WO2014041588A1 - Cutting method for electrode band for electronic component using laser beam and device for same - Google Patents

Abstract

Provided is a dustless cutting device for electrode bands that uses a laser beam. An electrode band (1) is pressed onto and affixed to an electrode band transport platform (75) along a cutting line (2) of the electrode band (1) with pressing and affixing members (20a, 20b). A laser beam (41) output by a laser output unit (40) is made to progress over the cutting line (2) in order to cause melting at a light collection position for the laser beam (41). A blade (12) of a blade operating mechanism (10) follows the laser beam (41) and is made to make ingress into a molten site (3), and one of the molten ends (3a, 3b) of the molten site (3) is separated from the other.

Description

Laser beam cutting method and apparatus for electrode band of electronic component

The present invention relates to a laser beam cutting method and apparatus for cutting an electrode band of an electronic component such as a lithium battery or a capacitor to a predetermined size or size.

Non-aqueous electrolyte secondary batteries represented by lithium secondary batteries take advantage of the high energy density, and small electronic devices such as mobile phones and personal computers, large electric storage devices such as hybrid or electric vehicles, etc. Used in electronic components. The electrode assembly, which is the main internal structure of a lithium ion secondary battery, is a wound type in which a positive / negative electrode zone in which an active material is coated on a metal foil and a separator are wound, There is something.

In the case of a wound type, this positive or negative electrode band is slit into a predetermined width with a wide, long original strip, and a narrow positive / negative electrode band and a separator are supplied to a winder, and a predetermined length is obtained. After being wound up, it was cut into an electrode assembly for a lithium secondary battery. Further, in the case of the laminated type, a rectangular blank was punched out of a wide original sheet of positive and negative electrode bands with a Thomson blade, and this was alternately laminated between the separators to form a laminate for a lithium secondary battery. Then, the wound or stacked electrode assembly is accommodated in an outer can which is a container, and after the electrolyte is poured, a cap is attached and sealed, and finally, the battery is charged by being initially charged. Granted. The capacitor also has a similar structure.

Among the batteries manufactured in this manner, battery characteristics such as voltage and capacity, and behavior of deterioration of the battery characteristics due to aging may be mixed with those different from normal batteries. According to the findings up to the present, the cause is considered to be contamination of metallic foreign matter in the electrode zone. That is, the metallic foreign matter mixed in penetrates the separator, and the metallic foreign matter dissolves and elutes in the electrolytic solution with charge and discharge, and the metal ions deposit and grow from the negative electrode in the form of dendrite, and the positive and negative electrodes It is supposed that a slight current leaks between them to cause a minute short circuit.

And, among the manufacturing processes in which there are a number of lithium secondary batteries, it is said that the process in which the metallic foreign matter is particularly likely to be mixed is the cutting process. In the cutting process, a roll cutter made of blade steel, a scissors type cutter, or a Thomson blade is used in the case of punching into a rectangular shape, and the object to be cut is a copper foil or aluminum foil constituting an electrode strip. There is a high possibility that the fine powder from the metal blade used when cutting the metal and the fine powder of the metal foil to be cut mix and adhere to the electrode strip, and sharp burrs are generated at the cutting end, and these are metallic foreign substances It is said to be.

Then, the method which does not use a metal cutter as one solution, ie, use of the ceramic blade instead of the metal blade, could be considered, and it became possible to remove the foreign material from the blade, but it was cut. It was not possible to exclude the mixing of fine powder of metal foil and the generation of burrs (Patent Document 1).

Laser beam cutting has also been proposed for such physical cutting methods. In the case of cutting by a laser beam, when the laser beam is run along the cutting line, the electrode zone is instantaneously melted at its focusing position, which is a continuously generated minute region, but the temperature of the electrode zone is low. At the moment, the heat was taken away from the surroundings, it solidified and returned to its original state, and as a result, only the laser beam ran through the cutting line and cutting by only the laser beam was impossible.

Therefore, air was blown toward the cut portion or suctioned at the cut portion in an attempt to eliminate the metal in the molten micro area so as not to solidify at that position, but in the case of spraying, the molten metal was blown It is quenched by the air to form a large amount of fine spheres (metallic foreign matter), soars with the air and adheres to the electrode part at another place, causing the above-mentioned failure. In addition, the ability to remove molten metal in a minute range is insufficient in suction, and the use of air causes noise, which significantly deteriorates the factory environment.

The present invention has been made in view of the above problems, and an object of the present invention is to provide a method and apparatus for cutting an electrode strip by a laser beam which can reliably remove the problem of cutting by the laser beam.

The inventive method described in claim 1 is a method of cutting a long electrode strip 1 with a laser beam 41, and
Fix the electrode strip 1 along the cutting line 2 of the electrode strip 1,
The laser beam 41 is moved along the cutting line 2 to melt the light collecting position, and an external force is applied to the melting site 3 to spread the melting site 3 and continuously prevent re-fusion of the melting site 3. The melting zone 3 is separated to cut the electrode band 1. Here, the fixing method along the cutting line 2 of the electrode strip 1 may be pressing or adsorption. For adsorption, an existing adsorption method such as vacuum adsorption or electrostatic adsorption is adopted.

The invention method described in claim 2 is
The external force is characterized in that it is a pressing force, a shearing force, a tension or a vibration that pulls the melting portion 3 apart.

The invention described in claim 3 is a first embodiment A of a cutting device for realizing the laser cutting of claim 1. That is,
Pressing and fixing members 20a and 20b for pressing and fixing the electrode band 1 to the electrode band carrier table 75 along the cutting line 2 of the electrode band 1;
A laser emitting unit 40 for causing the emitted laser beam 41 to travel along the cutting line 2 and melting the condensing position of the laser beam 41;
It is characterized in that it comprises a blade operating mechanism 10 provided with a blade 12 which follows the laser beam 41 and enters the melting part 3 and separates one of the melting ends 3a and 3b of the melting part 3 from the other.

The invention described in claim 4 is a second embodiment B of the cutting apparatus for realizing the laser cutting of claim 1. That is,
A source side pressing and fixing member 20a and a destination side pressing and fixing member 20b for pressing and fixing the electrode band 1 to the electrode band transport table 75 on both sides along the cutting line 2 of the electrode band 1;
A laser emitting unit 40 for causing the emitted laser beam 41 to travel along the cutting line 2 and melting the condensing position of the laser beam 41;
A tension applying mechanism which moves either one of the original side pressing and fixing member 20a and the destination side pressing and fixing member 20b away from the other so that tension is applied to the part of the laser beam 41 on the electrode band 1 on the penetration side. And 50.

The invention described in claim 5 is a third embodiment C1 of the cutting device for realizing the laser cutting of claim 1. That is,
A feed source side pressing and fixing member 20a for pressing and fixing the electrode band 1 to the electrode band transport table 75 along the cutting line 2 of the electrode band 1;
A laser emitting unit 40 for causing the emitted laser beam 41 to travel along the cutting line 2 and melting the condensing position of the laser beam 41;
It is characterized by comprising an ultrasonic wave generator 60 which moves following the laser beam 41 and applies vibration to the melting portion 3 to separate one of the melting ends 3a and 3b of the melting portion 3 from the other.

The invention described in claim 6 is another third embodiment C2 of the cutting device for realizing the laser cutting of claim 1. That is,
A pressing and fixing member 20a for pressing and fixing the electrode strip 1 to the electrode strip transport table 75 along the cutting line 2 of the electrode strip 1;
A laser emitting unit 40 for causing the emitted laser beam 41 to travel along the cutting line 2 and melting the condensing position of the laser beam 41;
Ultrasonic generation having a vibrating member 62 disposed along the cutting line 2 and in contact with the electrode band 1 and applying vibration to the melting portion 3 to separate one of the melting ends 3a and 3b of the melting portion 3 from the other It is characterized in that it comprises the device 60.

In the cutting apparatus according to the third to fifth aspects of the present invention, in the cutting device according to the third to fifth aspects, the cutting line 2 of the electrode strip 1 on the electrode band transport table 75 is used instead of the source side pressing and fixing member 20a or the destination side pressing and fixing member 20b. An adsorption mechanism 90 for adsorbing the vicinity of is provided. As the suction mechanism 90, an existing mechanism such as a vacuum suction mechanism or an electrostatic suction mechanism is adopted.

According to the present invention, the laser beam 41 is caused to travel along the cutting line 2 to melt the light collecting position and apply an external force to the melting portion 3 to push out the melting portion 3 to inhibit refusion of the melting portion 3 However, since separation continues continuously, all of the small amount of molten metal in the melting part 3 separates and solidifies at the separated melting ends 3a and 3b as it is, and constitutes the cutting end, It does not become spherical powder like. As a result, dust-free laser cutting could be realized.

FIG. 1 is a perspective view of a first embodiment of a cutting device according to the present invention. (a) is a principal part expansion perspective sectional view of FIG. 1, (b) is a principal part expansion perspective sectional view of a modification. The front view before the action | operation of 1st Example of this invention apparatus. The principal part front view of the state which irradiated the laser beam to the electrode zone in 1st Example. FIG. 5 is a front view of an essential part in a state in which the blade is advanced to the melting portion in the first embodiment. The principal part front view after cutting of an electrode belt in a 1st example. The perspective view of 2nd Example of the cutting device which concerns on this invention. The principal part expansion perspective view of FIG. The front view which shows the operating state of 2nd Example. The principal part perspective view of the state which gave tension and cut | disconnected the part from a cutting | disconnection start point to a fusion | melting site | part in 2nd Example. The perspective view of 3rd Example of the cutting device which concerns on this invention. The perspective view of the modification of 3rd Example. The principal part front view of 4th Example.

Embodiment of the Invention

Hereinafter, a first embodiment A of the present invention will be described based on FIGS. 1 to 6. The first embodiment A includes an apparatus main body 70, an electrode band carrier 75 installed through the vertical frame 85 of the apparatus main body 70, and vertical linear guide rails 71 attached to the vertical frame 85 of the apparatus main body 70, An upper elevating block 72 mounted on the linear guide rail 71, a ball screw driving portion 73 for driving a servomotor (not shown) for vertically moving the upper elevating block 72, and an upper pressing mechanism portion 30 provided on the upper elevating block 72 Lower pressing mechanism units 81 and 82 provided as needed on the electrode band transport table 75 directly below the upper pressing mechanism unit 30, and upper pressing mechanism of the upper lifting block 72 mounted so as to be able to move up and down on the vertical frame 85 The laser emitting unit 40 and the laser emitting unit 40 that are disposed above the unit 30 and move along the cutting line 2 of the electrode strip 1 are provided It is composed of a blade actuating mechanism 10 having two.

The electrode strip 1 applied to the present invention is a long member in which an active material is applied at predetermined intervals on one surface or both front and back surfaces of aluminum foil or copper foil, and in this embodiment, a double-sided coated type material is used. ing. In cutting, the non-coated portion 1a or the coated portion 1b of the active material is cut with a predetermined dimension or cut with a predetermined size, and used as a positive electrode plate or a negative electrode plate for electronic parts such as secondary batteries and capacitors.

Two rails 71 are longitudinally mounted in parallel on the front side of the vertical frame 85, and an upper elevating block 72 is mounted so as to be movable up and down. A ball screw drive unit 73 is attached to the upper elevating block 72, and the upper elevating block 72 is raised and lowered by a servomotor (not shown). Although the ball screw drive unit 73 shown in the drawing is of a system in which it is rotationally driven by a servomotor, it is of course not limited thereto, and one of a cylinder drive type and other types can be adopted as appropriate.

The upper pressing mechanism unit 30 is attached to a standing plate 31 vertically attached to the front surface of the upper lift block 72 and a lower portion on both sides of the standing plate 31 so as to protrude toward the source side (right side in the figure). A pair of arms 32, a source side pressing and fixing member 20a constructed to cross the electrode band 1 with a predetermined interval below the front end of both arms 32, a destination side pressing and fixing member 20b, and a source side pressing and fixing A pair of source side guide members 21 for guiding the member 20a and the destination side pressing and fixing member 20b in the raising and lowering direction, respectively, and the destination side guide member 22 are provided.

The feed-side pressing and fixing member 20a and the sending-side pressing and fixing member 20b are longer than the width of the electrode band 1 and are blocks having a trapezoidal vertical cross section, and their opposing surfaces are formed to be inclined downward. The gap 20c is in the form of a slit through which the laser beam 41 from the laser emission unit 40 passes, and the width becomes narrower as it goes down. Although at least one of the feed source side pressing and fixing member 20a and the destination side pressing and fixing member 20b is sufficient, the feeding source side pressing and fixing member 20a may be sufficient, but here, both are described. Do.

The source side and destination side guide members 21 and 22 have the same structure in this embodiment, and are constituted by guide pins 21a and 22a and pressing springs 21b and 22b. Through-holes 21c and 22c in which the lower surface is seated are formed in the tip end portion of the arm 32, and the upper surface is seated on the source side pressing and fixing member 20a and the destination side pressing and fixing member 20b at positions corresponding thereto. Screw holes 21d and 22d are formed, and pressing springs 21b and 22b are respectively accommodated in facing counterbore portions. The threaded portions of the guide pins 21a and 22a disposed so as to pass through the inside of the pressing springs 21b and 22b are screwed into the screw holes 21d and 22d of the source side pressing and fixing member 20a and the destination side pressing and fixing member 20b. The shaft portions of the guide pins 21 a and 22 a are inserted so as to slide through the through holes 21 c and 22 c of the arm 32. As a result, the source side and destination side guide members 21 and 22 are pressed and urged downward.

The electrode band carrier table 75 intermittently feeds the long electrode band 1 from the source side to the destination side (from the right to the left in the figure) by an intermittent feeding mechanism (not shown). Have a width sufficient to cover the The electrode band transport table 75 is horizontally installed by penetrating the vertical frame 85 of the apparatus main body 70, and includes a source side electrode band transport table 75a and a destination side electrode band transport table 75b.

On the opposing portion of the source side electrode strip transport stand 75a and the destination side electrode strip transport stand 75b, a portion (hereinafter this portion is referred to as a triangle projection portion) 76a and 76b projecting in a right triangle shape in a front view is provided. ing. The gap 75c between the facing edges on the upper surface side of the triangular protrusion 76a and 76b is substantially the same as the gap 20c between the facing portions of the source-side pressing and fixing member 20a and the destination-side pressing and fixing member 20b. As can be seen from the enlarged views of FIGS. 4 and 5, although the tip of the opposing portion of the feed side pressing and fixing member 20a and the tip of the triangular projecting portion 76a of the feed side electrode band carrier 75a substantially coincide with each other, The tip of the triangular protrusion 76b of the side electrode band carrier 75b protrudes inward from the tip of the opposing portion of the destination side pressing and fixing member 20b. The gap 75c has a width to which the blade edge 12a of the blade 12 described later can enter.

On the upper surface in the vicinity of the facing portion of the feed side electrode strip transport stand 75a and the destination side electrode strip transport stand 75b, steps 77a and 77b larger than the thickness of the active material applied to the electrode strip 1 are provided. Bed side elevating blocks 81a and 82a of the lower elevating mechanisms 81 and 82 are fitted in the raising and lowering through holes formed in the flat portions 78a and 78b which are further lowered by the steps 77a and 77b. Self-propelled rollers 81c and 82c are arranged at predetermined intervals on the upper surfaces of the bed-side lifting blocks 81a and 82a. The main body portions 81b and 82b of the lower elevating mechanism portions 81 and 82 are formed by an elevating device such as a cylinder, and are attached to the horizontal frame portion 85a installed on the vertical frame 85 below the electrode band transport table 75 It is done.

The blade operating mechanism 10 is composed of a blade 12, a blade operating portion 11 and a blade guide 14. If the blade 12 is rigid enough to prevent deflection of the tip of the blade 12 during operation, the blade guide 14 is not required. The blade 12 is shaped like a single-edged or double-edged blade, and one end thereof is attached to, for example, a servomotor 11 a of the blade operating portion 11. Here, a single-edged one is shown. The servomotor 11a is attached to the mounting plate 11b. The other end of the blade 12 is guided by a blade guide 14 for anti-vibration. In the case of the figure, the blade guide 14 is bifurcated and a guide groove 14a is formed, and one end of the blade 12 is slidably inserted in the guide groove 14a. Of course, the blade guide 14 is not limited to such a structure, and the other end of the blade 12 may be vertically guided at a slight angle by using a commercially available linear guide rail which moves in the vertical direction. Is also possible.

The blade 12 is a single-edged blade in the case of FIG. 1 with the blade edge 12a up and the blade guide 14 side of the blade edge 12a is slightly higher than the blade operating portion 11 side. It is set in a gap 75c between the side electrode band carrier 75b. It is desirable that the material be excellent in heat resistance and thermal conductivity. For example, a material used for a spot welding electrode material such as copper-tungsten alloy, chromium copper alloy, alumina-dispersed copper, molybdenum, or a member such as ceramic will be used at least for the cutting edge 12a. . The same material or steel is used for the upper side source side pressing and fixing member 20a and the destination side pressing and fixing member 20b. In the positional relationship with the laser beam 41 described later, the laser beam 41 travels along the back side of the single-edged blade from the back side with a slight distance.

The laser emitting unit 40 is disposed above the upper pressing mechanism unit 30, and the laser beam 41 is emitted from the lower surface thereof toward a gap 20c between the source side pressing and fixing member 20a and the destination side pressing and fixing member 20b. The laser emitting unit 40 is moved by a laser emitting unit traveling mechanism (not shown). Here, the emitted laser beam 41 travels on the cutting line 2 located in the gap 20 c. Of course, the embodiment shown in the drawings is straight, but it is of course not limited to this. If the gap 20c is formed into a curved, rectangular or other shape, it travels freely on the cutting line 2 positioned in accordance with this. In that case, the shape of the gap 20 c is also formed in accordance with the cutting line 2.

Next, the operation of the device A according to the first embodiment will be described. As shown in FIG. 3, the electrode band 1 coated with the active material at predetermined intervals on both sides is placed on the electrode band conveyance table 75 and intermittently fed by the self-propelled rollers 81c and 82c. There is. In the case of the figure, the bed side elevating block 81a is set so that the non-coated portion 1a of the active material is aligned with the gap 75c of the electrode strip carrier 75 and the coated portion 1b of the active material is at the lowest point. It is placed on 82a. The cutting line 2 of the electrode strip 1 is a portion corresponding to the gap 75c (or the gap 20c). When cutting the applied portion 1b of the active material, the cut portion is set so as to match the gap 75c.

In this state, as shown in FIG. 4, the upper elevating block 72 is lowered and the source side pressing and fixing member 20a and the destination side pressing and fixing member 20b are not coated with the non-coated portion 1a. The upper surfaces of the triangular projecting portions 76a and 76b of the band carrier 75b are respectively pressed. In this state, the blade edge 12a of the blade 12 is not in contact with the lower surface of the non-coated portion 1a. At this time, the focal point of the laser beam 41 of the laser emitting unit 40 is located outside the cutting start point P1 of the electrode band 1. In this state, the laser beam 41 is moved from the side of the blade guide 14 of the blade 12 to the side of the blade operating portion 11 while emitting the laser beam 41 from the laser emitting unit 40. When the laser beam 41 reaches the cutting start point P1, the components of the electrode strip 1 are melted instantaneously in the focal range.

Then, the blade actuating portion 11 is rotated in synchronization with the movement of the laser beam 41, and the blade guide 14 side of the blade 12 is gradually lifted, and the cutting edge 12a is continuously applied to the minute melting portion 3 melted by the emission of the laser beam 41. It is made to enter and separate this part, and the electrode band 1 is cut along the cutting line 2 while preventing reconnection due to solidification of the minute melting site 3. It is an enlarged drawing of FIG. 5 which made the interruption the reconnection by solidification of the micro fusion | melting part 3 by the blade tip 12a into a schematic diagram. That is, by pushing the molten end 3b on the sending side of the portion 3 melted by the irradiation of the laser beam 41 with the cutting edge 12a, the molten end 3a is forcibly spread from the melting end 3a on the sending side. Do. The molten metal solidifies and integrates in the state where it adheres to the molten end 3a on the sending side and the molten end 3b on the sending side. This operation will be performed continuously following the progress of the laser beam 41.

When the laser beam 41 passes through the cutting end point P2 of the electrode strip 1 and the cutting edge 12a separates the cutting end point P2, the cutting ends. The laser emitting unit 40 ends the emission of the laser beam 41, and returns to the home position, and the blade operating mechanism 10 reverses to lower the blade 12, and the upper elevating block 72 moves up and the source side pressing and fixing member 20a and the destination side The pressing and fixing member 20b is returned to the home position in the raised position. After that, the bed side raising and lowering blocks 81a and 82a are raised to lift the electrode band 1. In this state, the self-propelled rollers 81c and 82c are rotated to carry one pitch, and the next cut portion of the electrode band 1 is positioned on the blade 12, and then the elevating blocks 79a and 79b are lowered to electrode band Reduce 1 (Figure 3). And cutting of the to-be-cut part of the electrode strip 1 is performed as mentioned above.

When cutting out a rectangular electrode sheet of a predetermined size from the wide raw fabric electrode band 1, although not shown, a rectangular blade such as a Thomson blade is used to make the laser beam 41 run around the cutting edge, as above Cut it out in the way.

Next, the apparatus B of the second embodiment will be described. In order to avoid complexity, mainly the points different from the first embodiment will be mainly described, and the description of the first embodiment will be incorporated. In this case, the tension applying mechanism 50 is used in place of the blade operating mechanism 10. In the apparatus B of the second embodiment, a pair of the source side pressing and fixing member 20a and the destination side pressing and fixing member 20b are essential because the tension is applied to the electrode band 1, and the source side pressing and fixing member 20a is the first embodiment. Same structure as the example. On the other hand, since the destination side pressing and fixing member 20b is different from the first embodiment A in the separating action, it is structurally different from the destination side pressing and fixing member 20b of the first embodiment A. Also in this case, as described in the first embodiment A, the suction mechanism 90 can be used as a fixing means instead of the feed source side pressing and fixing member 20a and the destination side pressing and fixing member 20b.

The inlet portion 75b2 is the same as the inlet portion 75b1 separated from the main body portion 75b1 by cutting the introduction portion of the destination-side electrode strip carrier 75b of the first embodiment A, and is opposed to the source side electrode strip carrier 75a. A triangular projecting portion 76b is formed on the opposite surface of the inlet portion 75b2, and a gap 75c is formed by this portion 76b and the triangular projecting portion 76a of the feed side electrode band carrier 75a. The inlet portion 75b2 is fixed to the swinging arm 53 of the tension applying mechanism 50 described later, and swings only a slight distance between the main body portion 75b1 and the triangular projecting portion 76a of the feed side electrode band carrier 75a. It oscillates and reciprocates around the rotation shaft 53 a of the arm 53.

The tension applying mechanism 50 includes a mounting plate 52 mounted on the electrode band transport table 75, a servomotor 51 mounted on the mounting plate 52, a swinging arm 53 mounted on a rotation shaft 53 a of the servomotor 51, and a swinging arm 53. An inlet portion 75b2 integrally attached to the feed destination side pressing and fixing member 20b disposed above the inlet portion 75b2, a holding mechanism 54 for vertically driving the destination side pressing and fixing member 20b, and a swing arm 53 It comprises a guide mechanism 57 for guiding the tip. In the guide mechanism 57, the rigidity of the swing arm 53 is high, and the guide mechanism 57 is not necessary if the tip end does not move.

The holding mechanism portion 54 for vertically driving the destination side pressing and fixing member 20b is constituted by a raising and lowering driving member 55 such as a cylinder and a guide pillar 56. A plurality of guide columns 56 are provided in parallel to the upper surface of the inlet portion 75b2 and slidably inserted in guide holes formed in the destination side pressing and fixing member 20b. The cylinder portion of the elevation driving member 55 is attached to the side surface of the inlet portion 75b2, and the shaft of the elevation driving member 55 is attached to the side surface of the destination side pressing and fixing member 20b. The position of the destination side pressing and fixing member 20b is disposed below the arm 32 and is opposed to the source side pressing and fixing member 20a as in the first embodiment A, and the gap 20c between them is the traveling path of the laser beam 41.

A slightly curved guide mechanism portion 57 is installed on the tip end side of the swing arm 53 to guide the tip of the swing arm 53 in accordance with the minute rotational movement of the servo motor 51, and swings to the movable side guide 57a. The tip of the arm 53 is attached. The fixed side guide 57b is mounted in parallel to the movable side guide 57a.

In the second embodiment B configured as described above, as shown in FIG. 7, the electrode band 1 is placed on the electrode band transport table 75, and the source side pressing and fixing member 20a and the destination side pressing and fixing member 20b are provided. It is located above the cutting site of the electrode strip 1. From this state, the upper elevating block 72 is lowered and the source side pressing and fixing member 20a presses and fixes the source side of the electrode band 1 along the cutting line 2 of the electrode strip 1 to the triangular projecting portion 76a. At the same time, the elevation driving member 55 is actuated to press and fix the destination side of the electrode band 1 along the cutting line 2 of the electrode band 1 to the triangular projecting portion 76b by the destination side pressing and fixing member 20b. As a result, both sides of the cutting line 2 are fixed.

In this state, the servomotor 51 is operated to slightly rotate the swing arm 53 and the inlet portion 75b2 integrally fixed thereto, and the destination side pressing and fixing member 20b and the triangular projecting portion 76b of the inlet portion 75b2 And lightly pull the electrode band 1 between the electrode band 1 and the electrode band 1 along the cutting line 2 so that the electrode band 1 is lightly tensioned.

As in the first embodiment A, the focal point of the laser beam 41 is located outside the cutting start point P1 of the electrode strip 1 in the laser emitting unit 40. In this state, the laser emitting unit 40 is operated to emit the laser beam 41 and moved in the direction of the cutting start point P1. When the laser beam 41 reaches the cutting start point P1, the electrode band 1 is instantaneously melted sequentially at the focal portion of the moving laser beam 41. Then, the rotation of the servomotor 51 is rotated in synchronization with the movement of the laser beam 41. As a result, with the movement of the swing arm 53, tension is applied to the electrode strip 1 as the destination side pressing and fixing member 20b and the inlet portion 75b2 are slightly separated from the source while holding the destination of the electrode strip 1 The points from the start point P1 to the minute melting site 3 are separated from each other. The melted metal at the minute melting portion 3 adheres to the melting end 3a on the sending side and the melting end 3b on the sending side as it is and solidifies. As a result, the reconnection due to the solidification of the micro-melted portion 3 is prevented, and in a state where the electrode band 1 matches the cutting line 2 in accordance with the progress of the laser beam 41, dust-free cutting is continuously performed.

When the cutting is completed, the emission of the laser beam 41 is ended, and at the same time, the source-side pressure fixing member 20a and the destination-side pressure fixing member 20b are raised. Subsequently, the servomotor 51 is reversely rotated to return the inlet portion 75b2 to the home position, and then the bed side raising and lowering blocks 81a and 82a are raised to lift the electrode band 1, and the electrode band 1 is conveyed by pitch. After moving to the cutting position, the elevating blocks 79a and 79b are lowered to lower the electrode strip 1 (FIG. 3). Then, as described above, dust-free cutting of the cut portion of the electrode band 1 is performed.

Next, an apparatus C of the third embodiment will be described. Also in this case, in order to avoid complexity, mainly the points different from the first embodiment will be mainly described, and the description of the first embodiment is used for the overlapping portions. In this case, the ultrasonic generator 60 is used in place of the blade operating mechanism 10. Here, two examples of the ultrasonic wave generator 60 are shown. The third embodiment shown in FIG. 11 is of a type in which the ultrasonic wave generator 60 moves, and is indicated by reference numeral C1, and in the third embodiment C shown in FIG. 12, the ultrasonic wave generator 60 is of a fixed type. It is indicated by C2. In the third embodiment C, since the ultrasonic wave generator 60 is installed on the side of the destination side pressing and fixing member 20b, the destination side pressing and fixing member 20b is not used.

The ultrasonic generator 60 is a device for converting electrical energy into mechanical vibrational energy, and converts an electrical signal of 50/60 Hz into an electrical signal of 20 kHz (or 35 kHz) by an oscillator (generator), Converter), where it is converted to mechanical vibrational energy. The conversion of the electrical signal into mechanical vibrational energy is performed by the piezoelectric element, which vibrational energy is transferred to the electrode strip 1 through a resonator called horn 61 via a booster which increases the mechanical amplitude. The horn 61 is usually a half-wave resonator, and its material is generally aluminum alloy, titanium alloy or steel. Here, the rotating body 62 a is attached to the tip of the horn 61.

In the case of the movable type, for example, the horizontal movement of the ultrasonic wave generator 60 is synchronized with the laser beam 41 using a servo motor horizontal movement device 63A or the like. An example of the servomotor horizontal movement device 63A is shown in FIG. A horizontal guide rail 64a is installed on the front surface of the standing plate 31 of the apparatus main body 70, and the main body of the ultrasonic wave generator 60 is attached to a mounting plate 65a attached to the movable side rail 641 of the horizontal guide rail 64a. . Then, the servomotor 68a is set on the fixed plate 66a provided on the front surface of the standing plate 31, and the feed screw portion 69a of the servomotor 68a is screwed to the moving female screw portion 67a attached to the movable side guide 641 of the horizontal guide rail 64a. It is inserted.

Next, the operation of the movable third embodiment C1 will be described. As shown in FIG. 11, the electrode band 1 is placed on the electrode band conveyance table 75, and the source side pressing and fixing member 20 a and the rotating body 62 a of the ultrasonic wave generator 60 are positioned above the cut portion of the electrode band 1. Do. From this state, the upper elevating block 72 is lowered and the feed side pressing and fixing member 20a is pressed and fixed by the resilient force of the pressing spring 21b to the triangular projecting portion 76a along the cutting line 2 of the electrode strip 1 Do.

At the same time, the rotating body 62 a of the ultrasonic wave generator 60 that has descended is located outside the cutting start point P 1 of the electrode strip 1. The focal point of the laser beam 41 of the laser emitting unit 40 is located outside the cutting start point P1 of the electrode band 1. In this state, the ultrasonic wave generator 60 is operated to vibrate the rotating body 62a, and the laser emitting unit 40 is operated to emit the laser beam 41 and moved in the direction of the cutting start point P1. When the laser beam 41 reaches the cutting start point P1, the electrode band 1 is instantaneously melted sequentially at the focal portion as described above. The rotating body 62a of the ultrasonic wave generator 60 follows the laser beam 41 in synchronization with the movement of the laser beam 41 or applies vibration to the minute melting portion 3 of the focal point at a close position to prevent refusion of the minute melting portion 3 Separate melting site 3. This enables dust-free cutting of the same electrode band 1 as described above.

Next, the fixed type C2 of the third embodiment will be described. In this case, a servomotor elevating and moving device 63B is used instead of the moving type C1 servomotor horizontal moving device 63A. In this case, since the fixed type C2 is used, the vibrating blade 62b is attached to the horn 61 instead of the rotating body 62a. The vibrating blade 62 b is attached to the tip of the horn 61 with a length that covers the entire width of the electrode band 1, and the vibrating blade 62 b vibrates by operating the ultrasonic wave generator 60.

An example of the servomotor elevating and moving apparatus 63B is shown in FIG. Guide pins 64 b are provided upright on the arms 32 provided on the front surface of the standing plate 31 of the apparatus main body 70. A movable female screw portion 67b is attached to the guide pin 64b so as to be capable of moving up and down, and a mounting plate 65b is fixed to the movable female screw portion 67b. And the main body of the ultrasonic wave generator 60 is attached to this attachment plate 65b. Then, the servomotor 68b is set on a fixed plate 66b provided on the front upper portion of the standing plate 31, and the feed screw portion 69b of the servomotor 68b is screwed into the female screw portion of the moving female screw portion 67b.

Next, the operation of the third embodiment C2 of the fixed type will be described. As shown in FIG. 12, the electrode strip 1 is placed on the electrode strip transport table 75, and the source side pressing and fixing member 20 a and the vibrating blade 62 b of the ultrasonic wave generator 60 are positioned above the cut portion of the electrode strip 1. Do. From this state, the upper elevating block 72 descends and the source side pressing and fixing member 20a presses and fixes the source side to the triangular projecting portion 76a along the cutting line 2 of the electrode strip 1 by the resilient force of the pressing spring 21b. . At the same time, the servomotor 68b is operated to lower the sound wave generator 60 so that the vibrating blade 62b lightly contacts the destination side of the electrode strip 1 along the cutting line 2 of the electrode strip 1.

As described above, the focal point of the laser beam 41 is located outside the cutting start point P1 of the electrode strip 1 in the same manner as described above. In this state, the ultrasonic wave generator 60 is operated to vibrate the vibrating blade 62b, and the laser emitting unit 40 is operated to emit the laser beam 41 and move it toward the cutting start point P1. When the laser beam 41 reaches the cutting start point P1, the electrode band 1 is instantaneously melted sequentially at the focal portion as described above. The vibrating blade 62b of the ultrasonic wave generator 60 continues to vibrate along the cutting line 2 of the electrode strip 1, so the movement of the laser beam 41 vibrates the continuously generated micro-melted portion 3 and the melted portion Separates the molten part to prevent re-fusion of the same, and is similarly cut free from dust.

In the case of cutting a rectangular electrode sheet of a predetermined size from the wide raw material electrode band 1, although not shown, the vibrating blade 62b is a square blade like a Thomson blade and the laser beam 41 is around the cutting edge. Run and cut in the same way as above. Also in this case, as described in the first embodiment A, the suction mechanism 90 can be used as a fixing means instead of the feed source side pressing and fixing member 20a.

Next, a fourth embodiment D will be described. In this case, the source side pressing and fixing member 20a and the destination side pressing of the source side electrode band transport base 75a and the destination side electrode band transport base 75b instead of the source side pressing and fixing member 20a and the destination side pressing and fixing member 20b A plurality of suction holes 90k are provided in a portion corresponding to the pressing portion of the fixing member 20b. The suction hole 90k is connected to the exhaust system, and the non-coated portion 1a of the electrode band 1 is suction fixed / released at the timing of pressing / fixing / releasing of the feed side electrode band transport table 75a and the destination side electrode band transport table 75b. It will be done. Here, although the adsorption method is shown, all materials which can be fixed and released by electrostatic adsorption or any other suitable method are included.

The present invention is not limited to the embodiments described herein, and all the same technical ideas are included.

A: first embodiment, B: second embodiment, C, C1: third embodiment, C2: modification of the third embodiment, D: fourth embodiment, P1: cutting start point, P2: cutting end point 1, 1: electrode strip, 1a: non-coated portion, 1b: coated portion, 2: cutting line, 3: melting portion, 3a, 3b: melting end, 10: blade operation mechanism, 11: blade operation portion, 11a: Servo motor, 11b: Mounting plate, 12: Blade, 12a: Cutting edge, 14: Blade guide, 14a: Guide groove, 20a: Feeding side pressing and fixing member, 20b: Delivery side pressing and fixing member, 20c: Clearance, 21: Feeding Original side guide member, 21a: guide pin, 21b: pressing spring, 21c: through hole, 21d: screw hole, 22: destination guide member, 22a: guide pin, 22b: pressing spring, 22c: through hole, 22d: screw Hole, 30: Upper pressing mechanism , 31: standing plate, 32: arm, 40: laser beam, 41: laser beam, 50: tension applying mechanism, 51: servo motor, 52: mounting plate, 53: rocking arm, 53a: rotating shaft, 54: clamping Mechanism unit 55: lift drive member 56: guide post 57: guide mechanism 57a: movable guide 57b: fixed guide 60: ultrasonic wave generator 61: horn 62: vibrating member 62a: Rotatable body, 62b: vibrating blade, 63A: servo motor horizontal moving device, 63B: servo motor vertical moving device, 64a: horizontal guide rail, 641: movable side rail, 64b: guide pin, 65a, 65b: mounting plate, 66a, 66b: fixed plate, 67a, 67b: moving female screw, 68a, 68b: servomotor, 69a, 69b: feed screw, 70: device Body 71: linear guide rail 72: upper elevating block 73: ball screw drive 75: electrode strip carrier 75a: source side electrode strip carrier 75b: destination side electrode strip carrier 75b1: body portion , 75b2: inlet portion, 75c: gap, 76a, 76b: portion projecting in a right triangle (triangular projecting portion), 77a, 77b: level difference, 78a, 78b: planar portion, 79a, 79b: lifting block, 81, 82: lower elevating mechanism, 81a, 82a: bed side elevating block, 81b, 82b; main body, 81c, 82c: self-propelled roller, 85: vertical frame, 85a: horizontal frame, 90: suction mechanism

Claims (7)

A method of cutting a long electrode strip with a laser beam,
Fix the electrode band along the cutting line of the electrode band,
The laser beam is run along the cutting line to melt the condensing position and an external force is applied to the melting site to push out the melting site, and the melting site is separated continuously while inhibiting re-fusion of the melting site. A method of laser cutting an electrode band of an electronic component, comprising cutting the electrode band. The laser cutting method of the electrode strip of the electronic component according to claim 1, wherein the external force is a pressing force, a shearing force, a tension or a vibration which separates the molten portion. A pressing and fixing member for pressing and fixing the electrode strip to the electrode strip carrier along the cutting line of the electrode strip;
A laser emitting unit for causing the emitted laser beam to travel along the cutting line and melting the condensing position of the laser beam;
A laser cutting apparatus for an electrode strip of an electronic component, comprising: a blade operating mechanism including a blade which follows a laser beam and enters a melting portion and separates one of the melting ends of the melting portion from the other. A source side pressing and fixing member and a destination side pressing and fixing member for pressing and fixing the electrode band to the electrode band conveyance base on both sides along the cutting line of the electrode band;
A laser emitting unit for causing the emitted laser beam to travel along the cutting line and melting the condensing position of the laser beam;
The tensioning mechanism is configured to move one of the original side pressing and fixing member and the destination side pressing and fixing member away from the other so that tension is applied to the portion on the penetration side of the laser beam with respect to the electrode strip. A laser cutting apparatus for an electrode band of an electronic component characterized by A feed source side pressing and fixing member for pressing and fixing the electrode band to the electrode band carrier along the cutting line of the electrode band;
A laser emitting unit for causing the emitted laser beam to travel along the cutting line and melting the condensing position of the laser beam;
The laser cutting of the electrode band of the electronic component is characterized by comprising: an ultrasonic generator which moves following the laser beam and applies vibration to the melting portion to separate one of the melting ends of the melting portion from the other. apparatus. A pressing and fixing member for pressing and fixing the electrode strip to the electrode strip carrier along the cutting line of the electrode strip;
A laser emitting unit for causing the emitted laser beam to travel along the cutting line and melting the condensing position of the laser beam;
An ultrasonic generator having a vibrating member disposed along the cutting line and in contact with the electrode band and applying vibration to the melting site to separate one of the melting ends of the melting site from the other The laser cutting device of the electrode band of the electronic component to be characterized. The laser cutting apparatus according to claim 3 is characterized in that the electrode band transport table is provided with an adsorption mechanism for adsorbing the vicinity of the cutting line of the electrode strip instead of the feed side pressing and fixing member or the destination side pressing and fixing member. Laser cutting device for the electrode band of electronic parts to be used.

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