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WO2013119229A3 - Substrate inductive devices and methods - Google Patents

Substrate inductive devices and methods Download PDF

Info

Publication number
WO2013119229A3
WO2013119229A3 PCT/US2012/024373 US2012024373W WO2013119229A3 WO 2013119229 A3 WO2013119229 A3 WO 2013119229A3 US 2012024373 W US2012024373 W US 2012024373W WO 2013119229 A3 WO2013119229 A3 WO 2013119229A3
Authority
WO
WIPO (PCT)
Prior art keywords
methods
inductive devices
inductive device
inductive
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2012/024373
Other languages
French (fr)
Other versions
WO2013119229A2 (en
Inventor
Christopher P. Schaffer
Aurelio J. Gutierrez
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Pulse Electronics Inc
Original Assignee
Pulse Electronics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Pulse Electronics Inc filed Critical Pulse Electronics Inc
Priority to PCT/US2012/024373 priority Critical patent/WO2013119229A2/en
Publication of WO2013119229A2 publication Critical patent/WO2013119229A2/en
Publication of WO2013119229A3 publication Critical patent/WO2013119229A3/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/66—Structural association with built-in electrical component
    • H01R13/719—Structural association with built-in electrical component specially adapted for high frequency, e.g. with filters
    • H01R13/7193—Structural association with built-in electrical component specially adapted for high frequency, e.g. with filters with ferrite filters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/2804—Printed windings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/0006—Printed inductances
    • H01F17/0013—Printed inductances with stacked layers
    • H01F2017/002—Details of via holes for interconnecting the layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/2804—Printed windings
    • H01F2027/2814—Printed windings with only part of the coil or of the winding in the printed circuit board, e.g. the remaining coil or winding sections can be made of wires or sheets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R24/00—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure
    • H01R24/60—Contacts spaced along planar side wall transverse to longitudinal axis of engagement
    • H01R24/62—Sliding engagements with one side only, e.g. modular jack coupling devices
    • H01R24/64—Sliding engagements with one side only, e.g. modular jack coupling devices for high frequency, e.g. RJ 45
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/08—Magnetic details
    • H05K2201/083—Magnetic materials
    • H05K2201/086—Magnetic materials for inductive purposes, e.g. printed inductor with ferrite core

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)
  • Coils Or Transformers For Communication (AREA)

Abstract

Methods and apparatus for providing a low-cost and high-precision inductive device. In one embodiment, the inductive device comprises a substrate based inductive device which utilizes inserted conductive pins in combination with plated substrates which replace windings disposed around a magnetically permeable core. In some variations this is accomplished without a header disposed between adjacent substrates while alternative variations utilize a header. In another embodiment, the substrate inductive devices are incorporated into integrated connector modules. Methods of manufacturing and utilizing the aforementioned substrate based inductive devices and integrated connector modules are also disclosed.
PCT/US2012/024373 2012-02-08 2012-02-08 Substrate inductive devices and methods Ceased WO2013119229A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/US2012/024373 WO2013119229A2 (en) 2012-02-08 2012-02-08 Substrate inductive devices and methods

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US2012/024373 WO2013119229A2 (en) 2012-02-08 2012-02-08 Substrate inductive devices and methods

Publications (2)

Publication Number Publication Date
WO2013119229A2 WO2013119229A2 (en) 2013-08-15
WO2013119229A3 true WO2013119229A3 (en) 2014-04-17

Family

ID=48948145

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2012/024373 Ceased WO2013119229A2 (en) 2012-02-08 2012-02-08 Substrate inductive devices and methods

Country Status (1)

Country Link
WO (1) WO2013119229A2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6584849B2 (en) * 2015-07-27 2019-10-02 日置電機株式会社 Electrical component

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6193560B1 (en) * 2000-03-03 2001-02-27 Tyco Electronics Corporation Connector assembly with side-by-side terminal arrays
US20050059295A1 (en) * 2000-08-03 2005-03-17 Bel Fuse Inc. Multiport RJ connector
US20100013589A1 (en) * 2008-07-17 2010-01-21 Schaffer Christopher P Substrate inductive devices and methods
US7819699B2 (en) * 2008-07-21 2010-10-26 Hon Hai Precision Ind. Co., Ltd. Electrical connector assembly having improved substrate
US20110034081A1 (en) * 2009-08-10 2011-02-10 3M Innovative Properties Company Electrical connector system

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6193560B1 (en) * 2000-03-03 2001-02-27 Tyco Electronics Corporation Connector assembly with side-by-side terminal arrays
US20050059295A1 (en) * 2000-08-03 2005-03-17 Bel Fuse Inc. Multiport RJ connector
US20100013589A1 (en) * 2008-07-17 2010-01-21 Schaffer Christopher P Substrate inductive devices and methods
US7819699B2 (en) * 2008-07-21 2010-10-26 Hon Hai Precision Ind. Co., Ltd. Electrical connector assembly having improved substrate
US20110034081A1 (en) * 2009-08-10 2011-02-10 3M Innovative Properties Company Electrical connector system

Also Published As

Publication number Publication date
WO2013119229A2 (en) 2013-08-15

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