the solution accommodating part, and the flexible substrate immersed in the solution accommodating part from an upper direction to a lower direction. It may further include a pressing unit for pressing. When the flexible substrate is transferred using the pair of rollers, the pressing unit may press the flexible substrate to apply tension to the flexible substrate immersed in the solution receiving portion.
  • the flexible integrated circuit device package manufacturing apparatus may further include a pair of rollers respectively disposed between the transfer part, the thin film forming part, the thin film removing part, and the wire forming part. have.
  • the flexible substrate may be transferred between the transfer part, the thin film forming part, the thin film removing part, and the wire forming part by rotation of the pair of rollers.
  • the flexible integrated circuit device package manufacturing apparatus may further include a baking unit disposed behind the thin film forming unit and baking the thin film formed on the flexible substrate.
  • the baking unit may include a pair of rollers, and may bake the flexible substrate at a temperature of 100 ° C. to 200 ° C. between the pair of rollers.
  • the transfer device for manufacturing a flexible integrated circuit device package is attached to the first adhesive tape having a first adhesive force A first plate to be placed, a second plate on which the flexible substrate to which the flexible integrated circuit device is transferred and attached by the third adhesive force of the third adhesive tape is placed, and the flexible integrated circuit device and the first region on the first plate Is disposed between the first plate and the second plate to make contact with and in contact with the flexible substrate on the second plate in a second region, separating the flexible integrated circuit device from the first adhesive tape in the first region.
  • the first contact to transfer and attach the flexible integrated circuit device to the flexible substrate in the second region may include a detachable portion having a second adhesive tape having a second adhesive force greater than the adhesion and less than the third adhesive force.
  • each of the first adhesive tape and the second adhesive tape includes a curable adhesive tape, the adhesive strength of which is reduced when irradiated or heated with ultraviolet rays, wherein the third adhesive tape is less than the curable adhesive tape.
  • the flexible integrated circuit device is a first adhesive force reducing portion for irradiating or heating the ultraviolet ray on the first adhesive tape before contacting the detachable portion in the first region. And irradiating or heating ultraviolet rays to the second adhesive tape before the flexible integrated circuit device contacts the flexible substrate in the second region, and a second adhesive force reducing portion disposed between the first region and the second region. It may further include.
  • the surface of the second adhesive tape may have an uneven structure to selectively transfer and attach the flexible integrated circuit elements from the first adhesive tape to the second adhesive tape.
  • the detachable part may further include a tape supply part supplying the second adhesive tape, and a tape recovery part recovering the second adhesive tape.
  • the second adhesive tape may be used for a single use.
  • the transfer device for manufacturing a flexible integrated circuit device package according to the exemplary embodiments of the present invention, the first adhesive tape having a first adhesive force, the peripheral edge is supported by a ring frame A first plate on which a transfer substrate comprising a flexible integrated circuit element attached thereto is placed, a second plate on which a flexible substrate for transferring and attaching the flexible integrated circuit element is attached by a third adhesive force of a third adhesive tape, and A rotatable roller and disposed between the first plate and the first plate to be in contact with the flexible integrated circuit device on the first plate in a first region and to be in contact with the flexible substrate on the second plate in a second region;
  • the flexible integrated circuit device may be separated from the first adhesive tape in the first area and transferred and attached to the second adhesive tape, and the
  • the first plate may include a frame support for supporting the ring frame, and a chuck table which is lifted in contact with a rear surface of the first adhesive tape.
  • the chuck table may be lifted and lowered in a state where the ring frame is fixed using the frame support so that tension is applied to the first adhesive tape.
  • the detachable part may further include a tape supply part supplying the second adhesive tape to the roller, and a tape recovery part recovering the second adhesive tape from the roller.
  • the second adhesive tape may be used for a single use.
  • the transfer device for manufacturing a flexible integrated circuit device package may include the first plate on which the transfer substrate is placed when the roller rotates in place from a first direction to a second direction.
  • the display device may further include a first transfer part for transferring in one direction and a second transfer part for transferring the second plate on which the flexible substrate is placed in the second direction.
  • the transfer device for manufacturing the flexible integrated circuit device package may be configured to irradiate or heat ultraviolet light on the first adhesive tape before the flexible integrated circuit device contacts the detachable portion in the first region.
  • the surface of the second adhesive tape may have an uneven structure to selectively transfer and attach the flexible integrated circuit elements from the first adhesive tape to the second adhesive tape.
  • a transfer device for manufacturing a flexible integrated circuit device package to transfer a handling substrate with a flexible integrated circuit device in a first direction
  • a first transfer part rotating from a first direction to a second direction, in contact with a flexible integrated circuit device of the handling substrate conveyed in the first direction in a first region to separate the flexible integrated circuit device from the handling substrate;
  • a rotating portion having a body, and a second transferring portion for transferring the flexible substrate in a second direction and contacting the flexible integrated circuit element on the rotating portion to detach the flexible integrated circuit element from the body and attach the flexible substrate to the flexible substrate.
  • the body of the rotating part may have an uneven structure to selectively attach the flexible integrated circuit elements to the body of the rotating part from the handling substrate.
  • the rotating portion surrounds the body
  • An adhesive film having a third adhesive force larger than the first adhesive force and smaller than the second adhesive force may be further provided.
  • the attachment film may have an uneven structure to selectively attach the flexible integrated circuit elements to the attachment film having the third attachment force from the handling substrate.
  • the adhesion film may include polydimethylsiloxane (PDMS).
  • An apparatus for manufacturing a flexible integrated circuit device package may include a transfer unit, a thin film forming unit, a thin film removing unit, and wiring forming units to continuously perform manufacturing processes of a package for a flexible integrated circuit device. Can be. Accordingly, the flexible integrated circuit device that can be bent or bent freely can be easily manufactured using the flexible integrated circuit device package manufacturing apparatus.
  • a flexible integrated circuit device attached to the first adhesive tape having a first adhesive force using a third adhesive tape having a third adhesive force It can be easily transferred and attached to the flexible substrate.
  • a second adhesive tape larger than the first adhesive force and smaller than the third adhesive force may be used as a medium, and the second adhesive tape supplies the second adhesive tape.
  • the transfer device for manufacturing a flexible integrated circuit device package since the replacement of the second adhesive tape is unnecessary, it is possible to prevent the operation of the transfer apparatus due to the replacement of the second adhesive tape, thereby improving productivity.
  • the transfer device for manufacturing a flexible integrated circuit device package according to another exemplary embodiment of the present invention, it is possible to easily transfer and attach the flexible integrated circuit device from the handling substrate to the flexible substrate, in particular the flexible attached to the handling substrate Integrated circuit elements may be selectively transferred and attached onto a flexible substrate. Accordingly, the transfer device for manufacturing the flexible integrated circuit device package may easily manufacture the flexible integrated circuit device packages having various structures.
  • FIG. 1 is a block diagram illustrating a flexible integrated circuit device package manufacturing apparatus according to exemplary embodiments of the present invention.
  • FIG. 2 is a cross-sectional view for describing a substrate for manufacturing a flexible integrated circuit device package formed using the transfer unit illustrated in FIG. 1.
  • FIG. 3 is a cross-sectional view for describing a substrate for manufacturing a flexible integrated circuit device package formed using the thin film forming unit illustrated in FIG. 1.
  • FIG. 4 is a cross-sectional view for describing a substrate for manufacturing a flexible integrated circuit device package formed by using the thin film removing unit illustrated in FIG. 1.
  • FIG. 5 is a diagram for describing a substrate for manufacturing a flexible integrated circuit device package formed using the wiring forming unit illustrated in FIG. 1.
  • FIG. 6 is a configuration diagram illustrating an example of a transfer unit of the flexible integrated circuit device manufacturing apparatus illustrated in FIG. 1.
  • FIG. 7 is a plan view illustrating a transfer substrate including a flexible integrated circuit device that may be transferred and attached to a flexible substrate using the transfer unit illustrated in FIG. 6.
  • FIG. 8 is a cross-sectional view taken along line II of FIG. 7.
  • 9 and 10 are cross-sectional views for describing the first plate of the transfer unit illustrated in FIG. 6, respectively.
  • FIG. 11 is a cross-sectional view for describing a second adhesive tape of a transfer unit according to other exemplary embodiments of the present invention.
  • FIG. 12 is a cross-sectional view for describing a process of transferring and attaching a flexible integrated circuit device using the second adhesive tape illustrated in FIG. 11.
  • 13 to 15 are cross-sectional views illustrating a process of transferring and attaching a flexible integrated circuit device using the transfer unit illustrated in FIG. 6.
  • 16 is a cross-sectional view illustrating a transfer part of a flexible integrated circuit device manufacturing apparatus according to another exemplary embodiment of the present invention.
  • FIG. 17 is a cross-sectional view illustrating a handling substrate to which the flexible integrated circuit device illustrated in FIG. 16 is attached.
  • FIG. 18 is a cross-sectional view for describing a rotating part of a transfer part according to another exemplary embodiment of the present invention.
  • FIG. 19 is a cross-sectional view for describing a process of transferring and attaching a flexible integrated circuit device by using the rotating unit illustrated in FIG. 18.
  • 20 to 22 are cross-sectional views illustrating a method for manufacturing the handling substrate illustrated in FIG. 16.
  • FIG. 23 is a perspective view of the semiconductor substrate and the handling substrate illustrated in FIG. 20.
  • FIG. 24 is a schematic perspective view of the semiconductor substrate and the handling substrate illustrated in FIG. 21.
  • 25 and 26 are schematic perspective views of the semiconductor substrate and the handling substrate illustrated in FIG. 22, respectively.
  • FIG. 27 is a schematic cross-sectional view illustrating a thin film forming unit and a baking unit of the flexible integrated circuit device manufacturing apparatus illustrated in FIG. 1.
  • FIG. 28 is a schematic cross-sectional view illustrating a thin film removing unit of the flexible integrated circuit device manufacturing apparatus illustrated in FIG. 1.
  • FIG. 29 is a schematic cross-sectional view illustrating an example of a thin film removing unit of the flexible integrated circuit device manufacturing apparatus illustrated in FIG. 1.
  • FIG. 30 is a schematic cross-sectional view illustrating a transfer device for manufacturing a flexible integrated circuit device package according to another exemplary embodiment of the present invention.
  • FIG. 31 is a plan view illustrating a transfer material including a flexible integrated circuit element for transferring and attaching to a flexible substrate using the transfer apparatus illustrated in FIG. 30.
  • FIG. 32 is a cross-sectional view taken along the line III-IV of FIG. 31.
  • 33 and 34 are cross-sectional views illustrating the first plate of the transfer apparatus illustrated in FIG. 30.
  • 35 is a cross-sectional view illustrating a second adhesive tape of a transfer apparatus according to other exemplary embodiments of the present invention.
  • FIG. 36 is a cross-sectional view for describing a process of transferring and attaching a flexible integrated circuit device using the second adhesive tape illustrated in FIG. 35.
  • 37 to 39 are cross-sectional views illustrating a process of transferring and attaching a flexible integrated circuit device onto a flexible substrate.
  • FIG. 40 is a cross-sectional view illustrating a transfer device for manufacturing a flexible integrated circuit device package according to still another exemplary embodiment of the present invention.
  • FIG. 41 is a perspective view illustrating a handling substrate to which the flexible integrated circuit device illustrated in FIG. 40 is attached.
  • FIG. 42 is a cross-sectional view illustrating a rotating part of a transfer device for manufacturing a flexible integrated circuit device package according to another exemplary embodiment of the present invention.
  • FIG. 43 is a cross-sectional view illustrating a process of transferring and attaching a flexible integrated circuit device using the rotating unit illustrated in FIG. 42.
  • 44 to 46 are cross-sectional views illustrating a process for manufacturing a handling substrate to which the flexible integrated circuit device of FIG. 40 is attached.
  • FIG. 47 is a perspective view illustrating the semiconductor substrate and the handling substrate illustrated in FIG. 44.
  • FIG. 48 is a schematic perspective view illustrating the semiconductor substrate and the handling substrate illustrated in FIG. 45.
  • 49 and 50 are perspective views illustrating the handling substrate illustrated in FIG. 46, respectively.
  • FIG. 1 is a block diagram illustrating an apparatus for fabricating a flexible integrated circuit device package according to exemplary embodiments of the present invention.
  • the flexible integrated circuit device package manufacturing apparatus 10 may include a transfer unit 100, a thin film forming unit 500, a thin film removing unit 700, and a wire forming unit 800.
  • the flexible integrated circuit device package manufacturing apparatus 10 may further include a baking unit 600 between the thin film forming unit 500 and the thin film removing unit 700.
  • FIG. 2 is a cross-sectional view for describing a substrate for manufacturing a flexible integrated circuit device package formed by using the transfer unit 100 illustrated in FIG. 1.
  • the transfer unit 100 of the flexible integrated circuit device package manufacturing apparatus 10 may form the flexible integrated circuit device 15 on the flexible substrate 30 in a transfer manner.
  • the flexible integrated circuit device 15 may be attached to the flexible substrate 30 using the adhesive member 20. That is, the flexible integrated circuit device 15 can be fixed on the flexible substrate 30 via the adhesive member 20 between the flexible substrate 30 and the flexible integrated circuit device 15.
  • FIG. 3 is a cross-sectional view for describing a substrate for manufacturing a flexible integrated circuit device package formed by using the thin film forming unit 500 illustrated in FIG. 1.
  • the thin film forming unit 500 of the flexible integrated circuit device package manufacturing apparatus 10 may have a flexible integrated circuit device on the flexible substrate 30 to which the flexible integrated circuit device 15 is transferred and attached.
  • the thin film 35 covering 15 can be formed.
  • the thin film 35 may include a protective tape.
  • the substrate for manufacturing the flexible integrated circuit device package including the thin film 35 maintains flexibility to bend or flex freely as a whole. Can be maintained.
  • FIG. 4 is a cross-sectional view for describing a substrate for manufacturing a flexible integrated circuit device package formed by using the thin film removing unit 700 illustrated in FIG. 1.
  • the thin film removing unit 700 of the flexible integrated circuit device package manufacturing apparatus 10 may expose the flexible substrate 30 and portions of the flexible integrated circuit device 15 to expose the flexible substrate 30.
  • the thin film 35 formed on 30 may be partially removed.
  • the thin film 35 is partially removed using the thin film remover 700 to form openings 38 exposing portions of the flexible substrate 30 and the flexible integrated circuit device 15 in the thin film 35. can do.
  • the thin film pattern 35a having the openings 38 may be formed from the thin film 35.
  • FIG. 5 is a cross-sectional view for describing a substrate for manufacturing a flexible integrated circuit device package formed using the wiring forming unit 800 illustrated in FIG. 1.
  • the wire forming unit 800 of the flexible integrated circuit device package manufacturing apparatus 10 connects an exposed portion of the flexible substrate 30 and an exposed portion of the flexible integrated circuit device 15.
  • Conductive wiring 40 can be formed. That is, the conductive wiring 40 may be formed on the thin film pattern 35a while substantially filling the openings 38. Accordingly, the exposed portion of the flexible substrate 30 and the exposed portion of the flexible integrated circuit device 15 may be electrically connected.
  • the conductive wiring 40 formed by the wiring forming portion 800 may include a metal such as copper (Cu). As such, when the conductive wiring 40 includes copper, the flexibility to continuously bend or bend the substrate for manufacturing the flexible integrated circuit device package including the conductive wiring 40 can be continuously maintained.
  • the flexible integrated circuit device when the conductive line 40 is formed on the flexible substrate 30 using the wire forming unit 800, the flexible integrated circuit device may be formed from a substrate for manufacturing the flexible integrated circuit device package. Packages can be obtained. That is, the substrate for manufacturing the flexible integrated circuit device package illustrated in FIG. 5 may correspond to the flexible integrated circuit device package. Accordingly, as described above, since the substrate for manufacturing the flexible integrated circuit device package including the conductive wiring 40 can be continuously maintained, the flexibility to bend or bend the flexible integrated circuit device package manufacturing apparatus ( The flexible integrated circuit device package obtained by using 10) can secure sufficient flexibility.
  • the adhesion of the thin film 35 to the flexible integrated circuit device 15 is performed.
  • the baking process may be performed on the thin film 35 using the baking unit 600.
  • the thin film 35 includes a protective tape
  • the adhesion of the thin film 35 to the flexible integrated circuit device 15 can be improved by using the baking unit 600.
  • the baking process for the thin film 35 is performed at a temperature of less than about 100 ° C., it may be difficult to sufficiently achieve the adhesion improvement of the thin film 35.
  • the temperature of the baking process exceeds about 200 ° C, thermal damage may be applied to the flexible substrate 30 including the thin film 35 due to the relatively high temperature. Accordingly, the temperature of the baking process for the thin film 35 using the baking unit 600 may range from about 100 ° C to about 200 ° C.
  • the flexible integrated circuit device manufacturing apparatus 10 may include a transfer part 100, a thin film forming part 500, a baking part 600, a thin film removing part 700, and a wire forming part 800. It may include a pair of rollers (101, 501, 601, 701) in between. The pair of rollers 101, 501, 601, and 701 may be formed between the transfer part 100, the thin film forming part 500, the baking part 600, the thin film removing part 700, and the wire forming part 800. Can transfer substrates for manufacturing flexible integrated circuit device packages.
  • the substrate for manufacturing the flexible integrated circuit device package when the substrate for manufacturing the flexible integrated circuit device package has a shape of a film as a whole, the substrate for manufacturing the flexible integrated circuit device package using the rollers 101, 501, 601, and 701 may be used. It can be easily transported. Accordingly, the processes for manufacturing the flexible integrated circuit device package using the flexible integrated circuit device package manufacturing apparatus 10 may be continuously performed, and the efficiency and productivity of the manufacturing process of the flexible integrated circuit device package may be improved. Can be. In addition, the flexible integrated circuit device package manufacturing apparatus 10 may more easily manufacture the flexible integrated circuit device package that may be bent or bent freely to a desired degree.
  • the transfer unit 100, the thin film forming unit 500, the baking unit 600, the thin film removing unit 700, and the wiring forming unit 800 of the apparatus 10 for manufacturing a flexible integrated circuit device package will be described in detail. Explain.
  • FIG. 6 is a cross-sectional view for describing the transfer unit 100 of the flexible integrated circuit device manufacturing apparatus illustrated in FIG. 1.
  • the transfer unit 100 may include a first plate 105, a second plate 110, The detachable part 115, the first adhesive force reducing unit 120, and the second adhesive force reducing unit 125 may be included.
  • the flexible integrated circuit device 140 attached to the first adhesive tape 130 having the first adhesive force may be disposed on the first plate 110.
  • the flexible substrate 145 may be disposed on the second plate 110 to transfer and attach the flexible integrated circuit device 140 by the third adhesive force of the third adhesive tape 135.
  • the detachable part 115 may be in contact with the flexible integrated circuit device 140 positioned on the first plate 105 in the first region of the transfer part 100, and may be placed on the second plate 110.
  • the substrate 145 may be in contact with the second area of the transfer part 100.
  • the detachable portion 115 may be disposed between the first plate 105 and the second plate 110, and may contact with the flexible integrated circuit device 140 in the first region to be flexible from the first adhesive tape 130.
  • the integrated circuit device 140 may be separated, and in the second area, the flexible integrated circuit device 140, which is contacted with the flexible substrate 145 and separated from the first adhesive tape 135, is transferred to the flexible substrate 145. And attach.
  • the detachable portion 115 may include a second adhesive tape 150 having a second adhesive force substantially greater than the first adhesive force and substantially less than the third adhesive force.
  • the first adhesive force reducing unit 120 may substantially weaken the adhesive force of the first adhesive tape 130 before the flexible integrated circuit device 140 contacts the detachable unit 115 in the first region.
  • the second adhesive force reducing unit 125 may substantially lower the adhesive force of the second adhesive tape 150 before the flexible integrated circuit device 140 contacts the flexible substrate 145 in the second region.
  • the first adhesive force of the first adhesive tape 130, the second adhesive force of the second adhesive tape 150, and the third adhesive force of the third adhesive tape 135 may be compared with each other.
  • the second adhesive force is substantially greater than the adhesive force
  • the third adhesive force is substantially greater than the second adhesive force.
  • the flexible integrated circuit device 140 may be transferred and attached from the first adhesive tape 130 to the second adhesive tape 150 using a second adhesive force that is substantially larger than the first adhesive force.
  • the flexible integrated circuit device 140 may be transferred and attached from the second adhesive tape 150 to the third adhesive tape 135 using a third adhesive force that is substantially greater than the second adhesive force.
  • the first adhesive tape 130 and the second adhesive tape 150 may include a curable adhesive tape which is substantially reduced in adhesive strength by irradiation or heating of ultraviolet rays.
  • a curable adhesive tape include an ultraviolet curable adhesive tape, a thermosetting adhesive tape, and the like.
  • the first adhesive tape 130 may include an adhesive tape substantially the same as the second adhesive tape 150. Therefore, the first adhesive tape 130 may have the first adhesive force reduced from the first adhesive force by using the first adhesive force reducing unit 120, and the second adhesive force may be used by the second adhesive force reducing unit 125.
  • the tape 150 may have the second adhesive force reduced than the initial adhesive force.
  • the third adhesive tape 135 may include an adhesive tape DAF.
  • FIG. 7 is a plan view illustrating a transfer substrate including a flexible integrated circuit device that may be transferred and attached onto a flexible substrate using the transfer unit 100 illustrated in FIG. 6, and FIG. 8 is a line II of FIG. 7. The cross section along the.
  • the flexible integrated circuit device 140 which is transferred and attached to the flexible substrate 145 using the transfer unit 100, is attached to the first adhesive tape 130 having the first adhesive force.
  • the first adhesive tape 130 may be bent in a state in which the flexible integrated circuit device 140 is attached to the first adhesive tape 130.
  • the periphery of the first adhesive tape 130 may be supported by the ring frame 150.
  • the flexible integrated circuit device 140 may be attached to the first adhesive tape 130 having the first adhesive force and attached to the first adhesive tape 130 supported at the periphery by the ring frame 150.
  • Including a transfer substrate 155 may be placed.
  • the flexible integrated circuit device 140 may include a semiconductor device such as a memory device or a non-memory device, and may also include an active device, a passive device, or the like.
  • integrated circuit devices which may be manufactured as flexible integrated circuit devices 140, may be formed on a semiconductor substrate.
  • the integrated circuit devices formed on the semiconductor substrate may be pre-cutted to be separated from each other.
  • the integrated circuit devices may be separated separately by pre-cutting a non-device region of the semiconductor substrate between the integrated circuit devices.
  • a polishing process may be performed to partially remove the lower portion of the semiconductor substrate. In this case, the polishing process may be performed until the integrated circuit devices have a thickness that may be applied to the flexible integrated circuit devices 140.
  • Each of the flexible integrated circuit devices 140 may have a thickness of several micrometers to several tens of micrometers, for example, about 1 micrometer to about 50 micrometers.
  • the first adhesive force reducing unit 120 may include a first adhesive contact before the flexible integrated circuit device 140 contacts the detachable unit 115 in the first region.
  • the adhesive tape 130 may have the first adhesive force reduced than the initial adhesive force.
  • the first adhesive force reducing unit 120 may be disposed in front of the first plate 105.
  • the first adhesive force reducing unit 120 may be disposed at a predetermined position before the transfer substrate 155 is transferred to the first plate 105.
  • the first adhesive force reducing unit 120 may include an ultraviolet irradiation unit capable of irradiating ultraviolet rays onto the first adhesive tape 130. .
  • the first adhesive force reducing unit 120 may include a heating device such as a heater capable of heating the first adhesive tape 130. Accordingly, the first adhesive force reducing unit 120 may irradiate ultraviolet rays onto the back surface of the first adhesive tape 130 or heat the first adhesive tape 130 to reduce the initial adhesive force of the first adhesive tape 130. May weaken. That is, the first adhesive force reducing unit 120 may irradiate ultraviolet rays onto the other surface opposite to one surface of the first adhesive tape 130 to which the flexible integrated circuit device 140 is attached, or the first adhesive tape 130 may be separated from the first adhesive tape 130. It can heat from the other surface.
  • a heating device such as a heater capable of heating the first adhesive tape 130.
  • the first adhesive force reducing unit 120 may irradiate ultraviolet rays onto the back surface of the first adhesive tape 130 or heat the first adhesive tape 130 to reduce the initial adhesive force of the first adhesive tape 130. May weaken. That is, the first adhesive force reducing unit 120 may irradiate ultraviolet rays onto the other surface opposite to
  • 9 and 10 are cross-sectional views for describing the first plate 105 of the transfer unit 100 illustrated in FIG. 6.
  • the transfer substrate 155 may be placed on the first plate 105.
  • the first plate 105 may have a frame support 108 and a chuck table 107.
  • the frame support 108 may support the ring frame 160 of the transfer substrate 155.
  • the frame support 108 can support the ring frame 160 in a substantially gripping manner.
  • Such frame support 108 may include a clamp.
  • the frame support 108 may support the ring frame 160 substantially entirely or partially support the ring frame 160. As the ring frame 160 is supported by the frame support 108, the ring frame 150 itself may be fixed to the first plate 105.
  • the chuck table 107 may contact the other surface of the first adhesive tape 130 of the transfer substrate 155. In addition, the chuck table 107 may move up and down while being in contact with the other surface of the first adhesive tape 130. The lifting and lowering of the chuck table 107 may be adjusted by a driving member (not shown) connected with the chuck table 107.
  • a predetermined tension may be applied in the transfer substrate 155 positioned on the first plate 105.
  • the movement of the chuck table 107 may be within a lifting range of about 0.5 mm to about 5 mm.
  • the second adhesive tape 150 may be more easily attached to the flexible integrated circuit device 140 attached to the first adhesive tape 130 from the first adhesive tape 130. ) Can be transferred and attached.
  • the first transfer part 113 may transfer the first plate 105 on which the transfer substrate 155 is placed.
  • the detachable part 115 may be disposed between the first plate 105 and the second plate 110.
  • the detachable portion 115 may be in contact with the flexible integrated circuit device 140 positioned on the first plate 105 in the first region, and may be placed on the second plate 110.
  • the paper may be in contact with the flexible substrate 145 in the second region.
  • the detachable part 115 may include a second adhesive tape 150 having a second adhesive force substantially greater than the first adhesive force and substantially smaller than the third adhesive force as described above.
  • the flexible integrated circuit device 140 may be separated from the first adhesive tape 130 by being in contact with the flexible integrated circuit device 140 in the first area, and the flexible substrate 145 may be contacted in the second area.
  • the flexible integrated circuit device 140 separated from the first adhesive tape 130 may be transferred and attached to the flexible substrate 145.
  • the second adhesive tape 150 may contact the flexible integrated circuit device 140 in the first region by the roller 165 of the detachable portion 115, and the flexible substrate 145 in the second region.
  • Contact with The roller 165 of the detachable portion 115 may be rotatably disposed between the first plate 105 and the second plate 110. Due to the rotation of the roller 165, a second adhesive tape 150 having the second adhesive force may be provided between the first plate 105 and the second plate 110 along the periphery of the roller 165.
  • the rotation of the roller 165 causes the second adhesive tape 150 to be placed on the first plate 105 in the first area along the circumference of the roller 165.
  • the flexible integrated circuit device 140 may be transferred and attached to the second adhesive tape 150, and the flexible integrated device may be attached to the second adhesive tape 150 in the second area.
  • the circuit element 140 may be transferred and attached onto the flexible substrate 145.
  • the second adhesive tape 150 of the detachable portion 115 may be provided to be used for a single use.
  • the detachable part 115 may include a tape supply part 170 and a tape recovery part 175.
  • the tape supply unit 170 may supply the second adhesive tape 150 to the roller 165
  • the tape recovery unit 175 may supply the second adhesive tape to the roller 165 by the tape supply unit 170.
  • 150 can be recovered.
  • the tape supply unit 170 may be disposed at a position capable of supplying the second adhesive tape 150 before the second adhesive tape 150 passes through the first region, and the tape recovery unit 175.
  • the second adhesive tape 150 may be disposed at a position where the second adhesive tape 150 can be recovered after the second adhesive tape 150 passes the second area.
  • the supply speed of the second adhesive tape 150 from the tape supply unit 170 and the recovery speed of the second adhesive tape 150 to the tape recovery unit 175 may be controlled to be substantially the same.
  • the supply speed of the second adhesive tape 150 and the recovery speed of the second adhesive tape 150 may be adjusted based on the rotation speed of the roller 165.
  • reference numeral 180 and reference numeral 185 denote transfer members for smooth recovery of the second adhesive tape 150, respectively.
  • the transfer unit 100 may include a tape supply unit 170 for providing the second adhesive tape 150 and a tape recovery unit 175 for collecting the second adhesive tape 150.
  • the two adhesive tapes 150 may be used for substantially one time use.
  • the flexible integrated circuit device 140 attaching a new second adhesive tape 150 to the first adhesive tape 130 from the tape supply unit 170. Since it is possible to continuously provide on the), the second adhesive force of the second adhesive tape 150 can be kept constant.
  • the exposure of the flexible integrated circuit device 140 may be minimized while using the second adhesive tape 150, process defects due to adsorption of foreign substances may be prevented and the second adhesive tape 150 may be replaced. Since it is not necessary, it is possible to prevent a decrease in productivity due to the interruption of operation of the transfer unit 100 due to the replacement of the second adhesive tape 150.
  • the thicknesses of the second adhesive tape 150 of portions to which the flexible integrated circuit devices 140 are transferred and attached may vary substantially according to the type of the flexible integrated circuit devices 140. . That is, the second adhesive tape 150 may include portions having substantially different thicknesses depending on the type of flexible integrated circuit elements 140.
  • FIG. 11 is a cross-sectional view illustrating another example of the second adhesive tape 151 used in the transfer unit 100 illustrated in FIG. 6, and FIG. 12 uses the second adhesive tape 151 illustrated in FIG. 11. Is a cross-sectional view for explaining a process of transferring and attaching the flexible integrated circuit device 140.
  • the second adhesive tape 151 may have a substantially uneven structure.
  • one side of the second adhesive tape 151 may have a structure in which a plurality of protrusions and / or grooves are repeated.
  • the flexible integrated circuit devices 140 may be transferred and attached from the first adhesive tape 130 only on portions except the grooves (ie, the protrusions). .
  • the flexible integrated circuit device 140 attached to the first adhesive tape 130 is illustrated.
  • Some flexible integrated circuit elements 140 may be selectively transferred and attached to the second adhesive tape 151.
  • the flexible integrated circuit devices 140 having various pattern shapes may be selectively attached to the second adhesive tape 151 from the first adhesive tape 130, respectively. You can. Accordingly, flexible integrated circuit device packages capable of selectively including various flexible integrated circuit devices 140 may be easily manufactured.
  • the second decrease in adhesion force 125 may cause the second adhesive tape 150 to be substantially less than the initial adhesion force before the flexible integrated circuit device 140 contacts the flexible substrate 145 in the second region. It can be made to have a weakened second adhesive force.
  • the second adhesive force reducing portion 125 may be formed in the first region and the position at which the supply and / or recovery of the second adhesive tape 150 by the detachable portion 115 does not interfere. It may be disposed between the second region.
  • the second adhesive force reducing unit 125 may form an ultraviolet irradiation member capable of irradiating ultraviolet rays onto the second adhesive tape 150. It may include.
  • the second adhesive force reducing unit 125 may include a heating device capable of heating the second adhesive tape 150.
  • the second adhesive force reducing unit 125 may radiate ultraviolet rays onto the back surface of the second adhesive tape 150 or may heat the back surface of the second adhesive tape 150. That is, the second adhesive force reducing unit 125 may irradiate or heat ultraviolet rays on the other surface substantially opposite to one surface of the second adhesive tape 150 to which the flexible integrated circuit device 140 is attached.
  • the flexible substrate 145 may be disposed on the second plate 110.
  • the second plate 110 may support the flexible substrate 145 to prevent the flexible substrate 145 from being bent or bent.
  • the second plate 110 may include a support member such as a chuck table.
  • the third adhesive tape 135 may be attached to one surface of the flexible substrate 145, but one surface of the flexible substrate 145 may be exposed as it will be described later.
  • the flexible integrated circuit device 140 is in contact with the flexible substrate 145 in the second area by the detachable portion 115. It may be transferred and attached onto the substrate 140.
  • the third adhesive tape 135 may be previously attached to the rear surface of the flexible integrated circuit device 140.
  • a third adhesive tape 135 may be interposed between the first adhesive tape 130 and the flexible integrated circuit device 140. Therefore, when the flexible integrated circuit device 140 is transferred and attached from the second adhesive tape 130 to the second adhesive tape 150, the third adhesive tape 135 is continuously formed on the rear surface of the flexible integrated circuit device 140. Can be attached. In this case, since the third adhesive force of the third adhesive tape 135 is substantially greater than the first adhesive force of the first adhesive tape 130, the third adhesive tape 135 is formed on the back surface of the flexible integrated circuit device 140. In the attached state, the flexible integrated circuit device 140 may be transferred and attached to the second adhesive tape 150.
  • the flexible integrated circuit device 140 may be easily transferred and attached onto the flexible substrate 145 while the third adhesive tape 135 contacts the flexible substrate 145.
  • the third adhesive force of the third adhesive tape 135 is substantially larger than the second adhesive force of the second adhesive tape 150, the flexible integrated circuit device 140 is easily transferred and attached onto the flexible substrate 145. Can be.
  • the transfer unit 100 since the transfer unit 100 has a configuration in which the roller 165 of the detachable unit 115 may rotate, the flexible integrated circuit device 140 and the flexible substrate 145 may be replaced in some cases. Need to be transferred.
  • the transfer part 100 may include the first conveying part 113 and the second plate 110 for conveying the first plate 105. It may include a second transfer unit 123 for transferring.
  • the first transfer part 113 may transfer the first plate 105 in the first direction
  • the second transfer part ( 123 may transfer the second plate 110 in the second direction.
  • the first transfer part 113 may move a conveyor belt, a winder, or the like to continuously transfer the first plate 105 on which the transfer substrate 155 is placed. It can be provided.
  • the second transfer part 123 may continuously transfer the second plate 110 on which the flexible substrate 145 is placed. Conveyor belts, winders and the like.
  • the first transfer unit 113, the detachable unit 115, and the second transfer unit 133 may move or rotate at a first speed, a second speed, and a third speed, respectively. Accordingly, the first speed of the first transfer part 113, the second speed of the detachable part 115, and / or the third speed of the second transfer part 123 are controlled to transfer and adhere onto the flexible substrate 145.
  • the flexible integrated circuit devices 140 may be easily aligned.
  • the first speed By adjusting the second speed and / or the third speed to be substantially the same, alignment of the flexible integrated circuit devices 140 transferred and attached onto the flexible substrate 145 may be easily achieved.
  • the first speed is increased.
  • the second speed are substantially the same, and the flexible integrated circuit device 140 transferred and attached onto the flexible substrate 145 by adjusting the third speed about twice as fast as the first and second speeds.
  • the second speed of the detachable portion 115 may be referred to as the rotational speed of the roller 165.
  • the first plate 105 and / or the second plate 110 may have a movable configuration.
  • the transfer part 100 may not include the first transfer part 113 and / or the second transfer part 123.
  • the transfer unit 100 has a third adhesive tape having a third adhesive force to the flexible integrated circuit device 140 attached to the first adhesive tape 130 having the first adhesive force.
  • the 135 can be easily transferred and attached onto the flexible substrate 145.
  • a second adhesive tape having a second adhesive force substantially larger than the first adhesive force and substantially smaller than the third adhesive force as a medium ( 150).
  • the transfer part 100 includes a tape supply part 170 for supplying the second adhesive tape 150 and a tape recovery part 175 for recovering the second adhesive tape 150, thereby providing a second adhesive tape. 150 may be used for a single use.
  • the transfer unit 100 can continuously supply the new second adhesive tape 150 during the transfer process, the second adhesive force of the second adhesive tape 150 can be kept constant, and the second adhesive tape ( Process defects caused by adhesion of foreign matters due to the continuous use of 150) can be prevented.
  • the replacement of the second adhesive tape 150 is unnecessary, the operation of the transfer part 100 may be prevented due to the replacement of the second adhesive tape 150, thereby improving productivity of the flexible integrated device package manufacturing process. have.
  • the transfer substrate 155 having the flexible integrated circuit device 140 attached thereto is provided on the first adhesive tape 130.
  • the first adhesive tape 130 of the first adhesive tape 130 is weakened by using the first adhesive force reducing unit 120, so that the first adhesive tape 130 has the first adhesive force.
  • the transfer substrate 155 having the flexible integrated circuit device 140 attached to the first adhesive tape 130 having the first adhesive force is transferred onto the first plate 105.
  • the first plate 105 lifts the chuck table 107 while supporting the ring frame 160 by using the frame support 108 to apply a predetermined tension to the first adhesive tape 130.
  • the first plate 105 on which the transfer substrate 155 is placed is transferred in the first direction. In this case, although the first plate 105 itself may be transferred, the first plate 105 may be transferred using the first transfer part 113.
  • the second adhesive tape 150 is supplied and recovered along the periphery of the roller 165 of the detachable portion 115.
  • the detachable part 115 may include a tape supply part 170 and a tape recovery part 175 to supply the second adhesive tape 150 in a single use.
  • the roller 165 of the detachable portion 115 may rotate from the first direction toward the second direction.
  • the first plate 105 As the first plate 105 is transferred in the first direction and the detachable portion 115 is rotated toward the second direction, the first plate 105 is attached to the detachable portion 115 and the transfer substrate 155 in the first region.
  • the flexible integrated circuit device 140 is brought into contact.
  • the second adhesive force of the second adhesive tape 150 of the detachable part 115 is substantially larger than the first adhesive force of the first adhesive tape 130 to which the flexible integrated circuit device 140 is attached, the flexible integration
  • the circuit element 140 is transferred and attached from the first adhesive tape 130 to the second adhesive tape 150.
  • the flexible integrated circuit device 140 which is transferred to and attached to the second adhesive tape 150 of the detachable portion 115, may move from the first direction to the second direction according to the rotation of the roller 165 of the detachable portion 115.
  • the second adhesive force reducing unit 125 reduces the initial adhesive force of the second adhesive tape 150 to the second adhesive force.
  • the flexible integrated circuit device 140 attached to the second adhesive tape 150 in accordance with the rotation of the roller 165 is in contact with the flexible substrate 145 transferred in the second direction in the second area.
  • the second plate 110 for transferring the flexible substrate 145 may move by itself, but may also transfer the second plate 110 using the second transfer unit 123.
  • the flexible substrate 145 As the flexible substrate 145 is transferred in the second direction and the detachable portion 115 is rotated from the first direction toward the second direction, the flexible substrate 145 and the second adhesive layer are adhered to the second region.
  • the flexible integrated circuit device 140 attached to the tape 150 contacts.
  • the third adhesive tape for transferring and attaching the flexible integrated circuit device 140 onto the flexible substrate 145 is greater than the second adhesive force of the second adhesive tape 150 to which the flexible integrated circuit device 140 is attached. Because the third adhesive force of 135 is substantially large, the flexible integrated circuit device 140 is transferred and attached onto the flexible substrate 145. That is, the flexible integrated circuit device 140 may be transferred and attached onto the flexible substrate 145 from the first adhesive tape 130 of the transfer substrate 155. Accordingly, the flexible integrated circuit device package including the flexible substrate 145 to which the flexible integrated circuit device 140 is attached can be manufactured.
  • FIG. 16 is a schematic diagram illustrating a transfer part of a flexible integrated circuit device package manufacturing apparatus according to another exemplary embodiment of the present disclosure.
  • the transfer unit 101 may include a first transfer unit 116, a rotation unit 123, a second transfer unit 117, and the like.
  • the first transfer unit 116 transfers the handling substrate 60 to which the flexible integrated circuit device 140 is attached in the first direction.
  • the first transfer unit 116 may continuously transfer the handling substrate 60.
  • the first transfer unit 116 may include a conveyor belt.
  • the flexible integrated circuit device 140 may include a semiconductor device such as a memory device or a non-memory device.
  • the flexible integrated circuit device 140 may include an active device, a passive device, and the like.
  • the flexible integrated circuit device 140 may include circuit patterns formed on a silicon substrate having a relatively thin thickness.
  • the silicon substrate used for the flexible integrated circuit device 140 may have a thin thickness of about several ⁇ m to about several tens of ⁇ m.
  • the silicon substrate may have a thickness of about 1.0 ⁇ m to about 50 ⁇ m, preferably about 5.0 ⁇ m to about 30.0 ⁇ m.
  • the flexible integrated circuit device 140 has a thickness of less than about 1.0 ⁇ m, fabrication of the integrated circuit device 140 may not be easy.
  • the thickness of the flexible integrated circuit device 140 exceeds about 50 ⁇ m, the flexible integrated circuit device 140 may not be easily bent.
  • FIG. 17 is a perspective view illustrating the handling substrate 60 to which the integrated circuit device 140 illustrated in FIG. 16 is attached.
  • the plurality of flexible integrated circuit devices 140 may be spaced apart from each other at predetermined intervals and attached to the handling substrate 60.
  • the flexible integrated circuit devices 140 may be separated separately by pre-cutting non-device regions between the flexible integrated circuit devices 140.
  • the flexible integrated circuit device 140 may be attached to the handling substrate 60 using the attachment film 65.
  • the attachment film 65 may have a first adhesion force.
  • the attachment film 65 may include a double-sided tape or the like. This attachment film 60 is referred to below as first attachment film 60.
  • the handling substrate 60 may be mainly composed of a dummy substrate. The handling substrate 60 to which the flexible integrated circuit device 140 is attached will be described later.
  • the rotating part 123 may include a body 123a in contact with the flexible integrated circuit device 140 on the handling substrate 60 in the first region A.
  • the rotating unit 123 may rotate from the first direction toward the second direction.
  • the first transfer unit 116 may transfer the handling substrate 60 in the first direction
  • the second transfer unit 117 may transfer the flexible substrate 145 in the second direction.
  • the rotating part 123 may rotate in place, and when the rotating part 123 rotates in position, flexible integration on the handling substrate 60 transferred by the first transfer part 116 in the first direction.
  • the circuit element 140 may be transferred onto the flexible substrate 145 transferred in the second direction by the second transfer part 117.
  • the rotating unit 123 may rotate in place from the first direction to the second direction, and the flexible integrated circuit device 140 and the first on the handling substrate 60 are conveyed in the first direction.
  • the body 123a may be provided in contact with the area A.
  • the body 123a of the rotating part 123 may be in contact with the flexible substrate 145 transferred in the second direction in the second area B.
  • the flexible integrated circuit device 40 on the handling substrate 60 may be detached from the handling substrate 60, and transferred and attached to the body 123a. Since the flexible integrated circuit device 140 needs to be separated from the handling substrate 60 to be transferred and attached to the body 123a, the rotating part 123 may further include an attachment film 123b substantially enclosing the body 123a. Can be. This attachment film 123b is referred to as a third attachment film below.
  • the third adhesive film 123b may have a third adhesive force.
  • the third attachment film 123b may include a double-sided tape.
  • the third adhesion film 123b may include polydimethylsiloxane (PDMS).
  • the third attachment force of the third attachment film 123b is determined by the first attachment film 65. 1 may be substantially greater than the adhesion.
  • the third adhesion of the third attachment film 123b is substantially smaller than the first adhesion of the first attachment film 122, it may be difficult to separate the flexible integrated circuit device 140 from the handling substrate 60.
  • the rotary part 123 rotates in place from the first direction to the second direction and a third attachment having the third attachment force while surrounding the body 123a. Since the film 123b may be provided, the flexible integrated circuit device 140 is contacted with the flexible integrated circuit device 140 on the handling substrate 60 in the first region A of the transfer part 101, and thus, the flexible integrated circuit is provided from the handling substrate 60. The device 40 may be separated and attached to the rotating part 123. In addition, when foreign matters are attached to the surface of the body 123a by the continuous use of the rotating part 123, the foreign matters may be adsorbed onto the flexible integrated circuit device 140 which is transferred and attached onto the third attachment film 123b.
  • the transfer part 101 may have a replaceable rotating part 123. Further, when the third attachment film 123b substantially surrounds the body 123a, the third attachment film 123b may also be replaced periodically or aperiodically.
  • FIG. 18 is a cross-sectional view illustrating a rotating unit 124a according to another exemplary embodiment of the present invention
  • FIG. 19 illustrates a third embodiment of the flexible integrated circuit device 140 using the rotating unit 124a illustrated in FIG. 18. It is sectional drawing for demonstrating the process of transferring and attaching on the adhesion film 123a.
  • the rotating part 123 may include a body 124a and a third attachment film 124b that may substantially wrap the body 124a.
  • an uneven structure having a plurality of grooves and / or protrusions may be formed on the surface of the body 124a.
  • the third attachment film 124b may include a surface having an uneven structure.
  • the handling substrate is formed on the grooves of the body 124a or the third attachment film 124b of the rotating part 123. From 60, flexible integrated circuit device 140 may be transferred and attached.
  • the flexible integrated circuit device 40 may be selectively selected from the handling substrate 60 by the body 124a or the third. It can be transferred and attached onto the adhesion film 124b.
  • the uneven structure of the body 124a or the third attachment film 124b of the rotating part 123 is formed in various shapes, flexible integrated circuit device packages including various patterns may be implemented as desired. That is, by variously forming the surface shapes of the bodies of the rotating portions or the third attachment films, it is possible to easily manufacture the flexible integrated circuit device packages in a variety of configurations.
  • the second transfer part 117 may transfer the flexible substrate 145 along the second direction.
  • the second direction may be substantially opposite to the first direction.
  • the second transfer unit 117 may include a winder (winder) or the like to continuously provide the flexible substrate 145.
  • the rotating unit It may be difficult to separate the flexible integrated circuit device 140 from 123 and attach it to the flexible substrate 145.
  • the flexible substrate 145 which is transferred in the second direction by the second transfer part 117, is flexible in the second area B of the transfer part 101. It may be disposed in contact with the integrated circuit device 140.
  • an attachment having a second adhesive force on the flexible substrate 145 is performed.
  • the film 70 may be formed.
  • This attachment film 70 is referred to below as a second attachment film.
  • the second attachment film 70 may include a double-sided tape.
  • the second attachment force of the second attachment film 70 may be a third attachment film (ie, to attach the flexible integrated circuit device 140 on the flexible substrate 145 from the rotating portion 123). Substantially greater than the third adhesion of 123b).
  • the second adhesive force of the second adhesive film 70 is substantially smaller than the third adhesive force of the third adhesive film 132b, it may be difficult to separate the flexible integrated circuit device 140 from the rotating part 123.
  • the flexible substrate 145 may include a flexible printed circuit board (FPCB).
  • FPCB flexible printed circuit board
  • FIG. 16 although the first area A and the second area B of the transfer unit 101 are shown to face substantially opposite to each other, the first area A and the second area within a range not interfering with each other. (B) may not be limited to specific positions in the transfer portion 101.
  • the transfer unit 101 including the first transfer unit 116, the rotation unit 123, the second transfer unit 117, and the like may be formed from the flexible integrated circuit device from the handling substrate 60.
  • the 140 may be more easily transferred and attached onto the flexible substrate 145.
  • the first transfer unit 116, the rotation unit 123, and the second transfer unit 117 may move or rotate at the first speed, the second speed, and the third speed, respectively, the first transfer unit 116. Control the first speed, the second speed of the rotating part 123 and / or the third speed of the second conveying part 117 to more easily align the flexible integrated circuit elements 140 on the flexible substrate 145. Can be.
  • the flexible integrated circuit devices 140 are easily transferred and attached onto the flexible substrate 145 from the handling substrate 60. Can be sorted.
  • the first By adjusting the speed substantially the same as the second speed, and by adjusting the third speed about two times faster than the first speed or the second speed, a flexible integrated circuit device attached to the flexible substrate 145 ( While aligning the 140 more easily, a flexible integrated circuit device package composed of the flexible substrate 145 to which the flexible integrated circuit devices 140 are attached may be manufactured.
  • the handling substrate 60 to which the flexible integrated circuit devices 140 are attached is transferred along the first direction.
  • the first transfer unit 116 may transfer the handling substrate 60 to which the flexible integrated circuit devices 140 are attached.
  • the flexible integrated circuit devices 140 may be attached onto the handling substrate 60 via the first attachment film 65 having the first attachment force.
  • 20 to 22 are cross-sectional views illustrating a method for manufacturing the handling substrate 60 to which the flexible integrated circuit devices 140 illustrated in FIGS. 16 and 17 are attached.
  • 23 to 20 are perspective views illustrating the flexible integrated circuit devices 140 and the handling substrate 60
  • FIG. 24 illustrates the flexible integrated circuit devices 140 and the handling substrate 60 illustrated in FIG. 21.
  • It is a perspective view showing. 25 and 26 are perspective views illustrating the flexible integrated circuit device 140 and the handling substrate 60 illustrated in FIG. 22, respectively.
  • integrated circuit devices 140a made of flexible integrated circuit devices 140 are formed on a semiconductor substrate 80.
  • the integrated circuit devices 140a formed on the semiconductor substrate 80 may be pre-cut to be separated from each other at predetermined intervals.
  • the integrated circuit devices 140a formed on the semiconductor substrate 80 may be separated from the integrated circuit devices 140a by pre-cutting a non-device region between the integrated circuit devices 140a. .
  • the semiconductor substrate 80 is positioned on the handling substrate 60 such that the integrated circuit elements 140a on the semiconductor substrate 80 and the handling substrate 60 substantially face each other.
  • the handling substrate 60 may be disposed on the semiconductor substrate 80 on which the integrated circuit devices 140a are formed. That is, the positional relationship between the handling substrate 60 and the semiconductor substrate 80 is not limited to FIGS. 20 to 26.
  • the integrated circuit elements 140a on the semiconductor substrate 80 may have the first attachment film on the handling substrate 60. Can substantially face (65).
  • the semiconductor substrate 80 is removed from the back surface of the semiconductor substrate 80 by performing a planarization process such as chemical mechanical polishing (CMP) on the semiconductor substrate 80. That is, the semiconductor substrate 80 may be polished from the rear surface opposite to the front surface of the semiconductor substrate 80 on which the integrated circuit elements 140a are located. For example, as illustrated in FIGS. 21 and 24, the semiconductor substrate 80 is polished by using the rotating polishing member 85, whereby the integrated circuit element 140a positioned on the front surface of the semiconductor substrate 80 is provided. The semiconductor substrate 80 may be removed until the holes are exposed. While polishing the semiconductor substrate 80 with the polishing member 85, a slurry containing suitable abrasive particles may be provided between the semiconductor substrate 80 and the polishing member 85.
  • CMP chemical mechanical polishing
  • the semiconductor substrate 80 is removed until the integrated circuit devices 140a are exposed, thereby removing the semiconductor substrate 80 on the first attachment film 65 of the handling substrate 60.
  • Integrated circuit elements 140a are left behind. That is, the integrated circuit devices 140a that are separately separated may be attached onto the first attachment film 65 of the handling substrate 60 according to the removal of the semiconductor substrate 80.
  • a stripping process is performed on the integrated circuit devices 140a attached to the handling substrate 60 to form the flexible integrated circuit devices 140 on the handling substrate 60.
  • the stripping process may include a heat treatment process, an ultraviolet irradiation process, and the like.
  • the handling substrate 60 to which the flexible integrated circuit devices 140 are attached may be obtained through the first adhesive film 65.
  • the handling substrate 60 may be transferred in the first direction by using the transfer unit 116 as illustrated in FIG. 6.
  • the flexible integrated circuit device on the rotating unit 123 and the handling substrate 60 in the first region A of the transfer unit 101. 140 may be contacted.
  • a third attachment film 123b having a third attachment force that is substantially larger than the first attachment force of the first attachment film 65 may be formed on the body 123a of the rotating part 123 to which the flexible integrated circuit elements 140 contact.
  • the flexible integrated circuit elements 140 on the handling substrate 60 are rotated 123a of the rotating part 123 because the rotating part 123 can rotate from the first direction to the second direction at its own position. ) May be attached to the third attachment film 132b surrounding the c).
  • the flexible integrated circuit devices 140 attached to the rotating part 123 from the handling substrate 60 may rotate from the first direction to the second direction along the rotating part 123, and may be formed of the transfer part 101.
  • the flexible substrate 145 may be in contact with the flexible substrate 145.
  • the flexible substrate 145 may be transferred in the second direction by the second transfer unit 117 as described above.
  • the flexible integrated circuit devices 140 may contact the second adhesion film 70 on the flexible substrate 145. Since the second adhesive film 70 may have a second adhesive force that is substantially larger than the third adhesive force of the third adhesive film 123b, the flexible integrated circuit elements 140 may include the rotating part 123 in the second region B. FIG. ) And transfer onto the flexible substrate 145.
  • the first speed of the first conveying part 116, the second speed of the rotating part 123, and / or the third speed of the second conveying part 117 are individually or totally controlled to be flexible from the handling substrate 600.
  • the flexible integrated circuit elements 140 may be transferred and attached to the substrate 145 while being easily aligned. Accordingly, the flexible integrated circuit device package including the flexible integrated circuit devices 140 arranged on the flexible substrate 145 may be manufactured.
  • the flexible integrated circuit elements 140 may be selectively transferred from the handling substrate 60 to the flexible substrate 145. Transfer and attachment can yield flexible integrated circuit device packages having various configurations.
  • FIG. 27 is a schematic cross-sectional view illustrating the thin film forming unit 500 and the baking unit 600 of the flexible integrated circuit device manufacturing apparatus 10 illustrated in FIG. 1.
  • the thin film forming part 500 may include a pair of rollers 505 and a protection tape supply part 507 that may be provided between the rollers 505 to supply the protection tape 90. can do.
  • the thin film forming unit 500 may include a formed substrate 91 including a flexible integrated circuit device 140 that is transferred and attached to the flexible substrate 145 by the transfer unit 100.
  • a substrate that may have a configuration substantially the same as the substrate shown in FIG. 2) may be passed between the pair of rollers 505, and protected from the protective tape supply 507 between the rollers 505. Since the tape 80 may be supplied, a thin film may be formed on the flexible substrate 145 to which the flexible integrated circuit device 140 is attached. That is, the flexible integrated by providing the protective tape 90 between the rollers 505 while transferring the substrate 91 including the flexible substrate 145 to which the flexible integrated circuit element 140 is attached between the rollers 505. The thin film may be formed on the circuit element 140.
  • the thin film that may cover the flexible integrated circuit device 140 may correspond to the protective tape 90 provided by the protective tape supply unit 507.
  • the flexible integrated circuit device 140 formed on the flexible substrate 145 and the substrate 83 including the thin film may have substantially the same structure as the substrate illustrated in FIG. 3. Substrates) can be obtained.
  • the thin film forming unit 500 may form the thin film that can sufficiently cover the flexible integrated circuit device 140 on the flexible substrate 145.
  • the substrate 93 since the flexible substrate 145, the flexible integrated circuit device 140, and the thin film may all have a film shape, the substrate 93 may be easily manufactured using the rollers 505.
  • the substrate 93 When the thin film covering the flexible integrated circuit device 140 is formed, the substrate 93 may be flexed or bent as a whole while effectively protecting the flexible integrated circuit device 140.
  • a baking unit 600 capable of baking a thin film of the substrate 93 may be disposed subsequent to the thin film forming unit 500.
  • the baking unit 600 may improve the adhesion of the protective tape 90 to the flexible integrated circuit device 140.
  • the temperature of the baking process performed in the baking unit 600 may be about 100 ° C to about 200 ° C.
  • the baking process for the substrate 93 including the thin film may include a pair of rollers including a heating member. By 605. Thereby, the thin film of the base material 93 can be baked simply and easily.
  • FIG. 28 is a schematic cross-sectional view illustrating the thin film removing unit 700 of the flexible integrated circuit device manufacturing apparatus 10 illustrated in FIG. 1.
  • the thin film remover 700 may include a laser drilling member 705.
  • the thin film remover 700 including the laser drilling member 705 may include the flexible substrate 145, the flexible integrated circuit device 140, and the substrate 93 including the thin film. Can be placed in the path.
  • the thin film removing process using the laser drilling member 705 may be performed by partially irradiating a laser onto the thin film of the substrate 93 to be transferred.
  • the irradiation of the laser from the laser drilling member 705 is performed on the entirety of the substrate 93 including the thin film, the flexible integrated circuit element 140 is protected between the substrate 93 and the laser drilling member 705.
  • a mask (not shown) may be located.
  • a mask for protecting the flexible integrated circuit device 140 may be omitted.
  • the thin film is partially removed from the substrate 93 by using the thin film removing unit 700 including the laser drilling member 705, so that the portions of the flexible substrate 145 and the flexible integrated circuit device (
  • a substrate 95 (a substrate that may have a configuration substantially the same as the substrate illustrated in FIG. 4) may be formed that includes a thin film pattern having openings that expose portions of 140.
  • rollers 601 and 701 for transferring the substrates 93 and 95 may be disposed before and after the thin film removing unit 700.
  • FIG. 29 is a schematic cross-sectional view illustrating the wiring forming unit 800 of the flexible integrated circuit device manufacturing apparatus 10 illustrated in FIG. 1.
  • the wiring forming part 800 may include a solution receiving part 804 containing a solution 809 including a conductive material.
  • the substrate 95 having the thin film pattern may be immersed in the solution 809 including the conductive material of the solution receiving unit 804. .
  • the exposed portion of the flexible substrate 145 and the exposed portion of the flexible integrated circuit device 140 may be exposed.
  • a base material 97 having conductive wiring capable of electrically connecting an exposed portion of the flexible substrate 145 and an exposed portion of the flexible integrated circuit element 140 by attaching a conductive material on the portion and the thin film pattern FIG.
  • a substrate which can have substantially the same configuration as the substrate exemplified in FIG. 5).
  • the conductive wiring formed by the wiring forming process using the wiring forming unit 800 may include a metal such as copper (Cu), a copper alloy, or the like.
  • the conductive wiring includes copper, it is possible to continuously maintain the flexibility that the substrate 97 having the conductive wiring may be bent or bent as a whole.
  • a flexible integrated circuit device package according to example embodiments may be manufactured. That is, the flexible integrated circuit device package may include a flexible substrate 145, flexible integrated circuit devices 140, the thin film pattern, and the conductive wiring. Such a flexible integrated circuit device package may maintain flexibility that can be flexed or bent freely as described above with the substrates 93, 95, and 97.
  • the wiring forming part 800 may include the rollers 803 and 805 and the solution receiving part (before and after the substrate 95 having the thin film pattern is immersed in the solution receiving part 804).
  • the substrate 95 having the thin film pattern impregnated in 804 may further include a pressing member 807 for pressing the upper portion of the solution receiving portion 804 from the upper direction.
  • the pressing member 807 can press the substrate 95 having the thin film pattern, so that the solution containing portion A predetermined tension may be applied to the substrate 95 having the thin film pattern immersed in 804.
  • the rollers 803 and 805 may also serve to support the substrates 95 and 97 together with the function of transporting the substrates 95 and 97.
  • the flexible integrated circuit device package manufacturing apparatus 10 may form the thin film pattern using the laser drilling member 705 and form the conductive wiring using the solution receiving portion 804. Can be.
  • the thin film pattern may be formed by performing an exposure process and a developing process, or the conductive wiring may be formed by performing a deposition process such as a sputtering process.
  • the flexible integrated circuit device package manufacturing apparatus may include a transfer unit, a thin film forming unit, a thin film removing unit, a wire forming unit, and the like, processes for manufacturing a flexible integrated circuit device package may be provided. May be performed substantially continuously.
  • the flexible integrated circuit device package manufacturing apparatus according to the exemplary embodiments may manufacture a flexible integrated circuit device that can be bent or bent freely more simply and easily. Such a flexible integrated circuit device package manufacturing apparatus can be more actively utilized in the manufacture of recent electronic devices that require semiconductor packages having more various configurations.
  • FIG. 40 is a cross-sectional view illustrating a transfer device for manufacturing a flexible integrated circuit device package according to another exemplary embodiment of the present invention.
  • the transfer device 1000 for manufacturing a flexible integrated circuit device package may include a first plate 1050, a second plate 1110, a detachable part 1115, a first adhesive force reducing part 1120, and a second The adhesion force reducing unit 1125 may be included.
  • a first adhesive tape 1130 having a first adhesive force may be disposed on the first plate 1050, and the flexible integrated circuit device 1140 may be disposed through the first adhesive tape 1130. It can be attached to.
  • a third adhesive tape 1135 having a third adhesive force may be disposed on the second plate 1110, and the flexible integrated circuit device 1140 may be transferred and attached by the third adhesive tape 1135.
  • the substrate 1145 may be disposed on the second plate 1110.
  • the detachable part 1115 may be disposed between the first plate 1050 and the second plate 1110.
  • the detachable part 1115 may be in contact with the flexible integrated circuit device 1140 disposed on the first plate 1050 in the first region of the transfer device, and may be positioned on the second plate 1110. 1145 may be in contact with the second area.
  • the detachable part 1115 may contact the flexible integrated circuit device 1140 in the first region to separate the flexible integrated circuit device 1140 from the first adhesive tape 1130.
  • the detachable part 1115 contacts the flexible substrate 1145 in the second area to transfer and attach the flexible integrated circuit device 1140 separated from the first adhesive tape 1130 onto the flexible substrate 1145.
  • the second adhesive tape 1150 of the detachable part 1115 may have a second adhesive force that is substantially larger than the first adhesive force and substantially smaller than the third adhesive force.
  • the first adhesive force reducing unit 1120 may reduce the adhesive force of the first adhesive tape 1130 before the flexible integrated circuit device 1140 contacts the detachable unit 1115 in the first region.
  • the second adhesive force reducing unit 1125 may weaken the adhesive force of the second adhesive tape 1150 before the flexible integrated circuit device 1140 contacts the flexible substrate 1145 in the second region.
  • the second adhesive force is substantially smaller than the first adhesive force. It may be large, and the third adhesive force may be substantially greater than the second adhesive force.
  • the flexible integrated circuit device 1140 may be transferred and attached from the first adhesive tape 1130 to the second adhesive tape 1150 using the second adhesive force that is substantially greater than the first adhesive force.
  • the flexible integrated circuit device 1140 may be transferred and attached from the second adhesive tape 1150 to the third adhesive tape 1135 using the third adhesive force that is substantially greater than the second adhesive force.
  • each of the first adhesive tape 1130 and the second adhesive tape 1150 may include a curable adhesive tape that may weaken the adhesive force when irradiated with ultraviolet rays or heated.
  • the curable adhesive tape may include an ultraviolet curable adhesive tape, a thermosetting adhesive tape, and the like.
  • the first adhesive force reducing portion 1120 may be used to cause the first adhesive tape 1130 to have the first adhesive force substantially reduced from the initial adhesive force, and the second adhesive force reducing portion may be used.
  • the second adhesive tape 1150 may have the second adhesive force substantially reduced than the initial adhesive force.
  • the first adhesive tape 1130 and the second adhesive tape 1150 may include substantially the same tape.
  • the adhesive tape for die bonding (DAF), etc. are mentioned.
  • FIG. 31 is a plan view illustrating a transfer substrate 1155 including a flexible integrated circuit device 1140 that is transferred and attached onto the flexible substrate 1145 by using the transfer apparatus 1000 illustrated in FIG. 30.
  • 32 is a cross-sectional view along the line III-IV of FIG. 31.
  • the flexible integrated circuit device 1140 which is transferred and attached onto the flexible substrate 1145 by using the transfer apparatus 1000, firstly has a first adhesive tape having the first adhesive force ( 1130).
  • the first adhesive tape 1130 may be bent in a state where the flexible integrated circuit device 1140 is attached to the first adhesive tape 1130.
  • a ring frame 1160 may be disposed to support the periphery of the first adhesive tape 1130. Accordingly, the transfer substrate 1155 including the flexible integrated circuit device 1140 attached to the first adhesive tape 1130 on which the periphery is supported by the ring frame 1160 may be placed on the first plate 1050.
  • the flexible integrated circuit device 1140 may include a semiconductor device such as a memory device, a non-memory device, or the like, and may include an active device, a passive device, and the like.
  • Integrated circuit devices for flexible integrated circuit devices 1140 are formed on a semiconductor substrate.
  • the integrated circuit elements formed on the semiconductor substrate may be pre-cut to be separated from each other.
  • non-device regions of the semiconductor substrate between the integrated circuit devices may be pre-cut to separate the integrated circuit devices individually.
  • a polishing process is performed to remove the semiconductor substrate from the entire surface or partially from the rear surface.
  • the polishing process may be performed until the integrated circuit devices have a thickness that may be used as the flexible integrated circuit devices 1140. Thicknesses that may be used for the flexible integrated circuit devices 1140 may range from several ⁇ m to several tens of ⁇ m, for example, from about 1 ⁇ m to about 50 ⁇ m.
  • the first adhesive tape 1130 which is peripherally supported by the ring frame 1160, is attached to the surfaces where the patterns of the flexible integrated circuit devices 1140 are not formed, and then the pattern of the flexible integrated circuit devices 1140 is attached. Remove the protective tape affixed on the formed surfaces.
  • a transfer substrate 1155 including flexible integrated circuit elements 1140 attached to the first adhesive tape 1130 having the first adhesive force is obtained.
  • the first adhesive force reducing unit 1120 may have a first adhesive tape 1130 less than the initial adhesive force before the flexible integrated circuit device 1140 contacts the detachable unit 1115 in the first region. It is possible to have a reduced said first adhesive force.
  • the first adhesive force reducing unit 1120 may be disposed in front of the first plate 1050. That is, the first adhesive force reducing unit 1120 may be located in a space in the transfer apparatus 1000 positioned in front of the first plate 1050 to which the transfer substrate 1155 is transferred.
  • the first adhesive force reducing unit 1120 may include an ultraviolet irradiation unit capable of irradiating ultraviolet rays onto the first adhesive tape 1130 when the first adhesive tape 1130 includes an ultraviolet curable adhesive tape.
  • the first adhesive force reducing unit 1120 may include a heating member capable of heating the first adhesive tape 1130.
  • the first adhesive force reducing unit 1120 may irradiate ultraviolet rays onto the back surface of the first adhesive tape 1130 or may heat from the back surface of the first adhesive tape 1130.
  • the first adhesive force reducing unit 1120 may emit ultraviolet light onto the rear surface of the first adhesive tape 1130 that substantially faces the front surface of the first adhesive tape 1130 to which the flexible integrated circuit device 1140 is attached. It may be irradiated or heated from the backside of the first adhesive tape 1130.
  • 33 and 34 are cross-sectional views illustrating the first plate 1050 of the transfer apparatus 1000 illustrated in FIG. 30.
  • a transfer substrate 1155 may be placed on the first plate 1050, and the first plate 1050 may include a frame support 1080, a chuck table 1070, and the like. Can be.
  • the frame support 1080 may support the ring frame 1160 of the transfer substrate 1155 in a manner of gripping.
  • frame support 1080 may include a clamp.
  • the frame support 1080 may support the ring frame 1160 as a whole, but may separately support respective portions of the ring frame 1160.
  • the ring frame 1160 may be supported by the frame support 1080 to be fixed to the upper portion of the first plate 1050.
  • the chuck table 1070 may contact the rear surface of the first adhesive tape 1130 of the transfer substrate 1150 to raise or lower the transfer substrate 1155.
  • the lifting and lowering of the chuck table 1070 may be performed by a driving member (not shown) connected to the chuck table 1070.
  • a predetermined tension may be applied to the first adhesive tape 1130.
  • the raising and lowering of the chuck table 1070 may be performed in a range of about 0.5 mm to about 5 mm.
  • the flexible integrated circuit device 1140 attached to the first adhesive tape 1130 may be more easily transferred and attached to the second adhesive tape 1150. have.
  • the first transfer unit 1113 may transfer the first plate 1050 on which the transfer substrate 1155 is placed. A detailed description of the first transfer unit 1113 will be described later.
  • the detachable part 1115 may be disposed between the first plate 1050 and the second plate 1110.
  • the detachable part 1115 may be in contact with the flexible integrated circuit device 1140 disposed on the first plate 1050 in the first region, and may be connected to the flexible substrate 1145 positioned on the second plate 1110. May be in contact with the second region.
  • the detachable part 1115 may include a second adhesive tape 1150, and the second adhesive tape 1150 may contact the flexible integrated circuit device 1140 in the first area and may be disposed from the first adhesive tape 1130.
  • the flexible integrated circuit device 1140 may be separated, and in the second region, the flexible integrated circuit device 1140 may be contacted with the flexible substrate 1145 to transfer and attach the flexible integrated circuit device 1140 onto the flexible substrate 1145.
  • the second adhesive force may be substantially larger than the adhesive force and substantially smaller than the third adhesive force.
  • the detachable part 1115 may include a roller 1165, and the second adhesive tape 1150 may contact the flexible integrated circuit device 1140 in the first area by the roller 1165. In two regions, the flexible substrate 1145 may be in contact with the flexible substrate 1145.
  • the roller 1165 may be rotatably disposed between the first plate 1050 and the second plate 1110. As the roller 1165 rotates, a second adhesive tape 1150 having the second adhesive force may be supplied between the first plate 1050 and the second plate 1110 along the circumference of the roller 1165. For example, since the second adhesive tape 1150 may be supplied along the circumference of the roller 1165, the first adhesive tape placed on the first plate 1050 in the first area by rotating the roller 1165.
  • the flexible integrated circuit device 1140 may be detached from the 1130 and then transferred and attached onto the second adhesive tape 1150, and the flexible integrated circuit device may be attached to the second adhesive tape 1150 in the second area. 1140 may be transferred and attached onto flexible substrate 1145.
  • the detachable part 1115 may include a disposable second adhesive tape 1150.
  • the detachable part 1115 may include a tape supply part 1170 capable of supplying the second adhesive tape 1150 to the roller 1165 and a second adhesive tape supplied to the roller 1165 by the tape supply part 1170 ( A tape recovery unit 1175 capable of recovering the 1150 may be provided.
  • the tape supply unit 1170 may be disposed at a position capable of providing the second adhesive tape 1150 before the second adhesive tape 1150 passes the first area, and the tape recovery unit 1175 may include the second After the adhesive tape 1150 passes through the second region, the adhesive tape 1150 may be disposed at a position where the second adhesive tape 1150 may be recovered.
  • the supply speed of the second adhesive tape 1150 by the tape supply unit 1170 and the recovery speed of the second adhesive tape 1150 by the tape recovery unit 1175 may be controlled to be substantially the same.
  • the supply speed and the recovery speed of the second adhesive tape 1150 may be controlled based on the speed at which the roller 1165 rotates.
  • the transfer members 1180 and 1185 may be disposed between the tape supply unit 1170 and the tape recovery unit 1175 for smooth supply and recovery of the second adhesive tape 1150.
  • a second The adhesive tape 1150 may be used for single use. Accordingly, since the new second adhesive tape 1150 can be continuously supplied during the transfer process using the transfer apparatus 1000, the second adhesive force of the second adhesive tape 1150 can be kept constant, and the second adhesive tape Process defects due to adhesion of foreign matters due to the continuous use of 1150 can be prevented. In addition, since the replacement of the second adhesive tape 1150 is unnecessary, the operation of the transfer device 1000 may be prevented due to the replacement of the second adhesive tape 1150, thereby improving productivity of the flexible integrated circuit device package manufacturing process. have.
  • the second adhesive tape 1150 is illustrated as having a substantially uniform thickness, recesses, grooves, or protrusions are formed in the second adhesive tape 1150 to form the second adhesive tape 1150.
  • the portions of may have different thicknesses.
  • FIG. 35 is a cross-sectional view illustrating a second adhesive tape 1151 of a transfer apparatus according to other exemplary embodiments of the present invention
  • FIG. 36 is flexible using the second adhesive tape 1151 illustrated in FIG. 35.
  • the second adhesive tape 1151 may include a concave-convex structure formed on a surface thereof.
  • the flexible integrated circuit device 1140 may be transferred and attached from the first adhesive tape 1130 in the recess or groove.
  • the second adhesive tape 1151 has a concave-convex structure
  • the flexible integrated circuit elements 1140 attached to the first adhesive tape 1130 may be selectively transferred and attached to the second adhesive tape 1151.
  • a flexible integrated circuit device package having various desired pattern structures may be manufactured.
  • the second adhesive force reducing unit 1125 may have a thickness lower than that of the first adhesive force of the second adhesive tape 1150 before the flexible integrated circuit device 1140 contacts the flexible substrate 1145 in the second region. It is possible to have a reduced said second adhesive force.
  • the second adhesive force reducing unit 1125 may be located in a space between the first region and the second region so as not to interfere with supply and recovery of the second adhesive tape 1150.
  • the second adhesive force reducing unit 1125 may include an ultraviolet irradiation member capable of irradiating ultraviolet rays onto the second adhesive tape 1150.
  • the second adhesive force reducing unit 1125 may include a heating member capable of heating the second adhesive tape 1150.
  • the second adhesive force reducing unit 1125 may irradiate ultraviolet rays on the rear surface of the second adhesive tape 1150 or may heat from the rear surface of the second adhesive tape 1150. That is, the second adhesive force reducing unit 1125 may irradiate ultraviolet rays on the rear surface of the second adhesive tape 1150 opposite to the front surface of the second adhesive tape 1150 to which the flexible integrated circuit device 1140 is transferred and attached. Or from the backside of the second adhesive tape 1150.
  • the flexible substrate 1145 may be placed on the second plate 1110, and the second plate 110 may support the back surface of the flexible substrate 1145 to prevent the flexible substrate 1145 from being easily bent.
  • the second plate 1110 may include a chuck table.
  • the third adhesive tape 1135 may be attached to the front surface of the flexible substrate 1145, the front surface of the flexible substrate 1145 may be exposed as described below.
  • the flexible integrated circuit device 1140 is in contact with the flexible substrate 1145 in the second area by the detachable part 1115. It may be attached on the third adhesive tape 1135 of the substrate 1145.
  • 37 to 39 are cross-sectional views illustrating a process of transferring and attaching the flexible integrated circuit device 1140 onto the flexible substrate 1145.
  • the third adhesive tape 1135 may be previously attached to the rear surface of the flexible integrated circuit device 1140. That is, the third adhesive tape 1130 may be interposed between the first adhesive tape 1130 and the flexible integrated circuit device 1140.
  • the third adhesive tape 1135 is continuously formed on the rear surface of the flexible integrated circuit device 1140. Can be attached.
  • the third adhesive force of the third adhesive tape 1135 is substantially greater than the first adhesive force of the first adhesive tape 1130, the third adhesive tape 1135 is attached to the rear surface of the flexible integrated circuit device 1140. In this state, the flexible integrated circuit device 1140 may be attached onto the second adhesive tape 1150.
  • the third adhesive tape 1135 is contacted with the flexible substrate 1145, and the flexible substrate is formed by the third adhesive tape 1135 having a third adhesive force substantially greater than the second adhesive force of the second adhesive tape 1150.
  • the flexible integrated circuit device 1140 may be easily transferred and attached onto the 1145.
  • the transfer device 1000 may include a rotatable roller 1165, and thus, it is necessary to transfer the flexible integrated circuit device 1140 and the flexible substrate 1145.
  • the transfer apparatus 1000 may transfer the first plate 1113 and the second plate 1110 to transfer the first plate 1050.
  • It may include a second transfer unit 1123 capable of transferring.
  • the first transfer part 1113 may transfer the first plate 1050 in the first direction
  • the second transfer unit 1123 may transfer the second plate 1110 in the second direction.
  • the first transfer part 1113 may continuously transfer the first plate 1050 on which the transfer substrate 1155 is placed.
  • Conveyor belts, winders and the like can be provided.
  • the flexible substrate 1145 may also be continuously supplied to match the continuous supply of the transfer substrate 1155, the second transfer part 1123 also continuously transfers the second plate 1110 on which the flexible substrate 1145 is placed. Conveyor belts, winders and the like can be included.
  • the flexible substrate 1145 may be adjusted by adjusting a first speed of the first transfer unit 1113, a second speed of the detachable unit 1115, and / or a third speed of the second transfer unit 1123.
  • the flexible integrated circuit elements 1140 that are transferred and attached onto them can be easily aligned.
  • the first speed, the second speed, and / or the third speed may be adjusted substantially the same to easily align the flexible integrated circuit devices 1140 transferred and attached onto the flexible substrate 1145.
  • the spacing between the patterns of the flexible integrated circuit device 1140 on the flexible substrate 1145 is about twice the interval between the patterns of the flexible integrated circuit device 1140 on the transfer substrate 1155
  • the second speed of the detachable part 1115 may correspond to the rotation speed of the roller 1165.
  • the transfer apparatus 1000 may move the first transfer unit 1113 and the second transfer unit 1123. It may not be provided.
  • the flexible integrated circuit device 1145 is attached to the flexible integrated circuit device 1140 attached to the first adhesive tape 1130 having the first adhesive force by using the third adhesive tape 1135 having the third adhesive force. It can be easily transferred and attached to the phase.
  • the second adhesive tape 1150 having a second adhesive force substantially larger than the first adhesive force and substantially smaller than the third adhesive force as a medium.
  • the second adhesive tape 1150 of the transfer apparatus 1000 may include a tape supply part 1170 capable of supplying the second adhesive tape 1150 and a tape recovery part 1175 capable of recovering the second adhesive tape 1150. When provided, the second adhesive tape 1150 may be used for a single use.
  • the second adhesive force of the second adhesive tape 1150 can be kept constant, 2 Minimized exposure due to the continuous use of the adhesive tape 1150 can prevent a process failure due to the adhesion of foreign substances.
  • productivity of the transfer apparatus 1000 may be prevented by stopping operation of the transfer apparatus 1000.
  • the transfer substrate 1155 is prepared by attaching the flexible integrated circuit device 1140 to the first adhesive tape 1130, and then the first adhesive force of the first adhesive tape 1130 using the first adhesive force reducing unit 1120. Is reduced to the first adhesive force.
  • the transfer substrate 1155 to which the flexible integrated circuit device 1140 is attached is transferred onto the first plate 1050 on the first adhesive tape 1130 having the reduced first adhesive force.
  • the chuck table 1070 is moved up and down to apply a predetermined tension to the first adhesive tape 1130.
  • the first plate 1050 on which the transfer substrate 1155 is placed is transferred in the first direction. In this case, the first plate 1050 may move by itself, and may transfer the first plate 1050 using the first transfer unit 1113.
  • the second adhesive tape 1150 is supplied and recovered along the circumference of the roller 1165 of the detachable part 1115 rotating from the first direction to the second direction.
  • the detachable part 1115 includes the tape supply part 1170 and the tape recovery part 1175, the second adhesive tape 1150 may be used for a single use.
  • the detachable portion 1115 and the transfer substrate in the first region are rotated.
  • the flexible integrated circuit device 1140 attached to 1155 is in contact.
  • the second adhesive force of the second adhesive tape 1150 is substantially larger than the first adhesive force of the first adhesive tape 1130 to which the flexible integrated circuit device 1140 is attached, the flexible integrated circuit device 1140 may be formed.
  • the first adhesive tape 1130 is transferred and attached to the second adhesive tape 1150.
  • the flexible integrated circuit device 1140 attached on the second adhesive tape 1150 of the detachable part 1115 rotates from the first direction to the second direction according to the rotation of the roller 1165.
  • the initial adhesive force of the second adhesive tape 1150 is weakened by using the second adhesive force reducing unit 1120, so that the second adhesive tape 1150 has the second adhesive force.
  • the flexible integrated circuit device 1140 attached to the second adhesive tape 1150 contacts the flexible substrate 1145 which is transferred in the second direction in the second area.
  • the second plate 1110 may move by itself, and the second plate 1110 may be transferred using the second transfer unit 1123.
  • the flexible substrate 1145 As the flexible substrate 1145 is transferred in the second direction, and the detachable part 1115 is rotated from the first direction toward the second direction, the flexible substrate 1145 and the second adhesive layer are adhered to the second region.
  • the flexible integrated circuit device 1140 attached to the tape 1150 contacts.
  • the third adhesive force of the third adhesive tape 1135 for transferring and attaching the flexible integrated circuit device 1140 is substantially greater than the second adhesive force of the second adhesive tape 1150 to which the flexible integrated circuit device 1140 is attached.
  • the flexible integrated circuit device 1140 is transferred and attached onto the flexible substrate 1145 from the second adhesive tape 1150.
  • the reliability and reliability of the flexible integrated circuit device package may be more reliably performed because transfer and attachment of the flexible integrated circuit device may be more stably performed, and process defects caused by adhesion of foreign matters may be prevented during such transfer and attachment. Can improve.
  • the productivity of the flexible integrated circuit device package can be improved by preventing the transfer of the transfer device due to the replacement of the adhesive tape.
  • FIG. 40 is a cross-sectional view illustrating a transfer device for manufacturing a flexible integrated circuit device package according to still another exemplary embodiment of the present invention.
  • the transfer apparatus 2000 for manufacturing a flexible integrated circuit device package may include a first transfer unit 2160, a rotation unit 2230, a second transfer unit 2170, and the like.
  • the first transfer unit 2160 may transfer the handling substrate 2060 to which the flexible integrated circuit device 2140 is attached in the first direction.
  • the first transfer unit 10 may include a conveyor belt or the like.
  • the flexible integrated circuit device 2140 may include a semiconductor device such as a memory device or a non-memory device.
  • the flexible integrated circuit device 2140 may include an active device, a passive device, and the like.
  • the flexible integrated circuit device 2140 may include a circuit pattern formed on a silicon substrate having a thin thickness.
  • the thin silicon substrate that may be used as the flexible integrated circuit device 2140 may have a thickness of about several ⁇ m to several tens of ⁇ m, for example, about 1.0 ⁇ m to about 50 ⁇ m.
  • the silicon substrate may have a thickness of about 5.0 ⁇ m to about 30.0 ⁇ m.
  • the manufacturing of the flexible integrated circuit device 2140 may not be easy, and the thickness of the flexible integrated circuit device 2140 may be greater than about 50 ⁇ m. In this case, the flexible integrated circuit device 2140 may be difficult to bend or bend.
  • FIG. 41 is a perspective view illustrating a handling substrate 2060 to which the flexible integrated circuit device 2140 illustrated in FIG. 40 is attached.
  • a plurality of flexible integrated circuit devices 2140 may be spaced apart from each other and attached to the handling substrate 2060.
  • the non-device region between the flexible integrated circuit devices 2140 may be pre-cut to separate the flexible integrated circuit devices 2140 separately.
  • the flexible integrated circuit devices 2140 may be attached onto the handling substrate 2060 using the attachment film 2065, and the attachment film 2065 may have a first attachment force.
  • the attachment film 2065 may include a double-sided tape.
  • the attachment film 2065 is referred to below as the first attachment film.
  • the handling substrate 2060 may generally include a dummy substrate.
  • the rotating part 2130 may include a body 2130a disposed to contact the flexible integrated circuit device 2140 on the handling substrate 2060 in the first region C. Referring to FIG. The rotating part 2130 may rotate from the first direction toward the second direction. Since the first transfer unit 2160 may transfer the handling substrate 2060 in the first direction, and the second transfer unit 2170 may transfer the flexible substrate 2145 in the second direction, the rotating unit 2130 may be used. In the case of rotating while moving), it may be difficult to transfer the flexible integrated circuit device 2140 from the handling substrate 2060 onto the flexible substrate 2145 as described below.
  • the rotating part 2130 may rotate at a magnetic position, and when the rotating part 2130 rotates in place, the flexible part on the handling substrate 2060 transferred in the first direction by the first transfer part 2160.
  • the circuit element 2140 may be transferred and attached to the flexible substrate 2145 which is transferred in the second direction by the second transfer unit 2170.
  • the body 2130a of the rotating part 2130 may be disposed to contact the flexible substrate 2145 transferred in the second direction in the second area D.
  • the rotating part 2130 may contact the flexible integrated circuit device 2140 on the handling substrate 2060 to separate the flexible integrated circuit device 2140 from the handling substrate 2060 to the body 2130a. Can be transferred and attached.
  • the rotating part 2130 may further include an attachment film 2130b substantially surrounding the body 2130a, and the attachment film 2130b may separate the flexible integrated circuit device 2140 from the handling substrate 2060. Can be.
  • the adhesion film 2130b is referred to below as a third adhesion film having a third adhesion.
  • the third attachment film 2130b may include a double-sided tape.
  • the third attachment film may comprise polymethylsiloxane (PDMS).
  • the third attachment film 2130b may be formed.
  • the third adhesive force may be substantially greater than the first adhesive force of the first adhesive film 2065.
  • the third adhesive force of the third adhesive film 2130b is smaller than the first adhesive force of the first adhesive film 2065, it may be difficult to separate the flexible integrated circuit device 2140 from the handling substrate 2060.
  • the rotating part 2130 substantially surrounds the body 2130a and the body 2130a from the first direction to the second direction, and has the third attachment film 2130b having the third adhesive force.
  • the flexible integrated circuit device 2140 may be detached from the handling substrate 2060 and attached to the rotating unit 2130 in contact with the flexible integrated circuit device 2140 of the handling substrate 2060 in the first region C. You can.
  • the body 2130a of the rotating part 2130 may be adhered to foreign matter on its surface by continuous use, and thus periodic or aperiodic may be adsorbed on the flexible integrated circuit device 2140 to be transferred and attached. It needs to be replaced.
  • the transfer device 2000 may have a configuration in which the body 2130a itself of the rotating unit 2130 is replaced, and the third attachment film 2130b may also be replaced periodically or aperiodically.
  • FIG. 42 is a cross-sectional view illustrating a rotating unit of a transfer device for manufacturing a flexible integrated circuit device package according to another exemplary embodiment of the present invention
  • FIG. 43 is a transfer portion of the flexible integrated circuit device using the rotating unit illustrated in FIG. 42.
  • a cross-sectional view for explaining a process of attaching is a cross-sectional view for explaining a process of attaching.
  • the surface of the body 2131a or the third attachment film 2131b surrounding the body 2131a of the rotating part may have an uneven structure.
  • the flexible integrated circuit device i.e., from the handling substrate 2060 in the groove or recess of the body 2131a or the third attachment film 2131b
  • the flexible integrated circuit device 2140 may be selectively selected from the handling substrate 2060 by the body 2131a or the third attachment film ( 2131b) can be transferred and attached. Accordingly, the shape of the uneven structure of the body 2131a or the third attachment film 2131b may be variously changed to manufacture a flexible integrated circuit device package having various desired pattern structures.
  • the second transfer unit 2170 may transfer the flexible substrate 2145 in the second direction substantially opposite to the first direction.
  • the second transfer unit 2170 may include a winder to continuously supply the flexible substrate 2145.
  • the flexible substrate 2145 conveyed by the second transfer unit 2170 does not contact the flexible integrated circuit device 2140 on the rotating unit 2130 in the second region D, the flexible integrated circuit device is rotated from the rotating unit 2130. It is difficult to separate and attach the 2140 to the flexible substrate 2145.
  • the second transfer unit 2170 may have a second region in which the flexible substrate 2145 is transferred in the second direction by the second transfer unit 2170.
  • the flexible integrated circuit device 2140 of the rotating unit 2130 may be in contact with the flexible integrated circuit device 2140.
  • the flexible substrate may be contacted with the flexible integrated circuit device 2140 of the rotating unit 2130 to detach the flexible integrated circuit device 2140 from the rotating unit 2130 and attach the flexible integrated circuit device 2140 to the flexible substrate 2145.
  • An attachment film 2070 having a second attachment force may be disposed on the 2145.
  • This attachment film 2070 is referred to below as a second attachment film.
  • the second adhesion film 2070 may include a double-sided tape.
  • the second attachment force of the second attachment film 2070 is greater than the third attachment force of the third attachment film 2130b so that the flexible integrated circuit device 2140 may be detached from the rotating part 2130 and attached to the flexible substrate 2145. Can be substantially large.
  • the second adhesive force of the second adhesive film 2070 is less than the third adhesive force of the third adhesive film 2130b, it may be difficult to separate the flexible integrated circuit device 2140 from the rotating part 2130.
  • the flexible substrate 2145 may include a flexible printed circuit board (FPCB).
  • FPCB flexible printed circuit board
  • the first region C and the second region D are shown to face each other substantially, the first region C and the second region D may be transferred to each other within a range where interference does not occur. 2000 may not be limited to specific areas in the system.
  • the transfer apparatus 2000 may include a first transfer unit 2160, a rotation unit 2130, a second transfer unit 2170, and the like to transfer the flexible integrated circuit device 2140 on the handling substrate 2060 to the flexible substrate ( 2145) can be easily attached and transferred onto.
  • the first conveying unit 2160, the rotating unit 2130, and the second conveying unit 2170 may move or rotate at the first speed, the second speed, and the third speed, respectively, and thus, the first conveying unit.
  • Integrated circuit elements 2140 may be easily aligned.
  • the first speed When the spacing between the patterns of the flexible integrated circuit elements 2140 on the handling substrate 2060 and the spacing between the patterns of the flexible integrated circuit elements 2140 on the flexible substrate 2145 are equal, the first speed, the By adjusting the second speed and / or the third speed to be substantially the same, the flexible integrated circuit elements 2140 attached from the handling substrate 2060 to the flexible substrate 2145 can be easily aligned.
  • the first speed when the spacing between the patterns of the flexible integrated circuit elements 2140 on the flexible substrate 2145 is about twice the spacing between the patterns of the flexible integrated circuit elements 2140 on the handling substrate 2060.
  • the second speed are substantially the same, and the third speed is adjusted about two times faster to facilitate alignment of the flexible integrated circuit devices 2140 attached to the flexible substrate 2145. Accordingly, a flexible integrated circuit device package having a flexible substrate 2145 to which the aligned flexible integrated circuit devices 2140 are attached may be manufactured.
  • the handling substrate 2060 to which the flexible integrated circuit devices 2140 are attached is transferred in the first direction by using the first transfer unit 2160.
  • the flexible integrated circuit devices 2140 may be attached onto the handling substrate 2060 via the first attachment film 2065 having the first attachment force.
  • a method of manufacturing the handling substrate 2060 to which the flexible integrated circuit devices 2140 are attached is as follows.
  • FIG. 44 to 46 are cross-sectional views for describing a process of manufacturing the handling substrate 2060 to which the flexible integrated circuit device 2140 illustrated in FIG. 40 is attached.
  • FIG. 47 is a perspective view illustrating the semiconductor substrate 2080 and the handling substrate 2060 illustrated in FIG. 44
  • FIG. 48 is a perspective view illustrating the semiconductor substrate 2080 and the handling substrate 2060 illustrated in FIG. 45.
  • 49 and 50 are perspective views illustrating a handling substrate 2060 to which the flexible integrated circuit devices 2140 illustrated in FIG. 46 are attached.
  • integrated circuit devices 2140a for flexible integrated circuit devices 2140 are formed on a semiconductor substrate 2080.
  • the integrated circuit elements 2140a formed on the semiconductor substrate 2080 are pre-cut so as to be spaced apart from each other.
  • the integrated circuit devices 2140a may be separately separated by pre-cutting a non-device region of the semiconductor substrate 2080 of the integrated circuit device 2140a and the adjacent integrated circuit device 2140a.
  • the integrated circuit elements 2140a and the handling substrate 2060 on the semiconductor substrate 2080 are positioned to substantially face each other. Since the first attachment film 2065 having the first attachment force is disposed on the handling substrate 2060, the integrated circuit elements 2140a on the semiconductor substrate 2080 are in contact with the first attachment film 2065.
  • a planarization process such as a chemical mechanical polishing (CMP) process, is performed to remove the semiconductor substrate 2080 from the rear surface of the semiconductor substrate 2080. That is, the semiconductor substrate 2080 is removed from the rear surface of the semiconductor substrate 2080 opposite to the front surface of the semiconductor substrate 2080 where the integrated circuit elements 2140a are located. In this case, the semiconductor substrate 2080 is removed using the polishing member 2085 until the integrated circuit elements 2140a formed on the front surface of the semiconductor substrate 2080 are exposed.
  • CMP chemical mechanical polishing
  • the semiconductor substrate 2080 is removed by performing a planarization process until the integrated circuit devices 2140a are exposed, the first adhesive film 2065 of the handling substrate 2060 is removed.
  • the integrated circuit elements 2140a are spaced apart from each other.
  • Stripping processes such as heat treatment, ultraviolet treatment, and the like are performed on the integrated circuit devices 2140a on the handling substrate 2060 to form the flexible integrated circuit devices 2140 on the handling substrate 2060.
  • the handling substrate 2060 to which the flexible integrated circuit devices 2140 are attached is transferred in the first direction by using the first transfer unit 2160.
  • the flexible integrated circuit elements 2140 on the rotating unit 2130 and the handling substrate 2060 may be formed in the first region C.
  • FIG. Contact a third attachment film 2130b having a third attachment force that is substantially larger than the first attachment force of the first attachment film 2065 is formed on the body 2130a of the rotating part 2130 to which the flexible integrated circuit elements 2140 are in contact.
  • Disposed and the flexible integrated circuit elements 2140 on the handling substrate 2060 substantially wrap the body 2130a as the rotating portion 2130 rotates in place from the first direction to the second direction. It is attached to the film 2130b.
  • the flexible integrated circuit elements 2140 attached to the rotating part 2130 rotate in the second direction from the first direction along the rotating part 2130, and the second transfer part 2170 in the second area D.
  • FIG. Contact with the flexible substrate 2145 transported in the second direction.
  • the flexible integrated circuit devices 2140 on the rotating part 2130 that contact the flexible substrate 2145 in the second region D may be in contact with the second attachment film 26 of the flexible substrate 24. Since the second adhesive film 2070 has a second adhesive force substantially greater than the third adhesive force of the third adhesive film 2130b, the flexible integrated circuit elements 2140 on the rotating part 2130 may be formed of the flexible substrate 2145. 2 is attached to the attachment film 2070. That is, the flexible integrated circuit device 2140 is transferred to and attached from the handling substrate 2060 onto the flexible substrate 2145, so that the flexible integrated circuit device 2145 includes a flexible substrate 2145 to which the flexible integrated circuit devices 2140 are attached.
  • the package can be manufactured.
  • the flexible substrate 2145 from the handling substrate 2060 by adjusting the first speed of the first transfer unit 2160, the second speed of the rotation unit 2130, and / or the third speed of the second transfer unit 2170.
  • the flexible integrated circuit elements 2140 that are transferred and attached onto the substrate may be easily aligned. 42 and 43, the flexible integrated circuit elements 2140 may be selectively transferred from the handling substrate 2060 onto the flexible substrate 2145.
  • a flexible integrated circuit device package having various structures may be manufactured using a transfer device for manufacturing a flexible integrated circuit device package, and as a result, electronic products having various configurations may be manufactured.

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

L'invention porte sur un appareil pour fabriquer un boîtier de dispositif de circuit intégré flexible, qui peut comprendre : une unité de transfert qui transfère et fixe un dispositif de circuit intégré flexible sur un substrat flexible ; une unité de formation de film mince qui forme un film mince qui couvre le dispositif de circuit intégré flexible sur le substrat flexible ; une unité de retrait de film mince qui retire le film mince qui est formé sur le substrat flexible de telle sorte que le substrat flexible et une partie du dispositif de circuit intégré flexible sont présentés ; et une unité de formation de câblage qui forme un câblage conducteur qui connecte électriquement la partie présentée du substrat flexible à la partie présentée du dispositif de circuit intégré flexible.
PCT/KR2013/003169 2012-09-28 2013-04-16 Appareil pour fabriquer un boîtier de dispositif de circuit intégré flexible Ceased WO2014051230A1 (fr)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
KR10-2012-0108931 2012-09-28
KR1020120108924A KR20140042317A (ko) 2012-09-28 2012-09-28 유연 집적회로 소자 패키지 제조용 전사 장치
KR10-2012-0108924 2012-09-28
KR1020120108931A KR20140042320A (ko) 2012-09-28 2012-09-28 유연 집적회로 소자 패키지 제조용 전사 장치
KR1020120118847A KR101425177B1 (ko) 2012-10-25 2012-10-25 유연 집적회로 소자 패키지 제조 장치
KR10-2012-0118847 2012-10-25

Publications (1)

Publication Number Publication Date
WO2014051230A1 true WO2014051230A1 (fr) 2014-04-03

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ID=50388579

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Application Number Title Priority Date Filing Date
PCT/KR2013/003169 Ceased WO2014051230A1 (fr) 2012-09-28 2013-04-16 Appareil pour fabriquer un boîtier de dispositif de circuit intégré flexible

Country Status (1)

Country Link
WO (1) WO2014051230A1 (fr)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004200363A (ja) * 2002-12-18 2004-07-15 Nippon Telegr & Teleph Corp <Ntt> 薄膜形成装置及び薄膜形成方法
JP2004221454A (ja) * 2003-01-17 2004-08-05 Dainippon Screen Mfg Co Ltd 薄膜形成装置および方法
US20040197487A1 (en) * 2002-07-15 2004-10-07 Hideo Aoki Method of manufacturing an electronic circuit and manufacturing apparatus of an electronic circuit
KR20060043012A (ko) * 2004-03-10 2006-05-15 세이코 엡슨 가부시키가이샤 박막 디바이스 공급체, 박막 디바이스 공급체의 제조 방법,전사 방법, 반도체 장치의 제조 방법 및 전자 기기
JP2009130157A (ja) * 2007-11-26 2009-06-11 Panasonic Corp ダイアタッチフィルム付きの半導体装置の製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040197487A1 (en) * 2002-07-15 2004-10-07 Hideo Aoki Method of manufacturing an electronic circuit and manufacturing apparatus of an electronic circuit
JP2004200363A (ja) * 2002-12-18 2004-07-15 Nippon Telegr & Teleph Corp <Ntt> 薄膜形成装置及び薄膜形成方法
JP2004221454A (ja) * 2003-01-17 2004-08-05 Dainippon Screen Mfg Co Ltd 薄膜形成装置および方法
KR20060043012A (ko) * 2004-03-10 2006-05-15 세이코 엡슨 가부시키가이샤 박막 디바이스 공급체, 박막 디바이스 공급체의 제조 방법,전사 방법, 반도체 장치의 제조 방법 및 전자 기기
JP2009130157A (ja) * 2007-11-26 2009-06-11 Panasonic Corp ダイアタッチフィルム付きの半導体装置の製造方法

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