WO2013121481A1 - ランプ及び発光装置 - Google Patents
ランプ及び発光装置 Download PDFInfo
- Publication number
- WO2013121481A1 WO2013121481A1 PCT/JP2012/007157 JP2012007157W WO2013121481A1 WO 2013121481 A1 WO2013121481 A1 WO 2013121481A1 JP 2012007157 W JP2012007157 W JP 2012007157W WO 2013121481 A1 WO2013121481 A1 WO 2013121481A1
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- WO
- WIPO (PCT)
- Prior art keywords
- support member
- head
- light
- translucent substrate
- lamp
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V7/00—Reflectors for light sources
- F21V7/04—Optical design
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
- F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/001—Arrangement of electric circuit elements in or on lighting devices the elements being electrical wires or cables
- F21V23/002—Arrangements of cables or conductors inside a lighting device, e.g. means for guiding along parts of the housing or in a pivoting arm
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V3/00—Globes; Bowls; Cover glasses
- F21V3/02—Globes; Bowls; Cover glasses characterised by the shape
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V3/00—Globes; Bowls; Cover glasses
- F21V3/04—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
- F21V3/06—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material
- F21V3/061—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material the material being glass
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V3/00—Globes; Bowls; Cover glasses
- F21V3/04—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
- F21V3/06—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material
- F21V3/062—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material the material being plastics
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Definitions
- the present invention relates to a lamp and a light emitting device that use a light emitting element such as an LED (Light Emitting Diode) as a light source, and more particularly to a technique for improving light extraction efficiency.
- a light emitting element such as an LED (Light Emitting Diode)
- Patent Documents 1 and 2 As a light bulb shaped lamp that replaces an incandescent light bulb, a lamp using an LED, which is one of semiconductor light emitting elements, as a light source (hereinafter referred to as an LED lamp) has been proposed (Patent Documents 1 and 2).
- a base a support member erected on the base, a translucent substrate mounted on the support member, mounted on the translucent substrate, and an LED
- the structure (refer nonpatent literature 1 (page 12)) provided with the light emission part containing and the globe etc. which were comprised with the transparent material is devised.
- a lamp in general, is required to improve light output without increasing the power supplied to the lamp from the viewpoint of energy saving.
- it is only necessary to improve the light extraction efficiency, which is the efficiency of light output with respect to a constant supply power.
- the cause of the decrease in the light extraction efficiency of the lamp may be the presence of light from the light emitting part toward the base.
- the light traveling from the light emitting portion toward the base is absorbed by the base when the base is made of a material having low light reflectivity, such as a resin or a metal whose light reflectivity is not approximately 100%. End up. This may reduce the light extraction efficiency.
- a lamp according to the present invention has a base, a rod-like leg portion erected on the base, the leg portion, and an upper surface and a side surface continuous to the upper surface.
- a lamp comprising: a support member including a head; a translucent substrate mounted on the upper surface of the head of the support member; and at least one light emitting unit mounted on the translucent substrate.
- the lamp is viewed from above the light emitting unit, at least a part of the light emitting unit is located in a region protruding from the upper surface of the head of the support member, and at least one of the side surfaces of the head of the support member.
- the portion is light-reflective and is formed so as to be inclined so that a dihedral angle formed with the upper surface of the head of the support member becomes an obtuse angle.
- the incident angle of the light incident on the side surface of the head becomes small.
- the reflection angle of the light incident on the side surface of the head of the support member is reduced, and the amount of light traveling toward the base can be reduced.
- a lamp with improved light extraction efficiency can be provided.
- FIG. 1 is a partially cutaway perspective view showing a structure of an LED lamp 100 according to Embodiment 1.
- FIG. FIG. 2 is a cross-sectional view taken along the line A-A ′ of the LED lamp 100 shown in FIG. 1.
- FIG. 2 is a cross-sectional view taken along line B-B ′ of the LED lamp 100 shown in FIG. 1.
- A The schematic diagram explaining the optical path of the LED lamp which concerns on a comparative example
- FIG. 6 is a partially cutaway view showing a structure of an LED lamp 200 according to Embodiment 2.
- FIG. FIG. 8 is a cross-sectional view taken along line A-A ′ of the LED lamp 200 shown in FIG. 7.
- FIG. 8 is a cross-sectional view taken along line B-B ′ of the LED lamp 200 shown in FIG. 7.
- A The schematic diagram explaining the optical path of the LED lamp which concerns on a comparative example
- FIG. 12 is a cross-sectional view taken along line A-A ′ of the LED lamp 300 shown in FIG.
- FIG. 12 is a cross-sectional view taken along the line B-B ′ of the LED lamp 300 shown in FIG. 11.
- A The perspective view which shows schematic structure of the modified example of the translucent board
- substrate and support member of the LED lamp shown in FIG. FIG. 2 is a cross-sectional view taken along line AA ′ showing a schematic configuration, and (c) a cross-sectional view taken along line BB ′ showing a schematic configuration of a modification of the translucent substrate and the support member of the LED lamp shown in FIG. is there.
- A The perspective view which shows schematic structure of the modified example of the translucent board
- FIG. 1 The modified example of the translucent board
- FIG. 2 is a cross-sectional view taken along line AA ′ showing a schematic configuration, and (c) a cross-sectional view taken along line BB ′ showing a schematic configuration of a modification of the translucent substrate and the support member of the LED lamp shown in FIG. is there.
- A The perspective view which shows schematic structure of the modified example of the translucent board
- FIG. 2 is a cross-sectional view taken along line AA ′ showing a schematic configuration, and (c) a cross-sectional view taken along line BB ′ showing a schematic configuration of a modification of the translucent substrate and the support member of the LED lamp shown in FIG. is there.
- Embodiment 1 >> 1. Overall Configuration Embodiment 1 for carrying out the present invention will be described in detail with reference to the drawings.
- LD laser diode
- the scale between each member is not necessarily unified in all figures including FIG. 1 and FIG.
- the symbol “ ⁇ ” used to indicate a numerical range includes numerical values at both ends.
- FIG. 1 is a partially cutaway perspective view showing the structure of an LED lamp according to Embodiment 1.
- FIG. FIG. 2 is a cross-sectional view of the LED lamp 100 shown in FIG.
- FIG. 3 is a cross-sectional view taken along line B-B ′ of the LED lamp 100 shown in FIG. 1.
- the upper side of the paper is above the LED lamp 100
- the lower side of the paper is below the LED lamp 100
- the horizontal direction on the paper is the side of the LED lamp 100.
- the definitions of upper, lower and side are the same.
- the LED lamp 100 includes a base composed of a case 7 and a heat radiating plate 19, a support member 11 erected on the base, a translucent substrate 2 mounted on the support member 11, and a translucent substrate 2.
- a light emitting unit 3 mounted on the base plate, a support member 11, a translucent substrate 2, and a globe 5 that accommodates the light emitting unit 3, and a base 9 connected to the globe 5 and the case 7.
- the translucent substrate 2 is made of a translucent material such as glass, alumina, sapphire, or resin. Therefore, the light emitted from the LED 3a is not only emitted upward of the LED lamp 100 but also transmitted through the translucent substrate 2 and emitted downward.
- the shape of the translucent substrate 2 is rectangular. Moreover, two through holes are formed in the translucent substrate 2.
- the through hole of the translucent substrate 2 is for inserting lead wires 4a and 4b for supplying power from the circuit unit to the LED 3a.
- the translucent substrate 2 is formed with a wiring pattern for electrically connecting the LEDs 3a, for example, connecting them in series or in parallel, or connecting them to a circuit unit (not shown).
- ⁇ Light emitting part> There are two light emitting units 3, and the shape of the light emitting unit 3 is long.
- the light emitting units 3 are arranged in parallel to each other on the translucent substrate 2.
- the light emitting unit 3 includes a plurality of LEDs 3a mounted on the upper surface of the translucent substrate 2, and a sealing body 3b that covers the LEDs 3a.
- a plurality of LEDs 3a are mounted, for example, arranged in a straight line along the longitudinal direction of the translucent substrate 2 at equal intervals.
- the number, arrangement, and the like of the LEDs 3a are appropriately determined according to the luminance required for the LED lamp 100.
- LED3a in this Embodiment uses what makes blue light emission color.
- the sealing body 3b has a function of preventing air and moisture from entering the LED 3a, and a wavelength conversion function of converting the wavelength of light emitted from the LED 3a.
- the sealing body 3b covers the LED 3a for one row.
- the sealing body 3b is made of a translucent material such as silicone resin, for example, and is mixed with phosphor particles that convert blue light into yellow light. As a result, white light mixed by blue light emitted from the LED 3a and yellow light wavelength-converted by the phosphor particles is emitted from the light emitting unit 3.
- each of the lead wires 4a and 4b is connected to the power supply terminal of the wiring pattern by the solder 4c, so that the lead wires 4a and 4b and the light emitting unit 3 are connected.
- the light emitted from the LED 3 a is transmitted through the translucent substrate 2, so that the light is emitted below the translucent substrate 2.
- the wiring pattern is also made of a light-transmitting material such as ITO, it is possible to prevent light emitted downward from the light-transmitting substrate 2 from being blocked.
- the globe 5 has a configuration similar to that of an incandescent bulb, and is, for example, an A type.
- the globe 5 has a hollow spherical portion 5a and a tubular portion 5b. There is an opening at the end of the tubular portion 5b opposite to the spherical portion 5a (the end on the lower side of the globe 5).
- the globe 5 is made of a translucent material such as a glass material, for example. In addition to the glass material, a resin material or the like may be used as the translucent material used for the globe 5.
- the base is composed of the case 7 and the heat radiating plate 19.
- the base only needs to have a function as a base for supporting the support member 11, and is not limited to this configuration, and may be composed of one member. Examples of the shape include a disk shape and a rectangular parallelepiped.
- the case 7 is made of a resin material such as polybutylene terephthalate (PBT).
- PBT polybutylene terephthalate
- the case 7 accommodates a circuit unit (not shown) inside.
- the other ends of the lead wires 4 a and 4 b are connected to the circuit unit through the through holes of the pedestal portion 13.
- the circuit unit converts commercial power received via the base 9 into power for lighting the LED 3a.
- the circuit unit includes a circuit board and various electronic components mounted on the circuit board.
- the case 7 has a function of releasing heat generated when the circuit unit accommodated therein is turned on to the outside.
- the heat radiation by the case 7 is performed by heat conduction from the case 7 to the outside air, convection by the outside air, and radiation.
- the heat radiating plate 19 has a shape in which an overhanging portion 19a is suspended from the disk.
- One through hole is formed in the center of the disk-shaped portion of the heat sink 19.
- the support member 11, the heat radiating plate 19, and the partition plate 23 are fixed by screws 21 arranged in the through holes.
- the heat radiating plate 19 As described above, there is an opening at the end of the cylindrical portion 5b of the globe 5 opposite to the spherical portion 5a (the end on the lower side of the globe 5), and this opening is blocked by the heat radiating plate 19 described later. It is. A gas, for example, air, is enclosed in the globe 5 closed by the heat radiating plate 19. Since the heat radiating plate 19 has a function as a heat radiating member, the material constituting the heat radiating plate 19 is preferably a material having high thermal conductivity, specifically, metal, resin, or the like.
- the globe 5, the heat radiating plate 19, and the case 7 are fixed with an adhesive 8.
- an adhesive 8 for example, an organic adhesive such as a resin or an inorganic adhesive can be used.
- the base 9 is attached to the opening end of the case 7 opposite to the globe 5.
- the outer periphery of the opening end on the opposite side of the globe 5 in the case 7 is a male screw, which is screwed into the base 9 so that the base 9 and the case 7 are coupled.
- the base 9 has a function of receiving power from the socket of the lighting fixture.
- die 9 is not specifically limited, For example, an Edison type is used.
- the base 9 includes a shell portion 9a having a cylindrical shape and a peripheral wall having a screw shape, and an eyelet portion 9b attached to the shell portion 9a via an insulating material.
- the shell portion 9a is connected to the circuit unit via the lead wire 4a, and the eyelet portion 9b is connected to the circuit unit via the lead wire 4b.
- the position of the light emitting unit 3 in the globe 5 is made to correspond to the filament position of the incandescent bulb.
- the light emitting unit 3 is arranged at the center position of the spherical portion 5a.
- This position is the center position of the spherical portion 5a when the globe 5 is used as a reference. Further, this position is a position where the distance from the tip of the base 9 (the end of the eyelet portion 9b) is substantially equal to the distance from the tip of the base in the incandescent light bulb to the filament.
- the support member 11 includes a pedestal portion 13, a rod-like leg portion 15 extending from the pedestal portion 13, and a head portion 17 provided on the leg portion 15. Further, the support member 11 extends from the heat radiating plate 19 toward the center portion in the globe 5.
- the support member 11 has a function as a support for the translucent substrate 2 and a function as a heat dissipation member when the LED lamp 100 emits light.
- the heat generated in the light emitting unit 3 is conducted to the heat radiating plate 19 through the translucent substrate 2 and the support member 11.
- the heat conducted by the heat sink 19 is stored in the globe 5 and released from the globe 5 to the outside of the LED lamp 100. Therefore, the material constituting the support member 11 is preferably a material with good thermal conductivity, and specifically, a metal, a resin, or the like. If the support member 11 is made of aluminum, for example, the LED lamp 100 can be reduced in weight.
- the entire light emitting unit 3 is located in a region protruding from the upper surface 17 c of the head 17 of the support member 11.
- the pedestal portion 13 includes an upper portion having a tapered cylindrical shape and a cylindrical lower portion.
- the pedestal 13 is formed with a through hole for inserting the lead wires 4a and 4b.
- a lower end portion of the leg portion 15 of the support member 11 extends from the pedestal portion 13. Further, the leg portion 15 of the support member 11 has a long and narrow bar shape in order to suppress blocking the emitted light emitted from the LED 3a and transmitted through the translucent substrate 2.
- the head 17 of the support member 11 is a rectangular parallelepiped having an upper surface 17c, a side surface connected to the upper surface 17c, and a bottom surface 17d.
- the two opposite side surfaces are inclined with respect to the LED 3a mounting surface of the translucent substrate 2, and the remaining two side surfaces are perpendicular to the LED 3a mounting surface of the translucent substrate 2.
- the inclined surface 17a which is a part of the side surface of the head 17 is inclined with respect to the LED 3a mounting surface of the translucent substrate 2.
- the dihedral angle formed between the upper surface 17c of the head 17 of the support member 11 and the inclined surface 17a of the head 17 of the support member 11 is an obtuse angle.
- the inclined surface 17 a of the head 17 of the support member 11 is parallel to the longitudinal direction of the light emitting unit 3.
- the inclined surface 17a of the head 17 of the support member 11 is a light reflecting surface.
- the light reflectivity is further improved by applying a mirror finish to the surface of the inclined surface 17a of the head 17 of the support member 11.
- a reflective film made of, for example, a metal film may be formed on the surface of the inclined surface 17a.
- the side surface 17b is not inclined with respect to the LED 3a mounting surface of the translucent substrate 2 and is vertical.
- the angle formed between the upper surface 17c of the head 17 of the support member 11 and the inclined surface 17a of the head 17 of the support member 11 is a right angle.
- the translucent substrate 2 is mounted on the upper surface 17 c of the head 17 of the support member 11. More specifically, all of the sealing body 3b is fixed by an adhesive other than the joint portion with the head portion 17 of the support member 11 in the translucent substrate. Therefore, at least a part of the light emitting unit 3 is disposed at a portion other than the portion of the translucent substrate 2 that joins the head 17 of the support member 11.
- the partition plate 23 has a disk shape having a through hole in the center, and has a shape in which an overhanging portion 23a hangs down from the disk. Further, the upper surface of the partition plate 23 is fixed with an adhesive along the lower surface of the heat radiating plate 19.
- the partition plate 23 is formed so that it is difficult to transfer heat from the light emitting unit 3 to the circuit unit accommodated in the case 7. Therefore, the material constituting the partition plate 23 is desirably a material having low thermal conductivity, and specifically, resin or the like. 3.
- Light extraction efficiency ⁇ Overall> In the LED lamp 100 according to the present embodiment, the light emitting unit 3 is provided in the globe 5 at a position corresponding to the light source position of the incandescent light bulb, for example, substantially the same position. As a result, even if the LED lamp 100 is mounted on a conventional lighting fixture with a reflector for an incandescent lamp, the light emitting section 3 is arranged at the focal position of the reflector, and the light distribution characteristics when the incandescent lamp is mounted.
- FIG. 4A is a schematic diagram for explaining the optical path of the LED lamp according to the comparative example
- FIG. 4B is a schematic diagram for explaining the optical path of the LED lamp 100 shown in FIG.
- FIGS. 4A and 4B are the same except for the shape of the head of the support member, and illustrate the optical path when light is emitted from the same portion of the translucent substrate at the same angle.
- the side surface 917a of the head portion 917 of the support member 911 is not inclined with respect to the mounting surface of the light emitting portion of the translucent substrate 902 and is vertical.
- the emitted light enters the side surface 917a at an incident angle ⁇ 1.
- the light reflected by the side surface 917a travels toward the lamp base. This is because the reflection angle of the side surface 917a is large because the incident angle from the light emitting portion to the side surface 917a is large.
- the base When the base is composed of a case having a small light reflectivity and a heat radiating plate, when light reflected by the side surface 917a is incident on the case and the heat radiating plate, the light is absorbed. On the other hand, even if the base is made of a case having a small light reflectivity and a heat radiating plate having a high light reflectivity, light reflected by the side surface 917a is absorbed into the case. In this way, the light extraction efficiency of the lamp 100 decreases due to the light traveling toward the base of the lamp 100.
- the inclined surface 17 a of the head 17 of the support member 11 is inclined with respect to the upper surface of the translucent substrate 2.
- the emitted light is incident on the inclined surface 17a at an incident angle ⁇ 2.
- the light reflected by the inclined surface 17 a travels to the side of the lamp 100.
- the inclined surface 17a of the head 17 of the support member 11 is supported from the light emitting unit 3 as compared with the case where the side surface of the head of the support member is not inclined as shown in FIG. This is because the incident angle of light on the inclined surface 17a of the head 17 of the member 11 is reduced.
- FIG. 5 is a diagram for explaining a simulation result of the LED lamp 100 shown in FIG. FIG. 5A shows an angle ⁇ (hereinafter referred to as “inclination angle ⁇ ”) formed between the upper surface 17c of the head 17 of the support member 11 and the inclined surface 17a of the head 17 of the support member 11 changed in the simulation.
- 5 (b) is a table of module luminous fluxes when the inclination angle ⁇ is 90 °, 105 °, and 120 °, and FIG.
- This configuration can provide the lamp 100 with improved light extraction efficiency. 4). Modification of Support Member
- the support member is not limited to that shown in the lamp according to the present embodiment, and may have a different structure.
- FIG. 6 is a perspective view showing a schematic configuration of a modification of the support member of the LED lamp 100 shown in FIG.
- the support member 11 may include a leg portion 15 and a head portion 17 having an upper surface 17c and a bottom surface 17d that are square and all of the four side surfaces are inclined surfaces 17a. Good. This configuration can be adopted when the translucent substrate 2 has a square shape when viewed in plan along the longitudinal direction of the support member 11. Further, since the inclined surface 17a of the head 17 can reduce the direction of the light toward the base for more light than in the first embodiment, the light extraction efficiency can be further improved.
- the support member 11 may include a leg portion 15 and a head portion 17 whose upper surface 17c and bottom surface 17d have a circular shape and whose side surfaces are all inclined surfaces 17a. Also in this configuration, as in the case of FIG. 6A, the inclined surface 17a of the head 17 can reduce the direction of the light toward the base with respect to more light than in the first embodiment. Efficiency can be improved.
- the support member 11 includes a leg portion 15 and a head portion 17 having an upper surface 17c and a bottom surface 17d that are rectangular and all of the four side surfaces are inclined surfaces 17a. Good. This configuration can be employed when the translucent substrate 2 is rectangular when viewed in plan along the longitudinal direction of the support member 11.
- the support member 11 may include a leg portion 15 and a head portion 17 whose upper surface 17c and bottom surface 17d are elliptical and all of the side surfaces are inclined surfaces 17a.
- This configuration can be adopted when the translucent substrate 2 is elliptical when viewed in plan along the longitudinal direction of the support member 11.
- the inclined surface 17a of the head 17 can reduce the direction of the light toward the base with respect to more light than in the first embodiment. Efficiency can be improved.
- FIG. 7 is a partially cutaway perspective view showing the structure of the LED lamp according to Embodiment 1.
- FIG. 8 is a cross-sectional view taken along line AA ′ of the LED lamp 200 shown in FIG.
- FIG. 9 is a sectional view taken along line BB ′ of the LED lamp 200 shown in FIG.
- the lamp 200 will be described with reference to FIGS. 7 to 9, the same reference numerals are given to the same components as those in the first embodiment, and the description thereof will be omitted.
- the LED lamp 200 according to the present embodiment is different from the LED lamp 100 according to the first embodiment in the configuration of the pedestal portion.
- Configuration The pedestal portion 213 is made of, for example, a metal such as aluminum, and the surface of the side surface of the pedestal portion 213 is mirror-finished and has light reflectivity.
- the pedestal portion 213 can be made of resin or the like other than metal.
- the surface of the side surface of the pedestal portion 213 is, for example, a mirror-finished surface or a reflection film made of a metal film or the like do it.
- all of the side surfaces of the pedestal portion 213 are inclined surfaces 213 a that are inclined with respect to the surface on which the light emitting portion 3 of the translucent substrate 2 is mounted. More specifically, the inclined surface 213a of the pedestal portion 213 is a dihedral angle formed between the upper surface 217c of the head 217 of the support member 211 and the inclined surface 213a of the pedestal portion 213 of the support member 11 that is inclined. Is inclined so that it is obtuse.
- the pedestal portion 213 is formed from above the pedestal portion 13 according to the first embodiment. 2. Effect FIG. 10A is a schematic diagram for explaining the optical path of the LED lamp according to Embodiment 1, and FIG. 10B is a schematic diagram for explaining the optical path of the LED lamp shown in FIG. FIGS. 10A and 10B are the same except for the shape of the pedestal, and illustrate the optical path when light is emitted at the same angle from the same location on the translucent substrate.
- the pedestal portion 13 when the pedestal portion 13 is not of a large taper shape, the light does not enter the side surface 13a of the pedestal portion 13 but enters the leg portion 15 of the support member 11 as it is. Thereafter, the light reflected by the leg portion 15 travels toward the lamp base. As described above, when the light travels in the direction of the lamp base, the light extraction efficiency is lower than when the light travels upward or sideward of the lamp.
- FIG. 11 is a partially cutaway perspective view showing the structure of the LED lamp according to the first modification of the first embodiment.
- FIG. 12 is a cross-sectional view taken along line AA ′ of the LED lamp 300 shown in FIG. 13 is a cross-sectional view taken along line BB ′ of the LED lamp 300 shown in FIG.
- the lamp 300 will be described with reference to FIGS. 11 to 13, the same reference numerals are given to the same components as those in the first embodiment, and the description thereof will be omitted.
- the LED lamp 300 according to this modification is different from the LED lamp 100 according to Embodiment 1 in the configuration of a light-transmitting substrate, a light emitting unit, and a support member.
- Configuration The LED lamp 300 includes a disc-shaped translucent substrate 302. Further, the sealing body 303b (light-emitting portion 303) has a curved row shape, unlike the serial sealing body 3b in the first embodiment.
- the support member 311 includes a pedestal portion 313, leg portions 315, and a head portion 317 whose upper surface and lower surface are circular and whose side surfaces are all inclined surfaces 317a. 2.
- FIG. 14A is a perspective view showing the structure of the support member in the LED lamp according to the second modification of the first embodiment.
- FIG. 14B is a cross-sectional view taken along the line AA ′ of the support member of the LED lamp 400 shown in FIG.
- FIG. 14C is a cross-sectional view of the support member of the LED lamp 400 shown in FIG.
- the same components as those in the first embodiment are denoted by the same reference numerals and description thereof is omitted.
- the LED lamp 400 in this modification is different from the LED lamp 100 according to Embodiment 1 in the configuration of the inclined surface of the head of the support member.
- the support member 411 includes a leg portion 413 and a head portion 417, similar to the support member 11 in the LED lamp 100.
- the side surfaces of the head 417 of the support member 411 two side surfaces are inclined surfaces 417a, and the remaining side surfaces are non-inclined side surfaces 417b.
- the inclined surface 417a of the head 417 is inclined with respect to the surface on which the light emitting unit 3 of the translucent substrate 2 is mounted.
- the inclined surface 417 a is a side surface parallel to the row of the light emitting units 3.
- FIG. 15A is a perspective view showing the structure of the support member in the LED lamp according to the third modification of the first embodiment.
- FIG. 15B is a cross-sectional view taken along the line AA ′ of the support member of the LED lamp 500 shown in FIG.
- FIG. 15C is a cross-sectional view of the support member of the LED lamp 500 shown in FIG.
- the same reference numerals are given to the same components as those in the first embodiment, and the description will be omitted.
- the LED lamp 500 in the present modification differs from the LED lamp 100 according to Embodiment 1 in the configuration of the translucent substrate and the support member and the fixing method of the translucent substrate and the support member.
- a through hole is formed in the approximate center of the translucent substrate 502.
- a convex portion 517 e is formed on the head 517 of the support member 511.
- An engagement structure is used for the connection between the upper surface 517 c of the head 517 of the support member 511 and the translucent substrate 502. That is, the shape of the through hole of the translucent substrate 502 and the shape of the convex portion 517e correspond to each other, and the convex portion 517e of the support member 511 is inserted (fitted) into the through hole of the translucent substrate 502.
- FIG. 16A is a perspective view showing the structure of the support member in the LED lamp according to Modification 4 of Embodiment 1.
- FIG. FIG. 16A is a perspective view showing the structure of the support member in the LED lamp according to Modification 4 of Embodiment 1.
- FIG. 16B is a cross-sectional view taken along line AA ′ of the support member of the LED lamp 600 shown in FIG.
- FIG. 16C is a cross-sectional view of the support member of the LED lamp 600 shown in FIG.
- the same components as those in the first embodiment are denoted by the same reference numerals, and description thereof is omitted.
- the LED lamp 600 according to the present modification differs from the LED lamp 100 according to Embodiment 1 in the configuration of the translucent substrate and the support member, and the fixing method of the translucent substrate and the support member.
- a through hole is formed in a region excluding the center of the translucent substrate 602.
- a convex portion 617 e is formed on the head 617 of the support member 611.
- the connection between the upper surface 617 c of the head 617 of the support member 611 and the translucent substrate 602 uses an engagement structure similar to that of the lamp 500.
- the through hole of the translucent substrate 502 is formed in a region excluding the center of the translucent substrate 602.
- FIG. 17A is a perspective view showing the structure of the support member in the LED lamp according to Modification 5 of Embodiment 1.
- FIG. 17B is a cross-sectional view taken along the line AA ′ of the support member of the LED lamp 700 shown in FIG.
- FIG. 17C is a cross-sectional view of the support member of the LED lamp 700 shown in FIG.
- the same components as those in the first embodiment are denoted by the same reference numerals, and description thereof is omitted.
- the LED lamp 700 in this modification is different from the LED lamp 100 according to Embodiment 1 in the configuration of the light-transmitting substrate and the support member.
- the light-transmitting substrate 702 has a recess 702b.
- the shape of the concave portion 702b of the translucent substrate 702 and the shape of the upper portion of the head 717 of the support member 711 correspond to each other.
- the support member 711 and the translucent substrate 702 are coupled to each other with the head portion 717 of the support member 711 in a state where the upper portion of the head portion 717 of the support member 711 is inserted (fitted) into the concave portion 702b of the translucent substrate 702.
- a thin plate (having a smaller side surface area than the upper surface area) has been described as an example.
- a thick plate may be used.
- a block shape may be used.
- the light-transmitting substrate in this specification has a pattern for mounting a semiconductor light emitting element (including an element and a surface mount type) and electrically connecting to the semiconductor light emitting element regardless of the shape, thickness, and form. It points to what you did. Therefore, the substrate may have a block shape.
- a semiconductor light emitting element including an element and a surface mount type
- the substrate may have a block shape.
- the light emitting element includes, for example, an LD (laser diode), an EL element (including an electric luminescence element, organic and inorganic), and the like. It may be. Moreover, you may use combining these, including LED.
- LD laser diode
- EL element including an electric luminescence element, organic and inorganic
- the light emission color of the LED is blue light
- the phosphor particles are described as an example of converting blue light into yellow light, but other combinations may be used.
- the LED emission color is ultraviolet light
- phosphor particles are converted into red light
- particles converted into green light and particles converted into blue light. Can be used.
- the light emission color of the LED may be mixed into white light by using three types of LED elements of red light emission, green light emission, and blue light emission. Needless to say, the color of light emitted from the light emitting unit is not limited to white, and various LEDs (including elements and surface mount types) and phosphor particles can be used depending on the application.
- the sealing body covers the plurality of LEDs mounted on the light-transmitting substrate, but the present invention is not limited to this. For example, one LED may be covered with one sealing body, or all LEDs may be covered with one sealing body.
- the phosphor particles are mixed in the sealed body.
- a phosphor layer containing the phosphor particles may be formed on the inner surface of the globe.
- a wavelength conversion member such as a fluorescent plate containing phosphor particles may be provided in the light emission direction of the LED.
- the phosphor particles are less affected by heat at the time of LED emission than when the phosphor particles are mixed in the sealed body sealing the LED. The decrease in the wavelength conversion efficiency can be reduced.
- substrate which mounted 2 rows of light emission parts was shown, the translucent board
- (2) Globe Although the example using an A type glove was explained in the above-mentioned embodiment etc., the present invention is not limited to this. For example, it may be an R, B, G type globe, or a shape that is completely different from the bulb shape of an incandescent bulb or the globe shape of a bulb-type fluorescent LED lamp.
- the globe may be transparent so that the inside can be seen, or semi-transparent so that the inside cannot be seen.
- the semi-transparent method include a method in which a diffusion layer mainly composed of calcium carbonate, silica, a white pigment, or the like is applied to the inner surface, or a treatment (for example, blasting) that makes the inner surface uneven. .
- the globe is made of glass material, it can be made of other materials. As other materials, a translucent resin, ceramic, or the like may be used.
- the case is made of a resin material, but it can be made of other materials. When a metal material is used as another material, it is necessary to ensure insulation between the base. Insulation between the base and the base can be ensured by, for example, applying an insulating layer to the outer peripheral surface of the small diameter portion of the case or performing an insulation treatment on the small diameter portion. Furthermore, it can be ensured by forming the globe side of the case from a metal material, and forming the base side of the case from a resin material, and combining the two.
- an Edison type base is used for the shape of the base, but other types, for example, pin type (specifically, G type such as GY, GX, etc.) May be used.
- the base was attached (joined) to the case by being screwed into the screw portion (small diameter portion) of the case using the female screw of the shell portion, it may be joined to the case by other methods.
- Other methods include bonding by an adhesive, bonding by caulking, bonding by press-fitting, and the like, and two or more of these methods may be combined.
- Pedestal part The shape of the pedestal part may be other than those described in the above embodiments. For example, a polyhedron such as a rectangular parallelepiped or a cube is conceivable.
- the circuit unit has only a function of supplying power to the light emitting unit, but a circuit for controlling the lighting of the LED based on a radio signal or the like is formed in the circuit unit. It is good to be.
- “lighting control” includes, for example, lighting, extinguishing, dimming, illumination color change, and the like.
- Support member In the above-described embodiment and the like, the leg portion of the support member is cylindrical, that is, the shape of the cross section perpendicular to the lamp axis is circular, but the present invention is not limited to this. For example, it may be a triangle or a polygon more than a quadrangle.
- Mounting on lighting apparatus The LED lamp described in the above embodiment can be applied to various light emitting devices. Here, as an example, a case where the LED lamp 100 according to Embodiment 1 is mounted on a lighting fixture (downlight type) will be described.
- FIG. 18 is a schematic view of a light emitting device.
- the light emitting device 801 is used by being mounted on a ceiling 802, for example, as shown in FIG.
- the light emitting device 801 includes an LED lamp (for example, the LED lamp 100 described in the first embodiment) and a lighting fixture 803 that is attached to the LED lamp 100 to be turned on / off.
- the lighting fixture 803 includes, for example, a fixture main body 805 attached to the ceiling 802 and a cover 807 attached to the fixture main body 805 and covering the LED lamp 100.
- the cover 807 is an open type here, and has a reflective film 811 on the inner surface that reflects light emitted from the LED lamp 100 in a predetermined direction (here, downward).
- the appliance body 805 is provided with a socket 809 to which the base 9 of the LED lamp 100 is attached, and electric power is supplied to the LED lamp 100 via the socket 809.
- the arrangement position of the translucent substrate 2 attached to the lighting fixture 803 is close to the arrangement position of the filament of the incandescent lamp, the emission center in the LED lamp 100 and the emission center in the incandescent lamp are close to each other.
- the whole shape of the LED lamp 100 becomes a shape similar to an incandescent bulb. Yes. Thereby, the fitting compatibility rate of the LED lamp 100 to the conventional lighting fixture which utilized the incandescent lamp can be made into about 100 [%].
- the lighting fixture here is an example.
- the lighting fixture may not have the opening-type cover 807 but may have a closed-type cover, or a posture in which the LED lamp faces sideways ( The lighting fixture may be turned on in a posture in which the central axis of the lamp is horizontal) or in an inclined posture (a posture in which the central axis of the lamp is inclined with respect to the central axis of the lighting fixture).
- the light emitting device is a direct attachment type in which the lighting fixture is mounted in a state of being in contact with the ceiling or the wall, but the light emitting device may be an embedded type in which the lighting fixture is mounted in a state of being embedded in the ceiling or the wall.
- a hanging type that is suspended from the ceiling by an electric cable of a lighting fixture may be used.
- the lighting fixture lights one LED lamp to be mounted, but a plurality of, for example, three LED lamps may be mounted.
- the pedestal portion and the support member are integrally formed, but the present invention is not limited to this.
- the lamp according to the present invention can be suitably used, for example, as a bulb-type LED lamp that replaces an incandescent bulb.
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Abstract
Description
1.全体構成
本発明を実施するための実施の形態1を、図面を参照して詳細に説明する。
2.各部構成
<透光性基板>
透光性基板2は、例えば、ガラス、アルミナ、サファイア、樹脂等の透光性を有する材料により構成されている。よって、LED3aから出射した光は、LEDランプ100の上方へ出射されるだけでなく、透光性基板2を透過して下方へも出射する。
<発光部>
発光部3は2つ存在し、発光部3の形状は長尺状である。発光部3は、透光性基板2上に互いに平行に配されている。発光部3は、透光性基板2における上面に実装された複数のLED3aと、LED3aを被覆する封止体3bとで構成される。
<グローブ>
グローブ5は、白熱電球のバルブと同じような構成であり、例えば、Aタイプである。グローブ5は、中空の球状をした球状部5aと、筒状をした筒状部5bとを有している。筒状部5bにおける球状部5aと反対側の端部(グローブ5における下方側の端部)には開口が存在する。グローブ5は、例えば、ガラス材料のような透光性材料により構成される。グローブ5に用いる透光性材料として、ガラス材料の他に、樹脂材料等を用いてもよい。
<基台>
本実施の形態では、上述したように、基台はケース7と放熱板19とで構成される。基台は、支持部材11を支える台としての機能を有すればよく、この構成に限らず、一つの部材で構成されてもよい。その形状には、例えば円盤状や直方体等がある。
<ケース>
ケース7は、例えば、ポリブチレンテレフタレート(PBT)のような樹脂材料により構成されている。ケース7は、内部に回路ユニット(不図示)を収容している。リード線4a、4bの他端は、台座部13の貫通孔を介して回路ユニットに接続されている。なお、回路ユニットは、口金9を介して受電した商業電力を、LED3a点灯用電力に変換する。回路ユニットは、回路基板と、回路基板に実装された各種の電子部品とから構成されている。
<放熱板>
放熱板19は、円盤から張り出し部19aが垂下した形状となっている。放熱板19の円盤状部分の中央には、1つの貫通孔が形成されている。支持部材11と放熱板19と仕切り板23とは、貫通孔に配されたねじ21によって固定されている。
<口金>
口金9は、ケース7におけるグローブ5と反対側の開口端部に被着されている。ケース7におけるグローブ5と反対側の開口端部の外周は雄ネジとなっており、これが口金9内にねじ込まれることにより、口金9とケース7とが結合される。
<支持部材>
支持部材11は、台座部13と、台座部13から延設された棒状の脚部15と、脚部15上に設けられた頭部17とを含む。また、支持部材11は、放熱板19からグローブ5内の中央部分に向かって延びている。
(支持部材の台座部)
台座部13は、テーパー状の円筒形状である上部と、円筒状の下部とからなる。また、台座部13には、リード線4a、4bを挿通するための貫通孔が形成されている。
(支持部材の脚部)
支持部材11の脚部15の下端部は、台座部13から延設されている。また、支持部材11の脚部15は、LED3aから出射されて透光性基板2を透過してきた出射した光を遮ることを抑制するため、細長い棒状となっている。
(支持部材の頭部)
支持部材11の頭部17は、上面17cと、上面17cに連なる側面と、底面17dとを有する直方体である。本実施の形態では、向かい合う2つの側面が透光性基板2のLED3a搭載面に対して傾斜しており、残りの2つの側面が透光性基板2のLED3a搭載面に対して垂直である。
<仕切り板>
仕切り板23は、中央に貫通孔を有する円盤状であり、円盤から張り出し部23aが垂れ下がったような形状となっている。また、仕切り板23の上面は、放熱板19の下面に沿って接着剤で固定されている。仕切り板23は、ケース7に収容された回路ユニットに発光部3からの熱を伝えにくいように形成されている。そのため、仕切り板23を構成する材料としては、熱伝導性の低い材料が望ましく、具体的には、樹脂等である。
3.光取り出し効率
<全体>
本実施の形態に係るLEDランプ100では、グローブ5内であって、白熱電球の光源位置に対応した位置、例えば略同じ位置に発光部3を設けている。これにより、LEDランプ100を従来の白熱電球用の反射鏡つきの照明器具に装着しても、反射鏡の焦点位置に発光部3が配されることとなり、白熱電球を装着した際の配光特性と近い特性を得ることができる。
<支持部材の頭部の側面が傾斜していることによる、光取り出し効率の向上>
図4(a)は比較例に係るLEDランプの光路を説明する模式図であり、図4(b)は図1に示すLEDランプ100の光路を説明する模式図である。図4(a)(b)ともに、支持部材の頭部の形状以外は同一であり、透光性基板の同じ箇所から同じ角度で光が出射する場合の光路を説明している。
<支持部材の頭部の傾斜角のシミュレーション>
図5は、図1に示すLEDランプ100のシミュレーション結果を説明するための図である。図5(a)はシミュレーションで変化させた支持部材11の頭部17の上面17cと、支持部材11の頭部17の傾斜面17aとの間でなす角度α(以下、「傾斜角α」と呼ぶ)を示す図であり、図5(b)は傾斜角αを90°、105°、120°としたときのモジュール光束の表であり、図5(c)は傾斜角αが90°のときのモジュール光束を1.000としたときの相対モジュール光束を示すグラフである。当該シミュレーションは、グローブを除くランプを3Dで想定して行った。なお、光源は透光性基板2の全部とした。
4.支持部材の変形例
支持部材は、本実施の形態に係るランプに示したものに限らず、異なる構造であってもよい。
<<実施の形態2>>
図7は、実施の形態1に係るLEDランプの構造を示す一部切り欠き斜視図である。図8は、図7に示すLEDランプ200のA-A’線矢視断面図である。図9は、図7に示すLEDランプ200のB-B’線矢視断面図である。図7から9を用いてランプ200を説明する。なお、図7から9において、実施の形態1と同様の構成には同じ符号を付し、説明を省略する。
1.構成
台座部213は、例えば、アルミニウムのような金属で構成され、台座部213の側面の表面は、鏡面加工が施され光反射性を有する。なお、台座部213は、金属以外にも樹脂等で構成でき、その場合も、台座部213の側面の表面を、例えば、鏡面加工を施した面としたり、金属膜等からなる反射膜としたりすればよい。
2.効果
図10(a)は実施の形態1に係るLEDランプの光路を説明する模式図であり、図10(b)は図7に示すLEDランプの光路を説明する模式図である。図10(a)(b)ともに、台座部の形状以外は同一であり、透光性基板の同じ箇所から同じ角度で光が出射する場合の光路を説明している。
<<変形例>>
以上、本発明の構成を上記実施の形態等に基づいて説明したが、本発明は上記実施の形態等に限られない。例えば、以下のような変形例等を挙げることができる。
<変形例1>
図11は、実施の形態1の変形例1に係るLEDランプの構造を示す一部切り欠き斜視図である。図12は、図11に示すLEDランプ300のA-A’線矢視断面図である。図13は、図11に示すLEDランプ300のB-B’線矢視断面図である。図11から13を用いてランプ300を説明する。なお、図11から図13において、実施の形態1と同様の構成には同じ符号を付し、説明を省略する。
1.構成
LEDランプ300は、円盤状の透光性基板302を備える。また、封止体303b(発光部303)は、実施の形態1における直列状の封止体3bと異なり、湾曲した列状である。支持部材311は、台座部313と、脚部315と、上面および下面が円形状であって側面の全部が傾斜面317aである頭部317とから構成されている。
2.効果
この構成では、円盤状の透光性基板302を用いても、頭部317の傾斜面317aで、発光部303から出射される光を反射させる。そのため、ランプ300の光の取り出し効率を向上できる。
<変形例2>
図14(a)は、実施の形態1の変形例2に係るLEDランプにおける支持部材の構造を示す斜視図である。図14(b)は、図14(a)に示すLEDランプ400の支持部材のA-A’線矢視断面図である。図14(c)は、図14(a)に示すLEDランプ400の支持部材のB-B’線矢視断面図である。なお、図14(a)から図14(c)において、実施の形態1と同様の構成には同じ符号を付し、説明を省略する。
1.構成
LEDランプ400において、支持部材411は、LEDランプ100における支持部材11と同じく、脚部413と頭部417とを含む。支持部材411の頭部417の側面のうち、2つの側面は傾斜面417aであり、残りの側面は傾斜していない側面417bである。頭部417の傾斜面417aは、透光性基板2の発光部3が搭載された面に対して傾斜している。傾斜面417aは、発光部3の列に平行な側面である。ここで、LEDランプ400において、頭部417の傾斜面417aの表面粗さは、頭部417の傾斜していない面417bの表面粗さよりも大きい。
2.効果
この構成でも、頭部417の傾斜面417aの表面粗さが大きいため、発光部3から入射した光の拡散性が向上し、ランプ400の配光特性が向上する。
<変形例3>
図15(a)は、実施の形態1の変形例3に係るLEDランプにおける支持部材の構造を示す斜視図である。図15(b)は、図15(a)に示すLEDランプ500の支持部材のA-A’線矢視断面図である。図15(c)は、図15(a)に示すLEDランプ500の支持部材のB-B’線矢視断面図である。なお、図15(a)から図15(c)において、実施の形態1と同様の構成には同じ符号を付し、説明を省略する。
1.構成
LEDランプ500において、透光性基板502の略中央には貫通孔が形成されている。また、支持部材511の頭部517には、凸部517eが形成されている。支持部材511の頭部517の上面517cと透光性基板502との結合には、係合構造を利用している。すなわち、透光性基板502の貫通孔の形状と凸部517eの形状とは互いに対応しており、支持部材511の凸部517eが透光性基板502の貫通孔に挿入(嵌合)された状態で、凸部517eと透光性基板502の貫通孔との間に接着剤を充填することで、支持部材511と透光性基板502とが結合される。
2.効果
この構成では、透光性基板502に形成された貫通孔と、支持部材511の頭部517に形成された凸部517eとを用いて、支持部材511と透光性基板502とを固定している。そのため、支持部材511と透光性基板502とを接着剤のみで固定するよりも、安定的に支持することができる。
<変形例4>
図16(a)は、実施の形態1の変形例4に係るLEDランプにおける支持部材の構造を示す斜視図である。図16(b)は、図16(a)に示すLEDランプ600の支持部材のA-A’線矢視断面図である。図16(c)は、図16(a)に示すLEDランプ600の支持部材のB-B’線矢視断面図である。なお、図16(a)から図16(c)において、実施の形態1と同様の構成には同じ符号を付し、説明を省略する。
1.構成
LEDランプ600において、透光性基板602の中央を除く領域には貫通孔が形成されている。また、支持部材611の頭部617には、凸部617eが形成されている。支持部材611の頭部617の上面617cと透光性基板602との結合は、ランプ500と同様の係合構造を利用している。
2.効果
この構成では、透光性基板502の貫通孔は、透光性基板602の中央を除く領域に形成されている。そのため、透光性基板602に配置される、例えばツェナーダイオードや配線等の素子を、透光性基板602の中央に配置できる。これにより、透光性基板602の設計の自由度を向上でき、例えば、透光性基板602を小型化したり、LED603aを多く配置したりすることができる。
<変形例5>
図17(a)は、実施の形態1の変形例5に係るLEDランプにおける支持部材の構造を示す斜視図である。図17(b)は、図17(a)に示すLEDランプ700の支持部材のA-A’線矢視断面図である。図17(c)は、図17(a)に示すLEDランプ700の支持部材のB-B’線矢視断面図である。なお、図17(a)から図17(c)において、実施の形態1と同様の構成には同じ符号を付し、説明を省略する。
1.構成
LEDランプ700において、透光性基板702には凹部702bが形成されている。透光性基板702の凹部702bの形状と支持部材711の頭部717の上部の形状とは互いに対応している。支持部材711と透光性基板702との結合は、支持部材711の頭部717の上部が透光性基板702の凹部702bに挿入(嵌合)された状態で、支持部材711の頭部717の上部と透光性基板702の凹部702bとの間に接着剤を充填することでなされる。
2.効果
この構成では、支持部材711と透光性基板702との接合面積が大きいため、発光部3で発生した熱をより放熱することができる。具体的には、発光部3で発生した熱を支持部材711にさらに放熱することができる。
<その他の変形例>
(1)透光性基板および発光部
(1-1)透光性基板
上記の実施の形態等では、LEDを実装する透光性を有する基板を透光性基板とし、透光性基板の片面のみにLEDが実装されていることとしたが、本発明はこれに限られない。例えば、透光性基板を非透光性基板とし、透光性基板の両面にLEDを実装することとしても、LEDからの光を下方側へ出射させることが可能である。
(1-2)発光部
上記の実施の形態等では、LEDとしてLED素子を利用した場合について説明したが、これに限られない。例えば、表面実装タイプや砲弾タイプのLEDを利用してもよい。
(1-3)封止体
上記の実施の形態では、封止体は、透光性基板上に実装された複数のLEDを被覆していたが、本発明はこれに限られない。例えば、1つのLEDを1つの封止体で被覆してもよいし、全てのLEDを1つの封止体で被覆することとしてもよい。
(2)グローブ
上記実施の形態等では、Aタイプのグローブを利用する例について説明したが、本発明はこれに限られない。例えば、R,B,Gタイプのグローブ、または白熱電球のバルブ形状や電球形蛍光LEDランプのグローブ形状と全く異なる形状であってもよい。
(3)ケース
上記の実施の形態では、ケースは樹脂材料により構成していたが、他の材料で構成することもできる。他の材料として金属材料を利用する場合には、口金との間の絶縁性を確保する必要がある。口金との間の絶縁性は、例えば、ケースの小径部の外周面に絶縁層を塗布したり、小径部に対して絶縁処理をしたりすることで確保できる。さらには、ケースのグローブ側を金属材料により構成し、ケースの口金側を樹脂材料により構成して、双方を結合することによっても確保できる。
(4)口金
上記の実施の形態等では、口金の形状について、エジソンタイプの口金を利用したが、他のタイプ、例えば、ピンタイプ(具体的にはGY、GX等のGタイプである。)を利用してもよい。
(5)台座部
台座部の形状に関して、上記の実施の形態等で説明したもの以外の形状であってもよい。例えば、直方体、立方体等の多面体が考えられる。
(6)回路ユニット
上記の実施の形態等では、回路ユニットは発光部に電力を供給する機能のみを有したが、回路ユニットに、無線信号等に基づきLEDを点灯制御させるための回路が形成されていることとしてもよい。ここでの「点灯制御」には、例えば、点灯、消灯、調光、照明色変更等が含まれる。
(7)支持部材
上記の実施の形態等では、支持部材の脚部が円柱状、すなわちランプ軸に垂直な断面の形状が円状であったが、本発明はこれに限られない。例えば、三角形、または四角形以上の多角形等であってもよい。
(8)照明器具への装着
上記の実施の形態で説明したLEDランプは、さまざまな発光装置に適用できる。ここでは、一例として、実施の形態1に係るLEDランプ100を照明器具(ダウンライトタイプである。)に装着する場合について説明する。
(9)その他
上記の実施の形態等では、台座部と支持部材とを一体で形成したが、本発明はこれに限られない。例えば、台座部と支持部材とを別個に形成し、嵌合構造、係合構造等を利用して固定することも可能である。
3 発光部
3a LED
3b 封止体
11 支持部材
13 台座部
15 脚部
17 頭部
100 ランプ
Claims (9)
- 基台と、
前記基台に立設された棒状の脚部と当該脚部上に設けられ、上面と当該上面に連なる側面を有した頭部とを含む支持部材と、
前記支持部材の頭部の前記上面に搭載された透光性基板と、
前記透光性基板に実装された少なくとも1つの発光部と、
を備えるランプであって、
前記発光部上方からランプを平面視したとき、前記発光部の少なくとも一部が、前記支持部材の頭部の前記上面からはみ出した領域に位置し、
前記支持部材の頭部の側面の少なくとも一部は、光反射性を有し、且つ、前記支持部材の頭部の前記上面との間でなす二面角が鈍角となるよう傾斜して形成されている、
ことを特徴とするランプ。 - 前記発光部は複数個存在し、且つ、各発光部の形状は長尺状であり、
前記各発光部は、前記透光性基板上に、互いに平行に配され、
前記支持部材の頭部の側面は、4つの面で構成され
前記支持部材の頭部の側面のうち傾斜している部分は、前記頭部の側面の4つの面のうち、向かい合う2つの面であり、
前記頭部の傾斜している2つの面は、前記発光部の長尺方向に平行である
ことを特徴とする請求項1に記載のランプ。 - 前記支持部材の頭部の側面のうち傾斜している部分の表面粗さは、前記支持部材の頭部の側面のうち傾斜していない部分または前記支持部材の頭部の上面および底面の表面粗さよりも大きい
ことを特徴とする請求項1に記載のランプ。 - 前記支持部材は、前記脚部と前記基台との間に台座部を含み、
前記台座部の側面の少なくとも一部は、光反射性を有し、且つ、前記支持部材の頭部の前記上面との間でなす二面角が鈍角となるよう傾斜して形成されている、
ことを特徴とする請求項1に記載のランプ。 - 前記透光性基板は円盤状であり、
前記支持部材の頭部は円錐台形状である
ことを特徴とする請求項1に記載のランプ。 - 前記透光性基板は凹部を有し、
前記支持部材の頭部の少なくとも上部は、前記透光性基板の凹部に嵌め込まれている
ことを特徴とする請求項1に記載のランプ。 - 前記透光性基板の前記支持部材の頭部に搭載される面に凹部が設けられ、
前記支持部材の頭部の前記上面には凸部が設けられ、
前記支持部材の頭部の凸部は、前記透光性基板の凹部に嵌め込まれている
ことを特徴とする請求項1に記載のランプ。 - 前記透光性基板の中央には、素子あるいは配線が設けられ、
前記透光性基板の凹部は、当該透光性基板の中央を除く領域に形成されている
ことを特徴とする請求項7に記載のランプ。 - 請求項1に記載のランプを備えた発光装置。
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013537979A JP5934947B2 (ja) | 2012-02-16 | 2012-11-08 | ランプ及び発光装置 |
| CN201290000206.9U CN203521471U (zh) | 2012-02-16 | 2012-11-08 | 灯以及发光装置 |
| US13/879,695 US20150023014A1 (en) | 2012-02-16 | 2012-11-08 | Lamp and lighting apparatus |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012031332 | 2012-02-16 | ||
| JP2012-031332 | 2012-02-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2013121481A1 true WO2013121481A1 (ja) | 2013-08-22 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/JP2012/007157 Ceased WO2013121481A1 (ja) | 2012-02-16 | 2012-11-08 | ランプ及び発光装置 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20150023014A1 (ja) |
| JP (1) | JP5934947B2 (ja) |
| CN (1) | CN203521471U (ja) |
| WO (1) | WO2013121481A1 (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9732913B2 (en) | 2014-03-13 | 2017-08-15 | Philips Lighting Holding B.V. | Filament for lighting device |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE202013000064U1 (de) * | 2013-01-04 | 2013-01-18 | Osram Gmbh | LED-Anordnung |
| US20160238199A1 (en) * | 2015-02-16 | 2016-08-18 | Gean Technology Co. Limited | Light bulb with led symbols |
| WO2021089492A1 (en) * | 2019-11-05 | 2021-05-14 | Signify Holding B.V. | A lifi device |
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| JP2007165811A (ja) * | 2005-12-16 | 2007-06-28 | Nichia Chem Ind Ltd | 発光装置 |
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| EP2672166B1 (en) * | 2010-11-04 | 2019-10-30 | Panasonic Intellectual Property Management Co., Ltd. | Light bulb shaped lamp and lighting apparatus |
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| JP2012248687A (ja) * | 2011-05-27 | 2012-12-13 | Toshiba Lighting & Technology Corp | 発光モジュール及び照明装置 |
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2012
- 2012-11-08 WO PCT/JP2012/007157 patent/WO2013121481A1/ja not_active Ceased
- 2012-11-08 US US13/879,695 patent/US20150023014A1/en not_active Abandoned
- 2012-11-08 CN CN201290000206.9U patent/CN203521471U/zh not_active Expired - Fee Related
- 2012-11-08 JP JP2013537979A patent/JP5934947B2/ja active Active
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| JP2006313717A (ja) | 2005-04-08 | 2006-11-16 | Toshiba Lighting & Technology Corp | 電球型ランプ |
| JP2010003580A (ja) | 2008-06-20 | 2010-01-07 | Sharp Corp | 連結体及び当該連結体を備える照明装置 |
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Also Published As
| Publication number | Publication date |
|---|---|
| US20150023014A1 (en) | 2015-01-22 |
| JP5934947B2 (ja) | 2016-06-15 |
| CN203521471U (zh) | 2014-04-02 |
| JPWO2013121481A1 (ja) | 2015-05-11 |
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