WO2013179989A1 - Package for housing optical semiconductor element, and optical semiconductor device - Google Patents

Abstract

This package for housing an optical semiconductor element is provided with: a substrate having a mounting region for mounting an optical semiconductor element, said mounting region being a part of the main surface of the substrate; and a frame body bonded to the main surface of the substrate, said frame body having a frame section constituting, with the substrate, the main body of the package for housing the optical semiconductor element, a protruding section, which is disposed outside of a substrate side surface positioned in the long-side direction of the substrate, and which is protruding downward, and an optical fiber attaching section, which is positioned between the frame section and the protruding section, and which connects the frame section and the protruding section to each other. The package for housing the optical semiconductor element is characterized in that the protruding section is bonded to the side surface positioned in the long-side direction of the substrate.

Description

Optical semiconductor element storage package and optical semiconductor device

The present invention relates to an optical semiconductor element storage package and an optical semiconductor device.

As an optical semiconductor element storage package for storing an optical semiconductor element, a package including a substrate and a frame body disposed on the main surface of the substrate is known (for example, JP-A-2002-169066). reference).

In such a package for storing an optical semiconductor element, the frame is fixed to the substrate by bonding the frame to the main surface of the substrate via a bonding member.

However, in such a package for storing an optical semiconductor element, heat is generated from the optical semiconductor element when the optical semiconductor element is driven, and the heat is transferred to the substrate and the frame, whereby the substrate and the frame are thermally expanded. there is a possibility.

At this time, since the thermal expansion coefficient of the substrate and the thermal expansion coefficient of the frame are different, stress is applied to the bonded portion of the substrate and the frame. In particular, since the thermal expansion of the substrate is likely to increase in the long side direction, a large stress is easily applied to the frame and the bonded portion of the substrate along the long side direction of the substrate. There is a possibility that the frame body peels off from the main surface of the substrate along the long side direction. When the frame is peeled off from the main surface of the substrate, there is a problem that the airtightness of the optical semiconductor element housing package is lowered.

The present invention has been made in view of the above problems, and an object of the present invention is to provide a package for housing an optical semiconductor element that suppresses the peeling of the frame from the main surface of the substrate and suppresses a decrease in hermeticity. There is to do.

An optical semiconductor element housing package of one embodiment of the present invention includes a substrate having a mounting region for mounting an optical semiconductor element on a main surface, and the optical semiconductor element together with the substrate bonded to the main surface of the substrate A frame portion constituting a main body of a package for housing the substrate, a protruding portion which is disposed outside a side surface located in the long side direction of the substrate and protrudes downward, and is positioned between the frame portion and the protruding portion. And a frame body having an optical fiber attachment portion for connecting the frame portion and the protruding portion.

The optical semiconductor element storage package is characterized in that the projecting portion is joined to the side surface located in the long side direction of the substrate.

An optical semiconductor device according to one embodiment of the present invention includes an optical semiconductor element storage package and an optical semiconductor element mounted in a mounting region.

It is a perspective view which shows the package for optical semiconductor element accommodation of one Embodiment of this invention. It is the side view which looked at the optical semiconductor element accommodation package shown in FIG. 1 from the X direction. It is a top view of the package for optical semiconductor element accommodation shown in FIG. FIG. 4 is a cross-sectional view taken along Y-Y ′ in the optical semiconductor element housing package shown in FIG. 3. It is a disassembled perspective view which shows the optical semiconductor device using the package for optical semiconductor element accommodation shown in FIG.

<Configuration of Optical Semiconductor Element Storage Package 1>
Hereinafter, an optical semiconductor element housing package 1 and an optical semiconductor device 10 according to an embodiment of the present invention will be described with reference to the drawings.

FIG. 1 is a perspective view showing an optical semiconductor element housing package 1 according to an embodiment of the present invention. As shown in FIGS. 1 to 4, an optical semiconductor element housing package 1 according to an embodiment of the present invention includes a substrate 2 and a frame 3 provided on the main surface of the substrate 2.

The substrate 2 is a member for mounting the optical semiconductor element 6. The substrate 2 has a mounting area 20 for mounting the optical semiconductor element 6 on the main surface. The substrate 2 has a rectangular shape having a long side and a short side when viewed in plan.

The substrate 2 has a first side surface 21 and a second side surface 22 that are parallel to the short side direction. The substrate 2 has a third side surface 23 and a fourth side surface 24 that are parallel to the long side direction. The third side surface 23 and the fourth side surface 24 are located between the first side surface 21 and the second side surface 22. That is, the first side surface 21 and the second side surface 22 are side surfaces positioned in the long side direction of the substrate 2, and the third side surface 23 and the fourth side surface 24 are side surfaces positioned in the short side direction of the substrate 2. is there.

The substrate 2 is made of, for example, a metal material. In the optical semiconductor element housing package 1 of the present embodiment, the material of the substrate 2 is copper tungsten. The thermal expansion coefficient of copper tungsten employed for the substrate 2 is, for example, 6 × 10 ⁻⁶ (1 / K).

The frame body 3 is a member for hermetically sealing the optical semiconductor element 6 together with the substrate 2 and the lid body 7. The frame 3 includes a frame part 30, a projecting part (first projecting part 31 and second projecting part 32), and an optical fiber attaching part (first optical fiber attaching part 33 and second optical fiber attaching part). 34).

The frame portion 30 is provided on the main surface of the substrate 2 so as to surround the mounting area 20. The frame portion 30 is a portion constituting a main body of a package that houses the optical semiconductor element 6 together with the substrate 2. The frame portion 30 of this embodiment is disposed on the main surface of the substrate 2. Further, the frame portion 30 is joined to the main surface of the substrate 2 via a joining member. Examples of the material of the joining member include solder or a brazing material such as silver brazing. In addition, the frame part 30 has a frame shape when viewed in plan.

The projecting portions 31 and 32 are portions which are located outside the side surfaces 21 and 22 located in the long side direction of the substrate 2 and project downward. Specifically, the first projecting portion 31 is a portion located outside the first side surface 21 of the substrate 2 and projecting downward, and the second projecting portion 32 is the second side surface 22 of the substrate 2. It is the part which is located outside and protrudes downward.

The first protrusion 31 is bonded to the first side surface 21 of the substrate 2 via a bonding member. Moreover, the 1st protrusion part 32 is joined to the 2nd side 22 of the board | substrate 2 via the joining member. The material of the joining member is the same as described above.

The first optical fiber attachment portion 33 and the second optical fiber attachment portion 34 are portions for attaching an optical fiber. The first optical fiber attachment portion 33 is formed from the frame portion 30 to the first protruding portion 31 and is located between the frame portion 30 and the first protruding portion 31. The first optical fiber attachment portion 33 connects the frame portion 30 and the first protruding portion 31. The second optical fiber attachment part 34 is formed from the frame part 30 to the second protrusion part 32, and is located between the frame part 30 and the second protrusion part 32. The second optical fiber attachment portion 34 connects the frame portion 30 and the second projecting portion 32.

Further, the first optical fiber attachment portion 33 and the second optical fiber attachment portion 34 are formed with optical fiber through holes through which the optical fibers are inserted. An annular holding member having a holding hole through which the optical fiber is inserted and held is disposed on the outer surface of the first optical fiber mounting portion 33 and the outer surface of the second optical fiber mounting portion 34. Yes. The holding hole of the holding member overlaps the optical fiber through hole.

The frame 3 is made of a metal material. In the optical semiconductor element housing package 1 of the present embodiment, an iron-nickel-cobalt alloy is used as the material of the frame 3. The thermal expansion coefficient of the iron-nickel-cobalt alloy employed in the frame 3 is, for example, 4.4 × 10 ⁻⁶ (1 / K).

The thermal expansion coefficient of the frame 3 is smaller than the thermal expansion coefficient of the substrate 2. When the substrate 2 and the frame portion 30 are thermally expanded by the heat of driving the optical semiconductor element 6, the substrate 2 is likely to have a large thermal expansion in the long side direction. A large stress is applied to the portion along the long side direction. When such stress is applied, the substrate 2 is warped, and the frame body 32 may be peeled off from the main surface of the substrate 2 along the long side direction of the substrate 2.

On the other hand, in the optical semiconductor element housing package 1, the first protrusion 31 is joined to the first side surface 21 located in the long side direction of the substrate 2, and the second protrusion 32 is the substrate. 2 is joined to the second side face 22 located in the long side direction. Thereby, even if the substrate 2 is thermally expanded in the long side direction by the heat of driving the optical semiconductor element 6, the first protrusion 31 reduces the expansion amount of the substrate 2 in the long side direction, and the second The protrusion 32 can reduce the expansion amount of the substrate 2 in the long side direction. Accordingly, since the thermal expansion of the substrate 2 in the long side direction can be reduced, the stress applied to the main surface of the substrate 2 and the joint portion of the frame portion 30 can be reduced, and the frame body 30 is prevented from peeling off from the main surface of the substrate 2. Thus, it is possible to prevent the airtightness of the optical semiconductor element housing package 1 from being lowered.

The frame 3 has a through-hole 35 formed from the first protrusion 31 to the first optical fiber attachment 33. Similarly, it has a through hole 35 formed from the second protrusion 32 to the second optical fiber attachment 34. The through hole 35 is used as a screw fixing hole. Since the frame 3 has holes for screwing, the optical semiconductor element housing package 1 can be easily mounted on the external substrate. In addition, since the area of the main surface of the substrate 2 can be ensured as compared with the case where a through hole for screwing is provided in the substrate 2, it is easy to ensure the space inside the frame portion 30.

Further, the upper ends of the first optical fiber attachment portion 33 and the second optical fiber attachment portion 34 are lower than the upper end of the frame portion 30 in the vertical direction perpendicular to the long side direction and the short side direction of the substrate 2. Yes. This makes it difficult for the upper portion of the screw to protrude upward from the frame portion 30 when the through hole 35 is screwed. Accordingly, when the lid body 7 is provided on the frame portion 30 of the optical semiconductor element housing package 1, it is difficult to apply stress due to screwing to the joint portion of the lid body 7 and the frame body 30. Furthermore, since the upper portion of the screw does not protrude, the optical semiconductor element housing package 1 can be reduced in height.

The frame part 30 is inserted with lead terminals 4 that electrically connect the inside and outside of the frame part 30 and an input / output terminal 5 for transmitting a high-frequency signal between the inside and outside of the frame part 30. Yes. The lead terminal 4 and the input / output terminal 5 are electrically connected to the optical semiconductor element 6 through bonding wires or the like.

<Configuration of Optical Semiconductor Device 10>
As shown in FIG. 5, the optical semiconductor device 10 includes an optical semiconductor element housing package 1, an optical semiconductor element 6, and a lid body 7. The optical semiconductor device 10 in the present embodiment uses an optical modulation element as the optical semiconductor element 6 and functions as an optical modulator. The optical semiconductor device 10 according to the present embodiment converts the light incident from one of the first optical fiber attachment portion 33 or the second optical fiber attachment portion 34 by the optical semiconductor element 6 to obtain the first optical fiber attachment portion. 33 or the other of the second optical fiber attachment portions 34.

The optical semiconductor element 6 is mounted on the mounting area 20 in the main surface of the substrate 2. As the optical semiconductor element 6, for example, a light emitting element that emits light to the optical fiber represented by the above-described light modulation element, LD element, or a light receiving element that receives light from an optical fiber represented by a PD element Is mentioned. The optical semiconductor element 6 is electrically connected to the input / output terminal 5 and the lead terminal 4 via a bonding wire or the like. The optical semiconductor element 6 is electrically connected to an external circuit through the bonding wire, the input / output terminal 5, the lead terminal 4, and the like.

The lid body 7 is provided on the frame portion 30 of the frame body 3. The lid body 7 is joined by closing the opening of the frame portion 30. Thereby, the optical semiconductor element 6 is hermetically sealed. As described above, since the optical semiconductor element 6 is hermetically sealed, deterioration of the optical semiconductor element 6 due to the use of the optical semiconductor device 10 for a long period of time can be suppressed.

As the material of the lid 7, for example, a metal material such as iron, copper, nickel, chromium, cobalt, or tungsten can be used. Alternatively, an alloy made of these metals can be used.

The frame body 3 and the lid body 7 may be directly joined. For example, a metal frame having a shape that overlaps the frame body 3 when viewed in plan, a so-called seal ring is sandwiched therebetween. May be.

Since the optical semiconductor device 10 according to this embodiment includes the optical semiconductor element housing package 1 described above, the thermal expansion of the substrate 2 in the long side direction of the substrate 2 can be reduced. The stress applied to the joint portion 30 can be reduced, and the frame body 30 can be prevented from being peeled off from the main surface of the substrate 2.

It should be noted that the present invention is not limited to the above-described embodiment, and various changes and improvements can be made without departing from the gist of the present invention.

For example, in the present embodiment, the first protrusion 31 and the second protrusion 32 are joined to the side surfaces (the first side surface 21 and the second side surface 22) of the substrate 2 that are positioned in the long side direction. However, it is not limited to this. Further, the first optical fiber attachment portion 33 and the second optical fiber attachment portion 34 wrap around the side surfaces (the third side surface 23 and the fourth side surface 24) in the short side direction of the substrate 2, and the side surfaces ( The third side surface 23 and the fourth side surface 24) may be joined.

In the present embodiment, the frame body 3 has the first projecting portion 31 and the second projecting portion 32, but the present invention is not limited to this. Specifically, the frame 3 may have only one of the first protrusion 31 or the second protrusion 32.

In the present embodiment, both the first protrusion 31 and the second protrusion 32 are provided with optical fiber attachment parts (the first optical fiber attachment part 33 and the second optical fiber attachment part 34). However, it is not limited to this. Specifically, the optical fiber attachment portion may be provided only on one of the first protrusion 31 or the second protrusion 32.

<Method for Manufacturing Optical Semiconductor Element Storage Package 1 and Optical Semiconductor Device 10>
A method for manufacturing the optical semiconductor element housing package 1 and the optical semiconductor device 10 shown in FIG. 5 will be described below. In addition, this invention is not limited to the following embodiment.

First, the substrate 2, the frame 3 and the holding member are produced. Each of the substrate 2, the frame body 3, and the holding member is manufactured by forming an ingot obtained by casting a molten metal material into a mold and solidifying it into a predetermined shape by using a metal processing method. The frame 3 is formed with a frame portion 30, a first protrusion portion 31, a second protrusion portion 32, a first optical fiber attachment portion 33, and a second optical fiber attachment portion 34. Is done.

Next, a joining member is disposed in the region along the outer periphery of the main surface of the substrate 2, the first side surface 21 and the second side surface 22. The frame 30 is joined to the main surface of the substrate 2, the first protrusion 31 is joined to the first side surface 21, and the second projection 32 is joined to the second side surface 22. 3 is arranged. When the frame 3 is disposed on the substrate 2, the first protrusion 31 comes into contact with the first side surface 21 and the second protrusion 32 comes into contact with the first side surface 22. The positional deviation between the frame 3 and the substrate 2 in the long side direction can be reduced. As a result, the accuracy in aligning the frame 3 and the substrate 2 is easily improved.

Next, a joining member is arranged on the outer surface of the first optical fiber attachment portion 33 and the second optical fiber attachment portion 34, and the holding member is joined. Here, a first protrusion 31 is formed below the first optical fiber attachment portion 33, and a third protrusion 32 is formed below the second optical fiber attachment portion 34. ing. Accordingly, when the holding member is arranged, the space of the first projecting portion 31 and the second projecting portion 32 can be used, so that the holding member can be more easily arranged on the substrate 2 side. Since it becomes easy to dispose the holding member on the substrate 2 side, it is possible to reduce the thickness of the member such as the optical semiconductor element 6 disposed in the frame portion 30. Easy to manufacture.

Next, the lead terminal 4 and the input / output terminal 5 are inserted into the frame 3. Then, the optical semiconductor element 6 is disposed on the main surface of the substrate 2, and the optical semiconductor element 6 is connected to the lead terminal 4 and the input / output terminal 5 via a bonding wire or the like. Furthermore, the optical semiconductor element storage package 1 can be sealed with the lid 7 to manufacture the optical semiconductor device 10.

1: Optical semiconductor element storage package 2: Substrate 20: Mounting region 21: First side surface 22: Second side surface 23: Third side surface 24: Fourth side surface 3: Frame body 30: Frame portion 31: First 1 protrusion 32: 2nd protrusion 33: 1st optical fiber attachment part 34: 2nd optical fiber attachment part 35: Through-hole 4: Lead terminal 5: Input / output terminal 6: Optical semiconductor element 7: Cover Body 10: optical semiconductor device

Claims (4)

A substrate having a mounting area for mounting an optical semiconductor element on the main surface;
A frame portion which is bonded to the main surface of the substrate and constitutes a main body of a package which accommodates the optical semiconductor element together with the substrate, and is disposed on the outer side of the side surface located in the long side direction of the substrate and below. An optical semiconductor element housing package comprising: a projecting portion projecting into a frame; and a frame body having an optical fiber mounting portion that is positioned between the frame portion and the projecting portion and connects the frame portion and the projecting portion. ,
The package for housing an optical semiconductor element, wherein the protruding portion is joined to the side surface located in the long side direction of the substrate. When the protruding portion is a first protruding portion, the side surface of the substrate joined to the first protruding portion is a first side surface, and the optical fiber mounting portion is a first optical fiber mounting portion In addition,
The substrate has a second side parallel to the first side;
The frame body is positioned outside the second side surface and protrudes downward, and is positioned between the frame portion and the second protrusion portion, and the frame portion and the second protrusion portion. A second optical fiber mounting portion for connecting the protruding portion of
2. The optical semiconductor element housing package according to claim 1, wherein the second projecting portion is joined to the second side surface of the substrate. 3. The optical semiconductor element storage package according to claim 2, wherein a thermal expansion coefficient of the substrate is larger than a thermal expansion coefficient of the frame. An optical semiconductor device comprising the optical semiconductor element storage package according to claim 1 and an optical semiconductor element mounted in the mounting area.

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