WO2013128602A1 - Organic el device and manufacturing method therefor - Google Patents

Description

Organic EL device and manufacturing method thereof

The present invention relates to an organic EL device and a manufacturing method thereof.

A self-luminous device (organic EL device) including an organic EL element includes, for example, a display screen of a mobile phone, a monitor screen of an in-vehicle or household electronic device, an information display screen of a personal computer or a television receiver, a lighting panel for advertisement As various display devices used in various applications, as various light sources used in scanners, printers, etc., as illumination devices used in general illumination and backlights of liquid crystal display devices, etc., and as an optical communication device utilizing a photoelectric conversion function It can be used for various applications and models.

In an organic EL device, an organic EL element is disposed on a substrate, and the organic EL element is disposed in a sealing region that is hermetically sealed by a sealing member. The electrode of the organic EL element is connected to an extraction electrode drawn out of the sealing region, and the extraction electrode is connected to the driving element and the wiring board in a connection space provided at the periphery of the substrate.

In general, an ACF (Anisotropic Conductive Film) method or a eutectic method is used to connect the extraction electrode to the drive element or the wiring board. In the prior art described in Patent Document 1 below, a circuit pattern connected to an organic EL element is formed on a substrate outside a sealing member, and an IC chip mounting (COG) or flexible print is applied to the circuit pattern. It is shown that a substrate is mounted (FPC) and a resin is applied to an exposed portion of a circuit pattern.

JP 2009-289615 A

In the organic EL device, the element arrangement space where the organic EL elements on the substrate are arranged is an effective space for obtaining light emission, and the outer space is a so-called frame space where light emission cannot be obtained. When mounting an organic EL device in a limited space such as in an electronic device or an automobile, it is required to make the element arrangement space which is an effective space as large as possible and make the frame space as narrow as possible.

In addition, in a tiling-type device that obtains a large light emitting area by arranging a plurality of organic EL device units in units of a single substrate in a plane, when the frame space increases, the joint for each organic EL device unit is There is a problem that high quality such as display and illumination cannot be obtained as a whole tiling type organic EL device. For this reason, in the tiling type organic EL device, narrowing the frame to make the frame space as narrow as possible is one of the important issues.

Although the frame space in the organic EL device occupies a large proportion of the connection space described above, in order to perform the above-described COG or FPC mounting, it is necessary to secure a relatively large connection space and achieve a narrow frame. For this purpose, the fundamental connection form has been renewed.

The present invention is an example of a problem to deal with such a problem. In other words, achieving a narrow frame in an organic EL device, increasing the effective space of a single organic EL device to increase the efficiency of the mounting space, and performance quality of display and lighting in a tiling type organic EL device It is an object of the present invention to improve the above.

In order to achieve such an object, the organic EL device according to the present invention has at least the following configuration.

A substrate, one or a plurality of organic EL elements formed on the substrate, a connection terminal connected to an electrode of the organic EL element, and a linear terminal having one end electrically connected to the connection terminal; An organic EL device comprising:

An organic EL device in which a plurality of organic EL device units are arranged, wherein the organic EL device unit is provided on a substrate, one or a plurality of organic EL elements formed on the substrate, and an electrode of the organic EL element. A connection terminal to be connected; and a linear terminal that is electrically connected at one end to the connection terminal and extends along an outer peripheral side surface of the organic EL device unit; The organic EL device unit includes an outer peripheral side surface facing the outer peripheral side surface, and a connected terminal to which the linear terminal is electrically connected is disposed on the outer peripheral side surface.

BRIEF DESCRIPTION OF THE DRAWINGS It is explanatory drawing which showed the whole structure of the organic electroluminescent apparatus or organic electroluminescent apparatus unit which concerns on one Embodiment of this invention (FIG. 1 (a) is a whole perspective view, FIG.1 (b) is FIG.1 (a). XX cross-sectional view in FIG. It is explanatory drawing which showed the form of the linear terminal in embodiment of this invention. It is explanatory drawing which showed the other example of the organic EL apparatus (or organic EL apparatus unit) in embodiment of this invention. It is explanatory drawing which showed the other example of the form which concerns on embodiment of this invention, and is explanatory drawing which showed the organic EL apparatus unit mutual connection form in the organic EL apparatus of a tiling system. It is explanatory drawing which showed the manufacturing method of the organic electroluminescent apparatus concerning embodiment of this invention.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. The embodiment of the present invention includes the contents shown in the drawings, but is not limited thereto. FIG. 1 is an explanatory view showing the overall configuration of an organic EL device or an organic EL device unit according to an embodiment of the present invention (FIG. 1 (a) is an overall perspective view, and FIG. 1 (b) is FIG. (A) XX sectional view in (a)). The organic EL device 1 here can be mounted on an electronic device or the like as a single unit, and the organic EL device unit 1U includes a plurality of organic EL device units 1U arranged to form a light emitting device having a relatively large area. Can be obtained.

The organic EL device 1 or the organic EL device unit 1U includes a substrate 2, one or a plurality of organic EL elements 10 formed on the substrate 2, and an electrode (lower electrode 11 or upper electrode 13) of the organic EL element 10. A connection terminal 4 to be connected and a linear terminal 5 having one end electrically connected to the connection terminal 4 are provided. In the illustrated example, a sealing member 3 that seals the organic EL element 10 with the substrate 2 is provided. The connection terminal 4 is provided outside the sealing member 3 on the substrate 2, and one end of the connection terminal 4 is physically and electrically connected to the connection terminal 4. Further, the linear terminal 5 is extended along the outer peripheral side surface of the organic EL device 1. In the illustrated example, the linear terminal 5 extends along the outer peripheral side surface 2 </ b> S of the substrate 2.

The organic EL element 10 is laminated on the substrate 2 as shown in FIG. The organic EL element 10 includes at least a lower electrode 11, an organic layer 12, and an upper electrode 13. In the illustrated example, the lower electrode 11 is formed on the substrate 2, the organic layer 12 is formed thereon, and the upper electrode 13 is further formed thereon. Several film-forming layers may exist between them, and other layers may be laminated between the lower electrode 11, the organic layer 12, and the upper electrode 13. The organic layer 12 is composed of one light emitting layer or several functional layers for emitting light (hole injection / transport layer, light emitting layer, electron injection / transport layer, etc.). In the illustrated example, the organic EL element 10 includes an insulating film 14 that insulates the light emitting region of each organic EL element 10 on the lower electrode 11, and a partition wall 15 that is formed on the insulating film 14 and insulates the upper electrode 13. Prepare. The illustrated configuration example of the organic EL element 10 is an example, and the driving method of the organic EL element 10 in the embodiment of the present invention may be either a passive driving method or an active driving method.

In the illustrated example, the sealing member 3 is bonded to the substrate 2 via an adhesive layer 3 </ b> A and performs hollow sealing to form a sealing space 3 </ b> S that accommodates the components of the organic EL element 10. However, the present invention is not limited to this, and solid sealing (film sealing) may be performed to cover the components of the organic EL element 10 without space.

The connection terminal 4 is provided outside the sealing member 3 on the substrate 2 and is electrically connected to the lower electrode 11 or the upper electrode 13 of the organic EL element 10. In the illustrated example, the connection terminal 4 is drawn directly from the lower electrode 11 to the outside of the sealing member 3, but is connected to the lower electrode 11 and the upper electrode 13 via an auxiliary electrode and a wiring electrode. May be. Moreover, it may be connected to the lower electrode or the upper electrode via an element such as a TFT like an active matrix organic EL device.

The one end of the linear terminal 5 is physically and electrically connected to the connection terminal 4. The point connection here includes a connection area having a certain size, but the area is limited within the connection terminal 4, and the physical connection is particularly limited within the connection terminal 4. It has been shown. The other end of the linear terminal 5 is electrically opened by the linear terminal 5 alone. That is, the linear terminal 5 is not electrically connected to any terminal of the organic EL device 1 (or the organic EL device unit 1U) except that one end is point-connected to the connection terminal 4. The linear terminal 5 is connected to an external drive device connected to the organic EL device 1 or a connection terminal of another organic EL device unit connected to the organic EL device unit 1U, and the organic EL device 1 or organic EL. This is for electrically connecting the connection terminal 4 of the device unit 1U. Unlike a PDP or the like, a substrate generally used in an organic EL device is very thin, and it is very difficult to form a wiring pattern on a side surface portion of the substrate. However, by adopting the configuration of the present invention, the substrate Wiring (linear terminals) can be easily arranged on the side surface portion.

Here, the linear terminal 5 is electrically connected to the cathode (for example, the upper electrode 13) of the organic EL element 10 rather than the diameter of what is electrically connected to the anode (for example, the lower electrode 11) of the organic EL element 10. It is preferable to increase the diameter of the product. In general, the anode of the organic EL device 10 is a transparent conductive film such as ITO or IZO, and the cathode of the organic EL element 10 is a metal electrode such as Al. By increasing the diameter of the linear terminal 5 connected to the metal electrode through which more current flows, the voltage drop due to the wiring resistance can be reduced and the influence on the luminance of the organic EL element 10 can be reduced. it can.

The cross-sectional shape of the linear terminal 5 may be a similar shape such as a circle, an ellipse, an oval, a rectangle (including a rectangle and a square), a polygon, and the like.

In the organic EL device 1 or the organic EL device unit 1U having such a configuration, the connection space of the connection terminal 4 on the substrate 2 only needs to be a space for point connection with one end of the linear terminal 5. The connection space on the substrate 2 can be minimized, and the frame space of the organic EL device 1 or the organic EL device unit 1U can be narrowed.

The linear terminal 5 extends in a state of being suspended along the outer peripheral side surface 2 </ b> S of the substrate 2 in a state where one end is point-connected to the connection terminal 4 on the substrate 2. Using the arrangement state of the linear terminals 5, the linear terminals 5 are electrically connected by contacting the connected object. Specifically, the linear terminal 5 is electrically connected to the connection target by pressure contact with the outer peripheral side surface of the organic EL device 1 or the outer peripheral side surface 2S of the substrate 2. As described above, by effectively utilizing the area of the outer peripheral side surface 2S of the substrate 2 as a connection space, it is possible to effectively expand the element formation space on the upper surface of the substrate 2 and to narrow the frame portion.

FIG. 2 is an explanatory view showing a form of a linear terminal in the embodiment of the present invention. In the example shown in FIG. 2A, the linear terminal 5 is formed in a spring shape (coil shape or spiral shape). In the example shown in FIG. 2B, the linear terminal 5 has a loop shape (arc shape). According to these forms, the elastic force at the time of press-contacting the linear terminal 5 to the to-be-connected object is obtained by the elasticity of the form of the linear terminal 5, and the electrical connection can be stabilized. In the example shown in FIG. 2C, the linear terminal 5 is formed of a bundle of a plurality of wires. According to this, it is possible to stabilize the electrical connection by making it difficult for disconnection of the linear terminal 5 and expanding the connection area with the connection target.

FIG. 3 is an explanatory view showing another example of the organic EL device (or organic EL device unit) in the embodiment of the present invention. In the example shown in FIG. 3, the other end or part of the linear terminal 5 is physically fixed to the constituent elements of the organic EL device 1 (or the organic EL unit 1). An adhesive member such as an adhesive or an adhesive tape can be used for the physical fixation here. By fixing the other end or a part of the linear terminal 5, the handleability at the time of connection with the connection target is improved, and the connection work can be simplified and stabilized.

In the example shown in FIGS. 3A and 3B, the other end or a part of the linear terminal 5 is physically fixed to a part of the substrate 2. In the example shown in FIG. 3A, the other end or a part of the linear terminal 5 is physically fixed to the surface of the substrate 2 opposite to the surface having the connection terminal 4 by the adhesive member m. . In the example shown in FIG. 3B, the other end or a part of the linear terminal 5 is fixed to the outer peripheral side surface 2S of the substrate 2 with an adhesive member m, and the end side on the connection terminal 4 side on the outer peripheral side surface 2S. Further, chamfered portions 2S1 and 2S2 are formed on the side opposite to the connection terminal 4 side. Here, the part near the connection terminal 4 of the linear terminal 5 is fixed to the chamfered part 2S1, and the other end of the linear terminal 5 is fixed to the chamfered part 2S2. By providing such chamfered portions 2S1 and 2S2, even when the other end or a part of the linear terminal 5 is fixed to the outer peripheral side surface 2S of the substrate 2, the outer peripheral side surface 2S that is press-contacted to the connection target is provided. Flattening can be achieved, and damage to the linear terminal 5 at the corners of the edge of the outer peripheral side surface 2S can be avoided. Only one of the chamfered portions 2S1 and 2S2 may be provided.

In the example shown in FIG. 3C, the other end or a part of the linear terminal 5 is physically fixed to a part of the sealing member 3 with an adhesive member m. This embodiment is effective when a part of the external drive device or another organic EL device unit 1U is connected so as to contact the sealing member 3. According to this, the space on the side of the sealing member 3 vacated on the connection terminal 4 can be effectively utilized as the connection space.

FIG. 4 is an explanatory view showing another example according to the embodiment of the present invention, and is an explanatory view showing a connection form between organic EL device units in a tiling type organic EL device. FIG. 4A is a side view showing a connection form between adjacent organic EL device units, and FIGS. 4B and 4C show different form examples in the X1-X1 cross-sectional view.

The linear terminal 5 of the organic EL device unit 1U is electrically and physically connected to the connected terminal 4-1 of another organic EL device unit 1U-1 to be connected. The outer peripheral side surface 2S-1 of the substrate 2-1 of the other organic EL device unit 1U-1 faces the outer peripheral side surface 2S of the organic EL device unit 1U, and the connected terminal 4-1 is connected to the outer peripheral side surface 2S-1. Is deployed. Then, by pressing the outer peripheral side surface 2S and the outer peripheral side surface 2S-1 together, the linear terminal 5 of the organic EL device unit 1U is pressed into contact with the connected terminal 4-1 of another organic EL device unit 1U-1.

The cross-sectional view of FIG. 4B shows an example of the connected terminal 4-1. In this example, the outer peripheral side surface 2S-1 of another organic EL device unit 1U-1 to be connected includes a pair of connected terminals 4-1 that sandwich the linear terminals 5 of the organic EL device unit 1U. . When the outer peripheral side surface 2S and the outer peripheral side surface 2S-1 are pressed against each other and the linear terminal 5 is sandwiched between the pair of connected terminals 4-1, the physical and electrical connection between the linear terminal 5 and the connected terminal 4-1. Connection is made.

The sectional view of FIG. 4C shows another example of the connected terminal 4-1. Here, an example is shown in which the linear terminal 5 has the spring-like form shown in FIG. In this example, the outer peripheral side surface 2S-1 of the other organic EL device unit 1U-1 to be connected has a recess 2S3 that accommodates the linear terminal 5 of the organic EL device unit 1U. The side surface 2S-1 is pressed against each other and the linear terminal 5 is accommodated in the recess 2S3, so that the physical and electrical connection between the linear terminal 5 and the connected terminal 4-1 provided in the recess 2S3 is achieved. A connection is made. By having the form of the connection target side as shown in FIGS. 4B and 4C, it is possible to ensure a stable connection between the linear terminal 5 and the connection terminal 4-1. The configuration on the connection target side shown in FIGS. 4B and 4C is adopted not only in the other organic EL device unit 1U1 but also in the connected portion of the external connection device connected to the organic EL device 1. Can do.

FIG. 5 is an explanatory view showing a method for manufacturing an organic EL device including a step of connecting a linear terminal to a connection terminal. Here, an example in which the linear terminals 5 are formed by a wire bonding method will be described. The wire bonding method is a method established as a semiconductor terminal connection method. By adopting this method, the terminal connection of the organic EL device 1 can be formed without requiring a large connection space and realized in a short mounting time. can do.

First, as shown in FIG. 5A, after forming the organic EL element 10 on the substrate 2 and sealing the organic EL element 10 with the sealing member 3, a temporary connection process of the linear terminals 5 is performed. . In this step, the dummy terminal 6 is disposed under the outer peripheral side surface 2S of the substrate 2. The dummy terminal 6 is a metal member that is formed of a conductive metal such as Cu but does not have any electrical connection relationship with the electrode of the organic EL element 10 or other circuit configuration. By providing the dummy terminal 6, a temporary connection of the linear terminal by the wire bonding method can be performed between the connection terminal 4 and the dummy terminal 6. First bonding of one end of the linear terminal 5 and the connection terminal 4 is performed by the wire bonding method, and thereby one end of the linear terminal 5 is connected to the connection terminal 4 by point connection. Next, second bonding between the other end of the linear terminal 5 and the dummy terminal 6 is performed, and thereby the temporary connection between the linear terminal 5 and the dummy terminal 6 is made.

Next, a cutting process is performed in which the linear terminal 5 having one end connected to the connection terminal 4 and the other end temporarily connected to the dummy terminal 6 is cut at a location closer to the dummy terminal 6 side. In this cutting step, the linear terminal 5 is cut using the cutter device 8 or the like. In this cutting, a plurality of linear terminals 5 may be cut together in one step, or the individual linear terminals 5 may be cut individually. By this cutting step, the linear terminal 5 extends along the outer peripheral side surface 2S of the substrate 2 with one end connected to the connection terminal 4 and the other end being a free end.

In the subsequent process, the linear terminal 5 is fixed as necessary. This fixing is a physical fixing and no electrical connection is made. Here, the linear terminal 5 having one end connected to the connection terminal 4 and the other end cut by the cutting process is fixed to the constituent elements of the organic EL device 1 using the adhesive member 7 (7A, 7B). In the illustrated example, the physical fixing state is strengthened by covering one end of the linear terminal 5 connected to the connection terminal 4 with an adhesive member 7A. Further, the other end of the linear terminal 5 which is a free end is fixed to the surface of the substrate 2 opposite to the surface having the connection terminal 4 by the adhesive member 7B, so that the handleability at the time of connecting the linear terminal 5 is improved. Has improved.

Hereinafter, a specific configuration example of the organic EL element 10 described above will be described.

The substrate 2 is light transmissive and is formed of a base material that can support the organic EL element 10 such as glass or plastic. The transparent conductive film layer forming the lower electrode 11 is a transparent metal such as ITO (Indium Tin Oxide), IZO (Indium Zinc Oxide), zinc oxide-based transparent conductive film, SnO ₂ -based transparent conductive film, titanium dioxide-based transparent conductive film, etc. An oxide can be used.

In the case where the lower electrode 11 is patterned on a plurality of electrodes, an insulating film 14 is provided to ensure insulation between the electrodes. The insulating film 14 is made of a material such as polyimide resin, acrylic resin, silicon oxide, or silicon nitride. The insulating film 14 is formed by depositing the material of the insulating film 14 on the substrate 2 on which the lower electrode 11 is patterned, and then forming an opening for forming a light emitting region for each organic EL element 10 on the lower electrode 11. Patterning is performed. Specifically, a film is formed on the substrate 2 on which the lower electrode 11 is formed to have a predetermined coating thickness by spin coating, and an exposure process and a development process are performed using an exposure mask, whereby an organic EL element is obtained. A layer of the insulating film 14 having 10 opening pattern shapes is formed. The insulating film 14 is formed so as to fill the space between the patterns of the lower electrode 11 and partially cover the side end portion thereof, and is formed in a lattice shape when the organic EL elements 10 are arranged in a dot matrix shape.

The partition wall 15 is formed in a stripe shape in a direction intersecting the lower electrode 11 in order to form a pattern of the upper electrode 13 without using a mask or the like, or to completely electrically insulate the adjacent upper electrode 13. The Specifically, an insulating material such as a photosensitive resin is formed on the above-described insulating film 14 by spin coating or the like so as to be thicker than the total thickness of the organic layer 12 and the upper electrode 13 that form the organic EL element 10. Then, the photosensitive resin film is irradiated with ultraviolet rays or the like through a photomask having a stripe pattern intersecting with the lower electrode 11, and the development speed resulting from the difference in the exposure amount in the thickness direction of the layer is applied. By utilizing the difference, the partition wall 15 having a taper surface whose side faces downward is formed.

The organic layer 12 has a laminated structure of light emitting functional layers including a light emitting layer. When one of the lower electrode 11 and the upper electrode 13 is an anode and the other is a cathode, a hole injection layer and a hole transport are sequentially formed from the anode side. A layer, a light emitting layer, an electron transport layer, an electron injection layer, and the like are selectively formed. As the film formation of the organic layer 12, a vacuum deposition method or the like is used as a dry film formation, and coating or various printing methods are used as a wet film formation.

An example of forming the organic layer 12 will be described below. For example, first, NPB (N, N-di (naphtalence) -N, N-dipheneyl-benzidene) is formed as a hole transport layer. This hole transport layer has a function of transporting holes injected from the anode to the light emitting layer. The hole transport layer may be a single layer or a stack of two or more layers. In addition, the hole transport layer is not formed by a single material, but a single layer may be formed by a plurality of materials, and a guest material having a high charge donating (accepting) property may be formed on a host material having a high charge transport capability. Doping may be performed.

Next, a light emitting layer is formed on the hole transport layer. As an example, red (R), green (G), and blue (B) light-emitting layers are formed in respective film formation regions by using a resistance heating vapor deposition method using a coating mask. As red (R), an organic material that emits red light such as a styryl dye such as DCM1 (4- (dicyanomethylene) -2-methyl-6- (4'-dimethylaminostyryl) -4H-pyran) is used. An organic material that emits green light, such as aluminum quinolinol complex (Alq3), is used as green (G). As the blue (B), an organic material emitting blue light such as a distyryl derivative or a triazole derivative is used. Of course, other materials or a host-guest layer structure may be used, and the emission form may be a fluorescent material or a phosphorescent material.

The electron transport layer formed on the light emitting layer is formed by using various materials such as an aluminum quinolinol complex (Alq3) by various film forming methods such as resistance heating vapor deposition. The electron transport layer has a function of transporting electrons injected from the cathode to the light emitting layer. This electron transport layer may have a multilayer structure in which only one layer is stacked or two or more layers are stacked. In addition, the electron transport layer may be formed of a plurality of materials instead of a single material, and a guest material having a high charge donating (accepting) property may be formed on a host material having a high charge transport capability. It may be formed by doping.

When the upper electrode 13 formed on the organic layer 12 is a cathode, a material (metal, metal oxide, metal fluoride, alloy, etc.) having a work function smaller than that of the anode (for example, 4 eV or less) is used. Specifically, metal films such as aluminum (Al), indium (In), magnesium (Mg), amorphous semiconductors such as doped polyaniline and doped polyphenylene vinylene, Cr ₂ O ₃ , NiO , Oxides such as Mn ₂ O ₅ can be used. As the structure, a single layer structure made of a metal material, a laminated structure such as LiO ₂ / Al, or the like can be adopted.

As the sealing member 3 for sealing the organic EL element 10, a glass substrate or a metal substrate is used when performing hollow sealing. When solid sealing is performed, as an example, a single layer or a multilayer of metal, silicon oxide, nitride, or oxynitride formed by an atomic layer growth method can be used. For example, an aluminum oxide film (for example, Al ₂ O) obtained by a reaction between an alkyl metal such as TMA (trimethylaluminum), TEA (triethylaluminum), DMAH (dimethylaluminum hydride) and water, oxygen, or alcohols. ₂ , Al ₂ O ₃ film), a silicon oxide film (for example, SiO ₂ film) obtained by a reaction between a vaporized gas of a silicon-based material and a vaporized gas of water can be used.

As described above, the organic EL device 1 or the organic EL device unit 1U according to the embodiment of the present invention uses the linear terminal 5 that is point-connected to the connection terminal 4 on the substrate 2, thereby narrowing the frame. Can be realized. As a result, in the single organic EL device 1, the effective space can be expanded to increase the efficiency of the mounting space in an electronic device or the like. Further, in the organic EL device unit 1U used for the tiling method, performance quality such as display and illumination in a large area can be improved by narrowing the non-light emitting area of the joint as much as possible.

As described above, the embodiments of the present invention have been described in detail with reference to the drawings. However, the specific configuration is not limited to these embodiments, and the design can be changed without departing from the scope of the present invention. Is included in the present invention. The embodiments described in the above drawings can be combined with each other as long as there is no particular contradiction or problem in the purpose, configuration, or the like. Moreover, the description content of each figure can become independent embodiment, respectively, and embodiment of this invention is not limited to one embodiment which combined each figure.

Claims (23)

A substrate,
One or more organic EL elements formed on the substrate;
A connection terminal connected to the electrode of the organic EL element;
An organic EL device comprising: a linear terminal having one end electrically connected to the connection terminal. 2. The organic EL device according to claim 1, wherein one end of the linear terminal is physically and electrically connected to the connection terminal and extends along an outer peripheral side surface of the organic EL device. A sealing member for sealing the organic EL element with the substrate;
The organic EL device according to claim 2, wherein the connection terminal is provided outside the sealing member on the substrate. 4. The organic EL device according to claim 3, wherein the linear terminals are electrically connected by contacting a connected object. 5. The organic EL device according to claim 4, wherein the linear terminal is electrically connected to an object to be connected by pressure contact with the outer peripheral side surface. 4. The organic EL device according to claim 3, wherein the other end of the linear terminal is electrically opened by the linear terminal alone. 4. The organic EL device according to claim 3, wherein the linear terminal has a spring shape. 4. The organic EL device according to claim 3, wherein the linear terminal has a loop shape. 4. The organic EL device according to claim 3, wherein the linear terminal is a bundle of a plurality of wires. The organic EL device according to claim 6, wherein the other end or a part of the linear terminal is physically fixed to a component of the organic EL device. The organic EL device according to claim 10, wherein the other end or a part of the linear terminal is physically fixed to the substrate. 12. The organic EL device according to claim 11, wherein the other end or a part of the linear terminal is physically fixed to a surface of the substrate opposite to the surface having the connection terminal. The organic EL device according to claim 11, wherein a chamfered portion is formed on one or both of the end side on the connection terminal side and the end side opposite to the connection terminal side on the outer peripheral side surface. . The organic EL device according to claim 10, wherein the other end or a part of the linear terminal is physically fixed to a part of the sealing member. 4. The organic EL device according to claim 3, wherein the linear terminal is a wire formed by a wire bonding method. 4. The diameter of the wire terminal electrically connected to the cathode of the organic EL element is larger than the diameter of the wire terminal electrically connected to the anode of the organic EL element. Organic EL device. An organic EL device in which a plurality of organic EL device units are arranged,
The organic EL device unit is
A substrate,
One or more organic EL elements formed on the substrate;
A connection terminal connected to the electrode of the organic EL element;
One end of the organic EL device unit is electrically connected to the connection terminal and extends along the outer peripheral side surface of the organic EL device unit.
Other organic EL device units adjacent to the organic EL device unit are:
An organic EL device comprising an outer peripheral side surface facing the outer peripheral side surface, and a connected terminal to which the linear terminal is electrically connected is disposed on the outer peripheral side surface. A sealing member for sealing the organic EL element with the substrate;
The organic EL device according to claim 17, wherein the connection terminal is provided outside the sealing member on the substrate. 19. The organic EL device according to claim 18, wherein the linear terminal is electrically connected to the connected terminal by pressure contact with the outer peripheral side surface. The organic EL device according to claim 18, wherein the outer peripheral side surface of the other organic EL device unit includes a pair of connected terminals sandwiching the linear terminals. 19. The organic EL device according to claim 18, wherein the outer peripheral side surface of the other organic EL device unit has a concave portion in which the linear terminal is accommodated. An organic EL device manufacturing method in which an organic EL element is formed on a substrate and the organic EL element is sealed with a sealing member,
A connection terminal provided outside the sealing member on the substrate and connected to an electrode of the organic EL element, and a dummy terminal disposed under the outer peripheral side surface of the substrate are linearly formed by a wire bonding method. A temporary connection step of temporarily connecting with a terminal;
And a cutting step of cutting the linear terminal at a location closer to the dummy terminal side. 23. The organic EL device according to claim 22, wherein the linear terminal having one end connected to the connection terminal and the other end cut by the cutting step is fixed to a component of the organic EL device. Device manufacturing method.

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