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WO2013183860A1 - Élément d'alliage de cuivre et son procédé de préparation - Google Patents

Élément d'alliage de cuivre et son procédé de préparation Download PDF

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Publication number
WO2013183860A1
WO2013183860A1 PCT/KR2013/003661 KR2013003661W WO2013183860A1 WO 2013183860 A1 WO2013183860 A1 WO 2013183860A1 KR 2013003661 W KR2013003661 W KR 2013003661W WO 2013183860 A1 WO2013183860 A1 WO 2013183860A1
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Prior art keywords
copper
copper alloy
weight
alloy
cold
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English (en)
Korean (ko)
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박효주
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    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/02—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working in inert or controlled atmosphere or vacuum
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon

Definitions

  • the present invention has a high electrical conductivity while increasing or maintaining the tensile strength by producing a copper alloy in a composition containing copper (Cu), iron (Fe), manganese (Mn) and phosphorus (P), copper (Cu ),
  • a copper alloy in a composition containing copper (Cu), iron (Fe), manganese (Mn) and phosphorus (P), copper (Cu )
  • Cu copper
  • Fe iron
  • Mn manganese
  • P phosphorus
  • Cu copper
  • semiconductor leadframe materials, transistor materials, copper tubes, and pipes which require high electrical conductivity and high strength, and connectors, switches, and switches that require higher tensile strength, electrical conductivity, and softening resistance than conventional copper alloys.
  • Cu-Fe-P-based alloys, including manganese (Mn) there is no surface defect does not drop the conductivity, as well as high strength and high conductivity copper alloy member and its manufacturing method Technology.
  • Cu-Fe-P-based alloys are used as copper alloys for semiconductor lead frames.
  • copper alloys containing 0.05 to 0.15 wt% of iron (Fe) and 0.025 to 0.04 wt% of phosphorus (P). (C19210) and copper alloy (CDA194) containing 2.1 to 2.6 wt% of iron (Fe) have been widely used as a lead frame material for semiconductors because of excellent strength and conductivity among copper alloys.
  • Cu-Fe-P-based alloys have high conductivity, but for high strength, Cu-Fe-P-based alloys have increased the content of Fe and P or added third elements such as Sn, Mg, and Ca. However, when the amount of these elements is increased, the strength is increased, but on the contrary, the conductivity is lowered. Therefore, it is difficult to use them in parts applied to industrial fields.
  • the total amount of Fe or Ni and P is 0.05 to 2.0% by weight, Zn is 5% by weight or more, Sn is 0.1 to 3.30% by weight, and the balance is made of Cu.
  • Fe or Ni to P atomic weight ratio (Fe / P, Ni / P, Fe + Ni) / P is 0.2 to 3.0, the particle size is controlled to 35 ⁇ m or less, Fe-P compound less than 0.2 ⁇ m is uniform Disperse copper alloys have been disclosed.
  • Japanese Patent Laid-Open No. 63-161134 discloses a copper alloy containing 0.01 to 0.3 wt% of Fe, 0.4 wt% or less of Z, 1.5 wt% of Zn, 0.2 to 1.5 wt% of Sn, and the balance of Cu. This has been disclosed.
  • copper alloys are manufactured with a composition containing copper (Cu), iron (Fe), manganese (Mn) and phosphorus (P) to have high electrical conductivity while increasing or maintaining tensile strength, and copper (Cu) and iron Copper alloy member and its manufacture which have superior tensile strength and electrical conductivity as well as excellent softening resistance as compared with the existing copper alloy by varying the composition ratio of copper alloy containing (Fe), manganese (Mn) and phosphorus (P).
  • the development of the method is urgently required.
  • the present invention has been conceived to solve the above problems, by increasing the tensile strength by manufacturing a copper alloy with a composition containing copper (Cu), iron (Fe), manganese (Mn) and phosphorus (P).
  • Another object is to provide a copper alloy member having a high electrical conductivity while maintaining the same, and a method of manufacturing the same.
  • Another object of the present invention is to vary the composition of the copper alloy containing copper (Cu), iron (Fe), manganese (Mn) and phosphorus (P), thereby having excellent tensile strength and electrical conductivity than conventional copper alloys.
  • the present invention provides a copper alloy member having excellent softening properties and a method of manufacturing the same.
  • Another object of the present invention is to provide a copper alloy member that can be applied to a lead frame material for a semiconductor, a transistor material, a copper tube, and a pipe that requires high electrical conductivity and high strength, and a method of manufacturing the same.
  • Another object of the present invention is to provide a copper alloy member and a method for manufacturing the same, which can be applied to electronic components such as connectors and switches requiring tensile strength, electrical conductivity and softening resistance superior to those of conventional copper alloys.
  • Another object of the present invention is to include a manganese (Mn) in the Cu-Fe-P-based alloy to provide a copper alloy member having high strength and high conductivity as well as not dropping the conductivity without surface defects, and a method of manufacturing the same.
  • Mn manganese
  • Copper alloy member according to an embodiment of the present invention for achieving the above object is 0.05 to 0.30% by weight of iron (Fe), 0.05 to 0.20% by weight of manganese (Mn), 0.015 to 0.10% by weight of phosphorus (P) ) And the remainder copper (Cu) and other unavoidable impurities.
  • the composition of the iron (Fe), manganese (Mn), phosphorus (P), copper (Cu) contains at least one of Zn, Sn, Al, Ni in 1.0% by weight or less It is characterized by.
  • the copper alloy member is characterized by having a tensile strength of 40 kgf / mm 2 or more, and an electrical conductivity of 50% IACs or more.
  • the particle size of the Mn-P and Fe-P precipitates in the composition of the iron (Fe), manganese (Mn), phosphorus (P), copper (Cu) is 10 ⁇ m to 30 ⁇ m And the size of the precipitate is 2 or less per 2 mm 2.
  • the method for manufacturing a rolled material of copper alloy according to an embodiment of the present invention for achieving the above object is 0.05 to 0.30% by weight of iron, 0.05 to 0.20% by weight of manganese, 0.015 to 0.10% by weight of phosphorus, balance Casting the billet to include copper; Hot rolling the cast alloy at 800 ° C. to 1000 ° C .; First annealing the hot rolled alloy at annealing for 1 to 10 hours at 400 ° C. to 600 ° C .; Cold rolling the intermediate annealing the primary annealed alloy at a reduction ratio of 30 to 70%; Secondary annealing the cold rolled alloy at a temperature of 500 ° C. to 800 ° C. for 30 to 600 seconds; Final cold rolling to finish roll the secondary annealed alloy to 20 to 40%; Characterized in that it comprises a.
  • the copper tube manufacturing method of the copper alloy according to an embodiment of the present invention for achieving the above object is 0.05 to 0.3% by weight of iron (Fe), 0.05 to 0.2% by weight of manganese (Mn), 0.015 to 0.10% by weight Casting phosphorus (P) and copper (Cu) billets of the balance;
  • the copper alloy member and the manufacturing method thereof according to the present invention has the following effects.
  • the present invention has high electrical conductivity while increasing or maintaining tensile strength by manufacturing copper alloy with a composition containing copper (Cu), iron (Fe), manganese (Mn) and phosphorus (P).
  • the present invention has superior tensile strength and electrical conductivity than conventional copper alloy
  • the softening properties are also excellent.
  • the present invention can be applied to lead frame materials for semiconductors, transistor materials, copper tubes, and pipes that require high electrical conductivity and high strength.
  • the present invention can be applied to electronic components, such as connectors and switches, which require superior tensile strength, electrical conductivity, and softening resistance than conventional copper alloys.
  • the present invention includes manganese (Mn) in the Cu-Fe-P-based alloy does not reduce the conductivity without surface defects, as well as high strength and high conductivity.
  • FIG. 1 is a process flow diagram illustrating a method for manufacturing a rolled material of copper alloy according to an embodiment of the present invention.
  • Figure 2 is a process flow diagram illustrating a copper tube manufacturing method of a copper alloy according to an embodiment of the present invention.
  • Figure 3 is a scanning electron microscope (SEM) photographs that can confirm that the Mn-P precipitates appeared in the copper alloy member according to an embodiment of the invention.
  • Copper alloy member of the present invention is 0.05 to 0.30% by weight of iron (Fe), 0.05 to 0.20% by weight of manganese (Mn), 0.015 to 0.10% by weight of phosphorus (P), and the balance of copper (Cu) And other unavoidable impurities.
  • the composition of the iron (Fe), manganese (Mn), phosphorus (P), copper (Cu) contains at least one of Zn, Sn, Al, Ni in 1.0% by weight or less, the copper alloy member Has a tensile strength of 40 kgf / mm 2 or more and an electrical conductivity of 50% IACS or more.
  • FIG. 1 is a process flow diagram illustrating a method for manufacturing a rolled material of copper alloy according to an embodiment of the present invention
  • Figure 2 is a process flow diagram showing a method for manufacturing a copper tube of copper alloy according to an embodiment of the present invention.
  • the process flow of manufacturing a rolled material of copper alloy is as follows.
  • First step S1 is a casting step, in which a billet is cast so as to include 0.05 to 0.30 wt% iron, 0.05 to 0.20 wt% manganese, 0.015 to 0.10 wt% phosphorus, and the balance copper.
  • the next step S2 is a hot rolling step, in which the cast alloy is hot rolled at 800 ° C to 1000 ° C.
  • the hot rolling exceeds 1000 °C, rather than the formation of precipitates, the same phenomenon appears even below 800 °C.
  • the next step S3 is a first annealing step, in which the hot rolled alloy is first annealed by annealing for 1 to 10 hours at 400 ° C to 600 ° C.
  • the appropriate conditions during the first annealing is in the 1 to 10 hours at 400 °C to 600 °C in excess of 600 °C and more than 10 hours, directly affect the strength, rather than at high temperature and long time the electrical conductivity is reduced Demonstrate the ability to do so. If the temperature is less than 400 ° C and less than 1 hour, sedimentation or recrystallization is insufficient.
  • the next step S4 is a cold rolling step, which is cold rolling to intermediate-roll the primary annealed alloy at a reduction ratio of 30 to 70%.
  • the upper limit of the reduction ratio during cold rolling is not particularly defined, but a good result is usually obtained in the range of a processing rate of 85% or less, and the high processing rate increases the load on a rolling mill or the like.
  • secondary cold rolling when the cold working rate is 70% or more, the amount of distortion in the material increases, and the bending workability decreases. On the other hand, if the cold working rate is 20% or less, sufficient strength effect cannot be obtained.
  • the next step S5 is a secondary annealing step, in which the cold rolled alloy is second annealed at 500 ° C. to 800 ° C. for 30 to 600 seconds.
  • Next step S6 is a final rolling step, which is the final cold rolling to finish rolling the secondary annealing alloy to 20 to 40%.
  • the process flow of manufacturing a copper tube of a copper alloy is as follows.
  • First step S11 is a casting step, in which 0.05 to 0.30% by weight of iron (Fe), 0.05 to 0.2% by weight of manganese (Mn), 0.015 to 0.10% by weight of phosphorus (P), and the balance of copper
  • the billet is cast to be (Cu).
  • the next step S12 is a hot extrusion step, in which the billet is hot extruded to hot extrusion to obtain an element pipe.
  • the next step S13 is a cold tube rolling step, in which the hot extruded element pipe is cold rolled to obtain a tube material by cold tube rolling.
  • the next step S14 is a cold drawing step, in which the cold drawn tube is cold drawn.
  • the next step S15 is a level winding step, in which the cold drawn tube is wound in the form of a coil.
  • Next step S16 is a heat treatment step, the heat treatment of the pipe wound in the coil form.
  • FIG. 3 is a scanning electron microscope (SEM) photograph showing that Mn-P precipitates appeared in a copper alloy according to an embodiment of the present invention.
  • SEM scanning electron microscope
  • the particle size of the Mn-P precipitates in the composition of the iron (Fe), manganese (Mn), phosphorus (P), copper (Cu) is 10 ⁇ m to 30 ⁇ m, The size of precipitate is 2 or less per 2mm ⁇ 2>.
  • Mn-P precipitates in Cu bases are formed to improve electrical conductivity and strength.Mn is less than 0.05% by weight, and it is difficult to form precipitates. It is difficult to secure 50% IACS, which is the required level of the material for lead frame, which requires characteristics as the electrical conductivity is lowered beyond the deposition amount.
  • the alloy shown in Table 1 was melted in a high frequency melting furnace to produce an ingot having a thickness of 22 mm, a width of 40 mm, and a length of 180 mm. After heating this ingot at 870 degreeC for 1 hour, it hot-rolled to thickness 10mm, faced each 1 mm each, and cold-rolled to 1.5 mm. This rolled material was heat-treated at the temperature of 480 degreeC, and the annealing process was performed in order to remove distortion, and it rolled to 0.25 mm and obtained the cold rolled material shown in Table 2.
  • the manufacturing process according to the above embodiment of the present invention is not limited thereto, and cold rolling, aging treatment, and surface cleaning (after pickling) may be performed after hot rolling, as is usually performed in a factory to correspond to the quality required by individual customers. Processes such as polishing), tensile annealing, tension leveling and the like can be selected and combined correspondingly as necessary.
  • Table 2 shows the test results of the tensile strength (TS) and the electrical conductivity (E.C) by cutting the test piece obtained through the composition and manufacturing process.
  • Comparative Examples 1 and 2 (Cu-Fe-P-Sn-based) and Comparative Examples 3 and 4 (Cu-Fe-P-based) prepared a specimen by preparing a copper alloy having the specifications and components shown in Table 1.
  • Bal. Balance, balance division sample Ingredient (% by weight) Cu Fe P Mn Sn
  • Example 1 One Bal. 0.12 0.04 0.07 - Example 2 2 Bal. 0.10 0.08 0.10 - Example 3 3 Bal. 0.14 0.07 0.12 - Example 4 4 Bal. 0.15 0.10 0.10 - Comparative Example 1 Cu-Fe-P-based Sn addition 5 Bal. 0.15 0.05 - 0.13 Comparative Example 2 6 Bal. 0.10 - - 0.08 Comparative Example 3 C19210 7 Bal. 0.10 0.05 - - Comparative Example 4 8 Bal. 0.12 0.04 - - -
  • TS Tensile strength
  • E.C electrical conductivity
  • Samples 1 to 4 prepared according to the Examples are excellent in tensile strength, conductivity and conductivity, in particular in the case of softening hardness, unlike Samples 5 to 8 prepared according to Comparative Examples 1 to 4 Shows excellent flame retardant properties compared to Comparative Examples 7,8. In addition, good surface conditions were observed in Examples 1 to 4.
  • the copper alloy member and the method of manufacturing the same can be applied to semiconductor leadframe materials, transistor materials, copper tubes, pipes, as well as to electronic components such as connectors, switches, and the like.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Conductive Materials (AREA)
PCT/KR2013/003661 2012-06-04 2013-04-29 Élément d'alliage de cuivre et son procédé de préparation Ceased WO2013183860A1 (fr)

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KR1020120059810A KR20130136183A (ko) 2012-06-04 2012-06-04 동합금부재와 그 제조 방법
KR10-2012-0059810 2012-06-04

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103878551A (zh) * 2014-03-27 2014-06-25 上海理工大学 一种高强度铜镍硅引线框架材料的生产方法
JP2020504231A (ja) * 2017-11-02 2020-02-06 プンサン コーポレーション 高強度及び高電気伝導度の特性を有する電気電子部品及び半導体用銅合金及びその製造方法

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101977508B1 (ko) * 2017-12-24 2019-05-10 주식회사 포스코 고 전기전도도 고강도 동합금 및 그 제조방법
KR102120295B1 (ko) * 2018-12-26 2020-06-08 태원공업(주) 양백각선의 제조 방법

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11264037A (ja) * 1998-03-18 1999-09-28 Nippon Mining & Metals Co Ltd 銅合金箔
JP2000328158A (ja) * 1999-05-13 2000-11-28 Kobe Steel Ltd プレス打抜き性が優れた銅合金板
KR20070031438A (ko) * 2004-08-17 2007-03-19 가부시키가이샤 고베 세이코쇼 굽힘 가공성을 구비한 전기 전자 부품용 구리 합금판
KR20100123243A (ko) * 2009-05-15 2010-11-24 한국기계연구원 강도와 전기전도도가 향상된 구리합금 및 이의 제조방법
KR20110091973A (ko) * 2010-02-08 2011-08-17 주식회사 풍산 고강도, 고전도성을 갖는 동합금 및 그 제조방법

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11264037A (ja) * 1998-03-18 1999-09-28 Nippon Mining & Metals Co Ltd 銅合金箔
JP2000328158A (ja) * 1999-05-13 2000-11-28 Kobe Steel Ltd プレス打抜き性が優れた銅合金板
KR20070031438A (ko) * 2004-08-17 2007-03-19 가부시키가이샤 고베 세이코쇼 굽힘 가공성을 구비한 전기 전자 부품용 구리 합금판
KR20100123243A (ko) * 2009-05-15 2010-11-24 한국기계연구원 강도와 전기전도도가 향상된 구리합금 및 이의 제조방법
KR20110091973A (ko) * 2010-02-08 2011-08-17 주식회사 풍산 고강도, 고전도성을 갖는 동합금 및 그 제조방법

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103878551A (zh) * 2014-03-27 2014-06-25 上海理工大学 一种高强度铜镍硅引线框架材料的生产方法
JP2020504231A (ja) * 2017-11-02 2020-02-06 プンサン コーポレーション 高強度及び高電気伝導度の特性を有する電気電子部品及び半導体用銅合金及びその製造方法

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