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WO2014042242A1 - Module de substrat de circuit - Google Patents

Module de substrat de circuit Download PDF

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Publication number
WO2014042242A1
WO2014042242A1 PCT/JP2013/074837 JP2013074837W WO2014042242A1 WO 2014042242 A1 WO2014042242 A1 WO 2014042242A1 JP 2013074837 W JP2013074837 W JP 2013074837W WO 2014042242 A1 WO2014042242 A1 WO 2014042242A1
Authority
WO
WIPO (PCT)
Prior art keywords
insulating substrate
circuit board
board module
substrate
frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2013/074837
Other languages
English (en)
Japanese (ja)
Inventor
林　泰伸
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Priority to JP2014535603A priority Critical patent/JP5765488B2/ja
Publication of WO2014042242A1 publication Critical patent/WO2014042242A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
    • H05K1/113—Via provided in pad; Pad over filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/042—Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2018—Presence of a frame in a printed circuit or printed circuit assembly
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1178—Means for venting or for letting gases escape

Definitions

  • the present invention relates to a circuit board module in which a plurality of chip components are mounted on an insulating substrate.
  • the hybrid IC includes an insulating substrate in which a plurality of chip components are mounted on wiring patterns provided on the front and back surfaces of the insulating substrate, and a frame-like substrate in which terminal electrodes (lead electrodes) are provided on the lower surface.
  • the frame-like substrate is attached to a portion where no component is mounted so as to surround the chip component mounted on the back surface of the insulating substrate. Further, the wiring patterns provided on the front and back surfaces of the insulating substrate and the terminal electrodes formed on the lower surface of the frame-like substrate are electrically connected by through holes.
  • the present invention has been made in view of the above-described problems, and the object of the present invention is that when mounted on a motherboard, the bonding strength between the circuit board module and the motherboard is high and can be stably mounted.
  • the object is to provide a circuit board module.
  • the present invention has the following configuration.
  • a first insulating substrate having a mounting portion, at least one electronic component electrically connected to the wiring pattern and mounted on the mounting portion, and the first insulating substrate
  • a frame-shaped substrate formed higher than the mounting height of the chip component, a cavity composed of the first insulating substrate and the frame-shaped substrate, and the first through the cavity
  • a second insulating substrate on which the terminal electrode is formed, and the electronic component and the terminal electrode provided on the second insulating substrate are formed in the frame shape. It is electrically connected through a substrate.
  • a vent hole penetrating at least one of the first insulating substrate, the second insulating substrate, and the frame-shaped substrate may be provided.
  • a vent opening communicating with the inside of the cavity and the outside air there is no deformation or breakage of the circuit board module due to the generation of gas, and therefore the circuit board module can be stably bonded.
  • a wiring pattern extending along both main surfaces of the second insulating substrate may be formed inside the second insulating substrate.
  • the terminal electrode since the terminal electrode can be formed at an arbitrary position on the bottom surface of the second insulating substrate, it corresponds to various arrangements of mounting electrodes on the motherboard on which the circuit board module is mounted. Can do.
  • the number of terminal electrodes formed on the second insulating substrate can be increased, it is possible to increase the functionality of the circuit board module by increasing the number of electronic components mounted on the circuit board module. it can. Furthermore, if the number of terminal electrodes formed on the second insulating substrate can be increased, the bonding strength between the circuit board module and the mother board can be further increased.
  • a plurality of via conductors may be formed inside the frame-shaped substrate so as to be aligned in a direction parallel to the main surface of the second insulating substrate. In this case, since more complicated wiring is possible inside the circuit board module, the function of the circuit board module can be enhanced.
  • a resin may be filled in a cavity surrounded by the first insulating substrate, the second insulating substrate, and the frame substrate.
  • the strength of the circuit board module itself can be improved, and the insulation of the electronic components mounted in the cavity can be improved.
  • the terminal electrode can be formed large, the bonding strength with the mother board can be increased.
  • FIG. 1A is a cross-sectional view of the circuit board module 100 according to the first embodiment
  • FIG. 1B is a bottom view
  • 2A to 2C are cross-sectional views for explaining the manufacturing process of the circuit board module according to the first embodiment in the order of steps, where FIG. 2A is a first step, FIG. 2B is a second step, c) is the third step.
  • FIG. 3A is a cross-sectional view of the circuit board module 200 according to the second embodiment, and FIG. 3B is a bottom view.
  • FIG. 4A is a cross-sectional view of a circuit board module 300 according to the third embodiment, and FIG. 4B is a bottom view.
  • FIG. 5 is a cross-sectional view of a circuit board module 400 according to the fourth embodiment.
  • FIG. 6 is a cross-sectional view of a circuit board module 500 according to the fifth embodiment.
  • FIG. 7 is a cross-sectional view of a circuit board module 600 according to the sixth embodiment.
  • FIG. 1A is a cross-sectional view of a circuit board module 100 according to the first embodiment.
  • the circuit board module 100 includes a first insulating substrate 111, a frame-shaped substrate 112, and a second insulating substrate 113.
  • the first insulating substrate 111, the frame-shaped substrate 112, and the second insulating substrate 113 are made of an organic substrate, ceramics, or the like, and each substrate is formed through a predetermined electrode and an insulating substrate described later.
  • Through-holes 121 and 122 are provided. Details will be described below.
  • the first insulating substrate 111 In the first insulating substrate 111, a hole penetrating in the thickness direction of the substrate is formed, and a conductive metal such as copper is filled in the hole to form via conductors 121a and 122a. On the first insulating substrate 111, wiring patterns 120a and 120b are formed on the front and back surfaces, and electronic components 130a, 130b, 131a, and 131b are mounted.
  • the height of the frame of the frame-like substrate 112 is formed higher than the height of the chip components 131a and 131b mounted on the back surface of the first insulating substrate 111.
  • Via conductors 121b and 122b are formed in the frame of the frame-shaped substrate 112 so as to be electrically connected to the via conductors 121a and 122a formed in the first insulating substrate 111 through the frame. .
  • a cavity 114 is formed by these two substrates.
  • via conductors 121c and 122c are formed in the same manner as the first insulating substrate so as to be electrically connected to the via conductors 121b and 122b formed on the frame substrate 112.
  • a via conductor 123 is formed near the center of the second insulating substrate 113, and a wiring pattern 124 is formed on the surface.
  • Terminal electrodes 125 a and 125 b are formed on the back surface of the second insulating substrate 113.
  • the bottom surface of the via conductor 121a and the top surface of the via conductor 121b, and the bottom surface of the via conductor 121b and the top surface of the via conductor 121c formed on each substrate are joined with a metal such as solder or a conductive paste to form a through hole 121.
  • the bottom surface of the via conductor 122a and the top surface of the via conductor 122b, and the bottom surface of the via conductor 122b and the top surface of the via conductor 122c are joined with a metal such as solder or a conductive paste to form a through hole 122.
  • the wiring patterns 120a and 120b formed on the front and back surfaces of the first insulating substrate 111 and the terminal electrodes 125a and 125b formed on the second insulating substrate 113 are through holes 121 and 122, and the terminal electrode 126 is a via.
  • the conductor 123 is electrically connected through the wiring pattern 124 and the through holes 121 and 122.
  • 2A to 2C are cross-sectional views illustrating the manufacturing process in order of process.
  • first, holes for forming via conductors 121a and 122a are formed at predetermined positions by a drill or a laser, and a conductive metal is filled in the holes.
  • a first insulating substrate 111 is prepared, wiring patterns 120a and 120b are formed on the front and back surfaces of the first insulating substrate 111, and chip components 131a and 131b are mounted on the back surface.
  • Via conductors 121b and 122b are formed on the frame substrate 112 so as to be connected to the via conductors 121a and 122b.
  • via conductors 121c, 122c, and 123 are formed at predetermined positions on the second insulating substrate 113, and wiring patterns 124 and terminal electrodes 125a, 125b, and 126 are formed.
  • the first insulating substrate 111, the frame substrate 112, and the second insulating substrate 113 are joined.
  • the lower surface of the via conductor 121a formed on the insulating substrate 111 and the upper surface of the via conductor 121b formed on the frame-shaped substrate, the lower surface of the via conductor 121b, and the upper surface of 121c are bonded by using solder.
  • the lower surface of the via conductor 122a and the upper surface of 122b, and the lower surface of the via conductor 121b and the upper surface of 121c are joined to form the through hole 122.
  • the underfill can be filled in the gap between the frame-shaped substrate 112 and the first insulating substrate 111 or the gap between the frame-shaped substrate 112 and the second insulating substrate 113 to increase the strength.
  • the chip components 130a and 130b are mounted on the surface of the first insulating substrate 111 to complete the circuit board module 100 of the present embodiment.
  • the through-hole conductors 121 and 122 may be formed at predetermined positions after the first insulating substrate 111, the frame-shaped substrate 112, and the second insulating substrate 113 are joined. 130b may be mounted on the insulating substrate 111 before bonding.
  • the terminal electrodes 125a and 125b are formed on the back surface of the second insulating substrate 113 with a large area regardless of the width of the frame-shaped substrate. Therefore, when the circuit board module 100 is mounted on the motherboard, the terminal electrodes 125a and 125b are stable. It is possible to connect with the obtained bonding strength. Furthermore, since the wiring pattern 124 is connected to the terminal electrode 126 through the through holes 121 and 122 and the via conductor 123, it functions as a ground electrode and can increase the bonding strength with the mother board. (Second Embodiment) A circuit board module 200 according to the second embodiment will be described with reference to FIGS.
  • FIG. 3A is a cross-sectional view of the circuit board module 200 according to the second embodiment
  • FIG. 3B is a bottom view of the circuit board module 200. Since the basic configuration is substantially the same as that of the first embodiment, the same reference numerals are used for details, and the description is omitted.
  • the circuit board module 200 is different from the circuit board module 100 according to the first embodiment in that a vent hole 240 having a diameter of 100 ⁇ m that penetrates the second insulating substrate 213 constituting the circuit board module 200 is formed. It is.
  • vent holes 240 different from those of the first embodiment are provided inside the frame-shaped substrate 112 and as terminal electrodes so that the cavities 114 are not sealed when the via conductor holes are formed in the second insulating substrate 213. Form on the non-overlapping parts with a drill or laser.
  • circuit board module 200 of the present embodiment is completed through the same processes as those of the first embodiment.
  • the terminal electrodes 125a and 125b formed on the second insulating substrate 213 are formed on the back surface of the second insulating substrate 213 with a large area, as in the first embodiment. Therefore, when the circuit board module 200 is mounted on the mother board, it can be connected with a stable bonding strength. Further, as shown in the first embodiment, a terminal electrode may be provided in the center of the back surface of the second insulating substrate.
  • the ventilation hole is provided in one place in the second insulating substrate, but it is formed in a portion that does not overlap with the first insulating substrate wiring pattern or the through hole of the frame substrate so that the cavity and the outside air can be communicated. It is also possible to form a plurality on each substrate.
  • a circuit board module 300 according to the third embodiment is shown in FIGS.
  • FIG. 4A is a cross-sectional view of the circuit board module 300 according to the third embodiment
  • FIG. 4B is a schematic bottom view of the circuit board module 300. Since the basic configuration is the same as that of the first embodiment, the same reference numerals are used for the details and the description is omitted, and different parts will be described.
  • the circuit board module according to this embodiment is different from the circuit board module 100 according to the first embodiment in that a chip component 330 is added to the surface of the first insulating board 311 and the second insulation A wiring pattern 320 c is formed on the surface of the substrate 313, the chip component 332 is mounted, and vent holes 340 a having a diameter of 150 ⁇ m are formed at predetermined positions on the first insulating substrate 311 and the second insulating substrate 313, respectively. 340b is formed.
  • the manufacturing method of the circuit board module 300 according to the present embodiment is almost the same as that of the first embodiment, the cross-sectional view of the manufacturing process is omitted, and only the parts different from the first embodiment will be described.
  • Ventilation holes 340a and 340b different from those in the first embodiment are formed in the first insulating substrate 311 and the second insulating substrate 313 so that the cavity 314 is not sealed.
  • the vent holes 340a and 340b are formed by a drill or a laser on the inside of the frame-shaped substrate 112 and not overlapping the wiring pattern or terminal electrode when forming the holes of the via conductors 121a, 121b, 121c, and 122c. To do. Then, the wiring patterns 120a and 120b are formed on the front and back surfaces of the first insulating substrate 311 and the chip components 131a and 131b are mounted on the back surface.
  • the second insulating substrate 313 is formed so that the wiring pattern 320 is formed on the front surface and the terminal electrodes 125a and 125b are formed on the back surface, and are electrically connected to the wiring pattern 320c formed on the surface of the second insulating substrate 313. Then, the chip component 332 is mounted and the process proceeds to the second step. In the second step, as in the first embodiment, the via conductors 121a to 122c are joined by solder.
  • the chip components 130a, 130b, and 330 are mounted on the surface of the first insulating substrate 311 to complete the circuit board module 300 of the present embodiment.
  • vents are provided as in this embodiment, the gas generated in the cavity can be released to the outside more quickly, and the board is less likely to be broken or deformed. can do.
  • the wiring pattern formed on the surface of the first insulating substrate of the circuit board module and the mounted chip component may be covered with a case cover or resin.
  • FIG. 5 shows a circuit board module 400 according to the fourth embodiment.
  • FIG. 5 is a cross-sectional view.
  • circuit board module 400 Since the basic configuration of the circuit board module 400 is the same as that of the first embodiment, the same reference numerals are given to the details and the description thereof is omitted, and only different portions will be described.
  • the circuit board module 400 includes a second insulating substrate 413.
  • Terminal electrodes 425a, 425b, 426a, and 426b are formed on the bottom surface of the second insulating substrate 413.
  • the second insulating substrate 413 has via conductors 421c, 422c, 423a, and 423b formed therein. Note that in FIG. 5 which is a cross-sectional view, the via conductors 423a and 423b are not formed in the cross-section, but are formed on the back side of the cross-section in the drawing, and thus are indicated by broken lines.
  • the second insulating substrate 413 has wiring patterns 424a and 424b extending along both main surfaces of the second insulating substrate 413 formed therein. Note that in FIG. 5 which is a cross-sectional view, the wiring patterns 424a and 424b are not formed in the cross section, but are formed on the back side of the cross section in the drawing, and thus are indicated by broken lines.
  • the via conductor 421c connects the via conductor 121b formed on the frame substrate 112 and the terminal electrode 425a.
  • the via conductor 422c connects the via conductor 122b formed on the frame substrate 112 and the terminal electrode 425b.
  • the via conductor 423a connects the wiring pattern 424a and the terminal electrode 426a.
  • the via conductor 423b connects the wiring pattern 424b and the terminal electrode 426b.
  • the wiring pattern 424a is not connected to the via conductor 421c, and is not shown in FIG. 5 hidden behind the via conductor 421c, but connected to another via conductor formed inside the second insulating substrate 413.
  • the wiring pattern 424b is not connected to the via conductor 422c, and is not shown in FIG. 5 hidden behind the via conductor 422c, but connected to another via conductor formed inside the second insulating substrate 413. Has been.
  • the terminal electrode 425a. 425b, 426a, and 426b can be formed at any position on the bottom surface of the second insulating substrate 413, and correspond to various arrangements of mounting electrodes on a motherboard (not shown) on which a circuit board module is mounted. can do.
  • the number of terminal electrodes 425a, 425b, 426a, and 426b formed on the second insulating substrate 413 can be increased, the number of electronic components 130a, 130b, 131a, and 131b mounted on the circuit board module 400 can be reduced.
  • FIG. 6 is a cross-sectional view.
  • circuit board module 500 Since the basic configuration of the circuit board module 500 is the same as that of the first embodiment, the same reference numerals are given to the details and the description thereof is omitted, and only different portions will be described.
  • the circuit board module 500 includes a frame-shaped substrate 512.
  • Via conductors 521b, 521d, 522b, and 522d are formed inside the frame of the frame-like substrate 512.
  • the vertical cross section of the frame-like substrate 512 including the cavity 114 is seen, but via conductors 521b and 521d are formed in the vertical cross section of the left frame of the pair of frames, and the pair of frames Via conductors 522b and 522d are formed in the longitudinal section of the right frame.
  • Via conductors 521b, 521d, 522b, and 522d are formed inside the frame-shaped substrate 512 so as to be aligned in a direction parallel to a main surface of a second insulating substrate 613 to be described later.
  • the circuit board module 500 includes a second insulating substrate 613.
  • Terminal electrodes 625a, 625b, 626a, 626b are formed on the bottom surface of the second insulating substrate 613.
  • the second insulating substrate 613 has via conductors 621c, 621e, 622c, 622e, 623a, and 623b formed therein.
  • the second insulating substrate 613 has wiring patterns 624a and 624b extending in a direction parallel to both main surfaces of the second insulating substrate 613.
  • the via conductor 121a, the via conductor 521b, the via conductor 621c, and the terminal electrode 625a formed on the first insulating substrate 111 are sequentially connected.
  • the via conductor 122a, the via conductor 522b, the via conductor 622c, and the terminal electrode 625b formed in the first insulating substrate 111 are sequentially connected.
  • the wiring pattern 120b formed on the first insulating substrate 111, the via conductor 521d, the via conductor 621e, the wiring pattern 624a, the via conductor 623a, and the terminal electrode 626a are sequentially connected.
  • the wiring pattern 120c formed on the first insulating substrate 111, the via conductor 522d, the via conductor 62e, the wiring pattern 624b, the via conductor 623b, and the terminal electrode 626b are sequentially connected.
  • FIG. 7 shows a circuit board module 600 according to the sixth embodiment.
  • FIG. 7 is a cross-sectional view.
  • circuit board module 600 The basic configuration of the circuit board module 600 is the same as that of the circuit board module 400 according to the fourth embodiment shown in FIG. Only explained.
  • the resin 601 is filled in the cavity 114 surrounded by the first insulating substrate 111, the frame substrate 112, and the second insulating substrate 413.
  • circuit board module 600 according to the sixth embodiment since the resin 601 is filled in the cavity 114, the strength of the circuit board module itself is improved. In addition, since the circuit board module 600 according to the sixth embodiment is filled with the resin 601 inside the cavity 114, the insulation of the electronic components 131a and 131b mounted in the cavity 114 from the outside is improved. Yes.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Combinations Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
PCT/JP2013/074837 2012-09-17 2013-09-13 Module de substrat de circuit Ceased WO2014042242A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2014535603A JP5765488B2 (ja) 2012-09-17 2013-09-13 回路基板モジュール

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012-203778 2012-09-17
JP2012203778 2012-09-17

Publications (1)

Publication Number Publication Date
WO2014042242A1 true WO2014042242A1 (fr) 2014-03-20

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ID=50278347

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2013/074837 Ceased WO2014042242A1 (fr) 2012-09-17 2013-09-13 Module de substrat de circuit

Country Status (2)

Country Link
JP (1) JP5765488B2 (fr)
WO (1) WO2014042242A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016012688A1 (fr) * 2014-07-23 2016-01-28 Valeo Equipements Electriques Moteur Dispositif électronique d'un compresseur de suralimentation électrique
CN114271035A (zh) * 2019-09-03 2022-04-01 富士通互连技术株式会社 基板、基板的制造方法及电子设备

Citations (4)

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Publication number Priority date Publication date Assignee Title
JPH08213516A (ja) * 1995-01-31 1996-08-20 Nec Corp 半導体装置及びその製造方法
JP2004119881A (ja) * 2002-09-27 2004-04-15 Sony Corp 半導体装置及びその製造方法
JP2004209585A (ja) * 2002-12-27 2004-07-29 Shinko Electric Ind Co Ltd 電子デバイス及びその製造方法
EP1494292A2 (fr) * 2003-07-01 2005-01-05 Matsushita Electric Industrial Co., Ltd. Capteur d'image à état solide et sa procédé de fabrication

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08213516A (ja) * 1995-01-31 1996-08-20 Nec Corp 半導体装置及びその製造方法
JP2004119881A (ja) * 2002-09-27 2004-04-15 Sony Corp 半導体装置及びその製造方法
JP2004209585A (ja) * 2002-12-27 2004-07-29 Shinko Electric Ind Co Ltd 電子デバイス及びその製造方法
EP1494292A2 (fr) * 2003-07-01 2005-01-05 Matsushita Electric Industrial Co., Ltd. Capteur d'image à état solide et sa procédé de fabrication
US20050001219A1 (en) * 2003-07-01 2005-01-06 Matsushita Electric Industrial Co., Ltd. Solid-state imaging device and method for manufacturing the same
JP2005026426A (ja) * 2003-07-01 2005-01-27 Matsushita Electric Ind Co Ltd 固体撮像装置およびその製造方法
CN1577872A (zh) * 2003-07-01 2005-02-09 松下电器产业株式会社 固体摄像装置及其制造方法
KR100591375B1 (ko) * 2003-07-01 2006-06-19 마쯔시다덴기산교 가부시키가이샤 고체 촬상 장치 및 그 제조방법

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016012688A1 (fr) * 2014-07-23 2016-01-28 Valeo Equipements Electriques Moteur Dispositif électronique d'un compresseur de suralimentation électrique
WO2016012666A1 (fr) * 2014-07-23 2016-01-28 Valeo Equipements Electriques Moteur Compresseur de suralimentation électrique
FR3024319A1 (fr) * 2014-07-23 2016-01-29 Valeo Equip Electr Moteur Dispositif electronique d'un compresseur de suralimentation electrique
CN114271035A (zh) * 2019-09-03 2022-04-01 富士通互连技术株式会社 基板、基板的制造方法及电子设备

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JP5765488B2 (ja) 2015-08-19
JPWO2014042242A1 (ja) 2016-08-18

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