Classifications

• • C—CHEMISTRY; METALLURGY
  • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
  • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
  • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
  • C25D17/008—Current shielding devices
• • C—CHEMISTRY; METALLURGY
  • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
  • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
  • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
  • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
• • C—CHEMISTRY; METALLURGY
  • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
  • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
  • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
  • C25D17/06—Suspending or supporting devices for articles to be coated
• • C—CHEMISTRY; METALLURGY
  • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
  • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
  • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
  • C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating

Definitions

• the embodiment features an apparatus for fluid processing a workpiece.
• the apparatus includes a housing capable of containing a fluid and a workpiece holder disposed within the housing and adapted to retain the workpiece.
• the apparatus also includes a member disposed within the housing adjacent the workpiece holder and adapted to move substantially parallel to a surface of the workpiece with a non-uniform oscillatory motion to agitate the fluid.
• the non-uniform oscillatory motion includes a reversal position that changes after each stroke of the non-uniform oscillatory motion.
• the non-uniform oscillatory motion can include a primary oscillation stroke and at least one secondary oscillation stroke. The length of the primary oscillation stroke can be substantially the same as the separation of spaced openings defined by the member, and a secondary oscillation stroke can change the reversal position of the non-uniform oscillatory motion of the member.
• the embodiment provides a method of fluid processing a workpiece.
• the method includes disposing a workpiece holder within a housing capable of containing a fluid.
• the workpiece holder retains the workpiece.
• the method also includes positioning a member within the housing adjacent the workpiece holder and agitating the fluid by moving the member substantially parallel to a surface of the workpiece with a non-uniform oscillatory motion.
• the method can include minimizing electric field imaging and/or fluid flow imaging of the member on the surface of the workpiece via the non-uniform oscillatory motion.
• the method includes removing gas bubbles entrapped in the fluid from the surface of the workpiece.
• the method can include minimizing electric field imaging and/or fluid flow imaging of the member on the surface of the workpiece via a non ⁇ uniform oscillatory motion.
• the method includes removing gas bubbles entrapped in the fluid from the surface of the workpiece.
• the method can include depositing or dissoluting a metal or a plastic on a surface of the workpiece.
• the method includes forming a non-periodic fluid boundary layer at the surface of the workpiece via the non-uniform oscillatory motion of the member.
• the method includes decreasing a fluid boundary layer thickness at the surface of the workpiece via the non-uniform oscillatory motion of the member.
• the apparatus also includes a plate disposed adjacent the member to shape the electric field incident on a surface of the workpiece.
• a body of the plate can define a plurality of holes, diameters of which varying on a surface of the plate.
• the plurality of holes can vary in a substantially radial pattern.
• the member can form a non-periodic fluid boundary layer at the surface of the workpiece.
• the member reduces a fluid boundary layer thickness at the surface of the workpiece, e.g., to less than about at 10 ⁇ . In one embodiment, the member is positioned less than about 2 mm from the surface of the workpiece.
• the embodiment features a method of fluid processing a workpiece.
• the method includes disposing a workpiece holder within a housing capable of containing a fluid and positioning a member within the housing adjacent the workpiece holder.
• the workpiece holder retains the workpiece, and the member defines a plurality of spaced openings.
• the method also includes agitating the fluid with the plurality of spaced openings by moving the member substantially parallel to a surface of the workpiece.
• the embodiment features an apparatus for fluid processing a workpiece.
• the apparatus includes a mean for retaining the workpiece in a housing capable of containing a fluid, and a means for agitating the fluid with a non-uniform oscillatory motion substantially parallel to a surface of the workpiece.
• the embodiment provides an apparatus for varying an electric field at a surface of a workpiece.
• the apparatus includes a mean for retaining the workpiece in a housing capable of containing a fluid, and a means defining a plurality of holes having distribution of hole sizes for varying the electric field incident on the surface of the workpiece.
• the embodiment features an apparatus for fluid processing a workpiece.
• the apparatus includes a mean for retaining the workpiece in a housing capable of containing a fluid, and a means defining a plurality of spaced openings for agitating the fluid with a motion substantially parallel to a surface of the workpiece .
• FIG. 1 depicts a block diagram of an exemplary production system for a workpiece.
• FIG. 2 shows a perspective view of an illustrative embodiment of a workpiece holder according to the invention.
• FIG. 4 shows a cross-section of an exemplary workpiece holder according to the invention.
• FIG. 5 depicts an exploded view of another exemplary workpiece holder according to the invention.
• FIGS. 8A-8C depict diagrammatic representations of the movement and action of the member and the flex feature (s) of an apparatus for retaining a workpiece according to the invention.
• FIG. 9 depicts a perspective view of another exemplary workpiece holder including a hole bored through for processing a plurality of surfaces of a workpiece according to the invention.
• FIG. 10 shows an exploded view of an exemplary apparatus for processing a workpiece according to the invention .
• FIG. 11 depicts a sectional view of another exemplary embodiment of an apparatus for processing a workpiece according to the invention.
• FIG. 14 shows a section view of another exemplary embodiment of a member for agitating a fluid during fluid processing of a workpiece according to the invention.
• FIG. 15 depicts a diagrammatic representation of the position of a portion of a member for agitating a fluid adjacent a workpiece surface during a oscillatory motion according to the invention.
• FIG. 16 shows a diagrammatic representation of oscillatory motion of a portion of a member adjacent a workpiece surface for agitating a fluid according to the invention .
• FIG. 17 shows a graphical view of an exemplary non-uniform oscillation profile for agitating a fluid during fluid processing of a workpiece according to the invention .
• FIG. 18 depicts a graphical view of another exemplary non-uniform oscillation profile for agitating a fluid during fluid processing of a workpiece according to the invention.
• FIG. 19 shows a graphical view of boundary layer thickness versus fluid agitation speed according to the invention .
• FIG. 20A depicts a plan view of an exemplary embodiment of a plate for varying an electric field during processing of a workpiece according to the invention.
• FIG. 20B depicts a plan view of an exemplary embodiment of a plate for varying an electric field during processing of a workpiece according to an aspect of the invention .
• FIG. 20C depicts a plan view of an exemplary embodiment of a plate for varying an electric field during processing of a workpiece according to an aspect of the invention .
• FIGS. 20D-20J illustrate exemplary contours of a plate for controlling fluid flow and/or an electrical field during processing of a workpiece according to an aspect of the invention.
• FIG. 20K is a cross sectional view of a portion of plate for controlling fluid flow and/or an electrical field during processing of a workpiece according to an aspect of the invention.
• FIG. 21A shows a plan view of an exemplary loading station for workpieces according to the invention.
• FIG. 21B shows a side view of the loading station depicted in FIG. 21A.
• FIG. 22 shows a perspective view of a contoured fluid agitation member
• FIG. 23 shows a perspective view of a contoured fluid agitation member
• FIG's. 25A-25E show section views of a contoured fluid agitation member
• FIG. 26 shows a cross section of a contoured region of a contoured fluid agitation member near a contact ring seal, workpiece and workpiece holder;
• FIG. 29 shows a cross section of a contoured micro hole shield plate
• FIG. 30 a cross section of a contoured region of a contoured micro hole shield plate.
• FIG. 1 illustrates an exemplary production system 10 for a workpiece.
• the production system 10 can utilize various features of the invention.
• the production system 10 can include a loading station 14 for delivering a workpiece to a workpiece holder 18.
• the production system 10 can also include one or more modules 22, e.g., process modules, for processing a workpiece.
• the loading station 14 and the one or more modules 22 can be mounted in a single framework, or in adjacent frameworks.
• the framework can include a transport system 26 for moving a workpiece holder 18 from the loading station 14 to a first module and between modules.
• An exemplary production system is a Stratus System available from NEXX Systems, Inc. in Billerica, Mass.
• the workpiece can be planar, substantially planar, and/or thin or ultra-thin.
• the workpiece has a circular shape or a substantially circular shape.
• the workpiece is non-circular.
• the workpiece can be rectangular, square, oval, or triangular, or have another suitable geometric configuration.
• the workpiece can be, for example, a semiconductor wafer, silicon workpiece, interconnection substrate, printed circuit board, or other workpiece suitable for processing.
• the loading station 14 can be an automated loading station, such as an automated wafer handling front end available from Newport Automation in Irvine, Calif, or Brooks Automation in Chelmsford, Mass.
• the workpiece holder 18, according to the invention can be used to retain a single workpiece, or a plurality of workpieces.
• the workpiece holder 18 can utilize a back-to-back configuration for two or more workpieces.
• the workpiece holder 18 can have a hole bored through its center for processing a plurality of surfaces of a single workpiece.
• Each of the one or more modules 22, according to the invention can be used for cleaning, rinsing, drying, pretreating, plating, buffering/holding, etching, electrodeposit ing, electroplating, electroetching, electrodissolution, electroless depositing, electroless dissolution, photoresist depositing, photoresist stripping, chemical etch processing, seed layer etching, and similar processes requiring fluid flow and/or electric field control and use.
• the workpiece is retained by the workpiece holder 18 while processing is performed.
• Each of the one or more modules 22 and/or the workpiece holder 18 can be used to apply a variety of films to a surface of a workpiece, including, but not limited to, metal, plastic, and polymer films.
• Suitable metals include, but are not limited to, copper, gold, lead, tin, nickel, and iron.
• alloys, compounds, and solders of these metals e.g., lead/tin and nickel/iron can be applied to a workpiece surface.
• the film deposited can have a thickness between about 1 lm and about 150 lm.
• the film can be high purity, and the thickness can be uniform across the surface of the workpiece.
• the film can have uniform electrical properties on (i) a flat, continuous uniform surface, (ii) on a flat continuous surface with micro-scale topography, and/or (iii) on a flat surface with topography and/or photo-resist patterning .
• the production system 10 can include between one and thirty modules, although additional modules can be used depending on the application.
• Various novel features of the one or more modules 22 are described in more detail below.
• Each of the one or more modules 22 can include a robust and modular construction so that it can be removed from the production system 10.
• the production system 10 can be customizable for specific applications.
• a module and a workpiece holder can be configurable for processing different sized workpieces, e.g., 150, 200, 250 or 300 mm wafers, with minimal lost production time during customization .
• the layout of a processing system can orient a workpiece in a vertical configuration.
• a vertical configuration can enable a significant number of workpieces to be processed simultaneously. For example, for a process time longer than about 10 minutes, over 20 workpieces can be processed simultaneously.
• a vertical configuration can facilitate the removal of air or gas bubbles from the surface of a workpiece.
• the production system 10 itself can be manual or automated.
• the production system 10 can include a computer that controls the operation of the loading station 14 and/or the transport system 26, as well the one or more modules 22.
• a freshly loaded workpiece is transported from the loading station 14 to the most distant module, and then subsequent processing returns the finished workpiece to the loading station 14.
• FIG. 2 shows an illustrative embodiment of a workpiece holder 18 for retaining a workpiece 30.
• the workpiece holder 18 includes a handle 34 that can be used to lift and/or transport the workpiece holder 18.
• the handle can be engageable with the transport mechanism 26 shown in FIG. 1.
• the workpiece holder 18 also includes a body 38 and a ring 42 for contacting the workpiece 30.
• the body 38 of the workpiece holder 18 is formed from a plastic, such as high density polyethylene (HDPE) or polyvinylidene fluoride (PVDF) .
• the body 38 can also include a guide strip (shown in FIGS. 5 and 6) formed in at least one edge 44. The guide strip (s) can be used to align the workpiece holder 18 in one of the modules 22.
• HDPE high density polyethylene
• PVDF polyvinylidene fluoride
• the ring 42 can press, hold, and/or retain the workpiece 30 against the body 38 of the workpiece holder. Contact between the workpiece 30 and the ring 42 occurs at the outer perimeter of the workpiece 30, e.g., by contacting less than 2 mm of the outer perimeter of the workpiece 30.
• the ring 42 includes a flexible member encased in an elastomer. Portion (s) of the elastomer can be used to contact the workpiece 30, and, in some embodiments, can create a seal with the workpiece 30.
• the first and second planes are parallel to each other and spaced apart.
• the first and second planes form an angle.
• the first and second planes are orthogonal.
• the first and second planes form either an acute angle or an obtuse angle. It is understood that the invention is not limited to a workpiece holder with only two planes. Embodiments using a single plane or more than two planes can be used. Two planes are used here to illustrate an exemplary embodiment of an apparatus retaining a plurality of workpieces.
• the workpieces are held in a back-to-back configuration, and, in a detailed embodiment, the workpieces are centered on each other in the back-to- back configuration. In some embodiments, the workpieces are held on distinct surfaces of the workpiece holder and are offset from one another. In another embodiment, a plurality of workpieces can be held on a single surface of a workpiece holder, e.g., in a side-by-side configuration. In some embodiments, a plurality of workpieces can be held on one surface of a workpiece holder, while at least one additional workpiece is held on a second surface of a workpiece holder.
• the body 38' of the workpiece holder 18'' defines a groove 54 for holding at least a member 58, a backing member 62, and a bladder 66.
• the member 58 is flexible, and can also be referred to as a flexure plate.
• the member 58 can have a circular shape, a substantially circular shape, or be non- circular (e.g., rectangular, square, oval, or triangular, or have another suitable geometric configuration) .
• the member 58 can be a ring or a plate, and in one detailed embodiment, can have a substantially planar ring-shape.
• the member 58 can be formed from a spring-like material, such as stainless steel or titanium.
• the member 58 can include at least one retaining feature (e.g., as shown in FIGS. 5 and 6) that can engage at least one engagement feature of the ring, for example, engagement feature 70 of the ring 42.
• the ring 42' and the member 58 are removably attached to the workpiece holder 18''.
• the backing member 62 can be a plate or a push plate, and can include at least one push pin 74.
• the backing member 62 can have a circular shape, a substantially circular shape, or be non-circular.
• the backing member 62 can be a ring or a plate.
• the backing member 62 can be formed from a metal, a plastic, or a polymer material.
• the bladder 66 which can be a pneumatic bladder, defines a cavity 78 that can be filled with a fluid, such as air, to inflate the bladder 66. When inflated, the bladder 66 pushes against the backing member 62 causing the at least one push pin 74 to contact the member 58, which causes the member to flex.
• the bladder 66 can have a circular shape, a substantially circular shape, or be non-circular, and, in various embodiments, can be a ring or a plate.
• the bladder 66 can be formed from a fluoroelastomer , urethane, or mylar material.
• FIGS. 5 and 6 show exploded views of another exemplary workpiece holder 18''' for retaining the workpiece 30.
• FIG. 5 shows the view from a first perspective
• FIG. 6 shows the view from a second perspective.
• This embodiment of the workpiece holder 18''' includes the ring 42', the groove 54, the backing member 62, and the bladder 66.
• the workpiece holder 18''' can also include a handle 34' and a member 58'.
• the workpiece holder 18''' shown in FIGS. 5 and 6 also includes a body 38'', which can include a guide strip 82.
• the recess 50 defined in the body 38'' includes multiple contact points 46 for providing support to the workpiece 30.
• the body 38'' includes at least one port 86 for providing a fluid to the bladder 66 and/or vacuum to the underside of the ring 42' via ducts (not shown) in the body 38''.
• the body 38'' can also include at least one electrical contact 90 to communicate electrical current to the workpiece 30.
• the backing member 62 can be connected to a stud 92 that is engageable with the body 38''.
• the stud 92 provides a force to contact the backing member 62 to the member 58'.
• the ring 42' illustrated in FIG. 6 includes at least one engagement feature 70, which, in one embodiment, is formed as one or more studs.
• a sealing groove 94 can circumscribe the outer perimeter of the ring 42'.
• the sealing groove 94 which can be an elastomer region of the ring 42', can mate with a sealing boss 98 that can circumscribe a perimeter of the workpiece holder 18'''. In one embodiment, this mating forms a barrier to fluid entry, e.g., a fluid-tight seal, between the workpiece holder 18''' and the ring 42'.
• the ring 42' also includes an inner sealing surface 102 that can form a barrier to fluid entry with the workpiece 30.
• the inner sealing surface 102 can form an electrical connection with the workpiece 30 as well.
• the inner sealing surface 102 can include flexure fingers that contact the workpiece 30.
• the flexure fingers can include exposed terminal tips for making electrical contact.
• the electrical current path can carrying up to 75 amps of electrical current to the workpiece surface and can allow for independent electrical current control to a plurality of workpieces .
• the member 58' defines at least one retaining feature 110 and at least one flex feature 114.
• the member 58' can include at least one tab section 118.
• the features of the member 58' can be cut, e.g., laser cut, into the member 58'.
• the at least one retaining feature 110 can be engageable with the at least one engagement feature 70 of the ring 42'.
• the at least one retaining feature 110 can be a keyhole slot or a capture slot cut into the member 58'.
• the at least one flex feature 114 has a ram's head shape.
• the member 58' defines a plurality of flex features 114.
• the plurality of the flex features 114 can provide an effective long path around the main body 122 of the member 58' to allow for substantial flexing of the member 58'.
• the plurality of flex features 114 can provide a force at least substantially uniformly around the perimeter of an object, e.g., a workpiece 30, when the member is flexed. The force can be provided substantially normal to the plane of the member 58'. When the force is applied, the ring 42' can retain the object.
• the flex feature (s) 114 in this embodiment or in other embodiments, can be formed about a perimeter of the member 58', e.g., an inner perimeter, an outer perimeter, or on both the inner and outer perimeters.
• the groove 54 e.g., a ring shaped cavity defined in the body 38'', can include at least one tooth feature 126 that can engage at least one tab section 118 of the member 58'.
• a force arises between the tab sections 118 perpendicular to the plane of the workpiece 30.
• the force between the member 58' and the ring 42' can be removed by inflating the bladder 66 so that the backing member 62 contacts the member 58' (with or without push pins 74) to deform it.
• the force engaging the engagement feature (s) 70 is relaxed so that they can be disengaged from the retaining feature (s) 110.
• the force engaging the engagement feature (s) 70 is relaxed so that the ring 42' can be rotated and moved away from the workpiece holder 18'''.
• the first workpiece can be removed from the ring 42', and if desired, a fresh workpiece can be disposed on the ring 42'.
• the integrity of the barrier is considered to be verified (e.g., about 10 percent in less than about 5 seconds) . If the vacuum changes at a faster rate, the ring 42' may not be mounted properly, and the workpiece can be unloaded and reloaded.
• FIG. 7 shows a detailed view of a portion 128 of the member 58', including retaining features 110, flex features 114, and tab sections 118.
• the member 58' defines lines 130 and 134 extending about the inner and outer perimeters of the member 58', respectively.
• the lines 130 and 134 are cut at least substantially through the main body 122.
• the lines 130 and 134 are cut through the main body 122.
• the lines do not extend continuously about the perimeters. Instead, the lines 130 and 134 are series of distinct lines.
• line 130a extends from a first retaining features 114a to an adjacent flex features 114b.
• using a series of distinct lines can provide a substantially long path around a perimeter of the member along which the member can be flexed. Furthermore, using a series of distinct lines can promote an at least substantially uniform force from the perimeter .
• FIG. 10 shows an exemplary apparatus for processing (e.g., fluid processing) a workpiece.
• the apparatus can include a module 22, which itself can include a housing 200.
• the module 22 contains a fluid, e.g., the housing 200 defines a cavity in which the fluid can be disposed.
• the apparatus also includes an embodiment of the workpiece holder 18, a member 204, a plate 208, and an anode 212. In some embodiments, one or more of these elements are not used or are not present. Variations are described in more detail below.
• the member 204, the plate 208 and/or the anode 212 are disposed within the module 20 and/or the housing 200. Because of the modular design, these elements can be removably or fixably disposed within the housing 200.
• the weight of the member 204 and the inertial forces incurred during reciprocating motion of the member 204 is supported by the linear motors via the magnetic field forces between the motor slider and the motor windings rather than by mechanical bearings.
• the one or more motors 216 can be computer controlled.
• FIG. 11 shows cross-section of another exemplary embodiment of an apparatus for processing a workpiece.
• This embodiment can be used, for example, to process two workpieces simultaneously.
• a housing 200' includes a side wall 224 and end walls 226, and the relative positioning of members 202, members 204a and 204b, plates 208 and anodes 212 is shown. These elements or the distances are not shown to scale.
• the members 204a and 204b are shown as two separate structures, they can form a single assembly.
• the first and second plates 232 and 234 can be joined by one or more spacer features 244 and to form the member 204 '.
• the first and second plates 232 and 234 are shown attached to the spacer features 244 by screws 248, although other means may be used, including, but not limited to, rivets, glues, epoxies, adhesives, or outer suitable attachment means.
• the plates 232 and 234 and the spacer features 244 can define a cavity in which an embodiment of the workpiece holder 18 can be inserted during processing.
• the spacer features 244 can facilitate alignment of the member 204' to the workpiece holder 18.
• the relationship between the guide wheels and the alignment wheels can be such that the member 204 or 204 ' to the workpiece surface is consistent to within less than about 1/4 mm. This promotes a substantially uniform fluid boundary layer to occur at the workpiece surface when the member 204 or 204 ' is moved substantially parallel to the workpiece surface.
• FIG. 13 shows a cross-section of another exemplary embodiment of a member 204'' for agitating a fluid during fluid processing of a workpiece.
• the spaced blades 240' have a cup shape.
• the spaced bladed 240' are shown adjacent the workpiece 30 being retained on the workpiece holder 18 using the ring 42.
• the series of spaced openings 236 and/or the series of spaced blades 240' agitate the fluid when the member 204'' is moved.
• an edge surface of a spaced blade 240' agitates the fluid.
• the edge surface can be a side surface, a pointed surface, or a rounded surface.
• FIG. 18 shows a graphical representation of another exemplary non-uniform oscillation profile 300 for agitating a fluid during fluid processing of a workpiece.
• the separation of the center points 252 is about 20 mm.
• the primary oscillation stroke is substantially the same as the separation between the center point 252 and an adjacent center point of the member 204x.
• the first secondary oscillation stroke is about 30 mm.
• the second secondary oscillation stroke is about 40 mm.
• the oscillatory motion can include additional secondary oscillation strokes.
• Line 304 shows the relative travel of the center point as a result of the primary oscillation stroke.
• Line 308 shows the relative travel of the center point as a result of the first secondary oscillation stroke.
• Line 312 shows the relative travel of the center point as a result of the second secondary oscillation stroke.
• FIG. 20 depicts an exemplary embodiment of a plate 208' for varying an electric field during processing of a workpiece 30. Varying the electric field at the workpiece surface can promote uniform deposition of a film, although the electric potential drop through the workpiece surface varies from the workpiece perimeter to the workpiece center.
• at least a portion of the plate 208' is fabricated from a non-conducting material that can block the electric field as it passes from the plane of the anode 212 to the plane of surface of the workpiece 30.
• the plate 208' has a substantially circular shape, but it should be understood that the plate 208, 208' can have any suitable size, shape and/or configuration.
• the plate 208' can include fastening holes 314 for connecting the plate 208' to the housing 200 or 200', or to a support feature (not shown) that suspends the plate 208' in the housing 200 or 200'.
• the diameter of the holes is between about 0.1 mm and about 20 mm, although larger and smaller diameter holes can be used depending on the application.
• the largest diameter holes can be about 5 mm in diameter.
• the smallest diameter holes can have a diameter of about 1 mm.
• the diameter of the holes in plate 700 (which is substantially similar to plates 208 and 208 ') vary in the direction of arrow 701 such that the diameter of the holes increases (i.e. is greatest) towards a centerline 702 of the plate and decreases as the distance from the centerline increases.
• FIG. 20C Another example, of a hole size gradient is shown in FIG. 20C where the diameter of the holes in plate 710 increases in the direction of arrow 703. It should be understood that the directions 701, 703 are only exemplary and that the hole size gradients may be oriented in any suitable direction.
• the surface of the plates may be contoured in any suitable manner to vary a distance between, for example the plate 208 and the shear plate 204 and/or the workpiece 30.
• contour or controlled are used for description purposes herein to refer to one or more portions or areas of the member (e.g. plate 208 or shear plate 204 or other member) that have a variance in surface, or surface profile, or cross section, or both, as a function of a dimension aiding the member.
• the contour of the plates 720-724 may influence the fluid flow rate over a surface of the workpiece 30 in a controlled manner to control (e.g.
• a deposition rate in an electrochemical deposition process may be at a first deposition rate adjacent a periphery of the wafer for any suitable reason such as a fluid flow rate at the periphery of the workpiece.
• the electric field varying plate 208 can be contoured to, for example, increase or decrease a distance between the plate 208 and the surface of the workpiece 30 and/or a distance between the plate 208 and the member 204 so that the flow rate of fluid over the surface of the workpiece towards a center of the workpiece is increased or decreased relative to or substantially the same as (e.g.
• the contour of the plate 208 can be adjusted so that the first and second deposition rates are substantially the same, so that the first deposition rate is greater than the second deposition rate, or so that the second deposition rate is greater than the first deposition rate.
• increased fluid flow rates over the surface of the workpiece may allow for increased replenishment of the processing fluid at the surface of the workpiece effecting improved deposition on the surface of the workpiece relative to slower flow rates. It is noted that the increased fluid replenishment rate associated with faster fluid flow rates may provide for greater replenishment rates of ions to be deposited on the surface of the workpiece .
• the fluid flow towards the center of the workpiece 30 would have a higher flow rate than the fluid flow at the edges of the workpiece due to the decreased distance between the plate 720 and the workpiece 30 at the center of the workpiece 30 formed by the convex contour of the plate.
• the fluid flow at the center of the workpiece 30 can be decreased by increasing the distance between the plate 721 and the workpiece 30 at a center of the workpiece through the concave shape of the pate 721 as shown in FIG. 20E.
• the direction of the fluid flow can also be influenced by the contours of the plates. For example, the circular steps of the plates 722 and 723 in FIGS.
• the steps may not be circular, and/or the transitions between different profiles or contour areas may not be stepped or abrupt (e.g. gradual transitions may be included as suitable) .
• the contours of the plates 723 and 724 may cause the fluid to follow the channels formed by their respective varying shaped surfaces 723A-723E and 724A-724E.
• Interaction between the agitation member 204 and the plates 208, 208', 700, 710 or 720-724 may also influence the fluid flow across the surface of the workpiece 30.
• the member 204 includes spaced openings, such as openings 236 described before. As the member 204 is moved in the reciprocating manner described before, the member may cause a motion of the fluid over the contoured surface of the plates 208, 208', 700, 710 or 720- 724 (see for example Fig. 20D) resulting in directional flow of fluid through the gap between the plate and surface of the workpiece.
• the action of the member 204 may also increase or decrease the fluid flow rate between the plates 208, 208', 700, 710 or 720-724 and the workpiece 30.
• the plates 208, 208 ', 700, 710 or 720-724 include holes that pass through the plates (as described above with respect to e.g. FIGS. 20A-2K) the action of the member 204 may cause the fluid to flow through the holes and hence through plates 208, 208', 700, 710, 720-724 (see for example Figs. 20A-20C) creating additional flow paths for the fluid which may also increase the agitation of the fluid adjacent the workpiece 30.
• the plate 720 may have a convex surface relative to the shear plate 204.
• the plate 721 may have a concave surface relative to the shear plate 204.
• the contour of the plate may be simple, such as the concave and convex shapes or complex.
• the surface of plate 722 may be a stepped or other suitable transition surface.
• the stepped surface includes three circular steps 722A, 722B, 722C but may include any suitable number of steps having any suitable geometric shape (i.e. square, rectangular, triangular, octagonal, etc.) .
• the step 722A may be considered a base step and the step 722C may be considered the most distal step.
• the plate 722 may be arranged relative to the shear plate 204 such that the distal step is extending towards the shear plate 204 as shown in FIG. 20G or extending away from the shear plate 204 as shown in FIG. 20H.
• the surface of the plate may be contoured with any suitable topographic configuration.
• FIG. 201 illustrates a plan view of a plate 723 having a non ⁇ symmetrical topographical contour. Here the topographical contour is divided into areas 723A-723E.
• areas 723A, 723B and 723D may protrude in the Z-direction (i.e. either into or out of the paper) beyond the surfaces 723C and 723E, which may also lie in different planes along the Z-axis.
• one or more of the surfaces 723A-723E may be contoured in the manner described with respect to one or more of FIGS. 20D-20H.
• surfaces 723A, 723B and 723D may be convex surfaces and surfaces 723C and 723E may be concave surfaces.
• the transition between the surfaces may be a smooth or blended transition or an abrupt transition, e.g. such as the stepped transitions shown in FIG. 20F.
• the contours are not limited to any axial direction and can extend along one or more of the x, y and z axes.
• FIG. 20J illustrates a plate 724 similar to plate 723 but the contours are symmetrical about one or more of the x, y and z axes.
• the contour areas 724A-724E in FIG. 20J are symmetrical about the x and y axes and may have any suitable combination of contoured shapes, such as those described above.
• one or more of the contour areas of the plates may include a non-conductive material that serves to block a portion of the electric field as it passes through the plate to, for example, a surface of the workpiece.
• the plates 720-724 of FIGS. 20D-20J may include a plurality of holes substantially similar to those described above with respect to FIGS. 20A-20C. In other examples, the plates 720-724 may not have holes in them.
• the surface of the plate includes multiple contours or stepped surfaces as illustrated in FIGS. 20F-20J one or more of the contoured or stepped surfaces may have a hole pattern that is different than a hole pattern of another one of the contoured or stepped surfaces.
• surface 722C may have holes of a first size that are arranged in a first pattern.
• Surface 722B may have holes of a second size arranged in a second pattern.
• Surface 722A may have holes of a third size arranged in a third pattern.
• one or more of the first second and third hole sizes may be different from the holes sizes of the other ones of the first, second and third hole sizes.
• one or more of the first second and third patterns may be different from the other ones of the first, second and third patterns.
• the holes may also be arranged to pass through the plate at any suitable angle.
• FIG. 20K illustrates a cross sectional view of a portion P of any one of the plates 208, 208 ', 700, 710, 720-724. As can be seen in FIG.
• the holes may pass through the plate such that a longitudinal axis 780L of the holes 780 passing through the plate is arranged substantially orthogonally relative to a surface S of the plate.
• the holes represented by hole 785) may also be arranged such that a longitudinal axis 785L of the holes 785 is arranged at any suitable angle a relative to the surface S of the plate.
• each of the holes in the plate may pass through the plate at the same angle (e.g.
• all holes have a longitudinal axis that is substantially orthogonal to the surface S or in another instance all holes have a longitudinal axis that is arranged at the angle a relative to the surface S) or at varying angles (e.g. the holes pass through the plates such that the angle of the longitudinal axis of one or more of the holes varies relative to the surface of the plate) .
• the average open area of a surface of the plate 208, 208', 700, 710 or 720-724 can be varied, and a property of the electric field passing through the plate 208 or 208' to the surface of the workpiece 30 can be varied. Further, by varying the distance between the plate 208, 208', 700, 710 or 720-724 and the surface of the workpiece 30 (and/or the member 204) a property of the electric field passing through the plate 208 to the surface of the workpiece 30 can be varied (e.g. through concentration or redirection of the electric field proximate the workpiece) .
• the non-conductive material in at least a portion of the plates can also vary a property of the electric field passing through the plate (e.g. through the blockage of the electric field in the area of the non- conductive material) .
• the property of the electric field that is varied can be amplitude or potential.
• the electric field proximate to the surface of the workpiece can be uniform.
• FIG. 22 there is shown a perspective view of an exemplary embodiment of a contoured fluid agitation paddle or member also referred to herein as a shear plate agitation paddle or member 800 for agitating a fluid during fluid processing of a workpiece such as for example in the vertical or upright configuration described before.
• Member 800 may have features as described with respect to plates 204, 204', 204'', 204''', 204x or otherwise.
• member 800 may include first and second plates as previously described.
• FIG. 23 there is shown a perspective view of an exemplary embodiment of a member 800 for agitating a fluid during fluid processing of a workpiece.
• contoured shear plate 800 is shown where FIG. 22 shows regions 810, 812 cut back, for example to 2mm, whereas the main body 808 of shear plate 800 may be about 3mm thick.
• FIG. 23 shows shear plate 800 with contour 810, 812 cut into body 808 with spaced openings 836 and blades 840.
• plate 800 defines a series of spaced openings 836.
• the shape of the spaced openings 836 can be, for example, oval or rectangular.
• Plate 800 may also include a series of spaced blades 840 for agitating the fluid.
• the profile (for example as seen in cross section) of the spaced blades 840 may be straight, angled, cup-shaped, or square.
• any suitable shape for spaced blades 840 or spaced openings 836 may be provided.
• the center points of the series of spaced openings 836 or the series of spaced blades 840 can be positioned in a substantially equidistant periodic array.
• the centers can be positioned with about 10 to about 30 mm between them. In alternate embodiments, other spacing may be provided. In one aspect of the embodiment, the centers may be positioned about 20 mm apart.
• the series of spaced openings 836 agitates the fluid when the member 800 is moved, for example as described with respect to plates 204x or otherwise. In one aspect of the embodiment, the series of spaced blades 840 agitates the fluid when the member 800 is moved.
• both the openings 836 and the blades 840 agitate the fluid.
• an edge surface of a spaced blade 840 agitates the fluid.
• Plate 800 can be formed from a suitable metal, plastic, or polymer. Suitable metals include titanium, stainless steel, or aluminum. Suitable plastics include polyvinyl chloride (PVC) , chlorinated PVC (CPVC) , HDPE, and PVDF . In alternate embodiments, any suitable material may be provided. In accordance with various aspects of the embodiment, plate 800 can be positioned between about 2 mm and about 10 mm from the surface of the work piece, for example, work piece 30 as shown in FIG. 26, although smaller or larger distances can be used depending on the application.
• the thickness of plate 800 may be between about 3 mm and about 6 mm, although smaller or larger thicknesses can be used depending on the application and/or the construction of the material.
• member or plate 800 may have contoured regions cut into it. Relatively thin pieces can be used so that the plate 800 can be positioned as close to the workpiece as possible. This improves the uniformity of deposition.
• Plate 800 may be aligned to the workpiece holder 18 in a manner that offers high precision without requiring mechanical support of the member 800 as previously described.
• FIG. 24 there is shown a front view of shear plate 800. In the embodiment shown, upper controlled region 810 and lower contoured regions 812 are shown having a different surface contour relative to adjoining regions.
• contoured regions may be thinner, or otherwise the surface of the plate 800 in the region may be offset relative to the surface of adjoining regions (see for example Fig. 26) .
• Regions 810, 812 are shown thinned in a manner for example to generate a desired boundary layer anywhere on the workpiece such as maintaining a uniform boundary layer on the workpiece surface including at the edge of the workpiece accommodating the effect of contact ring seal 42 height as shown in FIG. 26.
• an upper portion 842 of contoured region 810 of the shear plate 800 may overlap (in its entirety or in part) the contact ring seal during agitation where the lower edge of portion 842 agitates the workpiece surface proximate the workpiece, contact ring seal interface.
• the countered region 810 may taper to lower portions 844, 846 where portions 844, 846 may terminate at middle portions 850, 852 of shear plate 800 where the middle portions 850, 852 may only overlap the contact ring seal during vertical agitation 848.
• the configuration shown is representative, and in other aspects the general crescent configuration delineating the contoured regions may be of lessor or greater curvature.
• thinned region 812 may be a mirror cavity of region 810. Referring also to FIG. 25A, there is shown a section of shear plate 800. Although controlled region 810, 812 is shown as a thinned, stepped region, any suitable transition may be used alternately.
• the thinner region may include a further contoured region within such as by providing a further thinning of the cross section profile, or otherwise contouring the profile within the thinning region.
• the section shown in FIG. 25A may be from a region such as lower portions 844, 846 close to the lower termination of thinned region 810.
• FIG. 25B there is shown a section of shear plate 800, for example in region 842 of thinned region 810. Further contouring may be provided within each region as noted above.
• FIG. 25C there is shown a section of shear plate 800, for example in region 842 of thinned region 810 just above that shown in FIG.
• FIG. 25B showing the width of thinned region 810 decreasing with height on plate 800.
• FIG. 25D there is shown a section of shear plate 800, for example in region 842 of thinned region 810 just above that shown in FIG. 25C showing the width of thinned region 810 decreasing with height on plate 800.
• FIG. 25E there is shown a section of shear plate 800, outside of thinned region 810, 812 showing a uniform section across shear plate 800.
• FIG. 26 a cross section of Shear plate 800 in the contoured region which is near the contact ring seal 42 is shown with gap 865 between contoured region 812 and ring 42.
• contoured region 812 is shown thinned in a manner for example to maintain a uniform boundary layer at the edge of workpiece 30 in holder 18 accommodating the effect of contact ring seal 42. Similar to portion 836 here, lower portion 856 of contoured region 812 may overlap the contact ring seal during agitation where the upper edge of portion 856 agitates the workpiece surface proximate the workpiece, contact ring seal interface 860.
• member 800 may be disposed within a housing adjacent workpiece 30 (in the generally upright configuration described before) and adapted to move substantially parallel to a surface of the workpiece to agitate a fluid.
• Member 800 is shown having at least one contoured area 812 configured to vary a distance between member 800 and the surface of workpiece 30 in a space between the at least one contoured area 812 and a corresponding portion of the surface of workpiece 30.
• FIG. 27 there is shown a cross section of a contoured region of a contoured micro hole shield plate 900' and an anode 902'.
• FIG. 28 there is shown a cross section of a contoured region of opposing contoured micro hole shield plates 900, 900', opposing anodes 902, 902', contoured regions of opposing contoured shear plates 800, 800' with the opposing shear plates near opposing contact ring seals 42, 42', and opposing workpieces 30, 30' retained by workpiece holder 18.
• Shield plate (s) 900, 900' may incorporate contoured regions as described before, and in another aspect of the embodiment may be a "micro hole" shield plate with small holes 910 of equal diameter distributed across the surface with varying spacing.
• different hole size(s) and patterns may be provided.
• This type of embodiment as described with respect to shield plate 900 may be referred to as a "micro-hole" shield. Referring also to FIG.
• contoured micro hole shield plate 900 there is shown a cross section of contoured micro hole shield plate 900.
• FIG. 30 there is shown a cross section of a contoured region of contoured micro hole shield plate 900.
• a micro hole shield embodiment may be used in combination with contouring the shield surface to locally modify fluid flow, due to shear plate 204x or 800, at the wafer surface, for example, with respect to plates 800, 900.
• a contoured micro-hole- shield 900 may have a 3mm thick hole section 912, which tapers away 916 from the shear plate 900, thereby increasing gap 927 between shear plate 800 and shield plate 900, and thus gap 929 between workpiece surface 30 and shield plate 900 by about 1 mm starting at a radius 914 of about 100mm, and with the outside edge 920 contoured back 922 (e.g. reducing the gap) by for example about 5 mm starting at about 1 mm from the last holes, for example, about the 147 mm radius of the contact ring seal 42.
• Outside edge may be contoured back as a step with a radius as seen in FIG. 28, as an angled taper as seen in FIG.
• the surface 924, at least partially or otherwise opposing contact ring seal 42 may be contoured with taper 926, flange thickness 928 and step 930 as shown.
• any suitable geometry or dimensions may be used.
• more or less holes of differing sizes and different distributions may be used.
• one or more contours or tapers may be provided.
• an alternate embodiment may be to provide a contoured micro-hole shield to improve uniformity % Ag and Cu Pillar.
• % Ag non-uniformity may be due to variation in fluid agitation at the wafer surface.
• the boundary layer thickness may be sensitive to the micro-hole shield. For example, plate bending due to shear plate induced pressure can be large enough to locally influence the boundary layer thickness.
• other geometry may be applied to shield 900, for example to compensate and make % Ag more uniform.
• the shield plate may be thickened or otherwise varied, so that the gap between shield plate and workpiece is similar under static conditions, and increases to desired dimension during dynamic conditions such as fluid agitation by the shear plate.
• the shield plate face may be contoured to vary the gap between shear plate 800 and micro-hole shield 900 to locally adjust the boundary layer thickness along the workpiece.
• a support frame may be provided behind the micro hole shield 900 fixing the micro-hole shield plate, and the gap between shield plate and workpiece.
• any suitable contoured or modified structure may be provided.
• an apparatus for fluid processing at least one workpiece 30 having housing 925 configured to hold a fluid.
• Workpiece holder 18 is shown disposed within housing 925 and configured to retain the at least one workpiece 30.
• Electric field shield plate 900 is shown disposed within housing 925 adjacent each of the at least one workpiece 30, electric field shield plate 900 having at least one contoured area, for example, at 914, configured to vary gap 929, for example between the portion at 914 and the outer edge of shield plate 900 from the electric field shield plate 900 to a surface of the workpiece 30, gap 927 being defined by the at least one contoured area of the electric field shield plate and a corresponding portion of the surface of workpiece 30 facing electric field shield plate 900.
• the electric field shield plate may include a non-conductive material configured to block a portion of an electric field passing through the plate to the surface of workpiece 30.
• electric field shield plate 900 may include one or more contoured areas.
• the one or more contoured areas may be configured to form one or more of a convex plate profile, a concave plate profile and a stepped plate profile where a transition between contoured areas may be one of a smooth transition or an abrupt transition.
• electric field shield plate 900 includes a plurality of holes 910 passing through plate 900.
• a predetermined diameter of the holes of one of the one or more contoured areas may be different than a predetermined diameter of the holes of another of the one or more contoured areas where a pattern of the holes 910 of one of the one or more contoured areas may be different than a pattern of the holes 910 of another of the one or more contoured areas.
• a pattern of the holes 910 may form a radial gradient radiating from a center of plate 900.
• a pattern of the holes 910 may form a linear gradient across the plate 900.
• electric field shield plate 900 may include a plurality of holes 910 passing through the electric field shield plate 900 and a pattern of the holes 910 forms a linear gradient across the electric field shield plate.
• electric field shield plate 900 may be configured to control one or more of an electric field applied to the workpiece and a flow of fluid past the workpiece.
• Fluid agitation member 800 is shown disposed within housing 925 adjacent each of the at least one workpiece 30, with fluid agitation member 800 adapted to move substantially parallel to a surface of the workpiece 30 to agitate the fluid.
• member 800 is shown having at least one contoured area 812 configured to vary gap 861, 863 from member 800 to the surface of workpiece 30, gap 861, 863 being defined by the at least one contoured area 812 of the fluid agitation member and a corresponding portion of the surface of the workpiece 30 facing fluid agitation member 800.
• member 800 may include one or more contoured areas. As seen in FIG.
• At least one contoured area 812 may be configured to form a stepped plate profile where member 800 defines a plurality of spaced openings or a plurality of blades separated by spaced openings where the at least one contoured area is provided within the plurality of blades.
• electric field shield plate 900 may be disposed within housing 925 adjacent each of the at least one workpiece 30 with electric field shield plate 900 having at least one contoured area configured to vary a second gap 929 between electric field shield plate 900 and a surface of workpiece 30 and with member 800 disposed between electric field shield plate 900 and workpiece 30.
• FIGS. 21A and 21B show an illustrative embodiment of a loading station 14', which can be used to load one or more workpieces 30 on an embodiment of the workpiece holder 18.
• FIGS. 21A and 21B include a holder 324 for the workpiece holder 18, a base member 328 for moving a workpiece 30, and an arm 332 connecting the holder 324 and the base member 328.
• FIG. 21B shows workpieces 30 loaded onto the base member 328.
• the arm 332 and the holder 324 can include a hinged connection 336 so that the arm 332 can move the base member 328 between a substantially horizontal position and a substantially vertical position, or to an intermediate position.
• the base member 328 and the arm 332 can be components of the same piece.
• the holder 324 can retain the workpiece holder 18 while workpieces 30 are being loaded onto or removed from the workpiece holder 18. In some embodiments, the holder 324 can retain the workpiece holder 18 while workpieces 30 are being loaded onto or removed from the base member 328.
• the holder 324 can be a suitable metal, plastic, or polymer material.
• a second end effector (not shown) can be used to load a workpiece 30 onto the base 328.
• the loading station 14' can be coupled to a hydraulic mechanism and/or a computer to control the position of the arm 332.
• the base member 328 can include an end effector 340 positioned in the central portion of the base member 328 and a chuck 344 positioned around the outer perimeter of the base member 328.
• the end effector 340 can be a Bernoulli end effector, an electrostatic chuck, or a vacuum end effector.
• the end effector 340 can retain a workpiece 30 without contacting it.
• the chuck 344 is a vacuum chuck or a suction chuck.
• the chuck 344 can retain the ring 42 on the base member 328.
• the end effector 340 can retain the workpiece 30 against the ring 42 while the workpiece 30 is loaded onto or removed from the workpiece holder 18.
• the end effector 340 can retain the workpiece 30 against the ring 42 without contacting the workpiece 30.
• the ring 42 is engaged by the chuck 344.
• the workpiece 30 can be placed on the ring 42.
• the end effector 340 can be activated to hold the workpiece 30 against the ring 42.
• the arm 332 can be moved to a substantially vertical position.
• the workpiece holder 18 can engage the ring 42.
• the end effector 340 can be disengaged from the workpiece 30, and the chuck 344 can be disengaged from the ring 42.
• the arm 332 can be moved from the plane of the workpiece holder 18 so that there is clearance.
• the workpiece holder 18 can be removed from the holder 324 and directed to a module for processing. The steps need not be completed in this order to load the workpiece 30.
• the arm 332 can be moved to a substantially vertical position.
• the end effector 340 can engage the workpiece 30, and the chuck 344 can engage the ring 42.
• the ring 42 is disengaged from the workpiece holder 18.
• the arm 332 can be moved to a substantially horizontal position. The steps need not be completed in this order to remove the workpiece 30.
• the loading station 14' can load a single workpiece 30 to a workpiece holder 18, or can load a plurality of workpieces 30 to a workpiece holder 18. In one embodiment, two workpieces are loaded onto the workpiece holder 18 substantially concurrently. In one embodiment, two workpieces are removed from the workpiece holder 18 substantially concurrently. In some embodiments, a first workpiece is loaded onto or removed from the workpiece holder 18 before a second workpiece is loaded or removed.
• an apparatus for fluid processing at least one workpiece having a housing configured to hold a fluid.
• a workpiece holder is disposed within the housing and configured to retain the at least one workpiece.
• An electric field shield plate is disposed within the housing adjacent each of the at least one workpiece, the electric field shield plate having at least one contoured area configured to vary a gap from the electric field shield plate to a surface of the workpiece, in the gap being defined by the at least one contoured area of the electric field shield plate and a corresponding portion of the surface of the workpiece facing the electric field shield plate .
• the electric field shield plate includes a non-conductive material configured to block a portion of an electric field passing through the plate to the surface of the workpiece.
• the electric field shield plate includes one or more contoured areas.
• the one or more contoured areas are configured to form one or more of a convex plate profile, a concave plate profile and a stepped plate profile.
• a transition between contoured areas is one of a smooth transition or an abrupt transition.
• the electric field shield plate includes a plurality of holes passing through the plate.
• a predetermined diameter of the holes of one of the one or more contoured areas is different than a predetermined diameter of the holes of another of the one or more contoured areas.
• a pattern of the holes of one of the one or more contoured areas is different than a pattern of the holes of another of the one or more contoured areas.
• a pattern of the holes forms a radial gradient radiating from a center of the plate.
• a pattern of the holes forms a linear gradient across the plate.
• the electric field shield plate is configured to control one or more of an electric field applied to the workpiece and a flow of fluid past the workpiece .
• an apparatus for fluid processing at least one workpiece having a housing configured to hold a fluid.
• a workpiece holder is disposed within the housing and configured to retain the at least one workpiece.
• An electric field shield plate is disposed within the housing adjacent each of the at least one workpiece configured to control one or more of an electric field applied to the workpiece and a fluid flow across a surface of the workpiece, the electric field shield plate including at least one contoured area that varies a gap from the electric field shield plate to a surface of the workpiece the gap being defined by the at least one contoured area of the electric field shield plate and a corresponding portion of the surface of the workpiece facing the electric field shield plate.
• An agitation member is disposed between the plate and the workpiece holder.
• the electric field shield plate includes a plurality of holes passing through the electric field shield plate and a predetermined diameter of the holes of one of the one or more contoured areas is different than a predetermined diameter of the holes of another of the one or more contoured areas.
• the electric field shield plate includes a plurality of holes and a pattern of the holes of one of the one or more contoured areas is different than a pattern of the holes of another of the one or more contoured areas.
• the electric field shield plate includes a plurality of holes passing through the electric field shield plate and a pattern of the holes forms a linear gradient across the electric field shield plate.
• the method further comprising passing a fluid between the electric field shield plate and the surface of the workpiece, wherein the at least one contoured area controls one or more of a fluid flow direction and a fluid flow rate over the surface of the workpiece in a space between the at least one contoured area and a corresponding portion of the surface of the workpiece .

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• 2013
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