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WO2013118447A1 - Fluid handling apparatus and method for manufacturing same - Google Patents

Fluid handling apparatus and method for manufacturing same Download PDF

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Publication number
WO2013118447A1
WO2013118447A1 PCT/JP2013/000420 JP2013000420W WO2013118447A1 WO 2013118447 A1 WO2013118447 A1 WO 2013118447A1 JP 2013000420 W JP2013000420 W JP 2013000420W WO 2013118447 A1 WO2013118447 A1 WO 2013118447A1
Authority
WO
WIPO (PCT)
Prior art keywords
resin substrate
adhesive layer
resin
pet film
polyethylene terephthalate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2013/000420
Other languages
French (fr)
Japanese (ja)
Inventor
健 北本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Enplas Corp
Original Assignee
Enplas Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Enplas Corp filed Critical Enplas Corp
Publication of WO2013118447A1 publication Critical patent/WO2013118447A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L3/00—Containers or dishes for laboratory use, e.g. laboratory glassware; Droppers
    • B01L3/50—Containers for the purpose of retaining a material to be analysed, e.g. test tubes
    • B01L3/502—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures
    • B01L3/5027—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip
    • B01L3/502707—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip characterised by the manufacture of the container or its components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • B29C65/4805—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the type of adhesives
    • B29C65/483—Reactive adhesives, e.g. chemically curing adhesives
    • B29C65/4835—Heat curing adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • B29C65/50—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding using adhesive tape, e.g. thermoplastic tape; using threads or the like
    • B29C65/5057—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding using adhesive tape, e.g. thermoplastic tape; using threads or the like positioned between the surfaces to be joined
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
    • B29C66/112—Single lapped joints
    • B29C66/1122—Single lap to lap joints, i.e. overlap joints
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/50—General aspects of joining tubular articles; General aspects of joining long products, i.e. bars or profiled elements; General aspects of joining single elements to tubular articles, hollow articles or bars; General aspects of joining several hollow-preforms to form hollow or tubular articles
    • B29C66/51—Joining tubular articles, profiled elements or bars; Joining single elements to tubular articles, hollow articles or bars; Joining several hollow-preforms to form hollow or tubular articles
    • B29C66/53—Joining single elements to tubular articles, hollow articles or bars
    • B29C66/534—Joining single elements to open ends of tubular or hollow articles or to the ends of bars
    • B29C66/5346—Joining single elements to open ends of tubular or hollow articles or to the ends of bars said single elements being substantially flat
    • B29C66/53461—Joining single elements to open ends of tubular or hollow articles or to the ends of bars said single elements being substantially flat joining substantially flat covers and/or substantially flat bottoms to open ends of container bodies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/71—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the composition of the plastics material of the parts to be joined
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/71—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the composition of the plastics material of the parts to be joined
    • B29C66/712—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the composition of the plastics material of the parts to be joined the composition of one of the parts to be joined being different from the composition of the other part
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/73—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset
    • B29C66/731—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the intensive physical properties of the material of the parts to be joined
    • B29C66/7311—Thermal properties
    • B29C66/73117—Tg, i.e. glass transition temperature
    • B29C66/73118—Tg, i.e. glass transition temperature of different glass transition temperature, i.e. the glass transition temperature of one of the parts to be joined being different from the glass transition temperature of the other part
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/90—Measuring or controlling the joining process
    • B29C66/91—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux
    • B29C66/914—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux
    • B29C66/9141—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux by controlling or regulating the temperature
    • B29C66/91411—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux by controlling or regulating the temperature of the parts to be joined, e.g. the joining process taking the temperature of the parts to be joined into account
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/90—Measuring or controlling the joining process
    • B29C66/91—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux
    • B29C66/919—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges
    • B29C66/9192—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges in explicit relation to another variable, e.g. temperature diagrams
    • B29C66/91921—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges in explicit relation to another variable, e.g. temperature diagrams in explicit relation to another temperature, e.g. to the softening temperature or softening point, to the thermal degradation temperature or to the ambient temperature
    • B29C66/91931—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges in explicit relation to another variable, e.g. temperature diagrams in explicit relation to another temperature, e.g. to the softening temperature or softening point, to the thermal degradation temperature or to the ambient temperature in explicit relation to the fusion temperature or melting point of the material of one of the parts to be joined
    • B29C66/91935—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges in explicit relation to another variable, e.g. temperature diagrams in explicit relation to another temperature, e.g. to the softening temperature or softening point, to the thermal degradation temperature or to the ambient temperature in explicit relation to the fusion temperature or melting point of the material of one of the parts to be joined lower than said fusion temperature
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/90—Measuring or controlling the joining process
    • B29C66/91—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux
    • B29C66/919—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges
    • B29C66/9192—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges in explicit relation to another variable, e.g. temperature diagrams
    • B29C66/91921—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges in explicit relation to another variable, e.g. temperature diagrams in explicit relation to another temperature, e.g. to the softening temperature or softening point, to the thermal degradation temperature or to the ambient temperature
    • B29C66/91941—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges in explicit relation to another variable, e.g. temperature diagrams in explicit relation to another temperature, e.g. to the softening temperature or softening point, to the thermal degradation temperature or to the ambient temperature in explicit relation to Tg, i.e. the glass transition temperature, of the material of one of the parts to be joined
    • B29C66/91943—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges in explicit relation to another variable, e.g. temperature diagrams in explicit relation to another temperature, e.g. to the softening temperature or softening point, to the thermal degradation temperature or to the ambient temperature in explicit relation to Tg, i.e. the glass transition temperature, of the material of one of the parts to be joined higher than said glass transition temperature
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/90—Measuring or controlling the joining process
    • B29C66/91—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux
    • B29C66/919—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges
    • B29C66/9192—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges in explicit relation to another variable, e.g. temperature diagrams
    • B29C66/91921—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges in explicit relation to another variable, e.g. temperature diagrams in explicit relation to another temperature, e.g. to the softening temperature or softening point, to the thermal degradation temperature or to the ambient temperature
    • B29C66/91941—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges in explicit relation to another variable, e.g. temperature diagrams in explicit relation to another temperature, e.g. to the softening temperature or softening point, to the thermal degradation temperature or to the ambient temperature in explicit relation to Tg, i.e. the glass transition temperature, of the material of one of the parts to be joined
    • B29C66/91945—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges in explicit relation to another variable, e.g. temperature diagrams in explicit relation to another temperature, e.g. to the softening temperature or softening point, to the thermal degradation temperature or to the ambient temperature in explicit relation to Tg, i.e. the glass transition temperature, of the material of one of the parts to be joined lower than said glass transition temperature
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C3/00—Assembling of devices or systems from individually processed components
    • B81C3/001—Bonding of two components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L2300/00—Additional constructional details
    • B01L2300/08—Geometry, shape and general structure
    • B01L2300/0809—Geometry, shape and general structure rectangular shaped
    • B01L2300/0816—Cards, e.g. flat sample carriers usually with flow in two horizontal directions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L2300/00—Additional constructional details
    • B01L2300/08—Geometry, shape and general structure
    • B01L2300/0861—Configuration of multiple channels and/or chambers in a single devices
    • B01L2300/0877—Flow chambers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L2300/00—Additional constructional details
    • B01L2300/08—Geometry, shape and general structure
    • B01L2300/0887—Laminated structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/756—Microarticles, nanoarticles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/05—Microfluidics
    • B81B2201/058—Microfluidics not provided for in B81B2201/051 - B81B2201/054
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/03—Bonding two components
    • B81C2203/032—Gluing

Definitions

  • the present invention relates to a fluid handling apparatus used for analysis and processing of a liquid sample and a manufacturing method thereof.
  • microanalysis systems have been used in the scientific field or medical field such as biochemistry and analytical chemistry in order to perform analysis of trace amounts of substances such as proteins and nucleic acids (for example, DNA) with high accuracy and high speed.
  • a micro-channel chip having a structure in which two resin substrates are bonded together with an adhesive has been proposed as a micro-channel chip (fluid handling device) used in a micro-analysis system (see, for example, Patent Document 1).
  • a first resin substrate having a groove formed on one surface, a second resin substrate disposed on a surface of the first resin substrate on which a groove is formed, a first resin substrate, A microchannel chip having an adhesive layer that bonds two resin substrates is disclosed.
  • acrylic resin substrates having the same thickness are used as the first resin substrate and the second resin substrate.
  • acrylic resin substrates having the same thickness are used as the first resin substrate and the second resin substrate. From the viewpoint of improving the productivity and reducing the manufacturing cost, It is conceivable to use a resin film (acrylic resin film) as the two-resin substrate.
  • the acrylic resin film has a problem that defects such as scratches and fish eyes (lumps) are likely to occur.
  • this inventor examined using PET film which consists of a polyethylene terephthalate (PET) of good quality and cheap instead of an acrylic resin film.
  • PET film which consists of a polyethylene terephthalate (PET) of good quality and cheap instead of an acrylic resin film.
  • PET film which consists of a polyethylene terephthalate (PET) of good quality and cheap instead of an acrylic resin film.
  • PET film polyethylene terephthalate
  • An object of the present invention is to provide a method of manufacturing a fluid handling device capable of firmly bonding a PET film to a resin substrate without causing an adhesive to enter the flow path, and a fluid handling device obtained thereby. It is to be.
  • the fluid handling device of the present invention includes a resin substrate having a groove formed on one surface thereof, a polyethylene terephthalate film disposed on the one surface of the resin substrate and covering an opening of the groove, and the resin substrate.
  • the glass transition temperature of the resin substrate is Tg A
  • the melting point of the polyethylene terephthalate film is Tm B
  • the glass transition temperature of the adhesive layer is Tg C
  • the adhesion temperature is Tp.
  • the method of manufacturing a fluid handling device of the present invention includes a step of preparing a resin substrate having a groove formed on one surface, and a polyethylene terephthalate in which an adhesive layer containing an acrylic resin component and a urethane resin component is disposed on one surface
  • a step of preparing a film a step of disposing the polyethylene terephthalate film on the one surface of the resin substrate such that the adhesive layer is positioned between the resin substrate and the polyethylene terephthalate film, Heating the adhesive layer at a predetermined bonding temperature to bond the resin substrate and the polyethylene terephthalate film, the glass transition temperature of the resin substrate is Tg A, and the melting point of the polyethylene terephthalate film was a Tm B, the glass transition temperature of the adhesive layer and Tg C, the bonding temperature T When a, Tg C ⁇ Tp ⁇ Tg A ⁇ Tm B, meet, a configuration.
  • the present invention it is possible to provide a fluid handling apparatus in which the adhesive strength of the PET film to the resin substrate is sufficiently high while controlling the flow path shape with high accuracy.
  • FIG. 1A is a plan view of the microchannel chip of the embodiment.
  • 1B is a cross-sectional view taken along line AA shown in FIG. 1A.
  • FIG. 1C is a bottom view of the microchannel chip according to the embodiment.
  • FIG. 2A is a plan view of the resin substrate.
  • FIG. 2B is a bottom view of the resin substrate.
  • 3A and 3B are cross-sectional views showing the manufacturing process of the microchannel chip.
  • microchannel chip will be described as a representative example of the fluid handling apparatus of the present invention.
  • FIG. 1 is a diagram showing a configuration of a microchannel chip 100 according to an embodiment of the present invention.
  • FIG. 1A is a plan view of the microchannel chip 100.
  • 1B is a cross-sectional view taken along line AA shown in FIG. 1A.
  • FIG. 1C is a bottom view of the microchannel chip 100.
  • the microchannel chip 100 includes a resin substrate 120, a polyethylene terephthalate (PET) film 140, and an adhesive layer 160.
  • the microchannel chip 100 is manufactured by thermocompression bonding in a state where the resin substrate 120, the adhesive layer 160, and the PET film 140 are sequentially laminated.
  • FIG. 2A is a plan view of the resin substrate 120.
  • FIG. 2B is a bottom view of the resin substrate 120.
  • the resin substrate 120 is a transparent, substantially rectangular substrate, and includes two through holes and a groove 129 that connects these through holes.
  • the two through holes (the first through hole 121 and the second through hole 122) have a bottomed concave portion (the first concave portion 125 and the second concave portion 126) by closing one opening portion with the PET film 140.
  • the groove 129 is formed on one surface of the resin substrate 120 and communicates the first through hole 121 and the second through hole 122.
  • the opening of the groove 129 is blocked by the PET film 140, thereby forming a flow path 130 that communicates the first recess 125 and the second recess 126.
  • the thickness of the resin substrate 120 is not particularly limited, but is, for example, 1 to 10 mm.
  • shape of each through-hole is not specifically limited, For example, it is a substantially cylindrical shape.
  • diameter of each through-hole is not specifically limited, For example, it is about 2 mm.
  • the cross-sectional shape of the groove 129 is not particularly limited, but is substantially rectangular, for example.
  • the size of the groove 129 is not particularly limited. For example, the width is about 40 ⁇ m and the depth is about 25 ⁇ m.
  • the type of resin constituting the resin substrate 120 is such that the glass transition temperature (Tg A ) of the resin substrate 120 is higher than the bonding temperature (Tp) at the time of thermocompression bonding described later, and the melting point (Tm B ; 200 ° C.) of the PET film 140. If it is lower, it is not particularly limited. That is, the kind of resin constituting the resin substrate 120 only needs to satisfy the formula of Tp ⁇ Tg A ⁇ Tm B.
  • Tp the adhesion temperature
  • Examples of the type of resin constituting the resin substrate 120 include polymethyl methacrylate (PMMA), polycarbonate (PC), polyethylene terephthalate (PET), and the like.
  • the glass transition temperature (Tg A ) of PMMA used in this embodiment is about 97 ° C.
  • the glass transition temperature (Tg A ) of general PC is about 135 ° C.
  • the glass transition temperature of PET ( Tg A ) is about 70 ° C.
  • the PET film 140 is a transparent substantially rectangular PET resin film disposed on one surface of the resin substrate 120.
  • the PET film 140 is bonded to the surface of the resin substrate 120 where the groove 129 is formed via the adhesive layer 160 and covers the opening of the groove 129.
  • PET is optimal as a material for the film of the microchannel chip 100 from the viewpoint of quality and price.
  • the thickness of the PET film 140 is not particularly limited, but is about 100 ⁇ m, for example.
  • typical glass transition temperature of the resin (PET) constituting the PET film 140 (Tg B) is about 70 ° C.
  • a melting point (Tm B) is about 200 ° C..
  • the adhesive layer 160 is disposed between the resin substrate 120 and the PET film 140, and adheres the resin substrate 120 and the PET film 140 by being heated at a predetermined bonding temperature (Tp). Specifically, the adhesive layer 160 bonds the surface of the resin substrate 120 on which the groove 129 is formed (excluding the opening of the groove 129) and the PET film 140 without a gap. From the viewpoint of improving the adhesion between the resin substrate 120 and the PET film 140, the adhesive layer 160 needs to contain an acrylic resin component and a urethane resin component.
  • the bonding temperature (Tp) needs to be determined in consideration of the glass transition temperature (Tg C ) of the resin constituting the adhesive layer 160.
  • Tg C glass transition temperature of the resin constituting the adhesive layer 160
  • the glass transition temperature (Tg C ) of the resin constituting the adhesive layer 160 is 40 to 50 ° C.
  • the glass transition temperature (Tg C ) of the adhesive layer 160 can be adjusted by adding resin components having different glass transition temperatures and mixing two or more types of resin monomers having different glass transition temperatures. Then, it is possible to control by using a copolymer obtained by polymerization and adjusting the distribution ratio of the monomers as a material for the adhesive layer 160.
  • the thickness of the adhesive layer 160 is not particularly limited, but is preferably about 3 to 4 ⁇ m. When the thickness of the adhesive layer 160 is less than 3 ⁇ m, the resin substrate 120 and the PET film 140 cannot be sufficiently bonded, and the PET film 140 is easily peeled from the resin substrate 120. On the other hand, when the adhesive layer 160 exceeds 4 ⁇ m, the adhesive layer 160 may enter the flow path 130 during thermocompression bonding.
  • the adhesive layer 160 may have an acrylic resin component and a urethane resin component as a block copolymer.
  • the adhesive layer 160 may be a mixture of an acrylic resin and a urethane resin. Furthermore, a mixture of acrylic resin and urethane resin and a block copolymer may be mixed.
  • the acrylic resin component and the urethane resin component contained in the adhesive layer 160 have complementary functions, the adhesive layer 160 having both the light resistance of the acrylic resin and the chemical resistance of the urethane resin can be formed.
  • the microchannel chip 100 is manufactured by heating the adhesive layer 160 at a predetermined bonding temperature (Tp) in a state where the resin substrate 120, the adhesive layer 160, and the PET film 140 are laminated in this order. Is done.
  • the bonding temperature (Tp) for heating the adhesive layer 160 is higher than the glass transition temperature (Tg C ) of the adhesive layer 160, the glass transition temperature (Tg A ; 97 ° C.) of the resin substrate 120, and the PET film 140.
  • Tm B melting point of not particularly limited. That is, the bonding temperature may satisfy Tg C ⁇ Tp ⁇ Tg A ⁇ Tm B.
  • the bonding temperature (Tp) is higher than the glass transition temperature (Tg A ) of the resin substrate 120, the resin substrate 120 is softened during thermocompression bonding.
  • the bonding temperature (Tp) is about 90 ° C.
  • tip 100 of this invention is not specifically limited, For example, it can manufacture with the following method.
  • 3A and 3B are cross-sectional views showing the manufacturing process of the microchannel chip 100.
  • the microchannel chip 100 of the present invention includes 1) a first step of preparing a resin substrate 120, 2) a second step of preparing a PET film 140 on which an adhesive layer 160 is disposed, and 3) a resin substrate. 120 and a third step of laminating the PET film 140 on which the adhesive layer 160 is disposed, and 4) a fourth step of adhering the resin substrate 120 and the PET film 140 to each other.
  • FIG. 3A is a diagram showing a first step and a second step.
  • a resin substrate 120 is prepared.
  • a resin substrate 120 made of PMMA having two through holes and a groove 129 connecting these through holes is manufactured by injection molding.
  • a PET film 140 is prepared in which an adhesive layer 160 containing an acrylic resin component and a urethane resin component is disposed on one surface.
  • the PET film 140 may be manufactured by a melt extrusion method, a solution casting method, a calendar method, or the like, or a commercially available film may be used.
  • the method for disposing the adhesive layer 160 on the PET film 140 is not particularly limited.
  • a resin composition containing an acrylic resin component and a urethane resin component may be applied to the surface of the PET film 140 (application method), or a resin film containing an acrylic resin component and a urethane resin component may be applied to the surface of the PET film 140.
  • Lamination may be performed (lamination method).
  • the adhesive layer 160 is adjusted so that the glass transition temperature is 40 to 50 ° C.
  • FIG. 3B is a diagram showing the third step and the fourth step.
  • the PET film 140 is disposed on one surface of the resin substrate 120 so that the adhesive layer 160 is positioned between the resin substrate 120 and the PET film 140.
  • a PET film 140 in which the adhesive layer 160 faces downward is laminated on the resin substrate 120 with the surface on which the groove 129 is formed facing upward.
  • the adhesive layer 160 is heated at a predetermined bonding temperature to bond the resin substrate 120 and the PET film 140.
  • a predetermined bonding temperature For example, in a state where the adhesive layer is softened by thermocompression bonding, the PET film 140 is bonded to the resin substrate 120 to form the microchannel chip 100.
  • the thermocompression bonding is preferably performed at a temperature of about 90 ° C. for 10 seconds or more. If the time for thermocompression bonding is less than 10 seconds, the resin substrate 120 and the PET film 140 may not be sufficiently bonded.
  • the adhesive layer 160 and the PET film 140 are softened.
  • the bonding temperature is a temperature at which the adhesive layer 160 is sufficiently softened and the PET film 140 follows the surface shape of the resin substrate 120.
  • the manufacturing method of the microchannel chip 100 of the present invention includes 1) satisfying Tg C ⁇ Tp ⁇ Tg A ⁇ Tm B , and 2) the adhesive layer 160 containing the acrylic resin component and the urethane resin component. Including. Thereby, the PET film 140 can be firmly bonded to the resin substrate 120 without causing the adhesive to enter the flow path.
  • the microchannel chip 100 of the present invention manufactured as described above has high accuracy and high strength, the sample does not leak from the channel 130, and the sample can be analyzed with high accuracy.
  • the resin substrate shown in FIG. 2 was produced by injection molding using polymethyl methacrylate (PMMA) as a material.
  • the diameter of the through hole is 2 mm.
  • the width of the groove is 40 ⁇ m, and the depth of the groove is 25 ⁇ m.
  • a PET film (thickness: 100 ⁇ m) on which an adhesive layer containing a resin shown in Table 1 was formed was prepared.
  • the PET film was laminated on the resin substrate so that the surface on which the groove of the resin substrate was formed and the surface on which the adhesive layer was disposed were opposed to each other.
  • a microchannel chip was manufactured by thermocompression bonding at 90 ° C. for 10 seconds to adhere the PET film to the resin substrate.
  • the glass transition temperature (Tg A ) of the resin substrate (PMMA) is 97 ° C.
  • the melting point (Tm B ) of the PET film is 200 ° C.
  • the glass transition temperature (Tg C ) of the adhesive layer is 40 to 50 ° C.
  • the bonding temperature (Tp) during thermocompression bonding is 90 ° C. Therefore, even when any of the above adhesive layers is formed, Tg C ⁇ Tp ⁇ Tg A ⁇ Tm B is satisfied.
  • microchannel chip For each microchannel chip, the adhesive strength of the PET film to the resin substrate and the channel shape were evaluated.
  • Results Table 2 shows the evaluation results of the adhesive strength and the channel shape for each microchannel chip.
  • the microchannel chip of the present invention is excellent in the adhesive strength between the resin substrate and the PET film and the accuracy of the channel shape.
  • microchannel chip of the present invention is useful as a microchannel chip used in, for example, the scientific field and the medical field.

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Description

流体取扱装置およびその製造方法Fluid handling apparatus and manufacturing method thereof

　本発明は、液体試料の分析や処理などに用いられる流体取扱装置およびその製造方法に関する。 The present invention relates to a fluid handling apparatus used for analysis and processing of a liquid sample and a manufacturing method thereof.

　近年、生化学や分析化学などの科学分野または医学分野において、タンパク質や核酸（例えばＤＮＡ）などの微量な物質の分析を高精度かつ高速に行うために、マイクロ分析システムが使用されている。 In recent years, microanalysis systems have been used in the scientific field or medical field such as biochemistry and analytical chemistry in order to perform analysis of trace amounts of substances such as proteins and nucleic acids (for example, DNA) with high accuracy and high speed.

　マイクロ分析システムに用いるマイクロ流路チップ（流体取扱装置）として、２枚の樹脂基板を接着剤で貼り合わせた構造のマイクロ流路チップが提案されている（例えば、特許文献１参照）。特許文献１には、一方の面に溝が形成された第１樹脂基板と、第１樹脂基板の溝が形成されている面上に配置された第２樹脂基板と、第１樹脂基板と第２樹脂基板とを接着する接着剤層とを有するマイクロ流路チップが開示されている。特許文献１のマイクロ流路チップでは、第１樹脂基板および第２樹脂基板として、同一の厚さのアクリル樹脂基板を使用している。 A micro-channel chip having a structure in which two resin substrates are bonded together with an adhesive has been proposed as a micro-channel chip (fluid handling device) used in a micro-analysis system (see, for example, Patent Document 1). In Patent Document 1, a first resin substrate having a groove formed on one surface, a second resin substrate disposed on a surface of the first resin substrate on which a groove is formed, a first resin substrate, A microchannel chip having an adhesive layer that bonds two resin substrates is disclosed. In the microchannel chip of Patent Document 1, acrylic resin substrates having the same thickness are used as the first resin substrate and the second resin substrate.

特開２０００－２４８０７６号公報JP 2000-248076 A

　特許文献１のマイクロ流路チップでは、第１樹脂基板および第２樹脂基板として、同一の厚さのアクリル樹脂基板を使用しているが、製造性の向上および製造コストの低減の観点から、第２樹脂基板として樹脂フィルム（アクリル樹脂フィルム）を使用することが考えられる。 In the microchannel chip of Patent Document 1, acrylic resin substrates having the same thickness are used as the first resin substrate and the second resin substrate. From the viewpoint of improving the productivity and reducing the manufacturing cost, It is conceivable to use a resin film (acrylic resin film) as the two-resin substrate.

　しかしながら、アクリル樹脂フィルムは、傷やフィッシュアイ（塊）などの欠陥が生じやすいという問題がある。そこで、本発明者は、アクリル樹脂フィルムの代わりに、良品質で安価なポリエチレンテレフタレート（ＰＥＴ）からなるＰＥＴフィルムを使用することを検討した。ところが、従来の製造方法によりＰＥＴフィルムを用いて流体取扱装置を製造したところ、ＰＥＴフィルムと樹脂基板との接着強度が不十分であったり、溝に接着剤が入り込んで流路が狭くなってしまったりして、高精度かつ高強度の流体取扱装置を効率よく製造することができなかった。 However, the acrylic resin film has a problem that defects such as scratches and fish eyes (lumps) are likely to occur. Then, this inventor examined using PET film which consists of a polyethylene terephthalate (PET) of good quality and cheap instead of an acrylic resin film. However, when a fluid handling device is manufactured using a PET film by a conventional manufacturing method, the adhesive strength between the PET film and the resin substrate is insufficient, or an adhesive enters the groove and the flow path becomes narrow. As a result, it was not possible to efficiently manufacture a fluid handling device with high accuracy and high strength.

　本発明の目的は、流路に接着剤を入り込ませることなく、かつ樹脂基板に対してＰＥＴフィルムを強固に接着することができる流体取扱装置の製造方法、およびそれにより得られる流体取扱装置を提供することである。 An object of the present invention is to provide a method of manufacturing a fluid handling device capable of firmly bonding a PET film to a resin substrate without causing an adhesive to enter the flow path, and a fluid handling device obtained thereby. It is to be.

　本発明の流体取扱装置は、一方の面に溝が形成された樹脂基板と、前記樹脂基板の前記一方の面上に配置され、前記溝の開口部を覆うポリエチレンテレフタレートフィルムと、前記樹脂基板と前記ポリエチレンテレフタレートフィルムの間に配置され、アクリル樹脂成分およびウレタン樹脂成分を含む接着剤層とを有し、前記樹脂基板および前記ポリエチレンテレフタレートフィルムは、前記接着剤層を所定の接着温度で加熱することで互いに接着されており、前記樹脂基板のガラス転移温度をＴｇＡとし、前記ポリエチレンテレフタレートフィルムの融点をＴｍＢとし、前記接着剤層のガラス転移温度をＴｇＣとし、前記接着温度をＴｐとしたとき、ＴｇＣ＜Ｔｐ＜ＴｇＡ＜ＴｍＢ、を満たす、構成を採る。 The fluid handling device of the present invention includes a resin substrate having a groove formed on one surface thereof, a polyethylene terephthalate film disposed on the one surface of the resin substrate and covering an opening of the groove, and the resin substrate. An adhesive layer that is disposed between the polyethylene terephthalate film and includes an acrylic resin component and a urethane resin component, and the resin substrate and the polyethylene terephthalate film heat the adhesive layer at a predetermined bonding temperature. The glass transition temperature of the resin substrate is Tg A , the melting point of the polyethylene terephthalate film is Tm B , the glass transition temperature of the adhesive layer is Tg C , and the adhesion temperature is Tp. When Tg C <Tp <Tg A <Tm B is satisfied.

　本発明の流体取扱装置の製造方法は、一方の面に溝が形成された樹脂基板を準備する工程と、一方の面にアクリル樹脂成分およびウレタン樹脂成分を含む接着剤層が配置されたポリエチレンテレフタレートフィルムを準備する工程と、前記樹脂基板の前記一方の面上に、前記接着剤層が前記樹脂基板と前記ポリエチレンテレフタレートフィルムとの間に位置するように前記ポリエチレンテレフタレートフィルムを配置する工程と、前記接着剤層を所定の接着温度で加熱して、前記樹脂基板と前記ポリエチレンテレフタレートフィルムとを接着する工程と、を有し、前記樹脂基板のガラス転移温度をＴｇＡとし、前記ポリエチレンテレフタレートフィルムの融点をＴｍＢとし、前記接着剤層のガラス転移温度をＴｇＣとし、前記接着温度をＴｐとしたとき、ＴｇＣ＜Ｔｐ＜ＴｇＡ＜ＴｍＢ、を満たす、構成を採る。 The method of manufacturing a fluid handling device of the present invention includes a step of preparing a resin substrate having a groove formed on one surface, and a polyethylene terephthalate in which an adhesive layer containing an acrylic resin component and a urethane resin component is disposed on one surface A step of preparing a film, a step of disposing the polyethylene terephthalate film on the one surface of the resin substrate such that the adhesive layer is positioned between the resin substrate and the polyethylene terephthalate film, Heating the adhesive layer at a predetermined bonding temperature to bond the resin substrate and the polyethylene terephthalate film, the glass transition temperature of the resin substrate is Tg A, and the melting point of the polyethylene terephthalate film was a Tm B, the glass transition temperature of the adhesive layer and Tg C, the bonding temperature T When a, Tg C <Tp <Tg A <Tm B, meet, a configuration.

　本発明によれば、流路形状を高精度に制御しつつ、樹脂基板に対するＰＥＴフィルムの接着強度が十分に高い流体取扱装置を提供することができる。 According to the present invention, it is possible to provide a fluid handling apparatus in which the adhesive strength of the PET film to the resin substrate is sufficiently high while controlling the flow path shape with high accuracy.

図１Ａは、実施の形態のマイクロ流路チップの平面図である。図１Ｂは、図１Ａに示すＡ－Ａ線の断面図である。図１Ｃは、実施の形態のマイクロ流路チップの底面図である。FIG. 1A is a plan view of the microchannel chip of the embodiment. 1B is a cross-sectional view taken along line AA shown in FIG. 1A. FIG. 1C is a bottom view of the microchannel chip according to the embodiment. 図２Ａは、樹脂基板の平面図である。図２Ｂは、樹脂基板の底面図である。FIG. 2A is a plan view of the resin substrate. FIG. 2B is a bottom view of the resin substrate. 図３Ａ，Ｂは、マイクロ流路チップの製造工程を示す断面図である。3A and 3B are cross-sectional views showing the manufacturing process of the microchannel chip.

　以下、本発明の実施の形態について、図面を参照して詳細に説明する。以下の説明では、本発明の流体取扱装置の代表例として「マイクロ流路チップ」について説明する。 Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In the following description, a “microchannel chip” will be described as a representative example of the fluid handling apparatus of the present invention.

　［マイクロ流路チップの構成］
　図１は、本発明の一実施の形態に係るマイクロ流路チップ１００の構成を示す図である。図１Ａは、マイクロ流路チップ１００の平面図である。図１Ｂは、図１Ａに示すＡ－Ａ線の断面図である。図１Ｃは、マイクロ流路チップ１００の底面図である。 [Configuration of microchannel chip]
FIG. 1 is a diagram showing a configuration of a microchannel chip 100 according to an embodiment of the present invention. FIG. 1A is a plan view of the microchannel chip 100. 1B is a cross-sectional view taken along line AA shown in FIG. 1A. FIG. 1C is a bottom view of the microchannel chip 100.

　図１に示されるように、マイクロ流路チップ１００は、樹脂基板１２０、ポリエチレンテレフタレート（ＰＥＴ）フィルム１４０および接着剤層１６０を有する。マイクロ流路チップ１００は、樹脂基板１２０、接着剤層１６０およびＰＥＴフィルム１４０を順番に積層した状態で、熱圧着することで作製される。 As shown in FIG. 1, the microchannel chip 100 includes a resin substrate 120, a polyethylene terephthalate (PET) film 140, and an adhesive layer 160. The microchannel chip 100 is manufactured by thermocompression bonding in a state where the resin substrate 120, the adhesive layer 160, and the PET film 140 are sequentially laminated.

　図２Ａは、樹脂基板１２０の平面図である。図２Ｂは、樹脂基板１２０の底面図である。図２に示されるように、樹脂基板１２０は、透明な略矩形の基板であり、２つの貫通孔と、これらの貫通孔を繋ぐ溝１２９とを有する。２つの貫通孔（第１貫通孔１２１および第２貫通孔１２２）は、ＰＥＴフィルム１４０により一方の開口部が閉塞されることで、有底の凹部（第１凹部１２５および第２凹部１２６）となる。溝１２９は、樹脂基板１２０の一方の面に形成され、第１貫通孔１２１および第２貫通孔１２２を連通する。溝１２９は、ＰＥＴフィルム１４０によりその開口部が閉塞されることで、第１凹部１２５および第２凹部１２６を連通する流路１３０となる。 FIG. 2A is a plan view of the resin substrate 120. FIG. 2B is a bottom view of the resin substrate 120. As illustrated in FIG. 2, the resin substrate 120 is a transparent, substantially rectangular substrate, and includes two through holes and a groove 129 that connects these through holes. The two through holes (the first through hole 121 and the second through hole 122) have a bottomed concave portion (the first concave portion 125 and the second concave portion 126) by closing one opening portion with the PET film 140. Become. The groove 129 is formed on one surface of the resin substrate 120 and communicates the first through hole 121 and the second through hole 122. The opening of the groove 129 is blocked by the PET film 140, thereby forming a flow path 130 that communicates the first recess 125 and the second recess 126.

　樹脂基板１２０の厚さは、特に限定されないが、例えば１～１０ｍｍである。各貫通孔の形状は、特に限定されないが、例えば略円柱状である。各貫通孔の直径は、特に限定されないが、例えば２ｍｍ程度である。溝１２９の断面形状は、特に限定されないが、例えば略矩形である。溝１２９の大きさは、特に限定されないが、例えば幅が４０μｍ程度であり、深さが２５μｍ程度である。 The thickness of the resin substrate 120 is not particularly limited, but is, for example, 1 to 10 mm. Although the shape of each through-hole is not specifically limited, For example, it is a substantially cylindrical shape. Although the diameter of each through-hole is not specifically limited, For example, it is about 2 mm. The cross-sectional shape of the groove 129 is not particularly limited, but is substantially rectangular, for example. The size of the groove 129 is not particularly limited. For example, the width is about 40 μm and the depth is about 25 μm.

　樹脂基板１２０を構成する樹脂の種類は、樹脂基板１２０のガラス転移温度（ＴｇＡ）が後述する熱圧着時の接着温度（Ｔｐ）より高く、かつＰＥＴフィルム１４０の融点（ＴｍＢ；２００℃）より低ければ、特に限定されない。すなわち、樹脂基板１２０を構成する樹脂の種類は、Ｔｐ＜ＴｇＡ＜ＴｍＢの式を満たすようなものであればよい。樹脂基板１２０のガラス転移温度（ＴｇＡ）が、接着温度（Ｔｐ）より低い場合、熱圧着時に樹脂基板１２０が軟化して、流路形状が崩れてしまう。樹脂基板１２０を構成する樹脂の種類の例には、ポリメタクリル酸メチル（ＰＭＭＡ）、ポリカーボネート（ＰＣ）、ポリエチレンテレフタレート（ＰＥＴ）などが含まれる。なお、本実施の形態で用いたＰＭＭＡのガラス転移温度（ＴｇＡ）は約９７℃であり、一般的なＰＣのガラス転移温度（ＴｇＡ）は約１３５℃であり、ＰＥＴのガラス転移温度（ＴｇＡ）は約７０℃である。 The type of resin constituting the resin substrate 120 is such that the glass transition temperature (Tg A ) of the resin substrate 120 is higher than the bonding temperature (Tp) at the time of thermocompression bonding described later, and the melting point (Tm B ; 200 ° C.) of the PET film 140. If it is lower, it is not particularly limited. That is, the kind of resin constituting the resin substrate 120 only needs to satisfy the formula of Tp <Tg A <Tm B. When the glass transition temperature (Tg A ) of the resin substrate 120 is lower than the adhesion temperature (Tp), the resin substrate 120 is softened at the time of thermocompression bonding, and the flow path shape is collapsed. Examples of the type of resin constituting the resin substrate 120 include polymethyl methacrylate (PMMA), polycarbonate (PC), polyethylene terephthalate (PET), and the like. The glass transition temperature (Tg A ) of PMMA used in this embodiment is about 97 ° C., the glass transition temperature (Tg A ) of general PC is about 135 ° C., and the glass transition temperature of PET ( Tg A ) is about 70 ° C.

　ＰＥＴフィルム１４０は、樹脂基板１２０の一方の面上に配置された、透明な略矩形のＰＥＴ製の樹脂フィルムである。たとえば、ＰＥＴフィルム１４０は、接着剤層１６０を介して樹脂基板１２０の溝１２９が形成されている面に接着されており、溝１２９の開口部を覆う。ＰＥＴは、品質および価格の観点から、マイクロ流路チップ１００のフィルムの材料として最適である。ＰＥＴフィルム１４０の厚さは、特に限定されないが、例えば１００μｍ程度である。なお、ＰＥＴフィルム１４０を構成する樹脂（ＰＥＴ）の一般的なガラス転移温度（ＴｇＢ）は約７０℃であり、融点（ＴｍＢ）は約２００℃である。 The PET film 140 is a transparent substantially rectangular PET resin film disposed on one surface of the resin substrate 120. For example, the PET film 140 is bonded to the surface of the resin substrate 120 where the groove 129 is formed via the adhesive layer 160 and covers the opening of the groove 129. PET is optimal as a material for the film of the microchannel chip 100 from the viewpoint of quality and price. The thickness of the PET film 140 is not particularly limited, but is about 100 μm, for example. Incidentally, typical glass transition temperature of the resin (PET) constituting the PET film 140 (Tg B) is about 70 ° C., a melting point (Tm B) is about 200 ° C..

　接着剤層１６０は、樹脂基板１２０とＰＥＴフィルム１４０との間に配置されており、所定の接着温度（Ｔｐ）で加熱されることにより樹脂基板１２０とＰＥＴフィルム１４０を接着する。具体的には、接着剤層１６０は、樹脂基板１２０の溝１２９が形成された面（溝１２９の開口部を除く）とＰＥＴフィルム１４０を隙間なく接着する。接着剤層１６０は、樹脂基板１２０とＰＥＴフィルム１４０の密着性向上の観点から、アクリル樹脂成分とウレタン樹脂成分を含むことが必要である。 The adhesive layer 160 is disposed between the resin substrate 120 and the PET film 140, and adheres the resin substrate 120 and the PET film 140 by being heated at a predetermined bonding temperature (Tp). Specifically, the adhesive layer 160 bonds the surface of the resin substrate 120 on which the groove 129 is formed (excluding the opening of the groove 129) and the PET film 140 without a gap. From the viewpoint of improving the adhesion between the resin substrate 120 and the PET film 140, the adhesive layer 160 needs to contain an acrylic resin component and a urethane resin component.

　接着温度（Ｔｐ）は、接着剤層１６０を構成する樹脂のガラス転移温度（ＴｇＣ）を考慮して決める必要がある。接着剤層１６０のガラス転移温度（ＴｇＣ）が、接着温度（Ｔｐ）よりも低い場合、樹脂基板１２０にＰＥＴフィルム１４０を適切に接着することができない。たとえば、本発明において、接着剤層１６０を構成する樹脂のガラス転移温度（ＴｇＣ）は４０～５０℃である。 The bonding temperature (Tp) needs to be determined in consideration of the glass transition temperature (Tg C ) of the resin constituting the adhesive layer 160. When the glass transition temperature (Tg C ) of the adhesive layer 160 is lower than the bonding temperature (Tp), the PET film 140 cannot be properly bonded to the resin substrate 120. For example, in the present invention, the glass transition temperature (Tg C ) of the resin constituting the adhesive layer 160 is 40 to 50 ° C.

　接着剤層１６０のガラス転移温度（ＴｇＣ）は、ガラス転移温度の異なる樹脂成分を添加して、その添加量を調整したり、ガラス転移温度の異なる２種類以上の樹脂の単量体を混合して重合し、その単量体の配分比を調整した共重合体を接着剤層１６０の材料にしたりすることで制御することができる。 The glass transition temperature (Tg C ) of the adhesive layer 160 can be adjusted by adding resin components having different glass transition temperatures and mixing two or more types of resin monomers having different glass transition temperatures. Then, it is possible to control by using a copolymer obtained by polymerization and adjusting the distribution ratio of the monomers as a material for the adhesive layer 160.

　接着剤層１６０の厚みは、特に限定されないが、３～４μｍ程度であることが好ましい。接着剤層１６０の厚みが３μｍ未満の場合、樹脂基板１２０とＰＥＴフィルム１４０を十分に接着させることができず、樹脂基板１２０からＰＥＴフィルム１４０が剥離しやすくなる。一方、接着剤層１６０が４μｍ超の場合、熱圧着の際に接着剤層１６０が流路１３０内に入り込んでしまうおそれがある。 The thickness of the adhesive layer 160 is not particularly limited, but is preferably about 3 to 4 μm. When the thickness of the adhesive layer 160 is less than 3 μm, the resin substrate 120 and the PET film 140 cannot be sufficiently bonded, and the PET film 140 is easily peeled from the resin substrate 120. On the other hand, when the adhesive layer 160 exceeds 4 μm, the adhesive layer 160 may enter the flow path 130 during thermocompression bonding.

　接着剤層１６０は、アクリル樹脂成分およびウレタン樹脂成分をブロックコポリマーとして有していてもよい。また、接着剤層１６０は、アクリル樹脂とウレタン樹脂との混合体であってもよい。さらに、アクリル樹脂とウレタン樹脂との混合体およびブロックコポリマーが混在していてもよい。接着剤層１６０に含まれるアクリル樹脂成分およびウレタン樹脂成分が相補的な働きをすることで、アクリル樹脂の耐光性およびウレタン樹脂の耐薬品性を併せもつ接着剤層１６０を形成することができる。 The adhesive layer 160 may have an acrylic resin component and a urethane resin component as a block copolymer. The adhesive layer 160 may be a mixture of an acrylic resin and a urethane resin. Furthermore, a mixture of acrylic resin and urethane resin and a block copolymer may be mixed. When the acrylic resin component and the urethane resin component contained in the adhesive layer 160 have complementary functions, the adhesive layer 160 having both the light resistance of the acrylic resin and the chemical resistance of the urethane resin can be formed.

　前述の通り、マイクロ流路チップ１００は、樹脂基板１２０、接着剤層１６０およびＰＥＴフィルム１４０をこの順番に積層した状態で、接着剤層１６０を所定の接着温度（Ｔｐ）で加熱することで作製される。このとき、接着剤層１６０を加熱する接着温度（Ｔｐ）は、接着剤層１６０のガラス転移温度（ＴｇＣ）より高く、樹脂基板１２０のガラス転移温度（ＴｇＡ；９７℃）およびＰＥＴフィルム１４０の融点（ＴｍＢ）より低ければ、特に限定されない。すなわち、接着温度は、ＴｇＣ＜Ｔｐ＜ＴｇＡ＜ＴｍＢを満たせばよい。接着温度（Ｔｐ）が樹脂基板１２０のガラス転移温度（ＴｇＡ）より高い場合、熱圧着時に樹脂基板１２０が軟化してしまう。たとえば、ＰＥＴフィルム１４０と、ＰＭＭＡ製の樹脂基板１２０を用いてマイクロ流路チップ１００作製する場合、接着温度（Ｔｐ）は、９０℃程度である。 As described above, the microchannel chip 100 is manufactured by heating the adhesive layer 160 at a predetermined bonding temperature (Tp) in a state where the resin substrate 120, the adhesive layer 160, and the PET film 140 are laminated in this order. Is done. At this time, the bonding temperature (Tp) for heating the adhesive layer 160 is higher than the glass transition temperature (Tg C ) of the adhesive layer 160, the glass transition temperature (Tg A ; 97 ° C.) of the resin substrate 120, and the PET film 140. if lower than the melting point (Tm B) of not particularly limited. That is, the bonding temperature may satisfy Tg C <Tp <Tg A <Tm B. When the bonding temperature (Tp) is higher than the glass transition temperature (Tg A ) of the resin substrate 120, the resin substrate 120 is softened during thermocompression bonding. For example, when the microchannel chip 100 is manufactured using the PET film 140 and the resin substrate 120 made of PMMA, the bonding temperature (Tp) is about 90 ° C.

　［マイクロ流路チップの製造方法］
　本発明のマイクロ流路チップ１００の製造方法は、特に限定されないが、例えば以下の方法により製造されうる。図３Ａ，Ｂは、マイクロ流路チップ１００の製造工程を示す断面図である。 [Method of manufacturing microchannel chip]
Although the manufacturing method of the microchannel chip | tip 100 of this invention is not specifically limited, For example, it can manufacture with the following method. 3A and 3B are cross-sectional views showing the manufacturing process of the microchannel chip 100.

　本発明のマイクロ流路チップ１００は、１）樹脂基板１２０を準備する第１の工程と、２）接着剤層１６０が配置されたＰＥＴフィルム１４０を準備する第２の工程と、３）樹脂基板１２０と、接着剤層１６０が配置されたＰＥＴフィルム１４０とを積層する第３の工程と、４）樹脂基板１２０とＰＥＴフィルム１４０とを接着する第４の工程とを有する。 The microchannel chip 100 of the present invention includes 1) a first step of preparing a resin substrate 120, 2) a second step of preparing a PET film 140 on which an adhesive layer 160 is disposed, and 3) a resin substrate. 120 and a third step of laminating the PET film 140 on which the adhesive layer 160 is disposed, and 4) a fourth step of adhering the resin substrate 120 and the PET film 140 to each other.

　図３Ａは、第１の工程および第２の工程を示す図である。図３に示されるように、第１の工程では、樹脂基板１２０を準備する。たとえば、射出成型により、２つの貫通孔と、これらの貫通孔を繋ぐ溝１２９とを有するＰＭＭＡ製の樹脂基板１２０を作製する。 FIG. 3A is a diagram showing a first step and a second step. As shown in FIG. 3, in the first step, a resin substrate 120 is prepared. For example, a resin substrate 120 made of PMMA having two through holes and a groove 129 connecting these through holes is manufactured by injection molding.

　同図に示されるように、第２の工程では、一方の面にアクリル樹脂成分およびウレタン樹脂成分を含む接着剤層１６０が配置されたＰＥＴフィルム１４０を準備する。たとえば、ＰＥＴフィルム１４０は、溶融押出成型法や、溶液流延法、カレンダー法などで製造してもよいし、市販のフィルムを使用してもよい。また、ＰＥＴフィルム１４０上に接着剤層１６０を配置する方法は、特に限定されない。たとえば、ＰＥＴフィルム１４０の表面にアクリル樹脂成分およびウレタン樹脂成分を含む樹脂組成物を塗布してもよいし（塗布法）、ＰＥＴフィルム１４０の表面にアクリル樹脂成分およびウレタン樹脂成分を含む樹脂フィルムを積層してもよい（ラミネート法）。接着剤層１６０は、ガラス転移温度が４０～５０℃となるように調整されている。 As shown in the figure, in the second step, a PET film 140 is prepared in which an adhesive layer 160 containing an acrylic resin component and a urethane resin component is disposed on one surface. For example, the PET film 140 may be manufactured by a melt extrusion method, a solution casting method, a calendar method, or the like, or a commercially available film may be used. Further, the method for disposing the adhesive layer 160 on the PET film 140 is not particularly limited. For example, a resin composition containing an acrylic resin component and a urethane resin component may be applied to the surface of the PET film 140 (application method), or a resin film containing an acrylic resin component and a urethane resin component may be applied to the surface of the PET film 140. Lamination may be performed (lamination method). The adhesive layer 160 is adjusted so that the glass transition temperature is 40 to 50 ° C.

　図３Ｂは、第３の工程および第４の工程を示す図である。図３に示されるように、第３の工程では、樹脂基板１２０の一方の面上に、接着剤層１６０が樹脂基板１２０とＰＥＴフィルム１４０との間に位置するようにＰＥＴフィルム１４０を配置する。たとえば、溝１２９が形成された面を上に向けた樹脂基板１２０に対して、接着剤層１６０が下側に向くようにしたＰＥＴフィルム１４０を上方から積層する。 FIG. 3B is a diagram showing the third step and the fourth step. As shown in FIG. 3, in the third step, the PET film 140 is disposed on one surface of the resin substrate 120 so that the adhesive layer 160 is positioned between the resin substrate 120 and the PET film 140. . For example, a PET film 140 in which the adhesive layer 160 faces downward is laminated on the resin substrate 120 with the surface on which the groove 129 is formed facing upward.

　同図に示されるように、第４の工程では、接着剤層１６０を所定の接着温度で加熱して、樹脂基板１２０とＰＥＴフィルム１４０とを接着する。たとえば、熱圧着により接着剤層を軟化させた状態で、樹脂基板１２０に対してＰＥＴフィルム１４０を接合して、マイクロ流路チップ１００を形成する。熱圧着は、９０℃程度の温度で、１０秒間以上行うことが好ましい。熱圧着する時間が１０秒未満の場合、樹脂基板１２０とＰＥＴフィルム１４０が十分に接着されないおそれがある。 As shown in the figure, in the fourth step, the adhesive layer 160 is heated at a predetermined bonding temperature to bond the resin substrate 120 and the PET film 140. For example, in a state where the adhesive layer is softened by thermocompression bonding, the PET film 140 is bonded to the resin substrate 120 to form the microchannel chip 100. The thermocompression bonding is preferably performed at a temperature of about 90 ° C. for 10 seconds or more. If the time for thermocompression bonding is less than 10 seconds, the resin substrate 120 and the PET film 140 may not be sufficiently bonded.

　このように、樹脂基板１２０、接着剤層１６０およびＰＥＴフィルム１４０の積層体を熱圧着すると、接着剤層１６０およびＰＥＴフィルム１４０が軟化する。この際、接着温度は、接着剤層１６０が十分軟化し、ＰＥＴフィルム１４０が樹脂基板１２０の表面形状に追従する程度の温度である。この状態で圧着することで、樹脂基板１２０とＰＥＴフィルム１４０とが接着剤層１６０により接着される。 Thus, when the laminate of the resin substrate 120, the adhesive layer 160, and the PET film 140 is thermocompression bonded, the adhesive layer 160 and the PET film 140 are softened. At this time, the bonding temperature is a temperature at which the adhesive layer 160 is sufficiently softened and the PET film 140 follows the surface shape of the resin substrate 120. By pressure bonding in this state, the resin substrate 120 and the PET film 140 are bonded together by the adhesive layer 160.

　以上のように、本発明のマイクロ流路チップ１００の製造方法は、１）ＴｇＣ＜Ｔｐ＜ＴｇＡ＜ＴｍＢを満たすこと、および２）接着剤層１６０がアクリル樹脂成分およびウレタン樹脂成分を含むこと、を特徴とする。これにより、流路に接着剤を入り込ませることなく、かつ樹脂基板１２０に対してＰＥＴフィルム１４０を強固に接着することができる。このように製造された本発明のマイクロ流路チップ１００は、高精度かつ高強度であり、流路１３０から試料が漏出してしまうことがなく、かつ高精度に試料を分析することができる。 As described above, the manufacturing method of the microchannel chip 100 of the present invention includes 1) satisfying Tg C <Tp <Tg A <Tm B , and 2) the adhesive layer 160 containing the acrylic resin component and the urethane resin component. Including. Thereby, the PET film 140 can be firmly bonded to the resin substrate 120 without causing the adhesive to enter the flow path. The microchannel chip 100 of the present invention manufactured as described above has high accuracy and high strength, the sample does not leak from the channel 130, and the sample can be analyzed with high accuracy.

　以下、本発明について実施例を参照して詳細に説明するが、本発明はこれらの実施例により限定されない。 Hereinafter, the present invention will be described in detail with reference to examples, but the present invention is not limited to these examples.

　１．マイクロ流路チップの作製
　ポリメタクリル酸メチル（ＰＭＭＡ）を材料として、図２に示される樹脂基板を射出成形により作製した。貫通孔の直径は、２ｍｍである。また、溝の幅は４０μｍであり、溝の深さは２５μｍである。 1. Production of microchannel chip The resin substrate shown in FIG. 2 was produced by injection molding using polymethyl methacrylate (PMMA) as a material. The diameter of the through hole is 2 mm. The width of the groove is 40 μm, and the depth of the groove is 25 μm.

　表１に示される樹脂を含む接着剤層が形成されたＰＥＴフィルム（厚さ１００μｍ）を準備した。 A PET film (thickness: 100 μm) on which an adhesive layer containing a resin shown in Table 1 was formed was prepared.

Figure JPOXMLDOC01-appb-T000001
Figure JPOXMLDOC01-appb-T000001

　樹脂基板の溝が形成された面と、接着剤層が配置された面とが対向するようにして、ＰＥＴフィルムを樹脂基板に重ねた。この状態で、９０℃で１０秒間熱圧着して、ＰＥＴフィルムを樹脂基板に接着することでマイクロ流路チップを作製した。 The PET film was laminated on the resin substrate so that the surface on which the groove of the resin substrate was formed and the surface on which the adhesive layer was disposed were opposed to each other. In this state, a microchannel chip was manufactured by thermocompression bonding at 90 ° C. for 10 seconds to adhere the PET film to the resin substrate.

　樹脂基板（ＰＭＭＡ）のガラス転移温度（ＴｇＡ）は９７℃である。ＰＥＴフィルムの融点（ＴｍＢ）は２００℃である。接着剤層のガラス転移温度（ＴｇＣ）は４０～５０℃である。熱圧着の際の接着温度（Ｔｐ）は９０℃である。したがって、上記いずれの接着剤層を形成した場合であっても、ＴｇＣ＜Ｔｐ＜ＴｇＡ＜ＴｍＢ、が満たされている。 The glass transition temperature (Tg A ) of the resin substrate (PMMA) is 97 ° C. The melting point (Tm B ) of the PET film is 200 ° C. The glass transition temperature (Tg C ) of the adhesive layer is 40 to 50 ° C. The bonding temperature (Tp) during thermocompression bonding is 90 ° C. Therefore, even when any of the above adhesive layers is formed, Tg C <Tp <Tg A <Tm B is satisfied.

　これらの各ガラス転移温度および融点は、示差走査熱量測定（ＤＳＣ）装置を用いて測定した値、または使用した樹脂の仕様値である。 These glass transition temperatures and melting points are values measured using a differential scanning calorimetry (DSC) apparatus or specification values of the resin used.

　２．マイクロ流路チップの評価
　各マイクロ流路チップについて、樹脂基板に対するＰＥＴフィルムの接着強度と、流路形状を評価した。 2. Evaluation of microchannel chip For each microchannel chip, the adhesive strength of the PET film to the resin substrate and the channel shape were evaluated.

　（１）接着強度の評価
　接着強度の評価では、樹脂基板からのＰＥＴフィルムの剥がれにくさを調べた。マイクロ流路チップの凹部にフォースゲージの先端を挿入し、圧力換算して０．４ＭＰａの応力をＰＥＴフィルムに加えた。次いで、樹脂基板とＰＥＴフィルムの境界をカメラで撮像して、樹脂基板からＰＥＴフィルムが剥離しているか否かを確認した。樹脂基板からＰＥＴフィルムが剥離しなかったものを「○」と評価し、樹脂基板からＰＥＴフィルムが剥離したものを「×」と評価した。 (1) Evaluation of adhesive strength In the evaluation of adhesive strength, the difficulty of peeling of the PET film from the resin substrate was examined. The tip of a force gauge was inserted into the recess of the microchannel chip, and a pressure of 0.4 MPa was applied to the PET film in terms of pressure. Next, the boundary between the resin substrate and the PET film was imaged with a camera, and it was confirmed whether the PET film was peeled off from the resin substrate. The case where the PET film was not peeled off from the resin substrate was evaluated as “◯”, and the case where the PET film was peeled off from the resin substrate was evaluated as “x”.

　（２）流路形状の評価
　流路形状の評価では、流路内に接着剤層が入り込んでいるか否かを調べた。具体的には、ＰＥＴフィルムを樹脂基板から剥がした後、フーリエ変換赤外分光光度計により接着剤層の表面形状を流路の幅方向に測定した。流路部分における接着剤層の最大高さと最小高さの高低差が小さいマイクロ流路チップでは、接着剤層が流路内に入り込んでいないと考えられる。一方、高低差が大きいマイクロ流路チップでは、接着剤層が流路内に入り込んでいると考えられる。これらの考えに基づき、流路部分における接着剤層の高低差が１．６μｍ未満であったものを「○」と評価し、高低差が１．６μｍ以上であったものを「×」と評価した。 (2) Evaluation of flow path shape In the evaluation of the flow path shape, it was examined whether or not an adhesive layer had entered the flow path. Specifically, after peeling the PET film from the resin substrate, the surface shape of the adhesive layer was measured in the width direction of the flow path by a Fourier transform infrared spectrophotometer. In the micro-channel chip in which the difference in height between the maximum height and the minimum height of the adhesive layer in the channel portion is small, it is considered that the adhesive layer does not enter the channel. On the other hand, in the microchannel chip having a large difference in height, it is considered that the adhesive layer enters the channel. Based on these ideas, if the difference in height of the adhesive layer in the flow path portion was less than 1.6 μm, it was evaluated as “◯”, and if the difference in height was 1.6 μm or more, it was evaluated as “x”. did.

　（３）結果
　各マイクロ流路チップについての接着強度および流路形状の評価結果を表２に示す。 (3) Results Table 2 shows the evaluation results of the adhesive strength and the channel shape for each microchannel chip.

Figure JPOXMLDOC01-appb-T000002
Figure JPOXMLDOC01-appb-T000002

　接着剤層がアクリル樹脂およびウレタン樹脂の少なくとも一方を含まない比較例１～４のマイクロ流路チップでは、樹脂基板と接着剤層の境界が剥離しており、接着強度が弱かった。一方、接着剤層がアクリル樹脂およびウレタン樹脂の両方を含む実施例のマイクロ流路チップでは、剥離がまったく観察されず、接着強度が強かった。また、前述した式（ＴｇＣ＜Ｔｐ＜ＴｇＡ＜ＴｍＢ）を満たしている実施例および比較例１～４のマイクロ流路チップは、いずれも流路形状が良好であった。 In the microchannel chips of Comparative Examples 1 to 4 in which the adhesive layer did not contain at least one of acrylic resin and urethane resin, the boundary between the resin substrate and the adhesive layer was peeled off, and the adhesive strength was weak. On the other hand, in the microchannel chip of the example in which the adhesive layer contains both acrylic resin and urethane resin, no peeling was observed and the adhesive strength was strong. In addition, the microchannel chips of Examples and Comparative Examples 1 to 4 satisfying the above-described formula (Tg C <Tp <Tg A <Tm B ) all had good channel shapes.

　以上の結果から、本発明のマイクロ流路チップは、樹脂基板とＰＥＴフィルムの接着強度および流路形状の精度に優れていることがわかる。 From the above results, it can be seen that the microchannel chip of the present invention is excellent in the adhesive strength between the resin substrate and the PET film and the accuracy of the channel shape.

　本発明のマイクロ流路チップは、例えば、科学分野や医学分野などにおいて使用されるマイクロ流路チップとして有用である。 The microchannel chip of the present invention is useful as a microchannel chip used in, for example, the scientific field and the medical field.

　本出願は、２０１２年２月１０日出願の特願２０１２－０２６９７０に基づく優先権を主張する。当該出願明細書および図面に記載された内容は、すべて本願明細書に援用される。 This application claims priority based on Japanese Patent Application No. 2012-026970 filed on February 10, 2012. The contents described in the application specification and the drawings are all incorporated herein by reference.

　１００　マイクロ流路チップ
　１２０　樹脂基板
　１２１　第１貫通孔
　１２２　第２貫通孔
　１２５　第１凹部
　１２６　第２凹部
　１２９　溝
　１３０　流路
　１４０　ＰＥＴフィルム
　１６０　接着剤層 DESCRIPTION OF SYMBOLS 100 Microchannel chip 120 Resin substrate 121 1st through-hole 122 2nd through-hole 125 1st recessed part 126 2nd recessed part 129 Groove | channel 130 Flow path 140 PET film 160 Adhesive layer

Claims (4)

　一方の面に溝が形成された樹脂基板と、
　前記樹脂基板の前記一方の面上に配置され、前記溝の開口部を覆うポリエチレンテレフタレートフィルムと、
　前記樹脂基板と前記ポリエチレンテレフタレートフィルムの間に配置され、アクリル樹脂成分およびウレタン樹脂成分を含む接着剤層とを有し、
　前記樹脂基板および前記ポリエチレンテレフタレートフィルムは、前記接着剤層を所定の接着温度で加熱することで互いに接着されており、
　前記樹脂基板のガラス転移温度をＴｇＡとし、前記ポリエチレンテレフタレートフィルムの融点をＴｍＢとし、前記接着剤層のガラス転移温度をＴｇＣとし、前記接着温度をＴｐとしたとき、
　ＴｇＣ＜Ｔｐ＜ＴｇＡ＜ＴｍＢ、を満たす、
　流体取扱装置。 A resin substrate with a groove formed on one surface;
A polyethylene terephthalate film disposed on the one surface of the resin substrate and covering the opening of the groove;
Arranged between the resin substrate and the polyethylene terephthalate film, and having an adhesive layer containing an acrylic resin component and a urethane resin component,
The resin substrate and the polyethylene terephthalate film are bonded to each other by heating the adhesive layer at a predetermined bonding temperature,
When the glass transition temperature of the resin substrate is Tg A , the melting point of the polyethylene terephthalate film is Tm B , the glass transition temperature of the adhesive layer is Tg C , and the adhesion temperature is Tp,
Tg C <Tp <Tg A <Tm B is satisfied,
Fluid handling device. 　前記接着剤層を前記接着温度で加熱する時間は、１０秒以上である、請求項１に記載の流体取扱装置。 The fluid handling device according to claim 1, wherein the time for heating the adhesive layer at the bonding temperature is 10 seconds or more. 　一方の面に溝が形成された樹脂基板を準備する工程と、
　一方の面にアクリル樹脂成分およびウレタン樹脂成分を含む接着剤層が配置されたポリエチレンテレフタレートフィルムを準備する工程と、
　前記樹脂基板の前記一方の面上に、前記接着剤層が前記樹脂基板と前記ポリエチレンテレフタレートフィルムとの間に位置するように前記ポリエチレンテレフタレートフィルムを配置する工程と、
　前記接着剤層を所定の接着温度で加熱して、前記樹脂基板と前記ポリエチレンテレフタレートフィルムとを接着する工程と、を有し、
　前記樹脂基板のガラス転移温度をＴｇＡとし、前記ポリエチレンテレフタレートフィルムの融点をＴｍＢとし、前記接着剤層のガラス転移温度をＴｇＣとし、前記接着温度をＴｐとしたとき、
　ＴｇＣ＜Ｔｐ＜ＴｇＡ＜ＴｍＢ、を満たす、
　流体取扱装置の製造方法。 Preparing a resin substrate having grooves formed on one surface;
Preparing a polyethylene terephthalate film in which an adhesive layer containing an acrylic resin component and a urethane resin component is disposed on one surface;
Disposing the polyethylene terephthalate film on the one surface of the resin substrate such that the adhesive layer is located between the resin substrate and the polyethylene terephthalate film;
Heating the adhesive layer at a predetermined bonding temperature to bond the resin substrate and the polyethylene terephthalate film,
When the glass transition temperature of the resin substrate is Tg A , the melting point of the polyethylene terephthalate film is Tm B , the glass transition temperature of the adhesive layer is Tg C , and the adhesion temperature is Tp,
Tg C <Tp <Tg A <Tm B is satisfied,
Manufacturing method of fluid handling device. 　前記接着剤層を前記接着温度で加熱する時間は、１０秒以上である、請求項３に記載の流体取扱装置の製造方法。 The method for manufacturing a fluid handling device according to claim 3, wherein the time for heating the adhesive layer at the bonding temperature is 10 seconds or more.
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